JP5254422B2 - LED light source - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost LED light source. <P>SOLUTION: An RGB three primary color LED light source 1A or a white LED light source which lights up in the shape of a frame 3 is manufactured by mounting LED chips (sets of red LED chips (R), green LED chips (G) and blue LED chips (B), or white LED chips) on the frame 3, and then die-cutting tie bars to form an electric circuit without dicing the frame 3 for making LED chips to individual pieces. Electrode planes of the plural LED chips, having the same polarity, are electrically connected, respectively. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an LED (Light Emitting Diode) light source and a manufacturing technique thereof, and more particularly to a technique effective when applied to an LED light source using a visible LED.

  2. Description of the Related Art In recent years, LEDs have been widely used in backlights and flashlights for mobile phone liquid crystal displays, light sources for office automation equipment such as traffic signals, printers, and luminaires as brightness increases.

  For example, an LED light source device that dissipates heat generated from each LED of a plurality of mounted LEDs from a heat sink and efficiently conducts heat to an attached lighting fixture housing is disclosed (for example, a patent) Reference 1).

JP 2004-55229 A (paragraphs [0024] to [0025], FIG. 1)

  One LED is a point light source that emits light from a cube of 0.2 to 3 mm square, and the light emitted from one LED is as small as about 1 to 2 lumens. For this reason, when LED is used as a light source for illumination, a plurality of LEDs are gathered and used in order to compensate for insufficient illuminance or to irradiate a wide area. For example, in the case of using LEDs for the backlight of a 32-inch liquid crystal screen, 960 individual LEDs are required, and these individual LEDs are arbitrarily mounted on a printed wiring board as desired. Brightness is secured. A uniform and bright liquid crystal screen can be obtained by efficiently sending the luminous flux emitted from the LED in one direction at a wide angle.

  However, when comparing fluorescent lamps and LEDs having the same luminous efficiency only with simple numerical values, an illumination light source using a plurality of LEDs is more expensive than an illumination light source using a single fluorescent lamp, and LED will be used in the future. As one of the problems required for the light source, the price reduction of the LED light source is cited. Since an LED light source is manufactured by individually mounting a large number of individual LEDs on a printed wiring board, a huge amount of mounting time and number of mounting processes are required. This is one of the causes for increasing the price of LED light sources.

  The objective of this invention is providing the technique which can implement | achieve price reduction of an LED light source.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The LED light source of the present invention includes a plurality of die bond areas arranged along a first direction at a predetermined interval, a plurality of wire bond areas arranged along a first direction so as to face the die bond area, and a die bond A basic frame composed of a first lead connected to the area and extending in the first direction and a second lead connected to the wire bond area and extending in the first direction is one in a second direction perpendicular to the first direction. It has a frame that is arranged in rows or two or more rows, and a plurality of LEDs are mounted on the frame, and lights up in the state of the frame.

  The LED light source manufacturing method of the present invention includes a step of bonding an LED chip to a plurality of die bond areas of a frame, a step of connecting opposing LED chips and wire bond areas with bonding wires, an LED chip, a die bond area, and a bonding It has a step of forming an LED by sealing a wire and a wire bond area with a resin, and a step of punching a plurality of tie bars provided in a frame.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  After mounting a plurality of LEDs on a frame, an LED light source manufactured by arbitrarily mounting individualized LEDs on a wiring board by punching a tie bar and manufacturing an LED light source that lights in the state of the frame; In comparison, the manufacturing process is shortened and various materials necessary for mounting are not required, so that the material cost can be reduced and the price of the LED light source can be reduced.

It is a principal part top view of the LED light source using red LED by this Embodiment 1, green LED, and blue LED. It is a principal part top view of the LED light source using white LED which covers the blue LED chip by this Embodiment 1 with a fluorescent substance. It is process drawing of the manufacturing method of the backlight by this Embodiment 1. FIG. FIG. 4 is a plan view and a cross-sectional view of main parts of two rows of frames according to the first embodiment. It is principal part sectional drawing of the LED light source in each manufacturing process by this Embodiment 1. FIG. It is principal part sectional drawing of the backlight in each manufacturing process by this Embodiment 1. FIG. 1 is a schematic diagram of a transmissive liquid crystal display device with a built-in backlight according to Embodiment 1. FIG. FIG. 6 is a plan view of a main part of the first frame of the first row, the second row, and the third row according to the first embodiment. FIG. 5 is a plan view of a main part of the first row of 4 rows and 5 rows according to the first embodiment. FIG. 6 is a plan view of a main part of the first and second rows of second frames according to the first embodiment. FIG. 6 is a plan view of a main part of the third and fourth rows of second frames according to the first embodiment. FIG. 6 is a plan view of a main part of a six-row frame according to the first embodiment. FIG. 6 is a plan view of a main part of two rows of third frames according to the first embodiment. FIG. 6 is a plan view of a main part of two rows of fourth frames according to the first embodiment. It is a principal part top view of the LED light source which shows the 1st example of arrangement | positioning of red LED by this Embodiment 1, green LED, and blue LED. It is a principal part top view of the LED light source which shows the 2nd example of arrangement | positioning of red LED by this Embodiment 1, green LED, and blue LED. It is a principal part top view of the LED light source which shows the 3rd example of arrangement | positioning of red LED by this Embodiment 1, green LED, and blue LED. It is a principal part top view of the LED light source which shows the 4th example of arrangement | positioning of red LED by this Embodiment 1, green LED, and blue LED. It is a principal part top view of the LED light source for demonstrating the repair method by this Embodiment 1. FIG. It is a schematic diagram of the LED light source assembling apparatus using the reel-to-reel method according to the first embodiment. The principal part top view of the LED light source by this Embodiment 2 is shown. It is a principal part top view of an LED light source provided with the flame | frame of 2 rows which described the applied voltage by this Embodiment 3. FIG. It is a principal part top view of an LED light source provided with the flame | frame of 2 rows which described the applied voltage by this Embodiment 3. FIG. It is a principal part top view of an LED light source provided with the flame | frame of 2 rows which described the applied voltage by this Embodiment 3. FIG. It is a principal part top view of an LED light source provided with the flame | frame of 4 rows which described the applied voltage by this Embodiment 3. FIG. It is a schematic diagram which shows the connection method of the LED light source and power supply by this Embodiment 3. It is principal part sectional drawing of the LED light source using the flat type reflecting plate by this Embodiment 4. It is principal part sectional drawing of the LED light source using the flat type reflecting plate by this Embodiment 4. It is principal part sectional drawing of the LED light source using the concave-shaped reflecting plate by this Embodiment 4. It is principal part sectional drawing of the LED light source using the concave-shaped reflecting plate by this Embodiment 4. It is principal part sectional drawing of the LED light source using the concave-shaped reflecting plate by this Embodiment 4.

  In this embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. Some or all of the modifications, details, supplementary explanations, and the like are related.

  Further, in this embodiment, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), unless otherwise specified, or in principle limited to a specific number in principle. The number is not limited to the specific number, and may be a specific number or more. Further, in the present embodiment, the constituent elements (including element steps and the like) are not necessarily essential unless particularly specified and apparently essential in principle. Yes. Similarly, in this embodiment, when referring to the shape, positional relationship, etc. of the component, etc., the shape, etc. substantially, unless otherwise specified, or otherwise considered in principle. It shall include those that are approximate or similar to. The same applies to the above numerical values and ranges.

  In the present embodiment, the frame refers to a plurality of die bond areas arranged with a predetermined interval in the first direction, a plurality of wire bond areas arranged opposite to the die bond area in the first direction, and a die bond. A basic frame composed of a first lead connected to the area and extending in the first direction and a second lead connected to the wire bond area and extending in the first direction is repeated in one or more rows in the second direction. Says the formed metal framework.

  In the drawings used in the present embodiment, hatching may be added even in a plan view for easy understanding of the drawings. Furthermore, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
The structure of the LED light source according to the first embodiment will be described with reference to FIGS. FIG. 1 is a plan view of a main part of an LED light source (hereinafter simply referred to as RGB three primary color LED light source) 1A using three LEDs of RGB three primary colors red LED (R), green LED (G) and blue LED (B). FIG. 2 is a plan view of an essential part of an LED light source (hereinafter simply referred to as a white LED light source) 1B using a white LED (W) that covers a blue LED chip with a phosphor. The RGB three-primary-color LED light source 1 </ b> A has advantages in that the peak of the emission spectrum of each color appears remarkably, so that a clear color is obtained and the color reproducibility is good. Since the white LED light source 1B is composed of one LED that emits white light, the distance from the white LED light source 1B to the diffusion plate 10 can be shortened, and the backlight 4 is thinner than when the RGB three primary color LED light source 1A is used. (For example, a thickness of about 0.35 mm) is possible.

  The RGB three-primary-color LED light source 1A is a strip-shaped light emitter in which a plurality of red LEDs (R), green LEDs (G), and blue LEDs (B) are arranged at arbitrary intervals, and the white LED light source 1B is optional. A plurality of white LEDs (W) are arranged at intervals, and a frame 3 from which tie bars are removed is used as a substrate for the RGB three primary color LED light sources 1A and the white LED light sources 1B. In addition, although the number of columns of the basic frame of the frame 3 shown in FIGS. 1 and 2 is two, it may be one or three or more.

  The manufacturing method of the backlight comprised from the RGB three primary color LED light source by this Embodiment 1 is demonstrated in order of a process using FIGS. FIG. 3 is a process diagram of a method for manufacturing a backlight, FIG. 4A is a plan view of the main part of the frame 3 in two rows, and FIG. 4B is a cross-sectional view of the main part taken along the line AA 'in FIG. FIG. 5 is a cross-sectional view of main parts of the RGB three primary color LED light source 1A in each manufacturing process, and FIG. 6 is a cross-sectional view of main parts of the backlight 4 in each manufacturing process. Further, FIG. 7 shows an example of a schematic diagram of a transmissive liquid crystal display device 5 incorporating a backlight 4.

  First, as shown in FIGS. 4A and 4B, the die bond area 3a for mounting the LED chip, the first suspension lead 3c connecting the die bond area 3a and the first lead 3b, and the die bond area 3a are opposed to each other. A plurality of product regions 3A composed of the wire bond area 3d and the second suspension lead 3f connecting the wire bond area 3d and the second lead 3e, and a tie bar disposed between the plurality of product regions 3A A frame 3 having 3B is prepared. The frame 3 is made of, for example, copper (Cu) as a base material, and the surface thereof is subjected to silver (Ag) plating (step P1 in FIG. 3). The thickness of the frame 3 is, for example, about 100 to 300 μm, and the width (width indicated by w in the figure) is, for example, about 15 to 20 mm.

  Next, as shown in FIG. 5A, a paste material is applied to one end (die bond area) of the frame 3, the LED chip 2c is lightly pressed on the paste material, and the paste is applied at a temperature of about 100 to 200 ° C. The material is cured. As a result, the LED chip 2c and the frame 3 are mechanically fixed and electrically connected (step P2 in FIG. 3).

  The LED chip 2c is, for example, a GaP LED chip. The LED chip 2c can be formed, for example, as follows in units of chips on a semiconductor wafer in a manufacturing process called a pre-process or a diffusion process. For example, an n-type semiconductor layer and a p-type semiconductor layer are sequentially formed by an epitaxial crystal growth method on a semiconductor substrate made of single crystal GaP (or single crystal GaAs) (at this stage, a planar thin semiconductor plate called a semiconductor wafer). Thus, a light emitting layer is formed. Subsequently, the back surface of the semiconductor substrate is ground to reduce the thickness of the semiconductor substrate to a predetermined thickness, and the back surface of the semiconductor substrate is further polished. Subsequently, after forming a p-side electrode electrically connected to the p-type semiconductor layer and an n-side electrode electrically connected to the semiconductor substrate, the electrical and optical characteristics of each LED chip 2c are measured. For example, when a semiconductor substrate is placed on a measuring stage, a probe (probe) is brought into contact with the p-side electrode and a signal waveform is input from the input terminal, the signal waveform is output from the output terminal. The characteristic of each LED chip 2c is obtained by reading this by a tester. Thereafter, the semiconductor substrate is diced and divided into LED chips 2c of about 0.2 to 3 mm square.

  Next, as shown in FIG. 5B, the other end (wire bond area) of the frame 3 facing the LED chip 2c and the p-side electrode are connected using a bonding wire 6 (step of FIG. 3). P3). At this time, the bonding wire 6 has a raised loop shape so as not to touch the peripheral portion of the LED chip 2c.

  Next, as shown in FIG. 5 (c), the frame 3 is set in the mold 7, the resin 8 liquefied by raising the temperature is pumped and poured into the mold 7, and the LED chip 2c, die bond area, bonding The wire 6 and the wire bond area are sealed with the resin 8 to form the LED 2 (process P4 in FIG. 3). Subsequently, unnecessary resin 8 and burrs are removed. Next, as shown in FIG. 5 (d), the tie bar of the frame 3 is punched using the cutting machine 7a (step P5 in FIG. 3). Thereby, the RGB three primary color LED light source 1A shown in FIG. 1 is substantially completed.

  Next, as shown in FIG. 6A, the reflecting plate 9 is fitted between the irradiation surface sides of the adjacent LEDs 2 of the RGB three primary color LED light sources 1A (step P6 in FIG. 3). In general, when an LED light source generates heat, the light emission efficiency decreases and color unevenness occurs. Therefore, for example, in order to prevent light from leaking to the back surface and increase the light emission efficiency of the LED light source, a reflector made of a sheet (film or plate) is installed. Subsequently, as shown in FIG. 6B, the diffusion plate 10 of the RGB three primary color LED light source 1A is installed on the irradiation surface side (process P7 in FIG. 3). The diffuser plate 10 is a translucent sheet (film or plate) that scatters or diffuses light, and is mainly used to make the entire wide surface uniform brightness.

  Next, as shown in FIG. 6C, prism sheets 11a and 11b are installed on the diffusion plate 10 (process P8 in FIG. 3). The prism sheets 11a and 11b are sheets (films or plates) having a forward light collecting effect, and have a sawtooth shape or an uneven shape in cross section. Subsequently, as shown in FIG. 6D, the board 13 is installed on the back surface of the RGB three primary color LED light source 1A via the insulating film 12 (process P9 in FIG. 3). Thereby, the backlight 4 is substantially completed. The board 13 is an aluminum (Al) plate, for example, and functions as a heat sink in addition to holding the RGB three primary color LED light sources 1A.

  Thereafter, as shown in FIG. 7, the backlight 4 is installed on the back surface of the liquid crystal display element 14, whereby the liquid crystal display device 5 incorporating the backlight 4 is substantially completed. The liquid crystal display element 14 is composed of, for example, a laminate of a polarizing plate 14a, a liquid crystal element 14b, a color filter 14c, a polarizing plate 14d, and a half mirror 14e. The polarizing plate 14a is a plate or film that restricts the vibration of light waves in one direction, and the color filter 14c is a filter for displaying the three primary colors of RGB.

  In addition, although the manufacturing method of the backlight 4 which mounts RGBA primary color LED light source 1A was demonstrated in the said FIG. 6, the backlight which mounts white LED light source 1B can also be manufactured by the same method.

  Thus, in this Embodiment 1, after LED2 (red LED (R), green LED (G) and blue LED (B), or white LED (W)) is mounted on the frame 3, LED2 is separated into pieces. An electric circuit is formed by removing the tie bar without dicing the frame 3 for conversion into an RGB three-primary-color LED light source 1A or white LED light source 1B that is lit in the state of the frame 3. This cuts the LED from the lead frame and shortens the manufacturing process compared to an LED light source manufactured by arbitrarily mounting the separated LED on the wiring board, and bonding the wiring board and the LED to the wiring board. This eliminates the need for a paste material or the like to reduce the material cost. As a result, the price of the RGB three primary color LED light source 1A or the white LED light source 1B can be reduced.

(Frame shape)
FIG. 4 illustrates the two rows of frames 3 in which die bond areas and tie bars are alternately arranged, but the shape of the frame is not limited to this. Hereinafter, various shapes of the frame according to the first embodiment are illustrated in FIGS.

  The planar shape of the first frame used mainly as a single body is shown in FIGS. 8 (a), (b) and (c) are plan views of the main parts of the first, second and third rows of first frames 15a, 15b and 15c, and FIGS. 9 (a) and 9 (b) are four rows and It is a principal part top view of 1st flame | frame 15d, 15e of 5 rows.

  Next, FIGS. 10 and 11 show the planar shape of the second frame mainly used in combination. FIGS. 10A and 10B are main part plan views of the first and second rows of second frames 16a and 16b, and FIGS. 11A and 11B are the third and fourth rows of second frames 16c and 16d. FIG. In the second frames 16a to 16d, pitches in the y direction of the die bond area 17 (a direction perpendicular to the arrangement direction of the guide holes CN of the second frames 16a to 16d, the second direction) are arranged at equal intervals. When a frame having five or more columns is required, the frame is manufactured by selecting any one of the second frames 16a to 16d of the first to fourth columns and combining them. That is, an (n + m) column frame can be manufactured by combining an n column frame and an m column frame.

  FIG. 10B is a plan view of an essential part of six rows of frames 18 formed by combining the two rows of second frames 16b shown in FIG. 10B and the four rows of second frames 16d shown in FIG. 11B. Is shown in FIG. Also in the six rows of frames 18 formed in combination, the pitches of the die bond areas 17 in the y direction can be set at equal intervals. For the bonding of the second frame 16b and the second frame 16d, for example, an adhesive tape or the like is used. It should be noted that three rows of second frames 16b shown in FIG. 10B may be combined to form six rows of frames, or three rows of second frames shown in FIG. 11A. Two frames 16c may be combined to form a six-row frame. Furthermore, it is possible to form seven or more rows of frames by combining a plurality of second frames 16a to 16d, and an LED light source having a relatively large area can be realized.

  Next, FIG. 13 shows a planar shape of a third frame in which the area of the die bond area is relatively large and a plurality of LEDs can be mounted on one die bond area. FIG. 13A is a plan view of a main part of a third row 19 of two rows in which three LEDs can be mounted in one die bond area 17a, and FIG. 13B is a diagram of red LEDs, green LEDs, and blue LEDs. It is a principal part top view of the 3rd flame | frame 19 which mounted three LED in the one die bond area 17a. A broken line shown in FIG. 13B indicates the resin 20, and three LEDs, one die bond area 17 a, three bonding wires 6, and three wire bond areas are sealed with one resin 20. The In the third frame 19, since the width of the die bond area 17 can be widened, for example, the heat radiation efficiency can be improved as compared with the first frame 15b shown in FIG. 8B. The third frame 19 is mainly used for the RBG 3 primary color LED light source 1A. In order to further improve the white efficiency, a third frame on which four LEDs (for example, one red LED, two green LEDs, and one blue LED) are mounted can be used. At this time, the number of wire bond areas facing the die bond area 17a is also the same as the number of LEDs.

  Next, FIG. 14 shows a planar shape of the fourth frame in which one LED is mounted in one die bond area, and the die bond areas and the tie bars are not alternately arranged, and the tie bars are provided with a plurality of die bond areas interposed therebetween. . FIG. 14A shows three die bond areas 17 arranged continuously in the x direction (a direction parallel to the arrangement direction of the guide holes CN of the fourth frame 22; the first direction) as one region. FIG. 14B is a plan view of the main part of the fourth frame 22 provided with tie bars 21 so as to divide the regions, and FIG. 14B shows three LEDs of the red LED, the green LED and the blue LED. 4 is a plan view of a main part of a fourth frame 22 mounted on each die bond area 17; FIG. The broken line shown in FIG. 14B indicates the resin 20, and three LEDs, three die bond areas 17, three bonding wires 6 and three wire bond areas are sealed with one resin 20. The The fourth frame 22 is mainly used for the RBG three-primary-color LED light source 1A, like the third frame 19 described above. In order to further improve the white efficiency, a fourth frame in which four LEDs (for example, one red LED, two green LEDs, and one blue LED) are mounted in the one area can be used. .

(LED arrangement pattern)
In the RBG 3 primary color LED light source 1A, white efficiency can be improved by increasing the number of green LEDs mounted on the frame as compared with the number of other red LEDs or blue LEDs. Hereinafter, various arrangements of the red LED, the blue LED, and the green LED for improving the white efficiency according to the first embodiment are illustrated in FIGS. 15 to 18. For the frame, four rows of second frames 16d (FIG. 11B) in which die bond areas 17 are arranged at equal intervals in the y direction are used.

  FIG. 15 shows three primary colors of RGB in which odd rows in the x direction are alternately arranged with red LEDs (R) and green LEDs (G), and even numbers in the x direction are alternately arranged with green LEDs (G) and blue LEDs (B). The principal part top view of LED light source 1A1, FIG. 16 repeats red LED (R), green LED (G), blue LED (B), and green LED (G) in the arrangement in the x direction. The principal part top view of RGB three primary color LED light source 1A2 arrange | positioned in zigzag form in the y direction, FIG. 17 is arrangement | positioning of x direction in red LED (R), green LED (G), blue LED (B), and green LED (G). The main part plan view of the RGB three-primary-color LED light source 1A3 in which the green LEDs (G) are arranged in one even row in the y direction, FIG. 18 shows the green LEDs (G) arranged in the odd rows in the x direction. Even rows in the x direction are red LEDs (R) and blue Is a fragmentary plan view of RGB3 primary LED light sources 1A4, which was interleaved between the LED (B). 15 to 18, the number ratio of the red LED (R), the green LED (G), and the blue LED (B) is 1: 2: 1. In the first embodiment, the present invention is not limited to this, and LEDs arranged in even columns may be arranged in odd columns, and LEDs arranged in odd columns may be arranged in even columns.

(Pairing)
If there is a variation in the luminous efficiency of the LEDs, the luminance will change, and color irregularities and shades appearing in the LED light source will be a problem. Therefore, in the first embodiment, after forming a plurality of LED chips on a semiconductor wafer in a manufacturing process called a pre-process or a diffusion process, the electrical and optical characteristics of each LED chip are measured, and the characteristic data is measured. Are stored in a storage medium such as a floppy disk (registered trademark) or stored in a database via a network, and then LED chips having the same characteristics or approximate characteristics are automatically selected based on the above characteristic data, and these are selected. A method of adhering the LED chip to the frame is used. Thereby, since an LED with little difference in luminous efficiency can be mounted on the frame, an LED light source free from color unevenness and shading can be obtained.

(Repair)
Even if the LED mounted on the frame is broken, the LED light source can be easily repaired. Here, a method for replacing one non-lighted LED with a supplementary LED will be described. FIG. 19 is a plan view of an essential part of an RGB three-primary-color LED light source 1A for explaining a repair method. The RGB three primary color LED light sources 1A are formed in two rows of frames 3.

  First, as shown in FIG. 19A, the unlit LED 23 is confirmed by a lighting test, and then the unlit LED 23 is punched out from the frame 3 as shown in FIG. 19B. As shown in FIG. 19C, a plurality of replenishing LEDs 24 are manufactured in advance, and the red LED (R), green LED (G) and blue LED (B The replenishment LED 24 having the same characteristics or approximate characteristics as) is selected. Thereafter, as shown in FIG. 19D, the replenishment LED 24 is bonded to the portion of the frame 3 where the non-lighting LED 23 is punched. For example, a solder paste can be used for bonding the replenishing LED 24.

(LED light source assembly device)
A method of assembling an LED light source using a reel-to-reel method will be described. FIG. 20 is a schematic diagram of an LED light source assembling apparatus 25 using a reel-to-reel system. While the frame 3 wound around one reel 26 is wound around the other reel 27, a die bonding process 28 (process P2 in FIG. 3), a wire bonding process 29 (process P3 in FIG. 3), and a molding process 30 ( The LED is continuously mounted on the frame 3 through the process P4) of FIG. 3 and the tie bar cutting process 31 (process P5 of FIG. 3). Thereby, the strip-shaped LED light source of the length which can be wound on the reels 26 and 27 can be manufactured continuously. Thereafter, since the strip-shaped LED light source can be cut into an arbitrary length, a versatile LED light source can be manufactured.

  Instead of using the reel-to-reel method, the LED light source can be manufactured by a manufacturing method using a die bonder, a wire bonder, and a molding apparatus in each step. However, in this manufacturing method, since the size of the frame is determined by the size of the magazine (container for supplying and storing the frame) provided in each manufacturing apparatus, the length of the frame is restricted.

(Embodiment 2)
The LED light source according to the second embodiment will be described with reference to FIG. FIG. 21A is a plan view of the main part of an RGB three-primary-color LED light source 32A using a red LED (R), a green LED (G), and a blue LED (B), and FIG. 21 (b) is a blue LED chip made of a phosphor. The principal part top view of white LED light source 32B using white LED (W) to cover is shown. In the second embodiment, the RGB three primary color LED light sources 1A or the white LED light sources 1B formed on the two rows of frames 3 shown in FIGS. 1 and 2 of the first embodiment are arranged in the x direction, for example, by using a separate machine. By using the back-split, two rows of RGB three primary color LED light sources 32A or two rows of white LED light sources 32B are manufactured. In this way, after mounting the LEDs 2 on the two frames 3, the method of manufacturing the RGB three primary color LED light sources 32 </ b> A or the white LED light sources 32 </ b> B on the back is mounted on the frames 3. Thus, the manufacturing time can be shortened as compared with the method of manufacturing one row of LED light sources. Furthermore, by dividing the frame 3 back, it is possible to easily adjust the spacing or the luminous intensity of the RGB three primary color LED light sources 32A or one row of white LED light sources 32B.

  In the second embodiment, the number of columns of the frame 3 is two, but it may be three or more. For example, when a three-column frame is used, it is divided into three LED light sources in one column. Or, it can be divided into one LED light source in one row and one LED light source in two rows.

(Embodiment 3)
An example of the connection method of the power supply to the LED light source by this Embodiment 3 is shown in FIGS. 22 (a) and 22 (b) are plan views of main parts of the RGB three primary color LED light source 34A and the white LED light source 34B, each of which is formed on two rows of frames 33, and voltage is applied from one end of the frame 33. FIGS. 23 (a) and 23 (b) show the essential points of the first example of the RGB three-primary-color LED light source 36A and the white LED light source 36B, which are formed in two rows of frames 35, and voltages are applied from both ends of the frames 35. FIGS. 24A and 24B are partial plan views of the RGB primary color LED light source 38A and the white LED light source 38B formed on two rows of frames 37, respectively, to which voltages are applied from both ends of the frame 37. FIG. 25 is a plan view of the main part of two examples, and FIG. It is a diagram.

  The RGB three primary color LED light source 34A and the white LED light source 34B shown in FIGS. 22A and 22B respectively leave the tie bar 33a at one end of the frame 33, and the other tie bars are all cut, leaving the remaining tie bars. 33a is also cut with one inner lead 33b. Thereby, the two outer leads 33c are connected by the tie bar 33a. Therefore, by connecting a power source connected to the RGB three primary color LED light source 34A or the white LED light source 34B to one end of the frame 33, a red LED (R), a green LED (G) and a blue LED (B), or a white LED A first polarity voltage (positive voltage or negative voltage) is applied to the two outer leads 33c connected to one end of (W), and the red LED (R), green LED (G), and blue LED (B) Alternatively, a second polarity voltage (negative voltage or positive voltage) opposite to the first polarity can be applied to one inner lead 33b connected to the other end of the white LED (W).

  The RGB three primary color LED light source 36A and the white LED light source 36B shown in FIGS. 23A and 23B, respectively, are manufactured in the same manner as the RGB three primary color LED light source 34A and the white LED light source 34B LED described above. The two outer leads 35b are connected to each other by the tie bar 35a left on the left side. Therefore, the red LED (R), the green LED (G) and the blue LED (B), or the white LED can be obtained by connecting the power source connected to the RGB three primary color LED light source 36A or the white LED light source 36B to both ends of the frame 35. A first polarity voltage (positive voltage or negative voltage) is applied to the two outer leads 35c to which one end of (W) is connected, and a red LED (R), a green LED (G), and a blue LED (B) Alternatively, a second polarity voltage (negative voltage or positive voltage) can be applied to one inner lead 35b connected to the other end of the white LED (W).

  The RGB three primary color LED light source 38A and the white LED light source 38B shown in FIGS. 24A and 24B, respectively, leave the tie bars 37a1 and 37a2 at both ends of the frame 37, and the other tie bars are all cut. The tie bar 37a1 left at one end of the frame 37 is cut with one inner lead 37b, and the tie bar 37a2 left at the other end of the frame 37 is cut with two outer leads 37c. As a result, the two outer leads 37c are connected by the tie bar 37a1, and the one inner lead 37b is held by the tie bar 37a2. Therefore, the red LED (R), the green LED (G) and the blue LED (B), or the white LED can be obtained by connecting the power supply connected to the RGB three primary color LED light source 38A or the white LED light source 38B to both ends of the frame 37. A first polarity voltage (positive voltage or negative voltage) is applied to the two outer leads 37c connected to one end of (W), and the red LED (R), green LED (G), and blue LED (B) Alternatively, a second polarity voltage (negative voltage or positive voltage) can be applied to one inner lead 37b connected to the other end of the white LED (W).

  As shown in FIG. 25, the white LED light source 40 connects the second and fourth row leads 39b2 and 39b4, leaving a part of the tie bar 39a1 at one end of the frame 39, and the other end of the frame 39. The first, third, and fifth row leads 39b1, 39b3, and 39b5 are connected except for a part of the tie bars 39a2, and the other tie bars are all cut. Further, the tie bar 39a1 is cut from the third row lead 39b3, and the tie bar 39a2 is cut from the second row and fourth row leads 39b2 and 39b4. Accordingly, the second row lead 39b2 and the fourth row lead 39b4 are connected by the tie bar 39a1, and the first row lead 39b1, the third row lead 39b3, and the fifth row lead 39b5 are connected by the tie bar 39a2. Therefore, by connecting the power source connected to the white LED light source 40 to both ends of the frame 39, the first row lead 39b2 and the fourth row lead 39b4 connected to one end of the white LED (W) are connected to the first row lead 39b2. A polarity voltage (positive voltage or negative voltage) is applied, and the second polarity is applied to the first row lead 39b1, the third row lead 39b3, and the fifth row lead 39b5 to which the other end of the white LED (W) is connected. A voltage (negative voltage or positive voltage) can be applied.

  Next, three methods for connecting a power source to the LED light source according to the third embodiment will be described with reference to the schematic diagram shown in FIG. Here, a method of connecting a power source to one end of the frame will be described, but a method of connecting a power source to both ends of the frame is the same.

  In the first connection method, as shown in FIG. 26A, a lead wire 45 is connected to one end of a frame 43 constituting the LED light source 42 by using a solder paste 44. The second connection method is a method in which the lead wire 45 is connected to one end of the frame 43 constituting the LED light source 42 using a connector 46, as shown in FIG. In the third connection method, as shown in FIG. 26 (c), a flexible substrate 48 on which a wiring pattern 47 is formed is fixed to one end of a frame 43 constituting the LED light source 42 using a connector 46a. Is the method. An anisotropic conductive film 49 is sandwiched between the wiring pattern 47 and the frame 43. When a voltage is applied, a current flows through the anisotropic conductive film 49 and the wiring pattern 47 and the frame 43 are conducted. .

(Embodiment 4)
An example of the method of installing the reflector according to the fourth embodiment is shown in FIGS. 27 and 28 are cross-sectional views of the main part of the LED light source 51 using the flat reflector 50, and FIGS. 29 and 30 are cross-sectional views of the main part of the LED light source 53 using the concave reflector 52. The reflecting plates 50 and 52 are, for example, sheets (films or plates), and the thickness thereof is, for example, about 0.5 mm.

  As shown in FIG. 27, the flat reflector 50 is fitted between the irradiation surfaces of the LEDs 54 adjacent to the LED light source 51. In this case, a board 55 capable of dissipating heat generated from the LED light source 51 can be installed on the back surface of the LED light source 51. The board 55 is, for example, an aluminum (Al) plate. In addition, as shown in FIG. 28, the flat reflector 50 can be installed on the back surface of the LED light source 51.

  As shown in FIG. 29, the concave reflecting plate 52 is fitted between the irradiation surface sides of the LEDs 54 adjacent to the LED light source 53. Condensing efficiency can be improved by using a concave shape. A board 55 that can dissipate heat generated from the LED light source 53 can be installed on the back surface of the LED light source 53. In addition, as shown in FIG. 30, the concave reflector 52 can be installed on the back surface of the LED light source 53.

  In the fourth embodiment, a single element type LED light source (for example, the first frame of the first embodiment described above) in which one LED chip is bonded to one die bond area and one LED chip is resin-sealed. 15a to 15e or the LED light source using the second frames 16a to 16d) is exemplified. For example, a plurality of LED chips are bonded to one die bond area and the plurality of LED chips are resin-sealed, or 1 A plurality of element type LED light sources (for example, the third frame 19 or the fourth frame 22 of the first embodiment described above), in which one LED chip is bonded to one die bond area and the plurality of LED chips are collectively sealed with resin. It can also be applied to the LED light source used.

  In FIG. 31, the red LED (R), the green LED (G), and the blue LED (B) are mounted on the third frame 19 of the first embodiment, and the concave reflector 53 is installed on the back surface of the third frame 19. An example of the RGB three primary color LED light source 57 is shown. FIG. 31A is a plan view of the main part of the RGB three-primary-color LED light source 57, and FIG. 31B is a cross-sectional view of the main part taken along the line BB 'of FIG.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above-described embodiment, an RGB three-primary-color LED light source using a red LED, a green LED, and a blue LED and a white LED light source using a blue LED chip covered with a phosphor have been described. The present invention can also be applied to an LED light source using a light source, for example, a method of exciting red, green, and blue light emitting phosphors with a blue-violet LED chip.

  The LED light source of the present invention can be widely used for mobile phones, in-vehicle devices, traffic signals, lighting fixtures, OA (Office Automation) devices, etc., and can be replaced with conventionally used light sources. Further, it can be used as a light emitting element in a new field.

Claims (6)

A first electrodes, a second 1L ED chip and a second electrodes that is located on the side opposite to the first electrodes,
A third electrodes of the same polarity as the first electrodes, the second electrostatic consists poles of the same polarity, and, the 2L ED that having a fourth electrodes located on the opposite side of the third electrode Chips,
A first die bonding area of the lead that the first electrode of the first 1L ED chip is connected,
A second die bond area of the lead to which the third electrode of the second LED chip is connected ;
Provided next to the first die bonding area of the lead, and the second 1L ED chip first wire bond area wherein is the second electrodes electrically connected to,
Provided next to the second die bonding area of the lead, and the second 2L ED chip the fourth electrodes and the second wire bonding area which is electrically connected,
A first encapsulant encapsulating the first LED chip, the first die bond area and the first wire bond area with a resin;
A second encapsulant that encapsulates the second LED chip, the second die bond area and the second wire bond area with a resin and is separated from the first encapsulant;
Have
The LED light source , wherein the first wire bond area, the first die bond area, the second die bond area, and the second wire bond area are arranged along a first direction . The LED light source according to claim 1, wherein the first LED chip emits a color different from that of the second LED chip. The LED light source according to claim 2, wherein the second electrode and the first wire bond area are connected by a first bonding wire. The LED light source according to claim 3, wherein the first bonding wire is included in the first sealing body. 5. The LED light source according to claim 4, wherein the fourth electrode and the second wire bond area are connected by a second bonding wire. The LED light source according to claim 5, wherein the second bonding wire is included in the second sealing body.

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