CN205231056U - Integrated infrared launch function's outdoor emitting diode - Google Patents
Integrated infrared launch function's outdoor emitting diode Download PDFInfo
- Publication number
- CN205231056U CN205231056U CN201521011407.0U CN201521011407U CN205231056U CN 205231056 U CN205231056 U CN 205231056U CN 201521011407 U CN201521011407 U CN 201521011407U CN 205231056 U CN205231056 U CN 205231056U
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- CN
- China
- Prior art keywords
- terminal pad
- infra
- transmitting unit
- ray transmitting
- red
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses an integrated infrared launch function's outdoor emitting diode, including the sealed packaging body of gluing, still be equipped with infrared emission unit negative electrode bonding pad and infrared emission unit positive bonding pad on the bowl cup infrared emission unit negative electrode bonding pad is equipped with the infrared emission unit, the infrared emission unit corresponds the electricity with infrared emission unit negative electrode bonding pad and is connected, the infrared emission unit passes through the wire and corresponds with infrared emission unit positive bonding pad and be connected. The utility model relates to an integrated infrared launch function's outdoor emitting diode is provided with the infrared emission unit inside the diode, made things convenient for the use, has practiced thrift the space, and independent infrared device is used to traditional solution, but the pixel of display screen is more and more closeer, places independent infrared device between having no time, needs the brand -new SMD FOR LED of infrared launch function of integration and full -color demonstration function, the utility model overcomes these defects.
Description
Technical field
The utility model relates to outdoor LED field, especially a kind of outdoor LED of integrated infrared emission function.
Background technology
Can visible ray be given off when electronics and hole-recombination, thus can be used for making light-emitting diode.As indicator light in circuit and instrument, or form word or numerical monitor.Gallium arsenide diode glows, gallium phosphide diode green light, silicon carbide diode Yellow light-emitting low temperature, gallium nitride diode blue light-emitting.Because chemical property divides again Organic Light Emitting Diode OLED and inorganic light-emitting diode LED.Along with the technological progress of full color display, increasing thin part market is developed, and in media display field, needs the outdoor LED designing a kind of integrated infrared emission function.
Utility model content
In order to overcome defect of the prior art, provide a kind of outdoor LED of integrated infrared emission function.
The utility model is realized by following proposal:
A kind of outdoor LED of integrated infrared emission function, comprise fluid sealant packaging body, support is connected with at described fluid sealant packaging body, described support is corresponding with six pins to be connected, the bowl cup of cavity-like is provided with in described fluid sealant packaging body, described bowl cup is provided with public positive terminal pad, green negative terminal pad and blue negative terminal pad is provided with in the left side of described public positive terminal pad, red negative terminal pad is provided with on the right side of described public positive terminal pad, described public positive terminal pad is provided with red wafer successively, green wafer and blue dies, described red wafer, green wafer and blue dies are distributed on straight line, described red wafer, green wafer and blue dies all by wire respectively with red negative terminal pad, green negative terminal pad and the electrical connection of blue negative terminal pad correspondence, described red wafer is directly corresponding with public positive terminal pad to be electrically connected, described green wafer and blue dies are all electrically connected by wire is corresponding with public positive terminal pad, described bowl cup is also provided with infra-red ray transmitting unit negative terminal pad and infra-red ray transmitting unit positive terminal pad, infra-red ray transmitting unit is provided with in described infra-red ray transmitting unit negative terminal pad, described infra-red ray transmitting unit is corresponding with infra-red ray transmitting unit negative terminal pad to be electrically connected, described infra-red ray transmitting unit connects by wire is corresponding with infra-red ray transmitting unit positive terminal pad.
Described six pins comprise the green glow negative pole pin being arranged on fluid sealant encapsulation limit, side, blue light negative pole pin, ruddiness negative pole pin, public positive pole pin, infra-red ray transmitting unit negative pole pin and infra-red ray transmitting unit positive pole pin, described public positive pole pin is corresponding with public positive terminal pad to be electrically connected, described ruddiness negative pole pin is corresponding with red negative terminal pad to be electrically connected, described blue light negative pole pin is corresponding with blue negative terminal pad to be electrically connected, described green glow negative pole pin is corresponding with green negative terminal pad to be electrically connected, described infra-red ray transmitting unit negative terminal pad and infra-red ray transmitting unit positive terminal pad are corresponding with infra-red ray transmitting unit negative pole pin and infra-red ray transmitting unit positive pole pin to be respectively electrically connected.
The beneficial effects of the utility model are:
The outdoor LED of a kind of integrated infrared emission function of the utility model is provided with infra-red ray transmitting unit in diode inside, facilitate use, save space, traditional solution uses independently infrared device, but the pixel of display screen is more and more closeer, do not have space to place independently infrared device, need the brand-new patch light-emitting diode of a kind of integrated infrared emission function and full-color Presentation Function, the utility model overcomes these defects.
Accompanying drawing explanation
Fig. 1 is the syndeton schematic diagram of the outdoor LED of a kind of integrated infrared emission function of the utility model.
Fig. 2 is A-A direction cutaway view in Fig. 1.
In figure: 1 is fluid sealant packaging body, 2 is support, 3 is green glow negative pole pin, 4 is blue light negative pole pin, 5 is ruddiness negative pole pin, 6 is public positive pole pin, 7 is bowl cup, 8 is public positive terminal pad, 9 is green negative terminal pad, 10 is blue negative terminal pad, 11 is red negative terminal pad, 12 is red wafer, 13 is green wafer, 14 is blue dies, 15 is infra-red ray transmitting unit negative terminal pad, 16 is infra-red ray transmitting unit, 17 is infra-red ray transmitting unit positive terminal pad, 18 is infra-red ray transmitting unit negative pole pin, 19 is infra-red ray transmitting unit positive pole pin.
Embodiment
Below in conjunction with Fig. 1-2, the utility model preferred embodiment is further illustrated:
A kind of outdoor LED of integrated infrared emission function, comprise fluid sealant packaging body 1, support 2 is connected with at described fluid sealant packaging body 1, described support 2 is corresponding with six pins to be connected, the bowl cup 7 of cavity-like is provided with in described fluid sealant packaging body 1, described bowl cup 7 is provided with public positive terminal pad 8, green negative terminal pad 9 and blue negative terminal pad 10 is provided with in the left side of described public positive terminal pad 8, red negative terminal pad 11 is provided with on the right side of described public positive terminal pad 8, described public positive terminal pad 8 is provided with red wafer 12 successively, green wafer 13 and blue dies 14, described red wafer 12, green wafer 13 and blue dies 14 are distributed on straight line, described red wafer 12, green wafer 13 and blue dies 14 all by wire respectively with red negative terminal pad 11, green negative terminal pad 9 and the electrical connection of blue negative terminal pad 10 correspondence, described red wafer 12 is directly corresponding with public positive terminal pad 8 to be electrically connected, described green wafer 13 and blue dies 14 are all electrically connected by wire is corresponding with public positive terminal pad 8, described bowl cup 7 is also provided with infra-red ray transmitting unit negative terminal pad 15 and infra-red ray transmitting unit positive terminal pad 17, infra-red ray transmitting unit 16 is provided with in described infra-red ray transmitting unit negative terminal pad 15, described infra-red ray transmitting unit 16 is corresponding with infra-red ray transmitting unit negative terminal pad 15 to be electrically connected, described infra-red ray transmitting unit 16 connects by wire is corresponding with infra-red ray transmitting unit positive terminal pad 17.The utility model achieves infrared emission and full-color Presentation Function unites two into one.Scheme of the present utility model achieves infrared emission function and full-color display is integrated unites two into one, achieve the miniaturization of the full-color patch light-emitting diode of infrared emission function, the high definition of the media display in some special applications markets is shown and becomes possibility, widened the application market of display screen.
Described six pins comprise the green glow negative pole pin 3 being arranged on fluid sealant packaging body 1 side, blue light negative pole pin 4, ruddiness negative pole pin 5, public positive pole pin 6, infra-red ray transmitting unit negative pole pin 18 and infra-red ray transmitting unit positive pole pin 19, described public positive pole pin 6 is corresponding with public positive terminal pad 8 to be electrically connected, described ruddiness negative pole pin 5 is corresponding with red negative terminal pad 11 to be electrically connected, described blue light negative pole pin 4 is corresponding with blue negative terminal pad 10 to be electrically connected, described green glow negative pole pin 3 is corresponding with green negative terminal pad 9 to be electrically connected, described infra-red ray transmitting unit negative terminal pad 15 and infra-red ray transmitting unit positive terminal pad 17 are respectively with infra-red ray transmitting unit negative pole pin 18 with infra-red ray transmitting unit positive pole pin 19 is corresponding is electrically connected.
The outdoor LED of a kind of integrated infrared emission function of the utility model is provided with infra-red ray transmitting unit in diode inside, facilitate use, save space, traditional solution uses independently infrared device, but the pixel of display screen is more and more closeer, do not have space to place independently infrared device, need the brand-new patch light-emitting diode of a kind of integrated infrared emission function and full-color Presentation Function, the utility model overcomes these defects.In the utility model, the structure of infra-red ray transmitting unit and principle are existing known technology, at this, repeat no more.
Although done comparatively detailed elaboration to the technical solution of the utility model and enumerated; be to be understood that; to those skilled in the art; amendment is made to above-described embodiment or adopts equivalent replacement scheme; this is apparent to those skilled in the art; these modifications or improvements on the basis of not departing from the utility model spirit, all belong to the scope that the utility model is claimed.
Claims (2)
1. the outdoor LED of an integrated infrared emission function, comprise fluid sealant packaging body (1), it is characterized in that: be connected with support (2) described fluid sealant packaging body (1), described support (2) is corresponding with six pins to be connected, the bowl cup (7) of cavity-like is provided with in described fluid sealant packaging body (1), described bowl cup (7) is provided with public positive terminal pad (8), green negative terminal pad (9) and blue negative terminal pad (10) is provided with in the left side of described public positive terminal pad (8), red negative terminal pad (11) is provided with on the right side of described public positive terminal pad (8), described public positive terminal pad (8) is provided with red wafer (12) successively, green wafer (13) and blue dies (14), described red wafer (12), green wafer (13) and blue dies (14) are distributed on straight line, described red wafer (12), green wafer (13) and blue dies (14) all by wire respectively with red negative terminal pad (11), green negative terminal pad (9) and the electrical connection of blue negative terminal pad (10) correspondence, described red wafer (12) is directly corresponding with public positive terminal pad (8) to be electrically connected, described green wafer (13) and blue dies (14) are all electrically connected by wire is corresponding with public positive terminal pad (8), described bowl cup (7) is also provided with infra-red ray transmitting unit negative terminal pad (15) and infra-red ray transmitting unit positive terminal pad (17), infra-red ray transmitting unit (16) is provided with described infra-red ray transmitting unit negative terminal pad (15), described infra-red ray transmitting unit (16) is corresponding with infra-red ray transmitting unit negative terminal pad (15) to be electrically connected, described infra-red ray transmitting unit (16) connects by wire is corresponding with infra-red ray transmitting unit positive terminal pad (17).
2. the outdoor LED of a kind of integrated infrared emission function according to claim 1, it is characterized in that: described six pins comprise the green glow negative pole pin (3) being arranged on fluid sealant packaging body (1) side, blue light negative pole pin (4), ruddiness negative pole pin (5), public positive pole pin (6), infra-red ray transmitting unit negative pole pin (18) and infra-red ray transmitting unit positive pole pin (19), described public positive pole pin (6) is corresponding with public positive terminal pad (8) to be electrically connected, described ruddiness negative pole pin (5) is corresponding with red negative terminal pad (11) to be electrically connected, described blue light negative pole pin (4) is corresponding with blue negative terminal pad (10) to be electrically connected, described green glow negative pole pin (3) is corresponding with green negative terminal pad (9) to be electrically connected, described infra-red ray transmitting unit negative terminal pad (15) and infra-red ray transmitting unit positive terminal pad (17) are respectively with infra-red ray transmitting unit negative pole pin (18) with infra-red ray transmitting unit positive pole pin (19) is corresponding is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521011407.0U CN205231056U (en) | 2015-12-08 | 2015-12-08 | Integrated infrared launch function's outdoor emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521011407.0U CN205231056U (en) | 2015-12-08 | 2015-12-08 | Integrated infrared launch function's outdoor emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205231056U true CN205231056U (en) | 2016-05-11 |
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ID=55906102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521011407.0U Expired - Fee Related CN205231056U (en) | 2015-12-08 | 2015-12-08 | Integrated infrared launch function's outdoor emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205231056U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783825A (en) * | 2017-01-11 | 2017-05-31 | 深圳市奥蕾达科技有限公司 | Full-color COB panel lights bead seal welding equipment dish structure |
| CN108520706A (en) * | 2018-06-15 | 2018-09-11 | 永林电子有限公司 | A kind of RGB collocation infrared wavelength light filling identification scanning induction LED structure and application |
-
2015
- 2015-12-08 CN CN201521011407.0U patent/CN205231056U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783825A (en) * | 2017-01-11 | 2017-05-31 | 深圳市奥蕾达科技有限公司 | Full-color COB panel lights bead seal welding equipment dish structure |
| CN108520706A (en) * | 2018-06-15 | 2018-09-11 | 永林电子有限公司 | A kind of RGB collocation infrared wavelength light filling identification scanning induction LED structure and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170111 Address after: 518000 Guangdong city of Shenzhen province Gongming Guangming New District Office Tianliao Village tenth industrial zone 3 Building 7 floor Patentee after: Zhong Bin Address before: 518000 Guangdong city of Shenzhen province Gongming Guangming New District Office Tianliao Village tenth industrial zone 3 Building 7 floor Patentee before: SHENZHEN CHIPZDA TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170803 Address after: 518000 Jia anda building, big wave street, Longhua District, Guangdong, Shenzhen 503, China Patentee after: Shenzhen sunshine Photoelectric Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Gongming Guangming New District Office Tianliao Village tenth industrial zone 3 Building 7 floor Patentee before: Zhong Bin |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160511 Termination date: 20171208 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |