CN113490406B - Automatic production method of micro-power module power supply composition structure - Google Patents
Automatic production method of micro-power module power supply composition structure Download PDFInfo
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- CN113490406B CN113490406B CN202110766985.9A CN202110766985A CN113490406B CN 113490406 B CN113490406 B CN 113490406B CN 202110766985 A CN202110766985 A CN 202110766985A CN 113490406 B CN113490406 B CN 113490406B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
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Abstract
The invention provides an automatic production method of a micro-power module power supply composition structure. The method comprises the following steps: s1: preparing parts: sending a control signal to the manipulator, and respectively fixing the SMD base, the PCBA component and the shell of the micropower power supply module on the surface mounting platform according to the assembly process; s2: assembling the patch: registering the welding points of the PCBA component and the SMD base through a chip mounting head, and welding through a mechanical welding hand after successful registration; s3: buckling and crimping: and carrying out image alignment on the shell and the welded SMD base, buckling the shell and the welded SMD base through the manipulator after the image alignment, and carrying out pressurization and compression joint through the micro distance between the shell opening of the shell and the compression joint surface of the SMD base after the buckling. Compared with the prior art, the method is more suitable for automatic production operation in the prior art through fixed and flow fixed point and shaping operation. The crimping operation of the pressurization pressure is realized, and the problems of crimping damage and incomplete crimping caused by overlarge crimping pressure and undersize crimping pressure can be prevented.
Description
Technical Field
The invention relates to the technical field of electronic equipment production, in particular to an automatic production method of a micro-power module power supply composition structure.
Background
At present, with more and more electronic devices, various power supply devices, voltage transformation devices, and the like. However, various problems occur in the production process of these devices, such as incomplete soldering of the circuit with an excessive contact surface gap, difficulty in automating the production process, and the like. In the calculation process of the power module, the prior art is composed of a shell component, a PCBA component and an SMD base, and in the production process of the micro-power module power supply, the problem of inaccurate welding when the PCBA component and the SMD base are connected in a matching mode exists. When the buckling is released, the buckling ports cannot be aligned, so that crimping damage exists in the production of micro-power supplies. The existing crimping mode is generally standard crimping pressure, so that when the crimping surface of the shell opening and the SMD base is crimped, the crimping surface of the shell opening and the SMD base cannot be completely buckled or the crimping force is too high due to insufficient crimping force, and the crimping surface of the SMD base is damaged by crimping.
Disclosure of Invention
The invention provides an automatic production method of a micro-power module power supply composition structure, which is used for solving the problem of inaccurate welding when a PCBA component and an SMD base are connected in the production process of a micro-power module power supply. When the buckling is released, the buckling ports cannot be aligned, so that crimping damage exists in the production of micro-power supplies. The existing crimping mode is generally standard crimping pressure, so that when the crimping surface of the shell opening and the SMD base is crimped, the situation that the crimping surface of the SMD base is damaged by crimping due to the fact that the crimping force is insufficient, the crimping surface of the shell opening and the SMD base cannot be completely buckled or the crimping force is too high occurs.
An automatic production method of a micro-power module power supply composition structure comprises the following steps:
s1: preparing parts: sending a control signal to the manipulator, and respectively fixing the SMD base, the PCBA component and the shell of the micropower power supply module on the surface mounting platform according to the assembly process;
s2: assembling the patch: registering the welding points of the PCBA component and the SMD base through a chip mounting head, and welding through a mechanical welding hand after successful registration;
s3: buckling and crimping: and carrying out image alignment on the shell and the welded SMD base, buckling the shell and the welded SMD base through the manipulator after the image alignment, and carrying out pressurization and compression joint through the micro distance between the shell opening of the shell and the compression joint surface of the SMD base after the buckling.
As an embodiment of the present invention: the manipulator includes: the device comprises a pressing mechanical arm, a surface mounting mechanical arm, a welding mechanical arm and a moving mechanical arm; wherein the content of the first and second substances,
the pressing mechanical arm is a pneumatic driving mechanical arm;
the paster manipulator and the welding manipulator are electronic driving manipulators;
the mobile manipulator is a mechanical driving manipulator.
As an embodiment of the present invention: the sending of the control signal to the manipulator includes:
predetermining the composition structure of the micropower power supply module, and determining the installation operation flow of each structural component;
determining a preset installation position of each structural component according to the installation operation flow;
generating a control signal according to the preset installation position; wherein the content of the first and second substances,
the control signal includes: SMD base counterpoint fixed signal, PCBA subassembly counterpoint signal and shell counterpoint signal.
As an embodiment of the present invention: the SMD base alignment fixing signal comprises the following execution steps:
determining a fixing groove of the SMD base through a camera device on a mounting platform;
constructing a coordinate system by using the central point of the mounting platform, and taking the pin embedded groove of the fixed groove as a target coordinate point;
numbering pins of the SMD base, determining numbered pins, and determining a target coordinate point corresponding to each numbered pin;
determining a displacement variable from the numbering pin to the target coordinate point based on the visual field range of the camera equipment; wherein the content of the first and second substances,
the displacement variables include: a translation variable, a rotation variable, and a move down variable.
As an embodiment of the present invention: the PCBA component alignment signal comprises the following execution steps:
obtaining component parts of the PCBA assembly; wherein the content of the first and second substances,
the component parts include: electronic components, a surface mount transformer and a bonding pad;
determining a first patch pin of a positive welding surface and a second patch pin of a negative welding surface on the bonding pad;
determining an interactive plastic package pin on the electronic component and an input end on a surface mount transformer;
the electronic component is attached to the front welding surface of the welding disc, and the first patch pin and the interactive plastic package pin are subjected to plastic package through a plastic package body;
and attaching the surface-mounted transformer to the negative welding surface of the welding disc, and attaching and packaging the input end of the surface-mounted transformer and the second surface-mounted pin.
As an embodiment of the present invention: the shell alignment signal comprises the following execution steps:
performing contour scanning on the shell based on the camera equipment to determine a contour pattern;
determining an alignment contour on the SMD base according to the contour pattern;
and fixing the shell on the pressing manipulator according to the alignment contour and the buckling direction.
As an embodiment of the present invention: registering the welding spots of the PCBA component and the SMD base through a patch head, and the registering method comprises the following steps:
respectively scanning the welding points of the PCBA component and the SMD base at multiple visual angles to determine three-dimensional point cloud data of M visual angles;
determining a three-dimensional point cloud overlapping area based on the three-dimensional point cloud data;
acquiring a standard registration diagram of welding spots of a preset PCBA component and an SMD base, and determining registration points corresponding to the three-dimensional point cloud of the PCBA component and the welding spots of the SMD base according to the three-dimensional point cloud overlapping area;
determining the rotational translation parameters of the three-dimensional point cloud and the registration points according to the registration points and the three-dimensional point cloud data, and transforming the three-dimensional point cloud and the registration points to a standard coordinate system according to the rotational translation parameters;
determining approximate homonymous points in the three-dimensional point cloud data through K-D tree searching;
introducing an error equation to perform calculation adjustment calculation according to the approximate homonymous points, and determining error sets of the multiple groups of registration three-dimensional point clouds and the registration points;
performing iterative computation according to the error set, and determining error compensation parameters;
determining corresponding registration three-dimensional point cloud and registration point according to the minimum value of the error compensation parameter, and calculating a target rotation translation parameter transformed to a reference coordinate system;
and registering the welding points of the PCBA component and the SMD base through a patch head according to the target rotation translation parameters, and installing and fixing the PCBA component and the SMD base.
As an embodiment of the invention: the welding is performed by a mechanical welding hand after the registration is successful, and the welding method comprises the following steps:
step 1: determining welding positions corresponding to welding points of the PCBA component and the SMD base, and inputting the welding positions into a processor of a welding manipulator;
step 2: clamping a soldering tin block through camera equipment and an electronic manipulator, and placing the soldering tin block at the soldering position;
and step 3: heating a soldering block at the welding position by moving a welding manipulator;
and 4, step 4: shooting welding images of the PCBA component and the SMD base in the welding process by the camera equipment, and transmitting the welding images to the processor through the image acquisition card;
and 5: and the over-welding comparison processor calculates the welding offset of the PCBA component and the SMD base, executes a subsequent welding process when the welding offset is 0, and performs welding compensation when the welding offset is greater than 0.
As an embodiment of the present invention: carry out image alignment with the base after will shell and welding to after aiming at through manipulator lock, include:
acquiring, by one or more computing devices, a mount image of an SMD mount captured from a perspective angle at or near ground level;
identifying, by the one or more computing devices, a housing snap image of the housing;
converting, by the one or more computing devices, the base image to a curved image based at least in part on the geometric data associated with the SMD base by projecting an image plane of the housing snap fit image to an image plane associated with the base image;
identifying, by the one or more computing devices, one or more feature matches between the curved image and the housing snap image;
and determining, by the one or more computing devices, an alignment position based at least in part on the geometric data associated with the one or more feature matches to align the base image and the housing snap image;
and buckling through a crimping mechanical arm according to the alignment position.
As an embodiment of the invention: after the lock through the micro distance of the crimping face of shell mouth and SMD base, carry out pressure boost crimping, include:
continuously microcosmically shooting the pressure contact surfaces of the shell opening and the SMD base based on the camera equipment, and determining a microcosmic distance;
calculating real-time crimping pressure and required pressure of the crimping manipulator according to the microscopic distance;
and determining real-time pressurization pressure according to the required pressure and the real-time crimping pressure, carrying out crimping according to the real-time pressurization pressure, and stopping crimping when the shell opening of the shell is contacted with the crimping surface of the SMD base.
The beneficial effects of the above technical scheme are: compared with the prior art, the method is more suitable for automatic production operation in the prior art through fixed and flow fixed point and shaping operation. Through the alignment operation of the PCBA component and the welding spot of the SMD base, the alignment welding operation based on imaging and coordinate is realized, and the problems of incomplete welding and inaccurate welding can be further prevented. Finally, the micro-distance crimping operation of the pressurization pressure is continuously realized through the alignment operation of the shell opening of the shell on the SMD base, so that the problems of crimping damage and incomplete crimping caused by overlarge crimping pressure and undersize crimping pressure can be prevented.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
In the drawings:
FIG. 1 is a flow chart of a method for automated manufacturing of a micro-power module power supply assembly according to an embodiment of the present invention;
fig. 2 is a flow chart illustrating the process of fastening the housing and the base of the automatic manufacturing method of the micro-power module power supply structure according to the embodiment of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
As shown in fig. 1, an automatic production method of a micro-power module power supply composition structure includes:
s1: preparing parts: sending a control signal to the manipulator, and respectively fixing the SMD base, the PCBA component and the shell of the micropower power supply module on the surface mounting platform according to the assembly process;
s2: assembling the patch: registering the welding points of the PCBA component and the SMD base through a chip mounting head, and welding through a mechanical welding hand after successful registration;
s3: buckling and crimping: and carrying out image alignment on the shell and the welded SMD base, buckling the shell and the welded SMD base through the manipulator after the image alignment, and carrying out pressurization and compression joint through the micro distance between the shell opening of the shell and the compression joint surface of the SMD base after the buckling.
The working principle of the technical scheme is as follows: according to the invention, different composition structures of the micro-power supply module are subjected to fixed standards in the stage of preparing parts, so that the standardized fixed point and shaping operation of the position is realized in the stage of preparing parts. In the process of assembling the patch, the invention realizes the alignment operation based on imaging and coordinate by welding points of the PCBA component and the SMD base, and further realizes the welding operation after registration after the registration is finished. In the process of buckling and crimping, the invention realizes the micro-alignment of the shell opening of the shell and the crimping surface of the SMD base through images, and realizes the continuous pressurization crimping operation through the micro-alignment.
The beneficial effects of the above technical scheme are: compared with the prior art, the method is more suitable for automatic production operation in the prior art through fixed and flow fixed point and shaping operation. Through the alignment operation of the PCBA component and the welding spot of the SMD base, the alignment welding operation based on imaging and coordinate is realized, and the problems of incomplete welding and inaccurate welding can be further prevented. Finally, the micro-distance crimping operation of the pressurization pressure is continuously realized through the alignment operation of the shell opening of the shell on the SMD base, so that the problems of crimping damage and incomplete crimping caused by overlarge crimping pressure and undersize crimping pressure can be prevented.
As an embodiment of the present invention: the manipulator includes: the device comprises a pressing mechanical arm, a surface mounting mechanical arm, a welding mechanical arm and a moving mechanical arm; wherein the content of the first and second substances,
the pressing manipulator is a pneumatic driving manipulator;
the paster manipulator and the welding manipulator are electronic driving manipulators;
the mobile manipulator is a mechanical drive type manipulator.
The working principle of the technical scheme is as follows: in the prior art, the production of products is realized through a production line, and the manipulator is arranged on an operation node of production operation. The invention is also the same production flow, and also needs the cooperation of a plurality of manipulators, so the invention comprises four manipulators, and different manipulators execute different operation flows. However, in the prior art, only a chip mounting head or a chip mounting nipple is adopted in the chip mounting process of the chip mounter, and the invention combines various machines to carry out operation and production on a micropower power supply in various modes of chip mounting, welding and compression joint.
The beneficial effects of the above technical scheme are: the invention can be more rapid and convenient through various manipulators, and is more suitable for flow production.
As an embodiment of the present invention: the sending of the control signal to the manipulator includes:
predetermining the composition structure of the micropower power supply module, and determining the installation operation flow of each structural component;
determining a preset installation position of each structural component according to the installation operation flow;
generating a control signal according to the preset installation position; wherein the content of the first and second substances,
the control signal includes: SMD base counterpoint fixed signal, PCBA subassembly counterpoint signal and shell counterpoint signal.
The working principle of the technical scheme is as follows: in the prior art, generally produced products cannot send signals to a manipulator, but the invention is different from the micropower power module produced by the invention which needs to carry out wireless signal transmission originally, so that a manipulator control system of the invention can receive the signals of the micropower power module, and further realizes the installation and fixation. The invention generates control signals of different manipulators through a predetermined operation flow.
The beneficial effects of the above technical scheme are: the invention realizes cooperative production by controlling various manipulators through various control signals, and is more suitable for flow production compared with the prior art.
As an embodiment of the present invention: the SMD base alignment fixing signal comprises the following execution steps:
determining a fixing groove of the SMD base through a camera device on a mounting platform;
constructing a coordinate system by using the central point of the mounting platform, and taking the pin embedding groove of the fixed groove as a target coordinate point;
numbering pins of the SMD base, determining numbered pins, and determining a target coordinate point corresponding to each numbered pin;
determining a displacement variable from the numbering pin to the target coordinate point based on the visual field range of the camera equipment; wherein the content of the first and second substances,
the displacement variables include: a translation variable, a rotation variable, and a move down variable.
The working principle of the technical scheme is as follows: in the prior art, when mounting is performed, a pin of an SMD base is not used as a translation standard in a form of coordinates and numbers, but an image itself is used as a translation standard, and when the image itself is used as a translation mark, extraction of coordinates of any coordinate point of the image may be wrong, and extraction of an outline is wrong or impossible. According to the invention, the coordinates of the pins are extracted through the pin numbers, so that a large amount of calculation is reduced firstly, and secondly, the coordinates of each pin are extracted independently, so that the coordinates are extracted more accurately. Thereafter, through various translations, efficiency and accuracy can be achieved. And the calculated amount is reduced, the contour coordinate is obtained, the system resource occupation of the calculated variable is increased, and the efficiency is improved. When the SMD base is fixedly aligned, the position alignment is realized through the pin number of the base, and then the movement alignment is realized through the unique variable after the position alignment.
The beneficial effects of the above technical scheme are: the invention can realize the high-efficiency control of the manipulator, and can realize the high-efficiency alignment installation operation based on the advanced control of the SMD base.
As an embodiment of the present invention: the PCBA component alignment signal comprises the following execution steps:
obtaining component parts of the PCBA assembly; wherein the content of the first and second substances,
the component parts include: electronic components, a surface mount transformer and a bonding pad;
determining a first patch pin of a positive welding surface and a second patch pin of a negative welding surface on the bonding pad;
determining an interactive plastic package pin on the electronic component and an input end on a surface mount transformer;
the electronic component is attached to the front welding surface of the welding disc, and the first patch pin and the interactive plastic package pin are subjected to plastic package through a plastic package body;
and attaching the surface-mounted transformer to the negative welding surface of the welding disc, and attaching and packaging the input end of the surface-mounted transformer and the second surface-mounted pin.
The principle of the technical scheme is as follows: the invention realizes the mounting of the electronic element and device through the components of the PCBA based on the welding disc, and the electronic element and device is plastically packaged after being mounted. In the prior art, a welding pad is directly welded with a pin generally, so that connection is firmer in welding, but a product can only be replaced if the product is worn out, and the product is not easy to maintain.
The beneficial effects of the above technical scheme are: the invention adopts a plastic package mode without welding, thus various electronic components can be disassembled and assembled, and the stability and the fixity of the plastic package are not lower than those of welding.
As an embodiment of the invention: the shell alignment signal comprises the following execution steps:
performing contour scanning on the shell based on the camera equipment to determine a contour pattern;
determining an alignment contour on the SMD base according to the contour pattern;
and fixing the shell on the pressing manipulator according to the alignment contour and the buckling direction.
The principle and the beneficial effects of the technical scheme are as follows: the invention can scan the outline of the shell, then carry out the alignment of the SMD base, and realize the crimping and buckling after the alignment. In the prior art, because the standard operation flows are adopted, the inaccuracy of the comparison of the mechanical arm is generally not considered, and the production is directly carried out according to a standard. This has led to the large-scale appearance of defective products. The invention solves the problem, realizes the reduction of bad products and the improvement of high-quality tea growers through the outline, and has the advantages of lower yield and higher yield because the machine identification is more and more refined.
The beneficial effects of the above technical scheme are that: the method has the advantages that the method reduces bad products and improves high-quality tea farmers through the outline, and moreover, because machine identification is more and more refined, the yield is not low and is higher.
As an embodiment of the present invention: registering the welding spots of the PCBA component and the SMD base through a patch head, and the registering method comprises the following steps:
respectively scanning the welding points of the PCBA component and the SMD base at multiple visual angles to determine three-dimensional point cloud data of M visual angles; the purpose of multi-view scanning is to determine the positions of welding points on the PCBA component and the positions of the welding points on the SMD base through multiple views, and three-dimensional point cloud data of the positions of the welding points are obtained from different views.
Determining a three-dimensional point cloud overlapping area based on the three-dimensional point cloud data;
acquiring a standard registration diagram of welding points of a preset PCBA component and an SMD base, and determining registration points corresponding to the registration three-dimensional point cloud of the PCBA component and the welding points of the SMD base according to the three-dimensional point cloud overlapping area;
the standard distribution diagram has a distribution diagram of standard distribution, and the distribution points are determined by comparison in the process.
The three-dimensional overlapping area is the position of the welding point needing to be welded in multiple visual angles.
Determining the rotational translation parameters of the registered three-dimensional point cloud and the registered points according to the registered points, and transforming the registered three-dimensional point cloud and the registered points to a standard coordinate system according to the rotational translation parameters; a comparison then compares the standard map with the points to be registered, and the registration is performed by means of a coordinate system transformation.
Determining approximate homonymous points in the three-dimensional point cloud data through K-D tree searching;
the approximately same-name points are approximately same names, and are mainly based on a K-D book searching method to determine overlapped and same numbers in the three-dimensional point cloud data.
Introducing an error equation to perform calculation adjustment calculation according to the approximate homonymous points, and determining error sets of the multiple groups of registration three-dimensional point clouds and the registration points;
performing iterative computation according to the error set, and determining error compensation parameters;
determining corresponding registration three-dimensional point cloud and registration point according to the minimum value of the error compensation parameter, and calculating a target rotation translation parameter transformed to a reference coordinate system;
and registering the welding points of the PCBA component and the SMD base through a patch head according to the target rotation translation parameters, and installing and fixing the PCBA component and the SMD base.
The invention adopts a rotary translation mode to carry out rotary translation on the PCBA component to realize the fixed installation of the SMD base.
The working principle of the technical scheme is as follows: when the welding spot registration of the PCBA component and the SMD base is carried out, the three-dimensional point cloud data is based on standard level registration operation realized by a big data technology. And after standard-level registration operation, the mounting operation of welding spot registration is realized through the rotation and translation of the electronic manipulator.
The beneficial effects of the above technical scheme are: compared with the prior art, the welding process is quicker, and the welding mode is more accurate compared with the prior art.
As an embodiment of the invention:
the welding of the invention comprises two modes, the plastic package processing also comprises direct welding, therefore, when the direct welding is carried out, the welding is carried out by a mechanical welding hand after the registration is successful, and the welding comprises the following steps:
step 1: determining welding positions corresponding to welding points of the PCBA component and the SMD base, and inputting the welding positions into a processor of a welding manipulator;
the invention first collects the accurate positions of the solder joints on the PCBA component and the SMD base when performing solder joint alignment, so that the positions of the solder joints are sent to the processor.
Step 2: clamping a soldering tin block through camera equipment and an electronic manipulator, and placing the soldering tin block at the soldering position;
because soldering is required, the present invention picks up solder blocks to place at the soldering location in the same manner as conventional. However, when the plastic package packaging mode is adopted, the tin welding blocks do not need to be clamped, and the plastic package mode is directly adopted.
And step 3: heating a soldering block at the welding position by moving a welding manipulator; the purpose of the heating is to effect welding, so welding can be effected by a specialized welding robot.
And 4, step 4: shooting welding images of the PCBA component and the SMD base in the welding process by the camera equipment, and transmitting the welding images to the processor through the image acquisition card;
and 5: and calculating the welding offset of the PCBA component and the SMD base through a welding comparison processor, executing a subsequent welding process when the welding offset is 0, and performing welding compensation when the welding offset is greater than 0.
When soldering, the electronic components or circuits mounted on the chip may be misaligned due to the action of force. Therefore, the invention adopts offset calculation to realize welding compensation.
The working principle of the technical scheme is as follows: the welding machine firstly adds the soldering tin blocks, then realizes mobile welding through the welding manipulator, finally judges whether welding deviation occurs or not through the welding image, and finally realizes welding compensation.
The beneficial effects of the above technical scheme are: compared with the prior art, the invention can not only prevent the problem of insufficient welding during welding, but also perform welding compensation when the welding has problems.
As an embodiment of the present invention: as shown in fig. 2, the aligning the images of the housing and the welded base and the snapping the images by the robot after the aligning, includes:
acquiring, by one or more computing devices, a mount image of an SMD mount captured from a perspective angle at or near ground level; the base image of the SMD base captured at or near the perspective angle of the ground level because the snapping of the SMD base is the last step, the present invention achieves an efficient and effective snapping.
Identifying, by the one or more computing devices, a housing snap image of the housing;
converting, by the one or more computing devices, the base image to a curved image based at least in part on the geometric data associated with the SMD base by projecting an image plane of the housing snap fit image to an image plane associated with the base image; the invention can provide the collective image when buckling, and the collective image of the SMD base is convenient for buckling the picture when projecting to obtain the final target image.
Identifying, by the one or more computing devices, one or more feature matches between the curved image and the housing snap image;
and determining, by the one or more computing devices, an alignment position based at least in part on the geometric data associated with the one or more feature matches to align the base image and the housing snap image; geometric data is the representation of the contour data after visualization.
And buckling through a crimping mechanical arm according to the alignment position.
The working principle of the technical scheme is as follows: the invention realizes the image-level-based alignment mode through projection butt joint of the shell buckling port image and the SMD base image and finally through a plurality of feature matching, thereby realizing alignment buckling.
The beneficial effects of the above technical scheme are: compared with the prior art, the invention not only can realize high-efficiency buckling alignment operation, but also can prevent the problem of insufficient aligning and buckling degree in the prior art.
As an embodiment of the present invention: after the lock through the micro distance of the shell mouth and the press connection surface of the SMD base, the pressurization press connection is carried out, including:
continuously microcosmically shooting the pressure welding surfaces of the shell opening and the SMD base based on the camera equipment, and determining a microcosmic distance;
calculating real-time crimping pressure and required pressure of the crimping manipulator according to the microscopic distance;
and determining real-time pressurization pressure according to the required pressure and the real-time crimping pressure, carrying out crimping according to the real-time pressurization pressure, and stopping crimping when the shell opening of the shell is contacted with the crimping surface of the SMD base.
The working principle of the technical scheme is as follows: the prior art can not judge the crimping state, but the invention observes the crimping state through a microscopic camera, thereby realizing the self-adaptive crimping mode. When the shell opening of the shell and the pressure welding surface of the SMD base are in pressure welding, the pressure welding calculation of the pressing pressure and the contact pressure can be carried out through the microscopic distance, and then the contact pressure welding of the pressure welding surface is realized through the pressurization pressure.
The beneficial effects of the above technical scheme are: compared with the prior art, the invention can realize the adjustment and pressurization of the crimping pressure, thereby preventing the damage of components caused by the over-low crimping pressure and over-high crimping pressure.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. An automatic production method of a micro-power module power supply composition structure is characterized by comprising the following steps:
s1: preparing parts: sending a control signal to the manipulator, and respectively fixing the SMD base, the PCBA component and the shell of the micropower power supply module on the surface mounting platform according to the assembly process;
s2: assembling the patch: registering the welding points of the PCBA component and the SMD base through a patch head, and welding through a mechanical welding hand after successful registration;
s3: buckling and crimping: carrying out image alignment on the shell and the welded SMD base, buckling the shell and the welded SMD base through the manipulator after the image alignment, and carrying out pressurization and compression joint through the microscopic distance between the shell opening of the shell and the compression joint surface of the SMD base after the image alignment;
the sending of the control signal to the manipulator includes:
predetermining the composition structure of the micropower power supply module, and determining the installation operation flow of each structural component;
determining a preset installation position of each structural component according to the installation operation flow;
generating a control signal according to the preset installation position; wherein the content of the first and second substances,
the control signal includes: the SMD base alignment fixing signal, the PCBA component alignment signal and the shell alignment signal;
registering the welding spots of the PCBA component and the SMD base through a patch head, and the registering method comprises the following steps:
respectively scanning the welding points of the PCBA component and the SMD base at multiple visual angles to determine three-dimensional point cloud data of M visual angles;
determining a three-dimensional point cloud overlapping area based on the three-dimensional point cloud data;
acquiring a standard registration diagram of welding spots of a preset PCBA component and an SMD base, and determining registration points corresponding to the three-dimensional point cloud of the PCBA component and the welding spots of the SMD base according to the three-dimensional point cloud overlapping area;
determining the rotational translation parameters of the three-dimensional point cloud and the registration points according to the registration points and the three-dimensional point cloud data, and transforming the three-dimensional point cloud and the registration points to a standard coordinate system according to the rotational translation parameters;
determining approximate homonymous points in the three-dimensional point cloud data through K-D tree searching;
introducing an error equation to perform calculation adjustment calculation according to the approximate homonymous points, and determining error sets of the multiple groups of registration three-dimensional point clouds and the registration points;
performing iterative computation according to the error set, and determining error compensation parameters;
determining corresponding registration three-dimensional point cloud and registration point according to the minimum value of the error compensation parameter, and calculating a target rotation translation parameter transformed to a reference coordinate system;
registering the welding points of the PCBA component and the SMD base through a chip mounting head according to the target rotation translation parameters, and mounting and fixing;
carry out image alignment with the base after will shell and welding to after aiming at through manipulator lock, include:
acquiring, by one or more computing devices, a mount image of an SMD mount captured from a perspective angle at or near ground level;
identifying, by the one or more computing devices, a housing snap image of the housing;
converting, by the one or more computing devices, the base image to a curved image based at least in part on the geometric data associated with the SMD base by projecting an image plane of the housing snap fit image to an image plane associated with the base image;
identifying, by the one or more computing devices, one or more feature matches between the curved image and the housing snap image;
and determining, by the one or more computing devices, an alignment position based at least in part on the geometric data associated with the one or more feature matches to align the base image and the housing snap image;
and buckling through a crimping mechanical arm according to the alignment position.
2. The method of claim 1, wherein the robot comprises: the device comprises a pressing mechanical arm, a surface mounting mechanical arm, a welding mechanical arm and a moving mechanical arm; wherein the content of the first and second substances,
the pressing manipulator is a pneumatic driving manipulator;
the paster manipulator and the welding manipulator are electronic driving manipulators;
the mobile manipulator is a mechanical driving manipulator.
3. The method as claimed in claim 1, wherein the SMD base aligning fixing signal includes the following steps:
determining a fixing groove of the SMD base through a camera device on a mounting platform;
constructing a coordinate system by using the central point of the mounting platform, and taking the pin embedded groove of the fixed groove as a target coordinate point;
numbering pins of the SMD base, determining numbered pins, and determining a target coordinate point corresponding to each numbered pin;
determining a displacement variable from the numbering pin to the target coordinate point based on the visual field range of the camera equipment; wherein the content of the first and second substances,
the displacement variables include: a translation variable, a rotation variable, and a move down variable.
4. The method of claim 1, wherein the PCBA assembly alignment signal comprises the following steps:
obtaining component parts of the PCBA assembly; wherein the content of the first and second substances,
the component parts include: electronic components, a surface mount transformer and a bonding pad;
determining a first patch pin of a positive welding surface and a second patch pin of a negative welding surface on the bonding pad;
determining an interactive plastic package pin on the electronic component and an input end on a surface mount transformer;
the electronic component is attached to the front welding surface of the welding disc, and the first patch pin and the interactive plastic package pin are subjected to plastic package through a plastic package body;
and attaching the surface-mounted transformer to the negative welding surface of the welding disc, and attaching and packaging the input end of the surface-mounted transformer and the second surface-mounted pin.
5. The method of claim 1, wherein the housing alignment signal comprises the following steps:
performing contour scanning on the shell based on the camera equipment to determine a contour pattern;
determining an alignment contour on the SMD base according to the contour pattern;
and fixing the shell on the pressing manipulator according to the alignment contour and the buckling direction.
6. The method of claim 1, wherein the welding by a mechanical welding hand after the registration is successful comprises:
step 1: determining welding positions corresponding to welding points of the PCBA component and the SMD base, and inputting the welding positions into a processor of a welding manipulator;
step 2: clamping a soldering tin block through camera equipment and an electronic manipulator, and placing the soldering tin block at the soldering position;
and step 3: heating and welding the soldering block at the welding position by moving the welding manipulator;
and 4, step 4: shooting welding images of the PCBA component and the SMD base in the welding process by the camera equipment, and transmitting the welding images to the processor through the image acquisition card;
and 5: and calculating the welding offset of the PCBA component and the SMD base through a welding comparison processor, executing a subsequent welding process when the welding offset is 0, and performing welding compensation when the welding offset is greater than 0.
7. The method of claim 1, wherein the step of performing the pressure-increasing compression joint through the micro distance between the housing opening and the compression joint surface of the SMD base after the step of fastening comprises:
continuously microcosmically shooting the pressure welding surfaces of the shell opening and the SMD base based on camera equipment, and determining a microcosmic distance;
calculating real-time crimping pressure and required pressure of the crimping manipulator according to the microscopic distance;
and determining real-time pressurization pressure according to the required pressure and the real-time crimping pressure, carrying out crimping according to the real-time pressurization pressure, and stopping crimping when the shell opening of the shell is contacted with the crimping surface of the SMD base.
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