JP2014154644A - Led package and light-emitting device including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED package which can suppress temperature rise of an LED by enhancing heat dissipation, while enhancing color mixture of light.SOLUTION: In an LED package 1 formed by mounting a plurality of LEDs of different luminous colors on a substrate 2, a white LED 3W is arranged in a region R2 on the outside of a region R1 on the substrate 2 where a plurality of red LED 3R, green LED 3G and blue LED 3B (chromatic color LEDs) of different colors are mounted. In addition, the red LED 3R, green LED 3G and blue LED 3B (chromatic color LEDs) are sealed by a potting layer 10 of a diffusing material containing resin. Furthermore, the white LED 3W is constituted of a blue LED and a potting layer 11 mixed with phosphor for sealing the same.

Description

  The present invention relates to an LED package in which a plurality of LEDs (light emitting diodes) having different emission colors are mounted on a substrate, and a light emitting device including the LED package.

  In recent years, a COB (Chip On Boad) type LED package in which LEDs with high luminance and a long durability life are directly mounted on a substrate has been used as a light source for lighting fixtures, liquid crystal displays, and the like (for example, Patent Document 1). reference). In such a COB type LED package, an LED is mounted on a flat substrate having a lead electrode pattern formed of a metal film on the surface, the LED is electrically connected to the lead electrode, and the LED and the lead electrode are made of resin. It is sealed and configured.

  By the way, full-color LED packages are used for light sources such as stage lighting, signboard lighting, and stage lighting. This full-color LED package is RGB (red, green, blue) which is the three primary colors of colors on the substrate. In addition to red LED, green LED and blue LED emitting white light, white LED emitting white light is mounted, and full color light is emitted by mixing (toning) light of different colors emitted from these LEDs is there.

JP 2012-099572 A

  When performing light distribution control with a lens in a full-color LED package, there is a problem that heat is trapped in the vicinity of the light-emitting portion because the LEDs need to be densely packed. Further, in an LED package using a phosphor, heat is also generated from the phosphor, which raises a problem that the junction temperature of the LED rises and the light emission efficiency and durability of the LED decrease.

  The present invention has been made in view of the above problems, and an object of the present invention is to improve the color mixing property of the light and increase the heat dissipation to suppress the temperature rise of the LED and the light emitting device including the LED package. To provide an apparatus.

  To achieve the above object, according to the first aspect of the present invention, in the LED package formed by mounting a plurality of LEDs having different emission colors on the substrate, the plurality of chromatic LEDs having different colors on the substrate are mounted. A white LED is mounted in a region outside the region.

  A second aspect of the invention is characterized in that, in the first aspect of the invention, the chromatic LED is sealed with a potting layer of a diffusing material-containing resin.

  A third aspect of the invention is characterized in that, in the first or second aspect of the invention, the white LED is composed of a blue LED and a phosphor mixed potting layer for sealing the blue LED.

  A light emitting device according to a fourth aspect includes the LED package according to any one of the first to third aspects and a light guide disposed so as to face the LED package.

  According to the first and third aspects of the present invention, since a plurality of chromatic LEDs can be densely mounted on the substrate, the mixing property of light emitted from these LEDs with different colors is improved. In addition, since the white LED that uses the phosphor that generates heat is placed in a large area (outside the area where the chromatic LED is mounted), the heat dissipation of the entire LED package is improved and the temperature of each LED rises. Is suppressed, and the light emission efficiency and the durability life are prevented from decreasing.

  According to the second aspect of the present invention, the light emitted from the chromatic LED is diffused by the diffusing material included in the potting layer, so that the color mixing property of the light is further enhanced.

  According to the invention of claim 4, uniform color mixing is realized by the light from the LED package being transmitted through the light guide.

It is a top view of the LED package which concerns on this invention. It is the sectional view on the AA line of FIG. It is a top view which shows the other form of the LED package which concerns on this invention. It is a top view which shows the other form of the LED package which concerns on this invention. It is sectional drawing of the light-emitting device which concerns on this invention.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a plan view of an LED package according to the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, and the illustrated LED package 1 is a full-color package. In addition to six red LEDs 3R, six green LEDs 3G, and 11 blue LEDs 3B that emit light of three primary colors RGB (red, green, and blue), 11 white LEDs 3W that emit white light are mounted. Has been.

  The substrate 2 is made of a material having high insulating properties and low light transmittance, such as ceramics, phenol resin, epoxy resin, polyimide resin and the like. And on this board | substrate 2, red LED3R, green LED3G, blue LED3B, and white LED3W are each arrange | positioned from the inner side on the vertex or vertex and side of a concentric regular hexagon, LED of the same color, ie, The red LEDs 3R, the green LEDs 3G, the blue LEDs 3B, and the white LEDs 3W are electrically connected by lead electrodes 4, 5, 6, and 7 formed as a metal film pattern on the surface of the substrate 2, respectively.

  Thus, in the present embodiment, the plurality of red LEDs 3R, green LEDs 3G, and blue LEDs 3B that emit chromatic light are located in a region R1 surrounded by a circular dam 8 (see FIG. 2) at the center on the substrate 2. The plurality of white LEDs 3W are arranged in a circular dam 9 (see FIG. 2) outside the region R1 where the red LED 3R, the green LED 3G, and the blue LED 3B are disposed, and a ring-shaped region R2 surrounded by the dam 8. Has been placed.

  In the present embodiment, as shown in FIG. 2, a plurality of red LEDs 3R, green LEDs 3G, and blue LEDs 3B arranged in a region R1 surrounded by an inner circular dam 8 are made of a resin-filled resin potting layer. 10 is sealed.

  By the way, in this Embodiment, each white LED3W is comprised by the potting layer 11 (refer FIG. 2) of fluorescent substance mixed resin which seals this blue LED, and yellow is emitted by the blue light radiate | emitted from blue LED. When the phosphor is excited, white light is emitted from the white LED 3W. At this time, the phosphor also generates heat together with the blue LED.

  In the LED package 1 configured as described above, when the drive voltage is applied to each of the lead electrodes 4 to 7, the red LED 3R, the green LED 3G, and the blue LED 3B are red, green, and blue that are the three primary colors. As the light is emitted, white light is emitted from the white LED 3W, and full color light is emitted from the LED package 1 by mixing these light colors.

  Thus, in the present embodiment, a plurality of red LEDs 3R, green LEDs 3G, and blue LEDs 3B that emit chromatic light are surrounded by a region R1 surrounded by a circular dam 8 (see FIG. 2) at the center on the substrate 2. Therefore, the red LED 3R, the green LED 3G, and the blue LED 3B can be densely mounted on the substrate 2, and the red light, the green light, and the blue light emitted from the red LED 3R, the green LED 3G, and the blue LED 3B can be mounted. Mixability is improved. In this embodiment, since the plurality of red LEDs 3R, green LEDs 3G, and blue LEDs 3B are sealed with the potting layer 10 made of resin containing a diffusing material, the light emitted from these red LEDs 3R, green LEDs 3G, and blue LEDs 3B is potted layer 10. Is diffused by the diffusing material contained in the light, and the color mixing property of light is further enhanced by this diffusion.

  In the present embodiment, the white LED 3W that uses the phosphor that generates heat is disposed in the ring-shaped region R2 having a large area (the region outside the region R1 where the red LED 3R, the green LED 3G, and the blue LED 3B are disposed). The heat dissipation of the LED package 1 as a whole is enhanced, and the temperature rise of each LED 3R, 3G, 3B, 3W is suppressed, and the reduction of their luminous efficiency and durability is prevented.

  In this embodiment, the red LED 3R, the green LED 3G, and the blue LED 3B are arranged in the circular region R1 on the substrate 2, and the white LED 3W is arranged in the outer ring-shaped region R2, but for example, As shown in FIG. 3, the red LED 3R, the green LED 3G, and the blue LED 3B may be arranged in the rectangular area R1 at the center on the substrate 2, and the white LED 3W may be arranged in the rectangular ring-shaped area R2 outside the area. . Alternatively, as shown in FIG. 4, the red LED 3R, the green LED 3G, and the blue LED 3B are arranged in the rectangular area R1 in the center on the substrate 2, and the white LEDs 3W are arranged in the rectangular areas R2 on the left and right sides outside the red LED 3R. May be adopted.

  Further, the embodiment in which the present invention is applied to the full-color LED package 1 has been described above. However, the present invention can be applied to any LED package other than the full-color LED package in the same manner. The color and number of are arbitrary.

  Next, the light emitting device according to the present invention will be described below with reference to FIG.

  FIG. 5 is a cross-sectional view of a light emitting device according to the present invention, and the illustrated light emitting device 20 includes the LED package 1 shown in FIGS. 1 and 2 and a light guide 12 disposed opposite thereto. ing.

  Thus, according to the light emitting device 20 according to the present invention, the light from the LED package 1 passes through the light guide 12 to achieve uniform color mixing, and the light emitting device 20 needs light control and color control. It is suitably used for applications such as stage lighting, signage lighting, and production lighting.

1 LED package 2 Substrate 3B Blue LED
3G green LED
3R red LED
3W white LED
4 to 7 Lead electrodes 8, 9 Dam 10 Potting layer of resin containing diffusion material 11 Potting layer of phosphor mixed resin 12 Light guide 20 Light emitting device R1 Region in the center of the substrate R2 Region outside the center of the substrate

Claims (4)

In an LED package formed by mounting a plurality of LEDs having different emission colors on a substrate,
An LED package, wherein a white LED is mounted in a region outside a region where a plurality of chromatic LEDs having different colors are mounted on the substrate.   2. The LED package according to claim 1, wherein the chromatic LED is sealed with a potting layer made of a resin containing a diffusion material.   3. The LED package according to claim 1, wherein the white LED is composed of a blue LED and a phosphor mixed potting layer for sealing the blue LED. A light emitting device comprising: the LED package according to claim 1; and a light guide disposed so as to face the LED package.

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