CN209544386U - The light emitting diode and display device of high flatness light-emitting surface - Google Patents
The light emitting diode and display device of high flatness light-emitting surface Download PDFInfo
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- CN209544386U CN209544386U CN201822232160.5U CN201822232160U CN209544386U CN 209544386 U CN209544386 U CN 209544386U CN 201822232160 U CN201822232160 U CN 201822232160U CN 209544386 U CN209544386 U CN 209544386U
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Abstract
The light emitting diode of high flatness light-emitting surface in the application display device includes package support, luminescence chip, the encapsulating housing of setting on the package support, the luminescence chip is arranged in encapsulating housing, and the encapsulation glue-line that upper surface is plane is equipped with above the luminescence chip.The encapsulation glue-line upper surface of the light emitting diode of the application is smooth plane, improves the light-emitting uniformity of light emitting diode, reduces light leakage.Substantially increase the display effect and homogeneity of product of display screen.There is higher video display effect and higher color fidelity using the display device of the light emitting diode, display consistency is good.
Description
[technical field]
The utility model relates to light emitting diode field more particularly to a kind of light emitting diodes of high flatness light-emitting surface.
[background technique]
LED display will be applied to stadiums, city and public square, traffic, corporate image publicity, business extensively extensively
In announcement and other application.Since stadiums viewing distance is remote, ambient brightness is high, only LED display is just able to satisfy this spy
It is different to require, it is ensured that spectators obtain clear, distinct color image, bring unlimited visual enjoyment for spectators.In public places, room
Inside and outside LED display shows social information and various dynamic drawings, and people is allowed to feel the pulsation bounce of society at any time.As public
One of best image information approach of traffic information, LED display will also be in airport, railway station, highway, subway, districts and cities
Light rail etc. is given full play to one's skill.As oversize, the full color display of super brightness, LED is in street corner, commercial square, Gao great Jian
It builds, the important selection of park, shopping center as commercial advertisement.
Currently, there are mainly three types of applications for LED module: sport, family inside/outside billboard and lease/stage application.According to display
The difference of screen LED type used, image procossing also have different effects.For example, 3 close 1 LED, processing capacity will be given
3 LED pixels in one encapsulation.And the physical location of lamp-type LED, LED need to lean on closely and well to integrate
Together, to effectively be zoomed in and out to LED pixel and brightness change.
The display brightness of outdoor light-emitting diode display is higher than indoor, and outdoor light-emitting diode display typical brightness is 5,000-6,000
Nit, indoor LED display then 2,000 nit.The brightness height of outdoor version is in order under various environmental conditions, even sunlight
Can be visible under direct projection, type LED display is also heat-resisting at room, rain-proof, snow defence etc..In outdoor, LED display must have anti-
Cold, waterproof and dustproof and refrigerating function.And indoor LED display is then to LED encapsulation structure that more stringent requirements are proposed: it is closeer away from
Requirement, more high contrast, image quality needs more preferably clarity.Indoor LED display has the tendency that catching up with and surpassing liquid crystal display.
Therefore, LED display needs more fine definition, higher-definition, the light emitting diode of more high contrast in the market.This
High demand is proposed in specification to patch-type full-color light-emitting diode, needs high-reliability, fine definition, high image quality.It is existing
Having patch-type LED lamp structure is mostly that directly die bond bonding wire, conductive pin are rolled over using external force on bracket that plastic cement has been injected
It is curved.Existing epoxy glue can be because the coefficient of expansion and PPA be differently formed the light emitting structures inside contracted after dispensing.And because of dispensing glue amount
Difference causes glue surface uneven, this phenomenon seriously affects the display effect and homogeneity of product of display screen.Fig. 1~4 are please referred to,
Currently, the bracket 130 of patch-type is one of most important raw material of patch-type LED, it is responsible for conductive and thermal component in the led,
PPA injection-moulded housing is the carrier of LED wafer, gold thread and glue, luminescence chip 120 is arranged on bracket 130 in figure, and be encapsulated in
In black PPA encapsulating housing 110, encapsulated by gluing process, it now can be because after dispensing as the epoxy glue of packing colloid 150
For the coefficient of expansion and PPA the light emitting structures inside contracted are differently formed, if the part a inside contracts light emitting structures in Fig. 3, lead to light-emitting surface not
It is smooth, and because the difference of dispensing glue amount causes glue surface uneven, this phenomenon seriously affects the display effect and product of display screen
Consistency；In addition, the pin 140 in the structure exposes to 110 side of encapsulating housing, overall structure flatness and performance ginseng are influenced
Number, and be easy impaired.
[summary of the invention]
A kind of high flatness light-emitting surface for being designed to provide uniform in light emission, good product consistency of the application shines two
Pole pipe and the display device high using the display effect and homogeneity of product of the light emitting diode.
To realize the application purpose, the following technical schemes are provided:
The application provides a kind of light emitting diode of high flatness light-emitting surface comprising package support, setting are in encapsulation branch
Luminescence chip, encapsulating housing on frame, the luminescence chip are arranged in encapsulating housing, are equipped with above the luminescence chip upper
Surface is the encapsulation glue-line of plane.The encapsulation glue-line upper surface of the light emitting diode of the application is smooth plane, improves hair
The light-emitting uniformity of optical diode reduces light leakage.Substantially increase the display effect and homogeneity of product of display screen.
Specifically, the package support is patch-type package support.
In some of embodiments, the encapsulation glue-line is that liquid is molded glue-line, and the liquid molding glue-line is to pass through
Liquid press moulding mode is formed by the structure with surface high-flatness characteristic, is formed with used dispensing mode universal at present
Colloform texture it is entirely different, herein by liquid press moulding mode manufacture be formed by it is this have surface high-flatness characteristic
Colloid be referred to as liquid molding glue-line.This structure makes light-emitting area smooth, solves because the difference of dispensing glue amount leads to glue
The uneven problem in face, improves light-emitting uniformity and display effect.
Specifically, the encapsulation glue-line uses epoxide resin material, carries out die bond bonding wire craft on the package support, then adopts
Epoxy resin is coated into luminescence chip and conductive lead wire with liquid mould pressing process.
In some of embodiments, the light-path that the encapsulation glue-line is formed is square structure, and top is high flatness
Light-emitting surface.
In some of embodiments, the encapsulation glue-line is transparent misty colloid, which further increases out
Optical uniformity.
In some of embodiments, the encapsulation glue-line covers above the encapsulating housing, and generallys use at present
The packing colloid that dispensing mode is formed is different, and encapsulation glue-line described herein covers above the encapsulating housing, can make whole
The upper surface of a light emitting diode construction is even curface, the light-emitting surface with high flatness.
In some of embodiments, the luminescence chip is connected with conductive pin, the encapsulation glue-line outer surface with
The conductive pin side is concordant or exceeds the conductive pin side.The structure improves entire light emitting diode construction simultaneously
Flatness, including upper surface is smooth and the flatness of side surface, and have protective effect to pin.
In some of embodiments, the luminescence chip includes the red light chips of "-" type arrangement, blue chip and green
Optical chip.It can achieve the video display effect and higher color fidelity of homogeneous.
The application also provides a kind of display device comprising the light emitting diode of high flatness light-emitting surface as described above.
The prior art is compared, the application has the following advantages:
Luminescence chip is set in the application encapsulating housing, and it is plane that upper surface is further equipped with above the luminescence chip
Encapsulation glue-line.The encapsulation glue-line upper surface of the light emitting diode of the application is smooth plane, improves light emitting diode
Light-emitting uniformity reduces light leakage.The display effect and homogeneity of product of display screen are substantially increased, there is high brightness, high comparison
The advantages that spending.
[Detailed description of the invention]
Fig. 1 is the top view of existing light emitting diode；
Fig. 2 is the side perspective view in the direction A in Fig. 1；
Fig. 3 is the side perspective view in the direction B in Fig. 1；
Fig. 4 is the bottom view of existing light emitting diode；
Fig. 5 is the top view of the application light emitting diode；
Fig. 6 is the side perspective view in the direction C in Fig. 5；
Fig. 7 is the side perspective view in the direction D in Fig. 5；
Fig. 8 is the bottom view of the application light emitting diode.
[specific embodiment]
Please refer to Fig. 5~8, the embodiment of the light emitting diode of the high flatness light-emitting surface of the application comprising package support
230, luminescence chip 220, encapsulating housing 210 on package support 230 are set, and the luminescence chip 220 is arranged in encapsulating shell
In body 210, the encapsulation glue-line 250 that upper surface is plane is equipped with above the luminescence chip 220.The luminescence chip is connected with
Conductive pin 240.The encapsulation glue-line upper surface of the light emitting diode of the application is smooth plane, improves light emitting diode
Light-emitting uniformity reduces light leakage.Substantially increase the display effect and homogeneity of product of display screen.
Specifically, the package support 230 is patch-type package support, real with the patch-type supporting structure of PPA injection molding
Existing carrier, places chip and conductive lead wire on it.
The encapsulation glue-line 250 is that liquid is molded glue-line, and the liquid molding glue-line is by liquid press moulding mode institute shape
At the structure with surface high-flatness characteristic, with it is universal at present used by the colloform texture that is formed of dispensing mode completely not
Together, manufactured herein by hydraulic model injection pressure (Molding) mode be formed by it is this with surface high-flatness characteristic
Colloid is referred to as liquid molding glue-line.This structure makes light-emitting area smooth, solves because the difference of dispensing glue amount leads to glue surface
Uneven problem, improves light-emitting uniformity and display effect.
Specifically, the encapsulation glue-line 250 uses epoxide resin material, and die bond bonding wire craft is carried out on package support 230,
Then use liquid mould pressing process that epoxy resin is coated luminescence chip and conductive lead wire to form the access of light, this light-path is
Square structure, top are the light-emitting surface of high flatness.Specifically, the encapsulation glue-line 250 is transparent misty colloid, the structure feature
Further increase light-emitting uniformity.
Specifically, the encapsulation glue-line 250 covers 210 top of encapsulating housing, with the dispensing mode generallyd use at present
The packing colloid of formation is different, and encapsulation glue-line described herein covers above the encapsulating housing, can make entire luminous two
The upper surface of pole pipe structure is even curface, the light-emitting surface with high flatness.
250 outer surface of encapsulation glue-line is concordant with 240 side of conductive pin or exceeds the conductive pin side
Face.The structure improves the flatness of entire light emitting diode construction simultaneously, including upper surface is smooth and the flatness of side surface,
And there is protective effect to pin.In the present embodiment as shown in figures 5-8,250 outer surface of encapsulation glue-line and the conduction
240 side of pin is concordant.
The luminescence chip 220 include "-" type arrangement red light chips, blue chip and green light chip 221,222,
223.It can achieve the video display effect and higher color fidelity of homogeneous.
The application also provides a kind of display device comprising the light emitting diode of high flatness light-emitting surface as described above.
The application in structure use patch-type supporting structure, on bracket formed "-" type arrangement red light chips,
Three kinds of chips of blue chip and green light chip, are connect by lead with bracket, line construction are formed, using liquid moulded package mould
Encapsulation glue-line is arranged in formula on the package support, and epoxy resin is coated luminescence chip and conductive lead wire to form the access of light, this
Light-path is square structure, and top is the light-emitting surface of high flatness, this structure makes light-emitting area smooth, solves because of dispensing glue
The difference of amount causes glue surface uneven, this phenomenon seriously affects the display effect and homogeneity of product of display screen.This structure is adopted
With the supporting structure of patch-type, so that epoxy resin when hydraulic model injection pressure is not flow to cradle back, protect cradle back
Solder pad, unlikely influence SMT welding.The specification for the LED that this structure greatly reduces, using LED can do to
1.0x1.0x0.9mm, to be P1.8, the LED display of P1.9, P2.0 provide possibility.
The foregoing is merely the preferred embodiment of the application, the protection scope of the application is not limited thereto, any to be based on
Equivalent transformation in technical scheme belongs within the application protection scope.
Claims (8)
1. a kind of light emitting diode of high flatness light-emitting surface, which is characterized in that it includes package support, is arranged in package support
On luminescence chip, encapsulating housing, the luminescence chip is arranged in encapsulating housing, and upper table is equipped with above the luminescence chip
Face is the encapsulation glue-line of plane, and the light-path that the encapsulation glue-line is formed is square structure, and top is the light-emitting surface of high flatness,
The encapsulation glue-line covers above the encapsulating housing.
2. the light emitting diode of high flatness light-emitting surface as described in claim 1, which is characterized in that the encapsulation glue-line is liquid
Morphotype moulding layer.
3. the light emitting diode of high flatness light-emitting surface as described in claim 1, which is characterized in that the encapsulation glue-line is
Bright mist colloid.
4. the light emitting diode of high flatness light-emitting surface as described in claim 1, which is characterized in that the encapsulation glue-line uses
Epoxide resin material.
5. such as the light emitting diode of the described in any item high flatness light-emitting surfaces of Claims 1 to 4, which is characterized in that the hair
Optical chip is connected with conductive pin, and the encapsulation glue-line outer surface is concordant with the conductive pin side or exceeds the conduction
Pin side.
6. such as the light emitting diode of the described in any item high flatness light-emitting surfaces of Claims 1 to 4, which is characterized in that the hair
Optical chip includes red light chips, blue chip and the green light chip of "-" type arrangement.
7. such as the light emitting diode of the described in any item high flatness light-emitting surfaces of Claims 1 to 4, which is characterized in that the envelope
Dress bracket is patch-type package support.
8. a kind of display device, which is characterized in that it includes high flatness light-emitting surface as described in any one of claims 1 to 7
Light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822232160.5U CN209544386U (en) | 2018-12-28 | 2018-12-28 | The light emitting diode and display device of high flatness light-emitting surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822232160.5U CN209544386U (en) | 2018-12-28 | 2018-12-28 | The light emitting diode and display device of high flatness light-emitting surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209544386U true CN209544386U (en) | 2019-10-25 |
Family
ID=68267369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822232160.5U Active CN209544386U (en) | 2018-12-28 | 2018-12-28 | The light emitting diode and display device of high flatness light-emitting surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209544386U (en) |
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2018
- 2018-12-28 CN CN201822232160.5U patent/CN209544386U/en active Active
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