CN114007341A

CN114007341A - Electronic component mounting device and method for manufacturing display member

Info

Publication number: CN114007341A
Application number: CN202111463704.9A
Authority: CN
Inventors: 白井俊道
Original assignee: Shibaura Machine Co Ltd
Current assignee: Shibaura Machine Co Ltd
Priority date: 2017-09-28
Filing date: 2018-09-27
Publication date: 2022-02-01
Also published as: KR102285037B1; KR20210048469A; TWI681698B; JP2019062149A; KR102401706B1; KR20190037103A; TW201922082A; JP6767333B2; CN109587969A

Abstract

The invention provides an electronic component mounting device which can mount flexible electronic components on a flexible display panel with high precision. The electronic component mounting device is provided with: a table (42) on which a display panel (P) is placed so that the edge portion thereof extends within a range of 3 to 15 mm; a support unit for supporting the edge of the display panel (P); a temporary pressure joint (41) for holding an electronic component (W); imaging devices (44a, 44b) that take images of alignment marks provided on the edge of the display panel (P) and of alignment marks provided on the electronic component (W); a light irradiation unit (44d) that irradiates the display panel (P) with light from the side opposite to the side on which the image was taken; and a control unit that aligns the display panel (P) and the electronic component (W) based on the positional relationship identified by the imaging result, and thermocompression bonds the electronic component (W) to the display panel (P), wherein the bending elastic modulus of the portion protruding from the table (41) is 2.6GPa to 4.0 GPa.

Description

Electronic component mounting device and method for manufacturing display member

The present application is a divisional application of the present invention entitled mounting device for electronic parts and manufacturing method for display member, which was filed on the application date of 2018, 9 and 27, and has the application number of 201811130914.4.

Technical Field

Embodiments of the present invention relate to an electronic component mounting apparatus for mounting a flexible electronic component on an edge portion of a flexible display panel, and a method for manufacturing a display member.

Background

In the flat panel display market, which is used as a display of a portable terminal such as a television, a personal computer, and a smart phone, a liquid crystal display has an overwhelming popularity. Under such circumstances, in recent years, an organic EL display having a feature that it can be thinned without requiring a backlight and can be bent by being formed on a flexible resin film has been attracting attention particularly in the small display market for portable terminals. Accordingly, a mounting device for electronic components that can be favorably used for assembling an organic EL display that can be bent, that is, has flexibility is required.

Conventionally, as a general electronic component mounting device, an external wire bonding device for a liquid crystal display (hereinafter, referred to as an OLB device) is known (see patent document 1). However, an OLB device for an organic EL display is not known. Therefore, in the mounting process of electronic components performed in the production of an organic EL display, an OLB device for a liquid crystal display is used instead.

An OLB device for a liquid crystal display is a device in which electronic components are mounted on a display panel made of a glass substrate via an anisotropic conductive tape. In the mounting process using the OLB device for the liquid crystal display, first, an edge portion of the display panel for mounting the electronic component is held while being protruded from the table, and the electronic component held by the pressure contact is brought close to the edge portion of the display panel. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously photographed from below the display panel by one camera, and the relative positions of the alignment marks are recognized. Then, the edge portion of the display panel is held from below by the supporting tool, the electronic component is aligned with the display panel based on the recognized relative position, and the electronic component is heated and pressed by the pressure bonding head via the anisotropic conductive tape and attached to the edge portion of the display panel.

Patent document 1: japanese laid-open patent publication No. 2006-135082

When the above-described OLB device for a liquid crystal display is directly applied to a manufacturing process of an organic EL display, electronic components cannot be mounted with high accuracy. That is, the present inventors have tried to manufacture a display member by mounting electronic components on a flexible display panel (hereinafter, referred to as an organic EL panel) which is a constituent member of an organic EL display, using the above-described OLB device for a liquid crystal display as it is. Specifically, cof (chip on film) having a width of 38mm is mounted as an electronic component on an organic EL panel having a size of 5.0 inches and a thickness of about 0.2mm, which is widely used in smartphones. As a result, it was found that when only the OLB device for the liquid crystal display is directly applied, it is impossible to mount electronic components on the organic EL panel with high accuracy and high quality. Specifically, it is clear that the mounting accuracy of about ± 3 μm is required in the organic EL panel for the smartphone, but such mounting accuracy and further the mounting quality cannot be satisfied.

Disclosure of Invention

The present invention has been made to solve the problems of the reduction in mounting accuracy and the reduction in mounting quality of electronic components that occur when the conventional OLB device for a liquid crystal display is applied to a manufacturing process of an organic EL display, and an object thereof is to provide a mounting device for electronic components and a manufacturing method of a display member, which can mount electronic components on a display panel with high accuracy even when the flexible electronic components are mounted on the display panel by thermocompression bonding.

An electronic component mounting apparatus according to an embodiment is an electronic component mounting apparatus for mounting a plurality of terminals arranged corresponding to a plurality of electrodes in a flexible electronic component on a display panel by connecting the plurality of terminals to the plurality of electrodes arranged at an edge portion of the display panel via a bonding member, the electronic component mounting apparatus including: a table on which the display panel is placed so that the edge portion thereof extends in a range of 3mm to 15mm, and which is movable in a horizontal direction; a support unit configured to support the edge portion of the display panel placed on the table from below; a thermocompression bonding head which holds the electronic component from the upper side, thermocompressively bonds the electronic component to the upper surface of the edge portion supported by the support unit, and is movable in the horizontal direction and the vertical direction; a position recognition device is provided with: an imaging device that images an alignment mark provided on the edge portion of the display panel protruding from the table and an alignment mark provided on the electronic component; and a light irradiation unit that irradiates light to the display panel from a side opposite to the imaging device, the position recognition device recognizing a positional relationship between the display panel and the electronic component; and a control device that adjusts a relative position between the stage and the thermocompression bonding head so as to align positions of the display panel and the electronic component based on the positional relationship recognized by the position recognition device, and controls the stage and the thermocompression bonding head so as to thermally press-bond the electronic component onto the display panel by the thermocompression bonding head, wherein a bending elastic modulus of a portion of the display panel protruding from the stage is 2.6GPa to 4.0 GPa.

A method for manufacturing a display member according to an embodiment includes: a mounting step of mounting a flexible display panel on a table so that the amount of protrusion of an edge portion having a plurality of electrodes is in a range of 3mm to 15mm, wherein the flexural modulus of a portion of the display panel protruding from the table is 2.6GPa to 4.0 GPa; a holding step of holding an electronic component having a plurality of terminals provided corresponding to the plurality of electrodes and having flexibility to a thermocompression head; a position recognition step of photographing an alignment mark provided at the edge portion of the display panel placed on the table in a state where the alignment mark is irradiated with light from a side opposite to a side on which the photographing is performed, photographing an alignment mark provided on the electronic component held by the thermocompression bonding head, and recognizing a positional relationship between the display panel and the electronic component based on images of the two photographed alignment marks; and a thermocompression bonding step of adjusting a relative position between the stage and the thermocompression head based on the positional relationship recognized in the position recognition step, and thermocompressing the electronic component to the display panel by the thermocompression head, thereby manufacturing a display member in which the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via connection members.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the mounting apparatus of the present invention, even when the flexible electronic component is mounted on the flexible display panel such as the organic EL panel by thermocompression bonding, the electronic component can be mounted with high accuracy while maintaining the mounting quality. Further, according to the method for manufacturing a display member of the present invention, it is possible to provide a display member in which electronic components are mounted on a display panel with high accuracy and while maintaining mounting quality.

Drawings

Fig. 1 is a plan view showing an electronic component mounting apparatus according to an embodiment.

Fig. 2 is a side view of the mounting device shown in fig. 1.

Fig. 3 is a sectional view of an organic EL panel applied to the mounting device of the embodiment.

Fig. 4 is a perspective view showing a temporary pressure bonding apparatus of the mounting apparatus shown in fig. 1.

Fig. 5 is an enlarged cross-sectional view of a table of the temporary pressure bonding apparatus of the mounting apparatus shown in fig. 4.

Fig. 6 is a plan view showing an organic EL panel and electronic components applied to the mounting device of the embodiment.

Fig. 7 is a perspective view showing a main pressure bonding apparatus of the mounting apparatus shown in fig. 1.

Fig. 8 is a perspective view showing an example of a holder for the organic EL panel in the mounting apparatus shown in fig. 1.

Fig. 9 is a perspective view showing another example of the holder for the organic EL panel in the mounting device shown in fig. 1.

Fig. 10 is a plan view showing an electronic component mounting apparatus according to another embodiment.

Fig. 11 is a graph showing the variation of the mounting accuracy of example 1.

Fig. 12 is a graph showing the variation in mounting accuracy of comparative example 1.

Description of the symbols

1: mounting device, 10(10A, 10B): blanking device, 12: mold apparatus, 20: intermittent rotary conveyance device, 21: arm portion, 24: holding head, 30: anisotropic conductive tape attaching device (bonding member attaching device), 32: pasting head, 40: temporary crimping device, 41: temporary crimping head, 42: table, 42 a: mounting section, 42 b: table driving unit, 43: support unit, 43 a: support means, 44: position recognition device, 44 a: first image pickup device, 44 b: second imaging device, 44 c: image processing apparatus, 44 d: light irradiation section, 50: main pressure welding device, 51: table, 52: formal crimp, 53: support portion, 60: first interface unit, 61: receiving part, 70: second interface unit, 71: receiving part, 80: first conveying section, 81: holding body, 81 a: electrode surface adsorption block, 81 b: display region adsorption portion, 90: second conveying section, 91: holder, 100: third conveyance unit, 101: holding body, 110: control device, 111: storage unit, F: anisotropic conductive tape, P: organic EL panel, W: an electronic component.

Detailed Description

Hereinafter, an electronic component mounting apparatus and a method of manufacturing a display member according to an embodiment will be described with reference to the drawings. The drawings are schematic drawings, and the relationship between the thickness and the planar size, the ratio of the thicknesses of the respective portions, and the like may be different from the actual case. The term indicating the vertical direction in the description indicates, unless otherwise specified, a relative direction in a case where a mounting surface of an electronic component of a display panel (organic EL panel) to be described later is set to be an upper surface.

[ constitution of mounting device ]

Fig. 1 is a plan view showing a configuration of an electronic component mounting apparatus according to an embodiment, and fig. 2 is a side view of the electronic component mounting apparatus of fig. 1. The electronic component mounting apparatus 1 shown in fig. 1 and 2 is used for manufacturing a component (display member) of a display device such as an organic EL display. That is, the mounting device 1 is a device as follows: the flexible electronic component W such as COF punched out from the carrier tape T is mounted on the flexible organic EL panel P as a display panel via the anisotropic conductive tape F as a connecting member, and used to manufacture a display member having the electronic component W mounted on the organic EL panel P.

Here, the organic EL panel P is mainly formed of a member having flexibility. Examples of the member having flexibility include Polyimide (PI), polyethylene terephthalate (PET), and Polycarbonate (PC). These members may be bonded together with an adhesive. The organic EL panel P has a thickness of 50 to 500 [ mu ] m and a flexural modulus of 2.6 to 4.0 GPa. Hereinafter, the thickness and the flexural modulus are referred to as physical properties of the organic EL panel P. The organic EL panel P in the present embodiment has a structure in which a PI film on which organic EL elements are formed is bonded to a PET film as a support material with an adhesive interposed therebetween. Since the thickness of the PET film (about 200 μm) is 10 times or more of the thickness of the PI film (about 10 μm), the flexural modulus of the organic EL panel P and the flexural modulus of the PET film are considered to be substantially equal.

The physical properties need not be provided in the entire organic EL panel P, but may be provided at least in a portion protruding from a placement portion 42a (see fig. 4) of the table 42, which will be described later. For example, if the edge portion of the organic EL panel P on which the electronic component W is mounted is extended 15mm from the placement portion 42a of the table 42, the range of 15mm from the edge portion may have the above-described physical properties.

More specifically, as shown in fig. 3, the organic EL panel P on which the electronic component W is mounted has a display portion Pa and an edge portion Pb. The display portion Pa is a portion where an organic EL element Pa1 as a display element is formed, and is a portion where an image is displayed. The edge portion Pb is a portion located on the outer peripheral side of the display portion Pa, and is a portion where a connection portion Pb1 is formed, and an electrode or the like connected to an electrode of the electronic component W is formed at the connection portion Pb 1. As described above, the entire organic EL panel P including the display portion Pa and the edge portion Pb is formed of the PI film Ka as a base material, and the organic EL element Pa1 serving as the display portion Pa is formed on the PI film Ka. The PI film Ka is a very thin member having a thickness of less than 50 μm, specifically about 10 to 30 μm.

Therefore, in the present embodiment, the PET film Kb as a support material having the same size as the PI film Ka and a thickness of 200 μm is bonded to the back surface (the surface opposite to the surface on which the organic EL element Pa1 is formed) of the PI film Ka with the adhesive Kc. An optical film Kd such as a cover film (also referred to as a barrier film) for protecting the organic EL element Pa1 may be bonded to the display portion Pa. The optical film Kd has substantially the same size as the display portion Pa. For example, as the cover film, a film obtained by coating a gas barrier layer on a plastic film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or cycloolefin polymer (COP) can be used. The thickness of the cover film is about 10 μm to 200 μm.

In the organic EL panel P having such a configuration, when only the edge portion Pb protrudes from the placement portion 42a of the table 42, the edge portion Pb may have the above-described physical characteristics. That is, the portion where the PI film Ka and the PET film Kb are bonded may have the above-described physical properties. In the case where the edge portion Pb and a part of the display portion Pa protrude from the mounting portion 42a, the edge portion Pb and the part of the display portion Pa may have the above-described physical characteristics. That is, in the case where the cover film is not present in the display part Pa, the portion where the PI film Ka and the PET film Kb are bonded may have the above-described physical properties. On the other hand, when the optical film Kd is present in the display portion Pa, the physical properties of the portion where the PI film Ka and the PET film Kb are bonded to each other as the edge portion and the physical properties of the portion where the PI film Ka, the PET film Ks, and the optical film Kd are bonded to each other as the display portion Pa may be the above-mentioned physical properties.

Here, the flexural modulus is measured in accordance with JIS K7171: the plastic-bending property was determined by the test method defined in 2016 (3/22/3/22). Specifically, the flexural modulus test was performed as follows: a test piece having dimensions of 80. + -.2 mm in length, 10.0. + -. 0.2mm in width and 4.0. + -. 0.2mm in thickness was supported on a support table of a deflection measuring apparatus in which the distance between fulcrums was adjusted to 64mm, and the indenter was lowered to the center between the fulcrums at a test speed of 2 mm/min. The test atmosphere was a standard atmosphere (temperature 23 ℃/humidity 50%) prescribed in JIS K7100.

As the electronic component W, an electronic component such as COF having flexibility is used. COFs are formed by mounting a semiconductor element on a flexible film-like circuit board made of PI (polyimide) or the like. As described later, the COF is formed by punching out and singulation from a tape-shaped film member.

The display member is obtained by mounting an electronic component W such as COF on a display panel such as an organic EL panel P via a bonding member such as an anisotropic conductive tape F, and is used as a component of a display device such as an organic EL display.

The mounting device 1 of the embodiment is configured to include: a punching device 10(10A, 10B) for punching out the electronic component W from the carrier tape T; an intermittent rotary transport device 20 for holding the punched electronic component W by suction and transporting the electronic component W while intermittently rotating; an anisotropic conductive tape joining device (bonding member joining device) 30 which is disposed at an intermittent stop position in the middle of the conveyance path of the intermittent rotary conveyor 20 and joins an anisotropic conductive tape F as a bonding member to the electronic component W conveyed by the intermittent rotary conveyor 20; a temporary pressure bonding device 40 that temporarily pressure bonds the electronic component W to which the anisotropic conductive tape F is attached to the organic EL panel P via the anisotropic conductive tape F; a main pressure bonding device 50 that main-pressure bonds the electronic component W temporarily pressure bonded to the organic EL panel P by the temporary pressure bonding device 40; a first transfer device 60 that transfers the electronic component W between the punching device 10 and the intermittent rotary transport device 20; a second transfer device 70 that transfers the electronic component W between the intermittent rotary transfer device 20 and the temporary pressure bonding device 40; a first conveying unit 80 for carrying the organic EL panel P into the temporary bonding apparatus 40; a second conveying unit 90 for conveying the organic EL panel P from the temporary pressure bonding device 40 to the main pressure bonding device 50; and a third conveying unit 100 for carrying out the organic EL panel P from the main press bonding device 50, and the third conveying unit 100 includes a control device 110, and the control device 110 controls the operations of the respective units such as the press device 10, the intermittent rotary transport device 20, the anisotropic conductive tape pasting device 30, the temporary press bonding device 40, the main press bonding device 50, the first delivery device 60, the second delivery device 70, the first conveying unit 80, the second conveying unit 90, and the third conveying unit 100.

(Blanking device 10)

The punching device 10 is used for punching out COFs as electronic components W from a carrier tape T, and includes a first punching device 10A and a second punching device 10B. The first punching device 10A and the second punching device 10B have the same configuration, and are arranged in a state of being inverted right and left as viewed from the front of the device. The first and

second punching devices

10A and 10B are each used such that, while one

punching device

10A or 10B punches a carrier tape T, the

other punching device

10A or 10B can perform an operation of replacing the carrier tape T.

The first and

second punching devices

10A, 10B each include: a supply reel 11 around which the carrier tape T before blanking is wound; a die device 12 for punching out electronic components W from the carrier tape T supplied from the supply reel 11; and a winding reel 13 for winding the carrier tape T punched out of the electronic component W by the die device 12. The carrier tape T fed from the supply reel 11 is changed in direction by a plurality of guide rollers 14 and sprockets 15, and is conveyed to the take-up reel 13 via the die device 12. The sprocket 15 is disposed in front of the die device 12 in the transport direction of the carrier tape T, and is driven by a drive motor, not shown, to rotate, thereby positioning the carrier tape T with respect to the die device 12 while transporting the carrier tape T.

The mold device 12 includes an upper mold 12a and a lower mold 12b disposed opposite to the upper mold 12 a. The upper die 12a is provided with a punch 12c on its lower surface. On the other hand, the lower die 12b is formed with a die hole 12d into which the punch 12c enters and which penetrates vertically. In a state where the carrier tape T is supplied to and positioned with respect to the die device 12, the upper die 12a is moved in the vertical direction, thereby punching out the electronic components W from the carrier tape T. Further, a suction hole (not shown) is provided in the front end surface of the punch 12c, and the punched electronic component W can be sucked and held.

(intermittent rotary conveyer 20)

The intermittent rotary conveyance device 20 includes: an index table 22 having a cross shape in plan view, four arm portions 21 of the same shape being arranged in a mutually orthogonal relationship; and a rotation driving part 23 for intermittently rotating and driving the index table 22 at intervals of 90 °. A holding head 24 for holding the electronic component W by suction is provided at the tip of each arm 21 of the index table 22. At four stop positions a to D of the index table 22 at every 90 °, a receiving position a for receiving the electronic component W punched out by the punching device 10, a correcting/cleaning position B for positioning (correcting) and cleaning the electronic component W held by the holding head 24, a bonding position C for bonding the anisotropic conductive tape F to the electronic component W held by the holding head 24, and a delivery position D for delivering the electronic component W to which the anisotropic conductive tape F is bonded to the temporary pressure bonding device 40 are set.

(Anisotropic conductive tape applying apparatus 30)

The anisotropic conductive tape joining device 30 is provided corresponding to the joining position C of the intermittent rotary transport device 20, and includes: a supply reel 31 on which a strip-shaped member S for supporting the anisotropic conductive tape F to be adhered to the release tape R is wound; an application head 32 disposed at a position facing the holding head 24 fixed at the application position C; a recovery unit 33 for recovering the stripping tape R from which the anisotropic conductive tape F has been peeled; a plurality of guide portions 34 for guiding the tape-like member S supplied from the supply reel 31 to the collection portion 33 along a conveyance path passing through the bonding position C; a chuck transport unit 35 disposed downstream of the position C where the guide units 34 are attached to the transport path of the tape-shaped member S, and configured to transport the tape-shaped member S intermittently by a predetermined length each time by reciprocating the tape-shaped member S in the transport direction; and a cutting section 36 disposed upstream of the joining position C on the conveyance path of the tape-like member S and configured to cut only the anisotropic conductive tape F in the tape-like member S.

The pasting head 32 has: an attaching tool 32a for pressing the anisotropic conductive tape F cut to a predetermined length and conveyed and positioned at the attaching position C against the terminal portion of the electronic component W held by the holding head 24 positioned at the attaching position C; a lifting drive part 32b for lifting and lowering the sticking tool 32 a; and a heater 32c incorporated in the bonding tool 32a, for heating the bonding tool 32a to bond the anisotropic conductive tape F to the terminal portion of the electronic component W.

(temporary pressure bonding apparatus 40)

As shown in fig. 4, the temporary bonding apparatus 40 includes: a temporary pressure bonding head 41 as a thermal pressure bonding head for temporarily pressure bonding the electronic component W to which the anisotropic conductive tape F is attached by the anisotropic conductive tape attaching apparatus 30 to the organic EL panel P while holding the electronic component W by suction; a table 42 for holding and positioning the organic EL panel P; a support unit 43 for supporting, from below, a portion of the organic EL panel P held by the table 42, which includes an edge portion on which the electronic component W is mounted and which protrudes from the table; and a position recognition device 44 for recognizing a relative position between the organic EL panel P held by the table 42 and the electronic part W held by the temporary bonding head 41.

The temporary bonding head 41 includes a pressing tool 41a for holding the electronic component W by suction from the upper surface side of the electronic component W, a tool driving unit 41b for moving the pressing tool 41a in the Y, Z and θ directions, and a heater 41c incorporated in the pressing tool 41a for heating the pressing tool 41 a. As shown in fig. 4, the table 42 includes a mounting portion 42a on which the organic EL panel P is mounted, and a table driving portion 42b for moving the mounting portion 42a in directions X, Y, Z and θ.

A plurality of suction holes 42d for suction-holding the organic EL panel P are formed in the mounting surface 42c of the mounting portion 42a on which the organic EL panel P is mounted. The suction holes 42d are mainly disposed at positions facing the display region of the image in the organic EL panel P when the organic EL panel P is placed on the placement surface 42 c. In this example, although the description is given of an example in which the suction holes 42d are arranged in a matrix at regular intervals in the region of the mounting surface 42c on which the organic EL panel P is mounted (the region surrounded by the two-dot chain line in fig. 4), the organic EL panel P mounted on the mounting surface 42c is not necessarily sucked and held over the entire region thereof.

For example, in fig. 4, a half of the length of the organic EL panel P or a region around 1/3 may be suction-held from the side of the placement surface 42c where the temporary pressure bonding head 41 is located. The adsorption holes 42d adsorb the display region of the organic EL panel P, and therefore, it is preferable to set the hole diameter to be small so that adsorption traces remain in the display region due to adsorption. The relationship between the suction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P due to the suction is obtained by experiments or the like, and the size of the aperture may be set so as not to leave any suction mark. The placement surface 42c may be formed by a porous member, for example, a vacuum chuck using porous ceramics.

In addition, the placing portion 42a may be provided with a suction groove extending from a suction hole for sucking the organic EL panel P to the vicinity of the side edge at the side edge portion on the side where the temporary pressure bonding head 41 is located. Specifically, as shown in fig. 5, the side portion of the loading portion 42a is configured by a suction block 42f which is a separate member from the loading portion 42 a. The suction block 42f is a member long in the X direction, and is fixed to the placing section 42a so that the upper surface thereof has the same height as the placing surface 42c of the placing section 42 a. A plurality of suction holes 42g for sucking the organic EL panel P are arranged in the X direction on the upper surface of the suction block 42 f. Further, an adsorption groove 42h extending from each adsorption hole 42g toward an end of the adsorption block 42f (an end on the side where the temporary pressure contact head 41 is located) is provided on the upper surface of the adsorption block 42 f. The front end of the suction groove 42h extends to a position close to the end of the suction block 42 f. The distance between the front end of the adsorption groove 42h and the end of the adsorption block 42f is preferably 1 to 3 mm. The lower side of the end of the suction block 42f is an inclined portion 42i that is inclined downward from the end toward the placement portion 42 a. By forming the inclined portion 42i below the end portion, interference with the support unit 43 can be made less likely to occur.

The table driving unit 42b is a driving unit in which an X-axis direction driving unit that moves the placing unit 42a in an X-axis direction, which is one of horizontal directions, a Y-axis direction driving unit that moves in a Y-axis direction, which is a horizontal direction orthogonal to the X-axis direction, a Z-axis direction driving unit that moves in a Z-axis direction orthogonal to the horizontal direction, and a θ -axis driving unit that rotates in a horizontal plane are stacked in this order from the lower side. In order to improve the positioning accuracy in the X-axis direction and the Y-axis direction, the table driving unit 42b is additionally provided with linear encoders in the X-axis direction driving unit and the Y-axis direction driving unit.

The support unit 43 is provided at a temporary pressure contact position where the electronic component W is temporarily pressure contacted to the organic EL panel P. The support unit 43 includes a support tool 43a that is long in the X-axis direction and supports an edge portion of the organic EL panel P where the electrode array ER (fig. 6) is formed from below, and a support base 43b that is formed in a substantially rectangular parallelepiped shape and supports the support tool 43 a. The supporting tool 43a is made of stainless steel, and is formed flat on an upper end surface (supporting surface) that supports an edge portion of the organic EL panel P. In the present embodiment, the support unit 43 is fixedly disposed at the temporary pressure bonding position, but may be provided so as to be movable in the X-axis direction, or in the X-axis direction and the Y-axis direction as needed. In this case, the support base 43b may be mounted on the X-axis moving device or the XY-axis moving device.

Next, the position recognition device 44 will be described with reference to fig. 4 and 6. Fig. 6 is a plan view schematically showing the configuration of the organic EL panel P and the electronic component W for position recognition by the position recognition device 44. In the drawings, the X-axis direction is explained as the left-right direction. The organic EL panel P includes an electrode row ER formed at an edge portion thereof and a pair of alignment marks PM provided on both left and right sides of the electrode row ER. The electronic component W has a terminal row TR arranged so as to correspond to the electrode row ER, and a pair of alignment marks WM provided on each of the left and right sides of the terminal row TR. The position recognition device 44 recognizes the relative positional relationship between the pair of alignment marks PM of the organic EL panel P and the alignment mark WM of the electronic part W.

As shown in fig. 4, the position recognition device 44 includes a first imaging device 44a, a second imaging device 44b, an image processing unit 44c that processes images captured by the first and

second imaging devices

44a and 44b, and a light irradiation unit 44 d. The first and

second imaging devices

44a and 44b are mounted on the support base 43b of the support unit 43 via the X-axis drive unit 44e upward and independently of each other, and are near the end of the support tool 43 a. The first imaging device 44a simultaneously captures, from below, the left alignment mark PM of the pair of alignment marks PM provided at the edge portion of the organic EL panel P and the left alignment mark WM of the pair of alignment marks WM provided at the electronic component W into an imaging region 44a1 (indicated by a broken line in fig. 6) and performs imaging. The second imaging device 44b captures images of the alignment mark PM on the right side of the organic EL panel P and the alignment mark WM on the right side of the electronic component W from below simultaneously in an imaging region 44b1 (indicated by a broken line in fig. 6).

The first and

second imaging devices

43a and 43b capture the alignment marks PM and WM as still images, respectively, and include a camera 44f such as a ccd (charge Coupled device) camera and a lens barrel portion 44g including an optical unit such as a telecentric lens. The X-axis drive unit 44e can synchronously move the first and

second imaging devices

44a and 44b so as to increase or decrease the distance between the first and

second imaging devices

44a and 44b, and can change the arrangement distance between the first and

second imaging devices

44a and 44b according to the distance between the left and right alignment marks PM and WM.

The image processing unit 44c receives the image pickup signal of the camera 44f, recognizes the images of the alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic component W from the picked-up images taken into the image pickup regions 44a1 and 44b1, and detects data (hereinafter referred to as "position data") relating to the positions of the alignment marks PM and WM. The image processing unit 44c recognizes, as the alignment mark PM of the organic EL panel P, an image that can obtain a matching rate of a threshold value or more with the reference pattern of the alignment mark PM of the organic EL panel P set in advance in the captured image, by a known pattern matching process. Further, an image which can obtain a matching rate of a threshold value or more with the reference pattern of the alignment mark WM of the electronic component W is recognized as the alignment mark WM of the electronic component W. Then, the position data of the recognized alignment marks PM, WM is obtained based on the camera coordinate system. This allows the positional relationship between the organic EL panel P and the electronic component W to be recognized. The obtained position data is transmitted to the control device 110.

The light irradiation unit 44d is disposed above the organic EL panel P placed on the table 42 so as to be capable of irradiating light directly downward. In the present embodiment, the light irradiation sections 44d are provided in a pair at the same interval as the arrangement interval of the pair of alignment marks PM of the organic EL panel P. The light irradiation unit 44d is provided integrally with the temporary pressure welding head 41 by using a support tool not shown, but is not limited thereto, and may be supported by a frame or a stand of the mounting apparatus 1 via the support tool. In short, when the alignment mark PM of the organic EL panel P is imaged by the first and

second imaging devices

44a and 44b, the alignment mark PM of the organic EL panel P may be irradiated with light from the side opposite to the first and

second imaging devices

44a and 44 b. The number of the light irradiation portions 44d is not limited, and one elongated light irradiation portion may be provided.

(official pressure welding device 50)

As shown in fig. 7, the main pressure bonding device 50 includes: a table 51 for holding and positioning the organic EL panel P to which the electronic component W is temporarily pressure-bonded via the anisotropic conductive tape F; a main pressure bonding head 52 for main pressure bonding the electronic component W to the organic EL panel P; a support portion 53 disposed below the main bonding head 52 so as to face the main bonding head 52, for supporting an edge portion of the organic EL panel P, to which the electronic component W is temporarily bonded, from below during the main bonding; and a position identifying unit 54 for identifying the position of the organic EL panel P.

The table 51 includes a placing unit 51a for placing the organic EL panel P and a table driving unit 51b for moving the placing unit 51a in directions X, Y, Z and θ. The mounting portion 51a is a member having a rectangular shape in plan view, and a plurality of suction holes 51d for sucking and holding the organic EL panel P are formed in a mounting surface (upper surface) 51c on which the organic EL panel P is mounted. As with the suction hole 42d of the table 42 of the temporary bonding apparatus 40, the diameter of the suction hole 51d is preferably set to be small so as not to leave any suction mark on the organic EL panel P. Like the table driving unit 42c of the temporary bonding apparatus 40, the table driving unit 51b is a driving unit configured by stacking an X-axis direction driving unit, a Y-axis direction driving unit, a Z-axis direction driving unit, and a θ driving unit in this order from the lower side.

The main crimping head 52 includes: a pressing tool 52a that presses the electronic component W temporarily pressed against the organic EL panel P from the upper surface side thereof; a tool driving unit 52b for moving the pressing tool 52a in the Z-axis direction; and a heater 52c incorporated in the press tool 52a for heating the press tool 52 a. The support portion 53 has: a support tool 53a provided at a position right below the pressing tool 52a of the main crimping head 52 and formed to have a length equal to that of the pressing tool 52 a; and a support member 53b for supporting the support tool 53 a. The upper surface of the supporting tool 53a is formed as a flat surface for supporting the lower surface of the edge portion of the organic EL panel P placed on the placing portion 51a to which the electronic component W is temporarily pressed.

The position recognition unit 54 includes a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and

second cameras

54a and 54b are attached downward at a predetermined interval above the table 51 within a range in which the organic EL panel P is moved, and capture alignment marks provided near both end portions of the edge portion of the organic EL panel P to which the electronic component W is temporarily pressed. The interval (predetermined interval) between the first and

second cameras

54a and 54b is the interval between the alignment marks. The alignment mark is a different alignment mark from the alignment mark PM used for identification of the relative position data in the temporary crimping apparatus 40. An image processing unit, not shown, recognizes the alignment marks by known pattern matching processing based on the captured images of the alignment marks of the organic EL panel P captured by the first and

second cameras

54a and 54b, and detects the positions of the alignment marks.

(first interface unit 60)

The first handover device 60 includes: a receiving portion 61 for holding by suction the electronic component W punched out from the carrier tape T from below; and X, Y, Z and a θ drive unit 62 for moving the receiving unit 61 to a position directly below the die device 12 of the

punching devices

10A and 10B and a position directly below the holding head 24 of the intermittent rotary transport device 20 whose position is fixed at the receiving position a.

(second interface device 70)

The second handover device 70 includes: a receiving portion 71 for holding the electronic component W by suction from below; and X, Y, Z and a θ drive unit 72 for moving the receptacle 71 to a position directly below the holding head 24 of the intermittent rotary transport device 20 whose position is fixed at the delivery position D and to a position directly below the temporary bonding head 41 of the temporary bonding device 40.

(first conveying section 80)

The first conveying unit 80 includes: a holding body 81 for holding by suction from above the organic EL panel P supplied from a supply unit not shown; and an XZ drive unit 82 for moving the holding body 81 to a supply position of the supply unit, not shown, to the organic EL panel P and to a carry-in position of the organic EL panel P with respect to the table 42 of the temporary pressure bonding apparatus 40.

As shown in fig. 8, the holding body 81 includes: an electrode surface suction block 81a for sucking and holding an edge portion of the organic EL panel P where an electrode row ER on which electronic components W are mounted is formed; and a display region adsorption portion 81b which is disposed adjacent to the electrode surface adsorption block 81a and adsorbs and holds a portion of the organic EL panel P other than the portion adsorbed by the electrode surface adsorption block 81 a. The electrode surface suction block 81a is a rectangular parallelepiped member that is formed to be capable of sucking and holding the entire edge portion of the organic EL panel P where the electrode rows ER are formed, and is long in the direction along the edge portion. The electrode surface suction block 81a has a flat suction surface 81c and a plurality of suction holes 81 d. Further, the diameter of the suction hole 81d is set to a size that does not deform at the edge of the organic EL panel P, as in the placement portion 42a of the temporary bonding apparatus 40, and the edge of the organic EL panel P where the electrode row ER is formed can be flattened and sucked and held. The display region adsorption portion 81b is formed of a porous body or sponge having a flat adsorption surface, and has a plurality of adsorption holes. The electrode surface suction blocks 81a and the display area suction portions 81b have suction surfaces that are aligned on the same plane.

The electrode surface suction block 81a is not the entire suction-holding electrode array ER, and actually, the suction-holding electrode array ER is a portion on the display region side except for a portion to which the terminals of the electronic component W are connected via the anisotropic conductive tape F. That is, as shown by the two-dot chain line in fig. 8, the portion of the electrode array ER of the organic EL panel P to which the terminals of the electronic component W are connected is held in a state of protruding from the holding body 81.

Although one display region adsorption portion 81b is shown in fig. 8, a plurality of display region adsorption portions 81b may be arranged in a row. As shown in fig. 9, two display region adsorption portions 81b are arranged in a row in a direction (orthogonal direction in the present embodiment) intersecting the longitudinal direction of the electrode surface adsorption block 81a (the direction of the edge portion of the organic EL panel P held by the electrode surface adsorption block 81 a). The two display region adsorption portions 81b are supported by the main body portion 81e of the holding body 81 so that the distance from the electrode surface adsorption block 81a can be freely adjusted. These display region adsorption portions 81b include a base portion 81b1 made of metal such as aluminum and a flat porous sheet 81b2 covering a surface (hereinafter referred to as "lower surface") of the base portion 81b1 on which the organic EL panel P is held. The base portion 81b1 has suction grooves formed in a substantially grid pattern on the lower surface thereof and communicating with the vacuum suction holes, so that the vacuum suction force can be applied to the entire area of the porous sheet 81b2 provided on the lower surface, and the organic EL panel P can be held flat by a substantially uniform suction force over the entire area of the porous sheet 81b 2. As the porous sheet 81b2, for example, a sheet obtained by processing a porous molded body of a resin into a film shape can be used. With such a configuration, even if the holding member 81 is a thin flexible film-like organic EL panel P, it can be held by suction in a flat state without causing suction marks.

(second conveying section 90)

The second conveying unit 90 includes: a holder 91 that holds, by suction from above, the organic EL panel P to which the electronic component W is temporarily pressure-bonded by the temporary pressure bonding device 40; and an XZ drive unit 92 for moving the holding body 91 to a carrying-out position where the organic EL panel P is carried out from the table 42 of the temporary pressure bonding device 40 and a carrying-in position where the organic EL panel P is carried in with respect to the table 51 of the main pressure bonding device 50. The holder 91 includes a display region suction portion formed of a porous material or the like having a flat suction surface, which sucks and holds substantially the entire upper surface of the organic EL panel P. The display area suction part is configured in the same manner as the display area suction part 81b of the holding body 81.

(third conveyance section 100)

The third conveyance unit 100 includes: a holder 101 for sucking and holding, from above, a display member, which is an organic EL panel P to which an electronic component W is permanently crimped by a permanent crimping device 50; and an XZ drive unit 102 for moving the holder 101 to a carrying-out position where the organic EL panel P is carried out from the table 51 of the main pressure bonding device 50 and a delivery position where the organic EL panel P is delivered to a carrying-out device, not shown.

(control device 110)

The control device 110 includes a storage unit 111. The storage unit 111 stores, for example, loads, heating temperatures, and pressing times in the temporary pressure bonding device 40 and the main pressure bonding device 50, reference patterns of the alignment marks PM and WM related to the image processing unit 44c, position information of the reference patterns, and various information for controlling the respective units. The storage unit 111 stores an extension G for extending the edge of the organic EL panel P by a predetermined amount from the placement unit 42a of the table 42. Specifically, the protrusion G is set in a range of 3mm to 15mm, more preferably 3mm to 8 mm. Here, the protrusion G was set to 6 mm.

[ operation of mounting device ]

Next, the operation of the mounting device 1 of the embodiment will be described. First, a carrier tape T is supplied from a supply reel 11 of the first punching device 10A, and electronic components W are punched out of the carrier tape T by the die device 12. The punched electronic component W is sucked and held by the punch 12 c. The electronic component W held by the punch 12c is transferred to the receiving portion 61 of the first transfer device 60, and is transferred to the receiving position a of the intermittent rotary transfer device 20 by the first transfer device 60. The electronic component W transferred to the receiving position a is transferred to the holding head 24 of the intermittent rotary conveying device 20 fixed in position at the receiving position a. In addition, the first transfer device 60 rotates the orientation of the electronic component W by 90 ° while the electronic component W is being transferred to the receiving position a, thereby aligning the edge portion on which the terminal row TR is formed with the direction (Y direction) along the outer side surface of the holding head 24 positionally fixed to the receiving position a.

The electronic component W held by the holding head 24 is transferred to the correcting/cleaning position B, the bonding position C, and the delivery position D in order by the intermittent rotation of the index table 22. In the conveyance process, at the correction/cleaning position B, the electronic component W is positioned with respect to the holding head 24 by contact of a positioning mechanism, not shown, and dust adhering to the terminal portion is cleaned by a cleaning mechanism, such as a rotary brush, not shown. At the bonding position C, the anisotropic conductive tape F is bonded to the terminal portion of the electronic component W by the anisotropic conductive tape bonding apparatus 30. When the electronic component W, which is positioned and cleaned at the correcting/cleaning position B and to which the anisotropic conductive tape F is bonded at the bonding position C, is positionally fixed at the delivery position D, the electronic component W is delivered to the receiving portion 71 of the second delivery apparatus 70 at the delivery position D. The electronic component W delivered to the receiving portion 71 is transferred to a position directly below the provisional bonding head 41 of the provisional bonding apparatus 40, and delivered to the provisional bonding head 41.

On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out from the supply unit not shown by the holding body 81 of the first conveying unit 80 and supplied to the table 42 placed on the temporary pressure bonding apparatus 40. First, the holding body 81 of the first transport unit 80 is moved to the supply unit, not shown, and the holding surface of the holding body 81, that is, the suction surface 81c of the electrode surface suction block 81a and the suction surface of the display area suction unit 81b, are brought into contact with the upper surface of the organic EL panel P prepared in the supply unit. At this time, the holding member 81 presses the organic EL panel P lightly, and the electrode surface suction block 81a and the display region suction portion 81b are made to exert suction force. Thus, even when the organic EL panel P is warped or bent, the organic EL panel P can be held in the holding member 81 in a flat state.

When the organic EL panel P of the supply unit is sucked and held, the holding body 81 is fixed in position such that the end of the organic EL panel P on the side where the electrode array ER is formed protrudes by a predetermined length H from the outer end of the electrode surface suction block 81a (the edge on the opposite side of the display region suction portion 81 b). For example, the length H is a length of a width amount by which the electronic component W overlaps the organic EL panel P at the time of temporary pressure bonding.

That is, the length H is stored in the storage unit 111. When the organic EL panel P of the supply section is held by the holder 81, the control device 110 controls the XZ drive section 82 so that the electrode-side end of the organic EL panel P is held by the length H extending from the holder 81 with reference to the length H stored in the storage section 111. Specifically, in the supply unit, the organic EL panel P is prepared to a predetermined fixed position each time, and based on the fixed position, the XZ drive unit 82 is controlled to move the holding body 81 so as to have a positional relationship of the amount of the end portion of the organic EL panel P on the side where the electrode row ER is formed, which extends by the length H. Further, a detector such as a photosensor for detecting an end portion of the organic EL panel P may be provided on the holding body 81, and the holding body 81 may be moved so that the amount of protrusion becomes the preset length H in accordance with the position of the end portion of the organic EL panel P detected by the detector.

The organic EL panel P held by the holding body 81 is conveyed onto the table 42 of the temporary pressure bonding apparatus 40. At this time, the stage 42 of the temporary bonding apparatus 40 is fixed at a supply position (position indicated by a two-dot chain line in fig. 1) where the supply of the organic EL panel P is received from the holding body 81. The organic EL panel P carried to the table 42 is placed on the table 42. The control device 110 controls the relative position between the holder 81 and the placement portion 42a of the table 42, that is, the drive of the XZ drive portion 82 and the table drive portion 42b, so that the protrusion G of the edge portion of the organic EL panel P from the placement portion 42a becomes 6mm as the protrusion G stored in the storage portion 111.

As described above, the protrusion G is set in the range of 3mm to 15mm, more preferably 3mm to 8 mm. By setting the extension amount G in such a range, even in the organic EL panel P having flexibility and having a thickness of 50 μm to 500 μm inclusive and a flexural modulus of 2.6GPa to 4.0GPa inclusive, it is possible to prevent the edge portion extending from the mounting portion 42a from sagging. Further, the inventors have found the following, as a result of experiments: the relationship between the protrusion G and the amount of sagging of the edge portion differs depending on the type of the organic EL panel P, but if the organic EL panel P has a thickness of 50 μm to 500 μm inclusive and a flexural modulus of 2.6GPa to 4.0GPa inclusive, the amount of sagging of the edge portion can be suppressed within a range in which the accuracy of recognition of the alignment mark PM can be maintained by setting the protrusion G to 3mm to 15mm inclusive.

Even within the above-described range of physical properties, the protrusion G is preferably set to be short, and more preferably set in a range of 3mm to 8mm, in order to ensure stable recognition accuracy without being affected by the type. Here, it is understood that the shorter the extension amount G of the organic EL panel P, the more reliably the recognition accuracy is ensured, but when the extension amount is shorter, the closer distance between the placement portion 42a and the support tool 43a needs to be shortened. Since the distance of approach between the placement portion 42a and the support tool 43a becomes shorter, interference between the two, that is, the possibility of collision occurs, the lower limit value is set to 3 mm. The lower limit value (3mm) of the protrusion G is set in consideration of the width dimension of the anisotropic conductive tape F used for connection between the organic EL panel P and the electronic component W.

The organic EL panel P is held by the holding member 81 so that the end portion thereof extends by a length H. On the other hand, since the placement portion 42a is fixed in position at the supply position and the position thereof is known, the movement position of the holding body 81 at which the protrusion amount G can be obtained can be easily calculated.

When the organic EL panel P is placed on the placement portion 42a, the organic EL panel P is pressed against the placement surface 42c and flattened by the lowering of the holding member 81. More specifically, the display region of the organic EL panel P is held in a flat state because it is held by the display region suction portion 81b of the holding member 81. In this state, the organic EL panel P is pressed against the mounting surface 42c of the table 42, and thus the organic EL panel P is sandwiched between the suction surface of the display region suction portion 81b of the holder 81 and the mounting surface 42c of the table 42. Therefore, the organic EL panel P is transferred to the table 42 while maintaining the flattened state, and is sucked and held on the table 42.

At this time, the suction force of the electrode surface suction block 81a and the display region suction portion 81b of the holder 81 may be released after the suction force is applied to the suction hole 42d of the placement portion 42a of the table 42 in a state where the organic EL panel P is pressed against the placement surface 42c of the table 42, but the suction force of the holder 81 may be released before the suction force is applied to the table 42. This can reduce the restriction in the surface direction of the organic EL panel P sandwiched between the table 42 and the holding body 81, and therefore even if the holding body 81 holds the organic EL panel P with the warpage and the deflection remaining, it is desirable to correct the warpage and the deflection by sandwiching and flatten the panel P. Therefore, the force with which the holding body 81 is pressed against the table 42 is preferably set to a magnitude that does not interfere with the correction.

When the organic EL panel P is held on the table 42, the holding body 81 moves to a supply portion not shown. On the other hand, the table 42 is moved to the mark recognition position before the temporary crimping head 41 performs temporary crimping. The electronic component W held by the temporary bonding head 41 is also positionally fixed at the mark recognition position. In a state where the position is fixed at the mark recognition position, as shown in fig. 6, the organic EL panel P and the electronic component W are opposed to each other in a state where the edge portion of the organic EL panel P where the electrode row ER is formed and the edge portion of the electronic component W where the terminal row TR is formed are spaced apart from each other by a minute interval. In this state, the light irradiation section 44d is located directly above the alignment mark PM of the organic EL panel P. In this state, light is irradiated from the light irradiation section 44d, and an image including the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W is captured by the

imaging devices

44a and 44 b.

The captured image is sent to the image processing unit 44c, and position data of each of the alignment marks PM and WM is obtained, and position recognition of the organic EL panel P and the electronic component W is performed. The obtained position data is transmitted to the control device 110. Since the alignment mark PM of the organic EL panel P thus captured is captured as a contour image, the alignment mark PM can be captured as a clear image even if the organic EL panel P is warped or bumped, and even if the alignment mark PM provided on the upper surface is captured via the resin substrate of the organic EL panel P to which the PI film and the PET film are bonded.

The control device 110 obtains X, Y and θ -directional relative positional displacement between the organic EL panel P and the electronic component W based on the positional data of the left and right alignment marks PM of the organic EL panel P and the positional data of the left and right alignment marks WM of the electronic component W transmitted from the image processing unit 44 c. Then, the control device 110 moves the organic EL panel P and the electronic component W to the temporary press-contact position. At this time, the tool driving unit 41b and the table driving unit 42c are controlled so as to cancel the relative positional deviation, based on the obtained relative positional deviation, thereby performing the alignment of the organic EL panel P and the electronic component W.

Specifically, the control device 110 obtains the slope θ P of a line segment connecting these 2 points and the coordinates (XP, YP) of the midpoint of the line segment, based on the position data of the left and right alignment marks PM of the organic EL panel P. The controller 110 obtains the slope θ W of a line segment connecting these 2 points and the coordinates (XW, YW) of the midpoint of the line segment, based on the position data of the left and right alignment marks WM of the electronic component W. The difference between the coordinates of the slope and the midpoint obtained here is obtained as the relative positional deviation between the two. The positional deviation is corrected as follows based on the obtained relative positional deviation.

First, the pressing tool 41a is rotated in the θ direction to eliminate the difference between the inclination θ P of the line segment connecting the alignment marks PM of the organic EL panel P and the inclination θ W of the line segment connecting the alignment marks WM of the electronic component W, even if θ P — θ W is 0. Next, the table 42 (table driving section 42b) is driven so that the midpoint of the line segment connecting the alignment marks PM of the organic EL panel P coincides with the midpoint of the line segment connecting the alignment marks WM of the electronic component W. At this time, when the rotation center in the θ direction of the pressing tool 41a is located at a position shifted from the position of the midpoint of the line segment between the alignment marks WM that connect the electronic components W, the midpoint position of the line segment is shifted in the horizontal direction by the rotation amount of the pressing tool 41a by the rotation of the pressing tool 41a, and therefore the movement position of the organic EL panel P is performed in consideration of the positional shift.

The edge portion of the organic EL panel P positioned at the temporary pressure bonding position is supported on the upper surface of the supporting tool 43 a. The electronic component W is fixed in position, and the terminal row TR faces directly above the electrode row ER of the organic EL panel P with a minute gap. In this state, the pressing tool 41a is lowered by the driving of the tool driving portion 41 b. Thus, the terminal portion of the electronic component W is heated and pressed to the electrode surface of the organic EL panel P via the anisotropic conductive tape F at a predetermined heating temperature, pressing force, and pressing time, and the electronic component W is temporarily pressed against the organic EL panel P.

When the preset pressing time elapses, the suction of the electronic part W by the pressing tool 41a is released, and the pressing tool 41a is raised. The pressing tool 41a moves to a delivery position where the electronic component W is delivered from the second delivery device 70. The table 42 on which the organic EL panel P to which the electronic component W is temporarily pressed is placed is moved to a carrying-out position where the organic EL panel P is transferred to the second conveying unit 90. At the carry-out position, the organic EL panel P is sucked and held on the upper surface thereof by the holder 91 of the second conveying unit 90 in the same manner as the holding of the holder 81 of the first conveying unit 80, and is conveyed to the table 51 of the main pressure bonding device 50.

The organic EL panel P supplied to the main bonding apparatus 50 by the second conveying unit 90 is transferred to the table 51 whose position is fixed at the carrying-in position, and is sucked and held on the table 51. The operation at the time of delivery is performed in the same manner as the delivery of the organic EL panel P from the first conveying section 80 to the table 42. At this time, the edge portion of the organic EL panel P to which the electronic component W is temporarily pressed is held in a state of protruding from the table 51.

When the organic EL panel P is held on the table 51, the table 51 moves so that the edge portion of the organic EL panel P is supported on the upper surface of the supporting tool 53 a. Further, during the movement, the position recognition unit 54 recognizes the position of the alignment mark (mark different from the alignment mark PM) of the organic EL panel P. Based on the position recognition result, the table 51 is moved so that the electrode surface of the organic EL panel P is positioned on the upper surface of the supporting tool 53a in a correct positional relationship. When the edge portion of the organic EL panel P is supported on the upper surface of the supporting tool 53a, the pressing tool 52a is lowered by the driving of the tool driving unit 52b, and the electronic component W temporarily pressed against the organic EL panel P is subjected to main pressure bonding at a predetermined heating temperature, a predetermined pressing force, and a predetermined pressing time.

When a preset pressing time elapses, the pressing tool 52a is raised. The table 51 on which the display member, which is the organic EL panel P to which the electronic component W is normally crimped, is placed is moved to a carrying-out position where the organic EL panel P is delivered to the third transport unit 100. At the carry-out position, the organic EL panel P is sucked and held on the upper surface thereof by the holder 101 of the third conveyor unit 100, and is conveyed to a carry-out device not shown.

The mounting operation including the temporary pressure bonding step and the final pressure bonding step of the electronic component W to the organic EL panel P is repeatedly performed until there is no organic EL panel P to which the electronic component W should be mounted. In the mounting apparatus 1 according to the embodiment, while it is important to improve the positional accuracy in the temporary pressure bonding step, it is important to improve the pressure bonding strength and reliability of the anisotropic conductive tape F in the main pressure bonding step, and the process time is different. Therefore, by applying the temporary pressure bonding device 40 and the main pressure bonding device 50 and performing the temporary pressure bonding step and the main pressure bonding step, the mounting efficiency of the electronic component W can be improved. However, the mounting device 1 of the embodiment is not limited to such a configuration. The primary pressure bonding apparatus 50 may perform the positioning step to the primary pressure bonding step.

[ Effect of the mounting device ]

In the mounting device 1 of the above-described embodiment, the organic EL panel P having a thickness of 50 μm to 500 μm and a flexural modulus of elasticity of 2.6GPa to 4.0GPa and having flexibility is placed on the table 42 (placing section 42a) such that the edge portion of the table 42 where the electronic component W is mounted protrudes by 3mm to 15mm, and the alignment mark PM provided on the edge portion of the organic EL panel P is irradiated with light from the side opposite to the

image pickup devices

44a and 44b, i.e., from above by the light irradiation section 44 d. Then, in this state, the alignment marks PM provided at the edge portion of the organic EL panel P and the alignment mark WM of the electronic component W held by the temporary pressure welding head 41 are imaged by the

imaging devices

44a and 44 b. The image processing unit 44c performs image processing on the captured image, recognizes the positional relationship between the organic EL panel P and the electronic component W, aligns the organic EL panel P and the electronic component W with the control device 110, temporarily pressure-bonds the electronic component W to the organic EL panel P via the anisotropic conductive tape F, and then performs final pressure bonding.

With this, when the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are detected, it is possible to prevent the edge portion of the organic EL panel P where the electrode is formed and the edge portion protruding from the table 42 from sagging. Even in the organic EL panel P formed of a resin such as PI or PET, which may have warpage or undulation at the edge portion or may be formed of a resin substrate having a lower transmittance than glass, the alignment mark PM can be imaged as a contour image by transmitted light, so that the difference in brightness between the alignment mark PM and the background can be increased, and thus the alignment mark PM can be clearly imaged. Therefore, it is possible to reduce the recognition error of the alignment mark PM due to the sagging of the edge portion of the organic EL panel P and the recognition error of the alignment mark PM due to the lack of the sharpness of the captured image. As a result, the mounting accuracy of the electronic component W to the organic EL panel P can be improved. Therefore, even when the flexible electronic component W is mounted on the flexible organic EL panel P, the mounting accuracy and the mounting quality can be improved.

That is, since a display panel (hereinafter, referred to as a liquid crystal display panel) used in the manufacture of a conventional liquid crystal display is formed by bonding glass substrates having a thickness of 0.5 to 0.7mm to each other, the rigidity is relatively high. Therefore, even if the edge portion of the liquid crystal display panel is held by being protruded from the table by about several tens of mm, the edge portion hardly sags due to its own weight.

On the other hand, in the organic EL panel P, as described above, the rigidity is extremely low because a thin resin substrate is used which is formed by bonding the PI film Ka having a thickness of about 0.01 to 0.03mm (10 to 30 μm) which is a member on which the organic EL element is formed and the PET film Kb having a thickness of about 0.1 to 0.2mm which is a support material. Therefore, in the organic EL panel P, when the edge portion thereof is held by being protruded from the table by about several tens of mm, the protruded edge portion is liable to sag due to its own weight. When the edge portion of the organic EL panel P sags, the position of the alignment mark PM formed at the edge portion is shifted by a corresponding amount in the horizontal direction. Therefore, in the position recognition of the alignment mark PM of the organic EL panel P using the camera, the recognition position thereof is deviated.

The inventors of the present application confirmed through experiments that, in the same manner as in the case of a liquid crystal display panel of the same size, when the edge portion of the organic EL panel P was held while being extended by 20mm from the table, sagging occurred at the edge portion, and the position of the alignment mark PM was shifted by about 4 μm in the horizontal direction (toward the table side) due to the sagging. Also, in the case where the edge portion of the organic EL panel P droops, the alignment mark is inclined with respect to the horizontal state. When the tilted alignment mark PM is photographed from directly below, the length of the photographed alignment mark in the tilt direction is photographed to be shorter than that in the case of photographing in the horizontal state. That is, the shape of the captured alignment mark PM is deformed by an amount corresponding to the inclination. As a result, a difference in shape occurs between the reference mark PM and the reference mark stored in advance, and an error occurs in the recognition position of the alignment mark PM.

The inventors of the present application have conducted an experiment for comparing errors in the recognized positions between the alignment marks PM held horizontally and the alignment marks PM inclined at 5 ° with respect to the horizontal, and have confirmed that the average error of the alignment marks inclined at 5 ° is larger by about 1 μm. The reason why the experiment was performed with the alignment mark inclined by 5 ° is that, when sagging occurring when the edge portion was protruded 20mm from the table was measured for a plurality of organic EL panels P, sagging of 5 ° or more was observed for all of the organic EL panels P.

In contrast, in the mounting device 1 of the embodiment, as described above, the organic EL panel P having a thickness of 50 μm to 500 μm inclusive and a flexural modulus of 2.6GPa to 4.0GPa inclusive is placed on the table 42 (placing section 42a) such that the edge portion on which the electronic component W is mounted protrudes from the table 42 by 3mm to 15mm inclusive, whereby the edge portion of the organic EL panel P protruding from the table 42 can be prevented from sagging. This can suppress the occurrence of a recognition error of the alignment mark PM due to the sagging of the organic EL panel P from the extended portion of the table 42. That is, if the bending modulus of the overhang of the organic EL panel P is 2.6GPa or more, the thickness is 50 μm or more, and the overhang is 15mm or less, the overhang can be prevented from sagging. Further, when the flexural modulus of the extension exceeds 4.0GPa or the thickness exceeds 500 μm, the properties such as flexibility of the organic EL panel P and the basic properties as a thin display panel may be degraded.

Further, when the alignment mark PM of the organic EL panel P is imaged, if the camera is illuminated from a lower side, there is a problem that the alignment mark PM cannot be clearly imaged or cannot be imaged at all. The irradiation conditions when the illumination is performed from the lower side are (irradiation light amount, irradiation angle, and the like), and the conditions for capturing the alignment mark of the reference panel are set to be satisfactory by using the organic EL panel serving as the reference (for example, an organic EL panel having a flat edge portion, hereinafter referred to as "reference panel"). Even when such irradiation conditions are applied, the edge portion of the organic EL panel P actually photographed is different from the reference panel in reflection of illumination at the edge portion thereof because the edge portion of the organic EL panel P is different from the reference panel in the state of sagging, warping, tilting relative to the edge portion of the reference panel, and the like. As a result, there is a problem that the alignment mark PM cannot be clearly imaged or cannot be imaged at all. As a result of experiments by the present inventors, it was confirmed that when the alignment mark PM could not be clearly imaged, the recognition position was shifted by about 1 μm at maximum.

In view of this, in the mounting device 1 of the embodiment, in addition to preventing the edge portion of the organic EL panel P extending from the table 42 from sagging, the alignment mark PM is irradiated with light from above, which is the opposite side to the

image pickup devices

44a and 44b, by the light irradiation portion 44d, and the alignment mark PM is photographed as a contour image by transmitted light. Accordingly, even in the organic EL panel P formed of a resin such as PI or PET, which may have warpage or undulation at the edge portion, or a resin substrate having a lower transmittance than glass, the difference in brightness between the alignment mark PM and the background can be increased, and thus the alignment mark PM can be clearly imaged. This can reduce the recognition error of the alignment mark PM, and thus can improve the mounting accuracy of the electronic component W on the organic EL panel P.

In order to suppress sagging and warping of the edge portion of the organic EL panel P, the present inventors have attempted to mount electronic components in a state in which a support member having a flat suction hole is attached to a table so as to hold the edge portion supporting the organic EL panel without sagging. The support member is made of stainless steel used for a support tool of a general OLB apparatus. In addition, an observation hole for photographing having a diameter of 3mm penetrating vertically is provided in a portion of the support corresponding to the position of the alignment mark.

However, even if such a support member is used, the mounting accuracy of ± 3 μm cannot be sufficiently satisfied in some varieties of organic EL panels. That is, when an experiment was performed to confirm the mounting accuracy using a plurality of types of organic EL panels, it was found that there were types in which the mounting accuracy could be obtained within ± 3 μm and types in which the mounting accuracy exceeded ± 3 μm.

That is, since the organic EL panel P is formed of a thin and flexible resin substrate, when suction is performed with a large suction force, a suction mark is generated. The edge portion of the organic EL panel P is not used for displaying an image, but a fine electrode (also referred to as a "lead") connected to a terminal of the electronic component W is formed. Therefore, when the adsorption mark is generated in the electrode portion, the electrode is deformed such as bent. Stress remains in the deformed electrode, which is not preferable because it causes deterioration in durability of the electrode. Accordingly, the size of the suction hole and the size of the negative pressure acting on the suction hole need to be set within a range in which no suction mark of the organic EL panel is generated. In the above experiment, a row of adsorption holes having a diameter of 0.5mm were formed at intervals of 2mm on the support, and a negative pressure of-40 kPa was applied to the adsorption holes. However, when the suction force in consideration of the suction traces is set in this manner, it has been found that the edge portion may not follow the support surface of the support depending on the type of the organic EL panel.

That is, depending on the type of the organic EL panel, warping and undulation may occur at the edge portion thereof, and among the organic EL panels in which such warping and undulation occur, there are also panels in which warping and undulation are corrected by suction and a profile is formed on the support surface of the support, and panels in which warping and undulation are not corrected. In the organic EL panel in which the warpage and undulation were not corrected, it was confirmed that the mounting accuracy exceeded ± 3 μm. In addition, it has been found that in the organic EL panel in which such warpage and undulation are not corrected, the alignment mark cannot be clearly imaged unlike in the reference panel due to reflection of illumination irradiated from the same side as the camera, and as a result, the accuracy of recognition of the alignment mark is lowered.

In addition, it was further found that a new problem was caused by providing a support and providing an observation hole for imaging on the support. That is, it was confirmed that, when the pressure contact head is brought into contact with the organic EL panel via the electronic component at the time of temporary pressure contact by providing the observation hole, the organic EL panel is indented by the impact due to the contact. Such indentation also deforms the electrodes of the organic EL panel, as with the above-described adsorption trace, and therefore reduces the mounting quality, which must be avoided. In addition, in the part of the adsorption hole of the support, since the diameter was as small as 0.5mm, the generation of the indentation was not found.

Therefore, attempts have been made to form the support with glass, and identify the alignment mark through the support without providing a viewing hole. As a result, it was found that the occurrence of the indentation could be eliminated, but the durability had a problem. Specifically, when the mounting was repeatedly tested, the occurrence of a defect was confirmed in the support member from the time when the number of times of mounting exceeded 10000 times. Therefore, when such a glass support is used, the support needs to be replaced based on the number of times of installation of about 10000 times. In such mounting, since the time (tact time) required for mounting 1 electronic component is usually 3 seconds to 5 seconds, it reaches 10000 times in 8.3 hours to 13.9 hours in the case of continuous operation. Therefore, the support member needs to be replaced every 8.3 to 13.9 hours, that is, at a frequency of 2 to 3 times a day.

Between the holder and the pressure contact head, it is necessary to uniformly press the electrode portion of the electronic component against the electrode portion of the organic EL panel, and thus precise parallelism is required. The individual support members are processed into the same shape, but have individual differences. Therefore, each time the support is replaced, adjustment of the parallelism between it and the crimping tool is required. Therefore, the operation of the OLB apparatus must be stopped during this adjustment, and therefore production cannot be performed. When such stoppage occurs a plurality of times a day, productivity is significantly reduced, which is not practical. Further, it is also conceivable to fit a glass cover into the upper part of the observation hole of the support made of stainless steel, and to make the support surface of the support apparently flat. However, if the cover is made of glass, there is a problem in durability, and if a step is generated between the upper surface of the cover and the support surface, indentation is not likely to be generated.

The mounting device 1 of the embodiment can suppress the problems of the impression due to the observation hole of the support, the reduction of the recognition accuracy of the alignment mark due to the uncorrected warpage and undulation of the support surface of the support, the reduction of the mounting efficiency due to the durability of the glass support, and the like in the case of using the support as described above to prevent the sagging of the edge portion of the organic EL panel P and to recognize the alignment mark. That is, not only the edge portion of the organic EL panel P is extended from the table 42 and sagging is prevented from occurring at the extended edge portion, but also the alignment mark PM is imaged as a contour image by transmitted light, so that it is possible to avoid the problem caused by the above-described support, and to improve the mounting accuracy and mounting quality of the electronic component W with respect to the organic EL panel P.

In the mounting device 1 of the embodiment, the support tool 43a used for temporary pressure bonding is formed of, for example, stainless steel, and the support surface for supporting the edge portion of the organic EL panel P is formed flat. Therefore, it is possible to prevent the edge portion of the organic EL panel P from being indented at the time of temporary pressure bonding. Further, since stainless steel is used, the temporary pressure welding head 41 is less likely to be damaged even when pressed, and therefore, the temporary pressure welding head has excellent long-term durability and can maintain good productivity.

The control device 110 controls the driving of the stage driving unit 42b and the XZ driving unit 82 based on the amount of protrusion G of the edge portion of the organic EL panel P from the placement portion 42a of the stage 42 stored in the storage unit 111, and places the organic EL panel P on the placement portion 42a of the stage 42 from the holding body 81 of the first transport unit 80 by the amount of protrusion G set in the range of 3mm to 15 mm. Accordingly, the organic EL panel P can be reliably placed on the placement portion 42a with the set protrusion G, and the edge portion of the organic EL panel P can be reliably prevented from sagging, thereby further improving the accuracy of recognizing the alignment mark PM stably. As a result, the mounting accuracy of the electronic component W on the organic EL panel P can be stably obtained, and the mounting quality of the electronic component W can be improved.

The present invention is not limited to the above-described embodiments. For example, the description has been given of an organic EL panel as a display panel, but the present invention is not limited thereto. For example, a component of flexible electronic paper may be used as the display panel. In short, it can be applied to a display panel having flexibility and a thickness of 50 μm to 500 μm and a flexural modulus of 2.6GPa to 4.0 GPa.

Further, the organic EL panel P is placed on the placing section 42a by controlling the table driving section 42b and the XZ driving section 82 based on the set protrusion amount G, but the present invention is not limited thereto, and the protrusion amount of the organic EL panel P may be detected, and the table driving section 42b and the XZ driving section 82 of the first transport section 80 may be controlled so as to be the set protrusion amount G. In this case, for example, a detector such as a photo sensor or a laser sensor that detects the end portion (the side where the electrode row ER is formed) of the organic EL panel P held by the holder 81 is provided at the table 42 or at a delivery position where the organic EL panel P is delivered to the table 42, and based on the detection result of the detector, the amount of protrusion of the edge portion from the placement portion 42a is controlled so as to be the set amount of protrusion G.

Instead of storing the extension amount G in the storage unit 111, information (item information) about the item of the display panel may be stored. In this case, a conversion table indicating the relationship between the item information of the display panel P and the extension amount G corresponding to the item information is obtained in advance by an experiment or the like, and the conversion table is stored in the storage unit 111. Then, based on the item information input by the input means not shown, the extension amount G corresponding to the item information may be read.

In addition, the case where the first and

second imaging devices

44a and 44b that simultaneously capture the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W in the same field of view and perform imaging are used as the imaging device of the position recognition device 44 has been described, but the imaging device of the position recognition device 44 is not limited to this. For example, the first and

second imaging devices

44a and 44b may respectively image the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W.

Two image pickup devices may be provided, the first and second

image pickup devices

44a and 44b may image the alignment mark WM of the electronic component W, and the other two image pickup devices may image the alignment mark PM of the organic EL panel P. In this case, two other image pickup devices may be mounted so as to take an image from the upper side without taking an image from the lower side of the alignment mark PM of the organic EL panel P. In this case, the light irradiation unit 44d may be disposed below the placement unit 42a of the table 42, and may irradiate the alignment marks PM of the organic EL panel P with light from below. In this manner, when the alignment mark PM of the organic EL panel P is photographed from the upper side by the transmissive illumination, the alignment mark P provided on the upper surface side of the organic EL panel P is directly photographed. Therefore, compared to when imaging is performed by transmission illumination through a resin base material of the organic EL panel P from below, a light-dark difference can be further obtained, and the recognition accuracy can be further improved.

The alignment mark PM of the organic EL panel P is imaged by transmission illumination, but the alignment mark WM of the electronic component W may also be imaged by transmission illumination. In this case, a light guide portion may be provided in the pressing tool 41a of the temporary bonding head 41 so as to match the position of the alignment mark WM of the electronic component W, and light irradiated from the light irradiation portion 44d may be guided to the alignment mark WM through the light guide portion. Of course, the light irradiation portions may be provided separately or embedded in the pressing tool 41 a.

The anisotropic conductive tape F is used for connection between the organic EL panel P and the electronic component W, but is not limited thereto. Other connecting members, for example, an adhesive containing conductive particles, may be used. When an adhesive is used, a thermosetting or photocurable adhesive can be used.

The configurations of the first to third conveying

units

80, 90, and 100 are not limited to the above configuration, and may be other configurations. For example, instead of using the porous sheet, a material in which a plurality of openings for suction are provided in a soft rubber or a resin material such as a foamed urethane rubber or a silicone rubber may be used.

The case where the organic EL panel P is conveyed from the table 42 of the temporary pressure bonding apparatus 40 to the table 51 of the main pressure bonding apparatus 50 by using the second conveying section 90 has been described, but the present invention is not limited thereto. For example, the table 51 of the main pressure bonding device 50 may be moved to a position close to the table 42 of the temporary pressure bonding device 40, and the organic EL panel P may be conveyed to the table 51 of the main pressure bonding device 50 moved to the position close to the table 42 of the temporary pressure bonding device 40 by using the first conveying unit 80. That is, the first conveying unit 80 may also serve as the second conveying unit 90.

A plurality of main pressure bonding devices 50 may be provided in the mounting device 1 in consideration of the process time difference between the temporary pressure bonding step and the main pressure bonding step. Instead of providing a plurality of main pressure bonding devices 50, a table 51 on which a plurality of organic EL panels P can be placed in parallel may be provided on 1 main pressure bonding device 50, and a main pressure bonding head 52 that can collectively or individually main-press-bond the electronic components W on the plurality of organic EL panels P placed in parallel may be provided. Here, when the main press bonding is performed collectively, the main press bonding head 52 is equipped with a pressing tool 52a having a length capable of covering the entire area of the plurality of organic EL panels P placed in parallel. In addition, when the main press bonding is performed independently, the pressing tool 52a capable of covering the length of the electronic component W mounted on one organic EL panel P is mounted on the main press bonding head 52 in accordance with the mounting interval of the organic EL panel P. Each pressurizing tool 52a is preferably configured to be capable of independently setting a pressurizing force.

In the above embodiment, the configuration in which the anisotropic conductive tape F is attached to the electronic component W has been described, but the present invention is not limited thereto. The anisotropic conductive tape F may be attached to the organic EL panel P, that is, the display panel. In this case, instead of providing the anisotropic conductive tape application device 30 at the application position C of the intermittent rotary transport device 20, an anisotropic conductive tape application device for applying the anisotropic conductive tape F to the organic EL panel P may be provided upstream of the supply portion of the organic EL panel P. For example, a mounting apparatus 201 as shown in fig. 10 may be applied. Fig. 10 shows a structure of a mounting device 201 according to another embodiment.

[ mounting device of other embodiment ]

The mounting device 201 shown in fig. 10 has the following configuration: the anisotropic conductive tape pasting device 230, the temporary pressure bonding device 240, and the main pressure bonding device 250 are arranged in the X direction, the punching device 210 is arranged behind the temporary pressure bonding device 240 in the Y direction, and the conveying device 260 for conveying the electronic component W is arranged between the temporary pressure bonding device 240 and the punching device 210. The

transport portions

271, 272, 273, 274 of the organic EL panel P are disposed between the

processing devices

230, 240, 250. The mounting apparatus 201 supplies four organic EL panels P at a time to perform processing in each processing apparatus. The punching device 210 punches out the electronic component W from the carrier tape T, and has the same configuration as the punching device 10 described in the above embodiment.

The anisotropic conductive tape attaching device 230 attaches the anisotropic conductive tape F to the organic EL panel P. The anisotropic conductive tape bonding apparatus 230 has two placing units 231 and 232 arranged and held in the X direction for every two organic EL panels P arranged and held in the X direction. These placing units 231 and 232 are provided so as to be movable in XYZ θ directions. Further, attaching means 233 and 234 for the anisotropic conductive tape F are disposed corresponding to the two placing sections 231 and 232. The placement units 231 and 232 sequentially position and fix the organic EL panels P on the placement units 231 and 232 at the attachment positions of the

corresponding attachment units

233 and 234, respectively. The

pasting units

233 and 234 paste the anisotropic conductive tape F onto the organic EL panel P fixed in position at the pasting position.

The temporary bonding device 240 temporarily bonds the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is attached. The temporary pressure bonding device 240 includes: a mounting section 241 for holding four organic EL panels P in an array in the X direction; a temporary pressure bonding head 242 for temporarily pressure bonding the electronic component W to the organic EL panel P held by the placing section 241; and a support tool, not shown, for supporting the organic EL panel P from below when the electronic component W is temporarily pressure-bonded to the organic EL panel P by the temporary pressure-bonding head 242. The placing section 241 is provided to be movable in XYZ θ directions, and the four organic EL panels P on the placing section 241 are sequentially positionally fixed at the temporary pressing position of the temporary pressing head 242. The temporary press-bonding head 242 temporarily presses the electronic parts W in turn on the organic EL panel P positionally fixed at the temporary press-bonding position. It is needless to say that the temporary pressure bonding device 240 includes the same position recognition device as the temporary pressure bonding device 40 described in the above embodiment.

Here, the electronic components W punched out by the punching device 210 are sequentially supplied to the temporary bonding head 242 by the conveying device 260. That is, the conveying device 260 includes a receiving portion 262 that is movable in XYZ θ directions by an XYZ θ drive portion 261, that holds the electronic component W by suction from below, that receives the electronic component W from the press unit 210, and that delivers the electronic component W to the temporary bonding head 242.

The main pressure bonding device 250 performs main pressure bonding of the electronic component W temporarily pressure bonded to the organic EL panel P. The main pressure bonding device 250 is provided with four placing

units

251, 252, 253, and 254, each of which independently holds one organic EL panel P, arranged in parallel in the X direction. In addition, four main crimping

heads

255, 256, 257, 258 are provided corresponding to the four

placement portions

251, 252, 253, 254. The main pressure welding heads 255, 256, 257, and 258 are provided so as to be capable of independently adjusting the pressurizing force, and are provided so as to be capable of moving up and down in a lump. Each of the placing

sections

251, 252, 253, 254 is movable in XYZ θ directions, and can position the organic EL panel P with respect to the corresponding main crimping

heads

255, 256, 257, 258. The four main pressure bonding heads 255, 256, 257, 258 collectively perform main pressure bonding of the four organic EL panels P whose positions are fixed by the four

placement units

251, 252, 253, 254.

The

transport units

271, 272, 273, and 274 simultaneously transfer the four organic EL panels P to and from the

respective processing apparatuses

230, 240, and 250. That is, the

conveyance units

271, 272, 273, and 274 are provided with four holding units arranged in parallel in the X direction, for suction-holding the organic EL panel P from above. Then, the transport unit 271 simultaneously delivers and delivers the four organic EL panels P from a supply unit, not shown, to the anisotropic conductive tape application device 230. The transport unit 272 simultaneously transfers the four organic EL panels P from the anisotropic conductive tape application device 230 to the temporary pressure bonding device 240. The transport portion 273 simultaneously delivers the four organic EL panels P from the temporary pressure bonding device 240 to the main pressure bonding device 250. The transport unit 274 simultaneously carries out the four organic EL panels P from the main pressure bonding device 250 to a carrying-out unit, not shown. The present invention can also be applied to the mounting device 201 of such a configuration.

[ examples ] A method for producing a compound

Next, examples of the present invention and evaluation results thereof will be described.

(example 1)

An experiment for confirming the mounting accuracy by the teg (test Element group) was performed under the following conditions using the mounting apparatus 1 of the above-described embodiment. Here, the TEG is an evaluation member produced for testing, and here, an evaluation member of the organic EL panel P is produced. Specifically, a PET film having a thickness of 0.20mm (200 μm) and a size equivalent to 5 inches (120mm × 65mm) was laminated on a PI film having a thickness of 0.03mm (30 μm) and a PI film having a size equivalent to 5 inches (120mm × 65mm) using an optical ultraviolet curable resin to fabricate a TEG of an organic EL panel. The flexural modulus of PET was 3.07GPa, and that of PI was 3.5 GPa. From the ratio of the thicknesses of the two, the flexural modulus of elasticity of the organic EL panel P is estimated to be about 3.1 GPa. As the electronic component W, a COF having a width of 36mm and a length of 25mm was used. Hereinafter, the TEG of the organic EL panel P is simply referred to as the organic EL panel P. The target accuracy is the general accuracy required for an organic EL panel used for a display panel for a smartphone, and is ± 3 μm.

< Experimental conditions >

Heater of temporary crimping joint: close off

Tact time: 10 seconds (wherein the moving speed of the temporary bonding tool 41a and the placing section 42a is the same as that in the case of mounting at a beat of 5 seconds.)

Repetition time (number of times): 2.8 hours (1000 times)

In the experiment, first, the organic EL panel P is placed on the placing section 42a in a state where each panel is in the standby position, and the electronic component W is held by the pressing tool 41 a. The standby position is a supply position where the placing section 42a receives the organic EL panel P from the first conveying section 80, and the pressing tool 41a receives the electronic component W from the second delivery device 70. From this state, the organic EL panel P and the electronic component W are positionally fixed at the mark recognition position before the temporary pressure bonding. At this time, the pressing head 41a is fixed in position in a state rotated in the horizontal direction by θ +5 °. This is to confirm the correction accuracy of the rotational misalignment. The projecting amount G of the edge portion of the organic EL panel P was set to 4 mm.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are recognized by the first and

second imaging devices

44a and 44b, and the organic EL panel P and the electronic component W are aligned based on the recognition result. The positioning is performed in a state where the edge portion of the electronic component W does not overlap the edge portion of the organic EL panel P, but the edge portion of the organic EL panel P and the edge portion of the electronic component W are opposed to each other with a slight distance therebetween. Specifically, alignment marks PM and WM are aligned at intervals of 3 mm. The distances from the alignment marks PM, WM to the edges are about 0.6-1.2 mm, respectively, and therefore the edge portions are arranged at intervals of 0.6-1.8 mm.

When the alignment is completed, the alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic component W are simultaneously captured from below in the same field of view by using the first and

second imaging devices

44a and 44b, and the relative positional shift between the organic EL panel P and the electronic component W is recognized. Then, the relative positional deviation found from the recognition result is recorded as the mounting accuracy. Further, since the alignment marks PM and WM are aligned at an interval of 3mm, the alignment marks PM and WM are shifted by 3mm in the Y-axis direction in an ideal alignment state.

As a result, the maximum value of the positional deviation in the X-axis direction was 0.7 μm, and the minimum value was-0.4. mu.m. The maximum value of the positional shift in the Y-axis direction was 0.5 μm, and the minimum value was-0.9. mu.m. Are all within + -3 μm of the target accuracy.

(example 2)

In example 2, an experiment was performed under the same conditions as in example 1, except that the protrusion G was set to 15 mm. As a result, the maximum value of the positional deviation in the X-axis direction was 1.6 μm, and the minimum value was-1.1. mu.m. The maximum value of the positional shift in the Y-axis direction was 0.9 μm, and the minimum value was-2.3 μm. Are all within + -3 μm of the target accuracy.

Comparative example 1

In comparative example 1, an experiment was performed under the same conditions as in example 1, except that the protrusion G was set to 20 mm. As a result, the maximum value of the positional deviation in the X-axis direction (the maximum value of the positional deviation in the positive direction) was 2.7 μm, and the minimum value (the maximum value of the positional deviation in the negative direction) was-2.0 μm. The maximum value of the positional shift in the Y-axis direction was 1.5 μm, and the minimum value was-5.8. mu.m. The positional deviation in the X-axis direction is within. + -. 3 μm of the target accuracy, but the positional deviation in the Y-axis direction is greatly deviated from the range of. + -. 3 μm of the target accuracy.

The measurement results of example 1 are shown in table 1 and fig. 11. Table 2 and fig. 12 show the measurement results of comparative example 1. Table 1 and table 2 show the average value (1) of the data from the 1 st to the 10 th times, the average value (2) of the data from the 101 st to the 110 th times thereafter, and the average values ((3) to ((10)) of the data from the 10 th times per 100 times similarly in the following, as "relative positional deviation identification results", respectively, among the 1000 times of data acquired during the repetition time period. The "difference between the measurement results of (1)" in table 1 is a value obtained by subtracting the average value (1) from the average values ((2) to (10)) of the data for each 100 times. Fig. 11 and 12 show the variation of the "difference between the measurement results of (1)". As is clear from comparison of table 1 and fig. 11 with table 2 and fig. 12, variation in mounting accuracy of example 1 is significantly suppressed as compared with comparative example 1. Therefore, it is found that the mounting accuracy of the flexible electronic component to the flexible display panel can be maintained over a long period of time.

[ TABLE 1 ]

Example 1 (overhang G: 4mm)

[ TABLE 2 ]

Comparative example 1 (extension G: 20mm)

(examples 3 and 4)

As examples 3 and 4, using the mounting apparatus 1 of the above-described embodiment, another TEG was produced and an experiment for confirming mounting accuracy was performed. As the organic EL panel P, a panel having an optical film attached to a display portion was assumed, and a TEG having a PEN film attached to a portion corresponding to the display portion was produced. More specifically, a PEN film having a size of 114mm × 65mm and a thickness of 0.15mm (125 μm) was laminated on the TEG used in examples 1 and 2 using an optical ultraviolet-curable resin, and a new TEG was produced. The PEN film was bonded to the TEG used in examples 1 and 2 so as to be aligned with the end portion on the opposite side of the edge portion to which the electronic component W was mounted, and so as to form a 6mm gap between the end portion on the edge portion side to which the electronic component W was mounted and the end portion of the PEN film. The bending modulus of PEN was 2.2GPa, that of PI was 3.5GPa, and that of PET was 3.07 GPa. From the ratios of the thicknesses of the three, the bending elastic modulus of the organic EL panel P is estimated to be about 2.8 GPa. As the electronic component W, a COF having a width of 36mm and a length of 25mm was used in the same manner as in examples 1 and 2.

In example 3, an experiment was performed under the same conditions as in example 1. As a result, the maximum value of the positional deviation in the X-axis direction was 0.9 μm, and the minimum value was-0.3. mu.m. The maximum value of the positional shift in the Y-axis direction was 1.0 μm, and the minimum value was-0.7. mu.m. Although the results were inferior to example 1, they were within. + -. 3 μm as the target accuracy. In example 3, since the protrusion amount G was 4mm, the organic EL panel P had only the edge portion where the PEN film was not present in the portion protruding from the table 21, and it is estimated that the result was substantially the same as that of example 1.

In example 4, an experiment was performed under the same conditions as in example 1, except that the protrusion G was set to 12 mm. By setting the protrusion amount G to 12mm, the portion of the organic EL panel P to which the PEN film is bonded protrudes by 6 mm. As a result, the maximum value of the positional deviation in the X-axis direction was 1.9 μm, and the minimum value was-1.5. mu.m. The maximum value of the positional shift in the Y direction was 2.6 μm, and the minimum value was-1.6. mu.m. Are all within + -3 μm of the target accuracy.

Comparative example 2

In comparative example 2, an experiment was performed under the same conditions as in example 1, except that the protrusion G was set to 20 mm. As a result, the maximum value of the positional deviation in the X-axis direction was 2.8 μm, and the minimum value was-2.3. mu.m. The maximum value of the positional shift in the Y direction was 8.2 μm, and the minimum value was-0.6. mu.m. The positional deviation in the X-axis direction is within. + -.3 μm of the target accuracy, but the positional deviation in the Y-axis direction is greatly deviated from the range of. + -.3 μm of the target accuracy.

From these results, it is understood that the shorter the protruding amount G of the edge portion of the organic EL panel P from the placing portion 42a of the table 42, the more the mounting accuracy can be improved. It was also confirmed that the mounting accuracy can be made within. + -. 3 μm by setting the protrusion amount to 15mm or less.

Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Claims

1. An electronic component mounting apparatus for mounting a plurality of flexible electronic components on a display panel by connecting a plurality of terminals arranged corresponding to a plurality of electrodes among the plurality of electrodes to the plurality of electrodes arranged at an edge portion of the display panel via a bonding member, the electronic component mounting apparatus comprising:

a table on which the display panel is placed so that the edge portion thereof extends, the table being movable in a horizontal direction;

a conveying unit configured to supply the display panel to the table;

a support unit configured to support the edge portion of the display panel placed on the table from below;

a thermocompression bonding head which holds the electronic component from the upper side, thermocompressively bonds the electronic component to the upper surface of the edge portion supported by the support unit, and is movable in the horizontal direction and the vertical direction; and

a position recognition device is provided with: an imaging device that images an alignment mark provided on the edge portion of the display panel protruding from the table and an alignment mark provided on the electronic component in a state before the edge portion is supported by the support unit; and a light irradiation unit that irradiates light to the display panel from a side opposite to the imaging device, the position recognition device recognizing a positional relationship between the display panel and the electronic component,

the edge portion of the display panel extending from the table has a thickness of 50 to 500 [ mu ] m, a flexural modulus of 2.6 to 4.0GPa,

the mounting device is provided with a control device for controlling,

controlling the movement of the table and the conveying unit so that the edge portion protrudes from the table within a range of 3mm to 15mm and is placed on the table based on a protrusion amount of the edge portion of the display panel, which is set in advance within a range of 3mm to 15mm,

and adjusting a relative position between the stage and the thermocompression bonding head so as to align positions of the display panel and the electronic component based on the positional relationship recognized by the position recognition device, and controlling the stage and the thermocompression bonding head so that the electronic component is thermocompression bonded to the display panel by the thermocompression bonding head.

2. The mounting device for electronic parts according to claim 1,

the imaging device of the position recognition device captures an image of the alignment mark of the display panel placed on the table and an image of the alignment mark of the electronic component simultaneously in the same field of view.

3. A method for manufacturing a display member, comprising:

a mounting step of mounting a flexible display panel on a table so that the projecting amount of an edge portion having a plurality of electrodes is in a range of 3mm to 15mm, wherein the thickness of a portion of the display panel projecting from the table is 50 μm to 500 μm, and the flexural modulus is 2.6GPa to 4.0 GPa;

a holding step of holding an electronic component having a plurality of terminals provided corresponding to the plurality of electrodes and having flexibility to a thermocompression head;

a supporting step of supporting the edge portion of the display panel by a supporting unit;

a position recognition step of photographing an alignment mark provided at the edge portion of the display panel placed on the table in a state where the alignment mark is irradiated with light from a side opposite to a side where the photographing was performed before the support step, photographing an alignment mark provided on the electronic component held by the thermocompression head, and recognizing a positional relationship between the display panel and the electronic component based on images of the two photographed alignment marks; and

a thermocompression bonding step of adjusting a relative position between the stage and the thermocompression head based on the positional relationship recognized in the position recognition step, and thermocompressing the electronic component to the edge portion of the display panel by the thermocompression head after the supporting step,

in the method of manufacturing the display member described above,

and manufacturing a display member in which the plurality of terminals of the electronic component are connected to the plurality of electrodes of the display panel via a connection member.

4. The method for manufacturing a member for display according to claim 3,

the display member is continuously manufactured by repeating the mounting step, the holding step, the supporting step, the position recognizing step, and the thermocompression bonding step.