JP2016167572A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2016167572A
JP2016167572A JP2015121457A JP2015121457A JP2016167572A JP 2016167572 A JP2016167572 A JP 2016167572A JP 2015121457 A JP2015121457 A JP 2015121457A JP 2015121457 A JP2015121457 A JP 2015121457A JP 2016167572 A JP2016167572 A JP 2016167572A
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island
light emitting
emitting device
shaped member
light
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JP6485243B2 (en
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光司 寺上
Koji Teraue
光司 寺上
矢嶋 孝義
Takayoshi Yajima
孝義 矢嶋
誠治 山口
Seiji Yamaguchi
誠治 山口
美保 築嶋
Miho Tsukishima
美保 築嶋
伊藤 浩史
Hiroshi Ito
浩史 伊藤
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Toyoda Gosei Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing storage of heat while suppressing generation of light emission color unevenness.SOLUTION: A light-emitting device 1 according to an aspect of the present invention includes: a substrate 10; an annular dam 12 formed on the substrate 10; an island-like member 13 formed separated from the dam 12 on an element mounting region 17 surrounded with the dam 12 on the substrate 10; a plurality of light-emitting elements 14 mounted on the element mounting region 17; and a sealing member 16 including phosphor particles 15 filled on the element mounting region 17.SELECTED DRAWING: Figure 1

Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

一般的に、COB(Chip on board)型発光装置等の、基板上に複数の発光素子が搭載された発光装置においては、発光素子や封止材中に分散する蛍光体粒子から発せられる熱が素子搭載領域の中央部に集中して篭もりやすく、装置の寿命や発光特性の低下を引き起こすおそれがある。   Generally, in a light emitting device in which a plurality of light emitting elements are mounted on a substrate, such as a COB (Chip on board) type light emitting device, heat generated from phosphor particles dispersed in the light emitting element or the sealing material is generated. Concentrating on the central portion of the element mounting region tends to cause haze, which may cause a reduction in device life and emission characteristics.

従来の発光装置として、基板上に複数の発光素子が搭載され、素子搭載領域の中央部に発光素子が搭載されていないものが知られている(例えば、特許文献1〜3)。   As a conventional light-emitting device, a device in which a plurality of light-emitting elements are mounted on a substrate and no light-emitting element is mounted at the center of the element mounting region is known (for example, Patent Documents 1 to 3).

これらの発光装置によれば、熱源となる発光素子が素子搭載領域の中央部に搭載されていないため、発光素子の発熱に起因する熱の集中を緩和することができる。   According to these light emitting devices, since the light emitting element serving as a heat source is not mounted in the central portion of the element mounting region, the concentration of heat caused by the heat generation of the light emitting element can be reduced.

特開2013−78336号公報JP 2013-78336 A 特開2013−4739号公報JP2013-4739A 特開2012−230967号公報JP 2012-230967 A

しかしながら、特許文献1〜3の発光装置においては、素子搭載領域の中央部には発光素子が搭載されないため、周辺の発光素子が搭載される領域と比較して、封止材の占有率が高くなり、それによって蛍光体粒子の量も多くなる。   However, in the light emitting devices of Patent Documents 1 to 3, since the light emitting element is not mounted at the center of the element mounting region, the occupation ratio of the sealing material is higher than the region where the peripheral light emitting element is mounted. Thereby increasing the amount of phosphor particles.

このため、素子搭載領域の中央部から発せられる光と周辺部から発せられる光の色が異なり、色むらが生じるおそれがある。また、蛍光体粒子も熱源となるため、熱の集中を緩和する効果の妨げとなるおそれもある。   For this reason, the color of the light emitted from the central part of the element mounting region and the light emitted from the peripheral part are different, and there is a possibility that color unevenness occurs. Further, since the phosphor particles are also a heat source, there is a possibility that the effect of relaxing the concentration of heat may be hindered.

本発明の目的の一つは、発光色むらの発生を抑えつつ、熱篭もりを抑えることのできる発光装置を提供することにある。   One of the objects of the present invention is to provide a light-emitting device capable of suppressing thermal clouding while suppressing the occurrence of uneven emission color.

本発明の一態様は、上記目的を達成するために、下記[1]〜[10]の発光装置を提供する。   One embodiment of the present invention provides the following light-emitting devices [1] to [10] in order to achieve the above object.

[1]基板と、前記基板上に形成された環状のダムと、前記基板上の前記ダムに囲まれた素子搭載領域上に、前記ダムと離れて形成された島状部材と、前記素子搭載領域上に搭載された複数の発光素子と、前記素子搭載領域上に充填された、蛍光体粒子を含む封止材と、を有する、発光装置。 [1] A substrate, an annular dam formed on the substrate, an island-shaped member formed on the device mounting region surrounded by the dam on the substrate and separated from the dam, and the device mounting A light emitting device comprising: a plurality of light emitting elements mounted on a region; and a sealing material containing phosphor particles filled on the device mounting region.

[2]前記島状部材が、前記素子搭載領域の中心を含む領域上に形成された、上記[1]に記載の発光装置。 [2] The light emitting device according to [1], wherein the island-shaped member is formed on a region including a center of the element mounting region.

[3]前記島状部材が、十字型の平面形状を有する、上記[2]に記載の発光装置。 [3] The light-emitting device according to [2], wherein the island-shaped member has a cross-shaped planar shape.

[4]複数の前記島状部材が、前記素子搭載領域の中心から外周まで前記島状部材に交わらずに通る直線が存在しないように配置された、上記[1]に記載の発光装置。 [4] The light emitting device according to the above [1], wherein the plurality of island-shaped members are arranged so that there is no straight line passing through the element mounting region from the center to the outer periphery without intersecting the island-shaped members.

[5]前記島状部材の上端の位置が、前記発光素子の上端の位置より高い、上記[1]〜[4]のいずれか1項に記載の発光装置。 [5] The light emitting device according to any one of [1] to [4], wherein a position of an upper end of the island-shaped member is higher than a position of an upper end of the light emitting element.

[6]前記島状部材の上端が、前記封止材の表面から露出している、上記[1]〜[5]のいずれか1項に記載の発光装置。 [6] The light emitting device according to any one of [1] to [5], wherein an upper end of the island-shaped member is exposed from a surface of the sealing material.

[7]前記島状部材が前記封止材中に埋もれている、上記[1]〜[5]のいずれか1項に記載の発光装置。 [7] The light emitting device according to any one of [1] to [5], wherein the island-shaped member is buried in the sealing material.

[8]前記島状部材が、側面がテーパー状に傾斜した部分を有する、上記[1]〜[7]のいずれか1項に記載の発光装置。 [8] The light-emitting device according to any one of [1] to [7], wherein the island-shaped member has a portion whose side surface is tapered.

[9]前記島状部材が、側面が逆テーパー状に傾斜した部分、又は側面に前記基板に接しない突起が設けられた部分を有する、上記[1]〜[7]のいずれか1項に記載の発光装置。 [9] In any one of the above [1] to [7], the island-shaped member has a portion whose side surface is inclined in a reverse taper shape, or a portion where a protrusion that does not contact the substrate is provided on the side surface. The light-emitting device of description.

[10]前記島状部材が白色又は透明である、上記[1]〜[9]のいずれか1項に記載の発光装置。 [10] The light-emitting device according to any one of [1] to [9], wherein the island-shaped member is white or transparent.

本発明によれば、発光色むらの発生を抑えつつ、熱篭もりを抑えることのできる発光装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which can suppress a thermal clouding can be provided, suppressing generation | occurrence | production of luminescent color unevenness.

図1は、第1の実施の形態に係る発光装置の斜視図である。FIG. 1 is a perspective view of the light emitting device according to the first embodiment. 図2(a)、(b)は、発光装置の垂直断面図である。2A and 2B are vertical sectional views of the light emitting device. 図3は、比較例としての、島状部材を有しない発光装置の斜視図である。FIG. 3 is a perspective view of a light emitting device having no island-like member as a comparative example. 図4(a)は、島状部材が、側面がテーパー状に傾斜した部分を有する場合の発光装置の断面図である。図4(b)は、島状部材が、側面が逆テーパー状に傾斜した部分を有する場合の発光装置の断面図である。FIG. 4A is a cross-sectional view of the light-emitting device when the island-shaped member has a portion whose side surface is tapered. FIG. 4B is a cross-sectional view of the light emitting device when the island-shaped member has a portion whose side surface is inclined in a reverse taper shape. 図5(a)、(b)は、それぞれ、第1の実施の形態に係る島状部材を有する発光装置と、比較例に係る島状部材を有しない発光装置の温度分布を示すサーモグラフィ画像である。FIGS. 5A and 5B are thermographic images showing the temperature distributions of the light-emitting device having the island-shaped member according to the first embodiment and the light-emitting device not having the island-shaped member according to the comparative example, respectively. is there. 図6(a)は、第2の実施の形態に係る発光装置の構成を概略的に表す上面図である。図6(b)は、第1の実施の形態に係る発光装置の構成を概略的に表す上面図である。FIG. 6A is a top view schematically showing the configuration of the light emitting device according to the second embodiment. FIG. 6B is a top view schematically showing the configuration of the light emitting device according to the first embodiment. 図7(a)、(b)、(c)は、第3の実施の形態に係る発光装置の構成を概略的に表す上面図である。FIGS. 7A, 7B, and 7C are top views schematically showing the configuration of the light emitting device according to the third embodiment.

〔第1の実施の形態〕
(発光装置の構成)
図1は、第1の実施の形態に係る発光装置1の斜視図である。図2(a)、(b)は、発光装置1の垂直断面図である。
[First Embodiment]
(Configuration of light emitting device)
FIG. 1 is a perspective view of a light emitting device 1 according to the first embodiment. 2A and 2B are vertical sectional views of the light emitting device 1.

発光装置1は、配線11を有する基板10と、基板10上に形成された環状のダム12と、基板10上のダム12に囲まれた領域である素子搭載領域17の中心を含む領域上に、ダム12と離れて形成された島状部材13と、素子搭載領域17のダム12と島状部材13との間の領域上に搭載された複数の発光素子14と、素子搭載領域17上に充填された、蛍光体粒子15を含む封止材16とを有する。   The light emitting device 1 includes a substrate 10 having wirings 11, an annular dam 12 formed on the substrate 10, and a region including the center of the element mounting region 17 that is a region surrounded by the dam 12 on the substrate 10. On the element mounting area 17, the island-shaped member 13 formed away from the dam 12, the plurality of light-emitting elements 14 mounted on the area between the dam 12 and the island-shaped member 13 in the element mounting area 17, And a sealing material 16 including phosphor particles 15 filled therein.

図2(a)は、島状部材13の上端の高さが封止材16の表面の高さより高く、島状部材13の上端が封止材16の表面から露出している場合の断面図である。一方、図2(b)は、島状部材13の上端の高さが封止材16の表面の高さより低く、島状部材13が封止材16中に埋もれている場合の断面図である。なお、図1においては、封止材16及び封止材16に含まれる蛍光体粒子15の図示は省略している。   FIG. 2A is a cross-sectional view when the height of the upper end of the island-shaped member 13 is higher than the height of the surface of the sealing material 16 and the upper end of the island-shaped member 13 is exposed from the surface of the sealing material 16. It is. On the other hand, FIG. 2B is a cross-sectional view when the height of the upper end of the island-shaped member 13 is lower than the height of the surface of the sealing material 16 and the island-shaped member 13 is buried in the sealing material 16. . In FIG. 1, illustration of the sealing material 16 and the phosphor particles 15 included in the sealing material 16 is omitted.

また、図3は、比較例としての、島状部材13を有しない発光装置2の斜視図である。発光装置2においては、素子搭載領域17の中心を含む領域上にも、発光素子14が配置されている。   FIG. 3 is a perspective view of the light emitting device 2 that does not have the island-like member 13 as a comparative example. In the light emitting device 2, the light emitting element 14 is also disposed on a region including the center of the element mounting region 17.

基板10は、例えば、Al基板、AlN基板等のセラミック基板、表面が絶縁膜で覆われたAl基板やCu基板等の金属基板、又はガラスエポキシ基板である。図1に示される基板10は配線基板であるが、リードフレームインサート基板等の他の形態の基板であってもよい。 The substrate 10 is, for example, a ceramic substrate such as an Al 2 O 3 substrate or an AlN substrate, a metal substrate such as an Al substrate or a Cu substrate whose surface is covered with an insulating film, or a glass epoxy substrate. Although the substrate 10 shown in FIG. 1 is a wiring substrate, it may be a substrate of another form such as a lead frame insert substrate.

ダム12は、例えば、酸化チタン等の白色染料を含むシリコーン系樹脂やエポキシ系樹脂等の樹脂からなる。ダム12の平面形状は、環状であればよく、多角形等の円形以外の形状であってもよい。また、ダム12の垂直断面形状も特に限定されない。   The dam 12 is made of a resin such as a silicone resin or an epoxy resin containing a white dye such as titanium oxide. The planar shape of the dam 12 may be an annular shape, and may be a shape other than a circle such as a polygon. Further, the vertical sectional shape of the dam 12 is not particularly limited.

発光素子14は、例えば、チップ基板と、発光層及びそれを挟むクラッド層を含む結晶層とを有するLEDチップである。また、レーザーダイオード等のLEDチップ以外の発光素子であってもよい。   The light emitting element 14 is, for example, an LED chip having a chip substrate and a crystal layer including a light emitting layer and a clad layer sandwiching the light emitting layer. Moreover, light emitting elements other than LED chips, such as a laser diode, may be used.

発光素子14は、基板10に含まれる配線11に図示しないボンディングワイヤー等により接続され、配線11の端子部11aを介して外部から電源が供給される。   The light emitting element 14 is connected to the wiring 11 included in the substrate 10 by a bonding wire (not shown), and power is supplied from the outside through the terminal portion 11 a of the wiring 11.

蛍光体粒子15の蛍光色は特に限定されず、例えば、黄色系の蛍光体粒子としては、BOS(バリウム・オルソシリケート)系蛍光体や、YAG(イットリウム・アルミニウム・ガーネット)系蛍光体の粒子が用いられる。例えば、発光素子14の発光色が青色であり、蛍光体粒子15の蛍光色が黄色である場合は、発光装置1の発光色は白色になる。   The fluorescent color of the phosphor particles 15 is not particularly limited. For example, examples of yellow phosphor particles include BOS (barium / orthosilicate) phosphors and YAG (yttrium / aluminum / garnet) phosphor particles. Used. For example, when the emission color of the light emitting element 14 is blue and the fluorescent color of the phosphor particles 15 is yellow, the emission color of the light emitting device 1 is white.

封止材16は、例えば、シリコーン系樹脂やエポキシ系樹脂等の透明樹脂からなる。封止材16は、滴下成形等により形成される。   The sealing material 16 is made of a transparent resin such as a silicone resin or an epoxy resin, for example. The sealing material 16 is formed by dropping molding or the like.

発光装置1の素子搭載領域17の中心を含む領域(以下、中央領域と呼ぶ)には、発光装置2と異なり、島状部材13が配置されているため、発光素子14は配置されない。このため、発光素子14の発する熱による中央領域への熱の集中を防ぎ、熱篭もりを抑えることができる。   Unlike the light emitting device 2, the island-shaped member 13 is disposed in a region including the center of the element mounting region 17 of the light emitting device 1 (hereinafter referred to as a central region), and thus the light emitting element 14 is not disposed. For this reason, it is possible to prevent concentration of heat to the central region due to heat generated by the light emitting element 14, and to suppress heat buildup.

また、島状部材13が配置されているため、中央領域には蛍光体粒子15を含む封止材16もほとんど存在しない。このため、中央領域の蛍光体粒子15の濃度が高まることによる、発光装置1の発光色度むらを抑え、かつ、蛍光体粒子15の発する熱による中央領域への熱の集中を防ぎ、より効果的に熱篭もりを抑えることができる。   Further, since the island-shaped member 13 is disposed, the sealing material 16 including the phosphor particles 15 is hardly present in the central region. For this reason, the emission chromaticity unevenness of the light emitting device 1 due to the increase in the concentration of the phosphor particles 15 in the central region is suppressed, and the concentration of heat to the central region due to the heat generated by the phosphor particles 15 is prevented, and thus more effective. Therefore, it is possible to suppress hot flashes.

さらには、島状部材13が中央領域に配置されているため、島状部材13が配置されていない発光装置2と比較して、発光装置の動作前後(通電前後)の封止材16の膨張、収縮による水平方向の変位量が低減し、封止材16のクラックの発生を抑えることができる。   Furthermore, since the island-shaped member 13 is disposed in the central region, the expansion of the sealing material 16 before and after the operation of the light-emitting device (before and after energization) is compared with the light-emitting device 2 in which the island-shaped member 13 is not disposed. The amount of horizontal displacement due to shrinkage can be reduced, and the occurrence of cracks in the sealing material 16 can be suppressed.

図2(a)に示されるように、島状部材13の上端が封止材16の表面から露出している場合には、中央領域の蛍光体粒子15の量がより低減されるため、発光色度むらをより効果的に抑えることができる。   As shown in FIG. 2A, when the upper end of the island-shaped member 13 is exposed from the surface of the sealing material 16, the amount of the phosphor particles 15 in the central region is further reduced, and thus light emission The chromaticity unevenness can be more effectively suppressed.

また、この場合、発光装置1の動作前後(通電前後)の封止材16の膨張、収縮による水平方向の変位量をより大きく低減することができるため、封止材16のクラックの発生もより効果的に抑えることができる。このため、この島状部材13の上端が封止材16の表面から露出している構造は、例えば、発光装置1が、封止材16の面積が大きくクラックが発生しやすい、スタジアム用照明等に用いられる大面積の発光装置である場合に、特に有効であるといえる。   Further, in this case, since the amount of displacement in the horizontal direction due to the expansion and contraction of the sealing material 16 before and after the operation of the light emitting device 1 (before and after energization) can be greatly reduced, the occurrence of cracks in the sealing material 16 is further increased. It can be effectively suppressed. For this reason, the structure in which the upper end of the island-shaped member 13 is exposed from the surface of the sealing material 16 is, for example, a lighting for a stadium where the light-emitting device 1 has a large area of the sealing material 16 and easily generates cracks. It is particularly effective when the light emitting device has a large area used in the above.

一方、ダム12上に、レンズ等の部材を直接搭載する場合には、島状部材13の高さを低く抑えることが求められる。このような場合、図2(b)に示されるような、島状部材13が封止材16中に埋もれている構造であれば、製造が容易である。   On the other hand, when a member such as a lens is directly mounted on the dam 12, it is required to keep the island-like member 13 low. In such a case, if the structure is such that the island-like member 13 is buried in the sealing material 16 as shown in FIG.

島状部材13がこれらの機能を発揮するためには、島状部材13の材料や形状は、特に限定されないが、材料や形状によって、さらなる機能や効果を付加することができる。   In order for the island-shaped member 13 to exhibit these functions, the material and shape of the island-shaped member 13 are not particularly limited, but additional functions and effects can be added depending on the material and shape.

例えば、島状部材13が上記の機能を発揮するためには、ある程度の高さを有していることが好ましく、例えば、島状部材13の上端の位置が、発光素子14の上端の位置より高いことが好ましい。   For example, in order for the island-shaped member 13 to exhibit the above function, it is preferable that the island-shaped member 13 has a certain height. For example, the position of the upper end of the island-shaped member 13 is higher than the position of the upper end of the light emitting element 14. High is preferred.

また、島状部材13は、発光素子14の発する光を吸収して発熱することのない材料、すなわち発光素子14の発光エネルギーよりも大きなバンドギャップを有する材料からなることが好ましい。   The island member 13 is preferably made of a material that does not generate heat by absorbing light emitted from the light emitting element 14, that is, a material having a band gap larger than the light emission energy of the light emitting element 14.

また、島状部材13の表面を白色の材料で構成することにより、島状部材13の光反射率を向上させ、光取出効率を向上させることができる。一方、例えば、島状部材13の形状が、光反射による光取出効率の向上が期待できないような形状である等の場合には、透明の材料で島状部材13を形成して、光を透過させることができる。   Moreover, by configuring the surface of the island-shaped member 13 with a white material, the light reflectance of the island-shaped member 13 can be improved and the light extraction efficiency can be improved. On the other hand, for example, when the shape of the island-shaped member 13 is a shape that cannot be expected to improve the light extraction efficiency due to light reflection, the island-shaped member 13 is formed of a transparent material to transmit light. Can be made.

図4(a)は、島状部材13が、側面がテーパー状に傾斜した部分を有する場合の発光装置1の断面図である。図4(a)に示される島状部材13の断面は、その側面がテーパー状に傾斜した部分の断面である。   FIG. 4A is a cross-sectional view of the light emitting device 1 when the island-like member 13 has a portion whose side surface is tapered. The cross section of the island-shaped member 13 shown in FIG. 4A is a cross section of a portion whose side surface is inclined in a tapered shape.

この場合、光を島状部材13によって好ましい方向へ反射することができるため、光取出効率を向上させることができる。島状部材13がこのような形状を有する場合、光反射率を向上させるため、島状部材13の表面を白色の材料で構成することが好ましい。   In this case, since light can be reflected in a preferable direction by the island-shaped member 13, the light extraction efficiency can be improved. When the island-shaped member 13 has such a shape, it is preferable that the surface of the island-shaped member 13 is made of a white material in order to improve the light reflectance.

図4(b)は、島状部材13が、側面が逆テーパー状に傾斜した部分を有する場合の発光装置1の断面図である。図4(b)に示される島状部材13の断面は、その側面が逆テーパー状に傾斜した部分の断面である。   FIG. 4B is a cross-sectional view of the light emitting device 1 when the island-like member 13 has a portion whose side surface is inclined in a reverse taper shape. The cross section of the island-shaped member 13 shown in FIG. 4B is a cross section of a portion whose side surface is inclined in a reverse taper shape.

この場合、島状部材13によって、封止材16の基板10からの剥離を抑えることができる。また、島状部材13が、側面に前記基板に接しない突起が設けられた部分を有する場合(例えば、上層の幅が下層の幅よりも大きい二段構造を有する場合)にも、同様に、島状部材13によって、封止材16の基板10からの剥離を抑えることができる。島状部材13がこれらの形状を有する場合、島状部材13の全体又は上部を透明の材料で構成することが好ましい。   In this case, the island-shaped member 13 can suppress the peeling of the sealing material 16 from the substrate 10. Similarly, when the island-shaped member 13 has a portion provided with a protrusion on the side surface that does not contact the substrate (for example, a case where the upper layer has a two-stage structure in which the width of the upper layer is larger than the width of the lower layer), The island-shaped member 13 can suppress the peeling of the sealing material 16 from the substrate 10. When the island-like member 13 has these shapes, it is preferable that the whole or upper part of the island-like member 13 is made of a transparent material.

図5(a)、(b)は、それぞれ、島状部材13を有する発光装置1と、島状部材13を有しない発光装置2の温度分布を示すサーモグラフィ画像である。図5(a)、(b)の右側には、画像の濃度と温度(℃)の対応を示す温度スケールが表示されている。なお、この温度分布を測定した発光装置1に含まれる島状部材13は、図2(b)に示されるように、封止材16中に僅かに埋もれている。   5A and 5B are thermographic images showing the temperature distribution of the light emitting device 1 having the island-shaped member 13 and the light emitting device 2 not having the island-shaped member 13, respectively. On the right side of FIGS. 5A and 5B, a temperature scale indicating the correspondence between the image density and the temperature (° C.) is displayed. In addition, the island-like member 13 included in the light-emitting device 1 whose temperature distribution has been measured is slightly buried in the sealing material 16 as shown in FIG.

図5(a)と図5(b)を比較すると、発光装置1の中央領域における熱篭もりが島状部材13によって抑制されていることがわかる。   Comparing FIG. 5A and FIG. 5B, it can be seen that the thermal fogging in the central region of the light emitting device 1 is suppressed by the island-shaped member 13.

〔第2の実施の形態〕
第2の実施の形態は、島状部材の平面形状において、第1の実施の形態と異なる。なお、その他の第1の実施の形態と同様の点については、説明を省略又は簡略化する。
[Second Embodiment]
2nd Embodiment differs from 1st Embodiment in the planar shape of an island-shaped member. Note that description of other points similar to those of the first embodiment is omitted or simplified.

(発光装置の構成)
図6(a)は、第2の実施の形態に係る発光装置20の構成を概略的に表す上面図である。なお、図6(a)においては、発光素子14、封止材16及び封止材16に含まれる蛍光体粒子15の図示は省略している。
(Configuration of light emitting device)
FIG. 6A is a top view schematically showing the configuration of the light emitting device 20 according to the second embodiment. In FIG. 6A, illustration of the light emitting element 14, the sealing material 16, and the phosphor particles 15 included in the sealing material 16 is omitted.

発光装置20は、配線11を有する基板10と、基板10上に形成された環状のダム12と、素子搭載領域17の中心を含む領域上に、ダム12と離れて形成された島状部材21と、素子搭載領域17のダム12と島状部材21との間の領域上に搭載された複数の発光素子14と、素子搭載領域17上に充填された、蛍光体粒子15を含む封止材16とを有する。   The light emitting device 20 includes an island-like member 21 formed away from the dam 12 on the substrate 10 having the wiring 11, the annular dam 12 formed on the substrate 10, and the region including the center of the element mounting region 17. A plurality of light-emitting elements 14 mounted on a region between the dam 12 and the island-shaped member 21 in the element mounting region 17 and a sealing material including the phosphor particles 15 filled on the element mounting region 17 16.

図6(a)に示されるように、本実施の形態の島状部材21は、十字型の平面形状を有する。なお、平面形状以外の特徴、性質については、第1の実施の形態の島状部材13と同様である。   As shown in FIG. 6A, the island-shaped member 21 of the present embodiment has a cross-shaped planar shape. Note that the features and properties other than the planar shape are the same as those of the island-like member 13 of the first embodiment.

図6(b)は、第1の実施の形態に係る発光装置1の構成を概略的に表す上面図である。なお、図6(b)においては、発光素子14、封止材16及び封止材16に含まれる蛍光体粒子15の図示は省略している。   FIG. 6B is a top view schematically illustrating the configuration of the light emitting device 1 according to the first embodiment. In FIG. 6B, the light emitting element 14, the sealing material 16, and the phosphor particles 15 included in the sealing material 16 are not shown.

図6(b)に示されるように、島状部材13とダム12との間の封止材の長さ(L、L等)は、素子搭載領域17の直径と比較して短いため、島状部材13とダム12とを結ぶ方向に沿った封止材16の膨張、収縮による水平方向の変位量は小さい。 As shown in FIG. 6B, the length (L 1 , L 2, etc.) of the sealing material between the island-shaped member 13 and the dam 12 is shorter than the diameter of the element mounting region 17. The horizontal displacement due to the expansion and contraction of the sealing material 16 along the direction connecting the island member 13 and the dam 12 is small.

しかしながら、島状部材13の近傍の、島状部材13の長手方向に沿った封止材16の長さLは、素子搭載領域17の直径に近い。このため、この長さL3の部分の、島状部材13の長手方向に沿った変位量は比較的大きく、クラックの発生を十分に抑制できない場合がある。 However, the length L 3 of the sealing material 16 along the longitudinal direction of the island-shaped member 13 in the vicinity of the island-shaped member 13 is close to the diameter of the element mounting region 17. For this reason, the amount of displacement along the longitudinal direction of the island-shaped member 13 in the portion of the length L3 is relatively large, and the occurrence of cracks may not be sufficiently suppressed.

一方、第2の実施の形態に係る発光装置20によれば、島状部材21が十字型の平面形状を有するため、封止材16の平面方向に直線的に連続した領域の最大長さを短くすることができる。このため、封止材16の膨張、収縮による水平方向の最大変位量を低減し、クラックの発生をより効果的に抑制することができる。   On the other hand, according to the light emitting device 20 according to the second embodiment, since the island-shaped member 21 has a cross-shaped planar shape, the maximum length of the linearly continuous region of the sealing material 16 is increased. Can be shortened. For this reason, the maximum amount of horizontal displacement due to expansion and contraction of the sealing material 16 can be reduced, and the generation of cracks can be more effectively suppressed.

〔第3の実施の形態〕
第3の実施の形態は、複数の島状部材が含まれることや、島状部材の配置等において、第1の実施の形態と異なる。なお、その他の第1の実施の形態と同様の点については、説明を省略又は簡略化する。
[Third Embodiment]
The third embodiment differs from the first embodiment in that a plurality of island-shaped members are included, the arrangement of island-shaped members, and the like. Note that description of other points similar to those of the first embodiment is omitted or simplified.

(発光装置の構成)
図7(a)、(b)、(c)は、第3の実施の形態に係る発光装置30a、30b、30cの構成を概略的に表す上面図である。なお、図7(a)、(b)、(c)においては、発光素子14、封止材16及び封止材16に含まれる蛍光体粒子15の図示は省略している。
(Configuration of light emitting device)
7A, 7B, and 7C are top views schematically showing the configuration of the light emitting devices 30a, 30b, and 30c according to the third embodiment. 7A, 7 </ b> B, and 7 </ b> C, the light emitting element 14, the sealing material 16, and the phosphor particles 15 included in the sealing material 16 are not illustrated.

発光装置30a、30b、30cは、配線11を有する基板10と、基板10上に形成された環状のダム12と、素子搭載領域17の中心を含む領域上に、ダム12と離れて形成された島状部材31a、31b、又は31cと、素子搭載領域17上に搭載された複数の発光素子14と、素子搭載領域17上に充填された、蛍光体粒子15を含む封止材16とを有する。   The light emitting devices 30a, 30b, and 30c are formed on the substrate 10 having the wiring 11, the annular dam 12 formed on the substrate 10, and the region including the center of the element mounting region 17, apart from the dam 12. Island-shaped members 31 a, 31 b, or 31 c, a plurality of light emitting elements 14 mounted on the element mounting region 17, and a sealing material 16 including the phosphor particles 15 filled on the element mounting region 17. .

発光装置30a、30b、30cにおいては、島状部材31a、31b、又は31cが、素子搭載領域17の中心から外周まで島状部材31a、31b、又は31cと交わらずに通る直線が存在しないように配置されている。ここで、素子搭載領域17の中心から外周まで通る直線とは、図7(a)に点線で示されるような直線であり、素子搭載領域17の中心からどの方向に直線を延ばしても、島状部材31a、31b、又は31cと交わることになる。   In the light emitting devices 30a, 30b, and 30c, there is no straight line through which the island-shaped members 31a, 31b, or 31c pass from the center to the outer periphery of the element mounting region 17 without intersecting the island-shaped members 31a, 31b, or 31c. Has been placed. Here, the straight line passing from the center of the element mounting area 17 to the outer periphery is a straight line as shown by a dotted line in FIG. 7A, and no matter which direction the straight line extends from the center of the element mounting area 17, It intersects with the member 31a, 31b, or 31c.

素子搭載領域17の中心から外周まで島状部材31a、31b、又は31cに遮られずに通る直線が存在しないということは、素子搭載領域17の中心から外周まで連続する部分が封止材16に含まれないということであり、その結果、封止材16の平面方向に直線的に連続した領域の最大長さが短くなる。このため、封止材16の膨張、収縮による水平方向の最大変位量を低減し、クラックの発生をより効果的に抑制することができる。   The fact that there is no straight line passing through the island-shaped members 31a, 31b, or 31c from the center to the outer periphery of the element mounting region 17 means that a portion continuous from the center to the outer periphery of the element mounting region 17 is in the sealing material 16. As a result, the maximum length of the linearly continuous region in the planar direction of the sealing material 16 is shortened. For this reason, the maximum amount of horizontal displacement due to expansion and contraction of the sealing material 16 can be reduced, and the generation of cracks can be more effectively suppressed.

また、発光装置30a、30b、30cの素子搭載領域17の中心に発光素子14を搭載することができるため、素子搭載領域17の中心における蛍光体粒子の濃度が特に高くなることはなく、発光色むらの発生は抑えられる。   Further, since the light emitting element 14 can be mounted at the center of the element mounting area 17 of the light emitting devices 30a, 30b, and 30c, the concentration of the phosphor particles at the center of the element mounting area 17 is not particularly increased, and the emission color The occurrence of unevenness is suppressed.

なお、発光装置30a、30b、30cの島状部材31a、31b、31cは本実施の形態に係る島状部材の一例であり、島状部材の数、形状、配置等は限定されない。また、平面形状、数、配置以外の特徴、性質については、第1の実施の形態の島状部材13と同様である。   The island-shaped members 31a, 31b, and 31c of the light emitting devices 30a, 30b, and 30c are examples of island-shaped members according to the present embodiment, and the number, shape, arrangement, and the like of the island-shaped members are not limited. Further, the features and properties other than the planar shape, number, and arrangement are the same as those of the island-like member 13 of the first embodiment.

第3の実施の形態に係る島状部材は、熱が最も集中しやすい素子搭載領域17の中央領域上に配置されないため、第1の実施の形態に係る島状部材13や第2の実施の形態に係る島状部材21と比較して発光装置の熱篭もりを抑える効果は低いが、一方で、封止材16のクラックを抑える効果は高い。   Since the island-shaped member according to the third embodiment is not disposed on the central region of the element mounting region 17 where heat is most likely to concentrate, the island-shaped member 13 according to the first embodiment or the second embodiment Compared with the island-shaped member 21 according to the embodiment, the effect of suppressing heat buildup of the light emitting device is low, but the effect of suppressing cracks in the sealing material 16 is high.

次の表1に、第1〜第3の実施の形態に係る島状部材の有する効果の比較結果を示す。   Table 1 below shows a comparison result of the effects of the island-shaped members according to the first to third embodiments.

表1中のマーク「△」はやや優れていることを示し、マーク「○」は優れていることを示し、マーク「◎」は著しく優れていることを示す。「素子配置数」は、配置可能な発光素子14の数の多さを表している。島状部材の専有面積が大きいほど配置可能な発光素子14の数が少なくなる。   The mark “Δ” in Table 1 indicates that it is slightly superior, the mark “◯” indicates that it is excellent, and the mark “◎” indicates that it is extremely excellent. The “number of arranged elements” represents the number of light emitting elements 14 that can be arranged. The larger the exclusive area of the island-like member, the smaller the number of light emitting elements 14 that can be arranged.

(実施の形態の効果)
上記の実施の形態によれば、素子搭載領域17上に島状部材を設けることにより、発光装置の発光色むらの発生を抑えつつ、熱篭もりを抑えることができる。特に、素子搭載領域17の中心を含む領域上に島状部材が配置される第1及び第2の実施の形態においては、より効果的に熱篭もりを抑えることができる。
(Effect of embodiment)
According to the above-described embodiment, by providing the island-shaped member on the element mounting region 17, it is possible to suppress the thermal clouding while suppressing the occurrence of uneven emission color of the light emitting device. In particular, in the first and second embodiments in which the island-shaped member is disposed on the region including the center of the element mounting region 17, it is possible to more effectively suppress thermal fogging.

また、上記の実施の形態によれば、島状部材を設けることにより、封止材の平面方向に直線的に連続した領域の長さを短くして、封止材の膨張、収縮による水平方向の変位量を低減し、クラックの発生を抑えることができる。特に、封止材の平面方向に直線的に連続した領域の最大長さが最も短くなる第3の実施の形態においては、より効果的に封止材のクラックの発生を抑えることができる。   Moreover, according to said embodiment, by providing an island-like member, the length of the area | region linearly continued in the plane direction of the sealing material was shortened, and the horizontal direction by expansion | swelling and shrinkage | contraction of a sealing material The amount of displacement can be reduced, and the occurrence of cracks can be suppressed. In particular, in the third embodiment in which the maximum length of the linearly continuous region in the planar direction of the sealing material is the shortest, the occurrence of cracks in the sealing material can be more effectively suppressed.

以上、本発明の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、発明の主旨を逸脱しない範囲内において種々変形実施が可能である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

また、上記の実施の形態は特許請求の範囲に係る発明を限定するものではない。また、実施の形態の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない点に留意すべきである。   Moreover, said embodiment does not limit the invention which concerns on a claim. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

1、20、30a、30b、30c 発光装置
10 基板
12 ダム
13、21、31a、31b、31c 島状部材
14 発光素子
15 蛍光体粒子
16 封止材
1, 20, 30a, 30b, 30c Light-emitting device 10 Substrate 12 Dam 13, 21, 31a, 31b, 31c Island-like member 14 Light-emitting element 15 Phosphor particle 16 Sealing material

Claims (10)

基板と、
前記基板上に形成された環状のダムと、
前記基板上の前記ダムに囲まれた素子搭載領域上に、前記ダムと離れて形成された島状部材と、
前記素子搭載領域上に搭載された複数の発光素子と、
前記素子搭載領域上に充填された、蛍光体粒子を含む封止材と、
を有する、発光装置。
A substrate,
An annular dam formed on the substrate;
On the element mounting region surrounded by the dam on the substrate, an island-like member formed away from the dam,
A plurality of light emitting elements mounted on the element mounting region;
A sealing material filled in the element mounting region and containing phosphor particles;
A light emitting device.
前記島状部材が、前記素子搭載領域の中心を含む領域上に形成された、
請求項1に記載の発光装置。
The island-shaped member is formed on a region including the center of the element mounting region.
The light emitting device according to claim 1.
前記島状部材が、十字型の平面形状を有する、
請求項2に記載の発光装置。
The island-shaped member has a cross-shaped planar shape;
The light emitting device according to claim 2.
複数の前記島状部材が、前記素子搭載領域の中心から外周まで前記島状部材に交わらずに通る直線が存在しないように配置された、
請求項1に記載の発光装置。
The plurality of island-shaped members are arranged so that there is no straight line passing through the island-shaped member from the center to the outer periphery without crossing the island-shaped member.
The light emitting device according to claim 1.
前記島状部材の上端の位置が、前記発光素子の上端の位置より高い、
請求項1〜4のいずれか1項に記載の発光装置。
The position of the upper end of the island-shaped member is higher than the position of the upper end of the light emitting element,
The light-emitting device of any one of Claims 1-4.
前記島状部材の上端が、前記封止材の表面から露出している、
請求項1〜5のいずれか1項に記載の発光装置。
The upper end of the island-shaped member is exposed from the surface of the sealing material,
The light emitting device according to claim 1.
前記島状部材が前記封止材中に埋もれている、
請求項1〜5のいずれか1項に記載の発光装置。
The island-shaped member is buried in the sealing material;
The light emitting device according to claim 1.
前記島状部材が、側面がテーパー状に傾斜した部分を有する、
請求項1〜7のいずれか1項に記載の発光装置。
The island-shaped member has a portion whose side surface is tapered.
The light emitting device according to claim 1.
前記島状部材が、側面が逆テーパー状に傾斜した部分、又は側面に前記基板に接しない突起が設けられた部分を有する、
請求項1〜7のいずれか1項に記載の発光装置。
The island-shaped member has a portion whose side surface is inclined in a reverse taper shape, or a portion provided with a protrusion that does not contact the substrate on the side surface
The light emitting device according to claim 1.
前記島状部材が白色又は透明である、
請求項1〜9のいずれか1項に記載の発光装置。
The island-shaped member is white or transparent,
The light emitting device according to claim 1.
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