JP5325388B2 - Panel holder device - Google Patents

Description

  The present invention mounts a printed circuit board (PCB) as a drive circuit on a panel substrate through a group of semiconductor devices in the process of assembling flat display panels such as liquid crystal panels and plasma panels, and other panels. The present invention relates to a panel holder device that stably holds a panel assembly in order to perform an operation of sending the panel assembly to a subsequent process.

  As a flat display panel, for example, a liquid crystal panel is manufactured through various processes. In this manufacturing process, a driving circuit and a control circuit are mounted on a panel substrate in which two transparent substrates are sealed and bonded together. There is a board mounting process for connecting the two. The drive circuit is composed of a semiconductor device in which an IC circuit is mounted on a flexible substrate. This semiconductor device is connected to a predetermined number of at least two sides, three sides, or four sides of the panel, and a semiconductor device group on each side. Configure. The control circuit includes a printed circuit board on which a circuit pattern is formed and on which predetermined electronic components are mounted, and one or a plurality of printed circuit boards are connected to the entire semiconductor device group on one side. The mounting of the semiconductor device on the panel substrate and the connection of the printed circuit board to the semiconductor device group can be performed by soldering or the like, but from the viewpoint of workability and connection accuracy, the connection is made through an anisotropic conductive film. The method is common. This anisotropic conductive film is composed of a binder resin having an adhesive function in which conductive particles are uniformly dispersed, and the electrodes provided on the two members to be connected are electrically connected via the conductive particles. Both members are bonded and fixed by a binder resin.

Here, Patent Document 1 discloses an apparatus for connecting a printed circuit board to a panel board. In Patent Document 1, a panel substrate on which a semiconductor device group is formed and a printed circuit board on which an anisotropic conductive film is attached are placed on separate holding members. In this state, the panel holding member on which the panel substrate is mounted is driven to perform alignment with the printed circuit board fixed to the substrate holding member, and then the panel holding member is lowered to remove the panel substrate. A number of electrodes formed in the semiconductor device group are brought into contact with electrodes on the printed circuit board side. Then, in the crimping stage in which the crimping blade is provided in the upper position and the cradle is provided in the lower side, the crimping blade is lowered while the connection position of the semiconductor device group in the printed circuit board is installed on the cradle. The printed circuit board is connected to the panel substrate by pressing the group from above and pressing the binder resin of the anisotropic conductive film while heating.
Japanese Patent Laid-Open No. 10-1877182

  After the printed circuit board is connected to the panel substrate as described above and the panel assembly is formed, this panel assembly is used to connect the printed circuit board to other sides, for example, as follows. Transferred to the process. At this time, the panel assembly is taken out from the panel holding member, and this transfer is performed by pick and place means including a vacuum suction member for vacuum suction of the panel substrate. This vacuum suction is performed from the surface side of the panel substrate, and if it is a small-sized panel substrate, there is no particular problem. However, if a thin and large panel assembly is lifted by vacuum suction, damage to the panel substrate will occur. And stress increases.

  In addition, since the printed circuit board is not directly connected to the panel substrate but is connected through a group of semiconductor devices having a flexible substrate, not only the panel substrate but also the printed circuit substrate needs to be vacuum-sucked. Accordingly, the pick-and-place means is provided with a vacuum suction head for the panel substrate and a vacuum suction head for the printed circuit board, and there is a problem that the configuration is complicated and large. Moreover, the printed circuit board has a plurality of electronic components mounted on the surface side, and a circuit pattern is formed, and there are uneven portions that cannot be stably adsorbed by the vacuum adsorbing head. The site where the adsorption can be performed is limited, and there is a problem that, depending on the adsorption position, there is a case where it cannot be stably held.

  The present invention has been made in view of the above points, and an object of the present invention is to make a panel assembly in which a printed circuit board is mounted on a panel substrate via a semiconductor device without causing any damage. In addition, it is to ensure that it can be held securely and stably.

In order to achieve the above-described object, the present invention provides a panel holder for holding a panel assembly in which one or a plurality of printed circuit boards are connected to a panel substrate via a plurality of semiconductor devices having IC circuits mounted on a flexible substrate. In the apparatus, the panel substrate is placed in a horizontal state and has a plurality of holder arms arranged in parallel in the horizontal direction, and both sides of the plurality of holder arms are arranged according to the size of the panel substrate. Two fixed holder arms and a plurality of holder arms positioned in the middle of the two fixed holder arms, the plurality of intermediate holder arms being the axis of the holder arm. Among the arm unit that adjusts the position in a direction orthogonal to the holder arm and the holder arm that is adjusted in position, the arm unit is mounted at a lower position of at least two holder arms. A substrate support member that contacts the lower surface of the printed circuit board, a retracted position where each of the substrate support members does not protrude from the tip of the holder arm, and a lower surface of the printed circuit board that protrudes from the tip of the holder arm. It is characterized in that it is provided with an advancing / retreating drive means for displacing it to an operating position in contact therewith.

  The panel substrate is held by an arm unit that is provided in the panel holder device and includes a plurality of holder arms, and this substrate holding is generally performed by a vacuum suction means. The required number of holder arms varies depending on the size and thickness of the panel substrate. In the case of a thin and large panel substrate, the number of holder arms is increased. When the printed circuit board is connected to the panel substrate, one or a plurality of printed circuit boards are connected to the portion of the panel substrate where the semiconductor device group is provided. The connection of the printed circuit board is performed by using, for example, a crimping means. In order to prevent interference with the crimping means, the arm unit is prevented from protruding from the end portion of the panel substrate. On the other hand, after the printed circuit board is connected to the group of semiconductor devices provided on the panel substrate, the printed circuit board is supported from the lower side by the substrate supporting member. By causing the substrate support member to move forward and backward between the retracted position and the operating position, interference with the crimping means is avoided when crimping between the printed circuit board and the semiconductor device group. The advancing / retreating drive means of the substrate supporting member can be constituted by an electric motor, a solenoid or the like, but an air cylinder is used as the simplest configuration. And the piston rod of an air cylinder can be functioned as a board | substrate support member. When using an air cylinder, hold it so that the piston rod as the board support member protrudes by an urging means such as a spring, and when necessary, specifically when crimping the printed circuit board It is desirable to supply pressurized air to the air cylinder so that it is displaced to the retracted position.

  In order to form a panel assembly, a plurality of stages are arranged in a predetermined direction, and a panel substrate is sequentially transferred to each stage. For this purpose, the panel holder device according to the present invention is attached to each stage. It is desirable to drive the panel holder devices of the front and rear stages to transfer the panel substrate between the arm units in order to prevent damage to the panel substrate. In order to transfer the panel substrate (including the state before the connection of the printed circuit board and the state after the connection) between the stages, each panel holder device is configured to include an arm unit drive mechanism. This drive mechanism comprises at least a horizontal rotation means, a forward / backward movement drive means, and a lift drive means. In addition to these, for example, a driving means in the left-right direction may be provided, and further, a tilt adjusting means for the holder arm may be provided. And each holder arm of the arm unit in one panel holder apparatus is made to enter between adjacent arm units of the counterpart arm unit and can be combined.

  In the case of a plurality of stages, it is desirable that the holder arm mounted on the panel holder device arranged on each stage can be adjusted in the arrangement direction. Thereby, when the panel holder devices of the front and rear stages are combined, the position of each holder arm of the one side panel holder device can be adjusted so as not to interfere with each holder arm of the counterpart panel holder device. Moreover, when connecting a printed circuit board to a panel board of a different size, the setup can be easily changed by adjusting the interval between the holder arms in each panel holder device.

  For example, when a semiconductor device group is provided on three or four sides of a panel substrate and a printed circuit board is connected to these sides, the arm unit can be index-rotated every 90 degrees by horizontal turning means. And A connection port for pressurized air to the air cylinder constituting the advancing / retreating drive means of the substrate support member is provided at each index angle position of the horizontal rotation means. When a connector connected to a pipe from a pressurized air source is attached so that it can move back and forth, and when rotating the index, pull out the connector from the connection port once, and after rotation, connect the connector to the connection port that faces it again. Configure. As a result, the pipes are not twisted and the pipes can be routed stably.

  The panel substrate is usually rectangular, and the holder arm attached to the panel holder device can be arranged in a direction parallel to the short side of the panel substrate. Regardless of which side of the panel substrate the printed circuit board is connected to, the transfer of the panel substrate between the panel holder devices is at a fixed rotational position. Then, after the printed circuit boards are connected to the four sides of the panel board, it is necessary to support each printed circuit board from below. In this case, the substrate supporting member that can be displaced between the retracted position and the operating position is provided in the front and rear and left and right directions.

  Hold the panel assembly with the printed circuit board connected to the panel board via the semiconductor device smoothly, reliably and stably without causing any damage to the panel board or the printed circuit board connected to it. The operation such as transfer can be performed.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In FIG. 1, reference numeral 1 denotes a panel substrate. The panel substrate 1 includes upper and lower transparent substrates 1a and 1b, and liquid crystal is sealed between the transparent substrates 1a and 1b. As shown in FIG. 1 (a), the lower transparent substrate 1b on the panel substrate 1 protrudes from the upper transparent substrate 1a on four sides, and these four extended portions are shown in FIG. 1 (b). As shown, a semiconductor device 2 composed of a plurality of TCP (Tape Carrier Packages) is mounted by a TAB (Tape Automated Bonding) method. On each side, a plurality of semiconductor devices 2 are taken as a group, and one or a plurality of printed circuit boards 3 are connected to them to form a panel assembly 4. Here, as is well known, the semiconductor device 2 has an IC circuit mounted on a flexible substrate, and has flexibility in a bending direction except for a portion where the IC circuit is mounted.

  FIG. 2 shows an example of a stage configuration in a board mounting process for connecting the printed circuit board 3 to the panel board 1. Each of these stages is provided with a table for performing predetermined work, operation or processing, and these tables are provided with means or mechanisms for performing work, operation or processing. .

  In the figure, reference numeral 10 denotes a carry-in stage. The carry-in stage 10 is provided with a mechanism for cleaning the TAB mounting area of the loaded panel substrate 1. This cleaning can be performed, for example, by rubbing the surface of the panel substrate 1 by tape cleaning. Thereby, dirt on the TAB mounting portion of the panel substrate 1 can be wiped off.

  A stage located on the downstream side of the carry-in stage 10 is an ACF attaching stage 11 for attaching an anisotropic conductive film, that is, an ACF (Anisotropic Conductive Film) to the TAB mounting portion of the panel substrate 1. The ACF is preferably affixed individually to a portion where each semiconductor device 2 is mounted, but may be affixed over the entire length of each side.

  Reference numeral 12 denotes a temporary pressure-bonding stage, and 13 denotes a main pressure-bonding stage. In the temporary pressure bonding stage 12, the semiconductor device 2 is temporarily pressure bonded to a predetermined position on the panel substrate 1. In the pre-bonding, all the semiconductor devices 2 mounted on one side are sequentially mounted. The main crimping stage 13 is fixed to the panel substrate 1 through the ACF by pressurizing the semiconductor device 2 temporarily crimped by the temporary crimping stage 12 under heating. Here, the main pressure bonding is simultaneously performed on all the semiconductor devices 2 mounted on one side of the panel substrate 1 at the same time. Then, an inspection stage 14 for determining whether or not the semiconductor device 2 crimped to the panel substrate 1 is mounted at a regular position is provided as a subsequent process.

Further, a PCB connection stage 15 for connecting the PCB 3 is provided on the downstream side of the inspection stage 14. In the PCB connecting stage 15, PCB 3 two is adapted to be connected to the entire semiconductor instrumentation 置群 comprising a plurality of semiconductor devices 2 mounted on the long side of the panel substrate 1. There are cases where the PCB 3 is connected as a whole or divided into three or more. Then, after the PCB 3 is attached, the process shifts to a resin coating stage 16 that applies a sealing resin to the connection portion between the semiconductor device 2 and the PCB 3, and thereby the semiconductor device 2 on one side of the panel substrate 1 and Connection of PCB3 is completed.

  Next, the semiconductor device 2 is mounted and the PCB 3 is connected to the other side of the panel substrate 1. Here, the semiconductor device 2 and the PCB 3 having different structures are connected to the long side and the short side of the panel substrate 1, respectively. That is, in the illustrated panel substrate 1, two PCBs 3 are connected to the long side and one PCB 3 is connected to the short side. When the PCB 3 is connected to the short side, the stage and the stage configuration shown in FIG. 2 are substantially the same as those described above, and the same stage as in FIG. 2 can be arranged in a line. The substrate mounting process can be executed while reciprocating the structure.

  Each of the above stages 10 to 16 is provided with a panel holder device 20 that holds the panel substrate 1 in a horizontal state so as to be detachable. The structure of the panel holder device 20 is shown in FIGS. The panel holder device 20 shown in FIGS. 3 and 4 has six holder arms 21a to 21f (referred to collectively as arm units 21). The number of holder arms is not limited to this number, and it is sufficient if there are at least two holder arms. Each holder arm 21a-21f is provided in the guide member 22 extended in the direction orthogonal to those axis lines so that position adjustment is possible. Therefore, as apparent from FIG. A pair of front and rear leg rods 23 are connected to 21 f, and the position of each leg rod 23 can be adjusted along a guide rail 22 a provided on the side surface of the guide member 22.

  A rotating member 24 is connected to the lower surface of the guide member 22 to which the arm unit 21 is mounted. The rotating member 24 is provided on the horizontal rotating means 25. The horizontal rotation means 25 is attached to an elevating means 26, and the elevating means 26 is further attached to an XY axis driving means 27. The horizontal turning means 25, the raising / lowering means 26 and the XY axis driving means 27 constitute a drive mechanism of the arm unit 21, and the arm unit 21 holding the panel substrate 1 is rotated by an index every 90 degrees in the horizontal direction. Further, the panel substrate 1 is inserted into and removed from the tables installed on the stages 10 to 16, and the panel substrate 1 is exchanged between the stages at adjacent positions. In addition, since the drive mechanism comprised from the horizontal rotation means 25, the raising / lowering means 26, and the XY-axis drive means 27 can use a conventionally well-known structure, detailed illustration and description about these mechanisms are abbreviate | omitted. To do.

  The arm unit 21 including the six holder arms 21a to 21f is placed with the panel substrate 1 placed in a horizontal state, and in order to stably hold the panel substrate 1, the surface of each holder arm 21a to 21f A plurality of suction pads 28 are attached. The suction pad 28 communicates with a negative pressure passage (not shown) formed in the holder arms 21a to 21f, and the lower surface of the panel substrate 1 is sucked and held by using the suction pad 28 as a negative pressure action hole.

  Of the holder arms 21 a to 21 f constituting the arm unit 21, the holder arms 21 a and 21 f located on the left and right sides are fixed holder arms, and the middle four holder arms 21 b to 21 e are along the guide member 22. It is a holder arm whose position can be adjusted by moving. Accordingly, the panel substrate 1 is stably held by adjusting the positions of the holder arms 21b to 21e according to the size and shape of the panel substrate 1 to be handled. The position adjustment of these holder arms 21 b to 21 e is performed by moving each leg rod 23 along the guide rail 22 a of the guide member 22.

  An air cylinder 29 as a substrate support member is mounted at a position immediately below the suction portion of the panel substrate 1 of the holder arms 21b to 21e. The tip of the piston rod 29a of the air cylinder 29 is configured to be displaceable between a retracted position drawn into a lower position of the holder arms 21b to 21e and an operating position protruding a predetermined length from the holder arms 21b to 21e. Yes. A PCB 3 is connected to the panel substrate 1 via a semiconductor device 2 made of a flexible substrate, and each of the holder arms 21a to 21f constituting the arm unit 21 sucks and holds only the panel substrate 1, but air In the extended state, the piston rod 29a of the cylinder 29 abuts on the lower surface of the PCB 3 connected to the panel substrate 1 to support the PCB 3.

  Here, the air cylinder 29 is attached to the front and rear portions of the holder arms 21b to 21e. Therefore, the PCB 3 connected to the long sides on both sides of the panel substrate 1 can be supported. On the other hand, in order to support the PCB 3 connected to the short side of the panel substrate 1, outwardly from the holder arms 21a and 21f at both ends, that is, in a direction perpendicular to the holder arms 21a and 21f, respectively. Two air cylinders 30 are provided, and a support bar 31 having a predetermined length in a direction parallel to the holder arms 21a and 21f is connected to the tip of the piston rod 30a in these air cylinders 30. The PCB 3 connected to the short side of the panel substrate 1 is supported by these support bars 31. When the PCB 3 is connected to two or three sides of the panel substrate 1, it is not always necessary to provide an air cylinder in four directions, and the side to which the PCB 3 is not connected need not be provided with an air cylinder. good.

  When the piston rods 29a and 30a are in the extended state, the air cylinders 29 and 30 are in an operating position for supporting the PCB 3, and when the piston rods 29a and 30a are contracted, the air cylinders 29 and 30 are retracted to the lower positions of the holder arms 21a to 21f. It becomes. At normal times, the piston rods 29a and 30a are urged to be in the extended operating position by an urging means such as a spring (not shown), and are pressurized into the cylinder 29b or the cylinder of the air cylinder 30 (not shown). When air is supplied, the piston rod 29a is displaced to the retracted position. The reason why the air cylinder 29 is displaced to the retracted position in this way is to avoid interference with the crimping means described later in the PCB connection stage 15 or the like that connects the PCB 3 to the panel substrate 1.

  Here, the PCB 3 is connected to four sides of the panel substrate 1. In the PCB connection stage 15, the panel substrate 1 makes the side to which the PCB 3 is connected face the PCB connection stage 15. For this purpose, the panel holder device 20 is provided with horizontal rotation means 25, and each side of the panel substrate 1 supported by the arm unit 21 is directed to the stage 15. The rotating body 24 is attached to a horizontal rotating means 25, and the horizontal rotating means 25 is configured to rotate an index every 90 degrees.

  In the panel holder device 20, an air cylinder 29 or 30 at a position facing the stage is selectively connected to any one of the arm units 21, and an air pipe 32 from a pressurized air source is selectively connected. Is done. For this purpose, as shown in FIG. 6 and apparent from FIG. 4, a connector 33 in which an air pipe 32 is connected to the elevating means 26 is provided. On the other hand, a rotating body 24 connected to the horizontal rotation means 25 is provided at a lower position of the guide member 22, and a connecting port 34 is provided in the rotating body 24 every 90 degrees. A plurality of air supply pipes 35 are drawn out from the air passages 34 a to 34 d of these connection ports 34. The connector 33 is provided with four connection pipes 33 a to 33 d that are inserted into and removed from the air passages 34 a to 34 d of the connection port 34. These air supply pipes 35 are connected to air cylinders 29 and 30 at respective positions mounted at an angular relationship of 90 degrees.

  As is clear from FIG. 7, the connector 33 is configured to be selectively connected to the connection ports 34 provided at four locations. For this purpose, a base 36 is mounted on the lifting means 26, and a slider 38 that reciprocates along the guide rail 37 is provided on the base 36. The connector 33 is attached to the slider 38 and can be moved back and forth by a drive cylinder 39. Therefore, when the horizontal rotation means 25 is driven and the guide member 22 provided with the arm unit 21 is index-rotated, one of the four connection ports 34 selectively faces the connector 33. Placed in position. In this state, by driving the drive cylinder 39, the connector 33 from the air pipe 32 is brought into contact with or separated from any one of the connection ports 34, and the air cylinder 29 or 30 disposed at any angular position is retracted. Will be displaced to the position.

  Pressurized air is supplied when the connector 33 is connected to the connection port 34, and supply of the pressurized air is stopped when the connector 33 is disconnected from the connection port 34. For this purpose, the connection pipes 33a to 33d are provided with flow path opening / closing means (not shown), and only when these connection pipes 33a to 33d are inserted into the air passages 34a to 34d of the connection port 34, respectively. The flow path is configured to open, whereby the connector 33 performs a so-called switching operation function of performing ON / OFF control of the air cylinders 29 and 30, and the connector 33 is connected to any one of the connection ports 34. When this occurs, the air cylinder 29 or 30 connected to the connection port 34 is displaced to the retracted position.

  Although the panel holder device 20 is configured as described above, the PCB 3 is connected to the panel substrate 1 by the panel holder device 20 in the PCB connection stage 15. That is, as shown in FIG. 8, the PCB connection stage 15 is provided with a PCB clamp unit 40. The PCB clamp unit 40 includes a fixed clamp member 41 and a rotation clamp member 43 that can be rotated in the vertical direction about the rotation shaft 42. The PCB 3 is placed on the fixed clamp member 41. The PCB 3 is clamped and held by joining the rotating clamp member 43 onto the fixed clamp member 41. Here, in the PCB 3, a portion connected to the panel substrate 1 is protruded by a predetermined length, and the ACF is attached to the upper surface portion of the protruding portion.

  The panel substrate 1 held by the arm unit 21 of the panel holder device 20 is advanced to a position where the mounting portion of the semiconductor device 2 is directed to the PCB connection stage 15 and the semiconductor device 2 overlaps the ACF attachment region of the PCB 3. However, a pressure receiving member 44 is disposed on the lower side of the ACF attachment region, and a pressure blade member 45 is disposed on the upper portion thereof so as to be movable up and down. The pressure receiving member 44 and the pressure blade member 45 constitute a pressure bonding means. Accordingly, the semiconductor device 2 and the ACF attachment region of the PCB 3 are overlapped with each other and brought into contact with the pressure receiving member 44, and the pressure cutting blade 45a of the pressure bonding blade member 45 is lowered from above, and this pressure is applied with a predetermined pressure. Pressure bonding is performed by pressing the semiconductor device 2 and the PCB 3. At least the crimping blade 45a has a built-in heater, and the ACF interposed between the semiconductor device 2 and the PCB 3 is heated to a predetermined temperature during the crimping.

  Therefore, a method for connecting the PCB 3 to the panel substrate 1 will be described with reference to FIG. First, as shown in FIG. 9A, the crimping blade member 45 is raised and separated from the crimp receiving member 44, and the PCB 3 clamped by the PCB clamp unit 40 is pasted with an ACF to be crimped. It arrange | positions so that an area | region may become the upper position of the crimp receiving member 44. FIG. The panel holder 1 holds the panel substrate 1 by suction, and the direction is controlled so that the side of the panel substrate 1 to which the PCB 3 is connected faces the PCB 3. Note that a predetermined number of groups of semiconductor devices 2 are already connected to this side of the panel substrate 1 in the previous process.

  In the following, it is assumed that the panel substrate 1 held by suction on the arm unit 21 of the panel holder device 20 is connected to the PCB 3 on the long side. At this stage, a predetermined number of semiconductor devices 2 are already connected to this long side. Further, with respect to the PCB 3, the ACF is attached to the portion where the electrode is disposed, and when the PCB 3 is clamped by the PCB clamp unit 40, the ACF attachment surface faces upward.

  As shown in FIG. 9B, the PCB 3 clamped by the PCB clamp unit 40 is placed on the upper surface of the pressure receiving member 44. Then, the panel holder device 20 is moved in the direction approaching the PCB clamp unit 40 so that the semiconductor device 2 of the panel substrate 1 is adjusted to the upper position of the PCB 3, and the semiconductor device 2 and the PCB 3 are accurately aligned. To do. From this state, as shown in FIG. 9C, the lifting means 26 of the panel holder device 20 is driven to pull down the arm unit 21 so that each semiconductor device 2 of the panel substrate 1 contacts the PCB 3. Lower. Here, at the latest, before the arm unit 21 starts to be pulled down in the panel holder device 20, the piston rod 29a of the air cylinder 29 is held in the retracted position so as to be pulled into the cylinder 29b.

  In this state, as shown in FIG. 9D, the crimping blade member 45 is lowered and brought into contact with the semiconductor device 2, and a predetermined pressure is applied under heating. As a result, the electrodes of each semiconductor device 2 connected to the panel substrate 1 and the electrodes provided on the PCB 3 are electrically connected via the conductive particles of the ACF, and the semiconductor device 2 and the PCB 3 are connected by the binder resin. It is fixed. Here, in the upper and lower parts of the semiconductor device 2 and the PCB 3, there is no member that interferes with or interferes with the crimping by the operation of the crimping blade member 45, so that the operation is performed smoothly. Thus, a uniform pressure can be applied over the entire length of the PCB 3 to perform accurate pressure bonding.

  When the crimping is completed, the crimping blade member 45 is lifted, and the arm unit 21 and the PCB clamp unit 40 of the panel holder device 20 are lifted and separated from the crimping receiving member 44 to return to the state of FIG. Let Here, the arm unit 21 and the PCB clamp unit 40 are raised simultaneously. As a result, even if the ACF does not exhibit a sufficient fixing force immediately after the pressure bonding, the semiconductor device 2 and the PCB 3 are not separated or the bonding state does not become unstable.

  At this time, the supply of pressurized air to the air cylinder 29 is shut off as shown in FIG. This blocking of the pressurized air can be performed by pulling out the connector 33 from the connection port 34. As a result, the piston rod 29a is displaced to the operating position protruding from the cylinder 29b. Then, as shown in FIG. 9 (f), the rotating clamp member 43 constituting the PCB clamp unit 40 is rotated upward to release the clamp, and the arm unit 21 is raised. At this time, as shown in FIG. 10, the piston rod 29a extended from the cylinder 29b functions as a substrate support member, and the PCB 3 is placed. The semiconductor device 2 made of a flexible substrate is bent and the PCB 3 is bent. It does not hang down due to its own weight, and does not become unstable such as positional displacement or partial peeling on the PCB 3. Therefore, the piston rod 29a is held at a height position as close as possible to the contact surface of the panel substrate 1 of the arm unit 21.

  As described above, the air cylinders 29 and 30 are set to the operating positions on each side of the panel substrate 1 except when the PCB 3 is connected, so that the PCB 3 is supported to be connected to the panel substrate 1 via the flexible substrate. The stability of the PCB 3 is secured, and there is no possibility of colliding with other objects when the panel holder device 20 is operated.

  Thus, the arm units 21 constituting the panel holder device 20 are alternately arranged in two different intervals. That is, as shown in FIG. 2, the panel holder device with a narrow arm unit width and the panel holder device with a wide arm unit width are alternately arranged. This is to prevent mutual interference when the panel substrate 1 is transferred between the front and rear panel holder devices.

  As shown in FIG. 11, the panel holder device 20W provided with an arm unit 21W having a wider interval between the holder arms 21a to 21f, and the interval between the holder arms 21a and 21f on both sides is narrow and the intermediate holder arms 21b to A panel holder device 20N having an arm unit 21N disposed between the holder arms 21b to 21e in the arm unit 21W is disposed on the front and rear stages. It should be noted that the number of holder arms constituting the arm unit in both panel holder devices 20W and 20N may be different from the panel holder device 20W, for example, by reducing the number of the panel holder devices 20N having a narrow interval by one. Accordingly, the holder arms 21a to 21f constituting the arm unit 21W and the holder arms 21a to 21f constituting the arm unit 21N enter the other arm unit without interfering with each other, and It can be in a complicated state. Assume that the panel substrate 1 is held on one side of the panel holder device 20W and the panel holder device 20N arranged at opposite positions, for example, the arm unit 21W of the panel holder device 20W. From the panel holder device 20W, The operation will be described assuming that the panel substrate 1 is transferred to the arm unit 21N of the panel holder device 20N.

  The panel holder device 20N on the receiving side is brought close to the panel holder device 20W, 20N in a state where the arm unit 21N is lowered by the lifting means 26. Driving in this direction can be performed by operating either or both XY driving means 27. As a result, the arm units 21W and 21N of both panel holder devices 20W and 20N are assembled with each other. At this time, the arm unit 21N is disposed at a position below the arm unit 21W on which the panel substrate 1 is placed, specifically, at a height position between the arm unit 21W and the guide member 22. And the raising / lowering means 26 of the panel holder apparatus 20N is operated, and the arm unit 21N is raised. The rising height of the arm unit 21N is higher than the arm unit 21W. Preferably, when the arm unit 21N is at substantially the same height as the arm unit 21W, a negative pressure is applied to the suction pads 28 of the holder arms 21a to 21f on the arm unit 21N side, and the arm unit 21W The action of the negative pressure on the suction pads 28 of the side holder arms 21a to 21f is stopped. Thus, the panel substrate 1 is transferred from the panel holder device 20W to the panel holder device 20N. Therefore, the panel holder device 20N is separated from the panel holder device 20W, and the arm unit 20N is lowered to a predetermined position. Thereby, it will be in the state which can start the operation | work in the stage in which the panel holder apparatus 20N is arrange | positioned.

  As described above, the panel substrate 1 is transferred between the panel holder devices 20W and 20N. At this time, the PCB 3 is connected to the panel substrate 1 via the semiconductor device 2, and the PCB 3 is suspended. When the holder arms 21a to 21f constituting the arm unit 21N enter the space between the holder arms 21a to 21f of the arm unit 21W, there is a possibility that the tips of the arms abut against the PCB 3. However, since the position of the PCB 3 is held at substantially the same height as the panel substrate 1 by the air cylinders 29 and 30 constituting the substrate supporting member, such a situation does not occur and smooth and reliable transfer is possible. The loading operation is performed, and the PCB 3 immediately after the connection is not damaged.

It is explanatory drawing which shows an example of a panel board | substrate. It is explanatory drawing which shows an example of the stage structure of the board | substrate mounting process which connects PCB to a panel board | substrate. It is a top view which shows the structure of the panel holder apparatus which shows embodiment of this invention. FIG. 4 is a front view of FIG. 3. FIG. 4 is a side view of FIG. 3. It is a top view which shows the connection structure of the connector from an air piping, and the connection port to an air supply pipe. It is explanatory drawing which shows the connection structure of piping to each air cylinder. It is a configuration explanatory view showing a configuration of a PCB connection mechanism to the panel substrate. It is process explanatory drawing which shows the connection procedure of PCB to a panel board | substrate. It is a side view which shows the connection part of a panel board | substrate and PCB. It is a top view which shows the state which is delivering the panel board | substrate between panel holder apparatuses.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Panel substrate 2 Semiconductor device 3 PCB 4 Panel assembly 20, 20W, 20N Panel holder apparatus 21a-21f Holder arm 21,21W, 21N Arm unit 22 Guide member 28 Adsorption pad 29, 30 Air cylinder 32 Air piping 33 Connector 34 Connection port 35 Air supply pipe 40 PCB clamp unit 44 Crimp receiving member 45 Crimp blade member

Claims (6)

In a panel holder device for holding a panel assembly in which one or a plurality of printed circuit boards are connected to a panel substrate via a plurality of semiconductor devices having an IC circuit mounted on a flexible substrate,
The panel substrate is placed in a horizontal state, has a plurality of holder arms arranged in parallel in the horizontal direction, and is positioned on both sides of the plurality of holder arms according to the size of the panel substrate. There are two fixed holder arms and a plurality of holder arms positioned between the two fixed holder arms, and the plurality of intermediate holder arms are orthogonal to the axis of the holder arm. An arm unit that adjusts the position in the direction,
A substrate support member mounted at a lower position of at least two holder arms of the holder arms to be adjusted, and in contact with a lower surface of the printed circuit board;
Advancing / retreating driving means for displacing each of the board supporting members to a retracted position that does not protrude from the tip of the holder arm and an operating position that protrudes from the tip of the holder arm and contacts the lower surface of the printed circuit board is provided. A panel holder device.   The advancing / retreating drive means is an air cylinder, and the substrate support member is a piston rod of the air cylinder. The substrate support member is always in an operating position, and is retracted by supplying pressurized air to the air cylinder. 2. The panel holder device according to claim 1, wherein the panel holder device operates so as to be displaced to a position.   In order to form the panel assembly, a plurality of stages are provided, and a panel holder device is disposed on each of the stages, and one panel holder is used to deliver the panel assembly between the two panel holder devices. Each holder arm constituting the arm unit of the other panel holder apparatus can enter between each holder arm constituting the arm unit of the apparatus, and these arm units include a horizontal turning means, a forward / backward moving means, and The panel holder device according to claim 2, wherein a lifting / lowering means is provided.   The arm unit is rotated by an index every 90 degrees by the horizontal rotation means, and a connection port in which a pipe for pressurized air to the air cylinder is connected to each index angular position. The piping from the pressurized air source is connected to a connector, and the connector is configured to be selectively connected to each of the connection ports by contact / separation means. 3. The panel holder device according to 3.   The panel holder device according to any one of claims 1 to 4, wherein each holder arm constituting the arm unit is configured to be positionally adjustable in a direction approaching or separating from each other.   Each of the holder arms comprises a plurality arranged in a direction parallel to the short side of the panel, and each of the substrate support members is provided at the front and rear in the axial direction at at least one place of each of the holder arms. 6. The panel holder device according to claim 5, wherein the panel holder device is also arranged in both directions perpendicular to the axis of the arm.

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