CN106783825A - Full-color COB panel lights bead seal welding equipment dish structure - Google Patents
Full-color COB panel lights bead seal welding equipment dish structure Download PDFInfo
- Publication number
- CN106783825A CN106783825A CN201710016932.9A CN201710016932A CN106783825A CN 106783825 A CN106783825 A CN 106783825A CN 201710016932 A CN201710016932 A CN 201710016932A CN 106783825 A CN106783825 A CN 106783825A
- Authority
- CN
- China
- Prior art keywords
- pad
- chip
- full
- arm
- panel lights
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 18
- 238000003466 welding Methods 0.000 title claims abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
The present invention relates to a kind of full-color COB panel lights bead seal welding equipment dish structure.The full-color COB panel lights bead seal welding equipment dish structure includes Lamp cup, the first pad, the second pad, the 3rd pad, the 4th pad, the first chip, the second chip and third wafer；The Lamp cup is rounded, first pad, the second pad, the 3rd pad, the 4th pad may be contained within Lamp cup, first pad is in equilateral L-shaped, by the first equilateral arm, the second arm, and flex point composition, positioned at the center of Lamp cup, second pad is positioned at the outside of the first arm for the flex point, 3rd pad is located at the outside of the second wall, and the 4th pad is located at the inner side of the first pad.More stablize the invention enables full-color COB panel lights bead seal dress, and colour mixture is uniform, lighting angle is bigger.
Description
Technical field
The present invention relates to a kind of LED lamp bead structure, more particularly to a kind of full-color small spacing COB panel lights pearl encapsulation welding tray knot
Structure.
Background technology
Traditional small light-emitting diode, the space of its die bond Lamp cup pad is smaller, and because the size of LED lamp bead
It is small, the stability of itself is have impact on, while leg is fine and closely woven, the difficulty of processing and reliability of LED panel are had a strong impact on, so,
Single LEDs lamp bead is a limiting factor of the small spacing of LED display.
COB panels are occurred in that in the market to replace traditional small light-emitting diode, are more easily realized LED and are shown
The small spacing of display screen, but, lamp bead on COB panels is limited because of procedure, it is impossible to realize the flows such as mixed lamp, this is allowed for
The encapsulation requirement of COB panel lamp beads is higher, and the pad structure of encapsulation is the big factor for determining encapsulation quality.
The content of the invention
In view of pad structure of the prior art is easily caused the unstable technical problem of display screen, it is necessary to provide a kind of
Unstable full-color COB panel lights bead seal welding equipment dish structure is not easily caused.
Full-color COB panel lights bead seal welding equipment dish structure, including Lamp cup, the first pad, the second pad, the 3rd pad, the 4th
Pad, the first chip, the second chip and third wafer；The Lamp cup is rounded, first pad, the second pad, the 3rd weldering
Disk, the 4th pad may be contained within Lamp cup, and first pad is in equilateral L-shaped, by the first equilateral arm, the second arm, and is turned
Point composition, the flex point is located at the center of Lamp cup, and second pad is located at the outside of the first arm, the 3rd pad position
In the outside of the second arm, the 4th pad is located at the inner side of the first pad.
First chip is fixed in the flex point, and second chip is fixed on first arm, and the described 3rd
Chip is fixed on second arm.
The negative pole of first chip is electrically connected with the first pad, and the negative pole of second chip is by wire and the second weldering
Disk is electrically connected, and the negative pole of the third wafer electrically connected by wire with the 3rd pad, first chip, the second chip, the
The positive pole of three chips is electrically connected by wire with the 4th pad.
The present invention is brilliant to luminous efficiency reversed polarity first higher more flexibly, also may be selected in the selection of the first chip
Piece, during selection the first chip of reversed polarity, the first chip is fixed on the 4th pad, and the positive pole of the first chip and the 4th pad are electric
Connection, the negative pole of the first chip is electrically connected by wire with the first pad.The invention enables full-color COB panel lights bead seal dress more
Stabilization, and colour mixture is uniform, lighting angle is bigger.
Brief description of the drawings
Fig. 1 is full-color COB panel lights bead seal dress welding plate structure schematic of the invention.
Fig. 2 is full-color COB panel lights pearl packaging and die bonding bonding wire schematic diagram of the invention.
Fig. 3 is an embodiment schematic diagram of full-color COB panel lights pearl packaging and die bonding bonding wire of the invention.
Specific embodiment
In conjunction with accompanying drawing, presently preferred embodiments of the present invention is elaborated.
The present invention proposes a kind of full-color COB panel lights bead seal welding equipment dish structure.Referring to Fig. 1, including Lamp cup 10, the first pad
31st, the second pad 32, the 3rd pad 33, the 4th pad 30, the first chip 21, the second chip 22 and third wafer 23；Lamp cup 10
Rounded, the first pad 31, the second pad 32, the 3rd pad 33, the 4th pad 30 may be contained within Lamp cup 10, the first pad 31
In equilateral L-shaped, it is made up of the first equilateral arm 311, the second arm 312, and flex point 310, flex point 310 is located at the center of Lamp cup 10
Position, the second pad 32 is located at the outside of the first arm 311, and the 3rd pad 33 is located at the outside of the second arm 312, the 4th pad 30
In the inner side of the first pad 31.
Referring to Fig. 2, the first chip 21 is fixed in flex point 310, and the second chip 22 is fixed on the first arm 311, and the 3rd is brilliant
Piece 23 is fixed on the second arm 312.
The negative pole of the first chip 21 is electrically connected with the first pad 31, and the negative pole of the second chip 22 passes through wire and the second pad
32 electrical connections, the negative pole of third wafer 23 electrically connected by wire with the 3rd pad 33, the first chip 21, the second chip 22, the
The positive pole of three chips 23 is electrically connected by wire with the 4th pad 30.
Referring to Fig. 3, the present invention it is also possible that an embodiment of full-color COB panel lights pearl packaging and die bonding bonding wire, also may be selected
Luminous efficiency the first chip of reversed polarity 21 higher, during selection the first chip 21 of reversed polarity, the 4th is fixed on by the first chip 21
On pad 30, the positive pole of the first chip 21 is electrically connected with the 4th pad 30, and the negative pole of the first chip 21 is by wire and the first weldering
Disk 31 is electrically connected.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (3)
1. full-color COB panel lights bead seal welding equipment dish structure, including Lamp cup, the first pad, the second pad, the 3rd pad, the 4th weldering
Disk, the first chip, the second chip and third wafer；The Lamp cup is rounded, first pad, the second pad, the 3rd pad,
4th pad may be contained within Lamp cup, and first pad is in equilateral L-shaped, by the first equilateral arm, the second arm, and flex point group
It is located at the center of Lamp cup into, the flex point, second pad is located at the outside of the first arm, the 3rd pad is located at the
The outside of two arms, the 4th pad is located at the inner side of the first pad.
2. full-color COB panel lights bead seal welding equipment dish structure according to claim 1, it is characterised in that first chip
It is fixed in the flex point, second chip is fixed on first arm, the third wafer is fixed on second arm
On.
3. full-color COB panel lights bead seal welding equipment dish structure according to claim 2, it is characterised in that first chip
Negative pole electrically connected with the first pad, the negative pole of second chip is electrically connected by wire with the second pad, and the described 3rd is brilliant
The negative pole of piece is electrically connected by wire with the 3rd pad, and first chip, the second chip, the positive pole of third wafer pass through wire
Electrically connected with the 4th pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710016932.9A CN106783825A (en) | 2017-01-11 | 2017-01-11 | Full-color COB panel lights bead seal welding equipment dish structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710016932.9A CN106783825A (en) | 2017-01-11 | 2017-01-11 | Full-color COB panel lights bead seal welding equipment dish structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106783825A true CN106783825A (en) | 2017-05-31 |
Family
ID=58948819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710016932.9A Pending CN106783825A (en) | 2017-01-11 | 2017-01-11 | Full-color COB panel lights bead seal welding equipment dish structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106783825A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859894U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
| CN203312291U (en) * | 2013-06-07 | 2013-11-27 | 四川柏狮光电技术有限公司 | Super-small-size glue-pouring paster LED packaging |
| CN205141025U (en) * | 2015-12-08 | 2016-04-06 | 深圳市芯志达科技有限公司 | Outdoor high density emitting diode |
| CN205231056U (en) * | 2015-12-08 | 2016-05-11 | 深圳市芯志达科技有限公司 | Integrated infrared launch function's outdoor emitting diode |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
-
2017
- 2017-01-11 CN CN201710016932.9A patent/CN106783825A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859894U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
| CN203312291U (en) * | 2013-06-07 | 2013-11-27 | 四川柏狮光电技术有限公司 | Super-small-size glue-pouring paster LED packaging |
| CN205141025U (en) * | 2015-12-08 | 2016-04-06 | 深圳市芯志达科技有限公司 | Outdoor high density emitting diode |
| CN205231056U (en) * | 2015-12-08 | 2016-05-11 | 深圳市芯志达科技有限公司 | Integrated infrared launch function's outdoor emitting diode |
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |