CN202855798U - Dimmable COB package structure - Google Patents
Dimmable COB package structure Download PDFInfo
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- CN202855798U CN202855798U CN 201220579314 CN201220579314U CN202855798U CN 202855798 U CN202855798 U CN 202855798U CN 201220579314 CN201220579314 CN 201220579314 CN 201220579314 U CN201220579314 U CN 201220579314U CN 202855798 U CN202855798 U CN 202855798U
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- encapsulating structure
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Abstract
The utility model discloses a dimmable COB package structure, and relates to an LED light source module. The dimmable COB package structure comprises: a PCB substrate; LED chips which are fixed in neighboring annular regions on the PCB substrate separately; first fluorescent powder glue and second fluorescent powder glue; four different copper foil pads which are arranged in the innermost wall glue on the PCB substrate and serve as the positive electrodes and the negative electrodes of two sets of power sources; gold wires which are used for connecting two neighboring LED chips in each region, wherein one end of each gold wire is connected with the surface electrode of an LED chip, and the other ends of the gold wires are connected with the pads between the LED chips; and LED chip arrays, wherein each LED chip array is formed by serially connecting the LED chips in each region, the LED chip arrays in separated regions are serially connected, and no electrical connection exists between the LED chip arrays in neighboring regions. According to the utility model, the neighboring annular regions are filled with different types of fluorescent powder glues having different components, so the continuous dimming on a CIE-1931 chromaticity diagram curve can be realized by controlling the currents in regions which are filled with a same type of fluorescent powder glue.
Description
Technical field
The utility model relates to a kind of tunable optical COB encapsulating structure.
Background technology
Along with the progress of semiconductor lighting technology, the LED illuminating product has begun to be applied to every field.In order to satisfy different demands, light regulating technology has been subject to using more and more widely.Present existing light regulating technology is to excite yellow fluorescent powder and produce white light LEDs with blue-light LED chip, by regulating the electric current of blue-light LED chip, regulates the brightness that colour temperature and chromaticity coordinates are regulated LED.But when adopting such scheme to carry out light modulation, the scope of light modulation is little, can't continue light modulation along the CIE-1931 chroma curve.The application for a patent for invention of China's application number 201210070119.7 discloses a kind of tunable optical COB light source module, by led chip being divided into independent light source region, and by in adjacent light source region, filling dissimilar phosphor gel, control by the size of current to the light source region of the phosphor gel that is filled with same kind, and then realize the colour temperature of whole led light source and regulating and control of colorimetric purity, so that tunable optical COB light source module has been realized the continuous light tuning on CIE-1931 chromatic diagram curve, increase the adjustable range of led light source, also guaranteed simultaneously the consistency of led light source colour temperature and colorimetric purity in the light area.But being shaped as of a kind of tunable optical COB light source of foregoing invention patent application module is square, and its light efficiency is not high, is subject to certain restrictions at aspects such as the light-source brightness of LED and stability.
The utility model content
The purpose of this utility model is for top described defective, provides that a kind of symmetry is good, stable performance, tunable optical COB encapsulating structure that processing cost is low.
The purpose of this utility model is achieved by the following technical programs.
A kind of tunable optical COB encapsulating structure, it is characterized in that: it comprises:
One PCB substrate, this PCB substrate is divided into donut by enclosure wall glue with it;
Be separately fixed at led chip in the adjacent circle ring area on the PCB substrate, the led chip quantity in each zone is unequal;
The first phosphor gel and the second phosphor gel are coated in respectively the led chip top in the regional, and the led chip top in each zone only applies a kind of in the first phosphor gel or the second phosphor gel, and the phosphor gel composition in the adjacent area is different;
Positive pole and negative pole that to be provided with 4 different Copper Foil pads in the most inboard enclosure wall glue on the described PCB substrate be two groups of power supplys, the led chip array is connected between the positive pole and negative pole of power supply electrically, and the electric current that flows through between the positive pole of every group of power supply and the negative pole is different;
Connect by gold thread between adjacent LED chip in described each zone, described gold thread one end connects the led chip surface electrode, and the other end is connected with pad between the led chip;
The rear formation of led chip series connection led chip array in described each zone is connected in series nothing electric connection between the led chip array in the adjacent area separately between the led chip array in the zone.
Described led chip is blue-light LED chip.
Described PCB substrate is the circular aluminum substrate of heat radiation, and the periphery of substrate offers for hard-wired hole slot.
Described enclosure wall glue be shaped as center of circle annulus, the radius of each corral wall glue is different, increases successively by its order radius from inside to outside.
The quantity of described led chip increases progressively successively by adjacent spaces zone order from inside to outside.
The high silver coating of described PCB substrate plating surface last layer reflecting rate.
The beneficial effects of the utility model are: the disclosed tunable optical COB encapsulating structure of the utility model, use circular substrate by enclosure wall glue led chip to be divided into donut, in adjacent circle ring area, fill the phosphor gel of heterogeneity, by the control to the size of current in the zone of the phosphor gel that is filled with same kind, and then realize continuous light tuning on CIE-1931 chromatic diagram curve.The utility model adopts the substrate of circular configuration, advantages such as comparing the square structure substrate and have that symmetry is good, light mixing effect is good, energy-conserving and environment-protective, good stability, processing cost are low.
Description of drawings
Fig. 1 is the stereogram of the tunable optical COB encapsulating structure among the utility model embodiment.
Fig. 2 is the vertical view of the tunable optical COB encapsulating structure among the utility model embodiment.
Fig. 3 is the A-A ' cutaway view of Fig. 2.
Fig. 4 is the PCB figure of the tunable optical COB encapsulating structure among the utility model embodiment.
Among the figure, the pad 6 between PCB substrate 1, led chip 2, the first phosphor gel 3, the second phosphor gel 4, enclosure wall glue 5, the led chip, first group of power electrode 7, second group of power electrode 8, gold thread 9, fixedly slotted eye 10 is installed.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described further.
As shown in Figures 1 to 4, tunable optical COB encapsulating structure comprises pad 6 between PCB substrate 1, led chip 2, the first phosphor gel 3, the second phosphor gel 4, enclosure wall glue 5, the led chip, first group of power electrode 7, second group of power electrode 8, gold thread 9, fixing slot 10 is installed.Described PCB substrate 1 is the circular aluminum substrate of heat radiation, and the periphery of PCB substrate 1 offers for hard-wired hole slot 10.Described enclosure wall glue 5 is divided into some zones with described PCB substrate 1.Described enclosure wall glue 5 be shaped as donut, the radius of each corral wall glue 5 is different, increases successively by its order radius from inside to outside.Described led chip 2 is blue-light LED chip, is separately fixed in the adjacent area on the described PCB substrate 1, and the led chip quantity in each zone is unequal, increases progressively successively by adjacent spaces zone order from inside to outside.Described the first phosphor gel 3 and described the second phosphor gel 4, be coated in respectively led chip 2 tops in the regional, led chip 2 tops in each zone only apply a kind of in the first phosphor gel 3 or the second phosphor gel 4, and the phosphor gel composition in the adjacent area is different.Connect by gold thread 9 between adjacent LED chip 2 in described each zone, described gold thread 9 one ends connect led chip 2 surface electrodes, and the other end is connected with pad 6 between the led chip 2.The rear formation of led chip 2 series connection led chip array in described each zone is connected in series nothing electric connection between the led chip array in the adjacent area separately between the led chip array in the zone.Positive pole and negative pole that to be provided with 4 different Copper Foil pads in the most inboard enclosure wall glue on the described PCB substrate 1 be two groups of power supplys, i.e. first group of power electrode 7 and second group of power electrode 8, led chip 2 arrays are connected between the positive pole and negative pole of first group of power electrode 7 and second group of power electrode 8 electrically, and the electric current that flows through between the positive pole of first group of power electrode 7 and second group of power electrode 8 and the negative pole is different.The high silver coating of plated surface last layer reflecting rate of described PCB substrate 1 is to improve light efficiency.
In use, the size of current of the led chip 2 in the zone at the first phosphor gel 3 by regulating respectively tunable optical COB encapsulating structure and the second phosphor gel 4 places, can regulate respectively the brightness of regional, just can determine the light feature of whole COB encapsulating structure behind the light mixed light of different color coordinates.
Claims (6)
1. tunable optical COB encapsulating structure, it is characterized in that: it comprises:
One PCB substrate, this PCB substrate is divided into donut by enclosure wall glue with it;
Led chip in the adjacent circle ring area of difference die bond on the PCB substrate, the led chip quantity in each zone is unequal;
The first phosphor gel and the second phosphor gel are coated in respectively the led chip top in the regional, and the led chip top in each zone only applies a kind of in the first phosphor gel or the second phosphor gel, and the phosphor gel composition in the adjacent area is different;
Positive pole and negative pole that to be provided with 4 different Copper Foil pads in the most inboard enclosure wall glue on the described PCB substrate be two groups of power supplys, the led chip array is connected between the positive pole and negative pole of power supply electrically, and the electric current that flows through between the positive pole of every group of power supply and the negative pole is different;
Connect by gold thread between adjacent LED chip in described each zone, described gold thread one end connects the led chip surface electrode, and the other end is connected with pad between the led chip;
The rear formation of led chip series connection led chip array in described each zone is connected in series nothing electric connection between the led chip array in the adjacent area separately between the led chip array in the zone.
2. a kind of tunable optical COB encapsulating structure according to claim 1, it is characterized in that: described led chip is blue-light LED chip.
3. a kind of tunable optical COB encapsulating structure according to claim 1 is characterized in that: described PCB substrate is the circular aluminum substrate of heat radiation, and the periphery of substrate offers for hard-wired hole slot.
4. a kind of tunable optical COB encapsulating structure according to claim 1 is characterized in that: described enclosure wall glue be shaped as center of circle annulus, the radius of each corral wall glue is different, increases successively by its order radius from inside to outside.
5. a kind of tunable optical COB encapsulating structure according to claim 1, it is characterized in that: the quantity of described led chip increases progressively successively by adjacent spaces zone order from inside to outside.
6. a kind of tunable optical COB encapsulating structure according to claim 1 is characterized in that: the high silver coating of described PCB substrate plating surface last layer reflecting rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220579314 CN202855798U (en) | 2012-11-06 | 2012-11-06 | Dimmable COB package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220579314 CN202855798U (en) | 2012-11-06 | 2012-11-06 | Dimmable COB package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202855798U true CN202855798U (en) | 2013-04-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220579314 Expired - Fee Related CN202855798U (en) | 2012-11-06 | 2012-11-06 | Dimmable COB package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202855798U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423649A (en) * | 2013-08-20 | 2013-12-04 | 揭阳市利业光电有限公司 | LED (Light-Emitting Diode) lamp bead string free of divider resistance |
| CN103956355A (en) * | 2014-04-12 | 2014-07-30 | 广东聚科照明股份有限公司 | Full spectrum COB light source |
| CN105428498A (en) * | 2015-11-20 | 2016-03-23 | 福建中科芯源光电科技有限公司 | High-density integrated COB white light source and generation method therefor |
| CN111911822A (en) * | 2020-08-31 | 2020-11-10 | 济南冠鼎信息科技有限公司 | Miniature ultraviolet light source |
-
2012
- 2012-11-06 CN CN 201220579314 patent/CN202855798U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103423649A (en) * | 2013-08-20 | 2013-12-04 | 揭阳市利业光电有限公司 | LED (Light-Emitting Diode) lamp bead string free of divider resistance |
| CN103956355A (en) * | 2014-04-12 | 2014-07-30 | 广东聚科照明股份有限公司 | Full spectrum COB light source |
| CN105428498A (en) * | 2015-11-20 | 2016-03-23 | 福建中科芯源光电科技有限公司 | High-density integrated COB white light source and generation method therefor |
| CN105428498B (en) * | 2015-11-20 | 2017-03-15 | 福建中科芯源光电科技有限公司 | High Density Integration COB white light sources and preparation method thereof |
| WO2017084320A1 (en) * | 2015-11-20 | 2017-05-26 | 福建中科芯源光电科技有限公司 | Solid crystal substrate, high-density integrated cob white light source, and manufacturing method therefor |
| US10504875B2 (en) | 2015-11-20 | 2019-12-10 | Fujian Cas-Ceramic Optoelectronics Technology Co., Ltd | Die-bonding substrate, high-density integrated COB white light source and method for manufacturing the same |
| CN111911822A (en) * | 2020-08-31 | 2020-11-10 | 济南冠鼎信息科技有限公司 | Miniature ultraviolet light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20151106 |
|
| EXPY | Termination of patent right or utility model |