CN201859894U - Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode - Google Patents
Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode Download PDFInfo
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- CN201859894U CN201859894U CN2010205058947U CN201020505894U CN201859894U CN 201859894 U CN201859894 U CN 201859894U CN 2010205058947 U CN2010205058947 U CN 2010205058947U CN 201020505894 U CN201020505894 U CN 201020505894U CN 201859894 U CN201859894 U CN 201859894U
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Abstract
The utility model discloses a pad structure of a full color chip mounting light-emitting diode and the full color chip mounting light-emitting diode, wherein the pad structure of the full color chip mounting light-emitting diode comprises an encapsulation body and a pad, wherein the encapsulation body comprises an encapsulation cavity; the pad comprises a common anode pad, a red cathode pad, a blue cathode pad and a green cathode pad; one of the four pads is a crystal fixing pad that is L-shaped; one of the other three pads is arranged inside the L-shaped pad; and the other two pads are arranged outside the L-shaped pad. The pad structure is relatively flexible in selection of red LED chips, and can select positive red chips with lower cost. The full color chip mounting light-emitting diode can adopt the positive red chip that is beneficial to reducing the production cost of the full color chip mounting light-emitting diode.
Description
[technical field]
The utility model relates to light-emitting diode, relates in particular to a kind of full-color patch light-emitting diode pad structure and full-color patch light-emitting diode.
[background technology]
The full-color patch light-emitting diode of display screen can only could be worked under the condition that is total to anode.As shown in Figure 1 to Figure 3, the solid brilliant pad occupation space of conventional small light-emitting diode (the following width of 2.4mm) is very big, the space of non-solid brilliant pad is very little, non-solid brilliant pad does not have enough pad spaces to connect lead more than two, this just can't use non-solid brilliant pad to be used as common anode, can only select solid brilliant pad to do common anode.This has just determined conventional small light-emitting diode (the following width of 2.4mm) can only use the pad connecting end is that anode has reverse red wafer ability operate as normal.Though reverse red wafer brightness is higher, cost is also higher, as using reverse red wafer, just the cost of full-color patch light-emitting diode can't be lowered.
[summary of the invention]
The technical problems to be solved in the utility model provides a kind ofly not only can have been used reverse red wafer but also can use the full-color patch light-emitting diode pad structure of the red wafer of forward.
Another technical problem that will solve of the utility model provides a kind of full-color patch light-emitting diode with low cost.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is, a kind of full-color patch light-emitting diode pad structure, comprise packaging body and pad, described packaging body comprises package cavity, described pad comprises common anode bond pad, red cathode pad, blue cathode pad and green cathode pad, 1 in described 4 pads is solid brilliant pad, described solid brilliant pad is L shaped pad, 1 inboard that is arranged in L shaped pad in other 3 pads, 2 each and every one solder pad arrangements are in the outside of L shaped pad.
Described L shaped pad long-armed is positioned on 1 center line of package cavity.
Described L shaped pad is red cathode pad.
Described anode bond pad altogether is arranged in the inboard of L shaped red cathode pad, and blue cathode pad and green cathode pad are arranged in the outside of L shaped red cathode pad.
Described L shaped pad is common anode bond pad, and 1 in 3 cathode pad is arranged in the L shaped inboard of anode bond pad altogether, and other 2 cathode pad are arranged in the L shaped outside of anode bond pad altogether.
A kind of technical scheme of full-color patch light-emitting diode is to comprise pad structure, red wafer, green wafer, blue wafer and pin, the above-mentioned full-color patch light-emitting diode pad structure of described pad structure employing; Described red wafer, green wafer and, blue wafer all is fixed on the L shaped pad.
Described L shaped pad long-armed is positioned on 1 center line of package cavity.
Described red wafer, green wafer and, blue wafer all is fixed on L shaped pad long-armed.
Described L shaped pad is red cathode pad, and described anode bond pad altogether is arranged in the inboard of L shaped red cathode pad, and blue cathode pad and green cathode pad are arranged in the outside of L shaped red cathode pad.
Described L shaped pad is common anode bond pad, and 1 in 3 cathode pad is arranged in the L shaped inboard of anode bond pad altogether, and other 2 cathode pad are arranged in the L shaped outside of anode bond pad altogether.
Comparatively flexible in the selection of the utility model to the red wafer of LED, taking cost into account can the lower red wafer of forward of alternative costs.The solid brilliant pad of the utility model pad structure is L shaped, and for the non-asymmetric arrangement of brilliant pad admittedly stays enough spaces, simultaneously L shaped solid brilliant pad has guaranteed that also solid brilliant pad has enough spaces to link lead; Non-solid brilliant pad has adopted asymmetrical layout examination, the non-solid brilliant pad of L shaped solid brilliant pad inboard can be bigger than other non-solid brilliant pads, the non-solid brilliant pad of L shaped solid brilliant pad inboard has enough spaces to link 3 leads, as when adopting the red wafer of forward, the non-solid brilliant pad of L shaped solid brilliant pad inboard can be used as common anode bond pad, as adopt reverse red wafer, then can be with L shaped solid brilliant pad as being total to anode bond pad, the non-solid brilliant pad of L shaped solid brilliant pad inboard changes red negative terminal pad into.Pad structure of the present utility model so not only can use reverse red wafer but also can use the red wafer of forward.
[description of drawings]
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the front view of the full-color patch light-emitting diode of prior art.
Fig. 2 is the vertical view of the full-color patch light-emitting diode of prior art.
Fig. 3 is the right view of the full-color patch light-emitting diode of prior art.
Fig. 4 is the vertical view of the full-color patch light-emitting diode embodiment 1 of the utility model.
Fig. 5 is that A among Fig. 4 is to cutaway view.
Fig. 6 is the right view of the full-color patch light-emitting diode embodiment 1 of the utility model.
Fig. 7 is the vertical view of the full-color patch light-emitting diode embodiment 2 of the utility model.
[embodiment]
To the full-color patch light-emitting diode embodiment 1 of the utility model shown in Figure 6, comprise packaging body 1, pad, red wafer 2, green wafer 3, blue wafer 4 and the pin of plastics at Fig. 1.There is package cavity 101 in the central authorities of packaging body 1, pad comprises common anode bond pad 5, red cathode pad 8, blue cathode pad 6 and green cathode pad 7, wherein red cathode pad 8 is solid brilliant pad, red cathode pad 8 is L shaped, anode bond pad 5 is arranged in the inboard of L shaped red cathode pad 8 altogether, and blue cathode pad 6 and green cathode pad 7 are arranged in the outside of L shaped pad.
The full-color patch light-emitting diode embodiment 2 of the utility model shown in Figure 7 is with the difference of embodiment 1, wherein anode bond pad 5 is solid brilliant pad altogether, anode bond pad 5 is L shaped altogether, red cathode pad 8 is arranged in the L shaped inboard of anode bond pad 5 altogether, and blue cathode pad 6 and green cathode pad 7 are arranged in the L shaped outside of anode bond pad 5 altogether.
Long-armed 501 of L shaped anode bond pad 5 altogether is positioned on the longitudinal centre line of package cavity 101.Red wafer 2, green wafer 3, blue wafer 4 be fixed on L shaped anode bond pad 5 altogether long-armed 501 on, by linear array.Wherein, red wafer 2 is reverse red wafer, and its wire bond end is a negative pole, and the pad connecting end is an anode, though the cost of reverse red wafer is higher, brightness is also higher, can improve the quality of product.
Above embodiment has thoroughly changed traditional pad structure, and the solid brilliant pad of 1:L shape is that the asymmetric design of non-solid brilliant pad stays enough spaces, and L shaped solid brilliant pad has guaranteed that also solid brilliant pad has enough spaces to link lead simultaneously.2: non-solid brilliant pad has adopted asymmetric design, the non-solid brilliant pad of L shaped solid brilliant pad inboard is bigger than other non-solid brilliant pads, allow the non-solid brilliant pad of L shaped solid brilliant pad inboard have enough spaces to link 3 leads, during like this as with the red wafer of forward, the non-solid brilliant pad of L shaped solid brilliant pad inboard is common anode bond pad, as adopt reverse red wafer, can be with L shaped solid brilliant pad for being total to anode bond pad, the non-solid brilliant pad of L shaped solid brilliant pad inboard promptly changes red negative terminal pad into, can freely select as required.
Above embodiment is comparatively flexible in the selection to the red wafer of LED, taking cost into account can the lower red wafer of forward of alternative costs.As the brightness of wanting to improve light-emitting diode, the solution of reverse red wafer also is provided.Can bring different selections to the client.
Claims (10)
1. full-color patch light-emitting diode pad structure, comprise packaging body and pad, described packaging body comprises package cavity, described pad comprises common anode bond pad, red cathode pad, blue cathode pad and green cathode pad, 1 in described 4 pads is characterized in that for solid brilliant pad, and described solid brilliant pad is L shaped pad, 1 inboard that is arranged in L shaped pad in other 3 pads, 2 solder pad arrangements are in the outside of L shaped pad.
2. full-color patch light-emitting diode pad structure according to claim 1 is characterized in that, described L shaped pad long-armed is positioned on 1 center line of package cavity.
3. full-color patch light-emitting diode pad structure according to claim 1 is characterized in that described L shaped pad is red cathode pad.
4. full-color patch light-emitting diode pad structure according to claim 3 is characterized in that, described anode bond pad altogether is arranged in the inboard of L shaped red cathode pad, and blue cathode pad and green cathode pad are arranged in the outside of L shaped red cathode pad.
5. full-color patch light-emitting diode pad structure according to claim 1, it is characterized in that, described L shaped pad is common anode bond pad, and 1 in 3 cathode pad is arranged in the L shaped inboard of anode bond pad altogether, and other 2 cathode pad are arranged in the L shaped outside of anode bond pad altogether.
6. full-color patch light-emitting diode, comprise pad structure, red wafer, green wafer, blue wafer and pin, it is characterized in that described pad structure adopts the described full-color patch light-emitting diode pad structure of arbitrary claim in the claim 1 to 4.
7. full-color patch light-emitting diode according to claim 6 is characterized in that, described L shaped pad long-armed is positioned on 1 center line of package cavity.
8. full-color patch light-emitting diode according to claim 6 is characterized in that, described red wafer, green wafer and, blue wafer all is fixed on L shaped pad long-armed.
9. full-color patch light-emitting diode according to claim 8, it is characterized in that, described L shaped pad is red cathode pad, and described anode bond pad altogether is arranged in the inboard of L shaped red cathode pad, and blue cathode pad and green cathode pad are arranged in the outside of L shaped red cathode pad.
10. full-color patch light-emitting diode according to claim 6, it is characterized in that, described L shaped pad is common anode bond pad, and 1 in 3 cathode pad is arranged in the L shaped inboard of anode bond pad altogether, and other 2 cathode pad are arranged in the L shaped outside of anode bond pad altogether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205058947U CN201859894U (en) | 2010-08-26 | 2010-08-26 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205058947U CN201859894U (en) | 2010-08-26 | 2010-08-26 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201859894U true CN201859894U (en) | 2011-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205058947U Expired - Lifetime CN201859894U (en) | 2010-08-26 | 2010-08-26 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
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| CN (1) | CN201859894U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730072A (en) * | 2014-01-03 | 2014-04-16 | 深圳市奥蕾达光电技术有限公司 | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN106653723A (en) * | 2017-01-11 | 2017-05-10 | 深圳市奥蕾达科技有限公司 | Bonding pad structure for encapsulating full color lamp bead of COB panel |
| CN106783826A (en) * | 2017-01-20 | 2017-05-31 | 钟斌 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
| CN106783825A (en) * | 2017-01-11 | 2017-05-31 | 深圳市奥蕾达科技有限公司 | Full-color COB panel lights bead seal welding equipment dish structure |
-
2010
- 2010-08-26 CN CN2010205058947U patent/CN201859894U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730072A (en) * | 2014-01-03 | 2014-04-16 | 深圳市奥蕾达光电技术有限公司 | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN105810115B (en) * | 2016-05-30 | 2019-08-20 | 深圳市奥蕾达科技有限公司 | All-colour LED luminescent panel |
| CN106653723A (en) * | 2017-01-11 | 2017-05-10 | 深圳市奥蕾达科技有限公司 | Bonding pad structure for encapsulating full color lamp bead of COB panel |
| CN106783825A (en) * | 2017-01-11 | 2017-05-31 | 深圳市奥蕾达科技有限公司 | Full-color COB panel lights bead seal welding equipment dish structure |
| CN106783826A (en) * | 2017-01-20 | 2017-05-31 | 钟斌 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110608 |
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| CX01 | Expiry of patent term |