WO2002069392A1 - Lift type substrate treatment device, and substrate treatment system with the substrate treatment device - Google Patents

Lift type substrate treatment device, and substrate treatment system with the substrate treatment device Download PDF

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Publication number
WO2002069392A1
WO2002069392A1 PCT/JP2002/001583 JP0201583W WO02069392A1 WO 2002069392 A1 WO2002069392 A1 WO 2002069392A1 JP 0201583 W JP0201583 W JP 0201583W WO 02069392 A1 WO02069392 A1 WO 02069392A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
processing apparatus
substrate processing
winding
processing
Prior art date
Application number
PCT/JP2002/001583
Other languages
French (fr)
Japanese (ja)
Inventor
Shigeru Mizukawa
Katsutoshi Nakata
Shunji Matsumoto
Original Assignee
Sumitomo Precision Products Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co., Ltd. filed Critical Sumitomo Precision Products Co., Ltd.
Priority to KR1020027011885A priority Critical patent/KR20020093837A/en
Publication of WO2002069392A1 publication Critical patent/WO2002069392A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Definitions

  • the present invention relates to a processing apparatus for performing predetermined processing while moving (transporting) various substrates such as a semiconductor (silicon) wafer, a liquid crystal glass substrate, a photomask glass substrate, and an optical disk substrate; Also, the present invention relates to a substrate processing system configured by connecting a plurality of processing apparatuses.
  • a processing apparatus for performing each of the above-described processes there is a processing apparatus configured to place a substrate on a transport roller and perform the process while transporting the substrate in a horizontal direction by the transport roller. Further, there is known a substrate processing system as shown in FIG. 10 which is configured by connecting each processing apparatus in order to continuously perform each of the above processes.
  • FIG. 10 is a plan view showing a schematic configuration of a conventional substrate processing system.
  • the substrate processing system 200 includes a substrate loading / unloading section 201, It comprises a substrate processing section 205 and a substrate transport section 210.
  • the substrate loading / unloading section 201 includes a mounting table 202 on which a cassette 230 containing a plurality of substrates is mounted, and a cassette 203 mounted on the mounting table 202. From the transfer device 204, which takes out the substrates one by one and puts them into the substrate processing unit 205, takes out the processed substrate from the substrate processing unit 205, and stores it in the cassette 203. Become.
  • the transfer device 204 is usually composed of a robot that can move in the longitudinal direction of the mounting table 202.
  • the substrate processing unit 205 is composed of two processing lines of a first processing unit 206 and a second processing unit 207 arranged side by side in parallel with each other, a first processing unit 206 and
  • the second processing unit 200 includes a plurality of transport rollers 208 that transport the substrate in the directions indicated by arrows, respectively. Is performed.
  • the first processing unit 206 is a processing unit for etching a substrate, and an etching liquid is applied to the substrate being transported.
  • the second processing unit 2007 includes a washing processing unit 2007 a and a drying processing unit 2007 b. In the washing processing unit 107 a, cleaning water is supplied to the substrate, and the drying processing unit 200. At 7b, a drying gas is supplied to the substrate.
  • the substrate transport unit 210 is means for transporting the substrate processed by the first processing unit 206 to the second processing unit 206, and transporting the substrate discharged from the first processing unit 206.
  • a direction switching device 2 1 1 that switches the direction and transports, a plurality of transport rollers 2 1 2 that transports the substrate discharged from the direction switching device 2 1 1 in the discharge direction, and a transport roller 2 1 2
  • a direction switching device 213 for transferring the transferred substrate to the second processing unit 207 by switching the transfer direction thereof.
  • the direction switching device 211 transports the substrate K in the same transport direction in the same horizontal plane as the transport surface of the transport rollers 208 forming the first processing unit 206.
  • a second conveying roller pair 2 16 The second transport rollers 2 16 facing each other can move in directions approaching and moving away from each other.
  • reference numeral 217 denotes a stopper for stopping the movement of the substrate K.
  • the substrate K discharged from the first processing section 206 is moved forward until the substrate K comes into contact with the stopper 211 by the first transport roller 214. Conveyed in the discharge direction.
  • the lifter 2 15 is submerged downward from the transport surface of the first transport roller 2 14.
  • the lifter 2 15 projects upward from the transport surface of the first transport roller 2 14, whereby the substrate K is raised to the position shown by the two-dot chain line in FIG.
  • the second transport rollers 2 16 are at positions separated from each other. Then, after the second transport rollers 2 16 move to a position where they approach each other, the lifters 2 15 descend.
  • the substrate K is in a state of being supported by the second transport rollers 2 16, and thereafter, the direction orthogonal to the transport direction of the first transport rollers 2 14 by the second transport rollers 2 16, that is, The sheet is conveyed and discharged to the conveying roller 2 12 side. In this way, the transport direction of the substrate K is switched.
  • the direction switching device 2 13 has substantially the same configuration as the above-described direction switching device 2 11, and cuts the substrate K transported by the transport rollers 2 12 in the transport direction. Instead, it is conveyed to the second processing section 207.
  • a first processing unit 206, a substrate transfer unit 210, and a second processing unit 207 are arranged in an inverted C shape in plan view. Then, the substrate K taken out of the cassette 203 by the transfer device 204 is first put into the first processing unit 206. Next, the substrate K is subjected to a predetermined process (etching process) while being transported in the first processing section 206 in the direction indicated by the arrow, and then the transport direction is switched in the substrate transport section 210 to be carried out. Input to 2 processing unit 2007. Then, the substrate K is subjected to predetermined processing (washing processing and drying processing) while being transported in the second processing section 2007 in the direction of the arrow, and then is transferred to the cassette 204 again by the transfer device 204. Stored in 3.
  • etching process etching process
  • predetermined processing washing processing and drying processing
  • the accuracy is reduced.
  • a flange portion 208a is formed on rollers at both ends of the transport roller 208, and the substrate K being transported by the flange portion 208a is formed.
  • the attitude of is controlled. This is the same for the first transport roller 214 and the second transport roller 216.
  • the flange portion 208a becomes an obstacle, and the transport direction of the substrate K cannot be switched within the transport surface of the transport roller 208. Therefore, in the above-described direction switching devices 211 and 213, the substrate K is lifted above the upper end of the flange portion 208a to switch its transport direction. In addition, in the substrate transport unit 210 configured to raise and lower the substrate K for the above reason, the substrate K cannot be processed in the same unit, and therefore, only the substrate is transported.
  • the cleaning liquid ejected from the nozzle is strongly applied to the cleaning liquid, and the cleaning liquid is not applied to the cleaning liquid, and the cleaning effect becomes uneven.
  • the processing on the substrate K is not performed in the substrate transfer unit 210 as described above.
  • the second processing unit 20 The degree of progress of the etching varies depending on the variation of the transfer time to 7, and the etching cannot be controlled with high precision. Since the substrate transport unit 210 has a complicated operation mechanism including a mechanism for moving the substrate K up and down and a mechanism for moving the second transport roller 2 16, it is extremely difficult to control the transport time with high precision. is there.
  • the final step of the first processing unit 206 is a cleaning step
  • the substrate K is transported without being dried, uneven drying or stains may occur on the surface, and the substrate K may become unclean. It will be a good product.
  • the two processing lines of the first processing unit 206 and the second processing unit 207 are arranged in parallel, so that the installation efficiency of the apparatus is poor. There is also a problem.
  • the present invention has been made in view of the above circumstances, and has a function of transporting a substrate from one processing line to another processing line, and can perform processing on a substrate being transported.
  • Substrate processing apparatus and the same It is an object of the present invention to provide a substrate processing system provided with: Disclosure of the invention
  • the present invention for solving the above-mentioned problems, a housing-like cover integrated with a vertically arranged substrate input port and a substrate discharge port,
  • a processing mechanism comprising: a support base for supporting the support means; and a processing fluid output means disposed above the transfer and support means and discharging a processing fluid onto a substrate supported by the transfer and support means.
  • An up-and-down type substrate processing apparatus characterized in that the processing mechanism is provided with an elevating mechanism for supporting the processing mechanism and moving the processing mechanism up and down and passing the processing mechanism through the substrate inlet and the substrate outlet.
  • the processing mechanism is moved up and down by the elevating mechanism so as to pass through the substrate input port and the substrate discharge port. Then, the processing mechanism receives the substrate discharged from the processing unit in the preceding process from the substrate input port when passing through the substrate input port, supports the substrate, and moves the substrate to the substrate output port. During this time, the processing fluid is discharged from the processing fluid discharging means onto the substrate. As a result, the substrate is subjected to a predetermined process, and after the process, the substrate is discharged and transferred from the substrate discharge port to the processing unit in the next process.
  • the entire processing mechanism including the transport-supporting means for supporting the substrate and the processing fluid discharging means for discharging the processing fluid onto the supported substrate is raised and lowered. Therefore, the positional relationship between the substrate and the processing fluid discharge means does not change when the substrate is transported, and thus, for example, when cleaning the substrate, the cleaning liquid discharged from the processing fluid discharge means is not changed. It can be supplied almost evenly to each part on the substrate, and uniform cleaning can be performed.
  • the substrate can be transferred by a single operation of raising and lowering the processing mechanism by the lifting mechanism, the speed can be easily controlled. Therefore, even when performing processing such as etching, it is possible to control this with high precision.
  • the processing fluid includes a developing solution, an etching solution, a stripping solution for stripping a resist film, a cleaning water for cleaning, and a gas for drying.
  • a developing solution an etching solution
  • a stripping solution for stripping a resist film
  • a cleaning water for cleaning a cleaning water for cleaning
  • a gas for drying a gas for drying.
  • Various types of fluids are included, and it is possible to supply such various types of processing fluids to the substrate and process them.
  • transporting / supporting means may be configured to, after receiving the substrate, repeatedly move the received substrate back and forth in the direction of loading and discharging the substrate.
  • the processing fluid discharged from the processing fluid discharging means can be almost uniformly supplied to each part on the substrate.
  • there may be irregularities such as a high pressure area and a low pressure area. In such a case, it is not possible to perform a strictly uniform treatment on the substrate.
  • the back-and-forth movement of the substrate causes the processing fluid to hit the substrate. Pressure unevenness is averaged, and a uniform treatment can be performed on the substrate.
  • the cover body is divided into two chambers, a driving chamber and a processing chamber, in a loading and discharging direction of the substrate by a partition member.
  • the processing chamber having the substrate discharge port is provided with the processing mechanism, while the driving chamber is provided with the elevating mechanism,
  • An opening for communicating the processing chamber and the driving chamber is formed along the vertical direction of the partitioning member
  • Both edges of the opening formed in the partition member along the up-down direction are respectively formed in a tubular shape, and the pair of tubular portions are provided with surfaces facing each other in an upward and downward direction. Notch grooves are formed along In the processing mechanism, the support base is connected to the lifting mechanism by a connecting tool provided in an opening of the partitioning member.
  • the connecting member is a band-shaped sheet member disposed between the pair of cylindrical portions and extending upward and downward from the connecting member. Are connected to the sheet bodies inserted into the cylindrical portion from the notch grooves, respectively.
  • the drive chamber and the processing chamber may be configured to be partitioned by the partition member, the connecting member, and the sheet member.
  • the developing solution, etching solution, stripping solution and the like contained in the processing fluid are highly corrosive, and if they adhere to the elevating mechanism, the elevating mechanism may be damaged and its function may be impaired. Therefore, as described above, if the driving chamber in which the lifting mechanism is disposed and the processing chamber in which the processing mechanism is disposed are partitioned by the partition member, the connecting member, and the sheet, the processing chamber is used. The processing fluid can be prevented from entering the driving chamber, and the processing fluid can be prevented from damaging the elevating mechanism.
  • the upper and lower edges of the opening provided in the partitioning member are formed in a cylindrical shape, and both side edges of the sheet body arranged to extend above and below the connecting tool are formed by:
  • the opening, the connecting member, and the sheet body may have a configuration in which a plurality of these are provided.
  • the processing fluid that has entered the cylindrical portion from the gap between the sheet body and the cutout groove can be exhausted by the exhaust unit. Intrusion of the processing fluid into the chamber can be more reliably prevented.
  • the sheet body can be formed in an endless annular shape.
  • winding Z unwinding mechanisms for winding up and unwinding the sheet body are provided on the upper side and the lower side of the sheet body, respectively, according to the movement of the sheet body raised and lowered by the lifting mechanism.
  • the above-described sheet body may be configured to be wound and fed by the winding / unwinding mechanism.
  • the unwinding mechanism includes a winding shaft for winding the sheet body, and a driving unit for rotating the winding shaft, and further includes: a driving unit that rotates the winding shaft in the feeding direction. May be configured such that only braking force is applied to the winding shaft, while power is transmitted to the winding shaft via a friction clutch when the winding shaft is rotated in the winding direction. .
  • the sheet can be wound and unwound without causing slack in the sheet body.
  • the driving means comprises: a passive gear connected to the winding shaft; a driving gear coupled to the passive gear; a friction clutch connected to the driving gear; and a rotating shaft connected to the friction clutch.
  • Two one-way clutches respectively connected to both ends of the rotating shaft and allowing rotation of the rotating shaft in only one direction; and a pulley connected to the rotating shaft via one of the one-way clutches.
  • the first substrate processing apparatus and the second substrate processing apparatus that perform processing while moving the substrate substantially horizontally are arranged vertically above and below the first substrate processing apparatus.
  • the substrate discharge unit of the vertical substrate processing apparatus is connected to the substrate input port of the vertical substrate processing apparatus, and the substrate input section of the second substrate processing apparatus is connected to the substrate discharge port of the vertical substrate processing apparatus.
  • the first substrate processing apparatus and the second substrate processing apparatus can be sequentially constructed.
  • Substrate processing system that requires less installation space compared to the conventional processing systems described above, which are arranged side by side in the same horizontal plane BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 is a front view showing a schematic configuration of a substrate processing system according to a preferred embodiment of the present invention
  • FIG. 2 is a plan view thereof
  • FIG. 3 is a front sectional view thereof
  • FIG. 4 is a front sectional view showing the cleaning apparatus according to the present embodiment
  • FIG. 5 is a plan sectional view of the elevation type substrate processing apparatus shown in FIG.
  • FIG. 6 is a cross-sectional plan view of the elevating type substrate processing apparatus shown in FIG.
  • FIG. 7 is an enlarged plan sectional view showing the winding Z feeding structure according to the present embodiment.
  • FIG. 8 is a plan view showing a schematic configuration of a substrate processing system according to another embodiment of the present invention
  • FIG. 9 is a side view in the direction of arrow IV in FIG. FIG.
  • FIG. 10 is a plan view showing a schematic configuration of a substrate processing system according to a conventional example.
  • FIG. 11 is a front view showing a transport roller according to a conventional example.
  • FIG. 1 is a schematic diagram showing a schematic configuration of a direction switching device according to a conventional example.
  • FIG. 3 is also a cross-sectional view taken along the line I-I in FIG. In FIGS. 3 to 7, hatching to the cross-sectional portions is omitted.
  • the substrate processing system 1 of the present example includes a substrate input Z discharge section 2, a first substrate processing apparatus 6 and a second substrate processing apparatus 7, which are arranged vertically. And an elevating type substrate processing apparatus 10.
  • the substrate loading / unloading section 2 includes a mounting table 4 on which a cassette 5 containing a plurality of substrates is mounted, and a substrate 5 which is removed from the cassette 5 mounted on the mounting table 4 one by one.
  • a transfer device (3) that puts the substrate into the substrate processing device (6), removes the processed substrate from the second substrate processing device (7), and stores it in the cassette (5).
  • the transfer device 3 is composed of a robot that can move in the longitudinal direction (the direction of the arrow) of the mounting table 4.
  • the cassette 5 is transferred by a transfer device such as an AGV (not shown).
  • the first substrate processing apparatus 6 and the second substrate processing apparatus 7 each include a plurality of transport rollers 208 as illustrated in FIG. 11 for transporting a substrate in the direction indicated by an arrow. A predetermined process is performed while the substrate is being transported.
  • the first substrate processing apparatus 6 is configured to perform an etching process on a substrate
  • the second substrate processing apparatus 7 is configured to perform a cleaning process and a drying process on a substrate.
  • the elevating type substrate processing apparatus 10 includes a casing-shaped cover body 11 and a processing mechanism disposed in the cover integrated body 11. 20 and an elevating mechanism 40.
  • the cover 11 has an opening 11 a communicating with the first substrate processing apparatus 6 and an opening 11 b communicating with the second substrate processing apparatus 7. Further, the cover body 11 is supported by columns 12, and the interior thereof is partitioned into a processing chamber A in which the processing mechanism 20 is disposed and a drive chamber B in which the elevating mechanism 40 is disposed. I have.
  • the processing mechanism 20 includes a cleaning device 22 and a support base 21 that supports the cleaning device 22.
  • the cleaning device 22 includes a housing-like cover 23 provided with an opening 23 a on one side for carrying in and discharging the substrate K, and a cover 23 inside the cover 23.
  • the transport roller 26 has the same configuration as the transport roller 208 shown in FIG.
  • the transport roller 26 closest to the opening 23 a is provided with a nip roller 27 that abuts on the upper portion and nips the substrate K.
  • the substrate is carried in from the opening 23a and discharged from the opening 23a by the forward and reverse rotation of the transport roller 26 and the nipple roller 27.
  • Each of the nozzles 29 is fixed to a supply pipe 28 connected to a cleaning liquid supply source (not shown), and discharges the cleaning liquid supplied through the supply pipe 28 toward the upper surface of the substrate K.
  • the nozzles 30 are fixed to a supply pipe 31 connected to the cleaning liquid supply source, and discharge the cleaning liquid supplied through the supply pipe 28 toward the lower surface of the substrate K. I do.
  • 32 is the substrate K It is a sensor that detects the presence or absence.
  • a liquid collecting tank 24 is provided at the lower end of the cover 23 and communicates with each other through an opening 23 b.
  • the cleaning liquid discharged from the nozzles 29 and 30 is used for collecting the cleaning liquid. It is collected in the tank 24 and discharged as appropriate through the discharge pipe 25.
  • a frame 17 formed of a square pipe and formed in a vertical lattice is provided upright, and the frame 17 is provided with the elevating mechanism 40.
  • the frame 17 is attached to the column 12 via a bracket 18.
  • the elevating mechanism 40 includes: an elevating platform 44 connected to the support base 13 via connecting tools 55, 56 and 57, 58; A pair of guide rails 45 arranged side by side on the processing chamber A side are movably engaged with the respective guide rails 45 along the guide rails 45, and are fixed to the lift table 44.
  • the driving chamber B and the processing chamber A are partitioned by partitioning members 11a, 14 and 16. Openings are formed between the partitioning members 11a and 14 and between the partitioning members 14 and 16 respectively, and the connecting members 55 and so as to be located in the respective openings. 56 and 57, 58 are provided. Further, both side edges 15 of the partitioning member 14 forming each opening are formed in a cylindrical shape along the same, and are formed at the respective edges of the partitioning members 11a and 16 opposed thereto. Is The cylindrical members 13 are fixed along these. Further, notched grooves are formed on the opposed surfaces of the tubular portion 15 on both side edges of the partition member 14 and the tubular member 13 along the vertical direction.
  • strip-shaped sheet bodies 65, 66 are respectively provided along the tubular members 13.
  • the sheet members 65, 66 are inserted into the cylindrical portion 15, the cylindrical member 13, respectively, from the notch grooves at both side edges thereof, and are connected by connecting members 55, 56 and 57, 58. They are fixed to these while being sandwiched from the front and back.
  • the upper ends and lower ends of the sheets 65, 66 are wound by a winding mechanism 70, which will be described later.
  • the gas inside the cylindrical portion 15 and the cylindrical member 13 is exhausted by an appropriate exhaust means (not shown).
  • a Teflon sheet having excellent friction resistance and corrosion resistance was used for the sheet bodies 65 and 66.
  • the material is not limited to this, and other materials such as stainless steel can be used.
  • the driving chamber B and the processing chamber A are substantially composed of the partition members 11 a, 14, 16, the cylindrical members 13, 13, and the connecting members 55, 56, 57. , 58, and sheet bodies 65, 66.
  • a drive motor 60 is attached to the lift 44, and a balancer 50 is connected to the drive motor 60.
  • the drive motor 60 is fixed to the elevator 44 via a bracket 62, and drives the transport roller 26 of the cleaning device 22 via a transmission belt 61.
  • the balancer 50 has a guide rod 51 fixed to the frame 17 so as to be parallel to the guide rail 45, and a guide rod movably along the guide rod 51.
  • the main body 52 is engaged with the drop 51 and is also engaged with the lift table 44.
  • the winding Z feeding mechanism 70 is provided on both the upper and lower portions of the frame 17. Specifically, as shown in FIG. 72, 76, a drive shaft 71 connected to both of the winding shafts 72, 76, a gear 85 for driving the drive shaft 71, and the like.
  • the winding shafts 72 and 76 are rotatably supported by brackets 75 and 79, respectively.
  • the end of the sheet body 66 is sequentially wound on the winding shaft 72 via guide rollers 73 and 74 which are supported by the bracket 75 in a rotating manner, and the sheet is taken up.
  • the end of the body 65 is wound around the winding shaft 76 via guide rollers 77 and 78 rotatably supported by the bracket 9 in order.
  • the gear 85 is fixed to a torque keeper 86 as shown in FIG.
  • the torque cap 86 is passed through a rotating shaft 81, and the rotating shaft 81 is supported by a bearing 90 fixed to a bracket 84 and a one-way clutch 87.
  • a pulley 80 is fixed to an end of the rotating shaft 81 via a one-way clutch 88.
  • the gear 85 is combined with a gear 89 fixed to the drive shaft 71.
  • the one-way clutches 87 and 88 have a function of regulating the rotation direction of the rotating shaft 81. In this example, in the case of the winding / unwinding mechanism 70 provided at the upper part, the rotation of the rotating shaft 81 in the direction of arrow E is restricted, while the rotation in the direction of arrow F is permitted.
  • the torque keeper 86 is a so-called friction clutch, and applies a predetermined braking force (braking force) to the rotating shaft 81.
  • an endless transmission belt 82 is wound around the pulleys 80 provided on the upper and lower sides, and the transmission belt 82 is It is held by a holder 83 fixed to 42.
  • the substrates K are sequentially taken out of the cassette 5 by the transfer device 3 and put into the first substrate processing device 6.
  • the loaded substrate K is subjected to a predetermined process (etching process) while being conveyed in the direction indicated by an arrow in the first substrate processing apparatus 6, and is sequentially discharged from the first substrate processing apparatus 6.
  • the ejected substrate K then passes through the opening 11 a and the opening 23 a of the elevating type substrate processing apparatus 10, enters the cleaning apparatus 22 sequentially, and is internally moved by the action of the transport rollers 26.
  • the cleaning liquid is discharged from the nozzles 29 and 30 to start the cleaning of the substrate K.
  • the rotation of the transport roller 26 is continuously switched forward and reverse so that the substrate K moves back and forth by a predetermined distance in the loading / unloading direction.
  • the unevenness on the upper surface of the substrate K is averaged by moving the substrate K back and forth.
  • the substrate K can be washed evenly.
  • the transmission belt 82 connected to the nut 42 via the holder 83 rotates in the direction of arrow C.
  • the connecting members 55, 56 and 57, 58 are lowered, the sheet members 65, 66 fixed to the connecting members 55, 66 move downward together with the winding member provided at the upper part.
  • the sheet bodies 65, 66 are unwound from the Z unwinding mechanism 70, and the sheet bodies 65, 66 are wound by a winding unwinding mechanism 70 provided at a lower portion.
  • FIG. 7 is a cross-sectional plan view of the winding / unwinding mechanism 70 provided at the upper part and the lower part.
  • the connecting members 57 and 58 and the sheet body 66 will be described with reference to the drawings, but the same applies to the connecting members 55 and 56 and the sheet body 65.
  • the winding / unwinding mechanism 70 provided on the upper part will be described.
  • the connecting members 57, 58 are lowered, tension is generated in the sheet body 66, and rotational power is applied to the winding shaft 72 in the direction indicated by the arrow H.
  • This rotating power is transmitted to a drive shaft 71 connected to a winding shaft 72, a gear 88 fixed thereto, a gear 85 combined with the gear 88, and a torque keeper 86 fitted with the gear 85 in order.
  • the rotation of the rotating shaft 81 in the direction indicated by the arrow E is restricted by the one-way clutch 87, the rotation in the same direction is prevented. Therefore, the tension generated in the sheet body 66 gradually increases, and the torque transmitted to the torque keeper 86 increases.
  • the torque keeper 86 allows the gear 85 to rotate in the torque acting direction when the torque acting on the gear 85 becomes larger than a predetermined magnitude.
  • the gear 85 rotates in the direction indicated by the arrow E
  • the gear 88, the drive shaft 71 and the winding shaft 72 rotate in the direction indicated by the arrow H, so that the sheet body 66 unwinds from the winding shaft 72. Will be issued.
  • the sheet body 66 is fed out with a predetermined tension, there is no slack when the sheet body 66 is fed out.
  • the pulley 80 receives rotational power in the direction of arrow E, but the pulley 80
  • the pulley 80 is rotatable in the direction of arrow E with respect to the rotating shaft 81 by a one-way clutch 88 interposed between the rotating shaft 81 and the pulley 80. It rotates in the direction of arrow E following the belt 82.
  • the one-way clutch 88 regulates the rotation of the rotating shaft 81 in the direction of arrow E, but the rotation in the direction of arrow F allows this.
  • the one-way clutch 88 is rotatable in the direction indicated by the arrow E with respect to the rotating shaft 81.
  • the winding Z feeding mechanism 70 provided at the lower portion will be described.
  • the winding / unwinding mechanism 70 provided at the lower portion when the nut 42 descends and the transmission belt 82 rotates in the direction of the arrow C, the pulley 82 receives rotational power in the direction of the arrow E.
  • the one-way clutches 87 and 88 restrict the rotation of the rotating shaft 81 in the direction of arrow F, while the arrow E Rotation in the direction allows this.
  • the rotating shaft 81 when the pulley 82 receives rotational power in the direction indicated by the arrow E, the rotating shaft 81 is in the same direction. Rotate in the direction.
  • the rotating shaft 81 rotates in the direction indicated by the arrow E, its rotational power is transmitted to the drive shaft 71 and the winding shaft 72 via the torque keeper 86, gear 85 and gear 88, and these are transmitted by the arrow.
  • the sheet body 6 6 is rotated in the direction H shown in FIG.
  • the diameter of the winding shaft 72 and the diameter of the pulley 80 are set such that the winding speed of the winding shaft 72 is faster than the moving speed of the sheet body 66 and the transmission belt 82.
  • the gear ratio between gear 85 and gear 88 is set.
  • the gear 85 and the rotary shaft 81 slip, and the rotary shaft 81 follows the pulley 80 and rotates in the direction of arrow E without any trouble.
  • the sheet body 66 since the sheet body 66 is wound in a state where a predetermined tension is generated, the sheet body 66 does not loosen during winding.
  • the sheets 65, 66 can be wound and unwound without any slack when the cleaning device 22 is lowered. Can be.
  • the loaded substrate K is subjected to predetermined processing (water washing processing and drying processing) while being transported in the direction of the arrow, and the discharged substrate K after the processing is transferred. It is stored in the cassette 5 again by the device 3.
  • predetermined processing water washing processing and drying processing
  • the substrates K stored in the cassette 5 are sequentially converted into the first substrate processing device 6, the elevating substrate processing device 10 and the second substrate processing device. By passing through 7, predetermined processing is performed and stored in the cassette 5 again.
  • the first substrate processing apparatus 6 and the second substrate processing apparatus 7 are vertically arranged side by side, and these are vertically movable substrate processing apparatuses 10.
  • the first substrate processing apparatus 6 and the second substrate processing apparatus 7 have a smaller installation space compared to the conventional processing system 200 in which the first substrate processing apparatus 6 and the second substrate processing apparatus 7 are juxtaposed in the same horizontal plane. It is possible to install this efficiently.
  • the entire cleaning apparatus 22 including the transport rollers 26 for transporting and supporting the substrate K and the nozzles 29 and 30 for discharging the cleaning liquid onto the substrate K is raised and lowered.
  • the positional relationship between the substrate K and the nozzles 29 and 30 does not change, and therefore, the cleaning liquid discharged from the nozzles 29 and 30 is not changed. Can be almost uniformly supplied to each part of the substrate K, whereby uniform cleaning can be performed.
  • the substrate K is transported by a single operation of raising and lowering the cleaning device 22 by the elevating mechanism 40, and a high accuracy comprising the servo motor 43, the ball screw 41, and the nut 42. Since it is raised and lowered by a controllable mechanism, its speed can be controlled with high accuracy.
  • the etchant used in the first substrate processing apparatus 6 is extremely corrosive, and the cleaning water containing the etchant flows out of the cleaning apparatus 22 and moves up and down. If it adheres to the structure 40, it may be damaged and its function may be impaired.
  • the driving chamber B in which the elevating mechanism 40 is disposed and the processing chamber A in which the cleaning device 22 is disposed are divided into partitioning members 1 1 a, 1 4, 16, cylindrical members 13, 13, couplers 55, 56, 57, 58, and sheets 65, 66, so they flow out of the cleaning device 22 It is possible to prevent the etched etching liquid from entering the driving chamber B, and prevent the lifting mechanism 40 from being damaged by the etching liquid.
  • a tubular portion 15 and a tubular member 13 are provided at the vertical edges of the opening formed between the partition members 1 la, 14, 16, respectively, and the connecting members 55, 56, and 5 are provided.
  • a so-called labyrinth in which both side edges of the sheet bodies 65, 66 fixed to 7, 58 are inserted into cutout grooves formed in the cylindrical portion 15 and the cylindrical member 13, respectively. Since the structure is employed, and the inside of the cylindrical portion 15 and the cylindrical member 13 is exhausted by the exhaust means, the intrusion of the etching solution into the drive chamber B can be reliably prevented.
  • the sheet bodies 65 and 66 are wound up and fed out by the winding / unwinding mechanism 70 in accordance with the elevation of the cleaning device 22.
  • the sheet bodies 65 and 66 can be formed endlessly and annularly, and they can be configured to rotate as the cleaning device 22 moves up and down.
  • the cleaning is performed in the liftable substrate processing apparatus 10, but the present invention is not limited to this, and etching or other processing may be performed. This is the same for the first substrate processing apparatus 6 and the second substrate processing apparatus 7.
  • the substrate processing system 100 is composed of a substrate input / output unit 101, a dry processing unit 110, and a cleaning device 120.
  • Substrate loading Z discharge section 101 mounts a cassette 1 3 1 containing multiple substrates And a transfer device 103 for transferring the substrate.
  • the transfer device 103 is provided so as to be movable along a track 104 along the longitudinal direction thereof. It consists of on-board robot 105.
  • the transfer robot 105 has a hand that can be moved to an arbitrary position in the three-dimensional space, and the substrate is placed on the hand. Substrates are taken out one by one and put into the dry processing unit 110, or the substrate discharged from the dry processing unit 110 is put into the cleaning device 120 and discharged from the cleaning device 120. A process is performed to store the loaded board in cassette 13 1 again. Note that the cassette 1311 is carried into the mounting table 102 by the automatic transport vehicle 130 and is carried out from the mounting table 102.
  • the dry processing section 110 includes a mounting table 113 for transferring the substrate, and two dry processing apparatuses 111 for performing a dry process such as dry etching and film formation on the substrate. It is composed of a transfer robot 1 1 2 arranged between the table 1 1 3 and the dry processing apparatus 1 1 1.
  • the transfer robot 112 has a hand that can be moved to an arbitrary position in a three-dimensional space in the same manner as the transfer robot 105, and the transfer robot 112 has a substrate mounted on the hand.
  • the substrate on the mounting table 1 1 3 is put into the dry processing apparatus 1 1 1, and then the substrate is taken out from the dry processing apparatus 1 1 1 and placed on the mounting table 1 1 3.
  • the cleaning device 120 has a housing-like cover body, and the inside thereof is provided with a substrate receiving part 121, a substrate lowering and conveying part 122, and a brush cleaning part 123.
  • the transfer robot has a configuration in which the transfer robot is divided into a plurality of regions including a tilt rinsing unit 124, a substrate raising / conveying unit 125, a substrate drying unit 126, and a substrate discharging unit 127.
  • the substrate is carried into the substrate receiving portion 121 by 105, and the substrate is discharged from the substrate discharging portion 127.
  • Substrate receiving section 1 2 1, Substrate lowering transport section 1 2 2, Brush cleaning section 1 2 3, Inclined rinsing section 1 2 4, Substrate ascending transport section 1 2 5, Substrate drying section 1 2 6, and Substrate unloading section 1
  • Each of the substrates 27 has a plurality of transport rollers 208 as shown in FIG. 11, and the substrate carried into the substrate receiving portion 121 is transported in the direction of the arrow by the transport rollers 208.
  • 1 2 2 brush cleaning section 1 23, Inclined rinsing unit 124, Substrate lifting / conveying unit 125, Substrate drying unit 126
  • the substrate is conveyed to the substrate unloading unit 127 in order.
  • the brush cleaning section 123, the inclined rinsing section 124, the substrate ascending transport section 125, and the substrate drying section 126 perform predetermined processing while transporting the substrate by the transport roller 208. Do.
  • the substrate ascending and transporting section 125 has substantially the same configuration as the above-described elevating type substrate processing apparatus 10.
  • the brush cleaning section 123 the substrate is cleaned by a rotating brush that supplies cleaning water, and in the inclined rinsing section 124, cleaning water is supplied to the upper surface of the substrate that is inclined. This is cleaned, and in the substrate ascending and transporting section 125, the same cleaning as in the above-described elevating type substrate processing apparatus 10 is performed, and in the substrate drying section 126, the substrate is blown with a gas for drying. The substrate is dried.
  • the substrate tilted by the inclined rinsing unit 124 may be returned to the horizontal position by the substrate rising / conveying unit 125, even if the substrate is returned to the horizontal position by the inclined rinsing unit 124. Either way may be used.
  • the substrates in the cassette 13 1 mounted on the mounting table 102 are removed one by one by the transfer robot 105. Then, after being put into the dry processing unit 110, it is put into the cleaning device 120, or is put into the cleaning device 120, and then put into the dry processing unit 110.
  • the substrate put into the cleaning device 120 after being put into the dry processing unit 110 will be described.
  • the substrate put into the dry processing unit 110 is transferred to the dry processing unit.
  • the robot is put into the dry processing device 111 by the robot 112, and a predetermined dry process is performed.
  • the substrate processed by the dry processing apparatus 111 is taken out by the transfer robot 112 and transferred to the transfer robot 105 via the mounting table 113.
  • the wafer is put into the cleaning device 120 through the transfer port 105, and the substrate receiving portion 121, the substrate lowering / transporting portion 122, the brush cleaning portion 122, and the inclined rinsing portion 1 are provided.
  • board ascending transport section 1 2 5 board drying section 1 2 6 and board unloading
  • Predetermined cleaning is performed while the paper is sequentially passed through and transported to the part 127.
  • the substrate is taken out of the substrate unloading part 127 by the transfer robot 105, and is stored again in the cassette 131. .
  • the lifting type substrate processing apparatus and the substrate processing system including the same according to the present invention can reduce the installation space as compared with the related art, and are suitable as an apparatus for processing a large-sized substrate.

Abstract

A lift type substrate treatment device having a function to transfer a substrate from one to the other side of a treatment line and capable of treating the substrate during transfer, and a substrate treatment system having the lift type substrate treatment device; the lift type substrate treatment device, comprising a cabinet-like cover body (11) having a substrate inlet (11a) and a substrate outlet (11b) provided therein parallel with each other in vertical direction, a transfer supporting means forming a treatment mechanism (20) installed in the cover body (11), supportedly accepting the substrate carried in from the substrate inlet (11a), and discharging the substrate from the substrate outlet (11b), a support frame (21) for supporting the transfer/supporting means, the treatment mechanism (20) disposed above the transfer/supporting means and having a treatment fluid discharge means for discharging the treatment fluid onto the substrate, and a lifting mechanism (40) for supportedly lifting the treatment mechanism (20) in vertical direction to move the treatment mechanism (20) to the substrate inlet (11a) and the substrate outlet (11b).

Description

明 細 書 昇降式基板処理装置及びこれを備えた基板処理システム 技術分野  Elevating substrate processing apparatus and substrate processing system provided with the same
この発明は、 半導体 (シリコン) ウェハ, 液晶ガラス基板, フォ トマス ク用ガラス基板, 光ディスク用基板などの各種基板に対し、 これを移動さ せながら (搬送しながら) 所定の処理を行なう処理装置、 並びに複数の処 理装置を連結して構成される基板処理システムに関する。 背景技術  The present invention relates to a processing apparatus for performing predetermined processing while moving (transporting) various substrates such as a semiconductor (silicon) wafer, a liquid crystal glass substrate, a photomask glass substrate, and an optical disk substrate; Also, the present invention relates to a substrate processing system configured by connecting a plurality of processing apparatuses. Background art
例えば、 液晶ガラス基板の製造工程では、 現像液の塗布, エッチング液 の塗布, レジス ト膜を剥離するための剥離液の塗布といったゥ: I:ッ 卜プロ セス処理が行なわれ、 各ウエッ トプロセス処理間では、 洗浄処理及び乾燥 処理が行なわれる。  For example, in the manufacturing process of a liquid crystal glass substrate, application of a developing solution, application of an etching solution, and application of a stripping solution for stripping a resist film are performed. Between treatments, a cleaning treatment and a drying treatment are performed.
そして、 上記各処理を行なうための処理装置として、 従来、 搬送ローラ 上に基板を載置して、 当該搬送ローラによって基板を水平方向に移送しな がら処理を行なうように構成された処理装置が知られており、 更に、 上記 各処理を連続的に行なうために、 各処理装置を連結して構成された第 1 0 図に示す如き基板処理システムが知られている。  Conventionally, as a processing apparatus for performing each of the above-described processes, there is a processing apparatus configured to place a substrate on a transport roller and perform the process while transporting the substrate in a horizontal direction by the transport roller. Further, there is known a substrate processing system as shown in FIG. 10 which is configured by connecting each processing apparatus in order to continuously perform each of the above processes.
第 1 0図は、 従来例に係る基板処理システムの概略構成を示した平面図 であるが、 同図に示すように、 この基板処理システム 2 0 0は、 基板投入 /排出部 2 0 1 , 基板処理部 2 0 5及び基板搬送部 2 1 0からなる。 前記 基板投入ノ排出部 2 0 1 は、 複数の基板を収納したカセッ ト 2 0 3を載置 する載置台 2 0 2と、 載置台 2 0 2上に載置されたカセッ ト 2 0 3内から 基板を一枚づっ取リ出して基板処理部 2 0 5に投入し、 処理を終えた基板 を基板処理部 2 0 5から取り出してカセッ ト 2 0 3に格納する移戴装置 2 0 4からなる。 尚、 移戴装置 2 0 4は、 通常、 載置台 2 0 2の長手方向に 移動可能となったロボッ 卜から構成される。 前記基板処理部 2 0 5は、 相互に平行に並設された第 1処理部 2 0 6及 び第 2処理部 2 0 7の 2つの処理ラインからなリ、 第 1処理部 2 0 6及び 第 2処理部 2 0 7は、 第 1 1 図に示すように、 それぞれ矢示方向に基板を 搬送する複数の搬送ローラ 2 0 8を備え、 この搬送ローラ 2 0 8によって 基板を搬送しながら所定の処理を行なうようになっている。 例えば、 第 1 処理部 2 0 6は基板をエッチングする処理部であり、 搬送中の基板に対し てエッチング液が塗布される。 また、 第 2処理部 2 0 7は、 水洗処理部 2 0 7 a及び乾燥処理部 2 0 7 bからなり、 水洗処理部 2 0 7 aでは基板に 洗浄水が供給され、 乾燥処理部 2 0 7 bでは基板に乾燥用の気体が供給さ れる。 FIG. 10 is a plan view showing a schematic configuration of a conventional substrate processing system. As shown in FIG. 10, the substrate processing system 200 includes a substrate loading / unloading section 201, It comprises a substrate processing section 205 and a substrate transport section 210. The substrate loading / unloading section 201 includes a mounting table 202 on which a cassette 230 containing a plurality of substrates is mounted, and a cassette 203 mounted on the mounting table 202. From the transfer device 204, which takes out the substrates one by one and puts them into the substrate processing unit 205, takes out the processed substrate from the substrate processing unit 205, and stores it in the cassette 203. Become. Note that the transfer device 204 is usually composed of a robot that can move in the longitudinal direction of the mounting table 202. The substrate processing unit 205 is composed of two processing lines of a first processing unit 206 and a second processing unit 207 arranged side by side in parallel with each other, a first processing unit 206 and As shown in FIG. 11, the second processing unit 200 includes a plurality of transport rollers 208 that transport the substrate in the directions indicated by arrows, respectively. Is performed. For example, the first processing unit 206 is a processing unit for etching a substrate, and an etching liquid is applied to the substrate being transported. Further, the second processing unit 2007 includes a washing processing unit 2007 a and a drying processing unit 2007 b. In the washing processing unit 107 a, cleaning water is supplied to the substrate, and the drying processing unit 200. At 7b, a drying gas is supplied to the substrate.
前記基板搬送部 2 1 0は、 第 1処理部 2 0 6によって処理された基板を 第 2処理部 2 0 7に搬送する手段であり、 第 1処理部 2 0 6から排出され た基板の搬送方向を切り換えて搬送する方向切換装置 2 1 1 と、 方向切換 装置 2 1 1 から排出された基板を前記排出方向に搬送する複数の搬送ロー ラ 2 1 2と、 搬送ローラ 2 1 2によって搬送された基板を、 その搬送方向 を切り換えて第 2処理部 2 0 7に搬送する方向切換装置 2 1 3とから構成 される。  The substrate transport unit 210 is means for transporting the substrate processed by the first processing unit 206 to the second processing unit 206, and transporting the substrate discharged from the first processing unit 206. A direction switching device 2 1 1 that switches the direction and transports, a plurality of transport rollers 2 1 2 that transports the substrate discharged from the direction switching device 2 1 1 in the discharge direction, and a transport roller 2 1 2 And a direction switching device 213 for transferring the transferred substrate to the second processing unit 207 by switching the transfer direction thereof.
第 1 2図に示すように、 前記方向切換装置 2 1 1 は、 第 1処理部 2 0 6 を構成する搬送ローラ 2 0 8の搬送面と同じ水平面内で同じ搬送方向に基 板 Kを搬送する複数の第 1搬送ローラ 2 1 4と、 この第 1搬送ローラ 2 1 4間に配設され、 第 1搬送ローラ 2 1 4の搬送面から上下方向に突没する リフタ 2 1 5と、 第 1搬送ローラ 2 1 4の上方に相互に対向して配設され 、 第 1搬送ローラ 2 1 4の中心軸と直交する中心軸を有し、 基板 Kを搬送 ローラ 2 1 2側に搬送する複数組みの第 2搬送ローラ 2 1 6とからなる。 尚、 互いに対向する第 2搬送ローラ 2 1 6は、 相互に接近 離反する方向 に移動可能となっている。 また、 図中、 2 1 7は、 基板 Kの移動を制止す るストツパである。  As shown in FIG. 12, the direction switching device 211 transports the substrate K in the same transport direction in the same horizontal plane as the transport surface of the transport rollers 208 forming the first processing unit 206. A plurality of first transport rollers 2 14, a lifter 2 15 disposed between the first transport rollers 2 14, and protruding and retracting vertically from the transport surface of the first transport rollers 2 14; A plurality of substrates, which are disposed above and opposite to the transport rollers 221 and have a central axis orthogonal to the central axis of the first transport rollers 214, and transport the substrate K to the transport rollers 211 side. And a second conveying roller pair 2 16. The second transport rollers 2 16 facing each other can move in directions approaching and moving away from each other. In the figure, reference numeral 217 denotes a stopper for stopping the movement of the substrate K.
この方向切換装置 2 1 1 によると、 第 1処理部 2 0 6から排出された基 板 Kは、 第 1搬送ローラ 2 1 4によってス トツバ 2 1 7に当接するまで前 記排出方向に搬送される。 このときリフタ 2 1 5は第 1搬送ローラ 2 1 4 の搬送面から下方に没している。 ついで、 リフタ 2 1 5が第 1搬送ローラ 2 1 4の搬送面から上方に突出し、 これによつて基板 Kが第 1 2図におい て 2点鎖線で示す位置に上昇せしめられる。 このとき第 2搬送ローラ 2 1 6は互いに離反した位置に在る。 ついで、 第 2搬送ローラ 2 1 6が相互に 接近する位置に移動した後、 リフタ 2 1 5が降下する。 これにより、 基板 Kは第 2搬送ローラ 2 1 6によって支持された状態になり、 この後、 この 第 2搬送ローラ 2 1 6によって第 1搬送ローラ 2 1 4の搬送方向と直交す る方向、 即ち、 搬送ローラ 2 1 2側に搬送, 排出せしめられる。 この様に して基板 Kの搬送方向が切り換えられる。 According to the direction switching device 211, the substrate K discharged from the first processing section 206 is moved forward until the substrate K comes into contact with the stopper 211 by the first transport roller 214. Conveyed in the discharge direction. At this time, the lifter 2 15 is submerged downward from the transport surface of the first transport roller 2 14. Then, the lifter 2 15 projects upward from the transport surface of the first transport roller 2 14, whereby the substrate K is raised to the position shown by the two-dot chain line in FIG. At this time, the second transport rollers 2 16 are at positions separated from each other. Then, after the second transport rollers 2 16 move to a position where they approach each other, the lifters 2 15 descend. As a result, the substrate K is in a state of being supported by the second transport rollers 2 16, and thereafter, the direction orthogonal to the transport direction of the first transport rollers 2 14 by the second transport rollers 2 16, that is, The sheet is conveyed and discharged to the conveying roller 2 12 side. In this way, the transport direction of the substrate K is switched.
特に図示しないが、 前記方向切換装置 2 1 3も上述の方向切換装置 2 1 1 とほぼ同様の構成を備えており、 搬送ローラ 2 1 2によって搬送された 基板 Kを、 その搬送方向を切リ換えて第 2処理部 2 0 7に搬送する。  Although not specifically shown, the direction switching device 2 13 has substantially the same configuration as the above-described direction switching device 2 11, and cuts the substrate K transported by the transport rollers 2 12 in the transport direction. Instead, it is conveyed to the second processing section 207.
第 1 0図に示すように、 この基板処理システム 2 0 0は、 第 1処理部 2 0 6, 基板搬送部 2 1 0及び第 2処理部 2 0 7が平面視逆 C形状に配設さ れ、 移戴装置 2 0 4によってカセッ ト 2 0 3から取り出された基板 Kは、 まず、 第 1処理部 2 0 6に投入される。 ついで、 基板 Kは、 第 1処理部 2 0 6内を矢示方向に搬送されながら所定の処理 (エッチング処理) を施さ れた後、 基板搬送部 2 1 0においてその搬送方向が切り換えられて第 2処 理部 2 0 7に投入される。 そして、 基板 Kは、 第 2処理部 2 0 7内を矢示 方向に搬送されながら所定の処理 (水洗処理及び乾燥処理) を施された後 、 移戴装置 2 0 4によって再びカセッ ト 2 0 3内に格納される。  As shown in FIG. 10, in the substrate processing system 200, a first processing unit 206, a substrate transfer unit 210, and a second processing unit 207 are arranged in an inverted C shape in plan view. Then, the substrate K taken out of the cassette 203 by the transfer device 204 is first put into the first processing unit 206. Next, the substrate K is subjected to a predetermined process (etching process) while being transported in the first processing section 206 in the direction indicated by the arrow, and then the transport direction is switched in the substrate transport section 210 to be carried out. Input to 2 processing unit 2007. Then, the substrate K is subjected to predetermined processing (washing processing and drying processing) while being transported in the second processing section 2007 in the direction of the arrow, and then is transferred to the cassette 204 again by the transfer device 204. Stored in 3.
ところで、 第 1処理部 2 0 6及び第 2処理部 2 0 7において、 搬送中に 基板 Kの姿勢が変化すると、 例えば、 搬送方向に対しこれと直交する方向 に斜めに傾いたりすると、 精度の良い処理を行なうことができない。 そこ で、 従来、 第 1 1 図に示すように、 上記搬送ローラ 2 0 8の両端部のロー ラに鍔部 2 0 8 aを形成し、 この鍔部 2 0 8 aによって搬送中の基板 Kの 姿勢を制御するようにしている。 このことは、 上記第 1搬送ローラ 2 1 4 及び第 2搬送ローラ 2 1 6についても同様である。 ところが、 このような 鍔部 2 0 8 aを設けると、 当該鍔部 2 0 8 aが障害となり、 基板 Kの搬送 方向を搬送ローラ 2 0 8の搬送面内で切り換えることができない。 そこで 、 上述した方向切換装置 2 1 1 , 2 1 3では、 基板 Kを鍔部 2 0 8 aの上 端より上方に持ち上げて、 その搬送方向を切り換えるようにしている。 また、 上記理由から基板 Kを昇降させるように構成した基板搬送部 2 1 0では、 同部において基板 Kの処理を行なうことができないため、 基板 の搬送のみを行なっていた。 即ち、 例えば、 同部において基板の洗浄を行 なう場合、 基板 Kを昇降させると、 ノズルから噴射される洗浄液の強くあ たるところと、 そうでないところを生じ、 洗浄効果にむらを生じるのであ る。 By the way, in the first processing unit 206 and the second processing unit 207, when the posture of the substrate K changes during the transfer, for example, when the substrate K is inclined obliquely in a direction perpendicular to the transfer direction, the accuracy is reduced. Cannot perform good processing. Therefore, conventionally, as shown in FIG. 11, a flange portion 208a is formed on rollers at both ends of the transport roller 208, and the substrate K being transported by the flange portion 208a is formed. The attitude of is controlled. This is the same for the first transport roller 214 and the second transport roller 216. However, like this If the flange portion 208a is provided, the flange portion 208a becomes an obstacle, and the transport direction of the substrate K cannot be switched within the transport surface of the transport roller 208. Therefore, in the above-described direction switching devices 211 and 213, the substrate K is lifted above the upper end of the flange portion 208a to switch its transport direction. In addition, in the substrate transport unit 210 configured to raise and lower the substrate K for the above reason, the substrate K cannot be processed in the same unit, and therefore, only the substrate is transported. That is, for example, when the substrate is cleaned in the same part, when the substrate K is moved up and down, the cleaning liquid ejected from the nozzle is strongly applied to the cleaning liquid, and the cleaning liquid is not applied to the cleaning liquid, and the cleaning effect becomes uneven. You.
このため、 従来の基板処理システム 2 0 0では、 上記のように基板搬送 部 2 1 0において基板 Kへの処理を行わないようにしているが、 その一方 で、 このことにより却って、 以下に説明するような問題を生じていた。 即ち、 例えば、 第 1 0図に示した例のように、 第 1処理部 2 0 6におい て基板 Kにエッチング処理を施した後、 未洗浄のままこれを搬送すると、 第 2処理部 2 0 7への搬送時間のバラツキによつてエッチングの進行度合 いが異なってしまい、 エッチングを高精度にコントロールができないので ある。 基板搬送部 2 1 0は、 基板 Kを昇降させる機構及び第 2搬送ローラ 2 1 6を移動させる機構からなる複雑な動作機構を有するため、 その搬送 時間を高精度にコントロールするのは極めて困難である。  For this reason, in the conventional substrate processing system 200, the processing on the substrate K is not performed in the substrate transfer unit 210 as described above. Had a problem that That is, for example, as shown in the example shown in FIG. 10, after the substrate K is subjected to the etching process in the first processing unit 206 and transported without being cleaned, the second processing unit 20 The degree of progress of the etching varies depending on the variation of the transfer time to 7, and the etching cannot be controlled with high precision. Since the substrate transport unit 210 has a complicated operation mechanism including a mechanism for moving the substrate K up and down and a mechanism for moving the second transport roller 2 16, it is extremely difficult to control the transport time with high precision. is there.
また、 例えば、 第 1処理部 2 0 6の最終工程を洗浄工程とした場合、 基 板 Kを乾燥させないで搬送すると、 表面に乾燥むらを生じたり、 或いは染 みを生じて、 基板 Kが不良品となる。  Further, for example, when the final step of the first processing unit 206 is a cleaning step, if the substrate K is transported without being dried, uneven drying or stains may occur on the surface, and the substrate K may become unclean. It will be a good product.
更に、 上記従来の基板処理システム 2 0 0では、 第 1処理部 2 0 6と第 2処理部 2 0 7の 2つの処理ラインを平行に並設しているので、 装置の設 置効率が悪いという問題もある。  Furthermore, in the above-mentioned conventional substrate processing system 200, the two processing lines of the first processing unit 206 and the second processing unit 207 are arranged in parallel, so that the installation efficiency of the apparatus is poor. There is also a problem.
本発明は、 以上の実情に鑑みなされたものであって、 一方の処理ライン から他方の処理ラインに基板を搬送する機能を有すると共に、 搬送中の基 板に対して処理を行なうことができるようになった基板処理装置及びこれ を備えた基板処理システムの提供を目的とする。 発明の開示 The present invention has been made in view of the above circumstances, and has a function of transporting a substrate from one processing line to another processing line, and can perform processing on a substrate being transported. Substrate processing apparatus and the same It is an object of the present invention to provide a substrate processing system provided with: Disclosure of the invention
上記課題を解決するための本発明は、 上下に並設された基板投入口及び 基板排出口を備えてなる筐体状のカバ一体と、  The present invention for solving the above-mentioned problems, a housing-like cover integrated with a vertically arranged substrate input port and a substrate discharge port,
前記カバー体内に内装された処理機構であって、 前記基板投入口から搬 入された基板を受容して支持する一方、 前記基板排出口から前記基板を排 出する搬送 ·支持手段、 該搬送, 支持手段を支持する支持架台、 並びに該 搬送 ·支持手段の上方に配設され、 該搬送■支持手段によって支持された 基板上に処理流体を吐出する処理流体出手段を備えてなる処理機構と、 前記処理機構を支持して上下方向に昇降させ、 該処理機構を前記基板投 入口及び基板排出口に経由せしめる昇降機構とを設けて構成したことを特 徴とする昇降式基板処理装置に係る。  A processing mechanism housed inside the cover body, wherein the processing mechanism receives and supports the substrate loaded from the substrate input port, and discharges the substrate from the substrate discharge port. A processing mechanism comprising: a support base for supporting the support means; and a processing fluid output means disposed above the transfer and support means and discharging a processing fluid onto a substrate supported by the transfer and support means. An up-and-down type substrate processing apparatus characterized in that the processing mechanism is provided with an elevating mechanism for supporting the processing mechanism and moving the processing mechanism up and down and passing the processing mechanism through the substrate inlet and the substrate outlet.
この昇降式基板処理装置によると、 処理機構が昇降機構によって上下方 向に昇降せしめられ、 基板投入口及び基板排出口に経由せしめられる。 そ して、 処理機構は、 基板投入口に経由したときに、 前工程の処理部から排 出された基板を前記基板投入口から受容してこれを支持し、 基板排出口に 移動するまでの間、 処理流体吐出手段から基板上に処理流体を吐出する。 これにより、 基板は所定の処理が施され、 処理後、 前記基板排出口から次 工程の処理部に排出, 移送される。  According to this elevating type substrate processing apparatus, the processing mechanism is moved up and down by the elevating mechanism so as to pass through the substrate input port and the substrate discharge port. Then, the processing mechanism receives the substrate discharged from the processing unit in the preceding process from the substrate input port when passing through the substrate input port, supports the substrate, and moves the substrate to the substrate output port. During this time, the processing fluid is discharged from the processing fluid discharging means onto the substrate. As a result, the substrate is subjected to a predetermined process, and after the process, the substrate is discharged and transferred from the substrate discharge port to the processing unit in the next process.
このように、 この昇降式基板処理装置によれば、 基板を支持する搬送 - 支持手段及び支持された基板上に処理流体を吐出する処理流体吐出手段か らなる処理機構全体を昇降させるようにしているので、 基板を搬送する際 に、 基板と処理流体吐出手段との位置関係が変化することがなく、 したが つて、 例えば、 基板を洗浄する場合に、 処理流体吐出手段から吐出される 洗浄液を基板上の各部にほぼ均等に供給することが可能であり、 むらのな い洗浄を行なうことができる。  As described above, according to the elevating type substrate processing apparatus, the entire processing mechanism including the transport-supporting means for supporting the substrate and the processing fluid discharging means for discharging the processing fluid onto the supported substrate is raised and lowered. Therefore, the positional relationship between the substrate and the processing fluid discharge means does not change when the substrate is transported, and thus, for example, when cleaning the substrate, the cleaning liquid discharged from the processing fluid discharge means is not changed. It can be supplied almost evenly to each part on the substrate, and uniform cleaning can be performed.
また、 昇降機構によって処理機構を昇降させるという単一の動作で基板 を搬送することができるので、 その速度コントロールが容易であり、 した がって、 エッチングなどの処理を行なう場合にも、 これを高精度にコント ロールすることが可能である。 In addition, since the substrate can be transferred by a single operation of raising and lowering the processing mechanism by the lifting mechanism, the speed can be easily controlled. Therefore, even when performing processing such as etching, it is possible to control this with high precision.
尚、 本発明において、 前記処理流体には、 現像液, エッチング液, レジ ス ト膜を剥離するための剥離液や、 洗浄用の洗浄水, 乾燥用の気体といつ た基板を処理するための各種の流体が含まれ、 かかる各種の処理流体を基 板上に供給して、 これを処理することが可能である。  In the present invention, the processing fluid includes a developing solution, an etching solution, a stripping solution for stripping a resist film, a cleaning water for cleaning, and a gas for drying. Various types of fluids are included, and it is possible to supply such various types of processing fluids to the substrate and process them.
また、 前記搬送■支持手段は、 これを、 前記基板を受容した後、 受容し た基板を、 前記基板の搬入 排出方向に、 繰り返し前後動させるように構 成することができる。  Further, the transporting / supporting means may be configured to, after receiving the substrate, repeatedly move the received substrate back and forth in the direction of loading and discharging the substrate.
上述したように、 上記昇降式基板処理装置においては、 処理流体吐出手 段から吐出される処理流体を基板上の各部にほぼ均等に供給することが可 能であるが、 その一方で処理流体自体に、 例えば、 圧力の高いところと低 いところがあるというようにむらを生じているある場合があり、 このよう な場合には、 基板に対し、 厳密な意味で均質な処理を行なうことができな い o  As described above, in the elevating type substrate processing apparatus, the processing fluid discharged from the processing fluid discharging means can be almost uniformly supplied to each part on the substrate. In some cases, for example, there may be irregularities such as a high pressure area and a low pressure area. In such a case, it is not possible to perform a strictly uniform treatment on the substrate. O
そこで、 上記のように、 搬送■ 支持手段に受容, 支持された基板を、 そ の搬入ノ排出方向に繰リ返し前後動させるように構成すれば、 基板の前後 動によって、 基板に当たる処理流体の圧力むらが平均化され、 基板に対し て均質な処理を行なうことが可能となる。  Therefore, as described above, if the substrate received and supported by the transporting / supporting means is configured to be repeatedly moved back and forth in the loading / unloading direction, the back-and-forth movement of the substrate causes the processing fluid to hit the substrate. Pressure unevenness is averaged, and a uniform treatment can be performed on the substrate.
また、 前記昇降式基板処理装置は、 これを、 そのカバー体が、 仕切り部 材によって、 前記基板の搬入 排出方向に駆動室及び処理室の 2つの室に 分割されると共に、 前記基板投入口及び基板排出口を有する前記処理室に は前記処理機構が配設される一方、 前記駆動室には前記昇降機構が配設さ れてなり、  Further, in the liftable substrate processing apparatus, the cover body is divided into two chambers, a driving chamber and a processing chamber, in a loading and discharging direction of the substrate by a partition member. The processing chamber having the substrate discharge port is provided with the processing mechanism, while the driving chamber is provided with the elevating mechanism,
前記仕切リ部材には、 その上下方向に沿って、 前記処理室と駆動室とを 連通するための開口部が形成され、  An opening for communicating the processing chamber and the driving chamber is formed along the vertical direction of the partitioning member,
前記仕切リ部材に形成された開口部の上下方向に沿った両縁部はそれぞ れ筒状に形成され、 且つ該一対の各筒状部には、 相互に対向する面に、 上 下方向に沿った切リ欠き溝が形成され、 前記処理機構は、 その前記支持架台が、 前記仕切リ部材の開口部内に設 けられた連結具によつて前記昇降機構と連結せしめられ、 Both edges of the opening formed in the partition member along the up-down direction are respectively formed in a tubular shape, and the pair of tubular portions are provided with surfaces facing each other in an upward and downward direction. Notch grooves are formed along In the processing mechanism, the support base is connected to the lifting mechanism by a connecting tool provided in an opening of the partitioning member.
前記連結具には、 前記一対の筒状部間に配設され、 且つ前記連結具の上 方及び下方に延在するように配設された帯状のシート体であって、 その両 側縁部がそれぞれ前記切リ欠き溝から前記筒状部内に挿入せしめられたシ 一ト体が接続されてなリ、  The connecting member is a band-shaped sheet member disposed between the pair of cylindrical portions and extending upward and downward from the connecting member. Are connected to the sheet bodies inserted into the cylindrical portion from the notch grooves, respectively.
前記駆動室と処理室が、 前記仕切り部材, 連結具及びシート体によって 仕切られた構成とすることができる。  The drive chamber and the processing chamber may be configured to be partitioned by the partition member, the connecting member, and the sheet member.
処理流体に含まれる前記現像液, エッチング液や剥離液などは腐食性が 高く、 これが昇降機構に付着すると、 当該昇降機構が損傷してその機能が 損なわれる懸念がある。 そこで、 上記のように、 昇降機構が配設される駆 動室と、 処理機構が配設される処理室とを、 仕切り部材, 連結具及びシー 卜体によって仕切れば、 処理室で使用される処理流体が駆動室に侵入する のを防止することができ、 処理流体によって昇降機構が損傷するのを防止 することができる。 特に、 仕切リ部材に設けた開口部の上下方向に沿った 縁部を筒状に形成するとともに、 連結具の上方及び下方に延在するように 配設されたシート体の両側縁部を、 前記筒状部に形成された切リ欠き溝か ら当該筒状部内に挿入せしめた、 いわゆるラビリンス構造とすることで、 駆動室及び処理室双方を気密性の高いものとすることが可能となる。  The developing solution, etching solution, stripping solution and the like contained in the processing fluid are highly corrosive, and if they adhere to the elevating mechanism, the elevating mechanism may be damaged and its function may be impaired. Therefore, as described above, if the driving chamber in which the lifting mechanism is disposed and the processing chamber in which the processing mechanism is disposed are partitioned by the partition member, the connecting member, and the sheet, the processing chamber is used. The processing fluid can be prevented from entering the driving chamber, and the processing fluid can be prevented from damaging the elevating mechanism. In particular, the upper and lower edges of the opening provided in the partitioning member are formed in a cylindrical shape, and both side edges of the sheet body arranged to extend above and below the connecting tool are formed by: By forming a so-called labyrinth structure, which is inserted into the cylindrical portion from a notch groove formed in the cylindrical portion, it is possible to make both the drive chamber and the processing chamber highly airtight. .
更に、 前記開口部, 連結具及びシート体は、 これらを複数組設けた構成 としても良い。 また、 前記筒状部内の気体を排気する排気手段を設けると 、 前記シート体と切り欠き溝との隙間から筒状部内に侵入した処理流体を 、 前記排気手段によって排気することができるので、 駆動室への処理流体 の侵入を更に確実に防止することができる。  Further, the opening, the connecting member, and the sheet body may have a configuration in which a plurality of these are provided. In addition, when an exhaust unit that exhausts the gas in the cylindrical portion is provided, the processing fluid that has entered the cylindrical portion from the gap between the sheet body and the cutout groove can be exhausted by the exhaust unit. Intrusion of the processing fluid into the chamber can be more reliably prevented.
また、 前記シート体は、 これを無端の環状に形成することができる。 ま た、 前記シート体の巻き取り Z繰り出しを行う巻取 Z繰出機構を、 前記シ 一卜体の上部側及び下部側のそれぞれに設け、 前記昇降機構によって昇降 せしめられる前記シート体の動きに応じ、 当該巻取ノ繰出機構によって前 記シート体の巻き取り 繰り出しを行うように構成しても良く、 卷取 Z繰 出機構は、 前記シート体を巻き取る卷取軸と、 該卷取軸を回転させる駆動 手段とからこれを構成し、 更に、 前記駆動手段を、 前記巻取軸が繰出方向 に回転する際には、 制動力のみを卷取軸に作用させる一方、 前記卷取軸を 巻取方向に回転させる際には、 摩擦クラッチを介して前記巻取軸に動力を 伝達するように構成しても良い。 この巻取/繰出機構によれば、 シート体 に弛みを生じさせることなく、 その巻き取り, 繰り出しを行なうことがで きる。 Further, the sheet body can be formed in an endless annular shape. Further, winding Z unwinding mechanisms for winding up and unwinding the sheet body are provided on the upper side and the lower side of the sheet body, respectively, according to the movement of the sheet body raised and lowered by the lifting mechanism. The above-described sheet body may be configured to be wound and fed by the winding / unwinding mechanism. The unwinding mechanism includes a winding shaft for winding the sheet body, and a driving unit for rotating the winding shaft, and further includes: a driving unit that rotates the winding shaft in the feeding direction. May be configured such that only braking force is applied to the winding shaft, while power is transmitted to the winding shaft via a friction clutch when the winding shaft is rotated in the winding direction. . According to the winding / unwinding mechanism, the sheet can be wound and unwound without causing slack in the sheet body.
更に、 前記駆動手段は、 これを、 前記卷取軸に連結した受動歯車と、 こ の受動歯車に嚙合した駆動歯車と、 駆動歯車に連結された摩擦クラッチと 、 摩擦クラッチに連結された回転軸と、 回転軸の両端部にそれぞれ連結し 、 回転軸の回転を一方向にのみ許容する 2つの一方向クラッチと、 一方の 前記一方向クラツチを介して前記回転軸に連結されたプーリと、 該プーリ に巻回された伝動ベルトと、 他方の前記一方向クラツチを支持する支持部 材とから構成し、 前記 2つの一方向クラッチを、 前記卷取軸を巻取方向に 回転させる方向の前記回転軸の回転を許容する一方、 前記卷取軸を繰出方 向に回転させる方向の前記回転軸の回転を規制するように構成するととも に、 前記伝動ベル卜が前記昇降機構によって回動せしめられるように構成 することができる。  Further, the driving means comprises: a passive gear connected to the winding shaft; a driving gear coupled to the passive gear; a friction clutch connected to the driving gear; and a rotating shaft connected to the friction clutch. Two one-way clutches respectively connected to both ends of the rotating shaft and allowing rotation of the rotating shaft in only one direction; and a pulley connected to the rotating shaft via one of the one-way clutches. A transmission belt wound around a pulley and a supporting member for supporting the other one-way clutch, wherein the two one-way clutches rotate in a direction for rotating the winding shaft in a winding direction. While allowing rotation of the shaft, the rotation of the rotation shaft in the direction in which the winding shaft is rotated in the feeding direction is regulated, and the transmission belt is rotated by the lifting mechanism. Can be configured.
そして、 上記構成の昇降式基板処理装置によれば、 基板をほぼ水平に移 動させつつ処理を行う第 1基板処理装置と第 2基板処理装置とを上下に並 設し、 第 1基板処理装置の基板排出部と、 前記昇降式基板処理装置の基板 投入口とを接続させる一方、 第 2基板処理装置の基板投入部と、 前記昇降 式基板処理装置の基板排出口とを接続させ、 基板を、 第 1基板処理装置, 昇降式基板処理装置, 第 2基板処理装置に順次経由せしめるように構成し た基板処理システムを構築することができ、 第 1基板処理装置と第 2基板 処理装置とを同一の水平平面内に並設した上記従来の処理システムと比べ て、 設置スペースが小さくて足りる基板処理システムとすることができる 図面の簡単な説明 According to the liftable substrate processing apparatus having the above-described configuration, the first substrate processing apparatus and the second substrate processing apparatus that perform processing while moving the substrate substantially horizontally are arranged vertically above and below the first substrate processing apparatus. The substrate discharge unit of the vertical substrate processing apparatus is connected to the substrate input port of the vertical substrate processing apparatus, and the substrate input section of the second substrate processing apparatus is connected to the substrate discharge port of the vertical substrate processing apparatus. A first substrate processing apparatus, an elevating type substrate processing apparatus, and a second substrate processing apparatus. The first substrate processing apparatus and the second substrate processing apparatus can be sequentially constructed. Substrate processing system that requires less installation space compared to the conventional processing systems described above, which are arranged side by side in the same horizontal plane BRIEF DESCRIPTION OF THE FIGURES
第 1 図は、 この発明の好ましい実施形態に係る基板処理システムの概略 構成を示した正面図であり、 第 2図はその平面図であり、 第 3図はその正 断面図である。 また、 第 4図は、 本実施形態に係る洗浄装置を示した正断 面図であり、 第 5図は、 第 3図に示した昇降式基板処理装置の Π位置にお ける平断面図であり、 第 6図は、 同第 3図に示した昇降式基板処理装置の ΠΙ位置における平断面図である。 また、 第 7図は、 本実施形態に係る巻取 Z繰出镞構を拡大して示した平断面図である。 また、 第 8図は、 本発明の 他の形態に係る基板処理システムの概略構成を示した平面図であり、 第 9 図は、 第 8図における矢視 IV方向の側面図である。 また、 第 1 0図は、 従 来例に係る基板処理システムの概略構成を示した平面図であり、 第 1 1 図 は、 従来例に係る搬送ローラを示した正面図であり、 第 1 2図は、 従来例 に係る方向切換装置の概略構成を示した模式図である。 尚、 第 3図は、 第 5図における矢視 I一 I方向の断面図でもある。 また、 第 3図乃至第 7図 において、 断面部分へのハッチングはこれを省略している。 発明を実施するための最良の形態  FIG. 1 is a front view showing a schematic configuration of a substrate processing system according to a preferred embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a front sectional view thereof. FIG. 4 is a front sectional view showing the cleaning apparatus according to the present embodiment, and FIG. 5 is a plan sectional view of the elevation type substrate processing apparatus shown in FIG. FIG. 6 is a cross-sectional plan view of the elevating type substrate processing apparatus shown in FIG. FIG. 7 is an enlarged plan sectional view showing the winding Z feeding structure according to the present embodiment. FIG. 8 is a plan view showing a schematic configuration of a substrate processing system according to another embodiment of the present invention, and FIG. 9 is a side view in the direction of arrow IV in FIG. FIG. 10 is a plan view showing a schematic configuration of a substrate processing system according to a conventional example. FIG. 11 is a front view showing a transport roller according to a conventional example. FIG. 1 is a schematic diagram showing a schematic configuration of a direction switching device according to a conventional example. FIG. 3 is also a cross-sectional view taken along the line I-I in FIG. In FIGS. 3 to 7, hatching to the cross-sectional portions is omitted. BEST MODE FOR CARRYING OUT THE INVENTION
以下、 本発明をより詳細に説明するために、 添付図面に基づいてこれを 説明する。  Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.
まず、 本例の基板処理システム 1の構成について説明する。  First, the configuration of the substrate processing system 1 of the present example will be described.
第 1 図及び第 2図に示すように、 本例の基板処理システム 1 は、 基板投 入 Z排出部 2、 上下に並設された第 1基板処理装置 6及び第 2基板処理装 置 7、 並びに昇降式基板処理装置 1 0からなる。 基板投入ノ排出部 2は、 複数の基板を収納したカセッ ト 5を載置する載置台 4と、 載置台 4上に載 置されたカセッ ト 5内から基板を一枚づっ取リ出して第 1基板処理装置 6 に投入する一方、 処理を終えた基板を第 2基板処理装置 7から取り出して カセッ ト 5に格納する移戴装置 3からなる。 尚、 移戴装置 3は、 載置台 4 の長手方向 (矢示方向) に移動可能となったロボッ トから構成される。 ま た、 カセッ ト 5は図示しない A G Vなどの搬送装置によつて搬送される。 前記第 1基板処理装置 6及び第 2基板処理装置 7は、 それぞれ矢示方向 に基板を搬送する、 第 1 1図に示した如き搬送ローラ 2 0 8の複数を備え 、 この搬送ローラ 2 0 8によって基板を搬送しながら所定の処理を行なう ようになつている。 本例では、 第 1基板処理装置 6は基板に対しエツチン グ処理を行なうように構成され、 第 2基板処理装置 7は基板に対して洗浄 処理と乾燥処理とを行なうように構成されている。 As shown in FIG. 1 and FIG. 2, the substrate processing system 1 of the present example includes a substrate input Z discharge section 2, a first substrate processing apparatus 6 and a second substrate processing apparatus 7, which are arranged vertically. And an elevating type substrate processing apparatus 10. The substrate loading / unloading section 2 includes a mounting table 4 on which a cassette 5 containing a plurality of substrates is mounted, and a substrate 5 which is removed from the cassette 5 mounted on the mounting table 4 one by one. (1) A transfer device (3) that puts the substrate into the substrate processing device (6), removes the processed substrate from the second substrate processing device (7), and stores it in the cassette (5). The transfer device 3 is composed of a robot that can move in the longitudinal direction (the direction of the arrow) of the mounting table 4. The cassette 5 is transferred by a transfer device such as an AGV (not shown). The first substrate processing apparatus 6 and the second substrate processing apparatus 7 each include a plurality of transport rollers 208 as illustrated in FIG. 11 for transporting a substrate in the direction indicated by an arrow. A predetermined process is performed while the substrate is being transported. In this example, the first substrate processing apparatus 6 is configured to perform an etching process on a substrate, and the second substrate processing apparatus 7 is configured to perform a cleaning process and a drying process on a substrate.
第 3図, 第 5図及び第 6図に示すように、 前記昇降式基板処理装置 1 0 は、 筐体状をしたカバー体 1 1 と、 このカバ一体 1 1 内に配設された処理 機構 2 0及び昇降機構 4 0などからなる。 尚、 カバ一体 1 1 には、 第 1基 板処理装置 6内に連通する開口部 1 1 a及び第 2基板処理装置 7内に連通 する開口部 1 1 bが形成されている。 また、 カバー体 1 1 は支柱 1 2によ つて支持され、 その内部は、 処理機構 2 0が配設される処理室 Aと、 昇降 機構 4 0が配設される駆動室 Bに仕切られている。  As shown in FIG. 3, FIG. 5, and FIG. 6, the elevating type substrate processing apparatus 10 includes a casing-shaped cover body 11 and a processing mechanism disposed in the cover integrated body 11. 20 and an elevating mechanism 40. The cover 11 has an opening 11 a communicating with the first substrate processing apparatus 6 and an opening 11 b communicating with the second substrate processing apparatus 7. Further, the cover body 11 is supported by columns 12, and the interior thereof is partitioned into a processing chamber A in which the processing mechanism 20 is disposed and a drive chamber B in which the elevating mechanism 40 is disposed. I have.
前記処理機構 2 0は、 洗浄装置 2 2及びこの洗浄装置 2 2を支持する支 持架台 2 1 からなる。 洗浄装置 2 2は、 第 4図に示すように、 基板 Kが搬 入 Z排出される開口部 2 3 aを一側面に備えた筐体状のカバー 2 3と、 こ のカバ一 2 3内に配設された複数の搬送ローラ 2 6と、 この搬送ローラ 2 6の上方に配設された複数のノズル 2 9列と、 搬送ローラ 2 6の下方に配 設された複数のノズル 3 0列などからなる。 尚、 搬送ローラ 2 6は、 第 1 1 図に示した搬送ローラ 2 0 8と同様の構成を備えている。 また、 前記開 口部 2 3 aに最も近い搬送ローラ 2 6には、 その上部に当接して、 基板 K をニップするニップローラ 2 7が設けられている。 斯く して、 これら搬送 ローラ 2 6及びニップロ一ラ 2 7が正逆に回転することによって、 基板 が前記開口部 2 3 aから搬入され、 同開口部 2 3 aから排出される。  The processing mechanism 20 includes a cleaning device 22 and a support base 21 that supports the cleaning device 22. As shown in FIG. 4, the cleaning device 22 includes a housing-like cover 23 provided with an opening 23 a on one side for carrying in and discharging the substrate K, and a cover 23 inside the cover 23. , A plurality of nozzles 29 arranged above the conveying roller 26, and a plurality of nozzles 30 arranged below the conveying roller 26 Etc. The transport roller 26 has the same configuration as the transport roller 208 shown in FIG. The transport roller 26 closest to the opening 23 a is provided with a nip roller 27 that abuts on the upper portion and nips the substrate K. Thus, the substrate is carried in from the opening 23a and discharged from the opening 23a by the forward and reverse rotation of the transport roller 26 and the nipple roller 27.
前記各ノズル 2 9は、 図示しない洗浄液供給源に接続された供給管 2 8 に固設されておリ、 この供給管 2 8を介して供給された洗浄液を基板 Kの 上面に向けて吐出する。 同様に、 前記各ノズル 3 0は、 前記洗浄液供給源 に接続された供給管 3 1 に固設されており、 この供給管 2 8を介して供給 された洗浄液を基板 Kの下面に向けて吐出する。 尚、 図中 3 2は基板 Kの 有無を検出するセンサである。 Each of the nozzles 29 is fixed to a supply pipe 28 connected to a cleaning liquid supply source (not shown), and discharges the cleaning liquid supplied through the supply pipe 28 toward the upper surface of the substrate K. . Similarly, the nozzles 30 are fixed to a supply pipe 31 connected to the cleaning liquid supply source, and discharge the cleaning liquid supplied through the supply pipe 28 toward the lower surface of the substrate K. I do. In the figure, 32 is the substrate K It is a sensor that detects the presence or absence.
また、 カバー 2 3の下端には、 開口部 2 3 bを介して相互に連通される 集液槽 2 4が設けられおリ、 前記ノズル 2 9, 3 0から吐出された洗浄液 が前記集液槽 2 4に回収され、 排出管 2 5を通して適宜排出されるように なっている。  A liquid collecting tank 24 is provided at the lower end of the cover 23 and communicates with each other through an opening 23 b. The cleaning liquid discharged from the nozzles 29 and 30 is used for collecting the cleaning liquid. It is collected in the tank 24 and discharged as appropriate through the discharge pipe 25.
前記駆動室 B内には、 角パイプからなり、 縦格子状に形成されたフレー 厶 1 7が立設されており、 このフ レーム 1 7に前記昇降機構 4 0が付設さ れている。 尚、 フレーム 1 7はブラケッ ト 1 8を介して前記支柱 1 2に取 リ付けられている。  In the drive room B, a frame 17 formed of a square pipe and formed in a vertical lattice is provided upright, and the frame 17 is provided with the elevating mechanism 40. The frame 17 is attached to the column 12 via a bracket 18.
前記昇降機構 4 0は: 連結具 5 5, 5 6及び 5 7 , 5 8を介して支持架 台 1 3に連結される昇降台 4 4と、 前記フレーム 1 Ίを構成する縦桟の、 前記処理室 A側の面に並設された一対のガイ ドレ一ル 4 5と、 各ガイ ドレ ール 4 5にそれぞれこれに沿って移動自在に係合し、 且つ前記昇降台 4 4 に固設されたスライ ド部材 4 6と、 回転自在且つ前記ガイ ドレール 4 5に 対して平行となるように前記フレーム 1 7に支持されたポールねじ 4 1 と 、 このポールねじ 4 1 に螺合した状態で前記昇降台 4 4に固設されたナツ ト 4 2と、 前記フレ一厶 1 7に固設されて前記ボールねじ 4 1 を回転, 駆 動するサーボモータ 4 3などからなる。  The elevating mechanism 40 includes: an elevating platform 44 connected to the support base 13 via connecting tools 55, 56 and 57, 58; A pair of guide rails 45 arranged side by side on the processing chamber A side are movably engaged with the respective guide rails 45 along the guide rails 45, and are fixed to the lift table 44. The slide member 46, the pole screw 41 supported on the frame 17 so as to be rotatable and parallel to the guide rail 45, and a state where the pole screw 41 is screwed to the pole screw 41. It comprises a nut 42 fixed to the lift table 44 and a servomotor 43 fixed to the frame 17 for rotating and driving the ball screw 41.
サーポモータ 4 3によってボールねじ 4 1が回転せしめられると、 これ に螺合したナッ ト 4 2がボールねじ 4 1 に沿って移動 (昇降) し、 ナツ 卜 4 2に連結された昇降台 4 4、 この昇降台 4 4に連結具 5 5, 5 6及び 5 7 , 5 8を介して連結された支持架台 1 3、 及び支持架台 1 3に支持され る洗浄装置 2 2がナツ ト 4 2と共に昇降する。  When the ball screw 41 is rotated by the servo motor 43, the nut 42 screwed thereto moves (elevates) along the ball screw 41, and the elevator 44 connected to the nut 42, The support stand 13 connected to the lift base 44 via the connectors 55, 56 and 57, 58, and the cleaning device 22 supported by the support stand 13 are moved up and down together with the nut 42. I do.
前記駆動室 Bと処理室 Aとは、 仕切リ部材 1 1 a , 1 4 , 1 6によって 仕切られている。 仕切リ部材 1 1 a , 1 4間、 及び仕切リ部材 1 4 , 1 6 間にはそれぞれ開口部が形成されており、 各開口部内に位置するようにそ れぞれ前記連結具 5 5 , 5 6及び 5 7, 5 8が設けられている。 また、 各 開口部を形成する仕切リ部材 1 4の両側縁部 1 5は、 これに沿って筒状に 形成され、 これと対向する前記仕切リ部材 1 1 a , 1 6の各縁部には、 こ れに沿ってそれぞれ筒状部材 1 3が固設されている。 また、 前記仕切り部 材 1 4の両側縁の筒状部 1 5と前記筒状部材 1 3の各対向面にはそれぞれ 上下方向に沿った切リ欠き溝が形成されている。 The driving chamber B and the processing chamber A are partitioned by partitioning members 11a, 14 and 16. Openings are formed between the partitioning members 11a and 14 and between the partitioning members 14 and 16 respectively, and the connecting members 55 and so as to be located in the respective openings. 56 and 57, 58 are provided. Further, both side edges 15 of the partitioning member 14 forming each opening are formed in a cylindrical shape along the same, and are formed at the respective edges of the partitioning members 11a and 16 opposed thereto. Is The cylindrical members 13 are fixed along these. Further, notched grooves are formed on the opposed surfaces of the tubular portion 15 on both side edges of the partition member 14 and the tubular member 13 along the vertical direction.
また、 前記仕切リ部材 1 4の両側縁の筒状部 1 5と前記筒状部材 1 3と の間には、 これに沿って帯状のシート体 6 5 , 6 6がそれぞれ設けられて いる。 このシート体 6 5 , 6 6は、 その両側縁が前記切り欠き溝から筒状 部 1 5, 筒状部材 1 3内にそれぞれ挿入され、 連結具 5 5 , 5 6及び 5 7 , 5 8によって表裏から挟持された状態でこれらに固着されている。 そし て、 シート体 6 5 , 6 6の各上端部及び下端部はそれぞれ後述の卷取 繰 出機構 7 0に巻き取られている。 また、 前記筒状部 1 5及び筒状部材 1 3 は、 図示しない適宜排気手段によってその内部の気体が排気されるように なっている。 尚、 本例では、 前記シート体 6 5 , 6 6に、 耐摩擦性及び耐 食性に優れたテフロン製のシートを用いた。 但し、 これに限られるもので はなく、 この他に、 例えばステンレス製のものを使用することができる。 斯く して、 前記駆動室 Bと処理室 Aは、 実質的に、 仕切リ部材 1 1 a , 1 4 , 1 6、 筒状部材 1 3, 1 3、 連結具 5 5, 5 6, 5 7, 5 8、 シー 卜体 6 5 , 6 6によって仕切られている。  Further, between the tubular portions 15 on both side edges of the partition member 14 and the tubular members 13, strip-shaped sheet bodies 65, 66 are respectively provided along the tubular members 13. The sheet members 65, 66 are inserted into the cylindrical portion 15, the cylindrical member 13, respectively, from the notch grooves at both side edges thereof, and are connected by connecting members 55, 56 and 57, 58. They are fixed to these while being sandwiched from the front and back. The upper ends and lower ends of the sheets 65, 66 are wound by a winding mechanism 70, which will be described later. The gas inside the cylindrical portion 15 and the cylindrical member 13 is exhausted by an appropriate exhaust means (not shown). In this example, a Teflon sheet having excellent friction resistance and corrosion resistance was used for the sheet bodies 65 and 66. However, the material is not limited to this, and other materials such as stainless steel can be used. Thus, the driving chamber B and the processing chamber A are substantially composed of the partition members 11 a, 14, 16, the cylindrical members 13, 13, and the connecting members 55, 56, 57. , 58, and sheet bodies 65, 66.
また、 第 5図に示すように、 前記昇降台 4 4には駆動モータ 6 0が取り 付けられると共に、 バランサ 5 0が接続されている。 駆動モータ 6 0はブ ラケッ ト 6 2を介して前記昇降台 4 4に固設され、 伝動ベルト 6 1 を介し て前記洗浄装置 2 2の搬送ローラ 2 6を駆動する。 一方、 バランサ 5 0は 、 前記ガイ ドレール 4 5に対して平行となるように前記フレーム 1 7に固 設されたガイ ドロッ ド 5 1 と、 このガイ ドロッ ド 5 1 に沿って移動可能に 当該ガイ ドロッ ド 5 1 に係合すると共に、 前記昇降台 4 4に係合した本体 5 2からなる。  Further, as shown in FIG. 5, a drive motor 60 is attached to the lift 44, and a balancer 50 is connected to the drive motor 60. The drive motor 60 is fixed to the elevator 44 via a bracket 62, and drives the transport roller 26 of the cleaning device 22 via a transmission belt 61. On the other hand, the balancer 50 has a guide rod 51 fixed to the frame 17 so as to be parallel to the guide rail 45, and a guide rod movably along the guide rod 51. The main body 52 is engaged with the drop 51 and is also engaged with the lift table 44.
前記巻取 Z繰出機構 7 0は、 第 3図に示すように、 前記フレーム 1 7の 上部及び下部の双方に設けられており、 具体的には、 第 6図に示すように 、 巻取軸 7 2, 7 6、 この巻取軸 7 2 , 7 6の双方に連結した駆動軸 7 1 、 駆動軸 7 1 を駆動するギヤ 8 5などからなる。 卷取軸 7 2 , 7 6はそれぞれブラケッ ト 7 5, 7 9によって回転自在に 支持されている。 そして、 シート体 6 6は、 前記ブラケッ ト 7 5に回転自 在に支持されたガイ ドローラ 7 3 , 7 4に順次経由してその端部が前記巻 取軸 7 2に巻き取られ、 シー卜体 6 5は、 前記ブラケッ トフ 9に回転自在 に支持されたガイ ドローラ 7 7, 7 8に順次経由してその端部が前記巻取 軸 7 6に卷き取られている。 As shown in FIG. 3, the winding Z feeding mechanism 70 is provided on both the upper and lower portions of the frame 17. Specifically, as shown in FIG. 72, 76, a drive shaft 71 connected to both of the winding shafts 72, 76, a gear 85 for driving the drive shaft 71, and the like. The winding shafts 72 and 76 are rotatably supported by brackets 75 and 79, respectively. Then, the end of the sheet body 66 is sequentially wound on the winding shaft 72 via guide rollers 73 and 74 which are supported by the bracket 75 in a rotating manner, and the sheet is taken up. The end of the body 65 is wound around the winding shaft 76 via guide rollers 77 and 78 rotatably supported by the bracket 9 in order.
前記ギヤ 8 5は、 第 7図に示すように、 トルクキーパ 8 6に固設されて いる。 トルクキ一パ 8 6は回転軸 8 1 によって軸通され、 回転軸 8 1 はブ ラケッ ト 8 4に固着されたベアリング 9 0及び一方向クラッチ 8 7によつ て支持されている。 また、 回転軸 8 1の端部には一方向クラッチ 8 8を介 してプーリ 8 0が固着されている。 そして、 ギヤ 8 5は、 前記駆動軸 7 1 に固着されたギヤ 8 9と嚙合している。 尚、 前記一方向クラッチ 8 7 , 8 8は、 前記回転軸 8 1 の回転方向を規制する機能を有する。 本例では、 上 部に設けられた巻取 繰出機構 7 0の場合、 回転軸 8 1の矢示 E方向への 回転を規制する一方、 矢示 F方向への回転はこれを許容するようになって おり、 下部に設けられた卷取 繰出機構 7 0の場合、 回転軸 8 1 の矢示 F 方向への回転を規制する一方、 矢示 E方向への回転はこれを許容するよう になっている。 また、 トルクキーパ 8 6は、 いわゆる摩擦クラッチであり 、 回転軸 8 1 に対して所定の制動力 (ブレーキ力) を付与する。  The gear 85 is fixed to a torque keeper 86 as shown in FIG. The torque cap 86 is passed through a rotating shaft 81, and the rotating shaft 81 is supported by a bearing 90 fixed to a bracket 84 and a one-way clutch 87. A pulley 80 is fixed to an end of the rotating shaft 81 via a one-way clutch 88. The gear 85 is combined with a gear 89 fixed to the drive shaft 71. The one-way clutches 87 and 88 have a function of regulating the rotation direction of the rotating shaft 81. In this example, in the case of the winding / unwinding mechanism 70 provided at the upper part, the rotation of the rotating shaft 81 in the direction of arrow E is restricted, while the rotation in the direction of arrow F is permitted. In the case of the winding / unwinding mechanism 70 provided at the lower part, the rotation of the rotating shaft 81 in the direction of arrow F is restricted, while the rotation in the direction of arrow E is permitted. ing. The torque keeper 86 is a so-called friction clutch, and applies a predetermined braking force (braking force) to the rotating shaft 81.
また、 第 3図に示すように、 上下に設けられた前記プーリ 8 0 , 8 0に は、 無端状に形成された伝動ベルト 8 2が巻回され、 伝動ベル卜 8 2は、 前記ナツ ト 4 2に固着されたホルダ 8 3によって保持されている。  As shown in FIG. 3, an endless transmission belt 82 is wound around the pulleys 80 provided on the upper and lower sides, and the transmission belt 82 is It is held by a holder 83 fixed to 42.
次に、 以上の構成を備えた基板処理システム 1 の作動について説明する 。 尚、 前記昇降式基板処理装置 1 0は、 第 3図において実線で示した状態 にあるものとする。  Next, the operation of the substrate processing system 1 having the above configuration will be described. It is assumed that the liftable substrate processing apparatus 10 is in a state shown by a solid line in FIG.
まず、 移戴装置 3によってカセッ ト 5から順次基板 Kが取り出され、 第 1基板処理装置 6に投入される。 投入された基板 Kは、 第 1基板処理装置 6内で矢示方向に搬送されながら所定の処理 (エッチング処理) を施され た後、 順次第 1基板処理装置 6から排出される。 排出された基板 Kは、 次に昇降式基板処理装置 1 0の開口部 1 1 a , 開 口部 2 3 aを順次通って洗浄装置 2 2内に進入し、 搬送ローラ 2 6の作用 によって内部に搬入され、 基板 Kの搬入中若しくは搬入後に、 ノズル 2 9 , 3 0から洗浄液が吐出されて、 基板 Kの洗浄が開始される。 そして、 洗 浄を終了するまで、 前記基板 Kが搬入/排出方向に所定距離だけ前後動す るように、 前記搬送ローラ 2 6の回転が正逆に連続して切リ換えられる。 これにより、 ノズル 2 9, 3 0から吐出される洗浄液の吐出量, 吐出圧に むらがある場合であっても、 基板 Kを前後動させることで、 基板 K上面に おける前記むらを平均化することができ、 基板 Kをむらなく洗浄すること ができる。 First, the substrates K are sequentially taken out of the cassette 5 by the transfer device 3 and put into the first substrate processing device 6. The loaded substrate K is subjected to a predetermined process (etching process) while being conveyed in the direction indicated by an arrow in the first substrate processing apparatus 6, and is sequentially discharged from the first substrate processing apparatus 6. The ejected substrate K then passes through the opening 11 a and the opening 23 a of the elevating type substrate processing apparatus 10, enters the cleaning apparatus 22 sequentially, and is internally moved by the action of the transport rollers 26. During or after the transfer of the substrate K, the cleaning liquid is discharged from the nozzles 29 and 30 to start the cleaning of the substrate K. Until the washing is completed, the rotation of the transport roller 26 is continuously switched forward and reverse so that the substrate K moves back and forth by a predetermined distance in the loading / unloading direction. Thus, even if the discharge amount and the discharge pressure of the cleaning liquid discharged from the nozzles 29 and 30 are uneven, the unevenness on the upper surface of the substrate K is averaged by moving the substrate K back and forth. Thus, the substrate K can be washed evenly.
基板 Kの洗浄装置 2 2内への搬入を完了すると、 次に昇降機構 4 0のサ ーポモータ 4 3が駆動されて、 洗浄装置 2 2が降下せしめられる。 即ち、 サ一ボモータ 4 3によりボールねじ 4 1 が降下方向に回転せしめられると 、 これに螺合したナツ ト 4 2がボールねじ 4 1に沿って降下し、 ナツ 卜 4 2に連結された昇降台 4 4、 この昇降台 4 4に連結具 5 5, 5 6及び 5 7 , 5 8を介して連結された支持架台 1 3、 及び支持架台 1 3に支持される 洗浄装置 2 2がナツ ト 4 2と共に降下する。  When the transfer of the substrate K into the cleaning device 22 is completed, the servomotor 43 of the elevating mechanism 40 is driven, and the cleaning device 22 is lowered. That is, when the ball screw 41 is rotated in the descending direction by the servo motor 43, the nut 42 screwed thereto descends along the ball screw 41, and the lift connected to the nut 42 moves up and down. Table 44, a support base 13 connected to the elevating base 44 via connectors 55, 56 and 57, 58, and a cleaning device 22 supported by the support base 13 is a nut. 4 Descent with 2
ナッ ト 4 2が降下すると、 ホルダ 8 3を介してナッ ト 4 2に連結された 伝動ベル卜 8 2が矢示 C方向に回動する。 また、 連結具 5 5 , 5 6及び 5 7 , 5 8が降下すると、 これに固着されたシート体 6 5 , 6 6が共に下方 に移動し、 これに伴って、 上部に設けられた巻取 Z繰出機構 7 0からシ一 ト体 6 5, 6 6が繰り出され、 下部に設けられた卷取 繰出機構 7 0にシ ート体 6 5 , 6 6が巻き取られる。  When the nut 42 is lowered, the transmission belt 82 connected to the nut 42 via the holder 83 rotates in the direction of arrow C. When the connecting members 55, 56 and 57, 58 are lowered, the sheet members 65, 66 fixed to the connecting members 55, 66 move downward together with the winding member provided at the upper part. The sheet bodies 65, 66 are unwound from the Z unwinding mechanism 70, and the sheet bodies 65, 66 are wound by a winding unwinding mechanism 70 provided at a lower portion.
この卷取 繰出機構 7 0の巻取 繰出動作を、 第 7図を用いて更に詳し く説明する。 第 7図は、 上部及び下部に設けられた巻取/繰出機構 7 0の 平断面図である。 尚、 図示に基づき、 連結具 5 7 , 5 8及びシート体 6 6 について説明するが、 連結具 5 5 , 5 6及びシート体 6 5についても同様 である。  The winding / unwinding operation of the winding / unwinding mechanism 70 will be described in more detail with reference to FIG. FIG. 7 is a cross-sectional plan view of the winding / unwinding mechanism 70 provided at the upper part and the lower part. The connecting members 57 and 58 and the sheet body 66 will be described with reference to the drawings, but the same applies to the connecting members 55 and 56 and the sheet body 65.
まず、 上部に設けられた巻取 繰出機構 7 0について説明する。 上部に 設けられた卷取 Z繰出機構 7 0では、 連結具 5 7, 5 8が降下すると、 シ —卜体 6 6に張力が生じ、 卷取軸 7 2に矢示 H方向に回転動力が付与され る。 この回転動力は、 卷取軸 7 2に連結した駆動軸 7 1 、 これに固着され たギヤ 8 8、 ギヤ 8 8に嚙合したギヤ 8 5、 ギヤ 8 5が装着されたトルク キーパ 8 6を順次介して回転軸 8 1 に伝達される。 しかしながら、 回転軸 8 1 は一方向クラッチ 8 7によって矢示 E方向への回転が規制されている ため、 同方向の回転が阻止される。 このため、 シート体 6 6に生じる張力 が次第に増大して前記トルクキ一パ 8 6に伝達される トルクが増大する。 First, the winding / unwinding mechanism 70 provided on the upper part will be described. At the top In the provided winding Z feeding mechanism 70, when the connecting members 57, 58 are lowered, tension is generated in the sheet body 66, and rotational power is applied to the winding shaft 72 in the direction indicated by the arrow H. You. This rotating power is transmitted to a drive shaft 71 connected to a winding shaft 72, a gear 88 fixed thereto, a gear 85 combined with the gear 88, and a torque keeper 86 fitted with the gear 85 in order. Is transmitted to the rotating shaft 81 via However, since the rotation of the rotating shaft 81 in the direction indicated by the arrow E is restricted by the one-way clutch 87, the rotation in the same direction is prevented. Therefore, the tension generated in the sheet body 66 gradually increases, and the torque transmitted to the torque keeper 86 increases.
トルクキーパ 8 6は、 ギヤ 8 5に作用する トルクが所定の大きさよりも 大きくなると、 ギヤ 8 5がトルク作用方向に回転するのを許容する。 これ により、 ギヤ 8 5は矢示 E方向に、 ギヤ 8 8 , 駆動軸 7 1 及び巻取軸 7 2 は矢示 H方向にそれぞれ回転して、 シート体 6 6が巻取軸 7 2から繰り出 される。 このように、 シート体 6 6は所定の張力を生じた状態で繰り出さ れるので、 繰り出しの際に弛みを生じることがない。  The torque keeper 86 allows the gear 85 to rotate in the torque acting direction when the torque acting on the gear 85 becomes larger than a predetermined magnitude. As a result, the gear 85 rotates in the direction indicated by the arrow E, and the gear 88, the drive shaft 71 and the winding shaft 72 rotate in the direction indicated by the arrow H, so that the sheet body 66 unwinds from the winding shaft 72. Will be issued. As described above, since the sheet body 66 is fed out with a predetermined tension, there is no slack when the sheet body 66 is fed out.
—方、 ナツ ト 4 2の降下によって、 伝動ベル卜 8 2が第 3図に示した矢 示 C方向に回動すると、 プーリ 8 0は矢示 E方向の回転動力を受けるが、 プーリ 8 0と回転軸 8 1 との間に介在する一方向クラッチ 8 8によって、 プーリ 8 0は回転軸 8 1 に対して矢示 E方向に回転自在となっており、 プ ーリ 8 0は支障なく伝動ベルト 8 2に従がつて矢示 E方向に回転する。 一 方向クラッチ 8 8は、 回転軸 8 1 の矢示 E方向の回転を規制するが、 矢示 F方向の回転はこれを許容するようになっている。 したがって、 一方向ク ラッチ 8 8は、 回転軸 8 1 に対して矢示 E方向に回転自在となっている。 次に、 下部に設けられた巻取 Z繰出機構 7 0について説明する。 下部に 設けられた巻取 繰出機構 7 0では、 ナッ ト 4 2が降下して伝動ベルト 8 2が前記矢示 C方向に回動すると、 プーリ 8 2が矢示 E方向の回転動力を 受ける。 上述したように、 下部に設けられた卷取 繰出機構 7 0の場合、 一方向クラッチ 8 7 , 8 8は、 回転軸 8 1の矢示 F方向への回転を規制す る一方、 矢示 E方向への回転はこれを許容するようになっている。 したが つて、 プーリ 8 2が矢示 E方向の回転動力を受けると、 回転軸 8 1 は同方 向に回転する。 回転軸 8 1が矢示 E方向に回転すると、 その回転動力がト ルクキーパ 8 6, ギヤ 8 5及びギヤ 8 8を介して、 駆動軸 7 1及び巻取軸 7 2に伝達され、 これらが矢示 H方向に回転せしめられて、 シート体 6 6 が巻取軸 6 6に巻き取られる。 On the other hand, when the transmission belt 82 rotates in the direction of arrow C shown in FIG. 3 due to the descent of the nut 42, the pulley 80 receives rotational power in the direction of arrow E, but the pulley 80 The pulley 80 is rotatable in the direction of arrow E with respect to the rotating shaft 81 by a one-way clutch 88 interposed between the rotating shaft 81 and the pulley 80. It rotates in the direction of arrow E following the belt 82. The one-way clutch 88 regulates the rotation of the rotating shaft 81 in the direction of arrow E, but the rotation in the direction of arrow F allows this. Therefore, the one-way clutch 88 is rotatable in the direction indicated by the arrow E with respect to the rotating shaft 81. Next, the winding Z feeding mechanism 70 provided at the lower portion will be described. In the winding / unwinding mechanism 70 provided at the lower portion, when the nut 42 descends and the transmission belt 82 rotates in the direction of the arrow C, the pulley 82 receives rotational power in the direction of the arrow E. As described above, in the case of the winding / unwinding mechanism 70 provided at the lower portion, the one-way clutches 87 and 88 restrict the rotation of the rotating shaft 81 in the direction of arrow F, while the arrow E Rotation in the direction allows this. Therefore, when the pulley 82 receives rotational power in the direction indicated by the arrow E, the rotating shaft 81 is in the same direction. Rotate in the direction. When the rotating shaft 81 rotates in the direction indicated by the arrow E, its rotational power is transmitted to the drive shaft 71 and the winding shaft 72 via the torque keeper 86, gear 85 and gear 88, and these are transmitted by the arrow. The sheet body 6 6 is rotated in the direction H shown in FIG.
尚、 本例では、 シート体 6 6及び伝動ベルト 8 2の移動速度よりも、 巻 取軸 7 2の卷取速度が速くなるように、 巻取軸 7 2の軸径、 プーリ 8 0の 径、 及びギヤ 8 5とギヤ 8 8との間のギヤ比が設定されている。 シート体 6 6の移動速度よりも巻取軸 7 2の卷取速度を速くすると、 シート体 6 6 に生じる張力が次第に増大してトルクキ一パ 8 6に伝達されるトルクが増 大する。 上述したように、 トルクキーパ 8 6は、 ギヤ 8 5に作用する トル クが所定の大きさよリも大きくなると、 ギヤ 8 5がトルク作用方向に回転 するのを許容する。 これによリ、 ギヤ 8 5と回転軸 8 1 とはスリップした 状態となり、 回転軸 8 1 は支障なくプーリ 8 0に従がつて矢示 E方向に回 転する。 このように、 シ一卜体 6 6は所定の張力を生じた状態で巻き取ら れるので、 卷取に際して弛みを生じることがない。  In this example, the diameter of the winding shaft 72 and the diameter of the pulley 80 are set such that the winding speed of the winding shaft 72 is faster than the moving speed of the sheet body 66 and the transmission belt 82. , And the gear ratio between gear 85 and gear 88 is set. When the winding speed of the winding shaft 72 is higher than the moving speed of the sheet body 66, the tension generated in the sheet body 66 gradually increases, and the torque transmitted to the torque keeper 86 increases. As described above, the torque keeper 86 allows the gear 85 to rotate in the torque acting direction when the torque acting on the gear 85 becomes larger than a predetermined magnitude. As a result, the gear 85 and the rotary shaft 81 slip, and the rotary shaft 81 follows the pulley 80 and rotates in the direction of arrow E without any trouble. As described above, since the sheet body 66 is wound in a state where a predetermined tension is generated, the sheet body 66 does not loosen during winding.
以上詳述したように、 本例の巻取/繰出機構 7 0によれば、 洗浄装置 2 2の降下に伴って、 弛み無く、 シート体 6 5, 6 6を巻き取り及び繰り出 しすることができる。  As described in detail above, according to the winding / unwinding mechanism 70 of the present example, the sheets 65, 66 can be wound and unwound without any slack when the cleaning device 22 is lowered. Can be.
上記の如く して洗浄装置 2 2が下降端まで降下すると、 次に、 前記搬送 ローラ 2 6が排出方向に回転せしめられて基板 Kが開口部 2 3 aから排出 され、 カバー体 1 1の開口部 1 1 bから第 2基板処理装置 7に移送される 。 尚、 洗浄装置 2 2が下降端に達した状態を、 第 3図において 2点鎖線で 示している。  When the cleaning device 22 is lowered to the lower end as described above, next, the transport roller 26 is rotated in the discharge direction, the substrate K is discharged from the opening 23 a, and the opening of the cover body 11 is opened. It is transferred from the unit 11 b to the second substrate processing apparatus 7. The state in which the cleaning device 22 has reached the lower end is shown by a two-dot chain line in FIG.
基板 Kの排出を完了すると、 洗浄装置 2 2では、 ノズル 2 9 , 3 0から の洗浄液の吐出が停止される。 そして、 昇降機構 4 0のサーポモータ 4 3 が駆動され、 洗浄装置 2 2が上昇せしめられる。 その際、 上記とは逆の作 動によって、 上部に設けられた巻取 繰出機構 7 0にシ一卜体 6 5 , 6 6 が卷き取られ、 下部に設けられた卷取/繰出機構 7 0からシート体 6 5, 6 6が繰り出される。 そして、 洗浄装置 2 2が上昇端に達すると、 上述した基板 Kの搬入以降 の動作が繰り返される。 尚、 洗浄装置 2 2の昇降の際にサーボモータ 4 3 に作用する負荷が、 バランサ 5 0によって軽減されるようになっている。 一方、 第 2基板処理装置 7では、 搬入された基板 Kが矢示方向に搬送さ れながら所定の処理 (水洗処理及び乾燥処理) を施され、 処理を終えて排 出された基板 Kは移戴装置 3によって再びカセッ ト 5内に格納される。 こ のように、 本例の基板処理システム 1 では、 カセッ ト 5内に格納された基 板 Kが、 順次、 第 1基板処理装置 6 , 昇降式基板処理装置 1 0及び第 2基 板処理装置 7に経由することによって、 所定の処理が施され、 再び、 カセ ッ 卜 5内に格納される。 When the discharge of the substrate K is completed, the discharge of the cleaning liquid from the nozzles 29 and 30 in the cleaning device 22 is stopped. Then, the servo motor 43 of the lifting mechanism 40 is driven, and the cleaning device 22 is raised. At this time, the sheet bodies 65, 66 are wound around the winding / unwinding mechanism 70 provided at the upper part by the operation opposite to the above, and the winding / unwinding mechanism 7 provided at the lower part. Sheet bodies 65 and 66 are fed from 0. Then, when the cleaning device 22 reaches the rising end, the above-described operation after the transfer of the substrate K is repeated. The load acting on the servomotor 43 when the cleaning device 22 is moved up and down is reduced by the balancer 50. On the other hand, in the second substrate processing apparatus 7, the loaded substrate K is subjected to predetermined processing (water washing processing and drying processing) while being transported in the direction of the arrow, and the discharged substrate K after the processing is transferred. It is stored in the cassette 5 again by the device 3. As described above, in the substrate processing system 1 of the present example, the substrates K stored in the cassette 5 are sequentially converted into the first substrate processing device 6, the elevating substrate processing device 10 and the second substrate processing device. By passing through 7, predetermined processing is performed and stored in the cassette 5 again.
以上詳述したように、 本例の基板処理システム 1 によれば、 第 1基板処 理装置 6と第 2基板処理装置 7 とを上下に並設し、 これらを昇降式基板処 理装置 1 0によって連結した構成としているので、 第 1基板処理装置 6と 第 2基板処理装置 7とを同一の水平平面内に並設した上記従来の処理シス テム 2 0 0と比べて、 その設置スペースが小さくて足り、 これを効率良く 設置することが可能である。  As described in detail above, according to the substrate processing system 1 of the present example, the first substrate processing apparatus 6 and the second substrate processing apparatus 7 are vertically arranged side by side, and these are vertically movable substrate processing apparatuses 10. The first substrate processing apparatus 6 and the second substrate processing apparatus 7 have a smaller installation space compared to the conventional processing system 200 in which the first substrate processing apparatus 6 and the second substrate processing apparatus 7 are juxtaposed in the same horizontal plane. It is possible to install this efficiently.
また、 本例の昇降式基板処理装置 1 0では、 基板 Kを搬送, 支持する搬 送ローラ 2 6及び基板 Kに洗浄液を吐出するノズル 2 9 , 3 0からなる洗 浄装置 2 2全体を昇降させるようにしているので、 基板 Kを搬送する際に 、 基板 Kとノズル 2 9 , 3 0との位置関係が変化することがなく、 したが つて、 ノズル 2 9, 3 0から吐出される洗浄液を基板 Kの各部にほぼ均等 に供給することが可能であり、 これにより、 むらのない洗浄を行なうこと ができる。  In addition, in the elevating type substrate processing apparatus 10 of this example, the entire cleaning apparatus 22 including the transport rollers 26 for transporting and supporting the substrate K and the nozzles 29 and 30 for discharging the cleaning liquid onto the substrate K is raised and lowered. When the substrate K is transported, the positional relationship between the substrate K and the nozzles 29 and 30 does not change, and therefore, the cleaning liquid discharged from the nozzles 29 and 30 is not changed. Can be almost uniformly supplied to each part of the substrate K, whereby uniform cleaning can be performed.
また、 昇降機構 4 0によって洗浄装置 2 2を昇降させるという単一の動 作で基板 Kを搬送しており、 また、 サーポモータ 4 3 , ボールねじ 4 1及 びナツ ト 4 2からなる高精度に制御可能な機構によって昇降させているの で、 その速度制御を高精度に行うことができる。  In addition, the substrate K is transported by a single operation of raising and lowering the cleaning device 22 by the elevating mechanism 40, and a high accuracy comprising the servo motor 43, the ball screw 41, and the nut 42. Since it is raised and lowered by a controllable mechanism, its speed can be controlled with high accuracy.
第 1基板処理装置 6において使用されるエッチング液は腐食性が極めて 高く、 このエッチング液を含む洗浄水が洗浄装置 2 2から流出して昇降機 構 4 0に付着すると、 これが損傷してその機能が損なわれる懸念がある。 本例の昇降式基板処理装置 1 0によれば、 昇降機構 4 0が配設される駆動 室 Bと、 洗浄装置 2 2が配設される処理室 Aとを、 仕切リ部材 1 1 a , 1 4 , 1 6、 筒状部材 1 3 , 1 3、 連結具 5 5 , 5 6 , 5 7 , 5 8、 シ一ト 体 6 5 , 6 6により仕切っているので、 洗浄装置 2 2から流出したエッチ ング液が駆動室 Bに侵入するのを防止することができ、 エッチング液によ つて昇降機構 4 0が損傷するのを防止することができる。 The etchant used in the first substrate processing apparatus 6 is extremely corrosive, and the cleaning water containing the etchant flows out of the cleaning apparatus 22 and moves up and down. If it adheres to the structure 40, it may be damaged and its function may be impaired. According to the elevating type substrate processing apparatus 10 of this example, the driving chamber B in which the elevating mechanism 40 is disposed and the processing chamber A in which the cleaning device 22 is disposed are divided into partitioning members 1 1 a, 1 4, 16, cylindrical members 13, 13, couplers 55, 56, 57, 58, and sheets 65, 66, so they flow out of the cleaning device 22 It is possible to prevent the etched etching liquid from entering the driving chamber B, and prevent the lifting mechanism 40 from being damaged by the etching liquid.
特に、 仕切り部材 1 l a , 1 4 , 1 6間に形成した開口部の上下方向の 縁部にそれぞれ筒状部 1 5及び筒状部材 1 3を設けるとともに、 連結具 5 5, 5 6及び 5 7 , 5 8に固着されたシート体 6 5, 6 6の両側縁部を、 筒状部 1 5及び筒状部材 1 3に形成された切り欠き溝から内部に挿入せし めた、 いわゆるラビリンス構造とし、 しかも筒状部 1 5及び筒状部材 1 3 の内部を排気手段によつて排気しているので、 駆動室 Bへのエッチング液 の侵入を確実に防止することができる。  In particular, a tubular portion 15 and a tubular member 13 are provided at the vertical edges of the opening formed between the partition members 1 la, 14, 16, respectively, and the connecting members 55, 56, and 5 are provided. A so-called labyrinth in which both side edges of the sheet bodies 65, 66 fixed to 7, 58 are inserted into cutout grooves formed in the cylindrical portion 15 and the cylindrical member 13, respectively. Since the structure is employed, and the inside of the cylindrical portion 15 and the cylindrical member 13 is exhausted by the exhaust means, the intrusion of the etching solution into the drive chamber B can be reliably prevented.
以上、 本発明の一実施形態について説明したが、 本発明の採り得る具体 的な態様は、 何らこれに限定されるものではない。 例えば、 上述の例では 、 洗浄装置 2 2の昇降に合わせて、 シート体 6 5 , 6 6を巻取/繰出機構 7 0によって巻き取り, 繰り出しするようにしたが、 シート体 6 5 , 6 6 を無端, 環状に形成し、 洗浄装置 2 2の昇降に合わせて、 これらが回動す るように構成することもできる。  As mentioned above, although one Embodiment of this invention was described, the specific aspect which this invention can take is not limited to this at all. For example, in the above-described example, the sheet bodies 65 and 66 are wound up and fed out by the winding / unwinding mechanism 70 in accordance with the elevation of the cleaning device 22. However, the sheet bodies 65 and 66 Can be formed endlessly and annularly, and they can be configured to rotate as the cleaning device 22 moves up and down.
また、 上例では、 昇降式基板処理装置 1 0において洗浄を行なうように 構成したが、 これに限られるものでは無く、 エッチングや他の処理を行な うようにしても良い。 このことは、 第 1基板処理装置 6及び第 2基板処理 装置 7についても同様である。  Further, in the above example, the cleaning is performed in the liftable substrate processing apparatus 10, but the present invention is not limited to this, and etching or other processing may be performed. This is the same for the first substrate processing apparatus 6 and the second substrate processing apparatus 7.
また、 本発明に係る昇降式基板処理装置を用いた基板処理システムの他 の態様として、 第 8図及び第 9図に示したものを挙げることができる。 同 第 8図に示すように、 この基板処理システム 1 0 0は、 基板投入ノ排出部 1 0 1 、 ドライ処理部 1 1 0、 洗浄装置 1 2 0からなる。  Further, as another embodiment of the substrate processing system using the lifting type substrate processing apparatus according to the present invention, the one shown in FIGS. 8 and 9 can be mentioned. As shown in FIG. 8, the substrate processing system 100 is composed of a substrate input / output unit 101, a dry processing unit 110, and a cleaning device 120.
基板投入 Z排出部 1 0 1 は、 複数の基板を収納したカセッ 卜 1 3 1 を載 置する載置台 1 0 2と、 基板を搬送する移載装置 1 0 3とからなり、 移載 装置 1 0 3は、 軌道 1 0 4上をその長手方向に沿って移動可能に設けられ た移載ロボッ ト 1 0 5から構成される。 移載ロボッ ト 1 0 5は 3次元空間 内の任意位置に移動可能となったハンドを備え、 当該ハンド上に基板を載 置した状態で、 載置台 1 0 2上のカセッ ト 1 3 1 内から基板を一枚づっ取 り出してドライ処理部 1 1 0に投入したり、 ドライ処理部 1 1 0から排出 された基板を洗浄装置 1 2 0に投入したリ、 洗浄装置 1 2 0から排出され た基板をカセッ ト 1 3 1 内に再び格納する処理を行う。 尚、 カセッ ト 1 3 1 は自動搬送車 1 3 0によって載置台 1 0 2上に搬入され、 当該載置台 1 0 2上から搬出される。 Substrate loading Z discharge section 101 mounts a cassette 1 3 1 containing multiple substrates And a transfer device 103 for transferring the substrate. The transfer device 103 is provided so as to be movable along a track 104 along the longitudinal direction thereof. It consists of on-board robot 105. The transfer robot 105 has a hand that can be moved to an arbitrary position in the three-dimensional space, and the substrate is placed on the hand. Substrates are taken out one by one and put into the dry processing unit 110, or the substrate discharged from the dry processing unit 110 is put into the cleaning device 120 and discharged from the cleaning device 120. A process is performed to store the loaded board in cassette 13 1 again. Note that the cassette 1311 is carried into the mounting table 102 by the automatic transport vehicle 130 and is carried out from the mounting table 102.
ドライ処理部 1 1 0は、 基板受渡し用の載置台 1 1 3と、 基板に対して ドライエッチングや成膜処理などのドライプロセスを実施する 2台のドラ ィ処理装置 1 1 1 と、 これら載置台 1 1 3と ドライ処理装置 1 1 1 との間 に配設された移載ロボッ ト 1 1 2とから構成される。 移載ロボッ 卜 1 1 2 は、 前記移載ロボッ ト 1 0 5と同様に 3次元空間内の任意位置に移動可能 となったハンドを備え、 当該ハンド上に基板を載置した状態で、 載置台 1 1 3上の基板をドライ処理装置 1 1 1 に投入したリ、 ドライ処理装置 1 1 から基板を取り出して載置台 1 1 3上に載置する処理を行う。  The dry processing section 110 includes a mounting table 113 for transferring the substrate, and two dry processing apparatuses 111 for performing a dry process such as dry etching and film formation on the substrate. It is composed of a transfer robot 1 1 2 arranged between the table 1 1 3 and the dry processing apparatus 1 1 1. The transfer robot 112 has a hand that can be moved to an arbitrary position in a three-dimensional space in the same manner as the transfer robot 105, and the transfer robot 112 has a substrate mounted on the hand. The substrate on the mounting table 1 1 3 is put into the dry processing apparatus 1 1 1, and then the substrate is taken out from the dry processing apparatus 1 1 1 and placed on the mounting table 1 1 3.
洗浄装置 1 2 0は、 第 9図に示すように、 筐体状のカバー体を備え、 そ の内部を、 基板受入部 1 2 1 , 基板降下搬送部 1 2 2, ブラシ洗浄部 1 2 3 , 傾斜リ ンス処理部 1 2 4, 基板上昇搬送部 1 2 5 , 基板乾燥部 1 2 6 及び基板払出部 1 2 7などからなる複数の領域に区画形成した構成を備え 、 前記移載ロボッ ト 1 0 5によって基板受入部 1 2 1 に基板が搬入され、 基板払出部 1 2 7から基板が排出される。  As shown in FIG. 9, the cleaning device 120 has a housing-like cover body, and the inside thereof is provided with a substrate receiving part 121, a substrate lowering and conveying part 122, and a brush cleaning part 123. The transfer robot has a configuration in which the transfer robot is divided into a plurality of regions including a tilt rinsing unit 124, a substrate raising / conveying unit 125, a substrate drying unit 126, and a substrate discharging unit 127. The substrate is carried into the substrate receiving portion 121 by 105, and the substrate is discharged from the substrate discharging portion 127.
前記基板受入部 1 2 1 , 基板降下搬送部 1 2 2, ブラシ洗浄部 1 2 3 , 傾斜リンス処理部 1 2 4 , 基板上昇搬送部 1 2 5 , 基板乾燥部 1 2 6及び 基板払出部 1 2 7はそれぞれ第 1 1 図に示した如き搬送ローラ 2 0 8の複 数を備えておリ、 基板受入部 1 2 1 に搬入された基板が、 搬送ローラ 2 0 8によって矢示方向の搬送され、 基板降下搬送部 1 2 2 , ブラシ洗浄部 1 2 3, 傾斜リ ンス処理部 1 2 4, 基板上昇搬送部 1 2 5, 基板乾燥部 1 2 6を順次経由して基板払出部 1 2 7に搬送される。 Substrate receiving section 1 2 1, Substrate lowering transport section 1 2 2, Brush cleaning section 1 2 3, Inclined rinsing section 1 2 4, Substrate ascending transport section 1 2 5, Substrate drying section 1 2 6, and Substrate unloading section 1 Each of the substrates 27 has a plurality of transport rollers 208 as shown in FIG. 11, and the substrate carried into the substrate receiving portion 121 is transported in the direction of the arrow by the transport rollers 208. 1 2 2, brush cleaning section 1 23, Inclined rinsing unit 124, Substrate lifting / conveying unit 125, Substrate drying unit 126 The substrate is conveyed to the substrate unloading unit 127 in order.
また、 ブラシ洗浄部 1 2 3 , 傾斜リ ンス処理部 1 2 4, 基板上昇搬送部 1 2 5 , 基板乾燥部 1 2 6は、 搬送ローラ 2 0 8によって基板を搬送しな がら所定の処理を行なう。  In addition, the brush cleaning section 123, the inclined rinsing section 124, the substrate ascending transport section 125, and the substrate drying section 126 perform predetermined processing while transporting the substrate by the transport roller 208. Do.
基板上昇搬送部 1 2 5は、 上述した昇降式基板処理装置 1 0とほぼ同様 の構成を備えている。 また、 ブラシ洗浄部 1 2 3では、 洗浄水の供給を伴 つた回転ブラシによって基板が洗浄され、 傾斜リ ンス処理部 1 2 4では、 斜めに傾けた状態の基板上面に洗浄水が供給されてこれが洗浄され、 基板 上昇搬送部 1 2 5では、 上述の昇降式基板処理装置 1 0と同様の洗浄が行 われ、 基板乾燥部 1 2 6では、 基板に乾燥用の気体が吹き付けられること によって当該基板が乾燥される。  The substrate ascending and transporting section 125 has substantially the same configuration as the above-described elevating type substrate processing apparatus 10. In the brush cleaning section 123, the substrate is cleaned by a rotating brush that supplies cleaning water, and in the inclined rinsing section 124, cleaning water is supplied to the upper surface of the substrate that is inclined. This is cleaned, and in the substrate ascending and transporting section 125, the same cleaning as in the above-described elevating type substrate processing apparatus 10 is performed, and in the substrate drying section 126, the substrate is blown with a gas for drying. The substrate is dried.
尚、 傾斜リンス処理部 1 2 4で傾斜せしめられた基板は、 これを当該傾 斜リンス処理部 1 2 4で水平姿勢に戻すようにしても、 基板上昇搬送部 1 2 5において水平姿勢に戻すようにしてもいずれでも良い。  The substrate tilted by the inclined rinsing unit 124 may be returned to the horizontal position by the substrate rising / conveying unit 125, even if the substrate is returned to the horizontal position by the inclined rinsing unit 124. Either way may be used.
斯く して、 この基板処理システム 1 0 0によると、 載置台 1 0 2上に載 置されたカセッ ト 1 3 1 内の基板が、 移載ロポッ ト 1 0 5によって一枚づ つ取リ出されて、 ドライ処理部 1 1 0に投入された後、 洗浄装置 1 2 0に 投入されるか、 或いは、 洗浄装置 1 2 0に投入され後、 ドライ処理部 1 1 0に投入される。  Thus, according to the substrate processing system 100, the substrates in the cassette 13 1 mounted on the mounting table 102 are removed one by one by the transfer robot 105. Then, after being put into the dry processing unit 110, it is put into the cleaning device 120, or is put into the cleaning device 120, and then put into the dry processing unit 110.
代表例として、 ドライ処理部 1 1 0に投入された後に洗浄装置 1 2 0に 投入される場合について説明すると、 ドライ処理部 1 1 0に投入された基 板は、 当該ドライ処理部において移載ロボッ ト 1 1 2により ドライ処理装 置 1 1 1 に投入されて、 所定のドライプロセスが実施される。 ドライ処理 装置 1 1 1 で処理された基板は移載ロポッ 卜 1 1 2によって取り出され、 載置台 1 1 3を介して移載ロボッ ト 1 0 5に引き渡される。  As a typical example, a case where the substrate is put into the cleaning device 120 after being put into the dry processing unit 110 will be described. The substrate put into the dry processing unit 110 is transferred to the dry processing unit. The robot is put into the dry processing device 111 by the robot 112, and a predetermined dry process is performed. The substrate processed by the dry processing apparatus 111 is taken out by the transfer robot 112 and transferred to the transfer robot 105 via the mounting table 113.
ついで、 移載口ポッ ト 1 0 5により洗浄装置 1 2 0に投入され、 その基 板受入部 1 2 1 , 基板降下搬送部 1 2 2, ブラシ洗浄部 1 2 3, 傾斜リン ス処理部 1 2 4 , 基板上昇搬送部 1 2 5, 基板乾燥部 1 2 6及び基板払出 部 1 2 7に順次経由, 搬送される間に所定の洗浄が施され、 移載ロボッ ト 1 0 5によって基板払出部 1 2 7から取り出されて、 再びカセッ ト 1 3 1 内に格納される。 Next, the wafer is put into the cleaning device 120 through the transfer port 105, and the substrate receiving portion 121, the substrate lowering / transporting portion 122, the brush cleaning portion 122, and the inclined rinsing portion 1 are provided. 2 4, board ascending transport section 1 2 5, board drying section 1 2 6 and board unloading Predetermined cleaning is performed while the paper is sequentially passed through and transported to the part 127. The substrate is taken out of the substrate unloading part 127 by the transfer robot 105, and is stored again in the cassette 131. .
このようにして、 カセッ ト 1 3 1 内の基板が順次取リ出されて所定の処 理が施され、 再びカセッ ト 1 3 1 内に戻される。 産業上の利用可能性  In this way, the substrates in the cassette 13 1 are sequentially removed, subjected to a predetermined process, and returned to the cassette 13 1 again. Industrial applicability
本発明にかかる昇降式基板処理装置及びこれを備えた基板処理システム は、 従来に比べて、 その設置スペースを極めて小さくすることができ、 大 きなサイズの基板を処理する装置として適している。  The lifting type substrate processing apparatus and the substrate processing system including the same according to the present invention can reduce the installation space as compared with the related art, and are suitable as an apparatus for processing a large-sized substrate.

Claims

請 求 の 範 囲 The scope of the claims
1 . 上下に並設された基板投入口及び基板排出口を備えてなる筐体状の カバー体と、 1. A housing-like cover body provided with a substrate input port and a substrate discharge port arranged vertically above and below,
前記カバー体内に内装された処理機構であって、 前記基板投入口から搬 入された基板を受容して支持する一方、 前記基板排出口から前記基板を排 出する搬送■ 支持手段、 該搬送■ 支持手段を支持する支持架台、 並びに該 搬送 ' 支持手段の上方に配設され、 該搬送■ 支持手段によって支持された 基板上に処理流体を吐出する処理流体吐出手段を備えてなる処理機構と、 前記処理機構を支持して上下方向に昇降させ、 該処理機構を前記基板投 入口及び基板排出口に経由せしめる昇降機構とを設けて構成したことを特 徴とする昇降式基板処理装置。  A processing mechanism housed inside the cover body, the transfer mechanism supporting and receiving the substrate loaded from the substrate input port, and discharging the substrate from the substrate discharge port. A processing mechanism comprising: a support gantry for supporting the support means; and a processing fluid discharge means disposed above the transfer and support means for discharging a processing fluid onto the substrate supported by the transfer and support means. An elevating type substrate processing apparatus, comprising: an elevating mechanism for supporting the processing mechanism and elevating the processing mechanism in a vertical direction, and allowing the processing mechanism to pass through the substrate inlet and the substrate outlet.
2 . 前記搬送■ 支持手段が、 前記基板を受容した後、 受容した基板を、 前記基板の搬入/排出方向に、 繰り返し前後動させるように構成されてな る請求の範囲第 1項記載の昇降式基板処理装置。  2. The elevating device according to claim 1, wherein the transfer member supporting means is configured to, after receiving the substrate, repeatedly move the received substrate back and forth in the substrate loading / unloading direction. Type substrate processing equipment.
3 . 前記カバー体が、 仕切り部材によって前記基板の搬入 Z排出方向に 駆動室及び処理室の 2つの室に分割されると共に、 前記基板投入口及び基 板排出口を有する前記処理室には前記処理機構が配設される一方、 前記駆 動室には前記昇降機構が配設されてなリ、  3. The cover body is divided into two chambers, a driving chamber and a processing chamber, by a partition member in the direction of loading and discharging of the substrate in the Z discharge direction. While a processing mechanism is provided, the drive chamber is not provided with the elevating mechanism.
前記仕切リ部材には、 上下方向に沿って、 前記処理室と駆動室とを連通 する開口部が形成され、  An opening is formed in the partition member along the vertical direction to communicate the processing chamber and the driving chamber.
前記仕切リ部材に形成された開口部の上下方向に沿った両縁部はそれぞ れ筒状に形成され、 且つ該一対の各筒状部には、 相互に対向する面に、 上 下方向に沿った切リ欠き溝が形成され、  Both edges of the opening formed in the partition member along the up-down direction are respectively formed in a tubular shape, and the pair of tubular portions are provided with surfaces facing each other in an upward and downward direction. Notch grooves are formed along
前記処理機構は、 その前記支持架台が、 前記仕切り部材の開口部内に設 けられた連結具によつて前記昇降機構と連結せしめられ、  In the processing mechanism, the support base is connected to the lifting mechanism by a connecting tool provided in an opening of the partition member.
前記連結具には、 前記一対の筒状部間に配設され、 且つ前記連結具の上 方及び下方に延在するように配設された帯状のシ一ト体であって、 その両 側縁部がそれぞれ前記切リ欠き溝から前記筒状部内に挿入せしめられたシ 一ト体が接続されてなリ、 The connecting member is a band-shaped sheet member disposed between the pair of cylindrical portions and extending upward and downward of the connecting member, and is provided on both sides thereof. Edges are respectively inserted into the cylindrical portion from the notched grooves. One body is not connected,
前記駆動室と処理室が、 前記仕切り部材, 連結具及びシート体によって 仕切られてなる請求の範囲第 1項又は第 2項記載の昇降式基板処理装置。  3. The lifting substrate processing apparatus according to claim 1, wherein the drive chamber and the processing chamber are partitioned by the partition member, the connecting member, and the sheet member.
4 . 前記開口部, 連結具及びシート体の複数組が設けられてなる請求の 範囲第 3項記載の昇降式基板処理装置。 4. The lifting substrate processing apparatus according to claim 3, wherein a plurality of sets of the opening, the connecting member, and the sheet member are provided.
5 . 前記筒状部内の気体を排気する排気手段を備えてなる請求の範囲第 3項又は第 4項記載の昇降式基板処理装置。  5. The elevating substrate processing apparatus according to claim 3, further comprising an exhaust unit that exhausts gas in the cylindrical portion.
6 . 前記シート体が無端, 環状に形成されてなる請求の範囲第 3項乃至 第 5項記載のいずれかの昇降式基板処理装置。  6. The liftable substrate processing apparatus according to any one of claims 3 to 5, wherein the sheet body is formed in an endless and annular shape.
7 . 前記シート体の巻き取り Z繰り出しを行う卷取ノ繰出機構を、 前記 シート体の上部側及び下部側のそれぞれに設け、 前記昇降機構によって昇 降せしめられる前記シート体の動きに応じ、 該巻取 繰出機構によって前 記シート体の巻き取リノ繰り出しを行うように構成されてなる請求の範囲 第 3項乃至第 5項記載のいずれかの昇降式基板処理装置。 7. Winding and unwinding mechanism for winding the sheet body is provided on each of the upper side and the lower side of the sheet body, and according to the movement of the sheet body moved up and down by the elevating mechanism, The lifting substrate processing apparatus according to any one of claims 3 to 5, wherein the take-up / roll-out mechanism is configured to take up the sheet body in a take-up reno.
8 . 前記卷取 繰出機構は、 前記シート体を巻き取る巻取軸と、 該巻取 軸を回転させる駆動手段とから構成され、 8. The winding and unwinding mechanism includes a winding shaft for winding the sheet body, and driving means for rotating the winding shaft.
前記駆動手段は、 前記卷取軸が繰出方向に回転する際には、 制動力のみ を巻取軸に作用させる一方、 前記巻取軸を卷取方向に回転させる際には、 摩擦クラツチを介して前記巻取軸に動力を伝達するように構成されてなる 請求の範囲第 7項記載の昇降式基板処理装置。  The driving means applies only a braking force to the winding shaft when the winding shaft rotates in the unwinding direction, and applies a friction clutch when rotating the winding shaft in the winding direction. 8. The lifting / lowering substrate processing apparatus according to claim 7, wherein the lifting / lowering type substrate processing apparatus is configured to transmit power to the winding shaft.
9 - 前記駆動手段が、 前記卷取軸に連結した受動歯車と、 この受動歯車 に嚙合した駆動歯車と、 駆動歯車に連結された摩擦クラッチと、 摩擦クラ ツチに連結された回転軸と、 回転軸の両端部にそれぞれ連結し、 回転軸の 回転を一方向にのみ許容する 2つの一方向クラッチと、 一方の前記一方向 クラッチを介して前記回転軸に連結されたプーリと、 該プーリに卷回され た伝動ベル卜と、 他方の前記一方向クラツチを支持する支持部材とから構 成され、  9-the driving means comprises: a passive gear connected to the winding shaft; a driving gear coupled to the passive gear; a friction clutch connected to the driving gear; a rotating shaft connected to a friction clutch; Two one-way clutches respectively connected to both ends of the shaft to allow rotation of the rotating shaft in only one direction; a pulley connected to the rotating shaft via one of the one-way clutches; And a supporting member for supporting the other one-way clutch.
前記 2つの一方向クラッチが、 前記巻取軸を巻取方向に回転させる方向 の前記回転軸の回転を許容する一方、 前記巻取軸を繰出方向に回転させる 方向の前記回転軸の回転を規制するように構成されるとともに、 前記伝動ベル卜が前記昇降機構によって回動せしめられるように構成さ れてなる請求の範囲第 8項記載の昇降式基板処理装置。 The two one-way clutches allow the rotation of the rotating shaft in a direction for rotating the winding shaft in the winding direction, while rotating the winding shaft in the feeding direction. 9. The lifting substrate processing apparatus according to claim 8, wherein the lifting belt is configured to restrict rotation of the rotating shaft in a direction, and the transmission belt is configured to be rotated by the lifting mechanism. .
1 0 . 前記請求の範囲第 1項乃至第 9項記載のいずれかの昇降式基板処 理装置を備えると共に、 10. A lifting and lowering substrate processing apparatus according to any one of claims 1 to 9, further comprising:
基板をほぼ水平に移動させつつ処理を行う第 1基板処理装置と第 2基板 処理装置とを上下に並設し、  A first substrate processing apparatus and a second substrate processing apparatus that perform processing while moving a substrate substantially horizontally are arranged side by side,
前記第 1基板処理装置の基板排出部と、 前記昇降式基板処理装置の基板 投入口とを接続させる一方、  While connecting the substrate discharge unit of the first substrate processing apparatus and the substrate input port of the liftable substrate processing apparatus,
前記第 2基板処理装置の基板投入部と、 前記昇降式基板処理装置の基板 排出口とを接続させ、  Connecting a substrate loading section of the second substrate processing apparatus and a substrate discharge port of the liftable substrate processing apparatus,
基板を、 第 1基板処理装置, 昇降式基板処理装置, 第 2基板処理装置に 順次経由せしめるように構成したことを特徴とする基板処理システム。  A substrate processing system, wherein a substrate is sequentially passed through a first substrate processing apparatus, an elevating type substrate processing apparatus, and a second substrate processing apparatus.
PCT/JP2002/001583 2001-02-27 2002-02-21 Lift type substrate treatment device, and substrate treatment system with the substrate treatment device WO2002069392A1 (en)

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TW529072B (en) 2003-04-21
JP2002261143A (en) 2002-09-13

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