JP5779386B2 - Electrical component mounting machine - Google Patents

Description

The present invention relates to an electric-component mounting apparatus for mounting an electric component on a circuit board.

  The electrical circuit is manufactured by mounting electrical components on a circuit board. For the purpose of improving the mounting accuracy of the electrical component, when mounting this electrical component (hereinafter sometimes referred to as “component mounting”), for example, as described in the following patent document, The held electrical component is imaged from below by the component imaging device, and the substrate reference mark attached to the surface of the substrate fixed by the substrate fixing device is imaged by the substrate imaging device, and imaging data obtained by the imaging Then, the electrical component is mounted at an appropriate mounting position on the circuit board. In addition, after the component is mounted, the mounting position is also confirmed.

JP-A-11-168299

While higher accuracy is required for component mounting, the inventor will improve the practicality of the electrical component mounting machine by improving the above-described methods related to imaging of electrical components and circuit board surfaces and methods related to confirmation of mounting positions. I got the knowledge that I can do it. The present invention is based on this finding, and an object of the present invention is to provide a highly practical electric component mounting machine .

To solve the above problems, the electrical component mounting apparatus of the present invention, the predetermined imaging device moving device, that is, with the mounting heads are disposed in a portion that is removably attached to at least the board imaging device and the component imaging both the device and the support, each of them, it et al parts and holder lower position located below the holder, a movable imaging device moving device between a retracted position which is retracted from its position It is provided with.

According to the electrical component mounting machine of the present invention, in a state where the electrical component is located above the mounting portion of the circuit board, both the imaging data from above the mounting portion and the imaging data from below the electrical component are obtained. The electrical component can be acquired based on the acquired imaging data without moving the mounting head by the head moving device by retracting both the board imaging device and the component imaging device after acquiring the imaging data. It can be mounted on the mounting site. As a result, it is possible to perform component mounting with high accuracy. Furthermore, in the electric component mounting machine according to the present invention, when the component holder is moved above the mounting portion of the circuit board fixed by the substrate fixing device, the board imaging device and the component imaging device supported by the imaging device moving device, Both of them are moved together with the mounting head by the head moving device, and in the moved state, the image pickup device moving device is moved between the lower position of the holder and the retracted position, so that the board imaging device and the parts are moved. Both of the image pickup apparatus and the image pickup apparatus can be appropriately positioned at the holder lower position. This contributes to increasing the accuracy of component mounting.

Aspects of the Invention

  In the following, some aspects of the invention that can be claimed in the present application (hereinafter sometimes referred to as “claimable invention”) will be exemplified and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is merely for the purpose of facilitating the understanding of the claimable inventions, and is not intended to limit the combinations of the constituent elements constituting those inventions to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which some constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention. Some of the aspects of the claimable invention correspond to the invention according to the claims described in the claims.

Specifically, the items (2) and (4) are combined, and the limitation that “the mounting head is replaceable” is added to claim 1, (3) to claim 2, (7) is in claim 3, (8) is in claim 4, (9) is in claim 5, (10) is in claim 6, (11) is in claim 7, (12) term in the claim 8, their respective phase-skilled.

(1) a board fixing device for fixing a circuit board;
A mounting head for mounting the electrical component held on the circuit board fixed to the board fixing device, having a component holder for holding the electrical component;
A head mounting body to which the mounting head is mounted;
A head moving device that moves the mounting head along the surface of the circuit board fixed to the substrate fixing device by moving the head mounting body;
A board imaging device for imaging the surface of the circuit board fixed to the board fixing device from above the circuit board;
A component imaging device for imaging an electrical component held by the component holder of the mounting head from below, and supporting at least one of the board imaging device and the component imaging device, An electrical component mounting machine comprising: an imaging device moving device that is movable between a holder lower position positioned below the component holder and a retracted position retracted from the position.

  In the electrical component mounting machine of this section, for example, in a state where the electrical component held by the component holder is located above an arbitrary part of the circuit board fixed by the substrate fixing device, the board imaging device and the component imaging device It is possible to configure one of the positions below the holder, that is, between the portion of the circuit board and the electrical component held by the component holder. With such a configuration, as will be described later, in the state where the electrical component is located above the portion of the circuit board where the electrical component is mounted (hereinafter referred to as “mounting portion”), Image data or image data from below the electrical component can be acquired, and after the acquisition of the imaging data, the mounting head is moved by the head moving device by retracting one of the substrate imaging device and the component imaging device The electrical component can be mounted on the mounting site based on the acquired imaging data. As a result, it is possible to perform component mounting with high accuracy. This is effective when mounting an electrical component that requires particularly high mounting accuracy, such as an electrical component having a plurality of bumps described later.

  The “imaging device moving device” described in this section may support both the board imaging device and the component imaging device, as will be described later. When the imaging device moving device supports only the board imaging device, the electrical component mounting machine of this section can be configured such that the component imaging device is fixed to any part of the electrical component mounting machine, When only the component imaging device is supported, the substrate imaging device can be configured to be fixed to the mounting head or the head mounting body. In addition, when the electrical component mounting machine of this section includes two or more board imaging devices or two or more component imaging devices, only one of them is supported by the imaging device moving device and moved to the lower position of the holder. Can be configured.

  In addition, the “imaging device moving device” refers to one of the board imaging device and the component imaging device (hereinafter sometimes referred to as “one imaging device” and the other as “the other imaging device”) in one direction. For example, as in the case of an XY type moving device, it may be moved in an arbitrary direction within one plane. When it is moved only in one direction, it may be moved linearly or may be moved so as to rotate around any position. Further, in the “imaging device moving device”, only one retraction position is set relative to the lower position of the holder with respect to one lower position of the holder, and one imaging device is placed below the holder. It may be configured to move between a position and a retracted position, and is configured to move between a plurality of retracted positions that can be set or arbitrary with respect to the holder lower position. It may be. Further, when the mounting head has a plurality of electric component holders, one of the images is taken between a plurality of holder lower positions set in correspondence with the plurality of electric component holders and a retracted position. It may be configured to move the device. Note that “positioning the imaging device below the component holder” strictly means that the light receiving unit of the imaging device is positioned below the component holder.

(2) The imaging device moving device is
The electrical component mounting machine according to (1), which is disposed on the mounting head or the head mounting body.

  In the electrical component mounting machine of this section, the mounting head is moved by the head moving device, so that the electrical component held by the component holder is positioned above the mounting site. Can move one imaging device between the lower position of the holder and the retracted position by moving the imaging device with respect to the mounting head. When the head moving device is, for example, an XY robot type moving device, a ball screw mechanism that moves the mounting head in the X direction or the Y direction is generally employed. Even if the electrical component is positioned above the mounting site due to subtle bending of the screw rod constituting the ball screw mechanism or variation due to the position of the screw pitch, a certain amount of deviation occurs from the proper position. there is a possibility. Similarly, when the imaging device moving device is an XY robot type moving device different from the head moving device, even if one imaging device is positioned at the holder lower position, A certain amount of deviation may occur from an appropriate position. In the electrical component mounting machine of this section, when the component holder is moved above the mounting portion of the circuit board fixed by the substrate fixing device, one of the imaging devices supported by the imaging device moving device is a head together with the mounting head. If the image pickup device moving device is moved between the holder lower position and the retracted position by the image pickup device moving device in the moved state, the one image pickup device is positioned at an appropriate holder lower position. It becomes possible to make it. In short, even if the component holder is located above any part of the circuit board, for example, one imaging device can be positioned immediately below (directly below) the component holder. is there. This contributes to increasing the mounting accuracy of electrical components. When the mounting head is replaceably attached to the head mounting body, the imaging device moving device is attached to the head mounting body in consideration of the advantage that the imaging device can be shared by any mounting head. It is desirable to be disposed.

(3) The imaging device moving device is
Item (1) or Item (2), which has a vertical displacement mechanism capable of displacing one of the board imaging device and the component imaging device in the vertical direction in a state where one of them is positioned below the holder. Electric component mounting machine.

  The electrical component mounting machine of this section is excellent in convenience because it can easily cope with a difference in height (level) of the mounting site, a difference in thickness of the electrical component, etc. in imaging by one imaging device. If it explains in detail using a specific example, when one imaging device supported by the imaging device moving device is positioned at a lower position of the holder, the electrical component held by the component holder and the board fixing device It will be located between the fixed circuit board. Accordingly, since the distance between the electric component and the circuit board is relatively small, one of the imaging devices is required to be compact. Under this requirement, one imaging device may be forced to be an imaging device whose focal length cannot be adjusted, that is, a fixed focus type imaging device. Even in such an imaging apparatus, it is possible to obtain imaging data of an in-focus image with respect to mounting parts having different heights and electrical parts having different thicknesses by the vertical displacement mechanism. . The “vertical displacement mechanism” may be configured to be displaced in the vertical direction only when one of the imaging devices is positioned at the holder lower position, and between the holder lower position and the retracted position. Any of these positions may be configured to be displaced in the vertical direction.

  (4) The image pickup device moving device supports the other of the board image pickup device and the component image pickup device, and the other is a holder lower position where it is located below the component holder, The electrical component mounting machine according to any one of (1) to (3), wherein the electrical component mounting machine is configured to move between a retracted position retracted from a position.

  In the electrical component mounting machine of this section, in a state where the electrical component held by the component holder is located above the mounting site on the circuit board fixed by the board fixing device, the imaging data of the mounting site and the electrical data Since it is possible to acquire both of the imaging data of the parts, it becomes more practical. Note that the imaging device moving device in this section may be a device that moves the board imaging device and the component imaging device integrally as will be described later, and a moving mechanism that moves the board imaging device. And a moving mechanism for moving the component imaging device, that is, two moving mechanisms may be provided to move them independently of each other.

  (5) The electrical component mounting machine according to (4), wherein the imaging device moving device is configured to integrally move the board imaging device and the component imaging device.

  The electrical component mounting machine of this section can be interpreted as a mounting machine configured such that the imaging device moving device moves both of the two imaging devices by one moving mechanism. In the electrical component mounting machine of this section, the two imaging devices themselves may be integrated. In other words, it is possible to employ an imaging device that has a board imaging function and a component imaging function and is configured as one imaging device. Specifically, for example, the image pickup device and two image pickup devices each having an optical path for forming an image on the image pickup device may be fixed to each other. An element, two optical paths that form an image from each of the electrical component and the circuit board with respect to the imaging element, and a mechanism for switching the two optical paths may be used. Further, as will be described later, the two imaging devices may be moved integrally to one holder lower position set in common to the two imaging devices. The two imaging devices may be moved integrally in each of the two positions below the two holders set corresponding to the imaging device.

  (6) The board imaging device and the component imaging device are supported by the imaging device moving device so that when one of them is located at the lower position of the holder, the other is located at the lower position of the holder. The electrical component mounting machine described in (5).

  The electrical component mounting machine of this section moves the image pickup apparatus moving device described above, that is, the two image pickup apparatuses integrally to one holding tool lower position set in common to them. It can be considered that it is a component mounting machine provided with such an imaging device moving device. In the board imaging device and the component imaging device described in this section, the two optical axes directed to each of the circuit board and the electrical component in the imaging are made to coincide with each other, that is, they face each other on one axis. It is desirable to be configured as follows.

(7) The electrical component mounting machine includes a control device that controls the electrical component mounting machine,
The control unit is
The imaging device moving device is controlled in a state in which the electrical component held by the component holder is positioned above a mounting portion where the electrical component is mounted on the circuit board fixed by the substrate fixing device. Then, each of the board imaging device and the component imaging device is positioned at the lower position of the holder, and the board imaging is performed in a state where each of the board imaging device and the component imaging apparatus is positioned at the lower position of the holder. A pre-mounting imaging control unit that controls the apparatus and the component imaging device to image the mounting part and the electrical component held by the component holder;
Based on the imaging data of the mounting site imaged by the board imaging device and the imaging data of the electrical component imaged by the component imaging device, the amount of relative positional deviation between the mounting site and the electrical component is grasped. A deviation amount grasping unit;
A correction amount determination unit that determines a correction amount for a mounting position when the electrical component is mounted on the mounting site based on the relative positional shift amount between the mounting site and the electrical component grasped by the misalignment amount grasping unit. When,
Determined by the correction amount determination unit by controlling the imaging device moving device to position each of the board imaging device and the component imaging device at the retracted position and controlling the mounting head and the head moving device. Any one of (4) to (6), further comprising: a mounting control unit that mounts the electrical component held by the component holder on the mounting site while correcting the mounting position based on the correction amount. The electrical component mounting machine described in 1.

  The electrical component mounting machine according to this section is an electrical component mounting machine according to a mode in which a limitation is imposed on a component mounting process to be executed. According to the electrical component mounting machine of this section, as described above, the electrical component held by the component holder is positioned above the mounting portion of the electrical component on the circuit board fixed by the substrate fixing device. In the state, it is possible to acquire both the imaging data of the mounting part and the imaging data of the electrical component, and the component mounting is performed based on the imaging data, so that it is possible to mount the component with high mounting accuracy. Incidentally, the electrical component mounting machine of this section does not require mounting according to the above process on all of the plurality of electrical components mounted on one circuit board, for example, a plurality of electrical components. Of these, only those that require high mounting accuracy may be configured to perform mounting according to the above process. Note that the concept of “mounting position” described in this specification including this section does not mean only the position in the direction along the surface of the circuit board, but also includes the rotational position (orientation). Similarly, the “relative positional deviation amount” does not mean only a positional deviation in the direction along the surface of the circuit board, but also includes a rotational positional deviation (azimuth deviation).

(8) The electrical component held by the component holder has one or more bumps on the lower surface, and one or more lands on which the one or more bumps are respectively placed on the mounting portion of the circuit board. Formed,
The deviation amount grasping unit is configured to grasp a relative positional deviation amount between the one or more lands and the one or more bumps as a relative positional deviation amount between the mounting portion and the electrical component. The electrical component mounting machine described in 1.

  Generally, an electrical component having a bump is required to have high mounting accuracy. In particular, an electrical component in which a plurality of bumps are arranged at a small pitch is highly likely to be short-circuited due to a displacement of the mounting position, and requires considerably high mounting accuracy. In view of that, the electrical component mounting apparatus of this section performs mounting of an electrical component having a bump in consideration of the relative positional deviation between the bump and the land on which the bump is placed. Therefore, mounting with high accuracy can be performed.

(9) The control device
After the electrical component held by the component holder is mounted on the mounting site, the imaging device moving device is controlled so that the board imaging device is positioned below the holder and the board imaging device is controlled. And a post-mounting imaging control unit that images the electrical component mounted on the mounting site;
(7) or (8) having a mounting position confirmation unit that confirms the mounting position of the electrical component based on imaging data of the electrical component mounted on the mounting site imaged by the board imaging device. The electrical component mounting machine described.

  Even if the electrical component is positioned above the mounting part, the relative positional deviation amount between the mounting part of the circuit board and the electrical component is grasped, and the correction is performed based on the relative positional deviation amount. There is a possibility that the mounting position of the component is shifted due to the operation for mounting the electrical component on the substrate surface from above the part, that is, the component mounting operation. Specifically, when the component holder descends slightly but obliquely, the mounting position shift occurs when the tip surface of the component holder and the surface of the circuit board are slightly but not parallel. Further, there is a possibility that the mounting position is shifted due to the correction operation performed in the component mounting operation, that is, the correction operation. Specifically, when the tip of the component holder is eccentric with respect to the axis of the holder, the mounting position is deviated. In the electrical component mounting machine of this section, after mounting the electrical component, the electrical component mounted on the circuit board is imaged by the substrate imaging device at the same position as before mounting without moving the mounting head by the head moving device. Thus, the mounting position of the electrical component can be confirmed with high accuracy. Therefore, according to the electrical component mounting machine of this section, high mounting accuracy can be ensured by confirming the mounting position performed as described above.

(10) The electrical component held by the component holder has one or more bumps on the lower surface, and one or more lands on which the one or more bumps are respectively placed on the mounting portion of the circuit board. Formed,
The deviation amount grasping unit is configured to grasp a relative positional deviation amount between an outline of the electrical component and the one or more bumps based on imaging data of the electrical component imaged by the component imaging device. ,
The mounting position confirmation unit is configured to confirm the mounting position of the electrical component mounted on the mounting site while taking into account the relative positional deviation between the grasped contour of the electrical component and one or more bumps. The electrical component mounting machine according to item (9).

  As described above, the electrical component having the bump on the lower surface is mounted so that the bump is placed on the land formed on the mounting portion of the circuit board. In other words, when the bump is at the proper mounting position, it can be said that the mounting position of the electrical component is appropriate. However, it cannot be guaranteed that the bump is provided at an appropriate position of the electric component. For example, the position of the bump in the electric component may vary for each lot of the electric component. In the confirmation of the mounting position based on the imaging data by the board imaging device after mounting, the position of the bump cannot be identified because the bumps on the lower surface of the electrical component cannot be recognized. The mounting position of the component is confirmed. Therefore, taking into account the relative positional deviation amount between the contour of the electrical component and the bump contributes to confirming the mounting position with high accuracy. In other words, even if it is mounted accurately, if the relative position deviation between the contour of the electrical component and the bump is not taken into account, it is possible to truly determine whether or not the mounting position is accurate. There is no. In the electrical component mounting machine of this section, before mounting, the relative positional deviation amount between the contour of the electrical component and the bump is grasped based on the imaging data by the component imaging device, and the board imaging is performed in consideration of the relative positional deviation amount. Since the mounting position is confirmed based on the imaging data by the apparatus, the mounting position can be confirmed with high accuracy.

(11) The correction amount determination unit
According to the item (9) or the item (10), which is configured to determine the correction amount with reference to data on the mounting position confirmed by the mounting position confirmation unit for the electrical component mounted before the previous time. Electrical component mounting machine.

  As explained earlier, in the state where the electrical component is located above the mounting part, grasp the relative positional deviation amount between the mounting part of the circuit board and the electrical component, and perform correction based on the relative positional deviation amount and install it. Even so, the mounting position of the electrical component may be displaced due to the component mounting operation. Therefore, the correction of the mounting position of the electrical component can be considerably reduced by performing the correction in consideration of the confirmation result of the mounting position of the electrical component previously mounted. A specific method for determining the correction amount based on the confirmation result is not particularly limited. For example, an average and a weighting are applied to each mounting position shift amount of a plurality of electrical components mounted before the previous time. Processing may be performed in accordance with a statistical method such as averaging, and a correction amount may be determined by adding a value obtained by the processing as a value representing a tendency of mounting position deviation.

(12) The control device
It is configured to update data relating to the mounting position referred to by the correction amount determination unit when at least one of an event of changing a lot of electrical components, changing a lot of circuit boards, and replacing the component holder occurs. (11) Electrical component mounting machine.

  The tendency of the mounting position shift of the electrical parts changes depending on the mounting condition change. In particular, when the events listed in this section occur, that is, when the “Electric component lot”, “Circuit board lot”, and “Component holder” change, the tendency may change to some extent. high. The electrical component mounting machine in this section takes this into consideration and changes the data to be referred to when those events occur. The specific mode of data update is not particularly limited. For example, when those events occur, the data that has been referred to so far is discarded, and thereafter, the data of the reference data is newly It is possible to adopt a mode in which accumulation is started, that is, a mode in which data is reset.

(21) A component lower surface imaging data acquisition step of imaging an electrical component having one or more bumps on the lower surface by an imaging device and acquiring imaging data of the lower surface of the electrical component;
Based on the imaging data of the lower surface of the electrical component acquired in the component lower surface imaging data acquisition step, the imaging data processing device grasps the shift amount of the relative position between the contour of the electrical component and the one or more bumps. Quantity grasping process,
A component mounting step of mounting the electrical component on a mounting portion of a circuit board on which one or more lands on which the one or more bumps are respectively mounted are formed;
In the component mounting step, the electrical component mounted on the circuit board is imaged by an imaging device, and a component upper surface imaging data acquisition step of acquiring imaging data of the upper surface of the electrical component;
Based on the imaging data of the upper surface of the electrical component acquired in the component upper surface imaging data acquisition step, the imaging data processing device determines the contour of the electrical component and one or more bumps detected in the deviation amount grasping step. A mounting position confirming step of confirming the mounting position of the electrical component with respect to the circuit board while taking into account the relative positional deviation amount.

  The aspect of this section is an aspect relating to an electric circuit manufacturing method characterized by confirming the mounting position of the electrical component after the electrical component is mounted on the circuit board. As described above, an electrical component having a bump on the lower surface is mounted so that the bump is properly placed on a land provided in the mounting portion of the circuit board. Cannot be recognized. Therefore, the mounting position is confirmed based on the outline of the electrical component. According to the electrical circuit manufacturing method of this section, the relative position deviation amount between the outline of the electrical component and the bump is grasped, and the mounting position is confirmed by taking the relative position deviation amount into consideration. It is possible to accurately check the mounting position of the electric component. Note that the electrical circuit manufacturing method of this section does not require the mounting position confirmation process to be performed in the electrical component mounting machine that performs the component mounting process. In other words, a mounting result inspection machine for inspecting the mounting result may be installed separately from the electrical component mounting machine that performs the component mounting process, and the mounting position confirmation process may be performed by the inspection machine.

It is a perspective view which shows the electrical component mounting system comprised including the mounting module (a kind of work module) as an electrical component mounting machine of an Example. It is a perspective view which shows the mounting module which the electric component mounting system of FIG. 1 has. It is a perspective view which shows the mounting head with which the mounting module of FIG. 2 is equipped, and the head moving apparatus which moves the mounting head. It is a perspective view which shows the work head which can be attached to each work module of the electrical component mounting system of FIG. It is a perspective view which shows the imaging unit attached to the mounting module of FIG. It is a perspective view which shows the internal structure of the vertical-view camera which comprises the imaging unit of FIG. It is a figure showing the imaging unit of FIG. 5 in the viewpoint from the side. It is a flowchart of the component mounting operation performed by the mounting module of FIG. It is a figure which shows the image of the mounting | wearing site | part of a board | substrate based on the imaging data obtained by the imaging of the board | substrate camera which comprises the vertical-view camera of FIG. It is a figure which shows the image of the lower surface of a component based on the imaging data obtained by the imaging of the component camera which comprises the vertical-view camera of FIG. FIG. 7 is an image of a top surface of a mounting part based on imaging data obtained by imaging of a component camera constituting the vertical field of view camera in FIG. 6, assuming that the mounting position of the component is not shifted due to the component mounting operation FIG. FIG. 7 is an image of a top surface of a mounting part based on imaging data obtained by imaging with a component camera constituting the vertical field-of-view camera in FIG. It is a figure which shows an image in the case of being. FIG. 3 is a functional block diagram illustrating a control device that is mounted on the mounting module of FIG. 2 and controls the mounting module.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an electric component mounting machine and an electric circuit manufacturing method according to the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the claimable invention is implemented in various forms including various modifications and improvements based on the knowledge of those skilled in the art, including the form described in the above [Aspect of the Invention] section. can do.

≪Configuration of electrical component mounting system≫
FIG. 1 shows an electrical component mounting system including an electrical component mounting machine according to an embodiment. This system includes a base module 10 and eight work modules 12 a arranged side by side on the base module 10. , 12b (hereinafter may be collectively referred to as “work module 12”). A circuit board (hereinafter simply referred to as “substrate”) used for work is directed from the work module 12 on the upstream side (front side in the figure) toward the work module 12 on the downstream side (back side in the figure). The work is sequentially carried out by the work modules 12, and the work by the system is completed. By the way, in this system, seven of the eight work modules 12 on the upstream side are the mounting modules 12a for mounting electrical components (hereinafter simply referred to as “components”) on the board, and are the most downstream. The one located at is an inspection module 12b for inspecting the result of component mounting by the mounting module 12a. Each of the seven mounting modules 12a functions as an electrical component mounting machine of the embodiment, and one inspection module 12b functions as a mounting result inspection machine. On the upstream side of this system, a solder printer that screen-prints cream solder on the surface of the board is arranged, and on the downstream side, a reflow furnace for heating the board on which the components are mounted is arranged. The electric circuit manufacturing line is configured by the above. Therefore, the electrical component mounting system shown in the figure performs a part of the work in the electrical circuit manufacturing.

  FIG. 2 shows the mounting module 12a with the exterior panel removed. With reference to this figure, the mounting module 12a includes a base 14, a beam 16 overlaid on the base 14, and a base 14 A substrate conveyor device 18 disposed in the front, a plurality of component feeders 20 that are interchangeably attached to the base 14 on the front side of the module 12a, and each function as a component supply device, and a substrate conveyor device 18 and a plurality of components A base-fixed component camera 22 fixed to the base 14 between the feeder 20 and a component supplied from one of the plurality of component feeders 20 is held and the component is detached for mounting on the substrate S. The mounting head 24a (which is a kind of “working head 24”) and the mounting head 24a disposed on the beam 16 are moved. It is configured to include a head moving device 26.

  The substrate conveyor device 18 has two tracks (lanes) for transporting the substrate, and the substrate is loaded into each track from the upstream side and unloaded from each track to the downstream side. The substrate conveyor device 18 has a support table that can be moved up and down at the lower part of each track, and the substrate S carried to a predetermined position is supported by the raised support table and fixed at that position. That is, the substrate conveyor device 18 functions as a substrate fixing device that fixes the substrate S at a predetermined work position in the mounting operation. Since the board conveyor device 18 is disposed in each work module 12, the system can mount components in two lanes. Incidentally, the substrate transport direction which is the substrate transport direction by the substrate conveyor device 18 is the X direction shown in the figure (shown with arrows together with the Y direction and Z direction).

  As shown in FIG. 3, the head moving device 26 is a so-called XY type moving device, and includes a Y-direction moving device 28 and an X-direction moving device 30 (the X direction, the Y direction, and the Z direction are respectively (Shown with arrows in the figure). More specifically, the Y-direction moving device 28 includes a pair of Y guides 32 fixed to the beam 16, a Y slide 34 guided by the pair of Y guides 32, and a Y slide movement that moves the Y slide 34. And a mechanism 36. The X-direction moving device 30 includes a base body 38 fixed to the Y slide 34, a pair of X guides 40 fixed to the base body 38, an X slide 42 guided by the pair of X guides 40, An X slide moving mechanism 44 that moves the slide 42 is included. The mounting head 24a is detachably attached to an X slide 42 that functions as a head attachment body. With such a configuration, the head moving device 26 spans the mounting head 24a across the component supply portion of the component feeder 20 and the substrate S fixed to the substrate conveyor device 18, and above the surface of the substrate S. (Strictly, in a plane parallel to the surface of the substrate S) (see FIG. 2).

  The mounting head 24a is a so-called index type mounting head. As shown in FIG. 4 (a), each functions as a component holder and sucks and holds the component at the lower end by supplying negative pressure (meaning that the pressure is reduced below atmospheric pressure). Eight suction nozzles 48 are provided and are held by the revolver 50. The revolver 50 is intermittently rotated, and one suction nozzle 48 located at a specific position (most front side position) can be moved up and down by the nozzle lifting device, that is, can be moved in the vertical direction (Z direction). . When the suction nozzle 48 located at a specific position is lowered, negative pressure is supplied to hold the component, and when the negative pressure is cut off, the suction holding component is removed. Let In other words, the mounting head 24a can hold eight components sequentially by the component feeder 20, and can mount eight components sequentially by the substrate S. By the way, each of the eight suction nozzles 48 can be rotated around its own axis (hereinafter sometimes referred to as “nozzle axis”) by the nozzle rotating device, that is, around the nozzle axis. The mounting head 24a can change and adjust the rotational positions (also referred to as “rotational posture” and “azimuth”) of components held by the suction nozzles 48.

  In the work module 12, the work head 24 can be replaced, and another type of work head 24 other than the mounting head 24a can be attached. The mounting head 24b shown in FIG. 4B is an example of a work head 24 that can be mounted, and is a so-called single nozzle type mounting head. This mounting head 24b is provided with only one suction nozzle 52 as a component holder. Although only one part can be sucked and held at a time, relatively large parts can be sucked and held. The mounting head 24b also includes a nozzle lifting / lowering device and a nozzle rotating device. The suction nozzle 52 is lifted / lowered when holding / removing the component, and the nozzle axis line is used for changing / adjusting the rotational position of the component. Rotated around. Note that the work head 24 can be replaced by one-touch operation of the lever 54 (see FIG. 3).

  Each of the plurality of component feeders 20 functions as a component supply device. In each of them, a reel on which a component holding tape (a plurality of components are held on the tape, also referred to as “component taping”) is set, and each of the reels intermittently holds the component holding tape. The components are sequentially supplied one by one at a predetermined component supply site. Note that the mounting module 12 a can be attached with a so-called tray-type component supply device instead of the plurality of component feeders 20. The base-fixed component camera 22 that functions as a component imaging device is a fixed-focus camera with a relatively wide field of view, and a mounting head 24a (24b) that holds components by a suction nozzle 48 (52) is connected to the component feeder 20. Then, the component is imaged from below when it is moved to the substrate S fixed by the substrate conveyor device 18.

  An imaging unit 60 is attached to the mounting module 12a below the X slide 42 that functions as a head attachment body. As shown in FIG. 5, the imaging unit 60 includes a vertical viewing camera 62 and a camera moving device 64 that is fixed to the X slide 42 and moves while supporting the vertical viewing camera 62. The vertical field of view camera 62 generally has a rectangular parallelepiped shape with a relatively small thickness, and a component camera as a component imaging device that images the component sucked and held by the suction nozzle 48 from below, and the surface of the substrate S. A substrate camera as a substrate imaging device for imaging from above is integrated.

  More specifically, as shown in FIG. 6, the vertical view camera 62 includes a component camera main body 66, a board camera main body 68, and two pairs of prism sets 70. Built in. Light (shaded arrow in the figure) received through the upper light receiving unit 74 from above is guided to the component camera body 66 by the prisms 70a and 70b constituting one of the two pairs of prism sets 70, while the lower light receiving from below. The light received through the section 76 (the white arrow in the figure) is guided to the substrate camera body 68 by the prisms 70c and 70d constituting the other of the two pairs of prism sets 70. Each of the component camera body 66 and the board camera body 68 is a fixed focus type camera having a fixed focus lens. Each of the component camera body 66 and the board camera body 68 has an image sensor (CCD), and captures image data based on a signal obtained by the image sensor. Is configured to get. That is, the vertical view camera 62 includes a component camera main body 66, prisms 70a and 70b, and an upper light receiving unit 74, and the component camera 78 includes a substrate camera main body 68, prisms 70c and 70d, and a lower light receiving unit 76. The cameras 80 are respectively configured, and in the imaging unit 60, both the component camera 78 and the board camera 80 are supported by the camera moving device 64. In the vertical field-of-view camera 62, the optical axis of the component camera 78 in the upper light receiving unit 74 and the optical axis of the substrate camera 80 in the lower light receiving unit 76 are made to coincide with each other. That is, the vertical view camera 62 is configured such that these optical axes are opposite to each other on one axis.

  As shown in FIG. 5, the camera moving device 64 that functions as the imaging device moving device displaces the vertical field-of-view camera 62 in the front-rear direction (Y direction) and the front-rear direction advance / retreat mechanism 82 and the vertical direction (Z direction). And a vertical displacement mechanism 84. Although not shown, each of the forward / backward moving mechanism 82 and the vertical displacement mechanism 84 has an electromagnetic motor as a driving source, and the vertical viewing camera 62 is positioned at an arbitrary position by controlling the motor. . Specifically, due to the forward / backward moving mechanism 82, the vertical field of view camera 62 includes each of the component camera 78 and the board camera 80, strictly speaking, each of the upper light receiving unit 74 and the lower light receiving unit 76 which are the respective light receiving units. However, the “holding tool lower position” located below the suction nozzle 48 positioned at the specific position described above (directly below the mounting module 12a) and the most retracted from the lower position of the holding tool. It is moved back and forth linearly with respect to the “retraction position” (open arrow in the figure). In other words, the camera moving device 64 is configured to integrally move the component camera 78 and the substrate camera 80 to one holder lower position set in common for the component camera 78 and the substrate camera 80. When one of the component camera 78 and the board camera 80 is located at the holder lower position, the other is located at the holder lower position. Incidentally, in FIG. 5, the state where the vertical view camera 62 is located at the retracted position is shown by a solid line, and the state where it is located below the holder position is shown by a two-dot chain line. On the other hand, although the detailed description is omitted, the vertical view camera 62 is adjusted by, for example, the component camera 78 and the board camera 80 by the vertical direction displacement mechanism 78 regardless of the position in the front-rear direction. For the purpose, it is displaced vertically within a certain range (thick arrow in the figure). In addition, a ring strobe 86 using an LED as a light source is attached so as to irradiate light to parts and substrates that are imaging objects so as to surround each of the upper light receiving unit 74 and the lower light receiving unit 76 of the vertical field of view camera 62. Has been.

  A view of the imaging unit 60 viewed from the side is shown in FIG. This figure is a side view of the mounting module 12a in which a single nozzle type mounting head 24b is mounted instead of the index type mounting head 24a. In this figure, as in FIG. 5, the state where the component camera 78 and the board camera 80 are located at the retracted position is indicated by a solid line, and the state where the component camera 78 and the board camera 80 are located below the holder is indicated by a two-dot chain line. It is shown. Since the imaging unit 60 employs a vertical field-of-view camera 62 having a relatively small thickness, as can be seen from the drawing, the substrate fixed to the substrate conveyor device 18 with the mounting nozzle 52 sucking and holding the component P. Even when it is located above S, the vertical view camera 62, that is, the component camera 78 and the substrate camera 80 can be interposed between the component P and the substrate S. Has been. Then, by moving the vertical view camera 62 backward and positioning the component camera 78 and the substrate camera 80 at the retracted position, the suction nozzle 52 is moved down on the spot without moving the suction head 24b, and the component P is placed on the substrate. It is possible to attach to S.

  In the main mounting module 12a, since the main imaging unit 60 is disposed on the X slide 42 which is a head mounting body, the imaging unit 60 can be replaced regardless of which mounting head 24a, 24b is attached. In addition, imaging by the component camera 78 and the board camera 80 is possible. In other words, the component camera 78 and the board camera 80 are made common to both the mounting heads 24a and 24b, and the mounting module is excellent in convenience. Incidentally, it is conceivable that the holder lower position is different in the front-rear direction when the mounting head 24a is attached and when the mounting head 24b is attached. To cope with the difference, the camera moving device 64 is It has a function of adjusting the lower position of the holder according to the difference. That is, the forward / backward moving mechanism 82 is configured so that the position can be set as the holder lower position regardless of the position of the vertical view camera 62.

  The inspection module 12b has substantially the same configuration as the mounting module 24a except that a work head 24 different from the mounting head 24a is attached and a plurality of component feeders 20 are not attached. Specifically, an imaging head 24c shown in FIG. 4C is attached to the inspection module 12b. The imaging head 24c is a substrate imaging device for imaging the surface of the substrate S and components mounted on the substrate S, instead of the suction nozzles 48 and 52, and has a relatively wide field of view, a relatively high resolution, and And a head-mounted substrate camera 90 with adjustable focus.

≪Parts mounting work by mounting module≫
The component mounting work by the mounting module 12a is a work that constitutes at least a part of the electric circuit manufacturing work, and is a work as shown in the flowchart of FIG. This component mounting operation is performed by a control device (see FIG. 13) that controls the mounting module 12a executing a component mounting program. In accordance with the component mounting program, the control device includes a substrate conveyor device 18, a component feeder 20, a base fixed component camera 22, a mounting head 24b (working head 24), a head moving device 26, a camera moving device 64 of the imaging unit 60, and Each device such as the vertical view camera 62 (component camera 78 and board camera 80) is configured to operate under its own control. Hereinafter, the component mounting operation performed by one mounting module 12a on one board will be described in detail according to the above flowchart. In order to simplify the description, it is assumed that the mounting module 12a is mounted with the above-described single nozzle type mounting head 24b.

  First, in step 1 (abbreviated as “S1”. The other steps are similarly omitted), whether or not a lot change has been performed on a board on which a component mounting operation will be performed will be described later. It is determined whether or not a lot change has been made for any of these (for example, whether or not a new component holding tape has been supplied) and whether or not the suction nozzle 52 of the mounting head 24b has been replaced. Information on the fact of changing the lot of substrates, changing the lot of parts, and replacing the suction nozzle 52 is sent to the control device of the mounting module 12a, and based on the information, the judgment is made. The If it is determined that any one of the substrate lot change, the component lot change, and the suction nozzle 52 replacement has been performed, the process of S2 is executed. Since the process of S2 will be described later, a description thereof is omitted here.

  In the subsequent S3, the board used for component mounting work is carried in from the upstream side by the board conveyor device 18, and the board is fixed at a predetermined work position. Next, in S4, each of a plurality of substrate reference marks (fiducial marks) attached to the substrate is detected by the substrate camera 80 that constitutes the vertical view camera 60 of the imaging unit 60 disposed on the X slide 42. Imaged. More specifically, first, the lower light-receiving unit 76 of the vertical-view camera 60 that is positioned at the retracted position by the head moving device 26 by the forward / backward moving mechanism 82 of the camera moving device 64 includes each of the plurality of substrate reference marks. The mounting head 24b is moved by the head moving device 26 so as to be sequentially positioned above (directly above), and at each of the positions, the substrate camera 80 images each of the plurality of substrate reference marks. . When imaging the substrate reference mark, the height of the vertical view camera 60 is adjusted by the vertical displacement mechanism 84 of the camera moving device 64 so that the focus of the substrate camera 80 matches the surface of the substrate. Next, in S5, based on the imaging data of the plurality of board reference marks obtained by imaging in S4, a coordinate system (hereinafter, referred to as a reference for the position on the board used for mounting components on the board). May be referred to as a “substrate coordinate system”). This method of determining the substrate coordinate system is a general method and will not be described here.

  In S <b> 6, one component to be mounted next is sucked and held by the suction nozzle 52 in accordance with the mounting order set by the program. Specifically, the mounting head 24b is moved by the head moving device 26 to a position where the suction nozzle 52 is positioned directly above the component supply portion of the component feeder 20 that supplies the component to be mounted. Then, the mounting head 24b is actuated to lower the tip of the suction nozzle 52 to a height position where it contacts the upper surface of the component, and negative pressure is supplied to the suction nozzle 52 to hold the component by suction. The suction nozzle 52 holding the component is raised to a predetermined height position.

  In subsequent S <b> 7, it is determined whether or not the component sucked and held by the suction nozzle 52 is a required component that requires high mounting accuracy. Parts where bumps are formed on the lower surface and the bumps are placed on the corresponding lands on the board (so-called “parts with bumps”), especially when multiple bumps are formed at a small pitch There is a possibility that the bumps may be short-circuited due to a deviation in the mounting position of the component, and high accuracy is required with respect to the mounting position. Therefore, in the component mounting operation by the mounting module 12a, the bumped component is handled as a required component.

  If the case where the sucked and held part is not a precision part will be described first, in that case, S8 and subsequent steps are performed. First, in step S8, when moving the component sucked and held by the suction nozzle 52 from above the component feeder 20 to above the substrate, the head passes so that the component passes above the base fixed component camera 22. The mounting head 24 b is moved by the moving device 26. During the movement, a component is imaged from below by the component camera 22 at a position where the nozzle axis of the suction nozzle 52 coincides with the axis of the component camera 22. That is, imaging data of the lower surface image of the component is acquired. In S9, the positional deviation amount (relative positional deviation amount) of the component with respect to the nozzle axis is grasped based on the imaging data. More specifically, the center of the part is obtained based on the contour of the part in the lower surface image, and the relative positional deviation amount between the center and the nozzle axis line is grasped. In S10, the correction amount for the mounting position in the substrate coordinate system is determined based on the relative positional deviation amount. The various misalignment amounts described below, including the relative misalignment amount, are the misalignment amount in each of the X direction and the Y direction, and the misalignment amount with respect to the azimuth, that is, the misalignment amount in the rotational direction (deviation angle). Are treated as if they are included. Similarly, the correction amount for the mounting position is also the amount by which the component is shifted in each of the X direction and the Y direction during mounting and the amount by which the component is shifted in the rotation direction (azimuth), that is, the suction nozzle 52 is rotated. The amount of rotation (angle) of the part. In subsequent S11, the head moving device 26 and the mounting head 24b are operated based on the correction amount so that the component is positioned at a predetermined mounting position in the board coordinate system, and is sucked and held at that position. The suction nozzle 52 is lowered to a position where the lower surface of the component contacts the substrate surface based on the thickness of the component, and the supply of negative pressure is cut off, so that the component is mounted on the substrate. Placed in position. This component mounting operation is a general operation. When the component is not a required component, correction of the mounting position as described above, that is, correction based on imaging data of the component by the base fixed component camera 22 is performed. As a result, the mounting accuracy required for the component is sufficiently secured.

  On the other hand, if it is determined in S7 that the sucked and held part is a required precision part, S12 and subsequent steps are performed. Strictly speaking, the nozzle axis of the suction nozzle 52 is mounted so that the component held by the suction nozzle 52 is positioned above the portion (mounting portion) of the substrate surface to be mounted in the substrate coordinate system. The mounting head 24b is moved and fixed by the head moving device 26 so as to coincide with the center of the part. Next, in S13, in the state where the mounting head 24b is stationary, the front / rear direction advance / retreat mechanism of the camera moving device 64 is operated, and the vertical view camera 62 is positioned at the holder lower position. In a state where the vertical view camera 62 is positioned at the lower position of the holder, the optical axes of the component camera 78 and the board camera 80 are made to coincide with the center of the mounting portion and the nozzle axis. In this state, in the subsequent S14, the board mounting part is imaged by the board camera 80, and the imaging data of the mounting part, more specifically, the land imaging data formed in the mounting part is acquired, and in S15 The component picked up and held by the suction nozzle 52 by the component camera 78 is imaged, and the imaging data of the bumps on the lower surface of the component, more specifically, the bump on the lower surface of the component is acquired. That is, in S15, a component lower surface imaging data acquisition step for acquiring imaging data of the lower surface of the component is performed. It should be noted that the height position of the vertical view camera 62 is adjusted by the vertical displacement mechanism 84 so that the focus of the board camera 80 and the focus of the component camera 78 are matched to the surface of the board and the bottom surface of the component, respectively. Is adjusted.

  As shown in FIG. 9, the image of the mounting part based on the imaging data obtained as a result of imaging by the board camera 80 includes an image of the land L formed on the surface of the board S. As shown in FIG. 10, the image of the lower surface of the component based on the shooting data obtained as a result of imaging by the camera 78 includes an image of the bump B included in the component P. The component P shown in the figure has six bumps B, and six lands L on which the six bumps B are respectively placed are formed in the mounting site shown in the figure. By the way, in the following description, the six bumps B are considered to be integrated and are called “bump patterns” composed of the six bumps B, and the six lands L are considered to be integrated. Thus, it is called a “land pattern” composed of six lands L. The image of the lower surface of the component P shown in FIG. 10 is obtained by inverting the actually obtained image in order to represent the positions of the component P and the bump B in the substrate coordinate system.

In S16, based on each acquired image data, the relative positional deviation amount between the mounting part of the substrate and the component held by the suction nozzle 52 is the relative positional deviation amount between the bump and the land, more specifically, the bump pattern. And the relative positional deviation amount between the land pattern and the land pattern. As described above, the center of the mounting portion in the board coordinate system and the optical axis of the board camera 80 coincide with each other. If the explanation is made with reference to the image of the land L shown in FIG. The amount of deviation of the land pattern in the substrate coordinate system with reference to is recognized. Specifically, the amount of deviation includes the amount of deviation in the X direction (X direction land deviation amount) Δx _L , the amount of deviation in the Y direction (Y direction land deviation amount) Δy _L , and the amount of deviation in the rotational direction (rotation direction land deviation amount) Δθ. It is recognized as the amount of land deviation (Δx _L , Δy _L , Δθ _L ) with _L as a parameter. On the other hand, as described above, the nozzle axis line in the substrate coordinate system and the optical axis line of the component camera 78 coincide with each other, and the land pattern shift can be described with reference to the image of the bump B shown in FIG. Next to the amount, a deviation amount of the bump pattern in the substrate coordinate system with the image center O as a reference is recognized. Similar to the amount of deviation of the bump pattern, this amount of deviation is the amount of deviation in the X direction (X direction bump deviation amount) Δx _B , the amount of deviation in the Y direction (Y direction bump deviation amount) Δy _B , and the amount of deviation in the rotational direction (rotation direction). It is recognized as a bump deviation amount (Δx _B , Δy _B , Δθ _B ) with a bump deviation amount Δθ _B as a parameter. Since the optical axis line of the substrate camera 80 and the optical axis line of the component camera 78 coincide with each other, the relative deviation amount of the bump pattern with respect to the land pattern is equal to the bump / land relative deviation amount (Δx _BL , Δy _BL , Δθ _BL). ) As follows.
X-direction bump / land relative misalignment: Δx _BL = Δx _B −Δx _L
Y-direction bump / land relative misalignment: Δy _BL = Δy _B −Δy _L
Bump / land relative misalignment in rotation direction: Δθ _BL = Δθ _B −Δθ _{L
Incidentally, O L, O B, O} P in FIG, respectively, land pattern center, bump pattern center, the center of the part P (particularly, a "part contour center" hereinafter).

In S <b> 16, the contour (outer shape) of the component P is further specified based on the shooting data obtained as a result of imaging by the component camera 78, and the relative deviation amount between the specified contour and the bump B is grasped. In other words, the deviation of the bump pattern in the component P is grasped. In FIG. 10, the bump B in a state where the bump pattern is not shifted is indicated by a white circle, and actually, the bump pattern is shifted such that the bump B is indicated by a black circle, for example. The deviation of the bump pattern is unavoidable in manufacturing, and the confirmation of the mounting position of the mounting position after component mounting described later cannot recognize the bump, and the outer shape of the component P, that is, the contour is not recognized. Only relying confirmation can be made. In view of this, the amount of relative deviation between the contour of the component P and the bump B is grasped prior to confirmation of the mounting position. Specifically, the deviation amount of the contour of the component P with reference to the image center O shown in FIG. 10 is recognized as the component deviation amount (Δx _P , Δy _P , Δθ _P ), and the component deviation amount (Δx _P , [Delta] y _P, the amount Banpuzure that are certified as previously _{Δθ P) (ΔX B, ΔY} B, based on the [Delta] [theta] _B), the contour deviation of the component P with respect to the bump pattern in the coordinate system relative to the bump pattern center O _B The amount of component / bump relative deviation (Δx _PB , Δy) whose parameters are X direction component / bump relative deviation amount Δx _PB , Y direction component / bump relative deviation amount Δy _PB , rotational direction component / bump relative deviation amount Δθ _{PB PB} , Δθ _PB ). That is, in S16, a deviation amount grasping step for grasping the relative position deviation amount between the contour of the component and the bump is performed. The above-described method for obtaining the X-direction component / bump relative deviation amount is a method using a trigonometric function. However, since the method is purely mathematical, description thereof is omitted here.

In the next S17, correction amounts (ΔX, ΔY, ΔΘ) for component mounting are determined. This correction amount uses the X direction correction amount ΔX, the Y direction correction amount ΔY, and the rotation direction correction amount ΔΘ as parameters, and the determination thereof is performed by determining the bump / land relative deviation amount (Δx _BL , Based on [Delta] _yBL , [Delta] [theta] _BL ), it is performed by referring to the data relating to the mounting position confirmed for the mounting of the same component to the same mounting site performed so far. A reference correction amount (ΔX ₀ , ΔY ₀ , ΔΘ ₀ ) for placing each bump on each land without deviation is determined based on the bump / land relative deviation amount, and the component is positioned above the mounting site. Even if the suction nozzle 52 is lowered and the component is mounted after performing the correction operation based on the reference correction amount, the mounting position of the mounted component is slightly shifted. Specifically, even if a component mounting operation including a correction operation based on the bump / land relative misalignment amount is performed, the nozzle axis is slightly inclined, the tip of the suction nozzle 52 is displaced from the nozzle axis (bend of the nozzle), and suction is performed. Due to the smoothness of the tip surface of the nozzle 52, the upper surface of the component, the surface of the substrate, and the like, there is a possibility that a certain shift in the mounting position occurs. Therefore, in the present mounting module 12a, referring to the result of mounting performed so far, that is, the actually confirmed mounting position shift amount, the X-direction shift tendency amount δx ₀ , the Y-direction shift tendency amount δy ₀ , A deviation tendency amount (δx ₀ , δy ₀ , δθ ₀ ) using the rotational direction deviation tendency amount δθ ₀ as a parameter is recognized, and the recognized deviation tendency amount and the bump / land relative deviation amount (Δx _BL , Δy _BL , Δθ). _BL ) and the correction amount for the current component placement is determined according to the following equation.
X direction correction amount: ΔX = ΔX ₀ −δx ₀
Y direction correction amount: ΔY = ΔY ₀ −δy ₀
Rotation direction correction amount: ΔΘ = ΔΘ ₀ −δθ ₀
The reference correction amounts (ΔX ₀ , ΔY ₀ , ΔΘ ₀ ) are also determined according to a mathematical method using a trigonometric function. However, since the determination method is also a pure mathematical method, the description here will be given. Is omitted.

The mounting position shift amounts (δx, δy, δθ) using the X direction mounting position shift amount δx, the Y direction mounting position shift amount δy, and the rotational direction mounting position shift amount δθ confirmed in the previous mounting as parameters are related to the mounting position. Data (mounting position related data) is stored in the mounting position related data storage unit of the control device, and the stored data is subjected to processing according to a statistical method to obtain the above deviation tendency amount (δx ₀ , Δy ₀ , δ ₀ θ). Although the specific processing is not particularly limited, the present mounting module 12a averages the X-direction mounting position deviation amount δx, the Y-direction positional deviation amount δy, and the rotational-direction positional deviation amount δθ with respect to each previous mounting. The deviation tendency amount (δx ₀ , δy ₀ , δ ₀ θ) is determined. Instead of this method, according to another statistical method, for example, according to the following formula, the displacement position confirmed after the previous wearing performed using the deviation tendency amount to the displacement tendency amount certified in the previous wearing shift amount (previous mounting position deviation _{amount) (δx 1, δy 1,} δθ 1) by adding the multiplied by the weighting coefficient α (0 <α ≦ 1), the deviation tendency amount (.delta.x ₀ used in this attachment , Δy ₀ , δ ₀ θ) may be authorized.
X-direction shift tendency amount: δx ₀ = δx ₀ + α · δx ₁
Y direction deviation tendency amount: δy ₀ = δy ₀ + α · δy ₁
Rotation direction deviation tendency amount: δθ ₀ = δθ ₀ + α · δθ ₁
When this method is followed, the weighting coefficient may be changed according to the number of times of mounting performed this time. For example, it may be changed so that α = 1/2 in the second mounting, α = 1/3 in the third mounting, and α = 1/4 in the fourth and subsequent mountings.

  Note that the tendency of the displacement of the mounting position is influenced and changed by changing the lot of the substrate, changing the lot of the components, and replacing the suction nozzle 52 in view of the cause of the deviation described above. Considering that, if any of them is performed, then the mounting position related data in the previous mounting, and the current certification regarding the component mounting that will be affected by the change or replacement. It is desirable to newly recognize the deviation tendency amount based on the subsequent new mounting position related data without using the deviation tendency amount. In view of that, in the mounting module 12a, if it is determined in S2 described above that any of the substrate lot change, the component lot change, and the suction nozzle 52 replacement has been performed, the components affected by these changes. Regarding the mounting, the mounting position related data stored in the mounting position related data storage unit and the deviation tendency amount currently recognized are updated. Specifically, it is cleared, that is, reset.

  After the correction amounts (ΔX, ΔY, ΔΘ) are determined, in S18, the vertical view camera 62 located at the lower position of the holder is moved backward to the retracted position by the forward / backward moving mechanism 82. Thereafter, in S19, a component mounting process, that is, a component mounting operation including a correction operation is performed. More specifically, first, the mounting head 24b is moved by the head moving device 26 by the X direction correction amount ΔX and the Y direction correction amount ΔY, and the suction nozzle 52 is rotated in the rotation direction by the nozzle rotating device of the mounting head 24b. By rotating the correction amount ΔΘ, the mounting position is corrected, and thereafter, the suction nozzle 52 is lowered to a height position where the lower surface of the component is located on the substrate surface, and the suction nozzle 52 is moved to that position. When the supplied negative pressure is cut off, the sucked and held component is placed on the mounting site, and the component mounting for the component is completed.

  After the component mounting is completed, in S20, the vertical view camera 62 is advanced to the holder lower position by the forward / backward moving mechanism 82 without moving the mounting head 24b. At this position, the height position of the vertical view camera 62 is adjusted by the vertical displacement mechanism so that the upper surface of the mounted component is in focus with the upper surface of the mounted component, and then the substrate camera 80 is mounted in S21. The captured part is imaged, and imaging data of the part is acquired. That is, in S21, a component upper surface imaging data acquisition step for acquiring imaging data of the upper surface of the mounted component is performed.

In the case where it is assumed that there is no displacement of the component mounting position due to the component mounting operation, that is, the above-described shift tendency amount (δx ₀ , δy ₀ , δ ₀ θ) is (0, 0, 0). The correction amounts (ΔX, ΔY, ΔΘ) are the above-described reference correction amounts (ΔX ₀ , ΔY ₀ , ΔΘ ₀ ). In this case, the image of the part based on the shooting data obtained as a result of imaging by the board camera 80 is That is, the image of the component located at the normal position is an image as shown in FIG. The image center O of this image coincides with the nozzle axis in the state where the correction operation has been performed. In this image, the bump pattern of the component P is in the X direction in the substrate coordinate system based on the image center O. f (ΔX _0), Y direction f (ΔY _0), and has a f (ΔΘ ₀₎ shifted was state in the rotational direction. For convenience, they are defined as bump reference normal state index quantities {f (ΔX ₀ ), f (ΔY ₀ ), f (ΔΘ ₀ )}. The X direction bump reference normal state index amount f (ΔX ₀ ), the Y direction bump reference normal state index amount f (ΔY ₀ ), and the rotational direction bump reference normal state index amount f (ΔΘ ₀ ), which are parameters, are triangular. Although it is calculated | required by the calculation method using a function, since the method is purely mathematical, description here is abbreviate | omitted. Incidentally, since the suction nozzle 52 is rotated around the nozzle axis so that the rotation direction bump deviation amount Δθ _B coincides with the rotation direction land deviation amount Δθ _L , the rotation direction bump reference normal state index amount f (ΔΘ ₀ ) This is equal to the direction land deviation amount Δθ _L.

However, as described above, in reality, neither the bump B nor the land L can be recognized from the image, and the bump reference normal state index amount {f (ΔX ₀ ), f (ΔY ₀ ), f The mounting position of the component cannot be confirmed by the amount of deviation of the bump pattern with respect to (ΔΘ ₀ )}. That is, in order to confirm the mounting position of the component, it is necessary to rely on the outer shape, that is, the contour of the component P. For this purpose, the component / bump relative deviation amounts (Δx _PB , Δy _PB , Δθ _PB ) grasped in S 16 are used. In other words, the amount of relative positional deviation between the contour of the component and the bump is taken into account. By taking this into account, as shown in FIG. 11, in the board coordinate system centered on the image center O, the contour of the component P at the normal position is F (ΔX) in the X direction and F (ΔY) in the Y direction. ), And can be represented as being in a state shifted to F (ΔΘ) in the rotation direction, and these are expressed as contour reference normal state index quantities {F (ΔX ₀ ), F (ΔY ₀ ), F (ΔΘ ₀ )}. It is defined as The component mounting position can be accurately confirmed by the amount of deviation of the component outline with respect to the component reference normal state index amount {F (ΔX ₀ ), F (ΔY ₀ ), F (ΔΘ ₀ )}. . The X direction contour reference normal state index amount F (ΔX ₀ ), the Y direction contour reference normal state index amount F (ΔY ₀ ), and the rotation direction contour reference normal state index amount F (ΔΘ ₀ ), which are parameters, are also triangular. Although it is calculated | required by the calculation method using a function, since the method is also purely mathematical, description here is abbreviate | omitted.

As described above, since the displacement of the mounting position occurs due to the mounting operation, the image of the component based on the imaging data acquired and acquired in S21 is actually as shown in FIG. In this figure, the component P mounted at the normal position is indicated by a two-dot chain line, and it can be seen that the actual component P indicated by the solid line is mounted on the substrate in a state shifted from the normal position. In the mounting position confirmation processing in S22, first, the mounting position of the component is specified based on the contour of the component P. This identification, mounting position to Paramemeta parts contour center O _P in the X direction mounting position indicating amount x, Y-direction mounting position indicating amount y and rotational mounting position indicating amount θ in the substrate coordinate system based on the image center O This is done by specifying the index amount (x, y, θ). Next, based on the mounting position index amount (x, y, θ) and the contour reference normal state index amount {F (ΔX ₀ ), F (ΔY ₀ ), F (ΔΘ ₀ )}, Accordingly, the above-described mounting position deviation amounts (δx, δy, δθ) are recognized.
X direction mounting position deviation amount: δx = x−F (ΔX ₀ )
Y direction mounting position deviation amount: δy = y−F (ΔY ₀ )
Rotation direction mounting position deviation amount: δθ = θ−F (ΔΘ ₀ )
Based on the certified mounting position deviation amounts (δx, δy, δθ), whether or not the mounting position is good is determined. More specifically, when the value of each parameter of the mounting position deviation amount (δx, δy, δθ) is within the set threshold value set for each parameter, it is determined that good component mounting has been performed. If any of the parameters is not within the set threshold value, it is determined that the component is not mounted correctly. That is, in S22 where the mounting position is confirmed as described above, a mounting position confirmation process is performed in which the mounting position of the component on the board is checked while taking into account the relative positional deviation between the contour of the component and the bump. is there.

After the mounting position confirmation process, in S23, the recognized mounting position shift amounts (δx, δy, δθ) are stored in the mounting position related data storage unit as mounting position related data. As described above, this data is used to identify the deviation tendency amounts (δx ₀ , δy ₀ , δθ ₀ ). In subsequent S <b> 24, the vertical view camera 62 is retracted to the retracted position by the forward / backward moving mechanism 82. Then, in S25, it is determined whether or not the currently mounted component is the last component to be mounted on the board. If it is determined that the component is not the last component, the process returns to S6 and the next Installation of parts is started. If it is the last component, in S26, the substrate is fixed by the substrate conveyor device 18 and the substrate on which the component mounting operation by the mounting module 12a is completed is carried out to the downstream side.

  The above description regarding the component mounting operation has been performed for the mounting module 12a to which the mounting head 24b is mounted. When the component mounting operation is performed by the mounting module 12a to which the mounting head 24a which is the index type mounting head 24 is mounted, the number of components corresponding to the number of the suction nozzles 48 is sucked and held in S6, and the base in S8 After the parts are imaged by the fixed part camera 22, the steps S7 to S24 (excluding S8) are repeatedly executed as many times as the number of the held parts.

The component mounting result by the mounting module 12a is inspected by the inspection module 12b (see FIG. 1) described above. In the inspection, naturally, the mounting position of the required precision component, that is, the bumped component is also confirmed. As described above, an imaging head 24c (see FIG. 4) is attached to the inspection module 12b in place of the mounting head 24b, and the mounting component imaged by the board camera 90 included in the imaging head 24c is attached. Based on the imaging data, the inspection module 12b confirms the mounting position of the bumped component. The image of the component with bumps based on this imaging data is the same image as FIG. 12, and neither the bump nor the land on which the bump is placed can be recognized. Therefore, the confirmation processing of the mounting position of the bumped component by the inspection module 12b is performed by a method similar to the method performed in S22. Specifically, based on the mounting position index amount (x, y, θ) of the component to be checked and the component / bump relative shift amount (Δx _PB , Δy _PB , Δθ _PB ), the mounting position shift amount ( (δx, δy, δθ) are recognized, and whether or not the bumped component is mounted is determined based on the certified mounting position shift amount. That is, also in the inspection module 12b, a mounting position confirmation process is performed in which the mounting position of the component on the board is checked while taking into account the relative positional deviation between the contour of the component and the bump. The control device of the mounting module 12b and the control device of the inspection module 12b are capable of data communication with each other, and the component / bump relative misalignment grasped by the mounting module 12a is transmitted to the inspection module 12b and transmitted. The component / bump relative misalignment amount used is used in the confirmation process.

≪Function of control device≫
The mounting module 12a is controlled by a control device on which the mounting module 12a is mounted. The control device includes a computer, an image processing unit that functions as an imaging data processing device, and the like as main components. However, in view of the component mounting operation executed as described above, as shown in FIG. It can be considered that various functional units are provided.

  Specifically, in order to carry the substrate from the upstream side in S3 and fix it to a predetermined work position in S3, and to release the substrate in S26 and carry it out to the downstream side in S26. A substrate fixing / conveying control unit 102 is provided as a functional unit for controlling the substrate conveyor device 18. Further, the control device 100 includes a component supply control unit 104 as a functional unit that controls the component feeder 20 in order to supply the component held by the suction nozzle 52 (48) in S6 at a predetermined supply site. . Further, a mounting control unit 106 is provided as a functional unit for controlling the mounting head 24b (24a) and the head moving device 26 to perform a component mounting operation. The mounting control unit 106 mounts the component held by the suction nozzle 52 on the substrate while performing the correction operation, that is, performs the component mounting operation of S11 and S19. It has many functions including the function of controlling the moving device 26. Specifically, in S4, S6, S8, S12, etc., control related to the mounting head 24b (24a) and the head moving device 26, such as control for moving the mounting head 24b and raising / lowering the suction nozzle 52, etc. It has a function to execute widely.

  In S4, S8, S13, S14, and S15, the control device 100 fixes the imaging unit 60 and the base in order to take an image of the board mounting site, the components held by the suction nozzle, and the like before the component mounting operation. A pre-mounting imaging control unit 108 as a functional unit for controlling the camera 22 and the like, and in S21, S22, and S24, an imaging unit 60 for imaging components mounted on the board after the component mounting operation. A post-mounting imaging control unit 110 is provided as a functional unit to be controlled. Incidentally, the pre-mounting imaging control unit 108 and the post-mounting imaging control unit 110 also have a function of receiving imaging data from the component camera 78, the board camera 80, and the base fixed type component camera 22.

  Furthermore, the control device 100 includes a displacement amount grasping unit 112 and a mounting position confirmation unit 114 as functional units centered on the image processing unit. In S9 and S16, the deviation amount grasping unit 112 is based on the imaging data received from the component camera 78, the board camera 80, and the base fixed type part camera 22, and the relative positional deviation amount between the board mounting part and the part, The mounting position confirmation unit 114 confirms the mounting position of the mounted component, for example, by recognizing the displacement amount of the mounting position in S22. Part.

  Furthermore, the control device 100 determines the correction amount for the correction operation in S11 and S17 based on the relative positional deviation amount between the board and the component grasped by the deviation amount grasping unit 112 in S10 and S17. A correction amount determination unit 116 is provided as a functional unit. In S17, the correction amount determination unit 116 has a function of determining the correction amount in consideration of the tendency of the component mounting position shift, such as a mounting position shift amount that is data referred to at that time. As a functional unit for storing the mounting position related data, a mounting position related data storage unit 118 is provided. The mounting position related data is obtained at the time of confirmation by the mounting position confirmation unit 114, and is sent from the mounting position confirmation unit 114 to the mounting position related data storage unit 118.

12a: Mounting module [Electrical component mounting machine] 12b: Inspection module 18: Substrate conveyor device [Substrate fixing device] 20: Component feeder 24a: Mounting head (index type) 24b: Mounting head (single nozzle type) 24c: Imaging head 26 : Head moving device 28: Y direction moving device 30: X direction moving device 42: X slide [head mounting body] 48: suction nozzle [component holder] 52: suction nozzle [component holder] 60: imaging unit 62: up and down Field of view camera 64: Camera moving device [imaging device moving device] 78: Component camera [component imaging device] 80: Substrate camera [substrate imaging device] 82: Forward / backward moving mechanism 84: Vertical displacement mechanism 100: Control device 106: Mounting Control unit 108: Pre-mounting imaging control unit 110: Post-mounting imaging control unit 112: Deviation amount grasping unit 114: Mounting position confirmation unit 116: Correction amount determination unit

Claims (8)

A board fixing device for fixing a circuit board;
A mounting head for mounting the electrical component held on the circuit board fixed to the board fixing device, having a component holder for holding the electrical component;
A head mounting thereof mounting heads that replaceably attached to,
A head moving device that moves the mounting head along the surface of the circuit board fixed to the substrate fixing device by moving the head mounting body;
A board imaging device for imaging the surface of the circuit board fixed to the board fixing device from above the circuit board;
A component imaging device for imaging an electrical component held by the component holder of the mounting head from below;
Supporting both said to move both with the mounting head by the head moving device board imaging device and the component imaging device, prior SL is disposed on the head mounting body thereof board imaging device and Parts for the imaging device to together, each with their board imaging device and the component imaging device, they and holder lower position located below the component holder, a movable imaging between the allowed was retracted position retracted from the position An electrical component mounting machine comprising a device moving device. The imaging device moving device is
The electrical component mounting machine according to claim 1, further comprising a vertical displacement mechanism capable of vertically displacing each of the board imaging device and the component imaging device in a state where they are positioned below the holder. The electrical component mounting machine includes a control device that controls the electrical component mounting machine,
The control unit is
The imaging device moving device is controlled in a state in which the electrical component held by the component holder is positioned above a mounting portion where the electrical component is mounted on the circuit board fixed by the substrate fixing device. Then, each of the board imaging device and the component imaging device is positioned at the lower position of the holder, and the board imaging is performed in a state where each of the board imaging device and the component imaging apparatus is positioned at the lower position of the holder. A pre-mounting imaging control unit that controls the apparatus and the component imaging device to image the mounting part and the electrical component held by the component holder;
Based on the imaging data of the mounting site imaged by the board imaging device and the imaging data of the electrical component imaged by the component imaging device, the amount of relative positional deviation between the mounting site and the electrical component is grasped. A deviation amount grasping unit;
A correction amount determination unit that determines a correction amount for a mounting position when the electrical component is mounted on the mounting site based on the relative positional shift amount between the mounting site and the electrical component grasped by the misalignment amount grasping unit. When,
Determined by the correction amount determination unit by controlling the imaging device moving device to position each of the board imaging device and the component imaging device at the retracted position and controlling the mounting head and the head moving device. The electrical component mounting according to claim 1 , further comprising: a mounting control unit configured to mount the electrical component held by the component holder on the mounting site while correcting the mounting position based on the correction amount. Machine. The electrical component held by the component holder has one or more bumps on the lower surface, and one or more lands on which the one or more bumps are respectively placed are formed on the mounting portion of the circuit board. And
The displacement amount grasping unit is configured to grasp a relative displacement amount between the one or more lands and the one or more bumps as a relative displacement amount between the mounting part and the electrical component. The electrical component mounting machine described. The control device is
After the electrical component held by the component holder is mounted on the mounting site, the imaging device moving device is controlled so that the board imaging device is positioned below the holder and the board imaging device is controlled. And a post-mounting imaging control unit that images the electrical component mounted on the mounting site;
The mounting position confirmation part which confirms the mounting position of the electrical component based on the imaging data of the electrical component mounted in the mounting site imaged by the board imaging device. Electrical component mounting machine. The electrical component held by the component holder has one or more bumps on the lower surface, and one or more lands on which the one or more bumps are respectively placed are formed on the mounting portion of the circuit board. And
The deviation amount grasping unit is configured to grasp a relative positional deviation amount between an outline of the electrical component and the one or more bumps based on imaging data of the electrical component imaged by the component imaging device. ,
The mounting position confirmation unit is configured to confirm the mounting position of the electrical component mounted on the mounting site while taking into account the relative positional deviation between the grasped contour of the electrical component and one or more bumps. The electrical component mounting machine according to claim 5. The correction amount determination unit
7. The electrical component according to claim 5, wherein the correction amount is determined with reference to data on a mounting position confirmed by the mounting position confirmation unit for the electrical component mounted before the previous time. Mounting machine. The control device is
It is configured to update data relating to the mounting position referred to by the correction amount determination unit when at least one of an event of changing a lot of electrical components, changing a lot of circuit boards, and replacing the component holder occurs. The electrical component mounting machine according to claim 7.

Images