CN115547206A - Light-emitting module and manufacturing method thereof, backlight source, display panel and display device - Google Patents
Light-emitting module and manufacturing method thereof, backlight source, display panel and display device Download PDFInfo
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- CN115547206A CN115547206A CN202211204733.8A CN202211204733A CN115547206A CN 115547206 A CN115547206 A CN 115547206A CN 202211204733 A CN202211204733 A CN 202211204733A CN 115547206 A CN115547206 A CN 115547206A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a light-emitting module and a manufacturing method thereof, a backlight source, a display panel and a display device, wherein the light-emitting module comprises a first substrate, a second substrate and a third substrate, wherein the first substrate is provided with a first bonding pad and a first connecting through hole line; the light-emitting diode is arranged on the first substrate and electrically connected with the first bonding pad; the second substrate is positioned on one side of the first substrate, which is far away from the first bonding pad, a third bonding pad is arranged on one side of the second substrate, which faces the first substrate, and the third bonding pad is electrically connected with the first bonding pad through a first connecting through hole line; and the driving chip is arranged on the second substrate and is electrically connected with the third bonding pad. Through setting up independent first base plate and second base plate to set up emitting diode and driver chip respectively on first base plate and second base plate, can avoid driver chip to the luminous influence of emitting diode, improve emitting diode's the density of arranging, also reduced reflow soldering to the influence of beating, reduced the defective rate of beating.
Description
Technical Field
The invention relates to the technical field of display, in particular to a light-emitting module, a manufacturing method of the light-emitting module, a backlight source, a display panel and a display device.
Background
Mini LED, also known as "sub-millimeter light emitting diode," refers to a display screen made up of LEDs with grain (chip) sizes on the micrometer to millimeter scale, between Micro LEDs and small pitch displays. The application direction comprises a display screen with a Mini LED direct display and a Mini LED backlight. The micro IC is a silicon-based discrete integrated circuit with PWM drive, and can realize accurate control on the micro LED through the micro IC.
At present, a Mini LED and a Micro IC are usually positioned on the same side of a PCB (printed Circuit Board) in the prior art, and the external dimension of a Micro IC is far larger than that of the Mini LED, so that the Mini LED needs to be away from the Micro IC to ensure that the light emitted by the Mini LED is not shielded by the Micro IC, a corresponding dark area can be formed above the Micro IC, the density of the Mini LED in a subarea is influenced, and the display effect is poor; in order to solve the problem, a scheme that a mini LED and a micro IC are located on different sides of a PCB is researched, at the moment, reflow soldering needs to be carried out for many times, and when the mini LED is subjected to reflow soldering, the problem that soldering tin melts to cause elements and devices to fall off exists when the corresponding elements on the back face are located at high temperature.
Disclosure of Invention
The embodiment of the invention provides a light-emitting module and a manufacturing method thereof, a backlight source, a display panel and a display device, which are used for avoiding the influence of a driving chip on the light emitting of a light-emitting diode, improving the display effect, reducing the influence of reflow soldering on a workpiece, reducing the reject ratio of the workpiece, improving the yield of the workpiece and improving the manufacturing yield of the light-emitting module.
In a first aspect, an embodiment of the present invention provides a light emitting module, including:
a first substrate provided with a first pad and a first connection via line, the first pad being electrically connected with the first connection via line;
the light emitting diode is arranged on the first substrate and is electrically connected with the first bonding pad;
the second substrate is positioned on one side, away from the first bonding pad, of the first substrate, a third bonding pad is arranged on one side, facing the first substrate, and is perpendicular to the direction of the first substrate, and the third bonding pad is electrically connected with the first bonding pad through the first connecting through hole line;
and the driving chip is arranged on the second substrate and is electrically connected with the third bonding pad.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a light emitting module, including:
forming a first connecting through hole line penetrating through a first substrate, forming a first bonding pad electrically connected with the first connecting through hole line, and binding and electrically connecting a light-emitting diode on the first bonding pad;
forming a third bonding pad on the second substrate, and binding and electrically connecting a driving chip on the third bonding pad;
and butting one side of the second substrate, which is provided with the third bonding pad, with one side of the first substrate, which is deviated from the first bonding pad, and electrically connecting the third bonding pad with the first bonding pad.
In a third aspect, an embodiment of the present invention further provides a backlight, including the light emitting module according to any of the first aspects.
In a fourth aspect, an embodiment of the present invention further provides a display panel, including the light emitting module according to any one of the first aspect.
In a fifth aspect, an embodiment of the present invention further provides a display device, including the backlight according to the third aspect, or the display panel according to the fourth aspect.
According to the embodiment of the invention, the first substrate and the second substrate are arranged independently, and the light emitting diode and the driving chip are respectively arranged on the first substrate and the second substrate. Compared with the prior art that the light-emitting diode and the driving chip are arranged on the same side of the same substrate, the influence of the driving chip on the light-emitting of the light-emitting diode can be avoided, and the display effect is improved. The arrangement of the light emitting diodes is not limited by the size of the driving chip, and the arrangement density of the light emitting diodes can be improved. In addition, emitting diode and driver chip set up respectively on independent first base plate and second base plate, can adopt the single face to play the piece, compare among the prior art emitting diode and the two-sided piece of beating when driver chip sets up the different sides at same base plate, on the one hand can avoid when the reflow soldering, there is soldering tin to melt in the component of the back that corresponds is located high temperature and leads to the component, the problem that the device drops, and then the defective rate of beating the piece has been reduced, the yield of beating is improved, the preparation yield of light-emitting module has been improved. And on the other hand, compared with double-sided workpiece punching, single-sided workpiece punching reduces the cost of the surface mounting technology.
Drawings
Fig. 1 is a schematic structural diagram of a light emitting module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention;
fig. 8 is a schematic top view of a first substrate according to an embodiment of the invention;
fig. 9 is a schematic top view of a second substrate according to an embodiment of the invention;
fig. 10 is a schematic top view illustrating a light emitting module according to another embodiment of the present invention;
fig. 11 is a schematic flow chart illustrating a method for manufacturing a light emitting module according to an embodiment of the invention;
fig. 12 is a schematic structural diagram of a backlight according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be fully described by the detailed description with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, not all embodiments, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without inventive efforts fall within the scope of the present invention.
Fig. 1 is a schematic structural diagram of a light emitting module 01 according to an embodiment of the present invention, and referring to fig. 1, the light emitting module 01 includes a first substrate 10, a light emitting diode 13, a second substrate 20, and a driving chip 30. The first substrate 10 is provided with first pads 11 and first connection via lines 12. The first connecting via line 12 penetrates the first substrate 10 and extends from one side surface of the first substrate 10 to the other side surface of the first substrate 10. The first pads 11 are disposed on a surface of the first substrate 10. The first pad 11 is electrically connected to the first connection via 12. The light emitting diode 13 is disposed on the first substrate 10, the light emitting diode 13 is electrically connected to the first bonding pad 11, and the first bonding pad 11 provides an operating voltage and/or an operating current to the light emitting diode 13.
The second substrate 20 is located on a side of the first substrate 10 away from the first pads 11, and the second substrate 20 is opposite to the first substrate 10. The second substrate 20 is provided with third pads 21 on a side facing the first substrate 10. The third pad 21 is electrically connected to the first pad 11 through the first connecting via line 12. The driving chip 30 is disposed on the second substrate 20, and the driving chip 30 is electrically connected to the third pad 21. So that the driving chip 30 can supply the driving voltage and/or the driving current to the third pad 21.
The embodiment of the present invention provides the first substrate 10 and the second substrate 20 which are independent, and the first substrate 10 is provided with the first pads 11, the first connection via lines 12, and the light emitting diodes 13. The light emitting diode 13 is electrically connected to the first connection via line 12 through the first pad 11. The second substrate 20 is disposed opposite to the first substrate 10, and the third pad 21 and the driving chip 30 are disposed on the second substrate 20. The light emitting diode 13 is electrically connected to the driving chip 30 through the first pad 11, the first connection via 12, and the third pad 21 in this order. The driving voltage and/or the driving current provided by the driving chip 30 may be used as the operating voltage and/or the operating current of the light emitting diode 13. Therefore, the light emitting of the light emitting diode 13 can be prevented from being influenced by the driving chip, the arrangement density of the light emitting diode 13 can be improved, and the display effect is improved. In addition, the first substrate 10 and the second substrate 20 which are independently arranged are used for single-side workpiece making in the workpiece making process of the light emitting diode 13 and the driving chip 30, so that on one hand, the problem that components and devices fall off due to the fact that soldering tin melts when reflow soldering is carried out and the components on the back side corresponding to the substrates are at high temperature can be avoided, the reject ratio of workpieces is reduced, the workpiece making yield is improved, and the manufacturing yield of the light emitting module is improved. And on the other hand, compared with double-sided workpiece punching, single-sided workpiece punching reduces the cost of the surface mounting technology.
Exemplarily, referring to fig. 1, the first substrate 10 may be a PCB board. The light emitting diode 13 may include a micro light emitting element, such as a mini-LED, which has a small volume and a high spatial integration level, and is convenient for implementing the light emitting module 01 with a high resolution, thereby ensuring a better display effect of the light emitting module 01. In addition, the light emitting diode 13 may further include a light emitting body including a first semiconductor layer, a light emitting composite layer, and a second semiconductor layer stacked, a first electrode electrically connected to the first semiconductor layer, and a second electrode electrically connected to the second semiconductor layer.
Illustratively, the first semiconductor layer may be a P-type semiconductor layer, and the corresponding first electrode may be a P-type electrode or an anode, and the first electrode is electrically connected to the driving chip 30 for supplying holes to the P-type semiconductor layer. The second semiconductor layer may be an N-type semiconductor layer, and the corresponding second electrode may be an N-type electrode or a cathode for supplying electrons to the N-type semiconductor layer. The electrons and the holes are combined to emit light in the light-emitting composite layer, and normal light-emitting display of the light-emitting diode 13 is realized.
Exemplarily, referring to fig. 1, the driving chip 30 may be a micro IC that may be mounted on a PCB board or other conductive substrate. Specifically, the driving chip 30 includes a plurality of driving pins 31, the plurality of driving pins 31 includes an input pin and a plurality of output pins, the PCB includes a plurality of input bonding pads and a plurality of output bonding pads, the input bonding pads are electrically connected to the input pins in a one-to-one correspondence, the output bonding pads are electrically connected to the output pins in a one-to-one correspondence, and the driving chip 30 is configured to provide various driving signals required for normal operation of the light emitting diode 13.
It should be noted that fig. 1 is only an example to illustrate that the driving chip 30 is located between the first substrate 10 and the second substrate 20, and the application is not limited thereto as long as it is satisfied that the light emitting diode 13 and the driving chip 30 are respectively disposed on the two substrates, and those skilled in the art can specifically set them as required.
Fig. 2 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention, and referring to fig. 2, the driving chip 30 is located on a side of the second substrate 20 away from the first substrate 10. The driving chip 30 and the third pad 21 are located at opposite sides of the second substrate 20. The second substrate 20 is also provided with a second connection via line 23. The second connection via 23 penetrates the second substrate 20 and extends from one side surface of the second substrate 20 to the other side surface of the second substrate 20. The third pads 21 are disposed on the surface of the second substrate 20. The driving pin 31 of the driving chip 30 is electrically connected to the third pad 21 through the second connection via 23.
Optionally, referring to fig. 1, the light emitting module 01 further includes a second pad 14, and the second pad 14 is disposed on a side of the first substrate 10 away from the first pad 11. The second pads 14 and the first pads 11 are disposed on opposite sides of the first substrate 10. The second pads 14 are disposed on a side of the first substrate 10 adjacent to the second substrate 20. The second pad 14 is electrically connected to the first pad 11 through the first connection via 12. The second pads 14 are electrically overlapped with the third pads 21 in a direction perpendicular to the first substrate 10. Thus, the light emitting diode 13 is electrically connected to the driving chip 30 through the first pad 11, the first connection via 12, the second pad 14, and the third pad 21 in this order. The driving voltage and/or the driving current provided by the driving chip 30 may be used as the operating voltage and/or the operating current of the light emitting diode 13. In the process of manufacturing the light emitting module 01, the first substrate 10 and the related elements on the first substrate 10 are firstly prepared, then the second substrate 20 and the related elements on the second substrate 20 are prepared, and finally the first substrate 10 and the second substrate 20 are welded and fixed. Therefore, by providing the second pads 14 on the side of the first substrate 10 close to the second substrate 20, the elements on the first and second substrates 10, 20 are connected by the second and third pads 14, 21 which are opposed and overlapped.
In fig. 1, for better explaining the positional relationship of the second pads 14, the second pads 14 are shown protruding from the surface of the first substrate 10. However, in an actual manufacturing process, the thickness of the second pad 14 is small, and after the second pad 14 is manufactured, the green paint is applied, and the thickness of the second pad 14 is smaller than that of the green paint, so that in an actual product, the second pad 14 is recessed with respect to the surface of the first substrate 10. Similarly, the first pad 11 and the third pad 21 are also illustrated as protruding from the surface of the first substrate 10, but not limited thereto, and the first pad 11 may be recessed with respect to the surface of the first substrate 10. The third pads 21 may be recessed with respect to the surface of the second substrate 20.
Alternatively, referring to fig. 1, the driving chip 30 includes a plurality of driving pins 31, and the driving pins 31 are located at a first end of the driving chip 30. The second end of the driving chip 30 is opposite to the first end of the driving chip 30. The second end of the driving chip 30 is located between the first end of the driving chip 30 and the light emitting diode 13 in a direction perpendicular to the first substrate 10. The first end of the driving chip 30 points to the second end of the driving chip 30, which is consistent with the direction of the second substrate 20 pointing to the first substrate 10. The second end of the driving chip 30 is disposed toward the first substrate 10. The driving pin 31 is located at one end of the driving chip 30 close to the second substrate 20, the driving pin 31 is electrically connected to the third pad 21 located on the second substrate 20, and further the driving pin 31 is electrically connected to the light emitting diode 13 sequentially through the third pad 21, the second pad 14, the first connection via line 12 and the first pad 11, so that the driving chip 30 can control the brightness of the corresponding dimming area through the plurality of driving pins 31. In addition, the driving pins 31 are disposed at the first end of the driving chip 30, and the second end of the driving chip 30 is disposed between the first end of the driving chip 30 and the light emitting diode 13, so that the heat dissipation layer can be disposed at a side of the second substrate 20 away from the first substrate 10 in the following process, thereby easily guiding out heat and improving heat dissipation performance.
Illustratively, the first substrate 10 includes a plurality of dimming regions thereon, each of which includes at least one light emitting diode 13. The driving chip 30 includes a plurality of driving pins 31, and one driving pin 31 corresponds to one dimming region
Fig. 3 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention, and referring to fig. 3, the first substrate 10 is provided with a first groove 15 for accommodating a driving chip 30. The first groove 15 opens toward the second substrate 20. The depth of the first groove 15 is smaller than the thickness of the first substrate 10 in a direction perpendicular to the first substrate 10. The first groove 15 does not penetrate the first substrate 10.
Exemplarily, referring to fig. 3, the first groove 15 is disposed at a position of the first substrate 10 corresponding to the driving chip 30. The first recess 15 is opened toward the second substrate 20 for receiving the driving chip 30 on the second substrate 20. The driving chip 30 is positioned between the first substrate 10 and the second substrate 20. Therefore, the thickness of the light-emitting module 01 can be reduced on the basis of avoiding the influence of the driving chip 30 on the light-emitting of the light-emitting diode 13, improving the arrangement density of the light-emitting diode 13, realizing the light-emitting module 01 with high resolution, avoiding the influence of reflow soldering and reducing the reject ratio of the component. In addition, the first groove 15 can play a role in limiting when accommodating the driving chip 30, and the reject ratio of the component in reflow soldering is further reduced.
Alternatively, referring to fig. 1, the first substrate 10 is provided with a first via hole 16 for receiving the driving chip 30. The first via hole 16 penetrates from a surface of the first substrate 10 near a side of the second substrate 20 to a surface of the first substrate 10 far from the side of the second substrate 20. The first via hole 16 is a through hole formed in the first substrate 10. The first via hole 16 is provided to have an advantage in that a through hole can be formed on the first substrate 10 by using a conventional and mature drilling process, so that a complicated process is not required, and the process difficulty is reduced.
Exemplarily, referring to fig. 1, the first via hole 16 is disposed corresponding to the driving chip 30 and penetrates the first substrate 10, so that the first via hole 16 can accommodate the driving chip 30. Therefore, the thickness of the light-emitting module 01 can be reduced on the basis of avoiding the influence of the driving chip 30 on the light-emitting of the light-emitting diode 13, improving the arrangement density of the light-emitting diode 13, realizing the light-emitting module 01 with high resolution, avoiding the influence of reflow soldering and reducing the reject ratio of the component. In addition, the first via hole 16 can play a role in limiting when accommodating the driver chip 30, and the reject ratio of the component in reflow soldering is further reduced. The first via hole 16 penetrating through the whole first substrate 10 has high process feasibility and low manufacturing cost, the two opposite sides of the first substrate 10 are communicated by the first via hole 16, and heat generated by the driving chip 30 in the working process can be transmitted to one side of the first substrate 10, which is provided with the light emitting diode 13, through the first via hole 16, so that the heat is dissipated, and the heat dissipation effect is improved.
Alternatively, referring to fig. 1, the second end of the driving chip 30 is flush with the surface of the first substrate 10 where the first pad 11 is disposed. The second end of the driving chip 30 and the surface of the first substrate 10 on which the first pad 11 is disposed have the same distance from the second substrate 20. It can be understood that by arranging the second end of the driving chip 30 to be flush with the surface of the first substrate 10 on which the first bonding pad 11 is arranged, the second end of the driving chip 30 and the surface of the first substrate 10 on the side away from the second substrate 20 can be on the same plane, and thus, in the subsequent preparation processes of the planarization layer, the reflective layer and the like, the preparation process is ensured to be simple.
Optionally, fig. 4 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention, and referring to fig. 1 and 4 in combination, the light emitting module 01 further includes a planarization layer 40, where the planarization layer 40 is located on a side of the first substrate 10 where the first pad 11 is disposed, and fills the first via 16. In the embodiment of the present invention, the planarization layer 40 fills the first via hole 16, so that the stability of the driver chip 30 in the first via hole 16 can be ensured. That is, the planarization layer 40 plays a role of fixing the driving chip 30. On the other hand, the planarization layer 40 covers the second end of the driving chip 30 and the surface of the first substrate 10 on which the first bonding pad 11 is disposed, and plays a role of planarization, so as to provide a flat surface for subsequent elements and devices.
Optionally, referring to fig. 4, the light emitting module 01 further includes a light reflecting layer 50. The light reflecting layer 50 is located on one side of the planarization layer 40 away from the first substrate 10, and the light reflecting layer 50 is located between two adjacent light emitting diodes 13. In the embodiment of the present invention, the light-reflecting layer 50 is disposed between two adjacent light-emitting diodes 13, so that light emitted from the lower side of the light-emitting diode 13 can be reflected by the light-reflecting layer 50 and further emitted along the light-emitting direction of the light-emitting diode 13, thereby improving the light-emitting efficiency of the light-emitting module 01.
Alternatively, referring to fig. 4, the driving pin 31 includes a ground pin 310. The second substrate is also provided with a ground metal layer 22 and a second connecting via 23. The ground metal layer 22 is located on a side of the second substrate 20 away from the third pad 21. The ground metal layer 22 is electrically connected to the ground pin 310 through the second connection via 23 and the third pad 21. In the embodiment of the present invention, the grounding metal layer 22 is disposed on the side of the second substrate 20 away from the first substrate 10, and is electrically connected to the grounding pin 310 of the driving chip 30 through the second connection via 23, so as to guide out heat generated by the driving chip 30 in the working process, improve the heat dissipation efficiency of the light emitting module 01, and further improve the service life of the light emitting module 01.
Exemplarily, referring to fig. 4, the ground metal layer 22 includes a metal material having good heat conduction and heat dissipation properties.
Illustratively, the ground metal layer 22 is a whole film layer, and the ground pins 310 of the plurality of driver chips 30 are connected to the same ground metal layer 22 in a direction perpendicular to the second substrate 20. On one hand, the ground metal layer 22 provides a ground potential for the ground pins 310 of the plurality of driver chips 30; on the other hand, heat generated during the operation of the plurality of driving chips 30 is dissipated by the ground metal layer 22.
The above embodiments are described by taking the example of providing the grooves and/or the vias on the first substrate 10, and the following description is provided by taking the grooves and/or the vias on the second substrate with reference to the drawings.
Fig. 5 is a schematic structural view of another light emitting module according to an embodiment of the present invention, and referring to fig. 5, the second substrate 20 is provided with a second groove 24 for accommodating the driving chip 30, and the second groove 24 is open toward the first substrate 10. The depth of the second groove 24 is smaller than the thickness of the second substrate 20 in a direction perpendicular to the second substrate 20. The second groove 24 does not penetrate the second substrate 20.
Exemplarily, referring to fig. 5, the second substrate 20 is provided with a second groove 24 corresponding to the driving chip 30 on a side facing the first substrate 10, and the second groove 24 is used for accommodating the driving chip 30. Since the driving chip 30 is disposed in a "head-up pin-down" manner, that is, the driving pin 31 is located at the first end of the driving chip 30, and the second end of the driving chip 30 is located between the first end of the driving chip 30 and the light emitting diode 13. The second pad 14 connected to the driving pin 31 and the third pad 21 are also located in the second recess 24. The depth of the second groove 24 is greater than or equal to the thickness of the driving chip 30 in a direction perpendicular to the second substrate 20. The second recess 24 accommodates the driving chip 30, the second pad 14, and the third pad 21. Like this, first base plate 10 and second base plate 20 direct contact avoid driver chip 30 to the luminous influence of emitting diode 13, improve emitting diode 13's the density of arranging, realize high resolution's light-emitting module 01 to and avoid reflow soldering's influence, reduce the basis of beating a defective rate, very big reduction light-emitting module 01's thickness.
Fig. 6 is a schematic structural diagram of another light emitting module according to an embodiment of the present invention, and referring to fig. 6, the first substrate 10 is provided with a first groove 15 for accommodating the driving chip 30. The first groove 15 opens toward the second substrate 20. The second substrate 20 is provided with a second groove 24 for receiving the driving chip 30, and the second groove 24 is opened toward the first substrate 10.
Exemplarily, referring to fig. 6, a first groove 15 and a second groove 24 are provided on the first substrate 10 and the second substrate 20, respectively, and the first groove 15 is provided corresponding to the second groove 24. And along the thickness direction of the light emitting module 01, the projection of the second groove 24 covers the projection of the first groove 15, so that the second groove 24 accommodates the first end of the driving chip 30, the second bonding pad 14 and the third bonding pad 21, and the first groove 15 accommodates the second section of the driving chip 30. The driving pin 31 is located at a first end of the driving chip 30, and a second end of the driving chip 30 is located between the first end of the driving chip 30 and the light emitting diode 13. Therefore, the thickness of the second substrate 20 is not affected by the driving chip 30 with a larger size, and the first substrate 10 and the second substrate 20 can be in direct contact with each other, so that the thickness of the light emitting module 01 is greatly reduced.
Fig. 7 is a schematic structural view of another light emitting module according to an embodiment of the invention, and referring to fig. 7, the light emitting module 01 further includes a sealant 60, and the sealant 60 is located on a side of the light emitting diode 13 away from the first substrate 10. In the embodiment of the invention, the sealing compound 60 is located on one side of the light emitting diode 13 away from the first substrate 10, and covers the light emitting diode 13 and the first bonding pad 11 for preventing external corrosion and electrostatic breakdown, and in addition, the driving chip 30 is protected by the first groove 15 and/or the second groove 24 and the sealing compound 60, so that the reliability of the device is improved.
Illustratively, with continued reference to fig. 1, the light emitting module 01 includes a first substrate 10 and a second substrate 20.
In another embodiment, the light emitting module 01 includes a plurality of first substrates 10 and one second substrate 20. The plurality of first substrates 10 overlap the second substrate 20 in a direction perpendicular to the second substrate 20. A plurality of first substrates 10 are attached to the same second substrate 20. In this application scenario, a plurality of driving chips 30 may be disposed on the second substrate 20. For example, the number of the driving chips 30 is equal to the number of the first substrates 10.
In other embodiments, the light emitting module 01 includes a plurality of second substrates 20 perpendicular to the direction of the first substrate 10, and the plurality of second substrates 20 overlap the first substrate 10. A plurality of second substrates 20 are attached to the same first substrate 10. In this application scenario, a plurality of light emitting diodes 13 may be disposed on the first substrate 10. For example, the number of the light emitting diodes 13 is equal to the number of the second substrates 20.
It is understood that the second substrate 20 is correspondingly provided with the driving chip 30. Therefore, the material of the second substrate 20 may be provided as an aluminum substrate, a copper substrate, or the like, instead of the PCB board. Therefore, on one hand, the heat dissipation performance of the light-emitting module can be improved, and on the other hand, the production cost can be reduced. The aluminum substrate or the copper substrate has a smaller thickness, fewer metal stacks and fewer insulating layers between adjacent metal layers than a PCB. In addition, the aluminum substrate or the copper substrate does not need to be made of an insulating material defined by a PCB, so that an insulating material with better heat dissipation performance can be selected to enhance the heat dissipation performance of the second substrate 20.
Fig. 8 is a schematic top-view structure diagram of a first substrate according to an embodiment of the present invention, fig. 9 is a schematic top-view structure diagram of a second substrate according to an embodiment of the present invention, fig. 10 is a schematic top-view structure diagram of another light emitting module according to an embodiment of the present invention, and referring to fig. 8, fig. 9 and fig. 10, a plurality of light emitting diodes 13 arranged in an array are disposed on the first substrate 10. A plurality of first via holes 16 are also provided in regions other than the region where the light emitting diode 13 is located. For example, a plurality of light emitting diodes 13 are disposed around one first via hole 16 (fig. 8 illustrates four light emitting diodes 13 around one first via hole 16, but not limited thereto). The position of the first via hole 16 corresponds to the position of the driver chip 30 on the second substrate 20, so that the first via hole 16 can accommodate the driver chip 30 when the first substrate 10 and the second substrate 20 are bonded. The first substrate 10 is further provided with a power signal line PVDD, and the power signal line PVDD is electrically connected to the light emitting diode 13 and provides a power signal for the light emitting diode 13.
The second substrate 20 is provided with a plurality of driving chips 30, and the driving chips 30 include a plurality of driving pins 31. The driving pin 31 includes a ground pin 310, and referring to fig. 4, 9 and 10, the ground pin 310 is electrically connected to the ground metal layer 22 through the second connection via line 23 and the third pad 21.
The light emitting diode 13 is arranged on the first substrate 10, the driving chip 30 is arranged on the second substrate 20, the light emitting diode 13 and the driving chip 30 are respectively arranged on different substrates, so that the problem that components and devices fall off due to the fact that soldering tin melts when the corresponding components on the back face are located at high temperature during reflow soldering can be avoided, the yield of finished products is improved, and the manufacturing yield of the light emitting module is improved.
Based on the same inventive concept, an embodiment of the present invention provides a method for manufacturing a light emitting module, and fig. 11 is a schematic flow chart of the method for manufacturing a light emitting module in the embodiment of the present invention, and with reference to fig. 1 to 11, the method includes:
s110, forming a first connection via penetrating through the first substrate, forming a first pad electrically connected with the first connection via, and binding and electrically connecting the light emitting diode on the first pad.
The first substrate 10 may be a PCB, and the first connection via 12 and the first pad 11 are formed on the first substrate 10. The light emitting diode 13 is bound on the first pad 11, and the light emitting diode 13 is electrically connected with the first pad 11 through the first connection via line 12.
Illustratively, the light emitting diodes may be Mini LEDs, which may be sized around 100 μm-500 μm. Because the Mini LED has the characteristics of small chip size, high integration level, self-luminescence and the like, the light-emitting module has great advantages in the aspects of brightness, resolution, contrast, energy consumption, service life, response speed, thermal stability and the like.
And S120, forming a third bonding pad on the second substrate, and binding and electrically connecting the driving chip to the third bonding pad.
The driving chip 30 is used for providing a driving signal to drive the light emitting diode 13 to emit light, and the driving chip 30 may be a micro IC.
Illustratively, the micro IC is a silicon-based discrete integrated circuit with PWM driving, and precise control over the micro LED can be realized through the micro IC.
S130, butting one side, provided with the third bonding pad, of the second substrate with one side, departing from the first bonding pad, of the first substrate, and electrically connecting the third bonding pad with the first bonding pad.
The manufacturing method provided by the embodiment of the invention is used for forming the light-emitting module in the embodiment. The light emitting diode 13 is bonded on the first substrate 10, and the driving chip 30 is bonded on the second substrate 20. And then, the first substrate 10 bound with the light emitting diode 13 and the second substrate 20 bound with the driving chip 30 are in butt joint and electric connection, so that the corresponding electric connection between the light emitting diode 13 and the driving chip 30 is realized. The light emitting diode can be prevented from being influenced by the driving chip, the arrangement density of the light emitting diode can be improved, and the display effect is improved. In addition, in the process of performing the component mounting on the light emitting diode 13 and the driving chip 30, the first substrate 10 and the second substrate 20 which are independently arranged are both subjected to single-sided component mounting, so that on one hand, the problem that components and devices fall off due to the fact that soldering tin melts when reflow soldering is performed and the components on the back side corresponding to the substrates are at high temperature can be avoided, the reject ratio of the component mounting is reduced, and on the other hand, compared with double-sided component mounting, the single-sided component mounting reduces the cost of the surface mounting technology.
Fig. 12 is a schematic structural diagram of a backlight provided in an embodiment of the present invention, and referring to fig. 12, the backlight includes the light emitting module 01 described in any of the embodiments above, so that the backlight provided in the embodiment of the present invention has the corresponding beneficial effects in the embodiments above, and details are not repeated here.
Optionally, referring to fig. 12, the backlight further includes a back plate 70 and a heat conductive tape 71, where the heat conductive tape 71 is located between the light emitting module 01 and the back plate 70. The thermal tape 71 electrically connects the light emitting module 01 and the rear plate 70. Since air is a poor heat conductor, in the embodiment of the present invention, the heat conductive tape 71 is disposed to exhaust air between the light emitting module 01 and the rear plate 70, so as to achieve a good heat dissipation effect. On the other hand, the heat conductive tape 71 electrically connects the light emitting module 01 and the rear plate 70, and connects the ground terminal (e.g., the ground metal layer 22) of the light emitting module 01 to the rear plate 70.
In another embodiment, the light emitting module 01 may be directly contacted with the back plate 70 without providing the heat conductive tape 71.
Exemplarily, referring to fig. 12, the backlight source may further include a plurality of optical film layers on the light emitting side of the light emitting module 01, that is, on the side of the first substrate 10 away from the second substrate 20. The plurality of optical film layers may include at least one of a brightness enhancement film, a diffusion film, a prism sheet, and the like.
Fig. 13 is a schematic structural diagram of a display panel according to an embodiment of the present invention, and referring to fig. 13, a display panel 100 includes the light emitting module 01 according to any one of the embodiments, so that the display panel 100 according to the embodiment of the present invention has the corresponding beneficial effects in the embodiments, and details are not repeated herein.
It can be understood that, by increasing the arrangement density of the light emitting diodes 13 to realize the light emitting module 01 with high resolution, including the light emitting module 01, high resolution can be realized.
Fig. 14 is a schematic structural diagram of a display device according to an embodiment of the present invention, and referring to fig. 14, a display device 200 includes the backlight source described in the above embodiment or the display panel 100 described in the above embodiment. Therefore, the display device 200 provided by the embodiment of the present invention has the corresponding advantages in the above embodiments, and details are not repeated herein.
For example, referring to fig. 14, the display device 200 may be an electronic device such as a mobile phone, a computer, a smart wearable device (e.g., a smart watch), and an on-vehicle display device, which is not limited in the embodiments of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements and substitutions will now be apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (18)
1. A light emitting module, comprising:
a first substrate provided with a first pad and a first connection via line, the first pad being electrically connected with the first connection via line;
the light emitting diode is arranged on the first substrate and is electrically connected with the first bonding pad;
the second substrate is positioned on one side, away from the first bonding pad, of the first substrate, a third bonding pad is arranged on one side, facing the first substrate, and the third bonding pad is electrically connected with the first bonding pad through the first connecting through hole line;
and the driving chip is arranged on the second substrate and is electrically connected with the third bonding pad.
2. The light emitting module of claim 1, further comprising a second pad disposed on a side of the first substrate away from the first pad and electrically connected to the first pad through the first connection via;
the second bonding pad and the third bonding pad are overlapped and electrically connected in a direction perpendicular to the first substrate.
3. The light emitting module as claimed in claim 1, wherein the driving chip comprises a plurality of driving pins, and the driving pins are located at a first end of the driving chip;
the second end of the driving chip is opposite to the first end of the driving chip, perpendicular to the direction of the first substrate, and located between the first end of the driving chip and the light emitting diode.
4. The light emitting module according to claim 3, wherein the first substrate is provided with a first groove for accommodating the driving chip;
the first groove is open to the second substrate.
5. The light emitting module according to claim 3, wherein the first substrate is provided with a first via hole for accommodating the driving chip;
the first through hole penetrates from the surface of one side, close to the second substrate, of the first substrate to the surface of one side, far away from the second substrate, of the first substrate.
6. The light emitting module of claim 5, wherein the second end of the driving chip is flush with a surface of the first substrate on which the first bonding pad is disposed.
7. The light emitting module of claim 5, further comprising a planarization layer on a side of the first substrate where the first pad is disposed, filling the first via.
8. The light emitting module of claim 7, further comprising a light reflecting layer between two adjacent light emitting diodes on a side of the planarization layer away from the first substrate.
9. The lighting module of claim 3, wherein the driving pin comprises a ground pin,
the second substrate is further provided with a ground metal layer and a second connecting through hole line, the ground metal layer is located on one side, away from the third pad, of the second substrate, and the second connecting through hole line and the third pad are electrically connected with the grounding pin.
10. The light emitting module according to claim 1, wherein the second substrate is provided with a second groove for accommodating the driving chip;
the second groove is open to the first substrate.
11. The light emitting module of claim 10, wherein a depth of the second groove is greater than or equal to a thickness of the driving chip in a direction perpendicular to the second substrate.
12. The lighting module of claim 1, further comprising a sealant, wherein the sealant is disposed on a side of the light emitting diode away from the first substrate.
13. The light emitting module according to claim 1, comprising a plurality of the first substrates, a direction perpendicular to the second substrate, the plurality of the first substrates overlapping the second substrate; or,
the display device comprises a plurality of second substrates, wherein the second substrates are perpendicular to the direction of the first substrate and are overlapped with the first substrate.
14. A method for manufacturing a light emitting module is characterized by comprising the following steps:
forming a first connection via line penetrating through a first substrate, forming a first pad electrically connected with the first connection via line, and binding and electrically connecting a light emitting diode on the first pad;
forming a third bonding pad on the second substrate, and binding and electrically connecting the driving chip on the third bonding pad;
and butting one side of the second substrate, which is provided with the third bonding pad, with one side of the first substrate, which is deviated from the first bonding pad, and electrically connecting the third bonding pad with the first bonding pad.
15. A backlight comprising the light-emitting module according to any one of claims 1 to 13.
16. The backlight of claim 15, further comprising a back plate and a thermal tape between the light emitting modules and the back plate electrically connecting the light emitting modules and the back plate.
17. A display panel comprising the light-emitting module according to any one of claims 1 to 13.
18. A display device comprising the backlight of claim 15 or the display panel of claim 17.
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