CN201820787U - Copolar full-colored surface-mounted light emitting diode - Google Patents
Copolar full-colored surface-mounted light emitting diode Download PDFInfo
- Publication number
- CN201820787U CN201820787U CN2010205058650U CN201020505865U CN201820787U CN 201820787 U CN201820787 U CN 201820787U CN 2010205058650 U CN2010205058650 U CN 2010205058650U CN 201020505865 U CN201020505865 U CN 201020505865U CN 201820787 U CN201820787 U CN 201820787U
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- Prior art keywords
- wafer
- anode
- pad
- red
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model discloses a copolar full-colored surface-mounted light emitting diode, which comprises a package, a bonding pad, a red chip, a green chip, a blue chip and four pins. The package includes a packaging cavity, the bonding pad comprises a die bonding pad and a non-die bonding pad, and the red chip, the green chip and the blue chip are linearly arrayed. The red chip, the distances among the green chip and the blue chip which are linearly arrayed to eyes of an observer are the same regardless of observation from the front side or observation from the lateral sides, difference in mixed light colors can be avoided, and color cast can be avoided when the copolar full-colored surface-mounted light emitting diode is applied to a display screen.
Description
[technical field]
The utility model relates to light-emitting diode, relates in particular to the full-color patch light-emitting diode of a kind of copolar formula.
[background technology]
As shown in Figure 1, traditional full-color patch light-emitting diode of copolar formula comprises packaging body, 3 negative electrode pins and 1 common anode pin, at the packaging body cavity bottom 3 solid brilliant pads and 1 common anode bond pad is arranged.Arrange red wafer 1, green wafer 2 and blue wafer 3 on 3 the solid brilliant pad, red wafer 1, green wafer 2 and blue wafer 3 are isosceles triangle and distribute.Mixed light effect when the arrangement of 3 wafer isosceles triangles makes led lighting has certain limitation.The mixed light effect is better when top view, but can find that the mixed light color is variant when observing from the left and right side.Reason is that the wafer of traditional full-color patch light-emitting diode is Chinese character pin-shaped arrangement, and human eye produces difference from the distance of three kinds of wafers, so cause the difference of mixed light color.When this light-emitting diode is applied on the LED display, can produce the colour cast phenomenon.
[summary of the invention]
The technical problems to be solved in the utility model provides the full-color patch light-emitting diode of a kind of copolar formula, no matter be the difference that the mixed light color can not appear in top view or observation from the side, when being applied on the display screen, can not produce the colour cast phenomenon.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is, the full-color patch light-emitting diode of a kind of copolar formula, comprise packaging body, pad, red wafer, green wafer, blue wafer and 4 pins, comprise 1 common pin in the described pin, described packaging body comprises package cavity, and described pad comprises 3 solid brilliant pads and 1 non-solid brilliant pad, and described red wafer, green wafer, blue wafer are by linear array.
Described pin arrangement is in the both sides of packaging body, and described red wafer, green wafer, blue wafer arrangement are on the vertical pivot of package cavity.
Described blue wafer, green wafer and red wafer are arranged by the order of upper, middle and lower.
Described non-solid brilliant pad is for being total to the anode second solder joint pad, and described common pin is for being total to the anode pin, and the described anode second solder joint pad altogether anode pin together connects; The solid brilliant pad of described blue wafer is connected with the negative electrode pin of blue wafer, and the solid brilliant pad of green wafer is connected with the negative electrode pin of green wafer, and the solid brilliant pad of red wafer is connected with the negative electrode pin of red wafer; Anode, the anode of green wafer and the anode of red wafer of blue wafer are connected the common anode second solder joint pad respectively.
The red wafer of the full-color patch light-emitting diode of the utility model copolar formula, green wafer and blue wafer are by linear array, no matter be from top view or observation from the side, red wafer, green wafer and blue wafer by linear array are identical with the distance of observer's eyes, the difference that the mixed light color can not occur, when being applied on the display screen, can not produce the colour cast phenomenon.
[description of drawings]
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is the structure chart of the full-color patch light-emitting diode of existing copolar formula;
Fig. 2 is the structure chart of the full-color patch light-emitting diode of the utility model copolar formula.
[embodiment]
In the full-color patch light-emitting diode embodiment of formula, 4 pins are arranged in the both sides of packaging body 4 at the utility model shown in Figure 2, and negative electrode pin 5 and 6 is arranged in the right side of packaging body, and negative electrode pin 7 and common pin 8 are arranged in the left side of packaging body.Red wafer 1, green wafer 2, blue wafer 3 are by linear array.Blue wafer 3, green wafer 2 and red wafer 1 are pressed the arranged in order of upper, middle and lower on the vertical pivot A-A of package cavity 401.
Non-solid brilliant pad is to be total to the anode second solder joint pad 16 in 4 pads, and common pin 8 is to be total to the anode pin, the anode second solder joint pad 16 anode pin 8 connections together altogether
The solid brilliant pad 11 of blue wafer is connected with the negative electrode pin 5 of blue wafer, the solid brilliant pad 13 of green wafer is connected with the negative electrode pin 6 of green wafer, the solid brilliant pad 15 of red wafer is connected with the negative electrode pin 7 of red wafer, and the anode of the anode of blue wafer 3, green wafer 2 is connected the common anode second solder joint pad 16 respectively with the anode of red wafer 1.
The red wafer 1 of the full-color patch light-emitting diode embodiment of above copolar formula, green wafer 2 and blue wafer 3 are pressed linear array on the vertical pivot A-A of package cavity 401, no matter be from top view or observation from the side, red wafer 1, green wafer 2 by linear array are identical with the distance of observer's eyes with blue wafer 3, the difference that the mixed light color can not occur, when being applied on the display screen, can not produce the colour cast phenomenon yet.
Claims (4)
1. full-color patch light-emitting diode of copolar formula, comprise packaging body, pad, red wafer, green wafer, blue wafer and 4 pins, comprise 1 common pin in the described pin, described packaging body comprises package cavity, described pad comprises 3 solid brilliant pads and 1 non-solid brilliant pad, it is characterized in that described red wafer, green wafer, blue wafer are by linear array.
2. the full-color patch light-emitting diode of copolar formula according to claim 1 is characterized in that, described pin arrangement is in the both sides of packaging body, and described red wafer, green wafer, blue wafer arrangement are on the vertical pivot of package cavity.
3. the full-color patch light-emitting diode of copolar formula according to claim 2 is characterized in that, described blue wafer, green wafer and red wafer are arranged by the order of upper, middle and lower.
4. according to the full-color patch light-emitting diode of the described copolar formula of arbitrary claim in the claim 1 to 3, it is characterized in that, described non-solid brilliant pad is for being total to the anode second solder joint pad, described common pin is for being total to the anode pin, and the described anode second solder joint pad altogether anode pin together connects; The solid brilliant pad of described blue wafer is connected with the negative electrode pin of blue wafer, and the solid brilliant pad of green wafer is connected with the negative electrode pin of green wafer, and the solid brilliant pad of red wafer is connected with the negative electrode pin of red wafer; Anode, the anode of green wafer and the anode of red wafer of blue wafer are connected the common anode second solder joint pad respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205058650U CN201820787U (en) | 2010-08-26 | 2010-08-26 | Copolar full-colored surface-mounted light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205058650U CN201820787U (en) | 2010-08-26 | 2010-08-26 | Copolar full-colored surface-mounted light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201820787U true CN201820787U (en) | 2011-05-04 |
Family
ID=43918731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205058650U Expired - Lifetime CN201820787U (en) | 2010-08-26 | 2010-08-26 | Copolar full-colored surface-mounted light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201820787U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
| CN107731990A (en) * | 2017-11-24 | 2018-02-23 | 山西高科华烨电子集团有限公司 | Full-color COB display screens lamp bead encapsulation welding tray structure |
| CN109411457A (en) * | 2018-10-26 | 2019-03-01 | 吉安市木林森光电有限公司 | RGB LED integrating packaging module |
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
| WO2023221765A1 (en) * | 2022-05-16 | 2023-11-23 | 高创(苏州)电子有限公司 | Light-emitting assembly, backlight module and driving method therefor, and display device |
-
2010
- 2010-08-26 CN CN2010205058650U patent/CN201820787U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702831A (en) * | 2016-01-19 | 2016-06-22 | 深圳市华天迈克光电子科技有限公司 | Full-color SMD display screen support and die bonding and wire soldering method thereof |
| CN107731990A (en) * | 2017-11-24 | 2018-02-23 | 山西高科华烨电子集团有限公司 | Full-color COB display screens lamp bead encapsulation welding tray structure |
| CN109411457A (en) * | 2018-10-26 | 2019-03-01 | 吉安市木林森光电有限公司 | RGB LED integrating packaging module |
| CN114141912A (en) * | 2021-11-24 | 2022-03-04 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
| CN114141912B (en) * | 2021-11-24 | 2023-05-23 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method |
| WO2023221765A1 (en) * | 2022-05-16 | 2023-11-23 | 高创(苏州)电子有限公司 | Light-emitting assembly, backlight module and driving method therefor, and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110504 |
|
| CX01 | Expiry of patent term |