TW529072B - Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device - Google Patents

Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device Download PDF

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Publication number
TW529072B
TW529072B TW091102877A TW91102877A TW529072B TW 529072 B TW529072 B TW 529072B TW 091102877 A TW091102877 A TW 091102877A TW 91102877 A TW91102877 A TW 91102877A TW 529072 B TW529072 B TW 529072B
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TW
Taiwan
Prior art keywords
substrate
lifting
substrate processing
processing
winding
Prior art date
Application number
TW091102877A
Other languages
Chinese (zh)
Inventor
Shigeru Mizukawa
Katsutoshi Nakata
Shunji Matsumoto
Original Assignee
Sumitomo Precision Prod Co
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Publication of TW529072B publication Critical patent/TW529072B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Abstract

The present invention relates to a lift-type substrate treatment device, which has a function of transferring a substrate from one to the other side of a treatment line and is capable of treating the substrate during a transfer process, and a substrate treatment system having the lift type substrate treatment device. The lift-type substrate treatment device is provided with the followings: a cabinet-like cover body 11 having a substrate inlet 11a and a substrate outlet 11b provided in parallel with each other in vertical direction; a treatment mechanism 20, which is installed in the cover body and is provided with a transfer/supporting means for supporting/accepting the substrate carried in from the substrate inlet 11a and discharging the substrate from the substrate outlet, a support frame for supporting the transfer/supporting means, and a fluid treatment discharge means disposed above the transfer/supporting means for discharging the treatment fluid onto the substrate; and a lifting mechanism 40 for supporting and lifting the treatment mechanism 20 in a vertical direction to move the treatment mechanism 20 to the substrate inlet 11a and the substrate outlet 11b.

Description

529072 A7 _____B7 _ 五、發明說明(/ ) 技術領域 本發明是關於在半導體(矽)晶圓、液晶玻璃基板、光 罩用玻璃基板、光碟用基板等之各種基板上,將其一面移 動(搬送)一面進行既定處理的處理裝置,及將複數個處理 裝置予以連結而構成的基板處理系統。 背景技術 例如,在液晶玻璃基板之製程中有濕式過程處理,如 顯像液之塗佈、蝕刻液之塗佈、爲了剝離光阻膜所作之剝 離液塗佈等,而在各濕式過程處理之間則有洗淨處理及乾 燥處理。 就進行上述各處理之處理裝置而言,習知有一種在搬 送滾子上載置基板,利用該搬送滾子邊將基板在水平方向 移送邊進行處理的處理裝置,還有一種爲連續進行上述各 處理而將各處理裝置加以連結而構成如第10圖所示的基板 處理系統。 第10圖係習知基板處理系統之槪略構成俯視圖,如該 圖所示,該基板處理系統200是由基板投入/排出部201、 基板處理部205、及基板搬送部210所構成。前述基板投 入/排出部201是由載置著收納複數個基板的卡匣203之載 置台202及移載裝置204所構成,該移載裝置204係將從 載置於載置台202上之卡匣203中之基板一片一片地取出 並投入基板處理部205,並將處理完成之基板從基板處理 部205中取出再放進卡匣203內。又,移載裝置204通常 4 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) ----訂---------線j A7 529072 _____B7___ 五、發明說明(’/ ) 是由可在載置台202的長度方向移動的機器人所構成。 前述基板處理部205是由相互平行並排之第1處理部 206及第2處理部207之2個處理線所構成,第1處理部 206及第2處理部207是如第11圖所示,分別具備沿著箭 頭方向搬送基板的複數個搬送滾子208,利用此搬送滾子 208邊搬送基板邊進行既定的處理。例如,第1處理部206 是基板之蝕刻處理部,將蝕刻液塗佈在搬送中的基板上。 第2處理部207是由水洗處理部207a及乾燥處理部207b 所構成,在水洗處理部207a對基板上供給洗淨水,而在乾 燥處理部207b對基板上供給乾燥用氣體。 前述基板搬送部210係把被第1處理部206所處理後 之基板搬送至第2處理部207的機構,並具備:將從第1 處理部206所排出之基板的搬送方向予以切換後搬送的方 向切換裝置211、將從方向切換裝置211所排出之基板沿 著前述排出方向搬送的複數個搬送滾子212、及將由搬送 滾子212所搬送之基板的搬送方向予以切換並搬送至第2 處理部207的方向切換裝置213。 如第12圖所示前述方向切換裝置211具有:複數個位 於與構成第1處理部206之搬送滾子208的搬送面相同的 水平面上並以相同之搬送方向來搬送基板K的第1搬送滾 子214、配置於此第1搬送滾子214之間且沿著上下方向突 沒於第1搬送滾子214之搬送面的昇降器215、及複數組於 第1搬送滾子214之搬送面上方配置成彼此相對且具有與 弟1搬送浪子214中心軸正交的中心軸且供將基板κ搬送 ___5 本紙張尺度適用中國國家標準(CNS)A4規^(210 X 297公釐) 一 (請先閱讀背面之注意事項再填寫本頁) pr.^4---- 訂----------線- A7 529072 ^____B7____ 五、發明說明(1 ) 至搬送滾子212側用的第2搬送滾子216。還有,彼此相對 之第2搬送滾子216可在彼此接近/分開之方向移動。又, 圖中之217是用來制止基板K移動的擋塊。 經由此方向切換裝置211,從第1處理部206所排出之 基板K利用第1搬送滾子214被沿著前述排出方向搬送至 觸及擋塊217爲止。此時昇降器215是沉沒於第1搬送滾 子214之搬送面的下方。然後,昇降器215從第1搬送滾 子214之搬送面向上方突出,經由此方式讓基板K上昇至 如第12圖中2點鏈線所示之處。此時之第2搬送滾子216 是位於相互離開的位置處。然後當第2搬送滾子216移動 至相互接近的位置後,昇降器215降下。利用此方式讓基 板K呈現由第2搬送滾子216支撐著的狀態,然後,利用 此第2搬送滾子216以垂直於第1搬送滾子214之搬送方 向來搬送,也就是搬送至搬送滾子212側後排出。以此方 式而進行基板K的搬送方向切換。 雖然圖中並未特別的標示,在前述方向切換裝置213 中也是具備和上述方向切換裝置211大致相同的構成,將 經由搬送滾子212所搬送之基板K切換其搬送方向後搬送 至第2處理部207中。 如第10圖所示在此基板處理系統200中,是將第1處 理部206、基板搬送部210及第2處理部207配置成以平面 上看起來呈逆C之形狀,經由移載裝置204從卡匣203中 所取出之基板K是先被投入於第1處理部206中。接著在 第1處理部206內基板K沿著箭頭方向一面搬送一面被施 6 木紙張尺度適用中國國家標準(CNS)A4規^ (210 X 297公釐)~^ (請先閱讀背面之注意事項再填寫本頁) ----訂---------線; 529072 A7 ___B7 __ 五、發明說明(4 ) 予既定的處理(蝕刻處理)後,在基板搬送部210中將搬送 方向予以變更後投入於第2處理部207中。然後在第2處 理部207內基板K沿著箭頭方向一面搬送一面被施予既定 的處理(水洗處理及乾燥處理)後,再次利用移載裝置204 將其收納於卡匣203內。 當基板K在第1處理部206及第2處理部207搬送中 ,姿勢產生變化的話,例如在與搬送方向垂直之方向傾斜 時,就無法進行高精度的處理。因此習知方法是如第11圖 所示,在上述搬送滾子208之兩端部的滾子上形成鍔部 208a,利用此鍔部208a,來控制搬送中之基板K姿勢。在 上述之第1搬送滾子214及第2搬送滾子216上也是相同 狀態之構造。但是當設置了此種鍔部208a後,會由於該鍔 部208a之妨礙而無法在搬送滾子208之搬送面內變換基板 K的搬送方向。因此,利用上述方向切換裝置211、213將 基板K提昇至鍔部208a上端之上方,然後再變換其搬送方 向。 還有,如果基於上述理由而使用供提高基板K之基板 搬送部210的話,由於無法在該基板搬送部210進行基板 K之處理,故僅進行基板K之搬送作業。也就是說,若在 該處對基板K洗淨,當基板昇降時,會產生由噴嘴中噴出 之洗淨液所強力噴洗的部分及非強力噴洗的部分,而造成 洗淨效果不均之現象。 因此,在習知的基板處理系統200中,均如上所述在 基板搬送部210中不會對基板K處理,但仍由於此種方式 7__ 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) --------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) A7 529072 _____ B7_____ 五、發明說明(() 而產生以下的問題。 也就是說,例如第10圖所示之例當在第1處理部206 中將基板K施予蝕刻處理後,在未洗淨狀態下將其搬送時 ,會因爲搬送至第2處理部207所需搬送時間之偏差而使 蝕刻進展程度有所差異,而無法高精度地控制蝕刻處理。 由於基板搬送部210具有由基板K之昇降機構及第2搬送 滾子216之移動機構所構成之複雜的運作機構,故要高精 度地控制其搬送時間是極爲困難的。 又,例如以洗淨工程作爲第1處理部206之最終工程 時,在基板K不乾燥之狀態下搬送時,表面會乾燥不均勻 或產生污痕而使基板K成爲不良品。 又,在習知基板處理系統200中,是將第1處理部206 及第2處理部207之2個處理線予以平行並排設置,故也 有裝置之設置效率差的問題。 本發明之目的是鑑於以上之實情,提供一種基板處理 裝置及具備此裝置的基板處理系統,其將基板由一方的處 理線搬送至另一方的處理線上,並能對搬送中之基板進行 處理。 發明之揭示 爲了解決上述課題本發明之昇降式基板處理裝置係具 有:殻體狀蓋體,具有上下並排之基板投入口及基板排出 口;處理機構,裝於前述蓋體內者;並且具備,收納並支 撐著從前述基板投入口搬入之基板並從前述基板排出口排 _____ 8 t紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂---------線 A7 529072 ______B7__ 五、發明說明(G ) 出前述基板之搬送及支撐機構、支撐該搬送及支撐機構之 支撐架台、及配設於該搬送及支撐機構之上方,用來對被 該搬送及支撐機構支撐之基板上噴出處理流體之處理流體 噴出機構;及昇降機構,支撐著前述處理機構並使其上下 昇降,並使該處理機構經過前述基板投入口及基板排出口 Ο 依此昇降式基板處理裝置,處理機構藉由昇降機構而 會往上下方向昇降,並通過基板投入口及基板排出口。又 ,處理機構在經過基板投入口時將由前工程之處理部中排 出之基板從前述基板投入口予以收納並加以支撐,在移動 至基板排出口之過程中,處理流體從處理流體噴出機構中 噴出至基板上。基板藉此受到既定的處理,處理完後從前 述基板排出口排出並移往下一工程。 依此昇降式基板處理裝置,因可讓處理機構全體昇降 ,該處理機構具有支撐著基板之搬送及支撐機構及對受支 撐之基板噴出處理流體之處理流體噴出機構,故在搬送基 板時基板與處理流體噴出機構間的相互位置關係並沒有變 化,因此例如在洗淨基板之場合,可讓從處理流體噴出機 構中噴出之洗淨液大致均勻地供給基板上的各個部位,得 以進行均勻的洗淨作業。 又,因爲可利用昇降機構以單一動作讓處理機構昇降 來搬送基板,速度控制上較爲容易,故在進行蝕刻等處理 時,可對其進行高精度的控制。 還有,本發明之前述處理流體包含顯像液、蝕刻液、 — 9 B氏張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ~ ^ (請先閱讀背面之注意事項再填寫本頁) |裝--------訂---------線 A7 529072 _B7___ 五、發明說明(1 ) 用來剝離光阻膜之剝離液及洗淨用的洗淨水、乾燥用的氣 體等處理基板時之各種流體,可以將各種處理流體供給基 板而施加處理。 又,也可將前述搬送及支撐機構作成,當其收納前述 基板後,讓所收納之前述基板沿著前述基板之投入/排出方 向反覆前後移動。 在上述昇降式基板處理裝置中,雖然是如上所述的可 讓從處理流體噴出機構中噴出之處理流體大致均句地供給 基板的各個部位上,但另一方面例如處理流體本身有時會 有壓力較高及較低的部位而產生不均勻時,嚴格來說在此 種場合下是無法對基板進行均質的處理。 因此如上所述、如果將搬送及支撐機構作出讓其所收 納、支撐著的基板,沿著其基板之搬入/排出方向反覆的前 後移動之構成時,藉由基板之前後移動使處理流體作用於 基板上之壓力不均現象被平均化,而可對基板進行均質的 處理。 又,在前述昇降式基板處理裝置中,其蓋體是利用區 隔構件將前述基板之投入/排出方向分割成驅動室及處理室 兩個室,同時在具備前述基板投入口及基板排出口的前述 處理室上配設前述處理機構,而另一方面在前述驅動室配 設前述昇降機構;在前述區隔構件,鎳合沿著其上下方向 形成連通前述處理室及驅動室的開口部;在形成於前述區 隔構件之開口部之沿著上下方向的兩緣部分別形成筒狀, 而且在該一對筒狀部之彼此相對的面上,沿著上下方向形 10 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) ---------—--------訂--------_ 線 Imp (請先閱讀背面之注意事項再填寫本頁) A7 529072 ___B7____ 五、發明說明(f) 成缺口槽;前述處理機構之前述支撐架台利用設於前述區 隔構件之開口部內的連結具而和前述昇降機構連結;前述 連結具連接板片體(sheet),該板片體係配設於前述一對筒 狀部間,且配設成往前述連結具之上方及下方延伸的帶狀 板片體,其兩側緣部分別由前述缺口槽插進前述筒狀部內 ;前述驅動室及處理室被利用前述區隔構件、連結具及板 片體所區隔。 處理流體中所含有的前述顯像液、蝕刻液、剝離液等 之腐触性高,此液體附著於昇降機構上時,會造成該昇降 機構損傷而損及其功能。因此’若將配設有昇降機構之驅 動室及配設有處理機構之處理室,利用區隔構件、連結具 及板片體加以區隔的話,就能防止處理室中所使用之處理 流體侵入驅動室內,而可以防止昇降機構由於處理流體而 損傷。尤其是將設於區隔構件之開口部之沿著上下方向的 緣部作成筒狀,同時將配設成往連結具之上方及下方延伸 的板片體之兩側緣部,從形成於前述筒狀部的缺口槽中插 入該筒狀部內,而構成曲折式(labyrinth)構造,即可將驅動 室及處理室作成雙方均具有高氣密性。 還有,也可以設置複數組的前述開口部、連結具及板 片體。又,若設有供排出前述筒狀部內氣體的排氣機構, 能將由前述板片體與缺口槽之間隙侵入筒狀部內的處理流 體利用前述排氣機構加以排除,故可更確實防止處理流體 侵入驅動室內。 還有可將前述板片體形成無端環狀。也可將捲繞/送出 11 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝--------訂---------線j A7 529072 _______ 五、發明說明("I ) 前述板片體的捲繞/送出機構分別設於前述板片體之上部側 及下部側,隨著利用前述昇降機構而昇降之前述板片體之 動作,利用該捲繞/送出機構來進行前述板片體之捲繞/送 出,捲繞/送出機構是由捲繞前述板片體之捲繞軸、及旋轉 該捲繞軸之驅動機構所構成,前述驅動機構也可係當前述 捲繞軸往排出方向旋轉時僅讓制動力作用在捲繞軸上,另 一方面當前述捲繞軸往捲繞方向旋轉時則透過摩擦離合器 而將動力傳遞至前述捲繞軸上而構成。依此捲繞/送出機構 ,板片體不會鬆弛,而可進行其捲繞、送出動作。 又,前述驅動機構具有:連結至前述捲繞軸之從動齒 輪、及嚙合於從動齒輪之驅動齒輪、及連結至此驅動齒輪 上之摩擦離合器、及連結至此摩擦離合器之旋轉軸、及2 個分別與此旋轉軸之兩端部連結而僅容許旋轉軸能朝向一 方向旋轉的單方向離合器,及透過前述單方向離合器中的 一方而連結至前述旋轉軸上之滑輪、及繞捲於該滑輪上之 傳動帶、及支撐著前述單方向離合器中另一方的支撐構件 ,前述2個單方向離合器可以作成容許前述旋轉軸之旋轉 來讓前述捲繞軸朝向捲繞方向旋轉,而在另一方面限制前 述旋轉軸之旋轉而不讓前述捲繞軸朝向排出方向旋轉,同 時前述傳動帶是作成經由前述昇降機構而讓其旋動之構成 〇 依具有上述構成之昇降式基板處理裝置,將大致以水 平方向讓基板移動進行處理的第1基板處理裝置及第2基 板處理裝置以上下方向並排設置,讓第1基板處理裝置之 ___ 12 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) ----訂---------線; 529072 a7 __________ 五、發明說明(/D) 基板排出部與前述昇降式基板處理裝置之基板投入口相互 連接’另一方面讓第2基板處理裝置之基板投入部與前述 昇降式基板處理裝置之基板排出口相互連接,可以構築出 讓基板依序通過第1基板處理裝置、昇降式基板處理裝置 、第2基板處理裝置的構成,相較於將第1基板處理裝置 及弟2基板處理裝置並排設置於同一*個水平平面內之上述 習知的處理系統而言,可以作出以較小的設置空間即足夠 用的基板處理系統。 發明之最佳實施形態 以下爲了針對本發明作較詳細的說明,根據附圖式來 加以說明。 首先針對本實施例之基板處理系統1的構成加以說明 〇 如第1圖及第2圖所示,本實施例之基板處理系統1 是由基板投入/排出部2、上下並設的第1基板處理裝置6 及第2基板處理裝置7、及昇降式基板處理系統1〇所構成 。基板投入/排出部2是由載置著複數個收納基板用的卡匣 5之載置台4、及將基板一片一片的由載置於載置台4上之 卡匣5內取出並投入於第1基板處理裝置6中’另一方面 將處理完成後之基板由2基板處理裝置7中取出並收納至 卡匣5內的移載裝置3所構成。還有,移載裝置3是由可 以是由沿著載置台4之長度方向上(箭頭所示方向)移動的 機器人所構成。又,卡匣5是由圖中未顯示之AGV等搬送 (請先閱讀背面之注意事項再填寫本頁) |裝--------訂---------線_ 13 ___ 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A7 529072 ____B7____ 五、發明說明(Ll) 裝置來予以搬送。 前述第1基板處理裝置6及第2基板處理裝置7是分 別按照箭頭所示方向來搬送基板,並如第11圖所示具備複 數個搬送滾子208利用此搬送滾子208 —面搬送基板一面 進行既定的處理。在本例中、第1基板處理裝置6是作出 對基板進行蝕刻處理之構成,第2基板處理裝置7是作出 對基板進行洗淨處理及乾燥處理之構成。 如第3圖、第5圖及第6圖所示,前述昇降式基板處 理系統10是由作成筐狀體形狀之蓋體11、和配置於此蓋 體11內之處理機構20及昇降機構40所構成。又,在蓋體 11上形成連通至第1基板處理裝置6內的開口部11a及連 通至第2基板處理裝置7內的開口部lib。又,蓋體11是 由支柱12所支撐著,其內部又被區隔爲配置著處理機構 20之處理室A,及配置著昇降機構40之驅動室B。 前述處理機構20是由洗淨裝置22及支撐著此洗淨裝 置22之支撐架台21所構成。洗淨裝置22是如第4圖所示 ,是由殼體狀的外蓋23在其一側面上具備將基板搬入/排 出用的開口部23a,及配置於此外蓋23內之複數個搬送滾 子26,及配置於此搬送滾子26之上方的一列複數個噴嘴 29,及配置於此搬送滾子26之下方的一列複數個噴嘴30 所構成。又搬送滾子26是具備如第1圖中所示之搬送滾子 208相同的構成。又,在最靠近前述開口部23a之搬送滾子 26並與其上部接觸之位置處,設置著用來夾住(Νιρ)基板κ 用的夾持用搬送滾子27。利用此搬送滾子26及夾持用搬 14 本紙張尺度細中關家彳票準(CNS)A4規格(210 X 297公爱)—"""' ' (請先閱讀背面之注意事項再填寫本頁) -裝--------訂---------線j 529072 A7 ___B7___ 五、發明說明(pj 送滾子27之正反方向旋轉,將基板K從前述開口部23a搬 入,並從同一開口部23a排出。 前述各個噴嘴29是固設在圖中未顯示連接至洗淨液供 給源中之供給管28上,將透過此供給管28所供給之洗淨 液朝向基板K的上面噴出。相同的、前述各個噴嘴30是 固設於連接至前述洗淨液供給源中之供給管31上,將透過 此供給管31所供給之洗淨液朝向基板K的下面噴出。又 ,圖中所示32爲用來偵測是否有基板K之感知器。 在外蓋23之下端設置著透過開口部23a而相互連通之 集液槽24,由前述噴嘴29、30中所噴出之洗淨液由前述 集液槽24所回收,並通過排放管25而適當的予以排放。 在前述驅動室B內立設著由方管所作出並形成縱格子 狀之框架17,前述昇降機構40配置於此框架17上。框架 17又透過拖架18而被組裝於前述支柱12上。 前述昇降機構40是由透過連結具55、56及57、58而 連接至支撐架台13上的昇降台44,及以面向前述處理室A 側而並排設置於構成前述框架17縱棧上之一對導軌45, 及可分別沿著各個導軌45而任意移動方式卡合於其上,且 固設於前述昇降台44上之滑動構件46,及由前述框架Π 所支撐著且與前述導軌45平行可任意旋轉之滾珠螺桿41 ’及固定於前述昇降台44上且與此滾珠螺桿41呈螺合狀 態之螺帽42,及固定於前述框架17上用來驅動前述滾珠 螺桿41旋轉的伺服馬達43所構成。 經由伺服馬達43而讓滾珠螺桿41旋轉的話,螺合於 ____ 15 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) ---I--I------------訂·-------- (請先閱讀背面之注意事項再填寫本頁) 529072 B7 五、發明說明(ί、) 其上之螺帽42就沿著滾珠螺桿41而移動(昇降),此時連 接於螺帽42上的昇降台44、透過連結具55、56及57、58 而與此昇降台44連接之支撐架台13、及由支撐架台13所 支撐著的洗淨裝置22就和螺帽42 —起昇降。 前述驅動室Β及處理室Α之間是利用區隔構件11a、 14、16而加以隔開。在區隔構件11a、14間及區隔構件14 、16間分別形成開口部,並將前述連結具55、56及57、 58分別配置於各個開口部內。又,在形成各開口部之區隔 構件14的兩側緣部15處沿著此緣部作成筒狀部,而在與 此筒狀部相對向之前述區隔構件11a、16上的各個緣部處 又分別沿著此緣部而固定著筒狀構件13。還有在位於前述 區隔構件14兩側緣部處之筒狀部15與位於前述筒狀構件 13的各個對向面上分別形成沿著上下方向槽形切口。 又在位於前述區隔構件14兩側緣部上之筒狀部15與 前述筒狀構件13之間,分別沿著其緣部而設置著帶狀之板 片体65、66。此板片体65、66之兩側緣是分別經由前述槽 形切口而插入筒狀部15、筒狀構件13內,並利用連結具 55、56及57、58以從前後方挾持之狀態而被固定於此連結 具上。然後將板片体65、66之各個上端部及下端部處又分 別繞捲在後述之捲繞/送出機構70上。又,前述筒狀部15 與筒狀構件13是利用圖中未顯示之適當排氣裝置而將其內 部的氣體加以排放。還有,雖然在本實施例中前述板片体 65、66是採用具有優良耐摩擦性及耐蝕性的鐵氟龍 (TEFLON聚四氟乙烯)製板材。但並不受限於此材質,也可 16 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)529072 A7 _____B7 _ V. Description of the Invention (/) TECHNICAL FIELD The present invention relates to moving (conveying) one side of various substrates, such as semiconductor (silicon) wafers, liquid crystal glass substrates, glass substrates for photomasks, substrates for optical discs, etc. ) A processing device that performs a predetermined process, and a substrate processing system configured by connecting a plurality of processing devices. BACKGROUND For example, there are wet processes in the manufacturing process of a liquid crystal glass substrate, such as coating of a developing solution, coating of an etching solution, coating of a peeling solution for peeling a photoresist film, etc. There are washing treatment and drying treatment between treatments. As a processing device for performing each of the processes described above, there is conventionally known a processing device that mounts a substrate on a transfer roller and uses the transfer roller to process the substrate while transferring the substrate in a horizontal direction, and there is also a processing device that continuously performs the above-mentioned each Each of the processing apparatuses is connected to form a substrate processing system as shown in FIG. 10. Fig. 10 is a plan view showing a schematic configuration of a conventional substrate processing system. As shown in the figure, the substrate processing system 200 includes a substrate loading / discharging unit 201, a substrate processing unit 205, and a substrate transfer unit 210. The aforementioned substrate loading / discharging unit 201 is composed of a mounting table 202 on which a cassette 203 accommodating a plurality of substrates is placed, and a transfer device 204. The transfer device 204 is a cassette that is to be mounted on the mounting table 202. The substrates in 203 are taken out one by one and put into the substrate processing section 205, and the processed substrates are taken out from the substrate processing section 205 and put into the cassette 203. In addition, the transfer device 204 is usually 4 wood paper standards applicable to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling this page) ---- Order ----- ---- Line j A7 529072 _____B7___ 5. Description of the Invention ('/) is composed of a robot that can move in the length direction of the mounting table 202. The substrate processing section 205 is composed of two processing lines of a first processing section 206 and a second processing section 207 that are parallel to each other. The first processing section 206 and the second processing section 207 are shown in FIG. 11, respectively. A plurality of transfer rollers 208 are provided to transfer the substrate in the direction of the arrow, and a predetermined process is performed while the substrate is transferred using the transfer rollers 208. For example, the first processing unit 206 is an etching processing unit for a substrate, and applies an etchant to the substrate being transported. The second processing unit 207 is composed of a water washing processing unit 207a and a drying processing unit 207b. The water washing processing unit 207a supplies washing water to the substrate, and the drying processing unit 207b supplies drying gas to the substrate. The substrate transfer unit 210 is a mechanism that transfers the substrate processed by the first processing unit 206 to the second processing unit 207, and includes a mechanism for switching the transfer direction of the substrate discharged from the first processing unit 206 and transferring the substrate. Direction switching device 211, a plurality of transfer rollers 212 that transport the substrate discharged from the direction switching device 211 in the aforementioned discharge direction, and switch the transfer direction of the substrate transferred by the transfer roller 212 and transfer it to the second process The direction switching device 213 of the unit 207. As shown in FIG. 12, the aforementioned direction switching device 211 includes a plurality of first transfer rollers that are positioned on the same horizontal plane as the transfer surface of the transfer roller 208 constituting the first processing unit 206 and transfer the substrate K in the same transfer direction. A roller 214, a lifter 215 disposed between the first transfer roller 214 and protruding up and down from the transfer surface of the first transfer roller 214, and a plurality of arrays above the transfer surface of the first transfer roller 214 It is arranged opposite to each other and has a central axis orthogonal to the central axis of the carrying son 214 of the brother 1 and is used for carrying the substrate κ. 5 This paper size applies the Chinese National Standard (CNS) A4 regulations ^ (210 X 297 mm) One (please Read the precautions on the back before filling in this page) pr. ^ 4 ---- Order ---------- Line-A7 529072 ^ ____ B7____ 5. Description of the invention (1) For the transport roller 212 side Of the second transfer roller 216. The second transfer rollers 216 facing each other can move in a direction approaching / separating from each other. In addition, 217 in the figure is a stopper for preventing the substrate K from moving. Through this direction switching device 211, the substrate K discharged from the first processing unit 206 is transferred by the first transfer roller 214 in the aforementioned discharge direction until it reaches the stopper 217. At this time, the lifter 215 is sunk below the conveyance surface of the first conveyance roller 214. Then, the lifter 215 protrudes upward from the conveying surface of the first conveying roller 214, and in this way, the substrate K is raised to the position shown by the two-point chain line in FIG. At this time, the second transfer rollers 216 are located at positions separated from each other. When the second transfer roller 216 moves to a position close to each other, the lifter 215 is lowered. In this way, the substrate K is supported by the second transfer roller 216, and then the second transfer roller 216 is used to transfer in a direction perpendicular to the transfer direction of the first transfer roller 214, that is, to the transfer roller Sub 212 side is discharged. In this manner, the conveyance direction of the substrate K is switched. Although not specifically shown in the figure, the aforementioned direction switching device 213 also has a structure substantially the same as that of the above-mentioned direction switching device 211, and the substrate K transferred via the transfer roller 212 is switched to the second direction after being transferred to the second process. Department 207. As shown in FIG. 10, in this substrate processing system 200, the first processing unit 206, the substrate transfer unit 210, and the second processing unit 207 are arranged in a shape that looks like an inverse C on a plane, and passes through a transfer device 204. The substrate K taken out from the cassette 203 is first put into the first processing unit 206. Then the substrate K in the first processing unit 206 is transported along the direction of the arrow and is applied on the side. The size of the paper is applied to the Chinese National Standard (CNS) A4 ^ (210 X 297 mm) ~ ^ (Please read the precautions on the back first) (Fill in this page again) ---- Order --------- Line; 529072 A7 ___B7 __ V. Description of the invention (4) After a predetermined process (etching process), it will be transported in the substrate transport unit 210 After the direction is changed, the second processing unit 207 is input. Then, the substrate K is transported in the direction of the arrow in the second processing unit 207 and given a predetermined process (water washing process and drying process), and then it is stored in the cassette 203 by the transfer device 204 again. When the substrate K is conveyed by the first processing unit 206 and the second processing unit 207 and the posture is changed, for example, when the substrate K is inclined in a direction perpendicular to the conveying direction, high-precision processing cannot be performed. Therefore, the conventional method is to form the ridges 208a on the rollers at both ends of the conveying roller 208 as shown in FIG. 11, and use the ridges 208a to control the attitude of the substrate K during conveyance. The first conveying roller 214 and the second conveying roller 216 have the same structure. However, when such a projection 208a is provided, the transportation direction of the substrate K cannot be changed within the transportation surface of the transportation roller 208 due to the interference of the projection 208a. Therefore, the substrate K is lifted above the upper end of the crotch portion 208a by the above-mentioned direction switching devices 211 and 213, and then its conveying direction is changed. If the substrate transfer unit 210 for raising the substrate K is used for the reasons described above, since the substrate K cannot be processed in the substrate transfer unit 210, only the substrate K transfer operation is performed. In other words, if the substrate K is cleaned there, when the substrate is raised and lowered, a strong spraying portion and a non-strong spraying portion are generated by the cleaning liquid sprayed from the nozzle, resulting in uneven cleaning effect. Phenomenon. Therefore, in the conventional substrate processing system 200, the substrate K is not processed in the substrate transfer unit 210 as described above, but because of this method, the Chinese paper standard (CNS) A4 specification (210) X 297 mm) -------------------- Order --------- line (Please read the precautions on the back before filling this page) A7 529072 _____ B7_____ 5. Explanation of the invention (() and the following problems occur. That is, for example, as shown in FIG. 10, when the substrate K is subjected to the etching treatment in the first processing unit 206, it is in an uncleaned state. When it is transported next, the progress of etching will be different due to the deviation of the transport time required to transport to the second processing unit 207, and the etching process cannot be controlled with high accuracy. Since the substrate transporting unit 210 has a lifting and lowering by the substrate K Mechanism and the complex operation mechanism constituted by the moving mechanism of the second transfer roller 216, it is extremely difficult to control the transfer time with high accuracy. For example, when a cleaning process is used as the final process of the first processing unit 206 When the substrate K is transported without drying, the surface will dry unevenly Smudge is generated and the substrate K becomes a defective product. In the conventional substrate processing system 200, the two processing lines of the first processing unit 206 and the second processing unit 207 are arranged side by side in parallel, so there is also a device installation efficiency. The object of the present invention is to provide a substrate processing apparatus and a substrate processing system having the same in view of the above facts, which can transfer substrates from one processing line to another processing line, and can The substrate is processed. DISCLOSURE OF THE INVENTION In order to solve the above-mentioned problem, the lifting type substrate processing apparatus of the present invention includes: a shell-shaped cover body having a substrate input port and a substrate discharge port arranged side by side; and a processing mechanism installed in the cover body; It also contains and supports the substrates carried in from the substrate input port and discharged from the substrate discharge port _____ 8 t paper size applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the back Please note this page and fill in this page) Order --------- Line A7 529072 ______B7__ V. Description of the invention (G) The above-mentioned substrate transfer and support mechanism A supporting stand for supporting the conveying and supporting mechanism, and a processing fluid ejecting mechanism for ejecting a processing fluid on a substrate supported by the conveying and supporting mechanism, and a lifting mechanism supporting the conveying and supporting mechanism; The processing mechanism is moved up and down, and the processing mechanism passes through the substrate input port and the substrate discharge port. According to the lifting substrate processing device, the processing mechanism is moved up and down by the lifting mechanism, and passes through the substrate input port. And the substrate discharge port. When the processing mechanism passes through the substrate input port, the substrate discharged from the processing section of the previous process is stored and supported from the substrate input port. During the process of moving to the substrate discharge port, the processing fluid is removed from the processing port. The fluid ejection mechanism ejects onto the substrate. The substrate is thus subjected to a predetermined treatment, and after the processing is completed, the substrate is discharged from the aforementioned substrate discharge port and moved to the next process. According to this lifting substrate processing device, the entire processing mechanism can be raised and lowered. The processing mechanism has a substrate transport and support mechanism and a processing fluid ejection mechanism that ejects a processing fluid to the supported substrate. The mutual positional relationship between the processing fluid ejection mechanisms does not change. For example, when cleaning the substrate, the cleaning liquid ejected from the processing fluid ejection mechanism can be supplied to each part of the substrate substantially uniformly, and uniform cleaning can be performed. Net work. In addition, since the processing mechanism can be raised and lowered in a single operation by the lifting mechanism to carry the substrate, the speed control is relatively easy, so that it can be controlled with high accuracy when performing processing such as etching. In addition, the aforementioned processing fluid of the present invention includes a developing solution, an etching solution, and a 9-B scale standard applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ ^ (Please read the precautions on the back before (Fill in this page) | Install -------- Order --------- Line A7 529072 _B7___ V. Description of the invention (1) Stripping solution for peeling off the photoresist film and washing for cleaning Various fluids used for processing a substrate such as clean water and a gas for drying can be processed by supplying various processing fluids to the substrate. In addition, the transporting and supporting mechanism may be made such that after the substrate is stored, the stored substrate is repeatedly moved back and forth in a direction in which the substrate is put in / out. In the above-mentioned lift-type substrate processing apparatus, although the processing fluid ejected from the processing fluid ejection mechanism can be supplied to each part of the substrate approximately uniformly as described above, on the other hand, the processing fluid itself may have When unevenness occurs at high and low pressure parts, strictly speaking, in this case, it is impossible to perform homogeneous processing on the substrate. Therefore, as described above, if the conveying and supporting mechanism is configured to move the substrate stored and supported by it back and forth along the substrate loading / unloading direction, the processing fluid is applied to the substrate by moving it forward and backward. The pressure unevenness on the substrate is averaged, and the substrate can be processed homogeneously. Further, in the lifting substrate processing apparatus described above, the cover body is divided into a driving chamber and a processing chamber by a partition member into a substrate input / discharge direction, and the substrate includes a substrate input port and a substrate discharge port. The processing chamber is provided with the processing mechanism, and on the other hand, the lifting mechanism is provided with the driving chamber; in the partition member, nickel alloy is formed along the vertical direction of the opening to connect the processing chamber and the driving chamber; The two edge portions formed in the opening portion of the partition member in the vertical direction are formed in a cylindrical shape, respectively, and the surfaces of the pair of cylindrical portions facing each other are formed in the vertical direction. The paper size is applicable to the country of China. Standard (CNS) A4 Specification (210 X 297 Public Love) ----------------- Order --------_ Line Imp (Please read the note on the back first Please fill in this page again for details) A7 529072 ___B7____ V. Description of the invention (f) Form a notch; the aforementioned supporting frame of the aforementioned processing mechanism is connected to the aforementioned lifting mechanism by using a connector provided in the opening of the aforementioned partition member; the aforementioned connector Connection sheet, The plate system is disposed between the pair of cylindrical portions, and is configured as a strip-shaped plate body extending above and below the connector, and the edge portions on both sides thereof are respectively inserted into the cylindrical shape through the notch grooves. The driving chamber and the processing chamber are separated by the aforementioned partition member, linking device and plate body. The aforementioned developing liquid, etching solution, peeling liquid and the like contained in the processing fluid are highly corrosive. When this liquid adheres to the lifting mechanism, the lifting mechanism may be damaged and its function may be impaired. Therefore, if the drive room equipped with a lifting mechanism and the processing room equipped with a processing mechanism are separated by a partition member, a connector, and a plate body, the infiltration of the processing fluid used in the processing chamber can be prevented. Drive the chamber and prevent the lifting mechanism from being damaged by the processing fluid. In particular, the edge portions along the vertical direction provided in the opening portion of the partition member are formed into a tube shape, and the edge portions on both sides of the plate body that is arranged to extend above and below the connector are formed from the aforementioned The notch groove of the cylindrical portion is inserted into the cylindrical portion to form a labyrinth structure, and the driving chamber and the processing chamber can be made to have high airtightness in both of them. It is also possible to provide the aforementioned openings, connectors, and plate bodies of the plurality of arrays. In addition, if an exhaust mechanism for exhausting the gas in the cylindrical portion is provided, the processing fluid that has penetrated into the cylindrical portion through the gap between the plate body and the notch groove can be eliminated by the exhaust mechanism, so that the processing fluid can be more surely prevented. Intrusion into the drive room. In addition, the plate body can be formed into an endless ring shape. Can also be wound / sent out 11 wood paper sizes applicable to Chinese National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling this page) -Packing -------- Order --------- line j A7 529072 _______ 5. Description of the invention (" I) The winding / feeding mechanism of the aforementioned sheet body is respectively provided on the upper side and the lower side of the aforementioned sheet body, and The operation of lifting the plate body by the lifting mechanism, and winding / feeding the plate body by the winding / feeding mechanism. The winding / feeding mechanism is a winding shaft that winds the plate body. And a driving mechanism that rotates the winding shaft, the driving mechanism may be that when the winding shaft rotates in the discharge direction, only the braking force acts on the winding shaft, and on the other hand, when the winding shaft is rolled up When rotating in the direction, the friction clutch is used to transmit power to the winding shaft. According to the winding / feeding mechanism, the plate body can not be loosened, and the winding and feeding operations can be performed. The driving mechanism includes a driven gear connected to the winding shaft, a driving gear meshed with the driven gear, a friction clutch connected to the driving gear, a rotating shaft connected to the friction clutch, and two A unidirectional clutch that is connected to both ends of this rotary shaft and allows the rotary shaft to rotate only in one direction, and a pulley connected to the rotary shaft through one of the unidirectional clutches, and is wound around the pulley The upper transmission belt and the supporting member supporting the other one of the one-way clutches. The two one-way clutches can be made to allow the rotation of the rotating shaft to rotate the winding shaft toward the winding direction, while restricting it on the other hand. The rotation of the rotation shaft does not allow the winding shaft to rotate toward the discharge direction. At the same time, the transmission belt is configured to rotate through the lifting mechanism. According to the lifting-type substrate processing device having the above-mentioned configuration, it will be substantially horizontal. The first substrate processing apparatus and the second substrate processing apparatus that move the substrate for processing Set side by side, so that the ___ 12 wood paper size of the first substrate processing device applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) ---- Order --------- line; 529072 a7 __________ V. Description of the invention (/ D) The substrate discharge unit is connected to the substrate input port of the aforementioned lifting substrate processing apparatus. 'On the other hand, let the substrate of the second substrate processing apparatus be connected. The input unit is connected to the substrate discharge port of the lifting substrate processing apparatus described above, and it is possible to construct a structure that allows the substrate to sequentially pass through the first substrate processing apparatus, the lifting substrate processing apparatus, and the second substrate processing apparatus, compared with the first substrate processing apparatus. For the conventional processing system in which the processing device and the substrate processing device are arranged side by side in the same horizontal plane, a substrate processing system that is sufficient with a small installation space can be made. BEST MODE FOR CARRYING OUT THE INVENTION In order to describe the present invention in more detail, it will be described with reference to the drawings. First, the structure of the substrate processing system 1 of this embodiment will be described. As shown in FIG. 1 and FIG. 2, the substrate processing system 1 of this embodiment is a first substrate provided by a substrate loading / discharging unit 2 and being arranged side by side. The processing device 6 and the second substrate processing device 7 are configured by a lifting substrate processing system 10. The substrate loading / discharging unit 2 is a loading stage 4 on which a plurality of cassettes 5 for storing substrates are placed, and a substrate is taken out one by one from the cassettes 5 placed on the loading stage 4 and placed in the first stage. In the substrate processing apparatus 6, on the other hand, the processed substrate is composed of a transfer device 3 that is taken out of the two substrate processing apparatus 7 and stored in the cassette 5. The transfer device 3 is constituted by a robot that can move in the longitudinal direction (direction indicated by an arrow) of the mounting table 4. In addition, the cassette 5 is transported by AGV, etc., which is not shown in the figure (please read the precautions on the back before filling this page) | Installation -------- Order --------- Line_ 13 ___ The size of wood and paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) A7 529072 ____B7____ 5. Description of the Invention (Ll) The device is used for transportation. The first substrate processing apparatus 6 and the second substrate processing apparatus 7 transfer the substrates in the directions indicated by the arrows, respectively, and are provided with a plurality of transfer rollers 208 as shown in FIG. 11. The transfer rollers 208 are used to transfer the substrates on one side. Carry out the prescribed process. In this example, the first substrate processing apparatus 6 is configured to perform an etching process on the substrate, and the second substrate processing apparatus 7 is configured to perform a cleaning process and a drying process on the substrate. As shown in FIG. 3, FIG. 5, and FIG. 6, the aforementioned lifting substrate processing system 10 includes a cover 11 formed in a basket shape, and a processing mechanism 20 and a lifting mechanism 40 arranged in the cover 11 Made up. Further, an opening portion 11a communicating with the inside of the first substrate processing apparatus 6 and an opening portion lib communicating with the inside of the second substrate processing apparatus 7 are formed in the cover 11. The cover 11 is supported by the pillar 12, and the inside thereof is divided into a processing chamber A in which the processing mechanism 20 is arranged and a driving chamber B in which the lifting mechanism 40 is arranged. The processing mechanism 20 is composed of a cleaning device 22 and a support stand 21 that supports the cleaning device 22. As shown in FIG. 4, the cleaning device 22 is provided with a housing-shaped outer cover 23 on one side thereof with an opening 23 a for carrying in / out a substrate, and a plurality of transfer rollers disposed in the outer cover 23. The roller 26 is formed by a plurality of nozzles 29 arranged in a row above the transfer roller 26 and a plurality of nozzles 30 arranged in a row below the transfer roller 26. The transport roller 26 has the same configuration as the transport roller 208 shown in Fig. 1. Further, at a position closest to the conveying roller 26 of the opening 23a and in contact with the upper portion thereof, a holding conveying roller 27 for holding a substrate (κ) is provided. Use this to transport the rollers 26 and the clamps to carry 14 sheets of paper size (CNS) A4 size (210 X 297 public love) — " " " '(Please read the note on the back first Please fill in this page again for the matter)-Install -------- Order --------- Line j 529072 A7 ___B7___ V. Description of the invention (pj Send the roller 27 in the forward and reverse directions to rotate the substrate K It is carried in from the opening 23a and discharged from the same opening 23a. Each of the nozzles 29 is fixed on a supply pipe 28 connected to a cleaning liquid supply source (not shown in the figure), and is supplied through the supply pipe 28. The cleaning liquid is sprayed toward the upper surface of the substrate K. Similarly, each of the aforementioned nozzles 30 is fixed to a supply pipe 31 connected to the aforementioned cleaning liquid supply source, and the cleaning liquid supplied through this supply pipe 31 is directed toward the substrate The lower part of K is sprayed. In addition, 32 shown in the figure is a sensor for detecting whether there is a substrate K. A liquid collecting tank 24 is provided at the lower end of the outer cover 23 and communicates with each other through the opening 23a. The cleaning liquid ejected in 30 is recovered by the aforementioned liquid collecting tank 24 and is appropriately discharged through the discharge pipe 25. The driving room B is provided with a frame 17 formed by a square tube and forming a vertical lattice shape, and the lifting mechanism 40 is arranged on the frame 17. The frame 17 is assembled on the pillar 12 through the trailer 18. The elevating mechanism 40 is an elevating table 44 connected to the support stand 13 through the couplings 55, 56, and 57, 58 and a pair of guide rails arranged side by side on the vertical stack constituting the frame 17 facing the processing chamber A side. 45, and a sliding member 46 which can be arbitrarily moved along each of the guide rails 45, and is fixed on the lifting platform 44, and supported by the frame Π and parallel to the guide rail 45 can be arbitrarily A rotating ball screw 41 ′, a nut 42 fixed to the lifting table 44 and screwed with the ball screw 41, and a servo motor 43 fixed to the frame 17 to drive the ball screw 41 to rotate. When the ball screw 41 is rotated via the servo motor 43, it is screwed on ____ 15 The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 public love) --- I--I ----- ------- Order · -------- (Please read the first Note: Please fill in this page again) 529072 B7 V. Description of the invention (ί,) The nut 42 on it moves (lifts) along the ball screw 41, at this time, the lifting table 44 connected to the nut 42 is connected through the link The support stand 13 with 55, 56, and 57, 58 connected to the lifting table 44 and the cleaning device 22 supported by the support stand 13 are lifted up and down with the nut 42. The aforementioned drive room B and processing room A They are separated by partition members 11a, 14, 16. Opening portions are respectively formed between the partition members 11 a and 14 and between the partition members 14 and 16, and the aforementioned connectors 55, 56, 57, and 58 are respectively arranged in the respective openings. In addition, a cylindrical portion is formed along the edge portion 15 at both edge portions 15 of the partition member 14 forming each opening portion, and each edge of the partition member 11a, 16 facing the cylindrical portion is formed. The cylindrical member 13 is fixed at each part along this edge part. Further, groove-shaped cutouts are formed in the cylindrical portions 15 at the edge portions on both sides of the partition member 14 and the facing surfaces of the cylindrical member 13, respectively. Between the cylindrical portion 15 on the edge portions on both sides of the partition member 14 and the cylindrical member 13, belt-shaped plate bodies 65 and 66 are provided along the edge portions, respectively. Both side edges of the plate bodies 65 and 66 are inserted into the cylindrical portion 15 and the cylindrical member 13 through the groove-shaped cutouts, respectively, and are held in a state of being held from the front to the rear by using the couplings 55, 56, and 57, 58. It is fixed on this link. Then, the upper and lower end portions of the plate bodies 65 and 66 are respectively wound around a winding / feeding mechanism 70 described later. In addition, the cylindrical portion 15 and the cylindrical member 13 are used to discharge the gas inside the cylindrical portion 15 and an appropriate exhaust device (not shown). It should be noted that, in this embodiment, the plate bodies 65 and 66 are made of Teflon (teflon polytetrafluoroethylene) plate material having excellent friction resistance and corrosion resistance. But it is not limited to this material, it can also be 16 wood paper size applicable to China National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)

----訂---------線I A7 529072 — B7 五、發明說明((f) 以使用其它例如不銹鋼製的材料。 由上所述、前述驅動室B及處理室A實質上是利用區 隔構件11a、14、16,筒狀構件13、15,連結具55、兄、 57、58,板片体65、66而被區隔開。 又如第5圖所示在前述昇降台44上裝配著驅動馬達 60,同時也將平衡器50連接在上面。驅動馬達6〇是經由 拖架62而固定在前述昇降台44上,透過傳動帶61來驅動 則述洗淨裝置22中的搬送滾子26。另一方面、平衡器5〇 是由以相對平行於前述導軌45之狀態而固定於前述框體 17上的導桿51,及卡合於該導桿51上也同時卡合於前述 昇降台44上,可以沿著此導桿51而移動的本體52所構成 〇 前述捲繞/送出機構70是如第3圖所示,由設置於前 述框體17的上部及下部兩處,具體上如第6圖中顯示的捲 取軸72、76及連接者此捲取軸72、76雙方之驅動軸71, 及驅動此驅動軸71用的齒輪85所構成。 捲取軸72、76是分別利用拖架75、79以可任意旋轉 之方式加以支撐。然後讓板片体66依序的繞過以可任意旋 轉之方式而被支撐於前述拖架75上的導輪73、74上再將 其端部繞捲於前述捲取軸72上,讓板片体65依序的繞過 以任意旋轉之方式而被支撐於前述拖架75上的導輪77、 78上再將其端部繞捲於前述捲取軸76上。 前述齒輪85是如第7圖所示被固定於扭力保持裝置 86上。扭力保持裝置86與旋轉軸81是以軸部而相互連通 17 尺度適用中國國家標準(CNS)A4規格(210 X 297公髮1 ' (請先閱讀背面之注意事項再填寫本頁) · I I I 丨 — I I 訂----I I I I I j 529072 B7 五、發明說明(t、() ,旋轉軸81是利用固定於拖架84上的軸承90及單向離合 器87來加以支撐。又,在旋轉軸81之端部經由單向離合 器88而設置著滑輪80。因此齒輪85是與固定於前述驅動 軸71上的齒輪89相互嚙合。還有前述單向離合器87、88 具有限制旋轉軸81旋轉方向的機能。在本實施例中當捲繞 /送出機構70設置在上部之場合,會在限制旋轉軸81朝向 箭頭E方向旋轉之同時,容許其朝向箭頭F方向之旋轉’ 而當捲繞/送出機構70設置在下部之場合,會在限制旋轉 軸81朝向箭頭F方向旋轉之同時,容許其朝向箭頭E方向 之旋轉。還有扭力保持裝置86也就是所謂的摩擦離合器, 會施加既定的制動力(煞車力)於旋轉軸81上。 又如第3圖所示在設置於上下位置處的前述滑輪80、 8〇上,繞捲著形成連續狀的傳動帶82,傳動帶82是利用 固定於前述螺帽42上的支撐架(Holder)83予以保持著。 接著針對具備上述構成的基板處理系統1之動作予以 說明。還有前述昇降式基板處理系統10是如第3圖中以實 線狀態所顯示的。 首先利用移載裝置3將基板K依序的從卡匣5中取出 ’投入第1基板處理裝置6內。投入後之基板K在第1基 板處理裝置6內一面被按照箭頭方向搬送一面被施予既定 的處理(蝕刻處理)後,再依序的由第1基板處理裝置6中 排出。 接下來讓取出之基板K依序的通過昇降式基板處理系 統10的開口部11a、開口部23a而進入洗淨裝置22內,並 18 本紙張尺度適用中國國家標準(CNS)A4規格(21Q X 297公f ) ------- -----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 529072 B7 五、發明說明(β ) (請先閱讀背面之注意事項再填寫本頁) 經由搬送滾子26之作用搬入至其內部,在基板K之搬入 過程中或是搬入後從噴嘴29、30噴出洗淨液開始進行基板 Κ的洗淨作業。然後直到洗淨作業結束爲止連續的將前述 搬送滾子26之旋轉在正反方向間變換’讓前述基板Κ沿 著搬入/排出方向以既定的距離前後移動。以此方式即使是 從噴嘴29、30噴出洗淨液之噴出量、噴出壓產生變動的場 合,利用讓基板Κ前後移動之方式能將基板κ上面的不均 狀態予以平均化,而得以將基板κ均句的予以洗淨。 基板Κ完成洗淨裝置22內的搬入作業後,接著經由 昇降機構40中伺服馬達43的驅動讓洗淨裝置22降下。也 就是說利用伺服馬達43讓滾珠螺桿41朝下降方向旋轉’ 使得螺合於此螺桿上之螺帽42沿著滾珠螺桿41而降下’ 同時讓連結於螺帽42上之昇降台44 ’透過連結具55、56 及57、58而與此昇降台44連接之支撐架台13、及由支撐 架台13所支撐著的洗淨裝置22和螺帽42 —起降下。 當螺帽42降下時,透過支撐架83而連接於螺帽42上 的傳動帶82就朝向箭頭所示之C方向旋轉移動。當連結具 55、56及57、58降下時,固定於其上面的板片體65、66 會一起往下方移動,在此同時、板片體65、66會從設置於 上部的捲繞/送出機構70中排出,而板片體65、66也會繞 捲至設置於下部的捲繞/送出機構70內。 利用第7圖將此捲繞/送出機構70之捲繞/送出動作詳 細的說明如下。第7圖爲設置於上部及下部的捲繞/送出機 構70之平剖面圖。在圖示中雖然僅針對連結具57、%及 19 ί、紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) 529072 A7 __B7_____ 五、發明說明(ί 7 ) 板片體66加以說明,在連結具55、56及板片體65上也是 相同之情況。 首先針對設置於上部的捲繞/送出機構70加以說明。 當連結具57、58降下時會在板片體66產生張力,並對捲 繞軸72施予朝向箭頭所示之Η方向旋轉動力。此旋轉動 力會依序的經由連接於捲繞軸72上之驅動軸71,固定於 此驅動軸上之齒輪88,與齒輪88嚙合之齒輪85,裝置著 齒輪85之扭力保持裝置86然後傳遞至旋轉軸81上。但是 由於旋轉軸81是利用單向離合器87而被限制往箭頭所示 Ε方向旋轉故無法朝向同方向旋轉。因此產生在板片體66 之張力會漸漸的增大而傳遞至前述扭力保持裝置86上之扭 力也隨之增大。 在扭力保持裝置86中、當作用於齒輪85上之扭力超 過既定的大小値後,就容許齒輪85朝著扭力的作用方向旋 轉。以此方式齒輪85朝向箭頭所示之Ε方向,而齒輪88 、驅動軸71及捲繞軸72朝向旋轉箭頭所示之Η方向分別 的旋轉,使得板片體66從捲繞軸72中排出。像這樣板片 體66是在產生既定的張力之狀態下被排出,故在排出之過 程中不會發生鬆弛的現象。 另一方面、經由螺帽42之降下,當傳動帶82如第3 圖所不之箭頭C方向旋動時,滑輪80是承受箭頭Ε方向 的旋轉動力,由於在滑輪80與旋轉軸81之間裝置著單向 離合器88,滑輪80是相對於旋轉軸81可沿著箭頭Ε方向 任意的旋轉,故滑輪80能在無障礙之狀況下透過傳動帶 20 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 529072 A7 ______B7___ 五、發明說明((t) 82而朝向箭頭E方向任意的旋轉。單向離合器88雖然是 限制旋轉軸81朝向箭頭E方向的旋轉,但容許其朝向箭頭 F方向旋轉。因此,單向離合器88是相對於旋轉軸81而 可以沿著箭頭E方向任意的旋轉。 接下來針對設置於下部的捲繞/送出機構70加以說明 。在設置於下部的捲繞/送出機構70中,經由螺帽42之降 下當傳動帶82如前述箭頭C方向旋動時,滑輪82是承受 箭頭E方向的旋轉動力。如上所述在設置於下部的捲繞/送 出機構70之場合,單向離合器87、88會限制旋轉軸81朝 向箭頭F方向的旋轉,但另一方面容許其朝向箭頭E方向 旋轉。因此,當滑輪82承受箭頭所示E方向的旋轉動力時 ,旋轉軸81就朝向相同方向旋轉。當旋轉軸81朝向箭頭 E方向旋轉時,其旋轉動力會透過扭力保持裝置86、齒輪 85及齒輪88而傳遞至驅動軸71及捲繞軸72上,讓這些裝 置朝向箭頭Η方向旋轉而將板片體66繞捲於捲繞軸76上 〇 還有在本實施例中爲了讓捲繞軸72之捲繞速度較板片 體66及傳動帶82之移動速度快,而設定捲繞軸72之軸徑 、滑輪80之直徑、及齒輪85與齒輪88間的齒數比。當捲 繞軸72之捲繞速度較板片體66移動速度快時,產生於板 片體66上的張力則漸漸的增大傳遞至扭力保持裝置86上 之扭力也隨之增大。如上所述在扭力保持裝置86中、當作 用於齒輪85上之扭力超過既定的大小値後,就容許齒輪 85朝著扭力的作用方向旋轉。經由此方式在齒輪85與旋 21 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝 ----訂---------線‘ A7 529072 ___B7_____ 五、發明說明(丨"| ) 轉軸81間產生滑移(Slip)狀態,讓旋轉軸81可無障礙的跟 隨皮帶80而朝向箭頭E方向旋轉。以此方式讓板片體66 是在產生既定張力之狀態下進行捲繞,故在捲繞之過程中 不會發生鬆驰的現象。 如以上所詳述之方式,利用本實施例中之捲繞/送出機 構70,可以隨著洗淨裝置22之降下而在不產生鬆驰狀態 下進行板片體65、66的捲繞及排出作業。 如上所述當洗淨裝置22之降下至下降端位置後,接下 來讓前述搬送滾子26朝向排出方向旋轉而將基板K從開 口部23a排出,再從蓋體11之開口部lib將其移送至第2 基板處理裝置7內。又,利用第3圖中之2點鏈線來表示 當洗淨裝置22到達下降端位置後之狀態。 當完成了基板K之排出動作後,洗淨裝置22就停止 從噴嘴29、30中噴出洗淨液。然後經由昇降機構40中伺 服馬達43的驅動讓洗淨裝置22上昇。在此時則利用與上 述中相反的動作方式,將板片體65、66捲繞在設置於上部 的捲繞/送出機構70上,並將板片體65、66從設置於下部 的捲繞/送出機構70中排出。 然後當洗淨裝置22到達上昇端位置後,就重覆上述基 板K搬入以後之動作。又,在洗淨裝置22昇降之時利用 平衡器50來減輕作用於伺服馬達43上之負荷。 另一方面、在第2基板處理裝置7中一面將搬入後之 基板K往箭頭方向搬送,一面施予既定的處理(水洗處理及 乾燥處理),處理完後將基板K排出再利用移載裝置3收納 __ 22 紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) (請先閱讀背面之注意事項再填寫本頁) ----訂---------線j A7 529072 _____B7____ 五、發明說明(>力) 於卡匣5內。以此方式在本實施例之基板處理系統1中, 收納於卡匣5內的基板Κ是依序的經由第1基板處理裝置 6、昇降式基板處理系統10及第2基板處理裝置7,在被 施予既定的處理後又再次的被收納於卡匣5內。 如以上所詳述在本實施例之基板處理系統丨中,是將 第1基板處理裝置6及第2基板處理裝置7上下方向並排 設置,並利用昇降式基板處理系統10將其作成相互連結之 構成,故相較於習知將第1基板處理裝置6及第2基板處 理裝置7並排設置於同一水平平面內的處理系統2000,只 要較小的設置空間就足夠了,故可以具有較佳之設置效率 〇 還有在本實施例之昇降式基板處理系統10中,將進行 基板Κ之搬送、支撐用的搬送滾子26及由噴出洗淨液至 基板Κ上的噴嘴29、30所構成的洗淨裝置22整體的予以 昇降,故在搬送基板Κ之時基板Κ與噴嘴29、30間的位 置關係並不會改變,因此從噴嘴29、30所噴出之洗淨液可 以幾乎均等的供給基板Κ的各個部位上,以此方式而能夠 進行均勻的洗淨處理。 又由於是利用昇降機構40將洗淨裝置22予以昇降的 單一動作來搬送基板Κ,還有利用伺服馬達43、滾珠螺桿 41及螺帽42所構成具有高控制精度的機構 來讓其昇降,故可以高精度的進行其速度控制。 在第1基板處理裝置6中所使用之蝕刻液具有極高的 腐蝕性,如果含有此蝕刻液之洗淨水從洗淨裝置22中流出 23 ___ -----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 529072 a7 ___B7 五、發明說明(yl) 並附著於昇降機構40上時,就有損傷此機構而造成其機能 受損之顧慮。在本實施例之昇降式基板處理系統10中’利 用區隔構件lla、14、16,筒狀構件13、13,連結具55、 56、57、58,板片體65、66來將配置著昇降機構40的驅 動室B及配置著洗淨裝置22的處理室A加以區隔開來’ 故可以防止從洗淨裝置22流出之鈾刻液侵入驅動室B內’ 而得以防止由於触刻液造成昇降機構40之損傷。 尤其是分別沿著區隔構件lla、14、16之間所形成開 口部上下方向的緣部設置筒狀部15及筒狀構件13 ’同時 將固定於連結具55、56及57、58上的板片體65、66之兩 側緣部插入形成於筒狀部15及筒狀構件13上的槽狀缺口 內,也就是形成曲徑板式的密封構造,同時利用排氣裝置 將筒狀部15及筒狀構件13內部排氣,故能夠確實的防止 蝕刻液侵入驅動室B內。 以上雖針對本發明之一實施形態加以說明,但本發明 所得以採取的具體形式並不受限於上述之形態。例如在上 述之例子中雖是配合著洗淨裝置22之昇降而利用捲繞/送 出機構70來進行板片體65、66之捲繞或排出,也可以作 成將板片體65、66形成無端之連續環狀並配合著洗淨裝置 22之昇降而讓其旋動之構成。 還有在上面的例子中,是作成利用昇降式基板處理系 統10而進行洗淨之構成,但並不受限於此種形態也可以進 行蝕刻或其它的處理。這亦同樣的適用在第i基板處理裝 置6及第2基板處理裝置7上。 _____24 T紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 529072 A7 —------ -B7_ 五、發明說明(>V) 還有’使用本發明相關之昇降式基板處理裝置所作出 基板處理系統的其它形式,可以像是例如第8圖及第9圖 中所示一樣。如該圖8所示此基板處理系統1〇〇是由基板 投入/排出部1〇1、乾式處理部110、洗淨裝置120所構成。 基板投入/排出部101是由載置著複數個收納基板的卡 匣131用的載置台1〇2,及用來搬送基板之移載裝置ι〇3所 構成,移載裝置1〇3是由設置於軌道104上並可以沿著其 長度方向而移動的移載用機器人105所構成。移載用機器 人1〇5具備可在三次元空間之任意位置移動的手臂,利用 將基板載置於該手臂上之狀態,來進行從載置台1〇2上的 卡匣131內將基板一片一片的取出並投入於乾式處理部 110中’將從乾式處理部110所取出之基板投入洗淨裝置 120內’再將從洗淨裝置12〇所取出之基板再次收納於卡 匣131內之處理。還有,利用自動搬送車130將卡匣131 搬入載置台102上,並將其由該載置台102上搬出。 乾式處理部110是由用來交接基板的載置台113,及 兩台用來對基板進行乾式蝕刻理及成膜處理等乾式處理流 程之乾式處理裝置111,及配置於此載置台113與乾式處 理裝置111之間之移載用機器人112所構成。移載用機器 人112是和前述移載用機器人1〇5同樣的具備可在三次元 空間之任意位置移動的手臂,利用將基板載置於該手臂上 之狀態,來進行將載置台113上的基板投入於乾式處理裝 置111中,並將基板從乾式處理裝置111中取出載置於載 置台113上進行處理。 25 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------#裝--------訂---------線· (請先閱讀背面之注意事項再填寫本頁) 529072 A7 _ B7_____ 五、發明說明(*/)) 洗淨裝置120是如第9圖所示具備殼體狀之蓋體,在 其內部是作成由著基板收納部121、基板降下搬送部122、 毛刷洗淨部123、傾斜沖洗(Rinse)處理部124、基板上昇搬 送部125、基板乾燥部126及基板移出部127等所形成被區 隔成複數個領域之構造,利用前述移載用機器人105將基 板搬入基板收納部121中’並將基板從基板移出部127中 取出。 在前述基板收納部121、基板降下搬送部122、毛刷洗 淨部123、傾斜沖洗處理部124、基板上昇搬送部125、基 板乾燥部126及基板移出部127中分別具備複數個如第11 圖所示的搬送滾子208,搬入基板收納部121內之基板利 用搬送滾子208將其朝箭頭方向搬送,並依序的經過板降 下搬送部122、毛刷洗淨部123、傾斜沖洗處理部124、基 板上昇搬送部125、基板乾燥部126再搬送至基板移出部 127 中。 又,在毛刷洗淨部123、傾斜沖洗處理部124、基板上 昇搬送部125、基板乾燥部126中,基板是一面利用搬送 滾子208加以搬送一面進行既定的處理。 基板上昇搬送部125具備和上述之昇降式基板處理系 統10幾乎相同的構造。又毛刷洗淨部123中是在供給洗淨 水之同時利用毛刷之旋轉來將基板洗淨,傾斜沖洗處理部 124是將洗淨水供給成傾斜狀態之基板上來進行洗淨,在 基板上昇搬送部125中進行和上述之昇降式基板處理系統 10幾乎相同方式的洗淨,在基板乾燥部126中是利用將乾 _ 26 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) A7 529072 _ B7____ 五、發明說明(rf) 燥用之氣體吹至基板上來讓該基板乾燥。 還有,在傾斜沖洗處理部124中被形成呈傾斜狀態之 基板,可在該傾斜沖洗處理部124中讓其再回復至水平狀 態,或者也可在基板上昇搬送部125中再讓其回復至水平 狀態。 像這樣利用此基板處理系統100將被載置於載置台 102上卡匣131內的基板,經由移載用機器人105 —片一片 的取出並投入於乾式處理部110後,再投入洗淨裝置120 內,或者是先投入洗淨裝置120後再將投入於乾燥處理部 110 內。 針對先投入於乾式處理部110後再投入洗淨裝置120 內之場合作爲代表例加以說明時,基板被投入乾式處理部 110後’在該乾式處理部中利用移載用機器人112將其投 入乾式處理裝置111中進行既定的乾式處理程序。經過乾 式處理裝置111處理完後之基板利用移載用機器人112將 其取出’透過載置台113再送至移載用機器人105上。 接著利用移載用機器人105而投入洗淨裝置120內, 依序的在經過基板收納部121、基板降下搬送部122、毛刷 洗淨部123、傾斜沖洗處理部124、基板上昇搬送部125、 基板乾燥部126及基板移出部127,並在搬送之途中施予 既定的洗淨,然後利用移載用機器人105將其從基板移出 部127中取出後,再次的收納於卡匣131內。 以此方式將卡匣131內之基板依序的取出並施予既定 的處理後,再次的放回卡匣131內。 ____ 27 私紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公釐) -----------裝--------訂---------^ (請先閱讀背面之注意事項再填寫本頁) 529072 A7 B7 五 、發明說明C/t) 產業上之應用可行性 本發明相關之昇降式基板處理裝置及具備此裝置的其 板處理系統,相較於習知的裝置及系統可以將其所需的設 置空間極小化,適用於用來處理大型基板的處理裝置上。 圖式之簡單說明 第1圖爲本發明較佳實施形態的基板處理系統槪略構 成的前視圖。 第2圖爲第1圖之俯視圖。 第3圖爲第1圖之前視剖面圖,也爲第5圖中箭頭μι 方向之剖面視圖。 第4圖爲本實施形態的洗淨裝置的前視剖面圖。 弟5圖爲弟3圖中所τρ:昇降式基板處理裝置的η位置 處之俯視剖面圖。 第6圖爲第3圖中所示昇降式基板處理裝置的ΙΠ位置 處之俯視剖面圖。 第7圖爲本實施形態的捲繞/送出機構之俯視剖面放大 圖。 第8圖爲本發明另一形態的基板處理系統槪略構成之 俯視圖。 第9圖爲第8圖中箭頭IV方向之側視圖。 第10圖爲習知基板處理系統槪略構成的俯視圖。 第11圖爲習知搬送滾子之前視圖。 第12圖爲習知之方向切換裝置之槪略構成示意圖。 28 (請先閱讀背面之注意事項再填寫本頁) -裝--------訂---------線一 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A7 529072 _B7_ 五、發明說明(/ ) (請先閱讀背面之注意事項再填寫本頁) 其中省略第3圖到第7圖中剖面部分之陰影線。 符號說明 1 基板處理系統 6 第1基板處理裝置 7 第2基板處理裝置 10 昇降式基板處理裝置 11 蓋體 1111> 口-1^ 11a 基板投入口 lib 基板排出口 20 處理裝置 21 支撐架台 40 昇降機構 29 H張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)---- Order --------- Line I A7 529072 — B7 V. Description of the invention ((f) Use other materials such as stainless steel. As mentioned above, the aforementioned drive room B and processing room A Essentially, it is divided by the partition members 11a, 14, 16, the cylindrical members 13, 15, the linking devices 55, brothers, 57, 58 and the plate bodies 65, 66. As shown in FIG. The lifting platform 44 is equipped with a driving motor 60 and is connected to the balancer 50. The driving motor 60 is fixed to the lifting platform 44 via a trailer 62 and is driven by a transmission belt 61. The cleaning device 22 is described above. The conveying roller 26 in the middle. On the other hand, the balancer 50 is composed of a guide rod 51 fixed to the frame 17 in a state relatively parallel to the guide rail 45, and simultaneously engaged with the guide rod 51. The main body 52 which is engaged with the lifting table 44 and can be moved along the guide rod 51 is formed by the winding / feeding mechanism 70 as shown in FIG. 3 and is provided on the upper and lower portions of the frame 17 Two, specifically as shown in FIG. 6 of the take-up shafts 72, 76 and the drive shaft 71 of both the take-up shafts 72, 76, and the drive This drive shaft 71 is made up of a gear 85. The take-up shafts 72 and 76 are supported in a rotatable manner by using the carriages 75 and 79, respectively. Then, the plate body 66 is sequentially passed around to be arbitrarily rotated. It is supported on the guide wheels 73 and 74 on the trailer 75, and its ends are wound on the winding shaft 72, so that the plate body 65 is sequentially supported by being arbitrarily rotated and supported. The ends of the guide wheels 77 and 78 on the trailer 75 are wound on the winding shaft 76. The gear 85 is fixed to the torque holding device 86 as shown in Fig. 7. The torque holding device 86 and rotary shaft 81 communicate with each other by the shaft part. 17 scales are applicable to China National Standard (CNS) A4 specifications (210 X 297 public hair 1 '(Please read the precautions on the back before filling this page). III 丨 — II Order ---- IIIII j 529072 B7 V. Description of the invention (t, (), the rotating shaft 81 is supported by a bearing 90 and a one-way clutch 87 fixed on the carriage 84. Moreover, at the end of the rotating shaft 81 The pulley 80 is provided via the one-way clutch 88. Therefore, the gear 85 is fixed to the drive shaft 71. The gears 89 mesh with each other. The aforementioned one-way clutches 87 and 88 have a function of restricting the rotation direction of the rotation shaft 81. In this embodiment, when the winding / feeding mechanism 70 is provided at the upper portion, the rotation shaft 81 is restricted from facing the arrow While rotating in the E direction, it is allowed to rotate in the direction of the arrow F. When the winding / feeding mechanism 70 is provided at the lower part, it is allowed to rotate in the direction of the arrow F while restricting the rotation of the rotation shaft 81 in the direction of the arrow F. Spin. In addition, the torque holding device 86, which is a so-called friction clutch, applies a predetermined braking force (braking force) to the rotating shaft 81. As shown in FIG. 3, a continuous transmission belt 82 is wound around the pulleys 80 and 80 provided at the upper and lower positions, and the transmission belt 82 is a holder 83 fixed to the nut 42. Keep it. Next, the operation of the substrate processing system 1 having the above-mentioned configuration will be described. It is to be noted that the aforementioned lift-type substrate processing system 10 is shown in a solid line state as shown in FIG. First, the substrate K is sequentially taken out of the cassette 5 by the transfer device 3 and placed in the first substrate processing device 6. After the substrate K is put into the first substrate processing apparatus 6, the substrate K is transported in the direction of the arrow and given a predetermined process (etching process), and then discharged from the first substrate processing apparatus 6 in order. Next, the taken-out substrate K is sequentially passed through the opening 11a and the opening 23a of the lifting substrate processing system 10 into the cleaning device 22, and the paper size of this paper applies the Chinese National Standard (CNS) A4 (21Q X 297 male f) ------- ----------- install -------- order --------- line (Please read the precautions on the back first (Fill in this page again) 529072 B7 V. Description of the invention (β) (Please read the precautions on the back before filling in this page) It is moved into the interior by the action of the transport roller 26, during or after the substrate K is moved in The cleaning liquid is ejected from the nozzles 29 and 30, and the substrate K is cleaned. Then, until the cleaning operation is completed, the rotation of the carrying roller 26 is continuously changed between the forward and reverse directions' so that the substrate K is moved forward and backward along the carrying / discharging direction by a predetermined distance. In this way, even when the discharge amount and the discharge pressure of the cleaning liquid from the nozzles 29 and 30 are changed, the uneven state on the substrate κ can be averaged by moving the substrate K forward and backward, so that the substrate can be averaged. Kappa is washed in a sentence. After the substrate K has been carried in the cleaning device 22, the cleaning device 22 is lowered by driving the servo motor 43 in the lifting mechanism 40. In other words, the ball screw 41 is rotated in the downward direction by using the servo motor 43, so that the nut 42 screwed on the screw is lowered along the ball screw 41, and the lifting table 44 connected to the nut 42 is passed through the link. A support stand 13 having 55, 56, and 57, 58 connected to the lifting table 44 and a cleaning device 22 and a nut 42 supported by the support stand 13 are lifted and lowered. When the nut 42 is lowered, the transmission belt 82 connected to the nut 42 through the support frame 83 is rotated and moved in the direction C indicated by the arrow. When the couplings 55, 56, and 57, 58 are lowered, the plate bodies 65, 66 fixed on the upper side will move downward together, and at the same time, the plate bodies 65, 66 will be wound / sent out from the upper part. It is discharged from the mechanism 70, and the plate bodies 65 and 66 are also wound into the winding / feeding mechanism 70 provided at the lower portion. A detailed description of the winding / feeding operation of this winding / feeding mechanism 70 using Fig. 7 is as follows. Fig. 7 is a plan sectional view of the winding / feeding mechanism 70 provided at the upper and lower portions. Although shown in the illustration, only 57,% and 19 liters are used. The paper size is subject to the Chinese National Standard (CNS) A4 specification (210 X 297 public love). The same applies to the connecting devices 55 and 56 and the plate body 65. First, the winding / feeding mechanism 70 provided at the upper portion will be described. When the link devices 57 and 58 are lowered, tension is generated in the plate body 66, and a rotating power is applied to the winding shaft 72 in the direction indicated by the arrow 所示. This rotational power will be sequentially transmitted through the driving shaft 71 connected to the winding shaft 72, the gear 88 fixed on the driving shaft, the gear 85 meshing with the gear 88, and the torque holding device 86 of the gear 85 will be transmitted to Rotating shaft 81. However, the rotating shaft 81 cannot be rotated in the same direction because it is restricted to rotate in the E direction indicated by the arrow by the one-way clutch 87. Therefore, the tension generated in the plate body 66 will gradually increase, and the torque transmitted to the aforementioned torque holding device 86 will also increase. In the torque holding device 86, when the torque applied to the gear 85 exceeds a predetermined magnitude, the gear 85 is allowed to rotate in the direction in which the torque acts. In this way, the gear 85 is rotated in the direction E shown by the arrow, and the gear 88, the drive shaft 71, and the winding shaft 72 are respectively rotated in the direction Η shown by the rotation arrow, so that the plate body 66 is discharged from the winding shaft 72. Since the plate body 66 is discharged in a state where a predetermined tension is generated, slackness does not occur during the discharge process. On the other hand, when the transmission belt 82 is rotated in the direction of the arrow C shown in FIG. 3 through the lowering of the nut 42, the pulley 80 is subject to the rotating power in the direction of the arrow E. With the one-way clutch 88, the pulley 80 can arbitrarily rotate in the direction of the arrow E relative to the rotating shaft 81, so the pulley 80 can pass through the transmission belt 20 in an unobstructed condition. This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) ----------- install -------- order --------- line (please read the precautions on the back before filling this page) 529072 A7 ______B7___ V. Description of the invention ((t) 82 and arbitrary rotation in the direction of arrow E. Although the one-way clutch 88 restricts the rotation of the rotation shaft 81 in the direction of arrow E, it is allowed to rotate in the direction of arrow F. Therefore, the single The directional clutch 88 can rotate arbitrarily in the direction of the arrow E with respect to the rotation shaft 81. Next, the winding / feeding mechanism 70 provided at the lower portion will be described. When the nut 42 is lowered, the transmission belt 82 rotates in the direction of the arrow C described above. At this time, the pulley 82 is subject to the rotation power in the direction of the arrow E. In the case of the winding / feeding mechanism 70 provided at the lower portion as described above, the one-way clutches 87 and 88 restrict the rotation of the rotation shaft 81 in the direction of the arrow F, but otherwise On the one hand, it is allowed to rotate in the direction of arrow E. Therefore, when the pulley 82 receives the rotating power in the direction of arrow E, the rotating shaft 81 is rotated in the same direction. When the rotating shaft 81 is rotated in the direction of arrow E, its rotating power will be The torque holding device 86, gear 85, and gear 88 are transmitted to the drive shaft 71 and the winding shaft 72, and these devices are rotated in the direction of the arrow Η to wind the plate body 66 onto the winding shaft 76. In this embodiment, in order to make the winding speed of the winding shaft 72 faster than the moving speed of the plate body 66 and the transmission belt 82, the shaft diameter of the winding shaft 72, the diameter of the pulley 80, and the distance between the gear 85 and the gear 88 are set. Gear ratio. When the winding speed of the winding shaft 72 is faster than the movement speed of the plate body 66, the tension generated on the plate body 66 gradually increases, and the torque transmitted to the torque holding device 86 also increases. .As mentioned above in torque In the holding device 86, when the torque on the gear 85 exceeds a predetermined magnitude, the gear 85 is allowed to rotate in the direction of the torque. By this method, the Chinese national standard (CNS) is applied to the gear 85 and the screw 21. ) A4 size (210 X 297 mm) (Please read the precautions on the back before filling this page) -Installation ---- Order --------- Thread 'A7 529072 ___B7_____ V. Description of the invention (丨" |) A slip state is generated between the rotating shafts 81 so that the rotating shaft 81 can follow the belt 80 without any obstacle and rotate in the direction of the arrow E. In this way, the sheet body 66 is wound under a state where a predetermined tension is generated, so that slackness does not occur during the winding process. As described in detail above, with the winding / feeding mechanism 70 in this embodiment, it is possible to wind and discharge the plate bodies 65 and 66 without causing a slack state as the cleaning device 22 is lowered. operation. After the cleaning device 22 is lowered to the lowered end position as described above, the substrate roller K is then discharged from the opening 23a by rotating the conveying roller 26 in the discharge direction, and then transferred from the opening 11b of the cover 11 Into the second substrate processing apparatus 7. The two-dot chain line in Fig. 3 is used to indicate the state after the cleaning device 22 has reached the lower end position. When the ejection operation of the substrate K is completed, the cleaning device 22 stops ejecting the cleaning liquid from the nozzles 29 and 30. Then, the cleaning device 22 is raised by driving the servo motor 43 in the lifting mechanism 40. At this time, the plate body 65, 66 is wound around the winding / feeding mechanism 70 provided on the upper part by the operation method opposite to the above, and the plate body 65, 66 is wound from the lower part. Discharge from the sending-out mechanism 70. Then, when the cleaning device 22 reaches the rising end position, the above operation after the substrate K is carried in is repeated. When the washing device 22 is raised and lowered, the balancer 50 is used to reduce the load acting on the servo motor 43. On the other hand, in the second substrate processing apparatus 7, the substrate K after being carried in is conveyed in the direction of the arrow, and a predetermined process (water washing process and drying process) is given, and the substrate K is discharged after reuse and transferred to the transfer device. 3Storage __ 22 The paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) (Please read the precautions on the back before filling this page) ---- Order --------- Line j A7 529072 _____B7____ 5. The description of the invention (> force) is inside the cassette 5. In this way, in the substrate processing system 1 of this embodiment, the substrate K stored in the cassette 5 passes through the first substrate processing apparatus 6, the lifting substrate processing system 10, and the second substrate processing apparatus 7 in this order. After being given a predetermined treatment, it is stored in the cassette 5 again. As described above, in the substrate processing system of this embodiment, the first substrate processing apparatus 6 and the second substrate processing apparatus 7 are arranged side by side in the up-down direction, and they are connected to each other by using a lifting substrate processing system 10. Structure, compared with the conventional processing system 2000 in which the first substrate processing device 6 and the second substrate processing device 7 are arranged side by side in the same horizontal plane, a small installation space is sufficient, so it can have a better setting Efficiency 〇 Also, in the elevating substrate processing system 10 of this embodiment, the substrate roller K is transported and supported by the transfer rollers 26 and the nozzles 29 and 30 for spraying the cleaning liquid onto the substrate K are cleaned. The cleaning device 22 is lifted as a whole, so the positional relationship between the substrate K and the nozzles 29 and 30 does not change when the substrate K is transported. Therefore, the cleaning liquid sprayed from the nozzles 29 and 30 can be supplied to the substrate K almost equally. In this way, uniform washing treatment can be performed on each part. In addition, the substrate K is conveyed by a single operation of lifting and lowering the cleaning device 22 by a lifting mechanism 40, and a mechanism with high control accuracy is formed by a servo motor 43, a ball screw 41, and a nut 42 to lift the substrate K. It can perform its speed control with high precision. The etching solution used in the first substrate processing apparatus 6 is extremely corrosive. If the cleaning water containing this etching solution flows out of the cleaning apparatus 22 23 ___ ----------- -------- Order --------- Line (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ) 529072 a7 ___B7 5. Description of the Invention (yl) When attached to the lifting mechanism 40, there is a concern that the mechanism will be damaged and its function will be damaged. In the lift-type substrate processing system 10 of this embodiment, the partition members 11a, 14, 16 and the cylindrical members 13, 13 and the connecting members 55, 56, 57, 58 and the plate members 65 and 66 are used to arrange them. The driving chamber B of the lifting mechanism 40 and the processing chamber A equipped with the cleaning device 22 are separated from each other, so that the uranium etched liquid flowing out of the cleaning device 22 can be prevented from entering the drive room B, and the contact with the etched liquid can be prevented. Damage to the lifting mechanism 40 is caused. In particular, a cylindrical portion 15 and a cylindrical member 13 ′ are provided along edges in the vertical direction of the openings formed between the partition members 11 a, 14, and 16, respectively, and are fixed to the couplings 55, 56, 57, and 58 at the same time. Both edge portions of the plate bodies 65 and 66 are inserted into groove-shaped notches formed in the cylindrical portion 15 and the cylindrical member 13, that is, a meandering plate type sealing structure is formed, and the cylindrical portion 15 is exhausted by an exhaust device. Since the inside of the cylindrical member 13 is exhausted, it is possible to reliably prevent the etchant from entering the driving chamber B. Although one embodiment of the present invention has been described above, the specific form obtained by the present invention is not limited to the aforementioned form. For example, in the above-mentioned example, although the sheet body 65, 66 is wound or discharged by the winding / feeding mechanism 70 in conjunction with the lifting and lowering of the cleaning device 22, the sheet body 65, 66 can also be made endless. It has a continuous ring shape, and is configured to rotate with the lifting and lowering of the cleaning device 22. Also, in the above example, the cleaning is performed by using the elevating substrate processing system 10, but it is not limited to this type, and etching or other processing may be performed. The same applies to the i-th substrate processing apparatus 6 and the second substrate processing apparatus 7. _____24 T paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 mm) ----------- installation -------- order --------- Line (please read the precautions on the back before filling this page) 529072 A7 ------- -B7_ V. Description of the invention (> V) And 'Substrate made using the lifting substrate processing apparatus related to the present invention Other forms of the processing system may be as shown in, for example, FIGS. 8 and 9. As shown in FIG. 8, the substrate processing system 100 includes a substrate loading / discharging unit 101, a dry processing unit 110, and a cleaning device 120. The substrate loading / unloading unit 101 is composed of a mounting table 102 for placing a plurality of cassettes 131 for storing substrates, and a transfer device ι3 for transferring substrates. The transfer device 103 is composed of The transfer robot 105 is provided on the rail 104 and is movable along the longitudinal direction. The transfer robot 105 has an arm that can be moved at any position in the three-dimensional space. The substrate is placed on the arm to carry the substrates one by one from the cassette 131 on the mounting table 102. The substrate taken out from the dry processing unit 110 is put into the cleaning device 120, and the substrate taken out from the cleaning device 120 is stored in the cassette 131 again. In addition, the cassette 131 is carried into the mounting table 102 by the automatic transfer car 130 and is carried out from the mounting table 102. The dry processing section 110 includes a mounting table 113 for transferring substrates, and two dry processing devices 111 for performing dry processing processes such as dry etching and film formation on the substrate, and the mounting table 113 and dry processing are arranged on the mounting table 113. The transfer robot 112 is configured between the devices 111. The transfer robot 112 is the same as the transfer robot 105 described above, and has an arm that can move at any position in the three-dimensional space. The substrate is placed on the arm to carry out the placement on the mounting table 113. The substrate is put into the dry processing apparatus 111, and the substrate is taken out of the dry processing apparatus 111 and placed on a mounting table 113 for processing. 25 Wood paper size applies to China National Standard (CNS) A4 (210 X 297 mm) ----------- # 装 -------- Order -------- -Line · (Please read the precautions on the back before filling out this page) 529072 A7 _ B7_____ V. Description of the Invention (* /)) The cleaning device 120 is provided with a housing-like cover as shown in Figure 9. The interior is made up of a substrate storage section 121, a substrate lowering conveying section 122, a brush cleaning section 123, a tilt rinse processing section 124, a substrate ascending conveying section 125, a substrate drying section 126, and a substrate removing section 127. The structure is divided into a plurality of areas, and the substrate is transferred into the substrate storage section 121 by the transfer robot 105 described above, and the substrate is removed from the substrate removal section 127. The substrate storage section 121, the substrate lowering conveying section 122, the brush cleaning section 123, the oblique washing processing section 124, the substrate ascending conveying section 125, the substrate drying section 126, and the substrate removing section 127 are each provided as shown in FIG. 11. The conveying roller 208 shown, the substrate carried into the substrate storage section 121 is conveyed in the direction of the arrow by the conveying roller 208, and sequentially passes through the plate lowering conveying section 122, the brush cleaning section 123, and the inclined rinse processing section. 124. The substrate ascending conveyance section 125 and the substrate drying section 126 are conveyed to the substrate removing section 127. Further, in the brush cleaning section 123, the oblique washing processing section 124, the substrate lifting conveying section 125, and the substrate drying section 126, the substrate is subjected to predetermined processing while being conveyed by the conveying roller 208. The substrate raising and conveying unit 125 has a structure almost the same as that of the above-mentioned elevating substrate processing system 10. In the brush cleaning unit 123, the substrate is cleaned by the rotation of the brush while the cleaning water is being supplied. The tilt rinse processing unit 124 is configured to supply the cleaning water to the substrate in an inclined state to perform cleaning. The lifting conveying section 125 performs cleaning in almost the same manner as the above-mentioned lifting substrate processing system 10, and the substrate drying section 126 uses the dried _ 26 wood paper scale to apply Chinese National Standard (CNS) A4 specifications (210 X 297 Mm) ----------- install -------- order --------- line (please read the precautions on the back before filling this page) A7 529072 _ B7____ 5. Description of the Invention (rf) Drying gas is blown onto the substrate to dry the substrate. In addition, the substrate formed in the inclined processing unit 124 in an inclined state may be returned to the horizontal state in the inclined processing unit 124, or may be returned to the substrate raising transport unit 125 again. Horizontal state. In this way, using the substrate processing system 100, the substrate placed in the cassette 131 on the mounting table 102 is taken out one by one by the transfer robot 105 and put into the dry processing unit 110, and then put into the cleaning device 120. Inside, or after being put into the cleaning device 120, and then put into the drying processing unit 110. As a representative example, a case where the substrate is put into the dry processing unit 110 after being put into the dry processing unit 110 and then into the cleaning device 120 is described as a representative example. In the dry processing unit, the transfer robot 112 is used to put the substrate into the dry type. The processing device 111 performs a predetermined dry processing program. The substrate processed by the dry processing apparatus 111 is taken out by the transfer robot 112 'and passed through the mounting table 113 and then sent to the transfer robot 105. Next, it is put into the cleaning device 120 by the transfer robot 105, and sequentially passes through the substrate accommodating section 121, the substrate lowering conveying section 122, the brush cleaning section 123, the oblique washing processing section 124, the substrate ascending conveying section 125, The substrate drying section 126 and the substrate removal section 127 are subjected to predetermined cleaning during transportation, and are then removed from the substrate removal section 127 by the transfer robot 105 and then stored in the cassette 131 again. In this way, the substrates in the cassette 131 are sequentially taken out and given a predetermined treatment, and then returned to the cassette 131 again. ____ 27 Private paper standards are applicable to China National Standard (CNS) A4 specifications (21 × 297 mm) ----------- installation -------- order ------- -^ (Please read the precautions on the back before filling in this page) 529072 A7 B7 V. Description of the invention C / t) Feasibility of industrial application The lifting substrate processing device related to the present invention and its board processing equipped with this device Compared with the conventional devices and systems, the system can minimize the installation space required for the system, and is suitable for a processing device for processing large substrates. Brief Description of the Drawings Fig. 1 is a front view showing a schematic configuration of a substrate processing system according to a preferred embodiment of the present invention. Figure 2 is a plan view of Figure 1. FIG. 3 is a cross-sectional view before FIG. 1 and also a cross-sectional view in the direction of the arrow μm in FIG. 5. Fig. 4 is a front cross-sectional view of the cleaning device of the embodiment. Figure 5 is a cross-sectional top view at τρ: the position of the η of the elevating substrate processing apparatus shown in Figure 3. Fig. 6 is a top cross-sectional view of the lift-type substrate processing apparatus shown in Fig. 3 at a position II. Fig. 7 is an enlarged plan sectional view of a winding / feeding mechanism according to this embodiment. Fig. 8 is a plan view showing a schematic configuration of a substrate processing system according to another aspect of the present invention. FIG. 9 is a side view of the arrow IV direction in FIG. 8. FIG. 10 is a plan view showing a schematic configuration of a conventional substrate processing system. Figure 11 is a front view of a conventional transfer roller. FIG. 12 is a schematic structural diagram of a conventional direction switching device. 28 (Please read the precautions on the back before filling this page)-Install -------- Order --------- Line 1 paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) A7 529072 _B7_ 5. Description of the invention (/) (Please read the precautions on the back before filling in this page) The hatched lines in the sections in Figures 3 to 7 are omitted. DESCRIPTION OF SYMBOLS 1 Substrate processing system 6 First substrate processing apparatus 7 Second substrate processing apparatus 10 Lifting substrate processing apparatus 11 Cover 1111 > port-1 ^ 11a Substrate input port lib Substrate discharge port 20 Processing apparatus 21 Support stand 40 Lifting mechanism 29 H-sheet scales are applicable to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

529072 as C8 D8 六、申請專利範圍 1·一種昇降式基板處理裝置,係具備: 殻體狀蓋體,具有上下並排之基板投入口及基板排出 ρ ; 處理機構,裝於前述蓋體內者;並且具備,收納並支 撐著從前述基板投入口搬入之基板並從前述基板排出口排 出前述基板之搬送及支撐機構、支撐該搬送及支撐機構之 支撐架台、及配設於該搬送及支撐機構之上方,用來對被 該搬送及支撐機構支撐之基板上噴出處理流體之處理流體 噴出機構;及 昇降機構,支撐著前述處理機構並使其上下昇降,並 使該處理機構經過前述基板投入口及基板排出口。 2. 如申請專利範圍第1項之昇降式基板處理裝置,其 中前述搬送及支撐機構,係收納前述基板後,使所收納的 基板在前述基板的搬入/排出方向反覆前後移動。 3. 如申請專利範圍第1項之昇降式基板處理裝置,其 中前述蓋體,是在前述基板之搬入/排出方向被區隔構件分 割成驅動室及處理室之兩個室,並在具有前述基板投入口 及基板排出口之前述處理室配設前述處理機構,而在前述 驅動室則配設前述昇降機構; 在前述區隔構件,沿著上下方向形成供連通前述處理 室及驅動室的開口部; 形成於前述區隔構件之開口部之沿著上下方向的兩緣 部均形成筒狀,而且在該一對之各筒狀部之相對面形成上 下方向之缺口槽; ______1______ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ...................................—-訂----------------線· (請先閲讀背面之注意事項再填寫本頁) 529072 A8 B8 C8 D8 六、申請專利範圍 前述處理機構之前述支撐架台,係藉由設於前述區隔 構件開口部內的連結具而與前述昇降機構連結; 前述連結具上連接著帶狀板片體,該板片體係配設於前 述一對筒狀部之間並配設成向前述連結具之上方及下方延 伸,該板片體之兩側緣部分別由前述缺口槽插入前述筒狀 部內; 前述驅動室及處理室係被前述區隔構件、連結具、及 板片體所區隔開。 4 ·如申請專利範圍第3項之昇降式基板處理裝置,其; 中前述開口部、連結具、及板片體設有複數組。 5. 如申請專利範圍第3項之昇降式基板處理裝置,又 具備排出前述筒狀部內氣體的排氣機構。 6. 如申請專利範圍第3項之昇降式基板處理裝置,其 中前述板片體形成爲無端環狀。 7·如申請專利範圍第3項之昇降式基板處理裝置,係 將供捲繞/送出前述板片體的捲繞/送出機構分別設置於前 述板片體之上部側及下部側,配合著由前述昇降機構而產 生的前述板片體之昇降動作,利用該捲繞/送出機構來捲繞 /送出前述板片體。 8.如申請專利範圍第7項之昇降式基板處理裝置,其 中前述捲繞/送出機構是由捲繞前述板片體之捲繞軸、及使 該捲繞軸旋轉之驅動機構所構成; 前述驅動機構係當前述捲繞軸往送出方向旋轉時僅讓 制動力作用在捲繞軸上,而當前述捲繞軸往捲繞方向旋轉 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) — — — — — — —— — — — — — — — — — — — — — — — — I I I I _ (請先閲讀背面之注意事項再塡寫本頁} 、1Τ_· 線秦 529072 A8 B8 C8 D8 六、申請專利範圍 時則透過摩擦離合器來對前述捲繞軸傳達動力。 (請先閱讀背面之注意事項再塡寫本頁) 9. 如申請專利範圍第8項之昇降式基板處理裝置,其 中前述驅動機構係具有:連結於前述捲繞軸之被動齒輪、 嚙合於該被動齒輪之驅動齒輪、連結於該驅動齒輪之摩擦 離合器、連結於該摩擦離合器之旋轉軸、2個分別連結於 旋轉軸之兩端部且僅容許旋轉軸單向旋轉的單向離合器、 透過一方之前述單向離合器而連結於前述旋轉軸之滑輪、 繞在該滑輪上之傳動帶、及支撐著另一方之前述單向離合 器的支撐構件; 前述2個單向離合器,係容許前述旋轉軸在前述捲繞 軸朝捲繞方向旋轉之方向上旋轉,而限制前述旋轉軸在前 述捲繞軸朝送出方向旋轉;並且 前述傳動帶係藉由前述昇降機構來旋動。 10. —*種基板處理系統’其特徵在於: 係具備前述申請專利範圍第1〜9項中任一項之昇降式 基板處理裝置,並且將邊讓基板以大致水平移動邊進行處 理的第1基板處理裝置及第2基板處理裝置上下並排; 將前述第1基板處理裝置的基板排出部與前述昇降式 基板處理裝置的基板投入口予以連接,也將前述第2基板 處理裝置的基板投入部與前述昇降式基板處理裝置的基板 排出口予以連接; 讓基板依序經過第1基板處理裝置、昇降式基板處理 裝置、第2基板處理裝置。 _3_ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)' '529072 as C8 D8 6. Scope of patent application 1. A lifting substrate processing device, which includes: a shell-shaped cover with a substrate input opening and a substrate discharge ρ side by side; a processing mechanism installed in the aforementioned cover; and Equipped with a conveyance and support mechanism that accommodates and supports a substrate carried in from the substrate input port and discharges the substrate from the substrate discharge port, a support stand that supports the transfer and support mechanism, and is disposed above the transfer and support mechanism A processing fluid ejection mechanism for ejecting a processing fluid onto a substrate supported by the conveyance and support mechanism; and a lifting mechanism supporting the processing mechanism and lifting it up and down, and passing the processing mechanism through the substrate input port and the substrate Exhaust. 2. For example, the lift-type substrate processing apparatus in the scope of the patent application, wherein the conveying and supporting mechanism is to move the stored substrate back and forth in the loading / unloading direction of the substrate after the substrate is stored. 3. The lifting substrate processing device according to item 1 of the patent application range, wherein the cover is divided into two chambers of a driving chamber and a processing chamber by a partition member in the loading / unloading direction of the substrate, and the above The processing chamber of the substrate input port and the substrate discharge port is provided with the processing mechanism, and the driving chamber is provided with the lifting mechanism; the partition member is formed with an opening for connecting the processing chamber and the driving chamber along the vertical direction. Both sides of the openings of the partitioning member formed along the vertical direction are formed in a cylindrical shape, and notch grooves in the vertical direction are formed on opposite sides of the cylindrical portions of the pair; ______1______ This paper size applies China National Standard (CNS) A4 Specification (210 X 297 mm) ......... —-Order ---------------- line · (Please read the precautions on the back before filling out this page) 529072 A8 B8 C8 D8 The pedestal is connected with the lifting mechanism by a connecting tool provided in the opening of the partition member; A band-shaped plate body is connected to the link, and the plate system is arranged between the pair of cylindrical portions and is arranged to extend above and below the link, and both side edge portions of the plate body Do not insert the notch groove into the cylindrical portion; the drive chamber and the processing chamber are partitioned by the partition member, the coupling tool, and the plate body. 4 · The lifting substrate processing device according to item 3 of the patent application scope, wherein: the aforementioned openings, connectors, and plate bodies are provided with a plurality of arrays. 5. For example, the lift-type substrate processing apparatus according to item 3 of the scope of patent application, further includes an exhaust mechanism for exhausting the gas in the cylindrical portion. 6. The lifting substrate processing apparatus according to item 3 of the patent application, wherein the aforementioned plate body is formed into an endless ring. 7. If the lifting type substrate processing device according to item 3 of the scope of patent application, the winding / feeding mechanism for winding / feeding out the sheet body is provided on the upper side and the lower side of the sheet body, respectively. The lifting operation of the sheet body by the lifting mechanism uses the winding / feeding mechanism to wind up / out the sheet body. 8. The lifting-type substrate processing apparatus according to item 7 of the scope of patent application, wherein the winding / feeding mechanism is composed of a winding shaft that winds the plate body and a driving mechanism that rotates the winding shaft; The driving mechanism only allows the braking force to act on the winding shaft when the winding shaft rotates in the sending direction, and when the winding shaft rotates in the winding direction, the paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) — — — — — — — —— — — — — — — — — — — — — — — — IIII _ (Please read the notes on the back before writing this page} 、 1Τ_ · 线 秦 529072 A8 B8 C8 D8 6. When applying for a patent, the friction coil is used to transmit the power to the winding shaft. (Please read the precautions on the back before writing this page) 9. If the patent application scope is No. 8 lift base The processing device, wherein the driving mechanism includes a passive gear connected to the winding shaft, a driving gear meshing with the passive gear, a friction clutch connected with the driving gear, and a friction gear The rotating shaft of the clutch, two one-way clutches connected to both ends of the rotating shaft and allowing only one-way rotation of the rotating shaft, a pulley connected to the rotating shaft through one of the one-way clutches, and wound on the pulley A transmission belt and a supporting member supporting the one-way clutch of the other; the two one-way clutches allow the rotation shaft to rotate in a direction in which the winding shaft rotates in a winding direction, and restricts the rotation shaft from The winding shaft rotates in the feeding direction; and the transmission belt is rotated by the lifting mechanism. 10. The * substrate processing system is characterized in that it is provided with any one of items 1 to 9 of the aforementioned patent application scope. Lifting type substrate processing apparatus, and a first substrate processing apparatus and a second substrate processing apparatus that process a substrate while being moved substantially horizontally side by side; a substrate discharge unit of the first substrate processing apparatus and the lifting substrate processing The substrate input port of the device is connected, and the substrate input portion of the second substrate processing apparatus is also connected to the lifting base. The substrate discharge port of the plate processing device is connected; let the substrate pass through the first substrate processing device, the lifting substrate processing device, and the second substrate processing device in order. _3_ This paper size applies to China National Standard (CNS) A4 (210 X 297) Mm) ''
TW091102877A 2001-02-27 2002-02-20 Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device TW529072B (en)

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