CN101258613B - Liquid crystal display - Google Patents
Liquid crystal display Download PDFInfo
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- CN101258613B CN101258613B CN200580051555.8A CN200580051555A CN101258613B CN 101258613 B CN101258613 B CN 101258613B CN 200580051555 A CN200580051555 A CN 200580051555A CN 101258613 B CN101258613 B CN 101258613B
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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Abstract
A method of manufacturing a LED light source, wherein a LED (2) (red LED (R), green LED (G), and blue LED (B), or white LED (W)) is mounted on a frame (3), and an electric circuit is formed by punching out a tie bar without dicing the frame (3) for dividing the LED (2) into pieces. Thus, an RGB three primary color LED light source (1A) or a white LED light source (1B) lighting depending on the state of the frame (3) can be manufactured.
Description
Technical field
The present invention relates to a kind of LED (Light Emitting Diode, light-emitting diode) light source and manufacturing technology thereof, relate in particular to a kind of effective technology that is applicable to the led light source that adopts visual LED.
Background technology
In recent years, follow the brightnessization of self, LED is widely used in light source, ligthing paraphernalia of OA machines such as the backlight of liquid crystal display of mobile phone or photoflash lamp, traffic signaling equipment, printer etc.
For example, disclose a kind of led light source device, it can be when dispelling the heat to the heat of each LED generation of a plurality of LED after installing with radiator, and the ligthing paraphernalia hull efficiency after installing conducts heat (for example, with reference to patent documentation 1) well.
Patent documentation: TOHKEMY 2004-55229 communique ([0024]～[0025] section, Fig. 1).
Summary of the invention
Invent technical problem to be solved
1 LED is the point-source of light that sends light beam from the square cube of 0.2～3mm, and is less from the light beam that 1 LED sends, and is about 1～2 lumen.Therefore, under with the situation of LED, in order to remedy the illumination deficiency, or, a plurality of LED are gathered use in order to shine broader region as illumination light source.For example, when on the backlight of 32 inches liquid crystal panels, using LED, need 960 and cut apart LED in blocks, at random be installed on and guarantee the brightness expected on the printed circuit board by these being cut apart LED in blocks.To send to a direction with good efficiency and wide angle from the light beam that LED sends, thereby can obtain even and bright liquid crystal panel.
But, if the fluorescent lamp and the LED that only utilize numerical value will have identical luminous efficiency simply compare, the illumination light source that then adopts a plurality of LED is than the illumination light source price height that adopts a fluorescent lamp, thereby, can enumerate the low priceization of led light source as one of desired problem of led light source from now on.Led light source is installed on the printed circuit board one by one and makes by cutting apart many LED in blocks, therefore needs huge set-up time and erector's ordinal number.This just becomes one of reason of the high priceization that causes led light source.
The objective of the invention is to, a kind of technology that can realize the low priceization of led light source is provided.
Aforementioned and other purpose and new feature of the present invention can be clear and definite from the description and the accompanying drawing of this specification.
The technical scheme of technical solution problem
If it is the outline of representational invention in the application's invention disclosed is described simply, then as described below.
Led light source of the present invention, has the framework that forms by 1 row of configuration on the 2nd direction vertical or the above basic framework of 2 row with the 1st direction, load a plurality of LED on this framework, state according to framework is lighted, and above-mentioned basic framework is by constituting with the lower part: a plurality of small pieces engaging zones that have predetermined distance, arrange along the 1st direction; Relative with the small pieces engaging zones, along a plurality of wire-bonded zone that the 1st direction is arranged; With the binding of small pieces engaging zones, at upwardly extending the 1st lead of the 1st side; And with the binding of wire-bonded zone, at upwardly extending the 2nd lead of the 1st side.
The manufacture method of led light source of the present invention has: the operation of bonding led chip on a plurality of small pieces engaging zones of framework; Utilize closing line to connect the operation in opposing L ED chip and wire-bonded zone; Utilize resin-sealed led chip, small pieces engaging zones, closing line and wire-bonded zone to form the operation of LED; And the operation of punching a plurality of intercell connectors that framework has.
The invention effect
If explanation utilizes the effect of representational invention gained in the application's invention disclosed simply, and is then as described below.
Load the led light source of punching intercell connector and lighting behind a plurality of LED on the framework by being manufactured on according to the state of framework, with will cut apart LED in blocks and at random be installed on the led light source of making on the circuit board and compare, manufacturing process shortens, and required multiple material is installed is also become unnecessary, so can cut down material cost, can realize the low priceization of led light source.
Description of drawings
Fig. 1 is the key component plane graph of led light source of employing red LED, green LED and the blue led of present embodiment 1.
Fig. 2 covers the key component plane graph of led light source of the White LED of blue led chip for the employing of present embodiment 1 utilizes fluorophor.
Fig. 3 is the process chart of manufacture method of the backlight of present embodiment 1.
Fig. 4 is the key component plane graph and the key component profile of 2 frameworks that are listed as of present embodiment 1.
Fig. 5 is the key component profile of the led light source in each manufacturing process of present embodiment 1.
Fig. 6 is the key component profile of the backlight in each manufacturing process of present embodiment 1.
Fig. 7 is the skeleton diagram of the transmission type liquid crystal display device that is built-in with backlight of present embodiment 1.
Fig. 8 is the key component plane graph of 1 row, 2 row and 3 the 1st frameworks that are listed as of present embodiment 1.
Fig. 9 is 4 row of present embodiment 1 and the key component plane graph of 5 the 1st frameworks that are listed as.
Figure 10 is 1 row of present embodiment 1 and the key component plane graph of 2 the 2nd frameworks that are listed as.
Figure 11 is 3 row of present embodiment 1 and the key component plane graph of 4 the 2nd frameworks that are listed as.
Figure 12 is the key component plane graph of 6 frameworks that are listed as of present embodiment 1.
Figure 13 is the key component plane graph of 2 the 3rd frameworks that are listed as of present embodiment 1.
Figure 14 is the key component plane graph of 2 the 4th frameworks that are listed as of present embodiment 1.
Figure 15 is the key component plane graph of the led light source of the 1st configuration example of red LED, green LED and the blue led of expression present embodiment 1.
Figure 16 is the key component plane graph of the led light source of the 2nd configuration example of red LED, green LED and the blue led of expression present embodiment 1.
Figure 17 is the key component plane graph of the led light source of the 3rd configuration example of red LED, green LED and the blue led of expression present embodiment 1.
Figure 18 is the key component plane graph of the led light source of the 4th configuration example of red LED, green LED and the blue led of expression present embodiment 1.
Figure 19 is the key component plane graph of led light source that is used to illustrate the repair method of present embodiment 1.
Figure 20 is the schematic diagram of assembling device of led light source of employing volume to volume (the Reel to Reel) mode of present embodiment 1.
Figure 21 represents the key component plane graph of the led light source of present embodiment 2.
Figure 22 having had mark and applied the key component plane graph of led light source of frameworks of 2 row of voltage for present embodiment 3.
Figure 23 having had mark and applied the key component plane graph of led light source of frameworks of 2 row of voltage for present embodiment 3.
Figure 24 having had mark and applied the key component plane graph of led light source of frameworks of 2 row of voltage for present embodiment 3.
Figure 25 having had mark and applied the key component plane graph of led light source of frameworks of 4 row of voltage for present embodiment 3.
Figure 26 is the schematic diagram of the method for attachment of expression led light source of present embodiment 3 and power supply.
Figure 27 be present embodiment 4 employing the key component profile of led light source of plate reflecting plate.
Figure 28 be present embodiment 4 employing the key component profile of led light source of plate reflecting plate.
Figure 29 be present embodiment 4 employing the key component profile of led light source of reflecting plate of matrix.
Figure 30 be present embodiment 4 employing the key component profile of led light source of reflecting plate of matrix.
Figure 31 be present embodiment 4 employing the key component profile of led light source of reflecting plate of matrix.
Embodiment
In the present embodiment, for convenience, be divided into a plurality of parts or execution mode and describe, but except situation about expressing especially, be not that it doesn't matter between them, but have a side be the opposing party part or all variation, in detail, relation such as supplementary notes.
And, in the present embodiment, when the number that mentions key element waits (comprising number, numerical value, amount, scope etc.), on situation about expressing especially and principle, clearly be defined in the situation of specific number, all be not limited to this specific number, can for more than the specific number or below.And in the present embodiment, its inscape (also comprising key element step etc.) is except situation about expressing especially and clearly think not to be to be necessary certainly the necessary situation on principle.Equally, in the present embodiment, when the shape that mentions inscape etc., position relation etc., except situation about expressing especially and on principle, clearly think the situation that is not such, comprise approximate in fact or be similar to this shape etc.Like this equally for above-mentioned numerical value and scope.
In addition, in the present embodiment, so-called framework is meant that wherein, above-mentioned basic framework is by constituting with the lower part at the metal framework that repeats to be formed with the above basic framework of 1 row or 2 row on the 2nd direction: have predetermined distance, along a plurality of small pieces engaging zones of the 1st direction arrangement; Relative with the small pieces engaging zones, along a plurality of wire-bonded zone that the 1st direction is arranged; The 1st lead that links with the small pieces engaging zones, extends along the 1st direction; And the 2nd lead that links with wire-bonded zone, extends along the 1st direction.
In addition, in the employed accompanying drawing of present embodiment, even plane graph is also observed accompanying drawing and additional hatching sometimes for convenience.And then, attached to part in principle at all figure that are used for illustrating present embodiment with prosign with same function, omit repeat specification to it.Below, will describe embodiments of the present invention with reference to the accompanying drawings in detail.
(execution mode 1)
Use Fig. 1 and Fig. 2 that the structure of the led light source of present embodiment 1 is described.Fig. 1 is the key component plane graph of led light source (the following RGB 3 primary colors led light sources that the simply are called) 1A of the red LED (R), green LED (G) and these 3 LED of blue led (B) that have adopted RGB 3 primary colors.Fig. 2 has adopted the key component plane graph of led light source (the following White LED light source that simply is called) 1B that covers the White LED (W) of blue led chip with fluorophor.RGB 3 primary colors led light source 1A are owing to can manifest the peak value of luminescent spectrum of all kinds significantly, therefore having and can obtain advantages such as distinct color and colorrendering quality are good. White LED light source 1B is because white luminous with 1 LED formation, therefore can shorten from White LED light source 1B to diffuser plate 10 distance, compare with the situation of using RGB 3 primary colors led light source 1A, can realize the thin typeization (for example, the thickness about 0.35mm) of backlight 4.
Utilize Fig. 3～Fig. 6 and the manufacture method of the backlight that the RGB 3 primary colors led light sources by present embodiment 1 constitute is described according to process sequence.Fig. 3 is the process chart of the manufacture method of backlight, Fig. 4 (a) is the key component plane graph of the framework 3 of 2 row, Fig. 4 (b) is the key component profile along A-A ' line of this figure (a), Fig. 5 is the key component profile of the RGB 3 primary colors led light source 1A in each manufacturing process, and Fig. 6 is the key component profile of the backlight 4 in each manufacturing process.And then, in Fig. 7, an example of the skeleton diagram of the transmission type liquid crystal display device 5 that is built-in with backlight 4 is shown.
At first, shown in Fig. 4 (a) and Fig. 4 (b), the preparation framework 3 that has a plurality of product area 3A and be disposed at the intercell connector 3B between a plurality of product area 3A, these a plurality of product area 3A by the small pieces engaging zones 3a that led chip is installed, link the 1st suspension type lead 3c of small pieces engaging zones 3a and the 1st lead 3b, the wire-bonded zone 3d that is oppositely arranged with small pieces engaging zones 3a and the 2nd suspension type lead 3f that links wire-bonded zone 3d and the 2nd lead 3e constitute.Framework 3 is a mother metal with copper (Cu) for example, and to its electroplate (Ag) (the operation P1 of Fig. 3).In addition, the thickness of framework 3 for example is about 100～300 μ m, and its width (width of representing with w among the figure) for example is about 15～20mm.
Next, shown in Fig. 5 (a), a front end (small pieces engaging zones) coating sizing-agent at framework 3 presses led chip 2c gently on this slurry, by about 100～200 ℃ temperature, carry out the cure process of slurry.Thus, mechanically fixing led chip 2c and the framework 3 (the operation P2 of Fig. 3) of also electrically connecting.
Led chip 2c for example is a GaP class led chip.Can be in the manufacturing process of led chip 2c operation or diffusing procedure before being called as with for example following formation of the chip unit of semiconductor wafer.For example, on the semiconductor substrate (semiconductor thin plate that is called as the plane circular of semiconductor wafer in this stage) that constitutes by monocrystalline GaP (or monocrystalline GaAs), form n type semiconductor layer and p type semiconductor layer successively by the epitaxial crystallization growth method, thereby form luminescent layer.Next, the reverse side of grinded semiconductor substrate is reduced to the thickness of regulation with the thickness of semiconductor substrate, further the reverse side of grinding semiconductor substrate.Next, be electrically connected in the p lateral electrode on the p type semiconductor layer and be electrically connected in after n lateral electrode on the semiconductor substrate forms, measure electrical characteristic, the optical characteristics of each led chip 2c.For example, the semiconductor substrate mounting on measuring with platform, is made probe contact p lateral electrode, if from the input terminal waveform input signal, then from the lead-out terminal signal output waveform.By read this signal waveform by tester, obtain the characteristic of each led chip 2c.Thereafter, the cutting semiconductor substrate is divided into the led chip 2c of 0.2～3mm about square.
Then, shown in Fig. 5 (b), connect another front end (wire-bonded zone) and the p lateral electrode (the operation P3 of Fig. 3) of the framework 3 relative with closing line 6 with led chip 2c.At this moment, closing line 6 forms the annular of the periphery lifting that does not touch led chip 2c.
Next, shown in Fig. 5 (c), framework 3 is placed metal pattern 7, improve temperature, the resin 8 of force feed fluidization flows into metal pattern 7, with resin 8 sealing LED chip 2c, small pieces engaging zones, closing line 6 and wire-bonded zone, form LED2 (the operation P4 of Fig. 3).Then, remove unnecessary resin 8 and burr.Then, shown in Fig. 5 (d), punch the intercell connector (the operation P5 of Fig. 3) of framework 3 with cutting machine 7a.Thus, aforementioned RGB shown in Figure 13 primary colors led light source 1A finish substantially.
Next, shown in Fig. 6 (a), between the shadow surface side of the LED2 of the adjacency of RGB 3 primary colors led light source 1A, embed reflecting plate 9 (the operation P6 of Fig. 3).In general, if the led light source heating, then luminous efficiency will descend and produce color spot.Therefore, for example, the reflecting plate that is made of sheet material (film or plate) is set in order to prevent the light leak to the back side, the luminous efficiency of raising led light source.Then, shown in Fig. 6 (b), the diffuser plate 10 (the operation P7 of Fig. 3) of RGB 3 primary colors led light source 1A is set in the shadow surface side.Diffuser plate 10 is the translucent sheet materials (film or plate) that make light scattering or diffusion, is mainly used in to make broad face integral body be uniform brightness.
Next, shown in Fig. 6 (c), prismatic lens 11a, 11b (the operation P8 of Fig. 3) are set on diffuser plate 10. Prismatic lens 11a, 11b have a sheet material of spotlight effect (film or plate) forwards, and section comprises zigzag or concavo-convex etc.Then, shown in Fig. 6 (d), on the back side of RGB 3 primary colors led light source 1A, plate 13 (the operation P9 of Fig. 3) is set via dielectric film 12.Thus, backlight 4 is finished substantially.Plate 13 for example is aluminium (Al) plate, except keeping RGB 3 primary colors led light source 1A, also has the function of heating panel.
Thereafter, as shown in Figure 7, by the back side at liquid crystal display cells 14 backlight 4 is set, the liquid crystal indicator 5 of built-in backlight 4 is finished substantially.Above-mentioned liquid crystal display cells 14 is for example stacked and constitute by Polarizer 14a, liquid crystal cell 14b, colour filter 14c, Polarizer 14d and semi-transparent semi-reflecting lens 14e.Polarizer 14a be vibration limiting with light wave in the plate or the film of a direction, colour filter 14c is the filter that is used to show RGB 3 primary colors.
In addition, in earlier figures 6, the manufacture method of loading the backlight 4 of RGB 3 primary colors led light source 1A has been described, profit uses the same method also can make the backlight that loads White LED light source 1B.
As mentioned above, in present embodiment 1, after being loaded into LED2 (red LED (R), green LED (G) and blue led (B) or White LED (W)) on the framework 3, be not used for LED2 is cut apart the cutting of framework in blocks 3, but form electric circuit by removing intercell connector, make the RGB 3 primary colors led light source 1A or the White LED light source 1B that light according to the state of framework 3.Thus, with cut out LED from lead frame, will cut apart the led light source that LED in blocks at random is installed on the circuit board and make and compare, manufacturing process is shortened, and do not need to be used for wiring plate and LED are bonded to slurry on the circuit board, therefore can cut down material cost.Its result can realize the low priceization of RGB 3 primary colors led light source 1A or White LED light source 1B.
(frame shape)
In earlier figures 4, the frameworks 3 of 2 row of example has illustrated alternate configurations small pieces engaging zones and intercell connector, but the shape of framework is not limited thereto.Below, the different shape of the framework of present embodiment 1 is illustrated among Fig. 8～Figure 13.
Mainly the flat shape of the 1st framework that uses with monomer is shown in Fig. 8 and Fig. 9.It (c) is 1 row, 2 row and the 1st framework 15a of 3 row, the key component plane graph of 15b, 15c that Fig. 8 (a) and (b) reach.Fig. 9 (a) and (b) be the 1st framework 15d, the key component plane graph of 15e of 4 row and 5 row.
Then, mainly the flat shape by making up a plurality of the 2nd frameworks that use shown in Figure 10 and Figure 11.Figure 10 (a) and (b) be the 2nd framework 16a, the key component plane graph of 16b of 1 row and 2 row.Figure 11 (a) and (b) be the 2nd framework 16c, the key component plane graph of 16d of 3 row and 4 row.Among the 2nd framework 16a～16d, the spacing of the y direction of small pieces engaging zones 17 (with respect to vertical direction, the 2nd direction of orientation of the guide hole CN of the 2nd framework 16a～16d) is equally spaced configuration.Have at needs under the situation of framework of the columns more than 5 row, can from the 2nd framework 16a～16d of these 1 row～4 row, select arbitrarily a kind ofly, make by making up, promptly, the framework of n row and the framework of m row can be made up, thereby make the framework that (n+m) is listed as.
Figure 12 shows the key component plane graph of the framework 18 of 6 row that the 2nd framework 16d combination of 4 row shown in the 2nd framework 16b of the row of 2 shown in aforementioned Figure 10 (b) and aforementioned Figure 11 (b) is formed. in the framework 18 of 6 row that form in this combination, also can make spacing on the y direction of small pieces engaging zones 17 for uniformly-spaced. in the 2nd framework 16b and the 2nd framework 16d bonding, for example adopt adhesive tape etc. in addition, also can make up the 2nd framework 16b of the row of 2 shown in 3 aforementioned Figure 10 (b), form the framework of 6 row, or make up the 2nd framework 16c of 3 shown in 2 aforementioned Figure 11 (a) row, form the framework of 6 row. and then, combination by a plurality of the 2nd framework 16a～16d, also can form the above framework of 7 row, can realize having the led light source of big relatively area.
Then, Figure 13 shows the area that relatively increases the small pieces engaging zones, the flat shape that can load the 3rd framework of a plurality of LED on 1 small pieces engaging zones.Figure 13 (a) is the key component plane graph that can load 2 the 3rd frameworks 19 that are listed as of 3 LED on 1 small pieces engaging zones 17a, and Figure 13 (b) is the key component plane graph that has loaded the 3rd framework 19 of these 3 LED of red LED, green LED and blue led on 1 small pieces engaging zones 17a.Dotted line shown in Figure 13 (b) is represented resin 20, by 1 resin, 20 sealing 3 LED, 1 small pieces engaging zones 17a, 3 closing lines 6 and 3 wire-bonded zones.In the 3rd framework 19, because width that can broadening small pieces engaging zones 17 so compare with for example the 1st framework 15b shown in the earlier figures 8 (b), can improve radiating efficiency.In addition, the 3rd framework 19 is mainly used in RGB 3 primary colors led light source 1A.And then, also can adopt the 3rd framework that loads 4 LED (for example 1 red LED, 2 green LED and 1 blue led) in order to improve white efficient.At this moment, also the quantity with LED is identical in the wire-bonded zone relative with small pieces engaging zones 17a, is 4.
Next, Figure 14 shows and load 1 LED on 1 small pieces engaging zones, clips the flat shape that a plurality of small pieces engaging zones are provided with the 4th framework of intercell connector rather than alternate configurations small pieces engaging zones and intercell connector.Figure 14 (a) be will go up configuration continuously in x direction (with respect to parallel direction, the 1st direction of orientation of the guide hole CN of the 4th framework 22) 3 small pieces engaging zones 17 as a zone and be provided with the key component plane graph that intercell connector 21 is separated the 4th framework 22 between its zone, Figure 14 (b) is the key component plane graph that these 3 LED of red LED, green LED and blue led is loaded in the 4th framework 22 on 3 small pieces engaging zones 17 in above-mentioned 1 zone respectively.Dotted line shown in Figure 14 (b) is represented resin 20, by 20 sealings of 1 resin 3 LED, 17,3 closing lines 6 of 3 small pieces engaging zones and 3 wire-bonded zones.In addition, the 4th framework 22 is identical with aforesaid the 3rd framework 19, is mainly used in RGB 3 primary colors led light source 1A.And then, also can adopt the 4th framework that in an above-mentioned zone, loads 4 LED (for example 1 red LED, 2 green LED and 1 blue led) in order to improve white efficient.
(the configuration pattern of LED)
In RGB 3 primary colors led light source 1A, the quantity that is loaded into the green LED on the framework by increase makes it more than other the red LED or the quantity of blue led, can realize the raising of white efficient.Below, in Figure 15～Figure 18 illustration the various configurations of the red LED that is used to improve white efficient, blue led and green LED of present embodiment 1.For framework, adopt the 2nd framework 16d (aforementioned Figure 11 (b)) of small pieces engaging zones 17 at 4 row of the first-class arranged spaced of y direction.
Figure 15 is the alternate configurations that the odd number of x direction is classified red LED (R) and green LED (G) as, the even number of x direction is classified the alternately key component plane graph of arranged RGB 3 primary colors led light source 1A1 of green LED (G) and blue led (B) as, Figure 16 be the x direction be arranged as red LED (R), green LED (G), the repetition of blue led (B) and green LED (G), green LED (G) is the key component plane graph of the RGB 3 primary colors led light source 1A2 of configuration in a zigzag on the y direction, Figure 17 be the x direction be arranged as red LED (R), green LED (G), the repetition of blue led (B) and green LED (G), green LED (G) is configured to the key component plane graph of the RGB 3 primary colors led light source 1A3 of row on the even column of y direction, Figure 18 disposes green LED (G) on the odd column of x direction, the even number of x direction is classified the key component plane graph of RGB 3 primary colors led light source 1A4 of the alternate configurations of red LED (R) and blue led (B) as. the red LED of any one configuration among Figure 15～Figure 18 (R), green LED (G), the number ratio of blue led (B) is 1: 2: 1. in addition, in execution mode 1, be not limited to this, also the LED that disposes on the even column can be disposed at odd column, the LED that disposes on the odd column is disposed at even column.
(collocation)
If the luminous efficiency of LED has deviation, then brightness will change, the color spot that occurs in the led light source or deep or lightly will become problem.Therefore, present embodiment 1 adopts following method: before being called as in the manufacturing process of operation or diffusing procedure, after forming a plurality of led chips on the semiconductor wafer, measure electric, the optical characteristics of each led chip, its performance data is stored on the floppy disk memory medias such as (floppy disk, registered trade marks), or be stored in the database by network, based on above-mentioned performance data, the led chip that selection automatically has identical or close feature is adhered to these led chips on the framework then.Thus, can be loaded on the framework by the LED that luminous efficiency difference is little, so can obtain not having color spot or deep or light led light source.
(repairing)
Even be loaded into the LED breakage on the framework, also can easily repair led light source.Here, the method for 1 LED that does not work being replaced by the additional LED of using is described.Figure 19 is the key component plane graph that is used to illustrate the RGB 3 primary colors led light source 1A of repair method.RGB 3 primary colors led light source 1A are formed on the framework 3 of 2 row.
At first, shown in Figure 19 (a),, then, shown in Figure 19 (b), punch the LED23 that does not work from framework 3 by lighting the LED23 that the test affirmation does not work.Shown in Figure 19 (c), make a plurality of additional LED24 of using in advance, from wherein select be loaded in framework 3 on red LED (R), green LED (G) and the identical or close additional LED24 of using of blue led (B) characteristic.Then, shown in Figure 19 (d), punching of framework 3 on the position of the LED23 that do not work bonding replenishing use LED24.Use the bonding of LED24 for replenishing, for example can adopt scolder.
(assembling device of led light source)
Below the assembly method of the led light source of volume to volume mode is adopted in explanation.Figure 20 is the schematic diagram of assembling device 25 that adopts the led light source of volume to volume mode.To be wound in a framework 3 on the volume 26 during another volume 27 twines, engage operation 28 (the operation P2 of earlier figures 3), wire-bonded operation 29 (the operation P3 of earlier figures 3), mold pressing procedure 30 (the operation P4 of earlier figures 3) and intercell connector cutting operation 31 (the operation P5 of earlier figures 3) through small pieces, LED is loaded on the framework 3 continuously.Thereby, can make the led light source that can be wound in the band shape of rolling up the length on 26,27 continuously., banded led light source severing arbitrarily length can be, therefore led light source can be made with versatility thereafter.
In addition, also can not adopt the volume to volume mode, but utilize the manufacture method that in each operation, adopts little wafer bonder, wire bonder and molding device respectively, make led light source.But, in this manufacture method, the size of the size of the magazine (being used to supply with and take in the container of framework) that possesses by each manufacturing installation decision framework, so the length of framework will be restricted.
(execution mode 2)
Below utilize Figure 21 that the led light source of present embodiment 2 is described.Figure 21 (a) has been to use the key component plane graph of the RGB 3 primary colors led light source 32A of red LED (R), green LED (G) and blue led (B), and Figure 21 (b) has been to use the key component plane graph with the White LED light source 32B of the White LED (W) of fluorophor covering blue led chip.In present embodiment 2, the RGB 3 primary colors led light source 1A or the White LED light source 1B that for example use seperator will be formed on the frameworks 3 of 2 row of aforementioned Figure 1 and Figure 2 of aforementioned embodiments 1 carry on the back on the x direction and cut, make the RGB 3 primary colors led light source 32A of 21 row, or the White LED light source 32B of 21 row.As mentioned above, on the framework 3 of 2 row, load after the LED2, carry on the back the method for cutting the White LED light source 32B that makes 1 RGB 3 primary colors led light source 32A that are listed as or 1 row, make the method for the led light source of 1 row compares with loading LED on the framework 3 of 1 row, can shorten manufacturing time. and then, cut by framework 3 is carried on the back, can easily carry out the adjustment at interval of White LED light source 32B of RGB 3 primary colors led light source 32A or 1 row or the adjustment of luminosity.
In addition, in present embodiment 2, the columns of framework 3 is made as 2 row, but also can under the situation of the frameworks that for example adopt 3 row, can be divided into the led light sources of 31 row or be divided into the led light source of 11 row and the led light source of 12 row for more than 3 row.
(execution mode 3)
Figure 22～Figure 25 shows the power supply method of attachment to the led light source of present embodiment 3.Figure 22 (a) and (b) be respectively to be formed on the frameworks 33 of 2 row and to be applied with the RGB 3 primary colors led light source 34A of voltage and the key component plane graph of White LED light source 34B from an end of this framework 33, Figure 23 (a) and (b) be respectively to be formed on the frameworks 35 of 2 row and to be applied with the RGB 3 primary colors led light source 36A of voltage from two ends of this framework 35 and the key component plane graph of the 1st example of White LED light source 36B, Figure 24 (a) and (b) be respectively to be formed on the frameworks 37 of 2 row and to be applied with the RGB 3 primary colors led light source 38A of voltage from two ends of this framework 37 and the key component plane graph of the 2nd example of White LED light source 38B, Figure 25 are the key component plane graphs that is formed on the frameworks 39 of 4 row and is applied with the White LED light source 40 of voltage from two ends of this framework 39.
The intercell connector 33a that Figure 22 (a) and the RGB 3 primary colors led light source 34A that (b) illustrate respectively and White LED light source 34B stay an end of framework 33, other intercell connector all is cut off, and also is cut off between the intercell connector 33a that stays and 1 inboard wire 33b.Thus, by intercell connector 33a 2 outboard wire 33c are linked.Therefore, be connected with an end of framework 33 by the power supply that will be linked on RGB 3 primary colors led light source 34A or the White LED light source 34B, can apply the voltage (positive voltage or negative voltage) of the 1st polarity to 2 outboard wire 33c that the end linked of red LED (R), green LED (G) and blue led (B) or White LED (W), apply voltage (negative voltage or positive voltage) with the 1st opposite polarity the 2nd polarity to 1 inboard wire 33b that another end linked of red LED (R), green LED (G) and blue led (B) or White LED (W).
Figure 23 (a) and the RGB 3 primary colors led light source 36A and the White LED light source 36B that (b) illustrate respectively, similarly make with aforesaid RGB 3 primary colors led light source 34A and White LED light source 34BLED light source, the intercell connector 35a that stays on the end by framework 35 links 2 outboard wire 35b.Therefore, be connected with two ends of framework 35 by the power supply that will be linked on RGB 3 primary colors led light source 36A or the White LED light source 36B, can apply the voltage (positive voltage or negative voltage) of the 1st polarity to 2 outboard wire 35c that the end linked of red LED (R), green LED (G) and blue led (B) or White LED (W), apply the voltage (negative voltage or positive voltage) of the 2nd polarity to 1 inboard wire 35b that another end linked of red LED (R), green LED (G) and blue led (B) or White LED (W).
Intercell connector 37a1,37a2 that Figure 24 (a) and the RGB 3 primary colors led light source 38A that (b) illustrate respectively and White LED light source 38B stay two ends of framework 37, other intercell connector all is cut off, be cut off between the intercell connector 37a1 that stays on the end of framework 37 and 1 inboard wire 37b, be cut off between the intercell connector 37a2 that stays on another end of framework 37 and 2 outboard wire 37c.Thus, 2 outboard wire 37c are linked, keep 1 inboard wire 37b by intercell connector 37a2 by intercell connector 37a1.Therefore, be connected with two ends of framework 37 by the power supply that will be linked on RGB 3 primary colors led light source 38A or the White LED light source 38B, can apply the voltage (positive voltage or negative voltage) of the 1st polarity to 2 outboard wire 37c that the end linked of red LED (R), green LED (G) and blue led (B) or White LED (W), apply the voltage (negative voltage or positive voltage) of the 2nd polarity to 1 inboard wire 37b that another end linked of red LED (R), green LED (G) and blue led (B) or White LED (W).
As shown in figure 25, White LED light source 40 stays a part of intercell connector 39a1 of an end of framework 39, link the 2nd row and the 4th column wire 3962,3964, stay a part of intercell connector 39a2 of another end of framework 39, link the 1st row, the 3rd row and the 5th column wire 39b1,3963,3965, other intercell connector all cuts off.And then, be cut off between intercell connector 39a1 and the 3rd column wire 3963, be cut off between intercell connector 39a2 and the 2nd row and the 4th column wire 3962,3964.Thus, the 2nd column wire 3962 and the 4th column wire 3964 are linked, the 1st column wire 39b1, the 3rd column wire 3963 and the 5th column wire 3965 are linked with intercell connector 39a2 with intercell connector 39a1.Therefore, be connected with two ends of framework 39 by the power supply that will be linked on the White LED light source 40, the voltage (positive voltage or negative voltage) that can apply the 1st polarity to the 2nd column wire 3962 that the end linked and the 4th column wire 3964 of White LED (W) applies the voltage (negative voltage or positive voltage) of the 2nd polarity to the 1st column wire 39b1 that another end linked, the 3rd column wire 3963 and the 5th column wire 3965 of White LED (W).
Below, utilize schematic view illustrating shown in Figure 26 to connect 3 kinds of methods of power supply to the led light source of present embodiment 3.The method that connects power supply in end of framework is described, but the method that connects power supplys in two ends of framework also is identical herein.
The 1st method of attachment is to adopt scolder 44 to connect the method for lead 45 in an end of the framework 43 that constitutes led light source 42 shown in Figure 26 (a).The 2nd method of attachment is to adopt connector 46 to connect the method for lead 45 in an end of the framework 43 that constitutes led light source 42 shown in Figure 26 (b).The 3rd method of attachment is to adopt connector 46a fixedly to form the method for the flexible base plate 48 of wiring pattern 47 in an end of the framework 43 that constitutes led light source 42 shown in Figure 26 (c).Between wiring pattern 47 and framework 43, accompany anisotropic conductive film 49,, then in anisotropic conductive film 49, flow through electric current, wiring pattern 47 and framework 43 conductings in case apply voltage.
(execution mode 4)
Figure 27～Figure 30 shows the method to set up of the reflecting plate of present embodiment 4.Figure 27 and Figure 28 are the key component profiles that has adopted the led light source 51 of plate reflecting plate 50, and Figure 29 and Figure 30 are the key component profiles of led light source 53 that has adopted the reflecting plate 52 of matrix.Reflecting plate 50,52 for example is sheet (film or a plate), and its thickness for example is about 0.5mm.
As shown in figure 27, plate reflecting plate 50 is embedded between the shadow surface side of LED54 of adjacency of led light source 51.At this moment, the plate 55 that can distribute from the heat of led light source 51 generations can be set at the back side of led light source 51.Plate 55 for example is aluminium (Al) plate.In addition, as shown in figure 28, plate reflecting plate 50 can also be arranged at the back side of led light source 51.
As shown in figure 29, the reflecting plate 52 of matrix is embedded between the shadow surface side of LED54 of adjacency of led light source 53.By making it be matrix, can improve light gathering efficiency.The plate 55 that can distribute from the heat of led light source 53 generations can be set at the back side of led light source 53.In addition, as shown in figure 30, the reflecting plate 52 of matrix also can be arranged on the back side of led light source 53.
In addition, in present embodiment 4, illustration on 1 small pieces engaging zones bonding 1 led chip and 1 led chip carried out the led light source (for example adopting the 1st framework 15a～15e of aforementioned embodiments 1 or the led light source of the 2nd framework 16a～16d) of resin-sealed discrete component type, but also applicable to for example bonding a plurality of led chips and carry out resin-sealed on 1 small pieces engaging zones to a plurality of led chips, perhaps bonding 1 led chip and a plurality of led chips are concentrated the led light source (for example adopting the 3rd framework 19 of aforementioned embodiments 1 or the led light source of the 4th framework 22) carry out resin-sealed a plurality of component types on 1 small pieces engaging zones.
Illustrated and on the 3rd framework 19 of aforementioned embodiments 1, loaded red LED (R), green LED (G) and blue led (B), be provided with the example of RGB 3 primary colors led light sources 57 of the reflecting plate 53 of matrix among Figure 31 at the back side of the 3rd framework 19.Figure 31 (a) is the key component plane graph of RGB 3 primary colors led light sources 57, and Figure 31 (b) is the key component profile along B-B ' line of this figure (a).
More than, based on specifically clear present inventor's invention of execution mode, certainly, the present invention is not limited to aforementioned embodiments, can carry out various variations in the scope that does not break away from its main points.
For example, in aforementioned embodiments, the White LED light source that the RGB 3 primary colors led light sources that used red LED, green LED and blue led has been described and has used the blue led chip that covers with fluorophor, but, for example adopt the led light source of the method that on the bluish violet led chip, encourages the luminous fluorophor of red, green, blue also applicable to the led light source that has used other illumination modes.
Industrial applicibility
Led light source of the present invention can be widely used in mobile phone, on-vehicle machines, traffic signaling equipment, ligthing paraphernalia or OA (Office Automation, office automation) in machine etc., can replace mutually with the light source that uses in the past always, in addition, also can be for the purposes towards frontier as the invention element.
Claims (6)
1. liquid crystal indicator, the back side of liquid crystal display cells is provided with backlight, it is characterized in that,
Described backlight has:
Led light source;
Be arranged on the diffuser plate on the described led light source; With
Be arranged on the prismatic lens on the described diffuser plate,
Described led light source has:
A plurality of die paddle;
With each the 1st integrally formed lead in described a plurality of die paddle;
Be configured in the locational a plurality of wire-bonded zone relative respectively with described a plurality of die paddle;
With each the 2nd integrally formed lead in described a plurality of wire-bonded zone;
Be loaded in a plurality of led chips on described a plurality of die paddle respectively;
The a plurality of lead-in wires that electrically connect described a plurality of led chip and described a plurality of wire-bonded zone respectively; And
Seal a plurality of resins of described die paddle, described wire-bonded zone, described led chip and described lead-in wire respectively.
2. liquid crystal indicator as claimed in claim 1 is characterized in that,
Described a plurality of die paddle is striden the multiple row configuration along the 1st direction,
Described a plurality of die paddle has and is configured in a plurality of the 1st die paddle that the 1st in the described multiple row list and is configured in and the 2nd adjacent a plurality of the 2nd die paddle that list of described the 1st row,
Described the 1st lead is formed between described a plurality of the 1st die paddle and described a plurality of the 2nd die paddle along described the 1st direction.
3. liquid crystal indicator as claimed in claim 2 is characterized in that,
The multiple row configuration is striden along described the 1st direction in described a plurality of wire-bonded zone,
Described a plurality of wire-bonded zone has: be respectively formed on the position relative with described a plurality of the 1st die paddle and be configured in a plurality of the 1st wire-bonded zones that the 1st in the described multiple row lists; Be respectively formed at the position relative with described a plurality of the 2nd die paddle on and be configured in and adjacent the 2nd a plurality of the 2nd wire-bonded zones that list of described the 1st row,
With each integrally formed described the 2nd lead in described a plurality of the 1st wire-bonded zones, via the intercell connector that forms along the 2nd direction of intersecting with described the 1st direction, integrally formed with the 3rd lead, each in wherein said the 3rd lead and described a plurality of the 2nd wire-bonded zone is integrally formed.
4. liquid crystal indicator as claimed in claim 3 is characterized in that,
Between described a plurality of the 1st die paddle and described a plurality of the 2nd die paddle, dispose reflecting plate.
5. liquid crystal indicator as claimed in claim 3 is characterized in that,
The surface of described prismatic lens forms zigzag.
6. liquid crystal indicator as claimed in claim 3 is characterized in that,
Described led chip has red LED, green LED and blue led.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200580051555.8A CN101258613B (en) | 2005-09-20 | 2005-09-20 | Liquid crystal display |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200580051555.8A CN101258613B (en) | 2005-09-20 | 2005-09-20 | Liquid crystal display |
| PCT/JP2005/017291 WO2007034537A1 (en) | 2005-09-20 | 2005-09-20 | Led light source and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101258613A CN101258613A (en) | 2008-09-03 |
| CN101258613B true CN101258613B (en) | 2010-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200580051555.8A Expired - Fee Related CN101258613B (en) | 2005-09-20 | 2005-09-20 | Liquid crystal display |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI626395B (en) * | 2013-06-11 | 2018-06-11 | 晶元光電股份有限公司 | Light emitting device |
| US9395067B2 (en) * | 2013-10-07 | 2016-07-19 | Flextronics Ap, Llc | Method of and apparatus for enhanced thermal isolation of low-profile LED lighting fixtures |
| CN103996788A (en) * | 2014-05-21 | 2014-08-20 | 广东威创视讯科技股份有限公司 | LED device for display screen and manufacturing method thereof |
| WO2018114470A1 (en) * | 2016-12-21 | 2018-06-28 | Lumileds Holding B.V. | Aligned arrangement of leds |
| CN110133912A (en) * | 2019-05-24 | 2019-08-16 | 佛山市国星光电股份有限公司 | A kind of LED backlight device and backlight module |
-
2005
- 2005-09-20 CN CN200580051555.8A patent/CN101258613B/en not_active Expired - Fee Related
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| Title |
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| JP昭60-113655A 1985.06.20 |
| JP昭61-95583A 1986.05.14 |
| JP特开2000-114553A 2000.04.21 |
| JP特开2004-257801A 2004.09.16 |
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