CN110391262A - The luminescence unit coplanar structure of micro- light emitting diode indicator - Google Patents
The luminescence unit coplanar structure of micro- light emitting diode indicator Download PDFInfo
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- CN110391262A CN110391262A CN201810368257.0A CN201810368257A CN110391262A CN 110391262 A CN110391262 A CN 110391262A CN 201810368257 A CN201810368257 A CN 201810368257A CN 110391262 A CN110391262 A CN 110391262A
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- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 13
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- 238000000034 method Methods 0.000 claims description 4
- 230000003760 hair shine Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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Abstract
The invention discloses a kind of luminescence unit coplanar structures of micro- light emitting diode indicator, micro- light emitting diode indicator is to be arranged to form an array and constituted on a substrate by multiple luminescence units, the luminescence unit is by red, it is green, blue led chip arrangement, which is located on a support plate, to be constituted, wherein: the luminescence unit included it is red, it is green, in blue led chip at least the height of a LED chip relatively larger than remaining each LED chip height so that forming a difference in height therebetween, an at least groove is wherein equipped on first face of support plate for accommodating the relatively large LED chip of the height, wherein each groove has a depth and the depth is approximately equal to the difference in height, this is red whereby, it is green, blue led chip can form coplanar state on the support plate to promote micro- light emitting diode indicator in the hair of different perspectives The light uniformity.
Description
Technical field
The present invention relates to a kind of luminescence unit structures of micro- light emitting diode indicator, and espespecially one kind is in the luminescence unit
An at least groove is set for accommodating height phase in the red, green, blue LED chip on support plate for red, green, blue LED chip is arranged
To biggish LED chip, the red, green, blue LED chip is set to form coplanar state on the support plate whereby to promote micro- hair
Luminescence Uniformity of the optical diode display in different perspectives.
Background technique
Micro- light emitting diode indicator (Micro LED Display) is display technology of new generation, and structure is micromation
LED array, i.e., the LED array of the high density microsize integrated on a substrate (chip), therefore micro- LED technology can be considered LED
Miniatureization and matrixing technology, and the design of the structure of micro- light-emitting diode display can regard the miniature version of outdoor LED display as, also
It is that pixel distance is reduced to micron order from grade.
Illustrate by taking Fig. 1 as an example herein but do not limit, signified micro- light emitting diode (LED) display of the present invention is by multiple
Luminescence unit 1 arranges on a substrate (chip) 1a to be formed an array and is constituted, wherein each luminescence unit 1 is by a red LED core
It is located on a support plate 40 to piece 10, a green LED chip 20, a blue led chip 30 arrangement and electrical connection and constitutes as shown in Figure 1
But it does not limit, such as the support plate 40 of the luminescence unit 1 more can form one with the substrate 1a of micro- light emitting diode indicator, i.e.,
The red LED chip 10 of each luminescence unit 1, green LED chip 20, blue led chip 30 can directly arrange and electrical connection be located at
It substrate 1a but does not limit.In addition, the support plate 40 has one first face 41 and one second opposite face 42 as shown in Figure 2 but unlimited
System, wherein the red, green, blue LED chip (10,20,30) generally by flip-chip type package but does not limit, so that each chip (10,
20,30) the first face (11,21,31) is located to electrical connection each scheduled correspondence of institute on the first face 41 of the support plate 40 respectively
At position (10a, 20a, 30a) (as shown in Figure 1), and by the default each connection line of the support plate 40 43 (43a, 43b,
It 43c) but not limits to provide the red, green, blue LED chip (10,20,30) respectively and shine required electric power.
For the setting kenel of brilliant pad (such as pole P/N) each in LED chip, red, green, blue LED chip used at present
(10,20,30) can be divided into rectilinear chip and horizontal chip, wherein rectilinear chip refers to that it has at least two brilliant pads
It (such as pole P/N) and is separately located on the first surface and opposite second surface of the chip, and horizontal chip refers to its tool
There are at least two brilliant pads but is located on the same surface of the chip together.In addition, for the production technology of current micro- LED chip,
Although horizontal chip is conducive to flip-chip type package operation, but the cost of manufacture of horizontal chip is relatively high, is unfavorable for micro- hair
The cost control of optical diode (LED) display；In particular, for existing red, green, blue LED chip (10,20,30), it is red
Height of the height of LED chip (10) relatively larger than green, blue led chip (20,30), and the height of green, blue led chip (20,30)
Spend it is rough equal, i.e., the relatively large LED chip of height (such as red LED chip 10 but do not limit) with remaining each LED chip (such as
Green, blue led chip 20,30 but do not limit) height between already form a difference in height；Therefore work as existing red, green, blue LED
When on the same plane for the support plate 40 (or substrate 1a) that chip (10,20,30) is encapsulated in the luminescence unit 1, by positive view (such as
Positive angle shown in FIG. 1), the Luminescence Uniformity of red, green, blue LED chip (10,20,30) is not exposed to influence, but oblique angle regards
It (favours positive angle as shown in Figure 1), because the height of red LED chip (10) sees more feux rouges so that shadow compared with Gao Erhui
Ring the Luminescence Uniformity of the luminescence unit.
From the foregoing, it will be observed that for the luminescence unit of micro- light emitting diode indicator, how effectively to solve because it is red, green,
Blue led chip has different height and will affect the luminescence unit at angle of squint the problem of Luminescence Uniformity relatively, still deposits
There are improved needs, the present invention is directed to above-mentioned needs and proposes solution.
Summary of the invention
Present invention is primarily aimed at provide a kind of shining for micro- light emitting diode indicator (Micro LED Display)
Unit coplanar structure is that an at least groove is arranged on the support plate of the luminescence unit, so that each groove is corresponded to and accommodates the hair
The relatively high LED chip of chip height in the included red, green, blue LED chip of light unit, wherein each groove have a depth and
The depth is that intimate (approximately) LED chip relatively high equal to the chip height is opposite with other chip heights
Difference in height between lower LED chip so that the red LED chip, green LED chip and blue led chip be packaged in this shine
When after on the support plate of unit or carrying out luminous, each LED chip can form coplanar state on the support plate, so that this is micro- luminous
Diode display can keep good Luminescence Uniformity in different perspectives.
In an embodiment of the present invention, wherein in the luminescence unit, the relatively large LED chip of the height is that this is red
LED chip, and other highly relatively low LED chips are the green LED chip and the blue led chip.
In an embodiment of the present invention, wherein the green LED chip and the blue led chip are even more to have almost
(approximately) equal height, therefore the height of the red LED chip is relatively larger than the green LED chip and the blue led chip
Height, therefore a difference in height is formed between the two height.
In an embodiment of the present invention, wherein the red, green, blue LED chip be located at the luminescence unit support plate one first
Position on face forms a linear array or isosceles triangle arrangement.
In an embodiment of the present invention, wherein when the red LED chip, green LED chip and blue led chip are all horizontal core
When piece, each chip is at least two brilliant pads and at least two brilliant pad is dividually located on one first face of each chip,
In when each chip is located on the support plate of the luminescence unit with flip-chip type package, each brilliant pad energy for being located on the first face of each chip
Respectively by conduction material to be dividually electrically connected to the default each connection line of the support plate.
In an embodiment of the present invention, wherein when the red LED chip is rectilinear chip and the green LED chip and the indigo plant
When LED chip is horizontal chip, which is to have at least two brilliant pads, and wherein at least one brilliant pad is located at the LED core
On one first face of piece, and other at least one brilliant pads are set on an opposing second surface；Wherein when each chip is set with flip-chip type package
When on the support plate, at least one be located on red first face of LED chip is brilliant to pad and is located at the green LED chip and the indigo plant LED core
Each brilliant pad on the first face of piece can be respectively by conduction material to be dividually electrically connected to the default each connection line of the support plate
43, and at least one brilliant pad being located on red second face of LED chip is then by conduction material with electrical connection to being located at the support plate the
On one side above and positioned at the default connection line of groove outer rim.
In an embodiment of the present invention, wherein for the green LED chip is arranged on the first face of the support plate of the luminescence unit
A groove is further respectively provided with for the green LED chip and blue led chip merging and shape with the corresponding position of the blue led chip
At electrical connection.
In an embodiment of the present invention, the wherein substrate shape of the support plate of the luminescence unit and micro- light emitting diode indicator
Integrally, enable whereby the red, green, blue LED chip of each luminescence unit directly arrange and electrical connection set on the substrate.
Detailed description of the invention
Fig. 1 is the schematic elevation view of one embodiment of micro- light emitting diode indicator of the invention.
Fig. 2 is the schematic cross-sectional view of one embodiment of luminescence unit of the invention.
Fig. 3 is the schematic elevation view of another embodiment of luminescence unit of the invention.
Fig. 4 is the schematic cross-sectional view of luminescence unit shown in Fig. 3.
Fig. 5 is the schematic elevation view of another embodiment of luminescence unit of the invention.
Fig. 6 is the schematic cross-sectional view of luminescence unit shown in Fig. 5.
Fig. 7 is the schematic elevation view of luminescence unit still another embodiment of the invention.
Fig. 8 is the schematic cross-sectional view of luminescence unit shown in Fig. 7.
Description of symbols: 1- luminescence unit；1a- substrate；The red LED chip of 10-；10a- corresponding position；The first face 11-；
The second face 12-；13- crystalline substance pad；14- crystalline substance pad；The green LED chip of 20-；20a- corresponding position；The first face 21-；The second face 22-；23- is brilliant
Pad；24- crystalline substance pad；30- blue led chip；30a- corresponding position；The first face 31-；The second face 32-；33- crystalline substance pad；34- crystalline substance pad；40-
Support plate；The first face 41-；The second face 42-；43- connection line；43a- connection line；43b- connection line；43c- connection line；
44- groove；44a- groove；50- conduction material；60- protected material.
Specific embodiment
To keep the present invention definitely full and accurate, hereby enumerates preferred embodiment and cooperate following schemes, by structure of the invention
And its technical characteristic is described in detail as after, wherein each diagram is only to illustrate structural relation and correlation function of the invention, therefore each portion
Size or shape or size are not according to actual ratio setting and non-to limit the present invention:
With reference to Fig. 1, micro- light emitting diode (LED) display of the present embodiment is to be arranged in a base by multiple luminescence units 1
Plate (chip) 1a is upper and forms an array and is constituted, wherein each luminescence unit 1 (please referring to shown in the lower left corner of Fig. 1) is red by one
LED chip 10, a green LED chip 20 and a blue led chip 30 arrangement and electrical connection be located on a support plate 40 constitute but
It does not limit, such as the support plate 40 of the luminescence unit 1 more can form one with the substrate 1a of micro- light emitting diode indicator, i.e., respectively
The red LED chip 10 of luminescence unit 1, green LED chip 20, blue led chip 30 can directly arrange and electrical connection be located at the base
Plate 1a but non-to limit the present invention.
With reference to Fig. 2, which has one first face 41 and one second opposite face 42, wherein the red, green, blue LED core
Piece 10,20,30 is to pass through flip-chip type package operation but do not limit, so that each the first of the red, green, blue LED chip 10,20,30
Face 11,21,31 is located to electrical connection institute scheduled each corresponding position 10a, 20a, 30a on the first face 41 of the support plate 40 respectively
Locate (luminescence unit 1 as shown in the lower left corner Fig. 1), and by the default each connection line of the support plate 40 43 (43a, 43b,
It is 43c) as shown in Figure 2 but non-to limit the present invention with luminous required to the red, green, blue LED chip 10,20,30 offer respectively
Electric power.
Luminescence unit 1 of the invention is mainly characterized by: the red LED chip 10 that is included in the luminescence unit 1, green
Among LED chip 20 and blue led chip 30, an at least LED chip (10) and its chip height is relatively larger than other
The height of each LED chip (20,30).
Illustrate by taking Fig. 2 as an example herein but do not limit, wherein the LED chip 10 is red LED chip, and the LED chip 10
Possessed chip height, i.e. the distance between the first face 11 and the second face 12 of the LED chip 10, it is each relatively larger than other
The height of LED chip, that is, green LED chip 20 and blue led chip 30, thus the height of the relatively large LED chip 10 of height and its
A difference in height is formed between his each LED chip, that is, green LED chip 20 and the height of blue led chip 30；In addition, with reference to Fig. 1,2, In
An at least groove 44 is further provided on 40 first face 41 of support plate for being placed in the mutually relatively large each LED chip 10 of the height simultaneously
Electrical connection is formed, wherein each groove 44 has a depth, and the depth is that intimate (approximately) is equal to the height
Difference makes red LED chip 10, green LED chip 20 and the blue led chip 30 on the support plate 40 for being packaged in the luminescence unit 1 whereby
Later, each LED chip (10,20,30) can form coplanar state on the support plate 40, as shown in Figure 2 each LED chip (10,
20,30) it is all flush to A plane, so that micro- light emitting diode indicator is kept good in different perspectives whereby and shines uniformly
Degree.
The red LED chip 10, green LED chip 20, blue led chip 30 are located at the first face of the support plate 40 of the luminescence unit 1
A linear array can be formed at each corresponding position 10a, 20a, 30a on 41 as shown in figure 3, or formation isosceles triangle arrangement
As shown in Figure 1, the red LED chip 10 is located at isosceles triangle when forming isosceles triangle arrangement as shown in the lower left corner Fig. 1
Apex angle, green LED chip 20 and blue led chip 30 are located at remaining two corners of isosceles triangle.
Referring to figs. 1 to each embodiment shown in Fig. 8, red LED chip 10 which is included, green LED chip
20, among blue led chip 30, wherein the relatively large LED chip 10 of height is red LED chip, and other height are relatively small
Each LED chip 20,30 be green LED chip 20 and blue led chip 30 respectively but non-to limit the present invention.In addition, Fig. 1 extremely
In each embodiment shown in Fig. 8, which is to have intimate (approximately) equal with the blue led chip 30
Height but non-to limit the present invention, therefore the height of the red LED chip 10 is relatively larger than the green LED chip 20 and indigo plant LED
The height of chip 30, therefore the difference in height is formed between the two height.
With reference to Fig. 2,4, the red LED chip 10, the green LED chip 20 and the blue led chip 30 are all horizontal chip,
In each chip (10,20,30) be respectively provided at least two brilliant pads (13/14,23/24,33/34), at least two brilliant pad (13/
14, it 23/24,33/34) is dividually located on the first face (11,21,31) of each chip (10,20,30), wherein when each chip
(10,20,30) are located at each chip (10,20,30) with flip-chip type package and when being located to electrical connection on the support plate 40 respectively
Each brilliant pad (13/14,23/24,33/34) on first face (11,21,31) dividually can electrically be connected by conduction material 50 respectively
It ties to each connection line 43 (43a, 43b, 43c) default on the support plate 40.
Default each connection line 43 (43a, 43b, 43c) includes plane formula line on the support plate 40 of the luminescence unit 1
Road floor, punched-type route or combinations thereof are as shown in Fig. 2,4,6,8, since the production of each connection line 43 (43a, 43b, 43c) is
The person of can be done is needed according to design using the prior art such as printed circuit board (PCB) manufacturing skill, therefore is not repeated separately herein.
In addition, with reference to Fig. 5-6 or Fig. 7-8, when the red LED chip 10 be rectilinear chip and the green LED chip 20 with should
When blue led chip 30 is horizontal chip, which has at least two brilliant pads 13,14, wherein at least one brilliant pad 14
It is located on the first face 11 of the LED chip 10, and other at least one brilliant pads 13 are located on the second opposite face 12 such as Fig. 6,8 institutes
Show, then when each chip (10,20,30) is located to electrical connection on the support plate 40 respectively with flip-chip type package, it is red to be located at this
At least one brilliant pad 14 on 10 first face 11 of LED chip and be located at the green LED chip 20 and 30 first face 21 of blue led chip,
Each brilliant pad 23 and 24,33 and 34 on 31 is default each to be dividually electrically connected to the support plate 40 by conduction material 50 respectively
Connection line 43 (43a, 43b, 43c), and at least one brilliant pad 13 being located on red 10 second face 12 of LED chip then further leads to
Cross conduction material 50a with electrical connection to be located on 40 first face 41 of support plate and be located at the default connecting line of 44 outer rim of groove
Road 43a.
It, can be on 40 first face 41 of support plate for the green LED chip is arranged to design or making needs referring again to Fig. 7,8
20 with corresponding position 20a, 30a of the blue led chip 30 be further respectively provided with a groove 44a for be placed in the green LED chip 20 with
The blue led chip 30 simultaneously forms electrical connection, wherein the action function of groove 44a be similar to the groove 44, mainly to
Make red LED chip 10, green LED chip 20 and the blue led chip 30 after being packaged on the support plate 40, each LED chip (10,
20,30) can on the support plate 40 coplanar state be formed, each LED chip (10,20,30) as shown in Figure 8 is all flush to A plane.
In addition, with reference to Fig. 2,4,6,8, to protect each LED chip (10,20,30) steady in each groove 44 of merging or 44a
Solidity further fills up an at least protected material 60 in each groove 44 or 44a.
In addition, the design or production for micro- light emitting diode indicator need, the support plate 40 of the luminescence unit 1 is micro- with this
The substrate 1a of light emitting diode indicator forms one, i.e., the red LED chip 10 of each luminescence unit 1, green LED chip 20, indigo plant LED
Chip 30 also can directly be arranged without using the support plate 40 and electrical connection be located at substrate 1a on and but it is non-to limit
Invention.
The coplanar knot of luminescence unit of micro- light emitting diode indicator (Micro LED Display) provided by the invention
Structure at least has the advantage that compared with the state of the art
(1) present invention is designed to close by the depth of each groove 44 (or 44a) set on the support plate 40 (or substrate 1a)
(approximately) is equal to the difference in height between each LED chip (10,20,30), makes the red LED chip 10, green LED core
After being packaged on the support plate 40 (or substrate 1a), each LED chip (10,20,30) can be formed altogether for piece 20 and blue led chip 30
Flat state enables micro- light emitting diode indicator keep good Luminescence Uniformity in different perspectives whereby.
(2) technology of groove 44 (or 44a) is arranged in the present invention on the support plate 40 (or substrate 1a), no matter used
The structure kenel of red, green, blue LED chip (10,20,30) is that rectilinear chip or horizontal chip are all applicable in, and is conducive to make
It begins and the selection to red, green, blue LED chip (10,20,30) structure kenel and is effectively reduced cost.
(3) technology of groove 44 (or 44a) is arranged in the present invention on the support plate 40 (or substrate 1a), is not only enough to solve existing
There is each LED chip of technology (10,20,30) that coplanar problem can not be formed, and does not influence original encapsulation procedure.
The above description is only a preferred embodiment of the present invention, is merely illustrative for the purpose of the present invention, and not restrictive；
Those of ordinary skill in the art understand, can carry out many to it in the spirit and scope defined by the claims in the present invention and change
Become, modification or even equivalent change, but falls in protection scope of the present invention.
Claims (10)
1. a kind of luminescence unit coplanar structure of micro- light emitting diode indicator, wherein micro- light emitting diode indicator be by
Multiple luminescence units arrange on a substrate to be formed an array and is constituted, and wherein the luminescence unit is by red LED chip, green LED
It is located on a support plate to chip, blue led chip arrangement and electrical communication and is constituted, which has one first face and opposite one
Second face, wherein the red LED chip, green LED chip, blue led chip are with flip-chip type package so that the first face of each LED chip point
It is located to other electrical connection each scheduled corresponding position of institute on the first face of the support plate, and is respectively connected by the way that the support plate is default
Link is to provide the required electric power that shines to the red LED chip, green LED chip, blue led chip respectively；It is characterized by:
Among the red LED chip, green LED chip and the blue led chip that the luminescence unit is included, an at least LED chip
Highly relatively larger than the height of remaining each LED chip, so that the height and remaining each LED of the relatively large each LED chip of height
A difference in height is formed between the height of chip；
Wherein one is respectively provided with for each corresponding position of the relatively large each LED chip of setting height on the first face of the support plate
Groove is placed in and is formed electrical connection for the mutually relatively large each LED chip of height, wherein each groove has a depth and the depth
Degree is approximately equal to the difference in height, so that the red LED chip, green LED chip and blue led chip be when luminous, the of each LED chip
Two faces can form coplanar state.
2. the luminescence unit coplanar structure of micro- light emitting diode indicator as described in claim 1, which is characterized in that the height
Spending relatively large LED chip is the red LED chip, and other each LED chips are the green LED chip and the blue led chip.
3. the luminescence unit coplanar structure of micro- light emitting diode indicator as claimed in claim 2, which is characterized in that this is green
LED chip and the blue led chip have an equal height, thus the height of the red LED chip relatively larger than the green LED chip and
The height of the blue led chip, therefore the difference in height is formed between the two height.
4. the luminescence unit coplanar structure of micro- light emitting diode indicator as claimed in claim 2, which is characterized in that this is red
LED chip, green LED chip, blue led chip are located at the position on the first face of the support plate and form a linear array or isoceles triangle
Shape arrangement, wherein when formed isosceles triangle arrangement when, the red LED chip in isosceles triangle apex angle and green LED chip
And blue led chip is located at remaining two corners of isosceles triangle.
5. the luminescence unit coplanar structure of micro- light emitting diode indicator as claimed in claim 2, which is characterized in that when this
When red LED chip, the green LED chip and the blue led chip are all horizontal chip, each chip has at least two brilliant pads and should
At least two brilliant pads are dividually located on the first face of each LED chip, wherein when each LED chip is electrically connected respectively with rewinding method
When being located on the support plate to knot, each brilliant pad on the first face of each LED chip is located at respectively by conduction material with dividually electrical
It is linked to the default each connection line of the support plate.
6. the luminescence unit coplanar structure of micro- light emitting diode indicator as claimed in claim 2, which is characterized in that when this
Red LED chip is rectilinear chip and the green LED chip and the blue led chip when being horizontal chip, which has
At least two crystalline substances pad and wherein at least one brilliant pad is located on the first face of the red LED chip, and other at least one brilliant pad are located at this
On the second opposite face of red LED chip；Wherein when each LED chip is located to electrical connection on the support plate respectively with rewinding method
When, at least one be located on red first face of LED chip is brilliant to be padded and is located on the green LED chip and first face of blue led chip
Each brilliant pad respectively by conduction material to be dividually electrically connected to the default each connection line of the support plate, and it is red to be located at this
At least one brilliant pad on the second face of LED chip is then by conduction material with electrical connection to be located on first face of support plate and be located at should
In the default connection line of groove outer rim.
7. the luminescence unit coplanar structure of micro- light emitting diode indicator as described in claim 1, which is characterized in that the load
Default each connection line includes plane formula line layer, punched-type route or combinations thereof on plate.
8. the luminescence unit coplanar structure of micro- light emitting diode indicator as claimed in claim 2, which is characterized in that at this
A groove is further respectively provided with for dividing for the corresponding position of the green LED chip and the blue led chip is arranged on the first face of support plate
It is not placed in the green LED chip and the blue led chip and forms electrical connection.
9. the luminescence unit coplanar structure of micro- light emitting diode indicator as described in claim 1, which is characterized in that each
An at least protected material is further filled up in the groove.
10. the luminescence unit coplanar structure of micro- light emitting diode indicator as described in claim 1, which is characterized in that should
The substrate of the support plate of luminescence unit 1 and micro- light emitting diode indicator forms one.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110767646A (en) * | 2019-10-31 | 2020-02-07 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
| CN113629094A (en) * | 2021-07-16 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
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