JP5238331B2 - Substrate processing apparatus and substrate processing system - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a substrate processing system for processing a substrate.

  In order to perform various processes on various substrates such as a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate, It is used.

  In such a substrate processing apparatus, generally, a plurality of different processes are continuously performed on a single substrate. The substrate processing apparatus described in Patent Document 1 includes an indexer block, an antireflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure apparatus that is an external apparatus separate from the substrate processing apparatus is disposed adjacent to the interface block.

  In the substrate processing apparatus described above, the substrate carried in from the indexer block is configured such that after the formation of the antireflection film and the coating process of the resist film are performed in the antireflection film processing block and the resist film processing block, the interface block is To the exposure apparatus. After the exposure process is performed on the resist film on the substrate in the exposure apparatus, the substrate is transported to the development processing block via the interface block. After a resist pattern is formed by performing development processing on the resist film on the substrate in the development processing block, the substrate is transported to the indexer block.

  In recent years, miniaturization of resist patterns has become an important issue as the density and integration of devices increase. Accordingly, there is a liquid immersion method as a projection exposure method that enables further miniaturization of the exposure pattern (see, for example, Patent Document 2). In the projection exposure apparatus of Patent Document 2, a liquid is filled between the projection optical system and the substrate, and the exposure light on the substrate surface can be shortened. Thereby, the exposure pattern can be further miniaturized.

  However, in the case where the exposure process is performed using the immersion method, when the liquid supplied onto the substrate directly contacts the resist film, the resist film components are dissolved in the liquid and a processing failure occurs. Therefore, it has been proposed to form a resist cover film so as to cover the resist film.

For example, the substrate processing apparatus described in Patent Document 3 includes an indexer block, an antireflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. . After the resist film is formed on the substrate in the resist film processing block, the resist cover film is formed on the resist film in the resist cover film processing block. After the exposure processing, the resist cover film on the substrate is removed in a resist cover film removal block.
JP 2003-324139 A International Publication No. 99/49504 Pamphlet JP 2006-140283 A

  As described above, the number of substrate processing steps increases with the demand for finer exposure patterns. This increases the size of the substrate processing apparatus.

  Further, in the substrate processing apparatus as described above, when a failure occurs in a part of the substrate processing apparatus, it is necessary to stop the entire operation and perform a recovery operation. As the number of substrate processing steps increases, the frequency of occurrence of failures increases, and it is necessary to interrupt all processes each time. Thereby, the processing efficiency of the substrate deteriorates.

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing system capable of suppressing an increase in size and improving a substrate processing efficiency.

(1) A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus disposed so as to be adjacent to an exposure apparatus, which performs processing on the substrate and delivers the substrate to the exposure apparatus, and processing A loading / unloading unit for loading and unloading the substrate to / from the transfer unit, and the processing transfer unit includes a heat treatment unit for performing a heat treatment on the substrate after the exposure process, and a pre-exposure process carried by the loading / unloading unit. A first substrate transport mechanism for transporting the substrate to the exposure apparatus; a second substrate transport mechanism for transporting the substrate after the exposure process from the exposure apparatus to the heat treatment unit; and a substrate after the resist film is formed and before the exposure process. look including a cleaning unit for performing cleaning process, the cleaning unit includes a substrate rotation holding device for rotating while substantially horizontally holding the substrate, for cleaning the bottom surface of the substrate held by the substrate rotating holding device The substrate rotation holding device includes a cleaning brush, a rotation member provided to be rotatable around a rotation axis substantially along the vertical direction, a rotation drive mechanism provided on the upper side of the rotation member, and configured to rotate the rotation member, A holding member that is provided on the lower side of the rotating member and holds the substrate by contacting an outer peripheral end of the substrate disposed on the lower side of the rotating member .

In this substrate processing apparatus, the substrate is carried into the processing conveyance unit by the carry-in / out unit. The substrate is transported to the exposure apparatus by the first substrate transport mechanism after being cleaned by the cleaning processing unit . The exposure process is performed on the substrate in the exposure apparatus, and the substrate after the exposure process is transferred from the exposure apparatus to the heat treatment unit by the second substrate transfer mechanism. A heat treatment is performed on the substrate after the exposure processing by the heat treatment unit, and the substrate after the heat treatment is unloaded from the processing conveyance unit by the loading / unloading unit.

  In this case, the number of substrate processing steps in the substrate processing apparatus can be reduced by performing various processes on the substrate before and after the exposure processing outside the substrate processing apparatus. Thereby, the enlargement of the substrate processing apparatus can be suppressed, and the occurrence of failure in the substrate processing apparatus can be suppressed.

  When various processes are performed outside the substrate processing apparatus, even if a failure occurs in the substrate processing apparatus, various processes can be continuously performed outside the substrate processing apparatus. Thereby, it is possible to suppress the deterioration of the substrate processing efficiency due to the occurrence of the failure of the substrate processing apparatus.

  In the processing transport unit, the substrate before the exposure processing is transported by the first substrate transport mechanism, and the substrate after the exposure processing is transported by the second substrate transport mechanism. That is, the substrate transport path before the exposure process and the substrate transport path after the exposure process are independently secured.

  Thereby, the substrate can be efficiently transported as compared with the case where the transport route of the substrate before the exposure processing intersects with the transport route of the substrate after the exposure processing. As a result, the throughput can be improved. In addition, since the substrate before the exposure process and the substrate after the exposure process do not contact the same part, mutual contamination between the substrate before the exposure process and the substrate after the exposure process can be prevented.

Further, by performing a cleaning process on the substrate after the formation of the resist film and before the exposure process, the exposure process can be performed satisfactorily, and the occurrence of processing defects on the substrate can be prevented.
Further, the back surface of the substrate is cleaned by the cleaning processing unit. Thereby, contaminants adhering to the back surface of the substrate can be removed, and defocusing due to unevenness on the back surface of the substrate during exposure processing can be prevented. Therefore, it is possible to prevent occurrence of processing defects on the substrate.

( 2 ) The cleaning processing unit may clean the surface of the substrate.

  In this case, some of the components of the film formed on the surface of the substrate are eluted and washed away during cleaning by the cleaning processing unit. Therefore, even if the substrate comes into contact with the liquid during the exposure process, the film components on the substrate are hardly eluted in the liquid. Further, dust and the like attached to the substrate before the exposure process can be removed. As a result, contamination in the exposure apparatus is prevented.

(3 ) The processing transport unit may further include a drying processing unit that performs drying processing on the substrate after the exposure processing.

  In this case, even if a liquid adheres to the substrate during the exposure process, the liquid is prevented from falling into the substrate processing apparatus. This prevents malfunction of the substrate processing apparatus. Further, it is possible to prevent the components of the film on the substrate from eluting into the liquid on the substrate. As a result, processing defects of the substrate are prevented.

( 4 ) A substrate processing apparatus according to a second aspect of the present invention is a substrate processing apparatus disposed so as to be adjacent to an exposure apparatus, which performs processing on the substrate and delivers the substrate to the exposure apparatus, and processing A loading / unloading unit for loading and unloading the substrate to / from the transfer unit, and the processing transfer unit includes a heat treatment unit for performing a heat treatment on the substrate after the exposure process, and a pre-exposure process carried by the loading / unloading unit. A first substrate transport mechanism for transporting the substrate to the exposure apparatus; a second substrate transport mechanism for transporting the substrate after the exposure process from the exposure apparatus to the heat treatment unit; and a substrate after the resist film is formed and before the exposure process. a cleaning unit for performing cleaning process, see containing a drying processing unit to perform the drying process on the substrate after the exposure processing, indexer part, the process transport unit and the exposure apparatus parallel in this order along the first direction Installed and washed The treatment unit, the heat treatment unit, and the drying treatment unit are arranged along a second direction orthogonal to the first direction in the horizontal plane in the treatment conveyance unit, and the heat treatment unit is arranged at a substantially central portion of the treatment conveyance unit, cleaning unit and the drying process unit is shall be located on one side and the other side of the thermal processing unit along the second direction.

In this substrate processing apparatus, the substrate is carried into the processing conveyance unit by the carry-in / out unit. The substrate is transported to the exposure apparatus by the first substrate transport mechanism after being cleaned by the cleaning processing unit. The exposure process is performed on the substrate in the exposure apparatus, and the substrate after the exposure process is transferred from the exposure apparatus to the heat treatment unit by the second substrate transfer mechanism. A heat treatment is performed on the substrate after the exposure processing by the heat treatment unit, and the substrate after the heat treatment is unloaded from the processing conveyance unit by the loading / unloading unit.
In this case, the number of substrate processing steps in the substrate processing apparatus can be reduced by performing various processes on the substrate before and after the exposure processing outside the substrate processing apparatus. Thereby, the enlargement of the substrate processing apparatus can be suppressed, and the occurrence of failure in the substrate processing apparatus can be suppressed.
When various processes are performed outside the substrate processing apparatus, even if a failure occurs in the substrate processing apparatus, various processes can be continuously performed outside the substrate processing apparatus. Thereby, it is possible to suppress the deterioration of the substrate processing efficiency due to the occurrence of the failure of the substrate processing apparatus.
In the processing transport unit, the substrate before the exposure processing is transported by the first substrate transport mechanism, and the substrate after the exposure processing is transported by the second substrate transport mechanism. That is, the substrate transport path before the exposure process and the substrate transport path after the exposure process are independently secured.
Thereby, the substrate can be efficiently transported as compared with the case where the transport route of the substrate before the exposure processing intersects with the transport route of the substrate after the exposure processing. As a result, the throughput can be improved. In addition, since the substrate before the exposure process and the substrate after the exposure process do not contact the same part, mutual contamination between the substrate before the exposure process and the substrate after the exposure process can be prevented.
Further, by performing a cleaning process on the substrate after the formation of the resist film and before the exposure process, the exposure process can be performed satisfactorily, and the occurrence of processing defects on the substrate can be prevented.
In addition, the carry-in / carry-out unit, the processing conveyance unit, and the exposure apparatus are arranged in this order along the first direction, and the cleaning processing unit, the heat treatment unit, and the drying processing unit are orthogonal to each other in the first direction in the horizontal plane. It is arranged along the direction. In this case, the heat treatment unit is disposed at a substantially central portion of the processing conveyance unit, and the cleaning processing unit and the drying processing unit are disposed on one side and the other side of the heat treatment unit along the second direction. Accordingly, it is possible to reduce the size and space of the substrate processing apparatus while maintaining good substrate transfer efficiency in the processing transfer unit.

( 5 ) The carry-in / carry-out unit conveys the substrate between the container placement unit on which the storage container that accommodates the substrate is placed, and the storage container placed on the container placement unit and the processing conveyance unit. The substrate transfer mechanism further includes a substrate transfer unit disposed between the first substrate transfer mechanism and the carry-in / carry-out unit and for temporarily mounting the substrate. The substrate transport mechanism may transport the substrate before the exposure process by the exposure apparatus from the storage container to the substrate mounting unit, and may transport the substrate after the exposure process by the exposure apparatus from the heat treatment unit to the storage container.

  In this case, the substrate before the exposure processing is transported from the storage container to the substrate platform by the third transport mechanism. Then, the substrate is transported from the substrate platform to the exposure apparatus by the first substrate transport mechanism. Further, the substrate after the exposure processing is transferred from the exposure apparatus to the heat treatment unit by the second transfer mechanism, and the substrate after the heat treatment is transferred from the heat treatment unit to the storage container by the third transfer mechanism.

  In this way, it is possible to smoothly carry in and carry out the substrate with respect to the processing conveyance unit. Further, the substrate transfer efficiency can be further improved by transferring the substrate after the exposure processing from the processing transfer unit to the carry-in / out unit via the heat treatment unit.

( 6 ) A substrate processing system according to a third aspect of the present invention includes an exposure apparatus that performs exposure processing on a substrate, and a substrate processing apparatus that is disposed adjacent to the exposure apparatus. The substrate processing apparatus performs processing on a substrate. And a processing transfer unit for transferring the substrate to the exposure apparatus and a loading / unloading unit for loading and unloading the substrate with respect to the processing transfer unit, and the processing transfer unit heat-treats the substrate after the exposure processing A heat treatment unit, a first substrate transport mechanism that transports a substrate before exposure processing carried in by the carry-in / carry-out unit to the exposure apparatus, and a second substrate transport mechanism that transports the substrate after exposure processing from the exposure device to the heat treatment unit When the resist film even after the formation of the saw including a cleaning unit for performing cleaning process to the substrate before the exposure processing, the cleaning unit includes a substrate rotation holding device for rotating while substantially horizontally holding the substrate, the substrate A cleaning brush for cleaning the lower surface of the substrate held by the rolling holding device, the substrate rotation holding device comprising: a rotating member provided rotatably around a rotation axis along a substantially vertical direction; A rotation drive mechanism that is provided on the upper side and rotates the rotation member; and a holding member that is provided on the lower side of the rotation member and holds the substrate by contacting an outer peripheral end of the substrate disposed on the lower side of the rotation member. Is included .

  In this substrate processing system, exposure processing is performed on the substrate in the exposure apparatus, and predetermined processing is performed on the substrate in the substrate processing apparatus before and after the exposure processing.

In the substrate processing apparatus, the substrate is carried into the processing conveyance unit by the carry-in / out unit. The substrate is transported to the exposure apparatus by the first substrate transport mechanism after being cleaned by the cleaning processing unit . The substrate after the exposure processing is transferred from the exposure apparatus to the heat treatment unit by the second substrate transfer mechanism. A heat treatment is performed on the substrate after the exposure processing by the heat treatment unit, and the substrate after the heat treatment is unloaded from the processing conveyance unit by the loading / unloading unit.

  In this case, the number of substrate processing steps in the substrate processing apparatus can be reduced by performing various processes on the substrate before and after the exposure processing outside the substrate processing apparatus. Thereby, the enlargement of the substrate processing apparatus can be suppressed, and the occurrence of failure in the substrate processing apparatus can be suppressed.

  When various processes are performed outside the substrate processing apparatus, even if a failure occurs in the substrate processing apparatus, various processes can be continuously performed outside the substrate processing apparatus. Thereby, it is possible to suppress the deterioration of the substrate processing efficiency due to the occurrence of the failure of the substrate processing apparatus.

  In the processing transport unit, the substrate before the exposure processing is transported by the first substrate transport mechanism, and the substrate after the exposure processing is transported by the second substrate transport mechanism. That is, the substrate transport path before the exposure process and the substrate transport path after the exposure process are independently secured.

Thereby, the substrate can be efficiently transported as compared with the case where the transport route of the substrate before the exposure processing intersects with the transport route of the substrate after the exposure processing. As a result, the throughput can be improved. In addition, since the substrate before the exposure process and the substrate after the exposure process do not contact the same part, mutual contamination between the substrate before the exposure process and the substrate after the exposure process can be prevented.
Further, by performing a cleaning process on the substrate after the formation of the resist film and before the exposure process, the exposure process can be performed satisfactorily, and the occurrence of processing defects on the substrate can be prevented.
Further, the back surface of the substrate is cleaned by the cleaning processing unit. Thereby, contaminants adhering to the back surface of the substrate can be removed, and defocusing due to unevenness on the back surface of the substrate during exposure processing can be prevented. Therefore, it is possible to prevent occurrence of processing defects on the substrate.
(8) A substrate processing system according to a fourth aspect of the present invention includes an exposure apparatus that performs exposure processing on a substrate, and a substrate processing apparatus that is disposed adjacent to the exposure apparatus. The substrate processing apparatus processes a substrate. A processing transfer unit for transferring the substrate to the exposure apparatus and a loading / unloading unit for loading and unloading the substrate with respect to the processing transfer unit, and the processing transfer unit heat-treats the substrate after the exposure processing A heat treatment unit, a first substrate transport mechanism that transports a substrate before exposure processing carried in by the carry-in / carry-out unit to the exposure apparatus, and a second substrate transport mechanism that transports the substrate after exposure processing from the exposure device to the heat treatment unit And a cleaning processing unit that performs a cleaning process on the substrate after the resist film is formed and before the exposure process, and a drying processing unit that performs a drying process on the substrate after the exposure process. The optical devices are arranged in this order along the first direction, and the cleaning processing unit, the heat treatment unit, and the drying processing unit are arranged along the second direction orthogonal to the first direction in the horizontal plane in the processing transport unit. The heat treatment unit is arranged at a substantially central portion of the processing conveyance unit, and the cleaning processing unit and the drying processing unit are arranged on one side and the other side of the heat treatment unit along the second direction.
In this substrate processing system, exposure processing is performed on the substrate in the exposure apparatus, and predetermined processing is performed on the substrate in the substrate processing apparatus before and after the exposure processing.
In the substrate processing apparatus, the substrate is carried into the processing conveyance unit by the carry-in / out unit. The substrate is transported to the exposure apparatus by the first substrate transport mechanism after being cleaned by the cleaning processing unit. The substrate after the exposure processing is transferred from the exposure apparatus to the heat treatment unit by the second substrate transfer mechanism. A heat treatment is performed on the substrate after the exposure processing by the heat treatment unit, and the substrate after the heat treatment is unloaded from the processing conveyance unit by the loading / unloading unit.
In this case, the number of substrate processing steps in the substrate processing apparatus can be reduced by performing various processes on the substrate before and after the exposure processing outside the substrate processing apparatus. Thereby, the enlargement of the substrate processing apparatus can be suppressed, and the occurrence of failure in the substrate processing apparatus can be suppressed.
When various processes are performed outside the substrate processing apparatus, even if a failure occurs in the substrate processing apparatus, various processes can be continuously performed outside the substrate processing apparatus. Thereby, it is possible to suppress the deterioration of the substrate processing efficiency due to the occurrence of the failure of the substrate processing apparatus.
In the processing transport unit, the substrate before the exposure processing is transported by the first substrate transport mechanism, and the substrate after the exposure processing is transported by the second substrate transport mechanism. That is, the substrate transport path before the exposure process and the substrate transport path after the exposure process are independently secured.
Thereby, the substrate can be efficiently transported as compared with the case where the transport route of the substrate before the exposure processing intersects with the transport route of the substrate after the exposure processing. As a result, the throughput can be improved. In addition, since the substrate before the exposure process and the substrate after the exposure process do not contact the same part, mutual contamination between the substrate before the exposure process and the substrate after the exposure process can be prevented.
Further, by performing a cleaning process on the substrate after the formation of the resist film and before the exposure process, the exposure process can be performed satisfactorily and the occurrence of processing defects on the substrate can be prevented.
In addition, the carry-in / carry-out unit, the processing conveyance unit, and the exposure apparatus are arranged in this order along the first direction, and the cleaning processing unit, the heat treatment unit, and the drying processing unit are orthogonal to each other in the first direction in the horizontal plane. It is arranged along the direction. In this case, the heat treatment unit is disposed at a substantially central portion of the processing conveyance unit, and the cleaning processing unit and the drying processing unit are disposed on one side and the other side of the heat treatment unit along the second direction. Accordingly, it is possible to reduce the size and space of the substrate processing apparatus while maintaining good substrate transfer efficiency in the processing transfer unit.
( 8 ) A substrate processing method according to a fifth aspect of the present invention is a method of processing a substrate in a substrate processing apparatus provided with a processing transfer section and a loading / unloading section and arranged adjacent to an exposure apparatus, wherein a resist film A step of carrying the substrate on which the substrate is formed into the processing transfer unit by the loading / unloading unit, and a step of transferring the substrate loaded by the loading / unloading unit to the cleaning processing unit of the processing transfer unit by the first substrate transfer mechanism of the processing transfer unit A step of performing a cleaning process on the substrate transported by the first substrate transport mechanism by the cleaning processing unit, a step of transporting the substrate after the cleaning process by the cleaning processing unit to the exposure apparatus by the first substrate transport mechanism, A step of transporting a substrate after exposure processing by the exposure apparatus to a heat treatment unit of the processing transport unit by a second substrate transport mechanism of the processing transport unit; and a second substrate transporting machine And a step of performing heat treatment by a heat treatment unit in a substrate which is transported by, the step of performing a cleaning process by the cleaning unit includes the steps of rotating while substantially horizontally holding the substrate by the substrate rotation holding device, the substrate rotation holding device Cleaning the lower surface of the substrate held by the cleaning brush with a cleaning brush, and the step of rotating the substrate comprises the step of rotating the holding member provided below the rotating member to the outer peripheral edge of the substrate disposed below the rotating member. A step of holding the substrate by contacting the portion, and a step of rotating the rotating member around a rotation axis along a substantially vertical direction by a rotation driving mechanism provided on the upper side of the rotating member .
(9) A substrate processing method according to a sixth aspect of the present invention is a method for processing a substrate in a substrate processing apparatus provided with a processing transfer section and a loading / unloading section and disposed adjacent to an exposure apparatus, wherein a resist film A step of carrying the substrate on which the substrate is formed into the processing transfer unit by the loading / unloading unit, and a step of transferring the substrate loaded by the loading / unloading unit to the cleaning processing unit of the processing transfer unit by the first substrate transfer mechanism of the processing transfer unit A step of performing a cleaning process on the substrate transported by the first substrate transport mechanism by the cleaning processing unit, a step of transporting the substrate after the cleaning process by the cleaning processing unit to the exposure apparatus by the first substrate transport mechanism, A step of transporting the substrate after the exposure processing by the exposure apparatus to the drying processing unit of the processing transport unit by the second substrate transport mechanism of the processing transport unit; A step of performing a drying process on the substrate transferred by the drying processing unit, a step of transporting the substrate after the drying process by the drying processing unit to the heat treatment unit by the second substrate transport mechanism, and a second substrate transport mechanism A step of performing a heat treatment on the substrate conveyed by the heat treatment unit, and the carry-in / out unit, the process conveyance unit, and the exposure apparatus are arranged in this order along the first direction, and the cleaning treatment unit, the heat treatment unit, and the drying unit The processing unit is disposed along the second direction orthogonal to the first direction in the horizontal plane in the processing transport unit, and the heat treatment unit is disposed at a substantially central portion of the processing transport unit, and the cleaning processing unit and the drying processing unit Are arranged on one side and the other side of the heat treatment unit along the second direction.

  According to the present invention, the number of processing steps of a substrate in the substrate processing apparatus can be suppressed by performing various processes on the substrate before and after the exposure processing outside the substrate processing apparatus. Thereby, the enlargement of the substrate processing apparatus can be suppressed, and the occurrence of failure in the substrate processing apparatus can be suppressed. When various processes are performed outside the substrate processing apparatus, even if a failure occurs in the substrate processing apparatus, various processes can be continuously performed outside the substrate processing apparatus. Thereby, it is possible to suppress the deterioration of the substrate processing efficiency due to the occurrence of the failure of the substrate processing apparatus.

  Hereinafter, a substrate processing apparatus and a substrate processing system according to embodiments of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, and the like. Say.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In FIG. 1 and FIGS. 2 to 5 and FIG. 8 to be described later, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are attached in order to clarify the positional relationship. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is the + direction, and the opposite direction is the-direction. Further, the rotation direction around the Z direction is defined as the θ direction.

  As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer block 9, a cleaning heating block 10, and a substrate transport block 11. An exposure device 16 is disposed adjacent to the substrate transport block 11. In the exposure apparatus 16, the substrate W is subjected to an exposure process by a liquid immersion method.

  The indexer block 9 includes a main controller (control unit) 30 that controls the operation of each processing block, a plurality of carrier platforms 40, and an indexer robot IR. The indexer robot IR is provided with a hand IRH for delivering the substrate W.

  The cleaning heating block 10 includes cleaning / drying processing units SD1, SD2, substrate platforms PASS1, PASS2, first and second central robots CR1, CR2, and a placement / bake unit P-PEB. The cleaning / drying processing unit SD1 is disposed on the −X side of the cleaning heating block 10, and the cleaning / drying processing unit SD2 is disposed on the + X side of the cleaning heating block 10. The placement / bake unit P-PEB is disposed at a substantially central portion of the cleaning heating block 10.

  A first central robot CR1 and a substrate platform PASS1 are disposed between the placement / bake unit P-PEB and the cleaning / drying processing unit SD1. A second central robot CR2 and a substrate platform PASS2 are arranged between the placement / bake unit P-PEB and the cleaning / drying processing unit SD2.

  The cleaning / drying processing unit SD1 performs a cleaning process and a drying process for the substrate W before the exposure process, and the cleaning / drying process unit SD2 performs a cleaning process for the substrate W after the exposure process and a drying process. Details of the cleaning / drying processing units SD1 and SD2 will be described later.

  The first center robot CR1 is provided with hands CRH11 and CRH12 for delivering the substrate W up and down, and the second center robot CR2 is provided with hands CRH13 and CRH14 for delivering the substrate W up and down. It is done.

  The substrate transport block 11 includes a bevel inspection unit IM, a placement / cooling unit P-CP, a feed buffer unit SBF, and interface transport mechanisms IFRa and IFRb. The interface transport mechanism IFRa is provided with a hand H1 for delivering the substrate W, and the interface transport mechanism IFRb is provided with a hand H2 for delivering the substrate W.

  2 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed from the + X direction, and FIG. 3 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed from the −X direction. 2 mainly shows what is provided on the + X side of the substrate processing apparatus 500, and FIG. 3 mainly shows what is provided on the −X side of the substrate processing apparatus 500.

  As shown in FIG. 2, on the + X side of the cleaning heating block 10, five cleaning / drying processing units SD2 are vertically stacked. Also, as shown in FIG. 3, on the −X side of the cleaning heating block 10, five cleaning / drying processing units SD1 are stacked one above the other. On the −X side of the substrate transport block 11, a bevel inspection unit IM, four placement / cooling units P-CP, and a feed buffer unit SBF are arranged vertically.

  The numbers of the cleaning / drying processing units SD1 and SD2, the bevel inspection unit IM, the placement / cooling unit P-CP, and the placement / heating unit P-PEB may be changed as appropriate.

(2) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 500 according to the present embodiment will be described with reference to FIGS.

  On the carrier mounting table 40 of the indexer block 9, a carrier C that stores a plurality of substrates W in multiple stages is loaded. The indexer robot IR takes out the substrate W stored in the carrier C using the hand IRH. Thereafter, the indexer robot IR rotates in the ± θ direction while moving in the ± X direction, and places the substrate W on the substrate platform PASS1.

  In the present embodiment, a resist film is formed in advance by another apparatus on the substrate W carried into the indexer block 9. Further, an antireflection film for reducing standing waves and halation generated during exposure may be formed under the resist film, and a resist cover film for protecting the resist film may be formed on the resist film. .

  In the present embodiment, a FOUP (front opening unified pod) is adopted as the carrier C, but the present invention is not limited to this. cassette) or the like.

  Further, the indexer robot IR, the first and second center robots CR1 and CR2, and the interface transport mechanisms IFRa and IFRb are linearly moved with respect to the substrate W so as to move the hand back and forth. Although the robot is used, the present invention is not limited to this, and an articulated transfer robot that moves the joint linearly by moving the joint linearly may be used.

  The substrate W placed on the substrate platform PASS1 is received by the first central robot CR1 of the cleaning heating block 10. The first center robot CR1 carries the substrate W into one of the cleaning / drying processing units SD1. In the cleaning / drying processing unit SD1, cleaning and drying processing of the substrate W before the exposure processing is performed as described above.

  Next, the first central robot CR1 takes out the substrate W that has been cleaned and dried from the cleaning / drying processing unit SD1, and carries the substrate W into the bevel inspection unit IM of the substrate transport block 11. In the bevel inspection unit IM, the bevel portion (outer peripheral end portion) of the substrate W is inspected, and it is confirmed whether the bevel portion of the substrate W has an abnormality such as film peeling.

  When an abnormality in the bevel portion is confirmed in the bevel inspection unit IM, the substrate W is separately subjected to a predetermined treatment. For example, the substrate W is taken out from the bevel inspection unit IM by the first central robot CR1 and then carried into the sending buffer unit SBF. Then, after the lot is finished, it is collected by the operator.

  The substrate W having no abnormality in the bevel portion is taken out from the bevel inspection unit IM by the first central robot CR1 and carried into the sending buffer portion SBF. Then, the substrate W is taken out from the sending buffer unit SBF by the first central robot CR1.

  The exposure processing time by the exposure device 16 is usually longer than other processing steps and transport steps. Therefore, there are many cases where the exposure apparatus 16 cannot accept the subsequent substrate W. In this case, the substrate W is temporarily stored and stored in the sending buffer unit SBF of the substrate transport block 11.

  Next, the first central robot CR1 carries the substrate W taken out from the sending buffer unit SBF into the placement / cooling unit P-CP. The substrate W carried into the placement / cooling unit P-CP is maintained at the same temperature (for example, 23 ° C.) as that in the exposure apparatus 16.

  When the exposure apparatus 16 has a sufficient processing speed, the substrate W is transported from the bevel inspection unit IM to the placement / cooling unit P-CP without storing and storing the substrate W in the sending buffer unit SBF. Also good.

  Subsequently, the substrate W maintained at the predetermined temperature by the placement / cooling unit P-CP is received by the interface transport mechanism IFRa of the substrate transport block 11 and carried into the substrate carry-in section 16a in the exposure apparatus 16. .

  The substrate W that has been subjected to the exposure processing in the exposure device 16 is unloaded from the substrate unloading portion 16b by the interface transport mechanism IFRb. The interface transport mechanism IFRb places the substrate W on the substrate platform PASS2.

  The substrate W placed on the substrate platform PASS2 is received by the second central robot CR2 of the cleaning heating block 10. The second center robot CR2 carries the substrate W into one of the cleaning / drying processing units SD2. In the cleaning / drying processing unit SD2, the substrate W after the exposure processing is cleaned and dried as described above.

  Next, the second central robot CR2 takes out the substrate W that has been cleaned and dried from the cleaning / drying processing unit SD2, and carries the substrate W into the placement / heating unit P-PEB. In the placement / heating unit P-PEB, a post-exposure bake (PEB) process is performed on the substrate W. Details of the mounting / heating unit P-PEB will be described later.

  In the present embodiment, the operation process of the first central robot CR1 includes the transfer of the substrate W from the substrate platform PASS1 to the cleaning / drying process SD1, and the substrate W from the cleaning / drying processing unit SD1 to the bevel inspection unit IM. Transfer, transfer of the substrate W from the bevel inspection unit IM to the transfer buffer unit SBF, transfer of the substrate W from the transfer buffer unit SBF to the mounting / cooling unit P-CP, and transfer from the mounting / cooling unit P-CP to the substrate There are five steps of rotational movement to the placement part PASS1.

  In this case, for example, when the first central robot CR1 capable of performing one process in 3.6 seconds is used, 200 substrates W can be transferred in one hour.

  In addition, the operation process of the second central robot CR2 includes the transfer of the substrate W from the substrate platform PASS2 to the cleaning / drying processing unit SD2, and the substrate from the cleaning / drying processing unit SD2 to the mounting / heating unit P-PEB. There are three steps of transporting W and rotational movement from the placement / heating unit P-PEB to the substrate platform PASS2.

  In this case, for example, if the second central robot CR2 capable of performing one process in 3.6 seconds is used, 333 substrates W can be transferred in one hour.

  The substrate W on which the post-exposure baking process has been performed is received from the placement / heating unit P-PEB by the indexer robot IR of the indexer block 9. The indexer robot IR stores the substrate W in the carrier C. Thereby, each process of the board | substrate W in the substrate processing apparatus 500 is complete | finished.

  Note that after the substrate W is unloaded from the substrate processing apparatus 500, development processing is performed on the resist film on the substrate W by another apparatus. When a resist cover film is formed on the substrate W, the resist cover film is removed before the development process is performed.

(3) Details of Mounting / Heating Unit FIG. 4 is an external perspective view of the mounting / heating unit P-PEB, and FIG. 5 is a cross-sectional view of the mounting / heating unit P-PEB in the YZ plane.

  As shown in FIGS. 4 and 5, the placement / heating unit P-PEB includes a carry-out placement unit 200, a carry-in placement unit 210, a heating unit 220, and a transport mechanism 230. The carry-out placement unit 200, the carry-in placement unit 210, and the heating unit 220 are arranged side by side along the Y direction.

  The unloading placement unit 200 includes a cooling plate 201. A cooling pipe WP is provided inside the cooling plate. The cooling plate 201 can be cooled by circulating a cooling medium (for example, cooling water) through the cooling pipe WP. A plurality of (three in this example) lifting pins 202 are provided so as to protrude upward from the cooling plate 201.

  The loading placement unit 210 includes a placement plate 211. Plural (three in this example) lifting pins 212 are provided so as to protrude upward from the mounting plate 211.

  The heating unit 220 includes a heating plate 221. Plural (three in this example) lifting pins 222 are provided so as to protrude upward from the heating plate 221. An upper lid 224 is provided above the heating plate 221. The upper lid 224 is attached to the upper lid raising / lowering drive unit 225. The upper lid 224 is driven up and down by the upper lid raising / lowering drive unit 225.

  As shown in FIG. 5, the plurality of lifting pins 202 are attached to a pin support plate 203, and the plurality of lifting pins 212 are attached to a pin support plate 213. The plurality of lifting pins 222 are attached to the pin support plate 223. The pin support plates 203, 213, and 223 are lifted and lowered independently by the lift pin driving mechanism 240.

  As shown in FIG. 4, guide rails 231 are laid along the Y direction on the sides of the loading platform 200, the loading platform 210, and the heating unit 220. The transport mechanism 230 is movably provided along the guide rail 231.

  The transport mechanism 230 includes a transport hand 232 and a hand drive unit 233. The transport hand 232 is moved up and down by the hand drive unit 233 and moves along the Y direction integrally with the hand drive unit 233. The transport hand 232 moves between the unloading placement unit 200, the loading placement unit 210, and the heating unit 220 while holding the substrate W. Cuts are formed in the transport hand 232 so as not to interfere with the lift pins 202, 212, and 222.

  Next, the operation of the placement / heating unit P-PEB will be described. First, the second central robot CR2 in FIG. 1 carries the substrate W into the placement / heating unit P-PEB along the X direction by the hand CRH13 or the hand CRH14, and is placed on the lifting pins 212 of the loading placement unit 210. Place.

  After the hand CRH13 or hand CRH14 of the second center robot CR2 has left, the transport hand 232 moves between the substrate W and the placement plate 211 and receives the substrate W on the support pins 212.

  Subsequently, in a state where the upper lid 224 is separated from the heating plate 221, the transport hand 232 moves onto the heating plate 221 and places the substrate W on the support pins 222.

  Subsequently, the transport hand 232 is retracted from the heating unit 220 and the upper lid 224 is lowered to close the space on the heating plate 221. Then, the lift pins 222 are lowered to place the substrate W on the heating plate 221. In this state, the substrate W is heated by the heating plate 221.

  After a predetermined time has elapsed, the heating of the substrate W is stopped, and the upper lid 224 is raised. Subsequently, the elevating pins 222 are raised to separate the substrate W from the heating plate 221. Then, the transfer hand 232 moves between the heating plate 221 and the substrate W, and receives the substrate W on the lift pins 222.

  Subsequently, the transport hand 232 moves onto the cooling plate 201 of the unloading placement unit 200 while holding the heated substrate W, and places the substrate W on the support pins 202. Subsequently, the support pins 202 are lowered to place the substrate W on the cooling plate 201. In this state, the cooling plate 201 is cooled, whereby the substrate W is cooled.

  After a predetermined time elapses, the cooling of the substrate W is stopped, and the support pins 202 are raised to separate the substrate W from the cooling plate 201. Then, the indexer robot IR in FIG. 1 receives the substrate W from the support pins 202 by the hand IRH and carries the substrate W out of the placement / heating unit P-PEB along the Y direction.

  In the placement / heating unit P-PEB, a loading placement unit 210 is provided at a position close to the second center robot CR2, and a loading placement unit at a position close to the indexer robot IR (indexer lock 9). 200 is provided. This facilitates the loading of the substrate W into the loading platform 210 by the second center robot CR2 and the unloading of the substrate W from the loading platform 200 by the indexer robot IR. As a result, it becomes possible to quickly carry in and carry out the substrate W with respect to the placement / heating unit P-PEB.

  In the present embodiment, the cooling plate 201 cools the substrate W, but the cooling method of the substrate W is not limited to this, and a cooling function for cooling the substrate W may be provided to the transport hand 232. .

(4) Cleaning / Drying Processing Unit Next, the cleaning / drying processing unit SD1 will be described in detail with reference to the drawings. FIG. 6 is a side view showing the configuration of the cleaning / drying processing unit SD1. The cleaning / drying processing unit SD2 has the same configuration as the cleaning / drying processing unit SD1.

  As shown in FIG. 6, the cleaning / drying processing unit SD1 includes a spin chuck 621 for holding the substrate W horizontally and rotating the substrate W about a vertical rotation axis passing through the center of the substrate W.

  The spin chuck 621 is fixed to the upper end of the rotation shaft 625 rotated by the chuck rotation drive mechanism 636. In addition, the spin chuck 621 is formed with an intake path (not shown), and the substrate W is placed on the spin chuck 621 to exhaust the inside of the intake path so that the lower surface of the substrate W is covered with the spin chuck 621. The substrate W can be held in a horizontal posture.

  A motor 660 is provided outside the spin chuck 621. A rotation shaft 661 is connected to the motor 660. In addition, an arm 662 is connected to the rotation shaft 661 so as to extend in the horizontal direction, and a cleaning nozzle 650 is provided at the tip of the arm 662.

  The rotation shaft 661 is rotated by the motor 660 and the arm 662 is rotated, and the cleaning processing nozzle 650 is moved above the substrate W held by the spin chuck 621.

  A cleaning treatment supply pipe 663 is provided so as to pass through the motor 660, the rotation shaft 661, and the arm 662. The cleaning processing supply pipe 663 is connected to the cleaning liquid supply source R1 and the rinsing liquid supply source R2 via the valves Va and Vb.

  By controlling the opening and closing of the valves Va and Vb, the processing liquid supplied to the cleaning processing supply pipe 663 can be selected and the supply amount can be adjusted. In the configuration of FIG. 6, the cleaning liquid can be supplied to the cleaning processing supply pipe 663 by opening the valve Va, and the rinsing liquid can be supplied to the cleaning processing supply pipe 663 by opening the valve Vb. it can.

  The cleaning liquid or the rinse liquid is supplied to the cleaning process nozzle 650 from the cleaning liquid supply source R1 or the rinse liquid supply source R2 through the cleaning process supply pipe 663. Thereby, the cleaning liquid or the rinsing liquid can be supplied to the surface of the substrate W. As the cleaning liquid, for example, pure water, a liquid obtained by dissolving a complex (ionized) in pure water, a fluorine-based chemical liquid, or the like is used. As the rinsing liquid, for example, pure water, carbonated water, hydrogen water, or electrolytic ion water HFE (hydrofluoroether) is used.

  A motor 671 is provided outside the spin chuck 621. A rotation shaft 672 is connected to the motor 671. Further, an arm 673 is connected to the rotation shaft 672 so as to extend in the horizontal direction, and a drying processing nozzle 670 is provided at the tip of the arm 673.

  The rotation shaft 672 is rotated by the motor 671, the arm 673 is rotated, and the drying processing nozzle 670 moves above the substrate W held by the spin chuck 621.

  A drying processing supply pipe 674 is provided so as to pass through the motor 671, the rotation shaft 672, and the arm 673. The drying processing supply pipe 674 is connected to an inert gas supply source R3 via a valve Vc. By controlling the opening and closing of the valve Vc, the supply amount of the inert gas supplied to the drying treatment supply pipe 674 can be adjusted.

  The inert gas is supplied to the drying processing nozzle 670 from the inert gas supply source R3 through the drying processing supply pipe 674. Thereby, an inert gas can be supplied to the surface of the substrate W. As the inert gas, for example, nitrogen gas is used.

  When supplying the cleaning liquid or the rinsing liquid to the surface of the substrate W, the cleaning processing nozzle 650 is positioned above the substrate. When supplying the inert gas to the surface of the substrate W, the cleaning processing nozzle 650 is Retreated to a predetermined position.

  Further, when supplying the cleaning liquid or the rinsing liquid to the surface of the substrate W, the drying processing nozzle 670 is retracted to a predetermined position, and when supplying the inert gas to the surface of the substrate W, the drying processing nozzle 670 is located above the substrate W.

  The substrate W held on the spin chuck 621 is accommodated in the processing cup 623. A cylindrical partition wall 633 is provided inside the processing cup 623. A drainage space 631 for draining the processing liquid (cleaning liquid or rinsing liquid) used for processing the substrate W is formed so as to surround the periphery of the spin chuck 621. Further, a recovery liquid space 632 for recovering the processing liquid used for processing the substrate W is formed between the processing cup 623 and the partition wall 633 so as to surround the drainage space 631.

  The drainage space 631 is connected to a drainage pipe 634 for guiding the processing liquid to a drainage processing apparatus (not shown), and the recovery liquid space 632 is supplied with the processing liquid to the recovery processing apparatus (not shown). A collection pipe 635 for guiding is connected.

  A guard 624 for preventing the processing liquid from the substrate W from splashing outward is provided above the processing cup 623. The guard 624 has a rotationally symmetric shape with respect to the rotation shaft 625. A drainage guide groove 641 having a square cross section is formed in an annular shape on the inner surface of the upper end portion of the guard 624.

  In addition, a recovery liquid guide portion 642 is formed on the inner surface of the lower end portion of the guard 624. The recovery liquid guide portion 642 includes an inclined surface that is inclined outward and downward. A partition wall storage groove 643 for receiving the partition wall 633 of the processing cup 623 is formed near the upper end of the recovered liquid guide portion 642.

  The guard 624 is provided with a guard lifting / lowering drive mechanism (not shown) configured by a ball screw mechanism or the like. The guard lifting / lowering drive mechanism includes a guard 624, a recovery position where the recovery liquid guide portion 642 faces the outer peripheral end surface of the substrate W held by the spin chuck 621, and the substrate W where the drainage guide groove 641 is held by the spin chuck 621. The liquid is moved up and down with respect to the drainage position facing the outer peripheral end face. When the guard 624 is at the recovery position (the guard position shown in FIG. 6), the processing liquid splashed outward from the substrate W is guided to the recovery liquid space 632 by the recovery liquid guide 642 and recovered through the recovery pipe 635. Is done. On the other hand, when the guard 624 is at the drainage position, the processing liquid splashed outward from the substrate W is guided to the drainage space 631 by the drainage guide groove 641 and drained through the drainage pipe 634. With the above configuration, the processing liquid is drained and collected.

  Next, the processing operation of the cleaning / drying processing unit SD1 having the above configuration will be described. The operation of each component of the cleaning / drying processing unit SD1 described below is controlled by the main controller (control unit) 30 in FIG. The processing operation of the cleaning / drying processing unit SD2 is the same as the processing operation of the cleaning / drying processing unit SD1.

  First, when the substrate W is carried in, the guard 624 is lowered, and the first central robot CR1 in FIG. 1 places the substrate W on the spin chuck 621. The substrate W placed on the spin chuck 621 is sucked and held by the spin chuck 621.

  Next, the guard 624 moves to the above-described liquid discharge position, and the cleaning nozzle 650 moves above the center of the substrate W. Thereafter, the rotation shaft 625 rotates, and the substrate W held by the spin chuck 621 rotates with this rotation. Thereafter, the cleaning liquid is discharged from the cleaning nozzle 650 onto the upper surface of the substrate W. Thereby, the substrate W is cleaned.

  In the cleaning / drying processing unit SD1, the components of the resist cover film on the substrate W are eluted in the cleaning liquid during this cleaning. In cleaning the substrate W, the cleaning liquid is supplied onto the substrate W while rotating the substrate W. In this case, the cleaning liquid on the substrate W always moves to the periphery of the substrate W due to centrifugal force and scatters. Therefore, it is possible to prevent the components of the resist cover film eluted in the cleaning liquid from remaining on the substrate W.

  The components of the resist cover film may be eluted by, for example, depositing pure water on the substrate W and holding it for a certain time. The supply of the cleaning liquid onto the substrate W may be performed by a soft spray method using a two-fluid nozzle.

  After a predetermined time has elapsed, the supply of the cleaning liquid is stopped, and the rinsing liquid is discharged from the cleaning processing nozzle 650. Thereby, the cleaning liquid on the substrate W is washed away.

  Further, after a predetermined time has elapsed, the rotational speed of the rotating shaft 625 decreases. As a result, the amount of the rinsing liquid shaken off by the rotation of the substrate W is reduced, and a liquid layer L of the rinsing liquid is formed on the entire surface of the substrate W as shown in FIG. Note that the rotation of the rotation shaft 625 may be stopped to form the liquid layer L over the entire surface of the substrate W.

  Next, the supply of the rinsing liquid is stopped, the cleaning processing nozzle 650 is retracted to a predetermined position, and the drying processing nozzle 670 is moved above the center of the substrate W. Thereafter, an inert gas is discharged from the drying processing nozzle 670. As a result, as shown in FIG. 7B, the rinse liquid at the center of the substrate W moves to the peripheral edge of the substrate W, and the liquid layer L exists only at the peripheral edge of the substrate W.

  Next, as the number of rotations of the rotation shaft 625 (see FIG. 6) increases, the drying processing nozzle 670 gradually moves from above the central portion of the substrate W to above the peripheral portion as shown in FIG. 7C. . As a result, a large centrifugal force acts on the liquid layer L on the substrate W, and an inert gas can be blown over the entire surface of the substrate W, so that the liquid layer L on the substrate W can be reliably removed. As a result, the substrate W can be reliably dried.

  Next, the supply of the inert gas is stopped, the drying processing nozzle 670 is retracted to a predetermined position, and the rotation of the rotating shaft 625 is stopped. Thereafter, the guard 624 descends and the first center robot CR1 in FIG. Thereby, the processing operation in the cleaning / drying processing unit SD1 is completed. Note that the position of the guard 624 during the cleaning and drying process is preferably changed as appropriate according to the necessity of collecting or draining the processing liquid.

  In the above embodiment, the cleaning liquid processing nozzle 650 is commonly used for supplying the cleaning liquid and the rinsing liquid so that both the cleaning liquid and the rinsing liquid can be supplied from the cleaning liquid processing nozzle 650. However, a configuration in which the cleaning liquid supply nozzle and the rinsing liquid supply nozzle are separately provided may be employed.

  Further, when supplying the rinsing liquid, pure water may be supplied from a back rinsing nozzle (not shown) to the back surface of the substrate W so that the rinsing liquid does not flow around the back surface of the substrate W.

  In addition, when pure water is used as a cleaning liquid for cleaning the substrate W, it is not necessary to supply a rinse liquid.

  In the above embodiment, the substrate W is dried by the spin drying method. However, the substrate W may be dried by other drying methods such as a reduced pressure drying method and an air knife drying method.

  In the above embodiment, the inert gas is supplied from the drying processing nozzle 670 in a state where the liquid layer L of the rinsing liquid is formed, but the liquid layer L of the rinsing liquid is not formed. Alternatively, when the rinsing liquid is not used, the substrate W is completely dried by immediately supplying an inert gas from the drying nozzle 670 after the substrate W is rotated and the liquid layer of the cleaning liquid is once shaken off. May be.

(5) Effects of this Embodiment In the substrate processing apparatus 500 according to this embodiment, the cleaning process and the drying process for the substrate W before the exposure process, and the cleaning process, the drying process and the heating for the substrate W after the exposure process are performed. Processing is performed. Other processes such as resist film formation and development are performed separately outside the substrate processing apparatus 500.

  As described above, by performing various processes outside the substrate processing apparatus 500, an increase in the size of the substrate processing apparatus 500 can be suppressed and occurrence of a failure in the substrate processing apparatus 500 can be suppressed. Therefore, it is possible to reduce the labor and time required for the restoration work of the substrate processing apparatus 500.

  Even if a failure occurs in the substrate processing apparatus 500, other processes such as formation of a resist film can be continued. Thereby, deterioration of the processing efficiency of the substrate W due to the occurrence of a failure can be suppressed.

  In the cleaning heating block 10 and the substrate transport block 11, the substrate W before the exposure process is transported by the first center robot CR1 and the interface transport mechanism IFRa, and the substrate W after the exposure process is transported by the second center robot CR2. And is transported by the interface transport mechanism IFRb. That is, in the cleaning heating block 10 and the substrate transport block 11, the transport path of the substrate W before the exposure process and the transport path of the substrate W after the exposure process are ensured independently. In this case, the first and second center robots CR1 and CR2 and the interface transport mechanisms IFRa and IFRb are compared with the case where the transport path of the substrate W before the exposure process intersects with the transport path of the substrate W after the exposure process. Is simplified. Thereby, the transfer efficiency of the substrate W is improved, and the throughput can be improved.

  Further, in the cleaning heating block 10 and the substrate transport block 11, the substrate W before the exposure process and the substrate W after the exposure process do not contact the same part. Therefore, cross contamination (cross-contamination) between the substrate W before the exposure process and the substrate W after the exposure process can be prevented.

  Further, since the transport path of the substrate W before the exposure process and the transport path of the substrate W after the exposure process are independent from each other, the substrate W after the exposure process can be quickly and smoothly placed and heated. Can be transported to PEB. Therefore, when processing a plurality of substrates W continuously, the time from the exposure process to the PEB process can be made short and substantially constant. As a result, variations in exposure pattern accuracy can be prevented.

  Further, the placement / heating unit P-PEB plays a role of a placement unit for delivering the substrate W from the second center robot CR2 to the indexer robot IR. In this case, the transport path of the substrate W from the cleaning heating block 10 to the indexer block 9 can be simplified. Thereby, the throughput can be further improved.

  Further, in the present embodiment, before the exposure processing of the substrate W is performed in the exposure apparatus 16, the cleaning processing of the substrate W is performed in the cleaning / drying processing unit SD1. During this cleaning process, a part of the resist film on the substrate W or the resist cover film component of the resist cover film is eluted into the cleaning liquid or rinse liquid and washed away. Therefore, even if the substrate W comes into contact with the liquid in the exposure apparatus 16, the components of the resist film or resist cover film on the substrate W are hardly eluted in the liquid. Further, dust and the like attached to the substrate W before the exposure process can be removed. As a result, contamination in the exposure apparatus 16 is prevented.

  In the cleaning / drying processing unit SD1, the substrate W is subjected to a drying process after the substrate W is cleaned. As a result, the cleaning liquid or the rinse liquid adhering to the substrate W during the cleaning process is removed, so that the dust in the atmosphere or the like is prevented from adhering again to the substrate W after the cleaning process. As a result, contamination within the exposure apparatus 16 can be reliably prevented.

  Further, in the cleaning / drying processing unit SD1, the substrate W is dried by blowing an inert gas from the central portion to the peripheral portion of the substrate W while rotating the substrate W. In this case, the cleaning liquid and the rinsing liquid on the substrate W can be reliably removed, so that it is possible to reliably prevent dust and the like in the atmosphere from adhering to the cleaned substrate W. Thereby, the contamination of the substrate W can be surely prevented, and the occurrence of dry spots on the surface of the substrate W can be prevented.

  Further, in the cleaning / drying processing unit SD2, the substrate W after the exposure processing is dried. This prevents the liquid adhering to the substrate W during the exposure process from falling into the substrate processing apparatus 500. In addition, by performing a drying process on the substrate W after the exposure process, it is possible to prevent dust and the like in the atmosphere from adhering to the substrate W after the exposure process, thereby preventing contamination of the substrate W.

  In addition, since it is possible to prevent the substrate W to which the liquid is attached from being transported through the substrate processing apparatus 500, the liquid attached to the substrate W during the exposure process affects the atmosphere in the substrate processing apparatus 500. Can be prevented. Thereby, temperature and humidity adjustment in the substrate processing apparatus 500 is facilitated.

  Further, the liquid adhering to the substrate W during the exposure process is prevented from adhering to the indexer robot IR and the first and second center robots CR1 and CR2. Therefore, it is possible to prevent the liquid from adhering to the substrate W before the exposure process. This prevents dust and the like in the atmosphere from adhering to the substrate W before the exposure process, so that contamination of the substrate W is prevented. As a result, it is possible to prevent the resolution performance from being deteriorated during the exposure process and to prevent contamination in the exposure apparatus 16.

  In addition, it is possible to reliably prevent the resist component or the resist cover film component from being eluted into the cleaning liquid and the rinsing liquid remaining on the substrate W after the substrate W is transported from the cleaning / drying processing unit SD2. Thereby, deformation of the exposure pattern formed on the resist film can be prevented. As a result, it is possible to reliably prevent a reduction in line width accuracy during the development process.

  As a result, it is possible to prevent malfunctions such as abnormalities in the electrical system of the substrate processing apparatus 500 and to reliably prevent malfunctions of the substrate W.

  Further, in the cleaning / drying processing unit SD2, the substrate W is dried by blowing an inert gas from the central portion to the peripheral portion of the substrate W while rotating the substrate W. In this case, the cleaning liquid and the rinsing liquid on the substrate W can be reliably removed, so that it is possible to reliably prevent dust and the like in the atmosphere from adhering to the cleaned substrate W. Thereby, the contamination of the substrate W can be surely prevented, and the occurrence of dry spots on the surface of the substrate W can be prevented.

  In the cleaning / drying processing unit SD2, the substrate W is subjected to a cleaning process before the drying process. Therefore, even if dust or the like in the atmosphere adheres to the substrate W to which the liquid has adhered during the exposure process, the adhered matter is removed. Can be removed. Thereby, contamination of the substrate W can be prevented. As a result, it is possible to reliably prevent substrate processing defects.

(6) Other Embodiments FIG. 8 is a plan view of a substrate processing apparatus according to another embodiment of the present invention. A difference between the substrate processing apparatus 500a shown in FIG. 8 and the substrate processing apparatus 500 of the above embodiment will be described.

  In the substrate processing apparatus 500a, an interface transport mechanism IFRc is provided in the substrate transport block 11 so as to be movable in the ± X directions instead of the interface transport mechanisms IFRa and IFRb. In the interface transport mechanism IFRc, hands H3 and H4 for delivering the substrate W are provided up and down. The hands H3 and H4 are driven independently.

  The interface transport mechanism IFRc receives the substrate W placed on the placement / cooling unit P-CP by the hand H3, and carries the substrate W into the substrate carry-in portion 16a of the exposure apparatus 16. Further, the interface transport mechanism IFRc carries out the substrate W after the exposure processing from the substrate carry-out unit 16b of the exposure apparatus 16 by the hand H4, and places the substrate W on the substrate platform PASS2 of the cleaning heating block 10.

  As described above, in the substrate processing apparatus 500a, the hands H3 and H4 of the interface transport mechanism IFRc are independently driven in the substrate transport block 11, and the substrate W before the exposure process is transported by the hand H3, and after the exposure process. The substrate W is transported by the hand H4. Thereby, in the cleaning heating block 10 and the substrate transport block 11, the transport path of the substrate W before the exposure process and the transport path of the substrate W after the exposure process are independently secured. Therefore, the substrate W can be efficiently transferred.

  Further, in the cleaning heating block 10 and the substrate transport block 11, cross contamination between the substrate W before the exposure process and the substrate W after the exposure process is prevented.

(7) Still another embodiment In the above embodiment, the description has been given of the case where the exposure apparatus 16 that performs the exposure process of the substrate W by the immersion method is provided as an external apparatus of the substrate processing apparatus 500, but is not limited thereto. A conventional exposure apparatus that performs the exposure process on the substrate W without using a liquid may be provided as an external apparatus. In this case, the cleaning / drying processing units SD1 and SD2 may not be provided in the cleaning heating block 10. Further, instead of the cleaning / drying processing unit SD1, a back surface cleaning processing unit BC shown below may be provided. In the following description, the surface of the substrate W refers to the surface on which various films are formed, and the back surface of the substrate W refers to the opposite surface.

(7-1) Backside Cleaning Processing Unit FIGS. 9 and 10 are a side view and a schematic plan view showing the configuration of the backside cleaning processing unit BC. FIG. 10 schematically shows some components of the back surface cleaning unit BC.

  As shown in FIGS. 9 and 10, the back surface cleaning processing unit BC includes a spin chuck 700 that holds and rotates the substrate W horizontally. The spin chuck 700 includes a spin motor 701, a rotating shaft 702, a disk-shaped spin plate 703, a plate support member 704, a disk-shaped blocking plate 705, magnet plates 706 a and 706 b, and a plurality of chuck pins 707.

  A spin motor 701 is provided above the back surface cleaning processing unit BC. The spin motor 701 is supported by a motor support member 701s. The motor support member 701 s has a through hole 701 h extending in the vertical direction, and is attached to the motor fixing portion 290.

  A rotating shaft 702 having a cylindrical shape is provided so as to extend downward from the inside of the spin motor 701. The rotation shaft 702 functions as an output shaft of the spin motor 701.

  A plate support member 704 is attached to the lower end of the rotating shaft 702. As will be described later, the plate support member 704 has a cylindrical shape. The spin plate 703 is supported horizontally by the plate support member 704. Under the spin plate 703, a blocking plate 705 is horizontally fixed to the plate support member 704 and the spin plate 703 by fixing members 705a and 705b. A through hole 705 h is formed at the center of the blocking plate 705. When the rotation shaft 702 is rotated by the spin motor 701, the plate support member 704, the spin plate 703, and the blocking plate 705 rotate integrally around the vertical axis.

A fluid supply pipe 710 is inserted through the through hole 701h of the motor support member 701s, the inside of the rotation shaft 702 of the spin motor 701, and the inside of the plate support member 704. The fluid supply pipe 710 has a structure in which a gas supply pipe 712 is accommodated in the guide pipe 711. Gas (N ₂ gas in this example) is supplied to the gas supply pipe 712.

The gas supply pipe 712 is provided such that its tip protrudes slightly downward from the through hole 705 h of the blocking plate 705. Thereby, N ₂ gas can be reliably supplied between the shielding plate 705 and the substrate W. Note that the tip of the gas supply pipe 712 may be fixed to the blocking plate 705.

  A plurality (five in FIG. 6) of chuck pins 707 are provided at equiangular intervals with respect to the rotation shaft 702 on the peripheral edge of the spin plate 703. The number of chuck pins 707 is desirably five or more. The reason will be described later.

  Each chuck pin 707 includes a shaft portion 707a, a pin support portion 707b, a holding portion 707c, and a magnet 720. A shaft portion 707a is provided so as to penetrate the spin plate 703, and a pin support portion 707b extending in the horizontal direction is connected to a lower end portion of the shaft portion 707a. A holding portion 707c is provided so as to protrude downward from the tip portion of the pin support portion 707b. Further, on the upper surface side of the spin plate 703, a magnet 720 is attached to the upper end portion of the shaft portion 707a.

  Each chuck pin 707 is rotatable about a vertical axis around the shaft portion 707 a, and the holding portion 707 c is in contact with the outer peripheral end portion of the substrate W, and the holding portion 707 c is separated from the outer peripheral end portion of the substrate W. It can be switched to an open state in which they are separated. In this example, each chuck pin 707 is closed when the N pole of the magnet 720 is inside, and each chuck pin 707 is opened when the S pole of the magnet 720 is inside.

  Magnet plates 706a and 706b are arranged above the spin plate 703 along the circumferential direction around the rotation shaft 702. The magnet plates 706a and 706b have an S pole on the outside and an N pole on the inside. The magnet plates 706a and 706b are lifted and lowered independently by the magnet lifting mechanisms 713a and 713b, respectively, and between the upper position higher than the magnet 720 of the chuck pin 707 and the lower position substantially equal to the magnet 720 of the chuck pin 707. Moving.

  Each chuck pin 707 is switched between an open state and a closed state by raising and lowering the magnet plates 706a and 706b. Details of operations of the magnet plates 706a and 706b and the chuck pin 707 will be described later.

  A guard 714 for receiving the cleaning liquid scattered from the substrate W is provided outside the spin chuck 700. The guard 714 has a rotationally symmetric shape with respect to the rotation axis 702 of the spin chuck 700. The guard 714 is raised and lowered by a guard lifting mechanism 714a. The cleaning liquid received by the guard 714 is drained or collected by a draining device or a collecting device (not shown).

  Outside the guard 714, three or more (three in this example) substrate transfer mechanisms 730 are arranged at equiangular intervals around the rotation shaft 702 of the spin chuck 700. Each substrate delivery mechanism 730 includes a lifting / lowering rotation driving unit 731, a rotating shaft 732, an arm 733, and a holding pin 734. A rotation shaft 732 is provided so as to extend upward from the ascending / descending rotation driving unit 731, and an arm 733 is coupled so as to extend in the horizontal direction from the upper end portion of the rotation shaft 732. A holding pin 734 for holding the outer peripheral end of the substrate W is provided at the tip of the arm 733.

  The rotating shaft 732 performs the lifting / lowering operation and the rotating operation by the lifting / lowering driving unit 731. Thereby, the holding pin 734 moves in the horizontal direction and the vertical direction.

  Further, a substantially cylindrical back surface cleaning brush 735 is disposed below the back surface cleaning processing unit BC. The back surface cleaning brush 735 is attached to the rotating shaft of the motor 736 and is driven to rotate around the vertical axis. The motor 736 is held by a brush holding member 737. The brush holding member 737 is driven by the brush moving mechanism 738. Accordingly, the cleaning brush 735 moves in the horizontal direction and the vertical direction.

  A cleaning nozzle 739 is attached to a portion of the brush holding member 737 in the vicinity of the cleaning brush 735. A liquid supply pipe (not shown) to which a cleaning liquid is supplied is connected to the cleaning nozzle 739. The discharge port of the cleaning nozzle 739 is directed to the periphery of the cleaning brush 735, and the cleaning liquid is discharged from the discharge port toward the periphery of the cleaning brush 735. In this example, pure water is used as the cleaning water.

  The holding operation of the substrate W by the spin chuck 700 will be described. 11 and 12 are diagrams for explaining the holding operation of the substrate W by the spin chuck 700. FIG.

  First, as shown in FIG. 11A, the guard 714 moves to a position lower than the chuck pin 707. Then, the holding pins 734 of the plurality of substrate transfer mechanisms 730 (FIG. 9) pass below the guard 714 and move below the spin plate 703. The substrate W is placed on the plurality of holding pins 734 by the first central robot CR1 (FIG. 1).

  At this time, the magnet plates 706a and 706b are in the upper position. In this case, the magnetic force lines B of the magnet plates 706a and 706b are directed from the inside to the outside at the height of the magnet 720 of the chuck pin 707. Thereby, the south pole of the magnet 720 of each chuck pin 707 is attracted inward. Accordingly, each chuck pin 707 is opened.

  Subsequently, as shown in FIG. 11 (b), the plurality of holding pins 734 rise while holding the substrate W. As a result, the substrate W moves between the holding portions 707 c of the plurality of chuck pins 707.

  Subsequently, as shown in FIG. 12C, the magnet plates 706a and 706b move to the lower position. In this case, the N pole of the magnet 720 of each chuck pin 707 is attracted inward. Thereby, each chuck pin 707 is closed, and the outer peripheral end portion of the substrate W is held by the holding portion 707 c of each chuck pin 707. Each chuck pin 707 holds the outer peripheral end of the substrate W between adjacent holding pins 734. Therefore, the chuck pin 707 and the holding pin 734 do not interfere with each other. Thereafter, the plurality of holding pins 734 move to the outside of the guard 714.

  Subsequently, as shown in FIG. 12D, the guard 714 moves to a height surrounding the substrate W held by the chuck pins 707. And the back surface washing process of the board | substrate W is performed.

(7-2) Backside Cleaning Processing FIGS. 13 and 14 are side views for explaining the backside cleaning processing of the substrate W. FIG.

As shown in FIG. 13, during the back surface cleaning process of the substrate W, the substrate W is rotated by the spin chuck 700 and N ₂ gas is supplied between the shielding plate 705 and the substrate W through the gas supply pipe 712. As a result, an N ₂ gas airflow is formed between the blocking plate 705 and the substrate W toward the outside from the center of the substrate W. Therefore, the liquid is prevented from adhering to the resist film on the surface of the substrate W.

  In this state, the cleaning brush 735 contacts the back surface of the substrate W while being rotated by the motor 736. Then, the cleaning brush 735 moves between the lower part of the center of the substrate W and the lower part of the peripheral edge, and contacts the entire back surface of the substrate W. Pure water is supplied from the cleaning nozzle 739 to the contact portion between the substrate W and the cleaning brush 735. As a result, the entire back surface of the substrate W is cleaned by the cleaning brush 735, and contaminants attached to the back surface of the substrate W are removed.

  Subsequently, as shown in FIG. 14A, the magnet plate 706a is disposed at the lower position, and the magnet plate 706b is disposed at the upper position. In this case, as shown in FIGS. 14 (a) and 14 (b), in the outer region J1 of the magnet plate 706a (see FIG. 14 (b)), each chuck pin 707 is closed, and the magnet plate 706b In the outer region J2 (see FIG. 14B), each chuck pin 707 is opened. That is, the holding portion 707c of each chuck pin 707 is maintained in contact with the outer peripheral end of the substrate W when passing through the outer region J1 of the magnet plate 706a, and passes through the outer region J2 of the magnet plate 706b. At this time, the substrate W is separated from the outer peripheral end portion.

  Therefore, in the outer region J2 of the magnet plate 706b, the lower surface side portion of the outer peripheral end portion of the substrate W can be cleaned by the cleaning brush 735.

  In this example, at least four of the five chuck pins 707 are located in the outer region J1 of the magnet plate 706a. In this case, the substrate W is held by at least four chuck pins 707 even if the holding portion 707c of each chuck pin 707 is separated from the outer peripheral end portion of the substrate W when passing the outer region J2 of the magnet plate 706b. . Thereby, the stability of the substrate W is ensured.

  After the back surface cleaning process is completed, the magnet plates 706a and 706b are arranged at the lower position, and the substrate W is held by all the chuck pins 707. In this state, the substrate W is rotated at high speed by the spin chuck 700. Thereby, the pure water adhering to the substrate W is shaken off, and the substrate W is dried.

  Thus, in the back surface cleaning processing unit BC, the back surface of the substrate W can be cleaned while preventing the cleaning liquid from adhering to the resist film on the surface of the substrate W. As a result, the state of the resist film can be maintained normally, contaminants attached to the back surface of the substrate W can be removed, and defocusing occurs due to irregularities on the back surface of the substrate W during the exposure process. Can be prevented. Therefore, it is possible to reliably prevent the processing failure of the substrate W from occurring.

  In the case where an exposure apparatus that performs exposure processing of the substrate W without using a liquid is provided as an external apparatus, when the cleaning / drying processing unit SD2 is not provided, the second center robot CR2 is provided in the cleaning heating block 10. It does not have to be. In this case, the interface transport mechanism IFRb of the substrate transport block 11 directly transports the substrate unloaded from the exposure process 16 to the placement / cooling unit P-CP of the cleaning heating block 10.

  Even when the exposure apparatus 16 that performs the exposure process on the substrate W by the immersion method is provided as an external apparatus, the back surface cleaning processing unit BC may be provided in the cleaning heating block 10. In that case, a liquid supply means for supplying a cleaning liquid or a rinsing liquid to the surface of the substrate may be further provided in the back surface cleaning processing unit BC.

(8) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the cleaning heating block 10 and the substrate transport block 11 are examples of the processing transport unit, the indexer block 9 is an example of the loading / unloading unit, and the placement / bake unit P-PEB is an example of the heat treatment unit. The first center robot CR1 and the interface transport mechanism IFRa are examples of the first substrate transport mechanism, and the second center robot CR2 and the interface transport mechanism IFRb are examples of the second substrate transport mechanism.

The cleaning / drying processing unit SD1 is an example of a cleaning processing unit, the cleaning / drying processing unit SD2 is an example of a drying processing unit, the carrier C is an example of a storage container, and the carrier mounting table 40 is a container mounting. The indexer robot IR is an example of a third substrate transport mechanism, and the substrate platform PASS1 is an example of a substrate platform.
Further, the spin chuck 700 is an example of a substrate rotation holding device, the back surface cleaning brush 735 is an example of a cleaning brush, the spin plate 703 is an example of a rotating member, and the spin motor 701 is an example of a rotation driving mechanism, The chuck pin 707 is an example of a holding member.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  The present invention can be used for processing various substrates.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is the schematic side view which looked at the substrate processing apparatus of Drawing 1 from the + X direction. It is the schematic side view which looked at the substrate processing apparatus of Drawing 1 from the -X direction. It is an external appearance perspective view of a mounting and heating unit. It is sectional drawing of the mounting and heating unit in a YZ plane. It is a side view which shows the structure of a washing | cleaning / drying processing unit. It is a figure for demonstrating operation | movement of a washing | cleaning / drying processing unit. It is a top view of the substrate processing apparatus concerning other embodiments of the present invention. It is a side view which shows the structure of a back surface cleaning process unit. It is a schematic plan view which shows the structure of a back surface cleaning process unit. It is a figure for demonstrating holding | maintenance operation | movement of the board | substrate W by a spin chuck. It is a figure for demonstrating holding | maintenance operation | movement of the board | substrate W by a spin chuck. It is a side view for demonstrating the back surface cleaning process of a board | substrate. It is a side view for demonstrating the back surface cleaning process of a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 9 Indexer block 10 Cleaning heating block 11 Substrate conveyance block 16 Exposure apparatus 40 Carrier mounting base 500,500a Substrate processing apparatus P-PEB mounting and baking unit C carrier CR1, CR2 1st and 2nd center robot IFRa, IFRb, IFRc Interface transport mechanism IR Indexer robot SD1, SD2 Cleaning / drying processing unit W substrate

Claims (9)

A substrate processing apparatus disposed adjacent to an exposure apparatus,
A processing transport unit that performs processing on the substrate and delivers the substrate to the exposure apparatus;
A loading / unloading section for loading and unloading the substrate with respect to the processing conveyance section;
The processing transport unit is
A heat treatment unit for heat-treating the substrate after the exposure treatment;
A first substrate transport mechanism for transporting the substrate before exposure processing carried in by the carry-in / carry-out unit to the exposure apparatus;
A second substrate transport mechanism for transporting the substrate after exposure processing from the exposure apparatus to the heat treatment unit;
A cleaning unit which resist film even after the formation of performing the cleaning process on the substrate before the exposure processing see free,
The cleaning unit is
A substrate rotation holding device that rotates while holding the substrate substantially horizontal;
A cleaning brush for cleaning the lower surface of the substrate held by the substrate rotation holding device,
The substrate rotation holding device is
A rotating member provided to be rotatable around a rotation axis along a substantially vertical direction;
A rotation drive mechanism that is provided on the upper side of the rotating member and rotates the rotating member;
A substrate processing apparatus comprising: a holding member that is provided below the rotating member and holds the substrate by contacting an outer peripheral end portion of the substrate disposed on the lower side of the rotating member . The substrate processing apparatus according to claim 1, wherein the cleaning processing unit cleans the surface of the substrate. Wherein the processing conveyor unit, exposure processing substrate processing apparatus according to claim 1, wherein further comprising a drying unit for the substrate to dry processing after. A substrate processing apparatus disposed adjacent to an exposure apparatus,
A processing transport unit that performs processing on the substrate and delivers the substrate to the exposure apparatus;
A loading / unloading section for loading and unloading the substrate with respect to the processing conveyance section;
The processing transport unit is
A heat treatment unit for heat-treating the substrate after the exposure treatment;
A first substrate transport mechanism for transporting the substrate before exposure processing carried in by the carry-in / carry-out unit to the exposure apparatus;
A second substrate transport mechanism for transporting the substrate after exposure processing from the exposure apparatus to the heat treatment unit;
A cleaning unit that performs a cleaning process on the substrate after the formation of the resist film and before the exposure process ;
And a drying process unit for performing a drying process on the substrate after the exposure processing,
The carry-in / carry-out unit, the processing conveyance unit, and the exposure apparatus are arranged in this order along the first direction,
The cleaning processing unit, the heat treatment unit, and the drying processing unit are arranged along a second direction orthogonal to the first direction in a horizontal plane in the processing transport unit,
The heat treatment unit is disposed at a substantially central portion of the processing conveyance unit,
The cleaning unit and the drying process unit, the one side and the other board it is characterized disposed side processing apparatus of the second of the heat treatment unit along the direction. The loading / unloading section is
A container mounting portion on which a storage container for storing a substrate is mounted;
A third substrate transport mechanism for transporting a substrate between the storage container placed on the container placement unit and the processing transport unit;
The processing transport unit further includes a substrate placement unit that is disposed between the first substrate transport mechanism and the carry-in / carry-out unit and temporarily places a substrate thereon,
The third substrate transport mechanism transports the substrate before the exposure process by the exposure apparatus from the storage container to the substrate mounting unit, and transfers the substrate after the exposure process by the exposure apparatus from the heat treatment unit to the storage container. the substrate processing apparatus according to any one of claims 1 to 4, characterized in that for conveying the. An exposure apparatus for performing an exposure process on the substrate;
A substrate processing apparatus disposed adjacent to the exposure apparatus,
The substrate processing apparatus includes:
A processing transport unit that performs processing on the substrate and delivers the substrate to the exposure apparatus;
A loading / unloading unit for loading and unloading the substrate with respect to the processing conveyance unit,
The processing transport unit is
A heat treatment unit for heat-treating the substrate after the exposure treatment;
A first substrate transport mechanism for transporting the substrate before exposure processing carried in by the carry-in / carry-out unit to the exposure apparatus;
A second substrate transport mechanism for transporting the substrate after exposure processing from the exposure apparatus to the heat treatment unit;
A cleaning unit which resist film even after the formation of performing the cleaning process on the substrate before the exposure processing see free,
The cleaning unit is
A substrate rotation holding device that rotates while holding the substrate substantially horizontal;
A cleaning brush for cleaning the lower surface of the substrate held by the substrate rotation holding device,
The substrate rotation holding device is
A rotating member provided to be rotatable around a rotation axis along a substantially vertical direction;
A rotation drive mechanism that is provided on the upper side of the rotating member and rotates the rotating member;
A substrate processing system comprising: a holding member that is provided on a lower side of the rotating member and holds the substrate by contacting an outer peripheral end portion of the substrate disposed on the lower side of the rotating member . An exposure apparatus for performing an exposure process on the substrate;
  A substrate processing apparatus disposed adjacent to the exposure apparatus,
  The substrate processing apparatus includes:
  A processing transport unit that performs processing on the substrate and delivers the substrate to the exposure apparatus;
  A loading / unloading section for loading and unloading the substrate with respect to the processing conveyance section;
  The processing transport unit is
  A heat treatment unit for heat-treating the substrate after the exposure treatment;
  A first substrate transport mechanism for transporting the substrate before exposure processing carried in by the carry-in / carry-out unit to the exposure apparatus;
  A second substrate transport mechanism for transporting the substrate after exposure processing from the exposure apparatus to the heat treatment unit;
  A cleaning unit that performs a cleaning process on the substrate after the formation of the resist film and before the exposure process;
  A drying processing unit that performs drying processing on the substrate after the exposure processing,
  The carry-in / carry-out unit, the processing conveyance unit, and the exposure apparatus are arranged in this order along the first direction,
  The cleaning processing unit, the heat treatment unit, and the drying processing unit are arranged along a second direction orthogonal to the first direction in a horizontal plane in the processing transport unit,
  The heat treatment unit is disposed at a substantially central portion of the processing conveyance unit,
  The substrate processing system, wherein the cleaning processing unit and the drying processing unit are arranged on one side and the other side of the heat treatment unit along the second direction. A method of processing a substrate in a substrate processing apparatus provided with a processing transport unit and a loading / unloading unit and disposed adjacent to an exposure apparatus,
Carrying the substrate on which a resist film is formed into the processing and conveying unit by the carrying-in and carrying-out unit;
Transporting the substrate carried in by the carry-in / carry-out unit to the cleaning processing unit of the processing transport unit by the first substrate transport mechanism of the processing transport unit;
Performing a cleaning process on the substrate transported by the first substrate transport mechanism by the cleaning processing unit;
Transporting the substrate after the cleaning processing by the cleaning processing unit to the exposure apparatus by the first substrate transport mechanism;
Transporting the substrate after the exposure processing by the exposure apparatus to a heat treatment unit of the processing transport unit by a second substrate transport mechanism of the processing transport unit;
And performing a heat treatment on the substrate transported by the second substrate transport mechanism by the heat treatment unit ,
The step of performing the cleaning process by the cleaning processing unit includes:
Rotating while holding the substrate substantially horizontally by the substrate rotation holding device;
Cleaning the lower surface of the substrate held by the substrate rotation holding device with a cleaning brush,
The step of rotating the substrate comprises:
Holding the substrate by bringing a holding member provided on the lower side of the rotating member into contact with an outer peripheral end of the substrate disposed on the lower side of the rotating member;
And a step of rotating the rotating member around a rotation axis along a substantially vertical direction by a rotation driving mechanism provided on the upper side of the rotating member . A method of processing a substrate in a substrate processing apparatus provided with a processing transport unit and a loading / unloading unit and disposed adjacent to an exposure apparatus,
  Carrying the substrate on which a resist film is formed into the processing and conveying unit by the carrying-in and carrying-out unit;
  Transporting the substrate carried in by the carry-in / carry-out unit to the cleaning processing unit of the processing transport unit by the first substrate transport mechanism of the processing transport unit;
  Performing a cleaning process on the substrate transported by the first substrate transport mechanism by the cleaning processing unit;
  Transporting the substrate after the cleaning processing by the cleaning processing unit to the exposure apparatus by the first substrate transport mechanism;
  Transporting the substrate after the exposure processing by the exposure apparatus to a drying processing unit of the processing transport unit by a second substrate transport mechanism of the processing transport unit;
  Performing a drying process on the substrate by the drying processing unit on the substrate transported by the second substrate transport mechanism;
  Transporting the substrate after the drying processing by the drying processing unit to the heat treatment unit by the second substrate transport mechanism;
  And performing a heat treatment on the substrate transported by the second substrate transport mechanism by the heat treatment unit,
  The carry-in / carry-out unit, the processing conveyance unit, and the exposure apparatus are arranged in this order along the first direction,
  The cleaning processing unit, the heat treatment unit, and the drying processing unit are arranged along a second direction orthogonal to the first direction in a horizontal plane in the processing transport unit,
  The heat treatment unit is disposed at a substantially central portion of the processing conveyance unit,
  The substrate processing method, wherein the cleaning processing unit and the drying processing unit are arranged on one side and the other side of the heat treatment unit along the second direction.

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