JP6998508B2 - Crimping device and crimping method - Google Patents

Description

The present invention relates to a crimping device for crimping an object to be crimped onto the upper surface of a part of a substrate supported by a backup portion, and a crimping method using the crimping device.

ACF pasting device, temporary crimping device, main crimping device and the like in a component mounting line for mounting components on a substrate are known as crimping devices for crimping an object to be crimped such as ACF and components to a substrate. The crimping device includes a board holding table that holds the board so that a part of the board protrudes in the horizontal direction, a backup part that supports the lower surface of a part (protruding part) of the board that protrudes from the board holding table, and a backup part. Equipped with a crimping tool located above. The crimping tool presses the crimping tool against the upper surface of the protruding portion supported by the backup portion, and crimps the crimping object to the protruding portion.

In the crimping device having such a configuration, the position of the substrate held on the substrate holding table with respect to the substrate holding table is recognized and the protruding portion is supported by the backup portion. At this time, even if the posture of the board held on the board holding table with respect to the backup unit is rotated from the normal posture with respect to the backup unit to cause a rotation deviation, the board holding table is moved in the direction opposite to that direction. The rotation deviation can be eliminated by making a correction to rotate the protrusion, and the protrusion can be supported by the backup portion in a normal posture (see, for example, Patent Document 1 below).

Japanese Unexamined Patent Publication No. 2014-094666

However, in recent years, not only substrates with high rigidity such as glass panels but also substrates with extremely low rigidity such as organic EL panels are increasing. In a substrate having low rigidity, if the amount of protrusion from the board holding table is too large, the amount of downward bending of the protrusion becomes large and the backup portion cannot support the substrate. For this reason, a substrate with low rigidity has no choice but to reduce the amount of protrusion, and a rotation angle is required more than before. Depending on the situation, when the substrate holding table is corrected to rotate in order to eliminate the rotation deviation of the substrate, There is a problem that the rotation angle that can be corrected may be exceeded and that the end portion of the board holding table may interfere with the backup portion.

Therefore, the present invention provides a crimping device and a crimping method capable of preventing a correctionable rotation angle from being exceeded and interference between the board holding table and the backup portion when the protruding portion of the substrate is supported by the backup portion. The purpose.

The crimping device of the present invention supports a substrate holding table that holds the substrate in a state where a part of the substrate is projected in the horizontal direction, and a lower surface of a protruding portion that is a part of the substrate protruding from the substrate holding table. The backup portion, the table moving mechanism that moves the substrate holding table to support the lower surface of the protruding portion by the backup portion, and the crimping object are crimped to the upper surface of the protruding portion whose lower surface is supported by the backup portion. A crimping device provided with a crimping tool, the board position recognizing means for recognizing the position of the board with respect to the board holding table before the table moving mechanism supports the protruding portion on the backup part, and the board position. Based on the position of the board with respect to the board holding table recognized by the recognition means , the rotation angle of the rotation deviation of the board around the vertical axis from a predetermined normal posture with respect to the backup unit is obtained, and the board holding table is obtained. The projecting portion is supported by the backup unit based on whether or not the substrate holding table interferes with the backup unit when the substrate is rotated together with the substrate by the rotation angle in the direction opposite to the direction of the rotation deviation. The upper surface of the projecting portion is provided with a determination unit for determining whether or not the crimping object can be crimped based on whether or not the table moving mechanism can be crimped. When it is not determined that the crimping object can be crimped, the substrate holding table is moved so that the lower surface of the protruding portion is not supported by the backup portion.
Further, in the crimping device of the present invention, a substrate holding table that holds the substrate in a state where a part of the substrate is projected in the horizontal direction and a lower surface of a protruding portion that is a part of the substrate protruding from the substrate holding table. A crimping object is placed on a backup portion to be supported, a table moving mechanism for moving the substrate holding table to support the lower surface of the protruding portion on the backup portion, and an upper surface of the protruding portion whose lower surface is supported by the backup portion. A crimping device provided with a crimping tool for crimping, the table moving mechanism recognizing the position of the substrate held on the substrate holding table with respect to the substrate holding table before the protruding portion is supported by the backup portion. The crimping object can be crimped to the upper surface of the protruding portion based on the position of the substrate held on the substrate holding table recognized by the substrate position recognizing means and the position of the substrate with respect to the substrate holding table. The table moving mechanism is provided with a determination unit for determining whether or not, and when the determination unit does not determine that the crimping object can be crimped to the upper surface of the protruding portion, the table moving mechanism moves the substrate holding table. The lower surface of the protruding portion is not supported by the backup portion.

The crimping method of the present invention includes a substrate holding step of holding the substrate by a substrate holding table with a part of the substrate protruding in the horizontal direction, and moving the substrate holding table by a table moving mechanism to move the substrate holding table. A protrusion support step in which the lower surface of the protrusion, which is a part of the substrate protruding from the substrate, is supported by the backup portion, and a crimping step in which the crimping object is crimped to the upper surface of the protrusion whose lower surface is supported by the backup portion. The substrate position recognition step of recognizing the position of the substrate with respect to the substrate holding table and the substrate recognized in the substrate position recognition step before the protruding portion is supported by the backup portion. Based on the position of the substrate with respect to the holding table, the rotation angle of the rotation deviation of the substrate around the vertical axis from a predetermined normal posture with respect to the backup unit is obtained, and the substrate holding table is combined with the substrate in the direction of the rotation deviation. Based on whether or not the protruding portion can be supported by the backup unit based on whether or not the substrate holding table interferes with the backup unit when rotated by the rotation angle in the opposite direction to the above. The projection step is provided with a determination step of determining whether or not the crimping object can be crimped to the upper surface of the protrusion, and the protrusion support step cannot crimp the crimping object to the upper surface of the protrusion in the determination step. Do not execute if determined.
Further, the crimping method of the present invention includes a substrate holding step of holding the substrate by a substrate holding table with a part of the substrate protruding in the horizontal direction, and moving the substrate holding table by a table moving mechanism to move the substrate. A protrusion support step in which the lower surface of the protrusion, which is a part of the substrate protruding from the holding table, is supported by the backup portion, and crimping to crimp the object to be crimped to the upper surface of the protrusion whose lower surface is supported by the backup portion. A crimping method including a step of a substrate position recognition step of recognizing the position of the substrate held on the substrate holding table with respect to the substrate holding table before the protruding portion is supported by the backup portion. A determination step of determining whether or not the crimping object can be crimped to the upper surface of the protruding portion based on the position of the substrate held on the board holding table recognized in the board position recognition step with respect to the board holding table. The projection support step is not executed when it is determined in the determination step that the crimping object cannot be crimped to the upper surface of the protrusion.

According to the present invention, when the protruding portion of the substrate is supported by the backup portion, it is possible to prevent the rotation angle that can be corrected from being exceeded and the substrate holding table and the backup portion from interfering with each other.

Perspective view of the crimping device according to the embodiment of the present invention. Perspective view of the substrate transfer portion provided in the crimping apparatus according to the embodiment of the present invention. Perspective view of the substrate mounting portion and the crimping mechanism portion provided in the crimping device according to the embodiment of the present invention. A block diagram showing a control system of a crimping device according to an embodiment of the present invention. A flowchart showing the flow of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. (A) (b) Perspective view illustrating the operation of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. A plan view showing a state in which a substrate is held by a substrate holding table executed by a crimping apparatus according to an embodiment of the present invention. (A) (b) Perspective view illustrating the operation of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. A perspective view showing a state in which a substrate mark provided on a substrate is imaged by a camera provided in the crimping apparatus according to the embodiment of the present invention. (A) (b) (c) A plan view illustrating the operation of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. A perspective view illustrating the operation of the crimping operation performed by the crimping device according to the embodiment of the present invention. (A) (b) (c) Side view illustrating the operation of the crimping process of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. (A) (b) Perspective view illustrating the operation of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. (A) (b) (c) A plan view illustrating the operation of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention. (A) (b) (c) A plan view illustrating the operation of the crimping operation performed by the crimping apparatus according to the embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The crimping device 1 shown in FIG. 1 carries in a substrate 2 sent from a temporary crimping device (not shown) arranged on the upstream process side in the manufacture of an organic EL panel or the like, and the substrate 2 is carried by the temporary crimping device. This is a main crimping device that presses a component 3 which is a crimping object temporarily crimped to the edge of the substrate 2 against a substrate 2 to crimp (main crimp). In the present embodiment, for convenience of explanation, the left-right direction of the crimping device 1 as seen by the operator is the X-axis direction, the front-back direction as seen by the operator is the Y-axis direction, and the vertical direction is the Z-axis direction. Further, in the front-rear direction (Y-axis direction), the front side seen from the worker is referred to as the front side of the crimping device 1, and the back side seen from the worker is referred to as the rear side of the crimping device 1.

In FIG. 1, the crimping device 1 has a substrate transfer portion 11, a substrate mounting portion 12, and a crimping mechanism portion 13. In FIG. 2, the substrate transfer unit 11 is attached to a transfer body moving table 21 extending in the X-axis direction, a moving base 22 that can move on the transfer body moving table 21 in the X-axis direction, and a moving base 22. It is provided with two arm units 23. Each arm unit 23 has two suction arms 24 extending rearwardly and having a plurality of suction portions 24a at the tip end portion.

Each arm unit 23 attracts the substrate 2 to the suction portions 24a of the two suction arms 24 and holds the substrate (FIG. 2). The substrate transfer unit 11 transfers the substrate 2 in the X-axis direction by moving the moving base 22 on the transfer body moving table 21 in a state where the substrate 2 is held by each of the two arm units 23.

In FIG. 3, the board mounting unit 12 includes a table moving mechanism 31 and two board holding tables 32. The table moving mechanism 31 includes an X-axis base 41, a Y-axis base 42, a front-back moving base 43, a table base elevating motor 44, a table base 45, and two swivel motors 46.

The X-axis base 41 extends behind the transfer body moving table 21 in the X-axis direction, and moves the Y-axis base 42 in the X-axis direction. The Y-axis base 42 extends in the Y-axis direction, and moves the front-back movement base 43 in the Y-axis direction (front-back direction). The table base elevating motor 44 is attached to the front-rear moving base 43 to elevate and elevate the table base 45. The two swivel motors 46 are provided on the table base 45 side by side in the X-axis direction. The two board holding tables 32 are attached to the two swivel motors 46, respectively.

In FIG. 3, each substrate holding table 32 includes a substrate suction port 32K opened on the upper surface. Each substrate holding table 32 sucks and holds the lower surface of the substrate 2 transferred from the upstream process side by the substrate transfer unit 11 at the substrate suction port 32K.

The table moving mechanism 31 moves the table base 45 with respect to the X-axis base 41 by moving the Y-axis base 42 in the X-axis direction and moving the front-back movement base 43 with respect to the Y-axis base 42 in the Y-axis direction. (That is, the two substrate holding tables 32) are moved inward in the XY plane. Further, the table moving mechanism 31 moves the table base 45 (that is, the two board holding tables 32) in the Z-axis direction by the table base elevating motor 44, and moves the two board holding tables 32 to the XY planes by the two swivel motors 46. Turn inside. As a result, the table moving mechanism 31 can move the two boards 2 held by the two board holding tables 32 in the XY plane direction, move them in the Z axis direction, and rotate them in the XY plane.

In FIG. 3, the crimping mechanism portion 13 is installed behind the substrate mounting portion 12, and has two backup portions 52 on the base 51. The two backup units 52 are arranged in the X-axis direction, and the distance between the two backup units 52 corresponds to the distance between the two substrate holding tables 32.

In FIG. 3, a camera 53 (FIG. 4) with the image pickup optical axis directed downward is provided at a position near each of the two backup units 52 of the crimping mechanism unit 13 corresponding to each backup unit 52. The camera 53 moves in the X-axis direction and images two substrate marks 2 m (FIG. 2) located on the edge of the substrate 2 with the component 3 sandwiched between them from above.

In FIG. 3, a gate-shaped frame 61 is provided on the base 51. A tool base 63 is attached to the portal frame 61 so as to be able to move up and down. Two crimping cylinders 64 are attached to both ends of the tool base 63 in the X-axis direction. The two crimp cylinders 64 each raise and lower the crimp tool 65 below the tool base 63. The two crimping tools 65 are located above each of the two backup units 52.

In FIG. 4, the crimping device 1 includes a control device 70. The control device 70 controls the holding and transfer of the substrate 2 by the substrate transfer unit 11. The control device 70 controls the holding and movement of the board 2 by the board mounting unit 12. The control device 70 controls the raising and lowering operation of the tool base 63 and the two crimping tools 65 by the crimping mechanism portion 13. Further, the control device 70 controls the imaging operation of the camera 53.

Next, a procedure for performing a crimping operation (crimping method by the crimping device 1) in which the crimping device 1 crimps the component 3 to the substrate 2 will be described using the flowchart shown in FIG. In this crimping operation, first, the board transfer unit 11 holds the two boards 2 on which the component 3 is temporarily crimped from the device on the upstream process side (here, the temporary crimping device) by the two arm units 23 and crimps them. It is transferred to the apparatus 1 (FIG. 6A) and is located above the two substrate holding tables 32. When the two boards 2 are located above the two board holding tables 32, the operation of the table base elevating motor 44 raises the two board holding tables 32 and approaches the corresponding boards 2 from below. Then, the two substrate holding tables 32 each suck and hold the substrate 2 through the substrate suction port 32K (FIG. 6 (b); the substrate holding step of step ST1 shown in FIG. 5).

When each board holding table 32 holds the board 2 in the board holding step, a part of the trailing edge side of the board 2 protrudes horizontally (here, rearward) from the trailing edge of the board holding table 32. (Fig. 7). A part of the substrate 2 (the shaded area in each of the two substrates 2 shown in FIG. 7) that protrudes rearward from the trailing edge of the substrate holding table 32 is hereinafter referred to as “projecting portion 2T”. Refer to. The component 3 is temporarily crimped to the protruding portion 2T of each substrate 2.

After the two boards 2 are held by the two board holding tables 32, the board mounting unit 12 moves the front-back movement base 43 backward (FIG. 8A) to make the two board marks 2m of each board 2. It is located below the movement path of the camera 53 in the X-axis direction. When the two substrate marks 2m are located below the movement path of the camera 53 in the X-axis direction, the camera 53 moves in the X-axis direction and images the two substrate marks 2m of the substrate 2 from above (FIG. 9).

When the camera 53 captures the two substrate marks 2m, the substrate position recognition unit 70a (FIG. 4) of the control device 70 performs image recognition of the image data of the two substrate marks 2m sent from the camera 53, and the camera 53. The position of the board mark 2 m is calculated with reference to. Then, based on the calculated position of the board mark 2m and the coordinate position of the board holding table 32 set by the control data of the table moving mechanism 31, the position of each board 2 with respect to the board holding table 32 is recognized (step). ST2 board position recognition process).

As described above, in the present embodiment, the board position recognition unit 70a of the camera 53 and the control device 70 is a board position recognition means 81 that recognizes the position of the board 2 with respect to the board holding table 32 (FIG. 4).

The determination unit 70b (FIG. 4) of the control device 70 determines whether or not the component 3 can be crimped to the upper surface of the protrusion 2T. Here, the determination as to whether or not the component 3 can be crimped to the upper surface of the projecting portion 2T is conventionally executed after the projecting portion 2T of the substrate 2 is supported by the backup portion 52 and before the component 3 is crimped by the crimping tool 65. It had been. However, whether or not the component 3 can be crimped to the upper surface of the protrusion 2T depends on how the substrate 2 is held by the substrate holding table 32. Therefore, depending on how the board 2 is held by the board holding table 32, the limit that can be corrected by the board holding table 32 or the crimping tool 65 may be exceeded. In such a case, it can be determined that the component 3 cannot be crimped to the upper surface of the protruding portion 2T before the protruding portion 2T of the substrate 2 is supported by the backup portion 52. That is, the determination unit 70b is required to determine whether or not the component 3 can be crimped to the upper surface of the protrusion 2T, in other words, whether or not the protrusion 2T can be supported by the backup unit 52.

When the board position recognition unit 70a recognizes the position of each board 2 with respect to the board holding table 32, the determination unit 70b determines the position of each board 2 recognized by the board position recognition unit 70a and the backup unit 52 stored in advance. Based on the position, it is determined whether or not the protruding portions 2T of the two substrates 2 can be supported by the backup portion 52 (determination step of step ST3). In this determination step, the determination unit 70b obtains, for example, the protruding state of the protruding portion 2T from the substrate holding table 32 based on the position of the substrate 2 recognized by the substrate position recognition unit 70a, and projects based on the protruding state. It is determined whether or not the unit 2T can be supported by the backup unit 52.

Specifically, the determination unit 70b first projects from the protruding state of the protruding portion 2T to the rear from the trailing edge of the board holding table 32 at the left end of the trailing edge of the substrate 2 (protruding in the Y-axis direction). The amount YL) and the amount of protrusion backward from the trailing edge of the substrate holding table 32 at the right end of the trailing edge of the substrate 2 (protrusion amount YR in the Y-axis direction) are obtained (FIG. 10A). When the protrusions YL and YR are obtained, the rotational deviation of the substrate 2 around the Z axis from the normal posture with respect to the backup unit 52 (the posture in which the trailing edge of the board 2 is parallel to the X axis) is obtained from these protrusions YL and YR. The rotation angle θ (FIG. 10 (a)) of

When the determination unit 70b obtains the rotation angle θ of the rotation deviation, the substrate holding table 32 is rotated together with the substrate 2 in a direction opposite to the direction of the rotation deviation from the obtained rotation angle θ and the protrusion amounts YL and YR. It is assumed that the state is rotated by θ (see the substrate 2 and the substrate holding table 32 shown by the alternate long and short dash line in FIG. 10B). Then, the minimum value Ymin of the amount of protrusion (projection amount in the Y-axis direction) of the trailing edge of the substrate 2 from the trailing edge of the substrate holding table 32 to the rear in the assumed state is calculated (FIG. 10 (b)). ..

After calculating the minimum value Ymin, the calculated minimum value Ymin is the support length YB which is the dimension in the Y-axis direction of the portion defined as the region for supporting the protrusion of the substrate 2 in the backup unit 52 (FIG. 10 (FIG. 10). It is determined whether or not it is larger than a)). Then, when the minimum value Ymin exceeds the support length YB (minimum value Ymin> support length YB), it is determined that the protrusion 2T can be supported by the backup unit 52. On the other hand, when the minimum value Ymin does not exceed the support length YB (minimum value Ymin ≦ support length YB), it is determined that the protrusion 2T cannot be supported by the backup unit 52. The support length YB may be provided with a predetermined margin so that the support length YB has a margin.

When the determination unit 70b determines in the determination step of step ST3 that the protrusion 2T can be supported by the backup unit 52, the rotation angle θ of the rotation deviation is set as the correction angle (correction angle in step ST4). Setting process). Then, the table moving mechanism 31 is once moved forward (FIG. 8 (b)), and then the substrate holding table 32 is rotated using the correction angle (= θ) set in the correction angle setting step (FIG. 8). 10 (c)), the lower surface of the protruding portion 2T is supported by the backup portion 52 by moving the substrate holding table 32 backward (FIGS. 10 (c) and 11). On the other hand, when it is determined by the determination unit 70b that the protrusion 2T cannot be supported by the backup unit 52 (that is, when it is not determined that the component 3 can be crimped to the upper surface of the protrusion 2T), the substrate is held. The table 32 is not moved to support the lower surface of the protrusion 2T by the backup portion 52 (the protrusion support step in step ST5). In this protrusion support step, since it is known in advance that the minimum value Ymin> the support length YB, the protrusion 2T can always be supported by the backup portion 52.

When the protruding portion 2T is supported by the backup portion 52 in this way, the crimping cylinder 64 operates to lower the crimping tool 65. Then, by pressing the component 3 together with the substrate 2 against the backup portion 52, the component 3 is crimped to the protruding portion 2T (FIG. 12 (a) → FIG. 12 (b) → FIG. 12 (c). Crimping step of step ST6). .. The crimping process is sequentially performed for each substrate 2 (FIG. 13 (a) → FIG. 13 (b)). The crimping step may be performed on the two substrates 2 at the same time.

On the other hand, in the determination step of step ST3, since the minimum value Ymin did not exceed the support length YB (minimum value Ymin ≦ support length YB), the determination unit 70b causes the backup unit 52 to support the protrusion 2T. If it is determined that this is not possible, the protrusion 2T of the substrate 2 is backed up by executing the relative position changing step (steps ST7 to ST10 below) for changing the relative position of the substrate 2 with respect to the substrate holding table 32. It can be supported by the part 52.

In the relative position changing step, the amount of change in the relative position of the substrate 2 with respect to the substrate holding table 32 is obtained based on the protruding state of the protruding portion 2T from the substrate holding table 32. Specifically, first, the relative position change amount calculation unit 70c (FIG. 4) of the control device 70 determines the minimum value Ymin of the protrusion amount of the protrusion 2T of the board 2 with respect to the board holding table 32 located at the current position. Is the position of the substrate 2 (see the substrate 2 shown by the alternate long and short dash line in FIG. 14A) in which the support length YB of the backup unit 52 is exceeded (minimum value Ymin> support length YB). It is assumed from the protruding state of the protruding portion 2T of the substrate 2. Then, the assumed protruding state of the protruding portion 2T of the substrate 2 is compared with the current protruding state of the protruding portion 2T of the current substrate 2 (see the substrate 2 shown by the solid line in FIG. 14A). The substrate holding table 32 determines the amount of movement of the substrate 2 (movement amount in the X-axis direction, movement amount in the Y-axis direction, and rotation angle θ around the Z-axis) required to position the substrate 2 at the position of the substrate 2 assuming the substrate 2. It is calculated as the relative position change amount (relative position change amount) of the substrate 2 with respect to (step ST7 relative position change amount calculation step). The relative position change amount is calculated for each of the two substrates 2.

After the relative position change amount calculation unit 70c calculates the relative position change amount, the table moving mechanism 31 temporarily moves the two substrates 2 (that is, the front-back movement base 43) forward (FIG. 14 (b)). When the two boards 2 move forward, the board transfer unit 11 attracts and holds the two boards 2 by the two arm units 23 (FIG. 14 (c)), and the board holding table 32 is lowered. Then, the two substrates 2 are retracted above the substrate holding table 32 (the substrate retracting step of step ST8).

When the two boards 2 are retracted above the board holding table 32, the two board holding tables 32 each have a relative position change amount calculated by the relative position change amount calculation unit 70c with respect to the calculated direction. After moving the substrate holding table 32 in the opposite direction (FIG. 15A, the substrate moving step in step ST9), the substrate holding table 32 is raised and the substrate 2 is returned to the substrate holding table 32 (step). ST10 substrate return process). These substrate moving steps and substrate returning steps are sequentially performed on the two substrates 2. This completes the relative position change process. In this relative position changing step, the relative position change amount calculation unit 70c, the board transfer unit 11 and the table moving mechanism 31 of the control device 70 serve as relative position changing means 82 for changing the relative position of the board 2 with respect to the board holding table 32. (Fig. 4).

After changing the relative position of the substrate 2 with respect to the substrate holding table 32 in the relative position changing step, the table moving mechanism 31 changes the relative position by the rotation angle θ calculated in the relative position changing amount calculation step of step ST7. The board holding table 32 is rotated in the direction opposite to that when the above is executed, and the board holding table 32 is returned to the original direction (FIG. 15 (b)). As a result, the substrate 2 also rotates by the rotation angle θ. Then, the table moving mechanism 31 is moved backward to execute the substrate position recognition step of step ST2 described above, and through the determination step of step ST3 and the correction angle setting step of step ST4, the lower surface of the protruding portion 2T is backed up. It is supported by 52 (FIG. 15 (c). Projection support step in step ST5).

In this protrusion support step, since it is known in advance that the minimum value Ymin> the support length YB, the protrusion 2T can always be supported by the backup portion 52. Therefore, even if it is determined in the first determination step that the protrusion 2T cannot be supported by the backup unit 52, the protrusion 2T can be supported by the backup unit 52.

When the protruding portion 2T is supported by the backup portion 52, the crimping cylinder 64 is activated to lower the crimping tool 65, and the component 3 is pressed against the backup portion 52 together with the substrate 2 to crimp the component 3 to the projecting portion 2T ( FIG. 12 (a) → FIG. 12 (b) → FIG. 12 (c). Crimping step of step ST6). The crimping process is sequentially performed for each substrate 2 (FIG. 13 (a) → FIG. 13 (b)).

As described above, in the crimping method using the crimping device 1 and the crimping device 1 in the present embodiment, the table moving mechanism 31 moves the substrate holding table 32 (the lower surface of the protruding portion 2T of the substrate 2 is supported by the backup portion 52). The position of the substrate 2 with respect to the substrate holding table 32 is recognized (board position recognition step), and the protrusion 2T is supported by the backup unit 52 based on the recognized position of the substrate 2 with respect to the substrate holding table 32. Judge whether it can be done (judgment process). Then, when it is determined that the protrusion 2T can be supported by the backup unit 52, the protrusion 2T is supported by the backup unit 52 (projection support step). Therefore, when the protruding portion 2T of the substrate 2 is supported by the backup portion 52, it is possible to prevent the rotation angle that can be corrected from being exceeded and the substrate holding table 32 and the backup portion 52 from interfering with each other.

Further, in the crimping device 1 and the crimping method in the present embodiment, when it is determined that the protruding portion 2T cannot be supported by the backup portion 52, the relative position of the substrate 2 with respect to the substrate holding table 32 is changed, and then the position is changed. Since the protrusion 2T is supported by the backup portion 52, the protrusion 2T can be reliably supported by the backup portion 52 and the component 3 can be crimped to the substrate 2.

Although the present embodiment has been described so far, the present invention is not limited to the above. For example, in the above-described embodiment, whether or not the protrusion 2T of the substrate 2 can be supported by the backup unit 52 based on whether or not the end portion of the substrate holding table 32 interferes with the backup unit 52. Although the judgment has been made, the judgment may be made based on whether or not the protruding portions 2T of the two substrates 2 can be supported by the two backup portions 52 at the same time.

Further, in the above-described embodiment, the swivel motor 46 is attached to each of the board holding tables 32, but the swivel motor 46 may be attached to the front-rear movement base 43. The swivel motor 46 can swivel a plurality of substrate holding tables 32 at the same time via the front-back movement base 43. In such a case, the determination unit 70b determines whether or not the end portion of the substrate holding table 32 interferes with the backup unit 52 for all of the plurality of board holding tables 32. Therefore, even if one board holding table 32 can be swiveled and supported by the correction angle θ, it cannot be supported by another board holding table 32 (in the other board holding table 32). (When it interferes with the backup unit 52 when swiveled at the correction angle θ), the steps of step ST7 to step ST10 are performed.

Further, the determination unit 70b may determine whether or not a plurality of the substrates 2 to be crimped can be crimped at the same time, in addition to determining whether or not the end portion of the substrate holding table 32 interferes with the backup unit 52. If a plurality of substrates 2 cannot be crimped at the same time, the steps of steps ST7 to ST10 are carried out in the same manner as described above. When the substrate 2 is crimped at the same time, in addition to the above-mentioned minimum value Ymin> support length YB, it is also considered that the parallelism of the edges of the plurality of substrates 2 is within a predetermined range.

Further, in the above-described embodiment, the present crimping device is exemplified as an example of the crimping device for crimping the crimping object (part 3) to the protruding portion 2T of the substrate 2, but the crimping device and the crimping method of the present invention are other. It can also be applied to a crimping device (ACF pasting device, temporary crimping device, etc.). Therefore, as an example of the crimping object, a chip component, a flexible printed circuit board, an ACF, or the like can be mentioned.

Provided are a crimping device and a crimping method capable of preventing the protrusion of the substrate from exceeding the correctable rotation angle and interfering with the substrate holding table and the backup portion when the backup portion is supported.

1 Crimping device 2 Board 2T Protruding part 3 Parts (crimping target)
11 Board transfer unit 31 Table movement mechanism 32 Board holding table 52 Backup unit 65 Crimping tool 70b Judgment unit 81 Board position recognition means 82 Relative position change means

Claims (14)

A board holding table that holds the board with a part of the board protruding in the horizontal direction, a backup part that supports the lower surface of the protruding part that is a part of the board protruding from the board holding table, and the board holding. A crimping tool provided with a table moving mechanism for moving a table to support the lower surface of the protruding portion to the backup portion and a crimping tool for crimping an object to be crimped to the upper surface of the protruding portion whose lower surface is supported by the backup portion. It ’s a device,
A substrate position recognition means for recognizing the position of the substrate with respect to the substrate holding table before the table moving mechanism supports the protrusion on the backup portion.
Based on the position of the board with respect to the board holding table recognized by the board position recognition means , the rotation angle of the rotation deviation of the board around the vertical axis from a predetermined normal posture with respect to the backup unit is obtained, and the board is obtained. When the holding table is rotated together with the substrate by the rotation angle in the direction opposite to the direction of the rotation deviation, the protrusion is used as the backup portion based on whether or not the substrate holding table interferes with the backup portion. The upper surface of the protruding portion is provided with a determination unit for determining whether or not the crimping object can be crimped based on whether or not the object can be crimped.
When the determination unit does not determine that the object to be crimped can be crimped to the upper surface of the protrusion, the table moving mechanism moves the substrate holding table to support the lower surface of the protrusion to the backup portion. A crimping device that does not allow. The determination unit is a state in which the protrusion is projected from the board holding table when the board holding table is rotated together with the board by the rotation angle in a direction opposite to the direction of the rotation deviation, and the backup unit. The crimping device according to claim 1 , wherein it is determined whether or not the protrusion can be supported by the backup portion based on the size of the region that supports the protrusion. The relative position changing means for changing the relative position of the board with respect to the board holding table is provided, and when the determination unit determines that the protrusion cannot be supported by the backup unit, the relative position changing means may be used. The crimping according to claim 1 or 2 , after changing the relative position of the substrate with respect to the substrate holding table, the table moving mechanism moves the substrate holding table to support the lower surface of the protruding portion by the backup portion. Device. The relative position changing means moves the board holding table in a state where the board held in the board holding table is retracted above the board holding table to change the relative position of the board with respect to the board holding table. The crimping device according to claim 3 , wherein the substrate is then returned to the substrate holding table. The crimping device according to claim 4 , wherein the substrate is retracted by a substrate transfer unit that transfers the substrate to the substrate holding table. The crimping apparatus according to any one of claims 3 to 5 , wherein the amount of change in the relative position of the substrate with respect to the substrate holding table is obtained based on the protruding state of the protruding portion from the substrate holding table. One of the substrate holding steps in which the substrate is held by the substrate holding table in a state where a part of the substrate is projected in the horizontal direction, and the substrate which is moved from the substrate holding table by moving the substrate holding table by the table moving mechanism. A crimping method including a projecting portion supporting step of supporting the lower surface of a protruding portion, which is a portion, to a backup portion, and a crimping step of crimping an object to be crimped to the upper surface of the protruding portion whose lower surface is supported by the backup portion. ,
A substrate position recognition step of recognizing the position of the substrate with respect to the substrate holding table before the protrusion is supported by the backup portion.
Based on the position of the board with respect to the board holding table recognized in the board position recognition step, the rotation angle of the rotation deviation of the board around the vertical axis from a predetermined regular posture with respect to the backup unit is obtained, and the board holding. When the table is rotated together with the substrate by the rotation angle in the direction opposite to the direction of the rotation deviation, the protrusion is used as the backup portion based on whether or not the substrate holding table interferes with the backup portion. It is provided with a determination step of determining whether or not the crimping object can be crimped to the upper surface of the protruding portion based on whether or not it can be supported .
The protrusion support step is a crimping method that is not executed when it is determined in the determination step that the crimping object cannot be crimped to the upper surface of the protrusion. In the determination step, when the substrate holding table is rotated together with the substrate by the rotation angle in a direction opposite to the direction of the rotation deviation, the protruding portion is projected from the substrate holding table and the backup unit. The crimping method according to claim 7 , wherein it is determined whether or not the protrusion can be supported by the backup portion based on the size of the region that supports the protrusion. When it is determined in the determination step that the protrusion cannot be supported by the backup unit, the protrusion support step is performed after executing the relative position change step of changing the relative position of the substrate with respect to the substrate holding table. The crimping method according to claim 7 or 8 . To change the relative position of the substrate with respect to the substrate holding table in the relative position changing step, the substrate holding table is moved in a state where the substrate held by the board holding table is retracted above the board holding table. The crimping method according to claim 9 , wherein the substrate is then returned to the substrate holding table. The crimping method according to claim 10 , wherein the substrate is retracted by a substrate transfer unit that transfers the substrate to the substrate holding table. The crimping method according to any one of claims 9 to 11 , wherein the amount of change in the relative position of the substrate with respect to the substrate holding table is obtained based on the protruding state of the protruding portion from the substrate holding table. A board holding table that holds the board with a part of the board protruding in the horizontal direction, a backup part that supports the lower surface of the protruding part that is a part of the board protruding from the board holding table, and the board holding. A crimping tool provided with a table moving mechanism for moving a table to support the lower surface of the protruding portion to the backup portion and a crimping tool for crimping an object to be crimped to the upper surface of the protruding portion whose lower surface is supported by the backup portion. It ’s a device,
A substrate position recognition means for recognizing the position of the substrate held on the substrate holding table with respect to the substrate holding table before the table moving mechanism supports the protruding portion on the backup portion.
A determination unit for determining whether or not the crimping object can be crimped to the upper surface of the protruding portion based on the position of the substrate held on the board holding table recognized by the board position recognizing means with respect to the board holding table. And with
When the determination unit does not determine that the object to be crimped can be crimped to the upper surface of the protrusion, the table moving mechanism moves the substrate holding table to support the lower surface of the protrusion to the backup portion. A crimping device that does not allow. One of the substrate holding steps in which the substrate is held by the substrate holding table in a state where a part of the substrate is projected in the horizontal direction, and the substrate which is moved from the substrate holding table by moving the substrate holding table by the table moving mechanism. A crimping method including a projecting portion supporting step of supporting the lower surface of a protruding portion, which is a portion, to a backup portion, and a crimping step of crimping an object to be crimped to the upper surface of the protruding portion whose lower surface is supported by the backup portion. ,
A substrate position recognition step of recognizing the position of the substrate held on the substrate holding table with respect to the substrate holding table before the protrusion is supported by the backup portion.
A determination step of determining whether or not the crimping object can be crimped to the upper surface of the protruding portion based on the position of the substrate held on the board holding table recognized in the board position recognition step with respect to the board holding table. Equipped with
The protrusion support step is a crimping method that is not executed when it is determined in the determination step that the crimping object cannot be crimped to the upper surface of the protrusion.

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