CN205141025U - Outdoor high density emitting diode - Google Patents
Outdoor high density emitting diode Download PDFInfo
- Publication number
- CN205141025U CN205141025U CN201521010725.5U CN201521010725U CN205141025U CN 205141025 U CN205141025 U CN 205141025U CN 201521010725 U CN201521010725 U CN 201521010725U CN 205141025 U CN205141025 U CN 205141025U
- Authority
- CN
- China
- Prior art keywords
- terminal pad
- packaging body
- green
- pole pin
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model discloses an outdoor high density emitting diode, including the sealed packaging body of gluing the sealed packaging body of gluing is connected with the support, the support corresponds with four pins and is connected, four pins are equallyd divide for vertical portion and vertically horizontal part with it, the horizontal part all corresponds the contact with the sealed packaging body of gluing be equipped with the bowl cup of chamber form in the sealed gluey packaging body, a sealed packaging body thickness and bowl ratio more than or equal to 4 of the degree of depth of cup of gluing. The utility model discloses reduce the bowl cup degree of depth, traditional outdoor paster full color light emitting diode's a bowl cup degree of depth all is greater than 1mm, and owing to the luminance production great influence of the great meeting of the bowl cup degree of depth to emitting diode, luminance reduces by 70%, seals and glues a packaging body thickness and bowl ratio more than or equal to 4 of the degree of depth of cup, and owing to the bowl cup is more shallow, luminance can effectively improve, contrasts white cavity luminance and has only reduced by 30%, can effectively improve the luminance and the contrast of apparent screen.
Description
Technical field
The utility model relates to outdoor LED field, especially a kind of outdoor high density LED.
Background technology
Can visible ray be given off when electronics and hole-recombination, thus can be used for making light-emitting diode.As indicator light in circuit and instrument, or form word or numerical monitor.Gallium arsenide diode glows, gallium phosphide diode green light, silicon carbide diode Yellow light-emitting low temperature, gallium nitride diode blue light-emitting.Because chemical property divides again Organic Light Emitting Diode OLED and inorganic light-emitting diode LED.The display resolution of market to outdoor full color display screen is more and more higher, but the physical size of outdoor display screen luminescent device is all larger at present, current minimum outdoor display screen, esolving degree can only be accomplished 40000 every square (dot spacing P5), can not meet the demand in market far away, in this case, the outdoor full color luminescent device needing a kind of physical size smaller.
Utility model content
In order to overcome defect of the prior art, provide a kind of outdoor high density LED.
The utility model is realized by following proposal:
A kind of outdoor high density LED, comprise fluid sealant packaging body, support is connected with at described fluid sealant packaging body, described support is corresponding with four pins to be connected, described four pins are divided into vertical portion and horizontal part vertical with it, described horizontal part all contacts with fluid sealant packaging body is corresponding, the bowl cup of cavity-like is provided with in described fluid sealant packaging body, the ratio of the degree of depth of described fluid sealant encapsulation body thickness and bowl cup is more than or equal to 4, described bowl cup is provided with the public positive terminal pad of " L " shape, green negative terminal pad and blue negative terminal pad is provided with in the left side of described public positive terminal pad, red negative terminal pad is provided with on the right side of described public positive terminal pad, described public positive terminal pad is provided with red wafer successively, green wafer and blue dies, described red wafer, green wafer and blue dies are distributed on straight line, described red wafer, green wafer and blue dies all by wire respectively with red negative terminal pad, green negative terminal pad and the electrical connection of blue negative terminal pad correspondence, described red wafer is directly corresponding with public positive terminal pad to be electrically connected, described green wafer and blue dies are all electrically connected by wire is corresponding with public positive terminal pad.
Described four pins comprise and are arranged on green glow negative pole pin on the left of fluid sealant packaging body and blue light negative pole pin, be arranged on the ruddiness negative pole pin on the right side of fluid sealant packaging body and public positive pole pin, described public positive pole pin is corresponding with public positive terminal pad to be electrically connected, described ruddiness negative pole pin is corresponding with red negative terminal pad to be electrically connected, described blue light negative pole pin is corresponding with blue negative terminal pad to be electrically connected, and described green glow negative pole pin is corresponding with green negative terminal pad to be electrically connected.
The beneficial effects of the utility model are:
1. four pins of a kind of outdoor high density LED of the utility model are divided into vertical portion and horizontal part vertical with it, the pin of such bending and the seam of support carriage and support chip bearing place be not just at same plane, when moisture immerses from seam crossing, certain height that needs to climb just can reach chip bearing place, reduce the possibility that moisture invades, thus ensure that the reliability of paster full-color light-emitting diode, can be used for outdoor environment and use;
2. the bowl cup degree of depth reduces by a kind of outdoor high density LED of the utility model, the bowl cup degree of depth of the outdoor paster full-color light-emitting diode of tradition is all greater than 1mm, because the bowl cup degree of depth produces considerable influence compared with conference to the brightness of light-emitting diode, brightness reduces by 70%, bowl cup depth design is 0.5mm when not affecting quality by the utility model, the ratio of the degree of depth of fluid sealant encapsulation body thickness and bowl cup is more than or equal to 4, because bowl cup is more shallow, brightness can effectively improve, contrast white cavity brightness and only reduce 30%, effectively can improve the brightness and contrast of aobvious screen.
Accompanying drawing explanation
Fig. 1 is the syndeton schematic diagram of a kind of outdoor high density LED of the utility model.
Fig. 2 is A-A direction cutaway view in Fig. 1.
In figure: 1 is fluid sealant packaging body, 2 is support, and 3 is green glow negative pole pin, 4 is blue light negative pole pin, and 5 is ruddiness negative pole pin, and 6 is public positive pole pin, 7 is bowl cup, and 8 is public positive terminal pad, and 9 is green negative terminal pad, 10 is blue negative terminal pad, and 11 is red negative terminal pad, and 12 is red wafer, 13 is green wafer, 14 is blue dies, and 31 is vertical portion, and 32 is horizontal part
Embodiment
Below in conjunction with Fig. 1-2, the utility model preferred embodiment is further illustrated:
A kind of outdoor high density LED, comprise fluid sealant packaging body 1, support 2 is connected with at described fluid sealant packaging body 1, described support 2 is corresponding with four pins to be connected, described four pins are divided into vertical portion 31 and horizontal part 32 vertical with it, described horizontal part 32 all contacts with fluid sealant packaging body 1 is corresponding, the bowl cup 7 of cavity-like is provided with in described fluid sealant packaging body 1, the ratio of the degree of depth of described fluid sealant packaging body 1 thickness and bowl cup 7 is more than or equal to 4, four pins of a kind of outdoor high density LED of the utility model are divided into vertical portion and horizontal part vertical with it, the pin of such bending and the seam of support carriage and support chip bearing place be not just at same plane, when moisture immerses from seam crossing, certain height that needs to climb just can reach chip bearing place, reduce the possibility that moisture invades, thus ensure that the reliability of paster full-color light-emitting diode, can be used for outdoor environment to use.
Described bowl cup 7 is provided with the public positive terminal pad 8 of " L " shape, green negative terminal pad 9 and blue negative terminal pad 10 is provided with in the left side of described public positive terminal pad 8, red negative terminal pad 11 is provided with on the right side of described public positive terminal pad 8, described public positive terminal pad 8 is provided with red wafer 12 successively, green wafer 13 and blue dies 14, described red wafer 12, green wafer 13 and blue dies 14 are distributed on straight line, described red wafer 12, green wafer 13 and blue dies 14 all by wire respectively with red negative terminal pad 11, green negative terminal pad 9 and the electrical connection of blue negative terminal pad 10 correspondence, described red wafer 12 is directly corresponding with public positive terminal pad 8 to be electrically connected, described green wafer 13 and blue dies 14 are all electrically connected by wire is corresponding with public positive terminal pad 8.
Described four pins comprise and are arranged on green glow negative pole pin 3 on the left of fluid sealant packaging body 1 and blue light negative pole pin 4, be arranged on the ruddiness negative pole pin 5 on the right side of fluid sealant packaging body 1 and public positive pole pin 6, described public positive pole pin 6 is corresponding with public positive terminal pad 8 to be electrically connected, described ruddiness negative pole pin 5 is corresponding with red negative terminal pad 11 to be electrically connected, described blue light negative pole pin 4 is corresponding with blue negative terminal pad 10 to be electrically connected, and described green glow negative pole pin 3 is corresponding with green negative terminal pad 9 to be electrically connected.
The bowl cup degree of depth reduces by a kind of outdoor high density LED of the utility model, the bowl cup degree of depth of the outdoor paster full-color light-emitting diode of tradition is all greater than 1mm, because the bowl cup degree of depth produces considerable influence compared with conference to the brightness of light-emitting diode, brightness reduces by 70%, in the present embodiment, be 0.5mm when not affecting quality by bowl cup depth design, the ratio of the degree of depth of fluid sealant encapsulation body thickness and bowl cup is more than or equal to 4, because bowl cup is more shallow, brightness can effectively improve, contrast white cavity brightness and only reduce 30%, effectively can improve the brightness and contrast of aobvious screen.In actual production, in order to reach the requirement of outdoor full color paster display device, needing the physical size of full-color paster display device to be accomplished below 2mm (most High Resolution can reach 160000 every square), is 4 times of traditional scheme esolving degree.
Although done comparatively detailed elaboration to the technical solution of the utility model and enumerated; be to be understood that; to those skilled in the art; amendment is made to above-described embodiment or adopts equivalent replacement scheme; this is apparent to those skilled in the art; these modifications or improvements on the basis of not departing from the utility model spirit, all belong to the scope that the utility model is claimed.
Claims (2)
1. an outdoor high density LED, comprise fluid sealant packaging body (1), it is characterized in that: be connected with support (2) described fluid sealant packaging body (1), described support (2) is corresponding with four pins to be connected, described four pins are divided into vertical portion (31) and horizontal part vertical with it (32), described horizontal part (32) all contacts with fluid sealant packaging body (1) is corresponding, the bowl cup (7) of cavity-like is provided with in described fluid sealant packaging body (1), the ratio of the degree of depth of described fluid sealant packaging body (1) thickness and bowl cup (7) is more than or equal to 4, described bowl cup (7) is provided with the public positive terminal pad (8) of " L " shape, green negative terminal pad (9) and blue negative terminal pad (10) is provided with in the left side of described public positive terminal pad (8), red negative terminal pad (11) is provided with on the right side of described public positive terminal pad (8), described public positive terminal pad (8) is provided with red wafer (12) successively, green wafer (13) and blue dies (14), described red wafer (12), green wafer (13) and blue dies (14) are distributed on straight line, described red wafer (12), green wafer (13) and blue dies (14) all by wire respectively with red negative terminal pad (11), green negative terminal pad (9) and the electrical connection of blue negative terminal pad (10) correspondence, described red wafer (12) is directly corresponding with public positive terminal pad (8) to be electrically connected, described green wafer (13) and blue dies (14) are all electrically connected by wire is corresponding with public positive terminal pad (8).
2. the outdoor high density LED of one according to claim 1, it is characterized in that: described four pins comprise the green glow negative pole pin (3) and blue light negative pole pin (4) that are arranged on fluid sealant packaging body (1) left side, be arranged on ruddiness negative pole pin (5) and the public positive pole pin (6) on fluid sealant packaging body (1) right side, described public positive pole pin (6) is corresponding with public positive terminal pad (8) to be electrically connected, described ruddiness negative pole pin (5) is corresponding with red negative terminal pad (11) to be electrically connected, described blue light negative pole pin (4) is corresponding with blue negative terminal pad (10) to be electrically connected, described green glow negative pole pin (3) is corresponding with green negative terminal pad (9) to be electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521010725.5U CN205141025U (en) | 2015-12-08 | 2015-12-08 | Outdoor high density emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521010725.5U CN205141025U (en) | 2015-12-08 | 2015-12-08 | Outdoor high density emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205141025U true CN205141025U (en) | 2016-04-06 |
Family
ID=55626787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521010725.5U Expired - Fee Related CN205141025U (en) | 2015-12-08 | 2015-12-08 | Outdoor high density emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205141025U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783825A (en) * | 2017-01-11 | 2017-05-31 | 深圳市奥蕾达科技有限公司 | Full-color COB panel lights bead seal welding equipment dish structure |
| CN108447970A (en) * | 2018-02-09 | 2018-08-24 | 永林电子有限公司 | A kind of LED lamp bead of RGB three-colour light-emittings chip hybrid |
-
2015
- 2015-12-08 CN CN201521010725.5U patent/CN205141025U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783825A (en) * | 2017-01-11 | 2017-05-31 | 深圳市奥蕾达科技有限公司 | Full-color COB panel lights bead seal welding equipment dish structure |
| CN108447970A (en) * | 2018-02-09 | 2018-08-24 | 永林电子有限公司 | A kind of LED lamp bead of RGB three-colour light-emittings chip hybrid |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170110 Address after: 518000 Guangdong city of Shenzhen province Gongming Guangming New District Office Tianliao Village tenth industrial zone 3 Building 7 floor Patentee after: Zhong Bin Address before: 518000 Guangdong city of Shenzhen province Gongming Guangming New District Office Tianliao Village tenth industrial zone 3 Building 7 floor Patentee before: SHENZHEN CHIPZDA TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170803 Address after: 518000 Jia anda building, big wave street, Longhua District, Guangdong, Shenzhen 503, China Patentee after: Shenzhen sunshine Photoelectric Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Gongming Guangming New District Office Tianliao Village tenth industrial zone 3 Building 7 floor Patentee before: Zhong Bin |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160406 Termination date: 20171208 |