CN106653723A - Bonding pad structure for encapsulating full color lamp bead of COB panel - Google Patents
Bonding pad structure for encapsulating full color lamp bead of COB panel Download PDFInfo
- Publication number
- CN106653723A CN106653723A CN201710016931.4A CN201710016931A CN106653723A CN 106653723 A CN106653723 A CN 106653723A CN 201710016931 A CN201710016931 A CN 201710016931A CN 106653723 A CN106653723 A CN 106653723A
- Authority
- CN
- China
- Prior art keywords
- pad
- chip
- bonding pad
- vertical arm
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 19
- 238000003466 welding Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 6
- 238000000034 method Methods 0.000 description 2
- 239000011049 pearl Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention relates to a bonding pad structure for encapsulating a full color lamp bead of a COB panel. The bonding pad structure for encapsulating the full color lamp bead of the COB panel comprises a lamp cup, a first bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad, a first wafer, a second wafer and a third wafer, wherein the lamp cup is round; the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad are all arranged in the lamp cup; the first bonding pad is T-shaped and is formed by a cross arm and a vertical arm; the cross arm and the vertical arm are arranged on one diameter of the lamp cup; the second bonding pad is arranged at one side of the vertical arm; the third bonding pad is arranged on the other side of the vertical arm relative to the second bonding pad; and the fourth bonding pad is arranged at one side of the cross arm, which is far away from the vertical arm. According to the bonding pad structure, the encapsulation of the full color lamp bead of the COB panel is more stable, the color mixture is uniform and the emitting angle is larger.
Description
Technical field
The present invention relates to a kind of LED lamp bead structure, more particularly to a kind of full-color Small Distance COB panel light pearls encapsulation welding tray knot
Structure.
Background technology
Traditional small light-emitting diode, the space of its die bond Lamp cup pad is smaller, and because the size of LED lamp bead
It is little, the stability of itself is have impact on, while leg is fine and closely woven, the difficulty of processing and reliability of LED panel are had a strong impact on, so,
Single LEDs lamp bead is a limiting factor of the Small Distance of LED display.
COB panels are occurred in that in the market to replace traditional small light-emitting diode, are more easily realized LED and are shown
The Small Distance of display screen, but, the lamp bead on COB panels is limited because of procedure, it is impossible to realize the flow processs such as mixed lamp, this is allowed for
The encapsulation requirement of COB panel lamp beads is higher, and the pad structure of encapsulation is the big factor for determining encapsulation quality.
The content of the invention
In view of pad structure of the prior art is easily caused the unstable technical problem of display screen, it is necessary to provide a kind of
It is not easily caused unstable full-color COB panel lights bead seal welding equipment dish structure.
Full-color COB panel lights bead seal welding equipment dish structure, including Lamp cup, the first pad, the second pad, the 3rd pad, the 4th
Pad, the first chip, the second chip and third wafer；The Lamp cup is rounded, first pad, the second pad, the 3rd weldering
Disk, the 4th pad may be contained within Lamp cup, and first pad is in " T " font, is made up of transverse arm and vertical arm, the transverse arm and perpendicular
Arm is located at one of Lamp cup diametrically, and second pad is located at the side of the vertical arm, and the 3rd pad is located at vertical arm phase
For the opposite side of the second pad, the 4th pad is located at side of the transverse arm away from vertical arm.
The two ends of the cross wall to the side away from vertical arm is protruded, to increase the space of chip fixation.
First chip is fixed on the center of the transverse arm, and second chip is fixed on the one of the transverse arm
On end, the third wafer is fixed on the other end of the transverse arm with respect to the second chip.
The negative pole of first chip is electrically connected with the first pad, and the negative pole of second chip is by wire and the second weldering
Disk is electrically connected, and the negative pole of the third wafer electrically connected by wire with the 3rd pad, first chip, the second chip, the
The positive pole of three chips is electrically connected by wire with the 4th pad.
The invention enables full-color COB panel lights bead seal dress is more stable, and colour mixture is uniform, and lighting angle is bigger.
Description of the drawings
Fig. 1 is that full-color COB panel lights bead seal of the invention fills welding plate structure schematic.
Fig. 2 is full-color COB panel lights pearl packaging and die bonding bonding wire schematic diagram of the invention.
Specific embodiment
In conjunction with accompanying drawing, presently preferred embodiments of the present invention is elaborated.
The present invention proposes a kind of full-color COB panel lights bead seal welding equipment dish structure.Referring to Fig. 1, including Lamp cup 10, the first pad
31st, the second pad 32, the 3rd pad 33, the 4th pad 30, the first chip 21, the second chip 22 and third wafer 23；Lamp cup 10
Rounded, the first pad 31, the second pad 32, the 3rd pad 33, the 4th pad 30 may be contained within Lamp cup 10, the first pad 31
In " T " font, it is made up of transverse arm 311 and vertical arm 312, transverse arm 311 and vertical arm 312 are located at one of Lamp cup 10 diametrically, second
Pad 32 is located at the side of vertical arm 312, and the 3rd pad 33 is located at opposite side of the vertical arm 312 relative to the second pad 32, the 4th weldering
Disk 30 is located at side of the transverse arm 311 away from vertical arm 312.
The two ends of cross wall to the side away from vertical arm is protruded, to increase the space of chip fixation.
Referring to Fig. 2, the first chip 21 is fixed on the center of transverse arm 311, and the second chip 22 is fixed on transverse arm 311
On one end, third wafer 23 is fixed on the other end of relative second chip 22 of transverse arm 311.
The negative pole of the first chip 21 is electrically connected with the first pad 31, and the negative pole of the second chip 22 is by wire and the second pad
32 electrical connections, the negative pole of 4 third wafers 23 electrically connected by wire with the 3rd pad 33, the first chip 21, the second chip 22, the
The positive pole of three chips 23 is electrically connected by wire with the 4th pad 30.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (4)
1. full-color COB panel lights bead seal welding equipment dish structure, including Lamp cup, the first pad, the second pad, the 3rd pad, the 4th weldering
Disk, the first chip, the second chip and third wafer；The Lamp cup is rounded, first pad, the second pad, the 3rd pad,
4th pad may be contained within Lamp cup, and first pad is in " T " font, is made up of transverse arm and vertical arm, the transverse arm and vertical arm
Positioned at one of Lamp cup diametrically, second pad is located at the side of the vertical arm, and it is relative that the 3rd pad is located at vertical arm
In the opposite side of the second pad, the 4th pad is located at side of the transverse arm away from vertical arm.
2. full-color COB panel lights bead seal welding equipment dish structure according to claim 1, it is characterised in that the two of the cross wall
Hold to the side away from vertical arm and protrude, to increase the space of chip fixation.
3. full-color COB panel lights bead seal welding equipment dish structure according to claim 1, it is characterised in that first chip
It is fixed on the center of the transverse arm, second chip is fixed on one end of the transverse arm, the third wafer is consolidated
It is scheduled on the other end of the transverse arm with respect to the second chip.
4. full-color COB panel lights bead seal welding equipment dish structure according to claim 3, it is characterised in that first chip
Negative pole electrically connect with the first pad, the negative pole of second chip is electrically connected by wire with the second pad, and the described 3rd is brilliant
The negative pole of piece is electrically connected by wire with the 3rd pad, and first chip, the second chip, the positive pole of third wafer pass through wire
Electrically connect with the 4th pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710016931.4A CN106653723A (en) | 2017-01-11 | 2017-01-11 | Bonding pad structure for encapsulating full color lamp bead of COB panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710016931.4A CN106653723A (en) | 2017-01-11 | 2017-01-11 | Bonding pad structure for encapsulating full color lamp bead of COB panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106653723A true CN106653723A (en) | 2017-05-10 |
Family
ID=58843160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710016931.4A Pending CN106653723A (en) | 2017-01-11 | 2017-01-11 | Bonding pad structure for encapsulating full color lamp bead of COB panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106653723A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107705723A (en) * | 2017-11-24 | 2018-02-16 | 山西高科华烨电子集团有限公司 | All-colour LED surface mount device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859894U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
| CN201910422U (en) * | 2010-12-07 | 2011-07-27 | 安徽中智光源科技有限公司 | 5050LED (light-emitting diode) bracket and LED light source prepared by same |
| CN103730072A (en) * | 2014-01-03 | 2014-04-16 | 深圳市奥蕾达光电技术有限公司 | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
| US20150294959A1 (en) * | 2014-04-10 | 2015-10-15 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Led package structure |
-
2017
- 2017-01-11 CN CN201710016931.4A patent/CN106653723A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859894U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
| CN201910422U (en) * | 2010-12-07 | 2011-07-27 | 安徽中智光源科技有限公司 | 5050LED (light-emitting diode) bracket and LED light source prepared by same |
| CN103730072A (en) * | 2014-01-03 | 2014-04-16 | 深圳市奥蕾达光电技术有限公司 | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
| US20150294959A1 (en) * | 2014-04-10 | 2015-10-15 | Lite-On Opto Technology (Changzhou) Co., Ltd. | Led package structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107705723A (en) * | 2017-11-24 | 2018-02-16 | 山西高科华烨电子集团有限公司 | All-colour LED surface mount device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |