CN206422094U - A kind of LED support, LED component and the LED display of pad depression - Google Patents
A kind of LED support, LED component and the LED display of pad depression Download PDFInfo
- Publication number
- CN206422094U CN206422094U CN201621446920.7U CN201621446920U CN206422094U CN 206422094 U CN206422094 U CN 206422094U CN 201621446920 U CN201621446920 U CN 201621446920U CN 206422094 U CN206422094 U CN 206422094U
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- Prior art keywords
- led chip
- led
- depression
- pad
- crystal bonding
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
The utility model discloses a kind of LED support of pad depression, include the cup cover of metallic support and the parcel metallic support, metal pins of the metallic support in embedded this glass cover are constituted with the metal pin being exposed at outside this glass cover, the part that the cup cover is arranged at the top of the metal pins is reflector, and the part that the metal pins are arranged at reflector inner chamber bottom surface is pad；The pad is provided with least one relative to bond pad surface toward recessed depression crystal bonding area and at least one plane crystal bonding area concordant with bond pad surface.The invention also discloses a kind of LED component comprising above-mentioned LED support and LED display.Thus, the utility model only can be while the uniformity and uniformity that improve LED component light extraction be realized by the improvement of simple pad structure, it is ensured that the LED component of LED support and the application LED support and the stability and using effect of LED display.
Description
Technical field
The utility model is related to LED technology field, and in particular to a kind of LED support, LED component and the LED of pad depression
Display screen.
Background technology
In recent years, LED is fast-developing, and is dominated the market with advantages such as efficient, energy-saving and environmental protection, constantly replaces traditional lighting
And field of liquid crystal display.For color LED is shown, the uniformity and uniformity of LED light extractions are always as its display of evaluation
The important indicator of effect quality.
At present, full-color device is main using R, G, B three primary colours chip as luminescence unit, by driving IC to adjust each primary colours ratio
Example obtains the light of different colours.Wherein, the generally vertical structure of R chips, G, B chip are usually horizontal structure, due to itself
The difference of structure, the height of R chips is often higher than G, B chip.But, fixed position Dou Chu of the three primary colours chip bottom in pad
In in same level height, so causing the exiting surface of R chips to be higher than G, B chip, and then RGB, the RG for causing device to be sent
Or non-uniform phenomenon occurs in RB mixed light, display effect is influenceed.
Prior art is uneven, no to solve full-color device light extraction by using the consistent three primary colours chip of size
Consistent the problem of.For example, patent document (Authorization Notice No.：The U of CN 203932050) a kind of surface attaching type LED is disclosed, its
Including PPA supports；It is arranged on the crystal-bonding adhesive on the PPA supports；It is arranged on by the die bond glue sticking on the PPA supports
Three color chips；Three color chip is connected with the PPA supports by gold thread；The size of three color chip is consistent,
And die bond mode is yi word pattern.Although the technical scheme can make the exiting surface of R, G, B chip highly consistent, difficulty is realized
Height, because the R chips overwhelming majority of existing market sale is vertical stratification, its size is different from G, B chip of horizontal structure, then
Cause its height higher than G, B chip of horizontal structure plus backing material difference, prior art is difficult the height for accomplishing three
It is identical.
In addition, the crystal-bonding adhesive used in fixed chip is divided into conductive rubber cement added with conductive materials and non-conductive at present
Insulation rubber cement.The R chips of vertical stratification are typically bonded on pad by conductive rubber cement, and G, B chip of horizontal structure are then
By insulating, rubber cement is bonded on pad.The influence of the insulation excessively multipair device of rubber cement consumption is smaller, but for conductive rubber cement,
If control is improper, excessive conductive rubber cement may touch neighbouring pad, so as to cause device inside short circuit, cause
The performance of effect of leakage device.
Utility model content
For the drawbacks described above of prior art, the utility model purpose is to provide a kind of LED support of pad depression, passes through
Pad structure is made improvements, realize improve LED component light extraction uniformity and uniformity while, it is ensured that LED support and should
With the LED component of the LED support and the security reliability of LED display and using effect；It is of the present utility model another object is that
A kind of LED component comprising above-mentioned LED support and LED display are provided.
The technical solution adopted in the utility model is：
A kind of LED support of pad depression, including metallic support and the cup cover for wrapping up the metallic support, the metallic support
Metal pins in embedded this glass cover are constituted with the metal pin being exposed at outside this glass cover, and the cup cover is arranged at the gold
It is reflector to belong to the part at the top of pin, and the part that the metal pins are arranged at reflector inner chamber bottom surface is pad；Institute
State pad and be provided with least one relative to bond pad surface is toward recessed depression crystal bonding area and at least one is flat with bond pad surface
Neat plane crystal bonding area.
More preferably, the inner space of the depression crystal bonding area is up-narrow and down-wide.
More preferably, the inner bottom surface of the depression crystal bonding area is plane or the upward cambered surface of nock.
Specifically, the plan structure of the depression crystal bonding area is rectangular, circular, triangle, trapezoidal or irregular shape.
To reach the second purpose of the present utility model, the utility model provides the LED component that a kind of pad is recessed, including
LED support, LED chip and packing colloid；The LED support is the LED branch of the pad depression described in claim any one of 1-4
Frame, the LED chip is the group of any one or two kinds in green LED chip or blue-light LED chip and red LED chip
Close, the green LED chip or blue-light LED chip are arranged in the plane crystal bonding area, and the red LED chip is arranged on institute
State in depression crystal bonding area, the exiting surface of the green LED chip or blue-light LED chip and the exiting surface of the red LED chip
In same level height；The packing colloid is filled in the reflector inner chamber.
More preferably, the LED chip includes red LED chip, green LED chip and each one of blue-light LED chip, described
The pad of LED support is provided with a depression crystal bonding area and two plane crystal bonding areas, and the red LED chip is arranged on described
It is recessed in crystal bonding area, the green LED chip and blue-light LED chip are separately positioned in described two plane crystal bonding areas, described
The exiting surface of red LED chip, green LED chip and blue-light LED chip is in same level height.
More preferably, the red LED chip is vertical stratification, and the green LED chip and blue-light LED chip are level
Structure.
More preferably, the red LED chip is bonded in the depression crystal bonding area by conductive rubber cement；The green light LED
Chip and blue-light LED chip are bonded in described two plane crystal bonding areas respectively by the rubber cement that insulate.
More preferably, a height of 6mil~7mil of the red LED chip, its long a width of 5mil*5mil of *, 6mil*6mil,
7mil*7mil, 8mil*8mil or 9mil*9mil；A height of 4mil~5mil of the green LED chip, its long a width of 5mil* of *
6mil, 5mil*7mil, 6mil*8mil, 6mil*9mil, 8mil*10mil or 10mil*12mil；The blue-light LED chip
A height of 4mil~5mil, its long * a width of 5mil*6mil, 5mil*7mil, 6mil*8mil, 6mil*9mil, 8mil*10mil or
10mil*12mil。
To reach the 3rd purpose of the present utility model, the utility model provides the LED display that a kind of pad is recessed, its
Formed by some LED components are evenly distributed, each LED component is the LED component described in any of the above-described.
Relative to prior art, the utility model has the advantages that：
(1) by being made improvements to pad structure, namely on pad depression crystal bonding area is set to be used as red LED chip
Installation site, sets plane crystal bonding area as the installation site of green LED chip and blue-light LED chip, makes three-primary color LED chip
Exiting surface be in same level height, be conducive to improving the uniformity and uniformity of LED component and LED display light extraction,
Realize the raising of light-out effect and display effect.
(2) by setting depression crystal bonding area to accommodate excessive conductive rubber cement, prevent conductive rubber cement from crossing the river to neighbouring
Pad, it is to avoid cause LED component internal short circuits, electric leakage, it is ensured that the security reliability of LED component and LED display and make
Use effect.
(3) the depression crystal bonding area enhances the adhesion between LED support and packing colloid, improve LED component and
The structural stability of LED display.
(4) technically easily realize, only need to utilize the groove of stamping machine in the punching press link of LED support preparation section
Shape staking punch processes depression crystal bonding area on pad.
Brief description of the drawings
Fig. 1 is the top view of the LED support of pad depression of the present utility model.
Fig. 2 is the sectional view in the A-A directions of Fig. 1 the first embodiment.
Fig. 3 is the sectional view in the A-A directions of Fig. 1 second of embodiment.
Fig. 4 is the sectional view in the A-A directions of Fig. 1 the third embodiment.
Fig. 5 is the top view of the LED component of pad depression of the present utility model.
Fig. 6 is the sectional view in B-B directions in Fig. 5.
Embodiment
The utility model provides LED support, LED component and the LED display that a kind of pad is recessed, in order that this area
Technical staff be better understood when the technical solution of the utility model, it is new to this practicality with preferred embodiment below in conjunction with the accompanying drawings
Type is described in further detail.
A kind of LED support embodiment of pad depression
Please refer to Fig. 1-4, the utility model provides a kind of LED support 1 of pad depression, and the LED support 1 includes gold
Belong to support and wrap up the cup cover of the metallic support, the metallic support is the metal pins in embedded this glass cover and is exposed at this
Metal pin composition outside cup cover, the part that the cup cover is arranged at the top of the metal pins is reflector 11, the metal
The part that pin is arranged at the inner chamber bottom surface of reflector 11 is pad 12.
The cup cover is PPA or PCT plastics.
The pad 12 is provided with least one relative to the surface of pad 12 toward recessed depression crystal bonding area 121 and at least
One with the plane crystal bonding area 122 of the flush of pad 12.Specifically, the pad 12 is provided with a depression crystal bonding area 121
With two plane crystal bonding areas 122, it is adaptable to manufacture RGB trichromat parts.The depression crystal bonding area 121 is a groove, its inner bottom surface
Less than the plane crystal bonding area 122, the plane crystal bonding area 122 is concordant with the inner chamber bottom surface of reflector 11.As shown in figure 1, institute
State depression crystal bonding area 121 plan structure it is rounded, as other alternative solutions, its plan structure also can rectangular, triangle,
Trapezoidal or irregular shape.
As shown in Fig. 2 the inner bottom surface of the depression crystal bonding area 121 is plane, or as shown in figure 3, its inner bottom surface is arc
The upward cambered surface of mouth, is easy to concentrate on conductive rubber cement in die bond the center of depression crystal bonding area 121, reduces the use of conductive rubber cement
Amount, because conductive rubber cement is usually the rubber cement of the higher addition silver of cost, therefore is so set cost-saved.
More preferably, as shown in figure 4, the inner space of the depression crystal bonding area 121 is up-narrow and down-wide, it can accommodate and more lead
Electric rubber cement, prevents excessive conductive rubber cement from overflowing and crossing the river to neighbouring pad, it is to avoid cause LED component internal short circuits,
Electric leakage, it is ensured that LED component and the security reliability and using effect of LED display.
LED support 1 of the present utility model has various deformation, for example, the pad 12 is provided with a depression crystal bonding area
121 and a plane crystal bonding area 122, it is adaptable to manufacture RG two-color devices or RB two-color devices；And for example, the pad 12 includes one
Individual depression crystal bonding area 121 and three plane crystal bonding areas 122, it is adaptable to RGBW devices.
A kind of LED component embodiment of pad depression
Please refer to Fig. 5 and Fig. 6, the utility model provides a kind of LED component of pad depression, and the LED component includes
LED support, LED chip and packing colloid 5.
In the present embodiment, the LED support is the LED branch described in a kind of above-mentioned LED support embodiment of pad depression
Frame 1, the pad 12 of the LED support 1 is provided with a depression crystal bonding area 121 and two plane crystal bonding areas 122.
The LED chip is any one in green LED chip or blue-light LED chip or two kinds and red LED chip
Combination.Specifically, the LED component is RGB trichromat parts, and the LED chip includes red LED chip 2, green light LED core
Piece 3 and blue-light LED chip 4 each one.The red LED chip 2 is arranged in the depression crystal bonding area 121, the green light LED
Chip 3 and blue-light LED chip 4 are separately positioned in described two plane crystal bonding areas 122, the red LED chip 2, green light LED
The exiting surface of chip 3 and blue-light LED chip 4 is in same level height.The packing colloid 5 is filled in the reflector 11
Chamber.
The red LED chip 2 is vertical stratification, and it is bonded in the depression crystal bonding area 121 by conductive rubber cement.Tool
Body, a height of 6mil~7mil of the red LED chip 2, its long a width of 5mil*5mil of *, 6mil*6mil, 7mil*7mil,
8mil*8mil or 9mil*9mil.
The green LED chip 3 and blue-light LED chip 4 are horizontal structure, as positive assembling structure.The green light LED core
Piece 3 and blue-light LED chip 4 are bonded in described two plane crystal bonding areas 122 respectively by the rubber cement that insulate.Specifically, it is described green
A height of 4mil~5mil of light LED chip 3, its long a width of 5mil*6mil of *, 5mil*7mil, 6mil*8mil, 6mil*9mil,
8mil*10mil or 10mil*12mil.A height of 4mil~5mil of the blue-light LED chip 4, its long a width of 5mil*6mil of *,
5mil*7mil, 6mil*8mil, 6mil*9mil, 8mil*10mil or 10mil*12mil.
The packing colloid 5 is the transparent materials such as epoxy resin, silicones, acrylic resin or makrolon.
LED component of the present utility model has various deformation, for example, the LED component is RG two-color devices, its LED support
Pad be provided with an a depression crystal bonding area and plane crystal bonding area, its LED chip includes a red LED chip and one
Green LED chip, the red LED chip is arranged in the depression crystal bonding area, and the green LED chip is arranged on described flat
In the crystal bonding area of face；And for example, the LED component is RB two-color devices, and the pad of its LED support is provided with a depression crystal bonding area and one
Individual plane crystal bonding area, its LED chip includes a red LED chip and a blue-light LED chip, and the red LED chip is set
Put in the depression crystal bonding area, the blue-light LED chip is arranged in the plane crystal bonding area；For another example, the LED component is
RGBW devices, the pad of its LED support is provided with a depression crystal bonding area and three plane crystal bonding areas, and its LED chip includes one
Individual red LED chip, a green LED chip and two blue-light LED chips, the red LED chip are arranged on the depression
In crystal bonding area, the green LED chip and two blue-light LED chips are separately positioned in three plane crystal bonding areas, wherein
One blue-light LED chip covers the packaging plastic containing fluorescent material, therefore can send white light.
A kind of LED display embodiment of pad depression
A kind of LED display of pad depression, it is formed by some LED components are evenly distributed.In the present embodiment, it is described
Each LED component is the LED component described in a kind of above-mentioned LED component embodiment of pad depression, therefore be will not be repeated here.
Relative to prior art, the utility model has the advantages that：
(1) by being made improvements to pad structure, namely on pad depression crystal bonding area is set to be used as red LED chip
Installation site, sets plane crystal bonding area as the installation site of green LED chip and blue-light LED chip, makes three-primary color LED chip
Exiting surface be in same level height, be conducive to improving the uniformity and uniformity of LED component and LED display light extraction,
Realize the raising of light-out effect and display effect.
(2) by setting depression crystal bonding area to accommodate excessive conductive rubber cement, prevent conductive rubber cement from crossing the river to neighbouring
Pad, it is to avoid cause LED component internal short circuits, electric leakage, it is ensured that the security reliability of LED component and LED display and make
Use effect.
(3) the depression crystal bonding area enhances the adhesion between LED support and packing colloid, improve LED component and
The structural stability of LED display.
(4) technically easily realize, only need to utilize the groove of stamping machine in the punching press link of LED support preparation section
Shape staking punch processes depression crystal bonding area on pad.
The utility model is not limited to above-mentioned embodiment, if do not taken off to various changes or deformation of the present utility model
From spirit and scope of the present utility model, if these are changed and deformation belongs to claim of the present utility model and equivalent technologies
Within the scope of, then the utility model is also intended to comprising these changes and deformed.
Claims (10)
1. a kind of LED support of pad depression, including metallic support and the cup cover for wrapping up the metallic support, the metallic support is
Metal pins in embedded this glass cover are constituted with the metal pin being exposed at outside this glass cover, and the cup cover is arranged at the metal
Part at the top of pin is reflector, and the part that the metal pins are arranged at reflector inner chamber bottom surface is pad；It is special
Levy and be：The pad is provided with least one relative to bond pad surface toward recessed depression crystal bonding area and at least one and weldering
The concordant plane crystal bonding area of panel surface.
2. the LED support of pad depression according to claim 1, it is characterised in that：The inside of the depression crystal bonding area is empty
Between it is up-narrow and down-wide.
3. the LED support of pad depression according to claim 1, it is characterised in that：The inner bottom surface of the depression crystal bonding area
For plane or the upward cambered surface of nock.
4. the LED support of the pad depression according to claim any one of 1-3, it is characterised in that：The depression crystal bonding area
Plan structure is rectangular, circular, triangle, trapezoidal or irregular shape.
5. a kind of LED component of pad depression, including LED support, LED chip and packing colloid；It is characterized in that：The LED
Support is the LED support of the pad depression described in claim any one of 1-4, and the LED chip is green LED chip or blue light
The combination of any one or two kinds and red LED chip in LED chip, the green LED chip or blue-light LED chip are set
In the plane crystal bonding area, the red LED chip is arranged in the depression crystal bonding area, the green LED chip or indigo plant
The exiting surface of the exiting surface of light LED chip and the red LED chip is in same level height；The packing colloid is filled in
The reflector inner chamber.
6. the LED component of pad depression according to claim 5, it is characterised in that：The LED chip includes red-light LED
Chip, green LED chip and each one of blue-light LED chip, the pad of the LED support be provided with a depression crystal bonding area and
Two plane crystal bonding areas, the red LED chip is arranged in the depression crystal bonding area, the green LED chip and blue-ray LED
Chip is separately positioned in described two plane crystal bonding areas, the red LED chip, green LED chip and blue-light LED chip
Exiting surface is in same level height.
7. the LED component of pad depression according to claim 6, it is characterised in that：The red LED chip is vertical junction
Structure, the green LED chip and blue-light LED chip are horizontal structure.
8. the LED component of pad depression according to claim 7, it is characterised in that：The red LED chip passes through conduction
Rubber cement is bonded in the depression crystal bonding area；The green LED chip and blue-light LED chip are bonded in respectively by the rubber cement that insulate
In described two plane crystal bonding areas.
9. the LED component of the pad depression according to claim any one of 5-8, it is characterised in that：The red LED chip
A height of 6mil~7mil, its long * a width of 5mil*5mil, 6mil*6mil, 7mil*7mil, 8mil*8mil or 9mil*9mil；
A height of 4mil~5mil of the green LED chip, its long * a width of 5mil*6mil, 5mil*7mil, 6mil*8mil, 6mil*
9mil, 8mil*10mil or 10mil*12mil；A height of 4mil~5mil of the blue-light LED chip, its long a width of 5mil* of *
6mil, 5mil*7mil, 6mil*8mil, 6mil*9mil, 8mil*10mil or 10mil*12mil.
10. a kind of LED display of pad depression, is formed by some LED components are evenly distributed, it is characterised in that：It is described each
LED component is the LED component described in claim any one of 5-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621446920.7U CN206422094U (en) | 2016-12-27 | 2016-12-27 | A kind of LED support, LED component and the LED display of pad depression |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621446920.7U CN206422094U (en) | 2016-12-27 | 2016-12-27 | A kind of LED support, LED component and the LED display of pad depression |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206422094U true CN206422094U (en) | 2017-08-18 |
Family
ID=59575749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621446920.7U Active CN206422094U (en) | 2016-12-27 | 2016-12-27 | A kind of LED support, LED component and the LED display of pad depression |
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| CN (1) | CN206422094U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108520706A (en) * | 2018-06-15 | 2018-09-11 | 永林电子有限公司 | A kind of RGB collocation infrared wavelength light filling identification scanning induction LED structure and application |
| CN110391262A (en) * | 2018-04-23 | 2019-10-29 | 茂邦电子有限公司 | The luminescence unit coplanar structure of micro- light emitting diode indicator |
| CN111162150A (en) * | 2018-11-07 | 2020-05-15 | 惠州市聚飞光电有限公司 | LED (light-emitting diode) luminous piece and manufacturing method thereof |
-
2016
- 2016-12-27 CN CN201621446920.7U patent/CN206422094U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110391262A (en) * | 2018-04-23 | 2019-10-29 | 茂邦电子有限公司 | The luminescence unit coplanar structure of micro- light emitting diode indicator |
| CN108520706A (en) * | 2018-06-15 | 2018-09-11 | 永林电子有限公司 | A kind of RGB collocation infrared wavelength light filling identification scanning induction LED structure and application |
| CN111162150A (en) * | 2018-11-07 | 2020-05-15 | 惠州市聚飞光电有限公司 | LED (light-emitting diode) luminous piece and manufacturing method thereof |
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