CN204011476U - A kind of LED encapsulating structure and LED display - Google Patents
A kind of LED encapsulating structure and LED display Download PDFInfo
- Publication number
- CN204011476U CN204011476U CN201420442051.5U CN201420442051U CN204011476U CN 204011476 U CN204011476 U CN 204011476U CN 201420442051 U CN201420442051 U CN 201420442051U CN 204011476 U CN204011476 U CN 204011476U
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- CN
- China
- Prior art keywords
- led
- chip
- lead frame
- encapsulating structure
- cavity
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The utility model is applicable to LED field, and a kind of LED encapsulating structure and LED display are provided.Described LED encapsulating structure comprises lead frame and LED chip, described LED chip is fixed on described lead frame, described LED chip is by the coated encapsulation cavity that forms LED chip of the first encapsulating housing that is provided with a cavity of injection mo(u)lding for the first time, and the encapsulation cavity of described lead frame and LED chip is coated by the second encapsulating housing of injection mo(u)lding for the second time.LED encapsulating structure of the present utility model makes LED itself have good sealing property, make extraneous moisture and moisture be difficult to arrive core position chip and the bonding wire of LED, can avoid the impact of plastic rubber material moisture absorption on the chip in patch-type full-color light-emitting diode and bonding wire completely, humidity resistance is good.
Description
Technical field
The utility model belongs to light-emitting diode (Light Emitting Diode, LED) field, relates in particular to a kind of LED encapsulating structure and LED display.
Background technology
LED display is widely used in stadiums, public place, public transport, corporate image publicity, commercial advertisement and other application.Because stadiums viewing distance is far away, ambient brightness is high, only have LED display could meet this specific (special) requirements, guarantee that spectators obtain clear, distinct coloured image, for spectators bring unlimited visual enjoyment.In public places, indoor and outdoor LED display shows social information and various dynamic drawing, allows people feel that at any time social pulsation beats.As one of best image information approach of public traffic information, LED display also on airport, railway station, highway, subway, districts and cities' light rail etc. give full play to one's skill.As the full color display of oversize, super brightness, LED in street corner, commercial square, pile, park, shopping center become the important selection of commercial advertisement.
At present, LED display mainly contains three kinds of application: physical culture, family inside/outside billboard and lease/stage application.According to the difference of display screen LED type used, image is processed also different effects.For example, 3 close 1 LED, and its disposal ability will be given 3 LED pixels in an encapsulation.And lamp type LED, the physical location of LED need to lean on very closely and integrate well, thereby effectively LED pixel is carried out to convergent-divergent and brightness variation.
The display brightness of outdoor LED display screen is than indoor height, and outdoor LED display screen typical brightness is 5,000-6,000 nit, and indoor LED display is 2,000 nits.The brightness height of outdoor version is under various environmental conditions, even can be visible under direct sunlight, that outdoor version LED display must have be heat-resisting, cold-resistant, waterproof and dustproof and refrigerating function.This has proposed very high requirement to LED encapsulating structure.
In view of the intrinsic advantage of LED, widely apply on the products such as display screen, light fixture at present.In prior art, paster LED cannot be broken through the packaging technology technology of outdoor water-proof protection against the tide and antiultraviolet always, therefore still adopt Lamp conventional package structure for outdoor display screen market.At present, patch-type material is all to adopt PLCC6, PLCC4 structure, and the moisture-absorption characteristics of the PPA plastics that wherein PLCC adopts itself causes the waterproof and dampproof weak effect of LED, and LED is applied to outdoor display screen and often there will be the bad phenomenon such as dead lamp, and product reliability is poor.
Utility model content
The purpose of this utility model is to provide a kind of LED encapsulating structure and LED display, is intended to solve the waterproof and dampproof weak effect of LED, and LED is applied to outdoor display screen and often there will be the bad phenomenon such as dead lamp, the problem that product reliability is poor.
First aspect, the utility model provides a kind of LED encapsulating structure, described LED encapsulating structure comprises lead frame and LED chip, described LED chip is fixed on described lead frame, described LED chip is by the coated encapsulation cavity that forms LED chip of the first encapsulating housing that is provided with a cavity of injection mo(u)lding for the first time, and the encapsulation cavity of described lead frame and LED chip is coated by the second encapsulating housing of injection mo(u)lding for the second time.
Further, described LED chip comprises red chip, Green Chip and blue wafer, and described red chip, Green Chip and blue wafer are rods arranged in horizontal line.
Further, the cavity of described the first encapsulating housing adopts vaporific translucent diffusion colloid encapsulation.
Further, described lead frame is " several " character form structure, and the pin of described lead frame is smooth structure.
Second aspect, the utility model provides a kind of LED display that comprises above-mentioned LED encapsulating structure.
In the utility model, owing to adopting double-layer cavity structure on lead frame, particularly the second encapsulating housing of the upper opening of injection mo(u)lding is for the second time coated by the encapsulation cavity of lead frame and LED chip, make LED itself there is good sealing property, make extraneous moisture and moisture be difficult to arrive core position chip and the bonding wire of LED, can avoid the impact of plastic rubber material moisture absorption on the chip in patch-type full-color light-emitting diode and bonding wire completely, humidity resistance is good.
Accompanying drawing explanation
Fig. 1 is the front view of the LED encapsulating structure that provides of the utility model embodiment.
Fig. 2 is the end view of the LED encapsulating structure that provides of the utility model embodiment.
Fig. 3 is the upward view of the LED encapsulating structure that provides of the utility model embodiment.
Fig. 4 is the front view of the LED encapsulating structure that provides of the utility model embodiment after injection mo(u)lding for the first time.
Fig. 5 is the end view of the LED encapsulating structure that provides of the utility model embodiment after injection mo(u)lding for the first time.
Fig. 6 is the end view of the LED encapsulating structure that provides of the utility model embodiment after lead frame bending and forming.
Fig. 7 is the end view of the LED encapsulating structure that provides of the utility model embodiment after injection mo(u)lding for the second time.
Embodiment
In order to make the purpose of this utility model, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
For technical scheme described in the utility model is described, below by specific embodiment, describe.
Refer to Fig. 1 to Fig. 3, the LED encapsulating structure that the utility model embodiment provides comprises lead frame 100 and LED chip 200, and LED chip 200 is fixed on lead frame 100.LED chip 200 is by the coated encapsulation cavity that forms LED chip of the first encapsulating housing 300 that is provided with a cavity of injection mo(u)lding for the first time, and the encapsulation cavity of lead frame 100 and LED chip is coated by the second encapsulating housing 400 of injection mo(u)lding for the second time.Lead frame 100 is " several " character form structure, and the pin 101 of lead frame 100 is smooth structure, more easily welding.LED chip 200 comprises red chip, Green Chip and blue wafer, and red chip, Green Chip and blue wafer are rods arranged in horizontal line, can reach the video display effect of homogeneous and higher color fidelity.The cavity of the first encapsulating housing 300 adopts vaporific translucent diffusion colloid encapsulation, and light is uniformly distributed, and colloid can be epoxy resin, also can be silica gel.
The manufacturing process that refers to the LED encapsulating structure that Fig. 4 to Fig. 7 the utility model embodiment provides is as follows:
(1) lead frame 100 utilizes Sheet Metal Forming Technology to form line layer structure;
(2) injection mo(u)lding is for the first time provided with the encapsulation cavity of the coated LED chip 200 formation LED chips of the first encapsulating housing 300, the first encapsulating housing 300 of a cavity;
(3) lead frame 100 is bent into " several " character form structure, the pin 101 of lead frame 100 is smooth structure, more easily welding;
(4) the encapsulation cavity of 400 pairs of lead frames 100 of the second encapsulating housing of injection mo(u)lding for the second time and LED chip is coated;
(5) red chip, Green Chip and blue wafer are rods arranged in horizontal line, can reach the video display effect of homogeneous and higher color fidelity;
The cavity of (6) first encapsulating housings 300 adopts vaporific translucent diffusion colloid encapsulation.
The utility model embodiment also provides a kind of LED display that comprises the LED encapsulating structure that the utility model embodiment provides.
In the utility model embodiment, owing to adopting double-layer cavity structure on lead frame, particularly the second encapsulating housing of the upper opening of injection mo(u)lding is for the second time coated by the encapsulation cavity of lead frame and LED chip, make LED itself there is good sealing property, make extraneous moisture and moisture be difficult to arrive core position chip and the bonding wire of LED, can avoid the impact of plastic rubber material moisture absorption on the chip in patch-type full-color light-emitting diode and bonding wire completely, humidity resistance is good.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. a LED encapsulating structure, it is characterized in that, described LED encapsulating structure comprises lead frame and LED chip, described LED chip is fixed on described lead frame, described LED chip is by the coated encapsulation cavity that forms LED chip of the first encapsulating housing that is provided with a cavity of injection mo(u)lding for the first time, and the encapsulation cavity of described lead frame and LED chip is coated by the second encapsulating housing of injection mo(u)lding for the second time.
2. LED encapsulating structure as claimed in claim 1, is characterized in that, described lead frame is " several " character form structure, and the pin of described lead frame is smooth structure.
3. LED encapsulating structure as claimed in claim 1, is characterized in that, described LED chip comprises red chip, Green Chip and blue wafer, and described red chip, Green Chip and blue wafer are rods arranged in horizontal line.
4. LED encapsulating structure as claimed in claim 1, is characterized in that, the cavity of described the first encapsulating housing adopts vaporific translucent diffusion colloid encapsulation.
5. a LED display that comprises the LED encapsulating structure described in claim 1 to 4 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420442051.5U CN204011476U (en) | 2014-08-06 | 2014-08-06 | A kind of LED encapsulating structure and LED display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420442051.5U CN204011476U (en) | 2014-08-06 | 2014-08-06 | A kind of LED encapsulating structure and LED display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011476U true CN204011476U (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420442051.5U Expired - Fee Related CN204011476U (en) | 2014-08-06 | 2014-08-06 | A kind of LED encapsulating structure and LED display |
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| CN (1) | CN204011476U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161598A (en) * | 2015-07-27 | 2015-12-16 | 广州市鸿利光电股份有限公司 | Injection molding based CSP packaging structure and manufacturing process |
| CN105336707A (en) * | 2015-10-21 | 2016-02-17 | 武汉光迅科技股份有限公司 | Plastic airtight pipe shell and manufacturing method thereof |
-
2014
- 2014-08-06 CN CN201420442051.5U patent/CN204011476U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105161598A (en) * | 2015-07-27 | 2015-12-16 | 广州市鸿利光电股份有限公司 | Injection molding based CSP packaging structure and manufacturing process |
| CN105161598B (en) * | 2015-07-27 | 2019-01-01 | 鸿利智汇集团股份有限公司 | A kind of CSP encapsulating structure and manufacturing process based on moulding |
| CN105336707A (en) * | 2015-10-21 | 2016-02-17 | 武汉光迅科技股份有限公司 | Plastic airtight pipe shell and manufacturing method thereof |
| CN105336707B (en) * | 2015-10-21 | 2018-03-02 | 武汉光迅科技股份有限公司 | A kind of airtight shell of plastics and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20210806 |
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| CF01 | Termination of patent right due to non-payment of annual fee |