CN204118117U - A kind of package structure for LED - Google Patents
A kind of package structure for LED Download PDFInfo
- Publication number
- CN204118117U CN204118117U CN201420519863.5U CN201420519863U CN204118117U CN 204118117 U CN204118117 U CN 204118117U CN 201420519863 U CN201420519863 U CN 201420519863U CN 204118117 U CN204118117 U CN 204118117U
- Authority
- CN
- China
- Prior art keywords
- led
- emitting diode
- backlight unit
- light
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model is applicable to LED technology field, provides a kind of package structure for LED and comprises: a lead frame, an encapsulating housing, at least one light-emitting diode chip for backlight unit, a packing colloid and at least one metal level; Light-emitting diode chip for backlight unit is configured on lead frame, and is positioned at the receive chips depression that lead frame and encapsulating housing form, and metal level is positioned at below light-emitting diode chip for backlight unit, and light-emitting diode chip for backlight unit is electrically connected by metal level and lead frame; Packing colloid fills in receive chips depression, with coated light-emitting diode chip for backlight unit and metal level.Light-emitting diode of the present utility model is not by the moisture in the external world and the impact of moisture, therefore do not need to consider moistureproof problem, and the utility model relieves the technique of bonding wire in conventional patch type LED lamp structure, there will not be the problem that the moistureproof problem because of packaging body itself causes lamp body to lose efficacy.
Description
Technical field
The utility model belongs to LED technology field, particularly relates to a kind of full-color light-emitting diode encapsulating structure of outdoor.
Background technology
At present, LED (Light Emitting Diode, light-emitting diode) display screen is widely used in stadiums, city and public square, traffic, corporate image publicity, commercial advertisement and other application.Because stadiums viewing distance is far away, ambient brightness is high, therefore only have LED display could meet this particular/special requirement, guarantee that spectators obtain clear, distinct coloured image with this, for spectators bring unlimited visual enjoyment.In public places, indoor and outdoor LED display display social information and various dynamic drawing, the pulsation of society is beated to allow people feel at any time.As one of the best image information approach of public traffic information, LED display also will on airport, railway station, highway, subway, urban light rail etc. give full play to one's skill.As the full color display of oversize, super brightness, LED in street corner, commercial square, pile, park, shopping center become the important selection of commercial advertisement.
The display brightness of outdoor light-emitting diode display is than indoor height, and outdoor light-emitting diode display typical brightness is 5,000-6,000 nit, and indoor LED display is then 2,000 nit.The brightness height of outdoor version light-emitting diode display is in order under various environmental conditions, even can be visible under direct sunlight.In outdoor, LED display must have cold-resistant, waterproof and dustproof and refrigerating function.Therefore, this proposes very high requirement to LED encapsulation structure.
In view of the intrinsic advantage of LED, widely apply on display screen market at present.Out of doors the packaging technology of the market upper prong of display screen grasp by Japan; Domestic LED industry cannot break through outdoor water-proof protection against the tide always, and the packaging technology technology of antiultraviolet, cannot break through for waterproof and dampproof patch-type light-emitting diode always, still adopts Lamp conventional package to be used for outdoor display screen market at present.
As shown in Figure 1, current package structure for LED comprises: lead frame 1, encapsulating housing 2, light-emitting diode chip for backlight unit 3 and a packing colloid 4.Described light-emitting diode chip for backlight unit 3 is configured on described lead frame 1, and is positioned at the receive chips depression C that described lead frame 1 forms with described encapsulating housing 2, and wherein, described light-emitting diode chip for backlight unit 3 is electrically connected by bonding wire 5 and described lead frame 1.Described packing colloid 4 fills in described receive chips depression C, with coated described light-emitting diode chip for backlight unit 3 and described bonding wire 5.But this current package structure for LED mostly to be on lead frame that plastic cement injects directly die bond bonding wire, and this structure, because of the characteristic of plastic cement moisture absorption, causes its humidity resistance poor, and easily occurs that dead lamp phenomenon appears in position of bonding wire line when being pulled up.
Utility model content
The purpose of this utility model is to provide a kind of package structure for LED, be intended to solve existing package structure for LED and mostly be on lead frame that plastic cement injects directly die bond bonding wire, this structure is because of the characteristic of plastic cement moisture absorption, cause its humidity resistance poor, and easily occur that the problem of dead lamp phenomenon appears in position of bonding wire line when being pulled up.
The utility model provides a kind of package structure for LED, and described package structure for LED comprises: a lead frame, an encapsulating housing, at least one light-emitting diode chip for backlight unit, a packing colloid and at least one metal level;
Wherein, described light-emitting diode chip for backlight unit is configured on described lead frame, and be positioned at the receive chips depression that described lead frame and described encapsulating housing form, described metal level is positioned at below described light-emitting diode chip for backlight unit, and described light-emitting diode chip for backlight unit is electrically connected by described metal level and described lead frame; Described packing colloid fills in described receive chips depression, with coated described light-emitting diode chip for backlight unit and described metal level.
Preferably, described metal level is tin, copper, aluminium, gold, silver or platinum.
Preferably, described lead frame comprises line layer and many pins.
Preferably, described lead frame is several character form structures, and described pin is smooth structure.
Preferably, described light-emitting diode chip for backlight unit at least comprises three, is respectively red light emitting diodes chip, green LED chip and blue led chips.
Preferably, described red light emitting diodes chip, green LED chip and blue led chips become rods arranged in horizontal line.
Preferably, described light-emitting diode chip for backlight unit is flip chip structure, and two electrodes of described light-emitting diode chip for backlight unit are arranged on reverse side.
Preferably, described packing colloid is vaporific translucent diffusion colloid.
Preferably, described vaporific translucent diffusion colloid is epoxy resin, or is silica gel.
In the utility model, the present embodiment overturns traditional encapsulation mode completely on making technology, particularly determine mode is improved in the nation of light-emitting diode chip for backlight unit, the mode by previous die bond bonding wire craft structure modify being common gold solder is fixed to the nation of doing light-emitting diode chip for backlight unit, as by being covered with metal level (as tin cream) on lead frame, the mode of reflow and high temperature hot pressing welding is utilized to be welded on described lead frame by described light-emitting diode chip for backlight unit by described tin cream.The package structure for LED that the present embodiment provides is because of without traditional bonding wire craft, and therefore light-emitting diode is by the impact of extraneous moisture and moisture, does not therefore need to consider moistureproof problem.The most significant structure of the utility model embodiment is the technique relieving bonding wire in conventional patch type LED lamp structure, there will not be the problem that the moistureproof problem because of packaging body itself causes lamp body to lose efficacy.The package structure for LED that the utility model embodiment provides is specially adapted to outdoor display screen.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the package structure for LED that prior art provides.
Fig. 2 is the side schematic view that the utility model embodiment carries the package structure for LED of arch.
Fig. 3 is the front schematic view that the utility model embodiment carries the package structure for LED of arch.
Fig. 4 is the schematic bottom view that the utility model embodiment carries the package structure for LED of arch.
Embodiment
In order to make the purpose of this utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
In order to technical scheme described in the utility model is described, be described below by specific embodiment.
In the utility model embodiment, the present embodiment overturns traditional encapsulation mode completely on making technology, particularly determine mode is improved in the nation of light-emitting diode chip for backlight unit, the mode by previous die bond bonding wire craft structure modify being common gold solder is fixed to the nation of doing light-emitting diode chip for backlight unit, as by being covered with metal level (as tin cream) on lead frame, the mode of reflow and high temperature hot pressing welding is utilized to be welded on described lead frame by described light-emitting diode chip for backlight unit by described tin cream.The package structure for LED that the present embodiment provides is because of without traditional bonding wire craft, and therefore light-emitting diode is by the impact of extraneous moisture and moisture, does not therefore need to consider moistureproof problem.The most significant structure of the utility model embodiment is the technique relieving bonding wire in conventional patch type LED lamp structure, there will not be the problem that the moistureproof problem because of packaging body itself causes lamp body to lose efficacy.
See also Fig. 2, Fig. 3 and Fig. 4, Fig. 2 is the side schematic view that the utility model embodiment carries the package structure for LED of arch.Fig. 3 is the front schematic view that the utility model embodiment carries the package structure for LED of arch.Fig. 4 is the schematic bottom view that the utility model embodiment carries the package structure for LED of arch.For convenience of explanation, illustrate only the part relevant to the utility model embodiment.
Described package structure for LED comprises: lead frame 10, encapsulating housing 20, at least one light-emitting diode chip for backlight unit 30, one packing colloid 40 and at least one metal level 50.Described light-emitting diode chip for backlight unit 30 is configured on described lead frame 10, and be positioned at the receive chips depression C that described lead frame 10 forms with described encapsulating housing 20, wherein, described metal level 50 is positioned at below described light-emitting diode chip for backlight unit 30, and described light-emitting diode chip for backlight unit 30 is electrically connected by metal level 50 and described lead frame 10.Described packing colloid 40 fills in described receive chips depression C, with coated described light-emitting diode chip for backlight unit 30 and described metal level 50.
In the utility model embodiment; described metal level 50 can be tin, copper, aluminium, gold, silver, platinum etc.; but be not limited to above-mentioned material; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.In the present embodiment, described lead frame 10 is covered with described tin (as tin cream), utilizes the mode of reflow and high temperature hot pressing welding to be welded on described lead frame 10 by described light-emitting diode chip for backlight unit 30 by described tin cream.
In the utility model embodiment, described lead frame 10 comprises line layer (not indicating in figure) and many pins 60.The utility model embodiment utilizes Sheet Metal Forming Technology to form described line layer structure.The described lead frame 10 be made up of described line layer and many pins 60 is in " several " character form structure.Wherein, the medium of described pin 60 in order to be electrically connected with the external world as package structure for LED, and the heat conduction of described pin 60 also in order to be produced by described light-emitting diode chip for backlight unit 30 is gone out.But be understandable that, the described lead frame 10 being somebody's turn to do " several " character form structure makes described pin 60 become smooth structure, and therefore, the described pin 60 of this smooth structure more easily welds.
As the utility model one preferred embodiment, described light-emitting diode chip for backlight unit 30 at least comprises three, is respectively red light emitting diodes chip, green LED chip and blue led chips.Described red light emitting diodes chip, green LED chip and blue led chips become rods arranged in horizontal line.But, be understandable that, the light-emitting diode chip for backlight unit of multiple identical or different color can be set according to the actual requirements.Wherein, described red light emitting diodes chip, green LED chip and blue led chips become the design of rods arranged in horizontal line, can reach the video display effect of homogeneous and higher color fidelity.
As the utility model one preferred embodiment, described light-emitting diode chip for backlight unit 30 is flip chip structure, and two electrodes of described light-emitting diode chip for backlight unit 30 are arranged on reverse side.Namely, described red light emitting diodes chip, green LED chip and blue led chips are all flip chip structures, and two electrodes of described red light emitting diodes chip, green LED chip and blue led chips are all be arranged on reverse side.
In the utility model embodiment, described packing colloid 40 adopts vaporific translucent diffusion colloid, adopts this vaporific translucent diffusion colloid that uniform light can be made to distribute.But; be understandable that; described vaporific translucent diffusion colloid can be epoxy resin; also can be silica gel etc.; but be not limited to above-mentioned material; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
In the utility model embodiment, form described encapsulating housing 20 by the mode of injection molded.
In sum, the present embodiment overturns traditional encapsulation mode completely on making technology, particularly determine mode is improved in the nation of light-emitting diode chip for backlight unit, the mode by previous die bond bonding wire craft structure modify being common gold solder is fixed to the nation of doing light-emitting diode chip for backlight unit, as by being covered with metal level (as tin cream) on lead frame, the mode of reflow and high temperature hot pressing welding is utilized to be welded on described lead frame by described light-emitting diode chip for backlight unit by described tin cream.The package structure for LED that the present embodiment provides is because of without traditional bonding wire craft, and therefore light-emitting diode is by the impact of extraneous moisture and moisture, does not therefore need to consider moistureproof problem.The most significant structure of the utility model embodiment is the technique relieving bonding wire in conventional patch type LED lamp structure, there will not be the problem that the moistureproof problem because of packaging body itself causes lamp body to lose efficacy.The package structure for LED that the utility model embodiment provides is specially adapted to outdoor display screen.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (9)
1. a package structure for LED, is characterized in that, described package structure for LED comprises: a lead frame, an encapsulating housing, at least one light-emitting diode chip for backlight unit, a packing colloid and at least one metal level;
Wherein, described light-emitting diode chip for backlight unit is configured on described lead frame, and be positioned at the receive chips depression that described lead frame and described encapsulating housing form, described metal level is positioned at below described light-emitting diode chip for backlight unit, and described light-emitting diode chip for backlight unit is electrically connected by described metal level and described lead frame; Described packing colloid fills in described receive chips depression, with coated described light-emitting diode chip for backlight unit and described metal level.
2. package structure for LED as claimed in claim 1, it is characterized in that, described metal level is tin, copper, aluminium, gold, silver or platinum.
3. package structure for LED as claimed in claim 1, it is characterized in that, described lead frame comprises line layer and many pins.
4. package structure for LED as claimed in claim 3, it is characterized in that, described lead frame is several character form structures, and described pin is smooth structure.
5. package structure for LED as claimed in claim 1, it is characterized in that, described light-emitting diode chip for backlight unit at least comprises three, is respectively red light emitting diodes chip, green LED chip and blue led chips.
6. package structure for LED as claimed in claim 5, it is characterized in that, described red light emitting diodes chip, green LED chip and blue led chips become rods arranged in horizontal line.
7. package structure for LED as claimed in claim 1, it is characterized in that, described light-emitting diode chip for backlight unit is flip chip structure, and two electrodes of described light-emitting diode chip for backlight unit are arranged on reverse side.
8. package structure for LED as claimed in claim 1, it is characterized in that, described packing colloid is vaporific translucent diffusion colloid.
9. package structure for LED as claimed in claim 8, it is characterized in that, described vaporific translucent diffusion colloid is epoxy resin, or is silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420519863.5U CN204118117U (en) | 2014-09-10 | 2014-09-10 | A kind of package structure for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420519863.5U CN204118117U (en) | 2014-09-10 | 2014-09-10 | A kind of package structure for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204118117U true CN204118117U (en) | 2015-01-21 |
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ID=52335404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420519863.5U Expired - Fee Related CN204118117U (en) | 2014-09-10 | 2014-09-10 | A kind of package structure for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204118117U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461615A (en) * | 2018-05-24 | 2018-08-28 | 河源市富宇光电科技有限公司 | A kind of chip diode |
-
2014
- 2014-09-10 CN CN201420519863.5U patent/CN204118117U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461615A (en) * | 2018-05-24 | 2018-08-28 | 河源市富宇光电科技有限公司 | A kind of chip diode |
| CN108461615B (en) * | 2018-05-24 | 2024-01-26 | 河源市富宇光电科技有限公司 | Patch type diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150121 Termination date: 20210910 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |