CN201590414U - Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure - Google Patents
Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure Download PDFInfo
- Publication number
- CN201590414U CN201590414U CN2009202057719U CN200920205771U CN201590414U CN 201590414 U CN201590414 U CN 201590414U CN 2009202057719 U CN2009202057719 U CN 2009202057719U CN 200920205771 U CN200920205771 U CN 200920205771U CN 201590414 U CN201590414 U CN 201590414U
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- CN
- China
- Prior art keywords
- encapsulating structure
- led chips
- led chip
- line pad
- display floater
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Projection Apparatus (AREA)
Abstract
The utility model provides an encapsulating structure with multiple LED chips, which comprises a metal base plate and a plurality of LED chips. An electric insulating base plate is arranged on the metal base plate, a plurality of line welding discs which are separated from one another are arranged on the electric insulating base plate, and the LED chips are connected in series by a gold thread and the line welding discs. In the encapsulating structure with multiple LED chips, as the LED chips are connected in series by the gold thread and the line welding discs, the current passing through each chip is equal; moreover, the structure is simple, and the brightness of the chips after encapsulation is uniform. The utility model further provides an optical projection engine using the encapsulating structure with multiple LED chips.
Description
Technical field
The utility model relates to LED encapsulating structure and projection display technique, relates in particular to a kind of encapsulating structure of many led chips and uses its projecting optical engine.
Background technology
In recent years, because light-emitting diode (Light Emitting Diode, LED) characteristics such as Toxic matter are grown, are quick on the draw, are not contained to luminous efficiency height, life-span, make its application more and more widely, be considered to continue incandescent lamp, the later third generation lighting source of fluorescent lamp are widely used in liquid crystal projection apparatus, mobile phone backlight, display screen etc.Along with development of science and technology, LED also develops towards high brightness, low-loss direction.Yet the brightness that will improve LED reduces its light loss, and except from the architecture advances of LED own, the packaged type of led chip influences the key of its luminosity, the luminous uniformity especially.
In order to improve the luminous flux of whole illumination light, and then increase brightness, usually a plurality of led chips are encapsulated with parallel ways of connecting.Yet, because the internal resistance difference of each led chip, when the parallel connection of the led chip of a plurality of different internal resistances, the electric current that flows through on each led chip is also inequality, and the size of electric current directly influences the luminosity of LED, therefore, when the illumination light of this packaged type outgoing is shone screen, obviously brightness irregularities can appear, the skimble-scamble phenomenon of color and luster, and then directly influence the Projection Display effect.
The utility model content
The technical problems to be solved in the utility model provides a kind of encapsulating structure of simple in structure, many led chips of even brightness.
In addition, also need provide a kind of uniformity height, the effective projecting optical engine of Projection Display.
Goal of the invention of the present utility model is achieved through the following technical solutions:
A kind of encapsulating structure of many led chips comprises metal substrate and a plurality of led chip.Wherein, described metal substrate is provided with electrically insulating base, and described electrically insulating base is provided with a plurality of line pad separated from one another, and each led chip is connected in series by gold thread and described line pad.
A kind of projecting optical engine comprises little display floater, projection lens and lighting device.Wherein, little display floater is modulated incident light, and modulates the image light that carries image information.Projection lens is used for the visual information projection on described little display floater is imaged onto screen.Lighting device shines described little display floater.This lighting device comprises the encapsulating structure of a plurality of above-mentioned described many led chips.
The encapsulating structure of many led chips of the present utility model by gold thread and line pad a plurality of led chips connected in series, equates the electric current that flows through each chip, and is simple in structure, and encapsulation back chip brightness is even.And use the projecting optical engine of this encapsulating structure, and the little display floater of illumination light uniform irradiation of outgoing afterwards, modulates image light by little display floater, outputs to external screen from projection lens, and is simple in structure, the uniformity height, and Projection Display is effective.
Description of drawings
In order to be easy to explanation, the utility model is done to describe in detail by following preferred embodiment and accompanying drawing.
Fig. 1 is the main TV structure schematic diagram of the encapsulating structure of many led chips of the present utility model.
Fig. 2 is the plan structure schematic diagram of Fig. 1.
Fig. 3 is the A portion structure for amplifying schematic diagram of Fig. 1.
Fig. 4 is the equivalent circuit diagram of Fig. 1.
Fig. 5 is the planar structure schematic diagram of the utility model projecting optical engine.
Embodiment
Figure 1 shows that the main TV structure schematic diagram of the encapsulating structure of many led chips of the present utility model, consult Fig. 2 and Fig. 3 simultaneously, wherein, Fig. 2 is the plan structure schematic diagram of Fig. 1, and Fig. 3 is the A portion structure for amplifying schematic diagram of Fig. 1.The encapsulating structure of many led chips comprises metal substrate 10, is arranged at electrically insulating base 20 and a plurality of led chip 30 on the metal substrate 10.Wherein, electrically insulating base 20 is provided with a plurality of line pad 40 separated from one another.Each led chip 30 is connected in series by gold thread 50 and line pad 40.
In the utility model execution mode, a plurality of led chips 30 are to arrange with array way.Metal substrate 10 is that soldering is connected with the connected mode of electrically insulating base 20.And led chip 30 is that soldering is connected or elargol connects with the connected mode of electrically insulating base 20.Again, metal substrate 10 is the red copper substrate.Electrically insulating base 20 is a ceramic substrate, wherein preferred aluminium nitride (AlN); Adopt the structure of ceramic substrate, heat conduction in electric insulation realizes thermoelectric the separation.The material of line pad 40 is a metal.
In other execution mode of the utility model, a plurality of led chips 30 can also be arranged with circular, fashion.Ceramic substrate can also be Thermal Electric Cooler (TEC), that is, the utility model ceramic substrate is aluminium nitride or semiconductor cooler.Adopt the structure of semiconductor cooler, help rapid, uniform heat conduction, improve luminous efficiency.
Consult Fig. 3, the quantity of led chip 30 is consistent with the quantity of line pad 40.In the utility model execution mode, the quantity of led chip 30 is 6.
In other execution mode of the utility model, the quantity of led chip 30 also can be for more than 2 or 2.
Again, an end of each led chip is arranged at the surface of corresponding line pad respectively, and the other end of this led chip is connected with the line pad at another led chip place by gold thread 50.In the embodiment, the line pad at the led chip place that the other end of led chip is adjacent connects.
Say in detail, the upper surface of led chip, lower surface are generally the negative pole or the positive pole of chip, when an end of led chip is arranged on one of them line pad, for example the positive pole of led chip 31 is connected with line pad 41, and the other end of led chip 31, for example negative pole then is connected with another line pad 42 by gold thread 50, because these another line pad 42 places are connected with an end of another led chip 32, for example anodal, realize that then two chips are connected in series.After treating that all chips are all connected, only need the line pad at first chip place is connected with positive terminal (not indicating among the figure), and the negative pole of end chip is connected with negative terminal (not indicating among the figure), then realizes being connected in series of all chips equivalent circuit diagram as shown in Figure 4.
In addition, for effective each led chip 30 of protection and gold thread 50, improve the reliability of LED encapsulation, the encapsulating structure of many led chips also comprises the transparent enclosure colloid (not shown) that coats each led chip 30 and gold thread 50.
Therefore, the encapsulating structure of many led chips of the present utility model by gold thread and line pad a plurality of led chips connected in series, equates the electric current that flows through each chip, and is simple in structure, and encapsulation back chip brightness is even.
Figure 5 shows that the planar structure schematic diagram of the utility model projecting optical engine.Projecting optical engine comprises lighting device 60, polarizing beam splitter 70, little display floater 80 and projection lens 90.Wherein, the little display floater 80 of lighting device 60 irradiation, it comprises the encapsulating structure of many led chips of a plurality of above-mentioned execution modes and the various shaping mirror group (not shown)s of emergent light being carried out shaping.
Polarizing beam splitter 70 is arranged on the output light path of lighting device 60, in the utility model execution mode, polarizing beam splitter 70 is the lens type polarizing beam splitter, compose cube shaped by two triangular prisms, be coated with the polarization spectro rete therebetween on the contact-making surface, form a polarization light-dividing surface by this polarization spectro rete, this polarization light-dividing surface can be converted to non-polarized light polarised light and isolate the S polarised light and the P polarised light.Certainly, polarizing beam splitter 70 also can compose other shape by other prism, is converted into the polarised light outgoing as long as satisfy the non-polarized light of incident.
In other execution mode of the utility model, this polarizing beam splitter 70 also can be replaced by flat polarizing beam splitter.
The quantity of little display floater 80 is one, is arranged at a non-adjacent side of polarizing beam splitter 70 and lighting device, is used for received incident light is modulated, and modulates the image light that carries image information.In the utility model execution mode, little display floater 80 is reflective type silicon-based liquid crystal panel (LiquidCrystal on Silicon, LCOS), when the light that receives when little display floater 80 is the S polarised light, through after the modulation of little display floater 80, then reflect another polarised light P polarised light that carries image information, behind polarizing beam splitter 70 folded optical paths, with this P polarized light transmission to projection lens 90.Projection lens 90 and little display floater 80 opposing parallel settings in the execution mode of the present utility model are used for the visual information projection on little display floater 80 is imaged onto screen.
In other execution mode of the utility model, the received polarised light of little display floater 80 ' (shown in the dotted line of Fig. 5) also can be the P polarised light, through after the modulation of little display floater 80 ', be converted to the S polarised light that carries image information, and on its reflected back polarizing beam splitter 70, this S polarised light is reflexed on the projecting lens 90 by polarizing beam splitter 70.In other words, a projecting lens 90 and little display floater a 80 ' adjacent side that is arranged at polarizing beam splitter 70, that is, projecting lens 90 is arranged at respectively on the adjacent two sides of polarizing beam splitter 70 with little display floater 80 '.At this moment, projecting lens 90 is to be used to receive and throw the S polarised light that carries image information.
Therefore, the projecting optical engine of present embodiment, the illumination light of the encapsulating structure outgoing of many led chips is by the polarization separation of polarizing beam splitter, the little display floater of uniform irradiation, afterwards, little display floater modulates image light and enters polarizing beam splitter once more, output to external screen by polarizing beam splitter from projection lens, simple in structure, the uniformity height, Projection Display is effective.
The embodiment of the above is a better embodiment of the present utility model, be not to limit concrete practical range of the present utility model with this, scope of the present utility model comprises and is not limited to this embodiment that for example, little display floater is transmissive liquid crystal panel (Liquid Crystal Display, LCD), at this moment, omit polarizing beam splitter, transmissive liquid crystal panel is arranged on the emitting light path of lighting device, incident light is modulated, and transmitted the light that carries image information.The equivalence variation that all shapes according to the utility model, structure are done all comprises in the protection range of the present utility model.
Claims (12)
1. the encapsulating structure of led chip more than a kind, comprise metal substrate and a plurality of led chip, it is characterized in that, described metal substrate is provided with electrically insulating base, described electrically insulating base is provided with a plurality of line pad separated from one another, and each led chip is connected in series by gold thread and described line pad.
2. the encapsulating structure of many led chips according to claim 1 is characterized in that, an end of described led chip is arranged at the surface of corresponding line pad respectively, and the other end of led chip is connected by the line pad of gold thread with another led chip place.
3. the encapsulating structure of many led chips according to claim 2 is characterized in that, the line pad at the led chip place that the other end of described led chip is adjacent connects.
4. the encapsulating structure of many led chips according to claim 1 is characterized in that, the quantity of described led chip is consistent with the quantity of line pad.
5. the encapsulating structure of many led chips according to claim 1 is characterized in that, also comprises the transparent enclosure colloid that coats described led chip and gold thread.
6. the encapsulating structure of many led chips according to claim 1 is characterized in that, described metal substrate is that soldering is connected with the connected mode of electrically insulating base; Described led chip is that soldering is connected or elargol connects with the connected mode of electrically insulating base.
7. the encapsulating structure of many led chips according to claim 1 is characterized in that, described metal substrate is the red copper substrate; The material of described line pad is a metal.
8. the encapsulating structure of many led chips according to claim 1 is characterized in that, described electrically insulating base is a ceramic substrate.
9. the encapsulating structure of many led chips according to claim 8 is characterized in that, described ceramic substrate is aluminium nitride or semiconductor cooler.
10. projecting optical engine comprises:
Little display floater is modulated incident light, and modulates the image light that carries image information;
Projection lens is used for the visual information projection on described little display floater is imaged onto screen; And
Lighting device shines described little display floater, it is characterized in that, described lighting device comprises a plurality of encapsulating structures according to any described many led chips in the claim 1 to 9.
11. projecting optical engine according to claim 10 is characterized in that, described little display floater is LCOS, also is provided with polarizing beam splitter on its input path.
12. projecting optical engine according to claim 10 is characterized in that, described little display floater is LCD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202057719U CN201590414U (en) | 2009-09-30 | 2009-09-30 | Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202057719U CN201590414U (en) | 2009-09-30 | 2009-09-30 | Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201590414U true CN201590414U (en) | 2010-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202057719U Expired - Lifetime CN201590414U (en) | 2009-09-30 | 2009-09-30 | Encapsulating structure with multiple LED chips and optical projection engine using encapsulating structure |
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| Country | Link |
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| CN (1) | CN201590414U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456682A (en) * | 2011-11-17 | 2012-05-16 | 浙江英特来光电科技有限公司 | LED (light emitting diode) lamp structure |
| CN102767724A (en) * | 2012-07-26 | 2012-11-07 | 中山伟强科技有限公司 | Ceramic substrate LED module and high-power LED lamp |
| WO2022116879A1 (en) * | 2020-12-02 | 2022-06-09 | 深圳光峰科技股份有限公司 | Led light source structure and projector |
-
2009
- 2009-09-30 CN CN2009202057719U patent/CN201590414U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102456682A (en) * | 2011-11-17 | 2012-05-16 | 浙江英特来光电科技有限公司 | LED (light emitting diode) lamp structure |
| CN102456682B (en) * | 2011-11-17 | 2014-02-19 | 浙江英特来光电科技有限公司 | LED (light emitting diode) lamp structure |
| CN102767724A (en) * | 2012-07-26 | 2012-11-07 | 中山伟强科技有限公司 | Ceramic substrate LED module and high-power LED lamp |
| WO2022116879A1 (en) * | 2020-12-02 | 2022-06-09 | 深圳光峰科技股份有限公司 | Led light source structure and projector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: Cui Jing Road Shenzhen City, Guangdong province 518118 Pingshan New District No. 35 No. 1 Building 6 East Patentee after: Butterfly Technology (Shenzhen) Limited Address before: 518057, 301, two, Fengyun technology building, Fifth Industrial Zone, North Ring Road, Shenzhen, Guangdong, Nanshan District Patentee before: Butterfly Technology (Shenzhen) Limited |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100922 |
|
| CX01 | Expiry of patent term |