JP3248129B2 - Substrate transfer processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer processing apparatus for continuously transferring substrates to be processed, such as semiconductor wafers and glass substrates for LCDs, and appropriately processing the substrates.

[0002]

2. Description of the Related Art Generally, in a manufacturing process of a semiconductor manufacturing apparatus, a processing liquid such as a chemical solution or a rinsing liquid (cleaning liquid) is stored in a substrate to be processed (hereinafter, referred to as a wafer) such as a semiconductor wafer or LCD glass. Substrate transfer processing apparatuses that sequentially transfer to a treated processing tank or drying section and perform processing such as washing and drying are widely used.

In such a substrate transfer processing apparatus, in order to efficiently clean a plurality of wafers, for example, 50 wafers, etc., the wafers and the like are vertically arranged and conveyed, loaded into each processing unit, and processed. It is considered that the method of carrying out from the storage is preferable.

In this type of processing apparatus, a plurality of containers for storing unprocessed wafers and the like, for example, a carry-in portion of a carrier, and a plurality of containers for storing processed wafers and the like, for example, a carry-out portion of a carrier, are provided. A system in which a processing unit, a cleaning unit of a transport unit, and the like are arranged in a line is employed.

[0005] Further, with the recent trend toward finer integration and mass production of semiconductor devices, the diameter of wafers has been increasing from 8 inch wafers to 12 inch wafers.

[0006]

However, since the size and weight of the wafer and the like increase with the increase in the diameter of the wafer and the like, if the wafer is transported in a vertical state as usual from the loading to unloading, the loading and unloading is performed. When a wafer or the like is transferred between the unit and the processing unit, there is a problem that a positional shift occurs or particles are generated due to the movement of the wafer or the like, thereby lowering a product yield.

[0007] In addition, there is a problem in that the transfer means and each processing unit itself become large with the increase in the diameter of the wafer or the like, and the whole apparatus becomes large, which causes a decrease in throughput.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a substrate transfer processing apparatus capable of improving the throughput by reducing the size of the entire apparatus and improving the product yield. It is assumed that.

[0009]

In order to achieve the above object, the present invention is configured as follows.

[0010] ( 1 ) The invention according to claim 1 is a carrying-in portion for a container that stores a plurality of substrates to be processed in a horizontal state,
The unloading section of the container, substrate unloading means for extracting a plurality of substrates in the container, substrate storage means for storing a plurality of substrates in the container, and the plurality of substrates in a horizontal state and a vertical state A posture conversion unit for converting, a processing unit for appropriately processing the plurality of substrates, a substrate transfer for transferring the plurality of substrates between the posture conversion unit and the processing unit, and for transferring the substrate in the processing unit Means, wherein the substrate transfer means is formed so as to be movable to a position facing the attitude conversion means, and a substrate transfer between the substrate transfer means and the attitude conversion means for transferring the substrate therebetween. Means, and the substrate transfer means includes a plurality of substrates.
A support member for supporting the plate, and the support member is horizontally moved.
Horizontal moving part that moves and vertical moving part that moves vertically
It is characterized by having .

[0011] With this configuration, the inside of the container is
Convert multiple substrates stored in a horizontal state to a vertical state
Process, and process multiple substrates.
It can be converted to a horizontal state and stored in a container. Ma
In addition, only the horizontal and vertical linear mechanisms can be provided without providing a rotating mechanism for the movement operation of the substrate transfer means. Accordingly, the size and simplification of the device can be achieved, and the throughput can be improved.

[0012] (2) According to a second aspect of the invention, a loading unit of the container for storing a plurality of substrates for the process in a horizontal state,
The unloading section of the container, substrate unloading means for extracting a plurality of substrates in the container, substrate storage means for storing a plurality of substrates in the container, and the plurality of substrates in a horizontal state and a vertical state A posture converting means for converting, a processing unit for appropriately processing the plurality of substrates, a position detecting means for detecting a notch provided on the substrate and performing positioning,
A plurality of substrates positioned above are transferred between the attitude conversion unit and the processing unit, and a substrate transportation unit that transports the substrate in the processing unit; and a position where the substrate transportation unit faces the attitude conversion unit. movably formed on, between the substrate carrier means and the attitude changing means, disposed substrate transfer means for transferring the substrate therebetween, the substrate transfer
The support means includes a support member for supporting the plurality of substrates, and the support member.
Horizontal moving part for moving the holding member in the horizontal direction, and vertical direction
And a vertical moving unit for moving the moving object.

[0013] With such a configuration, according to claim 1
In addition to the described invention, a plurality of substrates can be processed in an appropriate state.

( 3 ) In the invention as set forth in claim 1 or 2 , preferably , the substrate transfer means further includes a rotating section for rotating the supporting member and the horizontal moving section in the horizontal direction. 3 ).

( 4 ) The invention according to claim 4, wherein a carry-in portion of a container for storing a plurality of substrates to be processed in a horizontal state,
The unloading section of the container, substrate unloading means for extracting a plurality of substrates in the container, substrate storage means for storing a plurality of substrates in the container, and the plurality of substrates in a horizontal state and a vertical state A posture conversion means for converting, a processing unit for appropriately processing the plurality of substrates, and a plurality of substrates, the postures of which have been converted by the posture conversion means, opposite to the loading unit and the unloading unit with the processing unit interposed therebetween. comprising: a substrate transfer means for transferring to the interface portion disposed on the side, while passing the plurality of substrates between the processing unit the interface unit, and a substrate conveying means for conveying the substrate in the processing section, the And the substrate transfer means is the attitude conversion means.
Movably formed at a position facing the
A base between the step and the posture changing means for transferring the substrate between the two.
A board delivery means is provided, and the plurality of board delivery means are provided.
A support member for supporting a plurality of substrates, and the support member
Horizontal moving part moving vertically and vertical moving vertically
It is characterized by having a moving unit . In this case, while passing the plurality of substrates between the processing unit and the attitude changing means, it is preferable to provide the second substrate transport device that transports the substrate processing section preferably (claim 5).

With this configuration, the plurality of substrates transferred to the interface unit disposed on the opposite side of the loading unit and the unloading unit across the processing unit can be transferred to the processing unit by the substrate transfer unit. Therefore, even when there are many processing steps and processing lines, a plurality of substrates can be continuously transferred. It is also used for the movement operation of the substrate transfer means.
Only horizontal and vertical linear mechanisms without a rolling mechanism
Can be given. Therefore, the size of the device can be reduced and
Simplification can be achieved and throughput can be improved.
Further, since the first and second substrate transfer means can share the transfer of the substrate in the processing section , the throughput can be further improved (Claim 5 ).

(5) The invention according to claim 6, wherein a carrying-in portion of a container for accommodating a plurality of substrates to be processed in a horizontal state,
An unloading unit for the container, a processing unit that appropriately processes the plurality of substrates, an interface unit disposed on the opposite side of the loading unit and the unloading unit with the processing unit interposed therebetween, and a loading unit that is loaded into the loading unit. Container transferring means for transferring the container to the interface unit; substrate extracting means for extracting a plurality of substrates in the container in the interface unit; and a plurality of substrates extracted from the container by the substrate extracting means. A first posture changing means for changing a posture of the substrate from a horizontal state to a vertical state, and transferring the plurality of substrates between the first posture changing means and the processing unit, and transporting the substrate in the processing unit. Substrate transporting means, second attitude changing means disposed on the loading section and unloading section, and changing the attitude of the plurality of substrates from a vertical state to a horizontal state; A substrate storage means for storing a substrate , wherein the substrate transfer means converts the posture.
Means for moving the substrate,
Transfer the board between the sending means and the attitude changing means
Substrate delivery means is provided, wherein the substrate delivery means comprises:
A support member for supporting a plurality of substrates, and
Horizontal moving part that moves in the horizontal direction, and moves in the vertical direction
It has a vertical moving part . In this case, while passing the plurality of substrates between the processing unit and the second attitude changing means, is preferable to provide the second substrate transport device that transports the substrate processing section preferably (claim 7) .
Further, it is preferable to provide a container standby portion at a position along the transfer path of the container transfer means (claim 8 ).

With such a configuration, the container carried into the carry-in section is transferred to the interface section via the container transfer means, and the posture of the plurality of substrates is horizontally adjusted by the first posture changing means in the interface section. After the state is changed from the vertical state to the vertical state, the substrate can be transferred to the processing unit by the substrate transfer unit, so that a plurality of substrates can be transferred continuously even when there are many processing steps and processing lines. Further, after the plurality of substrates processed by the second substrate transport unit are transferred to the second posture conversion unit, the postures of the plurality of substrates are changed from the vertical state to the horizontal state, and then the unloading unit is moved by the substrate storage unit. It can be accommodated in a container from the outside (claim 7 ). Therefore, the transfer of the substrate in the processing section can be shared by the first and second substrate transfer means, so that the throughput can be improved.

( 6 ) The invention according to claim 9 is the invention according to claim 1,
5. The substrate transfer processing device according to 2 or 4 , wherein a container standby unit for storing an empty container, a container for transferring the container in the loading unit and the unloading unit, and between the loading unit and the unloading unit and the container standby unit. Transport means. In this case, it is preferable to provide a container moving means for moving the container in the container standby section (claim 12).
With this configuration, it is possible to smoothly transport the containers at the loading unit and the unloading unit, and to smoothly transport the empty containers from the loading unit and store the processed substrates in the empty containers. it can.

( 7 ) The invention according to claim 10 is the substrate transfer processing apparatus according to claim 1, 2 , 4 or 6 .
The carry-in part and / or the carry-out part, between a substrate unloading position where a plurality of substrates are taken out of the container by the substrate unloading means and a substrate storing position where a plurality of substrates are stored in the container by the substrate storing means, A container conveying means for conveying the container is provided. With this configuration, it is possible to smoothly transport the container in the loading section and the unloading section.

(8) According to the eleventh aspect of the present invention, in the substrate transfer processing apparatus according to the first , second or fourth aspect , the container standby unit for storing the container, the loading unit and the unloading unit, and the container standby unit. First container transport means for transporting a container to and from a container, and second container transport means for transporting a container between the container standby unit and the substrate unloading means and the substrate storage means. It is characterized by. With this configuration, it is possible to facilitate the transport of the container in the loading unit and the unloading unit, and to facilitate the removal of the substrate from the container and the storage of the substrate in the container. Therefore, a large number of containers can be stocked and a large number of substrates can be processed continuously.

( 9 ) The invention according to claim 13 is the invention according to claim 4.
Or the substrate transport processing apparatus according to 6 , further comprising a position detecting means for detecting and positioning notches provided on the plurality of substrates taken out of the container. With this configuration, a plurality of substrates can be processed in an appropriate state.

( 10) The invention according to claim 14 is the substrate transfer processing apparatus according to claim 1, 2, 4, or 6 ,
The above-mentioned attitude changing means is provided with an interval adjusting mechanism for adjusting an interval between a plurality of substrates. With this configuration, it is possible to process a plurality of substrates in a uniform state, and it is possible to process as many substrates as possible while maintaining a minimum interval between the substrates. can do.

( 11 ) The invention according to claim 15 is the substrate transfer processing apparatus according to claim 1, 2, 4, or 6 ,
The processing unit includes a processing tank for accommodating a plurality of substrates, and a moving mechanism for loading and unloading the plurality of substrates into and from the processing tank. In this case, the moving mechanism is used to load and load a plurality of substrates into a plurality of processing tanks.
Write unloading can be formed preferably (claim 16). With this configuration, the processing unit can be made smaller in size than a structure in which the transporting means enters the processing tank. Moreover, by loading and unloading can form the substrate for a plurality of processing tanks moving mechanism, the processing liquid such as chemical solution can be prevented from adhering to the substrate transfer means (claim 1
6 ).

( 12 ) The invention according to claim 17 is the substrate transport processing apparatus according to claim 1, 2, 4, or 6 ,
The processing unit, comprising a processing tank for accommodating a plurality of substrates, a chemical liquid supply means for supplying a chemical liquid in the processing tank, and a cleaning liquid supply means for supplying a cleaning liquid in the processing tank. Features. With such a configuration, the chemical liquid treatment and the cleaning treatment of a plurality of substrates can be continuously performed, and thus, the adhesion of particles during transportation and the size of the apparatus can be reduced.

( 13 ) The invention according to claim 18 is the substrate transport processing apparatus according to claim 1, 2, 4, or 6 ,
The processing unit includes a cleaning unit that cleans at least a substrate holding unit of the substrate transport unit. With this configuration, the substrate holding unit of the substrate transfer unit can be cleaned, and contamination and the like of the substrate before and after processing due to the atmosphere of the processing unit can be prevented.

( 14 ) The invention according to claim 19 is the substrate transfer processing apparatus according to any one of claims 1, 2, 4, and 6 ,
The processing section is provided with a substrate cleaning / drying means. With this configuration, the substrate after cleaning can be immediately dried, so that adhesion of particles and the like to the substrate and generation of a watermark can be prevented.

( 15 ) According to a twentieth aspect of the present invention, in the substrate transfer processing apparatus according to the first, second, fourth or sixth aspect ,
In the loading section, a container loading port and a substrate loading port are provided,
The carrying-out section is provided with a container carrying-out port and a substrate carrying-in port. With this configuration, the loading and unloading of the container and the substrate can be performed smoothly, and the throughput can be improved.

( 16 ) The invention according to claim 21 is the substrate transport processing apparatus according to claim 1, 2, 4, or 6 ,
The loading unit and the unloading unit are provided side by side, and a processing unit is disposed opposite to the loading unit and the unloading unit. With such a configuration, the loading and unloading operations of the container and the substrate can be performed from one side of the apparatus, so that the clean room can be effectively utilized and the entire apparatus can be reduced in size.

( 17 ) The invention according to claim 22 is the substrate transport processing apparatus according to claim 1, 2, 4, or 6 ,
A first substrate transfer unit that transfers a plurality of substrates from the position conversion unit to the processing unit; and a second substrate transfer unit that transfers the plurality of substrates from the processing unit to the position conversion unit. Is provided. With this configuration, it is possible to transport a plurality of unprocessed substrates and a plurality of processed substrates using different transport systems, and to reattach particles and the like to the processed substrates. Can be prevented.

( 18) The invention according to claim 23, wherein a plurality of sheets
Loading section for containers that store substrates to be processed horizontally
And a discharge section of the container, and a plurality of bases in the container.
A substrate unloading means for unloading a plate, and a plurality of sheets in the container
Substrate storing means for storing a plurality of substrates, and the plurality of substrates
Attitude converting means for converting the horizontal state into the vertical state,
A processing unit for appropriately processing the plurality of substrates;
For transferring the plurality of substrates between the switching means and the processing unit.
Substrate transport means for transporting the substrate in the processing unit,
The substrate transport means can be rotated vertically
And a pair of side holding rods protruding from the
A base consisting of a lower holding rod located between the side holding rods
A plate chuck is provided . Configuration like this
By doing so, multiple sheets stored horizontally in the container
Substrate can be converted to a vertical state for processing.
Converted multiple substrates into horizontal state after processing
Can be stored. In addition, several substrates can be
Can be carried .

( 19) The invention according to claim 24, wherein a plurality of sheets
Loading section for containers that store substrates to be processed horizontally
And a discharge section of the container, and a plurality of bases in the container.
A substrate unloading means for unloading a plate, and a plurality of sheets in the container
Substrate storing means for storing a plurality of substrates, and the plurality of substrates
Attitude converting means for converting the horizontal state into the vertical state,
A processing unit for appropriately processing the plurality of substrates;
For transferring the plurality of substrates between the switching means and the processing unit.
Substrate transport means for transporting the substrate in the processing unit,
Comprising: the substrate transfer means; and the attitude conversion means.
The substrate transfer means is formed so as to be movable to a position facing the substrate.
A substrate between the two and the attitude conversion means
A transfer means is provided, and a vertical
A pair of side holding members protruding from a rotating arm
The rod and the lower holding rod located between these side holding rods
A substrate chuck is provided . This
By configuring as follows,
In addition, a rotation mechanism is provided for the movement operation of the substrate transfer means.
Without having only horizontal and vertical linear mechanisms.
Wear. Therefore, if the device can be reduced in size and simplified,
In both cases, the throughput can be improved .

(20) According to the twenty-fifth aspect, a plurality of sheets
Loading section for containers that store substrates to be processed horizontally
And a discharge section of the container, and a plurality of bases in the container.
A substrate unloading means for unloading a plate, and a plurality of sheets in the container
Substrate storing means for storing a plurality of substrates, and the plurality of substrates
Attitude converting means for converting the horizontal state into the vertical state,
A processing unit for appropriately processing the plurality of substrates;
Position detection hand that detects the notch provided and performs positioning
Step, and the position determination between the attitude converting means and the processing unit.
And transfer the multiple substrates
Substrate transport means for transporting a substrate by the
Is formed so as to be movable to a position facing the above-mentioned posture changing means.
And between the substrate transfer means and the posture changing means,
A board transfer means for transferring the board between
The substrate conveying means, butt to the rotating available-rotation arm in the vertical direction
A pair of side holding rods to be installed, and between these side holding rods
Provide a substrate chuck consisting of a lower holding rod located
It is characterized by having . With this configuration,
In addition to the invention described in claim 23, a plurality of substrates can be
Can be processed in the state .

(21) The invention according to claim 26 is characterized in that
Carry-in section for containers that store the substrates to be processed in a horizontal state
And a transport unit provided with a discharge unit for the container,
A processing unit that appropriately processes a plurality of substrates;
An interface unit provided between the processing unit and
Between the interface unit and the processing unit.
The board that transfers the board and transports the board in the processing unit
Board conveying means, and the interface unit includes:
Substrate take-out means for taking out a plurality of substrates in the container
And substrate storage means for storing a plurality of substrates in the container
And convert the plurality of substrates into a horizontal state and a vertical state.
Attitude conversion means and notches provided on the plurality of substrates
And a position detecting means for detecting
A pair of protruding rotating arms rotatable in the vertical direction.
And the lower part located between these side holding rods
Features a substrate chuck consisting of a holding rod
And With this configuration, a plurality of sheets to be processed can be processed.
The transfer section of the container that stores the
Interface between the processing unit
A plurality of substrates stored horizontally in a container.
Convert to a vertical state, and put it in an appropriate state for processing.
Can be used, and the processed substrates can be placed horizontally.
And can be stored in a container. In addition, multiple
The two substrates can be reliably held and transported .

(22) The invention according to claim 27, wherein a plurality of sheets
Loading section for containers that store substrates to be processed horizontally
And a transport unit provided with a discharge unit for the container,
A processing unit that appropriately processes a plurality of substrates;
An interface unit provided between the processing unit and
Between the interface unit and the processing unit.
The board that transfers the board and transports the board in the processing unit
Comprising a plate conveying means to the interface unit, the upper
A substrate extracting means for extracting a plurality of substrates in the container,
Substrate storage means for storing a plurality of substrates in the container,
Interval adjusting means for adjusting the interval between the plurality of substrates,
Attitude to convert the above multiple substrates into a horizontal state and a vertical state
Conversion means, and the substrate transfer means is vertically
A pair of side holding rods projecting from a rotatable rotating arm
And a lower holding rod located between these side holding rods.
A substrate chuck to be formed is provided . this
With this configuration, a plurality of substrates to be processed can be stored.
Container transport unit and processing unit that processes multiple substrates
In the interface provided between the
Change multiple substrates stored horizontally into a vertical
Can be replaced and multiple substrates can be kept in a uniform state.
And maintain the minimum necessary width between boards.
As many substrates as possible can be subjected to processing. Also,
Convert the processed substrates to a horizontal state and store them in a container.
Can be paid. In addition, securely holds multiple substrates
Can be transported .

( 23) The invention according to claim 28, wherein a plurality of sheets
Loading section for containers that store substrates to be processed horizontally
And a transport unit provided with a discharge unit for the container,
A processing unit that appropriately processes a plurality of substrates;
An interface unit provided between the processing unit and
Between the interface unit and the processing unit.
The board that transfers the board and transports the board in the processing unit
Board conveying means, and
A substrate extracting means for extracting a plurality of substrates in the container,
Substrate storage means for storing a plurality of substrates in the container,
Interval adjusting means for adjusting the interval between the plurality of substrates,
Attitude to convert the above multiple substrates into a horizontal state and a vertical state
The conversion means and the notches provided on the plurality of substrates are detected.
And a position detecting means for emitting the light,
A pair of sides protruding from a vertically rotatable rotary arm
Part holding rod and lower holding part located between these side holding rods
A substrate chuck composed of a bar and a bar is provided.
You . With this configuration, a plurality of sheets to be processed
The transport section of the container for storing substrates and the processing of multiple substrates
Interface section between the
Multiple substrates that are stored horizontally in a container
Can be converted to a state, and multiple substrates can be
Make sure it is positive and uniform, and minimize the distance between substrates
To process as many substrates as possible while maintaining the width
Can be. Also, the multiple substrates after processing are changed to a horizontal state.
Alternatively, it can be stored in a container. In addition, multiple
The substrate can be reliably held and transported .

(24) The invention according to claim 29, wherein a plurality of sheets
Loading section for containers that store substrates to be processed horizontally
And a discharge section of the container, and a plurality of bases in the container.
A substrate unloading means for unloading a plate, and a plurality of sheets in the container
Substrate storing means for storing a plurality of substrates, and the plurality of substrates
Attitude converting means for converting the horizontal state into the vertical state,
A processing unit for appropriately processing the plurality of substrates;
Processing the plurality of substrates, the orientation of which has been changed by
Located on the opposite side of the carry-in and carry-out sections
Substrate transfer means for transferring to the interface unit;
The plurality of substrates between the interface unit and the processing unit
The substrate that transfers and transports the substrate in the processing unit
Transport means, and the substrate transport means has a vertical direction.
A pair of side holding members protruding from a rotating arm
The rod and the lower holding rod located between these side holding rods
A substrate chuck is provided . This
With this configuration, the loading section and the processing section
To the interface located on the opposite side of the
The multiple substrates sent are transported to the processing unit by the substrate transporter.
Because it can be sent, there are many processing steps and processing lines
In this case, multiple substrates can be transported continuously.
You. In addition, ensure that multiple substrates are held and transported.
Can be .

[0038]

Embodiments of the present invention will be described below in detail with reference to the drawings. In this embodiment, a case where the present invention is applied to a semiconductor wafer cleaning processing system will be described.

First Embodiment FIG. 1 is a schematic plan view showing a first embodiment of a cleaning processing system to which the substrate transfer processing apparatus of the present invention is applied, FIG. 2 is a schematic side view thereof, and FIG. 3 is a schematic perspective view thereof. It is.

In the above-mentioned cleaning system, a plurality of semiconductor wafers W (hereinafter, referred to as wafers) as substrates to be processed are provided.
Transport unit 2 for loading and unloading a container, for example, carrier 1, for storing wafers in a horizontal state, processing unit 3 for subjecting wafer W to liquid processing such as a chemical solution and a cleaning liquid and drying processing, and transport unit 2 and processing unit 3. Delivery of a plurality of wafers W positioned between
It mainly includes an interface unit 4 for performing position adjustment, posture conversion, and the like.

The transfer section 2 includes a carry-in section 5 and a carry-out section 6 which are provided alongside one end of the cleaning system. The carrier 1 of the loading unit 5 and the unloading unit 6
At the carry-in entrance 5a and the carry-out exit 6b, a slide-type mounting table 7 that allows the carrier 1 to enter and exit the carry-in section 5 and the carry-out section 6 is provided. In addition, the loading unit 5 and the unloading unit 6
A carrier lifter 8 (container transfer means) is provided, and the carrier lifter 8 transfers the carrier 1 between the loading unit 5 and the unloading unit 6, and between the loading unit 5 and a removal position of a wafer removal arm described later. Transport, or
The transfer between the unloading section 6 and a storage position of a wafer storage arm to be described later can be performed, and the empty carrier 1 is transferred to a carrier standby section 9 provided above the transport section 2 and the carrier standby section 9 is transferred. (See FIGS. 2 and 3). In this case, the carrier standby unit 9 has a horizontal direction (X, Y directions).
A carrier transport robot 10 (container moving means) movable in the vertical direction (Z direction) is provided, and the empty carrier 1 transported from the loading section 5 by the carrier transport robot 10 is aligned and unloaded. It can be carried out to the unit 6 (see FIG. 4). In addition, in the carrier standby unit 9, not only the empty carrier but also the carrier 1 in which the wafer W is stored can be made to wait.

As shown in FIGS. 5 and 6, the carrier 1 has an opening 1a on one side and a plurality of, for example, 25
A container body 1b having a holding groove (not shown) for holding a plurality of wafers W at appropriate intervals in a horizontal state, and a lid 1c for opening and closing an opening 1a of the container body 1b, The cover 1c is configured to be opened and closed by operating the engagement / disengagement mechanism 1d incorporated in the cover 1c by a cover opening / closing device described later.

As shown in FIGS. 7 and 8, the wafer carrying-out port 5b of the carrying-in section 5 and the wafer carrying-in port 6a of the carrying-out section 6 are engaged with the engaging / disengaging mechanism 1d of the lid 1c of the carrier 1. A vertically movable and swingable lid opening and closing device 13 having an engaging pin 11 and a lid holding plate 12 is provided.
3, the cover 1c of the carrier 1 is opened or closed. Therefore, the lid 1c of the carrier 1 for storing the unprocessed wafer W transferred to the loading unit 5
Is removed by the lid opening / closing device 13 so that the wafer W in the carrier 1 can be carried out. After all the wafers W are carried out, the lid 1c can be closed again by the lid opening / closing device 13. Further, the lid 1c of the empty carrier 1 transported from the carrier standby unit 9 to the unloading unit 6 is removed by the lid opening / closing device 13 so that the wafers W can be loaded into the carrier 1, and all the wafers W have been loaded. Thereafter, the lid 1c can be closed again by the lid opening / closing device 13.

The interface section 4 includes a partition wall 4c.
A first chamber 4a adjacent to the loading section 5 and a loading section 6
And a second chamber 4b adjacent to the second chamber 4b. And
In the first chamber 4a, a horizontal (X, Y direction), a vertical direction (Z direction) and a rotatable (θ direction) wafer for taking out and transporting a plurality of wafers W from the carrier 1 of the loading unit 5 are transported. Take-out arm 14 (substrate take-out means), notch aligner 20 (position detecting means) for detecting notches Wa provided on a plurality of wafers W, and wafer take-out arm 1
And a first attitude changing device 40 for converting a horizontal state of the wafer W to a vertical state, the apparatus including an interval adjusting mechanism 30 for adjusting the interval between the plurality of wafers W taken out by the step 4.
(Posture conversion means) is provided.

In the second chamber 4b, a wafer transfer arm 15 (substrate transfer means) for receiving and transferring a plurality of processed wafers W from the processing section 3 in a vertical state.
And a second attitude conversion device 4 for converting the wafer W received from the wafer transfer arm 15 from a vertical state to a horizontal state.
0A (posture conversion means) and the second posture conversion device 40
A receives a plurality of wafers W converted to a horizontal state by A and stores them in the empty carrier 1 conveyed to the unloading section 6 in the horizontal (X, Y directions), vertical (Z directions), and rotation (θ Direction), a wafer storage arm 16 (substrate storage means) is provided. The second chamber 4b is sealed from the outside, and is configured so that the inside of the second chamber 4b is replaced by an inert gas (not shown), for example, N2 gas supplied from a nitrogen (N2) gas supply source.

As shown in FIGS. 9 and 10, the notch aligner 20 is provided with a plurality of support plates 21 for supporting the lower peripheral edge of each wafer W transferred by the wafer take-out arm 14, and a gap between the support plates 21. A conversion mechanism 22 for converting, a notch arm 23 that moves below the wafer W supported by the support plate 21 and mounts and rotates the wafer W, It mainly includes a photo sensor 24 that detects a notch Wa provided on the wafer W. The raising / lowering operation of the conversion mechanism 22, the movement of the notch arm 23 to the lower side of the wafer W, the retreating movement, and the raising / lowering operation of the notch arm 23 are performed, for example, by transmitting a power from the motors 25 to 28 to a ball screw mechanism (not shown) or transmitting the power. This can be performed via a mechanism or the like.

The notch aligner 2 configured as described above
In order to adjust the distance between the wafers W according to 0, the distance between the wafers W transported by the wafer take-out arm 14 and placed on the support plate 21 is widened by the conversion mechanism 22 and the notch is formed on the lower surface side of the wafer W. The arm 23 is inserted, the notch arm 23 is raised, and the notch arm 2 is placed on the notch arm 23 with the wafer W mounted thereon.
3 is rotated and the photo sensor 24 detects the notch Wa. Thus, the position of the notch Wa of each wafer W is detected, and positioning is performed by detecting the position of the notch Wa. After the positioning is performed, the notch arm 23 is lowered and then retracted to the outside from the lower surface side of the wafer W. After that, the interval between the wafers W is reduced by the conversion mechanism 22 to the state where the wafer W is loaded. , Wafer W is again received by wafer unloading arm 14 and
Transported to Therefore, the first attitude conversion device 4 is not movable in a state where the notches Wa of the plurality of wafers W are aligned and positioned.
0 can be transported.

The first and second attitude converting devices 40, 4
As shown in FIG. 11 to FIG. It comprises a horizontal adjustment mechanism 41 for adjusting, and a posture conversion mechanism 45 for converting a horizontal posture of the wafer W into a vertical posture.

In this case, the interval adjusting mechanism 30
, A plurality of sets of holding members 31 opposing each other so as to be able to move forward and backward, a guide bar 32 slidably supporting these holding members 31, and a holding member 31 via an arm 33.
And a ball screw mechanism 34 for moving the guide bar 32 forward and backward
A guide member 37 having a guide elongated hole 36 through which a pin 35 protruding from the holding member 31 is slidably inserted;
A link 39 is rotatably supported by a pin 35 and is vertically rotated by a distance adjusting motor 38. By configuring the gap adjusting mechanism 30 in this manner, when the gap adjusting motor 38 is driven to rotate the link 39 counterclockwise from the state shown by the solid line in FIG. The distance between the wafers W can be changed from P to p by moving in the directions shown to be close to each other (P> p), and the distance between the wafers W can be set to an optimum state in the subsequent processing steps.

The posture changing mechanism 45 is composed of a rotating shaft 47 mounted on an end of a support base 46 on which the distance adjusting mechanism 30 is mounted, and a posture changing motor 48 for rotating the rotating shaft 47. By rotating the rotation shaft 47 by driving the attitude changing motor 48 by 90 degrees, the horizontal state of the wafer W can be converted to the vertical state. In addition,
In the second attitude changing device 40A, the rotating shaft 47 is rotated in the opposite direction to the above, so that the vertical wafer W
Can be converted to a horizontal state.

The horizontal adjustment mechanism 41 is for converting the wafer W to an appropriate vertical state, and has a mounting portion 42a for rotatably mounting a support base 46 on which the interval adjustment mechanism 30 is mounted. A rotary shaft 42b, a rotary table 42e rotatably mounted on the mounting shaft 42b via a bearing 42c, and a rotary table 42e for mounting the attitude converting motor 48 via a bracket 42d;
and a horizontal adjustment motor 44 mounted below a fixed base 43 that rotatably supports the rotary table e. By configuring the horizontal adjustment mechanism 41 in this manner, the notch aligner 2 can be used.
The wafer W positioned by 0 is transferred from the wafer unloading arm 14 to the attitude conversion device 40, and the wafer W is rotated in the horizontal direction by the driving of the horizontal adjustment motor 44 to perform horizontal adjustment. Be prepared for the conversion.

On the other hand, the processing section 3 includes a first processing unit 51 for removing particles and organic contaminants adhering to the wafer W, a second processing unit 52 for removing metal contaminants adhering to the wafer W, A cleaning / drying processing unit 53 and a chuck cleaning unit 54 for removing and drying a chemical oxide film adhered to the wafer W are linearly arranged, and are provided at positions opposed to these units 51 to 54. The path 55 is provided with a wafer transfer arm 56 (substrate transfer means) that can be rotated in the X and Y directions (horizontal direction), the Z direction (vertical direction), and rotate (θ).

In this case, the wafer transfer arm 56 is
As shown in FIG. 4, a movable platform 57 that can move up and down along guide rails (not shown) provided in the transport path 55.
And a drive table 58 mounted on the movable table 57 so as to be rotatable and horizontally movable, and a pair of wafer holding chucks 59 projecting from the drive table 59 and capable of moving forward and backward.

The first and second processing units 51 and 5
Reference numeral 2 denotes a processing tank 60 for accommodating the wafer W, and a chemical solution such as an APM solution (ammonia, An outer tank 61 for receiving a mixed solution of hydrogen peroxide solution and pure water), an HPM solution (mixed solution of hydrochloric acid, hydrogen peroxide solution and pure water), and a cleaning solution such as pure water.
And moving means for loading and unloading wafers W into and out of the processing tank 60, such as a wafer boat 70 and a processing tank. A chemical and pure water supply means, such as a jet nozzle 80, which is provided at the bottom of the wafer 60 and supplies a chemical or pure water to the wafer W, is provided.

The processing tank 60 and the outer tank 61 are made of a material having high corrosion resistance and chemical resistance, for example, quartz or polypropylene (PP). A drain port 62 is provided at the bottom of the processing tank 60, and a drain pipe 64 is connected to the drain port 62 via a drain valve 63. Also,
A drain port 65 is provided at the bottom of the outer tank 61, and a circulation line 81 is connected between the drain port 65 and the jet nozzle 80.
Is connected. A pump 82, a damper 83, and a filter 84 are provided in this circulation line 81 in this order from the drain port 65 side. A drain pipe 86 is connected between the drainage port 65 and the pump 82 via a switching valve 85, and a switching valve 87 is provided between the switching valve 85 and the pump 82. Is connected to a chemical supply pipe 88.
Further, between the filter 84 and the jet nozzle 80,
A switching valve 89 is provided, and a pure water supply pipe 90 is connected to the switching valve 89. A pure water supply source (not shown) is connected to the pure water supply pipe 90, and a chemical supply source (not shown) is connected to the chemical supply pipe 88. A drain pipe 92 is connected between the filter 84 and the switching valve 89 via a drain valve 91.

As described above, by providing the circulation piping system between the jet nozzle 80 and the drainage port 62 of the outer tank 61, the chemical supplied from the chemical supply source (not shown) into the processing tank 60 can be processed. 60, the wafer W is circulated through the circulation line 81, and the wafer W
Particles and metal ions adhering to the surface of the wafer W while being supplied to the wafer W. After discharging the chemical solution, the switching valve 89 is switched to supply the pure water supplied from the pure water supply source to the jet nozzle 80, so that the chemical solution remaining in the jet nozzle 80 can be removed. Pure water can be sprayed onto the wafer W from 80 to remove a chemical solution attached to the wafer W. In this case, the pure water overflowing from the processing tank 60 is discharged through the drain pipe 86. Here, the chemical solution is removed by supplying pure water from the jet nozzle 80. However, in this chemical solution removing step, pure water is not supplied from the jet nozzle 80, but, for example, on the bottom side or the upper side of the processing tank 60. Alternatively, a pure water supply unit may be provided at another location such as, and pure water may be supplied therefrom.

A pure water tank (not shown) is provided above the processing tank 60 and the outer tank 61, and pure water in the pure water tank is rapidly supplied to the processing tank 60 via the outer tank 61. It is being supplied. Thus, the processing tank 60
Since the wafer W accommodated therein can be subjected to the chemical processing and the cleaning processing, the efficiency of the cleaning processing can be improved, and the processing unit can be downsized.

As shown in FIG. 15, the wafer boat 70 has an inverted T-shaped support member fixed with bolts 73 to a mounting member 72 connected to an elevating mechanism 71 provided outside the processing tank 60. 74, and a pair of holding members 75 horizontally supported by the support members 74,
It is configured such that the inside of the processing tank 60 can be moved up and down by driving the elevating mechanism 71. In this case, a plurality of, for example, 5
Zero holding grooves 75a are provided. The support member 74 and the holding member 75 are made of a material having excellent corrosion resistance, heat resistance and strength resistance, for example, polyetheretherketone (P
EEK) or a quartz member.

In the above embodiment, the case where the wafer boat 70 is constituted by the inverted T-shaped support member 74 and the pair of holding members 75 horizontally supported by the support member 74 has been described. A wafer boat 70A having a structure as shown in FIGS. 17 to 22 can be used as the wafer boat.

The wafer boat 70A has a support base member 76a attached to the attachment member 72 of the elevating mechanism 71.
A pair of support rods 76b vertically suspended from the lower surface of the support base member 76a, a pair of side holding members 77 projecting horizontally from the lower end side of each support rod 76b, and a lower end of the support rod 76b It mainly comprises a lower holding member 78 protruding from the connecting member 76c connected therebetween and between the side holding members 77 and in parallel with the side holding members 77.

In this case, as shown in FIGS. 19 and 20, the side holding member 77 includes a rigid core material such as a stainless steel pipe 77a and a stainless steel pipe 77a.
And a covering member 77b made of a synthetic resin member, for example, a polyether ether ketone (PEEK) that is resistant to different types of cleaning liquids, such as a chemical solution and pure water. This covering member 77b is
The outside has a wafer holding portion 77c rising upward, and the lower portion has a liquid drainage projection 77d having a tapered surface narrowing downward. Then, the wafer holding unit 7
As shown in FIG. 22A, a holding groove 77e having a substantially V-shaped cross section is provided at an appropriate interval in 7c. On the other hand, the lower holding member 78 is formed of a synthetic resin member such as PEEK, for example.
As shown in the figure, the expanded tapered surface 78a and the narrow tapered surface 78
The inclination preventing grooves 78c each having a substantially Y-shaped cross section and provided at appropriate intervals.

The supporting rod 76b, like the side holding member 77, also has a core material such as a stainless steel pipe 76d,
It is formed of a PEEK covering member 76e. In this case, the stainless steel pipe 76d of the support rod 76b and the stainless steel pipe 77a of the side holding member 77 are connected and fixed by a stainless steel bolt 79, as shown in FIG. , 77b are fusion bonded by upset welding (also called butt welding). The supporting base member 76a is also formed of a stainless steel core 76f and a PEEK covering member 76g that covers the core 76f.
Stainless steel pipe 76d of support rod 76b penetrating through 6f
Core material 76 with stainless steel bolt 79 screwed to
f and the stainless steel pipe 76d are connected. The covering members 76e and 76g are joined by upset welding (butt welding) (see FIG. 20A).

As described above, by forming the wafer boat 70A with the stainless steel core members 77a, 76d, and 76f and the PEEK coating members 77b, 76e, and 76g, strength can be provided and the volume can be increased. Can be significantly reduced.

In the cleaning / drying processing unit 53, after the chemical oxide film formed on the wafer W is removed by hydrofluoric acid, the wafer W is dried by contact with dry steam, for example, isopropyl alcohol (IPA) gas. . In the chuck cleaning unit 54, pure water is supplied to the chuck 59 of the wafer transfer arm 56 for cleaning, and a drying process is performed by supplying a dry gas such as N2 gas or air.

Next, the transfer and processing steps of the wafer W in the cleaning processing unit will be described with reference to FIG.
In FIG. 23, white arrows indicate the flow of the carrier 1 and black arrows indicate the flow of the wafer W.

First, the carrier 1 storing a plurality of unprocessed wafers W by an operator or a transfer robot.
Is mounted on the mounting table 7 in front of the carrier entrance 5a of the loading section 5, the loading table 7 moves and the carrier 1 is loaded into the loading section 5. The carrier 1 carried into the carry-in section 5 waits toward the interface section 4 with the cover 1c opened by the cover opening / closing device 13.
Then, the wafer take-out arm 14 arranged in the interface unit 4 enters the carrier 1 to take out a plurality of wafers W in the carrier 1 and delivers the taken-out wafer W to the notch aligner 20. The empty carrier 1 from which the wafer W has been taken out is transported by the carrier lifter 8 to the carrier standby section 9 above the transport section. The carrier 1 conveyed to the carry-in section 5 is conveyed by the carrier lifter 8 to the carrier carry-in entrance 5a to prepare for the next carry-in.

The plurality of wafers W transferred to the notch aligner 20 are positioned by aligning the notches Wa of the respective wafers W by the notch aligner 20. After the positioned wafer W is again received by the wafer take-out arm 14, it is transferred to the first attitude conversion device 40.

The plurality of wafers W transferred to the first attitude changing device 40 are adjusted to a predetermined interval by the interval adjusting mechanism 30 provided in the first attitude changing device 40.
The horizontal adjustment is performed by the horizontal adjustment mechanism 41, and then the attitude is changed from the horizontal state to the vertical state by the attitude conversion mechanism 45.

When the wafer W is converted to the vertical state, the wafer transfer arm 56 enters the lower side of the wafer W whose posture has been changed and receives the wafer W. The received wafer W is first transferred to the first processing unit 51. Wafer boat 70 or 70A
And the wafer boats 70 and 70A are lowered into the processing tank 60. The wafer W accommodated in the processing tank 60 is cleaned with a cleaning liquid, for example, pure water after removing particles and organic contaminants with a chemical, for example, an APM solution (a mixed solution of ammonia, hydrogen peroxide and pure water). The wafer W thus primarily cleaned is again received by the wafer transfer arm 56 and transferred to the wafer boat 70 of the second processing unit 52, and is transferred to a chemical such as an HPM solution (hydrochloric acid, hydrogen peroxide solution and pure water). After the metal contamination is removed by the mixed solution, the substrate is washed with pure water. The wafer W thus cleaned is again received by the wafer transfer arm 56 and transferred to the cleaning / drying processing unit 53, where the cleaning / drying processing unit 53
After the chemical oxide film is removed by hydrofluoric acid in the inside, drying steam, for example, isopropyl alcohol (IPA) gas is contacted and dried.

After the dried wafer W is received by the wafer transfer arm 15 in the second chamber 4b, it is transferred to the second attitude converter 40A, where the attitude is changed from a vertical state to a horizontal state. The plurality of wafers W whose posture has been changed to the horizontal state are received by the wafer storage arm 16 and stored in the empty carrier 1 waiting at the unloading section 6. At this time, the empty carrier 1 is transported from the carrier standby unit 9 to the unloading unit 6 by the carrier lifter 8, and the lid opening / closing device 13
After the lid 1c is opened, it stands by at the unloading section 6, and after the wafer W is stored in the carrier 1, the lid 1c is opened.
Is closed and carried out of the carrying-out section 6.

In the processing section 3, since a chemical solution, a cleaning liquid, or the like adheres to the wafer transfer arm 56 that has transferred the wafer W after the cleaning processing to the cleaning / drying processing unit 53, the next unprocessed wafer W Before receiving the wafer W, the chuck 59 is moved to the chuck cleaning unit 54 to clean and dry the chuck 59 of the wafer transfer arm 56, and the next wafer W
For transport.

Although not shown, by providing a fan filter unit such as a HEPA filter or an ULPA filter on the transport unit 2, the processing unit 3, and the interface unit 4, it is possible to provide a device with higher cleanliness.

Second Embodiment In the first embodiment, the wafer boats 70 and 70A are
The case where each of the processing units 51 to 54 is provided for the processing tank 60 has been described. However, such a structure is not necessarily required, and one wafer boat 70 </ b> B is used for a plurality of, for example, two processing tanks 60. (See FIG. 24). That is, as shown in FIG.
The elevating mechanism 71 can be moved in the horizontal direction (X direction) by guide moving means 70c having, for example, mutually parallel guide rails 70a and ball screw shafts 70b disposed along the adjacent processing tanks 60, 60. And the wafer W may be carried in and out of the two processing tanks.

With the above-described configuration, for example, the wafer W after the chemical treatment is received by the wafer boat 70B in the adjacent processing tank 60 without being received by the wafer transfer arm 56, and pure water Can be performed. Therefore, when the wafer W immediately after the completion of the chemical processing is received by the wafer transfer arm 56, there is a problem that the chemical adheres to the wafer transfer arm 56.
With such a configuration, such a problem can be solved. In the second embodiment, other parts are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

Third Embodiment In the above embodiment, the case where the carrier 1 is of a closed type having the lid 1c has been described. However, the carrier does not necessarily have to be a closed type having a lid, and an open Similarly, the wafer W can be transferred and processed for the type carrier. When using an open type carrier, as shown in FIG.
Wafer carry-out port 5b of carry-in section 5, wafer carry-in port 6a of carry-out section 6, and communication port 10 of interface section 4 and processing section 3.
0, the shutters 101, 102 and 103 are provided so as to be openable and closable.
The shutter 102 of the wafer loading port 6a and the shutter 103 of the communication port 100 of the interface unit 4 and the processing unit 3 are closed. In addition, it is necessary to close the shutter 102 at the wafer entrance 6a of the unloading section 6. The shutter 102 at the wafer entrance 6a of the unloading section 6 needs to be closed except for the transfer of the wafer W to the unloading section 6. In FIG. 25, other portions are the same as those in the first embodiment, and thus the same portions are denoted by the same reference numerals and description thereof will be omitted.

Fourth Embodiment In the above embodiment, the wafer W is transferred between the interface unit 4 and the processing unit 3, and the wafer transfer arm 56 is moved in the horizontal (X, Y) direction in the processing unit 3. The wafer W is moved in the vertical (Z) direction and rotated (θ) to each of the processing units 5.
Although the case where the transfer is performed to the wafer transfer arm 1 to 53 has been described, the operation of the wafer transfer arm 56 can be performed only in the horizontal (X, Y) direction to simplify the mechanism of the wafer transfer arm and reduce the size of the apparatus. .

That is, as shown in FIG. 26, the wafer transfer arm 56A is formed so as to be movable in the horizontal (X, Y) direction, and the transfer path 55A of the wafer transfer arm 56A extends from the processing section 3 to the interface section 4. Extending to provide
The first attitude changing device 40 and the second attitude changing device 40A provided in the interface unit 4 are provided so as to face the transport path 55A. Then, between the first and second attitude converting devices 40 and 40A and the transport path 55A, a substrate transfer means, for example, a slider 110 is disposed, and the first and second attitude converting devices 40 (40A) are provided. The transfer of the wafer W to and from the wafer transfer arm 56A is performed. In this case, as shown in FIG. 27, the slider 110 includes a pair of support members 112 having a plurality of support grooves 111 capable of supporting a plurality of, for example, 50 wafers W, and the support members 112 are moved in the horizontal (Y) direction. Moving horizontal moving unit 1
13, a rotation unit 114 and a support member 112 that rotate (θ) the support member 112 and the horizontal movement unit 113 in the horizontal direction;
A vertical moving unit 115 that moves the horizontal moving unit 113 and the rotating unit 114 in the vertical (Z) direction is provided.

Further, the wafer transfer arm 56A is
As shown in FIG. 5, the movable body 5 that can move horizontally (moves in the X direction) along a guide rail 56a provided along the transport path 55A.
6b, a horizontal moving body 56c mounted on the upper part of the movable body 56b so as to be horizontally movable (movable in the Y direction), and a wafer protruding in the Y direction from a driving unit 56d mounted on the upper part of the horizontal moving body 56c. It mainly comprises a chuck 56e. In this case, the wafer chuck 56e is
A pair of side holding rods 56g projecting from a rotating arm 56f rotatable in a vertical direction by a motor (not shown) built in d and a lower holding rod 56h located between the side holding rods 56g. Have been.

With the above-described configuration, the slider 110 can receive the wafer W carried in from the carrying-in section 5 and the posture of which is vertically changed by the first posture changing device 40. It can be delivered to the wafer transfer arm 56A. The wafer transfer arm 56A, which has received the wafer W, moves in the horizontal (X, Y) direction to transfer the wafer W between the processing units 51 to 53 in the processing unit 3 and to transfer the processed wafer W to the second unit. To the slider 110 of the attitude conversion device 40A. Then, the wafer W is transferred to the second posture changing device 40A by the slider 110, and the posture of the wafer W is changed from the vertical state to the horizontal state by the second posture changing device 40A. 1 can be accommodated.

In the fourth embodiment, a slider 110 is provided in place of the wafer transfer arm 15, and the wafer transfer port 5b of the transfer section 5, the wafer take-out arm 15, and the first posture changing device are provided. The two sliders 110 disposed between the first and second posture changing devices 40 (40A) and the transport path 55A are disposed in parallel with each other. The whole of the wafer W can be moved linearly. Therefore, with this configuration, the size of the apparatus can be reduced, the wafer W can be smoothly transferred, and the throughput can be improved. In the fourth embodiment, the other parts are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

Fifth Embodiment FIG. 29 is a schematic plan view of a fifth embodiment of a cleaning system to which the substrate transfer processing apparatus of the present invention is applied, FIG. 30 is a schematic plan view of a carrier standby unit in the fifth embodiment, FIG.
It is a schematic perspective view which shows the stock form of the carrier in 5th Embodiment.

In the fifth embodiment, similarly to the fourth embodiment, a wafer transfer arm 56A movable in horizontal (X, Y) and vertical (Z) directions and a slider 110 are provided to transfer a wafer W in a straight line. This is a case where a carrier stock mode and a wafer transfer mode are changed in addition to a configuration in which the process is performed in a standard manner.

That is, as shown in FIG. 29, the first posture changing device 40 and the second posture changing device 4
0A are arranged in parallel with each other, and a wafer take-out arm 14 and a wafer accommodating arm 16 are arranged in parallel with each other on the back side of the first and second posture changing devices 40 and 40A. The carry-in carrier lifter 131 and the carry-out carrier lifter 1 serving as second container carrying means are located at positions opposed to the arm 14 and the wafer accommodating arm 16.
32 is provided to transfer the wafer W to and from the carrier 1 waiting in the carrier waiting unit 9.

In this case, as shown in FIG. 32, a carrier lifter 8A for transporting the carrier 1 between the carry-in section 5 and the carry-out section 6 and the carrier standby section 9 includes a ball screw shaft 8a, a pulse motor 8b with a brake, and the like. A ball screw mechanism 8c, a lifting table 8e that can be moved up and down along a column 8d by the ball screw mechanism 8c, and a turntable 8f that is mounted on the lifting table 8e so as to be horizontally rotatable. I have. The carrier lifter 8 </ b> A configured as described above can receive the carrier 1 placed on the placement table 7 of the loading unit 5 and transport the carrier 1 to the carrier standby unit 9. Further, the carrier 1 received from the carrier standby unit 9 can be transferred onto the mounting table 7 of the unloading unit 6. A carrier sensor 8g for detecting the presence or absence of the carrier 1 is mounted on the turntable 8f of the carrier lifter 8A. A cover 8 is provided outside the mounting table 7.
h, and a carrier detection sensor 8i is attached to the cover 8h.

As shown in FIGS. 30 and 33, the carrier transfer robot 10A disposed in the carrier standby section 9 includes a pair of slide rails 121 disposed in the X direction on both sides of the carrier standby section 9. , These slide rails 1
A movable member 122 erected on and movable in the X direction.
A vertical drive unit 123 movably mounted in the Y direction along the movable member 122; and a lift table movable in the vertical (Z) direction by a cylinder (not shown) attached to the vertical drive unit 123. And a carrier hold 126 comprising a pair of holding claws 125 attached to the lower surface of the elevating platform 124 so as to be movable toward and away from each other and to be horizontally rotatable. The movement in the X and Y directions is performed by ball screw mechanisms 127 and 128. The rotation of the ball screw mechanisms 127 and 128 and the wafer hold 126 is driven by electricity from a cable (not shown) wired in a bendable cable duct 129 connected to a power supply (not shown). Have been.

On the other hand, as shown in FIG. 34, the carry-in and carry-out carrier lifters 131 and 132 are vertically movable along a support 133 by a vertical cylinder (not shown), and are horizontally moved on the vertically movable table 134. (Movement in the Y direction) and a slide stage 135 that is mounted movably. The carrier positioning pin 136 and the carrier support pin 1 are provided on the upper surface of the slide stage 135.
37 are protruded. A lid opening / closing device 13A for opening and closing the lid 1c of the carrier 1 and a wafer counter 140 are provided between the carry-in and carry-out carrier lifters 131 and 132 and the carrier standby unit 9.

The lid opening / closing device 13A has the same structure as the lid opening / closing device 13 described in the first embodiment.
The description is omitted here (see FIGS. 7 and 8). Also,
As shown in FIG. 35, the wafer counter 140 includes a horizontal cylinder 142 vertically movable by a ball screw mechanism (not shown) built in the vertical drive unit 141 and a lower end of a hanging rod 143 horizontally movable by the horizontal cylinder 142. A bifurcated arm 144 mounted horizontally,
It comprises a fiber sensor 145 comprising a light emitting unit and a light receiving unit attached to the tip of the bifurcated arm 144. The wafer counter 140 thus configured is
The bifurcated arm 144 approaches the opening of the carrier 1 and scans the wafer W accommodated in the carrier 1 by scanning vertically along the opening of the carrier 1.
Is configured to be able to measure the number of sheets.

The loading carrier lifter 131 configured as described above receives the carrier 1 containing the wafers W stored in the carrier standby unit 9 when the wafers W are loaded, and faces the lower wafer unloading arm 14. Then, the empty carrier 1 from which the wafer W in the carrier 1 has been taken out by the wafer take-out arm 14 can be raised to the carrier waiting section 9 and transferred into the carrier waiting section 9. The carrier lifter 132 for unloading is
At the time of unloading the wafer W, the empty carrier 1 in the carrier standby section 9 is received and lowered to a position opposite to the wafer storage arm 16, and the wafer W is stored in the carrier 1 by the wafer storage arm 16. It can be raised to the standby unit 9 and transported into the carrier standby unit 9.

In the fifth embodiment, the other parts are the same as those in the first and fourth embodiments, and therefore, the same parts are denoted by the same reference numerals and description thereof will be omitted.

Next, the operation of the cleaning system of the fifth embodiment configured as described above will be described. First, the carrier 1 carried into the carry-in section 5 is carried into the carrier standby section 9 by the carrier lifter 8A and stocked. The carrier 1 stocked in the carrier standby unit 9 is transported by the carrier transport robot 10A to the loading and unloading carrier lifters 131 and 132. When the wafer is loaded, the carrier standby unit is loaded by the loading carrier lifter 131 as described above. 9 is lowered to a position facing the wafer take-out arm 14. The wafer W taken out from the lowered carrier 1 by the wafer take-out arm 14 is positioned by the notch aligner 20, and then the posture is changed from the horizontal state to the vertical state by the first posture conversion device 40. The wafer W whose posture has been changed to the vertical state is received by the slider 110 and transferred to the wafer transfer arm 56A. Then, the wafer transfer arm 5
6A, the wafer W transferred from the processing section 3 to the interface section 4 by the wafer transfer arm 56A after the processing is again received by the slider 110 and processed by the second attitude conversion device 4
Delivered to 0A. The wafer W whose posture has been changed from the vertical state to the horizontal state by the second posture conversion device 40A is
Carrier lifter 1 for unloading by wafer storage arm 16
The carrier 32 is stored in the empty carrier 1 lowered from the carrier standby unit 9 by the carrier 32. When the wafer W is stored in the carrier 1, the unloading carrier lifter 132 rises and transports the carrier 1 into the carrier standby unit 9. The carrier 1 transported to the carrier standby unit 9 is transported by the carrier transport robot 10A to the position of the carrier lifter 8 of the unloading unit 6, and is received by the carrier lifter 8,
It is transported to the unloading section 6.

Sixth Embodiment FIG. 36 is a schematic side view showing a sixth embodiment of a cleaning processing system to which the substrate transfer processing apparatus according to the present invention is applied, and FIG. 37 is a schematic sectional view taken along line AA of FIG. 38 is a schematic sectional view taken along line BB of FIG.

In the sixth embodiment, the transfer time of the wafer W in the processing section 3 can be reduced.
In this case, as shown in FIGS. 36 and 37, a second interface unit 4A is provided on the opposite side to the interface unit 4 with the processing unit 3 interposed therebetween. Are communicated with each other by a wafer transfer path 150 provided at the bottom. In the wafer transfer path 150,
Wafer lifter 15 provided in interface unit 4
A wafer transfer liner 152 (substrate transfer means) for transferring the wafer W received from the interface unit 1 to the interface unit 4A is provided.

In the interface section 4A, a wafer lifter 153 for lowering the wafer W received from the wafer transfer liner 152, and the wafer lifter 153
From the processing unit 3 and the wafer W
A first wafer transfer arm 56B (first substrate transfer means) for transferring the wafer is provided. On the other hand, the interface unit 4 and the transfer path 55 receive the wafer W processed by the processing unit 3 and transfer the received wafer W to the attitude conversion device 40A.
Are arranged. The ceiling of the processing unit 3 and the ceiling of the wafer transfer path 150 are, for example, HEPA filters,
A fan filter unit 160 such as an ULPA filter is provided. In FIG. 37, the illustration of the first attitude conversion device 40 and the notch aligner 20 is omitted.
It is provided similarly to the first embodiment. Also, the first
And the second attitude conversion device can be integrated by changing the contact portions of the wafer W before and after the processing. In the sixth embodiment, the other parts are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

Next, the operation of the cleaning system of the sixth embodiment configured as described above will be described. First, the wafer W taken out of the carrier 1 carried into the carry-in section 5 is positioned and then changed in posture from a horizontal state to a vertical state as described above. The wafer W whose posture has been changed is transferred to the wafer transfer path 15 by the wafer lifter 151.
0, is received by the wafer transfer liner 152, and transferred to the interface unit 4A. The carrier 1 transferred to the interface unit 4A is lowered into the interface unit 4A by the wafer lifter 153, received by the first wafer transfer arm 56B, and then transferred to each of the processing units 51 to 53. After the wafer W processed by the processing unit 3 is received by the second wafer transfer arm 56C, the posture conversion device 40A
Is changed from a vertical state to a horizontal state. Then, the wafer is stored in the carrier 1 of the unloading section 6 by a wafer storage arm (not shown).

As described above, the first wafer transfer arm 5
6B, the unprocessed wafer W is transferred to each of the processing units 51 to 53 in the processing unit 3, and the processed wafer W is
The wafer W is transferred by the wafer transfer arm 56C, so that the wafer W can be transferred continuously even when the number of processing units is increased as compared with the case where the wafer W is transferred by one wafer transfer arm. Therefore, the throughput can be improved.

Seventh Embodiment FIG. 39 is a schematic side view showing a seventh embodiment of a cleaning processing system to which the substrate transfer processing apparatus according to the present invention is applied, and FIG. 40 is a schematic cross-sectional view taken along the line CC of FIG. FIG. 41 is a schematic sectional view taken along line DD of FIG.

In the seventh embodiment, as in the sixth embodiment, the transfer time of the wafer W in the processing section 3 can be shortened. In this case, FIG. 39 and FIG.
As shown at 0, interface units 4B and 4C are provided with the processing unit 3 interposed therebetween. The interface units 4B and 4C communicate with each other via a carrier transfer path 170 provided above the processing unit 3. Carrier transfer path 170
A carrier transfer liner 172 (container transfer means) for transferring the carrier 1 received from the carrier lifter 171 provided in the carry-in section 5 to the interface section 4C is provided therein.

In the interface section 4C, the carrier 1 received from the carrier transfer liner 172 is provided.
Lifter 173 for lowering the wafer, a wafer take-out arm 14 for taking out a wafer from the carrier 1 lowered by the carrier lifter 173, a notch aligner 20 for positioning the wafer W, and changing the posture of the wafer W from a horizontal state to a vertical state. First attitude conversion device 40 for conversion
And a first wafer transfer arm 56 that receives the wafer W from the first attitude conversion device 40 and transfers the received wafer W to each of the processing units 51 to 53 of the processing unit 3.
B is provided. Also, the interface unit 4B
Is provided adjacent to the carry-in section 5 and the carry-out section 6. In the interface section 4B, the wafer storage arm 16 for storing the wafer W in the carrier 1 of the carry-out section 6 and the posture of the wafer W are set in a vertical state. Second attitude changing device 40A for changing the attitude from horizontal to horizontal, and wafer W processed by processing unit 3
And a second wafer transfer arm 56C for transferring the received wafer W to the second attitude converting device 40A.
Are arranged.

A carrier standby section 9A is provided at one side of the carrier transfer path 170 so that the carrier 1 for storing the wafer W or the empty carrier 1 can be stocked in the carrier standby section 9A. Has become. The carrier standby section 9A is connected to the carrier transfer path 170
May be provided on the interface unit 4B in the same manner as in the first embodiment, without being provided at a position adjacent to. Further, a fan filter unit 160 such as a HEPA filter or an ULPA filter is disposed on the ceiling of the processing unit 3 and the ceiling of the carrier transfer path 170. In addition,
In the seventh embodiment, the other parts are the same as those in the first embodiment.
The description is omitted.

Next, the operation of the seventh embodiment will be described. First, the carrier 1 loaded into the loading section 1 is transported to the carrier transport path 170 by the carrier lifter 171, and the carrier 1 is transported to the interface section 4C by the carrier transport liner 172. The carrier 1 transferred onto the interface unit 4C is a carrier lifter 17
3, the wafer W taken out of the carrier 1 by the wafer take-out arm 14 from the carrier 1 is positioned by the notch aligner 20, and then transferred to the first posture changing device 40. The wafer W converted from the horizontal state to the vertical state by the first attitude conversion device 40 is received by the first wafer transfer arm 56B, and each of the processing units 51 to 51 in the processing unit 3 is processed.
It is transported to 53. After the wafer W processed by the processing unit 3 is received by the second wafer transfer arm 56C, the posture is changed from the vertical state to the horizontal state by the second posture conversion device 40A. Then, the wafer is stored in the carrier 1 of the unloading section 6 by the wafer storage arm 16. On the other hand, the empty carrier 1 from which the wafer W has been taken out is transported in the reverse of the above, and is stocked in the carrier standby unit 9A as needed.

As described above, the carrier 1 carried into the carry-in section 5 is transferred to the interface section 4C, and the wafer W
Is changed to the vertical state, the unprocessed wafer W is transferred to each of the processing units 51 to 53 in the processing unit 3 by the first wafer transfer arm 56B, and the processed wafer W is transferred to the second wafer. By transferring the wafer W by the arm 56C, the transfer of the wafer W can be continuously performed even when the number of processing units is large, so that the throughput can be improved.

Other Embodiments (1) In the first embodiment, the wafer transfer arm 56 for transferring the wafer W to each processing unit of the processing unit 3 and the wafer transfer arm 15 for receiving the processed wafer W are provided. However, it is not always necessary to provide two types of arms, and it is also possible to use the wafer transfer arm 56 and the wafer transfer arm 15 as one transfer arm.

(2) In the above embodiment, the case where the substrate transfer processing apparatus according to the present invention is applied to a semiconductor wafer cleaning processing system has been described. Of course, the present invention can also be applied to glass substrates for LCDs other than semiconductor wafers.

[0104]

As described above, according to the substrate transfer processing apparatus of the present invention, since it is configured as described above, the following excellent effects can be obtained.

1 ) According to the first and third aspects of the present invention,
Multiple substrates stored horizontally in a container are placed vertically
Can be converted and processed.
Can be converted to a horizontal state and stored in a container.
Large and heavy substrates can be delivered vertically
Compared to those transported by
The board can be transported and processed while preventing misalignment of the board.
You. Therefore, improvement of product yield and throughput
Can be achieved. Further, since only horizontal and vertical linear mechanisms can be provided without providing a rotating mechanism for moving the substrate transfer means, the apparatus can be reduced in size and simplified, and the throughput can be improved. .

2 ) According to the second aspect of the present invention,
In addition to 1) , a plurality of substrates can be processed in an appropriate state.

3 ) According to the invention as set forth in claims 4 to 8 , since a plurality of substrates can be transported continuously even when there are many processing steps and processing lines, in addition to the above 1), Throughput can be improved. Also, substrate transfer
Horizontal and vertical movements without a rotating mechanism
Since only a straight linear mechanism can be provided,
Smaller size and simplification, and higher throughput
Can be achieved. Further, the transfer of the substrate in the processing section is shared by the first and second substrate transfer means, so that the throughput can be further improved.

4) According to the ninth to eleventh aspects of the present invention, it is possible to smoothly transport the containers in the carry-in section and / or the carry-out section. Further, according to the invention of claim 14 or 16, it is possible to carry out the empty container from the carry-in portion and to store the processed substrate in the empty container smoothly. Therefore, the throughput can be further improved in addition to the above 1).

[0109] 5) According to the invention of claim 13, wherein detecting a notch provided in the plurality of substrates taken out from the container, so comprises a position detecting means for positioning,
In addition to the above 1) and 3) , a plurality of substrates can be processed in an appropriate state.

[0110] 6) According to the invention of claim 14 wherein, the posture converting means, so comprises a gap adjustment mechanism for adjusting the spacing between the plurality of substrates, processing a plurality of substrates in a uniform state In addition, it is possible to process as many substrates as possible while maintaining the interval between the substrates to a minimum necessary width.

[0111] 7) According to the invention of claim 15, wherein the processing unit, and a processing bath for storing a plurality of substrates, comprising a moving mechanism for loading and unloading a plurality of substrates into the processing tank Therefore, the processing unit can be reduced in size as compared with a structure in which the transfer means enters the processing tank, and the entire apparatus can be further reduced in size. Moreover, by loading and unloading can form the substrate moving mechanism for a plurality of processing tanks, the processing solution such as a chemical solution can be prevented from adhering to the substrate transfer means (claim 16).

8 ) According to the seventeenth aspect of the present invention, the processing section has a processing tank for accommodating a plurality of substrates, a chemical liquid supply means for supplying a chemical liquid in the processing tank, and a cleaning liquid in the processing tank. Since the cleaning liquid supply means is provided, the chemical liquid processing and the cleaning processing of the substrate can be performed continuously, and the adhesion of particles during transport and the reduction in size of the apparatus can be achieved.

9 ) According to the eighteenth aspect of the present invention, since the processing unit is provided with the cleaning unit for cleaning at least the substrate holding unit of the substrate transfer unit, it is possible to clean the substrate holding unit of the substrate transfer unit. This can prevent contamination of the substrate before and after the process due to the atmosphere of the processing section.

[0114] 10) According to the invention of claim 19, wherein the processing unit, so comprises a cleaning and drying unit of the substrate, it is possible to prevent the occurrence of adhesion and water marks such as particles to the substrate.

11 ) According to the twentieth aspect of the invention, the carry-in section is provided with the container carry-in port and the substrate carry-out port, and the carry-out section is provided with:
Since the container outlet and the substrate inlet are provided, the loading and unloading of the container and the substrate can be performed smoothly, and the throughput can be improved.

[0116] 12) According to the invention of claim 21, wherein, with features a unloading unit and the loading unit, since disposing the processing unit to face with these loading unit and the unloading unit, the container and the loading of the substrate, out The work can be performed from one side of the apparatus, and the clean room can be effectively used, and the size of the entire apparatus can be further reduced.

13 ) According to the invention of claim 22 , a plurality of unprocessed substrates and a plurality of processed substrates can be transported using different transport systems, and the plurality of substrates can be transferred to the processed substrates. Can be prevented from re-adhering to the particles and the like, so that the product yield can be further improved in addition to the above 1).

14) According to the twenty-third aspect of the present invention,
Multiple substrates stored horizontally in a container
Can be converted and processed.
The board can be converted to a horizontal state and stored in a container.
You. Furthermore, it is necessary to securely hold and transport multiple substrates.
Can be .

15) According to the invention described in claim 24,
In addition to the above description 14), furthermore,
Only horizontal and vertical linear mechanisms without a rolling mechanism
The device can be made smaller and simpler.
In addition, the throughput can be improved .

16) According to the invention described in claim 25,
In addition to the description 14), a plurality of substrates are
Can be processed .

17) According to the invention as set forth in claim 26,
A transport section of a container for storing several substrates to be processed,
Interface between the processing unit that processes
In the base part, a plurality of pieces stored horizontally in the container
Convert the substrates to a vertical state and make sure that
For processing, and a plurality of substrates after processing.
The board can be converted to a horizontal state and stored in a container.
You. Furthermore, it is necessary to securely hold and transport multiple substrates.
Can be .

18) According to the twenty-seventh aspect of the present invention,
A transport section of a container for storing several substrates to be processed,
Interface between the processing unit that processes
In the base part, a plurality of pieces stored horizontally in the container
A single board can be converted to a vertical state,
Several substrates must be kept in a uniform state and the space between the substrates is required
Process as many substrates as possible while maintaining a minimum width
Can be In addition, the processed multiple substrates are placed horizontally.
It can be converted into a state and stored in a container. In addition,
It is possible to reliably hold and transport several substrates .

19) According to the twenty-eighth aspect of the present invention,
A transport section of a container for storing several substrates to be processed,
Interface between the processing unit that processes
In the base part, a plurality of pieces stored horizontally in the container
A single board can be converted to a vertical state,
Keep several substrates in proper and uniform condition, and
Keep the gap to the minimum necessary width to process as many substrates as possible.
Can be served. Also, multiple substrates after processing
Can be converted to a horizontal state and stored in the container .
Furthermore, it is possible to securely hold and transport a plurality of substrates.
I can .

20) According to the invention described in claim 29, the processing
B on the opposite side of the carry-in and carry-out
Transfers multiple substrates transferred to the interface
Can be transported to the processing section by
Even if there are many processes and processing lines, transfer multiple substrates
It can be continued. Also, multiple substrates can be
It can be held and transported .

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a first embodiment of a cleaning processing system to which a substrate transfer processing apparatus according to the present invention is applied.

FIG. 2 is a schematic side view of the cleaning processing system.

FIG. 3 is a schematic perspective view of the cleaning system.

FIG. 4 is a perspective view showing a container transport unit and a container standby unit according to the present invention.

FIG. 5 is a perspective view showing an example of a container according to the present invention.

FIG. 6 is a cross-sectional view of the container.

FIG. 7 is a perspective view showing a substrate discharge port according to the present invention.

FIG. 8 is a perspective view showing a state in which a lid of a container is removed at a substrate discharge port.

FIG. 9 is a schematic sectional view showing a positioning means according to the present invention.

FIG. 10 is a perspective view showing a main part of the positioning means.

FIG. 11 is a side view showing an interval adjusting unit and a posture changing unit according to the present invention.

FIG. 12 is a side view showing the gap adjusting means.

FIG. 13 is a perspective view showing a main part of the gap adjusting means.

FIG. 14 is a perspective view showing a main part of a substrate carrying means according to the present invention.

FIG. 15 is a perspective view of a main part showing a substrate moving means according to the present invention.

FIG. 16 is a sectional view showing an example of a processing unit according to the present invention.

FIG. 17 is a plan view showing another embodiment of the wafer boat according to the present invention.

FIG. 18 is a side view of the wafer boat.

FIG. 19 is a sectional view of the wafer boat.

FIG. 20 is a cross-sectional view showing a connecting portion between the supporting base member and the supporting rod of the wafer boat and a cross-sectional view showing the connecting portion between the supporting rod and the holding member.

FIG. 21 is a vertical sectional view of a connecting portion between the support rod and the holding member.

FIG. 22A is an enlarged sectional view showing a holding groove of a side holding member of the wafer boat, and FIG. 22B is an enlarged sectional view showing an inclination preventing groove of a lower holding member.

FIG. 23 is a schematic perspective view showing a substrate transfer mode according to the present invention.

FIG. 24 is a schematic perspective view showing a second embodiment of the present invention.

FIG. 25 is a schematic plan view showing a third embodiment of the present invention.

FIG. 26 is a schematic plan view showing a fourth embodiment of the present invention.

FIG. 27 is a perspective view showing a substrate transfer means in the fourth embodiment.

FIG. 28 is a perspective view illustrating a substrate transfer unit according to a fourth embodiment.

FIG. 29 is a schematic plan view showing a fifth embodiment of the present invention.

FIG. 30 is a schematic plan view showing a container standby unit according to the fifth embodiment.

FIG. 31 is a schematic perspective view showing a stock form of a container according to a fifth embodiment.

FIG. 32 is a schematic perspective view showing a container carrying means in the fifth embodiment.

FIG. 33 is a schematic perspective view showing a container transport robot according to a fifth embodiment.

FIG. 34 is a schematic perspective view showing a carry-in and carry-out container carrying means in the fifth embodiment.

FIG. 35 is a schematic perspective view showing a wafer counter according to a fifth embodiment.

FIG. 36 is a schematic side view showing a sixth embodiment of the present invention.

FIG. 37 is a schematic sectional view taken along the line AA of FIG. 36.

FIG. 38 is a schematic sectional view taken along the line BB of FIG. 36.

FIG. 39 is a schematic side view showing a seventh embodiment of the present invention.

40 is a schematic sectional view taken along the line CC of FIG. 39.

FIG. 41 is a schematic sectional view taken along the line DD in FIG. 39;

[Explanation of symbols]

W Semiconductor wafer (substrate) Wa notch 1 Carrier (container) 3 Processing unit 4, 4A, 4B, 4C Interface unit 5 Loading unit 5a Carrier loading port 5b Wafer loading port 6 Loading section 6a Wafer loading port 6b Carrier loading port 8 Carrier lifter (Container transfer means) 8A First container transfer means 9, 9A Carrier standby unit 10, 10A Carrier transfer robot (container transfer means) 14 Wafer take-out arm (substrate take-out means) 15 Wafer transfer arm (substrate transfer means) 16 Wafer storage Arm (substrate storage means) 20 Notch aligner (position detection means) 30 Interval adjustment mechanism (interval adjustment means) 40, 40A Posture conversion device (posture conversion means) 51 First processing unit 52 Second processing unit 53 Cleaning / drying Processing unit (cleaning / drying means) 54 Chuck cleaning unit Knit (cleaning means) 55, 55A Transfer path 56, 56A Wafer transfer arm (substrate transfer means) 56B First wafer transfer arm (first substrate transfer means) 56C Second wafer transfer arm (second substrate transfer means) 60 processing tank 70, 70A, 70B wafer boat (moving means) 80 jet nozzle (chemical solution / cleaning liquid supply means) 131, 132 carrier lifter (second container conveying means) 150 wafer transfer path 151, 153 wafer lifter 152 for wafer transfer Liner (substrate transfer means) 170 Carrier transfer path 171,173 Carrier lifter 172 Carrier transfer liner (container transfer means)

Continued on the front page (72) Inventor Osamu Kuroda 1375 41 Nishishinmachi, Tosu City, Saga Prefecture Tokyo Electron Kyushu Co., Ltd. (56) References JP-A-7-86373 (JP, A) JP-A-6-216102 (JP, A) JP-A-7-273165 (JP, A) JP-A-63-140523 (JP) , A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/304 648

Claims (29)

(57) [Claims] A plurality of substrates to be processed are stored in a horizontal state.
Loading unit for the container to be stored, unloading unit for the container, and substrate unloading means for extracting a plurality of substrates in the container
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
Conversion means, a processing unit for appropriately processing the plurality of substrates, and the plurality of substrates between the attitude conversion means and the processing unit.
Deliver and transfer substrates within the processing unit
Comprising a feed means, and the substrate transfer means, opposed to the attitude changing means position
So that it is movable between the substrate transfer means and the attitude changing means.
A board delivery means for delivering a board is provided, and the board delivery means includes a support member for supporting a plurality of substrates, and a horizontal moving unit for moving the support member in a horizontal direction.
And a vertical moving unit that moves in a vertical direction. 2. A plurality of substrates to be processed are stored in a horizontal state.
Loading unit for the container to be stored, unloading unit for the container, and substrate unloading means for extracting a plurality of substrates in the container
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
A conversion unit, a processing unit that appropriately processes the plurality of substrates, and a notch provided in the substrate is detected and positioned.
Position detection means, and the positioning is performed between the attitude conversion means and the processing unit.
While transferring multiple substrates, the substrates are processed within the processing unit.
A substrate transfer means for transferring, and a position at which the substrate transfer means is opposed to the attitude conversion means.
So that it is movable between the substrate transfer means and the attitude changing means.
A board delivery means for delivering a board is provided, and the board delivery means includes a support member for supporting a plurality of substrates, and a horizontal moving unit for moving the support member in a horizontal direction.
And a vertical moving unit that moves in a vertical direction. 3. The substrate transfer processing apparatus according to claim 1, wherein the substrate transfer unit further includes a rotating unit configured to rotate a support member and a horizontal moving unit in a horizontal direction. apparatus. 4. A plurality of substrates to be processed are stored in a horizontal state.
Loading unit for the container to be stored, unloading unit for the container, and substrate unloading means for extracting a plurality of substrates in the container
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
Conversion means, a processing unit for appropriately processing the plurality of substrates , and the plurality of substrates subjected to posture conversion by the posture conversion means
On the opposite side of the loading and unloading sections with the processing section in between
Board transferer to transfer to the interface part arranged in
Between the interface unit and the processing unit.
Delivering the substrate and transporting the substrate within the processing unit
A substrate transfer means, wherein the substrate transfer means is movably formed at a position facing the posture changing means, and a substrate is transferred between the substrate transfer means and the posture changing means between the two. A delivery unit is provided, and the substrate delivery unit includes a support unit that supports a plurality of substrates.
Material and a horizontal moving part for moving the support member in the horizontal direction,
And a vertical moving unit that moves in a vertical direction . 5. The substrate transfer processing device according to claim 4, wherein the plurality of substrates are transferred between the processing unit and the attitude changing unit, and the substrate is transferred within the processing unit. A substrate transfer processing device comprising: 6. A plurality of substrates to be processed are stored in a horizontal state.
A carry-in part for the container to be packed, a carry-out part for the container, a processing part for appropriately processing the plurality of substrates, and a processing part interposed between the carry-in part and the carry-out part.
The interface section provided and the container carried into the carry-in section are connected to the interface section.
Container transferring means for transferring to the container portion, and a plurality of containers in the container in the interface portion.
Board taking-out means for taking out a number of substrates, and taking out the board
The plurality of substrates removed from the container by
First attitude converting means for converting an attitude from a flat state to a vertical state
Between the first attitude converting means and the processing unit,
Delivering the substrate and transporting the substrate within the processing unit
A substrate transporting means, and the plurality of substrates disposed on the loading section and the unloading section.
Second posture transformation for transforming the posture from the vertical state to the horizontal state
Means, and substrate storage means for storing a substrate in the container.
And, the substrate carrying means movably formed at a position facing the attitude changing means, between said substrate conveying means and the attitude changing means, disposed substrate transfer means for transferring the substrate therebetween, The substrate transfer means includes a support unit for supporting a plurality of substrates.
Material and a horizontal moving part for moving the support member in the horizontal direction,
And a vertical moving unit that moves in a vertical direction . 7. The substrate transport processing apparatus according to claim 6, wherein the plurality of substrates are transferred between the processing unit and the second posture changing unit, and the substrate is transported in the processing unit. A substrate transfer processing device provided with a substrate transfer means. 8. The substrate transfer processing apparatus according to claim 6 , wherein a container standby section is provided at a position along the transfer path of the container transfer means. 9. The substrate transfer processing apparatus according to claim 1, 2 or 4 , wherein a container standby unit for storing an empty container, the inside of the loading unit and the unloading unit, and the loading unit, the unloading unit, and the container standby unit. And a container transfer means for transferring a container between the substrate transfer device and the substrate transfer processing device. 10. The substrate transfer processing apparatus according to claim 1 , wherein the carry-in portion and / or the carry-out portion, a substrate unloading position at which a plurality of substrates are unloaded from the container by the substrate unloading means, and A substrate transport processing apparatus, further comprising: a container transport unit that transports the container between a substrate storage position where a plurality of substrates are stored in the container by the substrate storage unit. 11. The substrate transfer processing apparatus according to claim 1 , 2 or 4 , wherein the container is transported between the container standby unit for storing the container, and the loading / unloading unit and the container standby unit. A substrate transport processing apparatus, comprising: a first container transport unit; and a second container transport unit that transports a container between the container standby unit and the substrate unloading unit and the substrate storage unit. 12. The substrate transfer processing apparatus according to claim 9, wherein a container moving means for moving a container is provided in the container standby unit. 13. The substrate transfer processing apparatus according to claim 4 , further comprising a position detecting means for detecting notches provided on the plurality of substrates taken out of the container and performing positioning. A substrate transfer processing apparatus characterized by the above-mentioned. 14. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, characterized in that the said attitude changing means, formed by including a gap adjusting means for adjusting the spacing between the plurality of substrates Substrate transfer processing device. 15. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, carried into the processing unit, and a processing bath for storing a plurality of substrates, a plurality of substrates into the processing tank And a moving means for unloading the substrate. 16. The substrate transfer processing apparatus according to claim 15 , wherein said moving means is formed so that a plurality of substrates can be loaded into and unloaded from a plurality of processing tanks. apparatus. 17. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, to the processing unit, and a processing bath for storing a plurality of substrates, chemical supply for supplying a chemical liquid to the treatment tank Means, comprising a cleaning liquid supply means for supplying a cleaning liquid into the processing tank,
A substrate transfer processing apparatus characterized by the above-mentioned. 18. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, characterized in that the said processing unit, comprising comprises a cleaning means for cleaning at least the substrate holder of the substrate transfer means Substrate transfer processing device. 19. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, to the processing unit, the substrate transport apparatus characterized by comprising comprises a cleaning and drying unit of the substrate. 20. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, in the loading unit, the container carrying-in port and the substrate carry-out port is provided, to the unloading unit, the container unloading opening and the substrate entrance A substrate transport processing apparatus, comprising: 21. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, together with the features a unloading unit and the loading unit, arranged the processor to face with these loading unit and the unloading unit A substrate transport processing apparatus comprising: 22. The method of claim 1, in the substrate transfer apparatus according to 4 or 6, a first substrate carrying means for transferring a plurality of substrates between the processing unit from the attitude changing means, the A second method for transferring the plurality of substrates from the processing unit to the attitude conversion unit;
And a substrate transfer means. 23. A plurality of substrates to be processed are set in a horizontal state.
A loading section for a container to be stored, a loading section for the vessel, and a substrate removing means for removing a plurality of substrates in the vessel.
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
Conversion means, a processing unit for appropriately processing the plurality of substrates, and the plurality of substrates between the attitude conversion means and the processing unit.
Deliver and transfer substrates within the processing unit
And a pair of side holding bars projecting from a vertically rotatable rotating arm, and a lower holding bar located between the side holding bars. A substrate transfer processing apparatus comprising a substrate chuck configured as described above. 24. A plurality of substrates to be processed are set in a horizontal state.
A loading section for a container to be stored, a loading section for the vessel, and a substrate removing means for removing a plurality of substrates in the vessel.
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
Conversion means, a processing unit for appropriately processing the plurality of substrates, and the plurality of substrates between the attitude conversion means and the processing unit.
Deliver and transfer substrates within the processing unit
Comprising a feed means, and the substrate transfer means, opposed to the attitude changing means position
So that it is movable between the substrate transfer means and the attitude changing means.
Disposed the substrate receiving passing means passing plate, on the substrate transfer means, and a pair of side supporting bars are projected on a rotatable rotating arm vertically positioned between the side supporting bars A substrate transport processing apparatus provided with a substrate chuck constituted by a lower holding rod. 25. A plurality of substrates to be processed are set in a horizontal state.
A loading section for a container to be stored, a loading section for the vessel, and a substrate removing means for removing a plurality of substrates in the vessel.
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
A conversion unit, a processing unit that appropriately processes the plurality of substrates, and a notch provided in the substrate is detected and positioned.
Position detection means, and the positioning is performed between the attitude conversion means and the processing unit.
While transferring multiple substrates, the substrates are processed within the processing unit.
A substrate transfer means for transferring, and a position at which the substrate transfer means is opposed to the attitude conversion means.
So that it is movable between the substrate transfer means and the attitude changing means.
A board transfer means for transferring a board is provided, and a pair of side holding rods projecting from a vertically rotatable rotating arm is provided on the substrate transfer means, and a lower portion positioned between the side holding rods. A substrate transfer processing apparatus provided with a substrate chuck constituted by a holding rod. 26. A plurality of substrates to be processed are set in a horizontal state.
A loading section for the container to be stored and a loading section for the container are provided.
Transport section, a processing section for appropriately processing the plurality of substrates, and an interface provided between the transport section and the processing section.
Between the interface unit and the processing unit.
Delivering the substrate and transporting the substrate within the processing unit
Substrate transport means, wherein the interface unit includes a plurality of substrates in the container.
Means for taking out the substrate, and a plurality of sheets in the container.
A substrate storing means for storing the substrates, and
Attitude converting means for converting between a flat state and a vertical state;
Position detecting means for detecting a notch provided on the two substrates ;
A substrate chuck comprising: a pair of side holding rods projecting from a vertically rotatable rotary arm; and a lower holding rod positioned between the side holding rods. A substrate transfer processing device comprising: 27. A plurality of substrates to be processed are set in a horizontal state.
A loading section for the container to be stored and a loading section for the container are provided.
Transport section, a processing section for appropriately processing the plurality of substrates, and an interface provided between the transport section and the processing section.
Between the interface unit and the processing unit.
Delivering the substrate and transporting the substrate within the processing unit
Substrate transport means, wherein the interface unit includes a plurality of substrates in the container.
Means for taking out substrates, and a plurality of substrates
Between the substrate storage means for storing the plate and the plurality of substrates
An interval adjusting means for adjusting the interval, and
A posture conversion means for converting between a state and a vertical state, and a pair of side holding rods protruding from a vertically rotatable rotating arm, and a position between the side holding rods. A substrate transport processing apparatus provided with a substrate chuck constituted by a lower holding rod to be formed. 28. A plurality of substrates to be processed are set in a horizontal state.
A loading section for the container to be stored and a loading section for the container are provided.
Transport section, a processing section for appropriately processing the plurality of substrates, and an interface provided between the transport section and the processing section.
Between the interface unit and the processing unit.
Delivering the substrate and transporting the substrate within the processing unit
Substrate transport means, wherein the interface unit includes a plurality of substrates in the container.
Means for taking out substrates, and a plurality of substrates
Between the substrate storage means for storing the plate and the plurality of substrates
An interval adjusting means for adjusting the interval, and
Posture converting means for converting between a state and a vertical state;
Position detecting means for detecting a notch provided on the substrate of
A substrate chuck comprising a pair of side holding rods projecting from a vertically rotatable rotary arm and a lower holding rod positioned between the side holding rods. A substrate transfer processing device provided. 29. A plurality of substrates to be processed are set in a horizontal state.
A loading section for a container to be stored, a loading section for the vessel, and a substrate removing means for removing a plurality of substrates in the vessel.
And a substrate storage means for storing a plurality of substrates in the container, and a posture for converting the plurality of substrates into a horizontal state and a vertical state.
Conversion means, a processing unit for appropriately processing the plurality of substrates , and the plurality of substrates subjected to posture conversion by the posture conversion means
On the opposite side of the loading and unloading sections with the processing section in between
Board transferer to transfer to the interface part arranged in
Between the interface unit and the processing unit.
Delivering the substrate and transporting the substrate within the processing unit
And a substrate transfer means, comprising: a pair of side holding rods projecting from a vertically rotatable rotating arm, and a lower holding rod positioned between the side holding rods. A substrate transfer processing apparatus comprising a substrate chuck constituted by: