201105191 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子零件裝配用之裝置，例如關於 用以在液晶面板等顯示面板裝配半導體裝置之電子零件裝 配用之裝置。 【先前技術】 在LCD業界中，近年來其市場正從PC擴展到監視器 對應。伴隨該狀況，液晶面板（基板）尺寸也大型化，而 且要求低價格化。 液晶面板等顯示面板係在玻璃基板的緣部裝配驅動用 的電子零件（例如、TAB ( Tape Automated Bonding ;捲 帶式自動黏合）、COG ( Chip on Glass ;晶片玻璃板接合 )、TCP ( Tape Carrier Package ;捲帶式載體封裝）、或 是 FPC ( Flexible Printed Circuit ;軟性印刷電路版）等） 加以構成。用於對該顯示面板之電子零件裝配的裝置係由 在玻璃基板緣部黏著電子零件接著用之各向異性導電膜（ ACF: Anisotropic Conductive Film)的 ACF 黏貼部；介由 該各向異性導電膜搭載電子零件進行暫壓接的電子零件搭 載部；及利用在暫壓接狀態的電子零件及各向異性導電膜 施加熱與荷重進行熱壓接的電子零件壓接部等作業機構部 構成。 用於這樣的顯示面板組裝之電子零件裝配用之裝置， 一般而言以從小型到大型之尺寸不同的多品種基板爲對象 -5- 201105191 的泛用型爲多，上述作業機構部的配置或基板保持 移動行程係以預定的最大尺寸之基板爲基準加以設 —方面，在液晶模組之裝配設備中的電子零件 部係使用將搭載TAB或COG等構件之搭載頭等分 固定式旋轉頭進行裝配（例如，參照日本特開 2028 77號公報）》 因此，伴隨液晶面板尺寸的大型化，由於電子 壓接部的空間尺寸也是以預定的最大尺寸之基板爲 以設定，而逐漸大型化。 【發明內容】 在第9圖顯示用於上述之電子零件暫壓接部的 旋轉頭。液晶面板（基板）係必須在基板1 06之應 所間距運送移動而被搬送到固定式旋轉頭1 04的特 (可對位補正移動搭載的位置）。 爲此，（1)設備的處理速度係依存旋轉頭的 力。 又（2 )設備的必要區域係必須是成爲其設備 之最大基板尺寸的2倍以上。換言之，在基板的長 序並列搭載電子零件時，因爲旋轉頭爲固定的，想 必須移動基板β在第9圖中，當將基板的長邊側長 爲L時，基板106係爲了必須從第9圖的左方向朝 移動L的距離，設備的必要區域係必須確保有2 L公 (3)再者，在對於基板106的1邊配置複數 平台的 定。 暫壓接 配置之 2006- 零件暫 基準加 固定式 搭載場 定位置 搭載能 的對象 邊側依 當然爾 度暫定 右方向 L上。 個固定 -6 - 201105191 式旋轉頭104的情況，會有無法對應搭 〇 因此，本發明案的目的係爲提供可 作作業時間，一邊提升作爲設備的處理 配用之裝置（暫壓接用裝置），又提供 進行處理之電子零件裝配用之裝置，再 因應搭載作業之對象頭的選擇之電子元 爲了達成上述目的，本發明係針對 配電子零件之電子零件裝配用之裝置， 面板之複數個電子元件之電子元件供給 元件供給部所提供的電子元件，搭載在 載部；及從電子元件供給部取出電子元 移載至電子元件搭載部之移載部，其特 配置電子元件搭載部的基台爲定位固定 係對於應裝配電子元件之前述面板上的 移動之複數個搭載頭者。 換言之，將暫壓接部的單元構成分 、電子零件移載部、及電子零件搭載部 中，藉由可以在與面板（基板）處理邊 數個搭載頭，能夠謀求處理時間的縮短 根據本發明，可以一邊保持必要動 提升作爲設備的處理能力。 又可以利用最小空間進行處理。再 搭載作業之對象頭的選擇。 載間距變更的問題 以一邊保持必要動 能力之電子零件裝 可以利用最小空間 者，提供能夠達到 件裝配用之裝置。 在面板之特定處裝 具備：提供裝配在 部；定位由該電子 面板之電子元件搭 件並將該電子元件 徵爲：面板係對於 ，電子元件搭載部 處理邊具有可平行 爲電子零件供給部 。再者，在搭載部 的平行方向移動複 及省空間化。 作作業時間，一邊 者，能夠達到因應 201105191 【實施方式】 以下，根據圖面，針對本發明之實施形態加以說明。 〔實施例1〕 首先’在第1圖顯示對於面板（例如，液晶顯示面板 )1之電子零件（例如，COF (Chip on Film，覆晶薄膜的 簡稱）等）的裝配樣態。在同圖中，從上基板各自拉出面 板1之下基板的長邊及短邊各1邊，在此等下基板的長邊 側突出部la及短邊側突出部lb各自裝配複數個電子零件BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for assembling an electronic component, for example, an apparatus for assembling an electronic component for mounting a semiconductor device on a display panel such as a liquid crystal panel. [Prior Art] In the LCD industry, its market is expanding from PC to monitor in recent years. Along with this situation, the size of the liquid crystal panel (substrate) is also increased, and the price is required to be reduced. A display panel such as a liquid crystal panel is mounted on an edge of a glass substrate to mount electronic components for driving (for example, TAB (Tape Automated Bonding), COG (Chip On Glass), TCP (Paper Carrier) Package; tape carrier package), or FPC (Flexible Printed Circuit). The device for assembling the electronic component of the display panel is an ACF adhesive portion of an anisotropic conductive film (ACF) adhered to the edge of the glass substrate; the anisotropic conductive film is interposed An electronic component mounting portion that is equipped with an electronic component for temporary pressure bonding, and an operating mechanism portion such as an electronic component crimping portion that heat-compresses heat and load by using an electronic component and an anisotropic conductive film in a temporary pressure bonding state. The device for assembling an electronic component for the assembly of such a display panel is generally a general-purpose type of a multi-type substrate having a small size to a large size, and the general-purpose type of the above-mentioned operation mechanism is In the electronic component part of the mounting apparatus of the liquid crystal module, the mounting head of the mounting module of the liquid crystal module is divided into fixed rotating heads by means of a mounting head such as TAB or COG. In the case of the enlargement of the size of the liquid crystal panel, the size of the electronic crimping portion is also set to be larger than the predetermined maximum size of the substrate. SUMMARY OF THE INVENTION A rotary head for use in the above-described electronic component temporary pressure bonding portion is shown in FIG. The liquid crystal panel (substrate) must be transported to the fixed rotating head 104 at the pitch of the substrate 106, and transported to the fixed rotary head 104 (position that can be aligned and moved). To this end, (1) the processing speed of the device depends on the force of the rotating head. (2) The necessary area of the device must be more than twice the maximum substrate size of the device. In other words, when the electronic component is mounted in parallel in the long order of the substrate, the rotating head is fixed, and it is necessary to move the substrate β. In the ninth figure, when the long side of the substrate is L, the substrate 106 is required to be In the left direction of the figure, the distance to the movement L is required, and the necessary area of the device must be 2 L (3), and a plurality of platforms are arranged on one side of the substrate 106. Temporary pressure connection Configuration 2006- Part temporary reference plus fixed Mounting position Fixed position The object to be mounted is side-by-side, and the right side is tentatively set to the right direction L. In the case of the fixed -6 - 201105191 type rotary head 104, there is a possibility that the lap can not be matched. Therefore, the object of the present invention is to provide a device that can be used as a processing for the equipment while being used as a working time (temporary pressure receiving device) In order to achieve the above object, the present invention relates to a device for assembling an electronic component for an electronic component, and a plurality of panels for providing an electronic component for processing. The electronic component supplied from the electronic component supply component supply unit of the electronic component is mounted on the carrier portion, and the electronic component is taken out from the electronic component supply unit to the transfer portion of the electronic component mounting portion, and the base of the electronic component mounting portion is disposed. The table is a plurality of mounting heads for positioning and fixing the movement on the aforementioned panel to which the electronic component is to be mounted. In other words, in the unit configuration part of the temporary pressure bonding portion, the electronic component transfer portion, and the electronic component mounting portion, the mounting head can be mounted on the panel (substrate), and the processing time can be shortened. It is possible to maintain the necessary movement as the processing capability of the equipment. It is also possible to process with a minimum space. Then select the target of the job. Problems with the change of the load capacity The electronic parts that maintain the necessary dynamic capacity can be used to assemble the parts that can be used with the smallest space. At a specific place of the panel, there is provided: an assembly is provided; an electronic component of the electronic panel is positioned and the electronic component is classified as: a panel is provided, and the processing edge of the electronic component mounting portion is parallelizable to the electronic component supply portion. Furthermore, the movement in the parallel direction of the mounting portion is more space-saving. In the case of the work time, one can achieve the response 201105191. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. [Embodiment 1] First, an assembly state of an electronic component (for example, COF (Chip on Film) or the like) of a panel (for example, a liquid crystal display panel) 1 is shown in Fig. 1 . In the same figure, each of the long side and the short side of the lower substrate of the panel 1 is pulled out from the upper substrate, and the plurality of electrons are assembled on the long side protrusion 1a and the short side protrusion lb of the lower substrate. Components
其中，無論電子零件2爲COF或是TAB、TCP、FPC 的任一種，該電子零件2都是使用ACF (各向異性導電膜 )電氣連接形成在面板1之下基板的突出部la或是lb的 電極、與電子零件2側的電極之方式加以裝配。該ACF ( 未圖示）係由使導電粒子均勻分散在黏結劑樹脂者構成， 形成介由導電粒子電氣連接電子零件2側的電極與面扳1 側的電極。又黏結劑樹脂係由熱硬化型接著劑構成，在加 熱電子零件2下藉由對面板1進行加壓，而形成熱壓接。 但是，在裝配工程中，將電子零件2定位在預先黏貼ACF 的面板1之狀態下使其接合，在達到一次暫壓接後，以加 熱到黏結劑樹脂的硬化溫度以上之狀態下，藉由作用加壓 力而形成真壓接。 如以上所示，在面板1裝配電子零件2係由首先在該 -8 - 201105191 面板1的特定位置黏貼ACF之ACF黏貼工程；裝配電子 零件2，進行暫壓接之暫壓接工程；及真壓接工程構成。 再者，在此等各工程間爲了搬送面板1，面板1係利用面 板搬送手段（未圖示）加以搬送。 根據本發明之電子零件裝配用之裝置係爲實行該暫壓 接工程者。 首先，在第2圖顯示以本實施例說明的電子零件裝配 用之裝置200，在第3圖顯示其平面圖。 如第2圖所示，就電子零件裝配用之裝置200之主要 構成而言，係具備：用以保持電子零件（在此係以搭載在 COF之電子零件爲例加以說明。）的同時並取出其之電子 零件供給部4;將電子零件暫壓接在面板1之電子零件搭 載部7a、7b ;及用以搬送電子零件至搭載頭部之電子零件 移載部6 a、6 b。 再者，使用第3圖，針對各構成部的詳細加以說明。 其中，分爲左右加以配置的構件，例如，使COF捲軸3a 、3b或拔起式模型5a、5b各自分爲左右加以配置係爲了 防止COF捲軸交換時的設備停止。因此，在以下的說明 中，係以在圖面右方（符號的添附字a)圖示的部份爲中 心進行說明者。 電子零件供給部4係具備：捲繞在帶狀物上搭載複數 個電子零件15的COF之COF捲軸3a ;用以穿孔取出帶 狀物上的電子零件之拔起式模型5a;用以吸附取出的電子 零件並搬送到特定位置之直行型電子零件取出器11;及將 -9 - 201105191 該直行型電子零件取出器朝X方向移動之電子零件搬送機 構（X方向）13與朝Y方向移動之電子零件搬送機構（Y 方向）14。 又’將取出的電子零件依序配列爲特定的數目（在此 爲顯示16個的情況），用以進行彙集之電子零件彙集托 盤1 6係設置在電子零件供給部4的附近。 又’該電子零件彙集托盤16係具有吸附機能而被固 定。 電子零件移載部6a係具備：具備用以依序1個1個 取出配列在電子零件_集托盤16的電子零件15之吸附頭 的電子零件拾取器17a;及使該電子零件15的接著面與其 相反側面翻轉，再將電子零件移動載置到電子零件搭載部 7a的移載部本體18a。 移載部本體18a係因應電子零件搭載部7a的位置而 在電子零件移載部用軸19上順著與面板1之搭載電子零 件的處理邊平行的X方向移動。 電子零件搭載部7a係由用以將電子零件15暫壓接並 搭載在面板1的處理邊（例如，以第1圖所示之1 a )之搭 載頭9;及設置該搭載頭9，用以朝特定方向移動之搭載 滑件8 a構成。 搭載滑件8a係具備能夠在搭載滑件用軸20上朝X方 向移動的機構。 又在電子零件搭載部7a係設置用以檢測各自設置在 電子零件1 5與面板1之位置檢測用的對位標記之電子零 -10- 201105191 件•面板用對位攝影機l〇a。 其次，說明各構成部的動作。 首先，爲了取出形成在C OF捲軸之複數個電子零件 ，使拔起式模型5a上昇，另一方面使直行型零件取出器 11下降。使直行型零件取出器11收受被拔起的電子零件 ，開始上昇。其後，使用電子零件搬送機構（X方向）13 及電子零件搬送機構（Y方向）14移動到特定位置，將電 子零件15搬送到電子零件彙集托盤16，在特定位置依序 配列電子零件1 5。 在第3圖中，在電子零件彙集托盤16中係配列16個 電子零件。又在此所示的個數爲16個係因爲搭載在構成 本裝置之對象的面板周邊部之電子零件通常被配列爲最大 16個。 其次，利用電子零件拾取器1 7a，將配列在電子零件 彙集托盤16之電子零件1個1個吸附拿起。將支撐該電 子零件拾取器的臂部份進行180旋轉，使電子零件15的 表裏翻轉而將電子零件15移載到電子零件搭載部7a。又 藉由將臂部份進行180度旋轉，使電子零件15的電極與 面板側的電極對向而成爲可相互壓接的方式翻轉電子零件 15。 具備該電子零件拾取器的電子零件移載部6a係以將 電子零件15傳遞到電子零件搭載部7a的方式在電子零件 移載部用軸19上移動到適當的位置。 又電子零件移載部6a與電子零件搭載部7a的位置關 -11 - 201105191 係之控制，係利用控制裝置（未圖示）加以進行。 收受電子零件1 5的電子零件搭載部7a係使電子零件 15移動到暫壓接電子零件15之面板1周邊部（處理邊） 的預定區域。該移動係藉由在電子零件搭載部用軸20上 移動搭載滑件8a加以進行。電子零件搭載部7&係對於面 板1的處理邊爲平行移動。 電子零件1 5之對面板1的裝配係必須在正確定位的 狀態下加以進行。換言之，必須以設置在電子零件1 5的 電極與面板1側的電極正確一致的方式進行暫壓接。爲此 ，在電子零件15與面板1中係各自設置位置檢測用之對 位標記（未圖示），以使此等對位標記相互一致的的方式 進行裝配。爲了使該對位標記一致，設置電子零件•面板 用對位攝影機作爲對位標記檢測手段。根據利用該對位攝 影機所取得之畫像檢測相互的位置偏移。再者，當在電子 零件與面板之間有位置偏移時，進行其位置補正。在本實 施例中係設置左右2台攝影機。 如此一來，當結束電子零件1 5與面板1的對位時’ 將特定的加壓力作用在電子零件，藉此進行電子零件15 之對面板1的暫壓接。 此時，在本實施例中，搭載頭9係設定爲約60〜100 度範圍的期許溫度，又加壓的壓力係設定爲20〜98N (牛 頓）範圍的期許壓力。 關於上述搭載頭9，係因應搭載的電子零件或面板尺 寸等，而可以選擇設置在搭載滑件8a上的搭載頭種類° -12- 201105191 又搭載間距也可以利用調整搭載滑件8 a的移動量加以進 行。 又如上述所示，在說明的方便性上，關於左右成對的 構成部份雖然是以一方（圖面的右方）爲主體加以說明， 但是構成部份的左方（符號之添附字b)之動作也與右方 相同。 又相互的構成部份之動作關係則是藉由控制裝置（未 圖示）加以控制。例如，設置2台電子零件搭載部7a、7b 。對於各自的搭載頭將電子零件·面板用對位攝影機以2 台爲1組設置在搭載頭的左右。電子零件搭載部7a、7b 的相互動作關係則藉由上述的控制裝置加以控制。 又，搭載頭等各構成部份雖然是使用複數個的情況加 以說明，但是即使是單一個也可以。 將以上的動作依序反覆進行，將特定數的電子零件裝 配在面板1周邊部。其後，面板1係被搬送到下個工程， 在加熱下藉由加壓，也就是藉由進行真壓接，將電子零件 1 5固定在面板1。 又在本實施例中，在面板1中，雖然顯示在以第1圖 所示之長邊側1 a與短邊側1 b都是裝配相同樣式的電子零 件之情況，但是搭載不同樣式的電子零件亦可。 由以上所述，根據本實施例，可以期待以下的效果。 1)首先，面板1的位置係被固定。一方面，具備用 以暫壓接電子零件15的搭載頭之電子零件搭載部7a、7b 係對於面板1的處理邊爲平行移動。藉此，因爲面板1不 -13- 201105191 必移動，因此，不會如第9圖所示使面板移動其周邊 約2倍距離，至少可以使裝置的橫方向（X方向）成 約面板的周邊長長度，謀求裝置的小型化。 2 )因爲電子零件搭載部7a、7b的暫壓接作業係 子零件1 5的供給作業律動，因此電子零件搭載部72 之暫壓接的作業時間係能夠利用電子零件搭載部7a 的處理速度決定，謀求裝置的高速處理化。 3) 又，當對於一個面板結束暫壓接時，其面板 送到下個工程之真壓接工程。一方面，使重新進行暫 的面板從上流側的工程移送過來。在該移送期間，能 行從電子零件供給部4將電子零件1 5配列在電子零 集托盤16的作業。藉此，因爲可以與移送面板1的 時間（dead-time)獨立進行作業，因此，在面板移送 不必停止電子零件供給作業而造成待機，謀求裝置的 化》 4) 可以達到因應搭載作業之對象頭的選擇。 〔實施例2〕 在本實施例中，以與實施例1不同的部份爲中心 各構成部份與其動作加以說明。 在第4圖顯示以本實施例說明的電子零件裝配用 置201的立體圖，第5圖顯不其平面圖。 如第4圖所示，就電子零件裝配用之裝置201的 構成而言，係具備：用以保持電子零件（在此係以搭 長的 爲大 與電 、7b ' 7b 係移 壓接 夠進 件彙 空檔 時， 高速 針對 之裝 主要 載在 -14- 201105191 COF之電子零件爲例加以說明。）的同時並取出其之電子 零件供給部4;將電子零件暫壓接在面板丨之電子零件搭 載部7 a、7b ;及用以總括搬送電子零件至搭載頭部之電子 零件總括移載部3 3。 再者，使用第5圖，針對各構成部的詳細加以闡述《 首先，說明電子零件供給部4之電子零件的取出機構 。電子零件的取出部份係利用3等分旋轉式電子零件取出 部31加以構成。利用拔起式模型5 a拔起的電子零件j 5 係利用3等分旋轉式電子零件取出部3 1被吸附取出。3等 分旋轉式電子零件取出部31係具有3個電子零件取出器 3 〇，依序吸附取出電子零件1 5，配列在電子零件彙集托盤 16。此時’電子零件彙集托盤16係可朝X方向與γ方向 移動，根據該移動，能夠在電子零件彙集托盤16將電子 零件1 5依序配列於適當的位置。又配列在電子零件彙集 托盤16的電子零件個數係爲16個。該個數係與以實施例 1說明的內容相同。 其次，電子零件移載部6係利用設置在電子零件總括 移載部3 3的吸附頭，吸附拿起配列在電子零件彙集托盤 16的電子零件15。在本實施例中，因爲設置8個吸附頭 3 2，因此從電子零件彙集托盤1 6總括吸附8個電子零件 15 ° 電子零件總括移載部3 3係藉由朝Y方向移動，可以 將吸附在吸附頭3 2的電子零件1 5移動到電子零件搭載部 7 a ° 15· 201105191 在搭載滑件8a中，係設置電子零件暫置台35，在此 總括搬送吸附在吸附頭3 2的8個電子零件1 5，從吸附頭 32移載到電子零件暫置台35。 搭載滑件8a係進一步具有電子零件拾取器38，藉此 ，依序拾取配列在電子零件暫置台35的8個電子零件15 。使被拾取的電子零件15朝Y方向移動，並在移動途中 翻轉，拿到搭載頭9的期許位置。 搭載滑件8 a係在電子零件移載用軸3 7上朝與搭載電 子零件的面板周邊部平行的X方向移動。 又搭載頭9係在本實施例中成爲旋轉式，設置2台頭 部。利用電子零件拾取器3 8所拾取的電子零件係首先傳 遞到旋轉過來的頭部9x。該電子零件1 5係藉由將頭部9x 以1 8 0度旋轉到位於旋轉前的位置之頭部9y的位置，而 移動到面板周邊部之暫壓接電子零件的位置。 關於上述搭載頭9，係與實施例1相同，因應搭載的 電子零件或面板尺寸等，能夠選擇設置在搭載滑件8a上 的搭載頭種類。 關於上述以後的工程，電子零件與面板的對位、或暫 壓接作業及朝其後之真壓接的移行等，係與實施例1的情 況相同。 又各構成部分之相互的動作關係則與實施例1相同由 控制裝置加以控制。 從以上闡述，根據本實施例，可以期待其次的效果。 1)藉由具有3等分旋轉式電子零件取出部31，可以 -16- 201105191 縮短將電子零件1 5配列在電子零件彙集托盤1 6的作業時 間。 2 )利用設置在電子零件總括移載部3 3的8個吸附頭 32，因爲能夠總括移動多個電子零件，可以縮短朝電子零 件搭載部7 a側之每1個電子零件的移動時間。 3) 因爲可以在電子零件暫置台35暫置複數個（在此 爲8個）電子零件，可以防止造成電子零件之供給等待的 空檔時間，而能夠將暫壓接作業高速化。 4) 因爲在本實施例中面板也不用移動，裝置的小型 化係與實施例1相同。 5) 可以達到因應搭載作業之對象頭的選擇。 〔實施例3〕 在本實施例中，以與實施例1不同的部份爲中心針對 各構成部份與其動作加以說明。 在第6圖顯示以本實施例說明的電子零件裝配用之裝 置202的立體圖，第7圖顯示其平面圖。 如第6圖所示，就電子零件裝配用之裝置2 02的主要 構成而言，係具備：用以保持電子零件（在此係以搭載在 COF之電子零件爲例加以說明。）的同時並取出其之電子 零件供給部4;將電子零件暫壓接在面板1之電子零件搭 載部；及用以搬送電子零件至搭載頭部之電子零件移載部 (1) 43¾ (2) 44° 再者，使用第7圖，針對各構成部的詳細加以闡述。 -17- 201105191 在以本實施例所示的電子零件供給部4中，其特徵爲 具備2個拔起式模式42a及4個吸附頭40。 首先，說明電子零件供給部4之電子零件的取出機構 。利用2個拔起式模型，從COF —次拔出2個電子零 件1 5。拔出時之模型42a與電子零件取出動作係與實施例 1時相同。被拔出的2個電子零件利用4個吸附頭40加以 吸附，再者，藉由其次的模型42a與電子零件取出動作， 拔出2個電子零件，並利用4個吸附頭40加以吸附。此 時’在最初的吸附作業中，4個吸附頭40係針對2個拔起 式模型42a (配列在圖面右側的模型）中，吸附內側（圖 面上側）與前側（圖面下側）的2個，接著，在其次的吸 附作業中，4個吸附頭40係針對2個拔起式模型42b (配 列在圖面左側的模型）中，吸附內側（圖面上側）與前側 (圖面下側）的2個，吸附保持合計4個。 其次，在電子零件移載部（1) 43中，利用安裝在穿 梭器46b的電子零件拾取器45b，將利用最初作業吸附保 持之內側的電子零件與利用其次作業吸附之內側的電子零 件移載到穿梭器46b。一方面，在電子零件移載部（2) 44 中，利用安裝在穿梭器46a的電子零件拾取器45a，將利 用最初作業吸附保持之前側的電子零件與利用其次作業吸 附之則側的電子零件移載到穿梭器4 6 a。在電子零件搭載 部7a中係設置暫置台47，在此配列先前的2個電子零件 15° 保持在電子零件拾取器45a的2個電子零件15係利 -18- 201105191 用穿梭器46a朝Y方向移動，移載到電子零件搭載部7a 。此時’穿梭器46a係可以在電子零件移載用軸48上朝 X方向移動。因此，因應電子零件搭載部7a的位置，穿 梭器4 6 a係可以移動到該位置。 又’電子零件搭載部7a係可以在電子零件搭載部用 軸49上朝X方向移動》 關於上述以後的工程，電子零件與面板的對位、或暫 壓接作業及朝其後之真壓接的移行等，係與實施例i的情 況相同。 關於上述搭載頭9，係與實施例1相同，因應搭載的 電子零件或面板尺寸等，能夠選擇設置在搭載滑件8a上 的搭載頭種類。 又各構成部分之相互的動作關係則與實施例1相同由 控制裝置加以控制。 從以上闡述，根據本實施例，可以期待其次的效果。 1 )藉由具有2個拔起式模型42a及4個吸附頭40， 因爲可以總括取出複數個電子零件15，再移載，能夠縮短 作業時間。 2) 因爲穿梭器與搭載滑件可以各自獨立朝X方向移 動，能夠縮短相互間之電子零件傳遞的作業時間。 3) 因爲在本實施例中面板也不用移動，裝置的小型 化係與實施例1相同。 4 )可以達到因應搭載作業之對象頭的選擇。 -19- 201105191 〔實施例4〕 在本實施例中，以與實施例1不同的部份爲中心針對 各構成部份與其動作加以說明。 在第8圖顯示以本實施例說明的電子零件裝配用之裝 置203的平面圖。 在以本實施例所示之電子零件供給部4中，係具備拔 起式模型42a及2個吸附頭50 * 首先，說明電子零件供給部4之電子零件的取出機構 。利用拔起式模型42a，從COF拔出1個電子零件15。拔 出時之模型42 a與電子零件取出動作係與實施例1時相同 。被拔出的1個電子零件利用2個吸附頭50加以吸附， 再者，藉由其次的模型42a與電子零件取出動作，拔出1 個電子零件，並利用2個吸附頭50加以吸附。 又在本實施例中，拔起式模型42a雖然以拔起1個爲 例，但是也可以設置1個以上之複數個對應的裝置。 本實施例係將利用2個吸附頭5 0所吸附的電子零件 1 5移載到電子零件移載部6a之手段與實施例3不同。換 言之，在本實施例中，2個吸附頭5 0係可以在電子零件移 載部（Y方向）52a、b上移動，電子零件移載部52a、b 係可以在電子零件移載部（X方向）51上移動。 利用該機構，可以將利用2個吸附頭50所吸附保持 的電子零件傳遞到電子零件拾取器5 3 a，利用穿梭器54a ，可以將藉由電子零件拾取器5 3 a所吸附保持的電子零件 15移載到電子零件搭載部7a。針對電子零件拾取器53b -20- 201105191 或穿梭器5 4b，也與電子零件拾取器53a或穿梭器54a等 相同。 又，電子零件移載部（Y方向）52 a與電子零件移載 部（Y方向）b係在不會相互干擾的條件下開始動作，雙 方係交互進行取出動作。 關於上述以後的工程，電子零件與面板的對位、或暫 壓接作業及朝其後之真壓接的移行等，係與實施例1的情 況相同。 關於上述搭載頭9，係與實施例1相同，因應搭載的 電子零件或面板尺寸等，能夠選擇設置在搭載滑件8 a上 的搭載頭種類。 又各構成部分之相互的動作關係則與實施例1相同由 控制裝置加以控制。 從以上闡述，根據本實施例，可以期待其次的效果。 1) 因爲使電子零件移載部（Y方向）5 2a與電子零件 移載部（Y方向）5 2b也可以朝電子零件移載部（X方向 )51的方向移動，藉此因爲可以因應電子零件移載部6a 、6b的X方向移動加以移動，能夠縮短電子零件移載部 (Y方向）52a與電子零件移載部（Y方向）5 2b與電子零 件搭載部之間的電子零件傳遞作業時間。 2) 因爲使電子零件移載部（Y方向）5 2a與電子零件 移載部（Y方向）5 2b交互動作，取出電子零件，可以縮 短電子零件之每一個的作業時間。 3) 因爲在本實施例中面板也不用移動，裝置的小型 -21 - 201105191 化係與實施例1相同。 4)可以達到因應搭載作業之對象頭的選擇》 【圖式簡單說明】 第1圖係爲顯示已搭載電子零件之面板的平面圖》 第2圖係爲以實施例1所示之電子零件裝配用之裝置 的立體圖。 第3圖係爲以實施例1所示之電子零件裝配用之裝置 的平面圖。 第4圖係爲以實施例2所示之電子零件裝配用之裝置 的立體圖。 第5圖係爲以實施例2所示之電子零件裝配用之裝置 的平面圖。 第6圖係爲以實施例3所示之電子零件裝配用之裝置 的立體圖》 第7圖係爲以實施例3所示之電子零件裝配用之裝置 的平面圖。 第8圖係爲以實施例4所示之電子零件裝配用之裝置 的平面圖。 第9圖係爲習知之固定式旋轉頭的平面圖。 【主要元件符號說明】 1 :面板 1 a :長邊側 -22- 201105191 1 b :短邊側 2 :電子零件 3a、 3b: COF 捲軸 4 :電子零件供給部 5a、5b :拔起式模型 6a、6b :電子零件移載部 7a、7b :電子零件搭載部 8a、8b :搭載滑件 9、9x、9y :搭載頭 10a、10b :電子零件•面板用對位攝影機 11 :直行型電子零件取出器 12:直行型電子零件取出器部 13:電子零件搬送機構（X方向） 14:電子零件搬送機構（Y方向） 1 5 :電子零件 16:電子零件彙集托盤16 17a、17b :電子零件拾取器 18a、18b :移載部本體 19:電子零件移載部用軸 20 :搭載滑件用軸 30:電子零件取出器 31 : 3等分旋轉式電子零件取出部 3 2 :吸附頭 3 3 :電子零件總括移載部 -23- 201105191 3 4 :移載部本體 3 5 :電子零件暫置台 3 6 :旋轉台 37 =電子零件移載部用軸 3 8 :電子零件拾取器' 4 0 : 4個吸附頭 4 1 :直行型電子零件取出部 42a、b : 2個拔起式模型 43 :電子零件移載部（1 ) 44 :電子零件移載部（2 ) 45a、b :電子零件拾取器 46a、b :穿梭器 47 :暫置台 48 :電子零件移載部用軸 49 :搭載滑件用軸 5 0 : 2個吸附頭 51:電子零件移載部（X方向） 52:電子零件移載部（Y方向） 53a、b :電子零件拾取器 54a、b :穿梭器 55a、b:電子零件暫置台 100:暫壓接單元之上流單元 101 :暫壓接單元 102 :暫壓接單二之下流單元 -24- 201105191 104 :固定式旋轉頭 105 :搭載頭 106 :初期位置的面板 107 :移動後的面板 108 :面板支撐材 200 :以實施例1所示之電子零件裝配用之裝置的立 體圖 201:以實施例2所示之電子零件裝配用之裝置的立 體圖 2 02 :以實施例3所示之電子零件裝配用之裝置的立 體圖。 -25-Wherein, the electronic component 2 is any one of COF or TAB, TCP, FPC, and the electronic component 2 is electrically connected to the protrusion 1a or lb of the substrate formed under the panel 1 by using ACF (anisotropic conductive film). The electrode is assembled to the electrode on the side of the electronic component 2. The ACF (not shown) is composed of a conductive resin uniformly dispersed in a binder resin, and an electrode electrically connected to the side of the electronic component 2 via the conductive particles and an electrode on the side of the face plate 1 are formed. Further, the binder resin is composed of a thermosetting adhesive, and the panel 1 is pressurized under the heating electronic component 2 to form a thermocompression bonding. However, in the assembly process, the electronic component 2 is positioned in a state in which the panel 1 of the ACF is preliminarily bonded, and after being subjected to a temporary pressure bonding, it is heated to a temperature higher than the hardening temperature of the binder resin. The action adds pressure to form a true crimp. As shown above, the mounting of the electronic component 2 on the panel 1 is performed by first attaching the ACF adhesive work of the ACF at the specific position of the panel 1 of the -8 - 201105191; assembling the electronic component 2, temporarily pressing the temporary crimping work; The crimping process consists of. Further, in order to transport the panel 1 in each of these projects, the panel 1 is transported by a panel transport means (not shown). The apparatus for assembling an electronic component according to the present invention is a person who performs the temporary crimping work. First, a device 200 for mounting an electronic component described in the present embodiment is shown in Fig. 2, and a plan view thereof is shown in Fig. 3. As shown in FIG. 2, the main configuration of the apparatus 200 for assembling an electronic component includes: taking an electronic component (here, an electronic component mounted on the COF as an example) The electronic component supply unit 4; the electronic component mounting portions 7a and 7b for temporarily charging the electronic components to the panel 1; and the electronic component transfer units 6a and 6b for transporting the electronic components to the mounting head. In addition, the details of each component will be described using FIG. Here, the members are arranged in a left-right direction. For example, the COF reels 3a and 3b or the pull-up models 5a and 5b are arranged in a left-right direction to prevent the device from being stopped when the COF reel is exchanged. Therefore, in the following description, the part illustrated on the right side of the drawing (the attached word a of the symbol) is described as a center. The electronic component supply unit 4 includes a COF reel 3a that winds a COF on which a plurality of electronic components 15 are mounted on a ribbon, and a pull-up model 5a for punching out the electronic components on the ribbon; The electronic component is transported to the straight-line type electronic component extractor 11 at a specific position; and the electronic component transport mechanism (X direction) 13 that moves the straight-type electronic component extractor in the X direction from -9 to 201105191 and moves in the Y direction Electronic parts transport mechanism (Y direction) 14. Further, the electronic components to be taken out are sequentially arranged in a specific number (in the case where 16 are displayed here), and the electronic component collection trays 16 for collection are provided in the vicinity of the electronic component supply unit 4. Further, the electronic component collecting tray 16 is fixed by an adsorption function. The electronic component transfer unit 6a includes an electronic component pick-up device 17a for picking up the adsorption heads of the electronic component 15 arranged in the electronic component_set tray 16 one by one, and a bonding surface for the electronic component 15 The opposite side is turned over, and the electronic component is moved and placed on the transfer unit main body 18a of the electronic component mounting portion 7a. The transfer unit main body 18a moves in the X direction parallel to the processing side of the panel 1 on which the electronic component is mounted, in accordance with the position of the electronic component mounting portion 7a on the electronic component transfer portion shaft 19. The electronic component mounting portion 7a is a mounting head 9 for temporarily pressing the electronic component 15 and mounting it on the processing side of the panel 1 (for example, 1 a shown in FIG. 1); and the mounting head 9 is provided. It is configured by a mounting slider 8a that moves in a specific direction. The mounting slider 8a is provided with a mechanism that can move in the X direction on the mounting shaft 20 for the slider. Further, the electronic component mounting portion 7a is provided with an electronic zero -10-201105191 piece panel registration camera for detecting the positional marks for the position detection of the electronic component 15 and the panel 1. Next, the operation of each component will be described. First, in order to take out a plurality of electronic parts formed on the COF reel, the pull-up type 5a is raised, and on the other hand, the straight type part extractor 11 is lowered. The straight-type component extractor 11 receives the picked-up electronic component and starts to rise. Thereafter, the electronic component transport mechanism (X direction) 13 and the electronic component transport mechanism (Y direction) 14 are moved to a specific position, and the electronic component 15 is transported to the electronic component collection tray 16 to sequentially arrange the electronic components at a specific position. . In Fig. 3, 16 electronic components are arranged in the electronic component collection tray 16. In addition, the number of the electronic components shown in the peripheral portion of the panel which is the object of the device is usually 16 in the maximum. Next, the electronic component pick-up unit 17a is used to pick up one of the electronic components arranged in the electronic component collecting tray 16. The arm portion supporting the electronic component pickup is rotated 180, and the surface of the electronic component 15 is reversed to transfer the electronic component 15 to the electronic component mounting portion 7a. Further, by rotating the arm portion by 180 degrees, the electrode of the electronic component 15 is opposed to the electrode on the panel side, and the electronic component 15 is turned over so as to be press-contactable with each other. The electronic component transfer unit 6a including the electronic component pickup is moved to an appropriate position on the electronic component transfer portion shaft 19 so that the electronic component 15 is transferred to the electronic component mounting portion 7a. Further, the electronic component transfer unit 6a and the position control of the electronic component mounting portion 7a are controlled by a control device (not shown). The electronic component mounting portion 7a that receives the electronic component 15 moves the electronic component 15 to a predetermined region of the peripheral portion (processing side) of the panel 1 of the temporary electronic component 15 . This movement is performed by moving the mounting slider 8a on the electronic component mounting portion shaft 20. The electronic component mounting portion 7& is parallel to the processing side of the panel 1. The assembly of the panel 1 of the electronic component 15 must be carried out in the correct positioning state. In other words, it is necessary to perform temporary pressure bonding in such a manner that the electrodes provided on the electronic component 15 and the electrodes on the panel 1 side are correctly aligned. For this purpose, alignment marks (not shown) for position detection are provided in the electronic component 15 and the panel 1, respectively, so that the alignment marks are aligned with each other. In order to make the alignment mark coincide, the electronic camera and the panel are equipped with a registration camera as a registration detecting means. The mutual positional deviation is detected based on the image obtained by the alignment camera. Furthermore, when there is a positional shift between the electronic component and the panel, the position is corrected. In the present embodiment, two cameras are provided on the left and right. In this manner, when the alignment of the electronic component 15 and the panel 1 is completed, a specific pressing force is applied to the electronic component, whereby the temporary pressing of the panel 1 of the electronic component 15 is performed. At this time, in the present embodiment, the mounting head 9 is set to a predetermined temperature in the range of about 60 to 100 degrees, and the pressure to be pressurized is set to a predetermined pressure in the range of 20 to 98 N (Newton). In the above-described mounting heads 9, the type of the mounting head that can be mounted on the mounting slider 8a can be selected depending on the size of the electronic component or the panel to be mounted. -12- 201105191 The pitch can also be adjusted by adjusting the movement of the mounting slider 8a. The amount is carried out. Further, as described above, in terms of convenience of description, the left and right paired components are mainly described as one side (the right side of the drawing), but the left side of the constituent part (the added word of the symbol b) The action is also the same as the right side. The operational relationship of the mutual components is controlled by a control device (not shown). For example, two electronic component mounting portions 7a and 7b are provided. For each of the mounting heads, the electronic camera and the panel alignment camera are set to the left and right of the mounting head in two sets. The mutual operational relationship between the electronic component mounting portions 7a and 7b is controlled by the above-described control device. Further, although the components such as the first-class components are used in a plurality of cases, they may be used in a single one. The above operations are sequentially performed in reverse, and a specific number of electronic components are mounted on the peripheral portion of the panel 1. Thereafter, the panel 1 is transported to the next project, and the electronic component 15 is fixed to the panel 1 by pressurization under heating, that is, by performing true pressure bonding. Further, in the present embodiment, in the case of the panel 1, the electronic components of the same pattern are attached to the long side 1 a and the short side 1 b shown in Fig. 1, but different types of electrons are mounted. Parts are also available. As described above, according to the present embodiment, the following effects can be expected. 1) First, the position of the panel 1 is fixed. On the other hand, the electronic component mounting portions 7a and 7b having the mounting head for temporarily pressing the electronic component 15 are moved in parallel with respect to the processing side of the panel 1. Therefore, since the panel 1 does not move from -13 to 201105191, the panel is not moved about twice its distance as shown in Fig. 9, and at least the lateral direction (X direction) of the device can be made to be about the perimeter of the panel. The length is required to miniaturize the device. 2) Since the supply operation of the electronic component mounting portions 7a and 7b is performed by the charging operation of the sub-assembly 15, the working time of the electronic component mounting portion 72 can be determined by the processing speed of the electronic component mounting portion 7a. In order to achieve high-speed processing of the device. 3) Also, when the temporary pressure connection is completed for one panel, the panel is sent to the real crimping project of the next project. On the one hand, the reopening panel is transferred from the upstream side of the project. During the transfer, it is possible to arrange the electronic component 15 from the electronic component supply unit 4 in the electronic zero tray 16 . In this way, since the work can be performed independently of the time (dead-time) of the transfer panel 1, it is possible to wait for the electronic component supply operation without stopping the electronic component supply operation, and to realize the device. s Choice. [Embodiment 2] In this embodiment, the components which are different from the first embodiment will be described with respect to the respective components and their operations. Fig. 4 is a perspective view showing the electronic component mounting unit 201 described in the embodiment, and Fig. 5 is a plan view thereof. As shown in Fig. 4, the configuration of the device 201 for assembling an electronic component is provided to hold the electronic component (here, the length of the device is large and electric, and the 7b '7b system is moved and connected. In the case of the free space, the high-speed electronic components that are mainly contained in the -14-201105191 COF are explained as an example.) At the same time, the electronic component supply unit 4 is taken out; the electronic components are temporarily pressed to the electronic components of the panel. The component mounting portions 7 a and 7 b and the electronic component collective transfer portion 33 for collectively transporting the electronic components to the mounting head. In addition, the details of the respective components will be described with reference to Fig. 5. First, the take-out mechanism of the electronic component of the electronic component supply unit 4 will be described. The taken-out portion of the electronic component is constituted by a three-part rotating electronic component take-out portion 31. The electronic component j 5 pulled up by the pull-up type model 5 a is sucked and taken out by the three-part rotating electronic component take-out portion 31. The three-part rotary electronic component take-out unit 31 has three electronic component extractors 3, and sequentially picks up and takes out the electronic components 15 and arranges them in the electronic component collection tray 16. At this time, the electronic component collection tray 16 is movable in the X direction and the γ direction, and according to this movement, the electronic component 15 can be sequentially arranged in an appropriate position on the electronic component collection tray 16. Further, the number of electronic components arranged in the electronic component collection tray 16 is 16. This number is the same as that described in the first embodiment. Next, the electronic component transfer unit 6 picks up and picks up the electronic component 15 arranged in the electronic component collection tray 16 by the adsorption head provided in the electronic component collective transfer unit 33. In the present embodiment, since eight adsorption heads 32 are provided, eight electronic components are collectively adsorbed from the electronic component collection tray 16. The electronic component assembly transfer unit 3 3 is moved in the Y direction to be adsorbed. The electronic component 15 of the adsorption head 32 moves to the electronic component mounting portion 7 a 15 15 201105191 In the mounting slider 8a, the electronic component temporary table 35 is provided, and the eight adsorption and adsorption heads 32 are collectively transported. The electronic component 15 is transferred from the adsorption head 32 to the electronic component temporary stage 35. The mounting slider 8a further includes an electronic component picker 38, whereby the eight electronic components 15 arranged in the electronic component mounting table 35 are sequentially picked up. The picked-up electronic component 15 is moved in the Y direction, and is turned over during the movement to obtain the desired position of the mounting head 9. The mounting slider 8a is moved in the X direction parallel to the peripheral portion of the panel on which the electronic component is mounted, on the electronic component transfer shaft 37. Further, in the present embodiment, the head 9 is provided in a rotary type, and two heads are provided. The electronic parts picked up by the electronic part picker 38 are first transferred to the rotated head 9x. The electronic component 15 is moved to a position where the head portion of the panel is temporarily pressed to the electronic component by rotating the head portion 9x at a position of 180 degrees to a position 9y at a position before the rotation. In the same manner as in the first embodiment, the mounting head 9 can be selected from the type of the mounting head provided on the mounting slider 8a in accordance with the electronic component or the panel size to be mounted. Regarding the above-described subsequent work, the alignment of the electronic component and the panel, or the temporary pressure bonding operation, and the transition to the subsequent true pressure bonding are the same as those in the first embodiment. Further, the mutual operational relationship between the respective components is controlled by the control device in the same manner as in the first embodiment. From the above, according to the present embodiment, the next effect can be expected. 1) By having the three-division rotary electronic component take-out portion 31, the operation time for arranging the electronic component 15 in the electronic component collection tray 16 can be shortened from -16 to 201105191. 2) By using the eight adsorption heads 32 provided in the electronic component assembly transfer unit 33, since it is possible to collectively move a plurality of electronic components, the movement time per electronic component toward the electronic component mounting portion 7a can be shortened. 3) Since a plurality of (here, eight) electronic components can be temporarily placed on the electronic component temporary table 35, the neutral time for waiting for the supply of the electronic components can be prevented, and the temporary pressure bonding operation can be speeded up. 4) Since the panel does not need to be moved in this embodiment, the miniaturization of the apparatus is the same as that of the first embodiment. 5) The choice of the target head for the loading operation can be achieved. [Embodiment 3] In the present embodiment, the components and their operations will be described centering on portions different from the first embodiment. Fig. 6 is a perspective view showing a device 202 for mounting an electronic component explained in the present embodiment, and Fig. 7 is a plan view thereof. As shown in Fig. 6, the main configuration of the device for equipping an electronic component is to provide an electronic component (herein, an electronic component mounted on the COF is described as an example). The electronic component supply unit 4 is taken out; the electronic component is temporarily attached to the electronic component mounting portion of the panel 1; and the electronic component transfer unit for transporting the electronic component to the mounting head (1) 433⁄4 (2) 44° The details of each component are explained using Fig. 7. -17-201105191 The electronic component supply unit 4 shown in the present embodiment is characterized in that it has two up-and-down modes 42a and four adsorption heads 40. First, the take-out mechanism of the electronic component of the electronic component supply unit 4 will be described. Using the two pull-up models, two electronic parts 15 are pulled out from the COF. The model 42a and the electronic component take-out operation at the time of extraction are the same as those in the first embodiment. The two extracted electronic components are adsorbed by the four adsorption heads 40. Further, by the second model 42a and the electronic component take-out operation, two electronic components are extracted and adsorbed by the four adsorption heads 40. At this time, in the first adsorption operation, the four adsorption heads 40 are applied to the two up-and-down models 42a (the models arranged on the right side of the drawing), and the inside (front side) and the front side (lower side of the drawing) are adsorbed. In the next adsorption operation, the four adsorption heads 40 are for the two pull-up models 42b (the models arranged on the left side of the drawing), and adsorb the inner side (the upper side) and the front side (the front side). Two of the lower sides, and the total number of adsorptions is four. Next, in the electronic component transfer unit (1) 43, the electronic component pickup 45b attached to the shuttle 46b transfers the electronic component that is adsorbed and held by the first operation and the electronic component that is adsorbed to the inside by the second operation. Go to shuttle 46b. On the other hand, in the electronic component transfer unit (2) 44, the electronic component mounted on the shuttle 46a is used to adsorb and hold the electronic component on the front side and the electronic component on the side to be adsorbed by the second operation. Transfer to the shuttle 4 6 a. A temporary stage 47 is provided in the electronic component mounting portion 7a, and the two electronic components 15 are held in the electronic component 15a. The two electronic components 15 are attached to the electronic component 15 -18-201105191. The shuttle 46a is oriented in the Y direction. It moves and transfers to the electronic component mounting part 7a. At this time, the shuttle 46a can be moved in the X direction on the electronic component transfer shaft 48. Therefore, the shuttle 46 a can be moved to the position in response to the position of the electronic component mounting portion 7a. In addition, the electronic component mounting portion 7a can be moved in the X direction on the electronic component mounting portion shaft 49. For the subsequent work, the alignment of the electronic component and the panel, or the temporary pressure bonding operation and the subsequent true pressure bonding The migration or the like is the same as in the case of the embodiment i. In the same manner as in the first embodiment, the mounting head 9 can be selected from the type of the mounting head provided on the mounting slider 8a in accordance with the electronic component or the panel size to be mounted. Further, the mutual operational relationship between the respective components is controlled by the control device in the same manner as in the first embodiment. From the above, according to the present embodiment, the next effect can be expected. 1) By having two pull-up models 42a and four adsorption heads 40, it is possible to collectively take out a plurality of electronic components 15 and transfer them again, thereby shortening the working time. 2) Since the shuttle and the mounting slider can move independently in the X direction, it is possible to shorten the working time of electronic parts transfer between each other. 3) Since the panel does not need to be moved in this embodiment, the miniaturization of the apparatus is the same as that of the first embodiment. 4) The choice of the target head for the loading operation can be achieved. -19-201105191 [Embodiment 4] In the present embodiment, the components and their operations will be described centering on portions different from the first embodiment. Fig. 8 is a plan view showing the apparatus 203 for mounting an electronic component explained in the present embodiment. In the electronic component supply unit 4 of the present embodiment, the lift-up mold 42a and the two adsorption heads 50 are provided. First, the electronic component take-out mechanism of the electronic component supply unit 4 will be described. One electronic component 15 is pulled out from the COF using the pull-up model 42a. The model 42a and the electronic component take-out operation at the time of extraction are the same as those in the first embodiment. One of the extracted electronic components is adsorbed by the two adsorption heads 50, and one electronic component is taken out by the next model 42a and the electronic component take-out operation, and is adsorbed by the two adsorption heads 50. Further, in the present embodiment, the pull-up model 42a is exemplified by one pull-up, but one or more corresponding devices may be provided. In the present embodiment, the means for transferring the electronic component 15 adsorbed by the two adsorption heads 50 to the electronic component transfer portion 6a is different from that of the third embodiment. In other words, in the present embodiment, the two adsorption heads 50 can be moved on the electronic component transfer portions (Y direction) 52a, b, and the electronic component transfer portions 52a, b can be in the electronic component transfer portion (X Move on the direction 51. With this mechanism, the electronic components sucked and held by the two adsorption heads 50 can be transferred to the electronic component pick-up 5 3 a, and the electronic components sucked and held by the electronic component pick-up 5 3 a can be held by the shuttle 54a. 15 is transferred to the electronic component mounting portion 7a. The electronic part pickup 53b-20-201105191 or the shuttle 5 4b is also the same as the electronic part pickup 53a or the shuttle 54a. Further, the electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) b start to operate without interfering with each other, and the two sides alternately perform the take-out operation. Regarding the above-described subsequent work, the alignment of the electronic component and the panel, or the temporary pressure bonding operation, and the transition to the subsequent true pressure bonding are the same as those in the first embodiment. In the same manner as in the first embodiment, the mounting head 9 can be selected from the type of the mounting head mounted on the slider 8a in accordance with the size of the electronic component or the panel to be mounted. Further, the mutual operational relationship between the respective components is controlled by the control device in the same manner as in the first embodiment. From the above, according to the present embodiment, the next effect can be expected. 1) Since the electronic component transfer portion (Y direction) 5 2a and the electronic component transfer portion (Y direction) 5 2b can also be moved in the direction of the electronic component transfer portion (X direction) 51, since the electron can be responded to The component transfer portions 6a and 6b are moved in the X direction, and the electronic component transfer operation between the electronic component transfer unit (Y direction) 52a and the electronic component transfer unit (Y direction) 52b and the electronic component mounting portion can be shortened. time. 2) Since the electronic component transfer unit (Y direction) 52a interacts with the electronic component transfer unit (Y direction) 5 2b, the electronic component can be taken out, and the operation time of each of the electronic components can be shortened. 3) Since the panel does not need to be moved in this embodiment, the small-sized device of the device is the same as that of the first embodiment. 4) The selection of the target head for the mounting operation can be achieved. [Simplified illustration of the drawing] Fig. 1 is a plan view showing the panel on which the electronic component is mounted. Fig. 2 is an electronic component assembly shown in the first embodiment. A perspective view of the device. Fig. 3 is a plan view showing the apparatus for assembling an electronic component shown in the first embodiment. Fig. 4 is a perspective view showing the apparatus for assembling an electronic component shown in the second embodiment. Fig. 5 is a plan view showing the apparatus for assembling electronic parts shown in the second embodiment. Fig. 6 is a perspective view showing the apparatus for assembling an electronic component shown in the third embodiment. Fig. 7 is a plan view showing the apparatus for assembling an electronic component shown in the third embodiment. Fig. 8 is a plan view showing the apparatus for assembling electronic parts shown in the fourth embodiment. Figure 9 is a plan view of a conventional fixed rotary head. [Description of main component symbols] 1 : Panel 1 a : Long side -22- 201105191 1 b : Short side 2 : Electronic parts 3a, 3b : COF reel 4 : Electronic parts supply parts 5a, 5b : Pull-up type 6a 6b: electronic component transfer units 7a and 7b: electronic component mounting portions 8a and 8b: mounting sliders 9, 9x, and 9y: mounting heads 10a and 10b: electronic component and panel alignment camera 11: straight-through electronic component removal Device 12: Straight-line electronic component extractor unit 13: Electronic component transport mechanism (X direction) 14: Electronic component transport mechanism (Y direction) 1 5: Electronic component 16: Electronic component collection tray 16 17a, 17b: Electronic component pickup 18a, 18b: transfer unit body 19: shaft for electronic component transfer unit 20: mounting shaft 30 for slides: electronic component extractor 31: 3 equally divided rotary electronic component take-out unit 3 2: adsorption head 3 3 : electron Parts assembly transfer unit-23- 201105191 3 4 : Transfer unit body 3 5 : Electronic parts temporary table 3 6 : Rotary table 37 = Axis for electronic parts transfer part 3 8 : Electronic parts picker ' 4 0 : 4 Adsorption head 4 1 : Straight-line electronic component take-out portion 42a, b: 2 pull-up models 43: Electron zero Part transfer unit (1) 44: electronic component transfer unit (2) 45a, b: electronic component pick-up unit 46a, b: shuttle 47: temporary stage 48: shaft for electronic component transfer unit 49: for mounting slider Axis 50: 2 adsorption heads 51: electronic component transfer unit (X direction) 52: electronic component transfer unit (Y direction) 53a, b: electronic component pickups 54a, b: shuttles 55a, b: electronic parts The temporary stage 100: the temporary pressure unit upper flow unit 101: the temporary pressure connection unit 102: the temporary pressure unit 2 the downstream unit-24-201105191 104: the fixed rotary head 105: the mounting head 106: the initial position panel 107: moving Rear panel 108: panel support member 200: perspective view of the apparatus for assembling electronic parts shown in the first embodiment 201: perspective view of the apparatus for assembling electronic parts shown in the second embodiment 2 02: by the third embodiment A perspective view of the device for assembling electronic parts. -25-