JPH11309408A - Substrate treating system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to set substrates to respective substrate treating apparatus in the same direction by providing the inlet side of respective substrate treating means with a substrate turning means and changing the directions of the substrates. SOLUTION: The substrate treating system 1 is arranged with the substrate turning means 160 which executes the hand-over of the substrate 7 between the take-in position 6a of a untreated substrate transporting route 6 and a transfer position 9a of a used substrate transporting route 9 with the other substrate treating apparatus or system and regulates the direction of the substrate 7 by properly turning the substrate 7 180 deg.. The reason thereof lies in that the coating applicators 2a, 2b are arranged to face each other and therefore, the mere transportation of the substrate 7 leads to reversing of the direction of the substrate 7 supplied to the applicators 2a, 2b and there is the possibility of the occurrence of a trouble in multiple face coating and title display or the like. This substrate turning means 160 has the function not only to rotate the substrate 7 but to center the substrate 7 as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display device (LCD) and a plasma display device (PD), for example.
In the manufacturing process of flat panel displays (FPDs) such as P), semiconductor devices and various electronic components, for example, substrates such as glass substrates for LCDs or PDPs, semiconductor substrates, and printed boards are set in coating apparatuses, for example, and various coating liquids are set. The present invention relates to a substrate processing system such as a coating system in which a thin film such as a photoresist film, a color filter material, a planarizing material, an interlayer insulating film, an insulating film, and a conductive film is formed on a substrate surface by coating the substrate.

[0002]

2. Description of the Related Art Conventionally, as a method of applying a coating liquid on a substrate surface, there are a spin coating method, a blade coating method, a spray coating method, a roll coating method and the like.

In recent years, in a manufacturing process of a liquid crystal display device, a semiconductor device, or the like, a substrate is rotated while being kept horizontal, and a coating liquid is supplied to a central portion thereof to give a centrifugal force to the coating liquid. A spin coating method of uniformly applying a coating liquid from the upper central portion to the outer peripheral portion has been widely used.

However, in this spin coating method, the coating solution is spun outward by centrifugal force in combination with the tendency of the substrate to become larger and squarer, so that the coating solution used is not effectively used. And the use efficiency of the coating liquid was poor. Also,
By rotating the rectangular substrate in a horizontal posture, the size of the apparatus is increased as the size of the substrate is increased, and the installation space has to be increased. Furthermore, when a rectangular substrate is rotated at a high speed, turbulence of the air flow easily occurs on the substrate surface. It has been difficult to ensure coating quality such as unevenness and uniformity of coating film thickness.

On the other hand, in a vertical type coating apparatus using the capillary phenomenon, the substrate is held in a vertical position or an inclined position, and the nozzle and the substrate in the substrate width direction (horizontal direction) are covered with the nozzle. Since the coating liquid is applied by discharging the coating liquid pumped from the coating liquid tank by capillary action from the nozzle to the substrate surface while relatively moving along the coating surface, the above problem of the rotary coating method, that is, coating Decrease in liquid use efficiency,
It is possible to solve an increase in installation space and an uneven coating film thickness.

FIG. 30 shows a setting operation of setting a substrate on a substrate holding stage of such a coating apparatus using a conventionally known articulated robot as a virtual conventional technique.

FIG. 30 is a front view of a virtual prior art coating system.

As shown in FIG. 30, an articulated robot 81 for setting a substrate is provided in front of a coating apparatus 80a. On the left and right of the articulated robot 81, a take-in position 82a of the pre-processing horizontal transfer path 82 and a delivery position 83a of the processed horizontal transfer path 83 are arranged.

The arm portion 81a of the articulated robot 81
Has a suction structure capable of holding the substrate 84, and a stage 85a for vertically holding the substrate of the coating apparatus 80a.
When the substrate 84 is set in the vertical position, the horizontal position of the substrate 84 that has been horizontally conveyed along the pre-processing horizontal transfer path 82 is transferred to the pre-processing position by the tip suction portion of the arm 81 a of the articulated robot 81. Horizontal transport path 8
2 from the intake position 82a,
The stage is set in a vertical position on the stage 85a. In addition, the application portion 80a receives the coated substrate 84 in the vertical position from the stage 85a by the suction portion at the tip of the arm portion 81a of the articulated robot 81, sets the substrate 84 in the horizontal position, and transfers the substrate 84 to the transfer position 83a of the processed horizontal transfer path 83. It is designed to be transported up.

The arm 8 of the articulated robot 81
The tip suction portion 1a will be described in detail below with reference to FIGS. 31 and 32.

FIG. 31 is a side view showing an essential structure of a toggle type chuck opening / closing mechanism at a tip suction portion of an arm portion 81a of the articulated robot 81 shown in FIG.

The arm portion 81a of the articulated robot 81
As shown in FIG. 31, when the substrate 84 is set on the stage 85a or when the substrate 84 is removed from the stage 85a,
Because the front surface 84a of the substrate 84 comes to the near side, the outer peripheral edge of the back surface 84b at the upper and lower ends of the substrate 84 is moved to the plurality of chuck nozzles 9.
The sucker-shaped vacuum pad 91a on the back side of the L-shaped nail 1 holds the substrate 84 in a vertical posture by being sucked respectively.

FIG. 32 is a perspective view for schematically explaining the operation of the toggle chuck opening / closing mechanism of FIG. 31. In order to make the contents of the mechanism of FIG. Shown in a state where it is placed on the side,
In this case, the operations of the clamping cylinder and the chuck nozzle are reversed in FIGS. 31 and 32, but the same reference numerals are used for the members used.

In FIG. 32, two shafts 92 and 93 are separated from each other by a dimension slightly larger than the vertical dimension of the substrate 84.
Are arranged in parallel up and down. The upper shaft 92 is rotatably supported by two bearing members 95 fixed on a base plate 94 and separated by a predetermined distance.
Numeral 3 is rotatably supported by two bearing members 96 fixed on a base plate (not shown) at a predetermined distance. Three L-shaped chuck nozzles 91 are fixed to both ends and a center of each of the two shafts 92 and 93, respectively, and are partially attached with the rotation of the shafts 92 and 93. All chuck nozzles 91 rotate between an open position indicated by a virtual line and a holding position indicated by a solid line.

One end of an arm member 97 is fixed to the lower shaft 93, and the other end of the arm member 97 is rotatably supported by a rod tip of a clamping cylinder 98. The movement of the rod end of the cylinder 98 moves the shaft 9
By rotating each lower chuck nozzle 91 via 3, the rear edge of the substrate 84 is configured to be movable to a suction holding position or a suction holding release position. One end of an arm member 99 is fixed to the upper shaft 92, and the arm member 9
9 is rotatably supported on one end of the connecting arm member 100, and the other end of the connecting arm member 100 is
One end is rotatably supported by the other end of the arm member 101 rotatably connected to the lower shaft 92, and the rod of the clamping cylinder 102 is positioned near the other end of the arm member 101. The tip is pivotally supported pivotally,
The upper chuck nozzle 91 is rotated via a shaft 92 by the movement of the rod tip of the cylinder 102, so that the rear edge of the substrate 84 is movable to a suction holding position or a suction holding release position.

A description will be given of the operation of attaching and detaching the substrate 84 to and from the stage 85a by the end suction portion of the arm portion 81a of the articulated robot 81 with the above configuration. First, the substrate 8
When the stage 4 is mounted on the stage 85a, a plurality of vacuum pads protrude from the inside of the pad storage recess on the stage side so that the outer peripheral portion of the back surface of the substrate 84 is sucked by a plurality of suction cup-shaped vacuum pads (not shown) on the stage side. I'm waiting.

The arm 81 of the articulated robot 81
The substrate 84 sucked and held arrives at the leading end suction portion a, and the outer peripheral portion of the back surface of the substrate 84 in the vertical posture is sucked by a plurality of vacuum pads (not shown) on the stage side. Further, the suction portion of the arm portion 81a of the articulated robot 81 releases the suction, and then raises all the chuck nozzles 91 to release the substrate, thereby releasing the plurality of vacuum pads to the substrate 84. The substrate 84 is pulled into a predetermined position in the vacuum pad storage recess and stored therein.
Is mounted and held on the stage 85a or the stage 85b.

At this time, the substrate holding operation of the suction portion at the tip end of the arm portion 81a is performed by first releasing the suction by the vacuum pad on the back side of the L-shaped claw of all the chuck nozzles 91 so as to move the back side edge of the substrate 84 to them. When the rod tip of the cylinder 98 is extended and the rod tip of the cylinder 102 is contracted while being separated from the vacuum pad (not shown), all the upper and lower chuck nozzles 91 are partially shown by phantom lines. At right angles to the substrate surface,
Can be completed.

Similarly, when the substrate 84 is detached from the stage 85a, a plurality of vacuum pads protrude from the pad storage recess and stand by while the outer peripheral edge of the back surface of the substrate 84 is sucked by the plurality of vacuum pads.

The arm 81 of the articulated robot 81
The tip adsorption part of a comes. At this time, the substrate holding operation of the tip suction portion of the arm portion 81a is performed by extending the rod tip of the cylinder 98 and contracting the rod tip of the cylinder 102, so that all the upper and lower chuck nozzles 91
As indicated by the imaginary line, it stands perpendicular to the substrate surface, and the substrate 84 can be received.

Further, after receiving the substrate 84 in all the upper and lower chuck nozzles 91, the rod end of the cylinder 98 contracts, and the rod end of the cylinder 102 extends, so that the upper and lower chuck nozzles 91 become solid lines. As shown in the figure, the back side edge of the substrate 84 is sucked and held by the vacuum pad on the back side of the L-shaped nail of all the chuck nozzles 91 in a state parallel to the substrate surface.

Further, the suction of the outer peripheral edge of the back surface of the substrate 84 by the plurality of vacuum pads on the stage side is released,
The back edge of the substrate 84 is moved away from the vacuum pads, whereby the delivery of the substrate 84 from the stage 85a or the stage 85b is completed.

[0023]

However, in the above structure, the substrate 84 immediately after coating may have a coating liquid on the end face of the substrate 84, and it is not appropriate to hold the end face. When the substrate 84 is transferred between the robot side and the stage side in the vertical posture with the substrate 84 upright, the vacuum pad on the robot side and the vacuum pad on the stage side may be transported. Depending on the suction timing and the suction release timing, there is a risk that the substrate 84 will fall, and therefore, it is necessary to reduce the handling speed.

Further, at the time of setting operation to the stage 85a and at the time of removing operation from the stage 85a, the hand tip suction portion of the arm portion 81a of the articulated robot 81 comes to the surface side of the substrate 84. A driving source such as a cylinder or a motor is required, and the configuration is complicated, the weight is increased, and the load as the articulated robot 81 is also increased. Also, the articulated robot 8
When a plate for covering the substrate 84 and preventing the particles from adhering to the drive source is attached to the hand tip suction portion of the first arm portion 81a, the hand tip suction portion becomes even heavier and a load is applied to the arm portion 81a. Too much
When the plate is not attached to the hand tip suction portion, not only the particles from the driving source adhere to the substrate 84, but also the wind pressure is applied to the substrate 84 during handling, and the substrate 84 vibrates, thereby generating particles. There is a fear.

Further, the arm 8 of the articulated robot 81
Since the hand tip suction portion 1a comes to a position above the surface of the substrate 84 when accessing the substrate 84 in a horizontal posture, particles may adhere to the surface of the substrate 84, and a plate for covering the substrate 84 is provided. This is especially problematic if not. Further, since the coating process on the surface to be coated of the substrate 84 is performed on the transfer area side by the articulated robot 81, particles generated during the transfer may adhere to the surface of the substrate 84.

As described above, since the coating is performed on the transfer area side, the maintainability is also deteriorated. That is, since the coating state of the substrate 84 cannot be visually inspected from the outside of the coating apparatus, it is necessary to enter the transport area where people cannot easily enter, and the maintenance is very poor.

In order to solve the above problems, the present inventors will be described in detail in each embodiment described later, but have made the following proposal in another application.

That is, a substrate holding stage for holding a substrate is provided, and the substrate holding stage is pivoted about a pivot portion so that the substrate holding surface of the substrate holding stage is at a predetermined angle and either vertical or inclined. The stage rotation means is configured to be rotatable. The rotation of the stage rotation means moves the substrate holding stage from a predetermined angle posture to an inclined or vertical posture, and this state corresponds to the substrate processing in a substrate processing apparatus such as a coating apparatus. If the predetermined angular attitude is substantially horizontal, the setting of the substrate on the substrate holding stage is performed in the substantially horizontal attitude, and the substrate is disturbed by the conventional suction timing and suction release timing disturbance. There is no danger of falling, and therefore, there is no need to slow down the handling speed, and a more stable substrate transfer It can become. Further, since the substrate holding stage is tilted from a predetermined angle posture to the vertical or vertical posture by the rotation operation of the stage turning means, and is set to the substrate processing position from the back side of the substrate processing apparatus, and the substrate processing is performed on the front side,
The substrate processing area and the transfer area can be easily separated from each other, so that particles on the transfer area side are prevented from adhering to the substrate surface on the substrate processing area side. Since there is no mechanism, the substrate processing system is easy to enter the substrate processing area side, the substrate processing state is easy to see, and the substrate processing system is easy to maintain. As described above, since the application area and the transfer area are well separated from each other, it is possible to easily arrange an outer member that covers and seals the substrate processing space on the substrate holding surface side of the substrate holding stage. An adverse effect from the surroundings such as a change in atmospheric pressure is prevented, and more stable substrate processing can be performed.

When a plurality of such substrate processing apparatuses are provided along a transfer line of one substrate processing system,
Depending on the layout of each of the substrate processing apparatuses, for example, the substrate is set on the substrate holding stage such that the side on the right side on the transfer line is directed to one substrate processing apparatus, and the other substrate processing apparatus is set to the other substrate processing apparatus. For example, the substrate is set on the substrate holding stage such that the left side on the transfer line is on the upper side. However, the substrate to be processed is not necessarily symmetrical in the vertical and horizontal directions, and if the setting direction of the substrate changes in this way, inconvenience occurs. That is, in the above example, the width of the non-use area of the substrate is different between the right side and the left side on the transport line, etc., so that the effective area of the substrate changes, There is a disadvantage that the display positions are not the same.

An object of the present invention is to provide a substrate processing system capable of setting a transferred substrate to a plurality of substrate processing apparatuses in the same direction.

[0031]

A substrate processing system according to the present invention comprises a first receiving means for receiving and holding a substrate transported in a predetermined posture, and a first receiving means for rotating the first receiving means. A substrate rotating means capable of rotating the substrate held by the receiving means in the plane of the substrate, a second receiving means for receiving and holding the substrate from the first receiving means, and a second receiving means. A first attitude converting means for receiving and holding the held substrate and converting the substrate into a vertical or inclined attitude, and a process for processing the vertical or inclined attitude held by the first attitude converting means. A first substrate processing means, a second attitude converting means for receiving and holding the substrate held by the second receiving means and converting the substrate into a vertical or inclined attitude, and a second attitude converting means. Vertical or inclined position It is characterized in that a second substrate processing means for performing processing on.

According to this structure, the first and second substrate processing means are disposed, and the substrate is supplied to one of the substrate processing means and the substrate is supplied to the other substrate processing means. In some cases, the substrate setting direction to each substrate processing unit by each attitude conversion unit may be in the opposite direction, but with the above configuration, a substrate rotating unit is provided at the entrance side of each substrate processing unit, and If the direction of the substrate is changed by the substrate rotating means so that the substrate setting direction is the same direction, compared to a case where there is no substrate rotating means at the entrance side of each substrate processing means, it is possible to obtain a plurality of substrates or display a title. It is possible to eliminate the disadvantage that the substrate is turned upside down.

Further preferably, in the substrate processing system of the present invention, the substrate rotating means may be configured such that a destination of the substrate held by the first receiving means is the first attitude changing means or the second attitude changing means. The substrate is rotated depending on whether it is a conversion unit.

According to this configuration, if the substrate is rotated according to whether the substrate rotating means is transported to the first attitude converting means or the second attitude converting means, each substrate processing can be performed. It is possible to eliminate the inconvenience that the substrate setting direction of the means is turned upside down by the first attitude converting means and the second attitude converting means.

Still preferably, in a substrate processing system according to the present invention, the substrate rotating means may be configured such that a destination of the substrate held by the first receiving means is the first attitude changing means or the second attitude. The first attitude converting means as the transfer destination of the substrate and the second
The substrate is rotated by a rotation angle corresponding to the arrangement relationship with the posture changing means.

According to this configuration, the rotation in accordance with the positional relationship of each attitude converting means depends on whether the substrate rotating means is transported to the first attitude converting means or the second attitude converting means. If the substrate is rotated by an angle, the inconvenience that the substrate setting direction for each substrate processing means in various arrangement relations is reversed by the first attitude converting means and the second attitude converting means. It can be eliminated.

Further, in the substrate processing system of the present invention, the pre-processed substrate, which has been conveyed in the pre-processed substrate conveying path at a predetermined conveying angle, is transferred to the substrate processing position of the substrate processing apparatus, and the substrate is processed in a vertical or inclined posture. In a substrate processing system for processing and transferring a processed substrate processed by the substrate processing apparatus from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed to face the substrate processing apparatus,
For each of the opposed substrate processing apparatuses,
Each of the turning means capable of rotating the substrate holding stage is arranged such that the substrate holding surface of the substrate holding stage that holds the substrate is at a predetermined angle posture and either a vertical or inclined posture with the pivot portion as a rotation center, A substrate rotating means for rotating only the substrate supplied from one of the substrate processing apparatuses which are transferred from the pre-processing substrate transport path and supplied to one of the opposed substrate processing apparatuses so as to change the direction by 180 degrees; A substrate transfer for transferring a substrate onto the substrate holding surface of an angled substrate holding stage and transferring a processed substrate processed by the substrate processing apparatus from the substrate holding stage having a predetermined angle onto a processed substrate transport path. And means are arranged.

Each of the substrate processing apparatuses is disposed to face each other via the substrate transport path, and the substrate is supplied from the substrate transport path to one of the substrate processing apparatuses and the substrate is supplied to the other substrate processing apparatus. In this case, the direction of setting the substrates to the respective substrate processing apparatuses by the rotation of the rotation means is in the opposite direction. If the substrate is transferred by the substrate transfer means on the substrate holding surface of the substrate holding stage after changing the direction, the substrate setting direction to each of the opposed substrate processing apparatuses is the same direction,
Inconveniences such as conventional multi-paneling and title display will not occur.

Further, the substrate processing system of the present invention transfers the pre-processed substrate, which has been conveyed in the pre-processed substrate transfer path at a predetermined transfer angle posture, to the substrate processing position of the substrate processing apparatus and moves the substrate in a vertical or inclined posture. In a substrate processing system for performing processing and transferring a processed substrate processed by the substrate processing apparatus from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatuses are disposed opposite to each other. The substrate holding stage is rotated with respect to each of the substrate processing apparatuses such that the substrate holding surface of the substrate holding stage for holding the substrate is at a predetermined angle, vertical or inclined around the pivot. Each of the free turning means is disposed, and the substrate is transferred from the pre-processing substrate transport path, and only one substrate is supplied to one of the opposed substrate processing apparatuses. First substrate rotating means for rotating so as to change the direction by 0 degrees, and only the substrate which has been changed in the direction of 180 degrees transferred on the processed substrate transport path is further changed in direction by 180 degrees and rotated to return to the original state. A second substrate rotating means, transferring the unprocessed substrate from the first substrate rotating means onto the substrate holding surface of the substrate holding stage at a predetermined angle, And a substrate transfer means for transferring the substrate from the substrate holding stage in the angular posture onto the second substrate rotating means.

According to this configuration, only the substrate that has been turned 180 degrees and transferred on the processed substrate transfer path is further turned 180 degrees by the second substrate rotating means and returned to its original position. The direction of the substrate to be supplied to the next process through the processed substrate transport path becomes the same direction, so that the substrate can be set in the same direction during the substrate processing in the next process, and processing can be performed without any inconvenience due to the orientation of the substrate.
For example, as the substrate processing in the next step, there is an edge rinsing processing or an exposure baking processing for removing dripping of a coating liquid at the time of coating from a lower edge portion of the substrate.

Further, the substrate processing system of the present invention transfers the pre-processed substrate, which has been conveyed in the pre-processed substrate transfer path at a predetermined transfer angle posture, to the substrate processing position of the substrate processing apparatus, and moves the substrate in a vertical or inclined posture. In a substrate processing system for processing and transferring a processed substrate processed by the substrate processing apparatus from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed adjacently so as to form a predetermined angle. The substrate holding surface of the substrate holding stage that holds the substrate is arranged with respect to each of the adjacent substrate processing apparatuses so that the substrate holding surface is at a predetermined angle posture and any one of a vertical position and an inclined position around the pivot portion. The rotating means for rotating the substrate holding stage are provided next to each other, transferred from the substrate transfer path before processing, and supplied to each of the adjacently disposed substrate processing apparatuses. Rotating means for rotating the substrate so that the directions of the substrates to be rotated are the same, transferring the substrate from the substrate rotating means onto a substrate holding surface of a substrate holding stage having a predetermined angle, and processing the substrate by a substrate processing apparatus. A substrate transfer means for transferring the processed substrate from the substrate holding stage at a predetermined angle to a processed substrate transport path is provided.

According to the above configuration, the substrate holding stage is rotated by the substrate rotating means so that the directions of the substrates supplied to the respective substrate processing apparatuses disposed adjacent to each other at a predetermined angle are the same. If the substrate is transferred onto the substrate holding surface by the substrate transfer means, the substrate setting direction to each of the substrate processing apparatuses disposed adjacent to each other at an obtuse angle or at a right angle becomes the same direction. Inconveniences such as display will not occur.

Further, the substrate processing system of the present invention transfers the pre-processed substrate, which has been conveyed in the pre-processed substrate conveyance path at a predetermined conveyance angle posture, to the substrate processing position of the substrate processing apparatus, and moves the substrate in a vertical or inclined posture. In a substrate processing system for processing and transferring a processed substrate processed by the substrate processing apparatus from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed adjacently at an obtuse angle or a right angle. For each of the adjacent substrate processing apparatuses, the substrate holding surface of the substrate holding stage for holding the substrate is set so that the substrate holding surface is in a predetermined angle posture and either a vertical or inclined posture about a pivot portion as a rotation center. Revolving means for rotating the holding stage are provided next to each other, transferred from the pre-processing substrate transport path, and supplied to each of the adjacently disposed substrate processing apparatuses. First substrate rotating means for rotating so that the substrate direction is the same, and second substrate rotating means for rotating the substrate transferred from the substrate holding stage of each of the adjacent substrate processing apparatuses so as to be the same. A substrate rotating means, and transferring the unprocessed substrate from the first substrate rotating means onto the substrate holding surface of the substrate holding stage having a predetermined angular posture, and holding the processed substrate processed by the substrate processing apparatus at a predetermined angular posture. And a substrate transfer means for transferring the substrate from the substrate holding stage onto the second substrate rotating means.

According to this configuration, the substrate transferred onto the processed substrate transport path is rotated by the second substrate rotating means so that the substrate direction is the same. The direction of the substrate to be supplied to the subsequent process is the same direction, and the substrate processing in the next process is facilitated.

Further, in the substrate processing system of the present invention, the pre-processed substrate, which has been conveyed in the pre-processed substrate conveying path at a predetermined conveying angle, is transferred to the substrate processing position of the substrate processing apparatus, and the substrate is processed in a vertical or inclined posture. In a substrate processing system for processing and transferring a processed substrate processed by the substrate processing apparatus from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed adjacently at an obtuse angle or a right angle. For each of the adjacent substrate processing apparatuses, the substrate holding surface of the substrate holding stage for holding the substrate is set so that the substrate holding surface is in a predetermined angle posture and either a vertical or inclined posture about a pivot portion as a rotation center. Revolving means for rotatably holding the holding stage are provided next to each other, and are provided on the substrate holding surface of the substrate holding stage having the predetermined angle posture from the substrate transfer path before processing. The pre-processed substrate is transferred so that the direction of the substrate supplied to each placed substrate processing apparatus is the same, and the processed substrate processed by the substrate processing apparatus is processed from the substrate holding stage at a predetermined angle. And a substrate transfer means for transferring the substrate on the substrate transfer path.

According to this configuration, the substrate transfer means such as an articulated robot can transfer the unprocessed substrate so that the directions of the substrates supplied to the adjacently disposed substrate processing apparatuses are the same. In addition, the substrate setting direction for each of the adjacently disposed substrate processing apparatuses is the same direction, so that there is no problem that inconvenience occurs in multi-panel layout and title display as in the related art.

[0047]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a substrate processing system according to the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments.

A. Embodiment 1 FIG. 1 is a partial cross-sectional view showing a schematic main part configuration of a substrate processing system according to Embodiment 1 of the present invention, and FIG. 2 is a plan view schematically showing a schematic main part configuration of the substrate processing system of FIG. FIG.

A-1. Overview of the Embodiment In the substrate processing system 1, as shown in FIG. 1, two coating apparatuses 2a and 2b are arranged facing each other with a predetermined interval therebetween, and correspond to each other. Turning means 4a and 4b are provided as attitude changing means. This turning means 4
A is provided with a substrate holding stage 3a of the coating apparatus 2a, and can be horizontally moved (slid) by a stage moving means 5a so as to be able to freely contact and separate from the coating apparatus 2a. Therefore, while the substrate 7 before processing is held substantially horizontally by the substrate holding stage 3a, the turning means 4a rotates from the setting position 10a to the coating apparatus 2a side,
Further, when the substrate 7 is horizontally moved (slid) toward the coating apparatus 2a by the stage moving means 5a, the substrate 7 is positioned at the coating reference position of the coating apparatus 2a. Conversely, when the coating process is completed by the coating device 2a, the stage moving means 5 is held while the processed substrate 7 is held.
a, the turning means 4a is retracted from the coating device 2a,
When it is further rotated to the side opposite to the coating apparatus 2a, it returns to the setting position 10a, and the processed substrate 7 can be transported in a substantially horizontal state.

On the other hand, the coating device 2 facing the coating device 2a
The swirling means 4b provided on the substrate b also has the same configuration as the above-described swirling means 4a. After the substrate 7 before processing is held substantially horizontally by the substrate holding stage 3b at the setting position 10b, the turning means 4b is applied. When the substrate 7 is turned to the side of the apparatus 2b and further horizontally moved (slid) by the stage moving means 5b to the side of the coating apparatus 2b, the substrate 7 can be positioned at the coating reference position of the coating apparatus 2b. Conversely, after the coating process by the coating device 2b is completed, the swiveling unit 4b is retracted from the coating device 2b by the stage moving unit 5b, and further turned to the anti-coating device 2b side, returns to the setting position 10b, and the processed substrate 7 is removed. It can be transported in a substantially horizontal state.

As described above, in the first embodiment, the setting position 10a of the substrate 7 on the horizontal substrate holding stage 3a of the rotating means 4a with respect to the coating apparatus 2a, and the horizontal substrate holding of the rotating means 4b with respect to the coating apparatus 2b. The setting position 10b of the substrate 7 on the stage 3b is positionally the same, and is shared as a substrate setting area.

From the setting positions 10a and 10b provided as described above, as shown in FIG. 2, the substrate before processing is arranged in a direction orthogonal to the arrangement direction of the coating apparatuses 2a and 2b (vertical direction in FIG. 2). And a processed substrate transfer path 9 for transferring a processed substrate to another substrate processing apparatus are linearly connected and extend. On the side of the pre-process substrate transfer path 6, a pre-process substrate transfer means 8 a as a receiving means is arranged, and has been conveyed from the previous process to the leading end position of the pre-process substrate transfer path 6, that is, the take-in position 6 a. The substrate 7 before processing can be transported to the setting positions 10a and 10b.
A processed substrate transfer means 8b as a receiving means is disposed in the processed substrate transport path 9, and is moved by the coating apparatuses 2a and 2b toward the terminal end of the processed substrate transport path 9, that is, the delivery position 9a. Processed substrate 7 that has been coated
Can be transported.

Further, in this embodiment, in addition to the coating process, prior to transporting the processed substrate 7 to another substrate processing system, the lower edge of the substrate 7 located at the lower side during the coating process is edged. In order to perform the rinsing process (EBR process)
An edge rinse processing device 190 as a substrate edge processing means as a post-processing means is arranged near the delivery position 9a.

In the substrate processing system configured as described above, when the unprocessed substrate 7 is transferred to the take-in position 6a of the unprocessed substrate transfer path 6, the unprocessed substrate transfer means 8a transfers the substrate 7 to the unprocessed substrate transfer path 6a. The substrate holding stage 3a (3) of the turning means 4a (4b) located at the setting position 10a (10b).
b) to perform the coating process by the coating device 2a (2b). When the coating process in the coating device 2a (2b) is completed, the processed substrate 7 is returned to the setting position 10a (10b) by the turning means 4a (4b), and after the edge rinsing process, the next substrate processing system is started. It is carried out toward. In the first embodiment, the substrate 7 conveyed to the take-in position 6a is alternately processed by the coating devices 2a and 2b, as will be described in detail later in the description of the operation.

A-2. Detailed Configuration of Each Unit of System Next, details of each unit constituting the substrate processing system according to the first embodiment will be described with reference to the drawings.

A-2-1. Coating Devices 2a and 2b The coating devices 2a and 2b have the same configuration. That is, as shown in FIG. 1, the coating apparatuses 2a and 2b respectively have a nozzle unit 12 on which a nozzle means 11 capable of supplying a coating liquid is mounted, and a vertical posture set on the substrate holding stages 3a and 3b, respectively. While relatively moving each of the substrates 7 along the surface to be coated,
A coating liquid pumped up by a capillary phenomenon in a flow path from a coating liquid tank (not shown) that is open to the atmosphere inside the nozzle means 11 is supplied from each nozzle means 11 and applied to the coating surface of each substrate 7. It has become. In FIG. 1, the nozzle unit 12 shows the application end position by a solid line, the application start position above it, and the retracted position below it by a virtual line (two-dot chain line).

As shown in FIG. 3, the coating apparatus 2a is provided with a gantry base plate 37 which covers the back side thereof.
8 are provided. When the substrate holding surface of the substrate holding stage 3a is in a vertical posture by the stage moving means 5a, the substrate holding stage 3a is horizontally moved together with the turning means 4a toward the coating apparatus 2a, and the opening 38 is formed.
The substrate holding surface of the substrate holding stage 3a can be seen from the back side of the substrate holding member, and the outer peripheral edge of the front side of the stage mounting member 14a, which will be described later, is brought into contact with the reference surface of the peripheral edge of the opening portion 38 as shown by E. Thus, the application surface of the substrate 7 on the substrate holding surface of the substrate holding stage 3a is set as the application reference surface. At this time, the stage mounting member 14
Since “a” follows the pedestal base plate 37 having high accuracy and high rigidity, the position and flatness of the substrate holding stage 3a can be determined and maintained well.

As shown in FIG. 4, each of the at least upper and lower portions E is clamped and pressed from the back side of the stage mounting member 14a, thereby forming the outer peripheral edge and the opening of the front side of the stage mounting member 14a. Stage fixing means 39 for bringing the peripheral edge portion 38 into contact therewith are provided. The stage fixing means 39 includes a clamp member 40 capable of pressing with a constant pressure and capable of changing the pressing force, a toggle clamp mechanism 41 for moving the clamp member 40 to a clamp position and a clamp release position, and a toggle clamp mechanism. An air cylinder 42 is provided as driving means for driving the air cylinder 41. By extending and contracting the rod 43 of the air cylinder 42, the clamp member 40 is moved to a clamp position indicated by a solid line and a clamp release position indicated by a virtual line (two-dot chain line). Instead of the air cylinder 42, a drive mechanism (not shown) using a ball screw and a torque motor may be used. The clamp member 40 includes an elastic member 44 such as rubber for pressing the stage mounting member 14a from the back side thereof, and an urging means such as a compression spring (not shown) for urging the elastic member 44 toward the pressing side. And a screw member 45 capable of adjusting the pressing force by moving the positions of the elastic member 44 and the urging means (not shown). Opening 38 of coating device 2a
In a state where the substrate 7 placed on the substrate holding surface of the substrate holding stage 3a is viewed from the back side (a state in which the substrate 7 can be applied to the coating surface of the substrate 7 from the front side). The outer peripheral edge side of the stage mounting member 14a is stopped with respect to the surface, the substrate holding stage 3a is floated from a rotating shaft 17a and a slide mechanism described later, and the substrate 7 is moved together with the substrate holding stage 3a in a coating reference position parallel to the nozzle means 11. And the reproducibility of the coated surface can be guaranteed. In this case, the clamp is made firmly strong to some extent so that no vibration occurs during the coating. Furthermore, an exhaust device (not shown) may be provided at a position near the contact surface portion as a measure against particles at the contact surface portion.

Further, in the first embodiment, as shown in FIG. 3, the opening 38 is covered with the stage mounting member 14a, and the coating processing space on the front side of the substrate holding surface of the substrate holding stage 3a is covered. An outer shell member 46 (FIG. 1) made of a transparent material that can be hermetically sealed and whose inside can be seen is provided. Returning to FIG. 1, the description will be continued. Drying promotion mechanisms 47a and 47b for generating a uniform airflow to make the inside positive pressure are disposed inside the outer member 46, respectively. The drying promotion mechanism 47a is disposed above the apparatus, and includes a fan and a filter (not shown) for generating a uniform airflow (vertical laminar flow) in a direction D from top to bottom, and a downflow for maintaining cleanness. Generator (Air suction type vertical laminar flow HEP
A). Further, the drying promotion mechanism 47b is
The substrate holding stage 3a is set so as to face the substrate holding surface of the substrate holding stage 3a. This is a drying horizontal airflow generator (air suction type horizontal laminar flow HEPA) including a fan to be driven and a filter (not shown). Further, a switching control unit (not shown) switches to the drying promoting mechanism 47a at the time of coating to generate a uniform airflow of a down flow so as to eliminate particles and achieve a more uniform film thickness. 47b, the substrate 7 is used in order to quickly and uniformly dry the applied coating solution.
An airflow in a direction perpendicular to the application surface is generated.

The vertical laminar flow generated by the drying promotion mechanism 47a escapes from the lower part of the coating devices 2a and 2b, and the horizontal laminar flow generated by the drying promotion mechanism 47b is disposed below the coating devices 2a and 2b. The air is exhausted by the air exhaust device.

The drying promoting mechanism 47a (downflow generating device) and the drying promoting mechanism 47b (lateral airflow generating device) are each a cover member 46 serving as a cover.
Is openably and closably attached to a window portion by a hinge or the like, and a maintenance space for the nozzle means 11 and the like is secured.

In the case where a plurality of coating apparatuses are arranged as in the first embodiment, the coating area is set to the outer member 46 in order to eliminate adverse effects such as the wind pressure due to the substrate transfer operation and the pressure change due to the opening and closing of the installation room door. The opening 38 of the application area covered with is covered with the substrate holding stage 3a or the substrate holding stage 3b to seal the inside of the application area.

Further, these drying promoting mechanisms 47a, 47
Each of 7b is provided with a temperature control function, and the temperature of the laminar flow is controlled by an internal heater or the like so as to reach a predetermined set temperature.

A-2-2. Turning Means 4a, 4b The turning means 4a, 4b have the same configuration. For this reason, here, one of the turning means 4a will be described in detail, and the other will be denoted by the same or corresponding reference numerals, and description thereof will be omitted.

FIG. 5 is a perspective view schematically showing a schematic configuration of a main part of the turning means 4a. The turning means 4a includes a substrate holding stage 3a as shown in FIG. In the substrate holding stage 3a, a plurality of vacuum pads (not shown) as suction members capable of vacuum suction are formed in elongated concave portions (not shown) at appropriate positions corresponding to the outer peripheral edge (ineffective portion) of each size of the substrate 7. )).
In each vacuum pad, a distal end of a decompression tube (not shown) capable of depressurizing the inside is opened, and the substrate 7 is held by vacuum suction to the substrate 7 by the vacuum pad. I have. Also, the reason why the vacuum pad as the suction member does not hold the central portion of the substrate 7 is that the central portion of the substrate 7 is a portion where important circuits and the like are arranged, and the temperature may be reduced by vacuum suction and release by the vacuum pad. This is to prevent application unevenness due to rising. Therefore, the shape of the vacuum pad is also the shape of an elongated vacuum pad similar to those elongated recesses in order to vacuum-suction only the outer peripheral edge of the substrate 7.

The turning means 4a includes a stage mounting member 14a which is a plate-shaped backup plate to which the substrate holding stage 3a constructed as described above is fixed.
Two arm members 15a to which the stage mounting member 14a is fixed, and a pivot shaft 17a and a bearing of a shaft support 16a provided between the arm members 15a and provided at one end of the arm member 15a. And a revolving member comprising a portion 18a. And this shaft support 16
a, the arm member 15a is connected to the base member 1 together with the substrate holding stage 3a and the stage mounting member 14a.
In the state of being placed on the substrate 9a, the substrate holding surface of the substrate holding stage 3a is rotated so as to have a predetermined angle posture (horizontal posture in the present embodiment) and a vertical or inclined posture (vertical posture in the present embodiment). It is configured to be movable. A bearing 18a is mounted and fixed on the base member 19a.

The turning means 4a is provided with a turning drive means 20.
a is provided. This turning drive means 20a is provided in FIG.
As shown in the figure, a worm speed reducer 21a having one end of a turning shaft 17a connected to an output portion, and the worm speed reducer 2
The worm input shaft 22a of FIG. 1a has a servomotor 24a connected via a coupling 23a as a connecting means, and the rotation of the servomotor 24a is decelerated via the worm speed reducer 21a and the substrate holding stage 3a The substrate holding surface of the stage mounting member 14a and the arm member 1
The application device 2a is rotated from the horizontal posture to the vertical posture or from the vertical posture to the coating device 2a side to the horizontal posture around the axis of the revolving shaft 17a together with 5a. Also, when the coupling 23a is detached and the connection between the servo motor 24a and the worm input shaft 22a is released during maintenance or the like, the manual handle 2
5, the worm input shaft 22a is manually rotated to rotate the turning means 4a to rotate the worm input shaft 22a.
a can be set to a desired angle posture.

Further, in addition to the turning drive means 20a, a balance means 26a for balancing the turning means 4a is provided. Although the balance means 26a is actually arranged on both sides in terms of balance, FIG. 5 shows only one balance means 26a for simplicity of explanation. As shown in FIG.
a are provided on both outer sides of the two arm members 15a, and each of two pulleys 27 respectively fitted to the pivot 17a.
And a wire 28 serving as a connecting member wound around each of the pulleys 27 has a roll 29, 29 and a counter cylinder 32 connected to a movable shaft 31 via a linear guide 30.

Control means 4 for controlling balance means 26a
As for 8, for example, the configuration shown in FIG. 6 can be adopted. FIG. 6 is a control configuration diagram schematically showing an example of the rotation control in the turning means of FIG. This control means 48
Is an encoder 4 serving as an angle detecting means for detecting the rotation angle of the turning shaft 17a of the turning means 4a, as shown in FIG.
8a and an electropneumatic regulator 48b connected to the encoder 48a and controlling the air pressure of the air source 48c based on the angle signal from the encoder 48a to supply air to the counter cylinder 32. This control is performed in accordance with the tilt angle of the substrate holding stage 3a detected by the encoder 48a. Is performed by the electropneumatic regulator 48b so that the counter cylinder 32 gives the rotation shaft 17a.

According to such a configuration, the driving force for rotating the substrate holding stage 3a can be small, and effects such as downsizing of the rotation driving means 20a can be obtained.

Further, for example, when the substrate holding surface of the substrate holding stage 3a in the turning means 4a rises from the horizontal state of the substrate transfer posture, or when the substrate holding surface changes to the horizontal state of the substrate transfer posture, the wind pressure at that time is changed. The lower particles may be wound up, but the rotation speed when rising from the horizontal state or going down to the horizontal state is controlled to a low speed so that the wind pressure is not generated (soft lining and soft lining). The servo motor 24a and the like are controlled so as to perform soft starting.

A-2-3. Stage Moving Means 5a, 5b Each of the stage moving means 5a, 5b as a slide mechanism is, as shown in FIG.
A linear guide member 35 having a groove formed in the center at each of both side edges, a rail member 36 slidably fitted and guided in the groove of the linear guide member 35, and a base (not shown) It has a pinion and a rack (or a ball screw mechanism) connected to the member 19a for moving the base member 19a along the rail member 36, and a driving means such as a contact / separation motor. Then, the base member 19a is guided by the linear guide member 35 and the rail member 36 together with the turning means 4a by the driving of the driving means, and is configured to be slidable so as to approach the coating device 2a or to be separated from the coating device 2a. ing.

A-2-4. Lift Pin Unit 33 In the first embodiment, as described above, the coating device 2a,
2b, between the same setting positions 10a,
10b, these setting positions 10a, 10
A common lift pin unit 33 is provided corresponding to b. The lift pin unit 33 is provided with a plurality of lift pins 34 that can be moved up and down by a driving source (not shown) with respect to the substrate holding surface of the substrate holding stage 3a at a horizontal position, so that the substrate holding stage 3a can be moved higher and lower than the substrate surface. A hole 34a for the lift pin 34 is formed in the substrate holding stage 3a and the stage mounting member 14a.
3, or the substrate holding stage 3a is configured to be smaller than the surface of the substrate, and is provided outside the substrate holding stage 3a for the lift pins capable of supporting the outer peripheral portion of the substrate 7 from below. A hole can be made only in the stage mounting member 14a. With such a configuration, when the turning means 4a is rotated to the opposite side to the coating apparatus 2a side and the substrate holding surface is placed on the lift pin unit 33 in a horizontal posture, a plurality of The substrate 7 can be placed on the substrate holding stage 3a by the vertical movement of the lift pins 34, and the substrate 7 can be placed on the substrate holding stage 3a.
Can be peeled off.

A-2-5. Substrate Transfer Means 8 Next, the substrate transfer means 8 including the pre-processing substrate transfer means 8a and the processed substrate transfer means 8b will be described. As shown in FIG. 2, the substrate transfer means 8 transfers the substrate 7 between the lift pins 34 at the setting positions 10a (10b) and the unprocessed substrate transport path 6 or the processed substrate transport path 9. To be placed. In other words, the pre-processing substrate transfer means 8a rotates the substrate holding surfaces of the substrate holding stages 3a and 3b in the horizontal state of the substrate transfer posture by the rotation of the turning means 4a and 4b, and the pre-processing substrate transfer path 6a.
The upper substrate 7 is transferred so as to be placed on lift pins 34 projecting from the substrate holding surfaces of the substrate holding stages 3a and 3b. Further, the processed substrate transfer means 8b moves the substrate holding surfaces of the substrate holding stages 3a, 3b in the horizontal state of the substrate transfer posture by the rotation of the turning means 4a, 4b. The substrate 7 on the lift pins 34 projecting from the substrate is transferred so as to be placed on the processed substrate transfer path 9. Hereinafter, the configuration of the substrate transfer means 8 will be described in more detail with reference to FIG.

FIG. 7 is a partial perspective view schematically showing a schematic configuration of a main part of the substrate transfer means. As shown in the drawing, the substrate transfer means 8 includes a substrate setting member 50 that can place one side of the substrate 7 and hold the substrate 7 by suction at a predetermined position, and a horizontal movement that can move the substrate setting member 50 in the horizontal direction. Member 5
1 and a substrate transfer member 53 having a vertical movement member 52 capable of vertically moving the substrate setting member 50 and the horizontal movement member 51. A pair of these elements are provided and face each other. It is arranged.

The substrate transfer means 8a will be described below.
The substrate 7 is taken in by the upward movement of the substrate setting member 50 by the
Is placed and sucked and held at a predetermined position, the center position P1 at the setting position 10a where the substrate holding stages 3a and 3b are located, the center position P2 at the substrate standby position 6x, and the facing direction of the coating devices 2a and 2b. Is moved by the horizontal moving member 51 between the take-in position 6a and the center position P3 of the terminal unprocessed substrate transfer path 6 extending in one direction perpendicular to the vertical moving member 5.
The substrate 7 is transferred to the lift pins 34 protruding from the substrate holding surfaces of the substrate holding stages 3a and 3b by the downward movement of the substrate setting member 50 by 2.

The substrate setting member 50 has a section L
Each of the rotary mounting members is formed in a U-shape, and is rotatable at both longitudinal end portions of the planar member 54 in a longitudinal direction along one side surface and in a direction perpendicular to the longitudinal direction. 55 are provided respectively. A plurality of vacuum pads 56 as suction members capable of vacuum suction are respectively arranged in elongated concave portions (not shown) on the upper surface portion surrounded by the respective rotating mounting members 55 and the planar members 54 in a U-shape. Has been established. Although not shown, the vacuum pad 56 has an opening at the distal end of a decompression tube capable of depressurizing the inside of the vacuum pad 56. 7 is held by suction. Each of the rotary mounting members 55 is driven to rotate by a driving means 57 such as a rotary solenoid, a rotary cylinder, and a stepping motor. At a position perpendicular to 55, slack in a direction perpendicular to the transport direction of the substrate 7 is suppressed.

The horizontal moving member 51 includes a vertically extending base plate 58 and an upper rail 5 disposed horizontally (longitudinally) along the upper end of the base plate 58.
9, a lower rail 60 disposed in the horizontal direction (longitudinal direction) along the lower end of the base plate 58, and the upper rail 5
9 is slidable along the upper rail 59 and the flat member 54 of the board setting member 50.
It has two upper guide members 61 fixed to both ends in the longitudinal direction, respectively, and two lower guide members 62 to which the lower rail 60 can be fitted and is slidable along the lower rail 60. ing. For these two lower guide members 62, the base plate 58 is connected to the upper rail 59 and the lower rail 6.
0 and is slidable along its longitudinal direction, and the upper guide member 61 is configured to be slidable along its longitudinal direction with the planar member 54 and each of the rotating mounting members 55 with respect to the upper rail 59. ing. As a result, the movement stroke of the substrate setting member 50 is reduced by the movement strokes of the two upper guide members 61 and the base plate 58 with respect to the upper rail 59 and the lower rail 60 and the base plate 58 with respect to the two lower guide members 62. The total stroke amount is equal to the moving stroke.

Further, the vertical moving member 52 includes a base plate 63 having two lower guide members 62 fixed to the upper portions at both ends in the horizontal direction and standing upright in the vertical direction, and a base plate 63 at both ends in the horizontal direction of the base plate 63. The base plate 63 is disposed along the vertical direction, and the base plate 63 is connected to the horizontal moving member 51 and the setting member 5.
0, a vertical drive mechanism 64 composed of a rack and a pinion for moving in the vertical direction, a drive means 65 such as a servo motor or a stepping motor for driving each of the vertical drive mechanisms 64, and a base plate 63
Have two rails 66 fitted on the back surface side and guided in the vertical direction, and two main pillar members 67 each of which is fixed in the longitudinal direction.

A-2-6. Substrate Rotating Means 160 In the substrate processing system 1 according to the first embodiment, the take-in position 6a of the unprocessed substrate transport path 6 and the transfer position 9a of the processed substrate transport path 9 In addition, a substrate rotating means 160 for transferring the substrate 7 to and from another substrate processing apparatus or system and adjusting the orientation of the substrate 7 by appropriately rotating the substrate 7 by 180 ° is disposed. The reason for providing the substrate rotating means 160 in this manner is that, in the first embodiment, since the coating devices 2a and 2b are arranged facing each other, the substrate 7 is simply provided.
Is transported, the direction of the substrate 7 supplied to the coating devices 2a and 2b is reversed, and there is a possibility that inconvenience may occur in multi-panning or title display. The substrate rotating means 160 has a function of not only rotating the substrate 7 but also centering the substrate 7.

FIG. 8 is a perspective view showing an example of the substrate rotating means used in the substrate processing system 1 of FIG. The substrate rotating means 160 is a substrate mounting means serving as a receiving means for receiving and holding the substrate 7 from the back side by vacuum-adsorbable Teflon suction pads 161 provided at a plurality of pin tips provided at appropriate positions. Mounting member 162 and ball screw 1
63, a motor (not shown), an elevating unit 164 for elevating and lowering the substrate mounting member 162, and a rotary drive actuator 165 for mounting and rotating the substrate mounting member 162 and the elevating unit 164; An XY table driving member 166 for horizontally moving the rotation driving actuator 165 together with the substrate mounting member 162 and the elevating unit 164, and the position of the substrate 7 on the substrate mounting member 162 are detected, and the rotation is performed based on the detection result. And a centering member (FIG. 9) for driving and controlling the dynamic drive actuator 165 and the XY table drive member 166 to center the substrate 7.

FIG. 9 is a view showing a centering member employed in the substrate rotating means 160 of FIG. As shown in the figure, each of the centering members is provided with a respective C disposed opposite to a corner portion of two substrates 7 in a diagonal direction.
Based on the image of the substrate corner portion from the CD camera 170, the image recognition means 171 for recognizing the image displacement between the position of the image of the substrate corner portion and the reference position, and the image from the image recognition means 171 A drive control means 172 for controlling the drive of the rotary drive actuator 165 and the XY table drive member 166 based on the displacement information to control the centering of the substrate 7 is provided.

A-2-7. Edge Rinse Processing Apparatus 190 As described in “A-1. Overview of this Embodiment”, in the first embodiment, the edge rinse processing apparatus 190 is
a. As shown in FIG. 2, the edge rinsing apparatus 190 is provided with an edge rinsing groove 191 capable of accommodating and passing the edge of the substrate 7, and performing edge rinsing on the edge of the substrate 7. A guide member 1 comprising a rinsing portion 192 and a rail for guiding the edge rinsing portion 192 along an edge processing side of the substrate 7
93, a moving means (not shown) such as a motor for moving the edge rinse portion 192 along the rail, and the edge rinse portion 192 together with the guide member 193 is moved toward or away from the edge portion of the substrate 7. And a contact / separation means (not shown) such as a ball screw and a motor.

Although not shown, a nozzle for ejecting a treatment liquid for dissolving a coating film or the like to the edge portion on the application surface side of the substrate 7 is provided in the edge rinse groove 191 of the edge rinse portion 192, A suction port for sucking and removing the coating film dissolved in the step 7 together with the processing liquid is provided. A predetermined processing liquid is supplied from a nozzle to an edge portion on the coating surface side of the substrate 7, and unnecessary coating is performed from the suction port. The membrane is to be removed. Further, in this case, one edge rinsing device 190 can be shared by the two coating devices 2a and 2b disposed opposite to each other, so that the system can be reduced in size and cost.

A-2. Operation of First Embodiment Next, the operation of the substrate processing system 1 configured as described above will be described with reference to FIGS. In these drawings, the reference numeral “A” is given to the substrate 7, but this is for the purpose of visually clarifying the relationship between the top, bottom, left and right of the substrate 7 and assisting the understanding of the invention. Has nothing to do with the coating process. Also, the first embodiment
(And other embodiments 2 to 4 to be described later) First, the description will be made on the assumption that the substrate 7 is not transported to any of the coating apparatuses 2a and 2b.

(1) Loading of Unprocessed Substrate 7 and Movement to Substrate Standby Position First, as shown in FIG. Previous substrate 7
Are horizontally conveyed and placed on the substrate rotating means 160 (FIG. 8). Then, after centering the substrate 7 in the state of being transferred, the substrate 7 is received by the substrate transfer means 8a and moved to the substrate standby position 6x. In particular,
The substrate transfer unit 8a moves the rotary mounting member 55 and the planar member 54 in line so that the center position thereof is the center position P3 of the take-in position 6a. At the take-in position 6a, the respective rotation mounting members 55 are rotated by the respective driving means 57 so as to be in a direction perpendicular to the plane member 54 (the state shown in FIG. 7). At this time, the substrate 7 before processing is mounted on the substrate mounting table (not shown) at the take-in position 6a such that the outer peripheral portion protrudes, and the respective rotary mounting members 55 and the planar members 54 are provided.
Are located below the mounting position of the substrate 7. In this state, the substrate setting member 50 is moved upward by the vertical moving member 52 to receive and mount the outer peripheral edge of the substrate 7 from below, and the substrate 7 is suction-held by vacuum suction by the plurality of vacuum pads 56. Takes in the substrate 7. In this manner, with the substrate 7 placed on the pair of substrate setting members 50 and sucked and held at a predetermined position, the substrate transfer means 8
The center position of the substrate setting member 50a moves to the center position P2 of the substrate standby position 6x and stands by.

The turning means 4a is stopped in a state where the substrate holding surface of the substrate holding stage 3a is in a horizontal posture at the setting position 10a. At this time, the lift pin unit 33 is positioned below the substrate holding stage 3a so as to overlap, and a plurality of lift pins 3 are placed on the substrate holding surface.
4 is in a state where it can receive the substrate 7 in a protruding state. At this time, the substrate holding stage 3b is
Standing on b side.

(2) Transfer of the substrate 7 to the lift pins 34 Next, the substrate setting member 50 of the substrate transferring means 8a is set such that the center position of the substrate setting member 50 is from the center position P2 of the substrate standby position 6x to the position of the substrate holding stage 3a. It is moved together with the substrate 7 by the horizontal moving member 51 to the center position P1 at the position 10a (FIG. 10B). At this time, the substrate setting member 50 of the substrate transfer means 8a
The open portions of the U-shaped portions of the rotating mounting members 55 and the planar members 54 are in an opposed state, and the substrate 7 is mounted on the pair of the opposed U-shaped portions. In this state, the vacuum suction by the plurality of vacuum pads 56 of each of the rotation mounting member 55 and the plane member 54 is released, and the substrate setting member 50 is moved downward by the vertical moving member 52, so that the substrate holding stage 3a The substrate 7 is placed and transferred on the lift pins 34 protruding from the substrate holding surface. In this case, an area where the lift pins 34 and the substrate holding stage 3a are disposed is present in the opening areas of the pair of U-shaped portions facing each other.

In this manner, the substrate 7 before the coating process on the take-in position 6a of the pre-process substrate transfer path 6 is placed on the substrate setting member 50 and taken in. The substrate is transferred so as to be placed on a plurality of lift pins 34 protruding above the substrate holding surface of the substrate holding stage 3a in a horizontal posture. Further, each substrate transfer member 53 rotates the rotation mounting member 55 by the driving means 57 so that the longitudinal direction of the rotation mounting member 55 is parallel to the longitudinal direction of the substrate setting member 50. This is to prevent the rotation mounting member 55 from interfering with the substrate holding stage 3a or the like when the substrate transfer member 53 moves. After such rotation, the substrate transfer member 53 returns to the center position P2.

(3) Coating Processing by Coating Apparatus 2a Subsequently, the lift pin unit 33 slowly lowers the plurality of lift pins 34 on which the substrate 7 is placed, and places the substrate 7 on the substrate holding surface of the substrate holding stage 3a. And a vacuum suction process is performed on the substrate holding surface by a plurality of vacuum pads (not shown) disposed along positions corresponding to the outer peripheral edge of the substrate according to the size of the substrate 7. Then, the substrate 7 is set at a predetermined position of the holding stage 3a while keeping the horizontal posture, and is brought into a holding state.

After that, while the substrate 7 is held on the substrate holding stage 3a, the turning means 4a moves the substrate holding stage 3a and the stage mounting member 14a together with the substrate 7 to two.
Via the arm members 15a, the driving means such as the servomotor 24a and the counter cylinder 32 is driven so as to rotate the substrate holding surface from the horizontal posture to the vertical posture about the pivot 16a as the center of rotation. In particular, by slowly rotating when getting up from the horizontal posture, the particles below it are prevented from winding up.

As described above, the substrate 7 is moved to the substrate holding stage 3.
a in a state of being held vertically on the stage moving means 5
By the driving of the driving means (not shown), the substrate 7 is guided by the linear guide member 35 and the rail member 36 together with the turning means 4a on the base member 19a to approach the opening 38 on the coating apparatus 2a side. Then, the substrate 7 and the substrate holding stage 3a are horizontally moved until they can be seen from behind the opening 38. Further, by bringing the outer peripheral edge of the front side of the stage mounting member 14a into contact with the reference surface of the peripheral edge of the opening 38, the substrate holding stage 3
The application surface of the substrate 7 on the substrate holding surface a is set as the application reference surface (FIG. 3C).

Further, by the stage fixing means 39,
The front side of the stage mounting member 14a and the opening 38 are clamped and pressed from the back side of the stage mounting member 14a.
The substrate 7 is fixed to the opening 38 of the coating device 2a together with the substrate holding stage 3a by bringing the substrate 7 into contact with the peripheral edge of the substrate 7.
Should not move at the application reference position.

Further, as described above, during a series of processes until the substrate 7 is fixed together with the substrate holding stage 3a from the back side of the opening 38, the coating apparatus 2a places the nozzle means 11 on the front side thereof. The nozzle unit 12 is moved from the standby position (lower position) to the application start position (upper position), and at the application start position, the nozzle unit 11 is moved closer to the surface to be coated of the substrate 7 so that the width direction of the substrate 7 is reduced. The nozzle opening of the nozzle means 11 which is elongated into the nozzle means 11 is brought close to the surface to be coated of the substrate 7, and the coating liquid pumped up from the coating liquid tank inside the nozzle means 11 by the capillary action in the flow path causes the nozzle opening 11 to move between the nozzle opening and the substrate 7. A puddle forms on the surface.

Thereafter, while the nozzle port of the nozzle means 11 and each substrate 7 are relatively moved along the surface to be coated, the coating liquid pumped up from the coating liquid tank (not shown) inside the nozzle means 11 by capillary action. The liquid is supplied from the nozzle port of each nozzle means 11 and applied to the application surface of each substrate 7.

At this time, the inside of the coating apparatus 2a is in a closed state, and a uniform airflow of down flow is generated by the drying promoting mechanism 47a to make the inside positive, thereby eliminating particles and leveling the coating liquid. Is dried to obtain a more uniform film thickness. After the application is completed, for example, the drying promoting mechanism 47a to the drying promoting mechanism 47b
To generate an airflow in a direction perpendicular to the application surface of the substrate 7 to make the drying uniform and promote the drying.

Note that, as described above, the substrate holding stage 3a
Is raised and the substrate holding stage 3b is in the setting position 1 while the coating process is being performed by the coating device 2a.
An operation of setting the next substrate at 0b in the coating apparatus 2b is performed. At the same time, the next unprocessed substrate 7 is horizontally transferred from the device in the previous process to the take-in position 6a of the pre-processing substrate transfer path 6, and is placed on the substrate rotating means 160 (FIG. 8).

(4) Rotation of the substrate 7 by 180 ° and movement to the substrate standby position The next substrate 7 conveyed to the take-in position 6a as described above is processed by the coating device 2b. As shown in FIG.
Is rotated 180 °. That is, the substrate placing member 162 of the substrate rotating means 160 is raised by driving the lifting / lowering unit 164 so that the substrate 7 is placed on the suction pad 161.
Is held, and the substrate 7 is vacuum-sucked by the suction pad 161. Thereafter, the position of the substrate 7 on the substrate mounting member 162 is detected, and based on the detection result, the rotation driving actuator 165 and the XY table driving member 166 are driven and controlled to center and position the substrate 7. And
The substrate 7 is rotated to change its direction by 180 degrees. Further, the substrate placing member 162 is moved to the elevating unit 164.
Is driven to lower the suction pad 161.
Is released and placed on the substrate transfer means 8a.

Subsequently, the substrate 7 is transported to the substrate standby position 6x and waits in the same manner as in the above step (1).

(5) Placement of Substrate 7 on Lift Pins 34 Next, the substrate 7 at the substrate standby position 6x is placed on the lift pins 34 in the same manner as in the above step (2) (FIG. 2B). ).

(6) Coating process in coating device 2b and unloading of processed substrate 7 Then, in the same manner as in step (3), coating process on substrate 7 by coating device 2b is started (FIG. 3 (c)). ). At this time,
In the first embodiment, with respect to the substrate 7 to be subjected to the processing by the coating device 2b in the step (4), one
The substrate 7 is rotated by 80 °, and the direction of the substrate 7 supplied and set to the coating devices 2a and 2b is always the same.

On the other hand, after the setting of the substrate 7 in the coating device 2b, when the drying process in the coating device 2a is completed, the stage fixing means 39 is reversed, contrary to the operation in the step (3).
The stage moving means 5a releases the fixing of the stage mounting member 14a and the opening 38 by the above-mentioned state, and in a vertical posture in which the substrate 7 is held on the substrate holding stage 3a, the opening of the opening The stage mounting member 14a is retreated to a predetermined position such that the outer peripheral edge on the front side of the stage mounting member 14a is separated from the reference surface of the peripheral edge of the stage 38.

After that, while the substrate 7 is held on the substrate holding stage 3a, the turning means 4a moves the substrate holding stage 3a and the stage mounting member 14a together with the substrate 7 to two.
Via the arm members 15a, the driving means such as the servomotor 24a and the counter cylinder 32 is driven to rotate around the pivot 16a so that the substrate holding surface changes from a vertical position to a horizontal position. In particular, before the horizontal posture, the brake is gradually applied and the vehicle is stopped slowly in the horizontal posture, thereby preventing the particles below it from rolling up. At this time, the substrate holding stage 3b has already finished setting the substrate and stands up, the application by the coating device 2b has been started, and there is no problem even if the substrate holding stage 3a is turned down to the setting position 10a.

Then, the substrate holding stage 3a in the horizontal posture
On the substrate holding surface, the suction by the plurality of vacuum pads is released, and the lift pin unit 33 slowly raises the plurality of lift pins 34 with respect to the substrate holding surface of the substrate holding stage 3a on which the substrate 7 is placed. From the substrate holding surface of the holding stage 3a, the substrate 7 stuck after releasing the vacuum suction is lifted while being peeled off.

Thereafter, the substrate transfer means 8b is now in a state where each of the rotary mounting members 55 and the plane members 54 are in a line, and the center position thereof is shifted to the center position P1 of the setting position 10a where the substrate holding stage 3a is located. After moving by the horizontal moving member 51, the setting position 10
5A, each of the rotation mounting members 5 is
5 is rotated so as to be perpendicular to the plane member 54. At this time, the processed substrate 7 is mounted on the plurality of lift pins 34 such that the outer peripheral portion protrudes, and each of the rotating mounting members 55 and the planar members 54
Is located below the mounting position. In this state, the substrate setting member 50 is moved upward by the vertical moving member 52 to receive and mount the outer peripheral edge of the substrate 7 from below, and the plurality of vacuum pads 56 hold the substrate 7 by vacuum suction. Then, the substrate 7 is taken in.

As described above, in a state where the substrate 7 is placed on the pair of substrate setting members 50 and is suction-held at a predetermined position, the substrate setting member 50 of the substrate transfer means 8b is set so that its center position is the substrate standby position. After moving to the center position, the center position is moved by the horizontal moving member 51 together with the substrate 7 to the center position of the transfer position 9 a of the substrate transfer path 9. At this time, the substrate setting member 50 of the substrate transfer means 8b is in a state where the open portions of the U-shaped portions of the rotary mounting members 55 and the planar members 54 face each other. The substrate 7 is mounted on the portion. In this state, the vacuum suction by the plurality of vacuum pads 56 of each of the rotation mounting member 55 and the plane member 54 is released, and the pair of substrate setting members 50 is moved downward by the vertical moving member 52, so that the substrate transport path is moved. The substrate 7 is placed and transferred on the substrate rotating means 160 at the transfer position 9a of FIG. Thereafter, the center position of the substrate setting member 50 of the substrate transfer means 8b is changed to the standby position 9
Each of the rotating mounting members 55 and the plane members 54 is moved by the horizontal moving member 51 to the center position of x in a state of being aligned.

Thus, the setting position 10a
In the above, the substrate transfer means 8b places the coated substrate 7 on the plurality of lift pins 34 projecting on the substrate holding surface of the substrate holding stage 3a in the horizontal posture in the turning means 4a on the substrate setting member 50. The substrate rotating means 160 at the delivery position 9a of the substrate transport path 9
Transfer to rest on top.

In parallel with the transfer of the processed substrate 7 to the delivery position 9a as described above, the next unprocessed substrate 7 is transported to the substrate standby position 6x and the coating device 2
Prepare for the coating process in a.

(7) Edge Rinse Processing of the Substrate 7 The substrate 7 conveyed to the delivery position 9a is moved by the contact / separation means (not shown) to the edge rinse section 192 of the edge rinse processing device 190 at the lower end of the substrate 7. The edge 7a side, that is, the side that was located at the lower side in the application position of the application device 2a, is approached, and is further approached until the lower edge 7a is accommodated in the edge rinse groove 191 of the edge rinse portion 192. . Further, the edge rinsing section 192 is moved by a moving means (not shown) along the rail, and a predetermined processing is performed from a nozzle (not shown) in the edge rinsing groove 191 to the edge portion of the substrate 7 on the application surface side. The liquid is supplied, an unnecessary coating film is removed from a suction port (not shown) in the edge rinse groove 191, and an edge rinse process is performed.

Thus, the substrate 7 which has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

(8) Processed substrate 7 from coating device 2b
Then, the substrate 7 at the substrate standby position 6x is placed on the lift pins 34 in the same manner as in the step (2).
The substrate 7 is set in the coating device 2a in the same manner as described above.

After the setting of the substrate 7 in the coating device 2a, when the drying process in the coating device 2b is completed,
In the same manner as in step (6), the processed substrate 7 is unloaded from the coating device 2b and transported so as to be placed on the substrate rotating means 160 at the delivery position 9a of the substrate transport path 9 (FIG. 12).
(a)).

In parallel with this, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a and is placed on the substrate rotating means 160 (FIG. 8).

(9) Edge Rinsing of the Substrate 7 and Movement of the Substrate 7 to the Substrate Standby Position As shown in FIG.
The processed substrate 7 (substrate on the lower side in the figure) transferred to the substrate rotating means 160 provided in
In the same manner as (4), 180
゜ It is rotated. Thereby, at this delivery position 9a,
The direction of the substrate 7 is always the same, that is, the lower edge of the substrate 7, that is, the side located at the lower side in the application position of the application device 2b faces the edge rinse portion 192 side.

Subsequently, similarly to the above step (7), a predetermined processing liquid is supplied to the edge portion of the substrate 7 on the application surface side, and a suction port (not shown) in the edge rinse groove 191 is supplied. ), Unnecessary coating films are removed and edge rinse processing is performed.

Thus, the substrate 7 which has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

In parallel with such an operation, a process
Similarly to (4), after the substrate 7 to be processed by the coating apparatus 2b is rotated by 180 ° by the substrate rotating means 160, it is transported to the substrate standby position 6x and is standby.

In the present embodiment, the above-described series of processing steps are repeated, and the substrate 7 is sequentially processed (coating processing + edge rinsing processing).

A-3. Effects of First Embodiment As described above, the coating apparatuses 2a and 2 serving as the substrate processing apparatuses are used.
b are opposed to each other, and the substrate holding stages 3a, 3 of the turning means 4a, 4b provided correspondingly to each other.
Since b is symmetrically arranged so as to share the setting positions 10a and 10b, which are substrate setting areas having a predetermined angle posture, the installation space can be shared and the space can be saved. The overall length can be shortened and the footprint deteriorates,
The layout restrictions due to the overall length of the system can be eliminated. Further, the coating apparatuses 2a, 2 which are substrate processing apparatuses.
b can reduce the number of times the substrate is changed in the substrate transfer as compared with the case where a plurality of b are arranged adjacently in series.
The transfer stability of the substrate can be improved.

Further, the substrate 7 adhered to the substrate holding stages 3a and 3b after the suction is released can be easily peeled off by the plurality of lift pins 34 of the lift pin unit 33. In particular, in the case of the coating apparatuses 2a and 2b that are disposed to face each other as in the first embodiment, only one common lift pin unit 33 is required, and the number of parts is reduced, and the probability of failure is reduced and low. Cost.

Further, the substrate holding stages 3a, 3b are respectively changed from the horizontal posture at a predetermined transfer angle posture to the vertical posture of the coating posture by the respective rotating operations of the turning means 4a, 4b. , 2b in the vertical direction. In other words, since the posture conversion between the horizontal transfer posture and the vertical application posture of the substrate 7 is performed by the stage turning operation by the turning means 4a and 4b, each setting of the substrate 7 on the substrate holding stages 3a and 3b is kept in the horizontal position. Can be done with Further, there is no danger of the substrate 7 dropping due to disturbance of the suction timing and the suction release timing such as the transfer of the substrate 7 between the conventional robot hand and the vertical stage. Therefore, the operating speed (handling speed) does not need to be slowed down, but rather becomes faster, and more stable substrate transfer can be performed.

Further, since the substrate transfer mechanism of the substrate transfer means 8a, 8b can be in only a horizontal posture, the transfer structure can be greatly simplified as compared with the configuration of the articulated robot 81, and The load on the transport unit can be significantly reduced, and the stability of transport can be improved. In addition, a conventional articulated robot 81 for transferring a substrate is used.
Is complicated in its operation and its control system.
The transfer control by a and 8b and the rotation control of the turning means 4a and 4b are simpler and have less trouble than the transfer control by the articulated robot 81.

Further, the substrate holding stages 3a, 3b are respectively changed from the horizontal position to the vertical position by the respective rotating operations of the turning means 4a, 4b, and the substrate holding stages 3a, 3b are set to the substrate processing position from the back side of the substrate processing apparatus. Since the substrate processing is performed on the front surface side, the substrate processing area and the transfer area can be efficiently separated from each other. Can be suppressed from adhering to the surface of the substrate. Further, since there is no substrate transport mechanism on the application area side which is the substrate processing area, and the application processing is performed on the opposite side of the transport area with the substrate holding stages 3a and 3b interposed therebetween, it is necessary to perform maintenance when the nozzle means 11 and the like are performed. It is not necessary to enter the application area side, and the substrate processing system can be easily obtained, the application state can be easily seen, and the maintenance property is good. As described above, since the application area and the transfer area are separated from each other, there is no mechanism related to the substrate transfer on the stage application surface side, and the substrate processing spaces on the substrate holding surfaces of the substrate holding stages 3a and 3b are respectively covered. Each outer member 46 to be hermetically sealed, the air-drying accelerating unit and its driving mechanism can be easily arranged respectively, and it is possible to prevent adverse effects from surroundings such as wind pressure and pressure change, particles, etc., and to achieve a more stable substrate. A coating treatment as a treatment can be performed.

That is, if the processing space on each substrate holding surface side of the substrate holding stages 3a and 3b is covered and sealed by each outer member 46, the articulated robot 81 in FIG.
When the substrate is transported, a wind pressure is generated and adversely affects the coating process. However, such a wind pressure prevents the coating process from being adversely affected, such as uneven coating, and a pressure fluctuation caused by, for example, opening and closing a door of an installation room (clean room). In this case, an adverse effect such as a change in the coating film thickness occurs on the coating process. Therefore, for example, even if the setting of the substrate 7 is performed by the other coating device 2b while the coating is performed by the one coating device 2a, there is no interference of the wind pressure and the coating performance is not adversely affected. In addition, for example, an adverse effect on coating performance due to opening and closing of a door of an installation room (clean room) is also eliminated, so that defective coating does not occur.

Further, by sealing the application area with the outer member 46, the exhaust efficiency (particularly from the lower part) can be improved, and the leakage of the solvent atmosphere can be prevented. In addition, the drying promotion mechanisms 47a and 47b that generate a uniform airflow in the sealed outer member 46 allow a laminar flow to flow into an application area, which is a substrate processing unit in the outer member 46, and make the inside thereof positive pressure. The generation of floating particles can be prevented, and the intrusion of particles into the substrate processing section can be prevented, so that the cleanliness in the application area can be guaranteed. Further, the substrate processing and the drying processing can be more stably performed by the drying promotion mechanisms 47a and 47b.

Further, the substrate holding stages 3a, 3b are respectively changed from a horizontal posture, which is a predetermined conveying angle posture, to a vertical posture by each rotation operation of the turning means 4a, 4b. A drive source such as a screw feed mechanism by a servo system of the stage moving means 5a, 5b horizontally controls the substrate holding stages 3a, 3b while performing particle control (soft start and soft stop), respectively, up to the coating reference plane which is the substrate processing position. Because of the movement (sliding), the substrate holding stages 3a and 3b can be more accurately moved and positioned at the respective substrate processing positions of the coating devices 2a and 2b without generating floating particles.

Further, the substrate 7 and the substrate holding stages 3a and 3b in the vertical posture are connected to a substrate processing apparatus (coating apparatuses 2a and 2b).
Opening 38 that is the substrate processing position (application reference position) in b)
In this state, the stage is fixed by the stage fixing means 39 without play, so that more stable substrate processing (coating processing) can be performed.

The setting of the substrate 7 of the present invention on the substrate holding stages 3a, 3b using the above-mentioned turning means 4a, 4b, and the sliding movement of the substrate 7 on the substrate holding stages 3a, 3b to the substrate processing position. Is a vertical coating device 2
a, 2b can be efficiently adapted. These coating apparatuses 2a and 2b have nozzle cleaning and standby positions at the lower part thereof, and perform a stage rotating operation (substrate setting operation).
And the movement timing of the nozzle means 11 to the application start position (upper position) can be overlapped, and the processing tact can be shortened. Contrary to the present embodiment, for example, when the nozzle standby position is at the upper position, the stage turning operation (substrate setting operation) and the movement timing of the nozzle means 11 to the standby position (upper position) after coating are overlapped. It is possible, and also in this case, the processing tact can be shortened.

As described above, at the take-in position 6a of the pre-processing substrate transfer path 6, only the substrate 7 supplied to one of the coating devices 2a and 2b disposed opposite to each other is rotated. Means (first substrate rotating means) 160 to 18
After the direction is changed by 0 degrees, the substrate is transferred onto the substrate holding surface of the substrate holding stage 3b by the substrate transfer means 8a. Therefore, the substrate setting directions to the coating devices 2a and 2b disposed opposite to each other are the same, and It is possible to eliminate the inconvenience that the substrate is turned upside down, which occurs in multi-paneling and title display, as compared with the case where no rotating means is provided. Further, at the transfer position 9a of the processed substrate transfer path 9, only the substrate 7 that has been turned 180 degrees and transferred to the transfer position 9a is further rotated by 180 degrees by the substrate rotating means (second substrate rotating means) 160.
In order to change the direction and return to the original state, the direction of the substrate supplied from the coating apparatus 2a, 2b to the next step via the processed substrate transport path 9 becomes the same direction, and the edge rinse processing or various Substrate processing such as exposure can be facilitated.

Further, in this case, a substrate processing step such as an edge rinsing processing in the next step can be provided at the delivery position 9a, so that the installation space can be shared and the overall length of the system can be reduced, and the foot can be reduced. Deterioration of printing and layout restrictions due to the total length of the system can be eliminated.

A-4. Modification of First Embodiment In the first embodiment, the substrate transfer posture of the pre-processed substrate transfer path 6 and the processed substrate transfer path 9 is a horizontal position, but is not limited to this. Alternatively, an inclined conveyance posture slightly inclined from this horizontal posture may be used. In this case, the substrate 7 conveyed in the inclined conveyance posture is temporarily set in the horizontal posture by the pre-processing substrate transfer means 8a or the processed substrate transfer means 8b, or immediately, in the horizontal posture. 3b. In the first embodiment,
With respect to the coating reference positions of the coating devices 2a and 2b,
Although the substrate holding stages 3a and 3b are configured to be set in the vertical posture, the substrate holding stages 3a and 3b may be configured to hold the substrate in an inclined posture slightly inclined from the vertical posture to perform the coating process. In this case, the turning means 4a, 4b
To the substrate holding stage 3a,
3b, and the coating device 2
Slide to the a and 2b sides respectively to set the application reference position.

In the first embodiment, the substrate rotating means 160 shown in FIG. 8 is arranged at the take-in position 6a on the side of the unprocessed substrate transfer path 6 and the delivery position on the processed substrate transfer path 9 side. Although the substrate rotating means 160 shown in FIG. 8 is arranged in 9a, the arrangement position and configuration of the substrate rotating means are not limited to these, and can be modified as follows. In this regard, regarding this point,
The same applies to other embodiments described later.

That is, the position of the substrate rotating means can be set at any position on each of the pre-processing substrate transfer path 6 and the processed substrate transfer path 9. Further, when the direction of the substrate 7 is already controlled corresponding to the coating apparatuses 2a and 2b when the substrate is transferred to the take-in position 6a, a substrate rotating means 160 is provided on the pre-processing substrate transfer path 6 side. No need. Further, in the case where the edge rinsing process is not required, and there is no problem even if the substrate direction is not constant in the next step in which the processed substrate 7 is transferred from the processed substrate transfer route 9, It is not necessary to provide a substrate rotating means on the substrate. Further, when it is not necessary to consider the direction of the substrate 7 at all during the coating processing, the substrate rotating means 160 may not be provided on both the pre-processing substrate transport path 6 side and the processed substrate transport path 9 side.

In the first embodiment, the one shown in FIGS. 8 and 9 is shown as an example of the substrate rotating means.
The configuration is not limited to this, and at least one of the substrate rotating means 160 on the pre-processing substrate transport path 6 side and the processed substrate transport path 9 side may be configured as follows.

In the substrate rotating means 160, the centering member having the structure shown in FIG. 9 is employed.
The centering member may be constituted by a plurality of edge detecting means for detecting the edge of the substrate 7 and its drive control means. As shown in FIG. 13A, the edge detection means includes detection portions 173a to 173f for the surface of the substrate 7. In each of these detection portions 173a to 173f, one end of the optical fiber is disposed to face an edge portion (edge portion) of the substrate 7, and a reflection type optical sensor (not shown) is disposed on the other end side. These components constitute a reflection-type light detection unit that detects the centering position of the substrate 7. Further, the drive control means (not shown), based on the edge detection information (on or off) from the detection parts 173a to 173f of these edge detection means, detects the detection parts 17 of all the edge detection means.
As 3a to 173f detect (turn on) the edge of the substrate,
The drive of the rotation drive actuator 165 and the XY table drive member 166 of FIG. 8 is controlled to center the substrate 7.

More specifically, as shown in FIG. 13 (b), the drive control means turns off the detection parts 173a, 173b of the edge detection means and turns off the detection parts 173a, 173a.
When 73b is on, the XY table driving member 166
Is driven to move the substrate 7 in the -X direction until the detection portions 173a and 173b are turned on.

When only one of them is turned off at the time of such X-direction alignment, for example, as shown in FIG. 13 (c), the detection is performed among the detection portions 173a and 173b and the detection portions 173c and 173d of the edge detection means. Part 173
When only a is off and the detection portions 173b to 173d are on, the drive control means
65 is driven and the substrate 7 is detected by detecting portions 173a and 173.
The substrate 7 is rotated counterclockwise in the direction of the arrow until b and the detection portions 173c and 173d are turned on. Similarly, when, for example, only the detection portion 173b is off and the detection portions 173a, 173c, 173d are on, the drive control means drives and controls the rotary drive actuator 165 to move the substrate 7 to the detection portions 173a, 173.
The substrate 7 is rotated clockwise in the direction opposite to the arrow direction until all of the detection portions 3b and the detection portions 173c and 173d are turned on. These detection parts 173
If all of the detection portions 173a and 173b and the detection portions 173c and 173d are not turned on, the detection portions 173a and 173b and the detection portions 173c and 173d continue.
The drive control unit controls the XY control so that the alignment operation in the X direction and the rotation direction is performed until all the 3d are turned on.
Table driving member 166 and rotation driving actuator 16
5 is driven.

Further, after the detection portions 173a and 173b and the detection portions 173c and 173d are all turned on, the drive control means operates the XY table driving member 166 until both the detection portions 173e and 173f are turned on.
Is driven to move the substrate 7 in the Y direction (the detection portion 173e or the detection portion 173f that is off) to perform an alignment operation. As described above, the centering means detects the detection portions 173a to 173f.
The centering is performed by moving the substrate 7 so that all are turned on.

As described above, the centering member (not shown) is constituted by the six edge detecting means (not shown) for detecting the edge of the substrate 7 and its drive control means, but is not limited to this. Alternatively, the edge detection means may be three points of the detection portions 173e, 173c, 173d. In this case, as shown by a solid line in FIG. 13 (d), the substrate 7 is placed on a position deviated from the normal position to the lower left side in advance, and the detection portions 173c and 173d are both turned on. The drive control means drives and controls the XY table drive member 166 to move the substrate 7 in the X direction to perform an X-direction alignment operation. At this time, if a deceleration point is provided immediately before the detection portions 173c and 173d, the substrate 7 is moved by a slight movement from the deceleration point, and the detection portions 173c and 173d are more accurately set to the ON position of the ON state. And the substrate 7 can be quickly positioned at the correct position. When one of these detection parts 173c and 173d is in the ON state and the other is in the OFF state, the rotation correction is performed in the same manner as described above. That is, the detection part 17
Until both 3c and 173d are turned on, the drive control means drives and controls the rotation drive actuator 165 to move the substrate 7 in the predetermined rotation direction (the rotation direction on the side of the detection part 173c or the detection part 173d which is off). ) To perform an alignment operation in the θ direction. Further, after this rotation correction, the drive control means continues to control the XY table drive member 1 until the detection portion 173e is turned on.
66 is driven to move the substrate 7 in the Y direction to perform an alignment operation in the Y direction.

Furthermore, the present invention is not limited to the above, and a mechanical centering mechanism 174 may be provided on the substrate mounting member 162a as a centering member (not shown) as shown in FIG. This substrate mounting member 162a
Is configured to receive and support the substrate 7 from the back side on the tip of each of the plurality of temporary placement pins 176 erected at appropriate places on the base plate 175. The mechanical centering mechanism 174 is composed of two sets of racks and pinions 177. The two sets of racks and pinions 177 are opposed to each other so that the long sides and the short sides of the substrate 7 are held in contact with each other so as to be held therebetween. Two sets of centering rollers 178a,
178b are configured so as to be able to approach or separate at the same time.
The approach or separation of the centering rollers 178a is performed by a centering cylinder 179. When the rod of the centering cylinder 179 extends, the rack and the pinion 177 work together to move the centering roller 178a to the short side of the substrate 7. A pair of centering rollers 178a located along the center move simultaneously in a direction away from each other. Also, a pair of centering rollers 178b located along the long side of the substrate 7 are simultaneously separated and approached by another rack (not shown), a pinion, and a centering cylinder. And each temporary placement pin 1
If the rods of the above-mentioned two centering cylinders are contracted after the substrate 7 has been placed on the tip of 76, the pair of centering rollers 178a and the pair of centering rollers 178b move in the direction of approaching simultaneously. The substrate 7 is centered and positioned by sandwiching the opposing substrate sides.

In the first embodiment, the substrate rotating means 160 on the side of the pre-processing substrate transfer path 6 is provided with the coating devices 2a and 2b.
Although the substrate rotation adjustment for aligning the direction of the substrate 7 in b is combined with the centering function, a substrate cooling function may be added to the substrate rotation adjustment as shown in FIG. That is, the substrate rotating means may be provided with a cooling plate 180 as shown in FIG. 15 to cool the substrate 7. The cooling plate 180 may be configured so that constant-temperature water flows therein, or the cooling plate 180 may be configured to be able to move up and down and rotate. In other words, the substrate conveyed to the substrate processing system may be subjected to a process of applying or cleaning an adhesion enhancer in a previous process, and may be heated to a relatively high temperature at that time. In such a case, the cooling plate 180 is arranged at, for example, the substrate standby position 6x in the middle of the pre-processing substrate transport path 6, and the cooling process is performed at the substrate standby position 6x until the cooling plate 180 is transported to the setting positions 10a and 10b. Can be applied. With this configuration, the size of the apparatus can be reduced as compared with the case where the cooling plate is separately arranged, and the substrate can be sufficiently cooled and then loaded into the coating apparatuses 2a and 2b to perform the coating processing.

B. Embodiment 2 FIG. 16 is a plan view schematically showing a schematic main configuration of a substrate processing system according to Embodiment 2 of the present invention. FIG.
6 is a perspective view schematically illustrating a schematic configuration of a main part of the substrate processing system of FIG.

B-1. Configuration The second embodiment is largely different from the first embodiment described above in that the first embodiment has a configuration between the take-in position 6a and the delivery position 9a and the setting positions 10a and 10b. While the substrate 7 is transferred linearly without changing the transfer posture, in the second embodiment, the direction of the transfer posture of the substrate 7 and the setting direction of the substrate 7 on the substrate holding stages 3a, 3b are different. That they differ by 90 degrees.
Other basic configurations are the same.

That is, in the substrate processing system 109 according to the second embodiment, the transfer swivel arm 110a is provided on the pre-processing substrate transfer path 6 side, and
While the substrate 7 before processing on the take-in position 6a is transferred onto each substrate holding surface of the substrate holding stages 3a and 3b, a transfer swivel arm 110b is provided on the processed substrate transfer path 9 side, and the substrate holding stage The processed substrate 7 on each of the substrate holding surfaces 3a and 3b is transferred to the transfer position 9 of the processed substrate transport path 9.
a.

The transport turning arms 110a and 110b as receiving means are provided with arm members 111a and 111b.
Each of the root portions of the shaft support portions 112a, 112
b, and each tip is formed in U-shaped portions 113a and 113b for holding the substrate, and the upper surface portion surrounded by the U-shape has a substrate corresponding to the U-shape. A plurality of vacuum pads (not shown) as suction members capable of vacuum-sucking the outer peripheral portion of the back surface of 7 are disposed in an elongated concave portion (not shown). Also, the transfer swing arm 1
The shaft support portions 112a and 112b of 10a and 110b are supported by main column members 114a and 114b, and the arm members 111a and 111b are main column members 114a and 114b.
By means of b, it is configured to be able to move up and down vertically for taking in or transferring a substrate.

The U-shaped portions 113a and 113b are pivotally protruding members 115a when pivoting toward the substrate holding stages 3a and 3b in a horizontal posture with the respective pivot portions 112a and 112b as pivot centers. , 115b are rotatable between a position forming a U-shape indicated by a solid line in the drawing and a position forming an L-shape opening the U-shape indicated by an imaginary line in the drawing (the rotation in the second embodiment). (Moving angle 90 degrees). The rotation of these projecting members 115a, 115 is performed by driving means 116a, 1 such as a rotary solenoid, a rotary cylinder, and a stepping motor.
16b, the rotation is performed in conjunction with a predetermined timing of the rotation operation of the transfer swing arms 110a and 110b.

B-2. Operation of the Second Embodiment Next, the operation of the substrate processing system configured as described above will be described. The basic operation of the second embodiment is the same as that of the first embodiment. Are different from the take-in position 6a and the delivery position 9a and the setting positions 10a and 1a.
0b. Therefore, the operation will be described focusing on this difference.

(1) Loading of Unprocessed Substrate 7 First, the substrate 7 before the coating process is horizontally transported from the device in the previous process to the take-in position 6a of the pre-processed substrate transport path 6, and the substrate rotating means 160 (FIG. 8). ). Then, after centering the substrate 7 that has been transferred, the transfer turning arm 110a receives the substrate 7. That is, the U-shaped portion 113a is lowered by the main column member 114a from above the take-up position 6a of the pre-processing substrate transfer path 6 and the side surface of the mounting portion at the take-up position 6a is surrounded by the U-shaped portion 113a. The substrate 7 is transported to the take-in position 6a (substrate rotating means 160) and is centered.
Subsequently, the U-shaped portion 113a is
a, the outer peripheral edge of the rear surface of the substrate 7 is received and placed on the inner flat surface of the U-shaped portion 113a from below, and the outer peripheral edge of the rear surface of the substrate 7 is placed on a plurality of vacuum pads (not shown). )) And hold by vacuum suction.

Further, the turning means 4a is stopped with the substrate holding surface of the substrate holding stage 3a in a horizontal position at the setting position 10a. At this time, the lift pin unit 33 is positioned below the substrate holding stage 3a so as to overlap, and a plurality of lift pins 3 are placed on the substrate holding surface.
4 is in a state where it can receive the substrate 7 in a protruding state. At this time, the substrate holding stage 3b is
Standing on b side.

(2) Transfer of Substrate 7 to Lift Pins 34 Next, with the substrate 7 mounted on the surface of the U-shaped portion 113a, the transfer turning arm 110a rotates about the pivot 112a. Arm member 111a and its U-shaped portion 1
13a is a predetermined angle (rotation angle 90 degrees in the second embodiment)
By rotating, at the setting position 10a, it rotates to a position above the substrate holding stage 3a in a horizontal posture. At this time, the substrate 7 placed on the surface of the U-shaped portion 113a faces in a direction rotated by a predetermined angle (a rotation angle of 90 degrees in the second embodiment) from the transport direction. The transfer revolving arm 110a having the substrate 7 placed on the surface of the U-shaped portion 113a lowers the U-shaped portion 113a together with the substrate 7 from the position above the substrate holding stage 3a by the main column member 114a. 7, the vacuum suction by the plurality of vacuum pads on the outer peripheral edge of the back surface is released,
It is placed on the lift pins 34.

When the transfer of the substrate 7 to the lift pins 34 is completed, the projecting members 115a of the U-shaped portion 113a are formed.
Is rotated by the driving means 116a to open one of the U-shape. Then, in this state, the transfer swing arm 1
Reference numeral 10a denotes an arm member 111a and its U-shaped portion 11 around the pivot 112a to a position above the take-up position 6a of the unprocessed substrate transfer path 6 in a direction opposite to the above.
3a is rotated by a predetermined angle (a rotation angle of 90 degrees in the second embodiment). Further, the U-shaped portion 113a is lowered by the main column member 114a from a position above the capturing position 6a, and the side surface portion of the capturing position 6a is surrounded by the U-shaped portion 113a.
It waits for the next unprocessed substrate 7 to be transported and placed on the take-in position 6a.

(3) Coating Processing by Coating Apparatus 2a Subsequently, the lift pin unit 33 slowly lowers the plurality of lift pins 34 on which the substrate 7 is placed, and places the substrate 7 on the substrate holding surface of the substrate holding stage 3a. And a vacuum suction process is performed on the substrate holding surface by a plurality of vacuum pads (not shown) arranged along positions corresponding to the outer peripheral edge of the substrate according to the size of the substrate 7. Then, the substrate 7 is set at a predetermined position of the holding stage 3a while keeping the horizontal posture, and is brought into a holding state. And
The substrate holding stage 3a rises and the coating process by the coating device 2a is started.

While the coating process is being performed by the coating device 2a, the substrate holding stage 3b is located at the setting position 10b, and an operation of setting the next substrate to the coating device 2b is performed. At the same time, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a and is placed on the substrate rotating means 160 (FIG. 8).

(4) 180 ° Rotation of Substrate 7 The substrate 7 conveyed to the take-in position 6a as described above is processed by the coating device 2b. Is done.

(5) Placement of Substrate 7 on Lift Pins 34 Next, the substrate 7 at the loading position 6a is placed on the lift pins 34 in the same manner as in the above step (2).

(6) Coating process in coating device 2b and unloading of processed substrate 7 Then, in the same manner as in step (3), coating process on substrate 7 by coating device 2b is started. At this time, in the second embodiment, the substrate 7 to be subjected to the processing by the coating device 2b in the step (4) is previously rotated by 180 ° at the take-in position 6a, and is supplied to the coating devices 2a and 2b to be set. The direction of the substrate 7 is always the same.

On the other hand, when the drying process in the coating device 2a is completed after the setting of the substrate 7 in the coating device 2b, the substrate holding stage 3a is moved to a horizontal posture.
While releasing suction by multiple vacuum pads,
The lift pin unit 33 is provided with a plurality of lift pins 3 on a substrate holding surface of the substrate holding stage 3a on which the substrate 7 is mounted.
4 is slowly lifted, and the substrate 7 stuck after releasing the vacuum suction is lifted from the substrate holding surface of the substrate holding stage 3a while being peeled off.

In this state, the transport turning arm 110b is
In the same operation as the transfer swing arm 110a in the step (2),
The processed substrate 7 on the lift pins 34 is transferred to the substrate rotating means 16 disposed at the delivery position 9 a of the processed substrate transport path 9.
Transfer to 0.

That is, the projecting member 11 of the U-shaped portion 113b
5b is rotated by the driving means 116b to open one of the U-shaped portions 113b and the U-shaped portion 113b
Is lowered by the main pillar member 114b, and the lift pins 34
Lower than the tip of In this state, the transport revolving arm 110b rotates the arm member 111b and the U-shaped portion 113b thereof about a pivotal support portion 112b as a center of rotation by a predetermined angle (a rotation angle of 90 degrees in the second embodiment), and sets the horizontal posture. Is rotated to a position below the substrate 7 on the lift pins 34 which are described above. Here, the protruding member 1 of the U-shaped portion 113b
15b is turned by the driving means 116b to have a U-shape.

Further, the transport turning arm 110b raises the U-shaped portion 113b by the main column member 114b,
The outer peripheral edge of the rear surface of the substrate 7 is received and placed on the flat surface of the U-shaped portion 113b from below, and the outer peripheral edge of the rear surface of the substrate 7 is held by vacuum suction with a plurality of vacuum pads.

As described above, with the substrate 7 placed on the surface of the U-shaped portion 113b, the transport turning arm 110b
The arm member 111b and its U-shaped portion 113b are rotated by a predetermined angle (a rotation angle of 90 degrees in the second embodiment) around the pivotal support portion 112b as a rotation center, and the delivery position of the processed substrate transfer path 9 in a horizontal posture is transferred. It rotates to the position above 9a.
At this time, the substrate 7 placed on the surface of the U-shaped portion 113b rotates by a predetermined angle (in the second embodiment, a rotation angle of 90 degrees) and faces in a predetermined conveyance direction.

As described above, at the position above the delivery position 9a,
The transfer revolving arm 110b, on which the substrate 7 is placed on the surface of the U-shaped portion 113b, lowers the U-shaped portion 113b together with the substrate 7 by the main column member 114b, and also moves the plurality of Then, the vacuum suction by the vacuum pad is released, and the substrate 7 is placed on the substrate rotating means 160 disposed at the delivery position 9a.

In parallel with the transfer of the processed substrate 7 to the delivery position 9a as described above, the next unprocessed substrate 7 is carried in in the same manner as in the step (1) to prepare for the coating process in the coating device 2a. .

(7) Edge Rinse Processing of the Substrate 7 For the substrate 7 transported to the delivery position 9a, the edge rinsing device 19 disposed near the delivery position 9a
By 0, the unnecessary coating film is removed and the edge rinsing process is performed. Thus, the substrate 7 that has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

(8) Treated substrate 7 from coating device 2b
Then, the substrate 7 at the loading position 6a is placed on the lift pins 34 in the same manner as in the step (2), and then the substrate 7 is set in the coating apparatus 2a in the same manner as in the step (3).

After the setting of the substrate 7 in the coating device 2a, the drying process in the coating device 2b is completed.
In the same manner as in (6), the processed substrate 7 is carried out from the coating apparatus 2b and transferred so as to be placed on the substrate rotating means 160 at the delivery position 9a of the substrate transfer path 9.

In parallel with this, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a and is placed on the substrate rotating means 160 (FIG. 8).

(9) Edge Rinse Processing of the Substrate 7 The processed substrate 7 transported to the substrate rotating means 160 provided at the transfer position 9a of the substrate transport path 9 is:
In the same manner as in step (4), 1
Rotated by 80 °. Thus, at the delivery position 9a, the direction of the substrate 7 is always the same, that is, the lower edge 7 of the substrate 7
a faces the edge rinse portion 192 side. Subsequently, similarly to the above step (7), a predetermined processing liquid is supplied to the edge portion on the coating surface side of the substrate 7 to remove an unnecessary coating film and perform an edge rinsing process.

The substrate 7 that has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

In the present embodiment, the above series of processing steps are repeated, and the substrate 7 is sequentially subjected to processing (coating processing + edge rinsing processing).

B-3. Effects of Second Embodiment As described above, in the second embodiment, the direction of the transfer posture of the substrate 7 and the setting direction of the substrate 7 on the substrate holding stages 3a and 3b are at an angle of 90 degrees. Except for this point, the basic configuration and operation are the same as those of the first embodiment, so that the same effects as those of the first embodiment can be obtained.

Note that the transfer swivel arm 110a provides
The transport posture of the substrate 7 before processing is set by rotating the substrate 7 by a predetermined angle (rotation angle 90 degrees in the second embodiment) in the substrate setting direction of the coating apparatuses 2a and 2b.
The transport turning arm 110b rotates the processed substrate 7 by a predetermined angle (a rotation angle of 90 degrees in the second embodiment) in the transport direction from the substrate setting direction of the coating apparatuses 2a and 2b to transport the substrate. I have. Therefore, the entire substrate processing system can be made compact.

B-4. Modification Example of Second Embodiment The substrate transfer paths 6 and 9 may be configured as follows. That is, in FIGS. 18 and 19, the transport turning arm 110a
Shuttle arm 117a for transporting substrate 7 before processing
And a shuttle arm 117b that transports the processed substrate 7 from above the transport turning arm 110b is provided in the processed substrate transport path 9.

As shown in FIGS. 18 and 19, the shuttle arms 117a and 117b respectively receive and hold the rear edge of the central portion of the substrate 7 from below, and release the holding. It has substrate holding claws 118a and 118b which can approach or separate in the width direction (the direction orthogonal to the substrate transport direction). The shuttle arms 117a and 117b are configured to be capable of tact feeding by a predetermined transfer distance along rails 119a and 119b extending in the transfer direction, respectively. Further, the shuttle arms 117a and 117b are configured to vertically move the substrate holding claws 118a and 118b capable of holding the substrate 7 so as to be able to take in or transfer the substrate 7. In this case, the transfer swing arms 110a,
110b are shuttle arms 117a and 117, respectively.
Although not shown, a notch or a stepped portion is provided so that the substrate holding claws 118a and 118b at the front end portion of the b may escape from the shuttle arm 117a and the U-shaped portion 113a of the transport turning arm 110a. The substrate 7 can be directly transferred from the U-shaped portion 113b of the transfer swivel arm 110b to the shuttle arm 117b.

C. Third Embodiment FIG. 20 is a plan view schematically showing a schematic configuration of a main part of a substrate processing system according to a third embodiment of the present invention.
FIG. 2 is a perspective view schematically showing a configuration of a main part of the substrate processing system of No. 0, and members having the same functions and effects as those of the first embodiment are denoted by the same reference numerals.

C-1. Configuration A major difference of the third embodiment from the first embodiment described above is that the coating devices 2a and 2b are opposed to each other in the first embodiment. 3 is that the coating apparatuses 2a and 2b are arranged adjacent to each other at an angle where the substrate surface during processing is a right angle or an obtuse angle. In the third embodiment, a substrate rotation function is added to the pre-processing substrate transfer means without providing the substrate rotation means at the take-in position 6a on the pre-processing substrate transfer path 6 side. On the path 9 side as well, a substrate rotation function is added to the processed substrate transfer means without providing the substrate rotation means at the delivery position 9a, and this is different from the first embodiment. The other basic configurations are the same.

That is, as shown in these figures, in the substrate processing system 120 according to the present embodiment, the coating apparatuses 2a and 2b as the substrate processing apparatuses include the pre-processing substrate transport path 6, the processed substrate transport path 9, One side of the straight line formed is disposed adjacently (in the third embodiment, adjacently disposed at a right angle) in a bent state when viewed from above. Further, swirling means 4a, 4b are provided for the coating devices 2a, 2b provided next to each other.
Each of the substrate holding surfaces of the substrate holding stages 3a and 3b for holding the substrate 7 has a predetermined angle posture (horizontal posture in the third embodiment) and a vertical or inclined posture (this In the third embodiment, the substrate holding stages 3a and 3b are rotatable so as to be in one of the vertical postures. In addition, similarly to the first and second embodiments, the turning means 4a and 4b are provided adjacently so that the setting positions 10a and 10b where the substrate holding stages 3a and 3b are in a horizontal posture are shared as a substrate setting area.

Further, the substrate holding stages 3a, 3b in a horizontal posture are used as a substrate transfer mechanism to the substrate holding stages 3a, 3b.
b, a pre-processing substrate transfer means 121a for alternately transferring the substrate on each of the substrate holding surfaces is provided, and the coating apparatus 2 serves as a substrate transfer mechanism from the substrate holding stages 3a and 3b.
A processed substrate transfer means 121b for transferring the processed substrates 7 applied in a and 2b from the substrate holding stages 3a and 3b in a horizontal position onto a substrate mounting portion 121bb as a receiving means, respectively, is provided. . Since the pre-processing substrate transfer means 121a and the processed substrate transfer means 121b have the same configuration, only the configuration of the pre-processing substrate transfer means 121a will be described in detail here. The components of the completed substrate transfer means 121b are denoted by the same or corresponding reference numerals, and description thereof is omitted.

This pre-processing substrate transfer means 121a is provided by
As shown in FIG. 1, the substrate 7 is received and supported by the substrate mounting portion 121aa from below, and the substrate 7 is rotated clockwise by 45 °.
And a substrate 7 on the substrate mounting portion 121aa serving as a receiving device of the substrate rotating device. There is provided a substrate transport means 123a for holding and transporting the substrate so as to alternately transfer it from the substrate mounting portion 122a to each of the substrate holding surfaces of the substrate holding stages 3a and 3b. In such a configuration, when carrying in / out the substrate 7 to / from the substrate holding stage 3b of the coating apparatus 2b, the pre-processing substrate transfer means 121a rotates the substrate 7 supported by the substrate mounting portion 121aa counterclockwise by 45 degrees. The substrate is transferred to the substrate holding stage 3b by rotating,
b turns the substrate 7 supported by the substrate mounting portion 122bb clockwise 45 degrees and delivers it to the processed substrate transport path 9 (see FIG. 20). When loading and unloading the substrate 7 to and from the substrate holding stage 3a of the coating device 2a, the respective rotating directions are reversed. This is because the directions of the long side and the short side of the substrate 7 in the coating apparatuses 2a and 2b are aligned.

The substrate transporting means 12 for transporting the substrate before processing
Reference numeral 3a denotes a substrate mounting portion 122a for holding the substrate 7 by vacuum suction by a plurality of vacuum pads 124 with respect to the outer peripheral edge portion of the rear surface of the substrate 7, and a driving means by a rack and a pinion and a driving motor 125a. The horizontal feeding means 127a which can be horizontally extended and contracted via an arm 126a between a position corresponding to each substrate holding surface of the substrate holding stages 3a and 3b and a take-in position, and the substrate mounting portion 122a is moved together with the arm 126a. And a vertical moving means (not shown) for moving vertically.

The corner member 1 is mounted on the substrate mounting portion 122a.
28 are arranged in parallel with each other. This corner member 128
The substrate 7 can be placed on the stepped central plane portion, while on both sides other than the central plane portion, corresponding to the long side pitch position of the substrate 7, along the substrate long side. Each rotation mounting member 1 is rotatable in a direction and a substrate short side direction perpendicular to the direction, and the upper surface thereof is flush with the central plane portion.
29 are provided. Also, inside each of the rotation mounting members 129, the position of the short side pitch of the substrate 7 is freely rotatable in the direction along the short side of the substrate and in the direction of the long side of the substrate perpendicular to the direction. However, each of the rotary mounting members 130 is flush with the central plane portion and each of the rotary mounting members 129. A plurality of vacuum pads 124 as suction members capable of vacuum suction are provided in an elongated concave portion (not shown) on the center plane portion of each of the rotating mounting members 129 and 130 and the corner member 128. . Although not shown, the vacuum pad 124 has an opening at the tip end of a decompression tube capable of depressurizing the inside thereof, and a plurality of vacuum pads 124 adsorb the vacuum on the outer peripheral edge of the back surface of the substrate 7. Holds the substrate 7. The rotation of each of the rotation mounting members 129 and 130 is performed by driving means (not shown) such as a rotary solenoid, a rotary cylinder, and a stepping motor.

The corner members 12 arranged in parallel with each other
Numeral 8 is configured so that it can be freely approached or separated by a drive motor 131 via a drive mechanism. When the distance between the corner members 128 is the short side dimension of the substrate 7, each rotation is performed in the substrate short side direction. Each upper surface portion surrounded by a U-shape by the moving mounting member 129 and the central plane portion of each of the rotating mounting member 130 and the corner member 128 rotated in the direction along the long side of the substrate is disposed to face each other. Each of these top surfaces corresponds to each long side on the back side of the substrate 7. When the distance between the corner members 128 is the length of the long side of the substrate 7, each of the rotating mounting members 1 rotated in the direction of the long side of the substrate 7.
The upper surface portions surrounded by the U-shaped portion 30 and the central plane portion of the corner member 128 are disposed so as to face each other, and these upper surface portions correspond to the respective short sides on the back side of the substrate 7. It has become. Such a coating device 2a,
2b, the distance adjustment of the corner member 128 and the rotation timing of each of the rotation mounting members 129 and 130 are performed alternately, and the U-shaped portions opposed to each other are moved to the rotated substrate 7. Corresponds to the outer peripheral edge on the back side.

Further, the vertical transfer operation of the substrate 7, the horizontal feeding operation, the distance adjustment of the corner member 128, the rotation operation of each of the rotation mounting members 129 and 130, and the vacuum suction or vacuum suction by the plurality of vacuum pads 124. The drive timing in the release operation is such that each drive means sequentially executes each operation in accordance with an instruction from a sequencer or a microcomputer.

C-2. Operation of Embodiment 3 Next, the operation of the substrate processing system configured as described above will be described. (1) Loading of Unprocessed Substrate 7 and Movement to Substrate Standby Position First, when the substrate 7 before the coating process is horizontally transferred from the device in the previous process to the take-in position 6a of the pre-processed substrate transfer path 6, the substrate is 7 is the substrate rotation unit 121aaa.
At 21aa, it is rotated counterclockwise with the substrate 7 counterclockwise by an angle of 45 degrees. At this time, the long side of the substrate 7 is parallel to the corner member 128 of the substrate mounting portion 122a. Further, the distance between the corner members 128 is adjusted by driving by the drive motor 131 so that the distance between the respective corner members 128 becomes the short side dimension of the substrate 7, and each rotation mounting member 129 is rotated in the direction of the substrate short side. By rotating each rotation mounting member 130 in a direction along the long side of the substrate, the substrate mounting portion 12
2a is the rotary mounting members 129 and 130 and the square member 1
The upper surface portions surrounded in a U-shape by the central plane portion of 28 oppose each other, and these upper surface portions are located at positions corresponding to the outer peripheral edges of the long sides on the back side of the substrate 7, respectively. In this state, the substrate mounting part 122a is moved upward, and the vacuum suction by the plurality of vacuum pads 124 is driven to capture and hold the substrate 7 from the substrate mounting part 121aa to the substrate mounting part 122a. . Thereafter, the substrate 7 is transported to the substrate standby position 6x.

As shown in FIGS. 20 and 21,
The turning means 4b is stopped with the substrate holding surface of the substrate holding stage 3b in a horizontal position at the setting position 10b. At this time, the lift pin unit 33 is positioned below the substrate holding stage 3b so as to overlap with the substrate holding stage 3b, so that the substrate 7 can be received with the plurality of lift pins 34 protruding above the substrate holding surface. Also, at this time, the substrate holding stage 3a has risen to the coating device 2a side.

(2) Transferring the substrate 7 to the lift pins 34 Next, the substrate mounting portion 122a is moved together with the substrate 7 to a horizontal feeding means 127 to a position above the substrate holding surface of the substrate holding stage 3b.
a to move horizontally via the arm 126a. Further, the substrate mounting portion 12 is moved by a vertical moving means (not shown).
2a is lowered together with the arm 126a, the vacuum suction of the substrate 7 by the plurality of vacuum pads 124 is released, and the substrate 7 is transferred onto the lift pins 34. At this time, the substrate holding stage 3b is in a state where the substrate holding stage 3b is present inside the opening area of the pair of U-shaped portions facing each other.

Further, each corner member 128 of the substrate mounting portion 122a forming a pair of U-shaped portions is provided with a drive motor 131.
The arm 126a is horizontally shortened by the horizontal feed means 127a after being separated by the
The pair of U-shaped portions of the substrate mounting portion 122a is returned to the original position where the substrate mounting portion 121aa is sandwiched below. When the substrate mounting portion 121aa is at the lower position, the substrate transport means 123a is driven so that the distance between the corner members 128 becomes the long side dimension of the substrate 7 so as to transfer the substrate 7 to the coating device 2a. Square member 128 driven by motor 131
Is adjusted, the respective rotating mounting members 130 are rotated in the direction of the longer side of the substrate, and the respective rotating mounting members 129 are rotated in the direction along the shorter side of the substrate. The upper surface portions surrounded in a U-shape by the central plane portions of the rotary mounting members 130 and the corner members 128 face each other, and these upper surface portions respectively correspond to the short-side outer peripheral edges on the back side of the substrate 7. Position.

(3) Coating Process in Coating Apparatus 2b Subsequently, the lift pin unit 33 slowly lowers the plurality of lift pins 34 on which the substrate 7 is mounted, and places the substrate 7 on the substrate holding surface of the substrate holding stage 3b. And a vacuum suction process is performed on the substrate holding surface by a plurality of vacuum pads (not shown) arranged along positions corresponding to the outer peripheral edge of the substrate according to the size of the substrate 7. , The substrate holding stage 3b while keeping the substrate 7 in a horizontal posture.
Is set to a predetermined position to be in a holding state. Then, the substrate holding stage 3b rises and the coating device 2b
Is started.

While the coating process is being performed by the coating device 2b, the substrate holding stage 3a is positioned at the setting position 10a, and an operation of setting the next substrate to the coating device 2a is performed. At the same time, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a, and is placed on the substrate placing portion 121aa.

(4) Movement to Substrate Standby Position and Substrate 7
The rotation of the substrate 7 placed on the substrate mounting portion 121aa as described above moves to the substrate standby position 6x together with the substrate mounting portion 121aa. Then, at the substrate standby position 6x of the pre-processing substrate transfer path 6, the substrate rotating means 121a
The substrate 7 is rotated counterclockwise by an angle of 135 degrees on the substrate mounting portion 121aa of aa. In this manner, by rotating the coating apparatus in advance at the substrate standby position 6x, the coating apparatus 2
The directions of the substrates 7 supplied and set to the terminals a and 2b become the same.

(5) Placement of Substrate 7 on Lift Pins 34 Next, the substrate 7 at the substrate standby position 6x is placed on the lift pins 34 in the same manner as in the above step (2).

(6) Coating Process in Coating Apparatus 2a and Unloading of Treated Substrate 7 In the same manner as in step (3), the coating process on the substrate 7 by the coating apparatus 2a is started. At this time, in the third embodiment, the rotation of the substrate 7 to be subjected to the processing by the coating device 2a in the step (4) is adjusted in advance at the substrate standby position 6x, and is supplied to the coating devices 2a and 2b and set. The direction of the substrate 7 is always the same.

On the other hand, when the drying process in the coating device 2b is completed after the setting of the substrate 7 in the coating device 2a, the operation of the substrate holding stage 3b is reversed, contrary to the operation in the step (3).
To the horizontal position. At this time, the substrate holding stage 3a has already finished setting the substrate and stands up, the coating by the coating device 2a has been started, and there is no problem even if the substrate holding stage 3b is rotated down to the setting position 10b.

Then, the substrate holding stage 3b in the horizontal posture
On the substrate holding surface, the suction by the plurality of vacuum pads is released, and the lift pin unit 33 slowly raises the plurality of lift pins 34 with respect to the substrate holding surface of the substrate holding stage 3b on which the substrate 7 is placed. From the substrate holding surface of the holding stage 3b, the substrate 7 stuck after releasing the vacuum suction is lifted while being peeled off.

Thereafter, the processed substrate 7 placed on the lift pins 34 is received by the substrate placing portion 121bb, and moves to the substrate standby position 9x.

(7) Edge Rinsing of the Substrate 7 For the substrate 7 transported to the substrate standby position 9x,
An edge rinsing device 190 is provided by a contact / separation means (not shown).
Of the edge rinse portion 192 of the substrate 7 and the edge rinse groove 191 of the edge rinse portion 192 until the lower edge 7a is accommodated in the edge rinse groove 191. Further, the edge rinsing section 192 is moved by a moving means (not shown) along the rail, and a predetermined processing is performed from a nozzle (not shown) in the edge rinsing groove 191 to the edge portion of the substrate 7 on the application surface side. The liquid is supplied, an unnecessary coating film is removed from a suction port (not shown) in the edge rinse groove 191, and an edge rinse process is performed.

Thus, the substrate 7 which has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

(8) Treated substrate 7 from coating device 2a
Then, the substrate 7 at the substrate standby position 6x is placed on the lift pins 34 in the same manner as in the step (2).
The substrate 7 is set in the coating device 2b in the same manner as described above.

After the setting of the substrate 7 in the coating device 2b, when the drying process in the coating device 2a is completed,
In the same manner as in the step (6), the processed substrate 7 is unloaded from the coating device 2a and transferred to the substrate standby position 9x on the substrate transfer path 9.

At the same time, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a, and is placed on the substrate placing portion 121aa.

(9) Edge Rinsing of the Substrate 7 The processed substrate 7 transported to the substrate standby position 9x on the substrate transport path 9 is returned to the original state by the substrate rotating means 121aaa in the same manner as in the step (4). It is returned to a rotating state. Thus, at the substrate standby position 9x, the direction of the substrate 7 is always the same, that is, the lower edge 7a of the substrate 7 faces the edge rinse portion 192 side.

Subsequently, similarly to the above step (7), a predetermined processing liquid is supplied to the edge portion of the substrate 7 on the application surface side, and a suction port (not shown) in the edge rinse groove 191 is supplied. ), Unnecessary coating films are removed and edge rinse processing is performed.

The substrate 7 that has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

In parallel with such an operation, the process
Similarly to (4), the substrate 7 to be processed by the coating apparatus 2a rotates the substrate 7 counterclockwise on the substrate mounting portion 121aa of the substrate rotating means 121aaa at the substrate standby position 6x of the pre-processing substrate transport path 6. At 135 degrees.

In the present embodiment, the above series of processing steps are repeated, and the substrate 7 is sequentially processed (coating processing + edge rinsing processing).

C-3. Effect of Third Embodiment As described above, in the third embodiment, the basic configuration is different except that the arrangement of the coating apparatuses 2a and 2b is different from the conveyance posture based on the difference in the arrangement. Since the configuration and operation are the same as those of the first embodiment, the same effects as those of the first embodiment can be obtained.

In the third embodiment, each coating device 2
Since both a and 2b are adjacent to one side with respect to the transport path and are arranged in a cluster, the two coating apparatuses 2a and 2b are provided only from one side without passing through the transport path on the opposite side to the coating side.
Has a unique effect that maintenance can be performed more easily and quickly.

C-4. Modification of Third Embodiment In the third embodiment, the substrate holding stages 3a, 3
b as a substrate transfer mechanism to the substrate b.
And the processed substrate transfer means 121b is used as a substrate transfer mechanism from the substrate holding stages 3a and 3b, but the shuttle arm 1 used in the modification of the second embodiment is used.
A transfer arm such as 17a, 117b may be used.

In the third embodiment, the substrate 7 is supported by a substrate mounting portion (not shown), and the substrate 7 is rotated clockwise at an angle of 4 °.
A substrate rotating means for rotating by 5 degrees or an angle of 45 degrees counterclockwise; and a substrate mounting means for holding the substrate 7 on the substrate mounting portion 122a or 122b. Substrate transfer means 121a and 121b having substrate transfer means 123a and 123b for transferring the image data between the unit and the substrate holding stages 3a and 3b.
Instead of these substrate transporting means 123a and 123b, as shown in FIGS.
3, the substrate 7 is transferred between the substrate mounting portions of the substrate rotation means 132 on the substrate transfer path before processing and the processed substrate transfer path and on the plurality of lift pins 34 of the substrate holding stages 3a and 3b. One substrate horizontal transfer robot 133 may be provided. This substrate horizontal transfer robot 133
Is a floating substrate 7 supported by a plurality of lift pins 143.
An actuator member 134 that can be received and placed on a plate-shaped flat surface (a plurality of vacuum pads 124 may be provided on the upper surface thereof) having a thickness that can penetrate below, and supports the actuator member 134 so that it can expand and contract. An arm member 135 rotatably supporting the actuator member 134; a support member 136 rotatably supporting the arm member 135; and a vertically movable arm member 135 together with the actuator member 134; May be provided with a rotation driving means (not shown) for rotating the arm member 135 provided on the support member 136, and a lifting drive means (not shown) for raising and lowering the arm member 135 provided in the support member 136. .

Further, instead of the flat actuator member 134 of the substrate horizontal transfer robot 133, as shown in FIGS. 24 and 25, an L-shaped actuator which can be applied even when a plurality of lift pins 143 are not used. The substrate horizontal transfer robot 133a having the member 137 may be used. The actuator member 137 of the substrate horizontal transfer robot 133a includes a substrate mounting portion 138 that receives and supports the short side and the long side of the substrate 7 from below, and the substrate mounting portion 138.
A plurality of vacuum pads 139 for holding the outer peripheral edge portion of the back surface of the substrate may be provided at a plurality of appropriate locations on the upper side.

In the modified examples (FIGS. 22 to 25) of the third embodiment, when the substrate 7 is supplied to the coating apparatus 2b,
After rotating the substrate 7 clockwise by 45 degrees by the substrate rotating means 132 in the substrate transport path before processing, the substrate 7 is transferred to the substrate holding stage 3b by the substrate horizontal transport robots 133 and 133a, and the coating device 2a In the case where the substrate 7 is supplied to the
Is rotated counterclockwise by 45 degrees and then the substrate 7 is transferred to the substrate holding stage 3a by the substrate horizontal transfer robots 133 and 133a, so that the setting direction of the substrate 7 during the substrate processing becomes the same direction. . Also, the coating device 2b
Horizontal transfer robot 13 from the substrate holding stage 3b
When the substrate 7 is taken out at 3,133a, the substrate 7 is rotated counterclockwise by 90 degrees for edge rinsing by the substrate rotating means 132 on the processed substrate transfer path side, and then clockwise by 45 degrees. Rotated substrate transfer path 9
When the substrate 7 is taken out by the substrate horizontal transfer robots 133 and 133a from the substrate holding stage 3b of the coating apparatus 2a, the substrate 7 is edge-rinsed by the substrate rotating means 132 on the processed substrate transfer path side. It is not necessary to rotate the substrate for processing, and it is sufficient to rotate the substrate 45 degrees clockwise after the edge rinsing process and transport the substrate to the processed substrate transport path 9.

As described above, the substrate rotating means 132 similar to that shown in FIG. 8 (substrate rotating means 160) is moved to the substrate standby position 6x of the pre-processing substrate transport path 6 and the substrate standby position of the processed substrate transport path 9 The coating devices 2a, 2b are provided at the position 9x, and on the substrate supply side and the substrate unloading side with respect to the coating devices 2a, 2b whose coating mechanism back sides are provided at right angles or obtuse angles, respectively.
2b, a predetermined rotation process (a substrate supply side process in which the substrate 7 is rotated clockwise by 45 degrees or a counterclockwise angle 45 degrees), and the substrate 7 is rotated counterclockwise. After rotating 90 degrees, clockwise 45 degrees
(The process on the substrate take-out side that is rotated by 45 degrees or rotated clockwise by 45 degrees), the coating apparatus 2
The coating process can be performed by aligning the upper and lower setting directions of the substrate 7 with respect to the substrates a and 2b, and the edge rinsing process can be performed by the edge rinsing device 190 by aligning the substrate direction on the substrate extracting side.

D. Fourth Embodiment FIG. 26 is a plan view schematically showing a schematic configuration of a main part of a substrate processing system according to a fourth embodiment of the present invention.
6 is a perspective view schematically illustrating a schematic configuration of a main part of the substrate processing system of FIG.

D-1. Configuration The fourth embodiment differs greatly from the first embodiment described above in that the coating apparatus 2 is similar to the thirteenth embodiment.
The point is that a and 2b are arranged adjacent to each other so that the substrate surface during processing is at a right angle or an obtuse angle. The greatest feature of the fourth embodiment is that a multi-joint horizontal robot transfers a substrate between the take-in position 6a, the coating devices 2a and 2b, and the delivery position 9a. This is the same as the basic configuration of mode 3. Hereinafter, the configuration of the substrate processing system according to the fourth embodiment will be described focusing on this difference.

As shown in FIG. 26, in the substrate processing system 140, the coating apparatuses 2a and 2b, the pre-processing substrate transport path 6 and the processed substrate transport path 9 are arranged in the same manner as in the third embodiment. The setting position is between the coating devices 2a and 2b, and the substrate holding stage 3
Setting positions 10a, 1 where a, 3b are in a horizontal position
0b. Further, a lift pin unit 33 in which a plurality of lift pins 34 are arranged to be able to move up and down is provided at the setting positions 10a and 10b.
Further, a lift pin unit 142 having the same configuration as the lift pin unit 33 is also provided at the take-in position 6a of the pre-processed substrate transfer path 6 and the transfer position 9a of the processed substrate transfer path 9. The lift pins 143 can freely move back and forth with respect to the substrate holding surface and the substrate mounting surface.

In the fourth embodiment, the multi-joint horizontal robot 141 functioning as a substrate transfer means is disposed equidistant from the substrate holding stages 3a and 3b in the horizontal posture of each of the coating devices 2a and 2b. . As shown in FIG. 27, the articulated horizontal robot 141 has a first arm member 145 whose one end is rotatably supported at the center of the upper surface of a column member 144, and the other end of the first arm member 145. A second arm member 146 having one end rotatably supported at one end, and one end rotatably supported at the other end of the second arm member 146, and the other end at a plurality of lift pins 143. Actuator member 147 capable of receiving and mounting substrate 7 on a plate-like flat surface having a thickness capable of entering below supported and floating substrate 7
And a first arm member 145 provided in the support member 144.
By moving up and down one end of the first arm member 1
45, a vertically moving member (not shown) for transferring the substrate, which can move the second arm member 146 and the actuator member 147 up and down. Then, a plurality of lift pins 143 which can be respectively moved back and forth with respect to the respective substrate holding surfaces of the substrate holding stages 3a and 3b,
The substrate 7 can be transferred to and placed on the plurality of lift pins 143 at the take-in position 6a of the substrate transfer path 9 or at the transfer position 9a of the processed substrate transfer path 9. Further, a plurality of vacuum pads (not shown) capable of vacuum-sucking the back surface of the substrate 7 may be provided on the front surface side of the actuator member 147 in order to firmly hold the substrate 7.

The articulated horizontal robot 141 is
Substrate directions to be supplied from the pre-processing substrate transfer path 6 to the coating apparatuses 2a and 2b disposed adjacently on the substrate holding surface of the substrate holding stage 3a or the substrate holding stage 3b (in this embodiment, the substrate coating processing Vertical position of substrate 7
(Up and down direction) is the same for each of the coating apparatuses 2a and 2b.
In step b, the processed substrate 7 is transferred from the substrate holding surface of the substrate holding stage 3a or the substrate holding stage 3b to the processed substrate transfer path 9. As a result, the setting direction of the substrate 7 with respect to each of the coating devices 2a and 2b and the substrate transfer direction on the substrate take-out side are aligned.

D-2. Operation of Embodiment 4 Next, the substrate processing system 140 configured as described above
Will be described. (1) Loading of Unprocessed Substrate 7 First, the unprocessed substrate 7 is placed on a plurality of lift pins 143 provided at the take-in position 6a of the pre-processed substrate transport path 6 from the device in the previous process. Here, for convenience of explanation, as shown in FIGS. 26 and 27, the turning means 4b stops the substrate holding surface of the substrate holding stage 3b in the horizontal position at the setting position 10b. 3b
The lift pin unit 33 is positioned so as to overlap the lower side, and is capable of receiving the substrate 7 with a plurality of lift pins 34 protruding above the substrate holding surface. Note that, in this state, the substrate holding stage 3a rises toward the coating device 2a.

(2) Transfer of Substrate 7 to Lift Pins 34 Next, the unjoined substrate 7 positioned on the plurality of lift pins 143 is moved by the multi-joint horizontal robot 141 to the actuator member 147 below the center of the substrate 7. The substrate 7 is placed on the actuator member 147 by raising the actuator member 147 with the vertical movement member. In this state,
After the actuator member 145 is stopped at a position above the substrate holding stage 3b, the actuator member 145 is lowered together with the substrate 7 by a vertically moving member, and
b on the plurality of lift pins 34.

At this time, the articulated horizontal robot 141
Are applied from the pre-processing substrate transfer path 6 to the coating apparatuses 2a and 2b disposed adjacently on the substrate holding surface of the substrate holding stage 3b.
The unprocessed substrate 7 is transferred such that the direction of the substrate (in this embodiment, the vertical direction of the substrate 7 in the vertical position during the substrate coating process) is the same in each of the coating apparatuses 2a and 2b.

(3) Coating Processing by Coating Apparatus 2b Subsequently, the lift pin unit 33 slowly lowers the plurality of lift pins 34 on which the substrate 7 is mounted, and moves the substrate 7 onto the substrate holding surface of the substrate holding stage 3b. And a vacuum suction process is performed on the substrate holding surface by a plurality of vacuum pads (not shown) arranged along positions corresponding to the outer peripheral edge of the substrate according to the size of the substrate 7. , The substrate holding stage 3b while keeping the substrate 7 in a horizontal posture.
Is set to a predetermined position to be in a holding state. Then, the substrate holding stage 3b rises and the coating device 2b
Is started.

While the coating process is being performed by the coating device 2b, the substrate holding stage 3a is located at the setting position 10a, and an operation of setting the next substrate to the coating device 2a is performed. At the same time, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a and is placed on the lift pins 143.

(4) Placement of Substrate 7 on Lift Pins 34 Next, as in the above step (2), the articulated horizontal robot 141 moves the substrate 7 on the lift pins 143 to the lift pins 34.
Place on top of. Also at this time, the articulated horizontal robot 141 moves the pre-processing substrate transfer path 6 from the pre-processing substrate transfer path 6 onto the substrate holding surface of the substrate holding stage 3a.
The pre-processed substrate 7 is set so that the direction of the substrate supplied to each of the coating apparatuses 2a and 2b (the vertical direction of the substrate 7 in the vertical position during the substrate coating processing) is the same in each of the coating apparatuses 2a and 2b.
Is transported.

(5) Coating process in coating device 2a and unloading of processed substrate 7 Then, in the same manner as in step (3), coating process on substrate 7 by coating device 2a is started. At this time, in the fourth embodiment, since the transfer control of the substrate 7 is performed by the articulated horizontal robot 141 in the step (4), the coating apparatuses 2a and 2b are controlled.
The direction of the substrate 7 supplied and set at the same time is always the same.

On the other hand, after the setting of the substrate 7 in the coating device 2a, when the drying process in the coating device 2b is completed, the substrate holding stage 3b rotates to the setting position 10b, and the processed substrate 7 is placed on the lift pins 34. Is done. At this time, the substrate holding stage 3a has already finished setting the substrate and stands up, the coating by the coating device 2a has been started, and there is no problem even if the substrate holding stage 3b is rotated down to the setting position 10b.

Subsequently, the articulated horizontal robot 141
Is transferred onto a plurality of lift pins 143 provided at the delivery position 9a. That is, this articulated horizontal robot 141
In this case, the actuator member 147 is made to enter the lower part of the center of the substrate 7, and the actuator member 147 is raised by the vertically moving member, and the substrate 7 is placed on the actuator member 147. In this state, the first arm member 145 and the second arm member 146 are rotated and expanded and contracted from the substrate holding stage 3b side to the transfer position 9a side of the processed substrate transfer path 9 to move the actuator member 147 above the transfer position 9a. After stopping at the position, the actuator member 1
47 is lowered together with the substrate 7 and mounted on the plurality of lift pins 143 at the delivery position 9a.

(6) Edge Rinsing of the Substrate 7 The substrate 7 transported to the delivery position 9a is not shown in FIG.
Edge rinsing device 1 arranged close to delivery position 9a
By 90, a predetermined processing liquid is supplied to the edge portion on the application surface side of the substrate 7 to remove an unnecessary application film.

Thus, the substrate 7 which has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

(7) Processed substrate 7 from coating device 2a
After the substrate 7 on the lift pins 143 provided at the loading position 6a is placed on the lift pins 34 in the same manner as in the step (2), the substrate 7 is further removed in the same manner as in the step (3). It is set on the coating device 2b.

After the setting of the substrate 7 in the coating device 2b, when the drying process in the coating device 2a is completed,
In the same manner as in the step (5), the processed substrate 7 is unloaded from the coating device 2a and transferred onto the lift pins 143 provided at the delivery position 9a of the substrate transfer path 9.

In parallel with this, the next unprocessed substrate 7
Is the take-in position 6 of the pre-process substrate transfer path 6 from the device in the previous process.
a and the lift pin 14 at the take-in position 6a
3 is placed.

(8) Edge Rinse Treatment of Substrate 7 The substrate 7 processed by the lift pins 143 provided at the transfer position 9a of the substrate transport path 9 in the step (7) is
As in the first to third embodiments, although not shown in FIG. 26, a predetermined processing liquid is supplied to an edge portion on the application surface side of the substrate 7 by the edge rinse processing device 190 arranged close to the delivery position 9 a. Then, unnecessary coating films are removed. The articulated horizontal robot 141 transports the substrate 7 processed by the coating apparatus 2a so that the lower edge portion of the substrate 7 faces in the same direction. Therefore, it does not matter which of the coating apparatuses 2a and 2b has been transported. Instead, the same lower portion can be edge rinsed by the edge rinse device 190 at the same location.

The substrate 7 which has been subjected to the coating process and the edge rinsing process is transported along the substrate transport path 9 to the next processing step.

In the present embodiment, the above-described series of processing steps are repeated, and the substrate 7 is sequentially processed (coating processing + edge rinsing processing).

D-3. Effects of the Fourth Embodiment As described above, the fourth embodiment is basically the same as the fourth embodiment except that the arrangement of the coating apparatuses 2a and 2b is different from the conveyance posture based on the difference in the arrangement. Since the configuration and operation are the same as those of the first embodiment, the same effects as those of the first embodiment can be obtained.

In the fourth embodiment, since the lift pins 143, 34, and 143 are transported using the articulated horizontal robot 141, the following specific effects can be obtained.
That is, substrate transfer means for transferring the substrate 7 onto the substrate holding stages 3a and 3b, substrate rotation means for rotating the substrate 7 by a predetermined angle together with the substrate 7, and processing on the substrate mounting portion of the substrate rotation means. The articulated horizontal robot 141 is provided instead of the shuttle arm (not shown) for transferring the substrate 7 to the take-in position 6a of the front substrate transfer path 6 or the transfer position 9a of the processed substrate transfer path 9. Just by itself, the configuration is greatly simplified. Also in this case, similarly to the third embodiment, the installation space can be partially shared to save space, and only one common lift pin unit 142 is required. 2
The maintenance for b can be performed more easily and quickly.

D-4. Modification Example of Embodiment 4 In Embodiment 4, the articulated horizontal robot 141 is used.
Has a configuration in which the actuator member 147 is supported by a plurality of lift pins 143 and can receive and place the substrate 7 on a plate-like flat surface having a predetermined thickness that can enter the lower side of the substrate 7 in a floating state. As shown in the plan view of FIG. 28 and the perspective view of FIG. 29, this is the case of a multi-joint horizontal robot 141a having an L-shaped actuator member 148 that can be adapted even when a plurality of lift pins 143 are not used. Actuator member 148 of this articulated horizontal robot 141a
A substrate mounting portion 149 for receiving and supporting the short side and the long side of the substrate 7 from below, and a plurality of vacuum pads 150 disposed at appropriate positions on the substrate mounting portion 149 for holding the outer peripheral edge of the substrate rear surface. And

E. Others In the first to fourth embodiments, the substrate rotating means 160
Alternatively, by providing the substrate rotating means 121aaa, 121bbb and the substrate rotating means 132 so that the substrate setting directions to the coating devices 2a, 2b are the same,
It eliminates the inconvenience that the vertical direction of the substrate 7 is reversed and that the edge rinsing part is different, which occurs in the conventional multi-paneling and title display.
However, if these points are not a problem,
These substrate rotating means 160 and substrate rotating means 121a
Needless to say, it is not necessary to provide the aa, 121bbb and the substrate rotating means 132, but in this case as well, the substrate holding stages 3a, 3b share a setting position, which is a substrate setting area where the substrate holding stage 3a has a predetermined angle posture, so that the installation is possible. The space can be shared, the overall system length can be reduced, the footprint can be degraded, the layout restrictions due to the overall system length can be eliminated, and the effect of using a single lift pin unit can be obtained. Can be

Further, in the first to fourth embodiments, the coating apparatuses 2a and 2b are arranged to be opposed to each other via the substrate transfer path, or are arranged adjacently so as to have a right angle or an obtuse angle. However, these opposed arrangements do not necessarily have to face each other, and may be, for example, opposed to each other in a slightly inclined state. In addition, for example, the coating devices 2a and 2b that are arranged to face each other, and the coating devices 2a and 2b that are separately arranged so as to have a right angle or an obtuse angle.
2b may be provided together, or the coating devices 2a and 2 disposed adjacently so as to have a right angle or an obtuse angle.
Another coating apparatus can be disposed to face b through a substrate transport path, and a part of the first to fourth embodiments can be combined. For example, in contrast to the configuration of Embodiment 4 shown in FIG.
By providing one or two coating apparatuses, three or four coating apparatuses can be operated by transferring a substrate by one articulated horizontal robot 141.

[0240]

As described above, according to the first aspect of the present invention, the first and second substrate processing means are arranged, and the substrate is supplied to one of the substrate processing means and the other substrate processing means. In the case of supplying a substrate to the substrate processing means, the substrate setting direction to each substrate processing means by each attitude conversion means may be in the opposite direction, but with the above configuration, at the entrance side of each substrate processing means, If the direction of the substrate is changed by the substrate rotating means so that the directions of setting the substrates to the respective substrate processing means are the same, the number of substrates can be increased as compared with the case where there is no substrate rotating means at the entrance side of each substrate processing means. The inconvenience that the substrate is turned upside down due to chamfering or title display can be solved.

Further, according to the second aspect of the present invention, the substrate is rotated according to whether the substrate rotating means is transported to the first attitude converting means or the second attitude converting means. By doing so, it is possible to eliminate the inconvenience that the substrate setting direction for each substrate processing means is turned upside down by the first attitude converting means and the second attitude converting means.

Further, according to the third aspect of the present invention, each of the posture changing means depends on whether the substrate rotating means is conveyed to the first posture changing means or to the second posture changing means. If the substrate is rotated by a rotation angle corresponding to the arrangement relation of the substrate, the substrate setting directions for the substrate processing means of various arrangement relations can be adjusted by the first posture conversion means and the second posture conversion means. The inconvenience of turning upside down can be eliminated.

According to the fourth aspect of the present invention, only the substrate supplied to one of the opposed substrate processing apparatuses is turned 180 degrees by the substrate rotating means, and then the substrate is turned on the substrate holding surface of the substrate holding stage. Since the substrate is transferred by the substrate transfer means, the substrate setting directions for the substrate processing apparatuses arranged opposite to each other are the same direction, so that the inconvenience that occurs in conventional multi-panel picking and title display can be eliminated.

Further, according to the fifth aspect of the present invention, only the substrate which has been turned on the processed substrate transport path and turned by 180 degrees is further turned by 180 degrees by the second substrate rotating means and returned to the original position. Therefore, the direction of the substrate to be supplied from the substrate processing apparatus to the next process via the processed substrate transport path is the same direction, so that the substrate process such as the edge rinsing process and various exposure printing processes in the next process can be easily performed. can do.

Further, according to the sixth aspect of the present invention, the substrate is rotated by the substrate rotating means so that the directions of the substrates supplied to the respective substrate processing apparatuses disposed adjacent to each other at an obtuse angle or a right angle become the same. After that, the substrate is transferred onto the substrate holding surface of the substrate holding stage by the substrate transfer means, so that the substrate setting directions for the substrate processing apparatuses disposed adjacent to each other at an obtuse angle or at a right angle are the same, and as in the related art, Inconveniences such as chamfering and title display can be eliminated.

Further, according to the seventh aspect of the present invention, the substrate transferred onto the processed substrate transport path is rotated by the second substrate rotating means so that the substrate direction is the same. The direction of the substrate supplied from the apparatus to the next step via the processed substrate transport path is the same direction, and substrate processing such as edge rinsing processing and various exposure printing processing in the next step can be facilitated.

Further, according to the eighth aspect of the present invention, the substrate transfer means such as an articulated robot performs pre-processing so that the directions of the substrates supplied to the adjacently disposed substrate processing apparatuses are the same. Since the substrates are transferred, the directions of setting the substrates to the adjacently disposed substrate processing apparatuses are the same, so that it is possible to eliminate the inconvenience that occurs in conventional multi-screening and title display.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view illustrating a schematic main configuration of a substrate processing system according to a first embodiment of the present invention.

FIG. 2 is a plan view schematically showing a schematic configuration of a main part of the substrate processing system of FIG. 1;

FIG. 3 is a partial side view of a substrate processing system schematically showing a state in which a substrate holding stage of a rotating unit in FIG. 1 is set in a coating apparatus.

4 is an enlarged view of a portion E in FIG. 3 showing a state where a toggle clamp mechanism is attached.

FIG. 5 is a perspective view schematically showing a schematic configuration of a main part for describing operations of a turning drive unit and a stage moving unit of the turning unit of FIG. 1;

FIG. 6 is a control configuration diagram schematically showing an example of rotation control in the turning means of FIG. 1;

FIG. 7 is a partial perspective view schematically showing a schematic configuration of a main part of the substrate transfer means 8 of FIG. 2;

FIG. 8 is a perspective view schematically showing a schematic configuration of a main part of the substrate rotating means of the present invention.

FIG. 9 is a block diagram illustrating a configuration of substrate centering control in FIG. 8;

FIGS. 10A to 10C are diagrams showing the operation of the substrate processing system of FIG.

FIGS. 11A to 11C are diagrams illustrating the operation of the substrate processing system of FIG. 1;

FIGS. 12A and 12B are diagrams illustrating the operation of the substrate processing system of FIG. 1;

FIGS. 13A and 13B are modified examples of FIGS. 9A and 9B, wherein FIG. 13A shows an edge detection position with respect to the substrate, FIG. 13B shows a case where the substrate and the edge detection position are all off the left side, and FIG. Figure when the board and the edge detection position deviate by one on the left side,
FIG. 13D is a modification example of FIGS. 13A to 13C and illustrates the control of the movement of the substrate with respect to the edge detection position.

FIG. 14 is a perspective view showing a case where the centering mechanism in the substrate rotating means of FIG. 8 is a mechanical mechanism.

FIG. 15 is a modification example of FIGS. 8 and 14,
It is a perspective view which shows typically the schematic structure at the time of using a cool plate.

FIG. 16 is a plan view schematically illustrating a schematic configuration of a main part of a substrate processing system according to a second embodiment of the present invention.

FIG. 17 is a perspective view schematically showing a schematic configuration of a main part of the substrate processing system of FIG. 16;

FIG. 18 is a plan view schematically showing a modification of FIG.

FIG. 19 is a perspective view of a modification of FIG. 18;

FIG. 20 is a plan view schematically illustrating a schematic configuration of a main part of a substrate processing system according to a third embodiment of the present invention.

21 is a perspective view schematically showing a schematic configuration of a main part of the substrate processing system of FIG. 20;

FIG. 22 is a plan view schematically showing a first modification of FIG.

FIG. 23 is a perspective view of a modification of FIG. 22;

FIG. 24 is a view schematically showing a second modification of FIG. 20, and is a plan view when a substrate is delivered to a coating apparatus 2b.

FIG. 25 is a perspective view of a modification of FIG. 24;

FIG. 26 is a plan view schematically illustrating a schematic configuration of a main part of a substrate processing system according to a fourth embodiment of the present invention.

FIG. 27 is a perspective view schematically showing a schematic configuration of a main part of the substrate processing system of FIG. 26;

FIG. 28 is a plan view schematically showing a modification of FIG. 26;

FIG. 29 is a perspective view of a modification of FIG. 28.

FIG. 30 is a front view schematically illustrating a main configuration of a coating system according to a virtual conventional technique.

FIG. 31 is a side view showing a main configuration of a toggle-type chuck opening / closing mechanism at a tip suction portion of an arm in the articulated robot of FIG. 30;

FIG. 32 is a perspective view for schematically illustrating the operation of the toggle chuck opening / closing mechanism of FIG. 31;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate processing system 2a, 2b Coating device 3a, 3b Substrate holding stage 4a, 4b Turning means (posture conversion means) 6 Pre-processing substrate transport path 6a Take-in position 6x Inlet-side substrate standby position 7 Substrate 8a Pre-processing substrate transfer means 8b Processed substrate transfer means 9 Processed substrate transfer path 9a Delivery position 9x Exit side substrate standby position 10a, 10b Setting position 11 Nozzle means 20a Swivel drive means 109, 120, 140 Substrate processing system 110a, 110b Transfer swivel arm 121a Processing Front substrate transfer means 121b Treated substrate transfer means 121aa, 121bb Substrate placement parts 133, 133a Horizontal substrate transfer robot 141, 141a Articulated horizontal robot 160, 121aaa, 121bbb, 132 Substrate rotation means

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/68 H01L 21/68 A

Claims (8)

[Claims] 1. A first receiving means for receiving and holding a substrate conveyed in a predetermined posture, and a substrate held by the first receiving means by rotating the first receiving means in a plane of the substrate. , A substrate rotating means rotatable at a second position, a second receiving means for receiving and holding a substrate from the first receiving means, and a substrate held by the second receiving means for receiving and holding the substrate. First attitude converting means for converting the attitude into a vertical or inclined attitude, first substrate processing means for performing processing on a substrate in a vertical or inclined attitude held by the first attitude converting means, and the second receiving means Second attitude converting means for receiving and holding the substrate held by the means and converting the substrate into a vertical or inclined attitude; and performing processing on the substrate in the vertical or inclined attitude held by the second attitude converting means. Second substrate processing means to be applied; A substrate processing system comprising: 2. The method according to claim 1, wherein the substrate rotating unit is configured to determine whether the destination of the substrate held by the first receiving unit is the first posture changing unit or the second posture changing unit. The substrate processing system according to claim 1, wherein the substrate is rotated. 3. The method according to claim 1, wherein the substrate rotating unit is configured to: transfer the substrate held by the first receiving unit to the first position changing unit or the second position changing unit; The substrate is rotated by a rotation angle corresponding to a positional relationship between the first attitude conversion unit and the second attitude conversion unit that is a destination of the substrate. 7. The substrate processing system according to 6. 4. A pre-processed substrate that has been conveyed in a pre-processed substrate conveyance path at a predetermined conveyance angle posture is transferred to a substrate processing position of a substrate processing apparatus, and is processed in a vertical or inclined posture. In a substrate processing system for transferring a processed substrate that has been subjected to the substrate processing from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed in opposition to each of the substrate processing apparatuses disposed in opposition. In contrast,
Each of the turning means is arranged so that the substrate holding stage is rotatable so that the substrate holding surface of the substrate holding stage holding the substrate is at a predetermined angle posture and either a vertical or inclined posture with the pivot portion as a rotation center. Only one substrate transferred from the pre-processing substrate transport path and supplied to one of the opposed substrate processing apparatuses is 1
A substrate rotating unit for changing the direction by 80 degrees, and transferring the substrate from the substrate rotating unit onto the substrate holding surface of the substrate holding stage in the predetermined angle posture, and processing the processed substrate processed by the substrate processing apparatus. And a substrate transfer unit configured to transfer the substrate from the substrate holding stage having the predetermined angle to the processed substrate transfer path. 5. An unprocessed substrate transported in a pre-processed substrate transport path at a predetermined transport angle posture to a substrate processing position of a substrate processing apparatus for processing the substrate in a vertical or inclined posture. In a substrate processing system for transferring a processed substrate that has been subjected to the substrate processing from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed in opposition to each of the substrate processing apparatuses disposed in opposition. In contrast,
Each of the turning means is arranged so that the substrate holding stage is rotatable so that the substrate holding surface of the substrate holding stage holding the substrate is at a predetermined angle posture and either a vertical or inclined posture with the pivot portion as a rotation center. Only one substrate transferred from the pre-processing substrate transport path and supplied to one of the opposed substrate processing apparatuses is 1
First substrate turning means for turning by 80 degrees, second substrate turning means for turning only the 180-turned substrate transferred on the processed substrate transport path further and turning it back by 180 degrees, The unprocessed substrate is transferred from the first substrate rotating means onto the substrate holding surface of the substrate holding stage in the predetermined angle posture, and the processed substrate processed by the substrate processing apparatus is held in the substrate in the predetermined angle posture. A substrate processing system, comprising: a substrate transfer means for transferring the substrate from the stage onto the second substrate rotating means. 6. An unprocessed substrate transported in a pre-processed substrate transport path at a predetermined transport angle attitude to a substrate processing position of a substrate processing apparatus and processed in a vertical or inclined attitude. In the substrate processing system for transferring the processed substrate processed by the substrate processing apparatus from the substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed adjacently so as to form a predetermined angle. For each of the substrate processing apparatuses, the substrate holding stage of the substrate holding stage for holding the substrate is held at a predetermined angle with respect to the pivot portion as a rotation center, and the substrate holding stage is vertically or inclined. Each of the rotatable circling means is adjacently disposed, the substrate is transferred from the pre-processing substrate transfer path, and the direction of the substrate supplied to each of the adjacently disposed substrate processing apparatuses is the same. A substrate rotating means for rotating the substrate from the substrate rotating means onto the substrate holding surface of the substrate holding stage in the predetermined angle posture, and a substrate processed by the substrate processing apparatus. A substrate processing system, comprising: a substrate transfer unit configured to transfer a substrate from the substrate holding stage having the predetermined angle to the processed substrate transfer path. 7. An unprocessed substrate transported in a pre-processing substrate transport path at a predetermined transport angle posture is transferred to a substrate processing position of a substrate processing apparatus and processed in a vertical or inclined posture. In a substrate processing system for transferring a processed substrate that has been subjected to the substrate processing from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed adjacently at an obtuse angle or a right angle, and For each of the substrate processing apparatuses, the substrate holding stage is rotated so that the substrate holding surface of the substrate holding stage for holding the substrate is at a predetermined angle posture and either vertical or inclined around the pivot portion. Each of the free turning means is disposed adjacent to each other, transferred from the pre-processing substrate transfer path, and supplied to the adjacently disposed substrate processing apparatuses in the same direction. First substrate rotating means for rotating so as to be one, and second substrate for rotating so that the direction of a substrate transferred from the substrate holding stage of each of the adjacent substrate processing apparatuses is the same. Rotating means, transferring the unprocessed substrate from the first substrate rotating means onto the substrate holding surface of the substrate holding stage in the predetermined angle posture, and transferring the processed substrate processed by the substrate processing apparatus to the predetermined position. A substrate processing system, wherein substrate transfer means for transferring the substrate from the substrate holding stage in an angular posture onto the second substrate rotating means is arranged. 8. An unprocessed substrate transported along a pre-processing substrate transport path at a predetermined transport angle attitude to a substrate processing position of a substrate processing apparatus, and the substrate is processed in a vertical or inclined attitude. In a substrate processing system for transferring a processed substrate that has been subjected to the substrate processing from a substrate processing position of the substrate processing apparatus to a processed substrate transport path, the substrate processing apparatus is disposed adjacently at an obtuse angle or a right angle, and For each of the substrate processing apparatuses, the substrate holding stage is rotated so that the substrate holding surface of the substrate holding stage for holding the substrate is at a predetermined angle posture and either vertical or inclined around the pivot portion. Each of the free turning means is disposed adjacent to each other, and each of the bases disposed adjacent to each other on the substrate holding surface of the substrate holding stage at the predetermined angle from the pre-processing substrate transfer path. The pre-processed substrate is transferred so that the directions of the substrates supplied to the plate processing apparatus are the same, and the processed substrate processed by the substrate processing apparatus is transferred from the substrate holding stage at the predetermined angle to the processed substrate. A substrate processing system, comprising: a substrate transfer unit that transfers the substrate on a transport path.