CN210628301U

CN210628301U - LED packaging support and packaging body

Info

Publication number: CN210628301U
Application number: CN201921904985.5U
Authority: CN
Inventors: 潘静; 魏亚河; 饶臻然
Original assignee: Xiamen Xindeco Optoelectronics Co ltd
Current assignee: Xiamen Xindeco Optoelectronics Co ltd
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-05-26
Anticipated expiration: 2029-11-07

Abstract

The utility model relates to a LED encapsulates support and packaging body, wherein LED encapsulates the support and includes insulating base, inlays the metal electrode who locates in the base and the metal pin who extends by it, have a solid crystal face on the base, should solidify the crystal face and go up at least including first solid crystalline region and the solid crystalline region of second, first solid crystalline region and the solid crystalline region of second are recessed to be set up on solid crystal face, and first solid crystalline region and the solid crystalline region of second are by the base separation to when solving the many chips of current small-size lamp pearl encapsulation, the problem of the short circuit that causes because of solid brilliant silver glue overflow appears easily.

Description

LED packaging support and packaging body

Technical Field

The utility model relates to a LED encapsulates technical field, specifically relates to a LED encapsulates support and packaging body.

Background

In recent years, in the field of LED display screens, the small-space display application market is rapidly developed and expanded, and it is widely used in stadiums, cities and public squares, traffic, enterprise image propaganda, commercial advertisement, and the like. The stadium has a long watching distance and high requirements on the ambient brightness, and the LED display screen can well meet the special requirements, so that the spectators can obtain clear and vivid color images, and infinite visual enjoyment is brought to the spectators. However, due to the size of the packaging size and the heat dissipation of the traditional surface mount device LED, the LED display screen cannot be conveniently viewed in a short distance like other display media, so that the LED display screen cannot be well applied to the field of indoor high-definition display.

In order to reduce the packaging size of an LED lamp bead and meet the requirements of small dot spacing and high definition of an LED display screen, the size of an existing surface-mounted LED packaging support is smaller and smaller, so that the spacing between electrodes on the packaging support is designed to be smaller and smaller, and the problem of short circuit caused by glue overflow of crystal-fixing silver glue is easy to occur in the crystal-fixing process of red, green and blue chips.

In addition, because the red chip in the adopted chip is of a vertical chip structure, and the green chip and the blue chip are of normally-installed chip structures, the thicknesses of the red chip and the blue chip and the green chip are inconsistent, height difference exists, the operation difficulty in welding a gold wire is increased, and particularly the difficulty in welding the wire in a small space is greatly increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a LED encapsulates support to when solving current small-size lamp pearl encapsulation many chips, the problem of the short circuit that causes because of solid brilliant silver glue overflows easily appears.

The specific scheme is as follows:

an LED packaging support comprises an insulating base, a metal electrode embedded in the base and a metal pin extending out of the metal electrode, wherein the base is provided with a crystal fixing face, the crystal fixing face at least comprises a first crystal fixing area and a second crystal fixing area, the first crystal fixing area and the second crystal fixing area are arranged on the crystal fixing face in a concave mode, and the first crystal fixing area and the second crystal fixing area are isolated by the base.

Further, the first solid crystal area and the second solid crystal area are recessed to different depths.

Further, the height difference between the first solid crystal area and the second solid crystal area is 20-50 microns.

Furthermore, the metal electrodes comprise a first electrode, a second electrode, a third electrode and a fourth electrode which are arranged clockwise, the first die bonding area is located on the surface of the first electrode, and the second electrode, the third electrode and the fourth electrode are respectively provided with a welding wire area.

Furthermore, the bonding wire areas on the second electrode, the third electrode and the fourth electrode are all located on the same plane.

Furthermore, the welding wire regions on the second electrode, the third electrode and the fourth electrode are all arranged on the same level with the solid crystal plane.

Further, a metal sheet is arranged between the third electrode and the fourth electrode, and the surface of the metal sheet is the second solid crystal area.

The utility model also provides a packaging body, include as above arbitrary LED packaging support, solid brilliant many LED chips on LED packaging support, wherein solid brilliant has first LED chip on the first solid brilliant district, and solid brilliant has second LED chip on the second solid brilliant district.

Further, a first LED chip which is die-bonded on the first die bonding area is an LED red light chip, a second LED chip which is die-bonded on the second die bonding area is an LED blue light chip and/or an LED green light chip, wherein the depth of the recess of the first die bonding area is greater than the depth of the recess of the second die bonding area.

Further, the top surfaces of the LED red light chip and the LED blue light chip and/or the LED green light chip which are die-bonded on the first die bonding area and the second die bonding area are approximately flush.

The utility model provides a LED encapsulation support compares with prior art and has following advantage:

1. the utility model provides a have at least first solid crystalline region and the solid crystalline region of second on the LED encapsulation support, and the concave setting in these solid crystalline regions, when gluing at the point solid crystal, solid crystal glue by the insulating lateral wall separation around the solid crystalline region, and can not overflow to the recess outside, when gluing at the point solid crystal consequently, can set up positive deviation to ensure that the chip can be stable fix on the encapsulation support, and can not lead to the short circuit between each electrode. The yield of chip packaging is greatly improved.

2. The utility model provides a first solid crystalline region and the recessed degree of depth in second solid crystalline region on the LED packaging support are different, consequently at solid brilliant LED ruddiness chip, when LED blue light chip and LED green glow chip, the recessed difference in height in first solid crystalline region and second solid crystalline region can compensate the difference in height of LED red light chip and LED blue light chip and/or LED green glow chip, thereby make the top surface height roughly the same of LED ruddiness chip and LED blue light chip and/or LED green glow chip, subsequent bonding wire operation of being convenient for, can improve the efficiency and the yield of bonding wire greatly.

Drawings

Fig. 1 shows a perspective view of an LED package support.

Fig. 2 shows a top view of an LED package support.

Fig. 3 shows a cross-sectional view at a-a in fig. 2.

Fig. 4 shows a cross-sectional view at B-B in fig. 2.

Fig. 5 shows a cross-sectional view at C-C in fig. 2.

Fig. 6 shows a schematic view of metal electrodes within an LED package support.

Fig. 7 shows a schematic view of metal electrodes in another LED package support.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

As shown in fig. 1-6, the present embodiment provides an LED package support, which includes an insulating base 1, a metal electrode 2 embedded in the base 1, and a metal pin 20 extending therefrom. In which the base 1 is made of an insulating material such as PPA (polyphthalamide), EMC (Epoxy Molding Compound), ceramic, etc., and the metal electrode 2 is generally made of copper, iron, etc. as a base material and plated with a silver layer on the outer surface to increase the reflectivity. In this embodiment, the base 1 is made of PPA, the metal electrode 2 is made of pure copper, and the silver layer is plated on the surface thereof.

The metal electrode 2 includes a first electrode 210, a second electrode 220, a third electrode 230, and a fourth electrode 240. In this embodiment, the red light chip 30, the green light chip 31, and the blue light chip 32 are packaged on the package support as an example, and 4 electrodes are respectively used as the positive and negative electrodes of the red light chip 30, the green light chip 31, and the blue light chip 32. The red light chip 30, the green light chip 31, and the blue light chip 32 in this embodiment share an anode, specifically, the first electrode 210 serves as a cathode of the red light chip 30, the third electrode 230 serves as a cathode of the green light chip, the fourth electrode 240 serves as a cathode of the blue light chip, and the second electrode 220 serves as an anode. Although the LED package support is more advantageous when applied to the R, G, B chip package, the support is not limited thereto, and can be applied to other multi-chip packages.

The base 1 has a solid crystal surface 10, and the solid crystal surface 10 in this embodiment is a bottom surface of a bowl, that is, a solid crystal surface of an existing LED package support. The fixed crystal plane 10 at least comprises a first fixed crystal region 101 and a second fixed crystal region 102, the first fixed crystal region 101 and the second fixed crystal region 102 are arranged on the fixed crystal plane 10 in a concave mode and are blocked by the base 1, namely the first fixed crystal region 101 and the second fixed crystal region 102 are both grooves arranged on the fixed crystal plane 10 in a concave mode. In the present embodiment, the first solid crystal region 101 and the second solid crystal region 102 on the solid crystal plane 10 are taken as an example for description, but the present invention is not limited thereto, and the number of the solid crystal regions may be determined according to actual requirements.

When point solid crystal glue, solid crystal glue is obstructed by the insulating side wall around the solid crystal area, and can not overflow to the outside of the groove, so that when point solid crystal glue, positive deviation can be set, the chip can be stably fixed on the packaging support, and short circuit between electrodes can not be caused. The yield of chip packaging is greatly improved.

As a preferred embodiment of this embodiment, the first solid crystal region 101 and the second solid crystal region 102 are recessed to different depths. In this embodiment, the depth of the depressions of the first solid crystal regions 101 is greater than the depth of the depressions of the second solid crystal regions 102, wherein the depth of the depressions of the first solid crystal regions 101 is 50 micrometers, and the depth of the depressions of the second solid crystal regions 102 is 20 micrometers. In the present embodiment, the red chip 30 is die-bonded on the first die-bonding region 101, and the green chip 31 and the blue chip 32 are die-bonded on the second die-bonding region 102.

The red light chip in the existing RGB package is an AlGaInP process, the chip structure is mostly a vertical structure, the green light chip and the blue light chip are InGaN processes, and the chip structure is mostly a positive structure, so the thickness of the red light chip is different from that of the green light chip and the blue light chip. The vertical structure here means that the positive and negative electrodes of the chip structure are respectively located on the surface and bottom surface of the chip; the positive mounting structure refers to that the positive electrode and the negative electrode of the chip structure are both positioned on the surface of the chip.

Because the die bonding surfaces of the red light chip and the blue and green light chips of the existing packaging bracket are positioned on the same plane, after die bonding is finished, the heights of the positive electrodes and the negative electrodes of the red light chip and the blue and green light chips are also inconsistent and have a certain height difference. Therefore, when the bonding wire is used for bonding wires, the red light chip and the blue and green light chips cannot adopt the same process conditions, and the bonding wires are required to be separately adjusted according to the height of the red light chip and the blue and green light chips, so that the steps and the difficulty of the bonding wire process are increased, and the efficiency and the yield are reduced.

In the package support provided in this embodiment, the first die attach area 101 and the second die attach area 102 have a certain height difference, and therefore, after the red light chip and the blue and green light chips are respectively die-bonded in the first die attach area 101 and the second die attach area 102, the height difference between the first die attach area 101 and the second die attach area 102 makes up for the fact that the red light chip and the blue and green light chips are at a substantially horizontal level, and therefore, the same process conditions can be adopted for one-time wire bonding operation during wire bonding, so that the difficulty of wire bonding is greatly reduced, and the efficiency and yield of wire bonding are greatly improved.

Preferably, the surfaces of the third electrode 230, the fourth electrode 240 and the second electrode 220 are used as bonding wire areas of bonding wires, which are substantially located on the same plane, so that when the bonding wires are bonded, the height differences between the electrodes on the chip surface and the surfaces of the third electrode 230, the fourth electrode 240 and the second electrode 220 are substantially the same, and the wire bonding operation can be performed more simply to improve the efficiency of wire bonding.

In the present embodiment, the height difference between the first solid crystal region 101 and the second solid crystal region 102 is preferably 20 to 50 micrometers, and in this range, the package support has better applicability.

Referring to fig. 1 to 6, in the present embodiment, the first solid crystal region 101 is a surface of the first electrode 210 exposed to the solid crystal plane 10. Since the red light chip 30 is generally a vertical chip, the conductive silver paste is used for die bonding during die bonding, so that the die bonding effect can be achieved, and conduction between the red light chip and the first electrode 210 can also be achieved.

The green chip 31 and the blue chip 32 are die-bonded on the surface of the metal sheet 250, the metal sheet 250 may be located between the third electrode 230 and the fourth electrode 240 as shown in fig. 6, and the metal sheet 250 and the fourth electrode 240 are separated by thermoelectric separation. It is also possible to use an integrated design of the metal sheet 250 and the fourth electrode 240, as shown in fig. 7.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a LED encapsulation support, this LED encapsulation support includes insulating base, inlays the metal electrode of locating in the base and by its metal pin that extends, its characterized in that: the base is provided with a crystal fixing surface, the crystal fixing surface at least comprises a first crystal fixing area and a second crystal fixing area, the first crystal fixing area and the second crystal fixing area are arranged on the crystal fixing surface in a concave mode, and the first crystal fixing area and the second crystal fixing area are blocked by the base.

2. The LED package support of claim 1, wherein: the first solid crystal area and the second solid crystal area are recessed to different depths.

3. The LED package support of claim 2, wherein: the height difference between the first solid crystal area and the second solid crystal area is 20-50 microns.

4. The LED package support of claim 2, wherein: the metal electrodes comprise a first electrode, a second electrode, a third electrode and a fourth electrode which are arranged clockwise, the first die bonding area is located on the surface of the first electrode, and the second electrode, the third electrode and the fourth electrode are respectively provided with a welding wire area.

5. The LED package support of claim 4, wherein: and the welding wire areas on the second electrode, the third electrode and the fourth electrode are all positioned on the same plane.

6. The LED package support of claim 5, wherein: and the welding wire regions on the second electrode, the third electrode and the fourth electrode are all arranged on the same level with the solid crystal plane.

7. The LED package support of claim 4, wherein: and a metal sheet is arranged between the third electrode and the fourth electrode, and the surface of the metal sheet is the second solid crystal area.

8. A package, characterized in that: the LED packaging structure comprises the LED packaging support as claimed in any one of claims 1 to 7, and a plurality of LED chips die-bonded on the LED packaging support, wherein a first LED chip is die-bonded on the first die-bonding region, and a second LED chip is die-bonded on the second die-bonding region.

9. The package of claim 8, wherein: the first LED chip which is die-bonded on the first die bonding area is an LED red light chip, the second LED chip which is die-bonded on the second die bonding area is an LED blue light chip and/or an LED green light chip, wherein the depth of the recess of the first die bonding area is greater than the depth of the recess of the second die bonding area.

10. The package of claim 9, wherein: the top surfaces of the LED red light chip and the LED blue light chip and/or the LED green light chip which are die-bonded on the first die bonding area and the second die bonding area are approximately flush.