JP6881995B2 - Mounting device - Google Patents

Description

The present invention relates to a mounting device for flip-chip mounting a semiconductor chip having bumps on a substrate. More specifically, the present invention relates to a mounting device for laminating and mounting a plurality of semiconductor chips on a substrate.

Since the flip chip mounting does not use a bonding wire, it can be packaged close to the chip size, and its application range is widened as a mounting method suitable for miniaturization of electronic components.

In the flip chip mounting, as shown in FIG. 10A, the semiconductor chip C having the bump B is heat-bonded to the substrate W to bond the molten bump B to the electrode E of the substrate W, and the semiconductor chip C is bonded. It is mounted on the substrate W (FIG. 10 (b)). Flip chip mounting is performed by a mounting device 100 as shown in FIG. 11 as an example.

In the mounting device 100, the stage 810 holds the substrate W supplied by the substrate supply unit 400, and the bonding head 840 heat-bonds and holds the semiconductor chip C to be mounted. The semiconductor chips C are supplied one by one from the chip supply unit 500 to the tip of the bonding head 840. Normally, the semiconductor chip C is mounted on a plurality of locations on one substrate W, and the substrate W is carried to the substrate recovery unit 600 after the mounting on the plurality of locations is completed. Here, since the bonding head 840 needs to have rigidity for heat-bonding, when the semiconductor chips C are mounted on a plurality of places on the substrate W, the bonding head 840 is in a fixed state and the stage 810 is moved. It is common to perform positioning.

By the way, with the aim of improving the productivity of flip-chip mounting, a configuration in which a plurality of bonding heads (bonding head 841 and bonding head 842) are provided in one mounting device is also known as in the mounting device 200 of FIG. (For example, Patent Document 1).

In a configuration such as the mounting device 200, one of the bonding heads can be cooled to a temperature at which the next semiconductor chip C can be adsorbed and held while the other bonding head is thermocompression-bonded. The bonding head has the advantage that it can always perform thermocompression bonding. Further, since the substrate supply unit 400, the chip supply unit 500, the substrate recovery unit 600, and the stage 810 are shared, the productivity improvement effect exceeding the increase in equipment cost can be obtained.

International Publication No. 2014/157134

With the high-density mounting of electronic components, there is an increasing demand for three-dimensional mounting in which a semiconductor chip C having a through electrode or the like is laminated on a substrate W by flip-chip mounting. In three-dimensional mounting, as shown in FIG. 13A, the types of the base semiconductor chip CB mounted on the substrate W and the top semiconductor chip CT mounted on the base semiconductor chip CB may be different, but semiconductors having the same specifications are used. In some cases, the chip C is laminated and mounted, or as shown in FIG. 13B, the top semiconductor chip CT having the same specifications may be laminated and mounted on the base semiconductor chip CB.

Here, when the top semiconductor chip CT is mounted on the base semiconductor chip CB having different specifications, the substrate W on which the base semiconductor chip CB is mounted is mounted on all the predetermined parts of the substrate W from the viewpoint of improving the efficiency of semiconductor chip supply. After the collection unit 600 collects the substrate magazine rack M, the substrate supply unit 400 supplies the substrate W to the stage 810 from the substrate magazine rack M to mount the top semiconductor chip CT. On the other hand, when semiconductor chips C (top semiconductor chip CT) having the same specifications are laminated and mounted, from the viewpoint of ensuring mounting accuracy, semiconductor chips C (top semiconductor chips) having the same number of stages with the same head fixed in the stage 810 are fixed. It is preferable to thermocompression-bond CT).

Therefore, in the mounting device 200 as shown in FIG. 12, if a plurality of bonding heads are fixed, when a plurality of semiconductor chips having the same specifications are laminated, one bonding head is in a series from suction surface cooling to thermocompression bonding operation. The other bonding head goes into a standby state while the above operation is repeated a plurality of times. That is, since one substrate W is targeted despite the presence of the bonding head 831 and the bonding head 832, in an application in which semiconductor chips having the same specifications are laminated and mounted in a plurality of stages, a configuration such as the mounting device 200 increases the device cost. The productivity improvement effect commensurate with the above cannot be obtained.

On the other hand, when the top semiconductor chip CT is mounted on the base semiconductor chip CB having different specifications, the difference between the plurality of bonding heads may adversely affect the mounting quality. That is, if the bonding head that thermocompression-bonds the base semiconductor chip CB and the bonding head that thermocompression-bonds the top semiconductor chip CT are different, bonding failure or cracking may occur in any of the semiconductor chips.

The present invention has been made in view of the above problems, and provides a mounting device capable of ensuring mounting quality and improving productivity when laminating and mounting a plurality of types of semiconductor chips on a substrate.

In order to solve the above problems, the invention according to claim 1 is
A board supply unit that supplies substrates, a chip supply unit that supplies semiconductor chips,
A substrate identification unit that identifies the substrate supplied by the substrate supply unit, and a substrate identification unit.
A mounting unit composed of a combination of a stage for holding the substrate and a bonding head for heat-bonding the semiconductor chip, a substrate collecting unit for collecting the substrate on which the semiconductor chip is mounted in the mounting unit, and a substrate transport for transporting the substrate. A mounting device including means and a transfer control unit that controls the substrate transfer means.
The mounting units are arranged at a plurality of locations, and the transport control unit has a function of storing substrate identification information for each substrate identified by the substrate identification unit, and which of the plurality of mounting units mounts the semiconductor chip. Has a function of being associated with the substrate identification information and stored.
When mounting by stacking different semiconductor chips on the semiconductor chip with the substrate after mounting the semiconductor chip, based on the substrate identification information, to convey the substrate in any of the mounting portion of the double multiple locations This is a mounting device that the transport control unit determines and selects.

The invention according to claim 2 is the mounting device according to claim 1.
A mounting device is provided with a spare stage in addition to the stage for each mounting unit at a plurality of locations.

The invention according to claim 3 is the mounting device according to claim 1 or 2.
This is a mounting device in which the transfer control unit controls the substrate transfer means so that the transfer of the substrate from the same mounting unit to the substrate recovery unit is not continuous.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a mounting device capable of ensuring mounting quality and improving productivity when laminating and mounting a plurality of types of semiconductor chips on a substrate.

It is the schematic which shows the structure of the mounting apparatus which concerns on embodiment of this invention. It is a block diagram explaining the transfer control part which controls the substrate transfer which concerns on embodiment of this invention. In the description of the substrate transport state in the embodiment of the present invention, it is the figure which shows (a) initial state (b) transport to the mounting part of the 1st substrate (c) after transporting the 1st substrate. In the description of the substrate transport state in the embodiment of the present invention, (d) transport of the second substrate to the mounting portion (e) after transporting the second substrate (f) recovery of the first substrate and the third substrate. It is a figure which shows the transfer to the mounting part of the board. In the description of the substrate transport state in the embodiment of the present invention, (g) after transporting the third substrate to the mounting portion (h) collecting the second substrate and transporting the fourth substrate to the mounting portion ( i) It is a figure which shows after the transfer to the mounting part of the 1st board. It is a figure which shows simply showing the substrate transfer operation at the time of mounting the base semiconductor chip on the substrate in embodiment of this invention. It is a figure which shows simply the substrate transfer operation at the time of mounting a top semiconductor chip on the substrate which mounted the base semiconductor chip in the embodiment of this invention, and explains the steady state. In the embodiment of the present invention, the substrate transfer operation when the top semiconductor chip is mounted on the substrate on which the base semiconductor chip is mounted is simply shown, and an example of dealing with a non-steady state is described. In the embodiment of the present invention, the substrate transfer operation when the top semiconductor chip is mounted on the substrate on which the base semiconductor chip is mounted is simply shown, and another example corresponding to the unsteady state is described. (A) It is a figure explaining the semiconductor chip and the substrate used for flip chip bonding, and (b) is the figure which shows the state which the semiconductor chip is mounted on the substrate. It is a figure which shows an example of the mounting apparatus which performs flip chip mounting. Increased productivity of flip chip mounting (A) (b)

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing an example of a mounting device according to the present invention. The mounting device 1 of FIG. 1 heat-bonds the semiconductor chip C having the bump B to the substrate W as shown in FIG. 10A to bond the molten bump B to the electrode E of the substrate W. As shown in FIG. 10B, the semiconductor chip C is mounted on the substrate W. Further, as shown in FIG. 13A, the mounting device 1 can mount the top semiconductor chip CT on the substrate W on which the base semiconductor chip CB is mounted.

The mounting device 1 includes a frame 2, a frame 3, a board supply section 4, a chip supply section 5, a board storage section 6, a board transfer means 7, a mounting section 8 (8A and 8B), a board identification section 9, and a transfer control section 10 ( Fig. 2) is provided.

The gantry 2 supports the frame 3, and the gantry 2 and the frame 3 are the main structures of the mounting device 1, and support the chip supply unit 5, the board transfer means 7, the mounting unit 8, and the board identification unit 9. There is.

The substrate supply unit 4 has a function of sequentially taking out and supplying the substrate W one by one from the magazine rack M for the substrate in which the substrate W is housed.

The chip supply unit 5 has a function of picking up the semiconductor chip C from a diced wafer or the like and delivering it to the tip of the bonding head 84 (84A or 84B) of the mounting unit 8 (8A or 8B).

The substrate recovery unit 6 has a function of accommodating the substrate W in the magazine rack M for the substrate. Further, the substrate transporting means 7 has a function of transporting the substrate W from the substrate supply unit 4 to the mounting unit 8 (8A or 8B) and a function of transporting the substrate W from the mounting unit 8 (8A or 8B) to the substrate recovery unit 6. It has. In the mounting device 1 of FIG. 1, the substrate transporting means 7 is a transporting means 70 from the board supply unit 4 to the substrate recovery unit 6, a transporting means 7A for transporting the substrate between the transporting means 70 and the mounting unit 8A, and a transporting means 70. The configuration is composed of a transfer means 7B for transporting the substrate between the board and the mounting section 8B, but the present invention is not limited to this, and the board W is the board supply section 4, the mounting section 8 (8A or 8B), and the board recovery section. It suffices to have a function of moving between 6.

The mounting unit 8 includes a stage 81 (stage 81A, stage 81B), a bonding tool 83 (bonding tool 83A, bonding tool 83B), and a bonding head 84 (bonding head 84A, bonding head 84B) as basic components. The object of the present invention is a mounting device including a plurality of mounting units 8, and the mounting device 1 of FIG. 1 shows a configuration in which the mounting units 8A and the mounting units 8B are arranged at two locations. In the following description, A and B will be added when explaining the operation peculiar to the mounting unit 8A and the mounting unit 8B, but the mounting unit 8 will be described when explaining the common functions. This also applies to each element constituting the mounting unit 8A and the mounting unit 8B.

The stage 81 has a function of sucking and holding the substrate W and moving the substrate W in the in-plane direction to change the position where the semiconductor chip C should be mounted. The bonding tool 83 has a function of moving the bonding head in a direction perpendicular to the substrate W and pressurizing the bonding head. The bonding head 84 has a function of sucking and holding the semiconductor chip C, and by lowering the bonding tool 83, the semiconductor chip C can be pressed against the substrate W on the stage 81. Further, the bonding head 84 has a built-in heater and can heat the held semiconductor chip C. That is, the bonding head 84 has a function of heat-bonding the semiconductor chip C. Further, the mounting unit 8 may include a spare stage 82. It is desirable that the preliminary stage 82 has a function of preheating the substrate W, and the preheated substrate W has an advantage that the time at the time of thermocompression bonding can be shortened (compared to the case without preheating).

The board identification unit 9 has a function of identifying a board by image recognition or the like, and corresponds to, for example, a barcode reader that reads a lot number or the like which is board identification information given to the board, but is limited to this. It's not a thing.

The transfer control unit 10 controls the substrate supply unit 4, the substrate recovery unit 6, the substrate transfer means 7, and the like to manage the movement of the substrate W. The transfer control unit 10 may have a configuration in which a CPU, ROM, RAM, HDD, etc. are connected by a bus, or may have a configuration including a one-chip LSI or the like. The transfer control unit 10 stores various programs and data for controlling the substrate supply unit 4, the substrate recovery unit 6, the substrate transfer means 7, and the like.

The transfer control unit 10 is connected to a board supply unit 4, a board recovery unit 6, a substrate transfer means 7 (transfer means 70, transfer means 7A, transfer means 7B), a mounting unit 8A, a mounting unit 8B, and a board identification unit 9. There is.

By controlling the substrate supply unit 4 and the substrate transfer means 7, the transfer control unit 10 can transfer the substrate W from the magazine rack M for the substrate one by one to the substrate transfer means, and the substrate recovery unit 6 and the substrate transfer means By controlling 7, the substrate W can be housed in the substrate magazine rack M one by one from the substrate transport means 7.

The transfer control unit 10 has a function of selecting either the mounting unit 8A or the mounting unit 8B when the semiconductor chip C is thermocompression bonded to the substrate W, and controls the substrate transport means 7 based on the selection result. , The board is conveyed to either the mounting unit 8A or the mounting unit 8B.

The transfer control unit 10 has a function of storing information for identifying the substrate W (hereinafter referred to as substrate identification information) read by the substrate identification unit 9. Further, each substrate W also has a function of associating and storing which of the mounting unit 8A and the mounting unit 8B is mounted on the semiconductor chip C.

Hereinafter, the transfer of the substrate W when the semiconductor chip C is mounted on the sequentially supplied substrate W in the mounting apparatus 1 according to the present invention will be described with reference to FIGS. 3 to 5. Here, each of FIGS. 3 to 5 is a schematic view of the mounting device 1 as viewed from the upper surface (perpendicularly above the surface of the substrate W). In addition, the board W is referred to as "first board" or "second board" (and the number after sharpening in the figure), but the number here is the board. The order in which the magazine rack M for the substrate on the supply unit 4 side is sequentially supplied is described.

FIG. 3A shows a state before the mounting work by the mounting device 1 is started, and the board W (without mounting the semiconductor chip C) is mounted on the board magazine rack M on the board supply unit 4 side. In the fully loaded state, the board magazine rack M on the board recovery unit 6 side is empty. Further, the substrate W is not arranged in either the mounting portion 8A or the mounting portion 8B.

From the state of FIG. 3A, the transfer control unit 10 of the mounting device 1 controls the board supply unit 6 and the board transfer means 7 to arrange the first substrate W on the stage 81A of the mounting unit 8A (). FIG. 3 (b). At this time, the board identification unit 9 reads the board identification information that identifies the board W, and stores the mounting unit 8A, which is the transfer destination of the board W, in association with the board identification information. Further, the transfer control unit 10 recognizes that the substrate W exists on the stage 81A. In the present embodiment, the first substrate W is transported to the mounting portion 8A side, but as shown in FIG. 3A, it starts from a state where neither the mounting portion 8A nor the mounting portion 8B has the substrate W. If so, the first board W may be conveyed to the mounting unit 8B side. In this case, the mounting unit 8A and the mounting unit 8B described in FIGS. 3 (b) to 5 (i) can be read as each other. Just do it.

FIG. 3 (c) shows the state after the substrate W is conveyed as shown in FIG. 3 (b). In the state of FIG. 3C, the mounting unit 8A can start mounting the semiconductor chip C on the first substrate W. Further, in the state of FIG. 3C, the magazine rack M for the substrate on the substrate supply unit 4 side is in a state where the second substrate W can be supplied.

From the state of FIG. 3C, the mounting unit 8A mounts the semiconductor chip C on the first substrate W, while the substrate supply unit 4 and the substrate transporting means 7 are in an operable state. Here, since the transfer control unit 10 recognizes that the board W exists on the mounting unit 8A side, it controls the board supply unit 6 and the board transfer means 7 to control the second board W. It is arranged on the stage 81B of the mounting unit 8B (where the substrate W does not exist) (FIG. 4 (d)). At this time, the board identification unit 9 reads the board identification information that identifies the second board W, and stores the mounting unit 8B, which is the transfer destination of the board W, in association with the board identification information.

FIG. 4 (e) shows the state after the substrate W is conveyed as shown in FIG. 4 (d). In the state of FIG. 4 (e), the mounting unit 8A mounts the semiconductor chip C on the first substrate W, and the mounting unit 8B can start mounting the semiconductor chip C on the second substrate W. .. Further, the magazine rack M for the substrate on the substrate supply unit 4 side is in a state where the third substrate W can be supplied.

In the state of FIG. 4E, when the mounting unit 8A completes the mounting of the board W, the transport control unit 10 recognizes that the board W can be transferred from the mounting stage 81A by the signal from the mounting unit 8A. .. Further, even if the mounting unit 8B mounts the semiconductor chip C on the substrate W, the substrate transport means 7 and the substrate recovery unit 6 are in an operable state, so that the transport control unit 10 is the transport means 7 and the substrate recovery unit 6. Is controlled, and the (first sheet) board W whose mounting is completed by the mounting unit 8A is stored in the board magazine rack M on the board collecting unit 6 side (circled number 1 in FIG. 4 (f)). At this stage, the transfer control unit 10 recognizes that the substrate W does not exist on the stage 81A. After that, since the transfer control unit 10 also recognizes that the substrate W exists in the stage 81B, it controls the substrate supply unit 4 and the substrate transfer means 7 to mount the third substrate W. It is arranged on the stage 81A of 8A (circled number 2 in FIG. 4 (f)). At this time, the board identification unit 9 reads the board identification information that identifies the third board W, and stores the mounting unit 8A, which is the transfer destination of the board W, in association with the board identification information.

FIG. 5 (g) shows the state after the substrate W is conveyed as shown in FIG. 4 (f). In the state of FIG. 5 (g), the mounting unit 8B mounts the semiconductor chip C on the second substrate W, and the mounting unit 8A can start mounting the semiconductor chip C on the third substrate W. .. Further, the magazine rack M for the substrate on the substrate supply unit 4 side is in a state where the fourth substrate W can be supplied.

In the state of FIG. 5 (g), when the mounting unit 8B completes the mounting of the board W, the transport control unit 10 can transfer the board W from the mounting stage 81B based on the signal from the mounting unit 8B. recognize. Further, even if the mounting unit 8A mounts the semiconductor chip C on the substrate W, the substrate transport means 7 and the substrate recovery unit 6 are in an operable state, so that the transport control unit 10 is the transport means 7 and the substrate recovery unit 6. Is controlled, and the (second) board W whose mounting is completed by the mounting unit 8B is stored in the board magazine rack M on the board collecting unit 6 side (circled number 1 in FIG. 5 (h)). At this stage, the transfer control unit 10 recognizes that the substrate W does not exist on the stage 81B. After that, since the transfer control unit 10 also recognizes that the substrate W exists in the stage 81A, it controls the substrate supply unit 4 and the substrate transfer means 7 to mount the fourth substrate W. It is arranged on the stage 81B of 8B (circled number 2 in FIG. 5 (h)). At this time, the board identification unit 9 reads the board identification information that identifies the fourth board W, and stores the mounting unit 8B, which is the transfer destination of the board W, in association with the board identification information.

FIG. 5 (i) shows the state after the substrate W is conveyed as shown in FIG. 5 (h). In the state of FIG. 5 (h), the mounting unit 8A mounts the semiconductor chip C on the third substrate W, and the mounting unit 8B can start mounting the semiconductor chip C on the fourth substrate W. .. Further, the magazine rack M for the substrate on the substrate supply unit 4 side is in a state where the fifth substrate W can be supplied.

The state of FIG. 5 (h) is the same as the state of FIG. 4 (e) except that the substrate W housed in the magazine rack M for the substrate on the substrate recovery unit 6 side exists. Therefore, after that, the transport control unit 10 repeats the operations of FIGS. 4 (f) to 5 (h).

As described above, the change in the arrangement of the substrate W when the mounting apparatus 1 mounts the semiconductor chip C on the substrate W has been described with reference to FIGS. 3 to 5, but this is briefly shown by focusing on the substrate transfer operation. Is shown in FIG. 6 (FIGS. 7, 8 and 9 also briefly show the substrate transfer operation). The substrate transfer operation of FIG. 3 (b) is step 1 of FIG. 6, the substrate transfer operation of FIG. 4 (d) is step 2 of FIG. 6, and the substrate transfer operation of FIG. 4 (f) is step 3 and step 4 of FIG. , The substrate transfer operation of FIG. 5 (h) corresponds to step 5 and step 6 of FIG. Note that steps 7 and 8 in FIG. 6 have the same contents as steps 3 and 4, and thereafter, the same substrate transfer operation as in steps 5 and 6 continues. That is, in order to repeat steps 3 to 6, the transfer control unit 10 controls the substrate transfer means operation pattern shown at the right end of FIG. 6 to repeat the order of pattern 2A, pattern 1A, pattern 2B, and pattern 1B. Do it.

By the way, in FIGS. 3 to 5 and 6, the substrate supply unit 4 supplies the substrate W on which the semiconductor chip C is not mounted. Therefore, the supplied substrate W may be transported to the vacant side of the mounting unit 8A and the mounting unit 8B. However, in the case where another semiconductor chip C is laminated on the semiconductor chip of the substrate W on which the semiconductor chip C is mounted by the mounting unit 8A or the mounting unit 8B, the mounting unit 8A and the mounting unit are mounted for each substrate W. If any of 8B is mistaken, poor mounting quality may occur. That is, even if the mounting portion 8A and the mounting portion 8B are precision machined with the same specifications, there is a difference in the angle of the bonding head 84 with respect to the stage 81 surface, the flatness of the stage 81 surface, and the like, which makes it difficult to adjust. In some cases, cracking of semiconductor chips, poor bonding, etc. may be induced. For this reason, it is desirable to perform laminated mounting in the same mounting section.

Therefore, an example in which the top semiconductor chip CT is mounted on the substrate W in which the base semiconductor chip CB is mounted as shown in FIG. 13 will be described with reference to FIG. 7.

In FIG. 7, the white circles and black circles in parentheses after the (board) W are for convenience to distinguish the mounting portions on which the base semiconductor chip CB is mounted, and the white circles are based on the mounting portion 8A. The substrate W on which the semiconductor chip CB is mounted, and the black circles are the substrates W on which the base semiconductor chip CB is mounted in the mounting portion 8B. Further, the numerical values written after the white circles and the black circles indicate the order in which they are taken out from the substrate magazine rack M. That is, the white circle n (n = 1, 2, ...) Represents the nth board W on which the base semiconductor chip CB is mounted by the mounting section 8A, which is supplied from the board magazine rack M by the board supply section 4. The same applies to n (n = 1, 2, ...) In the black circle.

Here, whether the base semiconductor chip CB is mounted by the mounting unit 8A or mounted by the mounting unit 8B is stored by the transport control unit 10 in association with the board identification information. Therefore, the board identification unit 9 reads the board identification information of each board W, and the transfer control unit 10 determines and selects whether to transfer each board W to the mounting unit 8A or the mounting unit 8B, and selects the board. Controls the transport means 7. Specifically, as shown in FIG. 7, the substrate W on which the base semiconductor chip CB is mounted by the mounting unit 8A is transported to the mounting unit 8A, and the substrate W on which the base semiconductor chip CB is mounted on the mounting unit 8B is transported by the mounting unit 8B. To do.

When mounting the base semiconductor chip CB on the substrate W, as described above, the order of pattern 2A, pattern 1A, pattern 2B, and pattern 1B in FIG. 6 is repeated, so that the substrate magazine rack M on the substrate recovery unit 6 side is repeated. The board W mounted by the mounting unit 8A and the board W mounted by the mounting unit 8B are alternately housed in the. Therefore, the board magazine rack M in which the board W mounted by the mounting unit 8A and the board W mounted by the mounting unit 8B are alternately housed is arranged on the board supply unit 4 side to form the top semiconductor chip CT. At the time of mounting, if it is determined whether the first board W supplied from the board magazine rack M is mounted by the mounting unit 8A or the mounting unit 8B, the base semiconductor substrate CB is substantially used. The board transfer operation is the same as mounting. Actually, in the example of FIG. 7, since the first substrate W supplied from the substrate magazine rack M is the base semiconductor chip CB mounted by the mounting unit 8A, the substrate transfer operation is as shown in FIG. It is the same.

However, when mounting the base semiconductor chip CB on the board W, due to some trouble, the board W mounted by the mounting unit 8A and the board W mounted by the mounting unit 8B are not alternately housed, and the mounting unit 8A or the mounting unit 8A or The board W mounted by the mounting unit 8A may be continuously housed in the board magazine rack M. FIG. 8 shows an example of a substrate transfer operation when such a substrate magazine rack M is arranged on the substrate supply unit 4 side.

FIG. 8 shows a case where the first and second substrates W on which the base semiconductor chip CB is mounted by the mounting portion 8B are continuous.

In step 3 of FIG. 8, what is normally ready for supply in the board supply unit 4 should be the board W mounted (of the base semiconductor chip CB) in the mounting unit 8A, but mounted in the mounting unit 8B. It is the substrate W that has been subjected to. At this stage, the top semiconductor chip CT is mounted on the substrate W arranged on the stage 81B of the mounting unit 8B, and the transfer control unit 10 is not in a state where the substrate W can be transferred to the substrate recovery unit 6. It has recognized. On the other hand, from the board identification symbol read by the board identification unit 9, the transfer control unit 10 determines that the board W supplied by the board supply unit 4 should be transported to the mounting unit 8B side. Therefore, when the spare stages 82 (82A, 82B) are provided as in the mounting device 1 of FIG. 1, the board W is transferred from the board identification unit 9 to the stage of the mounting unit 8B as in step 4 of FIG. Place it at 82B. Here, it is desirable that the spare stage 82 (82A, 82B) is adjacent to the stage 81 (81A, 81B) and has a function of heating and retaining the substrate W. If the spare stage 82 is adjacent to the stage 81, the time after moving the substrate W from the stage 81 to the next mounting of the substrate W can be shortened. Further, if the spare stage 82 has a heat retention function, it is possible to shorten the heating of the substrate W by the stage 81 before mounting the semiconductor chip C.

After arranging the substrate W on the spare stage 82B in step 4 of FIG. 8, when the mounting of the top semiconductor chip CT on the stage 81B is completed, the substrate W arranged on the stage 81B is directed toward the substrate recovery unit 6. Transport (step 5 in FIG. 8). After that, the substrate W arranged on the spare stage 82B is transferred to the stage 81B (step 6 in FIG. 8).

After that, while the top semiconductor chip CT is mounted on the substrate W on the stage 81B of the mounting unit 8B, the substrate W supplied by the substrate supply unit 4 is conveyed by the transfer control unit 10 based on the reading result of the substrate identification unit 9. The destination is judged and selected. If the substrate W supplied by the substrate supply unit 4 has the base semiconductor chip CB mounted on the mounting unit 8A, the substrate W is conveyed from the substrate identification means 9 to the stage 81A of the mounting unit 8A (step 7 in FIG. 8). ). After that, if the board W mounted by the mounting unit 8A and the board W mounted by the mounting unit 8B are alternately supplied, the operation patterns of the board transporting means are pattern 2B, pattern 1B, pattern 2A, and so on. Pattern 1A is repeated.

By the way, at the stage where the substrate W is arranged on the spare stage 82B in step 4 of FIG. 8, the waiting time until the mounting of the substrate W on the stage 81B is completed is long, and the next substrate W (identified by the substrate identification unit 9) is If the base semiconductor chip CB is mounted by the mounting unit 8A, the substrate may be conveyed from the substrate identification unit 9 to the stage 81A of the mounting unit 8A in advance as in step 5 of FIG.

After performing such an operation, the substrate transfer operation as in steps 6 to 9 of FIG. 9 is performed. Therefore, if the board W mounted by the mounting unit 8A and the board W mounted by the mounting unit 8B are alternately supplied, the pattern 1A, the pattern 2B, the pattern 4B, the pattern 2A, and the pattern of FIG. 9 are supplied. 3B is repeated, and the situation of using the spare stage 82B continues. However, when two substrates W in which the base semiconductor chip CB is mounted in the mounting unit 8A are continuously supplied, it is possible to return to the state in which the spare stage 82B is not used.

Although the example provided with the spare stage 82 (82A, 82B) as in the mounting device 1 of FIG. 1 has been described above, the present invention is also effective when the spare stage 82 (82A, 82B) is not provided. If there is no spare stage 82, in step 3 of FIG. 8 (and FIG. 9), the next substrate W is transferred by the substrate identification unit 9 until the substrate W mounted on the stage 81B is conveyed to the substrate recovery unit 6. You will have to wait. Therefore, if the spare stage 82 is not provided, the time required for transporting the substrate W to be arranged next and the preheating time cannot be shortened. However, even if the configuration does not have the spare stage 82, if the transfer destination of the substrate W is determined based on the substrate identification information read by the substrate identification unit 9, the mounting of the base semiconductor chip CB and the top semiconductor chip CT is the same. Since it is performed in the mounting section, it is possible to suppress the occurrence of mounting defects.

Further, in the mounting device 1 of the present embodiment, the mounting portions 8 are arranged at two locations (mounting portions 8A and mounting portions 8B), but even if the mounting portions 8 are arranged at three or more locations, the mounting portions 8 may be arranged at three or more locations. Each mounting unit 8 can perform mounting work independently, and even when mounting the top semiconductor chip CT on the base semiconductor chip CB, it is possible to perform substrate distribution so as to suppress mounting defects, further improving productivity. It is possible to maintain the mounting quality while doing so.

In the present embodiment, it is premised that the base semiconductor chip CB and the top semiconductor chip CT are mounted in the same mounting unit, but the present invention is not limited to this, and different mounting units are used. Even when the combination of the above is preferable, the function of selecting which mounting portion to carry to based on the board identification information is effective.

1 Mounting device 2 Stand 3 Frame 4 Board supply unit 5 Chip supply unit 6 Board recovery unit 7 Board transfer means 8, 8A, 8B Mounting unit 9 Board identification unit 10 Transfer control unit 81, 81A, 81B Stage 82, 82A, 82B Spare Stage 83, 83A, 83B Bonding Tool 84, 84A, 84B Bonding Head C Semiconductor Chip M Magazine Rack for Substrate W Substrate

Claims (3)

The board supply unit that supplies the board and
The chip supply unit that supplies semiconductor chips and
A substrate identification unit that identifies the substrate supplied by the substrate supply unit, and a substrate identification unit.
A mounting portion including a combination of a stage for holding the substrate and a bonding head for heat-bonding the semiconductor chip.
A substrate recovery unit that collects a substrate on which a semiconductor chip is mounted in the mounting unit,
A substrate transporting means for transporting the substrate and
A mounting device including a transfer control unit that controls the substrate transfer means.
The mounting parts are arranged in a plurality of places,
The transfer control unit stores the function of storing the board identification information for each board identified by the board identification unit and which of the mounting units at a plurality of locations mounts the semiconductor chip in association with the board identification information. Has the function of
When mounting by stacking different semiconductor chips on the semiconductor chip with the substrate after mounting the semiconductor chip, based on the substrate identification information, to convey the substrate in any of the mounting portion of the double multiple locations A mounting device in which the transport control unit determines and selects whether or not. The mounting device according to claim 1.
A mounting device provided with a spare stage in addition to the above-mentioned stage for each mounting unit at a plurality of locations. The mounting device according to claim 1 or 2.
A mounting device in which the transfer control unit controls the substrate transfer means so that the transfer of the substrate from the same mounting unit to the substrate recovery unit is not continuous.

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