CN114999995B - Wafer tilting mechanism - Google Patents
Wafer tilting mechanism Download PDFInfo
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- CN114999995B CN114999995B CN202210930524.5A CN202210930524A CN114999995B CN 114999995 B CN114999995 B CN 114999995B CN 202210930524 A CN202210930524 A CN 202210930524A CN 114999995 B CN114999995 B CN 114999995B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 122
- 238000013459 approach Methods 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 143
- 230000005540 biological transmission Effects 0.000 claims description 124
- 230000007306 turnover Effects 0.000 claims description 39
- 230000008093 supporting effect Effects 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 20
- 230000006872 improvement Effects 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a wafer overturning mechanism, which comprises: the machine frame comprises a bottom plate and side plates vertically connected to two opposite sides of the bottom plate, the two groups of clamping mechanisms respectively penetrate through the two side plates and are connected with a first driving device for controlling the two groups of clamping mechanisms to mutually approach and clamp two sides of the wafer, and the side plates are connected with a driving assembly for controlling the two groups of clamping mechanisms to synchronously pivot in a plane parallel to the side plates. By the application, the technical effect that the wafer can be turned without integrally turning the wafer turning mechanism is realized, thereby prolonging the service life of the turning mechanism and reducing the occupied working space of the turning mechanism.
Description
Technical Field
The application relates to the field of semiconductor wafer production and manufacturing, in particular to a wafer overturning mechanism.
Background
During the continuous processing, forming and polishing of wafers, contaminants such as various organic substances, particles and metal impurities adhere to the wafers due to the contact with the wafers, and therefore the wafers need to be cleaned. Wafer cleaning is an important process step in wafer fabrication and requires the efficient use of chemical solutions or gases to remove impurities that remain on the wafer surface without compromising the wafer surface and electrical properties. In the wafer cleaning process flow, when one surface of the wafer is cleaned, the wafer needs to be turned over for cleaning the other surface, so that the wafer needs to be turned over.
In the existing wafer cleaning process flow, the wafer turnover mechanism generally adopts a negative pressure adsorption mode to turn over a single wafer, the negative pressure adsorption equipment is complex in structure, a negative pressure pipeline is difficult to manage and maintain, and the single wafer turnover efficiency is low, so that a mechanism capable of turning over a plurality of wafers is designed aiming at the defects of the negative pressure adsorption single wafer turnover mechanism. Meanwhile, in the prior art, a plurality of wafer turnover mechanisms need to use two groups of clamping seats which are oppositely arranged to move close to each other and away from each other, so that actions of loosening and clamping wafers are realized, when the two clamping seats are relatively close to each other, after the plurality of wafers are clamped, the turnover mechanisms enable the whole wafers to be turned to a specified angle, and at the moment, the wafers placed in the turnover mechanisms are turned over completely, and the wafers in the turnover mechanisms are taken out by using a manipulator. Finally, because the turning device in the prior art needs to turn over the whole wafer turning mechanism, the larger gravity needs to be overcome to turn over in the working process, so that larger working loss is brought to the turning device, the service life is shortened, and larger working space can be occupied in the whole turning process, so that the normal operation of other works is influenced.
In view of the foregoing, there is a need for an improved wafer flipping mechanism in the prior art that addresses the above-described issues.
Disclosure of Invention
The application aims to disclose a wafer overturning mechanism, which is used for solving a plurality of defects in the prior art, and particularly aims to realize wafer overturning without integrally overturning the wafer overturning mechanism so as to prolong the service life of the overturning mechanism and reduce the occupied working space of the overturning mechanism.
In order to achieve the above object, the present application provides a wafer flipping mechanism, comprising: the clamping mechanisms penetrate through the two side plates respectively and are connected with a first driving device used for controlling the two groups of clamping mechanisms to approach each other and clamp two sides of the wafer, and the side plates are connected with a driving assembly used for controlling the two groups of clamping mechanisms to synchronously pivot in a plane parallel to the side plates.
As a further improvement of the application, the clamping mechanism comprises a telescopic shaft and clamping seats, wherein the telescopic shaft penetrates through the side plates to be connected with the clamping seats, a plurality of clamping grooves matched with the edges of the wafers are formed in parallel on one side, far away from the telescopic shaft, of the two clamping seats, and the two groups of first driving devices are respectively connected with one end, far away from the clamping seats, of the telescopic shaft and drive the two clamping seats to be mutually close to or far away from each other.
As a further improvement of the application, the driving assembly comprises a rotating mechanism, a first transmission assembly and a second transmission assembly, wherein a transmission plate is connected between the first transmission assembly and the second transmission assembly, the first transmission assembly is connected with the rotating mechanism and penetrates through one side plate, and the second transmission assembly penetrates through the other side plate;
the telescopic shaft comprises a first telescopic shaft and a second telescopic shaft, the outer walls of the first telescopic shaft and the second telescopic shaft are respectively provided with a spline, the first telescopic shaft axially penetrates through a first transmission assembly and a rotating mechanism and is in spline fit with the first transmission assembly, the second telescopic shaft axially penetrates through a second transmission assembly and is in spline fit with the second transmission assembly, and the first driving device and the second driving device respectively drive the first telescopic shaft and the second telescopic shaft to axially displace in the rotating mechanism, the first transmission assembly and the second transmission assembly.
As a further improvement of the application, the rotating mechanism comprises a driving motor, a driving wheel and a driven wheel, wherein the driving motor is coaxially fixed with the driving wheel, the driving wheel and the driven wheel synchronously rotate through a winding transmission belt, the driven wheel is connected with a first transmission assembly, and the first telescopic shaft penetrates through the center of the driven wheel.
As a further improvement of the application, the wafer clamping device further comprises two groups of wafer supporting mechanisms which are used for supporting the wafer before the wafer is clamped by the clamping seat and after the wafer is loosened by the clamping seat, each group of wafer supporting mechanisms comprises supporting seats which are symmetrically distributed on two sides of the clamping seat respectively, and a second driving device which controls the supporting seats to move along the length direction parallel to the first telescopic shaft and the second telescopic shaft, and the supporting seats are provided with a plurality of supporting grooves corresponding to the clamping grooves.
As a further improvement of the application, the driving end of the second driving device is connected with the bearing seats through a connecting assembly, the connecting assembly comprises a first driving plate and a second driving plate, the first driving plate is connected between the two bearing seats, one end of the second driving plate is connected with the first driving plate, and the other end of the second driving plate penetrates through the side plate and is connected with the driving end of the second driving device.
As a further improvement of the application, the driving wheel is arranged under the driven wheel, the second driving device is arranged under the driven wheel, the driving end of the second driving device is inclined towards the direction close to the bottom plate, the second driving plate comprises a first plate body and a second plate body, the end parts of the first plate body are mutually perpendicular, the driving end of the second driving device is connected with the first plate body, and the second plate body is parallel to the driving end of the second driving device and penetrates through the side plate to be connected with the first driving plate.
As a further improvement of the application, the first driving device comprises a driving air cylinder and a mounting plate, wherein the mounting plate is parallel to the side plate, one side, far away from the driving end, of the driving air cylinder is connected with the side plate, the driving end of the driving air cylinder is perpendicular to the side plate and is connected with the mounting plate, one side, close to the side plate, of the mounting plate is provided with a clamping groove, and one ends, far away from the clamping seat, of the two telescopic shafts are respectively embedded in one clamping groove and are in rotary fit.
As a further improvement of the application, the side plate is connected with the sensor through a first bracket, the mounting plate is connected with the stop block through a second bracket, and the stop block is attached to the sensor when the clamping seat clamps the wafer.
As a further improvement of the application, the transmission plate comprises a first transmission plate and a second transmission plate, and the first transmission plate and the second transmission plate are positioned on the upper side and the lower side of the clamping seat.
Compared with the prior art, the application has the beneficial effects that:
firstly, radial two sides of a plurality of wafers can be synchronously and stably clamped through clamping mechanisms penetrating out of side plates, the clamping mechanisms are controlled by the first driving device to be mutually close to and far away from each other, clamping and loosening of the plurality of wafers can be achieved, meanwhile, after the first driving device drives the two groups of clamping mechanisms to stably clamp the two sides of the wafers, the driving assembly is started to enable the two groups of clamping mechanisms to synchronously rotate to drive the wafers to rotate 180 degrees, the turnover of the wafers is completed for subsequent steps, compared with the mode that the whole wafer turnover mechanism is turned over in the prior art to achieve wafer turnover, the first driving device and the driving assembly respectively control linear movement and circumferential rotation of the clamping mechanisms to achieve turnover of the wafers without turning over the whole equipment including a rack, so that the turnover working pressure born by the driving assembly is effectively reduced, the whole wafer turnover process is carried out in the rack, the service life of the equipment is prolonged, and the working space occupied in the process of turning over the wafers is reduced.
And secondly, forming a driving assembly through a rotating mechanism, a first transmission assembly and a second transmission assembly, connecting a transmission plate between the first transmission assembly and the second transmission assembly, providing power for the rotation of the two groups of clamping mechanisms by the driving mechanism, and synchronously rotating the first transmission assembly connected with the driving mechanism along with the rotating mechanism and synchronously rotating the second transmission assembly connected with the first transmission assembly by using the transmission plate. Because the first telescopic shaft and the second telescopic shaft are matched with the first transmission assembly and the second transmission assembly through the spline respectively, the first transmission assembly and the second transmission assembly can drive the first telescopic shaft and the second telescopic shaft to synchronously rotate while rotating, so that stable rotation is carried out on two sides of a plurality of wafers clamped by the clamping seat, and overturning is realized.
Finally, when the wafer is clamped and loosened, the first telescopic shaft and the second telescopic shaft are matched with the first transmission assembly and the second transmission assembly through the spline, so that the two groups of first driving devices can respectively drive the first telescopic shaft and the second telescopic shaft to perform linear motion, and when the two groups of first driving devices are relatively far away, the clamping grooves formed in the two clamping seats loosen the edge of the wafer, and at the moment, the wafer can be taken out through the mechanical arm; when the two groups of first driving devices are relatively close to each other, the clamping grooves formed in the two clamping blocks clamp the edge of the wafer for subsequent overturning operation of the wafer. The clamping and overturning of the wafer are realized by controlling the clamping mechanism, and the whole device has compact structure and avoids the defects of overturning of the whole device.
Drawings
FIG. 1 is a perspective view of the complete machine assembly of the present application with a cover disposed outside the drive assembly;
FIG. 2 is a perspective view of the present application showing a rotating mechanism, a first transmission assembly and a second transmission assembly;
FIG. 3 is a schematic cross-sectional view taken along the direction F-F of FIG. 2 with the top and side panels removed;
FIG. 4 is an enlarged view of portion A of FIG. 1;
FIG. 5 is an enlarged view of portion B of FIG. 3;
FIG. 6 is an enlarged view of portion C of FIG. 5;
FIG. 7 is an exploded view of the present application showing the mating relationship between the rotary mechanism and the first drive assembly and the first telescoping shaft;
FIG. 8 is a schematic cross-sectional view of the present application showing the mating relationship of the portions of the second drive assembly;
fig. 9 is a perspective view showing the mating relationship between the socket and the second driving device in the present application.
Detailed Description
The present application will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the present application, and functional, method, or structural equivalents and alternatives according to the embodiments are within the scope of protection of the present application by those skilled in the art.
In particular, in the embodiments described below, the term "longitudinal" refers to a direction perpendicular to the horizon or horizontal. The term "transverse" refers to a direction parallel to the horizon or horizontal.
Referring to fig. 1 to 9, compared with the conventional wafer turnover mechanism, the embodiment of the wafer turnover mechanism disclosed in fig. 1 to 9 controls the two groups of clamping mechanisms 2 to be close to or far away from each other through the first driving device 3, so as to realize stable clamping of two radial sides of the wafer 7 for subsequent turnover operation of the wafer 7, the driving device 4 controls the clamping mechanisms 2 to rotate in a plane parallel to the side plates 11, when the driving device 4 drives the clamping mechanisms 2 to rotate 180 °, the plurality of wafers 7 clamped on the clamping mechanisms 2 in parallel simultaneously rotate 180 °, that is, the turnover operation of the wafer 7 is completed, the whole turnover process only needs to adjust and control the clamping mechanisms 2 without turning the whole wafer turnover mechanism, thereby effectively avoiding the fatigue accumulation of the driving device due to high turnover pressure, shortening the service life of the whole wafer turnover mechanism, and effectively reducing the working space required by turnover of the wafer because the whole turnover process is not required to drive the frame 1 to synchronously rotate, and facilitating the turnover operation.
Referring to fig. 1 to 9, in the present embodiment, the wafer flipping mechanism (hereinafter referred to as flipping mechanism) includes: the machine frame 1 and two groups of clamping mechanisms 2 for synchronously clamping a plurality of wafers 7 on two radial sides, wherein the machine frame 1 comprises a bottom plate 12 and side plates 11 which are vertically connected with two sides opposite to the bottom plate 12, the two groups of clamping mechanisms 2 respectively penetrate through the two side plates 11 and are connected with a first driving device 3 for controlling the two groups of clamping mechanisms 2 to mutually approach and clamp the two sides of the wafers 7, and the side plates 11 are connected with a driving assembly 4 for controlling the two groups of clamping mechanisms 2 to synchronously and circumferentially rotate in a plane parallel to the side plates 11. When the turnover mechanism is used, the bottom plate 12 of the frame 1 is placed on a working plane, and the side plates 11 which are perpendicular to the bottom plate 12 and are oppositely arranged at two sides of the bottom plate 12 are perpendicular to the working plane. When clamping the wafer 7, the mechanical arm (not shown) simultaneously sends a plurality of wafers 7 into the frame 1 along the direction parallel to the bottom plate 12, at this time, the first driving device 3 drives the two clamping mechanisms 2 to be in a relatively far away state, and after the wafer 7 is completely sent into the frame 1, the two groups of first driving devices 3 respectively drive the two clamping mechanisms 2 to be mutually close to each other along the direction perpendicular to the two side plates 11 until the two clamping mechanisms 2 clamp the two radial sides of the wafer 7;
then the driving component 4 is started, the driving component 4 drives the two groups of clamping mechanisms 2 to synchronously pivot, and when the driving component 4 drives the two groups of clamping mechanisms 2 to rotate 180 degrees, the overturning action of the wafer 7 is completed. Then, a manipulator (not shown) for receiving the wafer 7 is extended into the frame 1, and the two groups of clamping mechanisms 2 are moved along the direction opposite to the clamping action until the two sides of the two groups of clamping mechanisms 2 release the two sides of the wafer 7, at this time, the wafer 7 falls onto the manipulator (not shown), and the turned wafer 7 can be taken out for subsequent operation. The whole clamping and overturning process only needs to control the clamping mechanism 2, so that the structure is more compact compared with the mode of respectively controlling the clamping of the wafer 7 and the whole overturning of the equipment in the prior art. And need not to carry out the design of upset to the whole equipment that contains frame 1, effectively reduced the weight that drive assembly 4 born when carrying out the upset operation to effectively reduced the working strength of drive assembly 4 in the upset operation, and whole upset process all goes on in frame 1, reduced the working space that tilting mechanism occupy when carrying out the upset operation.
Referring to fig. 2 to 7, the clamping mechanism 2 includes a telescopic shaft 21 and clamping holders 22, the telescopic shaft 21 passes through the side plate 11 and is connected with the clamping holders 22, a plurality of clamping grooves 221 adapted to the edge of the wafer 7 are formed in parallel on one side of the two clamping holders 22 away from the telescopic shaft 21, and the first driving device 3 is connected with one end of the telescopic shaft 21 away from the clamping holders 22 and drives the two clamping holders 22 to approach or separate from each other. The driving assembly 4 comprises a rotating mechanism 41, a first transmission assembly 42 and a second transmission assembly 43, the rotating mechanism 41 drives the first transmission assembly 42 to rotate by taking a broken line L as shown in fig. 7 as an axis, a transmission plate 44 is connected between the first transmission assembly 42 and the second transmission assembly 43, the first transmission assembly 42 penetrates through one side plate 11 and is connected with the rotating mechanism 41, and the second transmission assembly 43 penetrates through the other side plate 11.
Referring to fig. 2 to 7, the telescopic shaft 21 includes a first telescopic shaft 211 and a second telescopic shaft 212, the outer walls of the first telescopic shaft 211 and the second telescopic shaft 212 are formed with splines 213, the first telescopic shaft 211 axially passes through the first transmission assembly 42 and the rotating mechanism 41 and is matched with the first transmission assembly 42 through the splines 213, the second telescopic shaft 212 axially passes through the second transmission assembly 43 and is matched with the splines 213, and the two first driving devices 3 respectively drive the first telescopic shaft 211 and the second telescopic shaft 212 to axially displace in the rotating mechanism 41, the first transmission assembly 42 and the second transmission assembly 43 along the L axis as shown in fig. 7. The first transmission assembly 42 includes a first positioning plate 421, a first transmission member 422, a second transmission member 423, and a first connecting plate 424, which are axially distributed in sequence from left to right as shown in fig. 6 and 7; the second transmission assembly 43 includes a second positioning plate 431, a third transmission member 432, a fourth transmission member 433, and a second connection plate 434, which are axially distributed in this order from right to left as shown in fig. 8.
Wherein first locating plate 421 is attached to first driving member 422 and fixed by connecting member such as bolt, first locating plate 421 is attached to and fixed by rotating mechanism 41, second driving member 423 is attached to first driving member 422, the other end passes through side plate 11 and then is fixed to first connecting plate 424, first telescopic shaft 211 passes through first connecting plate 424, second driving member 423, first driving member 422 and first locating plate 421 in sequence and rotating mechanism 41 and then is connected to first driving device 3, spline 213 formed on the surface of first telescopic shaft 211 is in spline fit with inner holes (not labeled in the figure) of first driving member 422 and second driving member 423, and first telescopic shaft 211 is not contacted with rotating mechanism 41, first locating plate 421 and first connecting plate 424. The second positioning plate 431 is attached to and fixed to the third transmission member 432, one end of the fourth transmission member 433 is attached to the third transmission member 432, the other end of the fourth transmission member 433 passes through the side plate 11 and then is fixed to the second connection plate 434, the second telescopic shaft 212 sequentially passes through the second connection plate 434, the fourth transmission member 433, the third transmission member 432 and the second positioning plate 431 and then is connected to the first driving device 3, and the spline 213 formed on the surface of the second telescopic shaft 212 is in spline fit with inner holes (not labeled in the figure) of the third transmission member 432 and the fourth transmission member 433, so that the second telescopic shaft 212 does not contact with the second positioning plate 431 and the second connection plate 434, and the transmission plate 44 is connected between the first connection plate 424 and the second connection plate 434. The driving plate 44 includes a first driving plate 441 and a second driving plate 442, and the first driving plate 441 and the second driving plate 442 are located at the upper and lower sides of the clamping seat 22, and two ends of the first driving plate 441 and the second driving plate 442 are fixedly connected with the top and bottom ends of the first connecting plate 424 and the second connecting plate 434, respectively.
As shown in fig. 6 and 7, the rotation mechanism 41 includes a driving motor 411, a driving wheel 412 and a driven wheel 413, the driving motor 411 and the driving wheel 412 are coaxially fixed as shown in fig. 7 by a dashed line R axis, the driving wheel 412 and the driven wheel 413 synchronously rotate by a winding transmission belt 414, the driven wheel 413 is fixed with a first positioning plate 421 in the first transmission assembly 42, and the first telescopic shaft 211 passes through the center of the driven wheel 413 and is connected with the first driving device 3. In the process of turning over the wafer, after the two groups of first driving devices 3 respectively enable the first telescopic shaft 211 and the second telescopic shaft 212 to move relatively to the two sides of the clamped wafer 7 along the axial direction in the first transmission component 42 and the second transmission component 43, the driving motor 411 is started, the driving motor 411 drives the driving wheel 412 and the driven wheel 413 to rotate under the driving of the driving belt 414, the first positioning plate 421 fixedly connected with the driven wheel 413 drives the first transmission member 422 to synchronously rotate along with the driving of the driven wheel 413, the first telescopic shaft 211 matched with the first transmission member 422 is driven by the first transmission member 422, and the second transmission member 423 is matched with the first telescopic shaft 211 through the spline 213, so that the second transmission member 423 rotates under the driving of the first telescopic shaft 211, the first connection plate 424 fixed with the second transmission member 423 drives the first transmission plate 441 and the second transmission plate 442 to start rotating, the second connection plate 434 drives the fourth transmission member 433 fixed with the second connection plate to rotate, the second transmission member 433 is matched with the fourth transmission member to immediately rotate along with the fourth transmission member, the first transmission member 422 starts rotating along with the second telescopic shaft 212 through the spline 213, and the second transmission member 433 rotates along with the second transmission member 433 and the second transmission member 213 rotates along with the second transmission shaft 211 and the second transmission member 433 rotates along with the wafer 7, and the rotation seat 180 is clamped by the rotation of the second transmission member 7 is completed, and the rotation seat 7 is clamped. The arrangement of the first transmission plate 441 and the second transmission plate 442 effectively ensures that the upper side and the lower side of the second connection plate 434 can be stably stressed, so that the first telescopic shaft 211 and the second telescopic shaft 212 can be at the same rotation speed, and stable overturning of the wafer 7 is realized.
Because the spline 213 formed on the surfaces of the first telescopic shaft 211 and the second telescopic shaft 212, the first transmission member 422, the second transmission member 423, the third transmission member 432 and the fourth transmission member 433 meshed with the spline 213 can sequentially transmit and drive the two clamping seats 22 to synchronously rotate in the rotating process so as to realize the effect of turning the wafer 7, and simultaneously, when the wafer 7 needs to be clamped and loosened, the first telescopic shaft 211 and the second telescopic shaft 212 can respectively move in the first transmission member 422, the second transmission member 423, the third transmission member 432 and the fourth transmission member 433 along the axial direction under the external force applied by the first driving device 3, so that the two clamping seats 22 are relatively close to or far away from each other, and the clamping groove 221 formed in the clamping seat 22 clamps the wafer 7 to be turned or loosens the turned wafer 7, so that the whole working process of clamping and turning the wafer 7 can be realized only by controlling the clamping mechanism 2 and the whole working process of releasing the material is realized, the whole structure of the wafer turning mechanism is more compact, the whole working life of the whole turning mechanism 4 can be prolonged by directly changing the whole working mode of the whole turning mechanism 4 in the prior art, and the whole working life of the whole turning mechanism is prolonged.
As shown in fig. 6 to 8, the first driving device 3 includes a driving cylinder 31 and a mounting plate 32, the mounting plate 32 is parallel to the side plate 11, one side of the driving cylinder 31 away from the driving end is connected to the side plate 11, the driving end of the driving cylinder 31 is perpendicular to the side plate 11 and connected to the mounting plate 32, a clamping groove 321 is formed on one side of the mounting plate 32 close to the side plate 11, and one ends of the two telescopic shafts 21 away from the clamping seat 22 are respectively embedded in one clamping groove 321 and are in rotary fit. The side plate 11 is connected to the sensor 112 through the first bracket 111, the mounting plate 32 is connected to the stopper 323 through the second bracket 322, and the stopper 323 is attached to the sensor 112 when the wafer 7 is clamped by the clamping seat 22.
Due to the structural characteristics of the driving cylinder 31, the driving end is a piston rod, when the first driving device 3 is assembled, one end, far away from the piston rod, of the driving cylinder 31 is attached to the side plate 11 and fixed, the end of the piston rod is connected with the mounting plate 32, and the mounting plate 32 is arranged parallel to the side plate 11. As shown in fig. 6 and 7, the side of the mounting plate 32 near the side plate 11 is connected with a clamping block 324, a clamping groove 321 is formed in the side of the clamping block 324 near the side plate 11, one ends of the first telescopic shaft 211 and the second telescopic shaft 212 far away from the clamping seat 22 respectively penetrate through one clamping block 324 and then extend into the mounting plate 32 to be connected with a limiting piece 215, and the diameter of the limiting piece 215 is larger than that of the first telescopic shaft 211 and the second telescopic shaft 212. Through bearing 214 normal running fit between first telescopic shaft 211 and second telescopic shaft 212 and draw-in groove 321, bearing 214 one side is laminated with locating part 215, and the opposite side laminating sets up snap ring 216, and the diameter of snap ring 216 is greater than the diameter of bearing 214 and inlay in the fixture block 324 to effectively spacing bearing 214 is in order to avoid its emergence displacement. When clamping the wafer 7, the piston rod of the driving cylinder 31 retracts to drive the mounting plate 32 to move towards the direction close to the side plate 11, and the mounting plate 32 drives the clamping block 324 to displace due to the bearing 214 embedded in the clamping groove 321, so that the first telescopic shaft 211 and the second telescopic shaft 212 are also pushed to displace in the process of displacing, and the clamping seat 22 connected to the other ends of the first telescopic shaft 211 and the second telescopic shaft 212 is relatively close to clamp the wafer 7. In the process that the driving assembly 4 drives the first telescopic shaft 211 and the second telescopic shaft 212 to rotate respectively, the arrangement of the bearing 214 enables the rotation process of the first telescopic shaft 211 and the second telescopic shaft 212 to be more stable, friction force is effectively reduced, and the whole service life of the turnover mechanism is prolonged. Through the design, the whole structure of the turnover mechanism is more compact, the design is more reasonable, and the operation needs of clamping and turnover the wafer 7 can be completed only by controlling the movement of the clamping mechanism 2 without the whole rotation of the turnover mechanism including the frame 1.
The two side plates 11 are respectively connected with the annular mounting member 113 at the far side, the first transmission member 422, the second transmission member 423, the third transmission member 432 and the fourth transmission member 433 respectively penetrate through one annular mounting member 113 and are rotationally connected, the two first brackets 111 are respectively connected with the side surface of one annular mounting member 113 and extend upwards to be connected with the sensor 112, and in the embodiment, the sensor 112 is an infrared sensor. The second bracket 322 is connected to the side of the mounting plate 32 far away from the clamping block 324 and extends upwards to connect with the stop block 323, and the first driving device 3 controls the two groups of clamping mechanisms 2 to be relatively close, the stop block 323 gradually approaches the sensor 112 until the stop block 323 blocks the sensor 112, at this time, the clamping seat 22 clamps the wafer 7 in place, so that the piston rod of the driving cylinder 31 can stop moving, and then the rotating mechanism 41 is started to overturn the wafer 7.
Referring to fig. 2 to 5 and 9, the turnover mechanism further includes two sets of wafer receiving mechanisms 5 for receiving the wafer 7 before the wafer 7 is clamped by the clamping seat 22 and after the wafer 7 is released, the wafer receiving mechanisms 5 include receiving seats 51 symmetrically distributed on two sides of the clamping seat 22, and a second driving device 52 for controlling the receiving seats 51 to displace along a length direction parallel to the first telescopic shaft 211 and the second telescopic shaft 212, and the receiving seats 51 are provided with a plurality of receiving grooves 511 corresponding to the clamping grooves 221. After the robot (not shown) sends the wafers 7 arranged from top to bottom into the frame 1, the two second driving devices 52 control the four receiving seats 51 to move away from the side plates 11 until each wafer 7 is correspondingly inserted into one receiving groove 511, and then the robot (not shown) withdraws from the frame 1, and each wafer 7 is stably received in one receiving groove 511. At this time, the two sets of first driving devices 3 move the two clamping holders 22 away from the side plate 11 until each wafer 7 is stably clamped by one set of clamping grooves 221 formed on the two clamping holders 22, the second driving device 52 moves the receiving seat 51 along the direction opposite to the direction of receiving the wafer 7 until the wafer 7 moves out of the receiving groove 511, and then starts the rotating mechanism 41 to drive the wafer 7 to turn. After the turning of the wafer 7 is completed, the second driving device 52 drives the receiving seats 51 to move along the direction away from the side plates 11 again until each receiving groove 511 receives one wafer 7, then the two groups of first driving devices 3 drive the two clamping seats 22 to move towards the direction close to the side plates 11 to loosen two sides of the wafer 7, and then a mechanical arm (not shown) stretches into the frame 1 to take out the turned wafer 7. The arrangement of the wafer receiving mechanism 5 provides a transfer station between the manipulator (not shown) and the clamping mechanism 2, and each receiving groove 511 corresponds to the position of each clamping groove 221, so that the accuracy and stability of the clamping and overturning process of the wafer 7 are effectively improved, and the efficiency of the wafer overturning operation is further improved.
The number of the clamping grooves 221 of each clamping seat 22 is four in this embodiment, and the groove wall of each clamping groove 221 is an arc shape attached to the edge of the wafer 7, and the central angle of the wafer 7 corresponding to the arc groove wall of each clamping groove 221 is not less than 15 degrees, so that a better supporting effect can be provided for the wafer 7 in the clamping process. Because the number of the clamping seats 22 is four, the number of the receiving grooves 511 formed in each receiving seat 51 is four, and the two sides of the wafer 7, which are contacted with the clamping grooves 221, are received before the wafer 7 is clamped by the clamping seats 22 and after the wafer 7 is released, namely, the wafer 7 is subjected to four-point positioning, so that the clamping grooves 221 can accurately clamp the two radial sides of the wafer 7, the possibility of the wafer 7 sliding damage caused by subsequent overturning due to clamping dislocation is avoided, and the occurrence of defective products and production loss is reduced.
As shown in fig. 2, 7 and 9, the driving end of the second driving device 52 is connected with the receiving seats 51 through the connecting assembly 6, the connecting assembly 6 comprises a first driving plate 61 and a second driving plate 62, the first driving plate 61 is connected between the two receiving seats 51, one end of the second driving plate 62 is connected with the first driving plate 61, and the other end passes through the side plate 11 and is connected with the driving end of the second driving device 52. The driving wheel 412 is disposed under the driven wheel 413, the second driving device 52 is disposed under the driven wheel 413, the driving end of the second driving device 52 is inclined toward a side far away from the driven wheel 413, the second driving plate 62 includes a first plate 621 and a second plate 622 with end portions perpendicular to each other, the driving end of the second driving device 52 is connected to the first plate 621, and the second plate 622 is disposed parallel to the driving end of the second driving device 52 and passes through the side plate 11 to be connected to the first driving plate 61.
In the present embodiment, the second driving device 52 is a cylinder, and therefore the driving end of the second driving device 52 is a piston rod. As shown in fig. 2, in order to improve the compactness of the whole structure of the turnover mechanism, the difference between the width of the bottom plate 12 and the diameter of the wafer 7 is small, and the width of the side plate 11 is equal to the bottom plate 12, so that the area of the side plate 11 is small, the driving wheel 412 and the driven wheel 413 cannot be arranged in parallel, and in order to stably mount the driving motor 411, the bottom surface of the driving motor 411 is fixed on the bottom plate 12, so that the driving wheel 412 is disposed obliquely below the driven wheel 413. The side plate 11 is positioned below the driven wheel 413, the cushion block 114 is arranged below the driven wheel 413, the height of one side of the cushion block 114, which is close to the side plate 11, is higher than the height of the other side, the bottom surface of the second driving device 52 is connected to the slope surface of the cushion block 114, so that the end part of the piston rod of the second driving device 52 is downwards inclined and then connected with the first plate 621, the second plate 622 is perpendicular to the first plate 621, the second plate 622 has the same inclination as the second driving device 52, the transmission belt 414 can be avoided without interfering with the second plate 622, the compactness of the structure of the turnover mechanism is maintained, the control of the clamping seat 22 by the rotating mechanism 41 and the control of the bearing seat 51 by the second driving device 52 are facilitated, and the friction damage of the transmission belt 414 is effectively avoided. Then the second plate 622 penetrates the side plate 11 and then is connected to the middle point of the first driving plate 61, and two ends of the first driving plate 61 are respectively fixed to the bottom surfaces of the two bearing seats 51, so that when the second driving device 52 applies pushing force to the first plate 621, the pushing force can be uniformly applied to the two bearing seats 51 through the second plate 622 and the first driving plate 61, so that the two bearing seats 51 displace synchronously, and the movement process is more stable, so that the wafer 7 can be better borne.
The above list of detailed descriptions is only specific to practical embodiments of the present application, and they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the spirit of the present application should be included in the scope of the present application.
It will be evident to those skilled in the art that the application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (7)
1. A wafer flipping mechanism, comprising: the clamping mechanisms penetrate through the two side plates respectively and are connected with a first driving device for controlling the two groups of clamping mechanisms to mutually approach and clamp two sides of the wafer, and the side plates are connected with a driving assembly for controlling the two groups of clamping mechanisms to synchronously pivot in a plane parallel to the side plates;
the clamping mechanism comprises a telescopic shaft and clamping seats, the telescopic shaft penetrates through the side plates to be connected with the clamping seats, a plurality of clamping grooves matched with the edges of the wafers are formed in parallel on one side, away from the telescopic shaft, of the two clamping seats, and the two groups of first driving devices are respectively connected with one end, away from the clamping seats, of the telescopic shaft and drive the two clamping seats to be close to or far away from each other;
the first driving device comprises a driving air cylinder and a mounting plate, wherein the mounting plate is parallel to the side plate, one side, far away from the driving end, of the driving air cylinder is connected to the side plate, the driving end of the driving air cylinder is perpendicular to the side plate and connected with the mounting plate, a clamping groove is formed in one side, close to the side plate, of the mounting plate, and one end, far away from the clamping seat, of each telescopic shaft is respectively embedded in one clamping groove and is in rotary fit;
the side plate is connected with the sensor through a first bracket, the mounting plate is connected with the stop block through a second bracket, and the stop block is attached to the sensor when the clamping seat clamps the wafer;
the driving assembly comprises a rotating mechanism, a first transmission assembly and a second transmission assembly, the rotating mechanism drives the first transmission assembly to circumferentially rotate, the telescopic shaft comprises a first telescopic shaft and a second telescopic shaft, and the outer walls of the first telescopic shaft and the second telescopic shaft form splines;
the clamping groove is formed in one side, close to the side plate, of the clamping block, one end, far away from the clamping seat, of the first telescopic shaft and one end, far away from the clamping seat, of the second telescopic shaft respectively penetrate through one clamping block and then extend into the mounting plate to be connected with a limiting piece, the diameter of the limiting piece is larger than that of the first telescopic shaft or the second telescopic shaft, and the first telescopic shaft and the second telescopic shaft are respectively in running fit with the clamping groove through bearings;
the first telescopic shaft is in spline fit with the first transmission assembly, and the first transmission assembly comprises a first positioning plate, a first transmission piece, a second transmission piece and a first connecting plate which are axially distributed;
the second telescopic shaft is in spline fit with the second transmission assembly, and the second transmission assembly comprises a second locating plate, a third transmission piece, a fourth transmission piece and a second connecting plate which are axially distributed.
2. The wafer turnover mechanism of claim 1, wherein a transmission plate is connected between the first transmission assembly and the second transmission assembly, the first transmission assembly is penetrated through one side plate and connected with the rotation mechanism, and the second transmission assembly is penetrated through the other side plate;
the two first driving devices respectively drive the first telescopic shaft and the second telescopic shaft to axially displace in the rotating mechanism, the first transmission assembly and the second transmission assembly.
3. The wafer turnover mechanism of claim 2, wherein the rotation mechanism comprises a driving motor, a driving wheel and a driven wheel, the driving motor is coaxially fixed with the driving wheel, the driving wheel and the driven wheel synchronously rotate through a winding transmission belt, the driven wheel is connected with a first transmission assembly, and the first telescopic shaft penetrates through a circle center of the driven wheel.
4. The wafer flipping mechanism of claim 3, further comprising: the wafer supporting mechanisms are arranged in front of the clamping seat for clamping the wafer and are used for supporting the wafer after the wafer is loosened, each group of wafer supporting mechanisms comprises supporting seats which are symmetrically distributed on two sides of the clamping seat respectively, and a second driving device for controlling the supporting seats to move along the length direction parallel to the first telescopic shaft and the second telescopic shaft, and the supporting seats are provided with a plurality of supporting grooves corresponding to the clamping grooves.
5. The wafer turnover mechanism of claim 4, wherein the driving end of the second driving device is connected to the receiving seats through a connecting assembly, the connecting assembly comprises a first driving plate and a second driving plate, the first driving plate is connected between the two receiving seats, one end of the second driving plate is connected to the first driving plate, and the other end of the second driving plate penetrates through the side plate and is connected to the driving end of the second driving device.
6. The wafer turnover mechanism of claim 5, wherein the driving wheel is disposed under the driven wheel, the second driving device is disposed under the driven wheel, the driving end of the second driving device is inclined toward the direction close to the bottom plate, the second driving plate comprises a first plate body and a second plate body with end parts mutually perpendicular, the driving end of the second driving device is connected with the first plate body, and the second plate body is parallel to the driving end of the second driving device and penetrates through the side plate to be connected with the first driving plate.
7. The wafer tilting mechanism according to claim 2, wherein the driving plate comprises a first driving plate and a second driving plate, and the first driving plate and the second driving plate are located at the upper side and the lower side of the clamping seat.
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| CN202210930524.5A CN114999995B (en) | 2022-08-04 | 2022-08-04 | Wafer tilting mechanism |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004241552A (en) * | 2003-02-05 | 2004-08-26 | Shibaura Mechatronics Corp | Apparatus and method for treatment substrate |
| CN103515218A (en) * | 2012-06-18 | 2014-01-15 | 大日本网屏制造株式会社 | Substrate processing apparatus |
| CN104380456A (en) * | 2012-06-15 | 2015-02-25 | 斯克林集团公司 | Substrate inverting apparatus and substrate processing apparatus |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004241552A (en) * | 2003-02-05 | 2004-08-26 | Shibaura Mechatronics Corp | Apparatus and method for treatment substrate |
| CN104380456A (en) * | 2012-06-15 | 2015-02-25 | 斯克林集团公司 | Substrate inverting apparatus and substrate processing apparatus |
| CN103515218A (en) * | 2012-06-18 | 2014-01-15 | 大日本网屏制造株式会社 | Substrate processing apparatus |
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