CN203386808U - LED three-dimensional packaging structure - Google Patents
LED three-dimensional packaging structure Download PDFInfo
- Publication number
- CN203386808U CN203386808U CN201320417545.3U CN201320417545U CN203386808U CN 203386808 U CN203386808 U CN 203386808U CN 201320417545 U CN201320417545 U CN 201320417545U CN 203386808 U CN203386808 U CN 203386808U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- packaging structure
- bowl
- conducting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an LED three-dimensional packaging structure. The LED three-dimensional packaging structure comprises a first substrate and a second substrate. The first substrate and the second substrate are stacked in the thickness direction. The first substrate comprises a light-emitting component which is arranged in an embedded manner. The second substrate comprises a control circuit element which is arranged in an embedded manner and used for controlling the light emitting of the light-emitting component. The control circuit element is electrically connected with the light-emitting component. By adopting the three-dimensional packaging structure to package each component into the first substrate and the second substrate, the occupied area of the original packaged body is reduced so as to reduce the total area requited by the module substrates; through the through-hole interconnection technology, and each component adopts an embedded packaging and stacking structure, so the integration density can be effectively increased, so that the size of the LED module can be further reduced; and module layers are bonded together through a thermal conductive adhesive material, so the mechanical strength of the overall module structure can be enhanced, and the effective conduction of heat generated by elements can be ensured.
Description
Technical field
The utility model relates to the LED lighting field, relates in particular to a kind of LED three-dimension packaging structure.
Background technology
At present, the LED illumination module is just towards multi-functional, small size, future development cheaply, and still, integrated technology can not meet the needs of LED illumination now.
In prior art, the LED encapsulation technology mainly comprises the connection of 3 parts: LED module, radiator and circuit.
At first, the LED module, so-called LED module is that one or more LED light sources are encapsulated on substrate.Modal method for packing is encapsulated in LED chip in support exactly, then packaging body is welded in the nead frame on substrate.Also have further the LED integration packaging on substrate, by other circuit or control element, such as voltage stabilizing didoe, for the optical sensor of light output and junction temperature test etc., be encapsulated on same substrate, interconnect by the circuit on pcb board.
And then be radiator, the LED module is connected with radiator usually, and the heat produced during LED work can discharge by fin.
Be finally circuit, circuit is the electrical connection of each functional unit, generally take substrate as carrier.Circuit also has other functions that connect outside the LED module, and for example control element or sensor element (comprising that LED junction temperature transducer, lumen output transducer, CCT transducer have the sensor of special applications with some) are connected with output circuit.
Restriction based on prior art due to manufacturing technology and material, microminiaturization has certain difficulty; The space of arranging components and parts is very limited; The space of thermal diffusion is very limited; Each assembly independent design, the combination difficulty; Each size of components disunity; Each assembly connector position, connection mechanism does not have standard; The larger components and parts of each component application size; Each inter-module, material does not mate; Prior art will and drive the module stack to connect as one module by the optical mode group and can not realize; Size reduction is very difficult.
The utility model content
The technical problem that the utility model mainly solves is to provide a kind of effective increase integration density, the LED three-dimension packaging structure of the former packaging body area occupied of economization.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of LED three-dimension packaging structure is provided, comprise first substrate and second substrate, described first substrate and the stack of described second substrate through-thickness, comprise the embedded ground luminescence component that arranges on described first substrate, described second substrate comprise embedded arrange ground, for controlling the luminous control circuit element of described luminescence component, described control circuit element is electrically connected to described luminescence component.
Wherein, also be provided with the heat-conducting layer for heat conduction between described first substrate and described second substrate.
Wherein, described heat-conducting layer is thermal conductive adhesive, bonding by the heat conduction stick between described first substrate and described second substrate.
Wherein, described luminescence component comprises LED bare chip and drive circuit bare chip.
Wherein, be provided with a plurality of first bowl of cup and through hole on described first substrate, the surface-coated fluorescent material of described LED bare chip and being encapsulated in one first bowl of cup, described drive circuit bare chip is encapsulated in first bowl of other cup.
Wherein, be provided with second bowl of cup on described second substrate, described control circuit component encapsulation is in described second bowl of cup.
Wherein, be provided with the first metal conducting layer and the second metal conducting layer on described first substrate and described second substrate, described the first metal conducting layer is interconnected by described first bowl of cup and through hole electricity, described the second metal conducting layer is interconnected by described second bowl of cup electricity, be marked with electric conducting material in described through hole, in described through hole, electric conducting material is electrically connected to the second metal conducting layer on described second substrate.
Wherein, described the first metal conducting layer and the second metal conducting layer are the aluminium conductive layer.
Wherein, the height after described luminescence component and control circuit component encapsulation is less than or equal to the height of first substrate and second substrate face.
Wherein, described first substrate and described second substrate are silicon substrate, the silicon chip that described silicon substrate specification is 100 crystal structures.
The beneficial effects of the utility model are: be different from prior art, the utility model by the three-dimension packaging structure by each component package in substrate, economization former packaging body area occupied, to reduce the required gross area of module group substrates.
By the through-hole interconnection technology, add assembly is encapsulated and overlaying structure to embed pattern, effectively increase integration density, thereby further dwindle the size of LED module.
Reduce the gross area of module group substrates and, with each assembly integration packaging, save encapsulating material and simplify working process, reducing costs.
Due to the module microminiaturization, add without the extra module that drives, the heat sink position of light fixture can be vacateed, for placing the additional module of controlling, for realizing intelligent lighting, provide basis.
By with the thermal conductive adhesive material by module layer bonding, can strengthen the mechanical strength of whole modular structure, and guarantee that the heat that element produces can effectively conduct.
The accompanying drawing explanation
Fig. 1 is the structure cutaway view after encapsulation;
Fig. 2 is the structure cutaway view before encapsulation;
Fig. 3 is the structure cutaway view of first substrate and second substrate.
Label declaration:
1, first substrate; 2, second substrate; 3, heat-conducting layer; 11, first bowl of cup; 12, through hole; 13, LED bare chip; 14, drive circuit bare chip; 15, electric conducting material; 16, plastic packaging material; 17, the first metal conducting layer; 18, fluorescent material; 21, second bowl of cup; 22, the second metal conducting layer; 24, control circuit element.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, being realized purpose and effect, below in conjunction with execution mode and coordinate accompanying drawing to be explained in detail.
As Fig. 1 shows a kind of LED three-dimension packaging structure, it is mainly used in the fields such as illumination, communication, consumer electronics, automobile, advertisement, street lamp, decoration.This LED three-dimension packaging structure comprises first substrate 1, second substrate 2, luminescence component and control circuit element 24, and this first substrate 1 is arranged on the top of second substrate 2, and this first substrate 1 and second substrate 2 between the two through-thickness be superimposed.Be equipped with heat-conducting layer 3 between first substrate 1 and second substrate 2, the heat produced while making luminescence component and 24 work of control circuit element can discharge by heat-conducting layer.
In the present embodiment, first substrate 1 adopts silicon substrate with second substrate 2, and the silicon chip that the specification of this silicon substrate is 100 crystal structures, preferably can select four inches silicon chips.Understandably, some other be also to can be the substrate that material common on some other market is made in example, specification also can be other.This heat-conducting layer 3 is thermal conductive adhesive, bonding by the heat conduction stick between first substrate 1 and second substrate 2.By using the thermal conductive adhesive material by first substrate 1 and second substrate 2 bondings, can strengthen the mechanical strength of whole modular structure, and guarantee that the heat that element produces can effectively conduct.
One logical consults Fig. 2 and Fig. 3, is etched with the outside that two first bowl of cups 11 and 12, two through holes 12 of two through holes lay respectively at two first bowl of cups 11 on first substrate 1, is etched with two second bowl of cups 21 on second substrate 2.This luminescence component comprises LED bare chip 13 and drive circuit bare chip 14, and this LED bare chip 13 is arranged in one of them first bowl of cup 11, and drive circuit bare chip 14 is arranged in another first bowl of cup 11, and control circuit element 24 is arranged in second bowl of cup 21.Certainly, some other be in example, also etching is a plurality of as required for first bowl of cup 11, second bowl of cup 21 and through hole 12, or independently many groups mutually of etchings, is cut afterwards, is made into the encapsulation finished product, this can increase work efficiency greatly.
After this drive circuit bare chip 14 and control circuit element 24 are installed to first bowl of cup 11 and second bowl of cup 21, through plastic packaging material 16, encapsulated, in the present embodiment, plastic packaging material is epoxy resin, and LED bare chip 13 surface-coated fluorescent material 18, and sealed with fluorescent material 18.Luminescence component after encapsulation and control circuit element 24, lower than the real estate of first substrate 1 and second substrate 2, make smooth stack and the saving space be convenient to of substrate face.
By three-dimension packaging technique by each component package in silicon substrate, economization former packaging body area occupied, so reduce the required gross area of module group substrates.
Be printed with the first metal conducting layer 17 on this first substrate 1, be printed with the second metal conducting layer 22 on this second substrate 2, this first metal conducting layer 17 is electrically connected two first bowl of cups 11 and two through holes 12, and the second metal conducting layer 22 is printed on the part face of second substrate 2 and second bowl of cup 21 place, second bowl of cup 21 is electrically connected to.Fill with electric conducting material 15 in two through holes 12 of this first substrate 1, the bottom of this electric conducting material 15 is connected with the second metal conducting layer 22, makes control circuit element 24, drive circuit bare chip 14 and LED bare chip 13 form loop.By this through-hole interconnection technology, add each assembly is encapsulated and overlaying structure to embed pattern, effectively increase integration density, thereby further dwindle the size of LED module.
In the present embodiment, the first metal conducting layer 17 and the second metal conducting layer 22 are the aluminium conductive layer, certainly also can be the conductive layer of the metal making of other materials, for example the copper conductive layer.
Originally be in example, being shaped as of this first bowl of cup 11 and second bowl of cup 21 is trapezoidal, understandably, some other be in example, this first bowl of cup 11 and second bowl of cup 21 also can be designed to other shapes, for example rectangle or V-type, as long as facilitate the installation of luminescence component and control circuit element 24 to connect encapsulation.
Arrange due to the module microminiaturization like this, add and be arranged on first bowl of drive circuit bare chip 14 in cup 11, therefore without separately establishing again extra driving module, the heat sink position of light fixture can be vacateed, for placing the additional module of controlling, for realizing intelligent lighting, provide basis.
In addition, the gross area that has also reduced module group substrates reaches the integration packaging with each assembly, can save encapsulating material and simplify working process, and reduces costs.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present utility model.
Claims (10)
1. a LED three-dimension packaging structure, it is characterized in that, comprise first substrate and second substrate, described first substrate and the stack of described second substrate through-thickness, comprise the embedded ground luminescence component that arranges on described first substrate, described second substrate comprise embedded arrange ground, for controlling the luminous control circuit element of described luminescence component, described control circuit element is electrically connected to described luminescence component.
2. LED three-dimension packaging structure according to claim 1, is characterized in that: between described first substrate and described second substrate, also be provided with the heat-conducting layer for heat conduction.
3. LED three-dimension packaging structure according to claim 2, it is characterized in that: described heat-conducting layer is thermal conductive adhesive, bonding by the heat conduction stick between described first substrate and described second substrate.
4. LED three-dimension packaging structure according to claim 1, it is characterized in that: described luminescence component comprises LED bare chip and drive circuit bare chip.
5. LED three-dimension packaging structure according to claim 4, it is characterized in that: be provided with a plurality of first bowl of cup and through hole on described first substrate, the surface-coated fluorescent material of described LED bare chip and being encapsulated in one first bowl of cup, described drive circuit bare chip is encapsulated in first bowl of other cup.
6. LED three-dimension packaging structure according to claim 5, it is characterized in that: be provided with second bowl of cup on described second substrate, described control circuit component encapsulation is in described second bowl of cup.
7. LED three-dimension packaging structure according to claim 6, it is characterized in that: be provided with the first metal conducting layer and the second metal conducting layer on described first substrate and described second substrate, described the first metal conducting layer is interconnected by described first bowl of cup and through hole electricity, described the second metal conducting layer is interconnected by described second bowl of cup electricity, be marked with electric conducting material in described through hole, in described through hole, electric conducting material is electrically connected to the second metal conducting layer on described second substrate.
8. LED three-dimension packaging structure according to claim 7, it is characterized in that: described the first metal conducting layer and the second metal conducting layer are the aluminium conductive layer.
9. LED three-dimension packaging structure according to claim 1, it is characterized in that: the height after described luminescence component and control circuit component encapsulation is less than or equal to the height of first substrate and second substrate face.
10. according to the described LED three-dimension packaging of claim 1-9 any one structure, it is characterized in that: described first substrate and described second substrate are silicon substrate, the silicon chip that described silicon substrate specification is 100 crystal structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320417545.3U CN203386808U (en) | 2013-07-12 | 2013-07-12 | LED three-dimensional packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320417545.3U CN203386808U (en) | 2013-07-12 | 2013-07-12 | LED three-dimensional packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203386808U true CN203386808U (en) | 2014-01-08 |
Family
ID=49875262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320417545.3U Expired - Lifetime CN203386808U (en) | 2013-07-12 | 2013-07-12 | LED three-dimensional packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203386808U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575956A (en) * | 2015-12-31 | 2016-05-11 | 中国科学院半导体研究所 | Light emitting diode (LED) chip integration package module and package method |
| US20160225839A1 (en) * | 2015-01-29 | 2016-08-04 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| CN108028250A (en) * | 2015-09-14 | 2018-05-11 | 法雷奥照明公司 | LED light source comprising electronic circuit |
| CN115547206A (en) * | 2022-09-29 | 2022-12-30 | 上海天马微电子有限公司 | Light-emitting module and manufacturing method thereof, backlight source, display panel and display device |
-
2013
- 2013-07-12 CN CN201320417545.3U patent/CN203386808U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160225839A1 (en) * | 2015-01-29 | 2016-08-04 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| KR20160093786A (en) * | 2015-01-29 | 2016-08-09 | 삼성디스플레이 주식회사 | Display device and method of manufacturing the same |
| US9691742B2 (en) * | 2015-01-29 | 2017-06-27 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| KR102239170B1 (en) | 2015-01-29 | 2021-04-12 | 삼성디스플레이 주식회사 | Display device and method of manufacturing the same |
| CN108028250A (en) * | 2015-09-14 | 2018-05-11 | 法雷奥照明公司 | LED light source comprising electronic circuit |
| CN105575956A (en) * | 2015-12-31 | 2016-05-11 | 中国科学院半导体研究所 | Light emitting diode (LED) chip integration package module and package method |
| CN105575956B (en) * | 2015-12-31 | 2017-11-17 | 中国科学院半导体研究所 | LED chip integrating packaging module and method for packing |
| CN115547206A (en) * | 2022-09-29 | 2022-12-30 | 上海天马微电子有限公司 | Light-emitting module and manufacturing method thereof, backlight source, display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100502064C (en) | Package for light emitting device | |
| US8247833B2 (en) | LED package and manufacturing method thereof | |
| US9366421B2 (en) | LED base module and LED lighting device | |
| CN102197501A (en) | Multi-chip LED package | |
| CN103500787A (en) | Ceramic COB (Chip-on-Board) packaged LED (light-emitting diode) light source with bottom capable of being directly soldered on heat sink | |
| CN203386808U (en) | LED three-dimensional packaging structure | |
| CN102693972A (en) | Light emitting diode package and manufacture method of lead frame of the light emitting diode package | |
| CN102208518B (en) | Integrated patch unit | |
| CN103400835B (en) | The integrated encapsulation method of LED module | |
| CN201348169Y (en) | White light-emitting diode (LED) integrated array light source encapsulated based on chip-on-board (COB) technology | |
| CN103337496B (en) | Based on LED integrated encapsulation structure and the making method of two-sided silicon substrate | |
| CN105448202B (en) | A kind of LED display with transparent soft substrate | |
| CN204130528U (en) | A kind of lead frame posture high-power LED light source module | |
| CN102938442B (en) | LED package unit and LED package system having same | |
| KR101519110B1 (en) | method of manufacturing LED package module | |
| CN203038968U (en) | LED illumination module | |
| CN105299500A (en) | Light emitting diode (LED) lighting device used for providing directional light beam | |
| CN102832330B (en) | Wafer level LED packaging structure | |
| CN102522398B (en) | COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability | |
| CN204240090U (en) | For providing the LED light device of directional beam | |
| CN202695440U (en) | Led integrated light source | |
| CN102969433A (en) | LED (Light-Emitting Diode) wafer modularized packaging process | |
| CN105845804A (en) | Light emitting diode device and light emitting device using same | |
| KR101146656B1 (en) | Optical package and manufacturing method of the same | |
| KR101146659B1 (en) | Optical package and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140108 |
|
| CU01 | Correction of utility model | ||
| CU01 | Correction of utility model |
Correction item: Termination upon expiration of patent Correct: Revocation of Patent Expiration and Termination False: On July 28, 2023, the expiration and termination of the 39-volume 3002 patent Number: 30-02 Volume: 39 |