CN208189582U - A kind of full open air SMD-LED structure of common cathode common anode integration - Google Patents

A kind of full open air SMD-LED structure of common cathode common anode integration Download PDF

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Publication number
CN208189582U
CN208189582U CN201820254217.9U CN201820254217U CN208189582U CN 208189582 U CN208189582 U CN 208189582U CN 201820254217 U CN201820254217 U CN 201820254217U CN 208189582 U CN208189582 U CN 208189582U
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common
pad
green
red
smd
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CN201820254217.9U
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刘天明
彭昕
张盛
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MLS Co Ltd
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MLS Co Ltd
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Abstract

The utility model belongs to the fields such as LED display, LED decorative lamp, the specific open full open air SMD-LED structure of common cathode common anode integration, including metal pad and four pins, three luminescence chips of red, green, blue are respectively equipped on metal pad, broadside side, intermediate position and narrow side side are divided on metal pad from top to bottom, three luminescence chips of the red, green, blue are arranged at line-styled, when being designed as three brilliant common anodes, the upper N of red light-emitting chip selection extremely descends the reversed polarity luminescent wafer of the pole P;When being designed as three brilliant common cathodes, red light-emitting chip selects upper P extremely to descend N positive polarity luminescent wafer.The full open air SMD LED structure can accomplish inexpensive common cathode design, by common cathode common anode integration.In addition, by shortening two solder joint length of bonding pad of feux rouges lead and stretching the not common two solder joint length of bonding pad of pole of green light, horizontal direction bracing wire when three chips, five leads can be made to realize bonding wire can effectively improve bonding wire two and weld quality, promotes product reliability.

Description

A kind of full open air SMD-LED structure of common cathode common anode integration
Technical field
The utility model belongs to the technical fields such as LED display, LED decorative lamp, in particular to a kind of common cathode common anode one Change full open air SMD-LED structure.
Background technique
In the prior art, conventional patch type full-color light-emitting diode is generally divided into two kinds of structures of four pins and six pins and sets Meter: where six pins are the brilliant independent control of RGB three, and four pin configurations traditional pad structure design and IC due to one As designed using common-anode, and be necessarily required to positive polarity red wafer being changed to reversed polarity red wafer when being changed to common cathode It is just able to achieve, this undoubtedly significantly increases Material Cost.
In addition, the reliability of open air SMD LED product plays a crucial role the quality and service life of product, The most common outdoor products failure cause shows that lead is broken, and it is at D point and E that lead, which breaks the highest position of the frequency of occurrences, At point.
As shown in Figure 1, on pad 10 ', lead 20 ' causes with bonding wire power output direction out of plumb when traditional bonding wire Two weldering fish tails are asymmetrical in shape, and are smalled while big on one side, are existed simultaneously two welderings and are remained relatively low, pulling force influence reliability less than normal etc. is hidden Suffer from.
Therefore, a kind of open air SMD-LED low cost common cathode design is researched and developed, and can effectively improve bond wire pattern to be promoted The full open air SMD-LED structure of common cathode common anode integration of product reliability is extremely urgent.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, and it is complete outdoor specifically to disclose a kind of common cathode common anode integration SMD-LED structure, the full open air SMD-LED structure can accomplish inexpensive common cathode design, by common cathode common anode integration, in addition, It can effectively improve bond wire pattern and promote product reliability.
In order to reach above-mentioned technical purpose, the utility model is realized by following technical scheme:
The complete open air SMD-LED structure of a kind of common cathode common anode integration described in the utility model, including metal pad with set Three luminescence chips of red, green, blue, institute are respectively equipped in four pins on metal pad for electrical connection, on the metal pad It states and is divided into broadside side, intermediate position and narrow side side on metal pad from top to bottom, wherein the narrow side side on pad For the die bond position of red light-emitting chip, intermediate position is the die bond position of green luminescence chip, and broadside side is blue light emitting The die bond position of chip, and three luminescence chips of the red, green, blue are arranged at line-styled, three luminescence chips of the red, green, blue The electrical connection corresponding with four pins on metal dish by way of lead respectively, when being designed as three brilliant common anodes, the feux rouges The upper N of luminescence chip selection extremely descends the reversed polarity luminescent wafer of the pole P;When being designed as three brilliant common cathodes, the red light-emitting chip choosing With the lower N positive polarity luminescent wafer of the pole P.
As the further improvement of above-mentioned technology, the metal pad is equipped with public pole bonding wire region, the public pole Bonding wire region is connected to metal pad, and wherein the lead of three luminescence chips of red, green, blue and four pins is horizontal direction bracing wire Welding.
As the further improvement of above-mentioned technology, the two of red light-emitting chip weld pad length and width rulers on the metal pad It is very little to narrow down to as 0.35~0.55mm*0.2~0.4mm, two weldering pad length and width dimensions of green luminescence chip relax as 0.6~ 0.8mm*0.2~0.4mm, public pole wire welding area field width angle value is relaxed as 1.9mm~2.1mm, that is, by the sky on metal pad Between carry out rational deployment and optimization, to realize that all leads can carry out horizontal guy welding.
Compared with prior art, the utility model has the beneficial effects that
(1) the full open air SMD-LED structure of common cathode common anode integration described in the utility model passes through to traditional pad structure Image copying is carried out, reversed polarity common anode design can be carried out under common require, and can be used under particular requirement more inexpensive The design of positive polarity common cathode.
(2) in the utility model, optimization pad size design, by shortening two solder joint length of bonding pad of feux rouges lead and stretching The not common two solder joint length of bonding pad of pole of green light, horizontal direction bracing wire when three chips, five leads can be made to realize bonding wire, can be effective Ground improves bonding wire two and welds quality, greatly promotes the reliability of product.
Detailed description of the invention
The utility model is described in detail in the following with reference to the drawings and specific embodiments:
Fig. 1 is guy structure schematic diagram on pad described in the prior art;
Fig. 2 is full open air SMD-LED structural schematic diagram (common-anode-feux rouges reversed polarity) described in the utility model;
Fig. 3 is designed as the electrical connection schematic diagram of four pins when common-anode-feux rouges reversed polarity;
Fig. 4 is full open air SMD-LED structural schematic diagram (common cathode-feux rouges positive polarity) described in the utility model;
Fig. 5 is designed as the electrical connection schematic diagram of four pins when common cathode-feux rouges positive polarity.
Specific embodiment
As shown in Figure 2, Figure 4 shows, a kind of full open air SMD-LED structure of common cathode common anode integration described in the utility model, packet It includes metal pad 10 and is placed in four pins 1,2,3,4 on metal pad for electrical connection, set respectively on the metal pad 10 There are three luminescence chips of red, green, blue 5,6,7, is divided at the A of broadside side from top to bottom on the metal pad 10, is intermediate It is wherein the die bond position of red light-emitting chip 5 at the narrow side side C on pad 10 at the B of position and at the C of narrow side side, it is intermediate It is the die bond position of green luminescence chip 6 at the B of position, the place broadside side A is the die bond position of blue light emitting chip 7, and this is red, Green, blue three luminescence chips 5,6,7 one-tenth line-styled arrangements, three luminescence chips of the red, green, blue 5,6,7 pass through lead respectively Mode and four pins 1 on metal pad 10,2,3,4 corresponding electrical connections.
As shown in Figure 3 when being designed as three brilliant common anodes, the red light-emitting chip 5 selects upper N that the reversed polarity of the pole P is extremely descended to send out Light chip;As shown in figure 5, the red light-emitting chip selects the lower N positive polarity of the upper pole P to shine when being designed as three brilliant common cathodes Chip.
In the present invention, as shown in Figure 1, the metal pad 1010 is equipped with public pole bonding wire region, the public affairs Copolar bonding wire region is connected to metal pad, and wherein three luminescence chips of red, green, blue 5,6,7 and four pins 1,2,3,4 draw Line is horizontal direction bracing wire welding.
Two wide (D) size reductions of weldering pads long (L1) of red light-emitting chip 5 on the metal pad 10 are to being 0.35 ~0.55mm*0.2~0.4mm, two wide (D) sizes of weldering pad length and width long (L2) of green luminescence chip 6 relax as 0.6~ 0.8mm*0.2~0.4mm, public pole wire welding area field width angle value is relaxed as 1.9mm~2.1mm, that is, by metal pad 10 Space carries out rational deployment and optimization, to realize that all leads can carry out horizontal guy welding.
The utility model is not limited to above embodiment, and all various changes or modifications to the utility model do not take off Spirit and scope from the utility model, if these modification and variations belong to the claims and equivalents of the utility model Within the scope of, then the utility model is also implied that comprising these modification and variations.

Claims (3)

1. a kind of complete open air SMD-LED structure of common cathode common anode integration, including metal pad and it is placed on metal pad for electric Four pins of connection, it is characterised in that: three luminescence chips of red, green, blue, the metal welding are respectively equipped on the metal pad Broadside side, intermediate position and narrow side side are divided on disk from top to bottom, wherein the narrow side side on pad is feux rouges hair The die bond position of optical chip, intermediate position are the die bond position of green luminescence chip, and broadside side is consolidating for blue light emitting chip Brilliant position, and three luminescence chips of the red, green, blue are arranged at line-styled, three luminescence chips of the red, green, blue pass through respectively The electrical connection corresponding with four pins on metal dish of the mode of lead, when being designed as three brilliant common anodes, the red light-emitting chip N extremely descends the reversed polarity luminescent wafer of the pole P in selection;When being designed as three brilliant common cathodes, the luminescence chip selects the lower N of the upper pole P Positive polarity luminescent wafer.
2. the full open air SMD-LED structure of common cathode common anode integration according to claim 1, it is characterised in that: the metal Pad is equipped with public pole bonding wire region, and public pole bonding wire region is connected to metal pad, by redesigning two solder joints Length of bonding pad makes the lead of three luminescence chips of red, green, blue and four pins be horizontal direction bracing wire welding.
3. the full open air SMD-LED structure of common cathode common anode integration according to claim 2, it is characterised in that: the metal Two weldering pad length and width dimensions of red light-emitting chip are 0.35~0.55mm*0.2~0.4mm on pad, and green luminescence chip is non- Public pole two weldering pad length and width dimensions be 0.6~0.8mm*0.2~0.4mm, public pole wire welding area field width angle value be 1.9mm~ 2.1mm。
CN201820254217.9U 2018-02-12 2018-02-12 A kind of full open air SMD-LED structure of common cathode common anode integration Active CN208189582U (en)

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CN201820254217.9U CN208189582U (en) 2018-02-12 2018-02-12 A kind of full open air SMD-LED structure of common cathode common anode integration

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110137165A (en) * 2019-04-19 2019-08-16 开发晶照明(厦门)有限公司 Display device and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110137165A (en) * 2019-04-19 2019-08-16 开发晶照明(厦门)有限公司 Display device and preparation method thereof
CN110137165B (en) * 2019-04-19 2021-10-12 开发晶照明(厦门)有限公司 Display device and manufacturing method thereof

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