CN101339656A - Image processing process of full-automatic lead wire bonding machine image processing system - Google Patents
Image processing process of full-automatic lead wire bonding machine image processing system Download PDFInfo
- Publication number
- CN101339656A CN101339656A CN 200810079290 CN200810079290A CN101339656A CN 101339656 A CN101339656 A CN 101339656A CN 200810079290 CN200810079290 CN 200810079290 CN 200810079290 A CN200810079290 A CN 200810079290A CN 101339656 A CN101339656 A CN 101339656A
- Authority
- CN
- China
- Prior art keywords
- image
- image processing
- pin
- point
- carried out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to an image processing method of a full automatic wire bonder image processing system. The steps of the invention are that: (1) the collected images are calibrated; the calibration algorithm adopts standard checkerboard grid; the best fit algorithm is used for establishing a lookup table of feature points which are regularly distributed on the surface of the images; the feature points are found and analyzed, the deflection is calculated, then the feature points are amended; (2) by adopting different identification and positioning processes for the feature points of pins and chips, the distinguish of the geometric size, shape, location, and the like, is obtained; the location dispersion of the chips and the pins is accurately measured. The invention has the beneficial effects that the problem of the automatic alignment of the wire bonder is better resolved, and the image processing method of the invention further improves the speed and accuracy of alignment and position as well as consistency.
Description
Technical field
The present invention relates to a kind of image processing method of full-automatic lead bonding machine image processing system.
Background technology
In recent years, along with the progress of integrated circuit technique, the integrated circuit encapsulation has also obtained very big development.The encapsulation microminiaturization is an importance that realizes microminiaturized development.Characteristics such as the lead-in wire bonding is present the most frequently used chip interconnection technique, and it is minimum with the cost of its single connection, manufacture craft is flexible, adaptability is strong and captured the market of microelectronics Packaging.Full-automatic lead bonding machine is one of the most key equipment in the packaging process behind LED and the IC semiconductor, and image processing system is the core technology of this equipment.
Be to realize full-automatic lead bonding, find chip to be bonded at position on the shell, promptly realizing aiming at automatically is primary task.In the integrated circuit (IC) chip position detection part, adopt the method for computer vision, with the automatic grab chips image of ccd video camera, send into computing machine through image pick-up card, earlier digital picture is carried out pre-service, then according to information such as the pixel distribution of digital picture and gray scales, carry out Digital Image Processing, obtain physical dimension, shape, the differentiation of position etc., accurately measure the position residual quantity of actual chips and pin and come compensating error by driving worktable, chip is accurately aimed at, made error that the actual characteristic solder joint overlaps with the reference characteristic solder joint less than 5 μ m.By the method for Digital Image Processing, shorten the accurate location of chip welding spot and the time of detection greatly, improved work efficiency simultaneously.
Ccd video camera is being found a view with the lens optical device when carrying out image acquisition, owing to be subjected to the influence of object and factors such as video camera three-dimensional space position relation, lens distortion and video camera quality, imaging system and desirable pin-hole model are inconsistent, there is geometric distortion in the image that collects, particularly when using wide-angle lens, the radial distortion meeting has a strong impact on picture quality, brings difficulty to Flame Image Process.Therefore, when the quantitative test of carrying out based on graphical analysis such as pattern match, motion detection, just need proofread and correct or video camera is carried out geometric calibration the image that geometric distortion is arranged.
Summary of the invention
Technical matters to be solved by this invention provides a kind of image processing method that can further improve the full-automatic lead bonding machine image processing system of aligning and locating speed, precision and consistency problem.
The present invention adopts following technical scheme:
Concrete grammar step of the present invention is as follows:
(1) image of high-speed CCD camera acquisition is calibrated:
Calibration algorithm adopts the gridiron pattern of standard, and linear array or dot matrix imaging utilize best-fit algorithm that the unique point of imaging surface regular distribution is set up look-up table, searches and the analytical characteristic point, calculates deflection, and the result with identification compares correction then;
(2) pin and chip features point are discerned the location respectively:
A, to the position fixing process of pin unique point:
At first the image of gathering is carried out figure image intensifying, image filtering, the binaryzation pre-service is carried out feature extraction with pretreated image and is mated with the image template of the welding pin unique point of preserving, thereby weld pipe pin unique point has been carried out accurate location;
B, to the position fixing process of chip features point:
In case pin positioning feature point, then the potential zone of chip features point is determined thereupon, in its potential zone, image is carried out figure image intensifying, image filtering, binaryzation, obtain bianry image, then the bianry image that obtains is carried out image aspects and handle, earlier promptly " pin expands " back " corrosion ", afterwards, adopt little connected region delet method that interfered cell is deleted; After obtaining several big segmented areas, each unique point of area dividing mark is carried out feature extraction, then the unique point extracted and the image template of chip are mated, thereby accurately the chip features point is located.
The invention has the beneficial effects as follows and solved the self-aligning problem of wire bonder preferably; And solved further aligning and locating speed, precision and the consistency problem of having improved.
Description of drawings
Fig. 1 is a system chart of the present invention.
Fig. 2 is the tessellated image of collection standard of the present invention.
Fig. 3 is of the present invention to the image after the previous image correction.
Fig. 4 is the positioning feature point process block diagram of pin of the present invention.
Fig. 5 is a chip feature point location process block diagram of the present invention.
Fig. 6 is the image before the chip identification of the present invention.
Fig. 7 is a chip features point location result images of the present invention.
Embodiment
Get final product according to the operation of the technical scheme in the foregoing invention content part.
In case after pin unique point and chip features point were identified, system can calculate the load sum of errors pin error of chip automatically, the distance in revising between solder joint and the outer solder joint.Carry out the adjustment of worktable according to alternate position spike by the control card of the kinetic control system of wire bonder, the distance on the integrated circuit between interior solder joint and the outer solder joint is determined.In addition, on the chip on solder joint and the pin distance between the outer solder joint be not subjected to the influence of chip load sum of errors pin error.It is all definite that historical facts or anecdotes shows the required various data of full-automatic lead bonding.So far, the position of chip just is accurately positioned, and wire bonder just can have been finished accurate bonding.
Claims (1)
1, the image processing method of full-automatic lead bonding machine image processing system is characterized in that its concrete grammar step is as follows:
(1) image of high-speed CCD camera acquisition is calibrated:
Calibration algorithm adopts the gridiron pattern of standard, and linear array or dot matrix imaging utilize best-fit algorithm that the unique point of imaging surface regular distribution is set up look-up table, searches and the analytical characteristic point, calculates deflection, and the result with identification compares correction then;
(2) pin and chip features point are discerned the location respectively:
A, to the position fixing process of pin unique point:
At first the image of gathering is carried out figure image intensifying, image filtering, the binaryzation pre-service is carried out feature extraction with pretreated image and is mated with the image template of the welding pin unique point of preserving, thereby weld pipe pin unique point has been carried out accurate location;
B, to the position fixing process of chip features point:
In case pin positioning feature point, then the potential zone of chip features point is determined thereupon, in its potential zone, image is carried out figure image intensifying, image filtering, binaryzation, obtain bianry image, then the bianry image that obtains is carried out image aspects and handle, earlier promptly " pin expands " back " corrosion ", afterwards, adopt little connected region delet method that interfered cell is deleted; After obtaining several big segmented areas, each unique point of area dividing mark is carried out feature extraction, then the unique point extracted and the image template of chip pin are mated, thereby accurately the chip features point is located.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810079290 CN101339656A (en) | 2008-08-29 | 2008-08-29 | Image processing process of full-automatic lead wire bonding machine image processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810079290 CN101339656A (en) | 2008-08-29 | 2008-08-29 | Image processing process of full-automatic lead wire bonding machine image processing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101339656A true CN101339656A (en) | 2009-01-07 |
Family
ID=40213716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810079290 Pending CN101339656A (en) | 2008-08-29 | 2008-08-29 | Image processing process of full-automatic lead wire bonding machine image processing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101339656A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103240550A (en) * | 2013-05-08 | 2013-08-14 | 北京斯达峰控制技术有限公司 | Numerical control welding method, numerical control welding device and numerical control welding system |
| CN103593840A (en) * | 2013-09-30 | 2014-02-19 | 北京林业大学 | Method for detecting phenotype of Arabidopsis |
| CN104574367A (en) * | 2014-12-21 | 2015-04-29 | 浙江大学 | Method for detecting and calculating geometric size of integrated chip pin based on machine vision |
| CN105243663A (en) * | 2015-09-29 | 2016-01-13 | 深圳大学 | automatic PCB (Printed Circuit Board) scan image matching method and system |
| CN108711173A (en) * | 2018-04-13 | 2018-10-26 | 深圳安博电子有限公司 | Multiple-target identification method and device |
| CN113570550A (en) * | 2021-07-01 | 2021-10-29 | 南京航空航天大学 | Gold wire bonding size detection method based on three-dimensional point cloud |
-
2008
- 2008-08-29 CN CN 200810079290 patent/CN101339656A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103240550A (en) * | 2013-05-08 | 2013-08-14 | 北京斯达峰控制技术有限公司 | Numerical control welding method, numerical control welding device and numerical control welding system |
| CN103240550B (en) * | 2013-05-08 | 2015-12-02 | 北京斯达峰控制技术有限公司 | A kind of numerical control welding method, Apparatus and system |
| CN103593840A (en) * | 2013-09-30 | 2014-02-19 | 北京林业大学 | Method for detecting phenotype of Arabidopsis |
| CN103593840B (en) * | 2013-09-30 | 2017-01-11 | 北京林业大学 | Method for detecting phenotype of Arabidopsis |
| CN104574367A (en) * | 2014-12-21 | 2015-04-29 | 浙江大学 | Method for detecting and calculating geometric size of integrated chip pin based on machine vision |
| CN104574367B (en) * | 2014-12-21 | 2017-04-12 | 浙江大学 | Method for detecting and calculating geometric size of integrated chip pin based on machine vision |
| CN105243663A (en) * | 2015-09-29 | 2016-01-13 | 深圳大学 | automatic PCB (Printed Circuit Board) scan image matching method and system |
| CN108711173A (en) * | 2018-04-13 | 2018-10-26 | 深圳安博电子有限公司 | Multiple-target identification method and device |
| CN113570550A (en) * | 2021-07-01 | 2021-10-29 | 南京航空航天大学 | Gold wire bonding size detection method based on three-dimensional point cloud |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5249349A (en) | Parts mounting device | |
| CN108802046B (en) | Optical detection device and detection method for defects of hybrid integrated circuit assembly | |
| US20100328435A1 (en) | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components | |
| CN101339656A (en) | Image processing process of full-automatic lead wire bonding machine image processing system | |
| JP2009172718A (en) | Working device and calibration method of the same | |
| KR20010040998A (en) | Automatic inspection system with stereovision | |
| JP2006090740A (en) | Method of inspecting wiring board, method of manufacturing wiring board device for and inspecting wiring board | |
| CN112185870B (en) | High-precision bonding head positioning method and equipment | |
| CN112771652A (en) | Bare die attachment system and method for integrated accuracy verification and calibration using the same | |
| CN111486787A (en) | Test positioning method and test positioning system | |
| CN111279462A (en) | Joining device | |
| JP3855244B2 (en) | Three-dimensional image recognition device using a microscope | |
| KR101633139B1 (en) | A method and means for measuring positions of contact elements of an electronic components | |
| TWI638239B (en) | Displacement detection method, displacement detection apparatus, drawing apparatus and substrate inspection apparatus | |
| JPH05251897A (en) | Apparatus for mounting parts | |
| CN101857188A (en) | MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method | |
| CN116721958B (en) | Chip spacing adjustment method, clamping system and processor | |
| KR101120129B1 (en) | Method of adjusting work position automatically by reference value and automatic apparatus for the same | |
| CN113269729A (en) | Assembly body multi-view detection method and system based on depth image contrast | |
| CN106558513B (en) | Detection device and detection method thereof | |
| JPH06140799A (en) | Component mounting method | |
| CN102856214A (en) | Circuit board mounting method | |
| US20220180494A1 (en) | Wire shape measurement device, wire three-dimensional image generation method, and wire shape measurement method | |
| CN114353687A (en) | Arc height measurement of overlapping bond wires | |
| CN209182254U (en) | Optical detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: CETC Beijing Electronic Equipment Co., Ltd. Assignor: No.45 Inst., China Electronic science and Technology Group Corp. Contract fulfillment period: 2008.10.10 to 2014.12.29 contract change Contract record no.: 2009990000524 Denomination of invention: Image processing process of full-automatic lead wire bonding machine image processing system License type: Exclusive license Record date: 2009.5.18 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.10.10 TO 2014.12.29; CHANGE OF CONTRACT Name of requester: BEIJING ZHONGDIAN SCIENCE ELECTRONIC EQUIPMENT CO. Effective date: 20090518 |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090107 |