CN106783826A - A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast - Google Patents
A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast Download PDFInfo
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- CN106783826A CN106783826A CN201710042652.5A CN201710042652A CN106783826A CN 106783826 A CN106783826 A CN 106783826A CN 201710042652 A CN201710042652 A CN 201710042652A CN 106783826 A CN106783826 A CN 106783826A
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- substrate
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- pad
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- pin
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- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000005452 bending Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims 1
- 230000009467 reduction Effects 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003738 black carbon Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The present invention relates to LED field, a kind of especially indoor full-color paster TOP type light emitting diodes of high density high-contrast, including substrate, the edge of substrate front side is provided with the black bowl of annular, the depth of the bowl is 0.4mm, the public positive pole pin, red negative pin, green negative pin, blue negative pin include integrally formed connecting portion and bending part, the connecting portion is connected and perpendicular to substrate with substrate, the bending part is parallel to being provided with support frame between substrate, and bending part and substrate.By by each pin bending, increasing bonding area, weld strength is improved, advantageously reduce production cost.By setting the bowl of annular in the front edge of substrate, light extraction light type being changed, it is to avoid light side leakage, being conducive to improving contrast and the brightness of screen, reduction degree to picture is higher, and image quality is more preferable.Bowl is black, becomes apparent from the reflective obvious decrease of display screen, image quality.
Description
Technical field
The present invention relates to the indoor full-color paster TOP type light-emitting diodes of LED field, especially a kind of high density high-contrast
Pipe.
Background technology
Market to the density of indoor full color display, refresh, to display contrast more and more higher, particularly high density indoor aobvious
Display screen, indoor paster display screen device before much can not meet the demand in market, and main cause has two, first tradition patch
Piece full color display device is encapsulated using plastic packaging chip types, and light extraction light type is discrete, because of presence between 100 degree to 140 degree of left and right
Light-metering spills, and causes picture reduction degree not enough, watched under certain angle and occur spending screen and full-color reduction inadequate, lose highly dense
Spend the picture of high-resolution.Other traditional full-color paster display screen device is set perpendicular to hardware copper coin at the back side of hardware copper coin
Pin, the bottom area of pin is small, so results in and shows that the bonding area that operation is stayed is too small to downstream, causes weld strength not
It is enough, it is frequent in carrying and installation collision, cause fraction defective high.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of indoor full-color paster TOP types of high density high-contrast and light
Diode, to solve the above problems.
The technical solution adopted for the present invention to solve the technical problems is：A kind of indoor full-color paster of high density high-contrast
TOP type light emitting diodes, including substrate, the front of the substrate are provided with red chip, Green Chip, blue chip and public
Anode, the edge of the substrate back is provided with public positive pole pin, red negative pin, green negative pin, blue negative pole
Pin, the public anode, red chip, red negative pin are sequentially connected electrically, the public anode, Green Chip, green
Negative pin is sequentially connected electrically, and the public anode, blue chip and blue negative pin are sequentially connected electrically；
The edge of the substrate front side is provided with the black bowl of annular, and the depth of the bowl is 0.4mm, described public
Positive pole pin, red negative pin, green negative pin, blue negative pin include integrally formed connecting portion and bending
Portion, the connecting portion is connected and perpendicular to substrate with substrate, and the bending part sets parallel between substrate, and bending part and substrate
It is equipped with support frame.
Further, the bowl is PPA materials.
Further, the front of the substrate is provided with pad, the red chip, Green Chip, blue chip welding
In pad.
Further, the bowl and pad are adhered to substrate by glue, and nanoscale matt is added with the glue
Powder.
Further, the substrate is black plastic, and the pad is copper material.
Further, the length and width of the substrate is less than or equal to 1.1mm.
Further, the red chip, Green Chip, blue chip are linearly arranged, the public positive pole pin, red
Color negative pin, green negative pin, blue negative pin are distributed in four angles of substrate.
Further, the pad includes chip bonding pad, public anode pad, blue negative terminal pad and green negative pole weldering
Disk, the red chip, Green Chip, blue chip are welded in chip bonding pad, the blue negative terminal pad and green negative pole weldering
The length of disk is 0.31mm, and width is 0.175mm, and the length of the public anode pad is 0.44mm, and width is 0.175mm,
The distance between the distance between the chip bonding pad and public anode pad, chip bonding pad and blue negative terminal pad, chip weldering
The distance between the distance between disk and green negative terminal pad, blue negative terminal pad and green negative terminal pad are 0.09mm.
The beneficial effects of the invention are as follows：By by public positive pole pin, red negative pin, green negative pin, blueness
Negative pin bending, increases bonding area, improves weld strength, while the bulk strength of diode is increased by support frame,
The damage amount during following process is reduced, production cost is advantageously reduced.Annular is set by the front edge in substrate
Bowl, change light extraction light type, it is to avoid light side leakage, is conducive to improving contrast and the brightness of screen, to the reduction degree of picture
Higher, image quality is more preferable.Bowl is black, becomes apparent from the reflective obvious decrease of display screen, image quality.
Brief description of the drawings
Fig. 1 is front sectional view of the invention；
Fig. 2 is top view of the invention；
Fig. 3 is upward view of the invention.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and examples.
As shown in Figure 1, Figure 2 and Figure 3, the indoor full-color paster TOP types of a kind of high density high-contrast of the invention luminous two
Pole pipe, including substrate 1, the front of the substrate 1 are provided with red chip 2, Green Chip 3, blue chip 4 and public anode 5,
The edge at the back side of the substrate 1 is provided with public positive pole pin 6, red negative pin 7, green negative pin 8, blue negative pole and draws
Pin 9, the public anode 5, red chip 2, red negative pin 7 are sequentially connected electrically, the public anode 5, Green Chip 3,
Green negative pin 8 is sequentially connected electrically, and the public anode 5, blue chip 4 and blue negative pin 9 are sequentially connected electrically；
The positive edge of the substrate 1 is provided with the black bowl 10 of annular, and bowl 10 is PPA materials, that is, gather neighbour's benzene two
Formamide material, intensity is high, good toughness, and the depth of the bowl 10 is 0.4mm, and the public positive pole pin 6, red negative pole draw
Pin 7, green negative pin 8, blue negative pin 9 include integrally formed connecting portion 11 and bending part 12, the connecting portion
11 are connected and perpendicular to substrate 1 with substrate 1, and the bending part 12 is set parallel between substrate 1, and bending part 12 and substrate 1
There is support frame 13.
By setting the bowl 10 of annular in the front edge of substrate 1, light extraction light type is changed, it is to avoid light side leakage, have
Beneficial to the contrast and brightness that improve screen, the reduction degree to picture is higher, and image quality is more preferable.Bowl is black, makes display screen
Reflective obvious decrease, image quality becomes apparent from.Bowl 10 uses plastic material, wherein adding black carbon so that it is in black, with
Reflective amount is reduced, becomes apparent from image quality true to nature.By by public positive pole pin 6, red negative pin 7, green negative pin
8th, the blue bending of negative pin 9, increases bonding area, weld strength is improved, while increased diode by support frame 13
Bulk strength, reduces the damage amount during following process, advantageously reduces production cost.The depth of bowl 10 is 0.4mm, deep
Degree is shallower, it is ensured that enough brightness.
Further, the front of the substrate 1 is provided with pad 14, the red chip 2, Green Chip 3, blue chip
4 are welded in pad 14.
The bowl 10 is adhered to substrate 1 by glue, and nanoscale matt powder is added with the glue.In conventional seals
Nanoscale matt powder is added in glue.Through the patch light-emitting diode that matt is processed, when there is light irradiation in the external world, display screen device
Light reflection is there will not be, the contrast of display screen is effectively increased.It is possible to additionally incorporate the density of the fluid sealant of nanoscale matt powder
Also reinforce significantly, the moisture-proof characteristic of the patch light-emitting diode of raising.
The substrate 1 is black plastic, is further avoided reflective；The pad 14 is copper material, good conductivity, heat conduction
Property it is good, be conducive to radiating.
In order to improve brightness and resolution ratio, the length and width of the substrate 1 is less than or equal to 1.1mm.
Further, the red chip 2, Green Chip 3, blue chip 4 are linearly arranged, the public positive pole pin
6th, red negative pin 7, green negative pin 8, blue negative pin 9 are distributed in four angles of substrate 1.
In order to further improve display effect, the pad 14 includes chip bonding pad 15, public anode pad 16, blueness
Negative terminal pad 17 and green negative terminal pad 18, the red chip 2, Green Chip 3, blue chip 4 are welded in chip bonding pad 15,
The length of the blue negative terminal pad 17 and green negative terminal pad 18 is 0.31mm, and width is 0.175mm, the public anode weldering
The length of disk 16 is 0.44mm, and width is 0.175mm, the distance between the chip bonding pad 15 and public anode pad 16, core
It is the distance between the distance between piece pad 15 and blue negative terminal pad 17, chip bonding pad 15 and green negative terminal pad 18, blue
The distance between negative terminal pad 17 and green negative terminal pad 18 are 0.09mm.
The preferred embodiments of the present invention are the foregoing is only, is not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.It is all within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (8)
1. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast, including substrate (1), the substrate (1)
Front is provided with red chip (2), Green Chip (3), blue chip (4) and public anode (5), substrate (1) back side
Edge is provided with public positive pole pin (6), red negative pin (7), green negative pin (8), blue negative pin (9), institute
State public anode (5), red chip (2), red negative pin (7) to be sequentially connected electrically, the public anode (5), Green Chip
(3), green negative pin (8) is sequentially connected electrically, the public anode (5), blue chip (4) and blue negative pin (9)
It is sequentially connected electrically；It is characterized in that：
The positive edge of the substrate (1) is provided with the black bowl (10) of annular, and the depth of the bowl (10) is 0.4mm,
The public positive pole pin (6), red negative pin (7), green negative pin (8), blue negative pin (9) include one
The connecting portion (11) and bending part (12) of shaping, the connecting portion (11) is connected and perpendicular to substrate (1) with substrate (1), described
Bending part (12) is parallel to being provided with support frame (13) between substrate (1), and bending part (12) and substrate (1).
2. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 1, its feature exists
In：The bowl (10) is PPA materials.
3. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 1, its feature exists
In：The front of the substrate (1) is provided with pad (14), the red chip (2), Green Chip (3), blue chip (4) weldering
It is connected to pad (14).
4. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 3, its feature exists
In：The bowl (10) and pad (14) are adhered to substrate (1) by glue, and nanoscale matt powder is added with the glue.
5. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 3, its feature exists
In：The substrate (1) is black plastic, and the pad (14) is copper material.
6. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 1, its feature exists
In：The length and width of the substrate (1) is less than or equal to 1.1mm.
7. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 1, its feature exists
In：The red chip (2), Green Chip (3), blue chip (4) are linearly arranged, the public positive pole pin (6), red
Negative pin (7), green negative pin (8), blueness negative pin (9) are distributed in four angles of substrate (1).
8. a kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast as claimed in claim 3, its feature exists
In：The pad (14) includes chip bonding pad (15), public anode pad (16), blue negative terminal pad (17) and green negative pole weldering
Disk (18), the red chip (2), Green Chip (3), blue chip (4) are welded in chip bonding pad (15), the blue negative pole
The length of pad (17) and green negative terminal pad (18) is 0.31mm, and width is 0.175mm, the public anode pad (16)
Length is 0.44mm, and width is 0.175mm, the distance between the chip bonding pad (15) and public anode pad (16), chip
Between the distance between pad (15) and blue negative terminal pad (17), chip bonding pad (15) and green negative terminal pad (18) away from
0.09mm is from the distance between, blue negative terminal pad (17) and green negative terminal pad (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710042652.5A CN106783826A (en) | 2017-01-20 | 2017-01-20 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710042652.5A CN106783826A (en) | 2017-01-20 | 2017-01-20 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106783826A true CN106783826A (en) | 2017-05-31 |
Family
ID=58944990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710042652.5A Pending CN106783826A (en) | 2017-01-20 | 2017-01-20 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106783826A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731999A (en) * | 2017-10-30 | 2018-02-23 | 深圳市立彩光电科技有限公司 | The luminous LED in side |
| CN110137165A (en) * | 2019-04-19 | 2019-08-16 | 开发晶照明（厦门）有限公司 | Display device and preparation method thereof |
| CN110808325A (en) * | 2019-12-16 | 2020-02-18 | 深圳市恒泰新材料科技有限公司 | Display device of all-in-one TOP design based on Mini full-color display |
| CN112071829A (en) * | 2020-08-12 | 2020-12-11 | 深圳奥比中光科技有限公司 | Common anode multi-area emission module and depth camera |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859893U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Small size chip mounting light-emitting diode |
| CN201859894U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
| CN102376736A (en) * | 2010-08-20 | 2012-03-14 | 深圳路升光电科技有限公司 | Black-outside and white-inside type high-brightness full-color surface mounted device and light emitting diode (LED) display screen |
| CN202182350U (en) * | 2011-08-10 | 2012-04-04 | 深圳市九洲光电科技有限公司 | Full color LED (Light Emitting Diode) lamp |
| CN202196814U (en) * | 2011-08-22 | 2012-04-18 | 浙江英特来光电科技有限公司 | Three-channel pole-shared light-emitting diode |
| CN204045622U (en) * | 2014-08-25 | 2014-12-24 | 深圳市天电光电科技有限公司 | LED packaging |
| CN205141021U (en) * | 2015-12-08 | 2016-04-06 | 深圳市芯志达科技有限公司 | Outdoor high density high contrast emitting diode |
| CN206422065U (en) * | 2017-01-20 | 2017-08-18 | 钟斌 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
-
2017
- 2017-01-20 CN CN201710042652.5A patent/CN106783826A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376736A (en) * | 2010-08-20 | 2012-03-14 | 深圳路升光电科技有限公司 | Black-outside and white-inside type high-brightness full-color surface mounted device and light emitting diode (LED) display screen |
| CN201859893U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Small size chip mounting light-emitting diode |
| CN201859894U (en) * | 2010-08-26 | 2011-06-08 | 浙江英特来光电科技有限公司 | Pad structure of full color chip mounting light-emitting diode and full color chip mounting light-emitting diode |
| CN202182350U (en) * | 2011-08-10 | 2012-04-04 | 深圳市九洲光电科技有限公司 | Full color LED (Light Emitting Diode) lamp |
| CN202196814U (en) * | 2011-08-22 | 2012-04-18 | 浙江英特来光电科技有限公司 | Three-channel pole-shared light-emitting diode |
| CN204045622U (en) * | 2014-08-25 | 2014-12-24 | 深圳市天电光电科技有限公司 | LED packaging |
| CN205141021U (en) * | 2015-12-08 | 2016-04-06 | 深圳市芯志达科技有限公司 | Outdoor high density high contrast emitting diode |
| CN206422065U (en) * | 2017-01-20 | 2017-08-18 | 钟斌 | A kind of indoor full-color paster TOP type light emitting diodes of high density high-contrast |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731999A (en) * | 2017-10-30 | 2018-02-23 | 深圳市立彩光电科技有限公司 | The luminous LED in side |
| CN110137165A (en) * | 2019-04-19 | 2019-08-16 | 开发晶照明（厦门）有限公司 | Display device and preparation method thereof |
| CN110808325A (en) * | 2019-12-16 | 2020-02-18 | 深圳市恒泰新材料科技有限公司 | Display device of all-in-one TOP design based on Mini full-color display |
| CN112071829A (en) * | 2020-08-12 | 2020-12-11 | 深圳奥比中光科技有限公司 | Common anode multi-area emission module and depth camera |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180130 Address after: 361101 Xiamen torch high tech Zone (Xiangan), Xiamen, Fujian Province, No. 101, Xiang Xing Road, 361101 Industrial Zone Applicant after: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. Address before: East Lake street 516002 Guangdong city of Huizhou province Huicheng District No. 93 building 615 room 443 Applicant before: Zhong Bin |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |