JP2006227181A - Device and method for inverting substrate, and device for manufacturing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent positional deviation between bonded substrates, at inverting of the bonded substrates. <P>SOLUTION: In a device for inverting two sheets of substrates 1A, 1B bonded to each other via a sealing material 1a, a planar holding portion 21 is constructed so as to be ascendable and descendable, while sucking a face of the bonded two sheets of the substrates 1A, 1B; and a pressing portion 22 pressurizes the upper substrate 1A of the two sheets of the substrates 1A, 1B sucked and held with the holding portion 21 and holds them in between; and consequently bend deformation of the two sheets of the substrates 1A, 1B in inversion is suppressed and the high-quality bonded substrates are manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an improvement of a substrate inversion apparatus, a substrate inversion method, and a substrate manufacturing apparatus that are suitable for use in manufacturing a liquid crystal display panel.

  A liquid crystal display panel is manufactured through a bonding process in which two glass substrates, a color filter (CF) substrate and a TFT (Thin Film Transistor) substrate, are bonded via an adhesive sealant.

  In this bonding step, the CF substrate is adsorbed and held on the upper stage, the sealing agent is applied in a frame shape so as to surround the display surface, and the TFT substrate on which the liquid crystal is dropped on the display surface is adsorbed and held on the lower stage. After alignment, these two substrates are bonded together. It is known that such a bonding process is performed in a vacuum chamber.

  The two substrates bonded together through a sealant applied in a frame shape are assembled through a sealant curing process by ultraviolet (UV light) irradiation and a mounting process for electronic components etc. on the electrode part, and a liquid crystal display Completed as a panel unit.

  By the way, in the above bonding step, the CF substrate is sucked and held on the upper stage in the vacuum chamber, and the TFT substrate is sucked and held on the lower stage. The CF substrate is formed with a color filter layer formed in the pixel region and a black matrix layer that blocks light transmission in a portion other than the pixel region. The black matrix layer of the CF substrate includes the pixel region. The position may overlap with the sealant applied on the TFT substrate so as to surround.

  For this reason, the CF substrate is adsorbed and held on the upper stage, and the TFT substrate is adsorbed and held on the lower stage. When trying to cure, the black matrix layer of the CF substrate blocks UV light, and the sealing agent may not be cured properly.

Therefore, in order to appropriately irradiate the UV light to the sealing agent bonded with the CF substrate facing up and the TFT substrate facing down, the two glass substrates bonded together are inverted 180 degrees, Irradiation of UV light from above is performed toward the TFT substrate so as to be upward (see, for example, Patent Document 1).
JP 2003-233052 A

  By the way, the two substrates bonded together are likely to be displaced due to the bending of the substrate when the sealant is not cured.

  However, the conventional reaction device has only to have a configuration capable of reversing the two substrates by 180 degrees, such as holding a part of the two bonded substrates with a rotatable chuck.

  For this reason, in such a reversing device, there is no consideration of the rotational moment acting on the substrate during the reversing operation, and the substrate may be bent and deformed beyond the allowable range due to this rotational moment.

  As a result, misalignment occurs between the two substrates, and the required high precision bonding accuracy may not be maintained.

  Accordingly, the present invention provides a substrate reversing apparatus, a substrate reversing method, and a substrate manufacturing apparatus capable of suppressing a positional deviation between two substrates when reversing a bonded substrate before curing a sealant and ensuring a required bonding accuracy. The purpose is to provide.

  1st this invention is a board | substrate inversion apparatus which reverses two board | substrates bonded together through the sealing agent, before hardening the said sealing compound, One surface of the bonded said 2 board | substrate is an allowable range. A holding portion that holds the inner substrate by bending, a pressing portion that can press and hold the two substrates held by the holding portion from the opposite surface of the holding portion, and the pressing portion and the holding portion. And a reversing mechanism capable of reversing the two substrates sandwiched by each other.

  According to a second aspect of the present invention, in the substrate reversal method for reversing two substrates bonded via a sealant before the sealant is cured, one surface of the bonded two substrates is allowed. While holding by the bending within the range, the two substrates are reversed while pressing the two substrates from the other surface.

  According to a third aspect of the present invention, there is provided a substrate manufacturing apparatus for manufacturing a bonded substrate by curing a sealing agent between two substrates after bonding the two substrates through a sealing agent. A substrate reversing device capable of reversing the two bonded substrates before curing the sealing agent, wherein the substrate reversing device is the substrate reversing device of the first invention. .

  As described above, the substrate inversion device, the substrate inversion method, and the substrate manufacturing apparatus of the present invention can manufacture a high-quality bonded substrate by suppressing the bending deformation of the two substrates during the inversion.

  Hereinafter, an embodiment of a substrate reversing apparatus according to the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a front view showing a first embodiment of a substrate reversing apparatus according to the present invention holding a reversing bonded substrate, FIG. 2 is a plan view thereof, and FIG. It is AA arrow sectional drawing of the board | substrate inversion apparatus of FIG.

  1 to 3, the upper and lower two bonded substrates 1A and 1B to be reversed are the upper substrate 1A is a CF substrate, and the lower substrate 1B, which is a TFT substrate, is bonded to the lower side through the sealant 1a. The following description will be made on the assumption that the substrate is transferred to the substrate reversing device 2 in a state where the substrate is reversed.

  As shown in FIGS. 1 to 3, the substrate reversing device 2 of the first embodiment is a flat plate that receives the bonded substrates 1A and 1B conveyed by the conveying robot and adsorbs the lower substrate 1B to the surface. A holding part 21, a pressing part 22 that is attached to the right and left ends of the flat holding part 21 in the drawing and can hold and hold the upper substrate 1 </ b> A of the substrates 1 </ b> A and 1 </ b> B held by the holding part 21, A pair of reversing mechanisms 23, 23 each having a rotation shaft 23 a connected on a central axis along the longitudinal direction and capable of rotating the holding portion 21 in the direction indicated by the arrow R, and the reversing mechanisms 23, 23 respectively A pair of elevating mechanisms 24, 24 capable of moving up and down the holding unit 21 while supporting, and the holding substrate 21 and the holding unit 22 are penetrated so that the bonded substrates 1A, 1B can be supported from below. Multiple rod-shaped pins It is composed of a pin mechanism consisting of 25.

  Note that at least one of the pair of reversing mechanisms 23.23 incorporates a driving motor. In this embodiment, a description will be given assuming that one reversing mechanism 23 incorporates a motor and the other reversing mechanism 23 is driven.

  Hereinafter, the detailed structure of each component in the substrate reversing apparatus 2 will be described.

  The holding portion 21 is formed in a rectangular parallelepiped table shape, and as shown in FIG. 1 or 3, in order to suck the lower substrate 1B, a plurality of suction holes 21a are opened on the suction surface, and each suction hole 21a is formed. Is configured to be commonly connected to an exhaust pump (not shown) through a pipe 21b.

As will be described later, the substrates 1A and 1B are transported by the transport robot. The transported substrates 1A and 1B are once transferred onto the pins 25 and then transferred onto the pins 25. 1A and 1B are delivered to the holding unit 21 and held by suction. As shown in FIGS. 1 and 3, in order to exchange the substrates 1A and 1B between the pin 25 and the holding portion 21, the pin 25 planted downward can be inserted through and inserted into the holding portion 21. A through hole 21c is formed corresponding to the position of the pin 25. Therefore, as shown in the cross-sectional view of FIG. 3, when the holding portion 21 is in a horizontal state, the tip portion of the pin 25 can be viewed from above through the through hole 21c.
The holding part 22 is supported and fixed in common at its tip by a plurality (four) of cylinders 221 fixed in parallel at the four corners of the rectangular parallelepiped holding part 21 and the operating rods 221a of these cylinders 221. The rectangular holding plate 222 and the lower side of the holding plate 222 (that is, the side facing the holding portion 21 on which the substrates 1A and 1B are placed) as shown in FIG. A plurality of elastic members 223 are included.

  The elastic member 223 is configured by connecting a buffer body 223a made of rubber or the like and an elastic body 223b such as a coil spring. Further, a fluororesin sheet is provided on the contact surface of the buffer 223a with the substrate 1A. Note that a fluororesin sheet or film may be provided on the adsorption surface of the holding portion 21.

  As will be described later, the substrates 1A and 1B reversed 180 degrees by the substrate reversing device 2 are once transferred onto the pins 25, and the substrates 1A and 1B transferred onto the pins 25 are transferred to the transport robot. Is carried out. Accordingly, as shown in FIGS. 1 and 2, the holding plate 222 of the holding portion 22 is attached to the holding plate 22 so that the lower pins 25 can receive the substrates 1 </ b> A and 1 </ b> B that are inverted and supported via the elastic member 223. In addition, a through hole 222a into which the pin 25 can be loosely inserted is formed corresponding to the position of the pin 25.

  Note that the plurality of pins 25 in this embodiment are planted so as to be positioned in a line-symmetric position with respect to the rotation center of the holding portion 21. Further, the through hole 21c of the holding portion 21 and the through hole 222a of the holding portion 22 are provided coaxially. The pin 25 relays the transfer between the substrates 1A and 1B with the transfer robot. As shown in FIG. 1, the pin 25 is composed of a rod-shaped body. An elastic body that expands and contracts in the longitudinal direction may be interposed to receive and transfer the substrates 1A and 1B softly, or the pins 25 themselves may be configured to be slidable in the longitudinal direction. In addition, the cylinders 221 are provided at the four corners of the holding portion 21, respectively. However, the cylinders 221 may be provided only as a pair on one of the diagonal lines, and a guide mechanism for guiding in the axial direction may be provided on the other diagonal line. good.

  Next, one of the left and right reversing mechanisms 23, 23 has a built-in motor, and the holding shaft 21 is held and fixed on a line in which the rotating shafts 23 a, 23 a facing the horizontal center of the holding portion 21. The holding portion 21 and the pressing portion 22 are configured to be rotatable 180 degrees in the direction of arrow R (shown in FIG. 1) by rotating the motor.

  The elevating mechanisms 24 and 24 are sliders 241 and 241 that support and fix the reversing mechanisms 23 and 23, guide rails 242 and 242 that engage with the sliders 241 and 241 and guide the ascending and descending, and FIG. 1 and FIG. As shown in the figure, it has motors 243 and 243 that are attached to the tops of the columns 244 that support the guide rails 242 and 242 and that drive the ball screw mechanism that is built in the columns and moves the sliders 241 and 241 up and down. Has been.

Therefore, by synchronous rotation control for the motors 243 and 243 by a controller (not shown),
The reversing mechanisms 23 and 23 attached and fixed to the sliders 241 and 241 can be moved up and down.

  In the above description, the holding unit 21 has the suction hole 21a and sucks the lower substrate 1B. However, the holding unit 21 sucks and holds the bonded substrates 1A and 1B by an electrostatic chuck. It may be configured. In addition, the substrates 1A and 1B transferred by the transfer robot are pinpointed at several points in advance with respect to the sealing agent 1a applied for bonding the two substrates 1A and 1B. It may be irradiated with UV light and temporarily fixed.

  The operation of the substrate reversing apparatus 2 according to the first embodiment having the above configuration will be described below with reference to FIGS. 4 to 8 in addition to FIG.

  FIG. 4 shows that the reversing mechanisms 23 and 23 are lowered by the control of the elevating mechanism 24 by the controller (not shown) so that the tip of the pin 25 penetrates the holding portion 21 and protrudes from the upper surface thereof. The state in which the holding plate 222 is lifted by the control of the cylinders 221 and 221 in the holding portion 22 and a space sufficient for carrying in the substrates 1A and 1B is formed between the elastic member 223 of the holding portion 22 and the pins 25. Show.

  In the bonding process in the previous step, a sealant is applied in a frame shape, and a required amount of liquid crystal is dropped in a frame surrounded by the sealant, so that the substrate 1B and the other substrate 1A are placed in the vacuum chamber of the bonding apparatus. In FIG. 2, the alignment is performed in a vacuum atmosphere and the bonding is performed through the sealing agent 1a.

  The two bonded substrates 1A and 1B are taken out from the bonding process by the hand 3 of the transport robot, and are carried between the elastic member 223 of the pressing portion 22 and the pin 25, as shown in FIG. Passed on pin 25.

  After the hand 3 of the transfer robot delivers the substrates 1A and 1B to the pin mechanism, the controller retracts the hands 3 and 3 and raises the reversing mechanisms 23 and 23. During the ascent of the reversing mechanisms 23, 23, the substrates 1 A, 1 B are transferred from the pins 25 to the holding unit 21, and are surface-adsorbed and held by the holding unit 21.

  When the substrates 1A and 1B are held by the holding unit 21, the controller (not shown) drives and controls the cylinders 221 and 221 and lowers the holding plate 222 of the holding unit 22. Therefore, as shown in FIG. The upper substrate 1 </ b> A of 1 </ b> A and 1 </ b> B is pressed by the holding unit 21 via the elastic member 223, and the substrates 1 </ b> A and 1 </ b> B are sandwiched between the holding unit 21. In this state, the substrates 1A and 1B are kept in a bend within an allowable range, that is, a bend that does not cause a positional shift between the two substrates 1A and 1B due to the bend.

  The controller raises the reversing mechanism 23, 23 to a height position where the holding portion 21 and the holding portion 22 do not collide with the pin 25, that is, the rising end position even if the rotating shaft 23a is rotated 180 degrees, and then the reversing mechanism 23, 23 23 is driven and controlled, and the holding portion 21 holding the substrates 1A and 1B together with the holding portion 22 is rotated. FIG. 5 shows a state when the holding unit 21 and the holding unit 22 are rotated 90 degrees in the direction of arrow R from the horizontal state.

  When the reversal of the holding part 21 and the pressing part 22 is completed by the rotation control of the motor 233 by the controller, the bonded substrates 1A and 1B are reversed 180 degrees as shown in FIG.

  Next, from the state shown in FIG. 6, the reversing mechanisms 23, 23 are lowered by drive control of the motors 243, 243 by the controller.

  As shown in FIG. 7, the controller causes the tip of the pin 25 to pass through the holding plate 222 due to the lowering of the reversing mechanisms 23, 23, but the distance from the substrates 1 </ b> A, 1 </ b> B is set by a predetermined distance (cylinder 221). When the plate 222 is moved downward, the reversing mechanisms 23 and 23 are stopped at a height position separated by a sufficiently close distance that allows the substrates 1A and 1B to be transferred from the elastic member 223 to the pin 25, and The adsorption holding of the substrates 1A and 1B in the holding unit 21 is released. Next, the cylinders 221 and 221 are operated, and the pressing plate 222 is lowered in the direction of the arrow Z in the figure.

  As a result, the upside down substrates 1A and 1B are transferred from the pressing portion 22 onto the pins 25 and supported. Thereafter, as shown in FIG. 8, the hand 3 of the transfer robot is inserted below the inverted substrates 1A and 1B on the pin 25, and the substrates 1A and 1B are moved from the pin 25 to the hand 3 by the raising operation of the transfer robot. Are delivered to the next step, that is, the sealant curing step.

  After the reversed substrates 1A and 1B are carried out, the reversing mechanisms 23 and 23 are moved up in the direction indicated by the arrow Z in FIG.

  When the controller raises the reversing mechanisms 23 and 23 to the ascending end position, the controller 21 rotates the holding unit 21 by 180 degrees in the direction opposite to the previous rotation R direction by driving control of the reversing mechanisms 23 and 23. The apparatus 2 is returned to the state shown in FIG. By doing so, the substrate reversing device 2 can receive the workpiece newly transferred by the transfer robot, that is, the bonded substrates 1A and 1B, can be reversed 180 degrees and sent out to the next step by the above procedure. .

  On the other hand, the substrates 1A and 1B delivered to the sealing agent curing step are irradiated with ultraviolet rays to the sealing agent 1a by the ultraviolet irradiation device, and the sealing agent 1a is cured.

  In the first embodiment described above, the pressing portion 22 has a large number of elastic members 223, and the elastic members 223 press the upper substrate 1A of the substrates 1A and 1B adsorbed and held by the holding portion 21. Although the substrates 1A and 1B need only be held within a permissible range, the elastic body 223b of the elastic member 223 is replaced with a cylinder mechanism, and the upper substrate 1A is pressed by a cylinder pressing force. You may comprise so that a surface may be pressed. Further, in this case, by making the stroke length of the cylinder mechanism sufficiently long, the pressing plate 222 is fixed to the holding portion 21 by a column having a predetermined leg length instead of the cylinders 221 and 221 of the pressing portion 22. It can also be configured.

  In any case, according to the substrate reversing device 2 according to the first embodiment, the lower substrate 1B of the bonded substrates 1A and 1B is surface-adsorbed to the flat holding portion 21, and the upper substrate 1A is held to the holding portion 21. Press on the suction surface side and reverse. For this reason, since the substrates 1A and 1B are fixed along the flat suction surface of the holding portion 21, the bending deformation of the substrates 1A and 1B due to the rotational moment acting during the reversing operation is suppressed, and the two substrates are not deformed. A high-quality bonded substrate can be obtained while preventing displacement.

  Moreover, since it is possible to prevent the bonded substrates 1A and 1B from being bent and deformed during the reversing operation, the positional displacement between the substrates 1A and 1B due to the bonded substrates 1A and 1B being bent more than an allowable range. In addition, it is possible to prevent the circuit formed on the substrate from being damaged and the gap formed between the substrates 1A and 1B from being varied.

  Further, the upper substrate 1 </ b> A is pressed against the lower substrate 1 </ b> B surface-adsorbed by the holding unit 21 by the elastic member 223. Therefore, even if a force that shifts the substrates 1A and 1B in the surface direction is applied by the rotational moment that acts on the substrates 1A and 1B during the recoil operation, this is suppressed by the pressing force of the elastic member 223, so that both the substrates 1A and 1B It is possible to prevent the positional deviation from each other in the surface direction. Therefore, the bonding accuracy of the substrates 1A and 1B can be maintained, and the quality of the manufactured liquid crystal display panel can be improved.

  Further, the buffer 223a of the elastic member 223 is merely brought into contact with the substrate 1A. Therefore, when the buffer body 223a that has been in contact is separated from the substrate 1A, it is possible to prevent the force in the direction of separating from the lower substrate 1B from acting on the upper substrate 1A. As a result, the gap between the substrates 1A and 1B can be prevented from varying, and the quality of the liquid crystal display panel can be improved.

  Further, since the fluororesin sheet is provided on the contact surface of the buffer body 223a with the substrate 1A, the buffer body 223a can be prevented from sticking to the upper substrate 1A, and between the buffer body 223a and the upper substrate 1A. Static electricity can be prevented from being generated. For this reason, it is possible to prevent contact traces caused by adhesion or static electricity from remaining on the upper substrate 1A. Therefore, the display quality of the liquid crystal display panel can be improved.

  In the first embodiment, the elastic member 223 attached to the holding plate 222 is configured by connecting the buffer body 223a and the elastic body 223b. In short, the upper substrate 1A of the bonded substrates 1A and 1B is pressed. Since the substrates 1A and 1B only need to be sandwiched between the holding portion 21, the elastic member 223a and the elastic member 223b are connected to each other, and the elastic member 223a and the elastic member 223b are replaced by an elastic member made of a single member such as a pressable sponge. You may comprise so that 1 A of upper board | substrates may be pressed through a member.

  Next, FIG. 9 shows a second embodiment of the substrate reversing device 2 according to the present invention in which the upper substrate 1A of the substrates 1A and 1B held by the holding portion can be pressed through an elastic member that can be pressed and sucked. Will be described with reference to FIG.

  The substrate reversing device 2 according to the second embodiment is different from the substrate reversing device 2 according to the first embodiment in that only the structure of the elastic member 223 attached to the holding plate 222 is different. Since the operation is the same as that of the first embodiment, the elastic member 223 having a different structure will be mainly described.

  FIG. 9A is an enlarged front view of the main part of the substrate reversing device according to the second embodiment of the present invention, and FIG. 9B is an enlarged sectional view of the movable elastic member shown in FIG. is there.

  The substrate reversing device 2 shown in FIG. 9A differs from the substrate reversing device 2 according to the first embodiment shown in FIG. 4 in that the lengths of the substrates 1A and 1B in the horizontal direction shown in the figure. Indicates that it is long. Accordingly, in FIG. 9A, a large number (seven) of the pins 25 constituting the pin mechanism are arranged in the left-right (lateral) direction so as to support the substrates 1A and 1B.

  Accordingly, the elastic member 223 of the second embodiment is a variable elastic member 223B whose height position (length in the vertical direction in FIG. 9) can be changed in the vertical direction according to the pressing force on the substrate 1A. The holding plate 222 is attached so as to face the substrate 1A surface. Each variable elastic member 223 </ b> B is disposed so as to face one of the pins 25.

  The variable elastic member 223B, as shown in its enlarged cross-sectional view in FIG. 9B, is connected to a flexible air supply / exhaust pipe 223C, and is a suckable suction cup body 223c provided facing the substrates 1A and 1B. A movable pipe 223d having a large-diameter portion 223da and connected to the supply / exhaust pipe 223C while accommodating the suction cup body 223c, and a large-diameter portion 223da of the movable pipe 223d are accommodated to move the movable pipe 223d in the longitudinal direction (up and down in the drawing). A cylindrical body 223e attached to the holding plate 222 and a coil spring 223f that constantly urges the movable pipe 223d toward the substrates 1A and 1B in the cylindrical body 223e. Yes.

  The movable pipe 223d has a double structure at the tip, and a space connected to the air supply / exhaust pipe 223C is formed between the inner pipe 223db and a through hole into which the pin 25 can be inserted is formed in the inner pipe 223C. Is done. The upper end portion has a communication hole 223dc that communicates the air supply / exhaust pipe 22C with the space.

  Next, the substrate inversion operation of the second embodiment will be described with reference to FIG. 9 and FIGS. 5 to 8 of the first embodiment.

  First, as shown in FIG. 9, in the state where the holding plate 222 is raised and a space sufficient to carry in the substrates 1 </ b> A and 1 </ b> B is formed between the variable elastic member 223 </ b> B of the holding portion 22 and the pin 25. The substrates 1 </ b> A and 1 </ b> B held by the hand 3 are carried onto the holding unit 21. The loaded substrates 1 </ b> A and 1 </ b> B are transferred onto the holding unit 21 as the reversing mechanisms 23 and 23 are raised, and are surface-adsorbed to the holding unit 21. Thereafter, when the pressing plate 222 is lowered, the substrates 1A and 1B that are surface-adsorbed to the holding portion 21 are pressed by the variable elastic member 223B. Negative pressure is supplied to the suction cup body 223c from the air supply / exhaust pipe 223C at the timing when the variable elastic member 223B contacts the board 1A, and the board 1A is adsorbed by the suction cup body 223c.

  Thereafter, the substrates 1A and 1B are inverted in the same procedure as described with reference to FIGS. 5 and 6 in the second embodiment.

  If the substrates 1A and 1B are reversed, the reversing mechanisms 23 and 23 are lowered. In this descending process, the pin 25 is inserted into the through hole 222a of the pressing plate 222 and the inner tube 223db of the variable elastic member 223B. The reversing mechanisms 23 and 23 stop the pin 25 from descending at a height separated from the substrates 1A and 1B by a preset distance (the same state as in FIG. 7).

  Next, while lowering the holding plate 222, a positive pressure is applied to the air supply / exhaust pipe 223C, the pressure applied to the suction cup body 223c is switched from a negative pressure to a positive pressure, and the substrate 1A supported on the variable elastic member 223B, 1B is transferred onto the pin 25.

  If the substrates 1A and 1B are transferred to the pins, the inverted substrates 1A and 1B are received by the hand 3 of the transfer robot in the same procedure as described with reference to FIG. 8 in the first embodiment. It is conveyed to the sealing agent curing process.

  Such a second embodiment also has the same effect as the first embodiment.

  In the second embodiment, not only the holding unit 21 holds the substrate 1B by surface suction, but also holds the substrate 1A by the variable elastic member 223B. For this reason, it is possible to more reliably prevent displacement between the substrates 1A and 1B, which may be caused by a rotational moment acting on the substrates 1A and 1B during the reversing operation of the substrates 1A and 1B. Therefore, the reliability of the quality of the manufactured liquid crystal display panel can be further enhanced.

  Further, when the bases 1A and 1B supported on the variable elastic member 223B are transferred onto the pins 25, the pressure applied to the suction cup body 223c of the variable elastic member 223B is switched from negative pressure to positive pressure. When 1A leaves | separates from the suction cup body 223c, it can prevent making a board | substrate 1A bend. Thereby, gap unevenness and circuit damage that may occur as a result of bending of the substrate 1A can be prevented, and display defects of the liquid crystal display panel can be prevented.

  Further, since the pin 25 is made to penetrate the inner tube 223db of the variable elastic member 223B, when the substrates 1A and 1B supported on the variable elastic member 223B are transferred onto the pin 25, the variable elastic member 223B Even if the substrates 1A and 1B are attached to the sucker body 223c, the substrate 1A is prevented from moving together with the sucker body 223c by the pins 25, so that the substrate 1A moves away from the substrate 1B. An increase in the distance between 1A and 1B can be prevented. Thereby, it is possible to prevent variation in the gap between the substrates 1A and 1B, and it is possible to improve the display quality of the liquid crystal display panel.

  The substrate reversing device 2 according to the first and second embodiments is configured so that the main portion of the pressing portion faces the holding portion, and the substrates 1A and 1B are sandwiched between the holding portion. A pressing part that opens and closes in parallel with the side edge of the holding part is provided, and the surfaces of the substrates 1A and 1B are pressed through the elastic member attached to the pressing part by the closing operation of the pressing part. Can be configured.

  A third embodiment of the substrate reversing device according to the present invention in which a pressing plate with an elastic member attached thereto is rotatably attached to the edge of the holding portion will be described with reference to FIGS. The same components as those in the first and second embodiments are denoted by the same reference numerals and detailed description thereof is omitted.

  Further, the substrate reversing device 2 according to the third embodiment shown in FIGS. 10 and 11 is different from the pressing portion 22 in the first and second embodiments in the structure of the pressing portion, and other configurations and operations are the same. Since it is common to the first and second embodiments, only different configurations and operations will be described.

  10 is a front view of the substrate reversing apparatus according to the third embodiment, and FIG. 11 is a cross-sectional view of the substrate reversing apparatus 2 shown in FIG.

  As shown in FIG. 10, the holding unit 22 of the substrate reversing device according to the third embodiment is installed on the right side of the holding unit 21 so as to be juxtaposed in the front-rear (illustrated depth) direction. 11 and is composed of holding plates 225 and 225 that are opened and closed by double doors as shown in FIG. 11. Although not shown in detail, the holding plates 225 and 225 are attached to the rotating shafts 224a of the motors 224 and 224. An elastic member such as a rubber member is attached to the pressing surface of the substrate 225 against the substrate 1A. In FIG. 10, reference numeral 224a indicates a rotary bearing of the holding plates 225 and 225 that are rotated by the rotation of the motors 224 and 224, and the holding plates 225 and 225 are arranged in the illustrated depth direction. Therefore, in the front view shown in FIG. 10, only the front motor 224 and the pressing plate 225 are shown.

  The substrates 1A and 1B are sandwiched between the closed pressing plates 225 and 225 and the holding portion 21, and after being inverted 180 degrees, are transferred onto the pin mechanism as in the first and second embodiments. It is.

  In the substrate reversing device 2 according to the third embodiment, the holding plate 225, 225 is opened to transfer the pin on the lower pin 25, so that the through hole 225a is formed and penetrated. The presser plates 225 and 225 are comb-like and have slits that communicate from the through hole 225a to the tip so that the pin 25 can be slipped through when the presser plates 225 and 225 are opened. The plates 225 and 225 and the pin mechanism that receives the reverse substrates 1A and 1B are configured not to contact and interfere with each other.

Also according to the third embodiment having the above-described configuration, the pressing portion 22 is attached to the end portion of the holding portion 21 and presses the surface of the upper substrate 1A of the bonded substrates 1A and 1B held by surface adsorption to the holding portion 21. Therefore, the substrates 1A and 1B can be reversed 180 degrees and carried out for the next step in the same procedure as in the first embodiment.

  In the first to third embodiments described above, the bonded substrates 1A and 1B are configured such that the elastic member 223 directly presses the surface of the upper substrate 1A, thereby pressing the bonded substrates 1A and 1B with the pressing portion 22 and the holding portion 21. However, in short, the bonded substrates 1A and 1B need only be properly pressed against the surface of the holding portion 21 with little deformation during the reversal operation of 180 degrees. The object can be achieved in the same manner even if it is configured to press 1A toward the substrate 1B and reverse 180 degrees while maintaining the state.

  A substrate reversing device according to a fourth embodiment of the present invention configured to be reversed 180 degrees against the upper substrate 1A surface of the substrates 1A and 1B adsorbed by the holding unit 21 using wind pressure. This will be described with reference to FIG.

  FIG. 12 is a partially cutaway enlarged front view showing the right end of the substrate reversing apparatus according to the fourth embodiment. Unlike the first embodiment shown in FIGS. The portion 22 is different in that it is composed of a cylinder 226 attached to the left and right ends of the holding portion 21 and a blow member 227 connected to the operating rod 226a of the cylinder 226, and the other configuration is the first embodiment. Similar to the example. FIG. 12 shows the main part on the right side of the substrate reversing device, and the left side is similarly symmetrically configured to perform a synchronized operation.

  In the substrate reversing device 2 according to the fourth embodiment, the blow member 227 connected to the operating rod 226a is slidable in the direction indicated by the arrow X by the operation of the cylinder 226, and is sucked and held on the holding portion 21. With respect to the upper board | substrate 1A surface of board | substrate 1A, 1B, it is comprised so that pressurized air can be discharged in the illustrated arrow Z direction from many discharge ports 227a opened toward the lower surface of the blow member 227.

  That is, a large number of discharge ports 227a provided in the blow member 227 communicate with each other, and are connected to an air supply source such as an air pump (not shown) via a flexible discharge tube 227b, and are discharged by the controller. By performing ON / OFF control of a solenoid valve (not shown) provided in the middle, pressure air is discharged from the discharge port 227a.

  Therefore, since the upper substrate 1A is pressed toward the holding portion 21 during the reversing operation of the substrates 1A and 1B due to the discharge of the pressurized air from the discharge port 227a, the space between the bonded substrates 1A and 1B during the reversing operation of 180 degrees. Can be avoided.

  Reference numeral 227c (indicated by a dotted line) denotes a notch for delivery to the pins 25 of the substrates 1A and 1B during reversal.

  The notch 227c is formed in a U shape in plan view, and in FIG. 12, the U-shaped open part is provided to face the left.

  Further, when the substrates 1A and 1B to be reversed are sucked and held on the holding portion 21 via the pins 25, the blow member 227 is moved in the direction of the arrow x indicated by the dotted line in the drawing so that the blow member 227 does not become an obstacle. It is configured to be evacuable.

  In the substrate reversing device 2 according to the fourth embodiment, the blow member 227 of the pressing portion 22 is slid by the cylinder 226 in order to press the substrates 1A and 1B by the air pressure discharged from the discharge port 227a. However, even if the blow member 227 is configured to be opened and closed by driving the motor, the object can be similarly achieved. The gas discharged from the discharge port 227a is not limited to air, and may be nitrogen gas or ionized inert gas. Further, according to the substrate reversing device 2 according to the fourth embodiment, since the pressing portion 22 does not directly touch the surface of the substrate 1A, it is possible to prevent contact marks or the like from being made on the surface of the substrate 1A. Further, by blowing the gas, it is possible to prevent dust and the like from adhering to the surface of the substrate 1A, and it is possible to blow off the adhering dust and the like, so that the surface of the substrate 1A can be cleaned.

  In the first to third embodiments, after the substrates 1A and 1B are inverted 180 degrees, the pins 25 are passed through the holding plates 222 and 225 holding the bonded substrates 1A and 1B, and the pins 25 are passed through. The substrates 1A and 1B are handed over to the pin 25, but the blow member 227 according to the fourth embodiment has a space formed between the substrates 1A and 1B sucked and held by the holding portion 21. If it is possible to transfer the inverted substrates 1A and 1B to the pin mechanism and the substrates 1A and 1B from the pin mechanism to the hand 3 of the transfer robot in the formed space, the pins are attached to the blow member 227. The notch 227 provided for avoiding the collision / interference with 25 can be replaced with a through hole.

  In the description of each of the above embodiments, the substrate reversing device has been explained that a controller (not shown) drives and controls each operation. However, the operation of loading the workpiece into the substrate reversing device by the transfer robot and the reversed work The substrate reversing operation including the carry-out operation from the substrate reversing device 2 is controlled in an integrated manner so that an efficient reversing operation is performed.

  In the above embodiments, the elevating mechanism 24 is configured to move the reversing mechanism 23 up and down, but other elevating and moving devices such as a cylinder and a hoisting machine may be used.

  Moreover, although demonstrated in the example which applied this invention to manufacture of a liquid crystal display panel, two board | substrates bonded together until it seal | sticks two board | substrates through a sealing agent and the sealing agent hardens | cures. It can be applied if it is a product that needs to be inverted.

  Moreover, although the holding part demonstrated in the example which comprised the support surface which hold | maintains a bonding board | substrate planarly with a single member, in short, since a bonding board | substrate should just be hold | maintained with the tolerance | permissible_range, a some The support pieces may be arranged in a matrix or zigzag to hold the substrate in a plane. In this case, it is preferable that the elastic member attached to the pressing plate is disposed so as to face any of the plurality of support pieces, so that it is possible to prevent as much as possible from applying a force to bend the bonded substrate.

  In addition, although the example in which the holding unit holds the substrate by vacuum suction is described, other suction means such as an electrostatic check or a magnet may be used. Moreover, it is not always necessary to adsorb, and it may be supported only.

  Further, instead of providing means for sucking and holding the substrate in the holding part, means for sucking and holding the substrate may be provided, and the holding part may simply support the substrate without sucking.

It is the front view which showed the 1st Example of the board | substrate inversion apparatus by this invention. It is a top view of the apparatus shown in FIG. It is AA arrow sectional drawing of FIG. It is the front view which showed the state by which the bonding board | substrate of the reversal object was mounted | worn with the apparatus shown in FIG. FIG. 5 is a front view illustrating a state in which the bonded substrate is mounted and rotated by 90 degrees in the apparatus illustrated in FIG. 4. FIG. 6 is a front view showing a state in which the bonded substrate is further rotated by 90 degrees in the apparatus shown in FIG. 5. FIG. 7 is a front view showing a state in which the inverted substrate is delivered to the pin mechanism in the apparatus shown in FIG. 6. It is the front view which showed the state which carries out the reversed board | substrate with the apparatus shown in FIG. FIG. 9A is a front view of an essential part showing a second embodiment of the substrate reversing apparatus according to the present invention, and FIG. 9B is an enlarged sectional view of the variable elastic member shown in FIG. It is the front view which showed the 3rd Example of the board | substrate inversion apparatus by this invention. It is AA arrow sectional drawing of FIG. It is the principal part enlarged front view which showed the 4th Example of the board | substrate inversion apparatus by this invention.

Explanation of symbols

1A, 1B Substrate 1a Sealing agent 2 Substrate reversing device 21 Holding part 21a Adsorption hole 21b Pipe 21c Through hole 22 Holding part 221 Cylinder 221a Operating rod 222 Holding plate 223 Elastic member 223a Adsorption member 223b Spring member 224 Motor 224a Rotating shaft 224b Rotating bearing 225 Holding plate 225a Slit 226 Cylinder 226a Actuating rod 227 Blow member 227a Discharge port 227b Discharge pipe 227c Through hole 23 Reverse mechanism (motor)
23a Rotating shaft 24 Lifting mechanism 241 Slider 242 Guide rail 243 Motor 25 Pin (pin mechanism)
3 Hand (Transport Robot)

Claims (6)

In the substrate reversing apparatus for reversing the two substrates bonded together through the sealing agent before the sealing agent is cured,
A holding part for holding one surface of the two substrates bonded together with a deflection within an allowable range;
A pressing part capable of pressing and holding the two substrates held by the holding part from the opposite surface of the holding part; and
A substrate reversing apparatus comprising: a reversing mechanism capable of reversing the two substrates sandwiched between the pressing portion and the holding portion.   The substrate reversing device according to claim 1, wherein the pressing portion includes an elastic member that contacts the substrate, and a fluorine-based resin is provided on a contact surface of the elastic member with the substrate.   The substrate reversing device according to claim 1, wherein the pressing portion includes a blow member that presses the two substrates bonded together by pressing with wind pressure. In the substrate reversal method of reversing the two substrates bonded together via the sealant before the sealant is cured,
One surface of the two substrates bonded together is held with a deflection within an allowable range, and the two substrates are reversed while pressing the two substrates from the other surface. Substrate reversal method.   5. The substrate inversion method according to claim 4, wherein the two substrates are pressed from the other surface by wind pressure. In a substrate manufacturing apparatus for manufacturing a bonded substrate by bonding two substrates through a sealant and then curing the sealant between the two substrates,
Comprising a substrate reversing device capable of reversing the two substrates bonded via the sealing agent before the sealing agent is cured;
The said board | substrate inversion apparatus is a board | substrate inversion apparatus in any one of Claims 1-3, The board | substrate manufacturing apparatus characterized by the above-mentioned.

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