JP2013042070A - Mounting apparatus and mounting method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting apparatus which prevents a flexible printed circuit (FPC), temporarily crimped to a side part of a touch panel, from hitting on a backup tool and peeling when the FPC is finally crimped.SOLUTION: The mounting apparatus includes: a first backup tool supporting a lower surface of a side part to which an FPC of a substrate W placed on a temporary crimp stage 21 is temporarily crimped; a first mounting tool temporarily crimping the FPC to an upper surface of the side part of the substrate W with the lower surface of the substrate supported; a first final crimp stage 35 which the substrate W with the FPC temporarily crimped thereto is supplied and placed; a second backup tool which supports the lower surface of the side part to which the FPC of the substrate W is temporarily crimped by linearly moving the first final crimp stage 35, disposed so as to be lined with the first backup tool and on which the substrate W with the FPC temporarily crimped thereto is supplied and placed, in the lateral direction; and a second mounting tool finally crimping the temporarily crimped FPC to an upper surface of the side part of the substrate W with the lower surface supported by the second backup tool.

Description

  The present invention relates to an electronic component mounting apparatus and mounting method in which a plurality of electronic components are temporarily press-bonded to a side portion of a substrate and then main-bonded to be mounted.

  For example, in the assembly process of a substrate such as a touch panel or a display panel, electronic parts such as TCP (Tape Carrier Package), FPC (Flexible Printed Circuit) or bare chip are formed on the side of the substrate from a tape-like anisotropic conductive member. The mounting is performed through an adhesive tape.

  A mounting apparatus for mounting the electronic component on the side portion of the substrate with an adhesive tape has a supply portion for the substrate. The substrate is supplied from the supply unit to the temporary crimping unit, and the electronic component is temporarily crimped to the side portion of the substrate through the adhesive tape. Next, the electronic component that has been transported to the main press-bonding section and temporarily press-bonded to the side portion of the substrate at the main press-bonding section is finally press-bonded. And the board | substrate with which the electronic component was finally crimped | bonded by this crimping | compression-bonding part is discharged | emitted by the discharge part.

JP 2007-201375 A

  For example, when the substrate is a comparatively large touch panel having a size of 18 to 27 inches, the FPC as an electronic component is temporarily bonded to the side portion of the touch panel by the pressure-sensitive adhesive tape at the temporary pressure-bonding portion. It is designed to be permanently crimped.

  The FPC mounted on the touch panel is, for example, a relatively long and thin shape having a width dimension of 60 mm, a length dimension of 70 mm, and a thickness dimension of 200 μm or less, and a flexible one is used.

  Therefore, since the FPC temporarily bonded to the touch panel bends greatly downward, when the FPC is transported from the temporary pressure bonding part to the main pressure bonding part in order to perform the final pressure bonding of the touch panel to which the FPC is temporarily pressure bonded, The FPC provided in the crimping part may be temporarily pressure-bonded, or may come off from the touch panel by hitting a backup tool for mounting, or may be damaged.

  Even when the electronic component temporarily bonded to the substrate is bent and hangs downward, the electronic component is transferred from the temporary pressure bonding portion to the main pressure bonding portion. It is an object of the present invention to provide an electronic component mounting apparatus and mounting method that can be transported without hitting a backup tool of a crimping portion.

According to the present invention, a temporary press-bonding portion that temporarily press-bonds an electronic component to a side portion of a substrate via an adhesive tape, and an electronic component that is provided side by side and temporarily press-bonded at the temporary press-bonding portion are press-bonded. A mounting device having a main crimping part,
A temporary pressure-bonding stage in which the substrate before the electronic component is temporarily pressure-bonded on the upper surface is provided and mounted on the temporary pressure-bonded portion so that it can be driven along the direction in which the temporary pressure-bonded portion and the main pressure-bonded portion are juxtaposed. When,
The lower surface of the side portion to which the electronic component of the substrate placed on the temporary pressure-bonding stage is temporarily pressure-bonded is arranged along the direction in which the temporary pressure-bonded portion and the main pressure-bonded portion are juxtaposed to the temporary pressure-bonded portion. A supporting first backup tool;
First mounting means for temporarily press-bonding the electronic component to the upper surface of the side portion of the substrate whose lower surface is supported by the first backup tool;
A first final pressure-bonding stage provided on the main pressure-bonding portion, on which a substrate on which an electronic component is temporarily pressure-bonded to the side portion of the temporary pressure-bonding portion is supplied and placed;
A substrate on which the electronic component is temporarily press-bonded to the side portion in the temporary press-bonding portion is supplied and mounted on the main press-bonding portion in a line with the first backup tool along the direction parallel to the temporary press-bonding portion. A second back-up tool that supports the lower surface of the side portion on which the electronic component of the substrate is temporarily crimped by the first main crimping stage moving linearly in the lateral direction;
And a second mounting means for subjecting the electronic component temporarily press-bonded to the upper surface of the side portion of the substrate, the lower surface of which is supported by the second backup tool. In the electronic component mounting apparatus.

  When the substrate on which the electronic component is temporarily bonded by the temporary pressure bonding portion is transported to the main pressure bonding portion side along the longitudinal direction of the first backup tool by the temporary pressure bonding stage, the upper surface of the substrate is held. Then, the first pressure bonding stage is positioned below the substrate received from the temporary pressure bonding stage, and the substrate is then transferred to the first pressure bonding stage. -It is preferable that the pressure delivery means is provided.

The first backup tool of the temporary crimping part is divided into two backup tool parts that can be driven in the direction of contact and separation at the central part in the longitudinal direction,
In order to temporarily press-bond an electronic component to two side portions of one side portion of the substrate and the other side portion opposed to the one side, the substrate having the electronic component temporarily bonded to one side portion is 180. When the first backup tool is used to support the lower surface of the other side portion with the first backup tool, the two backup tool portions are spaced apart from the side portion of the substrate so as not to interfere with the substrate that is rotationally driven. It is preferable to drive in a direction away from

The main pressure-bonding portion includes a main pressure-main pressure delivery means for holding the upper surface of the substrate when the electronic component held by the first main pressure-bonding stage and temporarily bonded to one side is pressure-bonded, and the book. Having a second final pressure-bonding stage that is held by the pressure-main pressure delivery means and enters the lower surface side of the substrate and holds the substrate when the electronic component on one side is finally pressure-bonded;
When the electronic component temporarily bonded to one side of the substrate is finally bonded, and then the substrate is rotated 180 degrees and the electronic component temporarily bonded to the other side facing the one side is finally bonded. The second final crimping stage rotates the substrate by linearly moving to the side of the second backup tool to a position where the substrate held on the upper surface does not interfere with the second backup tool. It is preferable to return to the position and to support the lower surface of the other side portion of the substrate by the second backup tool.

  When the substrate on which the electronic component temporarily bonded to one side and the other side is finally bonded is carried out to the side of the second backup tool by the second final pressing stage, the second It is preferable that the apparatus is provided with unloading means for holding and receiving the upper surface of the substrate from the main pressure bonding stage and transporting the discharge unit.

The present invention provides a main press-bonding portion that press-bonds an electronic component to a side portion of a substrate via an adhesive tape at a temporary press-bonding portion and then press-bonds the electronic component with a main press-bonding portion arranged side by side on the temporary press-bonding portion. A mounting method comprising:
Supplying the substrate before the electronic component is temporarily crimped to the temporary crimping portion;
A step of supporting the lower surface of the side part to which the electronic component of the substrate supplied to the temporary crimping part is temporarily crimped by a first backup tool;
Temporarily bonding the electronic component to the upper surface of the side portion of the substrate whose lower surface is supported by the first backup tool;
The substrate on which the electronic component is temporarily crimped on the side portion at the temporary crimping portion is linearly moved along the direction of juxtaposition with the temporary crimping portion to the main crimping portion, and along the juxtaposing direction with the temporary crimping portion. Supporting the lower surface of the side portion of the substrate by a second backup tool arranged in a row with the first backup tool;
Mounting the electronic component temporarily bonded to the upper surface of the side portion of the substrate whose lower surface is supported by the second backup tool. It is in.

  The first backup tool of the temporary crimping portion and the second backup tool of the final crimping portion are arranged in a line, and the substrate on which the electronic component is temporarily crimped to the side portion by the temporary crimping portion is temporarily bonded to the final crimping portion. And moved in a straight line along the parallel direction.

  Therefore, even if the electronic component hangs down by being temporarily crimped to the side portion of the substrate, the electronic component is moved in a straight line along the direction in which the main crimping portion and the temporary crimping portion are arranged. Since the first backup tool and the second backup tool do not collide, the electronic component can be prevented from being peeled off or damaged.

The front view of the mounting apparatus which shows one embodiment of this invention. The top view of the mounting apparatus shown in FIG. (A) is explanatory drawing when FPC is temporarily crimped | bonded to the one side part of a board | substrate, (b) is a side view similarly. Explanatory drawing of the state by which the pair of backup tool parts of the 1st backup tool were driven in the separation direction after FPC was temporarily pressure-bonded to one side of the substrate. Explanatory drawing of the state which rotates the said board | substrate 180 degree | times in the position where a pair of backup tool part separated and the board | substrate was driven in the direction which retreats from a 1st backup tool. Explanatory drawing of the state driven to the direction of a pair of backup tool part which left | separated the board | substrate rotated 180 degree | times. (A) is explanatory drawing of the state which pressure-bonded FPC to the other side part of the board | substrate, (b) is a side view similarly. Explanatory drawing of the mechanism in which FPC is temporarily crimped | bonded to the side part of the board | substrate provided in the temporary crimping part. Explanatory drawing of the state which moves the board | substrate by which FPC was temporarily crimped | bonded to a pair of side part to a main crimping | compression-bonding part. (A) is explanatory drawing of the state by which the other side part of the board | substrate by which FPC was temporarily crimped | bonded to a pair of side part was supported by the 2nd backup tool, (b) is a side view similarly. (A) is explanatory drawing of the state which hold | maintained the upper surface of the board | substrate by the 3rd delivery means, when FPC temporarily crimped | bonded to the other side part of a board | substrate is crimped | bonded, (b) is also a side view. FIG. 6 is an explanatory diagram of a state in which the substrate is moved to a position away from a second backup tool in order to rotate 180 degrees and finally press-bond the FPC on one side portion after the main-bonding FPC on the other side portion of the substrate. (A) is explanatory drawing of the state which carries out the main crimping | compression-bonding of FPC of the one side part of a board | substrate, (b) is a side view similarly.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a front view of the mounting apparatus, and FIG. 2 is a plan view. The mounting apparatus includes a base 1. The substrate 1 has a substantially rectangular planar shape, and the upper surface thereof has a supply part 2 of a substrate W such as a touch panel from one end side to the other end side in the longitudinal direction, and an adhesive which will be described later on a side part of the substrate W. A plurality of, for example, FPCs 9 as four electronic components on one side part on the upper surface of the side part where the adhesive tape 8 of the substrate W is attached, the ACF attaching part 3 for attaching the tape 8 (ACF). As will be described later, the temporary press-bonding portion 4 for temporary press-bonding, the main press-bonding portion 5 for finally press-bonding the FPC 9 temporarily press-bonded to the upper surface of the side edge portion by the temporary press-bonding portion 4 A discharge unit 6 from which the substrate W is carried out is provided.

  Here, as shown in FIGS. 1 and 2, the longitudinal direction of the substrate 1 is defined as the Y direction, and the direction orthogonal to the Y direction is defined as the X direction. Further, as shown in FIG. 1, a direction orthogonal to a plane formed by the Y direction and the X direction is defined as a Z direction.

  As shown in FIG. 1, the supply unit 2 includes a mounting table 10 that is driven in the vertical direction by an elevator 11, and a plurality of the substrates W are stacked on the upper surface of the mounting table 10. A plate-like panel supply means 12 having a plurality of suction pads 12 a on the lower surface is provided above the mounting table 10 so as to be driven in the Y direction by a first Y drive source 13.

  When the mounting table 10 is driven upward in the Z direction, the panel supply means 12 sucks and holds the upper surface of the uppermost substrate W of the mounting table 10 by the suction pads 12a. After suction, the panel supply means 12 is driven in the -Y direction, positioned at the first delivery position D1, and stands by.

  At the first delivery position D1, the adhering stage 15 provided in the ACF adhering unit 3 is waiting to move in order to receive the substrate W from the panel supply means 12. The adhering stage 15 is driven by the first X, Y, Z, and θ driving source 16 shown in FIG. 1 in the X direction, the Y direction, the Z direction, and the θ direction that is a rotation direction about the vertical axis. It has become.

  And the said sticking stage 15 raises to a Z direction in the 1st delivery position D1, receives the board | substrate W from the said panel supply means 12, and carries out adsorption | suction holding | maintenance on the upper surface. The planar shape of the bonding stage 15 is a rectangular shape smaller than the substrate W, and the substrate W sucked and held by the bonding stage 15 has its peripheral portion outward from the peripheral edge of the bonding stage 15. It is protruding.

  The sticking stage 15 that has received the substrate W is driven in the −Y direction from the first delivery position D1 and moves to the sticking position indicated by P1. Next, the sticking stage 15 is driven in the + X direction toward the sticking mechanism 17 as shown in FIG. 2, and the adhesive tape 8 cut to a predetermined length on the side of the substrate W by the sticking mechanism 17. Is pasted.

  In addition, since the adhesion | attachment mechanism 17 which adheres the adhesive tape 8 to the side part of the board | substrate W is known, detailed description is abbreviate | omitted individually.

  The FPC 9 may be stuck not only on one side of the substrate W but also on the other side facing the one side. In that case, the sticking mechanism 17 adheres to one side of the substrate W. After the tape 8 is stuck, the sticking stage 15 is retracted in the −X direction, and then the sticking stage 15 is rotated 180 degrees. Next, the bonding stage 15 is driven in the + X direction toward the bonding mechanism 17, so that the substrate W is not only on one side but on the other side as shown in FIG. Also, the adhesive tape 8 is attached.

  In this embodiment, after the adhesive tape 8 is attached to one side and the other side of the substrate W, the FPC 9 is temporarily pressure-bonded to the one side and the other side, and then the main pressure is applied. The case will be described.

  When the adhesive tape 8 is attached to the pair of side portions of the substrate W, the attaching stage 15 is moved in the −X direction and then driven in the minus Y direction to be positioned at the second delivery position D2. . Above the second delivery position D2, a first delivery means 19 having a suction pad 19a on the lower surface is fixedly arranged. The first delivery means 19 is provided at the same position as the panel supply means 12 in the X direction.

  When the sticking stage 15 is positioned below the first delivery means 19, which is the second delivery position D2, the sticking stage 15 rises and the substrate W on the upper surface thereof is moved to the first delivery position D2. It is delivered to the delivery means 19.

  The bonding stage 15 transfers the substrate W to the first delivery means 19 and then returns to the first delivery position D1 to receive the substrate W to which the adhesive tape 8 is not attached from the panel supply means 12. Become.

  When the first delivery means 19 receives the substrate W, the temporary press-bonding stage 21 is positioned below the first delivery means 19. As shown in FIG. 1, the temporary press-bonding stage 21 is driven in the X, Y, Z, and θ directions by a second X, Y, Z, and θ drive source 22.

  The temporary crimping stage 21 is positioned at the second delivery position D2 below the first delivery means 19, and then is driven upward in the Z direction to be held by the first delivery means 19 on the substrate W. Receive.

  The temporary pressure-bonding stage 21 that has received the substrate W is driven in the -Y direction and positioned at the temporary pressure-bonding position of the temporary pressure-bonding portion 4 shown by P2 in FIG. As will be described below, four FPCs 9 are sequentially temporarily pressure-bonded to the upper surfaces of the attached one side portion and the other side portion.

  As shown in FIG. 2, the temporary pressure bonding portion 4 has a tray loader 24 in which a plurality of trays 23 in which the FPCs 9 are accommodated are stacked. The upper surface of the FPC 9 accommodated in the tray 23 is taken out by the first suction head 26 of the transport means 25 driven in the X, Y, and Z directions, and the suction surface is raised on the index table 27 shown in FIG. Toward the plurality of second suction heads 28 provided at predetermined intervals in the circumferential direction.

  The FPC 9 held by the second suction head 28 is delivered to a first mounting tool 29 as first mounting means. The first mounting tool 29 is provided above the index table 27 so as to be driven in the X, Y, and Z directions by the XY drive mechanism 29a and the Z drive mechanism 29b.

  Then, the first mounting tool 29 that has received the FPC 9 from the second suction head 28 is the adhesive tape 8 of the substrate W positioned by the temporary pressure-bonding stage 21 at the temporary pressure-bonding position P2 of the temporary pressure-bonding portion 4. The FPC 9 is temporarily pressure-bonded to the upper surface of the side part to which is attached as follows.

  That is, the substrate W received from the second delivery position D2 and positioned at the temporary pressure bonding position P2 by the temporary pressure bonding stage 21 has a pressure-sensitive adhesive tape 8 attached thereto as shown in FIG. The entire length of the lower surface of the side portion is supported by the first backup tool 31. The first backup tool 31 is arranged with its longitudinal direction along the Y direction, and is divided into two left and right backup tool portions 31a and 31b at the center in the longitudinal direction. These backup tool portions 31a and 31b are provided so as to be driven along the Y direction.

  As shown in FIG. 3A, the two backup tool portions 31a and 31b are in contact with the end surfaces, and the end surfaces of the backup tool portions 31a and 31b are the width dimensions of the substrate W as shown in FIG. It is driven in the Y direction between the separated states separated by a slightly larger interval.

  The temporary crimping stage 21 that has received the substrate W at the temporary crimping position P2 is driven in the + X direction so that one side of the substrate W faces the upper surface of the first backup tool 31. Next, it is driven upward in the Z direction and the lower surface of one side of the substrate W is supported by the first backup tool 31. This state is shown in FIG.

  In a state where the lower surface of one side of the substrate W is supported by the first backup tool 31, the four FPCs 9 are sequentially temporarily crimped to the upper surface of the one side by the first mounting tool 29 at predetermined intervals. . This state is shown in FIG.

  When the FPC 9 is temporarily press-bonded to one side portion of the substrate W, the backup tool portions 31a and 31b are driven in a direction in which the backup tool portions 31a and 31b are separated at a slightly larger interval than the width dimension of the substrate W. This state is shown in FIG.

  Next, the temporary press-bonding stage 21 raises the substrate W in the + Z direction, and then drives the substrate W in the −X direction until it is positioned on the −X side of the backup tool portions 31a and 31b as shown in FIG. , Rotate 180 degrees as indicated by the arrow.

  Thereafter, as shown in FIG. 6, the lower surface of the other side of the substrate W is driven in the + X direction so that it is at the same position as the pair of backup tool portions 31 a and 31 b separated from the first backup tool 31 in the X direction. Is done.

  When the lower surface of the other side portion of the substrate W is positioned at the same position in the X direction as the first backup tool 31, the pair of backup tools 31a and 31b in the separated state are driven in the contact direction indicated by the arrows. Thus, the substrate W is driven in the −Z direction by the provisional pressure bonding stage 21. Accordingly, the lower surface of the other side portion of the substrate W is supported by the pair of backup tools 31a and 31b of the first backup tool 31 as shown in FIG.

  When the lower surface of the other side portion of the substrate W is supported by the first backup tool 31, the four FPCs 9 are temporarily press-bonded to the upper surface of the other side portion by the first mounting tool 29. That is, the FPC 9 is temporarily bonded to the upper surfaces of the one side and the other side of the substrate W, respectively.

  Since the FPC 9 is relatively long and made of a flexible material, when one end in the longitudinal direction is temporarily pressure-bonded to the side of the substrate W, the other end is bent toward the lower surface of the substrate W. It will be. Therefore, when the FPC 9 is temporarily crimped to one side portion of the substrate W and then temporarily crimped to the other side portion, the FPC 9 is moved downward in the −X direction to a position disengaged from the first backup tool 31 and then rotated downward by 180 degrees. There is a possibility that the FPC 9 hanging on the substrate hits the first backup tool 31 and peels off from the substrate W.

  However, when the substrate W is moved in the −X direction and rotated 180 degrees as shown in FIG. 5, the two backup tool portions 31a and 31b of the first backup tool 31 are moved to the substrate W as shown in FIG. It was made to separate at intervals larger than the width dimension.

  Therefore, when the substrate W is moved in the −X direction, it is possible to prevent the FPC 9 temporarily bonded to one side of the substrate W from colliding with the first backup tool 31, and further rotated 180 degrees at a position retracted in the −X direction. It is possible to prevent the first backup tool 31 from colliding with the first backup tool 31.

  Therefore, when the FPC 9 is temporarily crimped to one side of the substrate W and then rotated to 180 degrees after the substrate W is retracted in the −X direction in order to temporarily crimp the other side, one side of the substrate W Thus, it is possible to reliably prevent the FPC 9 temporarily press-fitted to the drop-out or damage.

  If the FPC 9 is temporarily crimped to the other side of the substrate W in this way, the temporary crimping stage 21 on which the substrate W is placed is driven in the -Y direction, as shown in FIG. Next, the substrate W is positioned at the third delivery position D3. The third delivery position D3 is located on the + X direction side from the first and second delivery positions D1 and D2 by the amount indicated by S in FIG.

  That is, the third delivery position D3 corresponds to the case where the substrate W on which the FPC 9 is temporarily bonded to the other side on the first backup tool 31 is moved in the −Y direction without moving in the X direction. In position.

  Above the third delivery position D3, second delivery means 33 serving as provisional pressure-main pressure delivery means having a plurality of suction pads 33a provided on the lower surface is fixedly disposed. Accordingly, after the temporary pressure bonding stage 21 positions the substrate W at the third delivery position D3, the substrate W is delivered to the second delivery means 33 by being driven upward in the Z direction.

  The temporary press-bonding stage 21 that has transferred the substrate W to the second transfer means 33 returns to the second transfer position D2, and receives the substrate W on which the FPC 9 has not been pre-bonded from the first transfer means 19. Become.

  When the second transfer means 33 receives the substrate W, a third X, Y, Z, and θ driving source 34 supplies X, X, below the second transfer means 33, that is, the third transfer position D3. A first final crimping stage 35 driven in the Y, Z and θ directions is positioned. The first final crimping stage 35 is provided in the final crimping section 5.

  The first final crimping stage 35 positioned below the second delivery means 33 is driven upward in the Z direction, and after receiving the substrate W from the second delivery means 33, it is driven downward in the Z direction. . Next, the first final press-bonding stage 35 is driven in the −Y direction indicated by an arrow in FIG. 9 to position the substrate W at the final press-bonding position P3 as shown in FIG.

  A second backup tool 36 is disposed at the main press-bonding position P3 of the main press-bonding portion 5 so as to be aligned with the first backup tool 31 of the temporary press-bonding portion 4 in the Y direction. That is, the first backup tool 31 and the second backup tool 36 are provided at the same position in the X direction.

  Then, the first main press-bonding stage 35 positions the lower surface of the other side portion to which the FPC 9 of the substrate W is temporarily press-bonded above the second backup tool 36.

  Next, the first main press-bonding stage 35 is driven downward in the Z direction, and the lower surface of the other side of the substrate W is supported by the upper surface of the second backup tool 36 as shown in FIG. The Above the second backup tool 36, a second mounting tool 37 as second mounting means is provided so as to be driven in the vertical direction.

  When the lower surface of the side portion (other side portion) of the substrate W is supported by the first main press-bonding stage 35, the second mounting tool 37 is moved downward as shown in FIG. Driven. As a result, the four FPCs 9 temporarily bonded to the side portion (other side portion) of the substrate W are collectively bonded together.

  When the second crimping of the FPC 9 on the other side of the substrate W is started by the second mounting tool 37, it can be driven in the Z direction by the Z drive source 38 above the final crimping position P3 as shown in FIG. The third delivery means 39 as the main pressure-actual pressure delivery means provided on the lower side is driven downward, and the upper surface of the substrate W during the main pressure bonding is sucked and held by the suction pad 39a provided on the lower surface thereof. This state is shown in FIG.

  When the third delivery means 39 sucks and holds the upper surface of the substrate W during the main pressure bonding, the first main pressure bonding stage 35 is driven downward as shown in FIG. 11B to move away from the lower surface of the substrate W. After that, it is driven in the plus Y direction to return to the third delivery position D3, where it receives the substrate W on which the FPC 9 is temporarily bonded to both sides from the second delivery means 33.

  On the other hand, when the first final crimping stage 35 returns from the final crimping position P3 to the third delivery position D3, the fourth X / Y / Z / θ drive source 41 provided in the final crimping section 5 The second final crimping stage 42 driven in the Y, Z, and θ directions is positioned on the lower surface side of the substrate W on which the upper surface is held by the third delivery means 39 at the final crimping position P3.

  Next, the second final press-bonding stage 42 is driven upward in the Z direction to hold the lower surface of the substrate W. At the same time, the holding of the upper surface of the substrate W by the suction nozzle 39a of the third delivery means 39 is released, and the third delivery means 39 is driven upward in the Z direction.

  When the final crimping of the FPC 9 on the other side of the substrate W is completed, the second final crimping stage 42 is driven upward in the Z direction to lift the lower surface of the substrate W from the upper surface of the second backup tool 36. Thereafter, it is driven in the −Y direction as indicated by an arrow in FIG. 12 without being driven in the X direction.

  Then, at the position where the substrate W is disengaged from the second backup tool 36, the second main crimping stage 42 is driven to rotate 180 degrees to change the position of one side and the other side of the substrate W in the X direction. . That is, one side portion of the substrate W is opposed to the second backup tool 36.

  In this state, the second final crimping stage 42 is driven in the + Y direction to a position where the lower surface of one side of the substrate W faces the upper surface of the second backup tool 36 as shown in FIG. After that, it is driven downward in the Z direction. As a result, the lower surface of the one side portion of the substrate W is supported by the second backup tool 36, and thus the second mounting tool 37 is driven in the downward direction as shown in FIG. 13B. Thus, the plurality of FPCs 9 temporarily bonded to one side of the substrate W are collectively pressure bonded together like the other side.

  In this way, when the FPC 9 temporarily bonded to one side of the substrate W and then to the other side is finally bonded, the second final bonding stage 42 is driven upward in the Z direction to move the lower surface of the substrate W down. After floating from the upper surface of the second backup tool 36, the substrate W is driven in the −Y direction to a position where it is removed from the second backup tool 36, and the substrate W is positioned at the fourth delivery position D4.

  The fourth delivery position D4 is provided with unloading means 44 that is driven in the Y direction by the second Y drive source 43 and has a suction pad 44a on the lower surface. Therefore, when the substrate W is positioned at the fourth delivery position and the second final pressure bonding stage 42 is driven in the upward direction, the substrate W on the upper surface of the second final pressure bonding stage 42 is moved to the second second pressure bonding stage 42. The material is transferred from the main pressure bonding stage 42 to the unloading means 44.

  The unloading means 44 that has received the substrate is driven in the -Y direction, and is positioned above the mounting table 46 driven in the Z direction by the elevator 45 provided in the discharge unit 6, that is, at the fifth delivery position D5. . Next, the elevator 45 is driven in the upward direction, and the mounting table 46 receives the substrate W on which the FPC 9 is finally bonded to the pair of side portions from the carry-out means 44. The substrate W received by the mounting table 46 is transferred to the next process by a robot or the like (not shown).

  The FPC 9 is temporarily crimped to one side and the other side at the temporary crimping section 4, and the substrate W transported to the third delivery position D 3 by the temporary crimping stage 21 is transferred to the first book of the final crimping section 5. The substrate W is linearly moved in the minus Y direction by the first final crimping stage 35 when it is transferred to the final crimping position P3 after being delivered to the crimping stage 35.

  That is, after temporarily bonding the FPC 9 to one side portion of the substrate W and then temporarily pressing the FPC 9 to the other side portion, the FPC 9 is temporarily moved by moving it only in the Y direction without moving the substrate W in the X direction. The other side part thus crimped is supported by the second backup tool 36 of the main crimping part 5.

  Therefore, the FPC 9 that is temporarily press-bonded to the other side portion of the substrate W and hangs downward does not collide with the second backup tool 36, and the other side portion of the substrate W is brought into contact with the second backup tool 36. Therefore, it is possible to prevent the FPC 9 temporarily bonded to the other side portion of the substrate W from being peeled off or damaged.

  After the main pressure-bonding of the FPC 9 temporarily bonded to the other side portion of the substrate W, when the main pressure bonding of the FPC 9 temporarily bonded to the one side portion is performed, the second final pressure bonding stage 42 supporting the substrate W is set in the −Y direction. When the substrate W is driven and rotated away from the second backup tool 36, the substrate W is rotated 180 degrees and then moved in the + Y direction so that one side of the substrate W is moved to the second backup tool. The FPC 9 supported by 36 and temporarily press-bonded to the one side portion is finally press-bonded.

  Therefore, when the FPC 9 temporarily bonded to one side portion of the substrate W is finally bonded, the FPC 9 temporarily bonded to the one side portion is hit against the second backup tool 36 to cause peeling or damage. Can be surely prevented.

  In order to deliver the substrate W held on the upper surface of the sticking stage 15 to the temporary pressure bonding stage 21, the first delivery means 19 is fixedly disposed above the stages 15 and 21. Further, in order to deliver the substrate W held on the upper surface of the temporary pressure-bonding stage 21 to the first main pressure-bonding stage 35, the second transfer means 33 is fixedly disposed above the stages 21 and 35.

  That is, the first delivery means 19 and the second delivery means 33 for delivering the substrate W to each stage 15, 21, 35 are arranged in a three-dimensional manner in the vertical direction. Therefore, the length of the entire mounting apparatus in the Y direction can be shortened and the apparatus can be downsized.

  In the above embodiment, in order to temporarily press-bond the FPC to the side portion of the substrate at the ACF attachment portion, the adhesive tape is attached to the upper surface of the side portion of the substrate. A cut adhesive tape may be attached in advance, and the FPC with the adhesive tape attached may be supplied to the substrate at the temporary pressure bonding portion. By doing so, the ACF adhering portion becomes unnecessary, and the mounting apparatus can be downsized.

  In the above-described embodiment, the FPC is temporarily bonded to a pair of opposing side portions of the substrate, and then the main bonding is described. However, the present invention is applied to the case where the FPC is mounted only on one side of the substrate. May be.

  Further, the substrate is not limited to a touch panel, and any substrate may be used as long as an electronic component is mounted on a side portion such as a liquid crystal display panel. The electronic component is not limited to FPC, but is made of a flexible material such as TCP. Other electronic components may be used.

  In addition, the first backup tool of the temporary crimping part is divided into two backup tool parts so that it can be driven in the opening and closing direction, and if the FPC is temporarily crimped to one side of the substrate, the two backup tool parts are After opening, the substrate was retracted in the −X direction, rotated 180 degrees, and then advanced in the + X direction to temporarily press-bond the FPC to the other side portion of the substrate.

  Instead, if the first backup tool is the same as the second backup tool of the main crimping part and the FPC is temporarily crimped to one side of the board, the board is mounted on the first backup tool. Move it in the -Y direction to a position where it comes off the tool, rotate it 180 degrees, and then move it in the + Y direction to support the other side with the first backup tool, and temporarily crimp the FPC to the other side You may do it.

  In addition, the second back-up tool for the main press-bonding section is one, and the main press-bonding section is provided with first and second main press-bonding stages, and the substrate is transferred from the temporary press-bonding section to the first main press-bonding stage. When the FPC temporarily crimped to the other side portion of the substrate is finally crimped, it is transferred to the second final crimping stage, and the final crimping of the FPC temporarily crimped to the other side portion is completed. The second final crimping stage is moved in the −Y direction to a position where the substrate comes off from the second backup tool, and then rotated 180 degrees to return to the + Y direction, and the FPC temporarily crimped to one side is finally crimped. I tried to do it.

  Instead, similarly to the first backup tool, the second backup tool is divided into two backup tool parts that are driven so as to be able to come into contact with and separated from each other, and the other side of the substrate delivered to the first main pressure bonding stage. When the substrate is delivered to the second final crimping stage and the final crimping is completed, the two backup tool portions of the second backup tool are driven in the separating direction, The second main press-bonding stage may be moved backward in the −X direction to rotate the substrate by 180 degrees, and then driven in the + X direction so that the FPC temporarily press-bonded to one side portion of the substrate may be finally pressed.

  In addition, if the main press-bonding section is provided with the first main press-bonding stage and the second main press-bonding stage and the main press-bonding is started, the first main press-bonding stage is attached to the substrate on which the FPC is temporarily press-bonded. Productivity is improved by letting it go to receive, but even if only one main crimping stage is provided in the main crimping section, the FPC temporarily crimped to the other side and one side of the substrate This can be crimped.

  DESCRIPTION OF SYMBOLS 2 ... Supply part, 3 ... ACF sticking part, 4 ... Temporary pressure bonding part, 5 ... Final pressure bonding part, 6 ... Discharge part, 8 ... Adhesive tape, 9 ... FPC (electronic component), 15 ... Sticking stage, 21 ... Temporary crimping stage, 29 ... first mounting tool, 31 ... first backup tool, 31a, 31b ... backup tool section, 33 ... second delivery means (temporary pressure-main pressure delivery means), 35 ... first A final crimping stage 36, a second backup tool 37, a second mounting tool 42, a second final crimping stage.

Claims (6)

A temporary pressure-bonding part that temporarily press-bonds an electronic component to the side of the substrate via an adhesive tape, and a main pressure-bonding part that is bonded to the side of the temporary pressure-bonded part and is temporarily pressure-bonded by the temporary pressure-bonding part. A mounting apparatus comprising:
A temporary pressure-bonding stage in which the substrate before the electronic component is temporarily pressure-bonded on the upper surface is provided and mounted on the temporary pressure-bonded portion so that it can be driven along the direction in which the temporary pressure-bonded portion and the main pressure-bonded portion are juxtaposed. When,
The lower surface of the side portion to which the electronic component of the substrate placed on the temporary pressure-bonding stage is temporarily pressure-bonded is arranged along the direction in which the temporary pressure-bonded portion and the main pressure-bonded portion are juxtaposed to the temporary pressure-bonded portion. A supporting first backup tool;
First mounting means for temporarily press-bonding the electronic component to the upper surface of the side portion of the substrate whose lower surface is supported by the first backup tool;
A first final pressure-bonding stage provided on the main pressure-bonding portion, on which a substrate on which an electronic component is temporarily pressure-bonded to the side portion of the temporary pressure-bonding portion is supplied and placed;
A substrate on which the electronic component is temporarily press-bonded to the side portion in the temporary press-bonding portion is supplied and mounted on the main press-bonding portion in a line with the first backup tool along the direction parallel to the temporary press-bonding portion. A second back-up tool that supports the lower surface of the side portion on which the electronic component of the substrate is temporarily crimped by the first main crimping stage moving linearly in the lateral direction;
And a second mounting means for subjecting the electronic component temporarily press-bonded to the upper surface of the side portion of the substrate, the lower surface of which is supported by the second backup tool. Electronic component mounting device.   When the substrate on which the electronic component is temporarily bonded by the temporary pressure bonding portion is transported to the main pressure bonding portion side along the longitudinal direction of the first backup tool by the temporary pressure bonding stage, the upper surface of the substrate is held. Then, the first pressure bonding stage is positioned below the substrate received from the temporary pressure bonding stage, and the substrate is then transferred to the first pressure bonding stage. The electronic component mounting apparatus according to claim 1, further comprising a main pressure delivery unit. The first backup tool of the temporary crimping part is divided into two backup tool parts that can be driven in the direction of contact and separation at the central part in the longitudinal direction,
In order to temporarily press-bond an electronic component to two side portions of one side portion of the substrate and the other side portion opposed to the one side, the substrate having the electronic component temporarily bonded to one side portion is 180. When the first backup tool is used to support the lower surface of the other side portion with the first backup tool, the two backup tool portions are spaced apart from the side portion of the substrate so as not to interfere with the substrate that is rotationally driven. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is driven in a direction away from each other. The main pressure-bonding portion includes a main pressure-main pressure delivery means for holding the upper surface of the substrate when the electronic component held by the first main pressure-bonding stage and temporarily bonded to one side is pressure-bonded, and the book. Having a second final pressure-bonding stage that is held by the pressure-main pressure delivery means and enters the lower surface side of the substrate and holds the substrate when the electronic component on one side is finally pressure-bonded;
When the electronic component temporarily bonded to one side of the substrate is finally bonded, and then the substrate is rotated 180 degrees and the electronic component temporarily bonded to the other side facing the one side is finally bonded. The second final crimping stage rotates the substrate by linearly moving to the side of the second backup tool to a position where the substrate held on the upper surface does not interfere with the second backup tool. 4. The electronic component mounting apparatus according to claim 3, wherein the electronic component mounting apparatus returns to the position and supports the lower surface of the other side portion of the substrate by the second backup tool.   When the substrate on which the electronic component temporarily bonded to one side and the other side is finally bonded is carried out to the side of the second backup tool by the second final pressing stage, the second 5. The electronic component mounting apparatus according to claim 4, further comprising unloading means for holding and receiving the upper surface of the substrate from a main pressure bonding stage and transporting the discharging unit. A mounting method having a main pressure bonding portion that temporarily presses an electronic component to a side edge portion of a substrate with an adhesive tape at the temporary pressure bonding portion and then finally pressure bonds the main pressure bonding portion side by side with the temporary pressure bonding portion. Because
Supplying the substrate before the electronic component is temporarily crimped to the temporary crimping portion;
A step of supporting the lower surface of the side part to which the electronic component of the substrate supplied to the temporary crimping part is temporarily crimped by a first backup tool;
Temporarily bonding the electronic component to the upper surface of the side portion of the substrate whose lower surface is supported by the first backup tool;
The substrate on which the electronic component is temporarily crimped on the side portion at the temporary crimping portion is linearly moved along the direction of juxtaposition with the temporary crimping portion to the main crimping portion, and along the juxtaposing direction with the temporary crimping portion. Supporting the lower surface of the side portion of the substrate by a second backup tool arranged in a row with the first backup tool;
Mounting the electronic component temporarily bonded to the upper surface of the side portion of the substrate whose lower surface is supported by the second backup tool. .

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