CN113056102B - Method for manufacturing direct-insert micro-power module power supply - Google Patents

Method for manufacturing direct-insert micro-power module power supply Download PDF

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CN113056102B
CN113056102B CN202110291073.0A CN202110291073A CN113056102B CN 113056102 B CN113056102 B CN 113056102B CN 202110291073 A CN202110291073 A CN 202110291073A CN 113056102 B CN113056102 B CN 113056102B
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pcb
transformer
pins
target
magnetic ring
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CN113056102A (en
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李绍兵
薛涛
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Guangzhou Aipu Electron Technology Co ltd
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Guangzhou Aipu Electron Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F30/00—Fixed transformers not covered by group H01F19/00
    • H01F30/06—Fixed transformers not covered by group H01F19/00 characterised by the structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The invention discloses a method for manufacturing a direct-insert micro-power module power supply, which comprises the following steps: s1, providing a PCB, wherein one end of the PCB is provided with a plurality of first pins; s2, connecting the electronic component to the lower surface of the PCB; s3, providing a shell structure, and uniformly connecting a plurality of second pins at the bottom end of the side wall of the shell structure; s4, installing the magnetic ring transformer in the shell structure, connecting the third pin on the magnetic ring transformer with the second pin, and assembling to form a patch transformer; and S5, connecting the patch transformer to the upper surface of the PCB. According to the invention, the PCB and the first pins are integrally formed, the manual packaging steps are reduced, the working time and the manufacturing cost are reduced, the second pins and the electronic components are arranged in a surface mounting mode, the surface mounting machine is used for assembling, the automation degree of manufacturing is improved, the labor cost is saved, the magnetic ring transformer is fixed in the shell structure, the situation that the pins of the magnetic ring transformer are excessively pulled and fall off in the assembling process is avoided, and the product quality is improved.

Description

Method for manufacturing direct-insert micro-power module power supply
Technical Field
The invention relates to the technical field of micropower power supplies, in particular to a method for manufacturing a direct-insert micropower module power supply.
Background
With the rapid development of power electronic technology, the relationship between power electronic equipment and the work and life of people is increasingly close, and electronic equipment can not be powered by a reliable power supply. In a traditional micropower power supply structure, a transformer on a circuit board assembly is a magnetic ring transformer, the transformer is generally provided with 6 or 9 pin ends, in order to realize an electrical function, pins of the magnetic ring transformer need to be welded with bonding pads on the circuit board, the pins need to be manually welded by using a soldering iron because the pins are thin, the pins of the circuit board need to be separately welded, the welding time is long, and the welded pins are easy to fall off. Therefore, in order to solve the above problems of pin detachment and time consuming soldering of the magnetic ring transformer, a method for manufacturing a direct-insert micro-power module power supply is needed.
Disclosure of Invention
In order to solve the technical problems, the invention discloses a method for manufacturing a direct-insert micropower module power supply, wherein a PCB and a first pin are integrally formed, the traditional external metal pin is replaced, the manual packaging steps are reduced, the working time and the manufacturing cost are greatly reduced, a second pin and an electronic component are both arranged in a chip type, a chip mounter is used for assembling in the product assembling process, the automation degree of manufacturing is improved, the labor cost is effectively saved, a magnetic ring transformer is fixed in a shell structure, the phenomenon that the thin pin of the magnetic ring transformer is excessively pulled and falls off in the assembling process is avoided, and the quality and the yield of the product are improved; which comprises the following steps:
s1, providing a PCB, wherein one end of the PCB is provided with a plurality of first pins;
s2, connecting an electronic component to the lower surface of the PCB;
s3, providing a shell structure, and uniformly connecting a plurality of second pins at the bottom end of the side wall of the shell structure;
s4, installing the magnetic ring transformer in the shell structure, connecting the third pin on the magnetic ring transformer with the second pin, and assembling to form a patch transformer;
and S5, connecting the patch transformer to the upper surface of the PCB.
Preferably, a plurality of slots are formed in one end of the PCB in an array mode, the first pin is formed between every two adjacent slots, and the first pin and the PCB are integrally formed.
Preferably, the surface of the first pin is coated with a copper sheet, and the first pin is electrically connected with the electronic component and the patch transformer through wires.
Preferably, the cross section of the shell structure is set to be any one of square, rectangle and circle.
Preferably, the second pins are symmetrically arranged on two sides of the shell structure, and the number of the second pins is at least 4.
Preferably, the housing structure includes:
the magnetic ring transformer is arranged between the lower shell and the upper shell, and a third pin of the magnetic ring transformer is connected with the second pin.
Preferably, the upper surface of the PCB board is provided with a plurality of bonding pads, the bonding pads are arranged corresponding to the second pins, and the bonding pads are connected with the second pins to form a circuit with an electrical connection relation.
Preferably, the second pin and the electronic component are both arranged in a surface mount mode, and the PCB, the electronic component and the surface mount transformer are assembled by a surface mount machine.
Preferably, before the PCB is used, the image of the PCB pad is collected by the camera, the controller detects the defect of the PCB pad through a first preset algorithm, and the defective PCB is removed, wherein the first preset algorithm comprises:
step 1: carrying out gray level processing on the two-dimensional image of the PCB pad collected by the camera, calculating the gray level characteristic value of each point of the image and the texture gradient characteristic value of the local gray level of each point of the image by adopting a neighborhood average method, and respectively calculating the gray level characteristic value and the variance of the texture gradient characteristic value;
step 2: comprehensively considering gray scale, texture error and distribution thereof, and calculating texture characteristic metric of the PCB pad
Figure 393978DEST_PATH_IMAGE001
Comprises the following steps:
Figure 777031DEST_PATH_IMAGE002
wherein the content of the first and second substances,
Figure 228872DEST_PATH_IMAGE003
is a multiple of the variance of the gray level feature values,
Figure 30606DEST_PATH_IMAGE004
is a multiple of the variance of the texture gradient eigenvalues,
Figure 376136DEST_PATH_IMAGE005
the number of pixels in the length direction of the two-dimensional image,
Figure 870703DEST_PATH_IMAGE006
the number of pixels in the width direction of the two-dimensional image,
Figure 668894DEST_PATH_IMAGE007
to fall in a gray level error level of
Figure 274319DEST_PATH_IMAGE008
Texture gradient error level of
Figure 474356DEST_PATH_IMAGE009
The pixel point statistics of (1);
and step 3: judging the defect condition of the PCB welding disc, wherein the judgment result is
Figure 874245DEST_PATH_IMAGE010
：
Figure 159733DEST_PATH_IMAGE011
Wherein the content of the first and second substances,
Figure 568848DEST_PATH_IMAGE012
indicating that the detected PCB bonding pad has defects, eliminating the PCB,
Figure 498758DEST_PATH_IMAGE013
indicating that the detected PCB bonding pad has no defect or negligible defect, using the PCB for assembly,
Figure 459761DEST_PATH_IMAGE014
representing the preset texture characteristic metric value of the PCB pad
Figure 104981DEST_PATH_IMAGE015
The threshold value of (2).
Preferably, the types of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) are limited;
the manufacturing method of the direct-insert micro-power module power supply further comprises the following steps:
the types of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) are limited, and the method comprises the following steps:
any one of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) is used as a limiting target;
acquiring a preset category list corresponding to the limited target;
selecting any one of the preset category lists as a target category;
acquiring first target big data associated with the target type through a preset first acquisition path;
acquiring second target big data associated with the target type through a preset second acquisition path;
acquiring a preset scoring model;
the scoring model is adopted to score the target type for multiple times based on the first target big data, and a first score output by the scoring model is obtained after each scoring;
the scoring model is adopted to score the target type for multiple times based on the second target big data, and a second score output by the scoring model is obtained after each scoring;
calculating a ranking index of the target category based on the first score and the second score, the calculation formula being as follows:
Figure 911263DEST_PATH_IMAGE016
Figure 961259DEST_PATH_IMAGE017
Figure 827584DEST_PATH_IMAGE018
wherein the content of the first and second substances,
Figure 963030DEST_PATH_IMAGE019
for the purpose of said ranking index,
Figure 838582DEST_PATH_IMAGE020
is a natural constant and is a natural constant,
Figure 743084DEST_PATH_IMAGE021
and
Figure 45890DEST_PATH_IMAGE022
is a preset weight value, and is used as a weight value,
Figure 403053DEST_PATH_IMAGE023
performing a second targeting class for the scoring model based on the first targeting big data
Figure 816717DEST_PATH_IMAGE024
The first score output after the secondary scoring,
Figure 841304DEST_PATH_IMAGE025
a total number of times the scoring model scores the target category based on the first target big data,
Figure 190377DEST_PATH_IMAGE026
performing a second targeting class for the scoring model based on the second targeting big data
Figure 831574DEST_PATH_IMAGE024
The second score output after the secondary scoring,
Figure 783350DEST_PATH_IMAGE027
a total number of times the scoring model scores the target category based on the second target big data,
Figure 659514DEST_PATH_IMAGE028
is a preset first score threshold value and is,
Figure 304122DEST_PATH_IMAGE029
is a preset second score threshold;
and selecting the target type corresponding to the maximum value of the ranking index as the type of the limited target.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of the structure of the present invention.
Fig. 2 is a schematic diagram of the patch transformer structure of the present invention.
Fig. 3 is a structural schematic view of the lower case of the present invention.
In the figure: 1, a PCB board; 11. a first pin; 12. grooving; 2. an electronic component; 3. a surface-mounted transformer; 31. a housing structure; 311. a lower case; 312. an upper shell; 32. a second pin; 4. a magnetic loop transformer; 41. and a third pin.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
The invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 3, the method for manufacturing a direct-insert micro-power module power supply provided in this embodiment includes the following steps:
s1, providing a PCB (printed Circuit Board) 1, wherein one end of the PCB 1 is provided with a plurality of first pins 11;
s2, connecting the electronic component 2 to the lower surface of the PCB 1;
s3, providing a shell structure 31, and uniformly connecting a plurality of second pins 32 at the bottom end of the side wall of the shell structure 31;
s4, installing the magnetic loop transformer 4 inside the housing structure 31, so that the third pins 41 on the magnetic loop transformer 4 are connected with the second pins 32, and assembling to form the patch transformer 3;
and S5, connecting the patch transformer 3 to the upper surface of the PCB board 1.
The working principle of the invention is as follows:
the invention provides a method for manufacturing a direct-insert micro-power module power supply, wherein a first pin 11 and a PCB (printed circuit board) 1 are integrally formed, one end of the PCB 1 is provided with a plurality of slots 12, the first pin 11 is formed between every two adjacent slots 12, an electronic component 2 is arranged in a chip mounter mode, the electronic component 2 is accurately connected to a pad of the PCB 1 by using a chip mounter, then a magnetic ring transformer 4 is placed in a containing space in a shell structure 31, a third pin 41 is connected with a second pin 32 to form a chip transformer 3, and then the second pin 32 of the chip transformer 3 is accurately connected to the pad of the PCB 1 by using the chip mounter to finish the manufacturing of the direct-insert micro-power module power supply.
The invention has the beneficial effects that:
according to the manufacturing method of the direct-insert micro-power module power supply, the PCB 1 and the first pins 11 are integrally formed, the traditional external metal pins are replaced, the steps of manual packaging are reduced, the working time and the manufacturing cost are greatly reduced, the second pins 32 and the electronic components 2 are both arranged in a chip mounting mode, a chip mounting machine is used for assembly in the product assembly process, the automation degree of manufacturing is improved, the labor cost is effectively saved, the magnetic ring transformer 4 is fixed in the shell structure 31, the situation that the thin pins of the magnetic ring transformer 4 are excessively pulled and fall off in the assembly process is avoided, and the quality and the yield of products are improved.
In one embodiment, a plurality of slots 12 are formed in an array at one end of the PCB board 1, the first pin 11 is formed between two adjacent slots 12, and the first pin 11 is integrally formed with the PCB board 1.
The working principle and the beneficial effects of the technical scheme are as follows:
in step S1, the first pins 11 are integrally formed with the PCB 1, and during the forming, a plurality of slots 12 are formed at one end of the PCB 1, and the slots 12 are arranged in an array, so that the first pins 11 are formed between two adjacent slots 12. When traditional metal pin uses, need be connected to the PCB board with metal pin to encapsulate it through the casting glue, through above-mentioned structural design, effectively will PCB board 1 is integrated with first pin 11, has reduced the step of artifical encapsulation, reduces man-hour and manufacturing cost by a wide margin, and integrated into one piece's manufacturing approach has simultaneously improved the joint strength of first pin 11 and PCB board 1 guarantees first pin 11 and PCB board 1's electric connection validity, reduces the pin and damages the risk.
In one embodiment, the surface of the first pin 11 is coated with a copper sheet, and the first pin 11 is electrically connected with the electronic component 2 and the patch transformer 3 through wires.
The working principle and the beneficial effects of the technical scheme are as follows:
when the first pin 11 is used, the first pin 11 and the PCB board 1 are integrally formed, so that a copper sheet is coated on the surface of the first pin 11, the first pin 11 has electrical conductivity, and the first pin 11 is electrically connected with the electronic component 2 and the surface mount transformer 3 through a wire, so that a circuit with an electrical connection relation is formed among components on the PCB board 1, and the working reliability of the direct-insert micro-power module power supply is guaranteed.
In one embodiment, the housing structure 31 is configured in cross-section in any one of a square, a rectangle, and a circle.
The working principle and the beneficial effects of the technical scheme are as follows:
according to the manufacturing method of the direct-insert micro-power module power supply, the magnetic ring transformer 4 is arranged inside the shell structure 31 to form the patch transformer 3, and the patch transformer 3 is connected to the surface of the PCB 1, so that the cross section of the shell structure 31 is set to be any one of a square shape, a rectangular shape and a circular shape in order to adapt to the size of the magnetic ring transformer 4 and the installation space of the PCB 1, the accommodation function of the magnetic ring transformer 4 is met, the space utilization rate of the PCB 1 is effectively improved, the assembly is convenient, and the flexibility is better.
In one embodiment, a plurality of the second pins 32 are symmetrically arranged on two sides of the housing structure 31, and the number of the second pins 32 is at least 4.
The working principle and the beneficial effects of the technical scheme are as follows:
the second pins 32 are symmetrically arranged on two sides of the shell structure 31, the second pins 32 are connected with the third pins 41, the third pins 41 are sequentially arranged by the second pins 32, interference of the third pins 41 during use is prevented, the power connection risk is reduced, the number of the second pins 32 is at least 4, a sufficient contact area is provided for connection of the chip transformer 3 and the PCB 1, the connection strength of the chip transformer 3 and the PCB 1 is ensured, the second pins 32 are mutually guaranteed, one or more second pins 32 are prevented from falling off to influence the electric connection performance, and the reliability of the direct-insert micro-power module power supply is improved.
In one embodiment, the housing structure 31 includes:
the magnetic ring transformer 4 is arranged between the lower shell 311 and the upper shell 312, the second pins 32 are connected to the bottom end of the side wall of the lower shell 311, one end of each second pin 32 penetrates through the lower shell 311, the magnetic ring transformer 4 is arranged between the lower shell 311 and the upper shell 312, and the third pins 41 of the magnetic ring transformer 4 are connected with the second pins 32.
The working principle and the beneficial effects of the technical scheme are as follows:
the housing structure 31 is formed by connecting a lower housing 311 and an upper housing 312, when the surface-mounted transformer 3 is assembled, the upper housing 312 is taken down, the magnetic ring transformer 4 is placed in the accommodating space, the third pins 41 of the magnetic ring transformer 4 are correspondingly connected with the second pins 32 one by one, and then the lower housing 311 and the upper housing 312 are clamped to fix the magnetic ring transformer 4. The shell structure 31 serves as a framework of the patch transformer 3, is simple in structure and convenient to disassemble and assemble, provides a containing space for the magnetic ring transformer 4, realizes the fixing and flexible installation of the magnetic ring transformer 4, protects the magnetic ring transformer 4, simultaneously provides support for the second pins 32, ensures the stable connection of the third pins 41 and the second pins 32, avoids the third pins 41 from being excessively pulled and falling off in the assembling process, and improves the yield of the direct-insert micropower module power supply in the manufacturing process.
In one embodiment, the upper surface of the PCB board 1 is provided with a plurality of pads, the pads are disposed corresponding to the second pins 32, and the pads and the second pins 32 are connected to form a circuit having an electrical connection relationship.
The working principle and the beneficial effects of the technical scheme are as follows:
the PCB board 1 upper surface is provided with a plurality of pad, through inciting somebody to action second pin 32 welds on the pad, is connected SMD transformer 3 and PCB board 1 electricity, improves the stability of electricity connection, the pad corresponds the setting with second pin 32, guarantees second pin 32 welds and presets the position, reduces second pin 32 welding deviation improves the quality of cut straightly micropower module power.
In one embodiment, the second pins 32 and the electronic component 2 are both arranged in a surface mount manner, and the PCB board 1, the electronic component 2 and the surface mount transformer 3 are assembled by using a surface mount machine.
The working principle and the beneficial effects of the technical scheme are as follows:
second pin 32 and electronic components 2 all set up to SMD, optimize the traditional point connection for the face of paster device is connected, have increased the area of contact of connecting the face, can use the chip mounter to go on in the product assembling process the assembly of paster transformer 3 and electronic components 2, during the assembly, through removing the dress head handle paster transformer 3 and electronic components 2 accurately connect in on the PCB board 1 pad, need not manual welding, improved the degree of automation of manufacturing, effectively save the cost of labor, optimized the uniformity of cut-in micropower module power supply product, improve the yield of cut-in micropower module power.
In one embodiment, in the method for manufacturing a direct-insert micro-power module power supply, before the PCB board 1 is used, an image of a pad of the PCB board 1 is acquired by a camera, a controller detects a defect of the pad of the PCB board 1 through a first preset algorithm, and removes the defective PCB board 1, where the first preset algorithm includes:
step 1: carrying out gray level processing on the two-dimensional image of the PCB board 1 bonding pad collected by the camera, calculating to obtain a gray level characteristic value of each point of the image and a texture gradient characteristic value of local gray level of each point of the image by adopting a neighborhood average method, and respectively calculating the gray level characteristic value and the variance of the texture gradient characteristic value;
step 2: comprehensively considering gray scale, texture error and distribution thereof, and calculating the texture characteristic metric of the PCB 1 bonding pad as
Figure 635878DEST_PATH_IMAGE001
：
Figure 391344DEST_PATH_IMAGE002
Wherein the content of the first and second substances,
Figure 859366DEST_PATH_IMAGE003
is a multiple of the variance of the gray level feature values,
Figure 815820DEST_PATH_IMAGE004
is a multiple of the variance of the texture gradient eigenvalues,
Figure 759506DEST_PATH_IMAGE005
the number of pixels in the length direction of the two-dimensional image,
Figure 194029DEST_PATH_IMAGE006
the number of pixels in the width direction of the two-dimensional image,
Figure 906770DEST_PATH_IMAGE007
to fall in a gray level error level of
Figure 502968DEST_PATH_IMAGE008
Texture gradient error level of
Figure 199528DEST_PATH_IMAGE009
The pixel point statistics of (1);
and step 3: judging the defect condition of the PCB board 1 welding disc, wherein the judgment result is
Figure 172163DEST_PATH_IMAGE010
：
Figure 4990DEST_PATH_IMAGE011
Wherein the content of the first and second substances,
Figure 772089DEST_PATH_IMAGE012
indicating that the detected bonding pad of the PCB board 1 has defects, eliminating the PCB board 1,
Figure 690367DEST_PATH_IMAGE013
indicating that the detected bonding pad of the PCB board 1 has no defect or the defect is negligible, using the PCB board 1 for assembly,
Figure 463763DEST_PATH_IMAGE014
representing a preset texture of the PCB board 1 bonding padCharacteristic metric value
Figure 885517DEST_PATH_IMAGE015
The threshold value of (2).
The working principle and the beneficial effects of the technical scheme are as follows:
use the chip mounter right in the product assembling process PCB board 1 with paster transformer 3 and electronic components 2 assemble, provide set up in a plurality of pad on the PCB board 1, the PCB board receives external environment when erosion and external force destroy in production and transportation, can produce the texture characteristic defect, influences the normal use of pad, consequently, before PCB board 1 uses, gather through the camera the orthographic two-dimensional image of PCB board pad carries out grey scale processing to the image to gray level characteristic value and the texture gradient characteristic of image each point calculate, according to the error and the distribution condition of computational result, calculate the texture characteristic metric value of PCB board 1 pad, when its texture characteristic metric value that surpasss the normal use pad of predetermineeing, show that there is the defect in the PCB board 1 who detects, reject. By the aid of the calculation method, the defect condition of the bonding pad on the PCB 1 is detected, the PCB 1 used in the manufacturing process is pre-screened, a theoretical basis is provided for failure evaluation of the bonding pad on the PCB 1, effectiveness of the bonding pad is guaranteed, the chip transformer 3 and the electronic component 2 are prevented from falling off and being powered off due to failure of the bonding pad, reliability of the direct-insert micro-power module power supply is improved, the yield of the direct-insert micro-power module power supply is further improved, manual detection is not needed, errors observed by human eyes are reduced, and the automation degree of the manufacturing process is improved.
In one embodiment, the method for manufacturing an in-line micro-power module power supply further comprises:
the types of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) are limited, and the method comprises the following steps:
any one of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) is used as a limiting target;
acquiring a preset category list corresponding to the limited target;
selecting any one of the preset category lists as a target category;
acquiring first target big data associated with the target type through a preset first acquisition path;
acquiring second target big data associated with the target type through a preset second acquisition path;
acquiring a preset scoring model;
the scoring model is adopted to score the target type for multiple times based on the first target big data, and a first score output by the scoring model is obtained after each scoring;
the scoring model is adopted to score the target type for multiple times based on the second target big data, and a second score output by the scoring model is obtained after each scoring;
calculating a ranking index of the target category based on the first score and the second score, the calculation formula being as follows:
Figure 354676DEST_PATH_IMAGE016
Figure 370036DEST_PATH_IMAGE030
Figure 74687DEST_PATH_IMAGE018
wherein the content of the first and second substances,
Figure 491893DEST_PATH_IMAGE019
for the purpose of said ranking index,
Figure 991007DEST_PATH_IMAGE020
is a natural constant and is a natural constant,
Figure 493664DEST_PATH_IMAGE021
and
Figure 736427DEST_PATH_IMAGE022
is a preset weight value, and is used as a weight value,
Figure 273718DEST_PATH_IMAGE023
performing a second targeting class for the scoring model based on the first targeting big data
Figure 943734DEST_PATH_IMAGE024
The first score output after the secondary scoring,
Figure 199266DEST_PATH_IMAGE025
a total number of times the scoring model scores the target category based on the first target big data,
Figure 855506DEST_PATH_IMAGE026
performing a second targeting class for the scoring model based on the second targeting big data
Figure 371938DEST_PATH_IMAGE024
The second score output after the secondary scoring,
Figure 85292DEST_PATH_IMAGE027
a total number of times the scoring model scores the target category based on the second target big data,
Figure 687175DEST_PATH_IMAGE028
is a preset first score threshold value and is,
Figure 147106DEST_PATH_IMAGE029
is a preset second score threshold;
and selecting the target type corresponding to the maximum value of the ranking index as the type of the limited target.
The working principle and the beneficial effects of the technical scheme are as follows:
when the direct-insert micro-power module power supply is manufactured, a better PCB (1), an electronic component (2), a patch transformer (3) and a magnetic ring transformer (4) are selected, namely the types of the PCB, the electronic component, the patch transformer and the magnetic ring transformer are limited; the preset category list specifically includes: the staff can collect and combine the models provided by the suppliers into a list; the preset first obtaining path specifically includes: the system is connected with a manufacturer, the manufacturer tests samples of various types provided by various suppliers for multiple times, test results are summarized, and first target big data are data corresponding to target types in the test results; the preset second obtaining path specifically includes: the second target big data is the data corresponding to the target type in the evaluation data; the preset scoring model specifically comprises the following steps: the model is generated by learning a large number of test results, evaluation data and manual scoring records by using a machine learning algorithm, the model can be automatically scored based on the test result data or the evaluation data, and the higher the score is, the better the corresponding device is; calculating a sorting index based on the first score and the second score, sorting various types in a preset type list, selecting the type corresponding to the maximum value of the sorting index as the type to be limited by the corresponding device, namely selecting the type to be used for manufacturing the direct-insert micro-power module power supply; the preset first score threshold specifically includes: for example, 98; the preset second score threshold specifically includes: for example: 99.
the embodiment of the invention can help workers to intelligently select the better PCB (1), the electronic component (2), the patch transformer (3) and the magnetic ring transformer (4), thereby improving the convenience and the quality of the direct-insert micropower module power supply.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (8)

1. A method for manufacturing a direct-insert micro-power module power supply is characterized by comprising the following steps:
s1, providing a PCB (1), wherein one end of the PCB (1) is provided with a plurality of first pins (11);
s2, connecting the electronic component (2) to the lower surface of the PCB (1);
s3, providing a shell structure (31), and uniformly connecting a plurality of second pins (32) at the bottom end of the side wall of the shell structure (31);
s4, installing the magnetic ring transformer (4) in the shell structure (31), connecting the third pin (41) on the magnetic ring transformer (4) with the second pin (32), and assembling to form a patch transformer (3);
s5, connecting the patch transformer (3) to the upper surface of the PCB (1);
before PCB board (1) was used, gather through the camera the image of PCB board (1) pad, the controller is right through first preset algorithm PCB board (1) pad carries out defect detection, will have the defect PCB board (1) is rejected, first preset algorithm includes:
step 1: carrying out gray level processing on a two-dimensional image of the welding disc of the PCB (1) collected by the camera, calculating a gray level characteristic value of each point of the image and a texture gradient characteristic value of local gray level of each point of the image by adopting a neighborhood average method, and respectively calculating the gray level characteristic value and the variance of the texture gradient characteristic value;
step 2: comprehensively considering gray scale, texture error and distribution thereof, and calculating the texture characteristic metric value E of the bonding pad of the PCB (1) as follows:
Figure FDA0003246358520000011
wherein u is a multiple of the gray scale feature value variance, v is a multiple of the texture gradient feature value variance, a is the number of pixels in the length direction of the two-dimensional image, b is the number of pixels in the width direction of the two-dimensional image, and M (u, v) is a pixel statistic falling into a gray scale error level of u and a texture gradient error level of v;
and step 3: judging the defect condition of the welding disc of the PCB (1), wherein the judgment result FRU is as follows:
Figure FDA0003246358520000021
wherein A represents that the detected PCB board (1) has defects, the PCB board (1) is removed, B represents that the detected PCB board (1) has no defects or the defects are negligible, the PCB board (1) is used for assembly, EcA threshold value representing a preset texture characteristic metric value E of a bonding pad of the PCB (1);
further comprising: the types of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) are limited;
wherein, to PCB board (1), electronic components (2), paster transformer (3) and magnetic ring transformer (4) kind are injectd, include:
any one of the PCB (1), the electronic component (2), the surface mounted transformer (3) and the magnetic ring transformer (4) is used as a limiting target;
acquiring a preset category list corresponding to the limited target;
selecting any one of the preset category lists as a target category;
acquiring first target big data associated with the target type through a preset first acquisition path;
acquiring second target big data associated with the target type through a preset second acquisition path;
acquiring a preset scoring model;
the scoring model is adopted to score the target type for multiple times based on the first target big data, and a first score output by the scoring model is obtained after each scoring;
the scoring model is adopted to score the target type for multiple times based on the second target big data, and a second score output by the scoring model is obtained after each scoring;
calculating a ranking index of the target category based on the first score and the second score, the calculation formula being as follows:
Figure FDA0003246358520000031
Figure FDA0003246358520000032
Figure FDA0003246358520000033
wherein d is the ranking index, e is a natural constant, γ1And gamma2Is a preset weight value, sigma1,iScoring the target category an ith time based on the first target big data and outputting the first score, beta, of the scoring model1Total number of times, σ, that the scoring model scores the target class based on the first target big data2,iThe second score, beta, output after the ith scoring of the target category by the scoring model based on the second target big data2Total number of times, σ, that the scoring model scores the target class based on the second target big data1,0Is a preset first score threshold, σ2,0Is a preset second score threshold;
and selecting the target type corresponding to the maximum value of the ranking index as the type of the limited target.
2. An in-line micro-power module power supply manufacturing method according to claim 1, characterized in that an end array of the PCB board (1) is provided with a plurality of slots (12), the first pin (11) is formed between two adjacent slots (12), and the first pin (11) is integrally formed with the PCB board (1).
3. The manufacturing method of the in-line micro-power module power supply according to claim 1, wherein the surface of the first pin (11) is coated with a copper sheet, and the first pin (11) is electrically connected with the electronic component (2) and the patch transformer (3) through a wire.
4. An in-line micro power module power supply manufacturing method according to claim 1, characterized in that the housing structure (31) is configured with any one of a square, a rectangle and a circle in cross section.
5. An in-line micro power module power supply manufacturing method according to claim 1, characterized in that a number of the second pins (32) are symmetrically arranged on both sides of the housing structure (31), and the number of the second pins (32) is at least 4.
6. An in-line micro-power module power supply manufacturing method according to claim 1, characterized in that the housing structure (31) comprises: the magnetic ring transformer is characterized in that a lower shell (311) and an upper shell (312) are detachably connected, a containing space is formed between the lower shell (311) and the upper shell (312), the magnetic ring transformer (4) is installed in the containing space, the second pins (32) are connected to the bottom end of the side wall of the lower shell (311), one ends of the second pins (32) penetrate through the inside of the lower shell (311), the magnetic ring transformer (4) is installed between the lower shell (311) and the upper shell (312), and third pins (41) of the magnetic ring transformer (4) are connected with the second pins (32).
7. The method for manufacturing the direct-insert micro-power module power supply according to claim 1, wherein a plurality of bonding pads are arranged on the upper surface of the PCB (1), the bonding pads are arranged corresponding to the second pins (32), and the bonding pads and the second pins (32) are connected to form a circuit with an electrical connection relationship.
8. The manufacturing method of the direct-insert micro-power module power supply according to claim 1, wherein the second pin (32) and the electronic component (2) are both arranged in a patch manner, and the PCB (1), the electronic component (2) and the patch transformer (3) are assembled by a patch machine.
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