CN102767724A - Ceramic substrate LED (light emitting diode) module and high-power LED lamp - Google Patents

Ceramic substrate LED (light emitting diode) module and high-power LED lamp Download PDF

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Publication number
CN102767724A
CN102767724A CN2012102625107A CN201210262510A CN102767724A CN 102767724 A CN102767724 A CN 102767724A CN 2012102625107 A CN2012102625107 A CN 2012102625107A CN 201210262510 A CN201210262510 A CN 201210262510A CN 102767724 A CN102767724 A CN 102767724A
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CN
China
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heat
heat pipe
ceramic substrate
radiator
stage casing
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CN2012102625107A
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Chinese (zh)
Inventor
李克勤
陈宏杰
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中山伟强科技有限公司
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Priority to CN2012102625107A priority Critical patent/CN102767724A/en
Publication of CN102767724A publication Critical patent/CN102767724A/en

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Abstract

The invention discloses a ceramic substrate LED (light emitting diode) module and a high-power LED lamp. The ceramic substrate LED module comprises an aluminum nitride ceramic substrate, at least an LED chip, a metal plate and a connecting copper column, wherein the LED chip is arranged and fixed on the front face of the aluminum nitride ceramic substrate; the aluminum nitride ceramic substrate and the LED chip regularly are arranged in sequence; the metal plate is attached to the back face of the aluminum nitride ceramic substrate so as to support the aluminum nitride ceramic substrate; and the connecting copper column for the LED chip is tilted on the front face of the aluminum nitride ceramic substrate, wherein the connecting copper column is provided with a through hole communicated with the surface of the aluminum nitride ceramic substrate from the lower end and a jack communicated with the through hole from the side part; and a lead inserted into the through hole through the jack can be pressed and fixed on the aluminum nitride ceramic substrate by a screw passing through the through hole in a matched manner. The high-power LED lamp adopts the ceramic substrate LED module and obtains a good lighting effect by being matched with an internal radiator, a heat pipe set, a soaking plate and an external radiator. According to the ceramic substrate LED module and the high-power LED lamp provided by the invention, high-powder illumination in a small area can be realized and the ceramic substrate LED module and the high-power LED lamp have matched radiating efficiency at the same time.

Description

A kind of ceramic substrate led module and high-power LED lamp

Technical field

The present invention relates to a kind of high-power LED lamp, particularly relate to a kind of high-power LED lamp and ceramic substrate led module thereof.

Background technology

High-power illumination often is applied in large-scale place; On large-scale place such as indoor outer square, stadium, various commercial square and industrial plant, mining site or highway, along with popularizing of LED illumination, for seeking more energy-conserving and environment-protective and long-life illumination scheme; At present at the applied high-power illumination light fixture of large-scale occasion; Replaced by satisfactory LED more gradually, this type LED illuminating lamp can be described as high-power LED lighting fixture usually.When having determined its work, the characteristic of LED can produce higher heat; Therefore the heat radiation of LED lighting is a very important index, especially for high-power LED illumination, only possesses desirable radiator structure; Can guarantee the work that LED is normal, permanent; Otherwise when unnecessary heat can't effectively be discharged, can cause the LED light decay, and influence the service life of LED.

At present common high-power LED lamp is normal to adopt auxiliary cooling system to dispel the heat, and its power only reaches 100W to 200W mostly, not enough in the illumination intensity and the applicability of some large-scale occasion; Especially at the lighting field at more high tip; For example some require than small size and volume down the realization ultra high power throw light on, because of voltage and operating temperature all higher, the easy breakdown electric leakage of conventional configurations; Produce fault and danger; Also can not get dispersing and accelerated ageing timely and effectively by Yin Wendu simultaneously, visible still perfect inadequately technically at present, be necessary to make further improvement.

Summary of the invention

The technical problem that the present invention will solve provides and a kind ofly can in small size, realize high power illumination, the high-power LED lamp that possesses the ceramic substrate led module of the radiating efficiency that is complementary simultaneously and match and use.

The technical solution adopted for the present invention to solve the technical problems is: a kind of ceramic substrate led module comprises:

One aluminium nitride ceramics substrate;

At least one led chip is placed the front of being fixed in said aluminium nitride ceramics substrate, and is arranged in order by rule;

One metallic plate is fitted to support said aluminium nitride ceramics substrate with the back side of said aluminium nitride ceramics substrate each other; And

The wiring copper post of said led chip is affixed on said aluminium nitride ceramics substrate front side; Said wiring copper post is provided with the through hole that the lower end is communicated to said aluminium nitride ceramics substrate surface; And being communicated to the plug wire hole of said through hole by sidepiece, the lead that is inserted in said through hole through said plug wire hole cooperates the screw that is through at said through hole to press to be located on the said aluminium nitride ceramics substrate.

Preferably, the said led chip arrangement gross area is less than 100cm 2, the general power of said led chip is greater than 1000W.

Beneficial effect of the present invention: the present invention is with encapsulated LED chip and aluminium nitride ceramics substrate bonded; Use aluminium nitride ceramics substrate low thermal resistance, insulation, little, the high temperature resistant humidity of thermal expansivity, advantage that chemical stability is high; Make that product can be when reaching very high power work; Can be quick, stable heat be conducted realized the very big power stability illumination in small size as far as possible; Consider that the aluminium nitride ceramics substrate material is fragile, the present invention sets the good metallic plate of thermal conductivity in addition as support; Carry out lead through wiring copper post in addition and connect, efficiently solve the problem of aluminium nitride ceramics substrate welding difficulty, let product structure very rationally, have more practicality.

The present invention also provides a kind of high-power LED lamp, comprises above-described ceramic substrate led module.

Also comprise:

One inner radiator is made up of inner cylinder and outer cylinder with one heart mutual and that be set-located, between said inner cylinder and outer cylinder, is connected with a plurality of fins, forms the gas channel that can be produced stack effect by the heat that is received between the adjacent said fin;

One outer radiator; Has a through hole; Be provided with a plurality of radiating fins vertically or the gas channel of being made up of a plurality of radiating fins that can be produced stack effect by the heat that is received in said through hole periphery, said outer radiator is sheathed on outside the said inner radiator through said through hole;

One heat pipe heat; Heat pipe by a plurality of bendings that take the shape of the letter U is formed; Each said heat pipe is divided into the U-shaped stage casing of mid portion and the U-shaped end that distributes along both sides, said U-shaped stage casing; The mutual amalgamation of U-shaped end of a plurality of said heat pipes is fixed together and forms a burnishing surface, and said burnishing surface is as the position of fixing said ceramic substrate led module; The U-shaped pipe of said heat pipe is positioned at the same side of said burnishing surface jointly, and the circumferentially distribution of relative and said burnishing surface edge, forms a ring-type hurdle as circular pens, is sheathed on outside the said inner radiator, and is fitted in the outer wall of said inner radiator; And

One annular soaking plate is coated on the formed ring-type marge of U-shaped end of all heat pipes in the said heat pipe heat, and said soaking plate is sleeved on outside the said inner radiator, with the heat on the said heat pipe through said inner radiator pass to said outside radiator.

Preferably; Wall offers plurality of grooves vertically outside the said inner radiator outer cylinder; The U-shaped end of a plurality of heat pipes of said heat pipe heat is complementary and closely is mounted in the said groove; Wherein said groove cross section all is circular-arc, and the heat pipe of said heat pipe heat and the said groove face of fitting are arc surface;

Between the burnishing surface of said heat pipe heat and said inner radiator, also be provided with a heat pipe support; Said heat pipe support front is provided with the groove shape lines in the U-shaped stage casing of settling heat pipe; Fixing with near combining closely of the heat pipe realization and the said burnishing surface, the back side of said heat pipe support then fits tightly with said inner radiator end.

Preferably, the one side that the cross section of said groove shape lines and said heat pipe are fitted is circular-arc, and another side is the plane; Said heat pipe is to be formed by single heat pipe bending, and/or is made up of two L shaped heat pipe splicings.

Preferably, be provided with a soaking plate between said heat pipe heat and the said ceramic substrate led module.

Preferably, said heat pipe heat is set to first heat pipe heat and second heat pipe heat, replaces described heat pipe heat and annular soaking plate, wherein

First heat pipe heat; Heat pipe by a plurality of bendings that take the shape of the letter U is formed; The U-shaped stage casing of wherein said heat pipe pieces together a burnishing surface each other with fixing said ceramic substrate led module; The U-shaped end of said heat pipe is placed on outside the said inner radiator, and with the outer cylinder of said inner radiator outside within the through hole of wall and said outer radiator wall fit;

Second heat pipe heat; Heat pipe by a plurality of bendings that take the shape of the letter U is formed; The U-shaped stage casing of wherein said heat pipe is positioned at the rear in the U-shaped stage casing of said first heat pipe heat; And perpendicular with the U-shaped stage casing of said first heat pipe heat, the U-shaped end of said heat pipe is placed on outside the said inner radiator, and with the outer cylinder of said inner radiator outside within the through hole of wall and said outer radiator wall fit; And

One gripper shoe; Between the U-shaped stage casing of the U-shaped stage casing of said first heat pipe heat and said second heat pipe heat; What the front of said gripper shoe was provided with that U-shaped stage casing shape with said first heat pipe heat matches first fixes lines, is used to fix the U-shaped stage casing of said first heat pipe heat; What the back side of said gripper shoe was provided with that U-shaped stage casing shape with said second heat pipe heat matches second fixes lines, is used to fix the U-shaped stage casing of said second heat pipe heat; The wherein said first fixing lines and second fixes between the lines and runs through porose, makes the U-shaped stage casing of first heat pipe heat that quilt is fixed and the U-shaped stage casing of second heat pipe heat to be in contact with one another.

Preferably; Wall offers a plurality of first grooves vertically outside the said inner radiator outer cylinder; The U-shaped end of said first heat pipe heat and the U-shaped end of second heat pipe heat are complementary respectively and closely are mounted in said first groove; Wall offers a plurality of second grooves vertically within the said outer radiator through hole; The U-shaped end of said first heat pipe heat and the U-shaped end of second heat pipe heat are complementary respectively and closely are mounted in said second groove, and wherein said first groove and the second groove cross section all are circular-arc, and the heat pipe of said first heat pipe heat and second heat pipe heat and said first groove and the second groove face of fitting are arc surface;

The inner cylinder of said inner radiator is provided with at least one perforate that can let air communication cross;

The said first groove proximal most position place of distance is provided with fin on the said inner radiator, and the said second groove proximal most position place of distance is provided with radiating fin on the said outer radiator.

Preferably, the U-shaped stage casing rear side of said second heat pipe heat is provided with lower supporting plate, and said lower supporting plate is provided with the fixing lines, and the U-shaped stage casing of said second heat pipe heat is placed in the said fixing lines.

The present invention with above-mentioned ceramic substrate led module fit applications in high-power LED lamp, rational in infrastructure complete in conjunction with the ingenious cooperation of inner radiator, outer radiator and heat pipe heat etc., good heat dissipation effect; Through experimental verification, the present invention can control the operating temperature of LED within the acceptable range all the time, under limit testing environment, can reach high product yield.

Description of drawings

Fig. 1 is the structural representation of embodiment of the invention ceramic substrate led module;

Fig. 2 is the fractionation structural representation of wiring copper post in the embodiment of the invention;

Fig. 3 is the aging curve figure of the embodiment of the invention;

Fig. 4 is the fractionation structural representation of first kind of embodiment of embodiment of the invention high-power LED lamp;

Fig. 5 is the Facad structure sketch map of the high-power heat radiation module of the embodiment of the invention;

Fig. 6 is the perspective view of inner radiator in the embodiment of the invention;

Fig. 7 is the perspective view of heat pipe support in the embodiment of the invention;

Fig. 8 is the cross-sectional structure sketch map of embodiment of the invention heat pipe;

Fig. 9 is the Facad structure sketch map of first kind of embodiment of embodiment of the invention China and foreign countries' radiator;

Figure 10 is the Facad structure sketch map of second kind of embodiment of embodiment of the invention China and foreign countries' radiator;

Figure 11 is the equivalent thermal resistance heat dissipation path figure of the embodiment of the invention;

Figure 12 is the fractionation structural representation of second kind of embodiment of embodiment of the invention high-power LED lamp;

Figure 13 is the fractionation structural representation of the third embodiment of embodiment of the invention high-power LED lamp;

Figure 14 is the structural representation of first heat pipe heat among the third embodiment of the present invention;

Figure 15 is the structural representation of second heat pipe heat among the third embodiment of the present invention;

Figure 16 is the perspective view of gripper shoe among the third embodiment of the present invention;

Figure 17 is the Facad structure sketch map of gripper shoe among the third embodiment of the present invention;

Figure 18 is the structural representation of inner radiator among the third embodiment of the present invention;

Figure 19 is the Facad structure sketch map of the third embodiment China and foreign countries radiator of the present invention;

Figure 20 is the Facad structure sketch map of the 4th kind of embodiment China and foreign countries of the present invention radiator;

Figure 21 is the cross section structure sketch map that first heat pipe heat, second heat pipe heat and inner radiator and outer radiator fit together among the third embodiment of the present invention;

Figure 22 is the cross section structure sketch map of heat pipe in the preferred embodiment for the present invention;

Figure 23 is the equivalent heat dissipation path figure of the third embodiment of the present invention.

The specific embodiment

In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.

As depicted in figs. 1 and 2, a kind of ceramic substrate led module comprises:

One aluminium nitride ceramics substrate 11;

At least one led chip 12 is placed the front of being fixed in said aluminium nitride ceramics substrate 11, and is arranged in order by rule;

One metallic plate 13 is fitted to support said aluminium nitride ceramics substrate 11 with the back side of said aluminium nitride ceramics substrate 11 each other; And

The wiring copper post 14 of said led chip 12; Be affixed on said aluminium nitride ceramics substrate 11 fronts; Said wiring copper post 14 is provided with the through hole 141 that the lower end is communicated to said aluminium nitride ceramics substrate 11 surfaces; And being communicated to the plug wire hole 142 of said through hole 141 by sidepiece, the lead that is inserted in said through hole 141 through said plug wire hole 142 cooperates the screw 143 that is through at said through hole 141 to press to be located on the said aluminium nitride ceramics substrate 11.

The present invention combines encapsulated LED chip 12 with aluminium nitride ceramics substrate 11, make when product can reach very high power work, and can be quick, stable heat be conducted realized the very big power stability illumination in small size as far as possible; Consider that aluminium nitride ceramics substrate 11 materials are fragile, the present invention sets the good metallic plate of thermal conductivity 13 in addition as supporting; Carry out lead through wiring copper post 14 in addition and connect, efficiently solve the problem of aluminium nitride ceramics substrate welding difficulty, let product structure very rationally, have more practicality.

Wherein, The mount foundation of printed wiring as led chip 12 is set earlier on the aluminium nitride ceramics substrate 11; It is that higher aluminium nitride sintering forms that the baseplate material of aluminium nitride ceramics substrate 11 uses purity usually, compares the aluminium oxide ceramic substrate that generally adopts in the market, and the aluminium nitride ceramics substrate 11 that the present invention adopted can possess the high heat-conducting property of ratio; Its heat transfer coefficient K value can reach 200; And the K value of aluminium oxide ceramic substrate only can reach 20 usually, therefore visible the present invention adopt the aluminium nitride base material the heat transference efficiency that can reach, eminence conventional oxidation aluminum far away.The printed wiring of aluminium nitride ceramics substrate 11; Can adopt film or thick film manufacture craft; Sintering forms after utilizing vacuum evaporation or sputter or screen-printed metal slurry; It possesses very high reliability, can therefore especially be fit to modular circuit and make through methods such as laser ablation or oxidation adjustment tissue simultaneously.

Led chip 12 can adopt tin cream weldering or other equivalent means to settle and be fixed on aluminium nitride ceramics substrate 11 fronts, and arranges in the area that is limited to rectangle or circle according to printed wiring; Metallic plate 13 adopts copper or the high material of other heat conduction efficiency usually, and it is sticked at the back side of aluminium nitride ceramics substrate 11, though be used for supporting the aluminium nitride ceramics substrate 11 that thermal resistance is low, insulation is fragile; Being fixed on led chip 12 on the aluminium nitride ceramics substrate 11 connects successively or according to behind the certain rule series and parallel, need draw lead through the electrode that substrate provided.In the present invention, aluminium nitride ceramics substrate 11 is if directly adopt the scheme of welding lead, and then because the thermal conductive resin that himself low thermal resistance brought can cause too fast heat radiation, welding temperature is not enough, the problem that is difficult for burn-oning; Therefore the present invention is provided with on aluminium nitride ceramics substrate 11 and cooperates its printed wiring; With wiring copper post 14 to led chip 12 counter electrodes; Usually wiring copper post 14 has two; The both positive and negative polarity of the corresponding led chip 12 of difference, wiring copper post 14 can adopt tin cream weldering or similar means patch block in aluminium nitride ceramics substrate front side 11 equally.

Ceramic substrate led module 1 of the present invention can be implemented in the led chip of the general power 1000W that arranges in the square area of 10cm * 10cm.

As shown in Figure 3, provided the burn-in test curve map of said embodiment, wherein the environment temperature Ta of ceramic substrate led module 1 is 55~85 ℃; Corresponding LED central temperature Tj will reach 75~105 ℃, detect through experiment to show 6000 hours continuous operation; Ceramic substrate led module 1 few the generation significantly worn out; Until near 36000 hours, it is thus clear that the ageing rate of ceramic substrate led module 1 is also less than 30%, therefore advantage of the present invention.

As shown in Figure 4, first kind of preferred embodiment of the high-power LED lamp of the above-mentioned ceramic substrate led module 1 of application provided by the present invention comprises above-mentioned ceramic substrate led module 1, also comprises

One inner radiator 2; By concentric and inner cylinder 21 and outer cylinder 22 that be set-located are formed each other; Between said inner cylinder 21 and outer cylinder 22, be connected with a plurality of fins 24, form between the adjacent said fin 24 can nationality by the gas channel 23 of the heat generation stack effect that is received.In the structure of the present invention, the various accessories of light fixture like power module, can be arranged in the mider hole of tubular inner radiator 2, realize hiding and install, and lead connects is then drawn by nose end, is connected on the pin or metal heat-conducting element 1 of ceramic substrate led module 1.In addition, with reference to Fig. 6, among the said embodiment; Inner cylinder 21, outer cylinder 22, gas channel 23 and the good heat dissipation path of fin 24 common formation; So inner radiator 2 is understood this and is produced stack effects at gas channel 23 after accepting the heat that heat pipe heat 3 transmitted, and reaches better radiating effect.

One outer radiator 5; Has a through hole; Be provided with a plurality of radiating fins 52 vertically or the gas channel of being made up of a plurality of radiating fins 52 51 that can nationality be produced stack effect by the heat that is received in said through hole periphery, said outer radiator 5 is sheathed on outside the said inner radiator 2 through through hole; The more convenient heat that heat pipe heat 3 transmission are come of the design of the structure of through hole, radiating fin 52 and gas channel 51 passes easily.

One heat pipe heat 3; Heat pipe 31 by a plurality of bendings that take the shape of the letter U is formed; Each said heat pipe 31 is divided into the U-shaped stage casing of mid portion and the U-shaped end that distributes along both sides, said U-shaped stage casing; The mutual amalgamation of U-shaped end of a plurality of said heat pipes 31 or be weldingly fixed on and form a burnishing surface 30 together, said burnishing surface 30 is as the position of fixing said ceramic substrate led module 1; The U-shaped pipe of said heat pipe 31 is positioned at the same side of burnishing surface 30 jointly, and relative and circumferentially distribution of burnishing surface 30 edges, forms a ring-type hurdle structure as circular pens, is sheathed on outside the said inner radiator 2, and is fitted in the outer wall of said inner radiator 2.

The amalgamation of multistage heat pipe receives the heat shunting of coming with heat pipe heat 3 more easily and passes; The design of burnishing surface is fixing ceramic substrate led module 1 unlikely coming off more firmly; After accomplishing with inner radiator 2 assemblings; Heat pipe heat 3 formed burnishing surfaces 30 just are positioned at inner radiator 2 one ends, guarantee that in addition burnishing surface 30 and the heat conducting element of being settled 1 and/or ceramic substrate led module 1 do not stop the passage 23 of inner radiator 2 as far as possible, and its state is as shown in Figure 5; Ring-type hurdle structure Design makes the heat shunting evenly, is fitted in inner radiator 2 outer walls more easily, and spread heat is passed to annular soaking plate 4.And in actual product, can guarantee as far as possible that anomaly is equal between the heat pipe 31 formed ring-type hurdles, the passage 23 that guarantees inner radiator 2 simultaneously also is and is evenly distributed, and so realizes the reasonable distribution of heat and disperses.

One annular soaking plate 4; Be coated on the formed ring-type marge of U-shaped end of all heat pipes 31 in the said heat pipe heat 3; Said annular soaking plate 4 outer being sleeved in the said outer radiator 5, with the heat on the said heat pipe 31 through said inner radiator 2 pass to said outside radiator 5.The structure matching of the structural design of annular and inner radiator 2 and outer radiator 5, heat radiation are more evenly effectively.

The U-shaped end of said soaking plate 4 madial walls and each heat pipe 31 is fitted; Form good conducting structure; Heat on this heat pipe 31 also passes to the annular soaking plate 4 in the outside except passing to inboard inner radiator 2, and is two-dimensional plane via soaking plate 4 and evenly disperses heat; And outside soaking plate 4, be set with outer radiator 5, and said outer radiator 5 receives the heat that soaking plate 4 is transmitted, and flowing through air distributes, and integral body externally forms good radiator structure.

The present invention with above-mentioned ceramic substrate led module 1 fit applications in high-power LED lamp, rational in infrastructure complete in conjunction with the ingenious cooperation of inner radiator 2, outer radiator 5 and heat pipe heat 3 etc., good heat dissipation effect; Through experimental verification, the present invention can control the operating temperature of LED within the acceptable range all the time, under limit testing environment, can reach high product yield.

Metallic plate 13 can be used as the fixed installation structure because of possessing enough constant intensities, is used for being connected with heat pipe heat 3 mounts, and the work calories of led chip 12 can pass to heat pipe heat 3 through aluminium nitride ceramics substrate 11, metallic plate 13 successively; In addition, the lead of aforesaid led chip 12 can directly be guided to the through hole that inner radiator 2 leaves after fixing through wiring copper post 14, and in the through hole like inner cylinder 21 middle parts under this embodiment, and this draws or connect driving power; Metallic plate 13 can also be provided with the through hole that the restriction fixing cord is used in relevant deriving structure.Heat pipe heat 3 is as heat conduction components and parts; Purpose is in order will the heat that pass over to be conducted fast and effectively by ceramic substrate led module 1; So the heat of burnishing surface 30 acceptance according to the characteristic of heat pipe, is linearity and diffuses to the ring-type hurdle that the U-shaped end is surrounded jointly; And be delivered to inner radiator 2, exhale by inner radiator 2.

When considering assembling, ceramic substrate led module 1 is pressed down and makes to fit tightly itself and the parts that cooperated like heat pipe heat 3; And desirable heat transfer efficiency, avoid the module pressurized to be damaged again simultaneously, therefore whole module should possess rational size; To reach enough thickness and not influence normal heat radiation; Preferred embodiment of the present invention provides, aluminium nitride ceramics substrate 11 thickness 0.5mm, metallic plate 13 thickness 1~3mm; The more preferred thickness 1.5~2mm of metallic plate can meet the demands.

Shown in figure 12 is second kind of typical embodiment of the present invention, between said heat pipe heat and said ceramic substrate led module, is provided with a soaking plate.This soaking plate 7 possesses gas-liquid two-phase and changes performance and take this to realize the Rapid Thermal conduction in inside; Soaking plate 7 is used for fixing LED module 1; Profile generally is planar sheet; When it is advantageous that the placement surface as ceramic substrate led module 1, can obtain more superior heat conductivility, to realize quick conduction to the heat of ceramic substrate led module 1.

Heat pipe be shaped as a tubular usually; Need carry out bending technique among the present invention and roughly form U-shaped; And need a plurality of application that are bolted together, form one respectively and settle the ring-type hurdle of burnishing surface 30 and U-shaped end, so preferably also want opposite heat tube 31 to press-fit shaping; With better and relevant components and parts applying assembling, this reaches better thermal conduction effect.

Shown in Figure 6, in a kind of preferred version of the present invention, wall offers plurality of grooves 25 vertically outside inner radiator 2 cylinders; The U-shaped end of a plurality of heat pipes 31 is complementary and closely is mounted in the groove 25 in the heat pipe heat 3, and in order better to match, preferably processes groove 22 cross sections circular-arc; Corresponding heat pipe 31 is an arc surface with the side that groove 25 fits; Both fit closely in realization, so in the profile that needn't change heat pipe, simplify under the prerequisite of technology; Not only make heat pipe heat 3 firm with inner radiator 2 location, and make both fit closely and the conduction of order heat reaches optimum; And, be inconvenient to change setting in the shape of soaking plate 4 sidewalls because ring-type marge adhesive parts is a soaking plate 4, therefore as preferred scheme; Can the one side that heat pipe 31 and soaking plate 4 fit be compressed to the plane; To reach optimum contact effect equally, thus, then the shape of cross section of heat pipe 31 as shown in Figure 8; One side is the circular arc that cooperates with the groove 25 of inner radiator 2, and opposite side then is the plane of fitting with soaking plate 4 madial walls.

The heat that soaking plate 4 receives needs to exhale via outer radiator 5, and the area that outer radiator 5 contacts with air is big more; Then radiating effect is good, as shown in Figure 9 more, in a kind of scheme that the present invention preferably adopts; Outer radiator 5 peripheries are provided with a plurality of heat dissipation channels 51 vertically, and the heat that these heat dissipation channel 51 nationalitys are transmitted by soaking plate 4 can produce stack effect; To increase speed air flow, realized that so heat is transmitted fast; Shown in figure 10, in another kind of preferred version of the present invention, outer radiator 5 peripheries are provided with radiating fin 52, and radiating fin also can interconnect, and when having bigger area of dissipation, possesses the advantage of stack effect equally.

As shown in Figure 7; As preferred version; Can between the burnishing surface 30 of heat pipe heat 3 and inner radiator 2, be provided with heat pipe support 6, heat pipe support 6 fronts are provided with the groove shape lines 61 in the U-shaped stage casing of settling heat pipe, the cross section of said groove shape lines; The one side of fitting with said heat pipe is circular-arc, and another side is the plane; Fixing with near combining closely of the heat pipe 31 realization and the burnishing surface 30; Heat pipe support 6 back sides then fit tightly with inner radiator 2 ends; Heat pipe support 6 is beneficial to the better effective conduction of heat, can also make structure more stable and reasonable as the intermediate member to mount simultaneously.

The present invention can be applicable to the LED light fixture of ultra high power according to said structure, and is shown in figure 11; Represented equivalent thermal resistance heat dissipation path of the present invention, the heat that produces in the time of can knowing 1 work of ceramic substrate led module, its conduction route is: led chip 12 direct heat transfers are to aluminium nitride ceramics substrate 11; Soaking plate 7, heat pipe heat 3 and soaking plate 4, wherein the K value of aluminium nitride ceramics substrate 11 can reach 200, belongs to the heat transfer medium of low thermal resistance; Heat pipe heat 3 can equivalence be a hot superconduction in conduction process, plays the heat effect of conduction fast; And, then be divided into two-way via the heat of heat pipe heat 3, wherein one the tunnel for passing to inner radiator 2; Finally realize heat radiation by inner radiator 2 and air heat exchange; Another road then through after another equivalent hot superconduction soaking plate 4 uniform heat, passes to outer radiator 5, finally realizes heat radiation by outer radiator 5 air heat exchange.It is thus clear that scheme of the present invention is equivalent to two radiating parts that possess two parallel connections, dispel the heat because it is directed against unique ceramic substrate led module 1, so radiating effect is very good.

After lamp installation, the side with ceramic substrate led module 1 roughly towards the below shining, so produce heat during 1 work of ceramic substrate led module; Outside transmitting by heat conducting element 1, soaking plate 7, heat pipe heat 3, heat pipe support 6, inner radiator 2 soaking plate 4 and radiator 5; In the side near ceramic substrate led module 1, colder air rises, via the stack effect that passage produced of inner radiator 2 and/or outer radiator 5; Via inner radiator 2, outer radiator 5 passages and surface; With the heat absorption on inner radiator 2, the outer radiator 5, form hot-air gradually, finally the last square opening from passage flows out; So circulation can realize better heat radiating effect.

Shown in figure 13, the another kind of exemplary embodiments of high-power LED lamp provided by the invention, structure mainly comprise ceramic substrate led module 1, inner radiator 2 ', outer radiator 5 ', first heat pipe heat 8, second heat pipe heat 9 and the gripper shoe 6 '.Said heat pipe heat 3 is set to first heat pipe heat 8 and second heat pipe heat 9, replaces described heat pipe heat 3 and annular soaking plate 4.Therefore the work calories of led chip 12 can pass to first heat pipe heat 8 and second heat pipe heat 9 through aluminium nitride ceramics substrate 11, metallic plate 13 successively; First heat pipe heat 8 and second heat pipe heat 9 are as heat conduction components and parts, and purpose is in order to be conducted fast and effectively through transmitting by the heat that ceramic substrate led module 1 is produced.

Shown in figure 14; First heat pipe heat 8 is made up of the heat pipe 81 of a plurality of bendings that take the shape of the letter U; It is three parts that the heat pipe 81 of each U-shaped bending is converted into, and promptly mid portion is U-shaped stage casing and the U-shaped end that distributes along both sides, U-shaped stage casing, each U-shaped heat pipe 81; Can be formed by single heat pipe bending, also can be that two L shaped heat pipes are put together; At least one wherein the mutual amalgamation of U-shaped stage casing end or be weldingly fixed on of heat pipe 81 form a burnishing surface 80 together with fixing ceramic substrate led module 1, said burnishing surface 80 is promptly as the fixing position of ceramic substrate led module 1; The U-shaped end of at least one heat pipe 81 is positioned at the same side of burnishing surface 80 jointly, and distributes along circumferential with respect to burnishing surface 80, forms hurdle shape structure.The U-shaped end of said heat pipe 81 is placed on outside the said inner radiator 2 ', and with the outer cylinder 22 ' of said inner radiator 2 ' outside within the through hole 50 ' of wall and said outer radiator 5 ' wall fit.

Accordingly; Shown in figure 15, second heat pipe heat 9 is made up of the heat pipe 91 of a plurality of bendings that take the shape of the letter U equally, and it is three parts that the heat pipe 91 of each U-shaped bending is converted into; Be that mid portion is U-shaped stage casing and the U-shaped end that distributes along both sides, U-shaped stage casing; Each U-shaped heat pipe 91 can be formed by single heat pipe bending, also can be that two L shaped heat pipes are put together; In syndeton, the U-shaped stage casing of second heat pipe heat 9 is positioned at the rear in the U-shaped stage casing of first heat pipe heat 8, and perpendicular intersection of U-shaped stage casing of fastening with first heat pipe heat 8 closed in the position; And it is same; The U-shaped end of second heat pipe heat 9 is identical with the U-shaped end bearing of trend of first heat pipe heat 8; Thus because the square crossing of two heat pipe heat relation; The formed hurdle of the U-shaped end shape structure of second heat pipe heat 9 just with the formed hurdle of the U-shaped end shape complementary structure of first heat pipe heat 8, surrounds a circular hurdle jointly.

Because first heat pipe heat 8 and second heat pipe heat 9 all are made up of a plurality of heat pipe amalgamations together; In order to strengthen the fixing of heat pipe; The spy has set up the gripper shoe 6 ' arrangement in the middle of being used for and has fixed; Wherein said gripper shoe 6 ' is between the U-shaped stage casing of the U-shaped stage casing of first heat pipe heat 8 and second heat pipe heat 9; And shown in figure 16, what the front of gripper shoe 6 ' was provided with that U-shaped stage casing shape with first heat pipe heat 8 matches first fixes lines 61 ', is used to clamp the U-shaped stage casing of being made up of a plurality of heat pipes of fixing first heat pipe heat 8; What the back side of gripper shoe 6 ' was provided with that U-shaped stage casing shape with said second heat pipe heat 9 matches second fixes lines 62 ', is used to fix the U-shaped stage casing of being made up of a plurality of heat pipes of said second heat pipe heat 9; Gripper shoe 6 ' preferably adopts heat conductivility good metal goods; In addition in order to strengthen the heat transference efficiency between first heat pipe heat 8 and second heat pipe heat 9; Can be shown in figure 17 on gripper shoe 6 '; Sets up hole 63 ' between the first fixing lines 61 ' and the second fixing lines 62 ', so clamp in the U-shaped stage casing of first heat pipe heat 8 and be fixed in the first fixing lines 61 ', the U-shaped stage casing of second heat pipe heat 9 is adorned when being fixed in the second fixing lines 61 ' simultaneously; Can be communicated with through hole 63 ' mutually and contact, reach the zero heat rejection between mutual.

In the package assembly of light fixture; Second heat pipe heat 9 is made up of a plurality of heat pipes; In order to be more convenient for fixing, shown in Figure 13, can be provided with lower supporting plate 6 at the U-shaped stage casing of second heat pipe heat 9 rear side "; said lower supporting plate 6 " be provided with fix lines 61 ", make the U-shaped stage casing of second heat pipe heat 9 be placed in said fixing lines 61 " in.

Shown in figure 18; Inner radiator 2 ' of the present invention is by concentric and inner cylinder 21 ' and outer cylinder 22 ' that be set-located are formed each other; Between inner cylinder 21 ' and outer cylinder 22 ', be connected with a plurality of fins 23 ', form between the adjacent fin 23 ' can nationality by the gas channel 24 ' of the heat generation stack effect that is received; In the actual installation structure, the various accessories of light fixture like power module, can be arranged in the hole of inner cylinder 21 ', realize hiding and install, and lead connects is then drawn by nose end, is connected on the pin or metal heat-conducting assembly of ceramic substrate led module 1; In preferred version; Can on the inner cylinder 21 ' of inner radiator 2 ', be provided with the perforate 211 ' that at least one can let air communication cross; Air flowing in the hole of inner cylinder 21 ' like this; Can flow in the gas channel 24 ' and near the fin 23 ', help the whole heat radiation of LED light fixture through perforate 211 '.

Shown in figure 19, outer radiator 5 ' of the present invention has a through hole 50 ', is provided with radiator structure vertically in through hole 50 ' periphery, and outer radiator 5 ' is sheathed on outside the above-mentioned inner radiator 2 ' through through hole 50 '.The area that the radiator structure of outer radiator 5 ' contacts with air is big more; Then radiating effect is good more, and in a kind of scheme that the present invention preferably adopts, outer radiator 5 ' periphery is provided with some gas channels 52 ' vertically; The heat that nationality is transmitted by first heat pipe heat 8 and second heat pipe heat 9; Can produce stack effect,, realize that so heat is transmitted fast to increase speed air flow; In design and manufacturing; Outer radiator 5 ' can be little cylinder and large cylinder through two not of uniform size and mutual two sheathed concentric drums equally; And at least one radial radiating fin 51 ' of connection supports between little cylinder and large cylinder; So the little cylinder at heart place promptly within it side form the through hole 50 ' of the ring-type hurdle structure that sheathed inner radiator 2 ' and first heat pipe heat 8, second heat pipe heat 9 formed; And the roundlet tube combines large cylinder and some at least one radial radiating fins 51 ', has just formed some at least one gas channels 52 '.

And it is shown in figure 19; In another kind of preferred version of the present invention; Outer radiator 5 ' periphery is provided with radial radiating fin 51 ', and these radiating fins also can be " Y " or " T " font, and radiating fin also can interconnect; When having bigger area of dissipation, possesses the advantage of stack effect equally.

Heat pipe in the present invention's first heat pipe heat 8 and second heat pipe heat 9 is shaped as a tubular usually; Shown in figure 20; Be provided with the sintered type multiple tube of groove 91 in heat pipe 9 pipes; And the quantity of its groove 91 is greater than 120, and for reaching the application to high-power illumination, its thermal resistance of optimal selection is less than 0.05 ℃/watt; Heat pipe need carry out bending technique and roughly form U-shaped, and needs a plurality of application that are bolted together, and therefore preferably also wants opposite heat tube to press-fit shaping, fits with better and relevant components and parts and assembles, and this reaches better thermal conduction effect.

According to said structure, the circular hurdle that the present invention is made up of the heat pipe U-shaped end of first heat pipe heat 8 and second heat pipe heat 9 jointly just is nested with outside inner radiator 2 ' on the one hand, and with inner radiator 2 ' outside the outer wall applying of cylinder 22 '; On the other hand, then just be fitted in the wall of the through hole 50 ' of outer radiator 5 '.The circular hurdle that the heat pipe U-shaped end of first heat pipe heat 8 and second heat pipe heat 9 is formed; Can cover inner radiator 2 '; And be positioned at inner radiator 2 ' front end; In order to reach optimum heat conduction efficiency, each heat pipe of first heat pipe heat 8 and second heat pipe heat 9 is all pressed close in the end of a fin 23 ' of inner radiator 2 ', and the fin 23 ' end shape that said part is pressed close to heat pipe is all as the arc that adapts to the heat pipe bending place.

In preferred embodiments; Wall offers a plurality of first grooves 221 ' vertically outside the outer cylinder 22 ' of inner radiator 2 '; This first groove 221 ' is used to cooperate each heat pipe of the U-shaped end of first heat pipe heat 8 and second heat pipe heat 9; Making the heat pipe of U-shaped end to be complementary respectively closely is mounted in this first groove 221 '; Wherein can be so that this first groove, 221 ' cross section is circular-arc, and the heat pipe of first heat pipe heat 8 and second heat pipe heat 9 should be arc surface mutually with the side that this first groove 221 ' fits.

Same; The wall of the through hole 50 ' of outer radiator 5 ' preferably offers a plurality of second grooves 501 ' vertically; This second groove 501 ' is used to cooperate each heat pipe of the U-shaped end of first heat pipe heat 8 and second heat pipe heat 9; Making the heat pipe of U-shaped end to be complementary respectively closely is mounted in said second groove 501 '; Wherein can be so that said second groove 501 ' cross section is circular-arc, and the heat pipe of first heat pipe heat 8 and second heat pipe heat 9 should be arc surface mutually with the side that said second groove 501 ' fits.First heat pipe heat 8, second heat pipe heat 9 and the structural representation after inner radiator 2 ' and outer radiator 5 ' assembling cooperate are shown in figure 21, and wherein label 9 is represented the heat pipe of inner radiator 2 ' or outer radiator 5 ', it is thus clear that; In the profile that needn't change heat pipe; Simplify under the prerequisite of technology, not only make heat pipe 9 firm locating, when unnecessary change heat pipe is round-shaped with inner radiator 2 ' and outer radiator 5 '; Can reach desirable fixed effect, structure is compact and reasonable more also; On the other hand, arcwall face closely mount cooperation, can increase contact area, and then increase from the heat pipe to the inner radiator 2 ' or effective heat transfer area of outer radiator 5 ', make the three fit closely and the conduction of order heat reaches optimum.

In addition as the radiating efficiency that strengthens inner radiator 2 ' and outer radiator 5 '; In a kind of preferable embodiment; Inner radiator 2 ' is gone up distance first groove 221 proximal most position places and is provided with fin 23 '; Make to be delivered to the heat that passes over from heat pipe on the fin 23 ', shed with air heat exchange by fin 23 ' with beeline.Same; Outer radiator 5 ' is gone up a plurality of second grooves of distance 301 proximal most position places and is provided with radiating fin 51 '; Make to be delivered to the heat that passes over from heat pipe on the radiating fin 51 ', shed with air heat exchange by radiating fin 51 ' with beeline.

The present invention can be applicable to the LED light fixture of various super high powers, and the heat that produces when working as the ceramic substrate led module 1 of thermal source is the main thermal source of light fixture, during 1 work of ceramic substrate led module; Heat at first is delivered to the burnishing surface 80 that is made up of the U-shaped stage casing on first heat pipe heat 8; Make the heat pipe heat 8 of winning receive heat, and, can share the heat of first heat pipe heat 8 rapidly because second heat pipe heat 9 and first heat pipe heat 8 contact; Jointly heat is delivered to U-shaped end separately; Because the U-shaped end touches the outer wall of cylinder 22 ' outside the inner radiator 2 ' respectively, and wall within the through hole 50 ' of outer radiator 5 ', so heat divides for two paths; Be delivered to respectively on inner radiator 2 ' and the outer radiator 5 ', dispelled the heat by inner radiator 2 ' and outer radiator 5 ' acting in conjunction; In order to reach radiating effect completely; Total heat radiation power of first heat pipe heat 8 and 9 additions of second heat pipe heat; Must be more than or equal to the power of ceramic substrate led module 1; The radiating rate of first heat pipe heat 8 like this and second heat pipe heat 9, the speed of generation heat in the time of just being able to catch up with 1 work of ceramic substrate led module.

The present invention can be applicable to the LED light fixture of ultra high power according to said structure, and is shown in figure 23; Represented equivalent thermal resistance heat dissipation path of the present invention, the heat that produces in the time of can knowing 1 work of ceramic substrate led module, its conduction route is: led chip 12 direct heat transfers are to aluminium nitride ceramics substrate 11; Being directly passed to first heat pipe heat 8 and second heat pipe heat, 9, the first heat pipe heat 8 and second heat pipe heat 9 again in conduction process, can equivalence be a hot superconduction; Play the heat effect of conduction fast, and, then be divided into two-way via the heat that first heat pipe heat 8 and second heat pipe heat 9 are derived; Wherein one the tunnel for passing to inner radiator 2 '; Finally realize heat radiation by inner radiator 2 ' and air heat exchange, another road then passes to outer radiator 5 ', finally realizes heat radiation by outer radiator 5 ' air heat exchange.It is thus clear that scheme of the present invention is equivalent to two radiating parts that possess two parallel connections, dispel the heat because it is directed against unique ceramic substrate led module 1, so radiating effect is very good.

After lamp installation, the side with ceramic substrate led module 1 roughly towards the below to shine, generally also can outside LED module 1, set up a cover 10 and protect.Produce heat during 1 work of ceramic substrate led module, outside transmitting, in a side near ceramic substrate led module 1 by inner radiator 2 ' and radiator 5 '; Colder air rises, via the stack effect that passage produced of inner radiator 2 ' and/or outer radiator 5 ', gradually with the heat absorption on inner radiator 2 ', the outer radiator 5 '; Form hot-air; Finally the last square opening from passage flows out, and so circulation can realize better heat radiating effect.

The invention is not limited to above-mentioned embodiment; Those of ordinary skill in the art also can make equivalent variations or replacement under the prerequisite of spirit of the present invention, modification that these are equal to or replacement all are included in the application's claim institute restricted portion.

Claims (10)

1. ceramic substrate led module is characterized in that: comprising:
One aluminium nitride ceramics substrate;
At least one led chip is placed the front of being fixed in said aluminium nitride ceramics substrate, and is arranged in order by rule;
One metallic plate is fitted to support said aluminium nitride ceramics substrate with the back side of said aluminium nitride ceramics substrate each other; And
The wiring copper post of said led chip is affixed on said aluminium nitride ceramics substrate front side; Said wiring copper post is provided with the through hole that the lower end is communicated to said aluminium nitride ceramics substrate surface; And being communicated to the plug wire hole of said through hole by sidepiece, the lead that is inserted in said through hole through said plug wire hole cooperates the screw that is through at said through hole to press to be located on the said aluminium nitride ceramics substrate.
2. ceramic substrate led module according to claim 1 is characterized in that: it is less than 100cm that said led chip is arranged the gross area 2, the general power of said led chip is greater than 1000W.
3. a high-power LED lamp is characterized in that: comprise claim 1 or 2 each described ceramic substrate led modules.
4. high-power LED lamp according to claim 3 is characterized in that: also comprise:
One inner radiator comprises inner cylinder and outer cylinder concentric each other and that be set-located, between said inner cylinder and outer cylinder, is connected with a plurality of fins, forms the gas channel that can be produced stack effect by the heat that is received between the adjacent said fin;
One outer radiator; Has a through hole; Be provided with a plurality of radiating fins vertically or the gas channel of being made up of a plurality of radiating fins that can be produced stack effect by the heat that is received in said through hole periphery, said outer radiator is sheathed on outside the said inner radiator through said through hole;
One heat pipe heat; Heat pipe by a plurality of bendings that take the shape of the letter U is formed; Each said heat pipe is divided into the U-shaped stage casing of mid portion and the U-shaped end that distributes along both sides, said U-shaped stage casing; The mutual amalgamation of U-shaped end of a plurality of said heat pipes is fixed together and forms a burnishing surface, and said burnishing surface is as the position of fixing said ceramic substrate led module; The U-shaped pipe of said heat pipe is positioned at the same side of said burnishing surface jointly, and the circumferentially distribution of relative and said burnishing surface edge, forms a ring-type hurdle as circular pens, is sheathed on outside the said inner radiator, and is fitted in the outer wall of said inner radiator; And
One annular soaking plate is coated on the formed ring-type marge of U-shaped end of all heat pipes of said heat pipe heat, and said soaking plate is sleeved on outside the said inner radiator, with the heat on the said heat pipe through said inner radiator pass to said outside radiator.
5. high-power LED lamp according to claim 4; Its characteristic exists: wall offers plurality of grooves vertically outside the said inner radiator outer cylinder; The U-shaped end of a plurality of heat pipes of said heat pipe heat is complementary and closely is mounted in the said groove; Wherein said groove cross section all is circular-arc, and the heat pipe of said heat pipe heat and the said groove face of fitting are arc surface;
Between the burnishing surface of said heat pipe heat and said inner radiator, also be provided with a heat pipe support; Said heat pipe support front is provided with the groove shape lines in the U-shaped stage casing of settling heat pipe; Fixing with near combining closely of the heat pipe realization and the said burnishing surface, the back side of said heat pipe support then fits tightly with said inner radiator end.
6. high-power LED lamp according to claim 5 is characterized in that: the cross section of said groove shape lines, and the one side of fitting with said heat pipe is circular-arc, and another side is the plane; Said heat pipe is to be formed by single heat pipe bending, and/or is made up of two L shaped heat pipe splicings.
7. high-power LED lamp according to claim 4 is characterized in that: be provided with a soaking plate between said heat pipe heat and the said ceramic substrate led module.
8. high-power LED lamp according to claim 4 is characterized in that: said heat pipe heat is set to first heat pipe heat and second heat pipe heat, replaces described heat pipe heat and annular soaking plate, wherein
First heat pipe heat; Heat pipe by a plurality of bendings that take the shape of the letter U is formed; The U-shaped stage casing of wherein said heat pipe pieces together a burnishing surface each other with fixing said ceramic substrate led module; The U-shaped end of said heat pipe is placed on outside the said inner radiator, and with the outer cylinder of said inner radiator outside within the through hole of wall and said outer radiator wall fit;
Second heat pipe heat; Heat pipe by a plurality of bendings that take the shape of the letter U is formed; The U-shaped stage casing of wherein said heat pipe is positioned at the rear in the U-shaped stage casing of said first heat pipe heat; And perpendicular with the U-shaped stage casing of said first heat pipe heat, the U-shaped end of said heat pipe is placed on outside the said inner radiator, and with the outer cylinder of said inner radiator outside within the through hole of wall and said outer radiator wall fit; And
One gripper shoe; Between the U-shaped stage casing of the U-shaped stage casing of said first heat pipe heat and said second heat pipe heat; What the front of said gripper shoe was provided with that U-shaped stage casing shape with said first heat pipe heat matches first fixes lines, is used to fix the U-shaped stage casing of said first heat pipe heat; What the back side of said gripper shoe was provided with that U-shaped stage casing shape with said second heat pipe heat matches second fixes lines, is used to fix the U-shaped stage casing of said second heat pipe heat; The wherein said first fixing lines and second fixes between the lines and runs through porose, makes the U-shaped stage casing of first heat pipe heat that quilt is fixed and the U-shaped stage casing of second heat pipe heat to be in contact with one another.
9. high-power LED lamp according to claim 8 is characterized in that:
Wall offers a plurality of first grooves vertically outside the said inner radiator outer cylinder; The U-shaped end of said first heat pipe heat and the U-shaped end of second heat pipe heat are complementary respectively and closely are mounted in said first groove; Wall offers a plurality of second grooves vertically within the said outer radiator through hole; The U-shaped end of said first heat pipe heat and the U-shaped end of second heat pipe heat are complementary respectively and closely are mounted in said second groove; Wherein said first groove and the second groove cross section all are circular-arc, and the heat pipe of said first heat pipe heat and second heat pipe heat and said first groove and the second groove face of fitting are arc surface;
The inner cylinder of said inner radiator is provided with at least one perforate that can let air communication cross;
The said first groove proximal most position place of distance is provided with fin on the said inner radiator, and the said second groove proximal most position place of distance is provided with radiating fin on the said outer radiator.
10. high-power LED lamp according to claim 9; It is characterized in that: the U-shaped stage casing rear side of said second heat pipe heat is provided with lower supporting plate; Said lower supporting plate is provided with the fixing lines, and the U-shaped stage casing of said second heat pipe heat is placed in the said fixing lines.
CN2012102625107A 2012-07-26 2012-07-26 Ceramic substrate LED (light emitting diode) module and high-power LED lamp CN102767724A (en)

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CN103968275A (en) * 2013-02-01 2014-08-06 深圳市虹林辉科技有限公司 LED (light emitting diode) lam and wiring method
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CN102927480A (en) * 2012-11-20 2013-02-13 南京汉德森科技股份有限公司 LED light source module and heat radiator thereof
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