CN215266351U - Die bonder - Google Patents

Abstract

The utility model discloses a solid brilliant machine, including the platen, be equipped with mobilizable work box on the platen and with the runner of work box intercommunication, the relative both sides of work box are equipped with respectively and paste the dress subassembly, paste the dress subassembly including carrying the material subassembly, gu brilliant subassembly and machine vision subassembly, it includes the first movable plate of portable setting to carry the material subassembly, be equipped with two at least year material platforms on the first movable plate and carry the material platform for the rotatable setting of first movable plate, gu brilliant subassembly includes the solid brilliant swing arm of carrying the chip between year material platform and work box, machine vision subassembly is including setting up the last sight glass section of thick bamboo of carrying between material subassembly and the solid brilliant subassembly, and go up sight glass section of thick bamboo towards Z axle positive direction setting. The utility model provides a solid brilliant machine has improved the efficiency of subsides dress chip on jumbo size LED support, and gu brilliant swing arm can accurately pick up corresponding chip and paste it to the LED support on, satisfy the production demand of pasting dress multiple chip and a large amount of chip on same LED support.

Description

Die bonder

Technical Field

The utility model relates to a semiconductor package equipment technical field especially relates to a solid brilliant machine.

Background

The die bonder is an automatic production device for attaching chips to LED supports in a subsequent LED packaging production line. Along with the fact that products such as LED display screens are larger and larger in size and the types and the number of chips mounted on the products are larger and larger, the types and the number of crystal rings for containing the chips, which are stored in the existing crystal fixing machine, are limited, multiple machine halt is needed in the production process of LED products to replace the types of the crystal rings or supplement new crystal rings, the working efficiency of the crystal fixing machine is reduced, the types of the crystal rings can be wrong in the process of manually replacing the crystal rings, or the electrodes of the chips picked up by the crystal fixing machine are reversed due to the wrong placement position of the crystal rings, and further unqualified LED products are caused, and therefore the production requirements of the LED products with the large size and the various chips are met by the crystal fixing machine.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the die bonder can meet the production requirements of large-size LED products with various chips.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a solid brilliant machine, includes the platen, be equipped with on the platen along X axle direction and Y axle direction mobilizable work box and with the runner of work box intercommunication, the ascending relative both sides in work box X axle direction are equipped with respectively and paste the dress subassembly, paste the dress subassembly including carrying material subassembly, solid brilliant subassembly and machine vision subassembly, it includes the first movable plate of the mobilizable setting of X axle direction and Y axle direction to carry the material subassembly, be equipped with two at least year material platforms just on the first movable plate carry the material platform for the rotatable setting of first movable plate, gu brilliant subassembly includes carry the material platform and the solid brilliant swing arm of transport chip between the work box, machine vision subassembly is including setting up carry the material subassembly with gu a sight glass section of thick bamboo between the brilliant subassembly, just go up sight glass section of thick bamboo and set up towards Z axle positive direction.

Further, the die bonding assembly further comprises a die bonding welding head, and the die bonding swing arm is in transmission connection with the output end of the die bonding welding head.

Furthermore, one end of the die bonding swing arm, which is far away from the die bonding welding head, is provided with a suction nozzle.

Furthermore, subsides dress subassembly still includes to set up first movable plate below the thimble assembly, the thimble assembly includes the thimble of liftable setting in the Z axle direction.

Furthermore, the thimble assembly further comprises a second moving plate which is movably arranged along the X-axis direction and the Y-axis direction, and the thimble is arranged on the second moving plate.

Furthermore, the ejector pin is arranged on the second moving plate in a lifting mode along the Z-axis direction.

Further, the machine vision assembly further comprises a crystal taking lens barrel, wherein the crystal taking lens barrel is located above the first moving plate and is arranged in the direction of the Z axis negative direction.

Furthermore, the number of the material loading platforms is three, and the three material loading platforms are arranged in a row along the Y-axis direction.

Furthermore, the opposite sides of the work box in the Y-axis direction are respectively provided with the flow channel, one end of the flow channel, which is far away from the work box, is provided with a flow channel port, and the flow channel port is used for driving the LED support to enter and exit the flow channel.

Further, the runner port extends out of an area enclosed by a projection of the bedplate in the Z-axis direction.

The beneficial effects of the utility model reside in that: the utility model provides a die bonder is through set up two sets of subsides dress subassembly in the both sides of work box and paste the LED chip to the LED support in the work box simultaneously, improve the efficiency of pasting the chip on jumbo size LED support, and the material carrying subassembly in pasting dress subassembly includes a plurality of material carrying platforms, can contain different kinds of brilliant rings respectively on the material carrying platform and supply solid brilliant subassembly to pick up, and material carrying platform can not only follow first movable plate horizontal migration, also can rotate for first movable plate, do benefit to solid brilliant swing arm and accurately pick up corresponding chip, and discern the chip through the sight glass section of thick bamboo in the process that solid brilliant swing arm removes the chip to the LED support, judge whether the direction of corresponding chip kind and chip bottom electrode of waiting to paste is correct, and then make solid brilliant swing arm pick up corresponding kind of chip and paste it on the LED support according to the technological rule in proper order, satisfy the production demand of multiple chip and a large amount of chips on same LED support, and improve the product quality.

Drawings

Fig. 1 is a schematic structural view of a die bonder in accordance with a first embodiment of the present invention;

FIG. 2 is an enlarged view taken at A in FIG. 1;

FIG. 3 is an enlarged view at B of FIG. 1;

fig. 4 is an enlarged view at C in fig. 1.

Description of reference numerals:

1. a platen; 2. a working box; 3. a flow channel; 31. a runner port; 4. a loading assembly; 41. a material loading platform; 42. a first moving plate; 5. a die bonding assembly; 51. fixing a crystal and swinging the arm; 52. a die bonding welding head; 53. a suction nozzle; 6. a machine vision component; 61. a top view lens barrel; 62. taking a crystal lens barrel; 7. a thimble assembly; 71. a thimble; 8. and (5) fixing the lens cone.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 4, a die bonder includes a platen 1, a work box 2 movable along an X-axis direction and a Y-axis direction and a runner 3 communicated with the work box 2 are disposed on the platen 1, a bonding assembly is disposed on each of two opposite sides of the work box 2 in the X-axis direction, the bonding assembly includes a material loading assembly 4, a die bonder assembly 5 and a machine vision assembly 6, the material loading assembly 4 includes a first moving plate 42 movably disposed along the X-axis direction and the Y-axis direction, at least two material loading tables 41 are disposed on the first moving plate 42, the material loading tables 41 are rotatably disposed relative to the first moving plate 42, the die bonder assembly 5 includes a die bonder swing arm 51 for carrying chips between the material loading tables 41 and the work box 2, the machine vision assembly 6 includes an upper view lens barrel 61 disposed between the material loading assembly 4 and the die bonder assembly 5, and the upper view mirror cylinder 61 is arranged towards the positive direction of the Z axis.

From the above description, the beneficial effects of the present invention are: the utility model provides a solid brilliant machine has improved the efficiency of subsides dress chip on jumbo size LED support, and gu brilliant swing arm 51 can accurately pick up corresponding chip and paste it to the LED support on, satisfy the production demand of pasting the multiple chip of dress and a large amount of chips on same LED support to product quality has been improved.

Further, the die bonding assembly 5 further comprises a die bonding welding head 52, and the die bonding swing arm 51 is in transmission connection with an output end of the die bonding welding head 52.

Further, one end of the die bonding swing arm 51 away from the die bonding welding head 52 is provided with a suction nozzle 53.

As can be seen from the above description, the die bonding swing arm 51 is driven by the die bonding head 52 to swing so that the suction nozzle 53 disposed at the end of the die bonding swing arm 51 aligns with and sucks the chip, and then the chip is moved to the corresponding position of the LED holder in the work box 2, thereby completing the mounting of the chip.

Further, the mounting component further includes a thimble assembly 7 disposed below the first moving plate 42, and the thimble assembly 7 includes a thimble 71 disposed in a direction of the Z axis in a lifting manner.

Further, the thimble assembly 7 further includes a second moving plate movably disposed along the X-axis direction and the Y-axis direction, and the thimble 71 is disposed on the second moving plate.

Further, the thimble 71 is arranged on the second moving plate in a liftable manner along the Z-axis direction.

As can be seen from the above description, the ejector pin assembly 7 disposed on the first moving plate 42 is used for ejecting the chip to be sucked up to separate it from the blue film of the die ring for picking up by the die attach swing arm 51, and the ejector pin 71 for abutting against the chip can move horizontally with the second moving plate or rotate relative to the second moving plate to align with and eject the chip.

Further, the machine vision assembly 6 further includes a crystal taking lens barrel 62, wherein the crystal taking lens barrel 62 is located above the first moving plate 42, and the crystal taking lens barrel 62 is disposed toward the negative direction of the Z axis.

As can be seen from the above description, the position of the chip to be picked up is identified by the wafer picking lens barrel 62, and the distance that the first moving plate 42 needs to move in the horizontal direction is determined, so that the first moving plate 42 drives the corresponding chip on the material loading table 41 to reach the position for the wafer fixing swing arm 51 to pick up, thereby improving the picking efficiency of the wafer fixing swing arm 51.

Further, the number of the material loading platforms 41 is three, and the three material loading platforms 41 are arranged in a row along the Y-axis direction.

It can be known from the above description that the number of the material loading platforms 41 can be set to three, and three kinds of R, G, B chips or chips capable of emitting light with different wave bands are respectively contained in the three material loading platforms 41, so as to meet the requirement of mounting various chips on the LED support.

Furthermore, the flow channels 3 are respectively arranged on two opposite sides of the work box 2 in the Y-axis direction, a flow channel port 31 is arranged at one end of the flow channel 3, which is far away from the work box 2, and the flow channel port 31 is used for driving the LED support to enter and exit the flow channel 3.

Further, the runner port 31 extends out of an area surrounded by a projection of the bedplate 1 in the Z-axis direction.

As can be seen from the above description, the runner ports 31 of the multiple die bonder can be butted to connect the multiple die bonders, so that the LED support can be transferred to the next die bonder to bond another part of chips after completing the bonding of part of chips on one die bonder, thereby realizing the cooperative operation of the multiple die bonders and meeting the production requirements of complex products.

Example one

Referring to fig. 1 to 4, a first embodiment of the present invention is: a die bonder is used for mounting an LED chip on an LED bracket and realizing the automatic production of products such as an LED display screen.

As shown in fig. 1, the die bonder comprises a platen 1, a work box 2 for accommodating an LED support and a runner 3 for transporting the LED support to enter and exit the work box 2 are arranged on the platen 1, the work box 2 is movably arranged on the platen 1 along an X-axis direction and a Y-axis direction, mount components are respectively arranged on two opposite sides of the work box 2 in the X-axis direction, the mount components comprise a carrier component 4, a die bonder component 5 and a machine vision component 6, wherein the carrier component 4 is provided with a plurality of die rings, a plurality of chips are attached to the surfaces of the die rings for the die bonder to pick up, the die bonder component 5 picks up the chips from the die rings and moves the chips to a position on the LED support brushed with solder paste in advance to bond the chips with the LED support, the machine vision component 6 is used for identifying the positions of the chips and the positions to be mounted on the LED support in the process of picking up the chips and mounting the chips by the die bonder component 5, the die bonder component 5 sequentially bonds the corresponding types of chips to the preset positions according to the process procedures, and the bonding components located on two sides of the work box 2 simultaneously bond the chips on the LED support in the work box 2, so that the production efficiency of large-size LED products is greatly improved.

Referring to fig. 2, the material loading assembly 4 includes a first moving plate 42 and a material loading platform 41 disposed on the first moving plate 42, the first moving plate 42 is movably disposed along an X-axis direction and a Y-axis direction, the material loading platform 41 is rotatably disposed relative to the first moving plate 42, a wafer ring is disposed on an upper surface of the material loading platform 41, and one of chips on the wafer ring can be moved to a predetermined position for the die attach assembly 5 to pick up by the material loading platform 41 being driven by the first moving plate 42 to move along a horizontal direction and by the rotation of the material loading platform 41.

Specifically, the first moving plate 42 is provided with three material loading tables 41, the three material loading tables 41 are arranged in a row along the Y-axis direction, the three material loading tables 41 can be respectively placed with crystal rings attached with different types of chips, for example, R, G, B chips, or chips emitting light of different wave bands, and the horizontal movement of the first moving plate 42 can enable any one of the chips on the material loading tables 41 to be picked up by the fixed component, so as to meet the production requirement of mounting various chips on the LED support. The three material loading platforms 41 can also contain the same chip, so that a large number of the same chip can be provided for the die bonding assembly 5, and the requirement for producing large-size LED products can be further met.

Referring to fig. 2 and fig. 3, the die bonding assembly 5 includes a die bonding head 52 and a die bonding swing arm 51 disposed at an output end of the die bonding head 52, wherein a suction nozzle 53 is disposed at an end of the die bonding swing arm 51 away from the die bonding head 52, and the die bonding head 52 drives the die bonding swing arm 51 to swing so that the suction nozzle 53 can pick up a chip from the material loading platform 41 and then move the chip onto the work box 2, thereby completing the die attachment.

In detail, the top plate 1 is further provided with a thimble assembly 7, the thimble assembly 7 is located below the first moving plate 42, the thimble assembly 7 is provided with a thimble 71 capable of ascending and descending in the Z-axis direction, and the thimble 71 can extend into the bottom of the material loading table 41 and abut against the lower surface of the die ring, so that a chip correspondingly attached to the upper surface of the die ring is separated from the die ring to be picked up by the die bonding swing arm 51. The ejector pin assembly 7 further comprises a second moving plate movable along the X-axis direction and the Y-axis direction, so that the ejector pins 71 are aligned with the chips to be picked up on the material loading table 41 through the cooperation of the first moving plate 42 and the second moving plate, and the die bonding swing arms 51 are ensured to accurately pick up the corresponding chips.

As shown in fig. 1 to 3, the machine vision assembly 6 includes a taking lens barrel 62 and an upper view lens barrel 61. The crystal taking lens barrel 62 is arranged above the first moving plate 42 and is arranged in the negative direction of the X axis, the crystal taking lens barrel 62 is used for acquiring an image of the upper surface of the loading assembly 4 to judge the position of a chip to be picked up currently, and then the first moving plate 42 and the material table act according to the identification result of the crystal taking lens barrel 62 to move the chip to a preset position and move the thimble assembly 7 by a corresponding distance to enable the thimble 71 to be aligned with the chip. The upper view mirror cylinder 61 is arranged on the platen 1 and located between the material loading component 4 and the die bonding component 5, the upper view mirror cylinder 61 is arranged towards the positive direction of the Z axis and the die bonding swing arm 51 passes through the area shot by the upper view mirror cylinder 61 in the process of moving a chip, the die bonding swing arm 51 firstly moves the chip to the upper side of the upper view mirror cylinder 61 after picking up the chip, the upper view mirror cylinder 61 shoots and identifies the bottom of the chip to judge whether the type of the chip and the direction of the bottom electrode of the chip are correct, if the type of the chip or the direction of the electrode is incorrect, the die bonding machine stops running and reports errors, if the chip is normal, the die bonding swing arm 51 continuously swings to mount the chip to the preset position of the LED support, and the defects of wrong type of the chip or reverse mounting of the chip and the like are prevented from causing the quality of the LED product to be unqualified.

In order to improve the precision of the die bonder, the platen 1 is further provided with a die bonder lens barrel 8, the die bonder lens barrel 8 is located above the work box 2 and arranged in the negative direction of the Z axis, the die bonder lens barrel 8 is used for taking a picture of an LED support in the work box 2 to confirm the position of a chip to be bonded, and the work box 2 performs corresponding actions according to analysis results so that the die bonder swing arm 51 can place the chip at the corresponding position.

Referring to fig. 1 and 4, the flow channels 3 are respectively disposed on two opposite sides of the work box 2 in the Y-axis direction, the two flow channels 3 are respectively communicated with the work box 2, a flow channel opening 31 for driving the LED support to enter and exit the work box 2 is disposed at one end of the flow channel 3 away from the work box 2, and the flow channel opening 31 extends out of the bedplate 1. And then the flow channels 3 of the multiple die bonder are butted through the flow channel openings 31, so that the multiple die bonder are arranged in a row along the direction of transferring the LED support along the flow channels 3, and each die bonder is responsible for mounting chips in partial areas on the LED support, so that the multiple die bonder cooperate to complete the production of LED products. And the transfer direction of the LED support on the runner 3 can be set according to actual requirements, for example, the LED support can move back and forth between the two die bonder, wherein one die bonder can replace the other die ring on the die bonder when performing chip bonding operation, so as to continuously mount the LED support.

To sum up, the die bonder provided by the utility model respectively arranges the pasting components at the two opposite sides of the working box and pastes the chips on the LED support in the working box, thereby increasing the number of the chips which can be pasted on the LED support in unit time and improving the production efficiency of large-size LED products; the material carrying assembly of the die bonder comprises a plurality of material carrying tables, different die rings can be placed on the material carrying tables for the die bonder to take, so that different types of chips can be pasted on the LED bracket according to actual production requirements, and the display effect of an LED product is improved; an upward-looking lens barrel used for identifying the type of the chip and the direction of the bottom electrode is arranged on a platen of the die bonder, whether the type of the chip moving by the die bonder swing arm is consistent with a preset value and whether the chip mounting direction is correct is checked through the upward-looking lens barrel, the type error or the direction error of the chip attached to the LED support is effectively avoided, the quality of the LED product meets the requirement, and defective products are prevented; the LED support can be directly circulated among the multiple die bonder through the butt joint of the multiple die bonder, the multiple die bonder are respectively responsible for partial areas on the LED support, so that the production efficiency is improved through the cooperation of the multiple die bonder, and the circulation direction of the LED support on the multiple die bonder is controllable, so that the requirements of different production lines are met.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims (10)

1. The utility model provides a die bonder, includes the platen, be equipped with on the platen along X axle direction and Y axle direction mobilizable work box and with the runner of work box intercommunication, its characterized in that: the relative both sides in the X axle of work box side are equipped with respectively and paste dress subassembly, paste dress subassembly including carrying the material subassembly, solid brilliant subassembly and machine vision subassembly, it includes the first movable plate of the portable setting of X axle direction and Y axle direction to carry the material subassembly, be equipped with two at least year material platforms on the first movable plate just carry the material platform for the rotatable setting of first movable plate, gu brilliant subassembly includes carry the material platform and carry the solid brilliant swing arm of chip between the work box, machine vision subassembly is including setting up carry the material subassembly with gu an upper view mirror section of thick bamboo between the brilliant subassembly, just an upper view mirror section of thick bamboo sets up towards Z axle positive direction.

2. The die bonder of claim 1, wherein: the die bonding assembly further comprises a die bonding welding head, and the die bonding swing arm is in transmission connection with the output end of the die bonding welding head.

3. The die bonder of claim 2, wherein: and one end of the die bonding swing arm, which is far away from the die bonding welding head, is provided with a suction nozzle.

4. The die bonder of claim 1, wherein: the mounting component further comprises a thimble component arranged below the first moving plate, and the thimble component comprises a thimble arranged in a lifting manner in the Z-axis direction.

5. The die bonder of claim 4, wherein: the thimble assembly further comprises a second moving plate which can be movably arranged along the X-axis direction and the Y-axis direction, and the thimble is arranged on the second moving plate.

6. The die bonder of claim 5, wherein: the ejector pin is arranged on the second moving plate in a lifting mode along the Z-axis direction.

7. The die bonder of claim 1, wherein: the machine vision assembly further comprises a crystal taking lens barrel, wherein the crystal taking lens barrel is located above the first moving plate and is arranged towards the Z-axis negative direction.

8. The die bonder of claim 1, wherein: the number of the material loading platforms is three, and the three material loading platforms are arranged in a row along the Y-axis direction.

9. The die bonder of claim 1, wherein: the opposite sides of the working box in the Y-axis direction are respectively provided with the flow channel, one end of the flow channel, which is far away from the working box, is provided with a flow channel port, and the flow channel port is used for driving the LED support to enter and exit the flow channel.

10. The die bonder of claim 9, wherein: the runner port extends out of an area enclosed by the projection of the bedplate in the Z-axis direction.

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