CN102456682B - LED (light emitting diode) lamp structure - Google Patents
LED (light emitting diode) lamp structure Download PDFInfo
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- CN102456682B CN102456682B CN201110364255.2A CN201110364255A CN102456682B CN 102456682 B CN102456682 B CN 102456682B CN 201110364255 A CN201110364255 A CN 201110364255A CN 102456682 B CN102456682 B CN 102456682B
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- pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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Abstract
The invention relates to an LED (light emitting diode) lamp structure which can be used for solving the problems that by adopting a singlechip, the existing LED lamp is low in integration level and small in space density, and light and color space distribution is difficult to control, and when multi-chip integration is adopted, the light-emitting chips can not be controlled individually, the process yield is low, and the finished product failure rate is high. The LED lamp comprises a substrate, a bonding pad and a lamp cover body; the bonding pad comprises a plurality of die bonding pads and bonding wire bonding pads, which are arranged independently and mutually; the die bonding pads are provided with the light-emitting chips which are connected with the bonding wire bonding pads; the bottom of the substrate is provided with a conductive bonding pad; and the bonding wire bonding pads are connected with the conductive bonding pad through a guide post. The LED structure has the advantages that the connection of the light-emitting chips is realized through the serial connection, parallel connection or the mixture of the serial and parallel connection between the bonding pads at the bottom of the substrate, the independent control of the light-emitting chips is realized, the process yield of the LED lamp is improved, and the cost failure rate is lowered; and by adopting a thermoelectric separation structure, the service life of the LED lamp is longer.
Description
Technical field
The present invention relates to a kind of LED technical field, especially relate to a kind of LED modulated structure of realizing circuit connection, heat transfer good heat dissipation between luminescence chip by external pads.
Background technology
Existing LED lamp, be generally that single-chip or multi-chip are integrated, single chips packaging cost is high, exists integrated level low when applying, space density minor defect, during for light modulation toning, be point-source of light mixed light, exist photochromic spatial distribution to be difficult to control shortcoming, between traditional multi-chip integrated chip, by certain connection in series-parallel relation, link together, but can not control separately luminescence chip wherein, and process rate is low, finished product failure rate is high, can not debug flexibly.If publication No. is CN101964389, name is called the Chinese invention patent application of a kind of chip integrated high-power LED packaging process and products thereof, this LED comprises wiring board, LED chip, fluorescent coating and silica gel type body, LED chip setting in the circuit board, between a plurality of LED chips, by connection in series-parallel, be connected, just there is above-mentioned shortcoming in it: can not control separately luminescence chip wherein, can not debug flexibly.
Summary of the invention
The present invention is mainly that when in solution prior art, LED lamp adopts single-chip to have application, integrated level is low, space density is little, during light modulation toning, it is point-source of light mixed light, there is the unmanageable problem of photochromic spatial distribution, a kind of LED modulated structure of realizing circuit connection, heat transfer good heat dissipation between luminescence chip by external pads is provided.
Another goal of the invention of the present invention is to have solved LED lamp in prior art to adopt multi-chip integrated, can not control separately luminescence chip wherein, and process rate is low, finished product failure rate is high, the problem that can not debug flexibly, provides a kind of LED modulated structure of realizing circuit connection, heat transfer good heat dissipation between luminescence chip by external pads.
Above-mentioned technical problem of the present invention is mainly solved by following technical proposals: a kind of LED modulated structure, comprise substrate, be arranged on the pad of substrate surface and be arranged on the lampshade on substrate, on lampshade, perforate is formed with recessed cup, described pad comprises a plurality of mutual independent die bond pad and bonding wire pads that arrange, on each die bond pad, be respectively arranged with a luminescence chip, luminescence chip is connected with bonding wire pad by routing, in the bottom of substrate, be also provided with the conductive welding disk corresponding with bonding wire pad, bonding wire pad is connected by guide pillar is corresponding with conductive welding disk.In the present invention between die bond pad, between bonding wire pad, between die bond pad and bonding wire pad, be all independently divided setting, at substrate surface, be not communicated with each other, this has formed the structure of electric heating separation, the heat that luminescence chip produces is derived by die bond pad, electric current is to flow through on bonding wire pad, can improve like this LED lamp useful life.Conductive welding disk position is all corresponding with bonding wire pad with quantity, and each bonding wire pad is connected with a conductive welding disk by guide pillar.Luminescence chip is separately positioned on die bond pad, between luminescence chip, be also separate, do not have circuit to connect or share die bond pad, luminescence chip can by being arranged on, the conductive welding disk of base plate bottom be realized series and parallel connections or connection in series-parallel mixes connection as required, this can improve LED and make yield, reduce LED finished product failure rate, can to luminescence chip, debug easily and flexibly so in addition.
As a kind of preferred version, described die bond pad has 4, is arranged in the middle of substrate surface, described bonding wire pad has 8, around die bond pad, arrange, on described lampshade, corresponding die bond pad is provided with 4 recessed cups, and each recessed cup correspondence is positioned at a die bond pad top.4 die bond pads are lined up square being arranged in the middle of substrate surface, on square every one side, be all provided with 2 bonding wire pads, bonding wire pad is evenly centered around die bond pad periphery like this, make corresponding two the bonding wire pads of each die bond pad, and between them, distance is very short, dwindled the length that luminescence chip routing connects, not only saved cost and made again line more stable.Each recessed cup is arranged on a die bond pad top, and a luminescence chip is installed on each die bond pad, is that each recessed cup is arranged on a luminescence chip like this.
As a kind of preferred version, in described recessed cup, be filled with the fluorescent glue that luminescence chip light is mixed into white light.In recessed cup, by fluorescent glue, seal, protected chip and routing.In addition, fluorescent glue mixes the light of luminescence chip to produce white light.In recessed cup, also can place the luminescence chip that difference goes out light color, realize light modulation toning, while making white light, in recessed cup, can distinguish the different fluorescent glue of embedding.
As a kind of preferred version, on the bottom of substrate, post heat sink.Heat sink in order to strengthen, LED lamp conducts heat and the effect of heat radiation.
As a kind of preferred version, the substrate that described substrate is ceramic material.The ceramic substrate moisture absorption that can not absorb water, has avoided causing because of the water suction moisture absorption problem of the dead lamp of LED lamp, has improved LED lamp useful life.
As a kind of preferred version, at described lampshade, be also provided with identification point.The installation of identification point handled easily person to LED lamp.
As a kind of preferred version, serial or parallel connection or connection in series-parallel between described conductive welding disk.Can carry out respectively regulation and control to luminescence chip like this, thereby can to the photochromic of whole packaging body, regulate flexibly.
As a kind of preferred version, described luminescence chip is the different luminescence chip of light color.In recessed cup, can place the chip that difference goes out light color, realize light modulation toning, while making white light, in recessed cup, can distinguish the different fluorescent glue of embedding, also can realize different photochromic adjustings, a kind of encapsulating structure has been realized multiple use.
Therefore, advantage of the present invention is: can realize the connection between luminescence chip by the series, parallel between the pad of base plate bottom or string mixing 1., can to luminescence chip, carry out independent control respectively, this structure of while has improved LED lamp and has made yield, has reduced cost failure rate; 2. adopt the structure of thermoelectricity separation, make LED lamp longer service life; 3. in recessed cup, place the different chips that go out light color, realize light modulation toning, while making white light, the different fluorescent glue of embedding respectively in recessed cup, also realizes different photochromic adjustings, and a kind of encapsulating structure has been realized multiple use.
Accompanying drawing explanation
Accompanying drawing 1 is a kind of perspective view of the present invention;
Accompanying drawing 2 is a kind of structural representations of substrate front side in the present invention;
Accompanying drawing 3 is a kind of structural representations of substrate back in the present invention;
Accompanying drawing 4 is a kind of structural representations of lampshade in the present invention.
Heat sink 10-identification point 11-fluorescent glue of 1-substrate 2-lampshade 3-recessed cup 4-die bond pad 5-bonding wire pad 6-guide pillar 7-luminescence chip 8-conductive welding disk 9-.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, technical scheme of the present invention is described in further detail.
Embodiment:
A kind of LED modulated structure of the present embodiment, as shown in Figure 1, comprises substrate 1, is provided with lampshade 2 on substrate, and this substrate is ceramic substrate.As shown in Figure 2, on the surface of substrate, be provided with pad, this pad comprises four die bond pads 4 and 8 bonding wire pads 5, die bond pad is square, four die bond pads are arranged in square being arranged in the middle of substrate surface, 8 bonding wire pads are around die bond pad, on the square every one side being arranged at four die bond pads, be provided with two bonding wire pads, between die bond pad, between bonding wire pad and be all independently divided setting between die bond pad and bonding wire pad, on each piece die bond pad, be provided with a luminescence chip 7, it between luminescence chip, is also independent setting, do not connect, bonding wire pad of anodal separate connection of luminescence chip, bonding wire pad of negative pole separate connection.As shown in Figure 3, at base plate bottom and bonding wire pad locations corresponding position, be provided with conductive welding disk 8, between bonding wire pad and wire pad, by guide pillar 6, be connected, between conductive welding disk, carry out as required series, parallel or connection in series-parallel.In the bottom of substrate, also post heat sink 9, this is heat sink slice is decussate texture.As shown in Figure 4, on lampshade, perforate is formed with recessed cup 3, and recessed cup has 4, and recessed cup correspondence is positioned at luminescence chip top, and lampshade is sealedly connected on substrate, in recessed cup, is filled with fluorescent glue 11.For the installation of handled easily person to LED lamp, on lampshade, near a marginal position, be provided with an identification point 10.Luminescence chip in each recessed cup is the different luminescence chip of light color, can realize light modulation by adjusting and mix colours, and in recessed cup, according to the different fluorescent glue of luminescence chip difference embedding, also realizes different photochromic adjustings.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various modifications or supplement or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although more used the terms such as substrate, lampshade, die bond pad, bonding wire pad, conductive welding disk herein, do not got rid of the possibility of using other term.Use these terms to be only used to describe more easily and explain essence of the present invention; They are construed to any additional restriction is all contrary with spirit of the present invention.
Claims (1)
1. a LED modulated structure, comprise substrate, be arranged on the pad of substrate surface and be arranged on the lampshade on substrate, on lampshade, perforate is formed with recessed cup, it is characterized in that: described pad comprises a plurality of mutual independent die bond pad (4) and bonding wire pads (5) that arrange, on each die bond pad, be respectively arranged with a luminescence chip (7), luminescence chip is connected with bonding wire pad (5) by routing, in the bottom of substrate, be also provided with the conductive welding disk (8) corresponding with bonding wire pad (5), bonding wire pad is connected by guide pillar (6) is corresponding with conductive welding disk (8), described die bond pad (4) has 4, be arranged in the middle of substrate surface, described bonding wire pad (5) has 8, around die bond pad (4), arrange, the upper corresponding die bond pad of described lampshade (2) is provided with 4 recessed cups (3), each recessed cup correspondence is positioned at a die bond pad top, serial or parallel connection or connection in series-parallel between described conductive welding disk (8), 4 die bond pads are lined up square being arranged in the middle of substrate surface, on square every one side, be all provided with 2 bonding wire pads, bonding wire pad is evenly centered around die bond pad periphery like this, make corresponding two the bonding wire pads of each die bond pad.
2. a kind of LED modulated structure according to claim 1, is characterized in that being filled with the fluorescent glue (11) that luminescence chip light is mixed into white light in described recessed cup (3).
3. a kind of LED modulated structure according to claim 1, is characterized in that posting heat sink (9) on the bottom of substrate (1).
4. a kind of LED modulated structure according to claim 1, is characterized in that described substrate (1) is for the substrate of ceramic material.
According to claim 1 or or a kind of LED modulated structure described in 4, it is characterized in that being also provided with identification point (10) at described lampshade (2).
6. a kind of LED modulated structure according to claim 2, is characterized in that described luminescence chip (7) is the different luminescence chip of light color.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110364255.2A CN102456682B (en) | 2011-11-17 | 2011-11-17 | LED (light emitting diode) lamp structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110364255.2A CN102456682B (en) | 2011-11-17 | 2011-11-17 | LED (light emitting diode) lamp structure |
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| Publication Number | Publication Date |
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| CN102456682A CN102456682A (en) | 2012-05-16 |
| CN102456682B true CN102456682B (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110364255.2A Active CN102456682B (en) | 2011-11-17 | 2011-11-17 | LED (light emitting diode) lamp structure |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104482473A (en) * | 2014-11-19 | 2015-04-01 | 奇瑞汽车股份有限公司 | LED (light-emitting diode) light source of automotive headlamp |
| CN106195659B (en) * | 2016-07-27 | 2020-03-20 | 佛山市国星光电股份有限公司 | COB light source, integrated module and lamp |
| CN109994457A (en) * | 2017-12-29 | 2019-07-09 | 惠州市聚飞光电有限公司 | A kind of LED illuminating part |
| CN108730927A (en) * | 2018-06-17 | 2018-11-02 | 厦门天微电子有限公司 | A kind of four groups of LED lamp integral packaging methods |
| CN108598071A (en) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | A kind of three-primary color LED module device of TOP structures and preparation method thereof |
| CN112242476B (en) * | 2019-07-16 | 2022-03-18 | 佛山市国星光电股份有限公司 | LED display unit group and display panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201117657Y (en) * | 2007-08-10 | 2008-09-17 | 深圳市贝晶光电科技有限公司 | Light emitting diode packaging structure |
| CN201590414U (en) * | 2009-09-30 | 2010-09-22 | 红蝶科技(深圳)有限公司 | Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200965886Y (en) * | 2006-08-07 | 2007-10-24 | 陈盈君 | LED light source package structure for low temperature co-fired ceramic with thermo separation design |
| US20080179618A1 (en) * | 2007-01-26 | 2008-07-31 | Ching-Tai Cheng | Ceramic led package |
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- 2011-11-17 CN CN201110364255.2A patent/CN102456682B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201117657Y (en) * | 2007-08-10 | 2008-09-17 | 深圳市贝晶光电科技有限公司 | Light emitting diode packaging structure |
| CN201590414U (en) * | 2009-09-30 | 2010-09-22 | 红蝶科技(深圳)有限公司 | Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure |
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| CN102456682A (en) | 2012-05-16 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: LED lamp structure Effective date of registration: 20220111 Granted publication date: 20140219 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
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Date of cancellation: 20230720 Granted publication date: 20140219 Pledgee: Yiwu Branch of China Construction Bank Co.,Ltd. Pledgor: ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022330000050 |
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