CN203800086U - LED module - Google Patents
LED module Download PDFInfo
- Publication number
- CN203800086U CN203800086U CN201420193885.7U CN201420193885U CN203800086U CN 203800086 U CN203800086 U CN 203800086U CN 201420193885 U CN201420193885 U CN 201420193885U CN 203800086 U CN203800086 U CN 203800086U
- Authority
- CN
- China
- Prior art keywords
- led
- radiator
- lens
- substrate
- led module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 11
- 239000010980 sapphire Substances 0.000 claims description 11
- 229910052594 sapphire Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 abstract description 16
- 238000012856 packing Methods 0.000 description 13
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 208000002925 dental caries Diseases 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000006854 communication Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000011049 pearl Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 235000009967 Erodium cicutarium Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model relates to the technical field of lighting lamps. An LED module comprises a radiator, a lens and a substrate provided with an LED luminous body. The LED luminous body is arranged in the lens. The lens is provided with at least one protruding cavity. The LED luminous body comprises at least one LED luminous body unit. The protruding cavity and the LED luminous body unit are one-to-one corresponding. A seal space in which the LED luminous body is placed is formed between the protruding cavity of the lens and the radiator. The substrate is fixed on the radiator. The luminous body unit is composed of one or a number of wafer level package LED light sources. The LED module provided by the utility model has the advantages that the reliability is high; an index matching fluid is filled to realize a high seal waterproof grade and assist heat radiating; the luminous efficiency is high; the index matching fluid is filled to enable a luminous medium to change from air into a colloid; and the cost is low.
Description
Technical field
The utility model relates to the technical field of illuminating lamp, particularly a kind of LED module.
Background technology
Along with the development of LED chip technology and encapsulation technology, increasing LED product is applied to lighting field, especially large power white light LED.Because LED has high light efficiency, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the polluter such as not mercurous, become the lighting source of new generation after the conventional light source such as incandescent lamp, fluorescent lamp.
But there is following defect in current LED module:
First, the making step of existing LED module is various, and luminescent layer need first be arranged on substrate and be soldered to substrate again, causes complex manufacturing technology.
Secondly, the light that the LED chip of existing LED module sends needs through air dielectric in communication process, can cause interface loss, causes LED chip light extraction efficiency low; In existing LED module, non-filler between set of lenses and radiator, will damage LED luminous element once enter steam;
Finally, when existing LED module is applied in street lighting, because the reasons such as existing tail gas cause the easy dust suction of kick structure outside LED module, the utmost point affects the light effect that of LED module.
Utility model content
The utility model object is to provide a kind of LED module, to solve LED module in prior art, can not carry out the optics proportionings such as colour temperature, aobvious finger, and the lower technical matters of light efficiency.Meanwhile, can reduce costs.
The utility model object is achieved through the following technical solutions:
A kind of LED module, comprise radiator, lens, be provided with the substrate of LED luminous element, described LED luminous element is arranged in described lens, described lens are provided with at least one protruding cavity, LED luminous element at least comprises a LED luminous element unit, described protruding cavity is corresponding one by one with described LED luminous element unit, between the protruding cavity of described lens and radiator, form the seal cavity of placing described LED luminous element, described substrate is fixed on radiator, and described luminous element unit is comprised of one or several wafer level encapsulated LED light sources.
Preferably, in described lens, in the protruding cavity between LED luminous element and described lens, fill the index-matching fluid that is provided with to improve light efficiency.And index-matching fluid, fills by injecting glue or some glue form.
Preferably, index-matching fluid is filled between the full whole protruding cavity by described lens and radiator and is formed the seal cavity of placing described LED luminous element.
Preferably, the described lens of described LED module are provided with fastener, and described lens are fixed on described radiator by fastener and form described seal cavity.
Preferably, described radiator is set to the non-radiating layout with better radiating effect that flushes.
Preferably, on described water-tight space, be provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.
And the outlet of module is water-proof wire or bare wire.
Preferably, radiator is directly connected with substrate and further comprises directly laminating, the clamping of described radiator, is spirally connected or welds described substrate, or radiator is connected and is further comprised that described radiator is connected with described substrate by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate.
Preferably, described wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad, and described pad is arranged at luminescent layer bottom, and described sapphire is arranged on luminescent layer, and described fluorescent material is arranged on sapphire.Fluorescent material and luminescent layer separate by sapphire, realize heat isolation; Described wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
Described wafer level encapsulated LED light source is welded on described substrate, and substrate comprises metal substrate, ceramic substrate.
It should be noted that, lens radiator fixed form is buckle not necessarily, also plays screw; Sealing clamping ring shape is lattice-shaped not necessarily, and lattice-shaped is just as preferred.
Compared with prior art, the utility model has following beneficial effect:
First, LED module of the present utility model only arranges a plurality of lens or lens, and lens are provided with a plurality of protruding cavitys.One or many wafer level encapsulated LED light sources in this projection cavity, placing.Like this, lens can be set to circle, ellipse, square etc., and whole LED module, equally by various different layout setting lens, can be arranged to various shape and specification by LED module thus thus, has greatly promoted its application places.
Secondly, compared with prior art, in LED module of the present utility model, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid is mated with the lens in set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%; Also have, in LED module of the present utility model, in the confined space of radiator and set of lenses, be filled with packing colloid, substrate and the packed colloid of each LED luminous element are coated, therefore have good water resistance; And the heat that in the utility model, LED luminous element produces not only can transmit to substrate by the bottom surface of cooling stand of self, and can outwards transmit by packing colloid, makes radiating effect better.
In addition, wafer level encapsulated LED light source can carry out the optics proportionings such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can, by adding red-light source, realize aobvious finger and adjust.Wafer level encapsulated LED light source is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
Finally, LED module arranges a plurality of lens, is only provided with a protruding cavity on these lens.These lens are adopted and are difficult for falling dust, and the material that is particularly difficult for sticky tail gas is made, and can improve light efficiency.
Accompanying drawing explanation
Figure 1A, Figure 1B are respectively exploded view and the assembly drawing of the embodiment 1 of LED module;
Fig. 2 A, Fig. 2 B are respectively exploded view and the assembly drawing of the embodiment 2 of LED module.
Embodiment
Below in conjunction with accompanying drawing, describe the utility model in detail.
Embodiment 1
Refer to Figure 1A and Figure 1B, it is a kind of LED module instance graph with two protruding cavitys.A kind of LED module, comprise radiator 18, lens 11, waterproof grommet 12, be provided with the substrate 14 of LED luminous element, LED luminous element is arranged in lens 11, lens 11 are provided with at least one protruding cavity (lens 11 are provided with two protruding cavitys 111,112 in this example), LED luminous element at least comprises a LED luminous element unit (in this example, LED luminous element comprises two LED luminous element unit 131,132), protruding cavity 111,112 is corresponding one by one with LED luminous element unit 131,132.Put waterproof grommet 12, between the protruding cavity 111,112 of lens 11 and radiator 18, form the seal cavity of placing LED luminous element unit 131,132, substrate 14 is fixed on radiator 18, and luminous element unit 131,132 is comprised of one or several wafer level encapsulated LED light sources.
Wafer level encapsulated LED light source can be welded on substrate 14, and substrate 14 comprises one of them of metal substrate, ceramic substrate.
Wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad conventionally, and pad is arranged at luminescent layer bottom, and sapphire is arranged on luminescent layer, and fluorescent material is arranged on sapphire.Fluorescent material and luminescent layer separate by sapphire, realize heat isolation.The wafer level encapsulated LED light source adopting is to connect without gold thread, without disconnected gold thread risk, can greatly extend the chip life-span, thereby extend the life-span of whole module.
In addition, wafer level encapsulated LED light source can carry out the optics proportionings such as colour temperature, aobvious finger.The LED light source of different-colour can be soldered in same LED module, allot needed colour temperature, especially many inclined to one side color temperature lamp pearls can be neutralized into the bright dipping of positive colour temperature.Can, by adding red-light source, realize aobvious finger and adjust.In this example, a LED module can only arrange lens 11, and these lens 11 are provided with two protruding cavitys 111,112.The LED luminous element unit 131,132 of placing respectively in those protruding cavitys is comprised of many wafer level encapsulated LED light sources respectively.
On water-tight space, be provided with the wire hole for water-proof wire 17 outlets, and for hole for injecting glue and the steam vent of injecting glue.In lens 11, protruding cavity 111, the 112 interior fillings between wafer level encapsulated LED light source and lens 11 are provided with to improve the index-matching fluid of light efficiency.In airtight waterproof space, fill packing colloid, packing colloid is filled with confined space by the technique of injecting glue.Certainly, index-matching fluid, mainly fills by injecting glue or some glue form.In this example, packing colloid is transparence, and its refractive index is 1.3 ~ 1.7, and the refractive index of packing colloid and the refractive index of the lens in set of lenses 11 approach.In LED module of the present utility model, the light that LED chip sends packing colloid in communication process has substituted original air dielectric, and the refractive index of packing colloid is mated with the lens 11 in set of lenses, improved so to the full extent light emission rate, compared with prior art, light efficiency has improved 10 ~ 15%.In LED module of the present utility model, in the confined space of radiator 18 and lens 11, be filled with packing colloid, substrate 14 and the packed colloid of each LED luminous element are coated, therefore have good water resistance.In LED module of the present utility model, the heat that LED luminous element produces not only can pass through the bottom surface of the cooling stand of self and transmit to substrate 14, and can outwards transmit by packing colloid, makes radiating effect better.Certainly, also can be as required, in the confined space of radiator and lens 11, can be partially filled packing colloid.
In addition, radiator 18 is directly connected with substrate 14 and further comprises directly laminating, clamping of radiator 18, is spirally connected or welding substrate 14, or radiator 18 is connected and is further comprised that radiator 18 is connected with substrate 14 by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate 14.Radiator 18 is not limit with the type of attachment of substrate 14, as long as can reach the effect of abundant heat radiation.Also it should be noted that, radiator 18 is mainly the radiating fin that the other one side that contacts with substrate 14 is arranged to have high-cooling property, and existing radiating fin is mainly design side by side.The radiating effect that the applicant finds radiating fin is side by side not necessarily best, for this reason, the applicant's utility model there is the arrangement mode of the radiating fin of better radiating effect, such as, a kind of arrangement mode is: from intercepting face, radiating fin be divided into central part and centered by central part surrounding heronsbill mode disperse the fin unit of arranging, this set has better radiating effect to the heat at center.Also have, although the radiating fin of radiator 18 is interval designs side by side, each radiating fin is not continuously protruding, and each radiating fin can arrange some vacancies, the vacancy of adjacent radiating fin staggers, or the vacancy of adjacent radiating fin staggers between two.The radiating effect of the radiating fin of this radiator 18 is also extraordinary.In addition, radiator 18 is set to the non-radiating layout with better radiating effect that flushes.The height of radiating fin can be also different, needs the aspect ratio of place (as center) fin of heat radiation higher, and shorter the closer to the height of the fin of side.
In this example, the lens 11 of LED module are provided with fastener, and lens 11 are fixed on radiator 18 by fastener and form described seal cavity, and waterproof grommet 12 contributes to improve sealing effectiveness.It should be noted that, lens radiator fixed form is buckle not necessarily, also plays screw; Sealing clamping ring shape is lattice-shaped not necessarily, and lattice-shaped is just as preferred.
It should be noted that, in order to mate with existing LED module, the profile that this LED module is made can be identical with original LED module, reaches the effect being convenient for changing.
Certainly, the outlet of module is water-proof wire 17 or bare wire.
In this example, the waterproof screwed pipe 16 arranging on water-proof wire 17 wore radiator 18 by T-shaped sealing ring 15 and was connected with substrate 14.Certainly, arranging of water-proof wire 17 is not limited thereto, has a variety of implementations, and above is only for example, it should be noted that, in any case connect the sealing grade that must protect water-proof wire 17 to connect after getting on.Equally, radiator 18 is only also one with being spirally connected of substrate 14 and gives an example.
Embodiment 2
Unique different from embodiment 1, four protruding cavitys 111 are set on lens 11, same, LED light is sent out body and is comprised four corresponding LED luminous element unit 131.
Disclosed is above only several specific embodiments of the application, but the application is not limited thereto, and the changes that any person skilled in the art can think of, all should drop in the application's protection range.
Claims (12)
1. a LED module, it is characterized in that, comprise radiator, lens, be provided with the substrate of LED luminous element, described LED luminous element is arranged in described lens, described lens are provided with at least one protruding cavity, LED luminous element at least comprises a LED luminous element unit, described protruding cavity is corresponding one by one with described LED luminous element unit, between the protruding cavity of described lens and radiator, form the seal cavity of placing described LED luminous element, described substrate is fixed on radiator, and described luminous element unit is comprised of one or several wafer level encapsulated LED light sources.
2. LED module as claimed in claim 1, is characterized in that, in described lens, fills the index-matching fluid that is provided with to improve light efficiency in the protruding cavity between LED luminous element and described lens.
3. LED module as claimed in claim 2, is characterized in that, index-matching fluid is filled the seal cavity of the described LED luminous element of placement forming between the full whole protruding cavity by described lens and radiator.
4. LED module as claimed in claim 2, is characterized in that, index-matching fluid is filled by injecting glue or some glue form.
5. LED module as claimed in claim 1 or 2, is characterized in that, the described lens of described LED module are provided with fastener, and described lens are fixed on described radiator by fastener and form described seal cavity.
6. LED module as claimed in claim 1 or 2, is characterized in that, described radiator is set to the non-radiating layout with better radiating effect that flushes.
7. LED module as claimed in claim 1, is characterized in that, on described water-tight space, is provided with the wire hole for water-proof wire outlet, and for hole for injecting glue and the steam vent of injecting glue.
8. LED module as claimed in claim 1, is characterized in that, the outlet of module is water-proof wire or bare wire.
9. LED module as claimed in claim 1, is characterized in that,
Radiator is directly connected and further comprises directly laminating, the clamping of described radiator, is spirally connected or welds described substrate with substrate, or
Radiator is connected and is further comprised that described radiator is connected with described substrate by heat-conducting silicone grease, heat-conducting pad or graphite flake by medium with substrate.
10. LED module as claimed in claim 1, it is characterized in that, described wafer level encapsulated LED light source comprises fluorescent material, sapphire, luminescent layer, pad, and described pad is arranged at luminescent layer bottom, described sapphire is arranged on luminescent layer, and described fluorescent material is arranged on sapphire.
11. LED modules as claimed in claim 1, is characterized in that, described wafer level encapsulated LED light source is welded on described substrate, and substrate comprises metal substrate, ceramic substrate.
12. 1 kinds at least comprise that claim 1 is to the lighting device of any one LED module in claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420193885.7U CN203800086U (en) | 2014-04-21 | 2014-04-21 | LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420193885.7U CN203800086U (en) | 2014-04-21 | 2014-04-21 | LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203800086U true CN203800086U (en) | 2014-08-27 |
Family
ID=51382279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420193885.7U Expired - Lifetime CN203800086U (en) | 2014-04-21 | 2014-04-21 | LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203800086U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928601A (en) * | 2014-04-21 | 2014-07-16 | 杭州华普永明光电股份有限公司 | LED module |
-
2014
- 2014-04-21 CN CN201420193885.7U patent/CN203800086U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928601A (en) * | 2014-04-21 | 2014-07-16 | 杭州华普永明光电股份有限公司 | LED module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103542280B (en) | Luminaire | |
| CN203288644U (en) | Distributed high-voltage LED (Light-Emitting Diode) module group | |
| CN102024804B (en) | Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness | |
| CN107990267B (en) | Solar LED lawn lamp | |
| CN103915558A (en) | LED module | |
| CN103867947A (en) | LED bulb lamp | |
| CN103775858A (en) | 4 pi emergent light LED (Light Emitting Diode) light emitting pipe with chip flipped in transparent ceramic tube and illuminating lamp | |
| CN203192852U (en) | Led packaging structure | |
| CN204099932U (en) | Illumination light source and lighting device | |
| TW201533934A (en) | Led light source heat dissipation structure and heat dissipation method thereof | |
| CN203800079U (en) | LED module | |
| CN203800086U (en) | LED module | |
| CN103928601A (en) | LED module | |
| CN104747934A (en) | LED lighting device providing directed beams | |
| CN203950838U (en) | A kind of LED module | |
| CN103388764A (en) | LED (light-emitting diode) lighting lamp | |
| CN203023841U (en) | Four-pi light emission light-emitting diode (LED) luminous tube with chips inversely installed in transparent ceramic tube and illuminating lamp | |
| CN102148319A (en) | High-power white light emitting diode (LED) light source packaging structure | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN201408782Y (en) | Power type light-emitting diode | |
| CN104183581A (en) | LED module and manufacturing process thereof | |
| CN107994113A (en) | A kind of high-power blue-ray LED multilayer encapsulation structure | |
| CN202721186U (en) | Integrated high-efficiency lighting device provided with multi-layer structure | |
| CN103928602A (en) | LED module | |
| CN106025041A (en) | LED packaging structure and forming method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |