CN205355076U - Full -color SMD display screen support - Google Patents
Full -color SMD display screen support Download PDFInfo
- Publication number
- CN205355076U CN205355076U CN201620048710.6U CN201620048710U CN205355076U CN 205355076 U CN205355076 U CN 205355076U CN 201620048710 U CN201620048710 U CN 201620048710U CN 205355076 U CN205355076 U CN 205355076U
- Authority
- CN
- China
- Prior art keywords
- pad
- down mounting
- terminal pad
- pedestal
- polygon bowl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a full -color SMD display screen support, this support include three kinds of structures, the flip -chip support design that the positive flip -chip pad that is provided with two rows of parallel symmetric distributions in the bottom for polygon bowl cup was organized, and the thermal resistance is low, need not the gold thread welding, encapsulates the finished product and avoids the gold thread to receive glue stress to influence and result in breaking, a six pins of the miniwatt design of the solid crystalline region between the bonding wire district that openly is provided with two rows of parallel symmetric distributions for the bottom of polygon bowl cup and the two rows of bonding wires districts, has guaranteed to improve reliability of an item by thermoelectric separation, one kind for the bottom front triangle of polygon bowl cup sets up respectively to bonding wire district, and one corner sets up to positive positive bonding pad altogether, and the bottom of polygon bowl cup openly removes four pins of the high -power design that the bonding wire foreign was solid crystalline region, guarantees thermoelectric separation, and realized three kind red, green, blue chips anodal be total to positive, the design of polygon bowl cup is favorable to increasing the bowl cup degree of depth, promotes angle and luminance, and is dampproofing effectual.
Description
Technical field
This utility model relates to SMDLED support technology field, particularly relates to a kind of full-color SMD display/panel bracket.
Background technology
In prior art, along with the development of science and technology, LED product is promoted gradually and is come.The advantage of LED product is in that: environmental protection, power consumption is little, luminance is high, life-span length, non-maintaining, safe and reliable, response start fast and rich color.
Development along with industry, LED is turned to SMD paster structure by initial DIP straight cutting structure high-speed, the LED of SMD structure has that less, automatization lightweight, individual installs, lighting angle is big, color even, and light decay is slow and is prone to the advantages such as preservation, is becoming increasingly popular.3528RGB as common on the market is full-color, 5050RGB is full-color, has the feature of rich color, pure color, in particular for producing the 3528RGB all-colour LED of full color display, is widely used gradually.
But, along with the requirement of brightness and angle is more and more higher, often there is luminance shortage in the full-color lamp bead of existing display screen, angle is not enough and phenomenon that is that cause moisture effect bad because of the shallow problem of cup, or the bad phenomenon that light decay is fast.
Utility model content
For the weak point existed in above-mentioned technology, this utility model provides a kind of simple in construction, easy to operate full-color SMD display/panel bracket.
In order to achieve the above object, this utility model one full-color SMD display/panel bracket, including display screen lead frame, the pedestal being arranged on display screen lead frame and the polygon bowl extended by pedestal, and described pedestal is fixed with the bottom of polygon bowl by copper coin and is connected；The bottom front of described polygon bowl is provided with the upside-down mounting pad group of two row's Parallel Symmetric distributions, two row's upside-down mounting pad groups are positive pole upside-down mounting pad group and negative pole upside-down mounting pad group respectively, described positive pole upside-down mounting pad group includes three positive pole upside-down mounting pads, respectively the first positive pole upside-down mounting pad, the second positive pole upside-down mounting pad and the 3rd positive pole upside-down mounting pad, and described negative pole upside-down mounting pad group includes three negative pole upside-down mounting pads, respectively the first negative pole upside-down mounting pad, the second negative pole upside-down mounting pad and the 3rd negative pole upside-down mounting pad；The bottom rear of described polygon bowl be provided with multiple respectively with the first positive pole upside-down mounting pad, the second positive pole upside-down mounting pad, the 3rd positive pole upside-down mounting pad, the first negative pole upside-down mounting pad, the second negative pole upside-down mounting pad and the 3rd negative pole upside-down mounting pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically, and the pin of each negative pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically.
Wherein, the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of described polygon bowl, and described pedestal be shaped as square.
Wherein, described pedestal is provided with the trimming for identifying polarity, and described trimming is positioned at the side of positive pole upside-down mounting pad group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC.
This utility model also provides for a kind of full-color SMD display/panel bracket, and including display screen lead frame, the pedestal being arranged on display screen lead frame with prolonged the polygon bowl protruded upward by pedestal, described pedestal is fixed with the bottom of polygon bowl by copper coin and is connected；The bottom front of described polygon bowl is provided with the crystal bonding area between the wire welding area of two row's Parallel Symmetric distributions and two row wire welding areas, two row's wire welding area respectively positive pole bonding wire group and negative pole bonding wire groups, and described positive pole bonding wire group includes three positive terminal pad, respectively the first positive terminal pad, the second positive terminal pad and the 3rd positive terminal pad, described negative pole bonding wire group includes three negative terminal pad, respectively the first negative terminal pad, the second negative terminal pad and the 3rd negative terminal pad；The bottom rear of described polygon bowl be provided with multiple respectively with the first positive terminal pad, the second positive terminal pad, the 3rd positive terminal pad the first negative terminal pad, the second negative terminal pad and the 3rd negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically, and the pin of each negative terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically.
Wherein, the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of described polygon bowl, and described pedestal be shaped as square.
Wherein, described pedestal is provided with the trimming for identifying polarity, and described trimming is positioned at the side of positive pole bonding wire group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC.
This utility model also provides for a kind of full-color SMD display/panel bracket, and including display screen lead frame, the pedestal being arranged on display screen lead frame with prolonged the polygon bowl protruded upward by pedestal, described pedestal is fixed with the bottom of polygon bowl by copper coin and is connected；The bottom triangle of described polygon bowl is respectively set to wire welding area, and one jiao is set to common anode positive terminal pad, and the bottom front of described polygon bowl is crystal bonding area except wire welding area；Described wire welding area includes HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad, and the bottom rear of described polygon bowl be provided with respectively with common anode positive terminal pad, HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, described common anode positive terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, and described HONGGUANG negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, electrode pad and the pin of correspondence that described green glow negative terminal pad is corresponding are sequentially connected electrically, and described blue light negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically.
Wherein, the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of described polygon bowl, and described pedestal be shaped as square；
Wherein, described pedestal is provided with the trimming for identifying polarity, and described trimming is positioned at the side of HONGGUANG negative terminal pad；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC.
The beneficial effects of the utility model are:
Compared with prior art, this utility model provides a kind of full-color SMD display/panel bracket, this full-color SMD display/panel bracket includes three kinds of structures, a kind of bottom front for polygon bowl is provided with the upside-down mounting support Design of the upside-down mounting pad group of two row's Parallel Symmetric distributions, and upside-down mounting support Design is applicable to bipolar electrode red light chips, and thermal resistance is low, light decay is little, welding without gold thread during die bond bonding wire, encapsulation finished product avoids gold thread to be subject to glue stress influence to cause broken string, improves reliability；The small-power six pin design of the crystal bonding area that a kind of bottom front for polygon bowl is provided with between the wire welding area of two row's Parallel Symmetric distributions and two row wire welding areas, the design of small-power six pin is applicable to single electrode red light chips, ensure that thermoelectricity separates during die bond bonding wire, improve the reliability of product, overcome conventional display screen full-color lamp pearly-lustre and decline fast problem；A kind of bottom front triangle for polygon bowl is respectively set to wire welding area, one jiao is set to common anode positive terminal pad, and the bottom front of polygon bowl is the high-power four pin designs of crystal bonding area except wire welding area, high-power four pin designs are applicable to the reverse chip of high brightness HONGGUANG, not only ensure that during die bond bonding wire that thermoelectricity separates, and achieve the positive pole common anode of three kinds of chips of red, green, blue；The design of polygon bowl is conducive to increasing the bowl degree of depth, promotes angle and brightness, and moisture effect is good and life-saving.A kind of full-color SMD display/panel bracket that this utility model provides and die bond wire soldering method thereof, have be widely used, practical, encapsulation damp proofing effect of finished product is good, angle is big and brightness is high feature.
Accompanying drawing explanation
Fig. 1 is the top view of this utility model first embodiment；
Fig. 2 is the upward view of this utility model first embodiment；
Fig. 3 is the sectional view of this utility model first embodiment；
Fig. 4 is the top view of this utility model the second embodiment；
Fig. 5 is the upward view of this utility model the second embodiment；
Fig. 6 is the sectional view of this utility model the second embodiment；
Fig. 7 is the top view of this utility model the 3rd embodiment；
Fig. 8 is the upward view of this utility model the 3rd embodiment；
Fig. 9 is the sectional view of this utility model the 3rd embodiment；
Main element symbol description is as follows:
In first embodiment:
10, pedestal 11, polygon bowl
12, copper coin 13, containment vessel
14, trimming
111, first positive pole upside-down mounting pad the 112, second positive pole upside-down mounting pad
113, the 3rd positive pole upside-down mounting pad the 114, first negative pole upside-down mounting pad
115, the second negative pole upside-down mounting pad the 116, the 3rd negative pole upside-down mounting pad
117, electrode pad
In second embodiment:
20, pedestal 21, polygon bowl
22, copper coin 23, containment vessel
24, trimming 210, crystal bonding area
211, first positive terminal pad the 212, second positive terminal pad
213, the 3rd positive terminal pad the 214, first negative terminal pad
215, the second negative terminal pad the 216, the 3rd negative terminal pad
217, electrode pad
In 3rd embodiment:
30, pedestal 31, polygon bowl
32, copper coin 33, containment vessel
34, trimming 310, crystal bonding area
311, common anode positive terminal pad 312, HONGGUANG negative terminal pad
313, green glow negative terminal pad 314, blue light negative terminal pad
315, electrode pad.
Detailed description of the invention
In order to more clearly state this utility model, below in conjunction with accompanying drawing, this utility model is further described.
Consult Fig. 1-3, this utility model one full-color SMD display/panel bracket, for upside-down mounting support Design, including display screen lead frame (not shown), the pedestal 10 being arranged on display screen lead frame and the polygon bowl 11 that extended upward by pedestal 10, and pedestal 10 is fixed with the bottom of polygon bowl 11 by copper coin 12 and is connected；The bottom front of polygon bowl 11 is provided with the upside-down mounting pad group of two row's Parallel Symmetric distributions, two row's upside-down mounting pad groups are positive pole upside-down mounting pad group and negative pole upside-down mounting pad group respectively, positive pole upside-down mounting pad group includes three positive pole upside-down mounting pads, respectively the first positive pole upside-down mounting pad the 111, second positive pole upside-down mounting pad 112 and the 3rd positive pole upside-down mounting pad 113, and negative pole upside-down mounting pad group includes three negative pole upside-down mounting pads, respectively the first negative pole upside-down mounting pad the 114, second negative pole upside-down mounting pad 115 and the 3rd negative pole upside-down mounting pad 116；The bottom rear of polygon bowl 11 be provided with multiple respectively with the first positive pole upside-down mounting pad 111, second positive pole upside-down mounting pad 112, 3rd positive pole upside-down mounting pad 113, first negative pole upside-down mounting pad 114, second negative pole upside-down mounting pad 115 and the 3rd negative pole upside-down mounting pad 116 electrode pad 117 one to one, and each electrode pad 117 all run through copper coin 12 after be bent with the pin of correspondence, each positive pole upside-down mounting pad, corresponding electrode pad 117 and the pin of correspondence are sequentially connected electrically, and each negative pole upside-down mounting pad, corresponding electrode pad 117 and the pin of correspondence are sequentially connected electrically.
The bottom front of polygon bowl 11 be provided with two row's Parallel Symmetrics distribution upside-down mounting pad group be designed as upside-down mounting support Design, upside-down mounting support Design is applicable to bipolar electrode red light chips, thermal resistance is low, light decay is little, weld without gold thread during die bond bonding wire, only need to the positive pole of bipolar electrode red light chips be bonded on the first positive pole upside-down mounting pad 111 in common gold mode, and the negative pole of bipolar electrode red light chips is bonded on the first negative pole upside-down mounting pad 114 in common gold mode, the positive pole of green glow chip is bonded on the second positive pole upside-down mounting pad 112 in common gold mode, and the negative pole of green glow chip is bonded on the second negative pole upside-down mounting pad 115 in common gold mode, again the positive pole of blue chip is bonded on the 3rd positive pole upside-down mounting pad 113 in common gold mode, and the negative pole of blue chip is bonded on the 3rd negative pole upside-down mounting pad 116 in common gold mode；Die bond post package finished product avoids gold thread to be subject to glue stress influence to cause broken string, improves reliability；The design of polygon bowl 11 is conducive to increasing the bowl degree of depth, promotes angle and brightness, and moisture effect is good and life-saving.Certainly, this case is not limited to the distribution mode of three positive pole upside-down mounting pads and three negative pole upside-down mounting pads, if number of chips changes, so the quantity of positive pole upside-down mounting pad and negative pole upside-down mounting pad can change according to the change of number of chips, corresponding electrode pad and pin number all can change, ratio is if desired for four bipolar electrode chips of die bond, then positive pole upside-down mounting pad and negative pole upside-down mounting number of pads are all corresponding is adjusted to four die bond bonding wires that can realize four chips.
In the present embodiment, the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of polygon bowl 11.Polygon bowl 11 is shaped such that the lighting angle of bowl reaches 110-120 degree, certainly, affects the factor of lighting angle and also has that cup is deep, chamfering or plastic material etc..Symmetrical tetragon, pentagon, hexagon, heptagon or octagon are conducive to being evenly dividing of positive pole upside-down mounting pad and negative pole upside-down mounting pad, are conducive to electric heating to separate.And be conducive to the operation of die bond, bonding wire and process for filling colloid, be conducive to improving yields.
In the present embodiment, pedestal 10 being provided with the trimming 14 for identifying polarity, trimming 14 is positioned at the side of positive pole upside-down mounting pad group；Being arranged with containment vessel 13 outside polygon bowl 11, polygon bowl 11, containment vessel 13 and pedestal 10 are made up of the one in PPA plastics, EMC or SMC.Trimming 14 is denoted as positive pole.PPA plastics are PPTA, its heat distortion temperature is up to more than 300 DEG C, use temperature up to 170 DEG C continuously, required short-term and long-term hot property can be met, and its superior mechanicalness characteristic can be kept in broad temperature range and in high humidity environment, such as intensity, hardness, fatigue durability and creep resistance；EMC is epoxy resin, has good physics, chemical property, and the surface of metal and nonmetallic materials is had the adhesive strength of excellence by it, dielectric properties are good, and deformation retract rate is little, product size good stability, hardness is high, and pliability is better, to alkali and major part solvent-stable；SMC is silicones, is have highly cross-linked cancellated polysiloxane, has the double grading of organic resin and inorganic material concurrently, has the physics of uniqueness, chemical property.Therefore, a kind of containment vessel 13, polygon bowl 11 and the pedestal 10 prepared in selecting three kinds so that this full-color support has good physics and chemical property, it is ensured that the stability of structure.
Refer to Fig. 4-6, this utility model also provides for a kind of six and also provides for a kind of full-color SMD display/panel bracket, including display screen lead frame (not shown), the pedestal 20 being arranged on display screen lead frame with prolonged the polygon bowl 21 protruded upward by pedestal 20, it is connected by copper coin 22 is fixing between pedestal 20 with polygon bowl 21；The bottom front of polygon bowl 21 is provided with the crystal bonding area 210 between the wire welding area of two row's Parallel Symmetric distributions and two row wire welding areas, two row's wire welding area respectively positive pole bonding wire group and negative pole bonding wire groups, and positive pole bonding wire group includes three positive terminal pad, respectively the first positive terminal pad the 211, second positive terminal pad 212 and the 3rd positive terminal pad 213, negative pole bonding wire group includes three negative terminal pad, respectively the first negative terminal pad the 214, second negative terminal pad 215 and the 3rd negative terminal pad 216；The bottom rear of polygon bowl 21 be provided with multiple respectively with the first positive terminal pad the 211, second positive terminal pad the 212, the 3rd positive terminal pad 213 first negative terminal pad the 214, second negative terminal pad 215 and the 3rd negative terminal pad 216 electrode pad 217 one to one, and each electrode pad 217 all run through copper coin 22 after be bent with the pin of correspondence, the pin of each positive terminal pad, corresponding electrode pad 217 and correspondence is sequentially connected electrically, and the pin of each negative terminal pad, corresponding electrode pad 217 and correspondence is sequentially connected electrically.
Small-power six pin that is designed as of the crystal bonding area that the bottom front of polygon bowl 21 is provided with between the wire welding area of two row's Parallel Symmetric distributions and two row wire welding areas designs, the design of small-power six pin is applicable to small-power full color display, suitable in single electrode red light chips, during die bond, bottom by single electrode red light chips, the bottom of green glow chip and the bottom of blue chip cement in baking after on crystal bonding area 210 successively, the positive pole of green glow chip is near the second positive terminal pad 212, the negative pole of green glow chip is near the second negative terminal pad 215, the positive pole of blue chip is near the 3rd positive terminal pad 213, and the positive pole of blue chip is near the 3rd negative terminal pad 216, then bonding wire successively；Ensure that thermoelectricity separates, improve the reliability of product, overcome conventional display screen full-color lamp pearly-lustre and decline fast problem；The design of polygon bowl 21 is conducive to increasing the bowl degree of depth, promotes angle and brightness, and moisture effect is good and life-saving.Certainly, this case is not limited to the distribution mode of three positive terminal pad and three negative terminal pad, if number of chips changes, so the quantity of positive terminal pad and negative terminal pad can change according to the change of number of chips, corresponding electrode pad and pin number all can change, ratio is if desired for four bipolar electrode chips of die bond, then positive terminal pad and negative terminal pad quantity are all corresponding is adjusted to four die bond bonding wires that can realize four chips.
In the present embodiment, the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of polygon bowl 21.Polygon bowl 21 is shaped such that the lighting angle of bowl reaches 110-120 degree, certainly, affects the factor of lighting angle and also has that cup is deep, chamfering or plastic material etc..This figure is eight-sided formation figure.Symmetrical tetragon, pentagon, hexagon, heptagon or octagon are conducive to being evenly dividing of wire welding area and crystal bonding area, are conducive to electric heating to separate, and are conducive to the operation of die bond, bonding wire and process for filling colloid, are conducive to raising yields.
In the present embodiment, pedestal 20 being provided with the trimming 24 for identifying polarity, trimming 24 is positioned at the side of positive terminal pad group；Being arranged with containment vessel 23 outside polygon bowl 21, polygon bowl 21, containment vessel 23 and pedestal 20 are made up of the one in PPA plastics, EMC or SMC.Trimming 24 is denoted as positive pole.PPA plastics, EMC or SMC elaborate in the first embodiment.
Refer to Fig. 7-9, this utility model also provides for a kind of full-color SMD display/panel bracket, including display screen lead frame, the pedestal 30 being arranged on display screen lead frame with prolonged the polygon bowl 31 protruded upward by pedestal 30, pedestal 30 is fixed with the bottom of polygon bowl 31 by copper coin 32 and is connected；The bottom triangle of polygon bowl 31 is respectively set to wire welding area, and one jiao is set to common anode positive terminal pad 311, and the bottom front of polygon bowl 31 is crystal bonding area 310 except wire welding area；Wire welding area includes HONGGUANG negative terminal pad 312, green glow negative terminal pad 313 and blue light negative terminal pad 314, and the bottom rear of polygon bowl 31 be provided with respectively with common anode positive terminal pad 311, HONGGUANG negative terminal pad 312, green glow negative terminal pad 313 and blue light negative terminal pad 314 electrode pad 315 one to one, and each electrode pad 315 all run through copper coin 32 after be bent with the pin of correspondence, common anode positive terminal pad 311, corresponding electrode pad 315 and the pin of correspondence are sequentially connected electrically, and HONGGUANG negative terminal pad 312, corresponding electrode pad 315 and the pin of correspondence are sequentially connected electrically, the electrode pad 315 of green glow negative terminal pad 313 correspondence and the pin of correspondence are sequentially connected electrically, and blue light negative terminal pad 314, corresponding electrode pad 315 and the pin of correspondence are sequentially connected electrically.
The bottom front triangle of polygon bowl 31 is respectively set to wire welding area, one jiao is set to common anode positive terminal pad 311, and the bottom front of polygon bowl 31 except wire welding area, be crystal bonding area 310 be designed as high-power four pin support Design, high-power four pin solder stand designs are applicable to high-power full color display, adopt the high brightness reverse chip of single electrode HONGGUANG, during die bond, by reverse for HONGGUANG chip, green glow chip and blue chip cement in baking after on crystal bonding area 310 successively, during bonding wire, the electrode of the reverse chip of HONGGUANG is connected with HONGGUANG negative terminal pad 312 by bonding wire craft, and the bottom of red light chips is connected with common anode positive terminal pad 311 by elargol；The positive pole of green glow chip is connected with common anode positive terminal pad 311 by bonding wire craft, and the negative pole of green glow chip is connected with green glow negative terminal pad 313 by bonding wire craft；The positive pole of blue chip is connected with common anode positive terminal pad 311 by bonding wire craft, and the negative pole of blue chip is connected with blue light negative terminal pad 314 by bonding wire craft.Bonding wire post package finished product ensure that thermoelectricity separates, and improves the reliability of product, overcomes conventional display screen full-color lamp pearly-lustre and declines fast problem；The design of polygon bowl 31 is conducive to increasing the bowl degree of depth, promotes angle and brightness, and moisture effect is good and life-saving.
In the present embodiment, the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of polygon bowl 31.Polygon bowl 31 is shaped such that the lighting angle of bowl reaches 110-120 degree, certainly, affects the factor of lighting angle and also has that cup is deep, chamfering or plastic material etc..Symmetrical tetragon, pentagon, hexagon, heptagon or octagon are conducive to being evenly dividing of wire welding area and crystal bonding area, are conducive to electric heating to separate, and are conducive to the operation of die bond, bonding wire and process for filling colloid, are conducive to raising yields.
In the present embodiment, pedestal 30 being provided with the trimming 34 for identifying polarity, trimming 34 is positioned at the side of HONGGUANG negative terminal pad；Being arranged with containment vessel 33 outside polygon bowl 31, polygon bowl 31, containment vessel 33 and pedestal 30 are made up of the one in PPA plastics, EMC or SMC.Trimming 34 is denoted as HONGGUANG negative pole.PPA plastics, EMC or SMC elaborate in the first embodiment.
Concrete advantage of the present utility model is in that:
1, upside-down mounting support Design realizes the effect that thermal resistance is low, light decay is little, it is not necessary to bonding wire, it is to avoid gold thread is caused broken string by glue stress influence, improves reliability；
2, polygon bowl makes it encapsulate finished product angle up to 130 degree, and compared to existing full-color lamp bead, angle and brightness are greatly improved；
3, deeper polygon bowl makes encapsulation finished product reach good moisture effect, life-saving；
4, ensure that electric heating separates, improve the reliability of product.
Disclosed above being only several specific embodiment of the present utility model, but this utility model is not limited to this, the changes that any person skilled in the art can think of all should fall into protection domain of the present utility model.
Claims (9)
1. a full-color SMD display/panel bracket, it is characterised in that the pedestal include display screen lead frame, being arranged on display screen lead frame and the polygon bowl extended by pedestal, and described pedestal passes through, and copper coin is fixing with the bottom of polygon bowl to be connected；The bottom front of described polygon bowl is provided with the upside-down mounting pad group of two row's Parallel Symmetric distributions, two row's upside-down mounting pad groups are positive pole upside-down mounting pad group and negative pole upside-down mounting pad group respectively, described positive pole upside-down mounting pad group includes three positive pole upside-down mounting pads, respectively the first positive pole upside-down mounting pad, the second positive pole upside-down mounting pad and the 3rd positive pole upside-down mounting pad, and described negative pole upside-down mounting pad group includes three negative pole upside-down mounting pads, respectively the first negative pole upside-down mounting pad, the second negative pole upside-down mounting pad and the 3rd negative pole upside-down mounting pad；The bottom rear of described polygon bowl be provided with multiple respectively with the first positive pole upside-down mounting pad, the second positive pole upside-down mounting pad, the 3rd positive pole upside-down mounting pad, the first negative pole upside-down mounting pad, the second negative pole upside-down mounting pad and the 3rd negative pole upside-down mounting pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically, and the pin of each negative pole upside-down mounting pad, corresponding electrode pad and correspondence is sequentially connected electrically.
2. full-color SMD display/panel bracket according to claim 1, it is characterised in that the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of described polygon bowl, and described pedestal be shaped as square.
3. full-color SMD display/panel bracket according to claim 1, it is characterised in that be provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of positive pole upside-down mounting pad group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC.
4. a full-color SMD display/panel bracket, it is characterised in that the pedestal that include display screen lead frame, is arranged on display screen lead frame and prolonged the polygon bowl protruded upward by pedestal, described pedestal is fixed with the bottom of polygon bowl by copper coin and is connected；The bottom front of described polygon bowl is provided with the crystal bonding area between the wire welding area of two row's Parallel Symmetric distributions and two row wire welding areas, two row's wire welding area respectively positive pole bonding wire group and negative pole bonding wire groups, and described positive pole bonding wire group includes three positive terminal pad, respectively the first positive terminal pad, the second positive terminal pad and the 3rd positive terminal pad, described negative pole bonding wire group includes three negative terminal pad, respectively the first negative terminal pad, the second negative terminal pad and the 3rd negative terminal pad；The bottom rear of described polygon bowl be provided with multiple respectively with the first positive terminal pad, the second positive terminal pad, the 3rd positive terminal pad the first negative terminal pad, the second negative terminal pad and the 3rd negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, the pin of each positive terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically, and the pin of each negative terminal pad, corresponding electrode pad and correspondence is sequentially connected electrically.
5. full-color SMD display/panel bracket according to claim 4, it is characterised in that the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of described polygon bowl, and described pedestal be shaped as square.
6. full-color SMD display/panel bracket according to claim 4, it is characterised in that be provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of positive pole bonding wire group；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC.
7. a full-color SMD display/panel bracket, it is characterised in that the pedestal that include display screen lead frame, is arranged on display screen lead frame and prolonged the polygon bowl protruded upward by pedestal, described pedestal is fixed with the bottom of polygon bowl by copper coin and is connected；The bottom triangle of described polygon bowl is respectively set to wire welding area, and one jiao is set to common anode positive terminal pad, and the bottom front of described polygon bowl is crystal bonding area except wire welding area；Described wire welding area includes HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad, and the bottom rear of described polygon bowl be provided with respectively with common anode positive terminal pad, HONGGUANG negative terminal pad, green glow negative terminal pad and blue light negative terminal pad electrode pad one to one, and described each electrode pad all run through copper coin after be bent with the pin of correspondence, described common anode positive terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, and described HONGGUANG negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically, electrode pad and the pin of correspondence that described green glow negative terminal pad is corresponding are sequentially connected electrically, and described blue light negative terminal pad, corresponding electrode pad and the pin of correspondence are sequentially connected electrically.
8. full-color SMD display/panel bracket according to claim 7, it is characterised in that the one being shaped as in the tetragon of symmetry, pentagon, hexagon, heptagon or octagon of described polygon bowl, and described pedestal be shaped as square.
9. full-color SMD display/panel bracket according to claim 7, it is characterised in that be provided with the trimming for identifying polarity on described pedestal, and described trimming is positioned at the side of HONGGUANG negative terminal pad；Described polygon bowl overcoat is provided with containment vessel, and described polygon bowl, containment vessel and pedestal are made up of the one in PPA plastics, EMC or SMC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620048710.6U CN205355076U (en) | 2016-01-19 | 2016-01-19 | Full -color SMD display screen support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620048710.6U CN205355076U (en) | 2016-01-19 | 2016-01-19 | Full -color SMD display screen support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205355076U true CN205355076U (en) | 2016-06-29 |
Family
ID=56178529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620048710.6U Expired - Fee Related CN205355076U (en) | 2016-01-19 | 2016-01-19 | Full -color SMD display screen support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205355076U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
-
2016
- 2016-01-19 CN CN201620048710.6U patent/CN205355076U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105161608B (en) | A kind of LED filament light-emitting section and preparation method thereof | |
| CN100474646C (en) | Packaging method for white light illuminating diode | |
| CN105702831A (en) | Full-color SMD display screen support and die bonding and wire soldering method thereof | |
| CN205488200U (en) | Encapsulation of full -color SMD display screen | |
| CN205355076U (en) | Full -color SMD display screen support | |
| CN107424526A (en) | A kind of digital display tube and its production technology of uniformly astigmatism | |
| CN109256458A (en) | A kind of LED product encapsulating structure and its packaging method | |
| CN206236670U (en) | A kind of 360 degree of printing opacity LED filaments | |
| CN106356437B (en) | A kind of white light LED packaging device and preparation method thereof | |
| CN101635327A (en) | Packaging method of LED | |
| CN100477306C (en) | White Light-emitting diode | |
| CN208738244U (en) | A kind of LED component of built-in constant current driving | |
| CN101436625A (en) | Packaging method for white light LED | |
| CN204045628U (en) | A kind of surface-mounted LED light source of many bowls of cup structures | |
| CN102800664B (en) | LED (light-emitting diode) single lamp used for promoting plant growth and production process thereof | |
| CN201699054U (en) | SMD light-emitting diode | |
| CN205028918U (en) | LED support and LED packaging body | |
| CN103855280A (en) | LED wafer-level packaging method | |
| CN201354966Y (en) | Glass encapsulated light emitting diode | |
| CN100477307C (en) | Light-emitting diode | |
| CN203746897U (en) | Led | |
| CN203377265U (en) | LED packaging structure | |
| CN102544342B (en) | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof | |
| CN208189582U (en) | A kind of full open air SMD-LED structure of common cathode common anode integration | |
| CN106057991B (en) | A kind of production method of integrated LED light source mould group |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160629 Termination date: 20200119 |