KR101441977B1 - Reversal unit and substrate transferring device using this - Google Patents

Reversal unit and substrate transferring device using this Download PDF

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Publication number
KR101441977B1
KR101441977B1 KR1020130032904A KR20130032904A KR101441977B1 KR 101441977 B1 KR101441977 B1 KR 101441977B1 KR 1020130032904 A KR1020130032904 A KR 1020130032904A KR 20130032904 A KR20130032904 A KR 20130032904A KR 101441977 B1 KR101441977 B1 KR 101441977B1
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KR
South Korea
Prior art keywords
unit
substrate
torsion
transfer
adsorption
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KR1020130032904A
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Korean (ko)
Inventor
이주석
김종백
한상이
유대연
정태훈
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주식회사 제우스
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Priority to KR1020130032904A priority Critical patent/KR101441977B1/en
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Publication of KR101441977B1 publication Critical patent/KR101441977B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A reversal unit and a substrate transferring device using the same are disclosed. The disclosed reversal unit comprises: a reversal shaft unit which is a center of rotation for a reversal of a substrate; and a twisting unit which fixates a connecting line equipped in the reversal shaft unit, and passes the reversal shaft unit.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a reversing unit,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inversion unit and a substrate transfer apparatus using the same, and more particularly to an inversion unit capable of preventing line twisting of a connection line passing through an inversion shaft portion, will be.

2. Description of the Related Art [0002] In recent years, various flat panel display devices (FPD, Flat Panel Display) such as a liquid crystal device (LCD) and a plasma display panel (PDP) Display) is made by attaching two glass substrates together.

Flat panel displays have been continuously studied, and some have already been used as display devices in various devices. Among these display devices, LCDs are mostly used in place of CRTs (Cathode Ray Tube) for the purpose of a portable type image display device because of their excellent image quality, light weight, thinness and low power consumption. And a monitor for receiving and displaying a broadcast signal and a monitor for a computer.

Here, as the display device, the work of raising the quality of the image has many aspects that are arranged with the above-described features and advantages. Therefore, in order for a liquid crystal display device to be used in various parts as a general screen display device, it can be said that the key to development is how much high-quality images such as high brightness and large area can be realized while maintaining the features of light weight, thinness and low power consumption have.

Further, it is necessary to uniformly apply a uniform force to the entire glass substrate while the display device is becoming large, so that the adhesion is uniform.

A related prior art is Korean Registered Patent No. 10-0687460 (registered on Feb. 21, 2007, entitled "Vacuum Sealer for Flat Panel Display Manufacturing Equipment").

SUMMARY OF THE INVENTION An object of the present invention is to provide an inversion unit capable of preventing line twist of a connection line passing through an inversion shaft portion when a substrate is inverted, and a substrate transfer apparatus using the same

The inversion unit according to the present invention comprises: an inversion shaft part forming a center of rotation for inversion of a substrate; And a torsion unit provided on the inverting shaft and fixing the connecting line passing through the inverting shaft; And a control unit.

Here, the twist unit may include a twist penetration part through which the connection line passes; And a second fixing part for fixing the connection line at a position facing the first fixing part about the torsional penetration part, the first fixing part spaced apart from the torsional penetration part and fixing the connection line, Fixed government; And a control unit.

Here, the connection line may be 180 degrees or 360 degrees twisted between the first fixing unit and the second fixing unit according to a normal rotation angle of the substrate.

Here, the connection line may be twisted in the directions opposite to each other between the first fixing unit side and the second fixing unit side in accordance with the normal rotation angle of the substrate.

Here, the twist penetration portion may include: a first bracket portion that forms a rotation center of the substrate when the substrate is inverted; A second bracket part through which the connection line passes and which is rotatably coupled to the first bracket part according to a reversal operation of the substrate; And a torsion bearing portion rotatably supporting the second bracket portion between the first bracket portion and the second bracket portion; And a control unit.

Here, the torsion fixing unit may include: a torsion collecting unit for collecting the connection lines by bundling; And a torsional coupling unit for fixing the torsion collecting unit; And a control unit.

Wherein at least one of the twist penetration portion and the twist fixing portion has a twist hole portion into which the connection line is inserted; Is included.

Here, the twist hole portion may include a twist socket portion in which the connection line is inserted and supported; Are inserted and joined together.

Here, the twist socket may include a twist body inserted into the twist hole; A torsion inserting portion formed in the longitudinal direction of the torsion body portion so as to insert the connection line; And a torsion cut section for dividing the torsion body section so that the circumferential surface of the torsion body section and the torsion insertion section are in communication with each other; Is included.

Here, the circumferential surface of the torsion body portion is formed so as to be tapered so that the outer diameter thereof is reduced or increased.

Here, the inversion supporting part is fixed to the inverting shaft part and the substrate is attracted and supported; And a yaw support portion supporting the substrate mounted on the inverting support portion; And further comprising:

Here, the swing prevention part may include: a swing support part provided to face the inverted support part about the substrate; And a swing drive part for reciprocating the swing support part toward the inverting support part; And a control unit.

Here, the swing prevention portion may further include at least one of a swing support pin portion protruding from the swing support portion to support the substrate, and a swing bracket portion that supports the swing support portion so as to reciprocate .

Here, the swing drive portion may include: a swing piston portion coupled to the swing support portion; And a swinging reciprocating portion for reciprocating the swinging piston portion; And a control unit.

The substrate transfer apparatus according to the present invention comprises: a transfer unit for horizontally moving and elevating the substrate while horizontally supporting the substrate with respect to the substrate; A reversing unit for reversing the substrate transferred through the transfer unit in a state of being attracted and supported; And an adsorption unit provided in at least the inversion unit among the inversion units to adsorb and support the substrate; And a control unit.

The apparatus may further include at least one of a stacking unit in which the substrate is stacked on one side of the transfer unit and a stacking unit attached on the substrate on the other side of the transfer unit.

Here, the adsorption unit may include: a hollow adsorption tube portion through which an adsorption hole through which the applied adsorption force is transmitted is formed; A suction plate provided on the suction tube to closely contact the substrate; And an adsorption line portion radially recessed in the adsorption plate portion to communicate with the adsorption hole portion; And a control unit.

Here, the absorption line portion is formed with a depression width of 0.5 mm or more and 2.0 mm or less.

Here, the absorption line portion is formed to be recessed at a depth of not less than 0.2 mm and not more than 5.0 mm.

The adsorption unit may include a contact pad portion provided on the adsorption plate portion and contacting the substrate, an adsorption variable portion coupled to the adsorption portion to communicate with the adsorption hole portion and varying the length of the adsorption portion, And at least one of an adsorption hole portion and an adsorption driving portion for providing an adsorption force to the adsorption line portion.

The reversal unit and the substrate transfer apparatus using the reversal unit according to the present invention can suppress or prevent line twist of the connection line passing through the inversion shaft portion when the substrate is reversed.

Further, the present invention can stably support and hold the substrate, and smoothly transfer or reverse the attracted substrate.

Further, according to the present invention, it is possible to prevent the seals provided between the bonded substrates from separating from the substrate (seal breaking phenomenon) when the bonded substrates are attracted and supported.

Further, the present invention improves the attraction force of the substrate, prevents the substrate from being separated from the adsorption unit in the process of transporting or reversing the substrate, and prevents breakage of the substrate.

Further, the present invention can stably maintain the flatness of the substrate when the substrate is transported or inverted.

Further, the present invention can prevent the outer shape of the substrate from being deformed when the substrate is sucked, and prevent the occurrence of unevenness (mura) on the surface of the substrate.

Further, the present invention facilitates the inversion of the substrate, prevents the protrusion of the substrate (oscillation of the substrate) transmitted to the inversion unit, and prevents breakage of the substrate due to the protrusion of the substrate.

Further, the present invention can prevent the twist of the connection line for connection with the inversion unit in the inversion operation of the substrate through the inversion unit.

Further, the present invention can prevent the detachment, detachment, separation, slacking, disconnection, peeling of the cover and the like of the connection line and prolong the service life of the connection line.

In addition, the present invention can solve the problem of cable breakage and prevent the detachment of the connection line from the cable bear.

Further, the present invention can simplify the separation of the laminated portion attached to the substrate, and can stably support the substrate.

Further, in the present invention, either side of the substrate can maintain a non-contact state.

Figure 1 illustrates a substrate according to one embodiment of the present invention,
2 is a view illustrating a state in which a substrate is removed according to an embodiment of the present invention,
3 is a block diagram illustrating a substrate transfer apparatus according to an embodiment of the present invention,
4 is a side view of a substrate transfer apparatus according to an embodiment of the present invention,
Figure 5 illustrates a loading unit in one embodiment of the present invention,
Figure 6 illustrates a delivery unit in one embodiment of the present invention,
Figure 7 is a plan view of a transfer fork portion in one embodiment of the present invention,
Figure 8 is a cross-sectional view of a transfer fork portion in one embodiment of the present invention,
FIG. 9 is a side view showing an inverting unit in an embodiment of the present invention,
10 is a side view showing a modified example of the inverting unit in an embodiment of the present invention,
Figure 11 illustrates a torsion unit in an embodiment of the present invention,
12 shows a modification of the twist unit in an embodiment of the present invention,
FIG. 13 is an exploded view showing a coupled state of the twist fixing unit in FIG. 12,
FIG. 14 is a perspective view showing a torsion socket portion according to an embodiment of the present invention, FIG.
15 is a cross-sectional view showing an adsorption unit in an embodiment of the present invention,
16 is a plan view showing a shape of an absorption line portion in an embodiment of the present invention,
17 illustrates a desorption unit according to an embodiment of the present invention,
18 and 19 are diagrams showing an operation state of a desorption unit according to an embodiment of the present invention,
20 is a flowchart illustrating a substrate transfer method according to an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an inversion unit and a substrate transfer apparatus using the same according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.

In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

FIG. 1 is a view showing a substrate according to an embodiment of the present invention, and FIG. 2 is a view showing a state of attaching / detaching a substrate according to an embodiment of the present invention.

Referring to FIGS. 1 and 2, a substrate 100 according to an embodiment of the present invention may include a joining portion 112 and a lamination portion 111.

The joining portion 112 may be formed of various flat panel displays (FPDs) such as a liquid crystal device (LCD), a plasma display panel (PDP), or a solar cell. The upper and lower plate portions 101 and 102 ).

The upper and lower plate portions 101 and 102 may be coupled to each other in a state where the seal portion 103 is inserted between the upper plate portion 101 and the lower plate portion 102. [ The seal portion 103 can maintain a gap between the upper plate portion 101 and the lower plate portion 102. [ The seal portion 103 may seal the space between the upper plate portion 101 and the lower plate portion 102 by sealing between the upper plate portion 101 and the lower plate portion 102.

The laminated portion 111 can be attached to both sides of the bonded portion 112, respectively.

The stacked portion 111 can prevent scratches from being generated on the surface of the upper plate portion 101 and the surface of the lower plate portion 102. [ The laminated portion 111 protects the upper plate portion 101 and the lower plate portion 102 to prevent the substrate 100 from being damaged.

In one embodiment of the present invention, the substrate 100 may refer to any one of a lamination portion 111, a bonding portion 112, and a bonding portion 112 to which the lamination portion 111 is attached.

Here, a corner cut 113 may be formed on the substrate 100.

The corner cut 113 is formed around the substrate 100 so that a part of the laminated portion 111 is exposed. The formation of the corner cuts 113 allows the laminated portion 111 to be easily separated from the bonded portion 112. [

Hereinafter, a substrate transfer apparatus according to an embodiment of the present invention will be described.

FIG. 3 is a block diagram showing a substrate transfer apparatus according to an embodiment of the present invention, and FIG. 4 is a side view showing a substrate transfer apparatus according to an embodiment of the present invention.

Referring to FIGS. 3 and 4, the substrate transfer apparatus according to an embodiment of the present invention can stably invert the substrate 100 during the transfer of the substrate 100, and transfer the substrate 100 to the next step. At this time, either side of both surfaces of the substrate 100 can be kept in a non-contact state.

A substrate transfer apparatus according to an embodiment of the present invention includes a transfer unit 20, an inversion unit 30 and an absorption unit 40 and includes a loading unit 10, a torsion unit 60, Unit 50 as shown in FIG.

The substrate transfer apparatus according to the embodiment of the present invention includes the inverting unit 30, the stacking unit 10 and the dismounting unit 50 around the transferring unit 20 so as to transfer the transferring unit 20 to the remaining units With the wrapping configuration, the delivery unit 20 can be configured as a single unit.

The substrate transfer apparatus includes a stacking unit 10, a first transfer unit 21, an inversion unit 30, a second transfer unit 22, a detachment unit 50, And the transmission unit 20 is linearly arranged in a state that the transmission unit 20 is divided into the first transmission unit 21 and the second transmission unit 22 so that the transmission unit 20 can be composed of a plurality of units.

Hereinafter, the loading unit 10 will be described in an embodiment of the present invention.

FIG. 5 is a view showing a stacking unit in an embodiment of the present invention. Referring to FIG. 5, the stacking unit 10 is stacked with a substrate 100 on one side of a transfer unit 20. In one embodiment of the present invention, the stacking unit 10 can supply a substrate 100 composed of a stuck portion 112 to which a stacking portion 111 is attached. Further, the stacking unit (110) can be stacked with the stacking units (111) spaced from each other. Further, the stacking unit 10 can be stacked with the stacking units 112 spaced from each other.

The loading unit 10 may include a loading body portion 11 and a cassette portion 12.

The loading body portion 11 is provided on one side of the transmitting unit 20. [ A plurality of cassette portions 12 are detachably coupled to the loading body portion 11.

The cassette unit 12 includes a substrate 100 composed of a bonded portion 112 having a laminated portion 111 attached thereto, a laminated portion 111, and a cemented portion 111 having at least a laminated portion 111 of the bonded portion 112 attached thereto A substrate 100 composed of a substrate 112 is laminated. Here, the structure of the cassette unit 12 is not limited, and a plurality of the substrates 100 may be stacked with each other corresponding to the substrate 100. [

The cassette unit 12 may be configured such that a plurality of substrates 100 formed of a bonded portion 112 having a laminated portion 111 are stacked and transferred to the stacked body portion 11. The cassette unit 12 can be transferred to the stacking body unit 11 in an empty state such that at least one of the stacking unit 111 and the sticking unit 112 is stacked.

For example, the cassette portion 12 may be detachably coupled to the loading body portion 11 by various types of carriers or operators known in the art.

Hereinafter, the delivery unit 20 will be described in an embodiment of the present invention.

FIG. 6 is a view showing a delivery unit in an embodiment of the present invention, FIG. 7 is a plan view showing a delivery fork unit in an embodiment of the present invention, and FIG. Fig.

6 to 8, the transfer unit 20 moves horizontally and vertically while horizontally supporting the substrate 100 with respect to the floor.

The transmission unit 20 can be divided into a first transmission unit 21 and a second transmission unit 22. [

The first transit unit 21 can horizontally move and elevate the substrate 100 in a state of horizontally supporting the substrate 100 with respect to the floor at one side of the reversal unit 30. [

The second transit unit 22 can horizontally move and elevate the substrate 100 while horizontally supporting the substrate 100 against the floor at the other side of the reversal unit 30. [

For example, when the stacking unit 10, the reversing unit 30 and the dismounting unit 50 are disposed around the second conveying unit 22, the second conveying unit 22 includes the stacking unit 10, The substrate 100 can be interconnected between the units 30. Further, the second transfer unit 22 can transfer the substrate 100 between the reversing unit 30 and the desorption unit 50. [ In addition, the second transfer unit 22 can transfer the substrate 100 between the stacking unit 10 and the detachable unit 50.

As another example, when the stacking unit 10, the reversing unit 30 and the dismounting unit 50 are linearly arranged, and the transmitting unit 20 is divided into the first transmitting unit 21 and the second transmitting unit 22 The first transfer unit 21 transfers the substrate 100 between the stacking unit 10 and the inverting unit 30 and the second transferring unit 22 transfers the substrate 100 between the inverting unit 30 and the detachment unit 50 The substrate 100 may be interconnected.

The transfer unit 20 may include a transfer support portion 23, a transfer guide portion 24, and a transfer drive portion 25.

The transfer support portion 23 can support the substrate 100 when the substrate 100 is moved horizontally and vertically. In supporting the substrate 100, the transfer supporting portion 23 can support only one side of the substrate 100.

The transfer support part 23 can be divided into an upper transfer support part 23-1 and a lower transfer support part 23-2.

The upper transfer support portion 23-1 can be coupled to the transfer guide portion 24 so as to be movable up and down. The upper transfer support portion 23-1 is moved up and down along the transfer guide portion 24 by the transfer drive portion 25. [

The lower transmission support portion 23-2 can be coupled to the transmission guide portion 24 so as to be able to move up and down. The lower transfer support portion 23-2 is moved up and down along the transfer guide portion 24 by the transfer drive portion 25 separately from the upper transfer support portion 23-1.

The transfer support portion 23 described above may include a transfer fork portion 231 and a transfer link portion 235. [

The transfer fork portion 231 can support the substrate 100 when the substrate 100 is moved horizontally and vertically. The transfer fork portion 231 may include a transfer body portion 232 and a transfer extension portion 234.

The transmission body portion 232 is rotatably provided in the transmission link portion 235. The transmission body portion 232 can be rotated at the transmission link portion 235 by the transmission driving portion 25. [

A plurality of transfer extension portions 234 are spaced apart from each other and coupled to the transfer body portion 232 corresponding to the area of the substrate 100. [ The adsorption unit 40 may be provided at the transfer extension part 234 and spaced apart from each other. The transfer extension part 234 can prevent interference with the neighboring unit in the process of transferring the substrate 100 and can stably support the substrate 100. [

Here, the transmission extension part 234 may be provided with a fixed position guide part 26 for sensing the position of the transmission fork part 231. The fixed position guide part 26 may be provided at the free end of the transmission extension part 234.

The fixed position guiding portion 26 is supported in contact or noncontact manner with the fork support portion (not shown) of the reversing unit 30 according to the operation of the transmission fork portion 231 to correct or transmit the shaking of the transmission extending portion 234 The parallelism or flatness of the extension portion 234 can be maintained.

The substrate supporting part 40-1 may be provided on the transfer extension part 234 to prevent or prevent the flow of the substrate 100 while one side of the substrate 100 is supported.

For example, a plurality of the substrate supporting portions 40-1 may be spaced apart from each other and protrude from the upper portion of the transfer extending portion 234. The substrate supporting part 40-1 may be constituted by the contact pad part 43 and the substrate 100 may be contacted to one side of the substrate 100 to prevent the substrate 100 from slipping.

As another example, the substrate supporting portion 40-1 can adsorb and support one side of the substrate 100 by the applied attraction force. It is sufficient that the attraction force in the substrate support portion 40-1 is such that the substrate 100 does not flow at the upper portion of the propagation extension portion 234 when the substrate 100 is moved horizontally and vertically. At this time, the substrate supporting unit 40-1 may be constituted by the adsorption unit 40. [

The substrate support portion 40-1 can suppress or prevent the flow of the substrate 100 when the transfer link portion 235 is horizontally moved. The substrate support portion 40-1 does not leave any unevenness on one side of the substrate 100. [

Further, the absorption unit 40 may be provided at the lower portion of the transmission extension portion 234. [

The absorption units 40 provided at the lower portion of the transmission extension part 234 are spaced apart from each other and provided on the bottom surface of the transmission extension part 234 so that one side of the substrate 100 can be attracted and supported by a suction force applied thereto.

A plurality of transmission link portions 235 may be coupled to the transmission guide portion 24 so as to be movable up and down. The transfer link portion 235 can horizontally move the transfer fork portion 231 by the transfer drive portion 25. [ In addition, the plurality of transfer link portions 235 can be rotated in a horizontal state by the transfer drive portion 25, respectively, and the transfer fork portion 231 can be rotated.

The transfer guide portion 24 can be coupled to the transfer support portion 23 so as to be movable up and down.

The transfer guide part 24 forms a path through which the transfer support part 23 is moved up and down so that the transfer support part 23 can be smoothly moved up and down.

The transfer drive unit 25 can move the transfer support unit 23 horizontally or move the transfer support unit 23 up and down. The transmission drive unit 25 may include a servo motor that can precisely control the elevating movement position or the horizontal movement position of the transfer fork unit 231. [

The transfer support portion 23 can be moved up and down and the transfer link portion 235 can be rotated in the transfer support portion 23 and the transfer fork portion 231 can be rotated, Can be rotated.

Hereinafter, the inversion unit 30 will be described in an embodiment of the present invention.

FIG. 9 is a side view showing an inverting unit in an embodiment of the present invention, and FIG. 10 is a side view showing a modification of the inverting unit in an embodiment of the present invention.

9 or 10, the inversion unit 30 can reverse the substrate 100 in a state in which the substrate 100 is transferred through the transfer unit 20 by suction.

The inversion unit 30 is connected to the inversion body 31 through the operation of the inversion driving unit 34 while the inversion support unit 32 is rotatably coupled to the inversion body 31, The substrate 100 can be reversed by rotating the shaft portion 33 in the forward and reverse directions.

Here, the inverting body portion 31 supports the inverting shaft portion 33, so that the inverting supporting portion 32 can be rotatably engaged.

A plurality of inverting units 30 may be provided on the inverting body 31 along the elevating direction of the substrate 100 or the horizontal moving direction of the substrate 100.

The inversion unit 30 includes an inversion support portion 32, an inversion axis portion 33 and an inversion driving portion 34 and includes a substrate alignment portion 35, an inversion confirmation portion 36, ). ≪ / RTI >

The inverted support portion 32 sucks and supports the substrate 100. The substrate 100 can be attracted and supported on the inverted support portion 32 in a state of being in contact with one side of the substrate 100. [

The inverting support portion 32 may be provided with a suction unit 40 for suctioning the substrate 100. [

The inverting shaft portion 33 is fixed to the inverting support portion 32. The inverting shaft portion 33 may be fixed to the lower portion of the inverting support portion 32 to indicate the center of rotation of the inverting support portion 32. [

The inversion driving section 34 rotates the inversion shaft section 33 in at least one of the forward direction and the reverse direction. The inversion driving unit 34 may be coupled to the inversion shaft unit 33 to rotate the inversion shaft unit 33.

The inversion driving section 34 can rotate the inversion shaft section 33 or the inversion support section 32 intermittently in accordance with the rotation angle set for the inversion of the substrate 100. [

For example, the inversion driving section 34 may rotate the inversion shaft section 33 or the inversion support section 32 by 180 degrees. In addition, the inversion driving section 34 can rotate the inversion shaft section 33 or the inversion support section 32 by 180 degrees in the forward and reverse directions.

The substrate aligning section 35 can position the substrate 100 at the inverting support section 32 when the substrate 100 is mounted on the inverting support section 32. [

The substrate alignment unit 35 can position the substrate 100 through various known three-axis motions. For example, the substrate alignment unit 35 can position the substrate 100 by moving the substrate 100 in three axial directions or adjusting the tilt of the substrate 100. [

At this time, a displacement sensor 35-1 is provided in the inversion unit 30 to sense the position of the substrate 100 according to the operation of the substrate alignment unit 35, and control the operation of the substrate alignment unit 35 .

The reversal confirmation unit 36 can sense the reversal state of the substrate 100 or the reversal support 32. [

For example, the reversal confirmation unit 36 may be constituted by a contact type or non-contact type sensor for sensing the position of the reversal support unit 32, or may be constituted by a switch for selecting whether the reversal driving unit 34 is operated or not.

It is possible to stably invert the substrate 100 attracted and supported by the inverting support portion 32 in accordance with the operation of the inverting confirmation portion 36 and to maintain the horizontal state of the substrate 100 before and after the inversion of the substrate 100 Can be confirmed.

Although not shown, the inverting unit 30 may further include an inverting elevating part (not shown) for moving the inverting supporting part 32 up and down. The inverting elevating portion (not shown) can adjust the transmitting position of the substrate 100 by moving the inverting supporting portion 32 up and down.

The yaw support portion (37) supports the substrate (100) that is seated on the reverse support portion (32). The yaw support portion 37 supports the substrate 100 mounted on the inverting support portion 32 to prevent swinging of the substrate 100 transferred to the inverting support portion 32. [

For example, when the substrate 100 supported on the transfer unit 20 is transferred to the inversion support portion 32, the eccentric support portion 37 supports the substrate 100 seated on the inversion support portion 32, It is possible to prevent the substrate 100 from oscillating in the substrate holder 32 and stably support the substrate 100 in the substrate holder 32. [

As another example, when transferring the inverted substrate 100 to the transfer unit 20, by supporting the substrate 100 seated on the inverted support portion 32, the fluctuation of the substrate 100 separated from the inverted support portion 32 can be suppressed And the substrate 100 can be stably separated from the inversion support portion 32 and transferred to the transfer unit 20. [

The yaw support portion 37 includes a swing support portion 371 and a swing drive portion 373 and includes at least one of a swing support pin portion 372, a suction unit 40, and a swing bracket portion 375 .

The swing support portion 371 is provided to face the inverting support portion 32 about the substrate 100 mounted on the inverting support portion 32. The swing support portion 371 is spaced apart from the inverting support portion 32 and is capable of reciprocating toward the inverting support portion 32.

The swing drive portion 373 can reciprocate the swing support portion 371 toward the inverted support portion 32. [

The swing drive portion 373 may include a swing piston portion 374 and a swinging wobble portion 376.

The swing piston portion 374 is engaged with the swing support portion 371, and the swinging wobble portion 376 reciprocates the swing piston portion 374.

The swing support pin portion 372 is protruded from the swing support portion 371 to support the substrate 100. [ When the substrate 100 is mounted on the swing support pin portion 372 because the swing support pin portion 372 is protruded from the swing support portion 371, the transfer unit 20 is inserted between the swing support portion 371 and the substrate 100 So that it can be stably inserted.

The swing support pin portion 372 is composed of an absorption unit 40 protruding from the swing support portion 371, and can hold the substrate 100 by suction.

The swing bracket portion 375 supports the swing support portion 371 in a reciprocating manner. The swing bracket portion 375 connects the swing support portion 32 and the swing support portion 371 so that the swing support portion 371 is spaced from the inverting support portion 32 and the swing piston portion 374 can be coupled have.

The swing bracket portion 375 may be provided with an inverting shaft portion 33.

The twist unit 60 will now be described in an embodiment of the present invention.

FIG. 11 is a view showing a twist unit in an embodiment of the present invention, FIG. 12 is a view showing a modification of the twist unit in an embodiment of the present invention, and FIG. 13 is a cross- FIG. 14 is a perspective view showing a torsional socket unit according to an embodiment of the present invention. FIG.

11 to 14, the twist unit 60 is provided in the inversion unit 30 to fix the connection line 200 for connection with the inversion unit 30. [ Here, the connection line 200 may include at least one of a cable for electrical connection and a fluid line for fluid movement.

The torsion unit 60 may suppress or prevent line twist of the connection line 200 and may omit the installation of cable bails for unifying and consolidating the connection line 200, It is possible to prevent the connection line 200 from being detached or damaged by the cable bare.

The torsion unit 60 includes a torsional penetration portion 61 and a torsional fixation portion 62 and may further include at least a torsion support portion 623 of the torsion support portion 623 and a torsion support portion 623 .

The torsional penetration portion 61 is provided in the reversing unit 30 to allow the connection line 200 to pass therethrough.

The torsional penetration portion 61 may include a first bracket portion 611, a second bracket portion 612, and a torsion bearing portion 613.

The first bracket part 611 forms a center of rotation when the substrate 100 supported by the inverting support part 32 is inverted. The first bracket portion 611 is formed as a hollow body so that the connection line 200 is passed therethrough.

The second bracket part 612 is rotatably coupled to the first bracket part 611 according to the operation of the reversing unit 30. The second bracket portion 612 is formed as a hollow body to allow the connection line 200 to pass therethrough.

Here, it is advantageous that the first bracket portion 611 and the second bracket portion 612 are formed to overlap each other.

The torsion bearing portion 613 rotatably supports the second bracket portion 612 between the first bracket portion 611 and the second bracket portion 612.

It is possible to prevent the connection line 200 from interfering with the inversion unit 30 when the substrate 100 is inverted according to the configuration of the twist unit 60. [

For example, the first bracket portion 611 may be provided in the inversion shaft portion 33 or the swing bracket portion 375 of the reversing unit 30 and may be rotated in accordance with the reversing operation of the substrate 100, The first bracket portion 612 does not interfere with the rotation of the first bracket portion 611.

The second bracket portion 612 may be provided in the inverting shaft portion 33 or the swing bracket portion 375 of the reversing unit 30 so as to be rotated in accordance with the reversing operation of the substrate 100, The first bracket portion 612 does not interfere with the rotation of the first bracket portion 611.

The torsional fixation portions 62 are spaced apart from each other in the torsional penetration portion 61 to fix the connection line 200.

The torsional fixing portion 62 includes a first fixing portion 62-1 for fixing the connection line 200 at the side of the reversing unit 30 and spaced apart from the torsional penetration portion 61, And a second fixing part 62-2 fixing the connection line 200 at a position facing the first fixing part 62-1.

The first fixing portion 62-1 may be fixed to the inverting support portion 32 or the inverting shaft portion 33 in the inverting unit 30 and the second fixing portion 62-2 may be fixed to the inverting unit 30, To the reversing body portion 31 for rotatably supporting the reversing support portion 32 or the inverting shaft portion 33. [

At this time, the connection line 200 is rotated 180 degrees between the first fixing part 62-1 and the second fixing part 62-2 in accordance with the normal rotation angle of the reversing unit 30 for reversing the substrate 100 Or 360 degrees twisted.

The connection line 200 is provided on the side of the first fixing part 62-1 and the side of the second fixing part 62-2 in accordance with the normal rotation angle of the reversing unit 30 for reversing the substrate 100 It can be twisted in the opposite direction.

The torsion of the connection line 200 is reduced by 90 degrees or 180 degrees with respect to 180 degrees or 360 degrees of the inversion unit 30 to reduce the stress applied to the connection line 200, It is possible to extend the service life of the battery 200.

For example, when the inversion unit 30 has a normal rotation angle of 180 degrees, the connection line 200 is linearly connected to the first fixing unit 62-1 and the second fixing unit 62-1 without twisting the connection line 200 62-2, and then operating the inversion unit 30, the connection line 200 can be twisted by 180 degrees.

In this case, the twist angle of the connection line 200 may be twisted within a range from 0 degrees to 180 degrees.

As another example, when the normal rotation angle of the reversing unit 30 is 180 degrees, the connection line 200 is positioned at the center or torsional penetration portion between the first fixing portion 62-1 and the second fixing portion 62-2 61, the connecting line 200 is twisted at 90 degrees from the first fixing part 62-1 and the connection line 200 is fixed at 90 degrees from the second fixing part 62-2. And is twisted in the directions opposite to each other on the side of the first fixing portion 62-1 and the side of the second fixing portion 62-2. Accordingly, when the reversal unit 30 is operated, the connection line can be twisted within a range of 90 degrees in the forward direction from 90 degrees in the reverse direction.

In this case, the twist angle of the connection line 200 is reduced on the basis of the linear 0 degree of the connection line 200, thereby reducing the stress applied to the connection line 200 and extending the life of the connection line 200 .

The torsional fixation portion 62 may include a torsion collecting portion 621 and a torsional coupling portion 622.

The torsion collecting portion 621 collectively combines the connection lines 200 into a bundle. Here, the structure of the twist-gathering unit 621 is not limited, and the connecting lines 200 may be integrated and bundled through various known structures.

The torsional coupling portion 622 fixes the torsion collecting portion 621. The torsional coupling portion 622 can fix the torsional coupling portion 621 to the inverted shaft portion 33 or the swinging bracket portion 375 of the reversing unit 30 in the first fixing portion 62-1. Further, the twist coupling part 622 can fix the twist-gathering part 621 in the second fixing part 62-2 so as to face the first fixing part 62-1. The torsional coupling portion 622 can fix the torsion collecting portion 621 to the reversing body portion 31 of the reversing unit 30 at the second fixing portion 62-2.

The torsion support portion 623 is provided in at least one of the torsional penetration portion 61 and the torsional fixing portion 62. The torsion support portion 623 may be provided with a torsion hole portion 624 into which the connection line 200 is inserted.

The torsion support portion 623 can prevent interference between the connection lines 200 and prevent mutual entanglement of the connection lines 200 in fixing the connection line 200, Can be easily found and the twist state of the connection line 200 can be easily confirmed.

The torsion socket portion 625 is inserted and supported by the connecting line 200. The torsion socket portion 625 is inserted into the torsion hole portion 624, so that the connection line 200 can be stably supported. The torsion socket portion 625 can stably be inserted into the torsion hole portion 624 as the torsion support portion 623 is fixed to the torsion collecting portion 621 or the torsional penetration portion 61, Can be stabilized.

The torsion socket portion 625 may include a torsion body portion 626 and a torsion insertion portion 627 and may further include a torsional incision portion 628.

The torsion body portion 626 is inserted into the torsion hole portion 624.

The torsion inserting portion 627 is formed through the torsion body portion 626 and the connecting line 200 is inserted. The torsion inserting portion 627 can be formed in the longitudinal direction of the torsion body portion 626.

The circumferential surface of the torsion body 626 is tapered so that the outer diameter thereof is reduced or increased so that the diameter of the torsion insertion portion 627 is reduced when the torsion body portion 626 is inserted into the torsion hole portion 624 And it is possible to prevent the connection line 200 from flowing in the torsion inserting portion 627.

At this time, the torsion hole portion 624 may be tapered corresponding to the circumferential surface of the torsion body portion 626.

The torsionally cut portion 628 defines a torsion body portion 626 such that the circumferential surface of the torsion body portion 626 and the torsion insertion portion 627 communicate with each other. The torsional cutting portion 628 may be formed to extend from the torsional insertion portion 627 toward the circumferential surface of the torsional body portion 626 to define the torsional body portion 626.

The torsion cut-off portion 628 expands according to the insertion or detachment of the connection line 200 in which the connection is completed, so that the connection line 200 can be smoothly installed.

Although not shown, the torsional incision 628 is formed from the torsion hole portion 624 of the torsion support portion 623 toward the periphery of the torsion support portion 623 to facilitate the insertion of the connection line 200, ).

Hereinafter, the adsorption unit 40 will be described in an embodiment of the present invention.

Fig. 15 is a cross-sectional view showing an adsorption unit in an embodiment of the present invention, and Fig. 16 is a plan view showing a shape of an adsorption line part in an embodiment of the present invention.

Referring to FIGS. 15 and 16, the adsorption unit 40 adsorbs and supports the substrate 100 in the process of transferring the substrate 100. The adsorption unit 40 can be provided in at least one of the transfer unit 20, the reversing unit 30 and the desorption unit 50 to adsorb and support the substrate 100.

The adsorption unit 40 adsorbs and supports the substrate 100 by the applied adsorption force and includes a suction pipe section 41, a suction plate section 42 and an absorption line section 421, , An adsorption variable section (44), an adsorption drive section (45), and an adsorption fixation section (47).

The absorption tube portion 41 is hollow and has an absorption hole portion 411 through which an absorption force is transmitted.

The attracting plate portion 42 is provided at the end of the attracting tube portion 41 and is brought into close contact with the substrate 100. Here, the attraction plate portion 42 may be provided with a contact pad portion 43 which is in close contact with one side of the substrate 100.

The suction line portion 421 is recessed in the suction plate portion 42 so as to communicate with the suction hole portion 411. Here, the absorption line section 421 may be arranged radially around the absorption hole section 411. [

The absorption line section 421 has a linear structure such as a linear shape or a semicircular shape, and can be arranged radially.

Since the absorption line unit 421 is formed to be long in the radial direction, the absorption unit 40 can increase the adhesion with the substrate 100 and can suppress or prevent the external shape of the substrate 100 from being deformed with respect to the same attraction force It is possible to prevent seam bursting phenomenon in which the seal portion 103 is separated from at least one of the upper plate portion 101 and the lower plate portion 102 in the bonded portion 112 of the substrate 100, (42).

The adhesion pad portion 43 is provided on the attraction plate portion 42 to contact the substrate 100.

The adhesion unit 40 can increase adhesion with the substrate 100 and prevent the substrate 100 from flowing in a state in which the substrate 100 is in close contact with the substrate 100. [

The adsorption variable section 44 is connected to the adsorption tube section 41 so as to communicate with the adsorption hole section 411 to vary the length of the adsorption tube section 41. By varying the length of the adsorption pipe section 41 through the adsorption changing section 44, the length of the plurality of adsorption units 40 can be kept constant, and the substrate 100 can be supported more stably.

The attraction drive unit 45 provides attraction force to the attraction hole 411 and the attraction line unit 421 of the attraction tube unit 41 by a power source applied thereto. The attraction drive unit 45 can provide attraction force through various known types.

The adsorption fixing portion 47 is screwed to the adsorption pipe portion 41 when the adsorption tube portion 41 is coupled to the transfer unit 20 or the reversing unit 30 or the desorption unit 50, Or the reversing unit (30) or the detachment unit (50).

The adsorption fixing portion 47 is a portion in which the adsorption tube portion 41 is connected to the transfer unit 20 or the inversion unit 50 when the adsorption tube portion 41 is coupled to the transfer unit 20 or the reversal unit 30 or the desorption unit 50, (30) or the desorption unit (50).

The adsorption fixing unit 47 stably fixes the adsorption pipe section 41 so that the adsorption unit 40 is moved in accordance with the operation of the transfer unit 20 or the operation of the reversal unit 30 or the operation of the desorption unit 50 And it is possible to prevent the attraction force provided to the suction hole portion 411 or the suction line portion 421 from being lost.

In addition, since the adsorption unit 40 is stably fixed, the substrate 100 can be stably attracted and supported, and the substrate 100 can be prevented from dropping or from being damaged.

Hereinafter, adsorption characteristics of the adsorption unit 40 will be described with reference to the following tables.

In the pad type of each table, the suction plate portion 42 provided with the suction line portion 421 according to the embodiment of the present invention is referred to as a linear pad, and the plurality of concentric suction lines A suction plate portion 42 provided with a suction line portion 421 having a 1.5 mm recess width in the portion 421 is denoted by a 1.5 mm circular pad and is formed concentrically with the suction hole portion 411 to form a plurality of concentric suction lines A suction plate portion 42 provided with a suction line portion 421 having a 2.0 mm recess width is referred to as a 2.0 mm circular pad and a suction plate portion 42 having a porous suction line portion 421 ) Will be referred to as a porous pad.

The substrate thickness in [Table 1] and [Table 2] represents the thickness of a single plate portion such as the upper plate portion 101 or the lower plate portion 102. In Table 3 and Table 4, The thickness of the substrate 100 constituted by the adhesion portion 112 from which the adhesion portion 112 is removed and the thickness of the substrate 100 composed of the adhesion portion 112 to which the adhesion portion 111 is attached.

Table 1 shows experimental data on the adsorption load capable of stably supporting the substrate 100 according to the change of the attraction force with respect to the substrate thickness of each pad type.

Substrate thickness
(mm) Pad type Adsorption force (KPa) 20 40 60 80 0.15 t Linear pad (kgf) 0.15-0.18 0.33 to 0.35 0.35 to 0.39 0.40 to 0.46 1.5mm round pad (kgf) 0.15-0.18 0.25 to 0.28 0.33 to 0.35 0.37-0.42 2mm round pad (kgf) 0.15-0.18 0.26-0.30 0.34 to 0.37 0.38 to 0.43 The porous pad (kgf) 0.08 to 0.10 0.12 to 0.13 0.13 to 0.14 0.15-0.17 0.2t Linear pad (kgf) 0.20-0.23 0.38-0.42 0.39 to 0.43 0.47-0.52 1.5mm round pad (kgf) 0.16-0.20 0.30 to 0.34 0.35-0.40 0.45-0.50 2.0mm round pad (kgf) 0.16 to 0.21 0.31-0.35 0.35-0.40 0.38-0.44 The porous pad (kgf) 0.09 to 0.12 0.13 to 0.16 0.16 to 0.19 0.24-0.27

As a result of the experiment, in the case of the linear pad having the adsorption line portion 421 having the linear structure according to the embodiment of the present invention, as shown in Table 1, It can be confirmed that the pad has an excellent attraction force.

Table 2 shows the state of the substrate 100 according to the depression depth and the depression width of the suction line part 421 in the linear pad having the suction line part 421 having a linear structure according to an embodiment of the present invention This is the displayed data.

Substrate thickness
(mm) Condition Depth of Depth (A, mm), Depth of Depth (B, mm) A: less than 0.5
B: less than 0.2 A: 0.5 to 2.0
B: 0.2 to 5.0 A: exceeded 2.0
B: Greater than 5.0 0.15 t Adsorption force (80KPa) Substrate falling by adsorption load of 0.38Kgf or less 0.40 Kgf to 0.46 Kgf Adsorption load of 0.47Kgf or more Contour transformation Bending less than 0.03 mm 0.03mm to 0.08mm bending Bending more than 0.12mm 0.2t Adsorption force (80KPa) Falling of substrate with adsorption load of 0.45Kgf or less 0.47 Kgf to 0.52 Kgf Adsorption load of 0.53Kgf or more Contour transformation Bending less than 0.03 mm 0.03mm to 0.08mm bending Bending more than 0.12mm

As a result of the experiment, the absorption line portion 421 can be opened with a recess width of 0.5 mm or more and 2.0 mm or less as shown in [Table 2]. In addition, the absorption line portion 421 may be recessed to a depth of not less than 0.2 mm and not more than 5.0 mm.

Accordingly, stable adsorption load as shown in [Table 1] acts on the adsorption force of 80 KPa depending on the kind of the substrate 100 as shown in [Table 2], and the substrate 100 can be stably attracted and supported.

The substrate 100 may be damaged if the amount of warping of the substrate 100 exceeds 0.1 mm relative to the warping of the substrate 100. However, The following is a safe range because no damage is given to the substrate 100.

As a result, the suction line portion 421 is opened at a concave width of 0.5 mm or more and 2.0 mm or less, so that a deflection of 0.03 mm to 0.08 mm is generated and is safe. Further, the absorption line portion 421 is recessed at a recess depth of 0.2 mm or more and 5.0 mm or less, so that a deflection of 0.03 mm to 0.08 mm is generated and is safe.

When the recessed width of the suction line portion 421 is less than 0.5 mm or the recessed depth of the suction line portion 421 is less than 0.2 mm, as shown in [Table 2], the suction force of 80 KPa is shown in [Table 1] There is a problem in that the substrate 100 falls due to a failure to reach a stable adsorption load as described above. However, a deflection of 0.03 mm or less occurs, and the substrate 100 is not damaged.

When the recessed width of the suction line portion 421 exceeds 2.0 mm or the recessed depth of the suction line portion 421 exceeds 5.0 mm, as shown in [Table 2], the suction force of 80 KPa The substrate 100 can be stably attracted by the stable adsorption load as described in [1] above, but the substrate 100 may be damaged due to a deflection of 0.12 mm or more, The substrate 100 may be broken.

Table 3 shows experimental data on the adsorption load capable of stably supporting the substrate 100 according to the change of the attraction force with respect to the substrate thickness of each pad type.

Substrate thickness
(mm) Pad type Adsorption force (KPa) 20 40 60 80 0.3t
(0.15 + 0.15) Linear pad (kgf) 0.28-0.35 0.36 to 0.48 0.49 to 0.54 0.55-0.62 1.5mm round pad (kgf) 0.25 to 0.30 0.31-0.44 0.45-0.50 0.51 to 0.58 2mm round pad (kgf) 0.27 to 0.32 0.33 to 0.46 .047 ~ 0.52 0.53 to 0.60 The porous pad (kgf) 0.10 to 0.14 0.15-0.21 0.22-0.25 0.26 to 0.32 0.4t
(0.2 + 0.2) Linear pad (kgf) 0.34 to 0.41 0.42 to 0.54 0.55 to 0.60 0.61 to 0.68 1.5mm round pad (kgf) 0.27-0.35 0.36-0.50 0.51 to 0.56 0.57 to 0.64 2.0mm round pad (kgf) 0.32 to 0.38 0.39-0.52 0.53 to 0.58 0.59 to 0.66 The porous pad (kgf) 0.16-0.20 0.21-0.27 0.28-0.31 0.32 to 0.38

As a result of the experiment, in the case of the linear pad having the adsorption line portion 421 having the linear structure according to the embodiment of the present invention, as shown in Table 3, It can be confirmed that the pad has an excellent attraction force.

Table 4 shows the state of the substrate 100 according to the depression depth and the depression width of the suction line part 421 in the linear pad provided with the suction line part 421 having a linear structure according to an embodiment of the present invention This is the displayed data.

Substrate thickness
(mm) Condition Depth of Depth (A, mm), Depth of Depth (B, mm) A: less than 0.5
B: less than 0.2 A: 0.5 to 2.0
B: 0.2 to 5.0 A: exceeded 2.0
B: Greater than 5.0 0.3t Adsorption force (60KPa) Dropping the substrate with adsorption load of 0.24Kgf or less 0.25 Kgf to 0.54 Kgf Adsorption load of 0.55 Kgf or more Contour transformation Bending less than 0.03 mm 0.03mm ~ 0.16mm bending Bending more than 0.17mm 0.4t Adsorption force (60KPa) Substrate falling by adsorption load of 0.31Kgf or less 0.32 Kgf to 0.60 Kgf Adsorption load of 0.61 Kgf or more Contour transformation Bending less than 0.02 mm 0.02mm to 0.14mm bending Bending more than 0.17mm

As a result of the experiment, the absorption line portion 421 can be opened with a recess width of 0.5 mm or more and 2.0 mm or less as shown in [Table 4]. In addition, the absorption line portion 421 may be recessed to a depth of not less than 0.2 mm and not more than 5.0 mm.

Accordingly, as shown in Table 4, a stable adsorption load as shown in [Table 3] acts on the adsorption force of 60 kPa depending on the kind of the substrate 100, so that the substrate 100 can be stably attracted and supported.

The substrate 100 may be damaged if the amount of warping of the substrate 100 against the warping of the substrate 100 is 0.17 mm or more. However, if the amount of warping of the substrate 100 is less than 0.17 mm This is a safe range because it does not damage the substrate 100.

Accordingly, the suction line portion 421 is opened by a recess having a width of 0.5 mm or more and 2.0 mm or less, so that a deflection of 0.03 mm to 0.16 mm or a deflection of 0.03 mm to 0.14 mm is secured. Further, the absorption line portion 421 is recessed at a depth of not less than 0.2 mm and not more than 5.0 mm, so that a deflection of 0.03 mm to 0.16 mm or a deflection of 0.03 mm to 0.14 mm is secured.

However, when the recessed width of the suction line portion 421 is less than 0.5 mm or the recessed depth of the suction line portion 421 is less than 0.2 mm, as shown in [Table 4], the adsorption force of 60 KPa is shown in [Table 3] There is a problem in that the substrate 100 falls due to a failure to reach a stable adsorption load as described above. However, a deflection of 0.03 mm or less occurs, and the substrate 100 is not damaged.

When the recessed width of the suction line portion 421 exceeds 2.0 mm or the recessed depth of the suction line portion 421 exceeds 5.0 mm, as shown in [Table 4], the suction force of 60 KPa The substrate 100 can be stably attracted by the stable adsorption load as described in [3], but a deflection of 0.17 mm or more is generated to cause damage to the substrate 100, And the lower plate part 102 may be separated from each other, and the substrate 100 may be damaged or the substrate 100 may be damaged.

Hereinafter, the desorption unit 50 will be described in an embodiment of the present invention.

FIG. 17 is a view illustrating a desorption unit according to an embodiment of the present invention, and FIGS. 18 and 19 are views showing an operation state of a desorption unit according to an embodiment of the present invention.

17 to 19, the desorption unit 50 separates the lamination part 111 attached to the substrate 100 from the other side of the transmission unit 20. [

The detachment unit 50 includes a detachable body portion 51, a detachable support portion 52 and a first detachable separation portion 53. The detachable unit 50 includes at least one of an detachment adjustment portion 54 and a second detachable separation portion 55 And may further include any one of them.

The detachable body portion (51) is provided on the other side of the transmission unit (20). The detachable body portion 51 is configured to stably support at least the detachable support portion 52 out of the detachable support portion 52, the first detachable separation portion 53, the detachable adjustment portion 54 and the second detachable separation portion 55 can do.

The detachable support part 52 is mounted on the detachable body part 51 and the substrate 100 to be delivered through the transmission unit 20 is seated. Here, since the desorption supporting unit 52 is equipped with the adsorption unit 40, the substrate 100 seated on the desorption supporting unit 52 can be attracted and supported.

The first detachable separation portion 53 sucks and supports the laminated portion 111 on the substrate 100. Here, the first detachable separation unit 53 may be provided with a suction unit 40. [

The first detachable separator 53 can separate the laminate 111 from the substrate 100 as it is separated from the substrate 100 after the laminate 111 is adsorbed and supported on the substrate 100.

Particularly, the first detachable separation portion 53 absorbs and supports the laminated portion 111 protruding from the corner cut 113 on the substrate 100 to facilitate separation of the laminated portion 111 from the substrate 100 .

At least one of the desorption supporting portion 52 and the first desorption / separation portion 53 may be reciprocated in a direction away from each other through a separate desorption reciprocating portion (not shown).

The desorption adjusting unit 54 adjusts the position of the corner cuts 113 formed on the substrate 100 so that the stacking unit 111 is exposed. The desorption adjusting section 54 is constituted by the substrate aligning section 35 of the inverting support section 32 and moves the substrate 100 mounted on the desorption supporting section 52 or moves the first desorption separating section 53 The position of the corner cut 113 can be adjusted.

The second detachable separation portion 55 presses a part of the laminated portion 111 corresponding to the position of the corner cut 113. Here, a part of the laminated portion 111 may be formed to protrude from the corner cut 113. The second detachable separation portion 55 may be provided to face the first detachable separation portion 53 with respect to the substrate 100 and may be provided with a first detachable separation portion 53, Can be moved together.

The second detachable separating portion 55 separates a portion of the laminated portion 111 from the substrate 100 as the portion of the laminated portion 111 is pressed by the second detachable separation portion 55 to facilitate separation of the laminated portion 111 from the substrate 100 .

The second detachable separation portion 55 may include a detachment pin portion 551, a detachment transfer portion 553, and a detachable driving portion 555.

The separating pin portion 551 is reciprocally movable in a part of the lamination portion 111 in correspondence with the corner cut 113.

The desorption transfer unit 553 transfers the applied reciprocating force to the separation pin unit 551.

The detachment drive unit 555 provides a reciprocating force for reciprocating the detachment pin unit 551.

The operation of the desorption unit 50 will be described below. When the substrate 100 is placed on the desorption support unit 52 through the transfer unit 20, the desorption support unit 52 sucks and supports the substrate 100.

The position of the corner cut 113 formed on the substrate 100 is adjusted through the desorption adjusting unit 54.

The first detachable separation portion 53 sucks and supports a portion of the laminated portion 111 corresponding to the corner cut 113. The second detachable separation portion 55 can press a part of the laminated portion 111 corresponding to the corner cut 113. The first detachable separation portion 53 and the detachable support portion 52 are separated from each other The laminated portion 111 can be stably separated from the substrate 100 according to the operation.

The unexplained reference character C can control the operation of at least one of the transfer unit 20, the reversal unit 30, the suction unit 40 and the detachable unit 50 as a control unit.

Hereinafter, a substrate transfer method according to an embodiment of the present invention will be described.

20, a substrate transferring method according to an exemplary embodiment of the present invention includes a stacking unit 111 in a stuck portion 112, The attached substrate 100 is transferred to separate the laminated portion 111 from the substrate 100 and then the bonded portion 112 separated from the substrate 100 and the laminated portion 111 separated from the substrate 100, Are stacked on the respective cassette sections 12 as an example.

Here, the substrate transfer method of the present invention is not limited to this, but may be applied to various known processes so as to stably invert the transferred substrate 100, and to separate the laminated portion 111 from the substrate 100 Can ...

The method of transferring a substrate according to an embodiment of the present invention further includes a transfer step S2 and an inversion step S3 and further includes at least one of a desorption step S4 and an entry step S1, (S5) of at least a loading step (S5) and a loading step (S6).

The transfer step S2 transfers the substrate 100 to the inversion unit 30 through the transfer unit 20 or withdraws the substrate 100 from the inversion unit 30. [ Here, the substrate 100 may be mounted on the upper portion of the transfer support portion 23 in the transfer unit 20, or the substrate 100 may be sucked and supported on the lower portion of the transfer support portion 23.

Here, the delivering step S2 may include a first delivering step S21, a second delivering step S22, and a third delivering step S23.

The first delivery step S21 transfers the substrate 100 to the inversion unit 30 through the transfer unit 20. [ The first transmission step S21 is a step of transferring at least any one of the lamination portion 111 and the substrate 100 composed of the bonded portion 112 in which the lamination portion 111 is separated through the transfer unit 20 to the inversion unit 30 ).

For example, the first transmission step S21 is a step of transferring the substrate 100 composed of the bonded portion 112 in which the laminated portion 111 is separated from the one side of the substrate through the second transfer unit 22 of the transfer unit 20 To the inverting unit (30). The first delivering step S21 is a step of transferring the laminated portion 111 separated from one side of the substrate 100 to the reversing unit 30 or the stacking unit 10 To the cassette section 12 of the cassette 12.

The second delivery step S22 draws the substrate 100 from the inversion unit 30 through the delivery unit 20. [ For example, the second transmission step S22 can take out the substrate 100 separated from the lamination part 111 from the one side through the second transmission unit 22 of the transmission unit 20 in an inverted state.

The third delivery step S23 may take out the substrate 100 from the desorption unit 50 when the desorption step S4 is further included in the substrate transport method according to an embodiment of the present invention. The third transmission step S23 is a step of dismounting at least one of the laminated portion 111 separated from the other side of the substrate 100 and the substrate 100 composed of the bonded portion 112 completely separated from the laminated portion 111, Can be withdrawn from the unit (50).

For example, in the third delivery step S23, the laminated portion 111 separated from the other side of the substrate 100 is taken out from the desorption unit 50 through the second delivery unit 22 of the delivery unit 20, To the cassette unit (12) of the unit (30) or the loading unit (10).

The third transfer step S23 is a step of transferring the substrate 100 composed of the bonded portion 112 in which the laminated portion 111 is completely separated through the second transfer unit 22 of the transfer unit 20 to the detachment unit 50 And transfer it to the reversing unit 30 or the cassette unit 12 of the loading unit 10. [

The inversion step S3 reverses the substrate 100 in a state in which the inversion unit 30 sucks and supports the substrate 100. [ For example, when the substrate 100 composed of the bonded portion 112 separated from the laminated portion 111 at one side of the substrate 100 is transferred through the second transfer unit 22, the inversion step S3 is performed, The substrate 100 is inverted while the substrate 100 is attracted and supported through the substrate 30.

The surface on which the substrate 100 is attracted in the inversion step S3 may be the side of the bonded portion 112 where the laminated portion 111 is separated or the side of the laminated portion 111 attached to the bonded portion 112. [

Accordingly, the substrate transfer method according to an embodiment of the present invention can stably invert the substrate 100. [

The desorption step S4 removes the laminated portion 111 attached to the substrate 100 through the desorption unit 50.

The desorption step S4 may include a first desorption step S41 and a second desorption step S42.

The first detachment step S41 removes the laminated portion 111 attached to one side of the substrate 100 through the detachable unit 50 prior to the first delivery step S21.

The second desorption step S42 separates the laminated portion 111 attached to the other side of the substrate 100 through the desorption unit 50 after the second transmission step S22.

The entering step S1 transfers the substrate 100 composed of the bonded portion 112 to which the laminated portion 111 is attached to the desorption unit 50 prior to the desorption step S4.

The entry step S1 may include an entry stacking step S11 and an entry forwarding step S13, and may further include an entry forwarding step S12.

In the entry stacking step S11, the substrate 100 composed of the joining part 112 to which the lamination part 111 is attached is loaded before the first desorption step S41 in the desorption step S4. The entry stacking step S11 is put into the stacking unit 10 through the cassette unit 12 in which a plurality of substrates 100 are stacked and spaced from each other.

The entry transfer step S13 transfers the substrate 100 on which the laminate portion 111 is attached to the desorption unit 50 through the second transfer unit 22 of the transfer unit 20.

The entry transfer step S13 may transfer the substrate 100 transferred to the loading unit 10 or the inverting unit 30 to the desorption unit 50. [

The entry transfer step S12 transfers the substrate 100 through the entry stacking step S11 to the inversion unit 30. [ The entry transfer step S12 may transfer the substrate 100 to the inversion unit 30 through the first transfer unit 21 of the transfer unit 20.

The transfer step S5 draws the substrate 100 composed of the laminated portion 111 transferred to the inversion unit 30 or the bonded portion 112 in which the laminated portion 111 is completely separated from the inversion unit 30. The transfer step S5 can withdraw the substrate 100 from the inversion unit 30 through the first transfer unit 21 of the transfer unit 20. The laminated portion 111 or the bonded portion 112 drawn out in the conveying step S5 may be stacked and stacked on the stacking unit 10.

The transfer step S5 may further include at least one of a first transfer step S51, a second transfer step S52, and a third transfer step S53.

In the first transfer step S51, the lamination portion 111 transferred via the first transfer step S21 is taken out from the inversion unit 30. [ In the second transfer step S52, the lamination unit 111 transferred via the third transfer step S23 is taken out from the inversion unit 30. [ In the third transfer step S53, the sticking unit 112 to be transferred through the third transfer step S23 is taken out from the inversion unit 30.

The stacking step S6 loads the substrate 100 composed of the stacking unit 111 or the stacking unit 112 separated from the stacking unit 111 on the stacking unit 10 through the transfer step S5. The loading step S6 may load the substrate 100 into the stacking unit 10 through the first one of the transferring units 20. The stacking step S6 can stack the stacking unit 111 or the sticking unit 112 drawn out in the transfer step S5 on the stacking unit 10 so as to be spaced apart from each other.

The loading step S6 may further include at least one of a first loading step S61, a second loading step S62, and a third loading step S63.

In the first stacking step S61, the stacking unit 111, which is delivered via the first delivery step S21, is loaded through the stacking unit 10. In the second stacking step S62, the stacking unit 111, which is transferred via the third delivery step S23, is loaded through the stacking unit 10. In the third stacking step S63, the stacking unit 111, which is transferred via the third delivery step S23, is loaded through the stacking unit 10.

A substrate transfer method according to an exemplary embodiment of the present invention will now be described. A substrate 100 can be transferred to the desorption unit 50 through the entering step S1, and the desorption step S4 is performed The laminated portion 111 attached to the substrate 100 can be separated.

At this time, all of the laminated portions 111 attached to both sides of the substrate 100 can be separated while inverting the substrate 100 through the transfer step S2 and the inverting step S3.

Each separated laminated portion 111 and the bonded portion 112 are transferred from the reversing unit 30 or the removable unit 50 to the stacking unit 10 through the transporting step S5 and the stacking step S6 And are respectively loaded on the cassette unit 12 of the stacking unit 10 according to the roughness.

In the entry stacking step S11, the substrate 100 to which the lamination part 111 is attached is loaded into the stacking unit 10, 1 of the transfer unit 20 to the inversion unit 30 through the first transfer unit 21 and the transfer transfer step S13 through the second transfer unit 22 of the transfer unit 20 And transfers the substrate 100 of the inversion unit 30 to the detachment unit 50. [

The first desorption step S41 separates the lamination part 111 from the one side of the substrate 100 through the desorption unit 50 and the first delivery step S21 separates the substrate 100 from the substrate 100 through the second transfer unit 22 The substrate 100 composed of the separated laminated portion 111 and the bonded portion 112 in which the laminated portion 111 is separated is transferred to the inversion unit 30.

The inversion step S3 reverses the substrate 100 composed of the bonded portion 112 from which the laminated portion 111 has been separated through the inversion unit 30. [

Here, the laminated portion 111 separated from the substrate 100 passes through the first transfer unit S21 and the first stacking step S61 in order, and then passes through the first transfer unit S21, And is loaded on the cassette section 12.

In the second delivery step S22, the laminated portion 111 is separated through the second transfer unit 22 to transfer the inverted substrate 100 to the desorption unit 50, and the second desorption step S42 is carried out The laminated portion 111 is separated through the unit 50 and the laminated portion 111 is separated from the other side of the inverted substrate 100. The third delivery step S23 transfers the laminated portion 111 separated from the desorption unit 50 through the second delivery unit 22 and the adhesion unit 112 to the inversion unit 30. [

Here, the lamination part 111 and the sticky part 112 are subjected not only to the second conveying step S52 and the second stacking step S62, but also to the third conveying step S53 and the third stacking step S63 And is loaded on the cassette portion of the stacking unit 10 through the first transmission unit 21.

Each stacked portion 111 and the bonded portion 112 individually loaded on the cassette portion 12 of the stacking unit 10 can clean the surface of the substrate 100 through a cleaning step (not shown) .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand.

Accordingly, the true scope of protection of the present invention should be defined by the claims.

10: Stacking unit 11: Stacking body part
12: cassette part 20: delivery unit
21: first transmission unit 22: second transmission unit
23: transfer supporting part 23-1: upper transfer supporting part
23-2: lower transfer supporting portion 231: transfer fork portion
232: transmission body part 234: transmission extension part
235: transmission link part 24: transmission guide part
25: transmission drive unit 26:
30: inverting unit 31: inverting body part
32: inverted support part 33: inverted shaft part
33: inverting driver 35: substrate aligning part
35-1: Displacement sensor 36:
37: yaw divergent portion 371:
372: pivot support pin portion 373: pivot drive portion
374: swing piston part 375: swing bracket part
376: swing reciprocating unit 40: suction unit
40-1: substrate supporting part 41: suction tube part
411: Adsorption hole part 42: Suction plate part
421: suction line section 43:
44: adsorption variable section 45: adsorption drive section
47: Suction fixing unit 50: Desorption unit
51: detachable body part 52: detachment support part
53: first detachment separation part 54: detachment adjustment part
55: second detachable separation portion 551: detachment pin portion
552: Desorption transfer section 553: Desorption drive section
60: Torsion unit 61: Torsion penetration part
611: first bracket part 612: second bracket part
613: Torsion bearing portion 62: Torsion fixing portion
62-1: first fixing portion 62-2: second fixing portion
621: torsion collecting portion 622:
623: Torsion support portion 624:
625: Torsion socket portion 626: Torsion body portion
627: Torsion insertion part 628: Torsion incision part
100: substrate 111: laminated portion
112: sticking part 101: upper plate
102: Lower plate part 103: Seal part
113: corner cut part 200: connecting line
C:

Claims (20)

An inversion shaft portion forming a center of rotation for inversion of the substrate; And
A torsion unit provided on the inverting shaft and fixing the connecting line passing through the inverting shaft; / RTI >
The twist unit includes:
A torsional penetration portion through which the connection line passes; And
A first fixing part spaced apart from the twist penetrating part to fix the connection line and a second fixing part fixing the connection line at a position facing the first fixing part about the twist penetrating part, government; / RTI >
Wherein the torsional-
A first bracket for forming a center of rotation of the substrate when the substrate is inverted;
A second bracket part through which the connection line passes and is rotatably coupled to the first bracket part according to a reversal operation of the substrate; And
A torsion bearing portion rotatably supporting the second bracket portion between the first bracket portion and the second bracket portion; And an inversion unit.
delete The method according to claim 1,
The connection line includes:
Wherein the first fixing unit and the second fixing unit are twisted 180 degrees or 360 degrees between the first fixing unit and the second fixing unit according to the normal rotation angle of the substrate.
The method according to claim 1,
The connection line includes:
Wherein the first fixing unit and the second fixing unit are twisted in mutually opposite directions in accordance with the normal rotation angle of the substrate.
delete The method according to claim 1,
The torsion-
A torsion collecting part for collecting the connecting lines into a bundle; And
A torsion coupling portion for fixing the torsion collecting portion; And an inversion unit.
The method according to claim 1,
Wherein at least one of the torsional penetration portion and the torsional fixing portion includes:
A torsion support portion having a torsion hole into which the connection line is inserted; And an inversion unit.
8. The method of claim 7,
In the torsion hole portion,
A torsion socket portion in which the connection line is inserted and supported; Is inserted and coupled.
9. The method of claim 8,
The torsion socket portion includes:
A torsion body inserted into the torsion hole;
A torsion inserting portion formed in the longitudinal direction of the torsion body portion so as to insert the connection line; And
A torsional incision section for separating the torsion body section so that the circumferential surface of the torsion body section and the torsion insertion section are in communication; And an inversion unit.
10. The method of claim 9,
The circumferential surface of the torsion body portion
And the outer diameter is tapered so as to be reduced or increased.
The method according to claim 1,
An inverting supporting part fixed to the inverting shaft part and supporting the substrate by suction; And
An oscillating support portion supporting the substrate placed on the inverting support portion; Further comprising:
12. The method of claim 11,
The swing-
A swing supporting part provided to face the inverting support part about the substrate; And
A swing drive part for reciprocating the swing support part toward the inverting support part; And an inversion unit.
13. The method of claim 12,
The swing-
Further comprising: a swing support pin portion protruding from the swing support portion to support the substrate; and a swing bracket portion that supports the swing support portion so as to reciprocate the swing support portion.
13. The method of claim 12,
Wherein:
A swing piston part coupled to the swing support part; And
A swinging reciprocating portion for reciprocating the swinging piston portion; And an inversion unit.
A transfer unit for horizontally moving and elevating and moving the substrate while horizontally supporting the substrate with respect to the floor;
A reversing unit according to any one of claims 1, 3, 4, and 6 to 14 for reversing the substrate transferred through the transfer unit in a state of being attracted and supported; And
An adsorption unit provided in at least the inversion unit among the inversion units to adsorb and support the substrate; The substrate transfer device comprising:
16. The method of claim 15,
Further comprising at least one of a stacking unit in which the substrate is stacked on one side of the transfer unit and a stacking unit attached to the substrate on the other side of the transferring unit.
17. The method of claim 16,
Wherein the adsorption unit comprises:
A hollow adsorption tube portion through which an adsorption hole portion through which an adsorption force is transmitted is formed;
A suction plate provided on the suction tube to closely contact the substrate; And
An adsorption line portion formed radially in the adsorption plate portion so as to communicate with the adsorption hole portion; The substrate transfer apparatus comprising:
18. The method of claim 17,
Wherein the absorption line portion is recessed with a recess width of 0.5 mm or more and 2.0 mm or less.
18. The method of claim 17,
Wherein the absorption line portion is recessed at a recess depth of 0.2 mm or more and 5.0 mm or less.
18. The method of claim 17,
A suction pad portion provided on the suction plate portion and contacting the substrate; an adsorption variable portion coupled to the adsorption tube portion to communicate with the adsorption hole portion to vary a length of the adsorption tube portion; And a suction driving unit for supplying a suction force to the suction line unit.
KR1020130032904A 2013-03-27 2013-03-27 Reversal unit and substrate transferring device using this KR101441977B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018112172A1 (en) * 2016-12-15 2018-06-21 Applied Materials, Inc. Apparatus and method for processing thin substrates

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2002184835A (en) * 2000-12-13 2002-06-28 Ando Electric Co Ltd Suction pad
JP2002302248A (en) * 2001-03-30 2002-10-18 Shibaura Mechatronics Corp Substrate reversing device, and panel manufacturing device using it
KR20080061289A (en) * 2006-12-27 2008-07-02 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate processing method
JP2010255852A (en) * 2009-04-18 2010-11-11 Igus Gmbh Multiaxial joint particularly for robot engineering, joint assembly, and kit for robot engineering

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184835A (en) * 2000-12-13 2002-06-28 Ando Electric Co Ltd Suction pad
JP2002302248A (en) * 2001-03-30 2002-10-18 Shibaura Mechatronics Corp Substrate reversing device, and panel manufacturing device using it
KR20080061289A (en) * 2006-12-27 2008-07-02 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate processing method
JP2010255852A (en) * 2009-04-18 2010-11-11 Igus Gmbh Multiaxial joint particularly for robot engineering, joint assembly, and kit for robot engineering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018112172A1 (en) * 2016-12-15 2018-06-21 Applied Materials, Inc. Apparatus and method for processing thin substrates

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