KR20100128244A - Electronic component mounter - Google Patents

Abstract

PURPOSE: An electronic component mounting apparatus is provided to extract electronic components by alternatively operating an electronic component moving mount units. CONSTITUTION: An electronic component supply unit(4) supplies a plurality of electronic components mounted on a panel(1). An electronic component mount unit(7a,7b) mounts the electronic component on the panel by determining the position of the electronic component supplied from the electronic component supply unit. Electronic component moving mount units(6a,6b) mount the electronic components by drawing out the electronic components from the electronic component supply unit. The panel is determined on the base including the electronic component mount units. The electronic component mount unit moves in parallel to the processed surface of the panel to mount the electronic components.

Description

Electronic Component Mounting Units {ELECTRONIC COMPONENT MOUNTER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and, for example, relates to an electronic component mounting apparatus for mounting a semiconductor device on a display panel such as a liquid crystal panel.

In the LCD industry, the market has recently expanded from PCs to monitors. With such a situation, the liquid crystal panel (substrate) size is also enlarged and low price is required.

Display panels, such as liquid crystal panels, may be used as driver electronic components (eg, tape automated bonding (TAB), chip on glass (COG), tape carrier package (TCP), or flexible printed circuit (FPC)) at edges of glass substrates. Etc.] is implemented. The apparatus used for mounting electronic components to the display panel includes an ACF attachment portion for attaching an anisotropic conductive film (ACF) for bonding electronic components to the edge of the glass substrate, and the electronic component is attached through the anisotropic conductive film. The electronic component mounting part mounted and press-bonded, and work mechanism parts, such as an electronic component crimping | compression-bonding part which heat-presses by applying heat and a load to the electronic component and anisotropic conductive film of a pressurized state, are comprised.

The electronic component mounting apparatus used for such a display panel assembly generally has many general-purpose types for various types of substrates of different sizes, from small to large, and the arrangement of the work mechanism and the movement stroke of the substrate holding stage are It sets based on the board | substrate of the largest size to assume.

On the other hand, the pressing part of the electronic component in the mounting apparatus of a liquid crystal module is mounted using the fixed rotary head which dividedly mounted the mounting head which mounts members, such as TAB and COG, etc. (for example, Unexamined-Japanese-Patent Application Publication) See 2006-202877 publication.

Therefore, with enlargement of the liquid crystal panel size, since it sets based on the board | substrate of the largest size which also assumes the space size of the press-fitting part of an electronic component, it is increasing in size.

The fixed rotary head used for the press fitting part of the above-mentioned electronic component is shown in FIG. The liquid crystal panel (substrate) should be conveyed to the predetermined position (alignment, correction movement, mounting position) of the fixed rotary head 104 by pitch-shifting the place where the board | substrate 106 should be mounted.

Therefore, (1) the processing speed of the installation depends on the mounting capability of the rotary head.

(2) The required area of the equipment is required at least twice the maximum substrate size that the equipment is intended for. In other words, when the electronic components are sequentially arranged and mounted on the long side of the substrate, the rotary head is fixed, and therefore, it is necessary to move the substrate. In FIG. 9, when the length of the long side of the substrate is assumed to be L, since the substrate 106 needs to move the distance L in the right direction from the left direction in FIG. 9, for example, a required area of the equipment is required. It is necessary to secure more than 2L.

(3) Moreover, when the fixed rotary head 104 is arrange | positioned in multiple numbers with respect to one side of the board | substrate 106, there exists a problem which cannot respond to a mounting pitch change.

Accordingly, it is an object of the present invention to provide an electronic component mounting apparatus (pressure bonding apparatus) that can improve the processing capability as a facility while maintaining the required operation process time, and also enables the electronic component mounting to be processed in the minimum space. It is to provide an apparatus, and to provide an electronic component mounting apparatus which enables selection of a target head according to a mounting process.

In order to achieve the above object, the present invention provides an electronic component mounting apparatus for mounting an electronic component at a predetermined position of a panel, the electronic component supply unit supplying a plurality of electronic components mounted on the panel, and the electronic component supply unit. The electronic component mounting part which locates the mounted electronic component and mounts it on a panel, and the mobile mounting part which takes out an electronic component from an electronic component supply part, and moves and mounts the said electronic component to an electronic component mounting part, The panel arrange | positions an electronic component mounting part, The electronic component mounting part has a plurality of mounting heads which can be moved in parallel with respect to the processing edge on the panel for mounting the electronic component.

That is, the unit structure of a press fitting part is isolate | separated into an electronic component supply part, an electronic component movement mounting part, and an electronic component mounting part. Further, in the mounting portion, by allowing the plurality of mounting heads to move in parallel with the processing edge of the panel (substrate), the processing time can be shortened and the space can be reduced.

According to the present invention, it becomes possible to improve the processing capacity as a facility while maintaining the required operation process time.

In addition, processing can be performed in the minimum space. In addition, the target head can be selected according to the mounting process.

1 is a plan view showing a panel on which electronic components are mounted;
2 is a three-dimensional view of the electronic component mounting apparatus shown in the first embodiment.
3 is a plan view of the electronic component mounting apparatus shown in the first embodiment.
4 is a three-dimensional view of the electronic component mounting apparatus shown in the second embodiment.
5 is a plan view of the electronic component mounting apparatus shown in the second embodiment.
6 is a three-dimensional view of the electronic component mounting apparatus shown in the third embodiment.
7 is a plan view of the electronic component mounting apparatus shown in the third embodiment.
8 is a plan view of the electronic component mounting apparatus shown in the fourth embodiment.
9 is a plan view of a conventional stationary rotary head.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

(First embodiment)

First, the mounting form of the electronic component (for example, COF (approximately Chip on Film), etc.) to the panel (for example, liquid crystal display panel) 1 is shown in FIG. In FIG. 1, the long side and the short side of the lower substrate in the panel 1 are projected from the upper substrate by one side, respectively, and a plurality of electrons are respectively provided on the long side side protrusion 1a and the short side side protrusion 1b of these lower substrates. The component 2 is mounted.

Here, even if the electronic component 2 is COF, TAB, TCP, or FPC, the electronic component 2 includes the electrodes formed on the protrusions 1a or 1b of the lower substrate in the panel 1, and the electrons. The electrode on the component 2 side is mounted to be electrically connected using an anisotropic conductive film (ACF). This ACF (not shown) consists of disperse | distributing electrically conductive particle to binder resin uniformly, and the electrode of the electronic component 2 side, and the electrode of the panel 1 side are electrically connected through electroconductive particle. In addition, the binder resin is made of a thermosetting adhesive, and thermal compression is performed by pressing the electronic component 2 against the panel 1 under heating. However, in the mounting process, the electronic component 2 is bonded to the panel 1 with ACF attached in advance in a aligned state, and once pressed, the pressure is applied in a state where the binder resin is heated above the curing temperature of the binder resin. By acting, main compression is performed.

As described above, in order to mount the electronic component 2 on the panel 1, first, an ACF attaching step of attaching the ACF to a predetermined position of the panel 1, and the electronic component 2 are mounted and pressed. It consists of the press bonding process and main compression process. And in order to convey the panel 1 between these each process, the panel 1 is made to be conveyed by panel conveyance means (not shown).

The electronic component mounting apparatus which concerns on this invention performs this press bonding process.

First, the three-dimensional view of the electronic component mounting apparatus 200 demonstrated in this Example is shown in FIG. 2, and the top view is shown in FIG.

As shown in FIG. 2, as a main configuration of the electronic component mounting apparatus 200, an electronic component supply unit for holding an electronic component (here, an electronic component mounted on a COF will be described as an example) and taking out the same ( 4), the electronic component mounting parts 7a and 7b which press-bond the electronic component to the panel 1, and the electronic component moving mounting parts 6a and 6b for conveying the electronic component to the mounting head part.

In addition, the detail of each structural part is demonstrated using FIG. Here, the members arranged side by side, for example, the COF reels 3a, 3b and the pull-out molds 5a, 5b are arranged side by side, respectively, to prevent the equipment stop during COF reel exchange. For that. Therefore, in the following description, it demonstrates centering around the part shown by the right side of the figure (subscript a).

The electronic component supply unit 4 includes a COF reel 3a on which a COF having a plurality of electronic components 15 mounted thereon is wound on a tape, a pull-out mold 5a for punching out and taking out the electronic component on the tape; A straight electronic component extracting unit 11 for absorbing the extracted electronic component and conveying it to a predetermined position, and an electronic component conveying mechanism (X direction) 13 and Y for moving the straight electronic component extracting unit in the X direction. The electronic component conveyance mechanism (Y direction) 14 which moves to a direction is provided.

In addition, an electronic component collecting tray 16 for arranging and collecting a predetermined number of electronic components taken out (in this case, 16 cases in order) is sequentially provided in the vicinity of the electronic component supply unit 4.

In addition, the electronic component aggregation tray 16 has a suction function and is fixed.

The electronic component movement mounting portion 6a includes an electronic component pickup 17a having an adsorption head for sequentially taking out the electronic components 15 arranged on the electronic component intensive tray 16 one by one, and the electronic components 15. Of the mounting surface main body 18a which inverts the adhesive surface and the surface on the opposite side, and moves and loads the electronic component on the electronic component mounting portion 7a.

The moving mounting body main body 18a moves on the electronic component moving mounting part shaft 19 along the X direction parallel to the process side which mounts the electronic component of the panel 1 according to the position of the electronic component mounting part 7a.

The electronic component mounting portion 7a includes a mounting head 9 for mounting the electronic component 15 on the processing edge (for example, 1a shown in FIG. 1) of the panel 1 by pressing, and the mounting head 9. ) And a mounting slider 8a for moving in a predetermined direction.

The mounting slider 8a is equipped with the mechanism which can move on the mounting slider shaft 20 to an X direction.

Moreover, the electronic component mounting part 7a is provided with the electronic component and panel alignment camera 10a for detecting the alignment mark for position detection provided in the electronic component 15 and the panel 1, respectively.

Next, the operation of each component part will be described.

First, in order to take out the some electronic component formed in the COF reel, the pull-out mold 5a raises and, on the other hand, the linear member take-out part 11 falls. The linear member takeout part 11 receives the removed electronic component, and starts a rise. Thereafter, the electronic component conveyance mechanism (X direction) 13 and the electronic component conveyance mechanism (Y direction) 14 are moved to a predetermined position, and the electronic component 15 is moved to the electronic component aggregation tray 16. It conveys and arrange | positions the electronic component 15 sequentially at predetermined position.

In FIG. 3, sixteen electronic components are arranged in the electronic component aggregation tray 16. The number shown here is 16 because a maximum of 16 electronic components are usually arranged in the periphery of the panel to be the object of the present apparatus.

Next, one by one of the electronic components 15 arranged on the electronic component aggregation tray 16 is sucked up by the electronic component pickup 17a and lifted up. The arm part which supports the said electronic component pick-up is rotated 180 degrees, the front and back of the electronic component 15 are reversed, and the electronic component 15 is mounted on the electronic component mounting part 7a. Further, by rotating the arm portion by about 180 degrees, the electronic component 15 is reversed so that the electrodes of the electronic component 15 can be pressed against each other while facing the electrodes on the panel side.

The electronic component movement mounting portion 6a having the electronic component pickup moves on the shaft 19 for the electronic component movement mounting portion to a position suitable for delivering the electronic component 15 to the electronic component mounting portion 7a.

In addition, control of the positional relationship of the electronic component mounting part 6a and the electronic component mounting part 7a is performed by a control apparatus (not shown).

The electronic component mounting part 7a which received the electronic component 15 moves to the predetermined area | region of the periphery part (processing edge) of the panel 1 which presses the electronic component 15. FIG. The movement is performed by moving the mounting slider 8a on the electronic component mounting part shaft 20. The electronic component mounting portion 7a is moved in parallel with the processing side of the panel 1.

The mounting of the electronic component 15 on the panel 1 must be performed in a correctly positioned state. In other words, the electrodes provided on the electronic component 15 and the electrodes on the panel 1 side must be press-fitted so as to exactly match. To this end, the electronic component 15 and the panel 1 are each provided with alignment mark (not shown) for position detection, and are mounted so that these alignment marks may coincide with each other. In order to match this alignment mark, the alignment camera for electronic components and panels is provided as alignment mark detection means. The position shift of each other is detected based on the image acquired with the said alignment camera. And if there is a position shift between an electronic component and a panel, the position correction is performed. In this embodiment, two left and right cameras are provided.

In this way, when the alignment of the electronic component 15 and the panel 1 is complete | finished, a predetermined | prescribed pressing force will be applied to an electronic component, and pressure bonding to the panel 1 of the electronic component 15 is performed by this.

At this time, in this embodiment, the mounting head 9 is set to a desired temperature in the range of about 60 to 100 degrees, and the pressure to press is set to a desired pressure in the range of 20 to 98 N (Newton).

As for the mounting head 9 described above, the type of mounting head to be mounted on the mounting slider 8a can be selected according to the size of the electronic component to be mounted, the size of the panel, and the like. The mounting pitch can also be changed by adjusting the amount of movement of the mounting slider 8a.

As described above, for the sake of explanation, one or more parts (right side of the drawing) are mainly described as components, but the operation of the left side (signed subscript b) of the components is also right. It is the same as that of.

In addition, the operation relationship of mutual component parts is controlled by the control apparatus (not shown). For example, two of the electronic component mounting parts 7a and 7b are provided. For each mounting head, two sets of electronic components and panel alignment cameras are provided on the left and right sides of the mounting head. The operation relationship between the electronic component mounting parts 7a and 7b is controlled by the above-mentioned control apparatus.

In addition, although each component part, such as a mounting head, is demonstrated using several cases, they may be single.

The above operation is repeated sequentially and a predetermined number of electronic components are mounted on the periphery of the panel 1. Then, the panel 1 is conveyed by the following process, and the electronic component 15 is fixed to the panel 1 by pressurizing under heating, ie, performing main compression.

In addition, in the present embodiment, the case where the long side 1a and the short side 1b shown in FIG. 1 are mounted with the same type of electronic components in the panel 1 is described. It can also be mounted.

From the above description, according to the present embodiment, the following effects can be expected.

1) First, the position of the panel 1 is fixed. On the other hand, the electronic component mounting parts 7a and 7b provided with the mounting head for press-fitting the electronic component 15 move in parallel with the processing side of the panel 1. Thereby, since the panel 1 does not need to move, as shown in FIG. 9, the panel does not move about twice the distance of its peripheral length, so that at least the lateral direction (X direction) of the apparatus is approximately the panel. It can be made into the length of the periphery length, and the apparatus can be made compact.

2) Since the press-fitting operation of the electronic component mounting portions 7a and 7b is not limited to the supply operation of the electronic component 15, the working time of the press-fitting of the electronic component mounting portions 7a and 7b is determined by the electronic component mounting portions 7a and 7b. Can be determined by the processing speed, so that the apparatus can be processed at high speed.

3) In addition, when press bonding is completed for one panel, the panel is transferred to the main pressing process, which is the next step. On the other hand, the panel which press-bonds newly is conveyed from the upstream process. During this transfer, the operation of arranging the electronic components 15 from the electronic component supply section 4 to the electronic component aggregation tray 16 can be performed. As a result, the operation can be performed independently of the empty time (dead time) for transporting the panel 1, and thus, there is no need to stop and wait for the electronic component supply operation during panel transport, thereby speeding up the apparatus.

4) The target head can be selected according to the mounting process.

(2nd Example)

In this embodiment, each component part and its operation will be described centering on a part different from the first embodiment.

FIG. 4 and the top view of the electronic component implementation apparatus 201 demonstrated by a present Example are shown in FIG.

As shown in FIG. 4, as a main configuration of the electronic component mounting apparatus 201, an electronic component supply unit for holding an electronic component (here, an electronic component mounted on a COF will be described as an example) and taking out the same ( 4), the electronic component mounting parts 7a and 7b for pressing and attaching the electronic parts to the panel 1, and the electronic component collective moving mounting part 33 for collectively conveying the electronic parts to the mounting head part.

In addition, the detail of each structural part is demonstrated using FIG.

First, the taking-out mechanism of the electronic component in the electronic component supply part 4 is demonstrated. The extraction part of the electronic component is constituted by a three-part rotary electronic component extraction part 31. The electronic component 15 taken out by the extraction type | mold mold 5a is adsorbed and taken out by the three-part rotary electronic component take-out part 31. FIG. The three-segment rotary electronic component take-out part 31 has three electronic component take-out parts 30, and sequentially sucks and picks up the electronic part 15, and arranges them on the electronic component intensive tray 16. At this time, the electronic component aggregation tray 16 is movable in the X direction and the Y direction, and by the movement, the electronic component 15 can be arrange | positioned by the electronic component aggregation tray 16 in an appropriate position sequentially. In addition, the number of electronic components arranged in an electronic component intensive tray is 16 pieces. This number is the same as that described in the first embodiment.

Next, the electronic component movement mounting part 6 absorbs and picks up the electronic component 15 arranged in the electronic component intensive tray 16 by the adsorption head 32 provided in the electronic component collective movement mounting part 33. . In this embodiment, since eight suction heads 32 are provided, eight electronic components 15 are collectively adsorbed from the electronic component aggregation tray 16.

The electronic component batch movement mounting part 33 can move the electronic component 15 adsorbed by the adsorption head 32 to the electronic component mounting part 7a side by moving to the Y direction.

The electronic component mounting base 35 is provided in the mounting slider part 8a, and the eight electronic components 15 adsorb | sucked by the adsorption head 32 are collectively conveyed here, and an electronic component provisional part is carried out from the adsorption head 32. Mounted by moving to the cradle (35).

The mounting slider 8a further has an electronic component pickup 38, whereby the eight electronic components 15 arranged on the electronic component mounting base 35 are sequentially picked up. The picked-up electronic component 15 is moved in the Y direction, and is reversed during the movement to bring the pick-up head 9 to the desired position.

The mounting slider 8a moves on the electronic component movement mounting part shaft 37 in the X direction parallel to the periphery of the panel on which the electronic component is mounted.

In addition, in the present embodiment, the mounting head 9 is pivotal, and two heads are provided. The electronic component picked up by the electronic component pickup 38 is first delivered to the pivoted head 9x. The electronic component 15 is rotated by 180 degrees to the position of the head 9y which is located before the head 9x turns, thereby moving to the position where the electronic component of the panel peripheral part is pressed.

The mounting head 9 described above is similar to the first embodiment, and according to the size of the electronic component to be mounted, the size of the panel, and the like, the type of mounting head to be mounted on the mounting slider 8a can be selected.

Regarding the subsequent steps, the alignment of the electronic component and the panel, the work of pressing and the subsequent transfer to the main pressing are the same as in the case of the first embodiment.

In addition, control of the mutual operation relationship of each component part is controlled from a control apparatus similarly to 1st Embodiment.

From the above description, according to the present embodiment, the following effects can be expected.

1) By having a three-part rotary electronic component take-out part 31, the working time which arrange | positions the electronic component 15 to the electronic component aggregation tray 16 can be shortened.

2) Since the eight suction heads 32 installed in the electronic component collectively mount part 33 can move a large number of electronic components collectively, the movement time per electronic component toward the electronic component part 7a is shortened. can do.

3) Since a plurality of electronic components (here, eight) can be added to the electronic component mounting base 35, the vacant time for waiting for supply of the electronic components can be prevented, and the pressing work can be speeded up. .

4) Since the panel is not moved even in this embodiment, the compactness of the apparatus is the same as in the first embodiment.

5) The target head can be selected according to the mounting process.

(Third Embodiment)

In this embodiment, each component part and its operation will be described centering on a different part from the first embodiment.

FIG. 6 and the top view of the electronic component implementation apparatus 202 demonstrated in this embodiment are shown in FIG.

As shown in FIG. 6, as a main configuration of the electronic component mounting apparatus 202, an electronic component supply unit for holding an electronic component (here, an electronic component mounted on a COF will be described as an example) and taking out the same ( 4), the electronic component mounting part which press-bonds an electronic component to the panel 1, and the electronic component moving mounting parts ((1) 43 and (2) 44) for conveying an electronic component to a mounting head part.

In addition, the detail of each structural part is demonstrated using FIG.

The electronic component supply part 4 shown in this Example is characterized by including two pull-out molds 42a and four suction heads 40.

First, the taking-out mechanism of the electronic component in the electronic component supply part 4 is demonstrated. Two electronic components 15 are removed from the COF at a time by the two extraction mold 42a. The operation | movement of the metal mold | die 42a and the electronic component extraction at the time of taking out is the same as that of 1st Example. The two extracted electronic components are adsorbed by the four adsorption heads 40, and by the operation | movement of the following metal mold 42a and the electronic component extraction, two electronic components are pulled out and the four adsorption heads 40 are carried out. Is adsorbed. At this time, in the first adsorption work, the four adsorption heads 40 are two of the inner side (the upper side of the drawing) and the front side (the lower side of the drawing) in the two pull-out molds 42a (molds arranged on the right side of the drawing). In the next adsorption operation, the four adsorption heads 40 are the inner side (the upper side of the figure) and the front side (the figure) in two pull-out molds 42b (molds arranged on the left side of the figure). The lower two sides) are adsorbed, and a total of four are adsorbed and held.

Next, the electronic component provided on the shuttle 46b is provided with the inner electronic component adsorbed by the first work and held by the next adsorption work by the electronic component moving mounting part [(1) 43]. The component pickup 45b moves and mounts on the shuttle 46b. On the other hand, in the electronic component movement mounting part [(2) 44], the electronic component of the front side adsorbed and held by the first operation | work and the electronic component of the front side adsorbed by the following adsorption | suction operation are provided in the shuttle 46a. The parts are picked up and moved to the shuttle 46a by the pick-up 45a. The mounting base 47 is provided in the electronic component mounting part 7a, and the former two electronic components 15 are arrange | positioned here.

The two electronic components 15 held in the electronic component pickup 45a move in the Y direction by the shuttle 46a, and are mounted on the electronic component mounting portion 7a. At this time, the shuttle 46a can move on the shaft 48 for the electronic component moving mounting part in the X direction. Therefore, the shuttle 46a can move to the position according to the position of the electronic component mounting part 7a.

In addition, the electronic component mounting portion 7a can move on the mounting slider shaft 49 in the X direction.

Regarding the subsequent steps, the alignment of the electronic component and the panel, the work of pressing and the subsequent transfer to the main pressing are the same as in the case of the first embodiment.

As for the mounting head 9 described above, similarly to the first embodiment, the type of mounting head to be mounted on the mounting slider 8a can be selected according to the size of the electronic component to be mounted, the size of the panel, and the like.

In addition, control of the mutual operation relationship of each component part is controlled from a control apparatus similarly to 1st Embodiment.

From the above description, according to the present embodiment, the following effects can be expected.

1) By having two pull-out molds 42a and four adsorption heads 40, a plurality of electronic parts 15 can be taken out collectively and can be moved and mounted, and work time can be shortened.

2) Since the shuttle and the mounting slider can be moved independently in the X direction, the work time for transferring the electronic components can be shortened.

3) Since the panel is not moved even in this embodiment, the compactness of the apparatus is the same as in the first embodiment.

4) The target head can be selected according to the mounting process.

(Example 4)

In this embodiment, each component part and its operation will be described centering on a different part from the first embodiment.

8 is a plan view of the electronic component implementing apparatus 203 described in the present embodiment.

The electronic component supply part 4 shown in this embodiment is provided with the pull-out mold 42a and the two adsorption heads 50. As shown in FIG.

First, the taking-out mechanism of the electronic component in the electronic component supply part 4 is demonstrated. One electronic component 15 is pulled out from COF by the pull-out mold 42a. The operation | movement of the metal mold | die 42a and the electronic component extraction at the time of taking out is the same as that of 1st Example. One pulled out electronic component is attracted by the two adsorption heads 50, and one electronic component is pulled out and adsorbed by the two adsorption heads 50 by the operation | movement of the following metal mold 42a and an electronic component extraction. do.

In addition, in the present Example, although the extraction type | mold 42a shows the example of one removal, it is also possible to provide one or more apparatuses corresponding to one or more.

This embodiment differs from the third embodiment in that the means for moving and mounting the electronic component 15 adsorbed by the two adsorption heads 50 to the electronic component movement mounting portion 6a. That is, in this embodiment, the two adsorption heads 50 can move on the electronic component movement mounting portions (Y direction) 52a, 52b, and the electronic component movement mounting portions (Y direction) 52a, 52b are electronic components. The moving mount part (X direction) 51 can be moved.

By this mechanism, the electronic components adsorbed and held by the two adsorption heads 50 can be transferred to the electronic component pickup 53a, and the electronic components 15 adsorbed and held by the electronic component pickup 53a. ) Can be mounted on the electronic component mounting portion 7a by the shuttle 54a. The electronic component pickup 53b and the shuttle 54b are also similar to the electronic component pickup 53a and the shuttle 54a.

In addition, the electronic component movement mounting portion (Y direction) 52a and the electronic component movement mounting portion (Y direction) 52b are started under conditions that do not interfere with each other, and both of them take out the operation alternately.

Regarding the subsequent steps, the alignment of the electronic component and the panel, the work of pressing and the subsequent transfer to the main pressing are the same as in the case of the first embodiment.

As for the mounting head 9 described above, similarly to the first embodiment, the type of mounting head to be mounted on the mounting slider 8a can be selected according to the size of the electronic component to be mounted, the size of the panel, and the like.

In addition, control of the mutual operation relationship of each component part is controlled from a control apparatus similarly to 1st Embodiment.

From the above description, according to the present embodiment, the following effects can be expected.

1) The electronic component movement mounting portion (Y direction) 52a and the electronic component movement mounting portion (Y direction) 52b can also move in the direction of the electronic component movement mounting portion (X direction) 51, whereby the electronic component Since it can move in accordance with the X-direction movement of the movement mounting parts 6a and 6b, the transmission of the electronic component between the electronic component movement mounting part (Y direction) 52a and the electronic component movement mounting part (Y direction) 52b and an electronic component mounting part is carried out. Work time can be shortened.

2) Since the electronic component movement mounting portion (Y direction) 52a and the electronic component movement mounting portion (Y direction) 52b are operated alternately to take out the electronic component, the work time per electronic component can be shortened.

3) Since the panel is not moved even in this embodiment, the compactness of the apparatus is the same as in the first embodiment.

4) The target head can be selected according to the mounting process.

1: Panel
1a: Long side
1b: short side
2: electronic components
3a, 3b: COF Reel
4: electronic component supply unit
5a, 5b: Pull out mold
6a, 6b: Electronic component moving mount
7a, 7b: electronic component mounting part
8a, 8b: mounted slider
9, 9x, 9y: mounting head
10a, 10b: Alignment camera for electronic components and panels
11: nonlinear electronic component ejection unit
12: non-linear electronic component ejecting unit
13: Electronic component conveyance mechanism (X direction)
14: Electronic component conveyance mechanism (Y direction)
15: electronic components
16: electronic component intensive tray
17a, 17b: Electronic Component Pickup
18a, 18b: moving mount body
19: Shaft for electronic component moving part
20: shaft for mounting slider
30: electronic component extraction unit
31: three-part rotary electronic component ejecting unit
32: adsorption head
33: electronic parts batch movement mount
34: moving mount unit body
35: electronic component stand
36: swivel
37: Shaft for electronic component moving part
38: Electronic Component Pickup
40: 4 suction heads
41: direct type electronic component ejecting unit
42a, 42b: 2 pull out molds
43: electronic component moving mounting part (1)
44: electronic component moving mounting portion (2)
45a, 45b: electronic component pickup
46a, 46b: shuttle
47: stand
48: Shaft for electronic component moving part
49: axis for mounting slider
50: 2 suction heads
51: electronic component moving mounting part (X direction)
52: electronic component moving mounting part (Y direction)
53a, 53b: Electronic Component Pickups
54a, 54b: shuttle
55a, 55b: Electronic Component Mount
100: upstream unit of the pressing unit
101: pressing unit
102: downstream unit of the pressing unit
104: fixed rotary head
105: mounting head
106: panel in the initial position
107: panel after moving
108: panel support material
200: Stereoscopic view of the electronic component mounting apparatus shown in the first embodiment
201: A stereoscopic view of the electronic component mounting apparatus shown in the second embodiment
202: Three-dimensional view of the electronic component mounting apparatus shown in the third embodiment

Claims (9)

In the electronic component mounting apparatus which mounts an electronic component in predetermined location of a panel,
An electronic component supply unit for supplying a plurality of electronic components mounted on the panel;
An electronic component mounting portion for positioning and mounting the electronic component supplied from the electronic component supply portion on the panel;
It has an electronic component movement mounting part which takes out the said electronic component from the said electronic component supply part, and moves and mounts the said electronic component to the said electronic component mounting part,
The panel is fixedly positioned relative to the base on which the electronic component mounting portion is disposed,
The electronic component mounting apparatus has a mounting head that is movable in parallel with a processing edge of the panel for mounting the electronic component. The electronic component mounting apparatus according to claim 1, having at least two or more mounting heads. The electronic component mounting apparatus according to claim 1, wherein the electronic component movement mounting portion has a moving means movable in parallel with the processing edge of the panel. The electronic component mounting apparatus according to any one of claims 1 to 3, wherein the electronic component movement mounting portion has a means for collectively mounting a plurality of electronic components. The electronic component intensive means of Claim 1 or 2 which arrange | positions the electronic component taken out from the said electronic component supply part sequentially, and temporarily collects several of the said electronic component before it transfers to the said electronic component moving mounting part. The electronic component mounting apparatus characterized by having. The electronic component mounting apparatus according to any one of claims 1 to 3, wherein the electronic component supply unit has a means capable of taking out a plurality of electronic components collectively. The electronic component mounting apparatus according to any one of claims 1 to 3, wherein the electronic component mounting portion has a means for placing a plurality of electronic components. The electronic component mounting apparatus according to any one of claims 1 to 3, wherein the mounting head can select a type of the mounting head based on an installation specification of the electronic component to the panel. . The operation | work which mounts the said electronic component from the said electronic component supply part to the said electronic component movement mounting part, and the said electronic component mounting part carries out the said electronic component to the process side on the said panel in any one of Claims 1-3. An electronic component mounting apparatus comprising a control device that can be controlled so that work to be mounted is performed independently of time.

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