JP2011100853A - Method of manufacturing led device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing LED devices each having a conventionally known structure whose light extraction efficiency is good at low cost using techniques capable of mass-producing them. <P>SOLUTION: The method of manufacturing LED devices in which a plurality of LED devices 10 are simultaneously manufactured by mounting a plurality of LED elements 5 on a large-size circuit board 2L, and cutting and separating the respective LED elements 5 after coating the respective LED elements 5 with a fluorescent resin 8 in which fluorescent particles are mixed, includes steps of: mounting the plurality of LED elements 5 on the large-size circuit board 2L at predetermined intervals; coating the plurality of LED elements 5 with a transparent resin 7; forming grooves in the transparent resin 7 between the LED elements 5 by half-dicing up to the vicinity of the top of the large-size circuit board 2; coating the upper surface of the transparent resin 7 and the grooves 7a with the fluorescent resin 8; and cutting and separating the fluorescent resin 8 and large-size circuit board 2L at intermediate positions of the grooves 7a in the transparent resin 7. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an LED device coated with a fluorescent resin. Specifically, a plurality of LED elements are mounted on a large circuit board, and each LED element is covered with a fluorescent resin, and then cut and separated. The present invention relates to a method for manufacturing an LED device for simultaneously manufacturing the LED device.

  In recent years, LED elements, which are semiconductor elements, have long life and excellent driving characteristics, and are also widely used in backlights and lighting of color display devices because they are small, have high luminous efficiency and have a bright emission color. It has come to be.

  In particular, a white light emitting element by a combination of a blue LED and a YAG phosphor has been developed, and a method for improving light extraction efficiency from an LED device in which the LED element is covered with a phosphor has been proposed (for example, Patent Document 1). ).

  Hereinafter, a conventional LED device in Patent Document 1 will be described. FIG. 4 is a cross-sectional view of the LED device in Patent Document 1. In FIG. 4, the LED device 100 uses the first lead 101 and the second lead 102 as external terminals, and after the LED element 105 mounted on the first lead 101 and the second lead 102 are connected by the wire 103, the whole is made of a transparent resin 107. And the surface of the transparent resin 107 is covered with a fluorescent cover 108 such as a fluorescent resin.

  As the operation of the LED device 100, the LED element 105 emits light by supplying a driving voltage to the first lead 101 and the second lead 102 which are two external terminals, and this radiated light passes through the transparent resin 107. Then, the light enters the fluorescent cover 108. The incident light is wavelength-converted by colliding with the fluorescent particles in the fluorescent cover 108 and is emitted as outgoing light having different wavelengths.

  In the LED device 100, if the LED element 105 is a blue LED and the mixed fluorescent particles of the fluorescent cover 108 are YAG fluorescent particles, the emitted light becomes pseudo white light, and the LED element 105 is a near-ultraviolet LED and the fluorescent cover 108 If the mixed fluorescent particles are arbitrary color fluorescent particles, the emitted light becomes arbitrary color light.

Compared with the configuration of the LED device in which the LED element is directly covered with the fluorescent resin, the configuration of the LED device 100 is transparent because the phosphor is added only to the fluorescent cover 108 and not added to the transparent resin 107. Light scattering by the fluorescent particles does not occur in the resin 107, and the collision between the fluorescent particles and the incident light occurs only in the fluorescent cover 108 on the surface. As a result, since the light scattering loss due to the phosphor is reduced in the relatively thin fluorescent cover 108 as a whole, the LED light-emitting device can suppress the decrease in luminance due to wavelength conversion and can improve the light extraction efficiency.

  As a technical item different from the improvement of light extraction efficiency, there is a method of mass-producing LED devices. As a manufacturing method for efficiently obtaining an LED device on a chip, a plurality of LED elements are mounted on a large circuit board, each LED element is covered with a fluorescent resin mixed with fluorescent particles, and then cut and separated. An LED device manufacturing method for simultaneously manufacturing a plurality of LED devices has been proposed (for example, Patent Document 2).

Next, the manufacturing method of the LED device described in Patent Document 2 will be described.
FIG. 5 is a process diagram of the manufacturing method of the LED device in Patent Document 2, and shows a cross section of each element.

As shown in FIG. 5A, the LED element wafer 205L is attached on the dicing sheet 201, and the LED wafer 205L is fully diced to a desired size vertically and horizontally as shown in FIG. 205 is formed. Next, as shown in FIG.5 (c), the dicing sheet 201 is expanded to a desired magnitude | size, and the space | interval of each LED element 205 is expanded.
Next, as shown in FIG. 5D, the terminal electrodes of the LED elements 205 arranged on the expanded tape 201 and the wiring electrodes provided on the circuit board 202 are electrically fixed.

  Next, as shown in FIG. 5 (e), the entire LED element 205 including the gaps and surroundings of the LED elements 205 is covered with a fluorescent resin 208, and then the LED elements 205 are cut and separated by a dicing blade 209. Thus, as shown in FIG. 5F, the LED device 200 in which the LED element 205 mounted on the circuit board 202 is covered with the fluorescent resin 208 is obtained.

Japanese Patent Laid-Open No. 10-200165 Japanese Patent Laid-Open No. 10-144631

  In the LED device 100 described in Patent Document 1 shown in FIG. 4, light scattering by the fluorescent particles does not occur in the transparent resin, and the collision between the fluorescent particles and the incident light occurs only in the fluorescent cover 108 on the surface. That is, since the fluorescent cover 108 is relatively thin as a whole, there is little loss caused by light scattering by the phosphor, and a reduction in luminance due to wavelength conversion can be suppressed to a minimum, and there is an advantage that light extraction efficiency is improved. However, the LED device after molding the transparent resin 107 has a problem that it is not suitable for mass production because the fluorescent cover 108 must be formed individually.

  Further, in the LED device 200 described in Patent Document 2 shown in FIG. 5, a plurality of LED elements 205 are mounted on a large circuit board 202, and each LED element 205 is covered with a fluorescent resin 208 mixed with fluorescent particles. Since a plurality of LED devices 200 can be manufactured by cutting and separating simultaneously, mass productivity is good. However, since the LED element 205 is directly covered with the fluorescent resin 208, there is a problem that the luminance is often lowered due to wavelength conversion, and the light extraction efficiency cannot be improved.

  Accordingly, in view of the above problems, an object of the present invention is to produce an LED device having a high light extraction efficiency as shown in Patent Document 1 using a technology capable of mass production as shown in Reference Document 2. It is to provide a manufacturing method.

  In order to achieve the above object, a manufacturing method according to the present invention includes mounting a plurality of LED elements on a large circuit board, coating each LED element with a fluorescent resin mixed with fluorescent particles, and then cutting and separating the plurality of LED elements. In a manufacturing method of an LED device for simultaneously manufacturing an LED device, a step of mounting a plurality of LED elements on a large circuit board at a predetermined interval, a step of covering the plurality of LED elements with a transparent resin, and the LED element A step of forming a groove to the vicinity of the circuit board by half dicing between the transparent resin, a step of covering the upper surface and the groove of the transparent resin with the fluorescent resin, and the fluorescent resin and the circuit board to the transparent resin. And a cutting and separating step of cutting and separating at an intermediate position of the groove.

  According to the above manufacturing method, an LED device with good light extraction efficiency can be mass-produced at low cost using a technology capable of mass production.

  The process of mounting the LED elements is a wafer dicing process in which each LED element is formed by sticking the LED element wafer onto a dicing sheet and then fully dicing the desired size vertically and horizontally, and the dicing sheet is expanded to a desired size. Expanding the interval between the LED elements to a desired width, positioning the LED elements on the expanded tape on the wiring electrodes on the large circuit board, and the terminal electrodes of the LED elements and the wiring electrodes provided on the large circuit board It is preferable to have an LED element mounting step for electrically fixing the LED.

  The LED element is preferably flip-chip mounted on the circuit board.

  As described above, according to the present invention, a step of mounting a plurality of LED elements on a large circuit board at a predetermined interval, a step of covering the plurality of LED elements with a transparent resin, and the transparency between the LED elements Forming a groove to the vicinity of the circuit board by half dicing, covering the upper surface and the groove of the transparent resin with a fluorescent resin, and placing the fluorescent resin and the circuit board between the grooves of the transparent resin. Since a plurality of LED devices can be manufactured at the same time by cutting and separating at a position, an LED device having a high light extraction efficiency can be mass-produced at low cost using a technology that can be mass-produced.

It is sectional drawing which shows the structure of the LED device manufactured by the manufacturing method of this invention. It is process drawing which shows the manufacturing method of the LED apparatus in the aggregate substrate system which is 1st Embodiment of this invention, and has shown the cross section of each element. It is process drawing which shows the manufacturing method of the LED apparatus in the collective substrate system which is 2nd Embodiment of this invention. It is sectional drawing of the conventional LED device. It is process drawing which shows the manufacturing method of the conventional LED device.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of an LED device manufactured by the manufacturing method of the present invention. 2 and 3 are process diagrams showing a manufacturing method of the LED device in the collective substrate system according to the first embodiment and the second embodiment of the present invention, and show cross sections of each element.
(First embodiment)

  In FIG. 1, wiring electrodes 2a and external connection electrodes 2b are provided on the upper and lower surfaces of the circuit board 2, and the wiring electrodes 2a and external connection electrodes 2b are connected via through-hole electrodes 2c. The LED element 5 provided with the bump electrode 5a is flip-chip mounted on the wiring electrode 2a. Further, the LED element 5 is covered with a transparent resin 7, and the entire periphery of the transparent resin 7 is covered with a fluorescent agent resin 8.

  Next, the operation of the LED device 10 will be described. By supplying a driving voltage to the two external connection electrodes 2b, the LED element 5 emits light, and the emitted light passes through the transparent resin 7 and then enters the fluorescent resin 8. The incident light is converted in wavelength by colliding with fluorescent particles in the fluorescent resin 8 and is emitted as outgoing light having different wavelengths.

  In the LED device 10, if the LED element 5 is a blue LED and the fluorescent particles mixed with the fluorescent resin 8 are YAG fluorescent particles, the emitted light becomes pseudo white light, the LED element 5 is a near-ultraviolet LED, and the fluorescent resin 8 If the mixed fluorescent particles are arbitrary color fluorescent particles, the emitted light becomes arbitrary color light.

  Compared with the configuration of the LED device in which the LED element is directly covered with the fluorescent resin, according to the configuration of the LED device 10, the phosphor is added only to the fluorescent resin 8 and not added to the transparent resin 7, Light scattering by the fluorescent particles does not occur in the transparent resin 7, and the collision between the fluorescent particles and the incident light occurs only in the fluorescent resin 8 on the surface. That is, since the light scattering loss is reduced in the relatively thin fluorescent resin 8 as a whole, the LED device is suppressed to the minimum in luminance due to wavelength conversion, and the light extraction efficiency is improved.

Next, a method for manufacturing an LED device in the collective substrate system according to the first embodiment of the invention will be described with reference to FIG. 2A shows an LED mounting process in which a plurality of LED elements 5 are mounted on a top surface of a large circuit board 2L in a collective substrate system at a predetermined interval, and FIG. 2B shows a plurality of LED elements 5 covered with a transparent resin 7. FIG. 2C shows a step of transparent resin coating between the LED elements 5 according to the cutting line S1 shown by the dotted line in FIG. 2B, and half-dicing the surface of the large circuit board 2L to the groove 7a. 2 (d) is a fluorescent resin coating step in which the upper surface of the transparent resin 7 and the groove 7a are covered with the fluorescent resin 8. FIG. 2 (e) is a cut shown by a dotted line in FIG. 2 (d). This is a cutting / separating step of fully dicing the fluorescent resin 8 and the large-sized circuit board 2L according to the line S2 to cut and separate the LED device.
In this cutting and separating step, a plurality of LED devices 10 shown in FIG. 1 are simultaneously produced by cutting and separating at the intermediate position of the groove 7 a of the transparent resin 7.
(Second Embodiment)

  Next, a method for manufacturing an LED device in the collective substrate system according to the second embodiment of the present invention will be described with reference to FIG. The method for manufacturing the LED device in the second embodiment shown in FIG. 3 has basically the same parts as the method for manufacturing the LED device in the first embodiment shown in FIG. A duplicate description will be omitted.

  That is, the difference between the manufacturing method of the LED device in the second embodiment and the manufacturing method of the LED device in the first embodiment is that a plurality of LED elements 5 are mounted on the upper surface of the large circuit board 2L at a predetermined interval. It is added. FIG. 3 (x) shows a wafer dicing process in which the LED element wafer 5L is bonded onto the dicing sheet 1 and full dicing is performed to a desired size vertically and horizontally to form each LED element 5, and FIG. 3 (y) is a dicing sheet. 1 is expanded to a desired size to expand the space between the LED elements 5 to a desired width. FIG. 3 (z) shows the expanded tape 1 on the large circuit board 2 </ b> L by inverting it as indicated by a dashed line. This is an LED element mounting step in which the terminal electrode of the LED element 5 and the wiring electrode provided on the large circuit board 2L are electrically fixed to each other.

  3 (x) (y) (z) completes an LED mounting process in which a plurality of LED elements 5 are mounted on the upper surface of the large circuit board 2L shown in FIG. 2 (a) at a predetermined interval. The subsequent steps up to FIGS. 3A to 3E are the same as the steps of FIGS. 2A to 2E.

  In addition, the method of arrange | positioning the LED element 5 on the large format circuit board 2 is not restricted to the method described in 2nd Embodiment. The LED elements 5 may be arranged on the large circuit board 2 with a sorter in which the coordinate positions are stored in advance, or the LED elements 5 may be arranged on the large circuit board 2 using a positioning frame.

  As described above, according to the present invention, only a few steps are added to the manufacturing method of the LED device in the collective substrate system described in the cited document 2, which is highly mass-productive. It is possible to inexpensively mass-produce LED devices with low light loss and low light intensity due to wavelength conversion and with minimal light extraction efficiency.

1,201 Expand sheet 2,202 Circuit board 2a Wiring electrode 2b External connection electrode 2c Through-hole electrode 2L 202L Large format circuit board,
5, 105, 205 LED element 5a Bump electrode 7, 107 Transparent resin 7a Groove 8 Fluorescent resin 10, 100, 200 LED device 208 Fluorescent cover S1, S2 Cut gland

Claims (3)

  In a method for manufacturing an LED device, a plurality of LED elements are mounted on a large circuit board, each LED element is covered with a fluorescent resin mixed with fluorescent particles, and then cut and separated to simultaneously manufacture a plurality of LED devices. A step of mounting a plurality of LED elements on the circuit board at predetermined intervals, a step of covering the plurality of LED elements with a transparent resin, and a transparent resin between the LED elements by half dicing. A step of forming a groove to the vicinity, a step of covering the upper surface and the groove of the transparent resin with a fluorescent resin, and a cutting and separating step of cutting and separating the fluorescent resin and the circuit board at an intermediate position of the groove of the transparent resin. The manufacturing method of the LED device characterized by having.   The process of mounting the LED elements includes a wafer dicing process in which each LED element is formed by sticking an LED element wafer on a dicing sheet and fully dicing vertically and horizontally to a desired size. Expanding and expanding the space between each LED element to a desired width, positioning the LED element on the expanded tape on the wiring electrode on the large circuit board, and the wiring provided on the terminal electrode of the LED element and the large circuit board The LED device manufacturing method according to claim 1, further comprising: an LED element mounting step for electrically fixing the electrodes. The method of manufacturing an LED device according to claim 1, wherein the LED element is flip-chip mounted on a circuit board.

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