CN215266353U

CN215266353U - Mini LED die bonder

Info

Publication number: CN215266353U
Application number: CN202121142014.9U
Authority: CN
Inventors: 张跃春; 罗元明; 王志兵
Original assignee: ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Current assignee: ADVANCED OPTOELECTRONIC EQUIPMENT (SHENZHEN) CO LTD
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2021-12-21
Anticipated expiration: 2031-05-25

Abstract

The utility model discloses a Mini LED die bonder, including the platen, be equipped with work box and runner on the platen, the both sides of work box are equipped with the subsides dress subassembly respectively, the subsides dress subassembly is including carrying the material subassembly, get brilliant subassembly, correction subassembly and solid brilliant subassembly, it includes two at least year material platforms to carry the material subassembly, the correction subassembly is including proofreading and correct the platform, it includes getting brilliant arm to get brilliant subassembly, gu brilliant subassembly includes solid brilliant arm, the dress subassembly still includes ring changing subassembly and send the ring subassembly, it is close to carry the setting of material subassembly and send the ring subassembly to range upon range of being equipped with a plurality of brilliant rings to send the ring subassembly, the ring changing subassembly includes mobilizable absorption claw, it is used for carrying brilliant ring to absorb the claw. The Mini LED die bonder can produce Mini LED products with better display effect, greatly improves production efficiency, ensures that the position and the angle of a small-sized Mini LED chip when the Mini LED chip is pasted on an LED support are consistent with preset values, prevents unexpected deflection of the Mini LED chip on the LED support, improves the quality of the Mini LED products, and avoids defective products.

Description

Mini LED die bonder

Technical Field

The utility model relates to a semiconductor package equipment technical field especially relates to a solid brilliant device of Mini LED.

Background

With the development of the LED display screen technology, Mini LED chips with the size of 50-200 microns appear on the market, the size of the Mini LED chips is smaller than that of the traditional LED chips, and then more chips can be pasted on the same display area, so that the display effect of the LED display screen is more exquisite, and the brightness, the color gamut and other various performances of the LED display screen are improved. The problem that the conventional die bonder needs to be stopped for replacing or supplement a die ring for containing the Mini LED chips for many times, so that the production efficiency is reduced, and the requirement of the market on the production of the Mini LED products is difficult to meet.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: provided is a high-precision Mini LED die bonding device.

In order to solve the technical problem, the utility model discloses a technical scheme be: a Mini LED die bonder comprises a platen, wherein a work box and a flow channel which are communicated are arranged on the platen, the work box is movably arranged along the X-axis direction and the Y-axis direction, mounting assemblies are respectively arranged on two opposite sides of the work box in the X-axis direction, each mounting assembly comprises a material loading assembly, a die taking assembly, a correcting assembly and a die bonding assembly, each material loading assembly comprises at least two material loading tables, each correcting assembly comprises a correcting table, each die taking assembly comprises a die taking arm for moving a chip on each material loading table to the correcting table, each die bonding assembly comprises a die bonding arm for moving the chip on each correcting table to the work box, each mounting assembly further comprises a ring replacing assembly and a ring delivering assembly, each ring delivering assembly is arranged close to each material loading assembly, a plurality of die rings are stacked on each ring delivering assembly, each ring replacing assembly comprises a movable sucking claw, the suction claw is used for conveying the crystal ring between the ring feeding assembly and the material carrying platform.

Furthermore, the ring feeding assembly comprises a ring feeding platform which is arranged in a lifting mode along the Z-axis direction, and a plurality of crystal rings are arranged on the ring feeding platform in a stacking mode.

Furthermore, the ring changing assembly further comprises a first driving element, and the first driving element drives the suction claw to move in the Y-axis direction and the Z-axis direction.

Furthermore, the material loading assembly further comprises material loading plates which can move along the X-axis direction and the Y-axis direction, the material loading platforms are respectively arranged on the material loading plates, and the material loading platforms can be rotatably arranged relative to the material loading plates.

Furthermore, a waste material box is further arranged on the bedplate and is close to the material loading assembly.

Further, paste dress subassembly still including sweeping a yard rifle, it sets up to sweep a yard rifle carry the top of material platform.

Furthermore, a rotatable vacuum suction plate is arranged on the correction table, and the correction table can be movably arranged along the X-axis direction and the Y-axis direction.

Further, a die bonding lens barrel is further arranged on the bedplate and located above the working box.

Furthermore, the surface-mounted component further comprises a crystal taking lens barrel and a correcting lens barrel, wherein the crystal taking lens barrel is arranged above the material carrying table, and the correcting lens barrel is arranged above the correcting table.

Furthermore, the opposite two sides of the working box in the Y-axis direction are respectively provided with the flow channel, and one end of the flow channel, which is far away from the working box, is provided with a channel port for the LED bracket to enter and exit the working box.

The beneficial effects of the utility model reside in that: the Mini LED die bonder provided by the utility model changes the die ring above the material loading platform into the die ring attached with the Mini LED chip through the matching of the material feeding component and the ring replacing component, and a plurality of material loading platforms can respectively place the die rings attached with different Mini LED chips for picking up by the die picking component, so that the Mini LED die bonder can produce Mini LED products with better display effect, the mounting components arranged at the two opposite sides of the working box can simultaneously mount the Mini LED chips on the LED bracket, thereby greatly improving the production efficiency of the Mini LED products, simultaneously, the Mini LED chips on the die rings are moved to the calibration component from the material loading platform for calibration and then moved to the working box by the die bonding component for mounting, ensuring that the position and the angle of the Mini LED chips mounted on the LED bracket with small size are consistent with the preset, preventing the LED bracket of the Mini LED chips from being inclined unexpectedly, the quality of the Mini LED product is improved, and defective products are avoided.

Drawings

Fig. 1 is a schematic structural view of a Mini LED die bonder according to a first embodiment of the present invention;

fig. 2 is a top view of a Mini LED die bonder according to a first embodiment of the present invention;

fig. 3 is a schematic structural view of a work box in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a flow channel in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 5 is a schematic structural view of a loading assembly in a Mini LED die bonder in an embodiment of the present invention;

fig. 6 is a schematic structural view of a ring feeding assembly in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 7 is a schematic structural view of a ring replacement assembly in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 8 is a schematic structural diagram of a calibration assembly in a Mini LED die bonder according to a first embodiment of the present invention;

fig. 9 is a schematic structural view of a thimble in a Mini LED die bonder according to a first embodiment of the present invention.

Description of reference numerals:

1. a platen; 11. a waste material box; 12. a correction lens barrel; 13. taking a crystal lens barrel; 14. fixing a lens cone; 15. a photoelectric sensor; 16. a thimble; 17. a second driving member; 2. a working box; 21. a top plate; 22. a cover plate; 3. a flow channel; 31. a crossing; 4. a loading assembly; 41. a material loading platform; 42. a material carrying plate; 5. taking a crystal component; 51. a crystal taking arm; 52. taking a crystal welding head; 6. a correction component; 61. a correction table; 62. a vacuum suction plate; 7. a die bonding assembly; 71. a die bonding arm; 72. a die bonding welding head; 8. a ring changing assembly; 81. a suction claw; 82. a first driving member; 9. a feed ring assembly; 91. and a ring conveying platform.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 to 9, a Mini LED die bonder includes a platen 1, a work box 2 and a flow channel 3 communicated with each other are disposed on the platen 1, the work box 2 is movably disposed along an X-axis direction and a Y-axis direction, two opposite sides of the work box 2 in the X-axis direction are respectively provided with a die bonding assembly, the die bonding assembly includes a material loading assembly 4, a die taking assembly 5, a correcting assembly 6 and a die bonding assembly 7, the material loading assembly 4 includes at least two material loading tables 41, the correcting assembly 6 includes a correcting table 61, the die taking assembly 5 includes a die taking arm 51 for moving a chip on the material loading table 41 to the correcting table 61, the die bonding assembly 7 includes a die bonding arm 71 for moving a chip on the correcting table 61 to the work box 2, the die bonding assembly further includes a ring changing assembly 8 and a ring feeding assembly 9, the ring feeding assembly 9 is disposed close to the material loading assembly 4, and a plurality of die rings are stacked on the feeding assembly 9, the ring changing assembly 8 comprises a movable suction claw 81, and the suction claw 81 is used for conveying crystal rings between the ring feeding assembly 9 and the material loading platform 41.

From the above description, the beneficial effects of the present invention are: the utility model provides a solid brilliant device of Mini LED can produce the better Mini LED product of display effect, has improved the production efficiency of Mini LED product by a wide margin, and position and angle when guaranteeing small-size Mini LED chip to paste dress to the LED support simultaneously are unanimous with predetermineeing, prevent to appear unexpected crooked on the Mini LED chip LED support to improve the quality of Mini LED product, avoid appearing the defective products.

Further, the ring feeding assembly 9 includes a ring feeding platform 91 arranged in a lifting manner along the Z-axis direction, and a plurality of wafer rings are stacked on the ring feeding platform 91.

As can be seen from the above description, a plurality of wafer rings are stacked on the ring feeding platform 91 for the ring changing assembly 8 to pick up sequentially, and the wafer rings are fed into the picking-up range of the ring changing assembly 8 and are avoided from the moving ring feeding platform 91 by the lifting of the ring feeding platform 91.

Further, the ring changing assembly 8 further includes a first driving member 82, and the first driving member 82 drives the suction claw 81 to move in the Y-axis direction and the Z-axis direction.

As can be seen from the above description, the first driving member 82 drives the suction claws 81 to move in the Y-axis direction and the Z-axis direction, so that the suction claws 81 can stably grip and move the wafer ring.

Further, the material loading assembly 4 further includes material loading plates 42 movable along the X-axis direction and the Y-axis direction, the material loading tables 41 are respectively disposed on the material loading plates 42, and the material loading tables 41 are rotatably disposed relative to the material loading plates 42.

As can be seen from the above description, the movement of the material loading plate 42 in the X-axis and Y-axis directions drives the material loading platform 41 to move and the rotation of the material loading platform 41 makes the crystal taking arm 51 align with a specific Mini LED chip on the material loading platform 41, so that the Mini LED die bonder can sequentially mount the corresponding Mini LED chips on the LED support according to the process rules.

Further, a waste material box 11 is further arranged on the bedplate 1, and the waste material box 11 is arranged close to the material loading assembly 4.

As can be seen from the above description, when the wafer taking assembly 5 takes off all the Mini LED chips on the wafer ring, the ring replacing assembly 8 grabs the wafer ring and puts the wafer ring into the waste box 11, so as to collect the empty wafer rings to one position for processing.

Further, the surface-mounted component further comprises a code scanning gun, and the code scanning gun is arranged above the material loading platform 41.

As can be seen from the above description, a code scanning gun is disposed above the loading platform 41 to identify the type of the wafer ring placed on the loading platform 41, so that the crystal taking assembly 5 can pick up the corresponding type of Mini LED chips.

Further, a rotatable vacuum suction plate 62 is disposed on the calibration stage 61, and the calibration stage 61 is movably disposed along the X-axis direction and the Y-axis direction.

As can be seen from the above description, the crystal taking arm 51 places the Mini LED chip on the vacuum suction plate 62, rotates the Mini LED chip by the rotation of the vacuum suction plate 62 to correct the deviation of the angle of the Mini LED chip, and drives the position of the Mini LED chip by the movement of the correction table 61 in the horizontal direction.

Further, a die bonding lens barrel 14 is further arranged on the bedplate 1, and the die bonding lens barrel 14 is located above the working box 2.

Further, the mounting component further comprises a crystal taking lens barrel 13 and a correcting lens barrel 12, wherein the crystal taking lens barrel 13 is arranged above the material loading platform 41, and the correcting lens barrel 12 is arranged above the correcting platform 61.

As can be seen from the above description, the positions of the Mini LED chips to be picked up on the material loading table 41, the deviation degree of the Mini LED chips on the correction table 61, and the positions of the Mini LED chips to be mounted on the LED support are identified by the components such as the crystal taking barrel 13, the correction barrel 12, and the die bonding barrel 14, so as to further improve the precision of the Mini LED die bonding equipment.

Furthermore, the two opposite sides of the working box 2 in the Y axis direction are respectively provided with the flow channel 3, and one end of the flow channel 3 away from the working box 2 is provided with a port 31 for the LED bracket to enter and exit the working box 2.

As can be seen from the above description, the ports 31 of the plurality of Mini LED die attach devices can be butted to connect the plurality of Mini LED die attach devices, so that the plurality of Mini LED die attach devices are connected, and the same LED support completes the mounting of part of the Mini LED chips on one Mini LED die attach device and then transfers the part of the Mini LED chips to the next Mini LED die attach device for mounting another part of the Mini LED chips, so that the plurality of Mini LED die attach devices operate cooperatively.

Example one

Referring to fig. 1 to 9, a first embodiment of the present invention is: a Mini LED die bonding device is used for mounting Mini LED chips on an LED bracket according to a certain sequence in a subsequent packaging production line of a Mini LED product.

As shown in fig. 1 and 2, the Mini LED die bonder comprises a platen 1, wherein a work box 2 for fixing the position of an LED support and a flow channel 3 communicated with the work box 2 are arranged on the platen 1, the LED support enters and exits the work box 2 through the flow channel 3, the opposite two sides of the working box 2 along the X-axis direction are respectively provided with a mounting component, the mounting component comprises a material loading component 4 for containing a crystal ring, a correction component 6 for correcting the position and the angle of a Mini LED chip, a crystal taking component 5 for conveying the Mini LED chip between the material loading component 4 and the correction component 6, and a crystal fixing component 7 for conveying the Mini LED chip between the correction component 6 and the working box 2, and the Mini LED chip attached to the crystal ring on the loading component 4 is mounted on the LED bracket in the working box 2 through the matched operation of the loading component 4, the crystal taking component 5, the correcting component 6 and the crystal fixing component 7.

Specifically, get brilliant subassembly 5 including getting brilliant arm 51 and driving about get brilliant bonding tool 52 of brilliant arm 51 wobbling, the tip of getting brilliant arm 51 is equipped with the suction nozzle, gu brilliant subassembly 7 is including solid brilliant arm 71 and driving about the tip of solid brilliant bonding tool 72 of solid brilliant arm 71 wobbling also is equipped with the suction nozzle, get brilliant arm 51 and gu brilliant arm 71 all absorbs the Mini LED chip and remove the Mini LED chip through the swing through the suction nozzle that sets up at the tip to realize the Mini LED chip and be in carry material subassembly 4, rectify subassembly 6 and the transportation between the work box 2. And the mounting components positioned on the two opposite sides of the working box 2 run simultaneously and respectively mount Mini LED chips on the LED supports in the working box 2 according to a certain sequence, so that the number of the Mini LED chips mounted on the LED supports in unit time is increased, and the production efficiency of the Mini LED product is improved.

As shown in fig. 2, the work box 2 is movably disposed on the platen 1 along the X-axis direction and the Y-axis direction, so that the suction nozzle at the end of the die bonding arm 71 can align with a position to be mounted on the LED holder. The working box 2 comprises a liftable top plate 21 and a cover plate 22 arranged at an interval with the top plate 21, a space for accommodating the LED support is formed between the top plate 21 and the cover plate 22, an inductor and a liftable first baffle are arranged on the working box 2, the inductor induces that the LED support enters the space, the first baffle rises to stop the LED support to move continuously, meanwhile, the top plate 21 rises to support the LED support to fix the LED support between the top plate 21 and the cover plate 22, after the mounting operation on the LED support is completed, the top plate 21 and the first baffle respectively descend to release the LED support and enable the LED support to retreat from the flow channel 3, the inductor induces that the LED support leaves, and the flow channel 3 sends another LED support into the working box 2.

Referring to fig. 1, 2 and 4, the two opposite sides of the work box 2 along the Y-axis direction are respectively provided with the flow channels 3, and the two flow channels 3 are respectively communicated with the work box 2, one end of the flow channel 3 away from the work box 2 is provided with a port 31 for driving the LED support to move on the flow channel 3 and enter and exit the work box 2, the flow channel 3 is provided with a second baffle plate for blocking the LED support from moving, the platen 1 is provided with a gantry covering the flow channel 3 and the gantry is provided with a photoelectric sensor 15, whether the LED support is in the flow channel 3 can be identified by the photoelectric sensor 15, when the LED support is in the work box 2 and the flow channel 3 is also provided with a support, the second baffle plate rises to prevent the LED support in the flow channel 3 from entering the work box 2, and when the LED support in the work box 2 is moved out, and the second baffle plate descends to enable the LED supports in the flow channel 3 to continue to move, so that the LED supports sequentially enter the working box 2.

Preferably, the runners 3 of the Mini LED die bonder can be sequentially communicated, so that one LED bracket sequentially enters the work boxes 2 of the Mini LED die bonder, each Mini LED die bonder finishes the mounting work of a partial area on the LED bracket, and then Mini LED chips with different colors or different wave bands are respectively mounted on the same LED bracket by the Mini LED die bonder, thereby reducing the number of times for replacing the Mini LED chips on one Mini LED die bonder, enabling the Mini LED die bonder to cooperatively work and improving the display effect of the Mini LED product.

As shown in fig. 5, the loading assembly 4 includes a material loading plate 42 movable along an X-axis direction and a Y-axis direction, and three loading tables 41 respectively disposed on the material loading plate 42, wherein the loading tables 41 contain wafer rings, the three loading tables 41 are arranged in a row on the material loading plate 42, the three loading tables 41 are respectively rotatably disposed relative to the material loading plate 42, meanwhile, the material loading plate 42 is movably disposed relative to the platen 1 along the X-axis direction and the Y-axis direction, so that the loading tables 41 are driven to move in a horizontal direction by the movement of the material loading plate 42, a suction nozzle of the crystal taking arm 51 can align with any Mini LED chip on the wafer ring by the rotation of the loading table 41, and the three loading tables 41 respectively contain wafer rings with Mini LED chips of different colors or wavelengths for the crystal taking arm 51 to pick up, and the phenomenon that different crystal rings are replaced due to shutdown in the operation process of the Mini LED die bonding equipment is avoided, so that the Mini LED die bonding equipment can continuously operate.

Referring to fig. 1, 6 and 7, the mounting assembly further includes a ring replacing assembly 8 and a ring feeding assembly 9, the ring feeding assembly 9 has a ring feeding platform 91 capable of lifting in the Z-axis direction, a plurality of wafer rings are stacked on the ring feeding platform 91, and a plurality of vertical limiting rods are arranged on the ring feeding platform 91 to fix the relative positions of the wafer rings and the ring feeding platform 91. The ring changing assembly 8 comprises a suction claw 81 and a first driving part 82 for driving the suction claw 81 to move, the suction claw 81 comprises a plurality of suction nozzles arranged at intervals so as to ensure that the suction claw 81 is stably adsorbed on the surface of a crystal ring, and the suction claw 81 can move along the Y-axis direction and the Z-axis direction under the driving of the first driving part 82 so as to convey the crystal ring between the ring conveying platform 91 and the material platform. The platen 1 is further provided with a waste box 11, and the suction claws 81 can move empty crystal rings picked from the material table into the waste box 11 so as to centralize the empty crystal rings for subsequent treatment.

As shown in fig. 8, the calibration assembly 6 includes a calibration table 61, a rotatable vacuum suction plate 62 is provided on the calibration table 61, the Mini LED chip is placed on the vacuum suction plate 62 by the crystal taking arm 51, and then the vacuum suction plate 62 sucks the Mini LED chip to fix the position of the Mini LED chip, and the calibration table 61 is movable in the X-axis direction and the Y-axis direction with respect to the platen 1, so that the position of the Mini LED chip can be calibrated by the horizontal movement of the calibration table 61, that is, the rotation of the vacuum suction plate 62. The correcting lens barrel 12 is arranged on the bedplate 1, the correcting lens barrel 12 is arranged right above the correcting table 61, when the Mini LED chip is placed on the vacuum suction plate 62, the correcting lens barrel 12 photographs and identifies the Mini LED chip to judge the offset distance and angle of the Mini LED chip in the horizontal direction, so that the correcting table 61 and the vacuum suction plate 62 perform corresponding actions to align the Mini LED chip, and the correcting precision of the correcting component 6 is improved.

As shown in fig. 1, in order to further improve the mounting accuracy of the Mini LED die bonder, a die taking lens barrel 13 and a die bonding lens barrel 14 are further disposed on the platen 1. The crystal taking lens barrel 13 is located right above the material table and is arranged opposite to a position where the crystal taking arm 51 is in contact with the material table, the crystal taking lens barrel 13 is used for shooting an image of the material table to judge the distance between the position of a Mini LED chip to be picked next and the position picked by the crystal taking arm 51, and then the loading component 4 acts to move the Mini LED chip to a preset position. The die bonding lens barrel 14 is arranged above the working box 2 and is arranged opposite to the working box 2, the die bonding lens barrel 14 is used for shooting images of the working box 2 and judging the distance between the upper and lower positions to be mounted of the LED support and the position where the die bonding arm 71 is mounted, and then the working box 2 performs corresponding actions so that the die bonding arm 71 can be aligned with the position to be mounted.

As shown in fig. 1 and 9, the mounting component further includes a thimble 16 disposed below the material loading platform 41, the thimble 16 is disposed in a liftable manner in a Z-axis direction, and the platen 1 is provided with a second driving member 17 for driving the thimble 16 to move in an X-axis direction and a Y-axis direction, the thimble 16 is driven to align with the Mini LED chip to be sucked by the second driving member 17, and then the thimble 16 is lifted to abut against the blue film of the wafer ring, so that the Mini LED chip attached to the other side of the blue film of the wafer ring is separated, and at this time, the wafer taking arm 51 waiting above the Mini LED chip picks up the Mini LED chip, so that the wafer taking arm 51 can accurately suck the Mini LED chip to be mounted.

To sum up, the material loading assembly of the Mini LED die bonder provided by the present invention comprises a plurality of material loading platforms, wherein different crystal rings can be placed on the material loading platforms for the die bonder to take, so as to mount different types of chips on the LED support according to actual production requirements, and the empty crystal rings on the material loading platforms are replaced by the cooperation of the ring feeding assembly and the ring replacing assembly, thereby improving the working efficiency of the Mini LED die bonder and simultaneously improving the display effect of the Mini LED product; the Mini LED die bonder simultaneously pastes chips on the LED supports in the working box through the pasting components arranged on the two opposite sides of the working box so as to increase the number of the chips which can be pasted on the LED supports in unit time, and the production efficiency of the Mini LED die bonder is greatly improved; the Mini LED die bonder further calibrates the position and the angle of a Mini LED chip placed on a vacuum suction plate of the calibration table through the matching of the calibration component and the correction lens cone, so that the Mini LED chip attached to the surface of the LED support is aligned with the LED support, the Mini LED chip is placed to be inclined, defective products are effectively avoided, and the mounting precision of the Mini LED chip is improved.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. The utility model provides a solid brilliant device of Mini LED, includes the platen, be equipped with work box and the runner that is linked together on the platen, the work box is along X axle direction and the portable setting of Y axle direction, its characterized in that: the utility model discloses a chip mounting machine, including work box, correction platform, material loading component, correction component, material changing component and ring feeding component, relative both sides on the X axle direction of work box are equipped with subsides dress subassembly respectively, it includes carries the material subassembly to paste dress subassembly, gets brilliant subassembly, correction component and solid brilliant subassembly, it includes two at least year material platforms to carry the material subassembly, the correction component includes the correction platform, get brilliant subassembly including with carry the chip on the material platform to get brilliant arm on the correction platform, it still includes ring changing component and ring feeding component to paste dress subassembly, the ring feeding component is close to carry the material subassembly setting just the last range upon range of ring feeding component is equipped with a plurality of brilliant rings, ring changing component includes mobilizable absorption claw, it is used for to absorb the claw send the ring feeding component and carry brilliant ring between the material loading platform.

2. The Mini LED die bonding device of claim 1, wherein: the ring feeding assembly comprises a ring feeding platform which can be arranged in a lifting mode along the Z-axis direction, and a plurality of crystal rings are arranged on the ring feeding platform in a stacking mode.

3. The Mini LED die bonding device of claim 1, wherein: the ring changing assembly further comprises a first driving piece, and the first driving piece drives the suction claw to move in the Y-axis direction and the Z-axis direction.

4. The Mini LED die bonding device of claim 1, wherein: the material loading assembly further comprises material loading plates which can move along the X-axis direction and the Y-axis direction, the material loading platforms are respectively arranged on the material loading plates, and the material loading platforms can be rotatably arranged relative to the material loading plates.

5. The Mini LED die bonding device of claim 1, wherein: the table plate is further provided with a waste material box, and the waste material box is close to the material loading assembly.

6. The Mini LED die bonding device of claim 1, wherein: paste dress subassembly still including sweeping a yard rifle, it sets up to sweep a yard rifle the top of carrying the material platform.

7. The Mini LED die bonding device of claim 1, wherein: the correcting table is provided with a rotatable vacuum suction plate and can be movably arranged along the X-axis direction and the Y-axis direction.

8. The Mini LED die bonding device of claim 1, wherein: the bedplate is also provided with a die bonding lens barrel which is positioned above the working box.

9. The Mini LED die bonding device of claim 1, wherein: the surface mounting component further comprises a crystal taking lens barrel and a correcting lens barrel, wherein the crystal taking lens barrel is arranged above the material carrying table, and the correcting lens barrel is arranged above the correcting table.

10. The Mini LED die bonding device of claim 1, wherein: the opposite sides of the working box in the Y-axis direction are respectively provided with the flow channel, and one end of the flow channel, which is far away from the working box, is provided with a channel port for the LED bracket to enter and exit the working box.