KR20210048469A - Device for mounting electric component and method for manufacturing a display member - Google Patents

Abstract

An objective of the present invention is to provide an apparatus for mounting an electronic component, capable of enabling the electronic component having flexibility to be mounted on a display panel having flexibility with high accuracy. The apparatus for mounting the electronic component includes: a stage (42) on which a display panel (P) is disposed such that an edge portion of the display panel (P) protrudes in a range of 3 mm to 15 mm; a backup unit (43) for supporting the edge portion of the display panel (P); a pressure-bonding head (41) for holding an electronic component (W); image capturing devices (44a, 44b) for capturing images of an alignment mark formed in the edge portion of the display panel (P) and an alignment mark formed in the electronic component (W); a light irradiation unit (44d) for irradiating light from a side of the display panel (P) that is opposite to an image capturing side of the display panel (P); and a control device for aligning the display panel (P) and the electronic component (W) based on a positional relations recognized by an image capturing result to thermocompression-bond the electronic component (W) to the display panel (P), wherein a bending elastic modulus of the portion protruding from the stage (42) is greater than or equal to 2.6 GPa, and less than or equal to 4.0 GPa.

Description

Electronic component mounting device and manufacturing method of display member {DEVICE FOR MOUNTING ELECTRIC COMPONENT AND METHOD FOR MANUFACTURING A DISPLAY MEMBER}

An embodiment of the present invention relates to an electronic component mounting apparatus for mounting a flexible electronic component on an edge portion of a display panel having flexibility, and a method of manufacturing a display member.

In the flat panel display market used as a display for portable terminals such as televisions, personal computers, and smart phones, liquid crystal displays occupy an overwhelming penetration rate. Under such circumstances, in recent years, organic EL displays with the feature that they do not require a backlight and can be thinned, and can be bent by forming on a flexible resin film, are particularly focused on the small display market for portable terminals. Is attracting attention. From this, there is a demand for an electronic component mounting apparatus that can be bent, that is, which can be suitably used for assembling an organic EL display having flexibility.

Currently, as a general electronic component mounting device, an outer lead bonding device for a liquid crystal display (hereinafter referred to as an OLB device) is known (refer to Patent Document 1). However, no OLB device for use in organic EL displays is known. For this reason, an OLB device for a liquid crystal display is substituted for the mounting process of an electronic component performed at the time of manufacturing an organic EL display.

An OLB device for a liquid crystal display mounts an electronic component on a display panel made of a glass substrate through an anisotropic conductive tape. In the mounting process using an OLB device for a liquid crystal display, first, the edge on which the electronic component of the display panel is mounted is held by protruding from the stage, and the electronic component held by the crimping head is placed at the edge of the display panel. Bring it closer. In this state, the alignment mark on the upper surface of the display panel and the alignment mark on the lower surface of the electronic component are simultaneously imaged with one camera from the lower side of the display panel to recognize the relative positions of both. Thereafter, the edge of the display panel is maintained with a backup tool from the lower side, the electronic component is positioned on the display panel based on the recognized relative position, and the electronic component is placed on the edge of the display panel through an anisotropic conductive tape by a pressing head. By heating and pressurizing.

Japanese Patent Application Publication No. 2006-135082

When the aforementioned OLB device for a liquid crystal display is directly applied to the manufacturing process of an organic EL display, the electronic component cannot be mounted with high precision. That is, the inventor of the present application mounts an electronic component on a flexible display panel (hereinafter referred to as an organic EL panel), which is a constituent component of an organic EL display, using the above-described OLB device for a liquid crystal display as it is, Attempted to manufacture the display member. Specifically, a COF (Chip on Film) having a width of 38 mm as an electronic component was mounted on an organic EL panel having a size of 5.0 inches and a thickness of about 0.2 mm, which is widely used in smartphones. As a result, it turned out that only by applying the OLB device for liquid crystal displays as it is, it is not possible to mount an electronic component on an organic EL panel with high precision and high quality. Specifically, in the organic EL panel for a smartphone, a mounting accuracy of about ±3 µm is required, but it has become clear that such mounting accuracy and mounting quality cannot be satisfied.

The present invention has been made in order to cope with the problems of lowering the mounting precision or lowering the mounting quality of electronic components that occur when the above-described conventional OLB device for a liquid crystal display is applied to an organic EL display manufacturing process. An electronic component mounting device and a method for manufacturing a display member, which enable the electronic component to be mounted on a display panel with high precision, even when a flexible electronic component is mounted on a display panel with thermal compression. To provide.

The electronic component mounting apparatus of the embodiment includes a plurality of electrodes arranged at an edge portion of a flexible display panel, and a plurality of terminals arranged corresponding to the plurality of electrodes in a flexible electronic component By connecting through a bonding member, an electronic component mounting device for mounting the electronic component on the display panel, wherein the display panel is arranged so that the edge portion protrudes in a range of 3 mm or more and 15 mm or less. A stage movable in a horizontal direction, a backup unit supporting the edge portion of the display panel disposed on the stage from a lower side, and the edge portion holding the electronic component from the upper side and supported by the backup unit A thermocompression head movable in horizontal and vertical directions for thermocompressing the electronic component on an upper surface, an alignment mark formed on the edge of the display panel protruding from the stage, and an alignment mark formed on the electronic component. A position recognition device configured to provide an image pickup device and a light irradiation unit for irradiating light to the display panel from a side opposite to the image pickup device, and for recognizing a positional relationship between the display panel and the electronic component, and the position Based on the positional relationship recognized by the recognition device, the relative position of the stage and the thermocompression head is adjusted so as to align the position of the display panel and the electronic component, and the electronic component by the thermocompression head A control device for controlling the stage and the thermocompression head to thermocompress the display panel, and the bending elastic modulus of the portion protruding from the stage of the display panel is 2.6 GPa or more and 4.0 GPa or less. .

The method for manufacturing a display member of the embodiment is an arrangement step of arranging a flexible display panel on a stage such that a protruding amount of an edge portion having a plurality of electrodes is in a range of 3 mm or more and 15 mm or less. An arrangement step in which the bending elastic modulus of the portion protruding from the stage of the display panel is 2.6 GPa or more and 4.0 GPa or less, and a thermocompression-bonding head having a plurality of terminals provided corresponding to the plurality of electrodes and having flexibility And the alignment mark formed on the edge portion of the display panel disposed on the stage in a state in which light is irradiated to the alignment mark from a side opposite to the image capturing side. A position recognition process of recognizing the positional relationship between the display panel and the electronic component, based on the image of the alignment mark formed on the held electronic component, and the image of both the captured alignment marks, and the position recognition process recognized in the position recognition process. And a thermocompression bonding step of adjusting the relative position of the stage and the thermocompression head based on the positional relationship, and thermocompression bonding the electronic component to the display panel by the thermocompression head. A display member is manufactured in which the plurality of terminals of the electronic component are connected to the plurality of electrodes through a connecting member.

According to the mounting apparatus of the present invention, even when a flexible electronic component is mounted on a display panel having the same flexibility as an organic EL panel by thermocompression, the electronic component is mounted with high precision and while maintaining the mounting quality. can do. Further, according to the method for manufacturing a display member of the present invention, it is possible to provide a display member in which an electronic component is mounted on a display panel with high precision and while maintaining the mounting quality.

1 is a plan view showing an electronic component mounting apparatus in an embodiment.
2 is a side view of the mounting device shown in FIG. 1.
3 is a cross-sectional view of an organic EL panel applied to the mounting device of the embodiment.
4 is a perspective view showing a pressing device of the mounting device shown in FIG. 1.
5 is an enlarged cross-sectional view illustrating a stage of the pressing device of the mounting device shown in FIG. 4.
6 is a plan view showing an organic EL panel and an electronic component applied to the mounting device of the embodiment.
7 is a perspective view showing a main compression device of the mounting device shown in FIG. 1.
FIG. 8 is a perspective view showing an example of a holder of an organic EL panel in the mounting device shown in FIG. 1.
Fig. 9 is a perspective view showing another example of the holding body of the organic EL panel in the mounting device shown in Fig. 1;
10 is a plan view showing an electronic component mounting apparatus according to another embodiment.
11 is a graph showing variations in mounting accuracy according to Example 1. FIG.
12 is a graph showing variations in mounting accuracy according to Comparative Example 1. FIG.

Hereinafter, a method of manufacturing an electronic component mounting device and a display member according to the embodiment will be described with reference to the drawings. The drawings are schematic, and the relationship between the thickness and the planar dimension, the ratio of the thickness of each part, etc. may be different from the actual one. The term indicating the vertical direction in the description refers to a relative direction when the mounting surface of an electronic component of a display panel (organic EL panel) to be described later is turned up, unless otherwise specified.

[Configuration of mounting device]

1 is a plan view showing a configuration of an electronic component mounting device according to an embodiment, and FIG. 2 is a side view of the electronic component mounting device of FIG. 1. The electronic component mounting apparatus 1 shown in Figs. 1 and 2 is used for manufacturing a constituent member (display member) of a display device such as an organic EL display. That is, the mounting device 1 transfers the flexible electronic component W such as COF punched from the carrier tape T to the organic EL panel P as a flexible display panel as a connection member. It is a device used to manufacture a display member in which the electronic component W is mounted on the organic EL panel P by mounting through an anisotropic conductive tape F.

Here, the organic EL panel P is formed mainly with a member having flexibility. As the member having flexibility, for example, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), and the like are used. It is also possible to use these members by bonding them with an adhesive. The organic EL panel P is configured such that the thickness is 50 µm or more and 500 µm or less, and the flexural modulus is 2.6 GPa or more and 4.0 GPa or less. Hereinafter, this thickness and the flexural modulus are referred to as physical properties of the organic EL panel P. The organic EL panel P in this embodiment has a configuration in which the PI film on which the organic EL element is formed is bonded to a PET film as a support material through an adhesive. Since the thickness of the PET film (about 200 μm) is 10 times or more with respect to the thickness of the PI film (about 10 μm), it is considered that the bending elastic modulus of the organic EL panel P is substantially the same as that of the PET film.

On the other hand, the above-described physical properties need not be provided in the entire organic EL panel P, and at least a portion protruding from the placement portion 42a (see Fig. 4) of the stage 42 to be described later is provided. You just need to do it. For example, assuming that the edge portion on which the electronic component W of the organic EL panel P is mounted is protruded by 15 mm from the placement portion 42a of the stage 42, the range of 15 mm from this edge portion is described above. It just needs to have one physical characteristic.

More specifically, as shown in FIG. 3, the organic EL panel P on which the electronic component W is mounted has a display portion Pa and an edge portion Pb. The display portion Pa is a portion in which the organic EL element Pa1 as a display element is formed, and is a portion for displaying an image. The edge portion Pb is a portion positioned on the outer circumferential side of the display portion Pa, and is a portion in which the connection portion Pb1 in which an electrode or the like to be connected to the electrode of the electronic component W is formed is formed. As described above, the organic EL panel P is composed of a PI film Ka as a substrate, including the display portion Pa and the edge portion Pb, and is formed on the PI film Ka. The organic EL element Pa1 serving as the display portion Pa is formed in the display portion Pa. This PI film Ka is a very thin member having a thickness of less than 50 µm, specifically about 10 µm to 30 µm.

So, in this embodiment, the PET film (Kb) as a support material having the same size as the PI film (Ka) and a thickness of 200 µm is formed on the back surface of the PI film (Ka) (the surface on which the organic EL element (Pa1) is formed, and Is bonded to the opposite side] with an adhesive (Kc). Further, an optical film Kd such as a cover film (also referred to as a barrier film) for protecting the organic EL element Pa1 is bonded to the display portion Pa in some cases. The optical film Kd has substantially the same size as the display portion Pa. For example, as the cover film, a gas barrier layer coated on a plastic film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and cycloolefin polymer (COP) can be used. The thickness of the cover film is about several 10 µm to 200 µm.

In the organic EL panel P having such a configuration, when only the edge portion Pb protrudes from the arrangement portion 42a of the stage 42, it is sufficient that the edge portion Pb has the above-described physical properties. . That is, the portion where the PI film (Ka) and the PET film (Kb) are bonded may be the above-described physical properties. In addition, when a part of the edge part Pb and the display part Pa protrudes from the arranging part 42a, it is sufficient that the part of the edge part Pb and the display part Pa have the above-described physical characteristics. That is, when there is no cover film in the display portion Pa, the portion where the PI film Ka and the PET film Kb are bonded may have the above-described physical properties. On the other hand, when there is an optical film (Kd) in the display part (Pa), the physical properties of the part where the PI film (Ka) as the edge part and the PET film (Kb) are bonded, and the PI film (Ka) as the display part (Pa), PET The physical properties of the portion to which the film Kb and the optical film Kd are bonded may all be the above-described physical properties.

Here, the flexural modulus is a value measured according to the test method stipulated in JIS K7171: How to Calculate Plastic-Bending Characteristics (Revised on March 22, 2016). Specifically, in the flexural modulus test, a test piece having dimensions of 80±2 mm in length, 10.0±0.2 mm in width, and 4.0±0.2 mm in thickness was supported on a support of a bending measuring device in which the distance between points was adjusted to 64 mm. , It is carried out by lowering the indenter in the center between these points at a test speed of 2 mm/min, and bending the center of the test piece. The test atmosphere is a standard atmosphere (temperature 23°C/humidity 50%) specified in JIS K7100.

As the electronic component W, an electronic component such as a flexible COF is used. The COF is configured by mounting a semiconductor element on a flexible film-type circuit board formed of PI (polyimide) or the like. As described later, the COF is formed into pieces by being punched out of a tape-like film member.

The display member is obtained by mounting an electronic component W such as COF through a bonding member such as an anisotropic conductive tape F on a display panel such as an organic EL panel P, and a display device such as an organic EL display. It is a member used as a constituent part of.

The mounting device 1 of the embodiment is a punching device [10 (10A, 10B)] for punching an electronic component W from a carrier tape T, while adsorbing and holding the punched electronic component W, while intermittently rotating. The intermittent rotation conveying device 20 to be conveyed, the intermittent rotation conveying device 20 arranged at an intermittent stop position in the middle of the conveying path, and as a bonding member to the electronic component W conveyed by the intermittent rotation conveying device 20 The anisotropic conductive tape bonding device (bonding member bonding device) 30 for bonding the anisotropic conductive tape F, and the electronic component W to which the anisotropic conductive tape F is adhered to the organic EL panel P are attached to the anisotropic conductive tape ( A pressurizing device 40 that pressurizes through F), and the electronic component W pressurized to the organic EL panel P by the pressurizing device 40 is main-compressed (本壓着) The first delivery device 60, the intermittent rotation conveyance device 20, and the pressure bonding device for transferring the electronic component W between the main compression device 50, the punching device 10 and the intermittent rotation conveyance device 20 (40) The second transfer device 70 for transferring the electronic component W between, the first transfer unit 80 for carrying the organic EL panel P into the pressure bonding device 40, and a press bonding device ( The second conveyance part 90 which conveys the organic EL panel P from the main compression apparatus 50 from 40), The 3rd conveyance part 100 which carries out the organic EL panel P from the main compression apparatus 50 A punching device 10, an intermittent rotation conveying device 20, an anisotropic conductive tape bonding device 30, a pressing device 40, a main pressing device 50, a first transmission device 60, It is comprised with the control device 110 which controls the operation|movement of each part, such as the 2nd delivery device 70, the 1st conveyance part 80, the 2nd conveyance part 90, and the 3rd conveyance part 100.

(Punching device 10)

The punching apparatus 10 is for punching the COF as the electronic component W from the carrier tape T, and includes a first punching apparatus 10A and a second punching apparatus 10B. The 1st punching apparatus 10A and the 2nd punching apparatus 10B have the same structure, and are arrange|positioned in a state inverted left and right as seen from the front of the apparatus. The first and second punching apparatuses 10A and 10B are used one by one, and the carrier tape T of the other punching apparatus 10A and 10B is exchanged while punching is performed with one punching apparatus 10A and 10B. It is supposed to be able to do.

The first and second punching apparatuses 10A and 10B, respectively, are electronic components from the supply reel 11 on which the carrier tape T before punching is wound and the carrier tape T supplied from the supply reel 11 ( A mold apparatus 12 for punching W), and a take-up reel 13 for winding up the carrier tape T on which the electronic component W is punched by the mold apparatus 12 are provided. The carrier tape T unwound from the supply reel 11 is changed in direction by a plurality of guide rollers 14 and sprockets 15, and is sent to the take-up reel 13 via the mold device 12. Lose. On the other hand, the sprocket 15 is disposed immediately in front of the mold apparatus 12 in the conveying direction of the carrier tape T, and while conveying the carrier tape T by rotational drive by a drive motor (not shown), the carrier tape It is possible to position (T) with respect to the mold apparatus 12.

The mold apparatus 12 includes an upper mold 12a and a lower mold 12b disposed opposite to the upper mold 12a. The upper mold 12a is provided with a punch 12c on its lower surface. On the other hand, in the lower mold 12b, a die hole 12d penetrating vertically into which the punch 12c is inserted is formed. The electronic component W is punched out of the carrier tape T by moving the upper mold 12a up and down in a state in which the carrier tape T is supplied and positioned to the mold apparatus 12. On the other hand, a suction hole (not shown) is formed in the front end surface of the punch 12c, and it is configured so that the punched electronic component W can be sucked and held.

(Intermittent rotation conveyance device (20))

In the intermittent rotation conveyance device 20, the four arm portions 21 of the same shape are arranged in a relationship orthogonal to each other, and the index table 22 and the index table 22 having a cross shape in plan view are 90°. It includes a rotation driving unit 23 for intermittent rotational drive at intervals. At the tip ends of each arm portion 21 of the index table 22, a holding head 24 for attracting and holding the electronic component W, respectively, is provided. At four stop positions (A to D) every 90° of the index table 22, a receiving position (A) for receiving the electronic component (W) punched by the punching device (10), and a holding head (24). Positioning (gazing) and gauging/cleaning positions (B) for performing positioning (gazing) and cleaning of the electronic parts (W) held in the anisotropic conductive tape for the electronic parts (W) held in the holding head 24 ( An adhesion position C for bonding F) and a delivery position D for transferring the electronic component W to which the anisotropic conductive tape F is adhered to the pressure bonding device 40 are set.

(Anisotropic conductive tape adhesive device 30)

The anisotropic conductive tape bonding device 30 is provided corresponding to the bonding position C of the intermittent rotation conveying device 20, and the anisotropic conductive tape F is adhered and supported by a release tape R. The supply reel 31 on which the mold member S is wound, the adhesive head 32 arranged at a position opposite to the holding head 24 positioned at the adhesive position C, and the anisotropic conductive tape F The recovery part 33 accommodating the release tape R after peeling off and the tape-like member S supplied from the supply reel 31 follow the conveyance path passing through the bonding position C, and the recovery part ( 33), the plurality of guide portions 34 and the plurality of guide portions 34 are disposed downstream from the adhesive position C of the conveyance path of the tape-shaped member S, and the tape-shaped member S ) By reciprocating along the conveyance direction, the chuck conveying part 35 intermittently conveys the tape member S by a predetermined length, and the tape member S is arranged upstream from the adhesion position C of the conveyance path. It is provided with a cutting portion 36 for cutting only the anisotropic conductive tape F out of the tape member S.

The adhesive head 32 is a terminal portion of the electronic component W held by the holding head 24 positioned at the adhesive position C, cut to a predetermined length, and conveyed and positioned at the adhesive position C. An anisotropic conduction by heating the bonding tool 32a, built in the bonding tool 32a for pressing (F), the elevating driving unit 32b for lifting and moving the bonding tool 32a, and the bonding tool 32a. It has a heater 32c which adheres the tape F to the terminal portion of the electronic component W.

(Pressure bonding device (40))

The pressure bonding device 40 adsorbs and holds the electronic component W to which the anisotropic conductive tape F is adhered by the anisotropic conductive tape bonding device 30, as shown in FIG. 4, so that the organic EL panel P ), a pressure bonding head 41 as a thermocompression head for press bonding, a stage 42 for holding and positioning the organic EL panel P, and the organic EL panel P held on the stage 42. A backup unit 43 that includes an edge portion on which the electronic component W is mounted and supports a portion protruding from the stage from the lower side, and an organic EL panel P held on the stage 42 and a pressure bonding head ( A position recognition device 44 for recognizing the relative position of the electronic component W held in 41) is provided.

The pressurizing head 41 includes a pressurizing tool 41a for adsorbing and holding the electronic component W from its upper surface side, a tool driving unit 41b for moving the pressurizing tool 41a in the Y, Z, θ directions, It has a heater 41c that is built into the pressurization tool 41a and heats the pressurization tool 41a. As shown in FIG. 4, the stage 42 includes a mounting portion 42a for arranging the organic EL panel P, and a stage driving unit for moving the arranging portion 42a in the X, Y, Z, and θ directions ( 42b).

A plurality of adsorption holes 42d for adsorbing and holding the organic EL panel P are formed on the placement surface 42c in the placement portion 42a on which the organic EL panel P is disposed. When the organic EL panel P is disposed on the placement surface 42c, this suction hole 42d is mainly disposed at a position opposite to the display area of an image in the organic EL panel P. In this example, an example in which the adsorption holes 42d are arranged in a matrix shape at equal intervals in the area where the organic EL panel P of the placement surface 42c is disposed (the area surrounded by the double-dashed line in Fig. 4) is described. However, it is not always necessary to hold the organic EL panel P arranged on the arrangement surface 42c by adsorption over the entire area.

For example, in Fig. 4, an area of about half or 1/3 of the length of the organic EL panel P may be adsorbed and held from the side where the pressing head 41 is located on the mounting surface 42c. . Since the adsorption hole 42d adsorbs the display area of the organic EL panel P, it is preferable to set the pore diameter small so that adsorption marks do not remain in the display area due to adsorption. As for the pore diameter, the relationship between the suction force required for fixing the organic EL panel P and the amount of deformation of the organic EL panel P by this suction is obtained by experiment or the like, and the size is set so that no adsorption mark remains. On the other hand, the placement surface 42c may be constituted by a porous member, such as a vacuum chuck using porous ceramics.

In addition, with respect to the placement portion 42a, a suction groove extending from the suction hole for absorbing the organic EL panel P may be formed in the side of the side where the pressing head 41 is positioned, extending from the suction hole in the vicinity of the side. Specifically, as shown in Fig. 5, the side edge portion of the mounting portion 42a is constituted by a suction block 42f of a member different from that of the mounting portion 42a. This adsorption block 42f is a member that is elongated in the X direction, and is fixed to the placement portion 42a so that the upper surface thereof is at the same height as the placement surface 42c of the placement portion 42a. On the upper surface of the adsorption block 42f, a plurality of suction holes 42g for adsorbing the organic EL panel P are arranged along the X direction. Further, on the upper surface of the adsorption block 42f, an adsorption groove 42h extending from each adsorption hole 42g toward the end of the adsorption block 42f (the end on the side where the pressurization head 41 is located) is formed. Has been. The tip of the suction groove 42h extends to a position close to the end of the suction block 42f. The distance between the tip of the suction groove 42h and the end of the suction block 42f is preferably 1 mm to 3 mm. The lower end of the adsorption block 42f is an inclined portion 42i that obliquely descends from the end side toward the mounting portion 42a side. By making the lower end of the inclined portion 42i difficult to cause interference with the backup unit 43.

The stage driving unit 42b includes an X-axis direction driving unit that moves the placement unit 42a in the X-axis direction in one horizontal direction, a Y-axis direction driving unit that moves in the Y-axis direction orthogonal to the X-axis direction, and horizontal A driving unit configured by stacking a Z-axis direction driving unit that moves in the Z-axis direction orthogonal to the direction, and a θ driving unit that rotates within a horizontal plane in this order from the lower side. On the other hand, in order to improve the positioning accuracy in the X-axis direction and the Y-axis direction, the stage drive part 42b is provided with a linear encoder in the X-axis direction drive part and the Y-axis direction drive part.

The backup unit 43 is installed at a pressure bonding position for pressing the electronic component W to the organic EL panel P. Further, the backup unit 43 includes a backup tool 43a that is long in the X-axis direction and supports the edge portion on which the electrode row ER (FIG. 6) of the organic EL panel P is formed, from the lower side, and the backup tool 43a. It supports the tool 43a and has a support 43b formed in a substantially rectangular parallelepiped shape. The backup tool 43a is made of stainless steel, and the upper end surface (support surface) supporting the edge portion of the organic EL panel P is formed flat. On the other hand, in this embodiment, although it is assumed that the backup unit 43 is fixedly disposed in the pressing position, if necessary, it may be provided so as to be movable in the X-axis direction or in the X-axis direction and Y-axis direction. In this case, the support base 43b may be mounted on an X-axis moving device or an XY-axis moving device.

Next, the location recognition device 44 will be described with reference to FIGS. 4 and 6. 6 is a plan view showing a schematic configuration of an organic EL panel P and an electronic component W that are position-recognized by the position recognition device 44. In the drawing, the X-axis direction is described as a left-right direction. The organic EL panel P has an electrode row ER formed at its edge portion and a pair of alignment marks PM formed on both left and right sides of the electrode row ER, respectively. The electronic component W has a terminal row TR arranged to correspond to the electrode row ER, and a pair of alignment marks WM respectively formed on the left and right sides of the terminal row TR. The position recognition device 44 recognizes the relative positional relationship between the pair of alignment marks PM of the organic EL panel P and the alignment marks WM of the electronic component W.

Such a position recognition device 44, as shown in FIG. 4, is imaged by the first imaging device 44a, the second imaging device 44b, and the first and second imaging devices 44a, 44b. An image processing unit 44c that processes an image and a light irradiation unit 44d are provided. The first and second imaging devices 44a and 44b are mounted on the support base 43b of the backup unit 43, upwardly in the vicinity of the end portion of the backup tool 43a, and individually attached through the X-axis drive unit 44e. Has been. The first imaging device 44a includes a pair of alignment marks PM on the left side of the pair of alignment marks PM formed on the edge of the organic EL panel P and a pair of alignment marks formed on the electronic component W ( Among WM), the left alignment mark WM is simultaneously received in the imaging area 44a1 (indicated by a broken line in Fig. 6) from the lower side and imaged. The second imaging device 44b displays the alignment mark PM on the right side of the organic EL panel P and the alignment mark WM on the right side of the electronic component W, from the lower side to the imaging area 44b1 (in FIG. 6 ). (Indicated by a broken line) at the same time to capture an image.

The first and second imaging devices 44a and 44b each capture an alignment mark (PM, WM) as a still image, and a camera 44f such as a charge coupled device (CCD) camera, a telecentric lens, etc. It is provided with a barrel part (44g) provided with the optical unit of. On the other hand, the X-axis driving unit 44e enables the first and second imaging devices 44a and 44b to be synchronously moved so that the distance between each other is enlarged or reduced, and the distance between the left and right alignment marks PM and WM Together, the arrangement intervals of the first and second imaging devices 44a and 44b can be changed.

The image processing unit 44c receives the image pickup signal from the camera 44f, is received in the image pickup regions 44a1 and 44b1, and the alignment mark PM of the organic EL panel P and the electronic component W are The image of the alignment mark WM is recognized, and data (hereinafter referred to as "position data") related to the position of each alignment mark (PM, WM) is detected. The image processing unit 44c converts an image in which a matching rate equal to or higher than the threshold value is obtained with the reference pattern of the alignment mark PM of the organic EL panel P set in advance in the captured image by a known pattern matching process. It is recognized as the alignment mark (PM) of P). Further, an image in which the reference pattern of the alignment mark WM of the electronic component W and a matching rate equal to or higher than the threshold value are obtained is recognized as the alignment mark WM of the electronic component W. Then, position data of the recognized alignment marks PM and WM are obtained based on the camera coordinate system. Thereby, the positional relationship between the organic EL panel P and the electronic component W can be recognized. The obtained positional data is transmitted to the control device 110.

The light irradiation unit 44d is disposed at a position above the organic EL panel P disposed on the stage 42 so as to be able to irradiate light directly below it. In this embodiment, a pair of light irradiation parts 44d is provided at an interval equal to the arrangement interval of the pair of alignment marks PM of the organic EL panel P. The light irradiation part 44d is integrally installed with the pressure bonding head 41 using a support tool (not shown), but is not limited thereto, and the frame or mount of the mounting device 1 It may be supported through a support tool. In short, when imaging the alignment mark PM of the organic EL panel P by the first and second imaging devices 44a, 44b, the organic EL from the opposite side to the first and second imaging devices 44a, 44b It should just be provided so that light can be irradiated to the alignment mark PM of the panel P. In addition, as for the light irradiation part 44d, you may arrange|position one elongate shape, and the number is not limited.

(Main crimping device (50))

The main pressing device 50 is a stage 51 for holding and positioning the organic EL panel P to which the electronic component W is pressed through an anisotropic conductive tape F, as shown in FIG. 7. Wow, a main crimping head 52 for main-compressing the electronic component W to the organic EL panel P, and disposed under the main crimping head 52 to face the main crimping head 52, A backup portion 53 supporting the edge portion of the organic EL panel P to which the electronic component W is pressed from below during the main compression bonding, and a position recognition unit for recognizing the position of the organic EL panel P Equipped with 54.

The stage 51 includes an arrangement portion 51a on which the organic EL panel P is arranged, and a stage drive portion 51b that moves the arrangement portion 51a in the X, Y, Z, and θ directions. The placement portion 51a is a member having a rectangular shape in plan view, and in the placement surface (upper surface) 51c on which the organic EL panel P is disposed, an adsorption hole for adsorbing and holding the organic EL panel P ( A plurality of 51d) are formed. The suction hole 51d is preferably set to have a small hole diameter so that the suction mark of the organic EL panel P does not remain, similar to the suction hole 42d of the stage 42 of the press bonding device 40. The stage driving unit 51b, like the stage driving unit 42b of the pressing device 40, is configured by stacking an X-axis direction driving unit, a Y-axis direction driving unit, a Z-axis direction driving unit, and the θ driving unit in this order from the lower side. It is a driving part.

The main compression head 52 includes a pressing tool 52a that presses the electronic component W pressurized to the organic EL panel P from its upper surface side, and a tool that moves the pressing tool 52a in the Z-axis direction. It has a drive part 52b and a heater 52c built in the pressurizing tool 52a and heating the pressurizing tool 52a. The backup part 53 supports the backup tool 53a and the backup tool 53a provided in a position immediately below the pressing tool 52a of the main pressing head 52 and formed to have the same length as the pressing tool 52a. It has a supporting member 53b to be formed. The upper surface of the backup tool 53a is formed as a flat surface supporting the lower surface of the edge portion to which the electronic component W of the organic EL panel P arranged on the placement portion 51a is pressed.

The position recognition unit 54 has a first camera 54a, a second camera 54b, and an image processing unit (not shown). The first and second cameras 54a and 54b are attached downwardly at predetermined intervals above the moving range of the organic EL panel P by the stage 51, and The alignment marks formed in the vicinity of both ends in the edge portion to which the electronic component W is pressed are captured. The interval (predetermined interval) between the first and second cameras 54a and 54b described above is the interval between the alignment marks. On the other hand, this alignment mark is an alignment mark different from the alignment mark PM used for recognition of the relative position data in the pressure bonding device 40. An image processing unit (not shown) recognizes the alignment mark by a known pattern matching process based on the captured image of the alignment mark of the organic EL panel P captured by the first and second cameras 54a and 54b. , The position of the alignment mark is detected.

(First delivery device 60)

The first delivery device 60 includes a support part 61 for adsorbing and holding the electronic component W punched from the carrier tape T from the lower side, and the support part 61 in a mold of the punching devices 10A, 10B. X, Y, Z, θ drive unit 62 for moving to a position immediately below the device 12 and a position immediately below the holding head 24 of the intermittent rotation conveying device 20 located at the receiving position A It is equipped with.

(Second delivery device 70)

The second transmission device 70 includes a receiving portion 71 for adsorbing and holding the electronic component W from the lower side, and an intermittent rotational conveying device 20 in which the receiving portion 71 is positioned at the delivery position D. It includes an X, Y, Z, θ drive 72 for moving to a position immediately below the holding head 24 and a position immediately below the pressing head 41 of the pressing device 40.

(1st conveyance unit 80)

The first transfer unit 80 includes a holding member 81 that adsorbs and holds the organic EL panel P supplied from a supply unit (not shown) from the upper side, and an organic EL by a supply unit not shown. An XZ drive unit 82 for moving the panel P to the supply position and the carrying position of the organic EL panel P to the stage 42 of the pressing device 40 is provided.

As shown in FIG. 8, the holding member 81 is an electrode surface adsorption block 81a that adsorbs and holds the edge portion on which the electrode row ER on which the electronic component W is mounted in the organic EL panel P is formed. ), and a display area adsorption unit that is disposed adjacent to the electrode surface adsorption block 81a and adsorbs and holds a part other than the part adsorbed by the electrode surface adsorption block 81a in the organic EL panel P. 81b). The electrode surface adsorption block 81a is formed in a length capable of adsorbing and holding the entire edge portion of the organic EL panel P on which the electrode rows ER are formed, and is a rectangular parallelepiped member that is elongated in a direction along the edge portion. The adsorption surface 81c of this electrode surface adsorption block 81a is formed flat, and a plurality of adsorption holes 81d are formed. And, the hole diameter of this adsorption hole 81d is set to a size such that deformation does not occur at the edge of the organic EL panel P, similar to the placement part 42a of the pressure bonding device 40, , The edge portion on which the electrode row ER of the organic EL panel P is formed is made flat so that it can be adsorbed and held. The display area adsorption portion 81b is formed of a porous body or sponge having a flat adsorption surface, and has a large number of adsorption holes. The adsorption surfaces of the electrode surface adsorption block 81a and the display area adsorption unit 81b are adjusted to be located on the same plane.

On the other hand, the electrode surface adsorption block 81a does not adsorb and hold the entire electrode row ER, but in reality, the terminal of the electronic component W in the electrode row ER is through the anisotropic conductive tape F. The portion on the side of the display area other than the portion to be connected is adsorbed and held. That is, as shown by the two-dot chain line in FIG. 8, the portion to which the terminal of the electronic component W is connected in the electrode row ER of the organic EL panel P protrudes from the holder 81. Stays in the state.

In FIG. 8, one display area adsorption part 81b is shown, but a plurality of display area adsorption parts 81b may be arranged side by side. As shown in Fig. 9, the display area adsorption unit 81b is in the longitudinal direction of the electrode surface adsorption block 81a (the direction of the edge of the organic EL panel P held in the electrode surface adsorption block 81a) and Two are arranged side by side in the intersecting direction (orthogonal direction in this embodiment). The two display area adsorption parts 81b are supported by the main body 81e of the holder 81 so that the distance between each of the electrode surface adsorption blocks 81a can be adjusted. These display area adsorption portions 81b are a base portion 81b1 made of a metal such as aluminum, and a surface holding the organic EL panel P in the base portion 81b1 (hereinafter referred to as "lower surface"). It is provided with a flat porous sheet (81b2) covering. In the base portion 81b1, a substantially grid-like suction groove communicating with the vacuum suction hole is formed on the lower surface thereof, and a vacuum suction force is applied to the entire surface of the porous sheet 81b2 provided on the lower surface of the porous sheet. The organic EL panel P can be kept flat with a substantially uniform attraction force over the entire area 81b2. As the porous sheet 81b2, it is possible to use, for example, a resin porous molded article processed into a film shape. By constituting in this manner, even if the holding member 81 is a flexible thin-film organic EL panel P, it can be maintained by adsorption evenly and without generating an adsorption mark.

(2nd conveyance unit 90)

The second conveying unit 90 includes a holding member 91 for adsorbing and holding the organic EL panel P to which the electronic component W is pressurized by the pressing device 40 from the upper side, and the holding member 91 ) To the unloading position where the organic EL panel P is taken out from the stage 42 of the pressing device 40 and the carrying position of the organic EL panel P relative to the stage 51 of the main pressing device 50 It is provided with an XZ drive unit 92 for doing so. The holding member 91 is provided with a display area adsorption unit formed of a porous body or the like having a flat adsorption surface for adsorbing and holding an approximate whole of the upper surface of the organic EL panel P. This display area adsorption unit is configured in the same manner as the display area adsorption unit 81b of the holding member 81.

(3rd conveyance unit 100)

The third conveying unit 100 includes a holding body 101 for adsorbing and holding an organic EL panel P, that is, a display member, to which the electronic component W is fully compressed by the main compression device 50, and An XZ drive unit 102 for moving the holding body 101 to a delivery position to take out the organic EL panel P from the stage 51 of the main compression device 50 and a delivery position to a delivery device (not shown). It is equipped with.

(Control device 110)

The control device 110 includes a storage unit 111. In this storage unit 111, for example, the load in the pressing device 40 and the main pressing device 50, heating temperature, pressing time, reference patterns of alignment marks PM and WM related to the image processing unit 44c, and Position information of this reference pattern and various types of information for controlling each part are stored. Further, in the storage unit 111, a protruding amount G for causing the edge portion of the organic EL panel P to protrude from the arrangement unit 42a of the stage 42 by a predetermined amount is stored. Specifically, in the range of 3 mm or more and 15 mm or less, more preferably 3 mm or more and 8 mm or less, the amount of protrusion G is set. Here, it is assumed that the protruding amount (G) = 6 mm is set.

[Operation of mounting device]

Next, the operation of the mounting device 1 according to the embodiment will be described. First, the carrier tape T is supplied from the supply reel 11 of the first punching device 10A, and the electronic component W is punched out from the carrier tape T by the mold device 12. The punched electronic component W is adsorbed and held by the punch 12c. The electronic component W held by the punch 12c is transmitted to the receiving part 61 of the 1st delivery device 60, and the receiving position of the intermittent rotation conveyance device 20 by the 1st delivery device 60 It is transferred to (A). The electronic component W transferred to the receiving position A is transmitted to the holding head 24 of the intermittent rotation conveying device 20 positioned at the receiving position A. On the other hand, the first delivery device 60 receives the edge portion in which the terminal row TR is formed by rotating the direction of the electronic component W by 90° while transferring the electronic component W to the receiving position A. It aligns with the direction (Y direction) along the outer side of the holding head 24 which is located at position (A).

The electronic components W held by the holding head 24 are sequentially transferred to the gauging/cleaning position (B), the bonding position (C), and the delivery position (D) by intermittent rotation of the index table 22. . During this transfer, at the gauging/cleaning position (B), the electronic component (W) is positioned with respect to the holding head 24 by contact with a positioning mechanism (not shown), and cleaning of a rotating brush (not shown) The dust adhering to the terminal portion is cleaned by the mechanism. Further, at the bonding position C, the anisotropic conductive tape F is adhered to the terminal portion of the electronic component W by the anisotropic conductive tape bonding device 30. When positioning and cleaning are performed at the gauging/cleaning position (B), and the electronic component (W) to which the anisotropic conductive tape (F) is adhered at the adhesive position (C) is placed at the transfer position (D), the electronic component ( W) is transmitted to the support portion 71 of the second delivery device 70 at the delivery position D. The electronic component W delivered to the receiving portion 71 is transferred to a position immediately below the pressing head 41 of the pressing device 40 and transmitted to the pressing head 41.

On the other hand, in parallel with the above-described operation, the organic EL panel P is taken out by the holding member 81 of the first conveying unit 80 from a supply unit (not shown), and the stage 42 of the pressing device 40 ) Is placed in the supply. First, the holding member 81 of the first conveying unit 80 moves to a supply unit (not shown), and the holding surface of the holding member 81, that is, the electrode surface, is adsorbed on the upper surface of the organic EL panel P prepared in the supply unit. The adsorption surface 81c of the block 81a and the adsorption surface of the display area adsorption portion 81b are brought into contact with each other. At this time, while the organic EL panel P is lightly pressed by the holding member 81, the adsorption force of the electrode surface adsorption block 81a and the display area adsorption unit 81b is applied. By doing in this way, even when warping or bending occurs in the organic EL panel P, the organic EL panel P can be held in the holding member 81 in a flat state.

In addition, when adsorbing and holding the organic EL panel P of the supply unit, the holding member 81 moves the end portion of the organic EL panel P on the side where the electrode row ER is formed to the outside of the electrode surface adsorption block 81a. It is positioned so as to protrude by a predetermined length H from the end portion (the edge portion on the opposite side to the display area adsorption portion 81b). For example, this length H is the length of the width at which the electronic component W overlaps the organic EL panel P at the time of press bonding.

That is, the length H is stored in the storage unit 111. When holding the organic EL panel P of the supply unit in the holder 81, the control device 110 refers to the length H stored in the storage unit 111, and the organic EL panel P from the holder 81 The XZ driver 82 is controlled so that the end of the panel P on the electrode side protrudes and is held by the length H. Specifically, since the organic EL panel P in the supply unit is prepared each time at a preset position, the end of the organic EL panel P on the side where the electrode row ER is formed is The XZ drive unit 82 is controlled to move the holding member 81 so as to achieve a positional relationship protruding by the length H. On the other hand, a detector such as a photoelectric sensor is provided on the holding member 81 to detect the end of the organic EL panel P, and based on the position of the end of the organic EL panel P detected using this detector The holding member 81 may be moved so that the protruding amount becomes a preset length H.

The organic EL panel P held by the holding member 81 is conveyed on the stage 42 of the pressing device 40. At this time, the stage 42 of the pressing device 40 is positioned at a supply position (a position indicated by a double-dashed line in FIG. 1) to receive the organic EL panel P from the holding member 81. The organic EL panel P conveyed on the stage 42 is placed on the stage 42. In the control device 110, the protruding amount G of the edge portion of the organic EL panel P from the placement unit 42a is stored in the storage unit 111, and the protruding amount G = 6 mm. The relative position between the holding member 81 and the mounting portion 42a of the stage 42, that is, the driving of the XZ driving unit 82 and the stage driving unit 42b is controlled so as to be.

As described above, the protruding amount G is set in a range of 3 mm or more and 15 mm or less, and more preferably 3 mm or more and 8 mm or less. By setting the protruding amount (G) in this range, even if it is an organic EL panel (P) having a thickness of 50 µm or more and 500 µm or less, a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less, and having flexibility, It is possible to prevent sagging from occurring in the edge portion protruding from (42a). On the other hand, the relationship between the amount of protrusion (G) and the amount of sag at the edge is different depending on the kind of the organic EL panel (P), but is a thickness of 50 µm or more and 500 µm or less, and a bending modulus of 2.6 GPa or more and 4.0 GPa or less In the case of the organic EL panel (P) having, if the protruding amount (G) is set to 3 mm or more and 15 mm or less, the sagging of the edge portion can be suppressed to a range that can maintain the recognition accuracy of the alignment mark (PM). It was found out as a result of the inventor's experiment.

On the other hand, even within the range of the above-described physical characteristics, in order to ensure stable recognition accuracy without being influenced by the variety, the protruding amount (G) is preferably set short, and it is set in the range of 3 mm or more and 8 mm or less. It is more preferable. Here, it is known that the shorter the protruding amount G of the organic EL panel P, the more sure the recognition accuracy is secured. However, when the protruding amount decreases, the arrangement portion 42a and the backup tool 43a are The need to shorten the proximity distance arises. If the proximity distance between the placement portion 42a and the backup tool 43a is shortened, interference, that is, a risk of collision occurs between the two, the lower limit value is set to 3 mm. The lower limit (3 mm) of the protruding amount G is a value set in consideration of the width dimension of the anisotropic conductive tape F used to connect the organic EL panel P and the electronic component W.

The organic EL panel P is held by the holding member 81 so that its end portion protrudes by the length H. On the other hand, the placement portion 42a is located at the supply position, and since the position is known, the moving position of the holding body 81 from which the protruding amount G is obtained can be easily calculated. .

Further, when the organic EL panel P is disposed on the placement portion 42a, the organic EL panel P is pressed against the placement surface 42c by the lowering of the holding member 81 and is flattened. More specifically, the organic EL panel P is maintained in a flat state because the display region is adsorbed and held by the display region adsorbing portion 81b of the holding member 81. In this state, since the organic EL panel P is pressed against the mounting surface 42c of the stage 42, the organic EL panel P is the suction surface of the display area adsorption portion 81b of the holder 81 And, it is sandwiched between the mounting surface 42c of the stage 42. Therefore, the organic EL panel P is transferred onto the stage 42 while maintaining the flattened state, and is adsorbed and held by the stage 42.

At this time, in a state in which the organic EL panel P is pressed against the mounting surface 42c of the stage 42, a suction force is applied to the suction hole 42d of the mounting portion 42a of the stage 42, and then the holding member The suction force of the electrode surface suction block 81a and the display area suction portion 81b of 81 may be released, but the suction force of the holding member 81 may be released before the suction force is applied to the stage 42. In this way, the restraint in the plane direction of the organic EL panel P sandwiched between the stage 42 and the holding member 81 is reduced. Even when it is held at (81), it is expected that the warp or curvature is corrected and flattened by the pinching. For this reason, it is preferable to set the force for pushing the holding member 81 against the stage 42 to a size such that it does not interfere with the above-described calibration.

When the organic EL panel P is held on the stage 42, the holding member 81 moves to a supply unit (not shown). On the other hand, the stage 42 moves to the mark recognition position prior to the pressing by the pressing head 41. The electronic component W held by the pressing head 41 is also positioned at the mark recognition position. In the state positioned at the mark recognition position, the organic EL panel P and the electronic component W are, as shown in FIG. 6, the edge portion on which the electrode row ER of the organic EL panel P is formed. The edge portions on which the terminal rows TR of the electronic component W are formed face each other with a small gap therebetween. Moreover, in this state, the light irradiation part 44d is located just above the alignment mark PM of the organic EL panel P. Under this condition, light is irradiated from the light irradiation unit 44d, and the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are included by the imaging devices 44a and 44b. An image to say is accepted.

The received image is sent to the image processing unit 44c, position data of each alignment mark PM and WM is obtained, and position recognition of the organic EL panel P and the electronic component W is performed. The obtained positional data is sent to the control device 110. Since the alignment mark PM of the organic EL panel P received in this way is received as a silhouette image, even if a warp or undulation occurs in the organic EL panel P, the alignment mark PM ) Is captured through a resin substrate in which the PI film of the organic EL panel P and the PET film are bonded together, the alignment mark PM can be taken as a clear image.

The control device 110 is based on the positional data of the left and right alignment marks PM of the organic EL panel P sent from the image processing unit 44c and the positional data of the left and right alignment marks WM of the electronic component W. Thus, the relative positional shift of the organic EL panel P and the electronic component W in the X, Y, and θ directions is determined. Then, the control device 110 moves the organic EL panel P and the electronic component W to the pressing position. At this time, by controlling the tool driving unit 41b and the stage driving unit 42b to eliminate the positional displacement based on the obtained relative positional displacement, the organic EL panel P and the electronic component W are aligned.

Specifically, the control device 110, from the position data of the left and right alignment marks PM of the organic EL panel P, the inclination θP of the line segment connecting these two points and the coordinates of the midpoint of the line segment ( XP, YP). In addition, the control device 110, from the position data of the left and right alignment marks WM of the electronic component W, the inclination (θW) of the line segment connecting these two points and the coordinates of the midpoint of the line segment (XW, YW). ). The difference between the obtained inclination and the coordinates of the midpoint is obtained as the relative positional deviation of both. The positional deviation is corrected in the following manner from the obtained relative positional deviation.

First, the difference between the inclination (θP) of the line segment connecting between the alignment marks (PM) of the organic EL panel (P) and the inclination (θW) of the line segment connecting between the alignment marks (WM) of the electronic component (W) is eliminated. The pressing tool 41a is rotated in the θ direction so as to be so, that is, θP-θW=0. Subsequently, the stage 42 so that the midpoint of the line segment connecting the alignment marks PM of the organic EL panel P coincides with the midpoint of the line segment connecting the alignment marks WM of the electronic component W. The [stage drive unit 42b] is driven. At this time, when the rotation center of the pressing tool 41a in the θ direction is shifted from the position of the midpoint of the line segment connecting the alignment marks WM of the electronic component W, the rotation of the pressing tool 41a described above As a result, since the position of the midpoint of the line segment is shifted in the horizontal direction by the rotation amount of the pressing tool 41a, the moving position of the organic EL panel P is performed taking this position shift into account.

In the organic EL panel P positioned at the pressing position, its edge portion is supported on the upper surface of the backup tool 43a. In addition, the electronic component W is positioned so that the terminal row TR faces directly above the electrode row ER of the organic EL panel P with a slight gap therebetween. In this state, the pressing tool 41a is lowered by the drive of the tool driving unit 41b. Thereby, at a predetermined heating temperature, pressing force, and pressing time, the terminal portion of the electronic component W is heated and pressurized to the electrode surface of the organic EL panel P through the anisotropic conductive tape F, and the organic EL panel P The electronic component (W) is pressurized to the.

When the preset pressing time has elapsed, adsorption of the electronic component W by the pressing tool 41a is released, and the pressing tool 41a is raised. The pressing tool 41a is moved from the second transmission device 70 to a delivery position where the electronic component W is transmitted. Further, the stage 42 on which the organic EL panel P to which the electronic component W is pressed and attached is placed is moved to the carrying out position for transferring the organic EL panel P to the second conveying unit 90. In this carrying out position, the organic EL panel P is held by the holding member 91 of the second conveying unit 90, and its upper surface is the same as that of the holding member 81 of the first conveying unit 80. It is adsorbed and held, and is conveyed to the stage 51 of the main compression device 50.

The organic EL panel P supplied to the main compression device 50 by the second conveyance unit 90 is transferred onto the stage 51 positioned at the carrying position, and is adsorbed and held on the stage 51. . This transfer operation is performed in the same manner as the transfer of the organic EL panel P from the first transfer unit 80 to the stage 42. At this time, the edge portion of the organic EL panel P to which the electronic component W is pressed is maintained in a state protruding from the stage 51.

When the organic EL panel P is held on the stage 51, the stage 51 is moved to support the edge of the organic EL panel P on the upper surface of the backup tool 53a. On the other hand, during this movement, position recognition of the alignment mark (mark different from the alignment mark PM) of the organic EL panel P is performed by the position recognition unit 54. Based on this position recognition result, the stage 51 is moved so that the electrode surface of the organic EL panel P is positioned in a correct positional relationship on the upper surface of the backup tool 53a. When the edge of the organic EL panel P is supported on the upper surface of the backup tool 53a, the pressing tool 52a is lowered by the drive of the tool driving unit 52b, and the heating temperature, pressing force, and pressing time are set in advance. The electronic component W pressurized to the EL panel P is subjected to main pressure bonding.

When the preset pressing time has elapsed, the pressing tool 52a is raised. In addition, the organic EL panel P to which the electronic component W is fully bonded, that is, the stage 51 for arranging the display member, is a carry-out position for transferring the organic EL panel P to the third conveying unit 100. Is moved to. At this carrying out position, the upper surface of the organic EL panel P is adsorbed and held by the holding body 101 of the third carrying section 100 and transferred to a carrying-out device (not shown).

The mounting operation including the pressure bonding process and the main compression process of the electronic component W to the organic EL panel P described above is repeated until the organic EL panel P to which the electronic component W is to be mounted disappears. And run it. On the other hand, in the mounting apparatus 1 of the embodiment, the improvement of the positional accuracy is important in the pressing process, whereas the improvement of the compression strength and reliability by the anisotropic conductive tape F is important in the main compression bonding process. The time is also different. For this reason, the mounting efficiency of the electronic component W can be improved by applying the press bonding device 40 and the main compression bonding device 50 to perform the press bonding process and the main compression bonding process. However, the mounting device 1 of the embodiment is not limited to this configuration. You may make it perform from a positioning process to a main compression bonding process by the main compression apparatus 50.

[Effect of action of mounting device]

In the mounting apparatus 1 of the above-described embodiment, an organic EL panel P having a thickness of 50 µm or more and 500 µm or less, a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less, and having flexibility, is provided with the electronic component ( It is placed on the stage 42 (arrangement portion 42a) so that the amount of protrusion from the stage 42 at the edge portion where W) is mounted is 3 mm or more and 15 mm or less, and the edge portion of the organic EL panel P The alignment mark PM formed in is irradiated with light from the upper side opposite to the imaging devices 44a and 44b by the light irradiation unit 44d. And in this state, the alignment mark PM formed on the edge of the organic EL panel P and the alignment mark WM of the electronic component W held by the pressure bonding head 41 are image pickup devices 44a, 44b. ) To capture an image. Further, the captured image is image-processed by the image processing unit 44c, the positional relationship between the organic EL panel P and the electronic component W is recognized, and based on the position recognition result, the control device 110 As a result, the organic EL panel P and the electronic component W are aligned, and the electronic component W is press-bonded to the organic EL panel P through the anisotropic conductive tape F, and then subjected to full pressure bonding.

In this way, when detecting the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, it is the edge portion where the electrode in the organic EL panel P is formed and the stage ( 42), it is possible to prevent sagging from occurring on the edge portion protruding from. In addition, even if it is an organic EL panel (P) made of a resin such as PI or PET, warping or undulations may occur at the edges, or made of a resin substrate having a lower transmittance than glass, the alignment mark (PM) is formed by transmitted light. By imaging as a silhouette image, since the contrast between the alignment mark PM and the background can be improved, it becomes possible to clearly image the alignment mark PM. Therefore, the recognition error of the alignment mark PM resulting from sagging of the edge portion of the organic EL panel P and the recognition error of the alignment mark PM resulting from insufficient sharpness of the received image can be reduced. As a result, it becomes possible to improve the mounting precision of the electronic component W to the organic EL panel P. Therefore, even in the case of mounting the flexible electronic component W on the flexible organic EL panel P, it becomes possible to improve the mounting accuracy and mounting quality.

That is, since a display panel (hereinafter referred to as a liquid crystal display panel) used in the production of a conventional liquid crystal display is obtained by bonding glass substrates having a thickness of 0.5 mm to 0.7 mm, the rigidity is relatively high. Therefore, even if the edge portion of the liquid crystal display panel is held by protruding from the stage by several 10 mm, the edge portion hardly sags due to its own weight.

In contrast, in the organic EL panel P, as described above, a PI film Ka having a thickness of about 0.01 mm to 0.03 mm (10 μm to 30 μm), which is a member on which an organic EL element is formed, is used as a support material. Since a thin resin substrate formed by adhering to a PET film (Kb) of about 0.1 mm to 0.2 mm is used, the rigidity is very low. Therefore, in the organic EL panel P, when the edge portion is protruded from the stage by several 10 mm and is held, the projected edge portion is easily struck by its own weight. When the edge portion of the organic EL panel P sags, the position of the alignment mark PM formed on the edge portion is shifted in the horizontal direction by that amount. Therefore, in the position recognition of the alignment mark PM of the organic EL panel P performed using a camera, a shift occurs in the recognized position.

As a result of the experiment confirmed by the inventor of the present invention, when the edge of the organic EL panel (P) is maintained by protruding 20 mm from the stage as in the case of a liquid crystal display panel of the same size, sagging occurs at the edge. Then, it was confirmed that a displacement of about 4 µm occurred in the horizontal direction (toward the stage side) at the position of the alignment mark PM by this sag. In addition, when the edge portion of the organic EL panel P sags, the alignment mark is inclined with respect to the horizontal state. When the inclined alignment mark PM is imaged from immediately below, the length of the imaged alignment mark in the inclined direction is shorter than that in the case where it is imaged in a horizontal state. That is, the shape of the imaged alignment mark PM is deformed by an inclined portion. As a result, a difference occurs in the shape of the reference mark stored in advance, and this also causes an error in the recognition position of the alignment mark PM.

The inventor of the present invention conducted an experiment comparing the error of the recognition position in the alignment mark (PM) maintained horizontally and the alignment mark (PM) inclined by 5° with respect to the horizontal, as a result, the average of the alignment mark inclined by 5° was 1 μm. It was confirmed that the accuracy error was large. On the other hand, in the experiment by tilting the alignment mark by 5°, the sag that occurs when the edge of the stage is protruded by 20 mm was measured for a plurality of organic EL panels (P), and as a result, a sag of 5° or more was confirmed. Because.

On the other hand, in the mounting apparatus 1 of the embodiment, as described above, an organic EL panel P having a thickness of 50 µm or more and 500 µm or less and a bending elastic modulus of 2.6 GPa or more and 4.0 GPa or less is provided. The stage of the organic EL panel P is arranged on the stage 42 (placement portion 42a) so that the amount of protrusion from the stage 42 at the edge portion where the component W is mounted is 3 mm or more and 15 mm or less. It is possible to prevent sagging from occurring at the edge portion protruding from (42). Thereby, occurrence of the recognition error of the alignment mark PM based on the sag of the protruding portion from the stage 42 of the organic EL panel P can be suppressed. That is, when the bending elastic modulus of the protruding portion of the organic EL panel P is 2.6 GPa or more, the thickness is 50 µm or more, and the protruding amount is 15 mm or less, sagging of the protruding portion can be prevented. . On the other hand, when the bending elastic modulus of the protruding portion exceeds 4.0 GPa or the thickness exceeds 500 µm, there is a concern that characteristics such as flexibility of the organic EL panel P and basic characteristics as a thin display panel may be deteriorated.

In addition, when the alignment mark PM of the organic EL panel P is imaged, when illumination is illuminated from the lower side of the camera, the alignment mark PM cannot be clearly imaged, or it is said that it is impossible to image the alignment mark PM at all. The problem arises. The irradiation conditions (irradiation light amount, irradiation angle, etc.) when illuminating the light from the lower side are a standard using an organic EL panel (e.g., an organic EL panel with a flat edge, hereinafter referred to as a ``reference panel'') as a reference. The alignment mark on the panel is set under conditions that enable satisfactory imaging. Even when such irradiation conditions are applied, there is sagging or warping at the edge portion of the organic EL panel P to be actually imaged, and the state is different, such as inclining with respect to the edge portion of the reference panel, so that the organic EL panel P The reflection state of the light at the edge of) is different from that of the reference panel. As a result, there arises a problem that the alignment mark PM cannot be clearly imaged, or the image cannot be imaged at all. As a result of the experiment of the inventor of the present application, it was confirmed that when the alignment mark PM could not be captured clearly, a shift of about 1 µm at the maximum occurred at the recognition position.

In contrast to this, in the mounting apparatus 1 of the embodiment, in addition to preventing sagging from occurring in the edge portion protruding from the stage 42 of the organic EL panel P, the alignment mark PM Light is irradiated by the light irradiation unit 44d from the upper side opposite to the imaging devices 44a and 44b, and the alignment mark PM is imaged as a silhouette image by transmitted light. Accordingly, even if the organic EL panel P is formed of a resin such as PI or PET, warps or undulations may occur at the edge, or is composed of a resin substrate having a lower transmittance than glass, the alignment mark PM and the background Since the difference in contrast can be improved, it becomes possible to clearly image the alignment mark PM. As a result of these, since the recognition error of the alignment mark PM can be reduced, it becomes possible to improve the mounting precision of the electronic component W to the organic EL panel P.

On the other hand, in order to suppress sagging or warping of the edge portion of the organic EL panel P, the inventor of the present application staged a support tool in which a portion (supporting surface) supporting the edge portion of the organic EL panel was processed flat and formed with a suction hole. By attaching to the organic EL panel so as not to cause sagging at the edge of the organic EL panel, and attempting to mount the electronic component in this state. The support tool was made of stainless steel used in backup tools for general OLB devices. In addition, in a portion corresponding to the position of the alignment mark in the support tool, an observation hole for image pickup having a diameter of 3 mm and penetrating vertically was formed.

However, even if such a support tool was used, the mounting precision of ±3 µm could not be sufficiently satisfied with some types of organic EL panels. That is, as a result of carrying out an experiment for confirming the mounting precision using a plurality of types of organic EL panels, it was found that there are varieties whose mounting accuracy is within ±3 µm and those whose mounting accuracy exceeds ±3 µm.

That is, since the organic EL panel P is composed of a thin and flexible resin substrate, adsorption traces are generated when adsorbed with a large adsorption force. The edge portion of the organic EL panel P is not used for image display, but a fine electrode (also referred to as "lead") connected to the terminal of the electronic component W is formed. Therefore, when an adsorption trace is generated in the portion of the electrode, deformation such as bending or the like occurs in the electrode. Since stress remains inside the deformed electrode, it is a factor that lowers the durability of the electrode, which is not preferable. From this point of view, the size of the adsorption hole and the size of the negative pressure applied to the adsorption hole need to be set within a range in which no adsorption trace of the organic EL panel is generated. In the above-described experiment, suction holes having a diameter of 0.5 mm were formed in a row at intervals of 2 mm in the support hole, and a negative pressure of -40 kPa was applied to the suction holes. However, when the adsorption force in consideration of the adsorption traces is set in this way, it has been found that depending on the type of organic EL panel, it is not possible to make the edge part of the support surface along the support surface.

In other words, depending on the type of organic EL panel, warping or undulations may occur at the edges, and even in organic EL panels in which such warpages or undulations have occurred, the warpage or undulations are corrected by adsorption, and the support surface of the support tool is There were things that followed, and those that were not corrected for warpage or ups and downs. In the organic EL panel in which such warp and undulation are not corrected, it was confirmed that the mounting accuracy exceeded ±3 µm. In addition, in the organic EL panel in which such warp or undulation is not corrected, the reflection state of the light irradiated from the same side as the camera is different from that of the reference panel, and as a result, the alignment mark cannot be clearly imaged, and the alignment mark is recognized. It turned out that the precision was deteriorated.

Further, it has been found that a new problem arises by providing a support tool and forming an observation hole for imaging in this support tool. That is, by forming the observation hole, when the pressing head is brought into contact with the organic EL panel through the electronic component during press bonding, the impact caused by the contact causes indentation of the observation hole in the organic EL panel. Was confirmed. Similar to the above-described adsorption traces, such indentations also cause deformation in the electrodes of the organic EL panel, which deteriorates the mounting quality and must be avoided. On the other hand, in the portion of the suction hole of the support tool, since the diameter was as small as 0.5 mm, no indentation was observed.

Therefore, an attempt was made to pass through the support tool to recognize an alignment mark without forming an observation hole by forming the support tool from glass. As a result, the occurrence of the indentation could be eliminated, but it was found that there was a problem in durability. Specifically, as a result of carrying out the repeated test of mounting, it was observed that the support tool generated chapped from when the number of mounting exceeded 10000 times. Therefore, in the case of using such a support tool made of glass, it is necessary to replace the support tool based on about 10,000 mounting times. In such mounting, since the time (tact time) required for mounting one electronic component is usually 3 seconds to 5 seconds, when continuously operated, the calculation reaches 10,000 times from 8.3 hours to 13.9 hours. Therefore, it is necessary to change the support tool every 8.3 hours to 13.9 hours, that is, at a frequency of 2 to 3 times a day.

Since it is necessary to uniformly push the electrode portion of the electronic component against the electrode portion of the organic EL panel between the above-described support tool and the pressing head, a precise degree of parallelism is required. Although each support tool is processed into the same shape, it has individual differences. Therefore, it is necessary to adjust the degree of parallelism with the crimping tool every time the support tool is replaced. For this reason, since the operation of the OLB device must be stopped during this adjustment, production cannot be performed. The occurrence of such a stoppage several times a day leads to a significant decrease in productivity, which is not practical. Further, it is also considered that a cover made of glass is fitted in the upper portion of the observation hole of the support tool made of stainless steel, so that the support surface of the support tool is apparently flattened. However, as long as the cover is made of glass, it has a problem of durability, and if a step occurs between the upper surface and the support surface of the cover, it is also unrealistic because there is a concern about occurrence of indentation.

The mounting apparatus 1 of the embodiment is a problem in the case of recognizing the alignment mark while preventing sagging of the edge portion of the organic EL panel P by using the support tool as described above, that is, the indentation due to the observation hole of the support tool. , It is possible to suppress a decrease in the recognition accuracy of the alignment mark due to warpage or undulations that are not corrected on the support surface of the support tool, and a decrease in mounting efficiency based on the durability of the glass support tool. That is, in addition to making the edge part protrude from the stage 42 of the organic EL panel P and preventing sagging in the protruding edge part, the alignment mark PM is imaged as a silhouette image by transmitted light. Therefore, it becomes possible to improve the mounting precision and mounting quality of the electronic component W to the organic EL panel P after avoiding the problem caused by the above-described support tool.

In addition, in the mounting apparatus 1 of the embodiment, the backup tool 43a used at the time of press bonding is formed of, for example, stainless steel, and a support surface supporting the edge portion of the organic EL panel P is formed flat. have. For this reason, indentation is prevented from occurring in the edge portion of the organic EL panel P during pressure bonding. In addition, since it is stainless steel, damage is less likely to occur even when pressed by the pressing head 41, it is excellent in long-term durability, and good productivity can be maintained.

Further, based on the protruding amount G of the edge portion of the organic EL panel P from the arrangement portion 42a of the stage 42 stored in the storage unit 111, the control device 110 By controlling the driving of the driving unit 42b and the XZ driving unit 82, the organic EL panel P is transferred from the holder 81 of the first transfer unit 80 to the placement unit 42a of the stage 42. It is arranged with a protruding amount (G) set in the range of not less than ㎜ and not more than 15 ㎜. Thereby, it becomes possible to reliably arrange the organic EL panel P with the protruding amount G set on the arrangement part 42a, and it is certain that sagging occurs at the edge of the organic EL panel P. This makes it possible to further improve the recognition accuracy of the stable alignment mark PM. As a result, the mounting precision of the electronic component W to the organic EL panel P can be obtained stably, and the mounting quality of the electronic component W can be improved.

In addition, the present invention is not limited to the above-described embodiment. For example, an organic EL panel has been described as an example as a display panel, but the present invention is not limited thereto. For example, it is also possible to use a flexible electronic paper constituent member as a display panel. In short, it is applicable as long as it has a thickness of 50 µm or more and 500 µm or less, and a flexural modulus of 2.6 GPa or more and 4.0 GPa or less, and has flexibility.

In addition, by controlling the stage driving unit 42b and the XZ driving unit 82 based on the set protruding amount G, the organic EL panel P is arranged on the arrangement unit 42a, but is limited thereto. No, to detect the protruding amount of the organic EL panel P, and to control the stage driving unit 42b and the XZ driving unit 82 of the first conveying unit 80 so that the protruding amount G is set. You can do it. In this case, for example, the end of the organic EL panel P held by the holder 81 (electrode row ER) at the transfer position of the stage 42 or the organic EL panel P to the stage 42 A detector such as a photoelectric sensor or a laser sensor is installed to detect the formed side], and based on the detection result of this detector, the protrusion amount of the edge portion from the placement portion 42a becomes the set protrusion amount (G). You just have to control it.

Instead of storing the protruding amount G in the storage unit 111, information on the kind of the display panel (kind information) may be stored. In this case, a conversion table indicating the relationship between the variety information of the display panel P and the protruding amount G corresponding to the variety information is obtained and created in advance by an experiment or the like, and the conversion table is stored in the storage unit ( 111). Then, based on the variety information inputted by an input means (not shown), the protruding amount G corresponding to the variety information may be read.

In addition, as the image pickup devices of the position recognition device 44, the first and second images are captured by simultaneously receiving the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W within the same field of view. 2 Although the case where the imaging devices 44a and 44b are used has been described, the imaging device of the position recognition device 44 is not limited to this. For example, the first and second imaging devices 44a and 44b may separately image the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W, respectively.

In addition, two imaging devices are further provided, the alignment mark WM of the electronic component W is imaged by the first and second imaging devices 44a and 44b, and the organic EL panel is carried out by the other two imaging devices. The alignment mark PM of (P) may be imaged. On the other hand, at this time, the other two imaging devices may be attached so that the alignment mark PM of the organic EL panel P may not be imaged from the lower side, but may be imaged from the upper side. In this case, the light irradiation part 44d may be disposed at a position lower than the placement part 42a of the stage 42, and the alignment mark PM of the organic EL panel P may be irradiated with light from the lower side. In this way, when the alignment mark PM of the organic EL panel P is imaged from the upper side by transmission illumination, the alignment mark PM formed on the upper surface side of the organic EL panel P is directly imaged. Therefore, it becomes possible to take a much larger difference in contrast than when imaged with transmission illumination through the resin substrate of the organic EL panel P from the lower side, and further improvement of recognition accuracy can be achieved.

Although it is assumed that the alignment mark PM of the organic EL panel P is imaged by transmission illumination, the alignment mark WM of the electronic component W may also be imaged by transmission illumination. In this case, a light guide part is installed in the pressing tool 41a of the pressing head 41 in accordance with the position of the alignment mark WM of the electronic component W, and the light irradiated from the light irradiation part 44d is transmitted through the light guide part. It is also possible to guide it to the alignment mark (WM). Of course, the light irradiation portion may be provided individually, or the light irradiation portion may be embedded in the pressing tool 41a.

In addition, although the anisotropic conductive tape F was used for the connection of the organic EL panel P and the electronic component W, it is not limited to this. Other connecting members, such as an adhesive containing electroconductive particles, may be used. When using an adhesive, it is possible to use a thermosetting or photocurable adhesive.

The configurations of the first to third transport units 80, 90, and 100 are not limited to those described above, and other configurations may be used. For example, instead of using a porous sheet, a flexible rubber such as a foamed urethane rubber or a silicone rubber, or a resin material having a plurality of adsorption openings formed therein may be used.

It has been described as conveying the organic EL panel P from the stage 42 of the pressing device 40 to the stage 51 of the main pressing device 50 by using the second conveying unit 90, but limited to this. It does not become. For example, by configuring the stage 51 of the main pressing device 50 to be moved to a position close to the stage 42 of the pressing device 40, the close position of the stage 42 of the pressing device 40 The organic EL panel P may be conveyed using the first conveying unit 80 with respect to the stage 51 of the main compression device 50 that has been moved to. In other words, the first transport unit 80 may also serve as the second transport unit 90.

In consideration of the difference in process time between the pressing step and the main pressing step, a plurality of main pressing devices 50 may be provided in the mounting device 1. In addition, instead of installing a plurality of main pressing devices 50, a stage 51 capable of arranging a plurality of organic EL panels P in parallel is provided in one main pressing device 50, and a plurality of main pressing devices 50 are installed in parallel. It is also possible to provide a main compression head 52 capable of main compression bonding the electronic components W on the arranged organic EL panel P collectively or individually. Here, when the main compression bonding is performed collectively, a pressing tool 52a having a length capable of covering the entire area of the plurality of organic EL panels P arranged in parallel is equipped with the main compression bonding head 52. In addition, when performing main compression bonding individually, a pressurizing tool 52a having a length capable of covering the electronic component W mounted on one organic EL panel P is fitted in accordance with the arrangement interval of the organic EL panel P. It is equipped with the main crimping head 52. It is preferable to configure each pressing tool 52a so that the pressing force can be set individually.

In the above-described embodiment, the configuration in which the anisotropic conductive tape F is adhered to the electronic component W has been described, but is not limited thereto. The anisotropic conductive tape F may be adhered to the organic EL panel P, that is, a display panel. In this case, instead of installing the anisotropic conductive tape bonding device 30 at the bonding position C of the intermittent rotation conveying device 20, on the upstream side of the supply unit of the organic EL panel P, the organic EL panel P What is necessary is just to provide an anisotropic conductive tape bonding device which adheres the anisotropic conductive tape (F) to. For example, a mounting device 201 as shown in FIG. 10 may be applied. 10 shows a configuration of a mounting device 201 according to another embodiment.

[Mounting device according to another embodiment]

In the mounting device 201 shown in FIG. 10, the anisotropic conductive tape bonding device 230, the pressing device 240, and the main pressing device 250 are arranged side by side in the X direction, and the Y of the pressing device 240 The punching device 210 is disposed in the rear direction, and a conveying device 260 for conveying the electronic component W is disposed between the pressing device 240 and the punching device 210. Between each processing apparatus 230, 240, 250, the conveyance parts 271, 272, 273, 274 of the organic EL panel P are arrange|positioned. This mounting device 201 supplies four organic EL panels P each to perform processing in each processing device. The punching device 210 punches the electronic component W from the carrier tape T, and has the same configuration as the punching device 10 described in the above-described embodiment.

The anisotropic conductive tape bonding device 230 adheres the anisotropic conductive tape F to the organic EL panel P. In the anisotropic conductive tape bonding device 230, two arranging portions 231 and 232 that hold the organic EL panels P side by side in the X direction are disposed side by side in the X direction. These mounting portions 231 and 232 are provided so as to be movable in the XYZθ direction, respectively. Further, the adhesive units 233 and 234 of the anisotropic conductive tape F are arranged corresponding to the two mounting portions 231 and 232. Each of the placement units 231 and 232 sequentially positions the organic EL panels P on the placement units 231 and 232 at the bonding positions by the corresponding bonding units 233 and 234, respectively. Each of the bonding units 233 and 234 adheres the anisotropic conductive tape F to the organic EL panel P positioned at the bonding position.

The press bonding device 240 presses the electronic component W to the organic EL panel P to which the anisotropic conductive tape F is adhered. The press-bonding device 240 attaches the electronic component W to the arrangement part 241 which holds the organic EL panel P four by four in the X direction, and the organic EL panel P held by the arrangement part 241. When the electronic component W is press-attached to the organic EL panel P by the press-bonding head 242 and the press-bonding head 242, the organic EL panel P is not shown to be supported from the lower side. Equipped with backup tools. The placement unit 241 is provided so as to be movable in the XYZθ direction, and the four organic EL panels P on the placement unit 241 are sequentially positioned at the pressing position by the pressing head 242. The press bonding head 242 sequentially presses the electronic components W to the organic EL panel P positioned at the press bonding position. On the other hand, it goes without saying that the pressing device 240 includes the same position recognition device as the pressing device 40 described in the above-described embodiment.

Here, the electronic components W punched by the punching device 210 are sequentially supplied to the press bonding head 242 by the conveying device 260. That is, the conveyance device 260 is movable in the XYZθ direction by the XYZθ drive unit 261, and includes a support part 262 for adsorbing and holding the electronic component W from the lower side, and from the punching device 210 The electronic component W is received and delivered to the pressing head 242.

The main compression bonding apparatus 250 main compression bonding the electronic component W pressed onto the organic EL panel P. The main compression bonding apparatus 250 is provided with four arranging portions 251, 252, 253, and 254 that individually hold the organic EL panels P one by one in the X direction. In addition, four main pressing heads 255, 256, 257, 258 are provided corresponding to the four mounting portions 251, 252, 253, and 254. The main crimping heads 255, 256, 257, 258 are installed so that the pressing force can be individually adjusted, and are installed so as to be able to move up and down in a collective manner. The individual mounting portions 251, 252, 253, 254 are movable in the XYZθ direction, and the organic EL panel P can be positioned with respect to the corresponding main compression heads 255, 256, 257, 258. Has been. The four main compression heads 255, 256, 257, 258 collectively perform main compression on the four organic EL panels P positioned by the four placement units 251, 252, 253, 254. .

The conveyance units 271, 272, 273, and 274 simultaneously deliver four organic EL panels P between the processing apparatuses 230, 240 and 250. That is, the conveyance parts 271, 272, 273, and 274 are formed by arranging four holding portions for adsorbing and holding the organic EL panel P from the upper side in the X direction. And the conveyance part 271 simultaneously transfers four organic EL panels P to the anisotropic conductive tape bonding apparatus 230 from the supply part (not shown). The conveyance unit 272 simultaneously transfers four organic EL panels P from the anisotropic conductive tape bonding device 230 to the pressure bonding device 240. The conveyance unit 273 simultaneously transmits four organic EL panels P from the pressing device 240 to the main pressing device 250. The conveyance part 274 carries out four organic EL panels P simultaneously from the main compression apparatus 250 to a carrying out part (not shown). The present invention is applicable also to the mounting device 201 having such a configuration.

[Example]

Next, examples of the present invention and evaluation results thereof will be described.

(Example 1)

Using the mounting apparatus 1 of the above-described embodiment, an experiment was conducted to confirm the mounting accuracy by TEG (Test Element Group) under the following conditions. Here, TEG refers to a member for evaluation produced for testing, and here, a member for evaluation of the organic EL panel P was prepared. Specifically, a PI film having a size of 5 inches (120 mm×65 mm) and a thickness of 0.03 mm (30 µm) and a PET film having a size equivalent to 5 inches and a thickness of 0.20 mm (200 µm) is optically The TEG of an organic EL panel was produced by bonding using an ultraviolet-curable resin for use. The flexural modulus of PET was 3.07 GPa, and the flexural modulus of PI was 3.5 GPa. From the ratio of the thicknesses of both, the bending elastic modulus of the organic EL panel P was estimated to be about 3.1 GPa. As the electronic component W, a COF having a width of 36 mm and a length of 25 mm was used. Hereinafter, the TEG of the organic EL panel P is simply referred to as the organic EL panel P. The target accuracy was set to ±3 µm, which is a general accuracy required for an organic EL panel used in a display panel for a smartphone.

<Experimental conditions>

Heater of pressurized head: OFF

Tact time: 10 seconds (however, the moving speed of the pressing tool 41a and the placement unit 42a was the same as in the case of mounting in 5 seconds of tact.)

Repetition time (number of times): 2.8 hours (1000 times)

At the time of the experiment, first, with each of them in the standby position, the organic EL panel P is placed on the placement portion 42a, and the electronic component W is held in the pressing tool 41a. The standby position is a supply position for receiving the organic EL panel P from the first transfer unit 80 for the placement unit 42a, and the electronic component ( It is the location that receives W). From this state, the organic EL panel P and the electronic component W are positioned at the mark recognition position prior to pressing. At this time, the pressure head 41a is positioned in a state rotated in the horizontal direction of θ=+5°. This is to confirm the correction accuracy of the rotational deviation. The protruding amount G of the edge portion of the organic EL panel P was set to 4 mm.

In this state, the positions of the alignment marks of the organic EL panel P and the electronic component W are recognized using the first and second imaging devices 44a and 44b, and the organic EL panel ( P) and the electronic component W are aligned. On the other hand, this alignment does not overlap the edge portion of the electronic component W with respect to the edge portion of the organic EL panel P, but the edge portion of the organic EL panel P and the edge portion of the electronic component W slightly It is carried out in the state of facing each other with the distance between them. Specifically, alignment is performed so that the alignment marks PM and WM have an interval of 3 mm between them. Since the distance from the alignment marks PM and WM to the edge is approximately 0.6 mm to 1.2 mm, respectively, the edge portions are arranged at intervals of 0.6 mm to 1.8 mm.

When the alignment is complete, the alignment mark PM of the organic EL panel P and the alignment mark WM of the electronic component W are the same from the lower side using the first and second imaging devices 44a and 44b. The image is captured at the same time by putting it in the field of view, and the relative positional shift between the organic EL panel P and the electronic component W is recognized. And the relative positional deviation calculated|required from this recognition result was recorded as mounting precision. On the other hand, since the alignment marks (PM, WM) are spaced 3 mm apart, the alignment marks (PM, WM) are shifted by 3 mm in the Y-axis direction in the ideal positioning state. do.

As a result, the maximum value of the positional shift in the X-axis direction was 0.7 µm, and the minimum value was -0.4 µm. In addition, the maximum value of the positional shift in the Y-axis direction was 0.5 µm, and the minimum value was -0.9 µm. All were within ±3 µm, which is the target accuracy.

(Example 2)

In Example 2, an experiment was conducted under the same conditions as in Example 1, except that the protruding amount G was set to 15 mm. As a result, the maximum value of the positional shift in the X-axis direction was 1.6 µm, and the minimum value was -1.1 µm. In addition, the maximum value of the positional shift in the Y-axis direction was 0.9 µm, and the minimum value was -2.3 µm. All were within ±3 µm, which is the target accuracy.

(Comparative Example 1)

In Comparative Example 1, an experiment was conducted under the same conditions as in Example 1, except that the protruding amount G was set to 20 mm. As a result, the maximum value (maximum value of the position shift in the plus direction) in the X-axis direction was 2.7 µm, and the minimum value (the maximum value of the position shift in the minus direction) was -2.0 µm. In addition, the maximum value of the positional shift in the Y-axis direction was 1.5 µm, and the minimum value was -5.8 µm. The positional deviation in the X-axis direction was within ±3 µm, which is the target accuracy, but the positional deviation in the Y-axis direction was a result that greatly deviated from the range of ±3 µm, which is the target accuracy.

The measurement results of Example 1 described above are shown in Table 1 and FIG. 11. In addition, the measurement results of Comparative Example 1 are shown in Table 2 and Fig. 12. Tables 1 and 2 show the average value (1) of the data from the first to the tenth data, and the average value (2) of the data from the 101st to the 110th, in the data for 1000 times acquired during the repetition time. Thus, the average values (3) to (10) of the data for 10 times every 100 times are shown as "relative position shift recognition results", respectively. The "difference from the measurement result of (1)" in Table 1 is a value obtained by subtracting the average value (1) from the average values (2) to (10) of the data every 100 times. 11 and 12 show variations in "difference from the measurement result of (1)". As is evident from the comparison of Tables 1 and 11 with Tables 2 and 12, it can be seen that the variation in mounting accuracy in Example 1 is significantly suppressed compared to Comparative Example 1. Therefore, it can be seen that the mounting precision of the flexible electronic component with respect to the flexible display panel can be maintained over a long period of time.

(Examples 3 and 4)

As Examples 3 and 4, an experiment was conducted to confirm the mounting accuracy by fabricating another TEG using the mounting apparatus 1 of the above-described embodiment. As the organic EL panel P, it was assumed that an optical film was adhered to the display portion, and a TEG in which a PEN film was bonded to a location corresponding to the display portion was produced. More specifically, to the TEG used in Examples 1 and 2, a new TEG was prepared by bonding a PEN film having a size of 114 ㎜×65 ㎜ and a thickness of 0.15 ㎜ (125 ㎛) using an optical ultraviolet curable resin. I did. In this PEN film, the end of the side opposite to the edge on which the electronic component (W) is mounted is aligned with the TEG used in Examples 1 and 2, and the end of the edge on which the electronic component (W) is mounted and the PEN film It was joined so that a gap of 6 mm was created between the ends of the. The flexural modulus of PEN is 2.2 GPa, the flexural modulus of PI is 3.5 GPa, and the flexural modulus of PET is 3.07 GPa. From the ratio of the thickness of the three characters, the bending elastic modulus of the organic EL panel P was estimated to be about 2.8 GPa. As the electronic component W, as in Examples 1 and 2, a COF having a width of 36 mm and a length of 25 mm was used.

In Example 3, an experiment was conducted under the same conditions as in Example 1. As a result, the maximum value of the positional shift in the X-axis direction was 0.9 µm, and the minimum value was -0.3 µm. In addition, the maximum value of the positional shift in the Y-axis direction was 1.0 µm, and the minimum value was -0.7 µm. Although inferior to Example 1, all were within ±3 µm, which is the target accuracy. In Example 3, since the protruding amount G was 4 mm, the portion protruding from the stage 42 in the organic EL panel P was only the edge portion where the PEN film did not exist. It is assumed that the result was roughly the same as in Example 1.

In Example 4, an experiment was conducted under the same conditions as in Example 1, except that the protruding amount G was set to 12 mm. By setting the protruding amount G to 12 mm, the portion in the organic EL panel P to which the PEN film is bonded protrudes by 6 mm. As a result, the maximum value of the positional shift in the X-axis direction was 1.9 µm, and the minimum value was -1.5 µm. In addition, the maximum value of the positional shift in the Y direction was 2.6 µm, and the minimum value was -1.6 µm. All were within ±3 µm, which is the target accuracy.

(Comparative Example 2)

In Comparative Example 2, an experiment was conducted under the same conditions as in Example 1, except that the protruding amount G was set to 20 mm. As a result, the maximum value of the positional shift in the X-axis direction was 2.8 µm, and the minimum value was -2.3 µm. In addition, the maximum value of the positional shift in the Y direction was 8.2 µm, and the minimum value was -0.6 µm. The positional deviation in the X-axis direction was within ±3 µm, which is the target accuracy, but the positional deviation in the Y-axis direction was a result that greatly deviated from the range of the target accuracy ±3 µm.

From these results, it can be seen that the shorter the protruding amount G of the edge portion of the organic EL panel P from the arrangement portion 42a of the stage 42, the better the mounting accuracy can be. And it was confirmed that the mounting precision can be made within ±3 µm by setting the protruding amount to 15 mm or less.

On the other hand, although several embodiments of the present invention have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and summary of the invention, and are included in the invention described in the claims and their equivalents.

1: mounting device 10 (10A, 10B): punching device
12: mold device 20: intermittent rotation conveying device
21: arm part 24: holding head
30: Anisotropic conductive tape bonding device (bonding member bonding device)
32: adhesive head 40: pressure bonding device
41: pressure bonding head 42: stage
42a: placement unit 42b: stage driving unit
43: backup unit 43a: backup tool
44: position recognition device 44a: first imaging device
44b: second imaging device 44c: image processing device
44d: light irradiation unit 50: main compression device
51: stage 52: main crimping head
53: backup unit 60: first delivery device
61: support portion 70: second delivery device
71: support unit 80: first transfer unit
81: holding member 81a: electrode surface adsorption block
81b: display area adsorption unit 90: second conveyance unit
91: holding body 100: third conveying unit
101: holding body 110: control device
111: memory unit F: anisotropic conductive tape
P: organic EL panel W: electronic component

Claims (1)

By connecting a plurality of electrodes arranged at the edge of the flexible display panel to a plurality of terminals arranged corresponding to the plurality of electrodes in a flexible electronic component through a bonding member, the In the electronic component mounting apparatus for mounting the electronic component on the display panel,
A stage movable in a horizontal direction in which the display panel is disposed so that the edge portion protrudes in a range of 3 mm or more and 15 mm or less;
A backup unit supporting the edge portion of the display panel disposed on the stage from a lower side;
A thermocompression head movable in horizontal and vertical directions for holding the electronic component from above and thermocompressing the electronic component on an upper surface of the edge portion supported by the backup unit,
An imaging device for imaging an alignment mark formed on the edge portion and an alignment mark formed on the electronic component in a state before the edge portion of the display panel protruding from the stage is supported from the lower side by the backup unit, and the A position recognition device comprising a light irradiation unit for irradiating light to a display panel from a side opposite to the imaging device, and for recognizing a positional relationship between the display panel and the electronic component;
Based on the positional relationship recognized by the position recognition device, the relative position of the stage and the thermocompression head is adjusted so as to align the position of the display panel and the electronic component, and the thermocompression head adjusts the Control device for controlling the stage and the thermocompression head to thermocompress the electronic component to the display panel
And,
An electronic component mounting apparatus wherein a bending elastic modulus of a portion of the display panel protruding from the stage is 2.6 GPa or more and 4.0 GPa or less.

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