JP2864376B2 - Substrate processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor substrate or a glass substrate (hereinafter simply referred to as "substrate").

[0002]

2. Description of the Related Art FIGS. 12 and 13 show a prior art of a substrate processing apparatus. As shown in FIG. 12, a substrate transfer unit 103 for taking out a substrate 109 from a cassette 108 accommodating a plurality of substrates 109 or loading a plurality of substrates 109 into the cassette 108 and a plurality of substrates 109 are collectively assembled. Processing section 105, and a plurality of substrates 10 between the substrate transfer section 103 and the substrate processing section 105.
And a substrate transfer robot 104 that collectively holds and transfers the substrates 9. Note that in FIG.
11 is a cassette mounting table, 114 is a rotary drive,
Reference numeral 115 denotes a lower opening of the cassette 108, 116 denotes a delivery tool insertion hole, 117 denotes a substrate delivery tool, and 118 denotes a substrate mounting portion of the substrate delivery tool. In FIG. 13, 10
1 is a cassette loading / unloading stage, 102 is a cassette transport robot, 106 is a substrate drying unit, 107 is a cassette cleaning unit, 110 is a loading position, and 112 is a loading position.

In this type of substrate processing apparatus, a substrate transfer section 1
Unprocessed substrate 109 taken out of cassette 108 in 03
Is transferred to the substrate processing unit 105 by the substrate transfer robot 104, the substrate 109 processed by the substrate processing unit 105 is transferred to the substrate drying unit 106 by the substrate transfer robot 104, and the processed substrate 109 after drying is transferred to the substrate transfer robot At 104, the wafer is transferred to the substrate transfer section 103, where the cleaned cassette 1
08.

In this substrate processing apparatus, the substrate transfer robot 104 has a structure in which a pair of substrate chucks 149 are provided on the traveling unit main body 146 and substrate alignment holding grooves 152 are provided on opposing surfaces 150 of the substrate chuck 149. Transport of the unprocessed substrate 109 and the processed substrate 109
In each case, the substrate 109 is held in the same substrate alignment holding groove 152. In addition, the traveling unit main body 146 is movable up and down.
The unprocessed substrate 109 is moved to the substrate chuck 149
The substrate is immersed in the processing tank 174 of the substrate processing unit 105 while holding the substrate.

[0005]

The above prior art has the following problems. Since the transfer of the unprocessed substrate 109 and the transfer of the processed substrate 109 are both performed by holding the substrate 109 in the same substrate alignment holding groove 152 of the substrate chuck opposing surface 150, the transfer of the unprocessed substrate 109 is performed. Contaminants that have adhered to the processed substrate 10 via the substrate alignment holding groove 152
9 adheres. Therefore, the processed substrate 109 is contaminated. Also, in the pretreatment cleaning of the oxidation diffusion step, the already cleaned substrate is cleaned, so that the substrate is somewhat clean and does not have the above-described contamination problem, but holds the wet substrate after cleaning. When the dried substrate is held by the substrate chuck 149, there is a problem that a watermark is attached depending on the type of the substrate. The contamination of the substrate and the attachment of the watermark all lower the product yield.

The unprocessed substrate 109 is placed on a substrate chuck 149.
The substrate is immersed in the processing tank 174 of the substrate processing unit 105 while being held at the position, so that the contaminants attached to the substrate chuck 149 are brought into the processing tank 174. In addition, it is necessary to lower the substrate chuck 149 to transfer the substrate 109 to and from the substrate transfer tool 117 and to make the substrate chuck 149 deeply enter the processing bath 174.
Since the hanging dimension of the substrate chuck 149 is relatively long,
During the transfer of the substrate, the substrate chuck 149 easily vibrates, and the sliding of the substrate 109 and the substrate alignment holding groove 152 generates particles, which enter the processing tank 174. For this reason,
The inside of the processing tank 174 is contaminated, and the product yield is reduced.

The present invention has been made to solve such inconveniences. Therefore, according to the first aspect of the present invention, it is possible to prevent contamination of a processed substrate by a substrate chuck of a substrate transfer robot or prevent adhesion of a watermark. It is an object of the present invention to provide a substrate processing apparatus capable of performing such processing. According to the second aspect of the present invention, the transfer of an unprocessed substrate, the transfer of a processed substrate, and the transfer of a wet substrate are selectively used on the three chuck-facing surfaces of the transfer robot to further increase the product yield. Make it an issue.

[0008]

[Means for Solving the Problems]

(Invention of Claim 1) A substrate transfer section for taking out a substrate from a cassette accommodating a plurality of substrates or loading a plurality of substrates into the cassette, and a processing tank for immersing the plurality of substrates in a processing solution for processing. A substrate processing apparatus, comprising: a substrate processing unit having a substrate transfer robot that collectively holds and transports a plurality of substrates between the substrate transfer unit and the substrate processing unit. It is characterized by the following.

The above-mentioned substrate transfer robot includes a pair of substrate chucks and chuck rotating means for rotating each of the pair of substrate chucks. The pair of substrate chucks has a plurality of chuck-facing surfaces, The chuck-facing surface has a plurality of substrate alignment holding grooves, and is configured to collectively hold substrates in an upright alignment state on each set of chuck-facing surfaces, and to rotate the substrate chuck by chuck rotating means. The liquid holding groove is formed so as to be recessed between the chuck opposing surfaces of the individual substrate chucks.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, each of the pair of substrate chucks is a rod-shaped member having a triangular cross section, and has three sets of chuck opposing surfaces, and The retaining groove is formed at three corners having a triangular cross section.

[0011]

Effect of the Invention

(Invention of Claim 1) For example, when transferring an unprocessed substrate, when holding the substrate on a set of chuck opposing surfaces of the plurality of chuck opposing surfaces of the substrate chuck and conveying the processed substrate, Holds the substrate on another set of chuck-facing surfaces. That is, the chuck-facing surface for holding the substrate is selectively used for transporting the unprocessed substrate and transporting the processed substrate.
Alternatively, the chuck-facing surface for holding the substrate is selectively used for transporting a wet substrate and transporting a dry substrate. Then, when the wet substrate is transported, the droplet is introduced into the lower liquid stopping groove along the substrate alignment holding groove,
Once the liquid droplet is introduced into the liquid stopping groove, even if the liquid stopping groove rotates until the liquid stopping groove is positioned above, the liquid droplet is prevented from flowing down due to its own surface tension, and even if the substrate chuck is rotated, The droplet does not move to the substrate alignment holding groove located on another surface so as to go around the surface of the substrate chuck.

(Invention of claim 2) Each of the pair of substrate chucks is a rod-shaped member having a triangular cross section, and has a chuck opposing surface on each side of the triangular shape. The processed substrate is transported, the processed substrate is transported on another set of chuck-facing surfaces, and the wet substrate is held on another set of chuck-facing surfaces. In other words, three chuck-facing surfaces are selectively used for transporting an unprocessed substrate, transporting a processed substrate, and transporting a wet substrate. Further, since the liquid stopping groove is formed at three corners having a triangular cross section, when the wet substrate is transported, the droplet travels along the substrate alignment holding groove located on one side having the triangular cross section. The liquid droplets introduced into the lower liquid retaining groove and once introduced into the liquid retaining groove, even if the liquid retaining groove is positioned at the upper side, are located on another side having a triangular cross section. Never move to

[0013]

【The invention's effect】

(Invention of claim 1) By switching the chuck-facing surface of the substrate transfer chuck between the transfer of the unprocessed substrate and the transfer of the processed substrate, the contaminants adhering to the unprocessed substrate have been processed through the substrate transfer chuck. Contamination of the processed substrate due to transfer to the substrate can be prevented. Alternatively, the chuck opposing surface can be selectively used for a dry substrate and a wet substrate. When the wet substrate is transported, the liquid droplets adhering to the substrate are introduced into the liquid stopping groove, and the liquid droplet once introduced into the liquid stopping groove moves to the substrate alignment holding groove located on another surface. Therefore, it is possible to prevent the droplet from adhering to the dried substrate. This allows
The adverse effect of forming a watermark on a dry substrate can be effectively prevented, and the product yield can be increased.

According to a second aspect of the present invention, three chuck-facing surfaces can be selectively used for transporting an unprocessed substrate, transporting a processed substrate, and transporting a wet substrate, and the liquid stopping groove has a triangular cross section. Because it is formed at the three corners of
The effects of the invention according to claim 1 (prevention of contamination of the processed substrate and prevention of adverse effects due to the watermark) can be achieved more reliably, and the yield of products can be further improved.

[0015]

An embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 11, the substrate processing apparatus according to this embodiment includes a cassette loading / unloading stage 1, a cassette transfer robot 2, a substrate transfer unit 3, a substrate transfer robot 4, a substrate processing unit 5, A drying unit 6 and a cassette cleaning unit 7 are provided. The cassette 8 used in this embodiment is provided with a substrate alignment receiving groove inside so that a plurality of substrates 9 can be stored in an upright alignment state. Hereinafter, the configuration of each unit will be described.

In this substrate processing apparatus, when a cassette 8 accommodating an unprocessed substrate 9 is loaded into the loading position 10 of the cassette loading / unloading stage 1 from outside the substrate processing apparatus, two cassettes 8 are placed in the cassette transport robot 2. Is transported to the cassette mounting table 11 of the substrate transfer section 3 where the cassette 8
Two unprocessed substrates 9 are transferred to a substrate transfer device 17 described later.
Is taken out of the cassette 8 and delivered to the substrate transfer robot 4.

The substrate transport robot 4 transports the received unprocessed substrate 9 to the substrate processing unit 5, processes the substrate 9 in the substrate processing unit 5, and transports the processed substrate 9 to the substrate drying unit 6 again by the substrate transport robot 4. The substrate is transferred to the substrate transfer section 3 by the substrate transfer robot 4 again. On the other hand, the empty cassette 8 from which the unprocessed substrate 9 has been previously taken out by the substrate transfer section 3 is transported to the cassette cleaning section 7 by the cassette transport robot 2 for cleaning. Then, the cleaned cassette 8 is transported to the cassette mounting table 11 of the substrate transfer section 3 by the cassette transport robot 2. In the substrate transfer section 3, the processed substrate 9 is transferred to the washed cassette 8, and the cassette 8 is transferred by the cassette transfer robot 2 to the unloading position 12 of the cassette loading / unloading stage 1.
And then carried out of the substrate processing apparatus.

As described above, in the substrate processing apparatus, the cassette 8 is transported between the cassette loading / unloading stage 1 and the cassette mounting table 11 by the cassette transport robot 2, as shown in FIG. In the cassette 8, which takes the loading / unloading posture in the cassette loading / unloading stage 1,
The accommodation posture of the substrate 9 is a direction orthogonal to the processing posture of the substrate 9 in the substrate processing unit 5 in plan view. Further, the cassette transport robot 2 moves the cassette 8 between the cassette mounting table 11 and the cassette loading / unloading stage 1 by 180.
機構 Uses a mechanism that reverses and conveys.

For this reason, before the substrate processing, the cassette 8 having the loading position at the loading position 10 of the cassette loading / unloading stage 1 is set.
By the cassette transport robot 2
The substrate 9 in the cassette 8 on the cassette mounting table 11 is in a posture perpendicular to the processing posture in a plan view, and in this posture, the substrate 9 is in a posture parallel to the processing posture. The unprocessed substrate 9 cannot be transferred to the substrate transfer robot 4 which holds and transfers the unprocessed substrate 9. In addition, when the cassette 8 is transferred from the cassette mounting table 11 to the unloading position 12 of the cassette loading and unloading stage 1 by the cassette transfer robot 2 after the substrate processing, the cassette 8 is set to the unloading position at the unloading position 12. It is necessary to keep the cassette 8 on the cassette mounting table 11 180 ° inverted with respect to the unloading attitude, but the cleaned cassette 8 is mounted on the cassette mounting table 11 in such an attitude. In this case, the substrate accommodation direction of the cleaned cassette 8 is orthogonal to the processing posture in a plan view. Therefore, in this posture, the substrate conveyance is performed while holding the substrate 9 in a posture parallel to the processing posture. The processed substrate 9 cannot be received from the robot 4 into the cleaned cassette 8.

For this reason, in this substrate processing apparatus, the turntable 1 is attached to the cassette mounting table 11 of the substrate transfer section 3.
3 is provided. The configuration of the substrate transfer unit 3 is as follows. That is, as shown in FIG. 2, two turntables 13 are provided at two cassette mounting positions of the cassette mounting table 11, and this turntable 13 is interlocked and connected to a rotation driving device 14 described later. Turntable 1
3 is rotated by 90 °. As shown in FIG. 1, a delivery tool insertion hole 16 facing the lower opening 15 of the cassette 8 is formed in the center of the turntable 13.
The board transfer tool 17 is located below the transfer tool insertion hole 16.
Are provided in an upright state, and a substrate placing portion 18 for holding the plurality of substrates 9 in an upright alignment state is provided at an upper end portion of the substrate transfer tool 17. The board transfer tool 17 is provided on an elevating table 20 linked to a vertical feed screw shaft 19 linked to a lift drive means 85 (a lift drive motor).
By moving up and down, the plurality of substrates 9 are held in the standing and aligned state by the substrate mounting portion 18 so that the plurality of substrates 9 can be collectively transferred between the inside of the cassette 8 and the substrate transport robot 4. is there.

In the substrate transfer section 3, as shown in FIG. 2, before the substrate processing, the cassette transfer robot 2 turns the turntable 1 from the loading position 10 of the cassette loading / unloading stage 1.
The orientation of the cassette 8 conveyed to the cassette 3 is changed by 90 ° by the rotation of the turntable 13 in the direction a, and the accommodation attitude of the unprocessed substrates 9 in the cassette 8 is changed to the processing attitude of the substrates 9 in the substrate processing unit 5. As shown in FIG. 1, the unprocessed substrate 9 is
Is held, the unprocessed substrate 9 is taken out above the cassette 8, and without rotating the substrate transfer tool 17,
The unprocessed substrate 9 in the cassette 8 is delivered to the substrate transfer robot 4.

After the substrate processing and drying, the cleaned cassette 8 transferred to the turntable 13 by the cassette transfer robot 2 from the cassette cleaning section 7 shown in FIG.
From the position shown in FIG. 2 by the rotation of the turntable 13 in the direction a, the substrate is accommodated in a direction parallel to the processing position, as shown in FIG. The substrate mounting portion 18 of the substrate transfer tool 17 is lifted to hold the processed substrate 9 transferred by the substrate transfer robot 4, and in this state, the substrate transfer tool 17 is lowered and the substrate transfer tool 17 is lowered. The processed substrate 9 is removed from the cleaned cassette 8 without rotating the
Hand it over. Then, as shown in FIG. 2, the cleaned cassette 8 containing the processed substrate 9 is turned 90 ° by rotating the turntable 13 in the direction b, and the cassette is unloaded by the cassette transport robot 2. When the cassette 8 is conveyed to the carry-out position 12 of the
Is in the unloading position at the unloading position 12.

As described above, in the substrate transfer section 3, FIG.
As shown in (1), when the substrate 9 is transferred between the cassette 8 and the substrate transfer robot 4, it is not necessary to rotate the substrate transfer tool 17, so that the substrate held on the substrate mounting portion 18 of the substrate transfer tool 17 is not necessary. The posture of 9 does not shift. In addition, when changing the direction of the substrate 9, the turntable 13 is held while the substrate 9 is stably stored and held in the cassette 8.
Is rotated, so that the rotation speed of the turntable 13 can be set high without fear of a displacement of the posture of the substrate 9.

The specific structure of the turntable 13 of the substrate transfer section 3 and the rotation driving device 14 is as follows. As shown in FIG. 3A, the turntable 13 is mounted on the base plate 21 of the cassette mounting table 11 with the bearing 2.
It is rotatably mounted via 2. A rotary drive device 14 for rotating the turntable 13 uses a rotary drive motor, and a pinion gear 24 fixed to the output shaft 23 is externally fixed to the turntable 13.
5, the rotation angle is set to 90 °, and the turntable 13 is rotated as shown in FIG. 3 (C).

As shown in FIG. 3 (B), a cassette positioning frame 26 is formed on the turntable 13 along the three sides of the periphery of the rectangular delivery tool insertion hole 16 in a U-shape in plan view. At the same time, a cassette clamp 27 is provided on the other side of the peripheral edge so that the cassette 8 can be positioned and fixed on the turntable 13 at an appropriate position. In this embodiment, a rotary drive motor is used for the rotary drive device 14. Instead, as shown in FIGS. 3D and 3E, a rotary drive air cylinder is used for the rotary drive device 14. You may. In FIG. 3D, a rack gear 29 is attached to a piston 28 of a rotary drive cylinder, and the rack gear 29 is meshed with a ring gear 25 that is externally fixed to the turntable 13. In FIG. 3E, the piston 28 of the rotary driving air cylinder is pivotally mounted on a ring 30 externally fitted and fixed to the turntable 13.

As shown in FIG. 4A, a box 33 is attached to the upper end of a pipe 32 erected on a pipe support table 31. Is provided on the upper surface. This substrate mounting portion 18
Is composed of an elevating mounting part 38 and a fixed mounting part 39 for holding a plurality of substrates in a standing and aligned state, respectively. The lifting and lowering section 38 is composed of two parts, and the fixed placing section 39 is composed of three parts. The fixed mounting portion 39 has three fixed seats 34 fixed to the center and both sides of the upper surface of the box 33, and the elevating mounting portion 38 has two fixed seats 35 disposed between the fixed seats 34. It is attached.

The elevating seat 35 is fixed to the upper end of an elevating rod 36 penetrating through the pipe 32, and the elevating rod 36 is connected to an elevating drive device 37 attached to the pipe support 31. The lifting drive device 37 uses a lifting cylinder. That is, the two lifting / lowering mounting portions 38 constituting the substrate mounting portion 18 are switched between a rising position protruding above the fixed mounting portion 39 and a lowering position sinking below the fixed mounting portion 39. It is possible. For example, in FIG.
When the unprocessed substrate 9 is transferred from the cassette 8 to the substrate transfer robot 4, the lifting and lowering unit 38 is set to the raised position, and when the processed substrate 9 is transferred from the substrate transfer robot 4 to the cleaned cassette 8. Sets the lifting / lowering mounting portion 38 to the lowered position.

According to the above configuration, when the unprocessed substrate 9 is delivered, the unprocessed substrate 9 is held by the elevating mounting portion 38 and does not touch the fixed mounting portion 39. There is no contamination by the contaminants attached to the substrate 9. When the processed substrate 9 is delivered, the processed substrate 9 is held on the non-contaminated fixed mounting portion 39, so that the processed substrate 9 is prevented from being contaminated. Conversely, it is also possible to transfer the unprocessed substrate 9 by the fixed mounting portion 39 with the lifting / lowering mounting portion 38 being the lowered position, and to deliver the processed substrate 9 by setting the lifting / lowering mounting portion 38 to the raised position. Similarly, contamination of the processed substrate 9 can be prevented.

The lifting / lowering mounting portion 38 and the fixed mounting portion 39
As shown in FIG. 4 (C), the substrate 9
A substrate alignment holding groove 90 having the same pitch as the substrate alignment holding groove of the cassette 8 is provided in a main surface direction (a direction parallel to the paper surface in FIG. 4) of the cassette 8. The edge 92 is chamfered in a C shape to facilitate holding of the substrate. Further, as shown in FIG. 4B, the two lifting / lowering mounting portions 38 and the three fixed mounting portions 39 are formed by cutting the integrally processed normal substrate mounting portion 18 along a chain line portion. Can be easily manufactured.

As shown in FIG. 4B, the substrate aligning and holding groove 90 having a shape along the outer periphery of the substrate 9 held therein is cut out in the elevating and lowering mounting portion 38 and the fixed mounting portion 39. The substrate alignment holding groove 90 includes a straight portion 95 corresponding to the orientation flat of the substrate 9 and a curved portion 96 other than the straight portion 95. That is, a straight portion 95 corresponding to the orientation flat of the substrate 9 is cut out between the central fixed mounting portion 39 and the elevating mounting portions 38 on both sides thereof, and the outer fixed portion is fixed from the elevating mounting portion 38. Mounting part 3
9, a curved portion 96 is cut out. In other words, since the lifting / lowering mounting portions 38 have the linear portion 95 and the curved portion 96 and the fixed mounting portion 39 has the linear portion 95 and the bending portion 96, the lifting / lowering mounting portion 38 or the fixed mounting portion Even when the substrate 9 is held by any of the mounting portions 39, the rotation of the substrate 9 can be prevented.

In the above embodiment, the substrate transfer device 1
7 is composed of the elevating mounting part 38 and the fixed mounting part 3.
9, the lifting / lowering mounting part 38 moves up and down and the fixed mounting part 3
Although the description has been made assuming that 9 is fixed, both can be configured to be able to move up and down.

As shown in FIG. 5, two board transfer tools 17 are provided to transfer the board 9 between the two cassettes 8 and the board transfer robot 4. The two substrate transfer tools 17 can be shifted in width by a shifter 42. The configuration of the width shifting device 42 is as follows. As shown in FIG. 6A, the two pipe supports 31 are slidably supported by guide rails 43 on the elevating platform 20, and the two pipe supports 31 are connected by a linking link mechanism 44. As shown in FIG. 6 (A), the width-adjusting link mechanism 44 pivotally connects the center of the link arm 83 to a support shaft 82 vertically suspended from the center of the elevating platform 20, and both ends of the link arm 83 and both ends thereof. A link rod 84 is interposed between the pipe support table 31 and the pipe support base 31. And FIG.
As shown in (B), one of the pipe support bases 31 is interlockingly connected to the width shifting drive cylinder 45 attached to the lift 20.

In this width shifting device 42, when the width shifting drive cylinder 45 is reduced, one of the pipe support bases 31 connected thereto moves toward the center of the elevating platform 20 and at the same time via the width shifting link mechanism 44. The other pipe support table 31 also moves toward the center side of the lift table 20, and both substrate transfer tools 17
Is narrowed down. In addition, when the width shifting drive cylinder 45 is extended, both the board transfer tools 17 move away from each other. As shown in FIG. 5, in the width shifting device 42, two groups of unprocessed substrates 9 are removed from the two cassettes 8 before the substrate processing.
When the substrate transfer robot 4 transfers the unprocessed substrates 9 of the respective groups to the substrate mounting portions 18 of the two substrate transfer tools 17, the two substrate transfer tools 17 are brought closer to each other by width adjustment. These are transferred to the substrate transfer robot 4 without creating a large gap between the unprocessed substrates 9. Further, after the substrate processing, when the processed substrates 9 for the two cassettes 8 are transferred from the substrate transport robot 4 to the two cleaned cassettes 8, the processed substrates 9 transported by the substrate transport robot 4 are transferred to the cassettes. The two substrate mounting portions 1 of the two substrate transfer tools 17 which have been narrowed above the upper surface 8
The processed substrates 9 are separated into two groups by separating the substrate transfer tools 17 from each other, and each group is accommodated in two cleaned cassettes 8.

Next, the configuration of the substrate transfer robot 4 will be described. As shown in FIG. 1, the substrate transfer robot 4 rotates the traveling unit body 46, a pair of left and right arm rotation shafts 47 projecting substantially horizontally from the traveling unit body 46, and rotates the pair of arm rotation shafts 47. A shaft rotating means 48 and a pair of substrate chucks 49 fixed to each arm rotating shaft 47 are provided. In the pair of substrate chucks 49, substrate alignment holding grooves 52 and 53 having the same pitch as the array pitch of the substrate alignment accommodation grooves of the cassette 8 are formed on the pair of chuck opposing surfaces 50 and on the back surfaces of the chuck opposing surfaces 51, respectively. Then, by rotating the arm rotation shaft 47, the substrate chuck 49 can be switched to an inverted U-shaped substrate holding posture in which the pair of chuck opposing surfaces 50 and the opposing chuck opposing surfaces 51 thereof face each other. It is. Note that the arrangement pitch of the substrate alignment holding grooves 52 and 53 on the chuck facing surfaces 50 and 51 does not necessarily have to be the same as the arrangement pitch of the substrate alignment accommodation grooves of the cassette 8, and is 当 該 of the arrangement pitch of the cassette 8. The arrangement pitch may be used. This is because the substrate 9 taken out of the cassette 8 may be converted into half by an arrangement pitch converter or the like.

In the substrate transfer robot 4, when transferring the unprocessed substrate 9, the pair of chuck opposing surfaces 50 of the substrate chuck 49 face each other, and when transferring the processed substrate 9, the back surface is set. Are switched to a posture in which the chuck facing surfaces 51 face each other. In this way, when the unprocessed substrate 9 is transported, the substrate alignment holding groove 53 on the chuck opposing surface 51 on the back surface is not contaminated by the contaminants attached to the unprocessed substrate 9, and the processed substrate 9 is not contaminated.
During the transfer, contamination of the processed substrate 9 is prevented.

The substrate cleaning apparatus according to the present invention can also be applied as a pretreatment cleaning apparatus for an oxidation diffusion step. In this case, the already cleaned substrate is cleaned. Is somewhat clean and has no cross-contamination, so that the substrate chuck 49 can be selectively used before and after cleaning, that is, for holding a dry substrate and holding a wet substrate, as described later, rather than preventing contamination. .

The specific structure of the substrate chuck 49 is as follows. As shown in FIG.
Are end plates 5 at both ends of a plate-like chuck body 54.
The arm rotation shaft 47 is inserted and fixed to the center of the chuck body 54 and the center of the end plate 55. A pair of reinforcing pipes 59 is provided between the end plates 55.
Are mounted in parallel, and this is inserted into the chuck body 54 and fixed. As shown in FIG. 7B, both the substrate alignment holding grooves 52 and 53 of the chuck body 54 are formed in an arc shape along the peripheral edge of the substrate 9. Further, as shown in FIG. 7C, the release edges 57 of the substrate alignment holding grooves 52 and 53 are chamfered in a C-shape. This substrate chuck 4
Reference numeral 9 denotes a substrate alignment holding groove 5 as shown in FIGS.
A groove forming pipe 58 around which 2 and 53 are provided at an equal pitch may be externally fitted to the reinforcing pipe 59. In this case, by screwing the end plate 55 to the reinforcing pipe 59, the groove forming pipe 58 can be pinched and fixed between both end plates 55.

As shown in FIG. 8A, a pair of chuck rotating motors are used for the chuck rotating means 48 for rotating the arm rotating shaft 47. The chuck rotating motor is fixed to the traveling section main body 46, the arm rotating shaft 47 is connected to each output shaft 60 by a shaft joint 61, and the two arm rotating shafts 47 are individually rotated and linked. A travel drive motor is used as the travel drive means 62 of the travel section body 46. The traveling drive motor is fixed to a fixed machine frame 63 and a drive pulley 65
, And an interlock belt 66 is wound between an idler pulley (not shown) pivotally attached to the fixed machine frame 63 and a drive pulley 65, and the traveling unit body 46 is mounted on the interlock belt 66. Also, as shown in FIG.
Is slidably mounted on a guide rail 67 provided on the fixed machine frame 63.

As shown in FIG. 8C, the substrate transport robot 4 uses a single rotating motor to rotate the chuck rotating means 4.
8 and a driving gear 68 attached to the output shaft 60 thereof.
Gear 69 and one arm rotating shaft 47
The input gear 70 attached to the other arm rotation shaft 47 is connected to the input gear 70 attached to the
9 may be engaged with each other. As shown in FIG. 8D, a traveling drive motor, which is traveling drive means 62, is attached to the traveling section main body 46, and its output shaft 64 is provided.
May be engaged with the rack gear 73 attached to the fixed machine frame 63 to make the traveling unit body 46 self-propelled.

FIGS. 9A to 9D show a substrate chuck 49.
The following shows a modified example. The modification shown in FIG. 7A takes into consideration the case where the substrate chuck 49 is selectively used for holding a dry substrate and holding a wet substrate, and is provided at both upper and lower ends of the chuck main body 54 in FIG. Liquid stopping groove 54a running in the front-back direction
Is formed by recessing. According to this modification, when the substrate 9 after the immersion processing is held in the substrate processing unit 5 described later, the droplets attached to the substrate 9 travel along the substrate alignment holding groove 53 and enter the liquid stopping groove 54a. be introduced. Therefore, when the dry substrate 9 is held by the other pair of chuck-facing surfaces 50, the liquid retaining groove 54a is located at an upper position. It is prevented from flowing down due to surface tension and is prevented from adhering to the dry substrate 9. Note that this liquid stopping groove 54a is
In the modified examples of (B) to (D), they are formed similarly.

A modified example of FIG.
7A is constituted by a rod member having a substantially rectangular cross section instead of the plate member in FIG. 7A. The arm rotation shafts 47 are separated from each other by an actuator 47a described later, and the arm rotation shaft 47 is rotated. Chuck facing surfaces 50a and 50b
Is configured to be switched. 9C, the chuck main body 54 is configured to hold the substrate 9 at the center instead of the chuck main body 54 shown in FIG. 9B, and the other points are the same as those of FIG. 9B. It is configured similarly. Further, in the modification of FIG. 9D, the chuck body 54
9C is constituted by a rod member having a substantially triangular cross section in place of that of FIG. 9C, and three sets of chuck opposing surfaces 50a, 50b, and 50c are switched. It is configured in.

FIG. 10 is a perspective view showing a means for separating and rotating the arm rotation shaft 47. As shown in FIG. 10, the pair of arm rotating shafts 47 are respectively provided on a pair of left and right bases 46b, 46b, and each base 46b is mounted on the traveling unit body 46 by a pair of left and right actuators 48b, 48b. A pair of front and rear guide rails 67b provided at
Is provided so as to be movable along. Other points are the same as those in FIG.

The substrate processing section 5 has three processing tanks 74 as shown in FIGS. 1, 2 and 11, and these processing tanks 74 are configured as overflow tanks capable of so-called single bath processing. Have been. Each processing tank 74 is provided with a processing substrate mounting tool 75 for supporting the substrate 9.
The processing substrate mounting tool 75 can be moved up and down in conjunction with an elevating drive means 76 shown in FIG. 2 or FIG.
That is, as shown in FIG. 1, the position at which the substrate 9 held on the substrate mounting portion 18 of the substrate transfer tool 17 in the substrate transfer portion 3 is transferred to the substrate transfer robot 4 is defined as a first substrate transfer position 77. , Processing substrate mounting tool 7 of each processing tank 74
Assuming that the position at which the substrate 9 held at 5 is transferred to the substrate transfer robot 4 is a second substrate transfer position 78 (in FIG. 1, the central processing tank 74 is shown), the processing substrate mounting member 75 The substrate 9 held here is lifted and lowered.
Can be moved up and down between a second substrate transfer position 78 and a substrate processing position 79 where the substrate is immersed in the processing tank 74 to perform the processing. And the substrate transfer robot 4
Is designed to travel between a first substrate transfer position 77 and a second substrate transfer position 78.

In the above-described embodiment, the substrate transfer robot 4 travels only in the horizontal direction along the pair of guide rails 67. However, according to the arrangement of the substrate transfer unit 3, the substrate processing unit 5, and the like. It is also possible to move between the first substrate transfer position and the second substrate transfer position in biaxial or triaxial directions including the vertical direction. The traveling in this specification is a concept including such a movement in a biaxial or triaxial direction.

In the substrate processing section 5, the unprocessed substrate 9 transported by the substrate transport robot 4 is delivered to the raised processing substrate mounting section 75, and the processing substrate mounting section 75 is lowered. The substrate 9 is positioned at the substrate processing position 79 of the processing tank 74 and immersed in the processing liquid 80 to perform the processing. Processing tank 7
When the substrate processing in Step 4 is completed, the processing substrate mounting unit 75 is raised and transferred to the substrate transfer robot 4. Thus, the unprocessed substrate 9 is transferred to the processing substrate mounting portion 75 of the substrate processing portion 5.
The substrate chuck 49 of the substrate transfer robot 4 holding the substrate 9 does not need to be immersed in the processing liquid 80 of the processing tank 74 by holding and lifting the substrate 9.
No contaminants attached to the processing tank 74 are brought into the processing tank 74. In addition, since there is no need for the substrate chuck 49 to enter the processing bath 74, the hanging dimension of the substrate chuck 49 can be reduced, the substrate chuck 49 is less likely to vibrate during the transport of the substrate, and the substrate 9 and the substrate chuck 49 are aligned and held. Generation of particles due to sliding with the grooves 52 and 53 is reduced, and intrusion of particles into the processing tank 74 is reduced.

Hereinafter, a series of operations of the present embodiment will be briefly described. First, two cassettes 8 storing a plurality of unprocessed substrates W are loaded at the loading position 1 of the cassette loading / unloading stage 1.
0. The cassette transfer robot 2 is
The individual cassettes 8 are transferred onto the turntable 13 of the substrate transfer section 3. After the turntable 13 rotates 90 °,
The substrate transfer tool 17 moves up to take out the substrate 9 from the cassette C. At this time, the substrate mounting portion 18 of the substrate transfer tool 17 is switched to the elevating and lowering mounting portion 38 to hold the unprocessed substrate and prevent contamination of the processed substrate.

The substrate transfer robot 4 receives the unprocessed substrate 9 taken out of the cassette 8 and transfers it to the substrate processing section 5. At this time, to prevent contamination of the processed substrate,
The chuck opposing surfaces 50 and 51 of the substrate chuck 49 of the substrate transfer robot 4 are selectively used for the unprocessed substrate and the processed substrate as described above, thereby preventing the processed substrate from being contaminated. In the substrate processing section 5, the substrate 9 transported by the substrate transport robot 4 is received by the processing substrate mounting tool 75, and is sequentially immersed in a predetermined substrate processing tank 74 to perform surface processing. The substrate W subjected to the surface treatment is transferred to the substrate drying unit 6 by the substrate transfer robot 4. In the substrate drying unit 6, the transported substrate 9 is received by a lifter (not shown) similar to the substrate transfer tool 17, and is subjected to a drying process in a centrifugal dryer 61.

On the other hand, during the surface treatment of the substrate, the cassette transport robot 2 transports the two empty cassettes 8 to the cassette cleaning section 7. In the cassette cleaning section 7, the two cassettes 8 that have been transported are separated by a cassette lifter (not shown).
, Immersed in the cassette washing tank to perform the washing process, drained after the washing, and drained the heater (not shown).
Dry with. That is, by performing the surface treatment of the substrate 9 and the cleaning treatment of the cassette 8 in parallel, the processing efficiency is increased as a whole.

The cassette transfer robot 2 transfers the dried cassette 8 to the turntable 13 of the substrate transfer section 3 again. The dried substrate 7 is transferred to the substrate transfer robot 4
Is transferred to the substrate transfer section 3 by the In the substrate transfer section 3, the processed substrate 9 is stored in the cleaned cassette 8 via the substrate transfer tool 17. At this time, the substrate mounting portion 18 of the substrate transfer tool 17 is switched to the fixed mounting portion 39 to hold the processed substrate and prevent the processed substrate from being contaminated. The cassette transport robot 2 transports the two cassettes 8 containing the substrates 9 to the unloading section 12 of the cassette loading / unloading stage 1. Thus, a series of operations is completed.

The substrate cleaning apparatus according to the present invention can also be applied as a pretreatment cleaning apparatus in the oxidation diffusion step as described above. In this case, contamination of the substrate does not cause a problem. It is not necessary to switch between the lifting / lowering mounting portion 38 and the fixed mounting portion 39 of the delivery tool 17. Rather, before and after the cleaning process and before and after the drying, that is, when holding the dry substrate and when holding the wet substrate, the substrate chuck 49 is used.
It is necessary to use the chuck facing surfaces 50 and 51 properly. This is because, depending on the type of the substrate, when it comes into contact with the substrate chuck 49 wet in a dry state, a stain called a watermark may occur. By properly using the chuck opposing surfaces 50 and 51 as described above, the occurrence of a watermark can be prevented. Note that even if the substrate is held by the wet substrate chuck before the cleaning process, the influence of the watermark does not cause any problem. After that, the cleaning process is performed.

[Brief description of the drawings]

FIG. 1 is a vertical sectional front view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the substrate processing apparatus of FIG.

3A and 3B are explanatory views of a turntable used in the substrate processing apparatus of FIG. 1, wherein FIG. 3A is a longitudinal sectional view, FIG. 3B is a plan view, and FIG. FIG. 3D is a sectional view taken along the line C-C, FIG. 4D is a view corresponding to FIG. 4C of a first modification of the rotation drive mechanism of the turntable, and FIG. 6E is a second modification of the rotation drive mechanism of the turntable. (C) of FIG.

4A and 4B are views for explaining a substrate transfer tool used in the substrate processing apparatus of FIG. 1, wherein FIG. 4A is a longitudinal sectional view, and FIG. 4B is a description of a production example of a substrate mounting portion of the substrate transfer tool. FIG. 3C is a partial cross-sectional view of the substrate mounting portion.

FIG. 5 is a sectional view taken along line VV of FIG. 1;

FIGS. 6A and 6B are explanatory views of a width shifting link mechanism used in the substrate processing apparatus of FIG. 1, wherein FIG. 6A is a longitudinal sectional view and FIG. 6B is a plan view.

7A and 7B are diagrams illustrating a substrate chuck of a substrate transfer robot used in the substrate processing apparatus of FIG. 1, wherein FIG.
FIG. 2B is a sectional view taken along line BB of FIG. 2A, and FIG.
Is a cross-sectional view taken along the line CC of FIG. 4B, FIG. 4D is a vertical cross-sectional view of a modified example of the substrate chuck, and FIG.
FIG. 4 is a sectional view taken along line -E.

8A and 8B are diagrams illustrating a substrate chuck rotating mechanism and a traveling mechanism of a traveling unit body of the substrate transport robot used in the substrate processing apparatus of FIG. 1, wherein FIG. 8A is a perspective view and FIG. 10A is a side view, FIG. 10C is a perspective view of a modification, and FIG. 10D is a side view of FIG.

FIGS. 9A, 9B, 9C, and 9D are front views showing modifications of the substrate chuck, respectively.

FIG. 10 is a perspective view corresponding to FIG. 8 (A) showing a separating and rotating mechanism of the substrate chuck shown in FIGS. 9 (B), 9 (C) and 9 (D).

FIG. 11 is a perspective view of the substrate processing apparatus of FIG. 1;

FIG. 12 is a diagram corresponding to FIG. 1 of a substrate processing apparatus according to a conventional technique.

FIG. 13 is a plan view of the substrate processing apparatus of FIG.

[Explanation of symbols]

Reference numeral 3 denotes a substrate transfer unit, 4 denotes a substrate transfer robot, 5 denotes a substrate processing unit, 8 denotes a cassette, 9 denotes a substrate, 48 denotes a chuck rotating unit, 49 denotes a substrate chuck, and 50, 50a, 50b, and 50.
c · 51 ··· Chuck facing surface, 52 · 53 · · · Substrate alignment holding groove, 54 a · Liquid stopping groove, 74 ··· Processing tank.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/304 648 H01L 21/68

Claims (2)

(57) [Claims] 1. A substrate transfer unit for taking out a substrate from a cassette containing a plurality of substrates or loading a plurality of substrates into the cassette, and a processing tank for immersing the plurality of substrates in a processing liquid for processing. A substrate processing apparatus comprising: a processing unit; and a substrate transfer robot that collectively holds and transports a plurality of substrates between the substrate transfer unit and the substrate processing unit. Substrate chucks, and chuck rotating means for rotating each of the pair of substrate chucks. The pair of substrate chucks has a plurality of sets of chuck opposing surfaces, and each set of the chuck opposing surfaces has a plurality of substrate alignment and holding. It has a groove and is configured to hold the substrates collectively in an upright alignment state on each set of the chuck-facing surfaces, and the chuck of the substrate chuck is rotated by rotating the substrate chuck by chuck rotating means. Click facing surface and configured to be capable of switching the, between the chuck surface facing the chuck facing surface of the individual substrate chuck, a substrate processing apparatus, characterized in that the liquid stopping groove concaved formed. 2. The substrate processing apparatus according to claim 1, wherein each of the pair of substrate chucks is a rod-shaped member having a triangular cross section, and has three sets of chuck opposing surfaces, and the liquid stopping groove has a triangular cross section. A substrate processing apparatus characterized by being formed at three corners of a shape.